Electronic module and manufacturing method of the same

Abstract

To reduce stress generated in a conductive bonding member.SOLUTION: In an electronic module, electrode pads 12 of a first circuit component 10 and electrode pads 22 of a second circuit component 20 are arranged such that bonding member groups 31 are formed each having conductive bonding members 30 arranged along one direction in a plane direction of one surface 10a of the first circuit component 10. Each reinforcing member 41 is disposed apart from the bonding member group 31 and has a first portion 41a that extends in a direction intersecting with an extension direction of the bonding member group 31, and a second portion 41b that extends along the bonding member group 31.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to electronic modules and methods for manufacturing the same. [Background technology]

[0002] Conventionally, electronic modules have been proposed in which a first circuit component and a second circuit component are stacked and electrically connected to each other (see, for example, Patent Document 1). Specifically, in this electronic module, a first electrode pad is arranged on one surface of the first circuit component facing the second circuit component, and a second electrode pad is arranged on one surface of the second circuit component facing the first circuit component. The first circuit component and the second circuit component are electrically connected via a conductive bonding member arranged between the first electrode pad and the second electrode pad. The first electrode pad and the second electrode pad are arranged to overlap in the stacking direction of the first circuit component and the second circuit component, and are arranged side by side along one direction on one surface of the first circuit component.

[0003] Between the first and second circuit components, a reinforcing member is disposed near the first and second electrode pads, extending in the arrangement direction of the first and second electrode pads and connecting to the first and second circuit components. Furthermore, an insulating bonding member such as an underfill is disposed between the first and second circuit components.

[0004] Such an electronic module is manufactured as follows: A second circuit component is stacked on a first circuit component so that a conductive bonding material is disposed between the first and second electrode pads and a reinforcing material is disposed near the first and second electrode pads. Heating is then performed to bond the conductive bonding material to the first and second electrode pads and the reinforcing material to the first and second circuit components. After cooling to room temperature, an insulating bonding material is applied between the first and second circuit components and the electronic module is manufactured by heating again to bond the insulating bonding material to the first and second circuit components. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2023-155728 Summary of the Invention [Problem to be solved by the invention]

[0006] In the electronic module described above, the reinforcing member extends in one direction on one surface of the first circuit component, and therefore, when the temperature of this electronic module is lowered after heating to bond the conductive bonding member to the first electrode pads and the second electrode pads, if stress that causes bending of the first circuit component around an axis in one direction on one surface of the first circuit component occurs, the reinforcing member may not be able to reduce the stress generated in the conductive bonding member.

[0007] An object of the present disclosure is to provide an electronic module that can reduce stress generated in conductive bonding members, and a method for manufacturing the same. [Means for solving the problem]

[0008] According to one aspect of the present disclosure, an electronic module includes a first circuit component (10) having a plurality of electrode pads (12) on one surface (10a) thereof, a second circuit component (20) stacked on the first circuit component and having a plurality of electrode pads (22) on one surface (20a) thereof facing the one surface of the first circuit component, a conductive bonding member (30) disposed between the electrode pads of the first circuit component and the electrode pads of the second circuit component and electrically connecting the electrode pads of the first circuit component and the electrode pads of the second circuit component, a reinforcing member (41) disposed between the one surface of the first circuit component and the one surface of the second circuit component and bonded to the one surface of the first circuit component and the one surface of the second circuit component, and and an insulating bonding member (42) arranged between one surface of the first circuit component and one surface of the second circuit component, bonded to one surface of the first circuit component and one surface of the second circuit component, and made of a material different from the conductive bonding member and the reinforcing member, wherein the electrode pads of the first circuit component and the electrode pads of the second circuit component are arranged to form a bonding member group (31) having a plurality of conductive bonding members arranged along one direction in the planar direction of one surface of the first circuit component, and the reinforcing member is arranged apart from the bonding member group, and has a first portion (41a) extending in a direction intersecting the extending direction of the bonding member group and a second portion (41b) extending along the bonding member group.

[0009] With this, since the reinforcing member has the first and second portions extending in different directions, stress generated in the conductive bonding member can be reduced when the temperature is lowered after the conductive bonding member is fixed to the first and second circuit components, thereby preventing damage to the conductive bonding member.

[0010] According to another aspect of the present disclosure, the method for manufacturing the above-mentioned electronic module includes preparing a first circuit component and a second circuit component, arranging a conductive bonding material and a reinforcing material between the first circuit component and the second circuit component, and flowing and arranging an insulating bonding material between the first circuit component and the second circuit component, wherein preparing the first circuit component and the second circuit component includes preparing electrode pads arranged so that three or more bonding material groups are formed in one direction along the surface of the first circuit component, and flowing and arranging the insulating bonding material includes applying and flowing the insulating bonding material between each of the bonding material groups adjacent to each other in one direction.

[0011] This can prevent the insulating bonding members from wrapping around and joining together near the bonding member group, and can prevent voids from being generated in the insulating bonding members due to the joining of the insulating bonding members.

[0012] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view of the electronic module according to the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4A] 2A to 2C are cross-sectional views showing a manufacturing process of the electronic module shown in FIG. [Figure 4B] 4B is a cross-sectional view showing a manufacturing process of the electronic module subsequent to FIG. 4A. [Figure 4C] 4C is a cross-sectional view showing a manufacturing process of the electronic module subsequent to FIG. 4B. [Figure 5] 10 is a diagram showing the relationship between the amount of protrusion of a reinforcing member from a group of conductive bonding members and stress generated in the conductive bonding members. FIG. [Figure 6]10 is a diagram showing the relationship between the width of a reinforcing member and the stress generated in a conductive bonding member. FIG. [Figure 7] 10A and 10B are diagrams for explaining the amount of protrusion of the reinforcing member from the group of conductive bonding members, the width of the reinforcing member, and the distance between the reinforcing member and the group of conductive bonding members. [Figure 8] FIG. 10 is a cross-sectional view of an electronic module according to a second embodiment. [Figure 9A] 10 is a cross-sectional view showing the flow of an insulating bonding member in the vicinity of a reinforcing member connecting a first portion and a second portion. FIG. [Figure 9B] FIG. 9B is a cross-sectional view showing the state in which the insulating bonding member flows, following FIG. 9A. [Figure 10A] 10 is a cross-sectional view showing the state in which an insulating bonding material flows in the vicinity of a reinforcing member in which a first portion and a second portion are separated from each other. FIG. [Figure 10B] FIG. 10B is a cross-sectional view showing the state in which the insulating bonding member flows, following FIG. 10A. [Figure 11A] 10 is a cross-sectional view showing a state in which an insulating bonding member flows in the vicinity of a reinforcing member in which a first portion and a second portion are separated from each other and a group of conductive bonding members is sandwiched between the second portions. FIG. [Figure 11B] FIG. 11B is a cross-sectional view showing the state in which the insulating bonding member flows, following FIG. 11A. [Figure 12] FIG. 10 is a cross-sectional view showing how the insulating bonding material flows when applied from one location. [Figure 13A] FIG. 10 is a cross-sectional view showing how the insulating bonding material flows when applied from two positions. [Figure 13B] FIG. 13B is a cross-sectional view showing the state in which the insulating bonding member flows, following FIG. 13A. [Figure 13C] FIG. 13C is a cross-sectional view showing the state in which the insulating bonding member flows, following FIG. 13B. [Figure 14] 10A and 10B are diagrams illustrating the relationship between the shape of a reinforcing member and the stress generated in a conductive bonding member. [Figure 15A] FIG. 15 is a cross-sectional view showing a reinforcing member shape A in FIG. [Figure 15B]15 is a cross-sectional view showing a reinforcing member shape B in FIG. 14. FIG. [Figure 15C] 15 is a cross-sectional view showing a reinforcing member shape C in FIG. 14. FIG. [Figure 15D] FIG. 15 is a cross-sectional view showing a reinforcing member shape D in FIG. [Figure 16] FIG. 10 is a cross-sectional view of an electronic module according to a third embodiment. [Figure 17] 10A and 10B are diagrams illustrating the relationship between the shape of a reinforcing member and the stress generated in a conductive bonding member. [Figure 18A] FIG. 10 is a cross-sectional view showing the shape of a reinforcing member in another embodiment. [Figure 18B] FIG. 10 is a cross-sectional view showing the shape of a reinforcing member in another embodiment. [Figure 18C] FIG. 10 is a cross-sectional view showing the shape of a reinforcing member in another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the following embodiments, identical or equivalent parts will be denoted by the same reference numerals.

[0015] (First embodiment) An electronic module according to a first embodiment will be described with reference to the drawings. The electronic module according to this embodiment is preferably mounted on a vehicle such as an automobile and used to drive various electronic devices for the vehicle. As shown in FIGS. 1 and 2, the electronic module 1 according to this embodiment includes a power module 10 and a circuit module 20. In this embodiment, the power module 10 corresponds to a first circuit component, and the circuit module 20 corresponds to a second circuit component.

[0016] Although not shown, the power module 10 includes a semiconductor chip on which a gate-type switching element, which is a power semiconductor, is formed, and the semiconductor chip is sealed with a mold resin 11. The switching element is, for example, a MOSFET (short for Metal Oxide Semiconductor Field Effect Transistor) element, which has a gate terminal, a source terminal, and a drain terminal. However, the switching element may also be an IGBT (short for Insulated Gate Bipolar Transistor) element or the like. The power module 10 also includes terminal portions 13 that are connected to the source terminal and the drain terminal of the semiconductor chip. The power module 10 of this embodiment has a generally rectangular shape in plan view having long and short sides.

[0017] Although not shown, the circuit module 20 is connected to the gate terminal of the switching element built into the power module 10 and includes a wiring board on which a gate control circuit for controlling the gate voltage to the gate terminal is formed, and the wiring board is sealed with mold resin 21. The circuit module 20 of this embodiment has a generally rectangular shape in plan view having long and short sides, and is smaller in plan view than the power module 10.

[0018] The electronic module 1 is configured by stacking a circuit module 20 on a power module 10, and electrically connecting the semiconductor chip of the power module 10 to the wiring board of the circuit module 20. Note that, in Fig. 2, the power module 10 and the circuit module 20 are simply shown, and in reality, the semiconductor chip is arranged in the power module 10, and the wiring board is arranged in the circuit module 20.

[0019] In the following description, the surface of the power module 10 facing the circuit module 20 will be referred to as the surface 10a of the power module 10, and the surface of the circuit module 20 facing the power module 10 will be referred to as the surface 20a of the circuit module 20. In the following description, the stacking direction of the power module 10 and the circuit module 20 will be referred to as the Z-axis direction, a direction perpendicular to the Z-axis direction will be referred to as the X-axis direction, and a direction perpendicular to the X-axis and Z-axis directions will be referred to as the Y-axis direction. The X-axis and Y-axis directions are also directions along the planar directions of the surface 10a of the power module 10 and the surface 20a of the circuit module 20. In the present embodiment, the X-axis direction is a direction parallel to the long sides of the power module 10 and the circuit module 20, and the Y-axis direction is a direction parallel to the short sides of the power module 10 and the circuit module 20 (i.e., perpendicular to the long sides). In other words, in the present embodiment, the power module 10 and the circuit module 20 are stacked such that their long sides are parallel to the X-axis direction and their short sides are parallel to the Y-axis direction. In this embodiment, the power module 10 and the circuit module 20 are stacked in the Z-axis direction so that the circuit module 20 is positioned within the power module 10.

[0020] 2, a plurality of electrode pads 12 are provided on one surface 10a of the power module 10. Although details of the electrode pads 12 are omitted, they are electrically connected to a semiconductor chip arranged in the power module 10. Similarly, a plurality of electrode pads 22 are provided on one surface 20a of the circuit module 20. Although details of the electrode pads 22 are omitted, they are electrically connected to a wiring board arranged in the circuit module 20.

[0021] The power module 10 has the same number of electrode pads 12 as the circuit module 20, and the electrode pads 22 are arranged so as to overlap in the Z-axis direction when stacked. The power module 10 and the circuit module 20 are stacked on top of each other so that their surfaces 10a, 20a face each other and their electrode pads 12, 22 face each other. In other words, "in the Z-axis direction" can also be defined as when viewed from the Z-axis direction.

[0022] A conductive bonding member 30 is disposed between the electrode pad 12 of the power module 10 and the electrode pad 22 of the circuit module 20, and the conductive bonding member 30 is fixed to the electrode pad 12 and the electrode pad 22. This electrically connects the electrode pad 12 of the power module 10 and the electrode pad 22 of the circuit module 20 via the conductive bonding member 30. The conductive bonding member 30 is made of, for example, a conductive adhesive made of a mixture of a conductive material and a resin. However, the conductive bonding member 30 may also be made of solder or the like.

[0023] As shown in FIG. 3 , the electrode pads 12 and 22 of this embodiment are arranged to form a plurality of bonding member groups 31, each of which includes a plurality of conductive bonding members 30 arranged along the Y-axis direction. In this embodiment, the electrode pads 12 and 22 are arranged such that four conductive bonding members 30 are arranged in the Y-axis direction to form one bonding member group 31. That is, the electrode pads 12 and 22 are arranged such that each electrode pad group includes four electrode pads 12 and four electrode pads 22 arranged in the Y-axis direction. In this embodiment, the electrode pads 12 and 22 are arranged such that six bonding member groups 31 are formed. More specifically, in this embodiment, three bonding member groups 31 are arranged in the X-axis direction, and the electrode pads 12 and 22 are arranged such that two sets of three bonding member groups 31 are arranged in the Y-axis direction. Note that in FIG. 3 , insulating bonding members 42, which will be described later, are omitted, and the outline of the circuit module 20 is indicated by a dotted line.

[0024] 2, a reinforcing member 41 and an insulating bonding member 42 are disposed between the power module 10 and the circuit module 20. The reinforcing member 41 is made of an adhesive such as epoxy or the same material as the conductive bonding member 30. The insulating bonding member 42 is made of underfill or the like. In this embodiment, the reinforcing member 41 and the insulating bonding member 42 are made of a material with a higher linear expansion coefficient than the conductive bonding member 30.

[0025] 3, the reinforcing members 41 are disposed near each bonding member group 31 and are fixed to one surface 10a of the power module 10 and one surface 20a of the circuit module 20, respectively. In this embodiment, six bonding member groups 31 are disposed, and therefore six reinforcing members 41 are disposed and are fixed to one surface 10a of the power module 10 and one surface 20a of the circuit module 20, respectively. However, each reinforcing member 41 is disposed away from each bonding member group 31 and electrode pads 12, 22, and is not in contact with each bonding member group 31 and electrode pads 12, 22.

[0026] The reinforcing member 41 has a first portion 41a extending in the X-axis direction and intersecting with a virtual line K1 extending in the Y-axis direction and passing through each of the joining member groups 31, and a second portion 41b extending in the Y-axis direction and intersecting with a virtual line K2 extending in the X-axis direction and passing through each of the joining member groups 31. In other words, the reinforcing member 41 has a second portion 41b extending in the longitudinal direction of each of the joining member groups 31, and a first portion 41a extending from one end of the second portion 41b in a direction intersecting the extension direction of the second portion 41b. In other words, the reinforcing member 41 has a first portion 41a and a second portion 41b extending in two different directions (i.e., perpendicular directions). The reinforcing member 41 of this embodiment has a generally L-shaped planar shape in which the first portion 41a and the second portion 41b are connected. As will be described later, the reinforcing member 41 serves to reduce stress generated in the conductive bonding members 30 (i.e., the bonding member group 31). For this reason, the reinforcing member 41 is disposed away from the conductive bonding members 30 (i.e., the bonding member group 31), but is disposed at a position where stress generated in the conductive bonding members 30 can be reduced.

[0027] As shown in FIG. 2, the insulating bonding member 42 is arranged so as to cover the conductive bonding member 30 and the reinforcing member 41, and is fixed to one surface 10a of the power module 10 and one surface 20a of the circuit module 20, respectively.

[0028] The above is the configuration of the electronic module 1 in this embodiment. Next, a method for manufacturing the electronic module 1 of this embodiment will be described with reference to Figures 4A to 4C, and the configuration will be described in more detail. Figures 4A to 4C are cross-sectional views of a portion corresponding to Figure 2.

[0029] First, as shown in FIG. 4A , a power module 10 having electrode pads 12 on one surface 10a is prepared. Then, on the one surface 20a of the power module 10, conductive bonding members 30 are applied to the electrode pads 12, and a reinforcing member 41 is applied around the conductive bonding members 30 (i.e., the electrode pads 12) using a dispenser or the like. The conductive bonding members 30 may be a conductive paste (i.e., a paste (e.g., silver paste) containing a conductive material, a resin, and a solvent) that constitutes a conductive adhesive, or cream solder. The conductive bonding members 30 may also be preformed solder (e.g., solder balls). When the conductive bonding members 30 are preformed solder, the conductive bonding members 30 (i.e., preformed solder) are placed on each electrode pad 22 instead of being applied. The reinforcing member 41 is applied so as not to come into contact with each electrode pad 12 and the conductive bonding members 30. When the conductive bonding members 30 and the reinforcing members 41 are made of the same material, the conductive bonding members 30 and the reinforcing members 41 are applied in the same process. Although an example in which the conductive bonding members 30 and the reinforcing members 41 are applied to the power module 10 will be described here, the conductive bonding members 30 and the reinforcing members 41 may also be applied to the circuit module 20.

[0030] Next, as shown in FIG. 4B , a circuit module 20 having electrode pads 22 on one surface 20 a is prepared. Then, the circuit module 20 is stacked on the power module 10 so that the electrode pads 12 of the power module 10 and the electrode pads 22 of the circuit module 20 face each other. As a result, the conductive bonding member 30 and the reinforcing member 41 are disposed between the power module 10 and the circuit module 20, with the conductive bonding member 30 contacting both the electrode pads 12 and 22 and the reinforcing member 41 contacting both the surfaces 10 a and 20 a. Note that the conductive bonding member 30 and the reinforcing member 41 expand laterally due to pressure applied when the circuit module 20 is placed on the power module 10. Therefore, the electrode pads 12 and 22 and the reinforcing member 41 are arranged so as not to contact each other even when they expand laterally.

[0031] Thereafter, a first heating step is performed to heat the laminate of the power module 10 and the circuit module 20. As a result, the conductive bonding members 30 are fixed to the electrode pads 12, 22, and the reinforcing member 41 is fixed to one surface 10a of the power module 10 and one surface 20a of the circuit module 20. Specifically, if the conductive bonding members 30 are a conductive paste, the conductive bonding members 30 are hardened by heating and fixed to the electrode pads 12, 22. If the conductive bonding members 30 are solder, the conductive bonding members 30 melt by heating and then solidify and fix to the electrode pads 12, 22 when the temperature of the laminate drops.

[0032] When the conductive bonding member 30 is heated, outgassing occurs from the conductive bonding member 30. That is, if the conductive bonding member 30 is a conductive paste, the solvent contained in the conductive paste volatilizes due to heating, generating outgassing. Also, if the conductive bonding member 30 is solder, the flux contained in the solder volatilizes due to heating, generating outgassing. In this case, in this embodiment, the conductive bonding member 30 and the reinforcing member 41 are disposed apart from each other, and the outer peripheral surface of the conductive bonding member 30 is exposed, so that outgassing generated in the conductive bonding member 30 is discharged to the outside of the laminate. Therefore, the formation of voids inside the reinforcing member 41 due to outgassing generated in the conductive bonding member 30 is suppressed. Furthermore, the reinforcing member 41 hardens due to heating and is fixed to the one surface 10a of the power module 10 and the one surface 20a of the circuit module 20.

[0033] Next, after the conductive bonding members 30 and the reinforcing members 41 are fixed to their respective objects, the laminate is cooled to room temperature. During this process, the power module 10 and the circuit module 20 each contract. Since the circuit module 20 and the power module 10 have different linear expansion coefficients, the circuit module 20 and the power module 10 contract by different amounts. This causes shear stress to be applied to the conductive bonding members 30 disposed between the power module 10 and the circuit module 20. Furthermore, since the circuit module 20 and the power module 10 contract by different amounts, warping occurs in the power module 10 and the circuit module 20. This causes tensile stress to be applied to the conductive bonding members 30 disposed between the power module 10 and the circuit module 20.

[0034] In this embodiment, not only the conductive bonding member 30 but also a reinforcing member 41 is disposed between the power module 10 and the circuit module 20. The reinforcing member 41 has a first portion 41a extending in the X-axis direction and a second portion 41b extending in the Y-axis direction. Therefore, in this embodiment, contraction of the power module 10 and the circuit module 20 is suppressed, and warping of the power module 10 and the circuit module 20 about the X-axis direction and about the Y-axis direction is suppressed. Therefore, thermal stress applied to the conductive bonding member 30 due to a temperature drop is reduced. This suppresses damage to the conductive bonding member 30 due to a temperature drop.

[0035] The inventors conducted extensive research into the relationship between the configuration of the reinforcing member 41 and the stress generated in the conductive bonding member 30, and obtained the results shown in FIGS. 5 and 6. FIG. 5 shows the results of examining the stress generated in the conductive bonding member 30, indicated by arrow A in FIGS. 3 and 7, when the laminate was cooled to room temperature after the first heating step. Hereinafter, as shown in FIG. 7, the protrusion amount D of the first portion 41a of the reinforcing member 41 from the bonding member group 31 in the X-axis direction at the end opposite the second portion 41b is referred to as the protrusion amount D. Similarly, the protrusion amount D of the second portion 41b of the reinforcing member 41 from the bonding member group 31 in the Y-axis direction at the end opposite the first portion 41a is referred to as the protrusion amount D. The width of the reinforcing member 41 is referred to as the width W. The width W of the reinforcing member 41 refers to the length along the Y-axis direction at the first portion 41a and the length along the X-axis direction at the second portion 41b. In this embodiment, the width W of the reinforcing member 41 is uniform in both the X-axis and Y-axis directions. Furthermore, the distance between the reinforcing member 41 and the joining member group 31 is defined as L.

[0036] As shown in FIG. 5 , the stress generated in the conductive bonding member 30 decreases sharply as the protrusion amount D approaches 0 when the protrusion amount D is less than 0 mm. Furthermore, the stress generated in the conductive bonding member 30 gradually decreases as the protrusion amount D increases when the protrusion amount D is greater than 0 mm and less than or equal to 10 mm. Furthermore, the stress generated in the conductive bonding member 30 hardly changes when the protrusion amount D is greater than 10 mm. However, the longer the protrusion amount D, the longer the process of applying the reinforcing member 41 and the longer the manufacturing process. For this reason, the protrusion amount D is preferably greater than 0 mm and less than or equal to 10 mm. Note that in FIG. 5 , a protrusion amount D of less than 0 mm means that the end of the first portion 41a opposite the second portion 41b and the end of the second portion 41b opposite the first portion 41a do not protrude from the bonding member group 31.

[0037] 6, it was confirmed that the stress generated in the conductive bonding member 30 decreases sharply as the width W approaches 2 mm when the width W is less than 2 mm. It was also confirmed that the stress generated in the conductive bonding member 30 decreases gradually as the width W increases when the width W is between 2 mm and 6 mm. It was also confirmed that the stress generated in the conductive bonding member 30 hardly changes when the width W is 6 mm or more. However, the wider the width W, the longer the process of applying the reinforcing member 41 tends to be, and the longer the manufacturing process tends to be. For this reason, in this embodiment, it is preferable that the width W be between 2 mm and 6 mm.

[0038] In this embodiment, the distance L between the reinforcing member 41 and the group of bonding members 31 is set to approximately 0.5 to 3.0 mm so that the conductive bonding members 30 and the reinforcing members 41 do not come into contact with each other even if they are expanded laterally due to pressure when the circuit module 20 is placed on the power module 10.

[0039] 4C , an insulating bonding member 42 is applied and filled into the gap between the one surface 10a of the power module 10 and the one surface 20a of the circuit module 20 (i.e., around the conductive bonding members 30 and the reinforcing members 41). The insulating bonding member 42 is filled so as to come into contact with the one surface 10a of the power module 10 and the one surface 20a of the circuit module 20 while covering the outer peripheral surfaces of the conductive bonding members 30 and the outer peripheral surfaces of the reinforcing members 41.

[0040] Next, a second heating step is performed to heat the laminate of the power module 10 and the circuit module 20 again. As a result, the insulating bonding members 42 are hardened and fixed to one surface 10a of the power module 10 and one surface 20a of the circuit module 20. The insulating bonding members 42 then come into close contact with the outer peripheral surfaces of the conductive bonding members 30 to protect the conductive bonding members 30.

[0041] According to the present embodiment described above, the reinforcing member 41 has the first portion 41a and the second portion 41b that extend in different directions. This reduces the stress generated in the conductive bonding member 30 when the temperature is lowered after the conductive bonding member 30 is fixed to the power module 10 and the circuit module 20. This prevents the conductive bonding member 30 from being damaged.

[0042] (1) In the present embodiment, the first portion 41a and the second portion 41b are formed to be connected to each other. Therefore, when applying the material of the first portion 41a and the second portion 41b that constitute the reinforcing member 41, the material can be applied continuously, which simplifies the manufacturing process.

[0043] (2) In this embodiment, the protrusion amount D of the end of the first portion 41a opposite to the second portion 41b from the bonding member group 31 and the protrusion amount D of the end of the second portion 41b opposite to the first portion 41a from the bonding member group 31 are preferably set to be greater than 0 mm and equal to or less than 10 mm. This makes it possible to sufficiently reduce stress generated in the conductive bonding member 30 when the temperature is lowered after the conductive bonding member 30 is fixed to the power module 10 and the circuit module 20.

[0044] (3) In this embodiment, the width W of the reinforcing member 41 is preferably 2 mm or more and 6 mm or less. This allows for sufficient reduction in stress generated in the conductive bonding member 30 when the temperature is reduced after the conductive bonding member 30 is fixed to the power module 10 and the circuit module 20.

[0045] (4) In this embodiment, the reinforcing member 41 and the insulating bonding member 42 have a higher linear expansion coefficient than the conductive bonding member 30. Here, according to the study by the present inventors, after manufacturing the electronic module 1, it has been confirmed that if the linear expansion coefficient of the insulating bonding member 42 is lower than the linear expansion coefficient of the conductive bonding member 30, the stress generated in the conductive bonding member 30 may be easily increased. Similarly, it has been confirmed that if the linear expansion coefficient of the reinforcing member 41 is lower than the linear expansion coefficient of the conductive bonding member 30, the stress generated in the conductive bonding member 30 may be easily increased. Therefore, in this embodiment, the linear expansion coefficients of the reinforcing member 41 and the insulating bonding member 42 are set higher than the linear expansion coefficient of the conductive bonding member 30, which makes it easier to reduce the stress generated in the conductive bonding member 30.

[0046] (5) In this embodiment, since the reinforcing member 41 is disposed as described above, the conductive bonding member 30 can be formed using a conductive adhesive with low bonding strength. Therefore, in this embodiment, the selectivity of the material of the conductive bonding member 30 can be improved.

[0047] (6) In this embodiment, when the reinforcing member 41 is made of the same material as the conductive bonding member 30, the reinforcing member 41 and the conductive bonding member 30 can be applied in the same process, thereby simplifying the manufacturing process.

[0048] (7) In this embodiment, the reinforcing member 41 is not in contact with the conductive bonding member 30. Therefore, when the first heating step is performed, it is possible to prevent voids from being formed in the reinforcing member 41 due to outgassing from the conductive bonding member 30. Furthermore, since the insulating bonding member 42 is formed after the first heating step is performed, it is not affected by outgassing from the conductive bonding member 30. Therefore, it is possible to prevent voids from being formed in the insulating bonding member 42.

[0049] (Second embodiment) A second embodiment will be described. This embodiment is different from the first embodiment in that the configuration of the reinforcing member 41 is changed. As the rest is the same as the first embodiment, a description thereof will be omitted here.

[0050] As shown in Fig. 8, the electronic module 1 of this embodiment has three bonding member groups 31 arranged in the X-axis direction, and two sets of these three bonding member groups 31 arranged in the Y-axis direction, as in the first embodiment. Hereinafter, in this embodiment, the three bonding member groups 31 arranged along the X-axis direction will also be referred to as first to third bonding member groups 311 to 313 and fourth to sixth bonding member groups 314 to 316. Fig. 8 is a cross-sectional view corresponding to Fig. 3. In Fig. 8, the first to third bonding member groups 311 to 313 are arranged along the X-axis direction from the lower left of the page, and the fourth to sixth bonding member groups 314 to 316 are arranged along the X-axis direction from the upper left of the page.

[0051] The reinforcing member 41, which is disposed adjacent to the first, third, fourth, and sixth bonding member groups 311, 313, 314, and 316 located at both end sides in the X-axis direction, has two second portions 41b disposed on either side of each bonding member group 31. The reinforcing member 41 also has two first portions 41a disposed at the ends of the second portions 41b along the Y-axis direction, on the long side ends of one surface 10a of the power module 10. In the reinforcing member 41 of this embodiment, a first passage 51 is defined between the two first portions 41a, and a second passage 52 is defined between the two second portions 41b. The bonding member group 31 is disposed so as to be located within the second passage 52.

[0052] The first portions 41a of the reinforcing member 41 arranged near the first and third bonding member groups 311, 313 are arranged so as to extend toward the second bonding member group 312. The first portions 41a of the reinforcing member 41 arranged near the fourth and sixth bonding member groups 314, 316 are arranged so as to extend toward the fifth bonding member group 315. Of the two first portions 41a, one located on the longer side of one surface 10a of the power module 10 is arranged away from the second portion 41b. In other words, the reinforcing member 41 is arranged so that the first portion 41a and the second portion 41b are separated from each other.

[0053] The reinforcing member 41, which is disposed near the second and fifth joint member groups 312 and 315 located toward the center in the X-axis direction, has two second portions 41b disposed on either side of the joint member group 31. The reinforcing member 41 also has a first portion 41a extending from one end of each second portion 41b along the Y-axis direction, on the long side of one surface 10a of the power module 10, on the opposite side from the joint member group 31. The reinforcing member 41 also has a first portion 41a extending in the X-axis direction so as to intersect with an imaginary line K1 extending along the Y-axis direction that passes through each joint member group 31, and disposed so as to form a first passage 51 between itself and the first portion 41a connected to the second portion 41b.

[0054] The above is the configuration of the electronic module 1 in this embodiment. In the first embodiment, when the insulating bonding material 42 is applied, it is applied from a predetermined location between the surface 10a of the power module 10 and the surface 20a of the circuit module 20, and then spreads throughout the space between the surface 10a of the power module 10 and the surface 20a of the circuit module 20. During this process, differences in the speed at which the insulating bonding material 42 spread occur due to factors such as partial differences in the surface roughness of the surfaces 10a and 20a. For this reason, for example, when the insulating bonding material 42 spreads as shown in FIG. 9A, voids V due to entrapped air may occur near the bonding material group 31, as shown in FIG. 9B.

[0055] For this reason, in this embodiment, the first portion 41a and the second portion 41b are configured to have a portion where they are separated from each other. As a result, when the insulating bonding material 42 flows as shown in Fig. 10A, the insulating bonding material 42 is discharged through the gap S between the first portion 41a and the second portion 41b as shown in Fig. 10B, and it is possible to prevent the generation of voids V in the portion between the first portion 41a and the second portion 41b.

[0056] In this embodiment, two second portions 41b are provided on either side of the bonding member group 31 so that the flow direction of the insulating bonding member 42 relative to the bonding member group 31 is unidirectional. More specifically, the bonding member group 31 is arranged in the second passage 52. This makes it easier for the insulating bonding member 42 to flow in one direction through the second passage 52, as shown in FIG. 11A, and as shown in FIG. 11B, it is possible to suppress the generation of voids V near the bonding member group 31. In this embodiment, the first passage 51 connected to the second passage 52 is configured with two first portions 41a so that the insulating bonding member 42 can easily flow in one direction through the second passage 52.

[0057] Furthermore, in the case of providing a plurality of bonding member groups 31 as in this embodiment, when the insulating bonding member 42 is applied from one application location, the insulating bonding member 42 may flow around the bonding member group 31 and merge around the bonding member group 31, potentially creating a void V at the merged portion. For example, as shown in Fig. 12, when the insulating bonding member 42 is applied at an application location AL between the first bonding member group 311 and the second bonding member group 312, the insulating bonding member 42 may merge near the third bonding member group 313, potentially creating a void V at the merged portion.

[0058] 13A, the insulating bonding material 42 is applied from a first application location AL1 between the first bonding member group 311 and the second bonding member group 312 and a second application location AL2 between the second bonding member group 312 and the third bonding member group 313. That is, the insulating bonding material 42 is applied between adjacent bonding member groups 31. As a result, the insulating bonding material 42 applied from the first application location AL1 flows toward the first bonding member group 311 and the second bonding member group 312, and the insulating bonding material 42 applied from the second application location AL2 flows toward the second bonding member group 312 and the third bonding member group 313. At this time, since the application locations AL1 and AL2 are located between the bonding member groups 31, it is possible to prevent the insulating bonding material 42 from flowing around and merging as shown in FIG. 12. In this embodiment, the first passage 51 disposed near the first bonding member group 311 faces the second bonding member group 312, and the first passage 51 disposed near the second bonding member group 312 faces the first bonding member group 311. Similarly, the first passage 51 disposed near the second bonding member group 312 faces the third bonding member group 313, and the first passage 51 disposed near the third bonding member group 313 faces the second bonding member group 312. Therefore, the insulating bonding material 42 applied from the first application area AL1 easily flows through the first passage 51 toward the first bonding member group 311 and the second bonding member group 312. Similarly, the insulating bonding material 42 applied from the second application area AL2 easily flows through the first passage 51 toward the second bonding member group 312 and the third bonding member group 313.

[0059] 13B, when the insulating bonding members 42 reach the second passages 52 in which the first to third bonding member groups 311 to 313 are arranged, they flow in one direction through the second passages 52. Thereafter, as shown in Fig. 13C, the insulating bonding members 42 maintain their flow direction and reach the fourth to sixth bonding member groups 314 to 316. Therefore, even in the fourth to sixth bonding member groups 314 to 316, the insulative bonding members 42 can be prevented from joining together, and the occurrence of voids V can be prevented.

[0060] Even if the reinforcing member 41 is configured with the first portion 41a and the second portion 41b spaced apart as in this embodiment, the stress generated in the conductive bonding member 30 can be sufficiently reduced when the temperature is lowered after the conductive bonding member 30 is fixed to the power module 10 and the circuit module 20. The inventors conducted extensive research into the relationship between the shape of the reinforcing member 41 and the stress generated in the conductive bonding member 30 and obtained the results shown in FIG. 14. Note that the reinforcing member shape A in FIG. 14 is the result of configuring the reinforcing member 41 with only one second portion 41b extending along the bonding member group 31, as shown in FIG. 15A. The reinforcing member shape B in FIG. 14 is the result of arranging two second portions 41b extending along the bonding member group 31 so as to sandwich the bonding member group 31, as shown in FIG. 15B. Reinforcing member shape C in Fig. 14 is the result when the first portion 41a and the second portion 41b are connected to form a substantially L-shape, as shown in Fig. 15C. Reinforcing member shape D in Fig. 14 is the result when the first portion 41a and the second portion 41b are spaced apart, as shown in Fig. 15D.

[0061] 14, since reinforcing member shape C and reinforcing member shape D have the first portion 41a and the second portion 41b, it has been confirmed that they can sufficiently reduce the stress generated in the conductive bonding member 30 compared to reinforcing member shape A and reinforcing member shape B. Furthermore, it has been confirmed that reinforcing member shape D, in which the first portion 41a and the second portion 41b are arranged apart, can also sufficiently reduce the stress generated in the conductive bonding member 30 compared to reinforcing member shape A and reinforcing member shape B. Note that FIG. 14 shows a boundary of approximately 30 MPa, which is the breaking strength of the conductive adhesive, as a reference boundary.

[0062] According to the present embodiment described above, the reinforcing member 41 has the first portion 41a and the second portion 41b, and therefore, the same effects as those of the first embodiment can be obtained.

[0063] (1) In this embodiment, the reinforcing member 41 has a portion where the first portion 41a and the second portion 41b are separated from each other. This prevents voids V from being generated when the insulating bonding member 42 is applied and disposed.

[0064] (2) In this embodiment, the reinforcing member 41 has two second portions 41b that sandwich the bonding member group 31. This makes it easier to make the flow direction of the insulating bonding members 42 relative to the bonding member group 31 uniform, thereby suppressing the generation of voids V.

[0065] (3) In this embodiment, a plurality of bonding member groups 31 are provided. When applying the insulating bonding member 42, the insulating bonding member 42 is applied between adjacent bonding member groups 31. This prevents the insulating bonding member 42 from wrapping around and joining together near the bonding member groups 31, and prevents voids V from being generated inside the insulating bonding member 42.

[0066] (Third embodiment) A third embodiment will be described. This embodiment is different from the first embodiment in that the configuration of the reinforcing member 41 is changed. As the rest is the same as the first embodiment, a description thereof will be omitted here.

[0067] In this embodiment, as shown in Fig. 16, the reinforcing member 41 is divided into a plurality of parts. Specifically, the reinforcing member 41 in this embodiment is divided into a plurality of parts so that the first portions 41a and the second portions 41b are in a dot shape. Fig. 16 is a cross-sectional view corresponding to Fig. 3.

[0068] According to the present embodiment described above, the reinforcing member 41 has the first portion 41a and the second portion 41b, and therefore, the same effects as those of the first embodiment can be obtained.

[0069] (1) In this embodiment, the reinforcing member 41 is divided into multiple pieces. Therefore, when the insulating bonding member 42 is applied and placed, the insulating bonding member 42 flows around the reinforcing member 41, making it less likely for air to be entrapped, thereby suppressing the formation of voids V. Even if the reinforcing member 41 is divided into multiple pieces, when the temperature is lowered after the conductive bonding member 30 is fixed to the power module 10 and the circuit module 20, the stress generated in the conductive bonding member 30 can be sufficiently reduced, as shown in FIG. 17 . Note that the reinforcing member shapes A and C in FIG. 17 are the same as the reinforcing member shapes A and C in FIG. 14 . The third embodiment in FIG. 17 is a reinforcing member 41 in which the first portion 41 a and the second portion 41 b are dot-shaped, as in this embodiment. In FIG. 17 , the breaking strength of the conductive adhesive, approximately 30 MPa, is shown as a reference boundary.

[0070] (Other embodiments) Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, various combinations and forms, as well as other combinations and forms including only one element, more than one element, or less than one element, are also within the scope and spirit of the present disclosure.

[0071] For example, in each of the above embodiments, the number and arrangement of the conductive bonding members 30 constituting the bonding member group 31 can be changed as appropriate. For example, as shown in FIG. 18A, four conductive bonding members 30 may be arranged along the Y-axis direction, and these four conductive bonding members 30 may be arranged in two sets along the X-axis direction. Furthermore, as shown in FIG. 18B, when two sets of conductive bonding members 30 are arranged along the X-axis direction, the conductive bonding members 30 may be arranged so as not to face each other in the X-axis direction. Furthermore, as shown in FIG. 18C, the Y-axis direction may be inclined rather than perpendicular to the long side of the circuit module 20. That is, the X-axis direction may be inclined rather than parallel to the long side of the circuit module 20. The configuration of the reinforcing member 41 can also be changed as appropriate. For example, as shown in FIGS. 18A to 18C, the reinforcing member 41 may include two second portions 41b and one first portion 41a, and the first portion 41a may be arranged so as to be spaced apart from the second portion 41b.

[0072] In each of the above embodiments, the power module 10 and the circuit module 20 may have a planar polygonal shape instead of a substantially rectangular shape.

[0073] Furthermore, in each of the above embodiments, the protrusion amount D of the first portion 41a and the second portion 41b may be less than 0 mm or may be greater than 10 mm. Similarly, in each of the above embodiments, the width W of the reinforcing member 41 may be less than 2 mm or greater than 6 mm.

[0074] In the second embodiment, the reinforcing member 41 may have one first portion 41a and one second portion 41b, with the first portion 41a and the second portion 41b being spaced apart, as shown in Fig. 15D. Even with this configuration, it is possible to prevent the void V from occurring in the portion between the first portion 41a and the second portion 41b.

[0075] In the third embodiment, either the first portion 41a or the second portion 41b may be divided into a plurality of portions. In the third embodiment, the division method can be changed as appropriate.

[0076] The third embodiment may be combined with the second embodiment, and the reinforcing member 41 may be divided into a plurality of parts.

[0077] [Disclosure of the Invention] The present disclosure described above can be understood from the following viewpoints, for example. [First viewpoint] 1. An electronic module comprising: a first circuit component (10) having a plurality of electrode pads (12) on one surface (10a); a second circuit component (20) stacked on the first circuit component and having a plurality of electrode pads (22) on one surface (20a) opposite to the one surface of the first circuit component; a conductive bonding member (30) disposed between the electrode pads of the first circuit component and the electrode pads of the second circuit component, electrically connecting the electrode pads of the first circuit component and the electrode pads of the second circuit component; a reinforcing member (41) disposed between one surface of the first circuit component and one surface of the second circuit component and joined to one surface of the first circuit component and one surface of the second circuit component; an insulating joining member (42) disposed between one surface of the first circuit component and one surface of the second circuit component, joined to one surface of the first circuit component and one surface of the second circuit component, and made of a material different from the conductive joining member and the reinforcing member; the electrode pads of the first circuit component and the electrode pads of the second circuit component are arranged so as to form a bonding member group (31) having a plurality of the conductive bonding members arranged along one direction in the planar direction of one surface of the first circuit component; The reinforcing member is an electronic module having a first portion (41a) that is positioned away from the group of connecting members and that extends in a direction intersecting the direction in which the group of connecting members extends, and a second portion (41b) that extends along the group of connecting members. [Second viewpoint] The electronic module according to the first aspect, wherein the reinforcing member connects the first portion and the second portion. [Third Perspective] The electronic module according to the first aspect, wherein the reinforcing member has a portion where the first portion and the second portion are separated from each other. [Fourth viewpoint] The electronic module according to the first aspect, wherein at least one of the first portion and the second portion of the reinforcing member is divided into a plurality of portions. [Fifth viewpoint] The electronic module according to any one of the first to fourth aspects, wherein the reinforcing member has two of the second portions so as to sandwich the group of joining members. [Sixth viewpoint] The electronic module according to any one of the first to fifth aspects, wherein an end of the first portion opposite the second portion protrudes from the group of joining members toward the side opposite the second portion, and an end of the second portion opposite the first portion protrudes from the group of joining members toward the side opposite the first portion, and a protrusion amount (D) of the first portion from the group of joining members and a protrusion amount (D) of the second portion from the group of joining members are greater than 0 mm and are not greater than 10 mm. [Seventh viewpoint] The electronic module according to any one of the first to sixth aspects, wherein the reinforcing member has a width (W) of 2 mm or more and 6 mm or less. [Eighth viewpoint] The electronic module according to any one of the first to seventh aspects, wherein the reinforcing member and the insulating bonding member have a linear expansion coefficient greater than that of the conductive bonding member. [Ninth viewpoint] The electronic module according to any one of the first to eighth aspects, wherein the conductive bonding member is made of a conductive adhesive. [10th viewpoint] The electronic module according to any one of the first to ninth aspects, wherein the reinforcing member is made of the same material as the conductive bonding member. [11th viewpoint] a first circuit component (10) having a plurality of electrode pads (12) on one surface (10a); a second circuit component (20) stacked on the first circuit component and having a plurality of electrode pads (22) on one surface (20a) opposite to the one surface of the first circuit component; a conductive bonding member (30) disposed between the electrode pads of the first circuit component and the electrode pads of the second circuit component, electrically connecting the electrode pads of the first circuit component and the electrode pads of the second circuit component; a reinforcing member (41) disposed between one surface of the first circuit component and one surface of the second circuit component and joined to one surface of the first circuit component and one surface of the second circuit component; an insulating joining member (42) disposed between one surface of the first circuit component and one surface of the second circuit component, joined to one surface of the first circuit component and one surface of the second circuit component, and made of a material different from the conductive joining member and the reinforcing member; the electrode pads of the first circuit component and the electrode pads of the second circuit component are arranged so as to form a bonding member group (31) having a plurality of the conductive bonding members arranged along one direction in the planar direction of one surface of the first circuit component; a method for manufacturing an electronic module, the method comprising: forming a reinforcement member at a distance from the group of joining members, the reinforcement member having a first portion (41a) extending in a direction intersecting a direction in which the group of joining members extends, and a second portion (41b) extending along the group of joining members, providing the first circuit component and the second circuit component; disposing the conductive bonding member and the reinforcing member between the first circuit component and the second circuit component; and disposing the insulating bonding member between the first circuit component and the second circuit component by causing the insulating bonding member to flow. preparing the first circuit component and the second circuit component, the electrode pads are arranged so that three or more bonding member groups are formed in one direction of a surface of the first circuit component; In the method for manufacturing an electronic module, the insulating bonding material is applied and caused to flow between each of the bonding member groups adjacent to each other in the one direction, in the disposing of the insulating bonding material by flowing. [Explanation of symbols]

[0078] 10 Power module (first circuit component) 10a one side 20 Circuit module (second circuit component) 20a one side 30 Conductive joining material 31 Joint members 41 Reinforcement member 41a Part 1 41b Part 2 42 Insulating joining material

Claims

1. 1. An electronic module comprising: a first circuit component (10) having a plurality of electrode pads (12) on one surface (10a); a second circuit component (20) stacked on the first circuit component and having a plurality of electrode pads (22) on one surface (20a) opposite to one surface of the first circuit component; a conductive bonding member (30) disposed between the electrode pads of the first circuit component and the electrode pads of the second circuit component, electrically connecting the electrode pads of the first circuit component and the electrode pads of the second circuit component; a reinforcing member (41) disposed between one surface of the first circuit component and one surface of the second circuit component and joined to one surface of the first circuit component and one surface of the second circuit component; an insulating bonding member (42) disposed between one surface of the first circuit component and one surface of the second circuit component, bonded to one surface of the first circuit component and one surface of the second circuit component, and made of a material different from the conductive bonding member and the reinforcing member; the electrode pads of the first circuit component and the electrode pads of the second circuit component are arranged so as to form a bonding member group (31) having a plurality of the conductive bonding members arranged along one direction in the planar direction of one surface of the first circuit component; The reinforcing member is positioned away from the group of connecting members and has a first portion (41a) extending in a direction intersecting the extension direction of the group of connecting members, and a second portion (41b) extending along the group of connecting members.

2. The electronic module according to claim 1 , wherein the reinforcing member connects the first portion and the second portion.

3. The electronic module according to claim 1 , wherein the reinforcing member has a portion where the first portion and the second portion are separated from each other.

4. The electronic module according to claim 1 , wherein at least one of the first portion and the second portion of the reinforcing member is divided into a plurality of portions.

5. The electronic module according to claim 1 , wherein the reinforcing member has two of the second portions so as to sandwich the group of joining members.

6. 2. The electronic module according to claim 1, wherein an end of the first portion opposite the second portion protrudes from the group of joining members toward the side opposite the second portion, and an end of the second portion opposite the first portion protrudes from the group of joining members toward the side opposite the first portion, and wherein the amount of protrusion (D) of the first portion from the group of joining members and the amount of protrusion (D) of the second portion from the group of joining members are greater than 0 mm and less than or equal to 10 mm.

7. The electronic module according to claim 1 , wherein the reinforcing member has a width (W) of 2 mm or more and 6 mm or less.

8. The electronic module according to claim 1 , wherein the reinforcing member and the insulating bonding member have a linear expansion coefficient greater than that of the conductive bonding member.

9. 2. The electronic module according to claim 1, wherein the conductive bonding member is made of a conductive adhesive.

10. 10. The electronic module according to claim 1, wherein the reinforcing member is made of the same material as the conductive joining member.

11. a first circuit component (10) having a plurality of electrode pads (12) on one surface (10a); a second circuit component (20) stacked on the first circuit component and having a plurality of electrode pads (22) on one surface (20a) opposite to one surface of the first circuit component; a conductive bonding member (30) disposed between the electrode pads of the first circuit component and the electrode pads of the second circuit component, electrically connecting the electrode pads of the first circuit component and the electrode pads of the second circuit component; a reinforcing member (41) disposed between one surface of the first circuit component and one surface of the second circuit component and joined to one surface of the first circuit component and one surface of the second circuit component; an insulating bonding member (42) disposed between one surface of the first circuit component and one surface of the second circuit component, bonded to one surface of the first circuit component and one surface of the second circuit component, and made of a material different from the conductive bonding member and the reinforcing member; the electrode pads of the first circuit component and the electrode pads of the second circuit component are arranged so as to form a bonding member group (31) having a plurality of the conductive bonding members arranged along one direction in the planar direction of one surface of the first circuit component; a method for manufacturing an electronic module, the method comprising: forming a reinforcement member at a distance from the group of joining members, the reinforcement member having a first portion (41a) extending in a direction intersecting a direction in which the group of joining members extends, and a second portion (41b) extending along the group of joining members; providing the first circuit component and the second circuit component; disposing the conductive bonding member and the reinforcing member between the first circuit component and the second circuit component; and disposing the insulating bonding member between the first circuit component and the second circuit component by causing the insulating bonding member to flow. preparing the first circuit component and the second circuit component, the electrode pads are arranged so that three or more bonding member groups are formed in one direction of a surface direction of the first circuit component; In the method for manufacturing an electronic module, the insulating bonding material is applied and caused to flow between each of the bonding member groups adjacent to each other in the one direction, in the disposing of the insulating bonding material by flowing.

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