Electronic device

Abstract

To provide an electronic device in which a partition wall capable of obtaining an appropriate air flow can be easily assembled to a board.SOLUTION: An electronic device 10 comprises: two fans 30; a mother board 25 that is provided between the respective fans 30 so as to radiate heat by receiving air flows of the respective fans 30 and has positioning holes 25f to 25h; and a first partition wall 60 and a second partition wall 61 that are provided on the front and rear of a center section 25C in the mother board 25 and blocks a space with a casing so as to extend over between the two fans. The first partition wall 60 and the second partition wall 61 have stiff materials 63, 67 fixed to a surface of the mother board 25, and elastic materials 64, 68 that are fixed to the stiff materials 63, 67 and are compressed elastically with the casing. The stiff material 67 in the second partition wall 61 has projections 67a to 67c penetrating positioning holes 25f to 25h, and the stiff material 63 in the first partition wall 60 has fitting sections 63a to 63c into which the projections 67a to 67c are fitted.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an electronic device having a fan and a board. [Background technology]

[0002] Electronic devices such as notebook PCs are equipped with a cooling module for cooling heat-generating elements such as a CPU. This type of cooling module includes a heat transport device such as a heat pipe that absorbs and transports heat generated by the CPU and other components, and a heat sink and fan that expel the heat transported by the heat transport device to the outside of the housing. The electronic device described in Patent Document 1 has fans on the left and right sides, with a board on which the CPU is mounted located between them. The fan is provided with a sponge partition that regulates the airflow direction. This partition acts to guide the fan's airflow to exhaust ports on both the left and right rear ends. The fan may also be provided with a guide or the like to attach the partition in the appropriate position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-117678 Summary of the Invention [Problem to be solved by the invention]

[0004] It is believed that cooling efficiency can be further improved by having the airflow from the two fans flow not only through the exhaust ports at both ends, but also over the top and bottom surfaces of the board located between them, and flowing from the rear center exhaust port. In such a configuration, it is desirable to install partitions on the front and back of the board so that the airflow flows appropriately toward the rear center exhaust port, spanning between the two fans. However, since the board is somewhat long from side to side and has no guides, it is difficult to attach partitions to the board.

[0005] The present invention has been made in view of the above-mentioned problems, and has an object to provide an electronic device in which a partition wall that can obtain an appropriate airflow can be easily attached to a board. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, an electronic device according to an embodiment of the present invention is an electronic device having a flat housing, comprising at least one fan, a substrate having a through hole arranged to receive the airflow discharged from the fan and dissipate heat, and a first partition and a second partition provided on the front and back of the substrate to seal the space between the substrate and the flat housing to define a space to receive the airflow discharged from the fan, wherein the first partition and the second partition each have a rigid material fixed to the surface of the substrate and an elastic material fixed to the rigid material and elastically compressed between the substrate and the flat housing, the rigid material in the second partition has a protrusion that penetrates the through hole, and the rigid material in the first partition has a fitting portion into which the protrusion fits. [Effects of the Invention]

[0007] According to the above aspect of the present invention, the partition wall that can obtain an appropriate airflow can be easily assembled to the substrate. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment, viewed from above. [Figure 2] FIG. 2 is a plan view schematically showing the internal structure of the housing. [Figure 3] FIG. 3 is a perspective view of the rear edge of the housing as seen from the bottom side. [Figure 4] FIG. 4 is an enlarged cross-sectional view of a part of the housing. [Figure 5] FIG. 5 is an exploded perspective view of the motherboard, the first partition wall, and the second partition wall. [Figure 6] FIG. 6 is a plan view of a portion of the motherboard including the first partition wall. [Figure 7] FIG. 7 is a schematic cross-sectional view of the motherboard, the first partition wall, and the second partition wall. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to these preferred embodiments.

[0010] FIG. 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 according to this embodiment is a clamshell notebook PC. The electronic device 10 has a configuration in which a cover 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game console.

[0011] The cover 11 is a thin, flat, box-shaped housing. The cover 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin, flat box. A keyboard device 18 and a touchpad 19 face the top surface 12a of the housing 12. Hereinafter, the housing 12 and each component mounted thereon will be described based on the posture of an operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (top and bottom) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may similarly be referred to as the Y direction and the Z direction. These directions are defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10, etc.

[0013] The housing 12 can be composed of a plate-like member 20 that forms the top surface 12a, a cover member 21 that forms the bottom surface 12b, and standing wall members 22 that form the four peripheral side surfaces 12c. The plate-like member 20 has a large rectangular opening 20a in which the keyboard device 18 is placed. A bezel 20b that surrounds the keyboard device 18 is formed around the opening 20a. The cover member 21 is formed in a plate shape (see FIG. 3). The standing wall members 22 stand upright between the four peripheral edges of the plate-like member 20 and the four peripheral edges of the cover member 21, and form a frame shape as a whole.

[0014] The hinge 14 is installed in a concave hinge placement groove 12d formed in the rear edge of the housing 12, and connects the housing 12 and the cover 11. The hinge 14 has a structure in which, for example, a hinge shaft 14a serving as a rotation axis is supported at both longitudinal ends of a hinge housing 14b (see FIG. 4). The hinge 14 of this embodiment is configured in a so-called one-bar shape, in which the hinge housing 14b extends along the longitudinal direction of the hinge placement groove 12d. The hinge 14 rotates integrally with the cover 11 and descends obliquely rearward (see FIG. 4). The hinge 14 has a structure that increases the rotation angle of the cover 11 in this way, a so-called drop-down structure. The hinge 14 may have a structure other than that described above.

[0015] Fig. 2 is a plan view that schematically shows the internal structure of the housing 12. Fig. 2 is a view of the inside of the housing 12 as seen from above with the plate-shaped member 20 removed.

[0016] 2, a cooling module 24, a motherboard (substrate) 25, and a battery device 26 are housed inside the housing 12. Various electronic components, mechanical components, etc. are also provided inside the housing 12.

[0017] The motherboard 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the motherboard 25 and extends in the X direction.

[0018] The motherboard 25 of this embodiment is equipped with a CPU (Central Processing Unit) 25a, a GPU (Graphics Processing Unit) 25b, a memory 25c, two SSDs (Solid State Drives) 25d, and the like. In addition to these components, the motherboard 25 can also be equipped with various other electronic components, such as a communication module. The CPU 25a, the GPU 25b, and the memory 25c are mounted between two fans 30, 30 (described below) on the motherboard 25. This portion is also referred to as a central portion 25C. The central portion 25C is slightly elongated in the X direction. The two SSDs 25d are mounted adjacent to the Y1 side of each fan 30 and extend in the X direction.

[0019] The motherboard 25 has, for example, an upper surface (first surface 25A) as a mounting surface for the CPU 25a and the like, and a lower surface (second surface 25B) as an attachment surface for the housing 12.

[0020] The CPU 25a is a heat generating element that generates the largest amount of heat among the electronic components mounted in the housing 12. The cooling module 24 can absorb and diffuse the heat generated by the CPU 25a and discharge it to the outside of the housing 12. The cooling module 24 of this embodiment is configured to cool the GPU 25b and the like in addition to the CPU 25a.

[0021] As shown in FIG. 2, the cooling module 24 of this embodiment includes a metal plate 27, a heat pipe 28, a pair of heat sinks 29, 29, and a pair of fans 30, 30.

[0022] The metal plate 27 is a thin plate made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 27 is a copper plate. The metal plate 27 extends in the X direction between the left and right fans 30. As a result, the metal plate 27 covers the center portion 25C of the motherboard 25, which is disposed between the left and right fans 30, and the CPU 25a mounted on the center portion 25C, from the first surface 25A side (Z1 side). The metal plate 27 functions as a heat diffusion member that absorbs and diffuses heat from the CPU 25a and the like. The metal plate 27 is connected to the surface of the CPU 25a. Between the metal plate 27 and the CPU 25a, for example, thermally conductive grease and a copper block of approximately the same size as the outer shape of the CPU 25a are interposed.

[0023] The heat pipe 28 is a pipe-type heat transport device. The heat pipe 28 is configured by flattening a metal pipe to form a thin, elliptical cross section, with a working fluid sealed inside. Examples of the working fluid include water, alternative chlorofluorocarbons, acetone, and butane. The center of the heat pipe 28 in the longitudinal direction is fixed to the backside of the surface of the metal plate 27 that is connected to the CPU 25a. Both ends of the heat pipe 28 are fixed to the Z1-side surfaces (upper portions 29a) of the left and right heat sinks 29, respectively (see FIG. 4). The center of the longitudinal direction of each heat pipe 28 overlaps with the CPU 25a in the Z direction. This allows the heat pipe 28 to efficiently receive heat from the CPU 25a transferred to the metal plate 27 and transport it to the heat sinks 29 at both ends with high efficiency.

[0024] The heat sink 29 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands in the Z direction on a predetermined base plate and extends in the Y direction. A gap is formed between adjacent fins of the heat sink 29, allowing air sent from the fan 30 to pass through. The heat sink 29 is made of a metal with high thermal conductivity, such as aluminum or copper. The heat sink 29 is disposed opposite the side surface 30a (outlet port 34a) on the Y2 side of the fan 30.

[0025] The pair of fans 30, 30 are arranged side by side in the X direction, straddling the central portion 25C and metal plate 27 of the motherboard 25, and facing each other. Each fan 30 has an outlet 34a on its side surface 30a on the Y2 side. The outlet 34a is adjacent to and faces the heat sink 29 behind it. Each fan 30 may also have an outlet 34b on its side surface 30b facing in the opposing direction. The outlets 34b of the left and right fans 30 face each other across the central portion 25C. Each fan 30 may have an intake port 35 on the lower surface 30d on the Z2 side of its upper and lower surfaces 30c, 30d facing the Z direction. In this embodiment, the upper surface 30c on the Z1 side of the fan 30 abuts against the lower surface 18a of the keyboard device 18 (see FIG. 4).

[0026] Fan 30 is a centrifugal fan that rotates impeller 30e housed inside a housing using a motor (see FIG. 4), allowing fan 30 to draw in air through intake port 35 and discharge it from outlets 34a and 34b.

[0027] Fig. 3 is a perspective view of the rear edge portion of the housing 12 as seen from the bottom surface 12b side. Fig. 4 is an enlarged cross-sectional view of a portion of the housing 12. Fig. 4 is a schematic side cross-sectional view of the rear edge portion of the housing 12 and its surrounding area.

[0028] As shown in Figures 2 to 4, a hinge arrangement groove 12d recessed toward the Y1 side is provided in the Y2-side edge of the housing 12. The hinge arrangement groove 12d can be composed of a notch 20c formed in the plate-shaped member 20 and a rear wall 22A formed in part of the Y2-side standing wall member 22. The notch 20c is a recess formed by cutting out the rear edge of the plate-shaped member 20 toward the Y1 side. Reference numeral 36 denotes a frame member. The heat sink 29 is disposed inside the housing 12 between the rear wall 22A and the discharge port 34a.

[0029] 2 and 3, in the electronic device 10 of this embodiment, the air vents 41 can be divided into three regions A1 to A3 in the X direction. The air vents 41 belonging to the left and right end regions A1 and A2 exhaust air that is discharged from the outlet 34a of the fan 30 and has passed through the left and right heat sinks 29 to the outside of the housing 12. The air vent 41 belonging to the central region A3 (hereinafter also referred to as air vent 41C) exhausts air that is discharged from the outlet 34b of the fan 30 and has passed through the surface of the central metal plate 27 and the front and back surfaces of a central portion 25C of the motherboard 25 to the outside of the housing 12. In other words, the central portion 25C is configured to receive airflow from the two fans 30 and dissipate heat.

[0030] The ventilation opening 41 penetrates the rear wall 22A in the thickness direction (Y direction) and is partitioned into upper and lower sections by a horizontal partition wall 45 extending in the X direction.

[0031] The ventilation opening 41 is divided into a plurality of sections 41a in the X direction by a plurality of support columns (second support columns) 44b arranged along the longitudinal direction (X direction) of the rear wall 22A, for example. The support columns 44b are rods extending along the upright direction (Z direction) of the rear wall 22A. For example, the ventilation openings 41 belonging to the regions A1 and A2 are divided into five sections 41a, and the ventilation opening 41C is divided into four sections 41a (see FIG. 3). It goes without saying that the number of sections 41a of the ventilation opening 41 is not limited to this. The ventilation openings 41 belonging to the regions A1 and A2 are arranged immediately behind the heat sink 29 and face the heat sink 29. The ventilation opening 41C is arranged immediately behind the Y2-side edge of the central portion 25C.

[0032] 3 and 4, the housing 12 has a bottom vent 52 that opens to the bottom surface 12b. The bottom vent 52 is an opening for introducing air outside the housing 12 into the intake port 35 of the fan 30. The bottom vent 52 may extend in the Y direction, for example, and may be configured with a plurality of slit-shaped openings that are narrow in the X direction lined up in the X direction.

[0033] In the electronic device 10, heat generated by heat generating elements such as the CPU 25a is transferred to the metal plate 27 and diffused, and is also efficiently transported to the left and right heat sinks 29 by the heat pipes 28. The left and right fans 30 draw outside air (cool air) from the bottom ventilation opening 52 into the intake port 35 and discharge it from the exhaust ports 34a and 34b.

[0034] The air discharged from the outlets 34a of the left and right fans 30 passes through and is cooled by the heat sink 29. The cooled air (warm air) is discharged to the outside of the housing 12 through the vents 41 belonging to the areas A1 and A2.

[0035] The air discharged from the outlets 34b of the left and right fans 30 flows along the surface of the metal plate 27, cooling the metal plate 27 and the heat pipes 28, and at the same time directly cools the central portion 25C and the electronic components mounted around the CPU 25a and GPU 25b mounted therein. The cooled air (warm air) is discharged to the outside of the housing 12 through the vent 41C.

[0036] Next, we will explain the partition structure 57, which appropriately guides the air discharged from the outlet 34b of the fan 30 to the vent 41C. The partition structure 57 includes front and rear fan partitions 58, a first partition 60, and a second partition 61, as well as fixing means for these.

[0037] Fan partitions 58 are provided on both the top and bottom surfaces of each fan 30. The fan partitions 58 are T-shaped and include a vertical partition 58a extending along the Y direction on the side facing the central portion 25C of the motherboard 25 and a horizontal partition 58b extending along the X direction on the side facing the heat sink 29. The vertical partition 58a and the horizontal partition 58b may be separate bodies. The vertical partition 58a regulates the air discharged from the outlet 34b so that it flows toward the central portion 25C. The horizontal partition 58b regulates the air discharged from the outlet 34a so that it flows toward the heat sink 29. The fan partition 58 is, for example, a member formed into a strip-like shape from sponge or rubber. The fan partition 58, as well as the first partition 60 and second partition 61 described below, do not need to completely block the passage of air, but have an appropriate airtightness that provides a certain amount of airflow resistance and regulates the direction of airflow.

[0038] Fig. 5 is an exploded perspective view of the motherboard 25, the first partition 60, and the second partition 61. Fig. 6 is a plan view of a portion of the motherboard 25 including the first partition 60. Fig. 7 is a schematic cross-sectional view of the motherboard 25, the first partition 60, and the second partition 61. Fig. 7 shows the position where the protrusion 67b fits into the positioning hole (through hole) 25g and the fitting portion 63b, but the same is true for the position where the protrusion 67a fits into the positioning hole 25f and the fitting portion 63a, and the position where the protrusion 67c fits into the positioning hole 25h and the fitting portion 63c.

[0039] To ensure that the air discharged from the outlets 34b of the left and right fans 30 flows appropriately toward the ventilation openings 41C, the vertical partitions 58a prevent the air from inappropriately flowing in the X direction, and the first and second partitions 60 and 61 are also provided to prevent the air from inappropriately flowing in the Y1 direction. In other words, the first and second partitions 60 and 61 define a space that receives the airflow discharged from the fans 30.

[0040] The first partition 60 and the second partition 61 are provided so as to span the space between the two fans 30 and to substantially follow the edge 25e on the Y1 side so as not to restrict the component mounting area in the central portion 25C of the motherboard 25. The first partition 60 is provided on the first surface 25A of the motherboard 25, and the second partition 61 is provided on the second surface 25B. The fan partition 58, the first partition 60, and the second partition 61 are basically strip-shaped and have the same width. The partitions 58, 60, and 61 are appropriately thin, for example, about 4 mm, while still ensuring airtightness and strength. The partitions 58, 60, and 61 are lightweight and inexpensive.

[0041] The end 60a of the first partition 60 on the X1 side is inclined, and the end 60b on the X2 side is crank-shaped, so as to avoid the SSDs 25d. The two SSDs 25d are located in a position where they are not exposed to the air blown from the outlet 34b, but separate heat dissipation measures, such as the provision of a heat sink, are taken. The Y2 sides of the ends 60a and 60b are in contact or nearly in contact with the end of the vertical partition 58a on the first surface 25A side. The central portion 60c between the ends 60a and 60b of the first partition 60 extends elongatedly in the X direction.

[0042] The end 61a on the X1 side and the end 61b on the X2 side of the second partition 61 extend briefly in the Y direction, and the Y2 side is in contact or nearly in contact with the end of the vertical partition 58a on the second surface 25B side. The central portion 61c between the ends 61a and 61b of the second partition 60 extends longitudinally in the X direction, and both ends are perpendicular to the ends 61a and 61b. The central portion 60c of the first partition 60 is positioned so as to overlap the central portion 61c of the second partition 61 along its entire length.

[0043] The motherboard 25 has three small positioning holes 25f, 25g, and 25h formed therein as positioning means for the first partition 60 and the second partition 61. The positioning holes 25f, 25g, and 25h are through-holes. The positioning hole 25f is located near the Y1 end and the X2 end of the X1-side fan 30. The positioning hole 25g is located approximately in the left-right center of the central portion 25C, near the Y1 end. The positioning hole 25h is located near the Y1 end and the X1 end of the X2-side fan 30. The positioning hole 25g is located approximately midway between the positioning holes 25f and 25h. A silkscreen mark 62 is printed on the first surface 25A in a region including the positioning holes 25f, 25g, and 25h where the first partition 60 will be placed. Although not shown, a similar mark is printed on the second surface 25B in a region where the second partition 61 will be placed.

[0044] The first partition wall 60 has a two-layer structure of a rigid material 63 and an elastic material 64, which are bonded together with adhesive tape 65. The rigid material 63 has three fitting portions 63a, 63b, and 63c formed on its Z1 side surface facing the motherboard 25. The fitting portions 63a, 63b, and 63c are blind holes that open to the Z1 side and are formed at positions corresponding to the positioning holes 25f, 25g, and 25h. The rigid material 63 is fixed to the position of the mark 62 on the motherboard 25 with adhesive tape 66. The adhesive tape 66 has three holes 66a, 66b, and 66c formed at positions corresponding to the fitting portions 63a, 63b, and 63c.

[0045] The second partition wall 61 has a two-layer structure of a resin rigid material 67 and an elastic material 68, which are bonded together with adhesive tape 69. The rigid material 67 has three protrusions 67a, 67b, and 67c formed on the Z2 side surface facing the motherboard 25. The rigid material 67 is fixed to the motherboard 25 with adhesive tape 70. The adhesive tape 70 has three holes 70a, 70b, and 70c formed in positions corresponding to the protrusions 67a, 67b, and 67c.

[0046] The protrusions 67a, 67b, 67c protrude toward the Z2 side and are formed at positions corresponding to the positioning holes 25f, 25g, 25h, and are adapted to penetrate the positioning holes 25f, 25g, 25h and fit into the fitting portions 63a, 63b, 63c. The protrusions 67a, 67b, 67c are long enough to fit into the fitting portions 63a, 63b, 63c to a depth appropriate for positioning, but do not reach the bottom.

[0047] The positioning holes 25f-25h, the fitting portions 63a-63c, the holes 66a-66c, 70a-70c, and the protrusions 67a-67c are circular and have a diameter of, for example, about 2 mm. The rigid members 63 and 67 are made of a material that is moderately hard and insulating, such as resin. The rigid members 63 and 67 are made of a material that is more rigid than the elastic members 64 and 68, and may have a certain degree of flexibility. The rigid members 63 and 67 may also be called hard materials. The elastic members 64 and 68 are made of an elastically compressible material, such as sponge or rubber. The elastic member 64 is compressed between the rigid member 63 and the cover member 21, and the elastic member 68 is compressed between the rigid member 67 and the keyboard device 18. This seals the gap between the first surface 25A and the second surface 25B of the motherboard 25 and the cover member 21 and keyboard device 18 that form part of the housing, separating the area in the central portion 25C where components such as the CPU 25a, GPU 25b, memory 25c are mounted from the area of ​​the battery device 26 on the Y1 side thereof in an airtight state, defining the flow path of the air discharged from the outlets 34b of the left and right fans 30, and ensuring that the airflow flows appropriately to the ventilation opening 41C.

[0048] The gap distance d1 between the first surface 25A of the motherboard 25 and the cover member 21 is longer than the gap distance d2 between the second surface 25B of the motherboard 25 and the keyboard device 18. Correspondingly, the thickness T1 of the rigid member 63 in the first partition wall 60 is thicker than the thickness of the rigid member 67 in the second partition wall 61.

[0049] Since the rigid material 63 is thicker than the rigid material 67, the formation of the fitting portions 63a to 63c does not have much effect on the reduction in strength. Furthermore, since the fitting portions 63a to 63c are bottomed holes, the reduction in strength of the rigid material 63 at these portions is suppressed compared to the case where they are through holes, and the adhesion between the rigid material 63 and the elastic material 64 does not become discontinuous at these portions. However, depending on the conditions, the fitting portions 63a to 63c may be through holes.

[0050] The first partition wall 60 and the second partition wall 61 are provided so as to cross the central portion 25C that is relatively long in the X direction. However, since the elastic members 64 and 68 are fixed to the rigid members 63 and 67, their shapes are stable, and even without a guide portion other than the mark 62, it is easy to align them at a predetermined position.

[0051] The first partition wall 60 and the second partition wall 61 are used as positioning means that also serve as the positioning holes 25f to 25h of the mother board 25. Therefore, the number of the positioning holes 25f to 25h is basically half of that in the case where dedicated positioning portions are provided for the first partition wall 60 and the second partition wall 61 respectively. Further, only the protrusions 67a to 67c of the second partition wall 61 are fitted into the positioning holes 25f to 25h, and since there is no fitting for the first partition wall 60 with respect to the positioning holes 25f to 25h, the operation is clear and it can be easily assembled to the mother board 25.

[0052] The first partition wall 60 and the second partition wall 61 slightly press the mother board 25 when the elastic members 64 and 68 are compressed. However, since their long central portions 60c and 61c overlap, they are balanced, and almost no bending force or torsional force acts on the mother board 25. Since the magnitudes of the gap distances d1 and d2 differ depending on the model, when d1 < d2, T1 < T2, and the fitting portions 63a to 63c and the protrusions 67a to 67c may be reversed.

[0053] In the above embodiment, two fans 30 are provided, and the first partition wall 60 and the second partition wall 61 are provided so as to extend between the two fans 30. However, at least one fan 30 is provided, and the first partition wall 60 and the second partition wall 61 may be provided on the front and back of the mother board 25 in order to define a space for receiving the air flow discharged from the fan 30. For example, when only one of the two fans 30 in the above embodiment is provided, the first partition wall 60 and the second partition wall 61 may be L-shaped extending between the end of the fan 30 and the end of the vent 41C.

[0054] The present invention is not limited to the above-described embodiments, and it is needless to say that it can be freely changed without departing from the gist of the present invention. [Explanation of symbols]

[0055] 10 Electronic equipment 11 Lid 12. Case 18 Keyboard device (casing) 21 Cover member (housing) 25 Motherboard (circuit board) 25C center part (board) 25f, 25g, 25h Positioning holes (through holes) 30 fans 34a,34b Discharge port 41,41C Ventilation hole 52 Bottom vent 57 Bulkhead structure 58 Fan bulkhead 60 1st bulkhead 61 2nd bulkhead 62 Landmark 63,67 Rigid material 63a, 63b, 63c fitting part 64,68 Elastic material 65, 66, 69, 70 Adhesive tape 67a,67b,67c protrusion

Claims

1. An electronic device having a flat housing, With at least one fan a substrate having a through hole and disposed so as to receive the airflow discharged from the fan and dissipate heat; a first partition wall and a second partition wall provided on the front and rear sides of the substrate to close the gap between the substrate and the flat housing, in order to define a space that receives the airflow discharged from the fan; and The first partition wall and the second partition wall each include: a rigid member fixed to a surface of the substrate; an elastic material fixed to the rigid material and elastically compressed between the rigid material and the flat housing; and the rigid member of the second partition wall has a protrusion that penetrates the through-hole, The rigid material of the first partition wall has a fitting portion into which the protrusion fits. An electronic device characterized by:

2. 10. The electronic device according to claim 1, Two of the fans are provided, the substrate is disposed between the two fans; The first partition wall and the second partition wall are provided so as to extend between the two fans. An electronic device characterized by:

3. 10. The electronic device according to claim 1, The rigid material in the first partition wall is thicker than the rigid material in the second partition wall. An electronic device characterized by:

4. 10. The electronic device according to claim 1, The fitting portion is a bottomed hole. An electronic device characterized by:

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