Substrate polishing device and substrate processing device

Abstract

To ease influence of twisting on a pure water supply pipeline.SOLUTION: A substrate polishing device 21 includes: a rotary polishing table; a polishing head 24 which holds a substrate and presses the substrate against the polishing table; a swing arm 60 which swings the polishing head 24; a bearing device 80 which is disposed in the swing arm 60 and pivotally supports the polishing head 24; and a pure water supply pipeline 100 which is introduced into the swing arm 60 and supplies pure water to the bearing device 80. The pure water supply pipeline 100 includes a spiral part 101 which is wound around a swing axis O2 of the swing arm 60.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate polishing apparatus and a substrate processing apparatus. [Background technology]

[0002] Conventionally, there has been known a substrate polishing apparatus that performs chemical mechanical polishing (CMP) to flatten the surface of a substrate such as a silicon wafer. This substrate polishing apparatus includes a rotating polishing table, a polishing head that holds the substrate and presses the substrate against the polishing table, and a swing arm that swings the polishing head (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-147990 Summary of the Invention [Problem to be solved by the invention]

[0004] A bearing device that supports the polishing head is provided inside the swing arm. The bearing device generates heat as the polishing head rotates, so it must be cooled with cooling water. The cooling water also serves the purpose of lubricating the sliding surfaces in environments where lubricating oil cannot be used. Clean, pure water, which has little effect on the substrate, is preferable as the cooling water. In this case, a pure water supply pipe is introduced from the outside into the swing arm and connected to the bearing device. However, because the swing arm swings, the pure water supply pipe may twist, blocking the flow path within the pipe, or the pipe itself may be damaged by the continuous force caused by the twisting.

[0005] The present invention has been made in view of the above problems, and has as its object to mitigate the influence of twisting on the pure water supply pipe. [Means for solving the problem]

[0006] A substrate polishing apparatus according to one aspect of the present invention comprises a rotating polishing table, a polishing head that holds a substrate and presses the substrate against the polishing table, a swing arm that swings the polishing head, a bearing device that is disposed inside the swing arm and supports the polishing head, and a pure water supply pipe that is introduced into the swing arm and supplies pure water to the bearing device, wherein the pure water supply pipe has a spiral portion that is wound around the swing axis of the swing arm.

[0007] In the substrate polishing apparatus described above, an opening may be formed on the upper surface of the swing arm on the swing axis, and the pure water supply pipe may include a first straight section extending upward from the spiral section and passing through the opening, and a second straight section extending from the upper end of the first straight section in a direction intersecting the swing axis and fixed to the outside of the swing arm.

[0008] In the substrate polishing apparatus, the first linear portion may be disposed along the swing axis.

[0009] In the substrate polishing apparatus, the spiral portion may be extendable and contractible in the vertical direction.

[0010] In the substrate polishing apparatus, the pure water supply pipe may be made of perfluoroalkoxyalkane.

[0011] A substrate processing apparatus according to one aspect of the present invention includes the substrate polishing apparatus for polishing a substrate, and a substrate cleaning apparatus for cleaning the substrate polished by the substrate polishing apparatus. [Effects of the Invention]

[0012] According to the above aspect of the present invention, the influence of twisting on the pure water supply pipe can be reduced. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Figure 2] 1 is a perspective view of a substrate polishing apparatus according to an embodiment; [Figure 3] 1 is a configuration diagram of a substrate polishing apparatus according to an embodiment; [Figure 4] FIG. 2 is a plan view of a swing arm according to one embodiment. [Figure 5] 1 is a perspective view of a pure water supply pipe according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0015] FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus 1 according to one embodiment. 1 is a chemical mechanical polishing (CMP) apparatus that polishes the surface of a substrate W such as a silicon wafer to a flat surface. The substrate processing apparatus 1 includes a rectangular box-shaped housing 2. The housing 2 is formed in a substantially rectangular shape in a plan view.

[0016] The substrate W to be processed includes various devices such as semiconductor wafers, glass substrates (for liquid crystal display devices and plasma displays), optical disk substrates, magneto-optical disk substrates, magnetic disk substrates, printed wiring boards, memory circuit substrates, logic circuit substrates, and image sensor substrates (e.g., CMOS sensor substrates). The shape is not limited to a circular shape, and may be rectangular, for example. In the case of a circular semiconductor wafer, the size of the wafer may be, for example, 100 mm, 150 mm, 200 mm, 300 mm, or 450 mm in diameter.

[0017] The housing 2 has a substrate transport path 3 extending longitudinally through its center. A load / unload unit 10 is disposed at one longitudinal end of the substrate transport path 3. A polishing unit 20 is disposed on one side of the width direction of the substrate transport path 3 (a direction perpendicular to the longitudinal direction in a plan view), and a cleaning unit 30 is disposed on the other side. A transport unit 40 that transports substrates W is provided on the substrate transport path 3. The substrate processing apparatus 1 also has a control unit 50 (control panel) that controls the overall operations of the load / unload unit 10, polishing unit 20, cleaning unit 30, and transport unit 40.

[0018] The load / unload unit 10 includes a front load unit 11 that accommodates substrates W. A plurality of front load units 11 are provided on one longitudinal side of the housing 2. The plurality of front load units 11 are arranged in the width direction of the housing 2. The front load unit 11 is equipped with, for example, an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF and FOUP are airtight containers that accommodate cassettes of substrates W and are covered with a partition wall, and can maintain an environment that is independent from the external space.

[0019] The loading / unloading section 10 also includes two transport robots 12 that take in and out substrates W from the front loading section 11, and a traveling mechanism 13 that causes each transport robot 12 to travel along the row of front loading sections 11. Each transport robot 12 has two hands, one on top and one on bottom, which are used before and after processing of the substrate W. For example, the upper hand is used when returning the substrate W to the front loading section 11, and the lower hand is used when removing the unprocessed substrate W from the front loading section 11.

[0020] The polishing section 20 includes a plurality of substrate polishing apparatuses 21 (21A, 21B, 21C, 21D) that polish (planarize) substrates W. The plurality of substrate polishing apparatuses 21 are arranged in the longitudinal direction of the substrate transport path 3. Each substrate polishing apparatus 21 includes a polishing table 23 that rotates a polishing pad 22 having a polishing surface, a polishing head 24 that holds the substrate W and polishes the substrate W while pressing it against the polishing pad 22 on the polishing table 23, a polishing liquid supply nozzle 25 that supplies a polishing liquid or a dressing liquid (e.g., pure water) to the polishing pad 22, a dresser 26 that dresses the polishing surface of the polishing pad 22, and an atomizer 27 that sprays a mist of a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) onto the polishing surface.

[0021] In the substrate polishing apparatus 21, a polishing liquid is supplied onto the polishing pad 22 from a polishing liquid supply nozzle 25, while a polishing head 24 presses a substrate W against the polishing pad 22. The polishing head 24 and polishing table 23 are then moved relative to each other to polish the substrate W and flatten its surface. The dresser 26 has hard particles, such as diamond particles or ceramic particles, fixed to the rotating part at the tip that contacts the polishing pad 22. The dresser rotates and oscillates the rotating part, uniformly dressing the entire polishing surface of the polishing pad 22 to form a flat polished surface. The atomizer 27 uses high-pressure fluid to wash away polishing debris and abrasive grains remaining on the polishing surface of the polishing pad 22, thereby cleaning the polished surface and reconditioning it using the mechanical contact of the dresser 26, i.e., regenerating the polished surface.

[0022] The cleaning section 30 includes a plurality of substrate cleaning apparatuses 31 (31A, 31B) that clean substrates W, and a substrate drying apparatus 32 that dries the cleaned substrates W. The plurality of substrate cleaning apparatuses 31 and substrate drying apparatuses 32 are arranged in the longitudinal direction of the substrate transport path 3. A first transfer chamber 33 is provided between the substrate cleaning apparatus 31A and the substrate cleaning apparatus 31B. The first transfer chamber 33 is provided with a transfer robot 35 that transfers substrates W between the transport section 40, the substrate cleaning apparatus 31A, and the substrate cleaning apparatus 31B. A second transfer chamber 34 is provided between the substrate cleaning apparatus 31B and the substrate drying apparatus 32. The second transfer chamber 34 is provided with a transfer robot 36 that transfers substrates W between the substrate cleaning apparatus 31B and the substrate drying apparatus 32.

[0023] Substrate cleaning apparatus 31A includes, for example, a module (hereinafter referred to as a roll-type cleaning module) having a roll-type substrate cleaning member (the surface of which is a PVA (polyvinyl alcohol) sponge or a urethane sponge) and performs primary cleaning of substrate W. Substrate cleaning apparatus 31B also includes a roll-type cleaning module and performs secondary cleaning of substrate W. Note that substrate cleaning apparatus 31A and substrate cleaning apparatus 31B may be the same type or different types of cleaning modules, such as a cleaning module having a pencil-type substrate cleaning member or a cleaning module having a two-fluid jet nozzle that ejects gas and gas.

[0024] The substrate drying apparatus 32 includes a drying module that performs, for example, Rotagoni drying (IPA (Iso-Propyl Alcohol) drying). After drying, a shutter 1a provided in a partition between the substrate drying apparatus 32 and the load / unload unit 10 is opened, and the transfer robot 12 removes the substrate W from the substrate drying apparatus 32.

[0025] Note that "cleaning" includes not only normal cleaning using a liquid such as a chemical solution or pure water (called wet cleaning in this embodiment) but also cleaning that does not use a liquid during cleaning (called dry cleaning). In other words, one of substrate cleaning apparatus 31A and substrate cleaning apparatus 31B may be a wet cleaning unit and the other a dry cleaning unit. Note that if wet cleaning is performed before dry cleaning, the above-mentioned substrate drying apparatus 32 may be provided to dry the substrate W.

[0026] The transport section 40 includes a lifter 41, a first linear transporter 42, a second linear transporter 43, and a swing transporter 44. The substrate transport path 3 is provided with a first transfer position TP1, a second transfer position TP2, a third transfer position TP3, a fourth transfer position TP4, a fifth transfer position TP5, a sixth transfer position TP6, and a seventh transfer position TP7, in that order from the loading / unloading section 10 side.

[0027] The lifter 41 is a mechanism that transports the substrate W up and down at the first transport position TP1. The lifter 41 receives the substrate W from the transport robot 12 of the load / unload section 10 at the first transfer position TP1. The lifter 41 also delivers the substrate W received from the transport robot 12 to the first linear transporter 42. A shutter 1b is provided on a partition wall between the first transfer position TP1 and the load / unload section 10, and when the substrate W is to be transported, the shutter 1b is opened and the substrate W is delivered from the transport robot 12 to the lifter 41.

[0028] The first linear transporter 42 is a mechanism that transports the substrate W between the first transfer position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4. The first linear transporter 42 includes a plurality of transport hands 45 (45A, 45B, 45C, 45D) and a linear guide mechanism 46 that moves each transport hand 45 horizontally at a plurality of heights. The transport hand 45A moves between the first transport position TP1 and the fourth transport position TP4 by means of a linear guide mechanism 46. The transport hand 45A is a pass hand for receiving the substrate W from the lifter 41 and transferring it to the second linear transporter 43.

[0029] The transport hand 45B moves between a first transfer position TP1 and a second transfer position TP2 by a linear guide mechanism 46. This transport hand 45B receives the substrate W from the lifter 41 at the first transfer position TP1, and delivers the substrate W to the substrate polishing apparatus 21A at the second transfer position TP2. The transport hand 45B is provided with an elevation drive unit that rises when delivering the substrate W to the polishing head 24 of the substrate polishing apparatus 21A, and descends after delivering the substrate W to the polishing head 24. Note that the transport hands 45C and 45D are also provided with similar elevation drive units.

[0030] The transport hand 45C moves between the first transfer position TP1 and the third transfer position TP3 by means of a linear guide mechanism 46. The transport hand 45C receives the substrate W from the lifter 41 at the first transfer position TP1, and delivers the substrate W to the substrate polishing apparatus 21B at the third transfer position TP3. The transport hand 45C also functions as an access hand that receives the substrate W from the polishing head 24 of the substrate polishing apparatus 21A at the second transfer position TP2, and delivers the substrate W to the substrate polishing apparatus 21B at the third transfer position TP3.

[0031] The transport hand 45D moves between the second transfer position TP2 and the fourth transfer position TP4 by the linear guide mechanism 46. The transport hand 45D functions as an access hand for receiving the substrate W from the polishing head 24 of the substrate polishing apparatus 21A or the substrate polishing apparatus 21B at the second transfer position TP2 or the third transfer position TP3, and for transferring the substrate W to the swing transporter 44 at the fourth transfer position TP4.

[0032] The swing transporter 44 has a hand that is movable between the fourth transfer position TP4 and the fifth transfer position TP5, and transfers the substrate W from the first linear transporter 42 to the second linear transporter 43. The swing transporter 44 also transfers the substrate W polished in the polishing unit 20 to the cleaning unit 30. A temporary placement table 47 for the substrate W is provided on the side of the swing transporter 44. The swing transporter 44 turns the substrate W received at the fourth transfer position TP4 or the fifth transfer position TP5 upside down and places it on the temporary placement table 47. The substrate W placed on the temporary placement table 47 is transferred to the first transfer chamber 33 by the transfer robot 35 of the cleaning unit 30.

[0033] The second linear transporter 43 is a mechanism that transports substrates W between a fifth transfer position TP5, a sixth transfer position TP6, and a seventh transfer position TP7. The second linear transporter 43 includes multiple transport hands 48 (48A, 48B, 48C) and a linear guide mechanism 49 that moves each transport hand 45 horizontally at multiple heights. The transport hand 48A moves between the fifth transfer position TP5 and the sixth transfer position TP6 by the linear guide mechanism 49. The transport hand 45A functions as an access hand that receives the substrate W from the swing transporter 44 and delivers it to the substrate polishing apparatus 21C.

[0034] The transport hand 48B moves between the sixth transfer position TP6 and the seventh transfer position TP7. The transport hand 48B functions as an access hand for receiving a substrate W from the substrate polishing apparatus 21C and transferring it to the substrate polishing apparatus 21D. The transport hand 48C moves between the seventh transfer position TP7 and the fifth transfer position TP5. The transport hand 48C functions as an access hand for receiving a substrate W from the polishing head 24 of the substrate polishing apparatus 21C or the substrate polishing apparatus 21D at the sixth transfer position TP6 or the seventh transfer position TP7 and transferring the substrate W to the swing transporter 44 at the fifth transfer position TP5. Although not described here, the operation of the transport hand 48 when transferring a substrate W is the same as that of the first linear transporter 42 described above.

[0035] FIG. 2 is a perspective view of a substrate polishing apparatus 21 according to an embodiment. 2, the substrate polishing apparatus 21 includes a polishing table 23 that rotates about a central axis O1, a polishing head 24 that holds a substrate W and presses the substrate W against the polishing table 23, and a swing arm 60 that swings the polishing head 24 about a swing axis O2. The swing axis O2 of the swing arm 60 extends parallel to the central axis O1 of the polishing table 23.

[0036] The polishing head 24 is configured to be able to hold the substrate W on its lower surface by vacuum suction. The swing arm 60 is configured to be able to swing about an arm shaft 61. An opening 62 is formed on the upper surface of the swing arm 60 on the swing axis O2. From the opening 62, a pure water supply pipe 100, various pipes other than the pure water supply pipe 100 (air pipes, etc.), and various electrical wiring, which will be described later, are introduced into the swing arm 60.

[0037] FIG. 3 is a configuration diagram of a substrate polishing apparatus 21 according to an embodiment. The swing arm 60 includes an arm body 60A connected to the upper end of an arm shaft 61, and an arm cover 60B that covers the arm body 60A. Inside the swing arm 60, there are provided a rotation device 70 that rotates the polishing head 24, a bearing device 80 that supports the polishing head 24, and an elevation device 90 that raises and lowers the polishing head 24.

[0038] A retainer ring 24a that can move up and down to adjust the amount of polishing of the substrate W is provided on the underside of the polishing head 24. A polishing head shaft 24b is connected to the upper surface of the polishing head 24. The polishing head shaft 24b is connected to a rotating cylinder 73 via a key (not shown) that extends in the vertical direction. The rotation device 70 rotates the rotating cylinder 73 via a polishing head motor 71, a timing pulley 72, and a timing belt 74. When the rotating cylinder 73 rotates, the polishing head 24 connected to the polishing head shaft 24b rotates.

[0039] The bearing device 80 includes a bearing 81 that supports the polishing head shaft 24b, and a rotary joint 82 attached to the upper end of the polishing head shaft 24b. The bearing 81 is supported by an elevator device 90 so that it can move up and down. A pure water supply pipe 100, which will be described later, is connected to the rotary joint 82 via a pipe connector 110 and a connection pipe 111. The pure water supply pipe 100 supplies pure water to the rotary joint 82 as quench water (cooling water). An air pipe (not shown) or the like that generates negative pressure on the underside of the polishing head 24 via the polishing head shaft 24b is connected to the rotary joint 82.

[0040] The lifting device 90 includes a lifting motor 91, a ball screw device 92, and a bridge 93. The lifting motor 91 is fixed to the arm body 60A via a support base 94. The ball screw device 92 includes a screw shaft connected to the lifting motor 91 and a nut into which the screw shaft is threaded. The nut is connected to the bridge 93. When the lifting motor 91 is rotated, the bridge 93 moves up and down via the ball screw device 92, thereby moving the polishing head shaft 24b and the polishing head 24 up and down. The height of the polishing head 24 can be measured by a height sensor facing the bridge 93.

[0041] Fig. 4 is a plan view of a swing arm 60 according to one embodiment. Fig. 5 is a perspective view of a pure water supply pipe 100 according to one embodiment. The swing arm 60 swings as shown in Fig. 4. Specifically, the swing arm 60 swings at an angle θ1 while the substrate W is being polished. The swing arm 60 also swings at an angle θ2 when the substrate W is transferred. That is, the swing arm 60 swings at an angle θ3 which is the sum of the angles θ1 and θ2. Specifically, the angle θ3 is set within a range of 110° to 150°, preferably within a range of 120° to 140°, and more preferably within a range of 125° to 135°.

[0042] The pure water supply pipe 100 has a shape that reduces the influence of the swinging of the swing arm 60. Specifically, as shown in FIG. 5, the pure water supply pipe 100 includes a spiral section 101, a first straight section 102, and a second straight section 103. The pure water supply pipe 100 is made of, for example, PFA (perfluoroalkoxyalkane), which has excellent heat resistance, water repellency, chemical resistance, and flexibility. However, the pure water supply pipe 100 may be made of a fluororesin other than PFA or other material that has chemical resistance, heat resistance, and ease of processing, as long as it has a predetermined flexibility.

[0043] A fixed portion 101a is attached to the lower end of the spiral portion 101, and the fixed portion 101a can be connected to a pipe connector 110 (see FIG. 3) inside the swing arm 60. The spiral portion 101 is wound around the swing axis O2 of the swing arm 60. This allows the pure water supply pipe 100 to flexibly follow twisting around the swing axis O2. The spiral portion 101 is also extendable and contractible in the vertical direction. This allows the pure water supply pipe 100 to flexibly respond not only to the swing of the swing arm 60, but also to small vibrations occurring during polishing of the substrate W and individual differences in the installation position of the pipe. The diameter of the spiral portion 101 may be within the space at the installation location. The pitch of the spiral portion 101 may be uniform or uneven.

[0044] The first linear portion 102 is disposed along the oscillation axis O2. As shown in FIG. 3, the first linear portion 102 extends upward from the spiral portion 101 and passes through the opening 62 of the arm cover 60B. The second linear portion 103 extends from the upper end of the first linear portion 102 in a direction intersecting the oscillation axis O2 (in this embodiment, perpendicular to the direction). A fixed portion 103a is provided at the end of the second linear portion 103. The fixed portion 103a is fixed to, for example, a connector (not shown) provided in a housing surrounding the substrate polishing apparatus 21, and is connected to a pure water supply device (not shown) via the connector.

[0045] According to the substrate polishing apparatus 21 having the above configuration, the pure water supply pipe 100 includes the spiral portion 101 wound around the swing axis O2 of the swing arm 60, and therefore, even if the swing arm 60 swings as shown in Fig. 4, it is possible to absorb twisting of the pipe caused by the swinging. Therefore, the flow path in the pure water supply pipe 100 is not blocked by twisting, and excessive force is not continuously applied to the pure water supply pipe 100, so that damage to the pipe itself can be prevented.

[0046] As described above, the substrate polishing apparatus 21 according to this embodiment includes a rotating polishing table 23, a polishing head 24 that holds a substrate W and presses the substrate W against the polishing table 23, a swing arm 60 that swings the polishing head 24, a bearing device 80 that is disposed inside the swing arm 60 and supports the polishing head 24, and a pure water supply pipe 100 that is introduced into the swing arm 60 and supplies pure water to the bearing device 80. The pure water supply pipe 100 includes a spiral portion 101 that is wound around the swing axis O2 of the swing arm 60. This configuration can mitigate the effects of torsion on the pure water supply pipe 100.

[0047] In this embodiment, an opening 62 is formed on the upper surface of the swing arm 60 on the swing axis O2, and the pure water supply pipe 100 includes a first straight portion 102 that extends upward from the spiral portion 101 and passes through the opening 62, and a second straight portion 103 that extends from the upper end of the first straight portion 102 in a direction intersecting the swing axis O2 and is fixed to the outside of the swing arm 60. With this configuration, the pure water supply pipe 100 can be introduced into the swing arm 60 from the limited space above the swing arm 60, allowing pure water to be stably supplied to the bearing device 80. Note that, although pure water is supplied to the rotary joint 82 in this embodiment, pure water may also be supplied to the bearing 81 in order to cool it.

[0048] In this embodiment, the first straight portion 102 is disposed along the oscillation axis O2. With this configuration, the center of the spiral portion 101 coincides with the oscillation axis O2, and the portion above the spiral portion 101 is slim, making it less likely to interfere with other piping or electrical wiring.

[0049] In this embodiment, the spiral portion 101 is extendable in the vertical direction. This configuration can flexibly accommodate and absorb small vibrations that occur during polishing of the substrate W and individual differences in the installation positions of the piping.

[0050] In this embodiment, the pure water supply pipe 100 is made of perfluoroalkoxyalkane. This configuration allows the pure water supply pipe 100 to have excellent heat resistance, water repellency, chemical resistance, and flexibility.

[0051] The substrate processing apparatus 1 according to this embodiment also includes a substrate polishing apparatus 21 that polishes a substrate W, and a substrate cleaning apparatus 31 that cleans the substrate W polished by the substrate polishing apparatus 21. This configuration can mitigate the influence of twisting on the pure water supply pipe 100.

[0052] While preferred embodiments of the present invention have been described and illustrated, it should be understood that these are illustrative of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Accordingly, the present invention should not be deemed limited by the foregoing description, but rather by the scope of the claims.

[0053] For example, in the above embodiment, the spiral portion 101 is provided at the bottom of the pure water supply pipe 100, but the spiral portion 101 may be provided at any position in the vertically extending portion of the pure water supply pipe 100. Furthermore, the spiral portion 101 may be provided over the entire vertically extending portion of the pure water supply pipe 100. Furthermore, the number of turns of the spiral portion 101 needs to be at least one.

[0054] Furthermore, for example, a hollow cylinder may be placed inside the spiral portion 101 to support the spiral portion 101 from the inside, thereby suppressing tilt of the pure water supply pipe 100 relative to the vertical direction. When a hollow cylinder is placed inside the spiral portion 101, it is preferable to make the outer diameter of the hollow cylinder slightly smaller than the inner diameter of the spiral portion 101 in order to prevent friction between the spiral portion 101 and the hollow cylinder. However, since providing a hollow cylinder increases the number of parts and costs, it is preferable to provide a spiral section 101 at the bottom of the pure water supply pipe 100, as in the present embodiment described above, so that it can also accommodate tilts relative to the vertical direction.

[0055] For example, in the above embodiment, a configuration in which the substrate polishing apparatus of the present invention is installed in a CMP substrate processing apparatus is exemplified, but the substrate polishing apparatus may be a stand-alone apparatus, and this configuration can also be applied to apparatuses other than CMP apparatuses (e.g., back surface polishing apparatuses, bevel polishing apparatuses, etc.). [Explanation of symbols]

[0056] 1. Substrate processing equipment 21 Substrate polishing equipment 23 Polishing table 24 Polishing Head 31 Substrate cleaning equipment 60 Swing arm 62 Opening 80 Bearing device 100 Pure water supply piping 101 Spiral Section 101a Fixed part 102 1st straight section 103 2nd straight section 103a Fixed part 110 Pipe Connector O1 center axis O2 swing axis W substrate θ1 angle θ2 angle θ3 angle

Claims

1. A rotating polishing table, a polishing head that holds a substrate and presses the substrate against the polishing table; a swing arm for swinging the polishing head; a bearing device disposed inside the swing arm and supporting the polishing head; a pure water supply pipe that is introduced into the swing arm and supplies pure water to the bearing device, the pure water supply pipe includes a spiral portion wound around the swing axis of the swing arm; Substrate polishing equipment.

2. An opening is formed on the upper surface of the swing arm on the swing axis line, The pure water supply pipe is a first linear portion extending upward from the spiral portion and passing through the opening; a second straight portion extending from an upper end of the first straight portion in a direction intersecting the swing axis and fixed to the outside of the swing arm, 2. The substrate polishing apparatus according to claim 1.

3. The first linear portion is disposed along the swing axis.

3. The substrate polishing apparatus according to claim 2.

4. The spiral portion is extendable in the vertical direction.

4. The substrate polishing apparatus according to claim 1.

5. the pure water supply pipe is formed from a perfluoroalkoxyalkane; 4. The substrate polishing apparatus according to claim 1.

6. a substrate polishing apparatus according to any one of claims 1 to 3 for polishing a substrate; a substrate cleaning apparatus that cleans the substrate polished by the substrate polishing apparatus. Substrate processing equipment.

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