Optical device and optical system

Abstract

To provide an optical device that restrains contamination from being caused by siloxane, and an optical system.SOLUTION: An optical device comprises a laser emission part, a silicone component-containing member, and a light shielding part for intercepting a laser beam, which is emitted from the laser emission part, from the member.SELECTED DRAWING: Figure 3A

Description

[Technical Field]

[0001] The present disclosure relates to optical devices and optical systems. [Background technology]

[0002] Organosilicones (siloxanes) are found in a variety of products, including silicone rubbers used inside electrical components and mechanical products, oils, adhesives, and shampoos and conditioners.

[0003] Low molecular weight siloxane volatilizes from silicone materials. If the volatilized low molecular weight siloxane adheres to electrical components (such as relays or motors), it can cause contact failure. Similarly, in light source devices that use semiconductor lasers, SiO2 (silicon dioxide) can adhere and accumulate at the laser emission point, degrading the laser characteristics and shortening the lifespan of the semiconductor laser.

[0004] In order to prevent the adhesion of contaminants such as siloxane to the end faces of semiconductor laser chips, techniques have been disclosed that prevent the adhesion of contaminants to the end faces of semiconductor laser chips by isolating them from the external environment with a case or by flowing gas inside the light source device (see, for example, Patent Document 1).

[0005] The optical device disclosed in Patent Document 1 includes an optical component arranged opposite to a light emission surface from which laser light is emitted and spaced apart from the light emission surface, a case that houses a semiconductor laser element and the optical component and has an inlet for introducing gas and an outlet for discharging gas, and a flow path section (cylinder) that has a blowing port for blowing the gas introduced from the inlet onto the semiconductor laser element. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2020 / 054593 [Patent Document 2] Special Publication No. 2022-523725 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the above optical device, the presence of low-siloxane molecules within the case and convection accelerate the molecular motion of the siloxane molecules, increasing their collisions with the light-emitting surface, resulting in failure to prevent siloxane deposition. Furthermore, a pump or other device is required to introduce gas, and the pump lubricant is oil or silicone grease containing linear siloxane. When this silicone grease is irradiated with blue laser light, the linear siloxane breaks down, potentially penetrating the case and causing SiO2 deposition.

[0008] In the laser system disclosed in Patent Document 2, the internal cavity is free of silicon-based contamination sources, and the housing is designed to isolate the internal cavity from the external environment, thereby preventing SiO2 generation within the internal cavity during operation of the solid-state device. This prevents SiO2 accumulation within the internal cavity.

[0009] However, in addition to the silicone grease mentioned above, there are many other products that may contain silicone components, such as adhesives, prepregs, fluxes, resists, resins, and semiconductor components, making it difficult to isolate them all. Specifically, in the case of optical components such as those shown in Figure 12, sources of contamination include adhesives used to secure lenses and mirrors, printed circuit boards used in semiconductor lasers, and mold release agents for rubber and plastic parts used for sealing. Furthermore, silicone grease and oils are used in moving parts within measuring devices that measure laser light, and these contain large amounts of siloxane.

[0010] Therefore, for example, in an optical device that emits blue laser light, the output of the laser light gradually decreases with irradiation time. Figure 13 is a graph showing changes in laser light output. In this graph, the horizontal axis represents the irradiation time of the laser light, and the vertical axis represents changes in the output of the laser light. This graph also shows changes in output in three cases: when 0.1 mg of cyclic siloxane is volatilized at 60 degrees (hereinafter referred to as "Case A"), when 0.1 mg of cyclic siloxane is volatilized at 25 degrees (hereinafter referred to as "Case B"), and when 1 mg of linear siloxane is volatilized at 25 degrees (hereinafter referred to as "Case C") in a sealed optical device. It has been confirmed that linear siloxane does not volatilize at room temperature.

[0011] As shown in Figure 13, in case A, the output decreased by about 20% in about 112 hours, and the amount of SiO2 deposition was 129 nm. In case B, the output decreased by about 5% in about 112 hours, and the amount of SiO2 deposition was 68.5 nm.

[0012] The fact that Case A is lower than Case B is presumably because, in the case of cyclic siloxane, the volatilization conditions stimulated the molecular motion of the volatilized cyclic siloxane molecules, reducing the stagnation of cyclic siloxane molecules on the inner wall surfaces of the device, resulting in a higher concentration of cyclic siloxane in the actual device, and the increased molecular motion resulting in more collisions of cyclic siloxane with the laser output facet.

[0013] In addition, in the case of Case C, the output decreased by approximately 24% in approximately 112 hours, and the amount of SiO2 deposition reached 210 nm. Case C was the case most affected by SiO2 adhesion and deposition among the three cases.

[0014] Until now, it has been thought that linear siloxanes are not related to the problem of siloxane adhesion and deposition because they decompose and volatilize at high temperatures of approximately 300°C or higher, but not at room temperature. However, as in this verification, it was proven that by irradiating linear siloxanes with blue laser light, linear siloxanes decompose even at room temperature, and SiO2 adheres and deposits on the emitting end surface of the blue laser.

[0015] Non-limiting examples of the present disclosure contribute to providing optical devices and optical systems that are less susceptible to siloxane contamination. [Means for solving the problem]

[0016] An optical device according to an embodiment of the present disclosure includes a laser emitting unit, a member containing a silicone component, and a light shielding unit that shields the member from laser light emitted from the laser emitting unit.

[0017] An optical system according to one embodiment of the present disclosure includes an optical device including a laser emitting unit, a member containing a silicone component, and a light-shielding unit that shields the member from the laser light emitted from the laser emitting unit, a focusing lens that focuses the laser light emitted from the laser emitting unit, and a movable unit that moves the focusing lens in the optical axis direction, wherein the movable unit includes a member coated with a material containing a silicone component and includes another light-shielding unit that shields the material from the laser light. [Effects of the Invention]

[0018] Non-limiting examples of the present disclosure can reduce siloxane contamination.

[0019] Further advantages and benefits of an embodiment of the present disclosure will become apparent from the specification and drawings. Such advantages and / or benefits may be provided by some of the embodiments and features described in the specification and drawings, respectively, but not necessarily all of them may be provided to obtain one or more identical features. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of an optical device according to a first embodiment; [Figure 2A] FIG. 10 is a diagram showing a configuration example in which a light-shielding portion is not provided. [Figure 2B] FIG. 10 is a diagram showing a configuration example in which a light-shielding portion is not provided. [Figure 3A] FIG. 10 is a diagram showing a configuration example in which a light-shielding portion is provided. [Figure 3B] FIG. 10 is a diagram showing a configuration example in which a light-shielding portion is provided. [Figure 4A] A diagram showing an example of a configuration in which a painted lens is fixed with adhesive. [Figure 4B] A diagram showing an example of a configuration in which a painted lens is fixed with adhesive. [Figure 5A] A diagram showing an example of the assembly process when paint is used as a light-shielding part. [Figure 5B] A diagram showing an example of the assembly process when paint is used as a light-shielding part. [Figure 5C] A diagram showing an example of the assembly process when paint is used as a light-shielding part. [Figure 6A] FIG. 10 is a diagram showing an example of an assembly process when a light-shielding portion is formed using a light-shielding plate. [Figure 6B] FIG. 10 is a diagram showing an example of an assembly process when a light-shielding portion is formed using a light-shielding plate. [Figure 6C] FIG. 10 is a diagram showing an example of an assembly process when a light-shielding portion is formed using a light-shielding plate. [Figure 7] FIG. 10 is a diagram showing an example of the configuration of an optical device according to a second embodiment; [Figure 8] FIG. 10 is a diagram showing an example of a configuration in which a light-shielding portion is not provided in an optical device; [Figure 9] FIG. 10 is a diagram showing an example of a configuration in which a light-shielding section is provided in an optical device; [Figure 10] FIG. 10 is a diagram showing an example of the configuration of an optical system according to a third embodiment. [Figure 11] A diagram showing a condenser lens and a movable part. [Figure 12] A diagram showing an example of an optical device [Figure 13] Graph showing changes in laser light output DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functions are designated by the same reference numerals, and redundant description will be omitted.

[0022] First Embodiment In the first embodiment, an embodiment will be described in which an adhesive is used as an example of a member containing a silicone component. FIG. 1 is a diagram showing an example of the configuration of an optical device 10 according to the first embodiment of the present invention. The optical device 10 includes a semiconductor laser chip 100, a submount 120, a light distribution control lens 130, an optical isolator 140, a photodiode 150, a temperature sensor 160, and a housing 170. The optical device 10 is a pigtail-type laser module. The optical device 10 may also be a device that emits laser light into an optical fiber for optical communication, or may be a laser processing device. The optical device 10 also includes mirrors and diffraction gratings for adjusting the optical path, but these are omitted from FIG. 1.

[0023] In the following description, the positive direction of the X axis shown in the drawings may be referred to as the forward direction. The negative direction of the X axis may be referred to as the backward direction. The positive direction of the Y axis may be referred to as the left direction. The negative direction of the Y axis may be referred to as the right direction. The positive direction of the Z axis may be referred to as the upward direction. The negative direction of the Z axis may be referred to as the downward direction. Using these notations, FIG. 1 is a view of the optical device 10 as seen from above. The laser light is emitted in the forward direction.

[0024] The semiconductor laser chip 100 is an example of a laser light emitting unit, and emits blue to ultraviolet laser light with a wavelength of approximately 350 nm to 450 nm. The P electrode surface of the semiconductor laser chip 100 is electrically connected to the N electrode surface via a submount 120, and the N electrode surface is electrically connected to the submount 120 by wire bonding or the like. The semiconductor laser chip 100 may be a single-emitter laser diode with one light-emitting point, or a bar-emitter laser diode with multiple light-emitting points.

[0025] The submount 120 is a substrate on which the semiconductor laser chip 100 is mounted. For the submount 120, a material having excellent thermal conductivity and matching the linear expansion coefficient of the semiconductor laser chip 100 is used to avoid stress when mounting the semiconductor laser chip 100, and for example, a ceramic material such as CuW, Cu diamond, or ALN is used.

[0026] The light distribution control lens 130 is, for example, a collimation lens, and controls the light distribution of light emitted by the semiconductor laser chip 100. The optical isolator 140 has the property of passing laser light only in the forward direction and blocking light in the reverse direction. For example, when laser light emitted by the semiconductor laser chip 100 is output through an optical fiber, this optical isolator 140 prevents stray light or reflected light from outside from passing through the optical fiber and entering the semiconductor laser chip 100. In the following description, the light distribution control lens 130 and the optical isolator 140 may be collectively referred to as optical component 135.

[0027] The material of the optical component 135 is a glass material, a resin material, etc. The optical component 135 is fixed to a mounting substrate (not shown) facing the light emission surface of the semiconductor laser chip 100 and spaced apart from the semiconductor laser chip 100 with an adhesive containing a silicone component. In the following description, the adhesive used to bond various components is assumed to contain a silicone component.

[0028] Furthermore, not all of the laser light emitted from the semiconductor laser chip 100 passes through the optical component 135, and the laser light that cannot pass through becomes stray light. The stray light irradiates the inside of the housing 170 of the light source device 10 as scattered light.

[0029] The temperature sensor 160 detects the temperature of the semiconductor laser chip 100. The photodiode 150 measures the current output from the rear facet of the semiconductor laser chip 100. The temperature sensor 160 and the semiconductor laser chip 100 are fixed to a housing 170 with an adhesive.

[0030] As described above, adhesives are used to fix various components in the optical device 10. As described above, scattered light is irradiated into the housing 170, and unless some countermeasure is taken, a large amount of siloxane will volatilize from the adhesive, adversely affecting the semiconductor laser chip 100.

[0031] Therefore, in order to suppress the volatilization of siloxane, a configuration in which a light-shielding portion that shields the adhesive from laser light is provided in the optical device 10 will be described. In the first embodiment, as an example, two configuration examples will be described in which a light-shielding portion that shields the adhesive for fixing the light distribution control lens 130 from laser light is provided. One configuration example is a configuration example using a lens holder, and the other is a configuration example in which paint of a color with low transmittance is applied to the surface of the light distribution control lens 130 that comes into contact with the adhesive, and the applied paint serves as the light-shielding portion. In the latter configuration example, the painted surface to which the paint of a color with low transmittance is applied constitutes part or all of the light-shielding portion. In the following description, "paint" refers to paint of a color with low transmittance for laser light. In the following description, a configuration example in which a light-shielding portion is not provided will also be described to easily distinguish between a case in which a light-shielding portion is provided and a case in which a light-shielding portion is not provided.

[0032] 2A and 2B are diagrams showing a configuration example when a light-shielding section is not provided. FIGS. 3A and 3B are diagrams showing a configuration example when a light-shielding section (lens holder) is provided. Also, FIGS. 2A and 3A are diagrams showing the optical device 10 as viewed from the right. FIGS. 2B and 3B are diagrams showing the optical device 10 as viewed from the front. In both diagrams, the optical isolator 140, photodiode 150, and temperature sensor 160 are omitted. Only the bottom surface of the housing 170 is shown. Note that the center of the cross shown in FIGS. 2B and 3B indicates the optical axis.

[0033] 2A and 2B, light distribution control lens 130 is fixed to housing 170 in a state of direct contact with adhesive 200. In the configuration shown in FIGS. 2A and 2B, no light-shielding portion is provided, and therefore adhesive 200 is irradiated with scattered light, causing siloxane to volatilize and adversely affecting semiconductor laser chip 100.

[0034] 3A and 3B, light distribution control lens 130 is held by lens holder 300, and lens holder 300 is fixed to housing 170 in a state where it is in direct contact with adhesive 200. The color of lens holder 300 is a color with low reflectance and transmittance, such as black, to prevent reflection by lens holder 300 and transmission of laser light. In addition, the optical axis position of the laser light can be adjusted by the size of lens holder 300 (for example, the height from housing 170 at which light distribution control lens 130 is set).

[0035] In the configuration shown in FIGS. 3A and 3B, lens holder 300 blocks laser light leaking in at least a direction perpendicular to the emission direction of the laser light (forward, optical axis direction). Lens holder 300 is fixed with adhesive 200 in an area that is blocked by lens holder 300. As described above, lens holder 300 blocks laser light leaking in a direction perpendicular to the optical axis, and therefore, this "area that is blocked by lens holder 300" is an area on a plane of lens holder 300 whose normal vector is a direction perpendicular to the optical axis. In the case of FIGS. 3A and 3B, this area is an area on a plane that is perpendicular to the X-axis (upward, downward, leftward, rightward, etc.), and since housing 170 is downward, the area on the downward surface of lens holder 300 is the area that comes into contact with adhesive 200. 3A and 3B, the size of adhesive 200 is smaller and thinner than in the cases of FIGS. 2A and 2B, which also reduces the size of the exposed area of ​​adhesive 200. As a result, volatilization of siloxane can be suppressed compared to when lens holder 300 is not provided.

[0036] Next, a description will be given of a configuration in which light distribution control lens 130, on the surface that comes into contact with adhesive 200, is fixed with adhesive 200. In the following description, light distribution control lens 130, on the surface that comes into contact with adhesive 200, is applied with paint, is referred to as a painted lens.

[0037] 4A and 4B are diagrams showing an example of a configuration in which a painted lens 500 is fixed with an adhesive 200. FIGS. 4A and 4B are diagrams showing the painted lens 500, light-shielding portions 600A and 600B, and a housing 170. In FIGS. 4A and 4B, the painted lens 500 has a light-shielding portion 600A. The light-shielding portion 600A is a painted surface on which paint is applied, and the light-shielding portion 600A is the surface that comes into contact with the adhesive 200. The painted lens 500 is fixed to the housing 170 in direct contact with the adhesive 200. A light-shielding portion 600B is provided on the surface of the adhesive 200 that does not come into contact with the painted lens 500.

[0038] As a result, the adhesive 200 blocks light on both the contact surface and non-contact surface with the coated lens 500 (i.e., the entire surface). The light-shielding portion 600B in Figures 4A and 4B has two types. One of them is a form in which the light-shielding portion 600B is made of applied paint, and the other is a form in which the light-shielding portion 600B is made of a cylindrical light-shielding plate.

[0039] 5A to 5C are diagrams showing an example of an assembly process in which the applied paint serves as the light-shielding portion 600B. As shown in FIG. 5A, first, a painted lens 500 equipped with the light-shielding portion 600A is prepared, and adhesive 200 is applied to the housing 170. Next, as shown in FIG. 5B, the painted lens 500 is placed on the adhesive 200 and positioned. Finally, as shown in FIG. 5C, paint is applied to the non-contact surface of the solidified adhesive 200, completing the light-shielding portion 600B.

[0040] 6A to 6C are diagrams showing an example of an assembly process when configuring light blocking unit 600B using a light blocking plate. As shown in Fig. 6A, first, light blocking unit 600B configured using a cylindrical light blocking plate is set in housing 170. The cylindrical light blocking plate is made of a flexible material such as aluminum foil, and the outside of the cylindrical light blocking plate is preferably coated with paint so that it deforms when bonded to painted lens 500.

[0041] Next, as shown in Fig. 6B, a coated lens 500 having a light-shielding portion 600A is prepared, and adhesive 200 is injected into the tube of the cylindrical light-shielding plate. Finally, as shown in Fig. 6C, the coated lens 500 is placed on adhesive 200, positioned, and the adhesive 200 is allowed to solidify.

[0042] Of the siloxane components contained in the adhesive 200, cyclic siloxane diffuses at room temperature, but this does not pose a problem if the diffused cyclic siloxane is removed during the assembly process of the optical device 10. However, linear siloxane decomposes and diffuses when exposed to blue laser light, so decomposition of linear siloxane can be prevented by shielding the adhesive 200 of the optical device 10 and other components containing linear siloxane from the blue laser light.

[0043] In the above-described embodiment, the light blocking portion 600A has been described as a painted surface, but the light blocking portion 600A may also be a lens holder attached to the lower half of the light distribution control lens 130.

[0044] As described above, according to the first embodiment, the lens holder 300 and the light-shielding portions 600A and 600B shield the adhesive 200 from the laser light, thereby making it possible to suppress contamination by siloxane.

[0045] Second Embodiment In the second embodiment, an adhesive is used as an example of a member containing a silicone component. FIG. 7 is a diagram showing a configuration example of an optical device 20 according to a second embodiment of the present invention. The optical device 20 includes a semiconductor laser chip 100, a submount 120, a light distribution control lens 130, an optical isolator 140, a photodiode 150, a P electrode block 710, an N power block 720, a temperature sensor 160, and a housing 170. The optical device 10 may be a device that emits laser light into an optical fiber for optical communication, or may be a laser processing device. The optical device 20 is a pigtail-type laser module. The optical device 10 also includes a mirror for adjusting the optical path, a diffraction grating, and the like, but these are omitted from FIG. 7.

[0046] A major difference from the configuration of the first embodiment is that the submount 120 and the semiconductor laser chip 100 are solder-mounted to a copper P electrode block 710, and the N power blocks 720 of the semiconductor laser chip 100 are connected to each other by wire bonds or bumps (not shown). In the following explanation, in order to make it easier to understand the difference between a case where a light-shielding portion is provided and a case where a light-shielding portion is not provided, a configuration example where a light-shielding portion is not provided will also be explained.

[0047] Fig. 8 is a diagram showing a configuration example in which no light-shielding portion is provided in optical device 20. As shown in Fig. 8, in optical device 20, P electrode block 710 and N power block 720 are bonded together using adhesive 200. Because adhesive 200 is injected between P electrode block 710 and N power block 720 from the side, adhesive 200 is exposed to the outside after solidification.

[0048] When the exposed adhesive 200 is irradiated with scattered light from the blue laser beam, siloxane volatilizes from the adhesive 200, causing the siloxane to diffuse into the sealed housing 170 of the optical device 20. If a light-shielding section is not provided, the adhesive 200 is irradiated with scattered light, causing the siloxane to volatilize and adversely affecting the semiconductor laser chip 100.

[0049] In order to suppress the volatilization of siloxane, a configuration in which a light-shielding portion that shields the adhesive from laser light is provided in the optical device 20 will be described. Fig. 9 is a diagram showing a configuration example in which a light-shielding portion 800 is provided in the optical device 20. As shown in Fig. 9, in the optical device 20, the adhesive 200 exposed to the outside is covered with the light-shielding portion 800 to block the laser light. The light-shielding portion 800 in the second embodiment is a plate-shaped member that blocks the laser light.

[0050] As described above, according to the second embodiment, by shielding the adhesive 200 from laser light by the light shielding portion 800, contamination by siloxane can be suppressed compared to the case where no light shielding portion is provided.

[0051] Third Embodiment In the third embodiment, an embodiment will be described in which a lubricant is used as an example of a material containing a silicone component in an optical system. FIG. 10 is a diagram showing an example of the configuration of an optical system 30 according to the third embodiment of the present invention. The optical system 30 is a system for observing the shape of a laser beam and measuring the intensity distribution of the laser beam. The optical system 30 includes the optical device 20 described in the second embodiment, an optical component 910, a CCD (Charge-Coupled Device) 920, a condenser lens 930, and a sensor 940. In the third embodiment, an optical device capable of emitting laser beam may be provided. Instead of the optical device 20, the optical device 10 described in the first embodiment may be used.

[0052] The laser light emitted from the optical device 20 is focused by the optical component 910. The optical component 910 emits the laser light to both the CCD 920 and the focusing lens 930. In the CCD 920, upon which the laser light is incident, each of the light receiving elements constituting the CCD 920 receives the laser light, and the shape of the laser light can be observed based on the outputs of these light receiving elements. Meanwhile, the focusing lens 930 upon which the laser light is incident emits the laser light to the sensor 940. The intensity of the laser light can be measured by detecting the intensity of the laser light in the sensor 940 upon which the laser light is incident.

[0053] The optical system 30 includes a movable unit that moves the above-described condenser lens 930 in the optical axis direction. FIG. 11 is a diagram showing the condenser lens 930 and a movable unit 950. The movable unit 930 includes a support 951, a light-shielding unit 952, and a rail 953. The rail 953 may be a ball screw. The support 951 includes a lens holder for the condenser lens 930, a column that supports the lens holder, and a rail block for sliding the rail 953. A lubricant 954 containing a silicone component is applied to the rail 953 to allow the rail block to slide. The lubricant 954 is, for example, silicone grease or oil.

[0054] Silicone grease and oil contain large amounts of linear siloxanes, and when these are irradiated with blue laser light, scattered light, or ultraviolet light, the linear siloxanes are decomposed. The decomposed linear siloxane molecules have a large molecular weight. Like low-molecular-weight cyclic siloxanes, they are assumed to stagnate without undergoing molecular movement in the air and without diffusing significantly.

[0055] However, when the stagnant material is further irradiated with laser light 40 or scattered light 41, some of the linear siloxane is decomposed and diffuses into the air. This diffused and floating linear siloxane combines with oxygen on the light-emitting surface of the semiconductor laser chip of the optical device 20, resulting in the deposition of SiO2 on the light-emitting surface.

[0056] Therefore, in this embodiment, a light-shielding portion 952 is provided to shield the lubricant 954 from the laser light. As shown in Fig. 11, the light-shielding portion 952 is a light-shielding sheet configured in a bellows shape so as to shield the rail 953 from light in accordance with the movement of the condenser lens 930. Note that a stage may be provided to shield the rail block and rail from the laser light, and the rail block and rail may be arranged below the stage to shield them from the laser light and ultraviolet light.

[0057] This bellows-shaped light-shielding part may be used for the moving parts of an open device without a safety door or cover, as shown in Figure 11, but in the case of a closed device such as the optical device 10 or an optical system with safety and dust countermeasures, the bellows-shaped light-shielding part is not necessary.

[0058] As described above, according to the third embodiment, by shielding the rail 953 from the laser light by the light shielding portion 952, contamination by siloxane can be suppressed compared to the case where no light shielding portion is provided.

[0059] <Modification> In the above embodiment, adhesives and lubricants have been used as members or materials containing silicone components, but the present invention is not limited to these. If the member containing silicone components is a solid such as a resin, the light-shielding portion may be formed of a light-shielding plate as described in the second embodiment. If the material containing silicone components is a liquid or soft matter, the light-shielding portion may be a container that encases the material or a light-shielding sheet as described in the third embodiment.

[0060] <Summary of the embodiment> An optical device according to an embodiment of the present disclosure includes a laser emitting unit, a member containing a silicone component, and a light shielding unit that shields the member from laser light emitted from the laser emitting unit.

[0061] An optical system according to one embodiment of the present disclosure includes an optical device, a focusing lens that focuses laser light emitted from the laser emitting unit, and a movable unit that moves the focusing lens in the optical axis direction, the movable unit including a member coated with a material containing a silicone component, and another light-shielding unit that shields the material from the laser light.

[0062] Although various embodiments have been described above with reference to the drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications or alterations within the scope of the claims, and it is understood that these also naturally fall within the technical scope of the present disclosure. Furthermore, the components of the above-described embodiments may be combined in any manner without departing from the spirit of the disclosure.

[0063] Although specific examples of the present disclosure have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and alterations of the specific examples exemplified above. [Industrial Applicability]

[0064] An embodiment of the present disclosure is suitable for devices and systems that are exposed to laser light. [Explanation of symbols]

[0065] 10, 20 Optical equipment 30 Optical System 100 Semiconductor laser chip 120 Submount 130 Light distribution control lens 135, 910 Optical components 140 Optical isolator 150 photodiodes 160 Temperature Sensor 170 cabinet 180 Peripheral illumination determination unit 200 adhesive 210 Irradiation control unit 220 Irradiation Body 300 Lens Holder 500 painted lens 600A, 600B, 800, 952 Light shielding part 710 P electrode block 720 N Power Block 920 CCD 930 Condenser Lens 940 Sensors 950 Moving parts 951 Post 953 Rail 954 Lubricants

Claims

1. a laser emitting unit; a member containing a silicone component; a light-shielding portion that shields the member from the laser light emitted from the laser light-emitting portion; An optical device comprising:

2. The optical device according to claim 1 , wherein the member is an adhesive.

3. The optical device according to claim 2 , wherein the member is an adhesive that fixes a light distribution control lens that controls the light distribution of the laser light emitted by the laser emission unit.

4. the member is an adhesive; 3. The optical device according to claim 2, wherein the light-shielding portion is a lens holder that blocks laser light leaking in a direction perpendicular to the emission direction of the laser light in a light distribution control lens that controls the distribution of the laser light emitted by the laser emission portion, the lens holder is fixed by the adhesive in an area that is blocked by the lens holder, and the optical axis position of the laser light can be adjusted by the size of the lens holder.

5. 2. The optical device according to claim 1, wherein the laser light emitting unit has a semiconductor element mounted on a lower electrode block, the semiconductor element is sandwiched between the lower electrode block and the upper electrode block to pass electricity therethrough, and terminal electrodes are attached to the lower electrode block and the upper electrode block, respectively.

6. The optical device according to claim 1 , wherein the laser light emitting unit emits laser light having a wavelength of less than 450 nm.

7. The optical device according to claim 1; a condenser lens that condenses the laser light emitted from the laser emitting unit; a movable portion that moves the condenser lens in the optical axis direction, the movable portion includes a member to which a material containing a silicone component is applied, An optical system including another shield that shields the material from the laser light.

8. The optical system according to claim 7 , wherein the other light blocking portion is a bellows that expands and contracts in accordance with the movement of the condenser lens to block the material from light.

Images