Suspension board with circuit

Abstract

To provide a suspension board with a circuit capable of suppressing contact between a second end portion of a slider and a second metal support layer.SOLUTION: A suspension board 1 with a circuit has a first portion 2 capable of supporting a slider S and a second portion 3 connected to the first portion 2. The first portion 2 has a magnetic head connecting terminal 21A, a first terminal 23A connected to one end portion of a first piezoelectric element Pz1, and a second terminal 23B connected to one end portion of a second piezoelectric element Pz2. The second portion 3 has a third terminal 31A connected to the other end portion of the first piezoelectric element Pz1, a fourth terminal 31B connected to the other end portion of the second piezoelectric element Pz2, and a facing portion 33 positioned between the third terminal 31A and the fourth terminal 31B, and facing the slider S. The facing portion 33 has a third insulating layer 331 that covers a metal support layer (second metal support layer 11B) of the second portion 3.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a suspension board with circuit. [Background technology]

[0002] BACKGROUND ART Conventionally, a suspension board with a circuit on which a slider having a magnetic head at its tip and a piezoelectric element can be mounted has been known (see, for example, Patent Document 1 below).

[0003] The suspension board with circuit includes a head-side terminal connected to the magnetic head, a piezoelectric tip-side terminal connected to the tip of the piezoelectric element, and a piezoelectric rear-side terminal connected to the rear end of the piezoelectric element. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-099204 Summary of the Invention [Problem to be solved by the invention]

[0005] In a suspension board with circuit such as that described in Patent Document 1, as the suspension board with circuit is made smaller in size in the front-to-rear direction, there is a possibility that the metal support layer supporting the rear piezo terminal and the rear end of the slider will be arranged facing each other. In this case, there is a possibility that the metal support layer supporting the rear piezo terminal and the rear end of the slider will come into contact with each other.

[0006] The present invention provides a suspension board with circuit that can suppress contact between the second end of the slider and the second metal support layer. [Means for solving the problem]

[0007] The present invention [1] is a suspension board with circuit on which a slider having a magnetic head, a first piezoelectric element, and a second piezoelectric element can be mounted, wherein the slider has a first end where the magnetic head is disposed and a second end opposite to the first end, the suspension board with circuit has a first portion capable of supporting the slider and a second portion disposed apart from the first portion, the first portion comprising a first metal support layer, a first insulating layer disposed on one side of the first metal support layer in a thickness direction of the first metal support layer, a magnetic head connection terminal disposed on one side of the first insulating layer in the thickness direction and connected to the magnetic head, a first terminal connectable to one end of the first piezoelectric element, and a second piezoelectric element disposed apart from the first terminal in a first direction perpendicular to the thickness direction, the second portion has a second metal support layer, a second insulating layer disposed on one surface of the second metal support layer in the thickness direction, a third terminal disposed apart from the first terminal in a second direction orthogonal to both the thickness direction and the first direction and connectable to the other end of the first piezoelectric element, and a fourth terminal disposed apart from the second terminal in the second direction and connectable to the other end of the second piezoelectric element, the second portion further having a facing portion disposed between the third terminal and the fourth terminal in the first direction and facing the second end of the slider at a distance in the thickness direction, the facing portion having a third insulating layer disposed on one surface of the second metal support layer in the thickness direction.

[0008] According to this configuration, the second part, which has a third terminal connectable to the other end of the first piezoelectric element and a fourth terminal connectable to the other end of the second piezoelectric element, has an opposing portion that faces the second end of the slider.

[0009] The facing portion faces the second end of the slider in the thickness direction with a gap therebetween and has a third insulating layer. The third insulating layer is disposed on one surface of the metal support layer (second metal support layer) of the second portion. In other words, one surface of the second metal support layer is covered with the third insulating layer.

[0010] Therefore, when the slider is mounted on the mounting portion, it is possible to prevent the second end of the slider from coming into contact with the second metal support layer.

[0011] The present invention [2] includes the suspension board with circuit of the above [1], wherein the facing portion is made of only the third insulating layer, and the thickness of the third insulating layer is smaller than the thickness of the first insulating layer.

[0012] With this configuration, the thickness of the facing portion is thinner than the thickness of the first insulating layer.

[0013] Therefore, when the slider is mounted on the mounting portion, a distance can be secured between the second end of the slider and the opposing portion.

[0014] As a result, when the slider is mounted on the mounting portion, it is possible to prevent the second end of the slider from coming into contact with the opposing portion.

[0015] The present invention [3] includes the suspension board with circuit according to the above [2], wherein the third insulating layer is made of the same material as the first insulating layer.

[0016] According to this configuration, in the step of forming the first insulating layer, the third insulating layer can be formed together with the first insulating layer.

[0017] Therefore, an increase in the number of steps can be suppressed.

[0018] The present invention [4] includes the circuit-equipped suspension board of the above [2], wherein the first portion is arranged on one side of the first insulating layer in the thickness direction, wiring connected to the magnetic head connection terminal, and a cover insulating layer is arranged on one side of the first insulating layer in the thickness direction and covers the wiring, and the third insulating layer is made of the same material as the cover insulating layer.

[0019] According to this configuration, the third insulating layer can be formed together with the cover insulating layer in the step of forming the cover insulating layer.

[0020] Therefore, an increase in the number of steps can be suppressed.

[0021] The present invention [5] includes the circuit-equipped suspension board of the above [1], wherein the first portion further comprises: a wiring arranged on one side of the first insulating layer in the thickness direction and connected to the magnetic head connecting terminal; and a cover insulating layer arranged on one side of the first insulating layer in the thickness direction and covering the wiring; the opposing portion further comprises: a conductor layer arranged on one side of the third insulating layer in the thickness direction; and an opposing cover insulating layer arranged on one side of the third insulating layer in the thickness direction and covering the conductor layer; and the width of the conductor layer is equal to or less than the width of the wiring.

[0022] According to this configuration, the width of the conductor layer disposed in the facing portion is equal to or smaller than the width of the wiring.

[0023] Therefore, when the facing portion has a conductor layer, it is possible to prevent the thickness of the facing insulating cover layer that covers the conductor layer from becoming thicker than the thickness of the insulating cover layer that covers the wiring.

[0024] This ensures a sufficient distance between the second end of the slider and the facing portion even when the facing portion has a conductive layer.

[0025] As a result, even if the facing portion has a conductive layer, it is possible to prevent the second end of the slider from coming into contact with the facing portion.

[0026] The present invention [6] includes the suspension board with circuit according to the above [5], wherein the thickness of the opposing insulating cover layer is thinner than the thickness of the insulating cover layer.

[0027] With this configuration, the distance between the second end of the slider and the opposing portion can be further ensured.

[0028] As a result, the second end of the slider can be further prevented from coming into contact with the opposing portion.

[0029] The present invention [7] includes the suspension board with circuit of any one of the above [1] to [6], wherein the first terminal and the second terminal are arranged on one side of the first insulating layer in the thickness direction, and the third terminal and the fourth terminal are arranged on one side of the second insulating layer in the thickness direction.

[0030] The present invention [8] includes the suspension board with circuit of any one of the above [1] to [6], wherein the first insulating layer has a first through hole and a second through hole arranged at a distance from the first through hole in the first direction, the first terminal is arranged in the first through hole, the second terminal is arranged in the second through hole, the second insulating layer has a third through hole and a fourth through hole arranged at a distance from the third through hole in the first direction, the third terminal is arranged in the third through hole, and the fourth terminal is arranged in the fourth through hole.

[0031] The present invention [9] is the suspension board with circuit of the above [8], wherein the first portion further comprises: a wiring arranged on one surface of the first insulating layer in the thickness direction and connected to the magnetic head connecting terminal; and a cover insulating layer arranged on one surface of the first insulating layer in the thickness direction and covering the wiring; the opposing portion further comprises: a first conductor layer arranged on one surface of the third insulating layer in the thickness direction and continuous with the third terminal; a second conductor layer arranged on one surface of the third insulating layer in the thickness direction and continuous with the fourth terminal; and an opposing cover insulating layer arranged on one surface of the third insulating layer in the thickness direction and covering the first conductor layer and the second conductor layer; and the width of the first conductor layer and the second conductor layer is equal to or less than the width of the wiring.

[0032] According to this configuration, the width of the first conductor layer and the second conductor layer disposed in the opposing portion is equal to or less than the width of the wiring.

[0033] Therefore, when the facing portion has the first conductor layer and the second conductor layer, it is possible to prevent the thickness of the facing cover insulating layer from becoming thicker than the thickness of the cover insulating layer that covers the wiring.

[0034] This ensures a sufficient distance between the second end of the slider and the facing portion even when the facing portion has the first conductor layer and the second conductor layer.

[0035] As a result, even when the facing portion has the first conductor layer and the second conductor layer, it is possible to prevent the second end of the slider from coming into contact with the facing portion. [Effects of the Invention]

[0036] According to the suspension board with circuit of the present invention, when the slider is mounted on the mounting portion, the second end of the slider can be prevented from coming into contact with the second metal support layer. [Brief explanation of the drawings]

[0037] [Figure 1] FIG. 1 is a plan view showing a first embodiment of a suspension board with circuit of the present invention. [Figure 2] Fig. 2A is a cross-sectional view taken along line AA of the suspension board with circuit shown in Fig. 1. Fig. 2B is a cross-sectional view taken along line BB of the suspension board with circuit shown in Fig. 1. [Figure 3] 3A and 3B show an insulating layer forming step in the manufacturing process of a suspension board with circuit. [Figure 4] 4A and 4B show a conductive pattern forming step in the manufacturing process of a suspension board with circuit. [Figure 5] 5A and 5B show a cover insulating layer forming step in the manufacturing process of a suspension board with circuit. [Figure 6] FIG. 6 shows a modified example (1) of the suspension board with circuit. [Figure 7] FIG. 7 shows a modified example (2) of the suspension board with circuit. [Figure 8] FIG. 8 shows a modified example (3) of the suspension board with circuit. [Figure 9] FIG. 9 is a plan view showing a second embodiment of the suspension board with circuit of the present invention. [Figure 10]Fig. 10A is a CC cross-sectional view of the suspension board with circuit shown in Fig. 9. Fig. 10B is a DD cross-sectional view of the suspension board with circuit shown in Fig. 9. DETAILED DESCRIPTION OF THE INVENTION

[0038] 1. Circuit-attached suspension board The suspension board with circuit 1 is one component that constitutes a head gimbal assembly of a hard disk drive.

[0039] 1, the suspension board with circuit 1 can mount a slider S having a magnetic head, a first piezoelectric element Pz1, and a second piezoelectric element Pz2. In the first embodiment, with the slider S, the first piezoelectric element Pz1, and the second piezoelectric element Pz2 mounted on the suspension board with circuit 1, the slider S is disposed between the first piezoelectric element Pz1 and the second piezoelectric element Pz2 in the first direction. Note that in the first embodiment, with the slider S, the first piezoelectric element Pz1, and the second piezoelectric element Pz2 mounted on the suspension board with circuit 1, the slider S, the first piezoelectric element Pz1, and the second piezoelectric element Pz2 are disposed on one side of the suspension board with circuit 1 in the thickness direction (see FIG. 2A ). In other words, with the slider S, the first piezoelectric element Pz1, and the second piezoelectric element Pz2 mounted on the suspension board with circuit 1, the first piezoelectric element Pz1 and the second piezoelectric element Pz2 are disposed on the same side of the suspension board with circuit 1 as the slider S. The slider S has a first end E1 and a second end E2 opposite to the first end E1. A magnetic head is disposed at the first end E1. The magnetic head is capable of reading data from and writing data to the recording surface of the hard disk.

[0040] The suspension board with circuit 1 has a mounting portion 1A and a wiring portion 1B.

[0041] (1) Mounting section The mounting portion 1A is disposed at the tip of the suspension board with circuit 1. A slider S, a first piezoelectric element Pz1, and a second piezoelectric element Pz2 are mounted on the mounting portion 1A. The mounting portion 1A is supported at the tip of the wiring portion 1B by outrigger portions (not shown). The mounting portion 1A has a first portion 2, a second portion 3, and a neck portion 4. In other words, the suspension board with circuit 1 has the first portion 2 and the second portion 3.

[0042] (1-1) Part 1 The first portion 2 is capable of supporting the slider S. The first portion 2 extends in a first direction and a second direction.

[0043] The first direction is the direction in which magnetic head connection terminals 21A, 21B, 21C, and 21D (described later) are aligned. The second direction is the direction in which a first terminal 23A (described later) and a third terminal 31A (described later) are aligned. In other words, the second direction is the direction in which the first piezoelectric element Pz1 expands and contracts. The second direction is perpendicular to the first direction. The first and second directions are perpendicular to the thickness direction of a first metal support layer 11A (described later) (see FIG. 2A).

[0044] The shape of the first portion 2 is not limited. For example, the first portion 2 has a substantially rectangular flat plate shape. The first portion 2 has a plurality of magnetic head connection terminals 21A, 21B, 21C, and 21D, portions of the plurality of wirings 22A, 22B, 22C, and 22D, a first terminal 23A, a second terminal 23B, and a plurality of pedestals 24A, 24B, and 24C.

[0045] The magnetic head connection terminals 21A, 21B, 21C, and 21D are aligned in the first direction. The magnetic head connection terminals 21A, 21B, 21C, and 21D are disposed between the first terminal 23A and the second terminal 23B in the first direction. When the slider S is mounted on the mounting portion 1A, the magnetic head connection terminals 21A, 21B, 21C, and 21D are connected to the magnetic head.

[0046] The wiring 22A electrically connects the magnetic head connection terminal 21A and an external connection terminal 101A, which will be described later. One end of the wiring 22A is connected to the magnetic head connection terminal 21A. The other end of the wiring 22A is connected to the external connection terminal 101A. The wiring 22A passes through the neck portion 4, the second portion 3, and the wiring portion 1B and is connected to the external connection terminal 101A.

[0047] The wiring 22B electrically connects the magnetic head connection terminal 21B and an external connection terminal 101B, which will be described later. One end of the wiring 22B is connected to the magnetic head connection terminal 21B. The other end of the wiring 22B is connected to the external connection terminal 101B. The wiring 22B passes through the neck portion 4, the second portion 3, and the wiring part 1B and is connected to the external connection terminal 101B.

[0048] The wiring 22C electrically connects the magnetic head connection terminal 21C and an external connection terminal 101C, which will be described later. One end of the wiring 22C is connected to the magnetic head connection terminal 21C. The other end of the wiring 22C is connected to the external connection terminal 101C. The wiring 22C passes through the neck portion 4, the second portion 3, and the wiring portion 1B and is connected to the external connection terminal 101C.

[0049] The wiring 22D electrically connects the magnetic head connection terminal 21D and an external connection terminal 101D, which will be described later. One end of the wiring 22D is connected to the magnetic head connection terminal 21D. The other end of the wiring 22D is connected to the external connection terminal 101D. The wiring 22D passes through the neck portion 4, the second portion 3, and the wiring part 1B and is connected to the external connection terminal 101D.

[0050] The first terminal 23A is arranged at one end of the first portion 2 in the first direction. The first terminal 23A is arranged on one side of the magnetic head connection terminals 21A, 21B, 21C, and 21D in the first direction. The first terminal 23A is arranged at the other end of the first portion 2 in the second direction. With the first piezoelectric element Pz1 mounted on the mounting portion 1A, the first terminal 23A is connected to one end of the first piezoelectric element Pz1. The first terminal 23A has a substantially rectangular shape.

[0051] The second terminal 23B is disposed away from the first terminal 23A in the first direction. The second terminal 23B is disposed at the other end of the first portion 2 in the first direction. The second terminal 23B is disposed on the other side of the magnetic head connection terminals 21A, 21B, 21C, and 21D in the first direction. The second terminal 23B is disposed on the opposite side of the first terminal 23A with respect to the magnetic head connection terminals 21A, 21B, 21C, and 21D in the first direction. The second terminal 23B is disposed at the other end of the first portion 2 in the second direction. When the second piezoelectric element Pz2 is mounted on the mounting portion 1A, the second terminal 23B is connected to one end of the second piezoelectric element Pz2. The second terminal 23B has a substantially rectangular shape.

[0052] When the slider S is mounted on the mounting portion 1A, the pedestal 24A and the pedestal 24B support the first end E1 of the slider S. The pedestal 24A is disposed on the other side of the magnetic head connection terminal 21A in the second direction. In other words, the pedestal 24A is disposed on the other side in the second direction of the magnetic head connection terminal 21A, which is disposed furthest on one side in the first direction among the multiple magnetic head connection terminals 21A, 21B, 21C, and 21D. The pedestal 24B is disposed away from the pedestal 24A in the first direction. The pedestal 24B is disposed on the other side in the second direction of the magnetic head connection terminal 21D. In other words, the pedestal 24B is disposed on the other side in the second direction of the magnetic head connection terminal 21D, which is disposed furthest on the other side in the first direction among the multiple magnetic head connection terminals 21A, 21B, 21C, and 21D.

[0053] The pedestal 24C is positioned away from the pedestals 24A and 24B in the second direction. The pedestal 24C is positioned at the other end of the first portion 2 in the second direction. When the slider S is mounted on the mounting portion 1A, the pedestal 24C supports approximately the center of the slider S in the second direction. The pedestal 24C is positioned between the first terminal 23A and the second terminal 23B in the first direction. When the slider S is mounted on the mounting portion 1A, the pedestal 24C supports approximately the center of the slider S in the first direction.

[0054] (1-2)Second part The second portion 3 is disposed on the other side of the first portion 2 in the second direction. The second portion 3 is connected to the first portion 2 via the neck portion 4. The second portion 3 extends in the first direction and the second direction. The shape of the second portion 3 is not limited. For example, the second portion 3 has a substantially rectangular flat plate shape. The second portion 3 has a third terminal 31A, a fourth terminal 31B, some of the multiple wirings 32A and 32B, and an opposing portion 33.

[0055] The third terminal 31A is disposed at one end of the second portion 3 in the first direction. The third terminal 31A is disposed away from the first terminal 23A in the second direction. When the first piezoelectric element Pz1 is mounted on the mounting portion 1A, the third terminal 31A is connected to the other end of the first piezoelectric element Pz1. The third terminal 31A has a substantially rectangular shape.

[0056] The fourth terminal 31B is disposed at the other end of the second portion 3 in the first direction. The fourth terminal 31B is disposed away from the third terminal 31A in the first direction. The fourth terminal 31B is disposed away from the second terminal 23B in the second direction. With the second piezoelectric element Pz2 mounted on the mounting portion 1A, the fourth terminal 31B is connected to the other end of the second piezoelectric element Pz2. The fourth terminal 31B has a substantially rectangular shape.

[0057] The wiring 32A electrically connects the third terminal 31A and an external connection terminal 102A, which will be described later. One end of the wiring 32A is connected to the third terminal 31A. The other end of the wiring 32A is connected to the external connection terminal 102A. The wiring 32A passes through the wiring section 1B and is connected to the external connection terminal 102A.

[0058] The wiring 32B electrically connects the fourth terminal 31B and an external connection terminal 102B, which will be described later. One end of the wiring 32B is connected to the fourth terminal 31B. The other end of the wiring 32B is connected to the external connection terminal 102B. The wiring 32B passes through the wiring section 1B and is connected to the external connection terminal 102B.

[0059] The facing portion 33 is disposed between the third terminal 31A and the fourth terminal 31B in the first direction. When the slider S is mounted on the mounting portion 1A, the facing portion 33 overlaps with the second end E2 of the slider S. That is, when the slider S is mounted on the mounting portion 1A, the facing portion 33 faces the second end E2 of the slider S in the thickness direction (see FIG. 2A). Note that the facing portion 33 does not include the third terminal 31A or the fourth terminal 31B. When the slider S is mounted on the mounting portion 1A, the second end E2 of the slider S does not overlap with the third terminal 31A or the fourth terminal 31B in the thickness direction.

[0060] (1-3) Neck The neck portion 4 is disposed in the second direction between the first portion 2 and the second portion 3. The dimension of the neck portion 4 is smaller than the dimension of the first portion 2 and the dimension of the second portion 3 in the first direction.

[0061] (2) Wiring section The wiring portion 1B is arranged on the other side of the mounting portion 1A in the second direction. The wiring portion 1B is arranged away from the mounting portion 1A. The wiring portion 1B extends in the second direction. The wiring portion 1B has a belt shape. In addition to the above-mentioned wires 22A, 22B, 22C, 22D and wires 32A, 32B, the wiring portion 1B has a plurality of external connection terminals 101A, 101B, 101C, 101D and a plurality of external connection terminals 102A, 102B.

[0062] The external connection terminals 101A, 101B, 101C, and 101D and the external connection terminals 102A and 102B are arranged in a predetermined direction at intervals from each other. The direction in which the external connection terminals 101A, 101B, 101C, and 101D and the external connection terminals 102A and 102B are arranged may be a direction different from the first direction.

[0063] 2.Layer structure of suspension board with circuit Next, the layer structure of the suspension board with circuit 1 will be described.

[0064] (1) Layer structure of the first part As shown in Figures 2A and 2B, the first part 2 has a first metal support layer 11A, a first insulating layer 12A, the above-mentioned magnetic head connection terminal 21A (see Figure 2A), the above-mentioned wiring 22A, 22B (see Figure 2A), a conductor layer 13A (see Figure 2B), a first cover insulating layer 14A as an example of a cover insulating layer, and the above-mentioned base 24A (see Figure 2A).

[0065] The magnetic head connection terminals 21B, 21C, and 21D (see FIG. 1), the wiring 22C and 22D (see FIG. 1), and the bases 24B and 24C do not appear in FIGS. 2A and 2B. Furthermore, although not shown in FIGS. 2A and 2B, the first portion 2 has a conductor layer 13B (see FIG. 1).

[0066] (1-1) First metal support layer The first metal support layer 11A supports the first insulating layer 12A, the magnetic head connection terminals 21A, 21B, 21C, and 21D, the wiring 22A, 22B, 22C, and 22D, the conductor layers 13A and 13B, the first cover insulating layer 14A, and the pedestals 24A, 24B, and 24C. Examples of materials for the first metal support layer 11A include stainless steel and copper alloys.

[0067] (1-2) First insulating layer The first insulating layer 12A is disposed on one surface of the first metal support layer 11A in the thickness direction of the first metal support layer 11A. The first insulating layer 12A is disposed between the first metal support layer 11A and the magnetic head connection terminals 21A, 21B, 21C, and 21D, between the first metal support layer 11A and the wiring 22A, 22B, 22C, and 22D, and between the first metal support layer 11A and the conductor layers 13A and 13B. The first insulating layer 12A insulates the magnetic head connection terminals 21A, 21B, 21C, and 21D, the wiring 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B from the first metal support layer 11A. The first insulating layer 12A is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 12A is preferably made of polyimide and has two through holes 121A and 121B (see FIG. 1).

[0068] (1-3) Magnetic head connection terminals, wiring, and conductor layers The magnetic head connection terminals 21A, 21B, 21C, and 21D, the wirings 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B are disposed on one surface of the first insulating layer 12A in the thickness direction. The conductor layer 13A includes the first terminal 23A described above. The conductor layer 13B includes the second terminal 23B described above. That is, the first terminal 23A and the second terminal 23B are disposed on one surface of the first insulating layer 12A in the thickness direction. The conductor layer 13A contacts the first metal support layer 11A through the through hole 121A of the first insulating layer 12A. This electrically connects the first terminal 23A to the first metal support layer 11A. The conductor layer 13B (see FIG. 1) contacts the first metal support layer 11A through the through hole 121B of the first insulating layer 12A. As a result, the second terminal 23B is electrically connected to the first metal support layer 11A. The magnetic head connection terminals 21A, 21B, 21C, and 21D, the wiring 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B are made of metal. Examples of metal include copper, silver, gold, iron, aluminum, and alloys thereof. The magnetic head connection terminals 21A, 21B, 21C, and 21D, the wiring 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B are preferably made of copper.

[0069] (1-4) First cover insulating layer The first cover insulating layer 14A is disposed on one surface of the first insulating layer 12A in the thickness direction. The first cover insulating layer 14A covers the wirings 22A, 22B, 22C, and 22D and part of the conductor layers 13A and 13B (portions other than the first terminal 23A and the second terminal 23B). The thickness of the first cover insulating layer 14A on the conductor layers 13A and 13B tends to be greater than the thickness of the first cover insulating layer 14A on the wirings 22A, 22B, 22C, and 22D. The first cover insulating layer 14A does not cover the magnetic head connecting terminals 21A, 21B, 21C, and 21D, the first terminal 23A, and the second terminal 23B. In the first embodiment, when the first piezoelectric element Pz1 is mounted on the suspension board with circuit 1, one end of the first piezoelectric element Pz1 is electrically connected to one surface of the first terminal 23A in the thickness direction. Furthermore, with the second piezoelectric element Pz2 mounted on the suspension board with circuit 1, one end of the second piezoelectric element Pz2 is electrically connected to one surface of the second terminal 23B in the thickness direction. The first cover insulating layer 14A is made of a resin. Examples of the resin include the same resin as that of the first insulating layer 12A described above. The first cover insulating layer 14A is preferably made of polyimide (a cured product of photosensitive polyimide).

[0070] (1-5) Pedestal Each of the bases 24A, 24B, and 24C is disposed on one surface of the first insulating layer 12A in the thickness direction. Each of the bases 24A, 24B, and 24C may be disposed on one surface of the first metal support layer 11A in the thickness direction. Each of the bases 24A, 24B, and 24C may have multiple layers 241, 242, and 243. The layer 241 is made of, for example, a metal. The layer 241 is preferably made of the same metal as the magnetic head connection terminals 21A, 21B, 21C, and 21D, the wiring 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B. The layer 242 is made of, for example, a resin. The layer 242 is preferably made of the same resin as the first insulating cover layer 14A. The layer 242 may be continuous with the first insulating cover layer 14A. The layer 243 is made of, for example, a resin. The layer 243 is preferably made of the same resin as the first insulating cover layer 14A.

[0071] (2) Layer structure of the second part The second portion 3 has a second metal support layer 11B, a second insulating layer 12B, a conductor layer 13C (see FIG. 2B), a second cover insulating layer 14B, and the above-mentioned facing portion 33 (see FIG. 2A).

[0072] Although not shown in FIGS. 2A and 2B, the second portion 3 has a conductor layer 13D (see FIG. 1).

[0073] (2-1) Second metal support layer The second metal support layer 11B supports the second insulating layer 12B, the conductor layers 13C and 13D, the second insulating cover layer 14B, and the facing portion 33. Examples of materials for the second metal support layer 11B include the same metal as that for the first metal support layer 11A. The second metal support layer 11B is preferably made of the same metal as that for the first metal support layer 11A. The second metal support layer 11B may be continuous with the first metal support layer 11A.

[0074] (2-2) Second insulating layer The second insulating layer 12B is disposed on one surface of the second metal support layer 11B in the thickness direction. The second insulating layer 12B is disposed between the second metal support layer 11B and the conductor layers 13C and 13D. The second insulating layer 12B insulates the conductor layers 13C and 13D from the second metal support layer 11B. The second insulating layer 12B is made of a resin. Examples of the resin include the same resin as that of the first insulating layer 12A. The second insulating layer 12B is preferably made of the same resin as that of the first insulating layer 12A. The second insulating layer 12B may be continuous with the first insulating layer 12A.

[0075] (2-3) Conductor layer The conductor layers 13C and 13D are disposed on one surface of the second insulating layer 12B in the thickness direction. The conductor layer 13C includes the third terminal 31A described above. The conductor layer 13D includes the fourth terminal 31B described above. That is, the third terminal 31A and the fourth terminal 31B are disposed on one surface of the second insulating layer 12B in the thickness direction. The conductor layer 13D is disposed away from the conductor layer 13C. The conductor layers 13C and 13D are made of a metal. Examples of the metal include the same metal as that of the magnetic head connecting terminals 21A, 21B, 21C, and 21D, the wiring 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B. The conductor layers 13C and 13D are preferably made of the same metal as the magnetic head connection terminals 21A, 21B, 21C, and 21D, the wirings 22A, 22B, 22C, and 22D, and the conductor layers 13A and 13B.

[0076] (2-4) Second cover insulating layer The second cover insulating layer 14B is disposed on one surface of the second insulating layer 12B in the thickness direction. The second cover insulating layer 14B covers part of the conductor layers 13C and 13D (portions other than the third terminal 31A and the fourth terminal 31B). The thickness of the second cover insulating layer 14B on the conductor layers 13C and 13D tends to be greater than the thickness of the first cover insulating layer 14A on the wirings 22A, 22B, 22C, and 22D. The second cover insulating layer 14B does not cover the third terminal 31A and the fourth terminal 31B. In the first embodiment, when the first piezoelectric element Pz1 is mounted on the suspension board with circuit 1, the other end of the first piezoelectric element Pz1 is electrically connected to one surface of the third terminal 31A in the thickness direction. Furthermore, with the second piezoelectric element Pz2 mounted on the suspension board with circuit 1, the other end of the second piezoelectric element Pz2 is electrically connected to one surface of the fourth terminal 31B in the thickness direction. The second cover insulating layer 14B is made of a resin. Examples of the resin include the same resin as that of the first cover insulating layer 14A. The second cover insulating layer 14B is preferably made of the same resin as that of the first cover insulating layer 14A. The second cover insulating layer 14B may be continuous with the first cover insulating layer 14A.

[0077] (2-5) Opposing part The facing portion 33 is disposed on one surface of the second metal support layer 11B in the thickness direction. The facing portion 33 has a third insulating layer 331. In the first embodiment, the facing portion 33 is made of only the third insulating layer 331.

[0078] The third insulating layer 331 is disposed on one surface of the second metal support layer 11B in the thickness direction. This covers one surface of the second metal support layer 11B. As a result, when the slider S is mounted on the mounting portion 1A, the second end E2 of the slider S can be prevented from contacting the second metal support layer 11B. In the first embodiment, the third insulating layer 331 is made of the same material as the first insulating layer 12A. The third insulating layer 331 may be continuous with the first insulating layer 12A and the second insulating layer 12B. The thickness T2 of the third insulating layer 331 is thinner than the thickness T1 of the first insulating layer 12A and the thickness of the second insulating layer 12B. In other words, in the first embodiment, the thickness of the facing portion 33 is thinner than the thickness T1 of the first insulating layer 12A. Therefore, when the slider S is mounted on the mounting portion 1A, the facing portion 33 faces the second end E2 of the slider S at a distance in the thickness direction. Therefore, when the slider S is mounted on the mounting portion 1A, the second end E2 of the slider S can be prevented from coming into contact with the facing portion 33.

[0079] When the slider S is mounted on the mounting portion 1A, the slider S preferably contacts only the pedestals 24A, 24B, and 24C, and does not contact any other parts of the mounting portion 1A than the pedestals 24A, 24B, and 24C.

[0080] 3. Manufacturing method of suspension board with circuit Next, a method for manufacturing the suspension board with circuit 1 will be described.

[0081] The method for manufacturing the suspension board with circuit 1 includes an insulating layer forming step (see FIGS. 3A and 3B), a conductor pattern forming step (see FIGS. 4A and 4B), and a cover insulating layer forming step (see FIGS. 5A and 5B).

[0082] (1) Insulation layer formation process 3A and 3B, in the insulating layer formation step, insulating layer 20 is formed on metal substrate M. Insulating layer 20 includes first insulating layer 12A, second insulating layer 12B, and third insulating layer 331. Metal substrate M is the material of first metal support layer 11A and second metal support layer 11B.

[0083] In the insulating layer forming step, third insulating layer 331 is formed by gradation exposure to be thinner than first insulating layer 12A and second insulating layer 12B.

[0084] Specifically, first, a solution (varnish) of a photosensitive resin (preferably a photosensitive polyimide) is applied onto the substrate M and dried to form a coating film of the photosensitive resin.

[0085] Next, the photosensitive resin coating is subjected to gradational exposure using a photomask having a light-shielding portion, a fully transparent portion, and a semi-transparent portion. The light-shielding portion faces the portion of the photosensitive resin coating where the insulating layer 20 will not be formed. The fully transparent portion faces the portion of the photosensitive resin coating where the first insulating layer 12A and the second insulating layer 12B will be formed. The semi-transparent portion faces the portion of the photosensitive resin coating where the third insulating layer 331 will be formed.

[0086] Next, the exposed coating film is developed. The portion of the coating film facing the semi-transparent portion is developed thinner than the portion facing the fully transparent portion. In this way, an insulating layer 20 is formed on the substrate M.

[0087] (2) Conductor pattern formation process 4A and 4B, in the conductor pattern forming step, the conductor pattern 30 is formed on the insulating layer 20. The conductor pattern 30 includes magnetic head connection terminals 21A, 21B, 21C, and 21D, wirings 22A, 22B, 22C, and 22D, conductor layers 13A, 13B, 13C, and 13D, wirings 32A and 32B, external connection terminals 101A, 101B, 101C, 101D, 102A, and 102B, and layers 241 of the bases 24A, 24B, and 24C.

[0088] More specifically, in the conductive pattern forming step, a seed layer is first formed on one surface of the insulating layer 20 and one surface of the substrate M in the thickness direction. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0089] Next, a plating resist is attached to one surface in the thickness direction of the base material M. The plating resist covers the insulating layer 20.

[0090] Next, the plating resist is exposed to light and developed, which removes the plating resist from the area where the conductive pattern 30 is to be formed, exposing the seed layer in the area where the conductive pattern 30 is to be formed. On the other hand, the plating resist remains in the area where the conductive pattern is not to be formed.

[0091] Next, the conductive pattern 30 is formed on the exposed seed layer by electrolytic plating. After the electrolytic plating is completed, the plating resist is stripped off. Thereafter, the seed layer exposed by the stripping of the plating resist is removed by etching.

[0092] (3) Cover insulating layer forming process 5A and 5B, in the cover insulating layer forming step, the cover insulating layer 40 is formed on the insulating layer 20. The cover insulating layer 40 includes a first cover insulating layer 14A, a second cover insulating layer 14B, and layers 242 of the bases 24A, 24B, and 24C.

[0093] The cover insulating layer 40 is formed in the same manner as the insulating layer 20. More specifically, in the cover insulating layer forming step, first, a photosensitive resin solution (varnish) is applied onto the conductive pattern 30, the insulating layer 20, and the base material M, and then dried to form a coating film of the photosensitive resin.

[0094] Next, the photosensitive resin coating is exposed to light and developed, thereby forming the cover insulating layer 40 on the insulating layer 20.

[0095] 2A and 2B, after the cover insulating layer forming step, a layer 243 is formed on the layer 242. The layer 243 is formed in the same manner as the insulating layer 20 and the cover insulating layer 40.

[0096] Thereafter, the substrate M is etched to form a metal support layer including a first metal support layer 11A, a second metal support layer 11B, and outrigger portions (not shown).

[0097] In this way, the suspension board with circuit 1 is obtained.

[0098] 4. Effects (1) According to the suspension board with circuit 1, as shown in FIG. 1, the second portion 3 has a third terminal 31A connected to the other end of the first piezoelectric element Pz1 and a fourth terminal 31B connected to the other end of the second piezoelectric element Pz2, and has an opposing portion 33 opposing the second end E2 of the slider S.

[0099] 2A, the facing portion 33 faces the second end E2 of the slider S at a distance in the thickness direction, and has a third insulating layer 331. The third insulating layer 331 is disposed on one surface of the second metal support layer 11B. That is, one surface of the second metal support layer 11B is covered with the third insulating layer 331.

[0100] Therefore, when the slider S is mounted on the mounting portion 1A, the second end E2 of the slider S can be prevented from coming into contact with the second metal support layer 11B.

[0101] (2) According to the suspension board with circuit 1, as shown in Fig. 2A, the facing portion 33 is formed only by the third insulating layer 331, and the thickness T2 of the third insulating layer 331 is thinner than the thickness T1 of the first insulating layer 12A. In other words, the thickness of the facing portion 33 is thinner than the thickness T1 of the first insulating layer 12A.

[0102] Therefore, when the slider S is mounted on the mounting portion 1A, a distance between the second end E2 of the slider S and the facing portion 33 can be ensured.

[0103] As a result, the second end E2 of the slider S can be prevented from coming into contact with the facing portion 33 when the slider S is mounted on the mounting portion 1A.

[0104] (3) According to the suspension board with circuit 1, as shown in FIG. 2A, the third insulating layer 331 is made of the same material as the first insulating layer 12A.

[0105] Therefore, as shown in FIG. 3A, in the step of forming the first insulating layer 12A, the third insulating layer 331 can be formed together with the first insulating layer 12A.

[0106] Therefore, an increase in the number of steps can be suppressed.

[0107] 5. Variations Next, a modified example will be described. In the modified example, the same members as those in the first embodiment are given the same reference numerals, and the description thereof will be omitted.

[0108] (1) As shown in FIG. 6, the third insulating layer 331 may be made of the same material as the first insulating cover layer 14A.

[0109] According to this modification, in the step of forming the first insulating cover layer 14A, the third insulating layer 331 can be formed together with the first insulating cover layer 14A.

[0110] Therefore, an increase in the number of steps can be suppressed.

[0111] 7, the facing portion 33 may further include a conductor layer 332 and a facing cover insulating layer 333. The facing portion 33 may include a plurality of conductor layers 332.

[0112] The conductor layer 332 is disposed on one surface of the third insulating layer 331 in the thickness direction. The conductor layer 332 is made of, for example, the same material as the conductor layers 13C and 13D. In this modification, the conductor layer 332 extends in a first direction. The direction in which the conductor layer 332 extends is not limited to the first direction. The conductor layer 332 has a width W2 in a direction (a second direction in this modification) perpendicular to both the extension direction of the conductor layer 332 and the thickness direction.

[0113] The width W2 of the conductor layer 332 is preferably equal to or smaller than the width W1 of each of the wirings 22A, 22B, 22C, and 22D. When the facing portion 33 includes a plurality of conductor layers 332, the spacing D2 between each of the plurality of conductor layers 332 is equal to or smaller than the spacing D1 between each of the wirings 22A, 22B, 22C, and 22D. The conductor layer 332 is not continuous with the wirings 22A, 22B, 22C, and 22D. The conductor layer 332 may be continuous with the conductor layer 13C or the conductor layer 13D.

[0114] The opposing cover insulating layer 333 is disposed on one surface of the third insulating layer 331 in the thickness direction. The opposing cover insulating layer 333 covers the conductor layer 332.

[0115] In this modification, the thickness T2 of the third insulating layer 331 may be the same as the thickness T1 of the first insulating layer 12A.

[0116] According to this modification, the opposing cover insulating layer 333 is inserted between each of the plurality of conductor layers 332, and is therefore formed thinner than the second insulating layer 14B on the conductor layer 13C.

[0117] Furthermore, the width W2 of the conductor layer 332 disposed in the facing portion 33 is equal to or smaller than the width W1 of the wiring 22A disposed in the first portion 2.

[0118] Therefore, when the facing portion 33 has the conductor layer 332, it is possible to prevent the thickness of the facing cover insulating layer 333 that covers the conductor layer 332 from becoming thicker than the thickness of the first cover insulating layer 14A that covers the wiring 22A.

[0119] As a result, even when the facing portion 33 has the conductive layer 332, the distance between the second end E2 of the slider S and the facing portion 33 can be ensured.

[0120] As a result, even when the facing portion 33 has the conductive layer 332, the second end E2 of the slider S can be prevented from coming into contact with the facing portion 33.

[0121] (3) As shown in FIG. 8, the thickness of the opposing cover insulating layer 333 is preferably thinner than the thickness of the first cover insulating layer 14A.

[0122] According to this modification, the distance between the second end E2 of the slider S and the facing portion 33 can be further ensured.

[0123] As a result, the second end E2 of the slider S is more effectively prevented from coming into contact with the facing portion 33.

[0124] (4) In the modified examples (1) to (3), the same effects as those of the above-described embodiment can be obtained.

[0125] 6. Second embodiment 9 to 10B, a suspension board with circuit 200 according to a second embodiment will be described. In the second embodiment, the same members as those in the first embodiment will be denoted by the same reference numerals, and description thereof will be omitted.

[0126] 10A and 10B , in a state in which the slider S, the first piezoelectric element Pz1, and the second piezoelectric element Pz2 are mounted on the suspension board with circuit 200, the first piezoelectric element Pz1 and the second piezoelectric element Pz2 may be disposed on the opposite side of the suspension board with circuit 200 from the slider S in the thickness direction. In other words, in a state in which the first piezoelectric element Pz1 and the second piezoelectric element Pz2 are mounted on the suspension board with circuit 1, the first piezoelectric element Pz1 and the second piezoelectric element Pz2 may be disposed on the other side of the suspension board with circuit 1 in the thickness direction.

[0127] 9, the first piezoelectric element Pz1 and the second piezoelectric element Pz2 may overlap the slider S in the thickness direction of the suspension board with circuit 1. The second end E2 of the slider S may overlap the third terminal 31A and the fourth terminal 31B in the thickness direction.

[0128] (1) First Metal Support Layer of the Second Embodiment 10B, in the second embodiment, the first metal support layer 11A has a first opening 201A. When the first piezoelectric element Pz1 is mounted on the suspension board with circuit 200, one end of the first piezoelectric element Pz1 is disposed within the first opening 201A of the first metal support layer 11A.

[0129] Although not shown, the first metal support layer 11A further has a second opening 201B that is disposed apart from the first opening 201A in the first direction. When the second piezoelectric element Pz2 is mounted on the suspension board with circuit 200, one end of the second piezoelectric element Pz2 is disposed within the second opening 201B of the first metal support layer 11A.

[0130] (2) First insulating layer of the second embodiment 9 and 10B, in the second embodiment, the first insulating layer 12A has a first through hole 211A. The first through hole 211A is disposed away from the through hole 121A. When viewed from the other side in the thickness direction, the first through hole 211A is disposed within the first opening 201A of the first metal support layer 11A.

[0131] 9, first insulating layer 12A has second through holes 211B arranged apart from first through holes 211A in the first direction. Second through holes 211B are arranged apart from through holes 121B. When viewed from the other side in the thickness direction, second through holes 211B are arranged within second openings 201B (not shown) of first metal support layer 11A.

[0132] (3) First and second terminals of the second embodiment In the second embodiment, the first terminal 23A is disposed in the first through hole 211A of the first insulating layer 12A. As shown in Fig. 10B, the first terminal 23A is exposed in the thickness direction through the first through hole 211A and into the first opening 201A of the first metal support layer 11A. With the first piezoelectric element Pz1 mounted on the suspension board with circuit 200, one end of the first piezoelectric element Pz1 is electrically connected to the other surface of the first terminal 23A in the thickness direction.

[0133] 9, the second terminal 23B is disposed in the second through-hole 211B of the first insulating layer 12A. The second terminal 23B is exposed in the thickness direction through the second through-hole 211B into a second opening 201B (not shown) of the first metal support layer 11A. With the second piezoelectric element Pz2 mounted on the suspension board with circuit 200, one end of the second piezoelectric element Pz2 is electrically connected to the other surface of the second terminal 23B in the thickness direction.

[0134] (4) First insulating cover layer of the second embodiment As shown in FIG. 10B, in the second embodiment, a first insulating cover layer 14A covers the entire conductor layers 13A and 13B.

[0135] (5) Second Metal Support Layer of the Second Embodiment 10B, in the second embodiment, the second metal support layer 11B has a third opening 202A. When the first piezoelectric element Pz1 is mounted on the suspension board with circuit 200, the other end of the first piezoelectric element Pz1 is disposed within the third opening 202A of the second metal support layer 11B.

[0136] Although not shown, the second metal support layer 11B further has a fourth opening 202B that is disposed apart from the third opening 202A in the first direction. When the second piezoelectric element Pz2 is mounted on the suspension board with circuit 200, the other end of the second piezoelectric element Pz2 is disposed within the fourth opening 202B of the second metal support layer 11B.

[0137] (6) Second insulating layer of the second embodiment 9 and 10B, in the second embodiment, the second insulating layer 12B has a third through hole 212A. The third through hole 212A is disposed apart from the first through hole 211A in the second direction. When viewed from the other side in the thickness direction, the third through hole 212A is disposed within the third opening 202A of the second metal support layer 11B.

[0138] 9, second insulating layer 12B has fourth through hole 212B disposed apart from third through hole 212A in the first direction. Fourth through hole 212B is disposed apart from second through hole 211B in the second direction. When viewed from the other side in the thickness direction, fourth through hole 212B is disposed within fourth opening 202B (not shown) of second metal support layer 11B.

[0139] (7) Third and fourth terminals of the second embodiment In the second embodiment, the third terminal 31A is disposed in the third through hole 212A of the second insulating layer 12B. As shown in Fig. 10B, the third terminal 31A is exposed in the thickness direction through the third through hole 212A and into the third opening 202A of the second metal support layer 11B. With the first piezoelectric element Pz1 mounted on the suspension board with circuit 200, the other end of the first piezoelectric element Pz1 is electrically connected to the other surface of the third terminal 31A in the thickness direction.

[0140] 9, the fourth terminal 31B is disposed in a fourth through hole 212B of the second insulating layer 12B. The fourth terminal 31B is exposed in the thickness direction through the fourth through hole 212B and into a fourth opening 202B (not shown) of the second metal support layer 11B. With the second piezoelectric element Pz2 mounted on the suspension board with circuit 200, the other end of the second piezoelectric element Pz2 is electrically connected to the other surface of the fourth terminal 31B in the thickness direction.

[0141] (8) Second insulating cover layer of the second embodiment As shown in FIG. 10B, in the second embodiment, a second insulating cover layer 14B covers the entire conductor layers 13C and 13D.

[0142] (9) Opposing portion 220 of the second embodiment As shown in FIG. 10A, in the second embodiment, the facing portion 220 includes a third insulating layer 331, a plurality of first conductor layers 332A, a plurality of second conductor layers 332B (see FIG. 9), and a facing cover insulating layer 333.

[0143] As shown in FIG. 9, the plurality of first conductor layers 332A are disposed apart from the fourth terminal 31B and are continuous with the third terminal 31A. Each of the plurality of first conductor layers 332A extends in a first direction. The width of the first conductor layer 332A is preferably equal to or smaller than the width W1 (see FIG. 7) of each of the wirings 22A, 22B, 22C, and 22D. The spacing between the plurality of first conductor layers 332A is equal to or smaller than the spacing D1 (see FIG. 7) of each of the wirings 22A, 22B, 22C, and 22D. The first conductor layer 332A is not continuous with the wirings 22A, 22B, 22C, and 22D.

[0144] The plurality of second conductor layers 332B are disposed between the plurality of first conductor layers 332A and the fourth terminal 31B in the first direction. The plurality of second conductor layers 332B are disposed apart from the plurality of first conductor layers 332A in the first direction. The plurality of second conductor layers 332B may be continuous with the plurality of first conductor layers 332A. The plurality of second conductor layers 332B are continuous with the fourth terminal 31B. Each of the plurality of second conductor layers 332B extends in the first direction. The width of the second conductor layer 332B is preferably equal to or smaller than the width W1 (see FIG. 7) of each of the wirings 22A, 22B, 22C, and 22D. The spacing between the plurality of second conductor layers 332B is equal to or smaller than the spacing D1 (see FIG. 7) between the wirings 22A, 22B, 22C, and 22D. The second conductor layer 332B is not continuous with the wirings 22A, 22B, 22C, and 22D.

[0145] As shown in FIG. 10A, the opposing cover insulating layer 333 covers the first conductor layer 332A and the second conductor layer 332B (see FIG. 9).

[0146] According to the second embodiment, the opposing cover insulating layer 333 covering the first conductor layer 332A is formed thinner than the second insulating layer 14B on the conductor layer 13C by being positioned between the plurality of first conductor layers 332A. Also, the opposing cover insulating layer 333 covering the second conductor layer 332B is formed thinner than the second insulating layer 14B on the conductor layer 13D by being positioned between the plurality of second conductor layers 332B. Furthermore, the widths of the first conductor layer 332A and the second conductor layer 332B arranged in the opposing portion 220 are equal to or smaller than the width W1 of each of the wirings 22A, 22B, 22C, and 22D.

[0147] Therefore, it is possible to prevent the thickness of the opposing cover insulating layer 333 from becoming thicker than the thickness of the first cover insulating layer 14A.

[0148] This ensures a gap between the second end E2 of the slider S and the facing portion 220, and prevents the second end E2 of the slider S from coming into contact with the facing portion 220.

[0149] In the second embodiment, the same effects as those of the first embodiment can be obtained. [Explanation of symbols]

[0150] 1. Circuit-equipped suspension board 2 Part 1 3 Second part 11A 1st metal support layer 11B Second metal support layer 12A First insulating layer 12B Second insulating layer 21A Magnetic head connection terminal 22A wiring 23A 1st terminal 23B 2nd terminal 31A 3rd terminal 31B 4th terminal 33 Opposing part 331 Third insulating layer 332 Conductor layer 333 Opposing cover insulating layer E1 1st end E2 2nd end Pz1 First piezoelectric element Pz2 Second piezoelectric element S slider W1 Wiring width W2 Conductor layer width

Claims

1. A suspension board with circuit on which a slider having a magnetic head, a first piezoelectric element, and a second piezoelectric element can be mounted, the slider has a first end where the magnetic head is disposed and a second end opposite the first end, the suspension board with circuit has a first portion capable of supporting the slider and a second portion connected to the first portion, The first portion is a first metal support layer; a first insulating layer disposed on one surface of the first metal support layer in a thickness direction of the first metal support layer; a magnetic head connection terminal disposed on one surface of the first insulating layer in the thickness direction and connected to the magnetic head; a first terminal connectable to one end of the first piezoelectric element; a second terminal that is disposed apart from the first terminal in a first direction perpendicular to the thickness direction and that is connectable to one end of the second piezoelectric element; and The second portion is a second metal support layer; a second insulating layer disposed on one surface of the second metal support layer in the thickness direction; the first terminal is spaced apart from the first terminal in a second direction perpendicular to both the thickness direction and the first direction, a third terminal connectable to the other end of the first piezoelectric element; a fourth terminal that is disposed apart from the second terminal in the second direction and is connectable to the other end of the second piezoelectric element; and The second portion is a facing portion disposed between the third terminal and the fourth terminal in the first direction and facing the second end of the slider across a gap in the thickness direction, The facing portion is a third insulating layer disposed on one surface of the second metal support layer in the thickness direction;

2. the facing portion is made of only the third insulating layer, 2. The suspension board with circuit according to claim 1, wherein the thickness of said third insulating layer is thinner than the thickness of said first insulating layer.

3. 3. The suspension board with circuit according to claim 2, wherein said third insulating layer is made of the same material as said first insulating layer.

4. The first portion is a wiring disposed on one surface of the first insulating layer in the thickness direction and connected to the magnetic head connection terminal; a cover insulating layer disposed on one surface of the first insulating layer in the thickness direction and covering the wiring, 3. The suspension board with circuit according to claim 2, wherein said third insulating layer is made of the same material as said cover insulating layer.

5. The first portion is a wiring disposed on one surface of the first insulating layer in the thickness direction and connected to the magnetic head connection terminal; a cover insulating layer disposed on one surface of the first insulating layer in the thickness direction and covering the wiring, The facing portion is a conductor layer disposed on one surface of the third insulating layer in the thickness direction; an opposing cover insulating layer disposed on one surface of the third insulating layer in the thickness direction and covering the conductor layer; 2. The suspension board with circuit according to claim 1, wherein the width of said conductor layer is equal to or smaller than the width of said wiring.

6. 6. The suspension board with circuit according to claim 5, wherein the opposing insulating cover layer has a thickness smaller than that of the insulating cover layer.

7. the first terminal and the second terminal are disposed on one surface of the first insulating layer in the thickness direction; 2. The suspension board with circuit according to claim 1, wherein the third terminal and the fourth terminal are arranged on one surface of the second insulating layer in the thickness direction.

8. the first insulating layer has a first through hole and a second through hole disposed apart from the first through hole in the first direction; the first terminal is disposed in the first through hole; the second terminal is disposed in the second through hole; the second insulating layer has a third through hole and a fourth through hole disposed apart from the third through hole in the first direction; the third terminal is disposed in the third through hole, The suspension board with circuit according to claim 1 , wherein the fourth terminal is disposed in the fourth through hole.

9. The first portion is a wiring disposed on one surface of the first insulating layer in the thickness direction and connected to the magnetic head connection terminal; a cover insulating layer disposed on one surface of the first insulating layer in the thickness direction and covering the wiring, The facing portion is a first conductor layer disposed on one surface of the third insulating layer in the thickness direction and continuous with the third terminal; a second conductor layer disposed on one surface of the third insulating layer in the thickness direction and continuous with the fourth terminal; an opposing cover insulating layer disposed on one surface of the third insulating layer in the thickness direction and covering the first conductor layer and the second conductor layer, 9. The suspension board with circuit according to claim 8, wherein the width of said first conductor layer and said second conductor layer is equal to or less than the width of said wiring.

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