Coin-type non-contact information medium and manufacturing method thereof

Abstract

To provide a coin-type non-contact information medium that is highly shock-resistant and enables accurate wireless communication even when a plurality of coin-type contactless information media are placed close to each other.SOLUTION: A coin-type non-contact information medium 10 includes a substrate 110 on which an IC chip is provided, a metal ring 120 including at least one slit portion, and a protective member 130 that covers the substrate and the metal ring. The IC chip is provided in a gap between the slits in the metal ring. The substrate may include a protrusion that fits into the slit portion, and the IC chip may be provided on the protrusion.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a coin-type contactless information medium and a method for manufacturing the coin-type contactless information medium. [Background technology]

[0002] Demand for contactless information media such as RFID is increasing due to their convenience, as they connect to a reader / writer via wireless communication and do not require contact with the reader / writer. In particular, coin-type contactless information media equipped with an IC chip are beginning to be used as chips in casinos, as they are highly secure and can be authenticated (see, for example, Patent Document 1 or Patent Document 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 6,021,949 [Patent Document 2] U.S. Patent No. 3,766,452 Summary of the Invention [Problem to be solved by the invention]

[0004] When coin-type contactless information media are used as casino chips, it is necessary to accurately read the information on each of the multiple coin-type contactless information media. Furthermore, because casino chips often collide with one another, it is necessary to prevent damage to the IC chips caused by the collisions. In particular, coin-type contactless information media used as casino chips require weight to create a luxurious feel, and may include weight elements. The impact of a collision between coin-type contactless information media containing weight elements is greater than the impact of a collision between coin-type contactless information media without weight elements, and therefore the impact transmitted to the IC chip is also greater.

[0005] In view of the above problems, one embodiment of the present invention has an object to provide a coin-type contactless information medium that is highly shock-resistant and capable of accurate wireless communication even when multiple coin-type contactless information media are placed in close proximity. Another object of one embodiment of the present invention is to provide a method for manufacturing the coin-type contactless information medium. [Means for solving the problem]

[0006] A coin-type contactless information medium according to one embodiment of the present invention includes a substrate having an IC chip, a metal ring including at least one slit portion, and a protective member covering the substrate and the metal ring, and the IC chip is provided within the gap of the slit portion.

[0007] The substrate may include a protrusion that fits into the at least one slit, and the IC chip may be provided on the protrusion.

[0008] In a side view, the top surface of the IC chip may be located lower than the top surface of the metal ring.

[0009] The metal ring may include a stepped portion on its inner side, and the peripheral edge of the substrate may contact the stepped portion.

[0010] The substrate may further include an antenna and an inductor connected in series with the antenna.

[0011] A coin-type contactless information medium according to one embodiment of the present invention includes a substrate having an IC chip, a metal ring having at least one slit portion and a first recess recessed inward from the surface, and a protective member covering the substrate and the metal ring, wherein the first recess overlaps the substrate, and the IC chip is located within the space formed by the first recess and the substrate.

[0012] The opening surface of the first recess may be covered by the substrate.

[0013] The substrate may further include an antenna and an inductor connected in series to the antenna, and the metal ring may further include a second recess recessed inward from the surface, and the inductor may be located within a space formed by the second recess and the substrate.

[0014] The substrate may further include a capacitor electrically connected in parallel to the IC chip, and the metal ring may further include a third recess recessed inward from the surface, and the capacitor may be located within a space formed by the third recess and the substrate.

[0015] A method for manufacturing a coin-type contactless information medium according to one embodiment of the present invention comprises mounting an IC chip on a protruding portion of a substrate, placing the substrate on a metal ring including at least one slit portion so that the protruding portion fits into the at least one slit portion, and using injection molding to form a protective member that covers the substrate and the metal ring.

[0016] The substrate may be disposed on the metal ring so that the top surface of the IC chip is located lower than the top surface of the metal ring in a side view.

[0017] The substrate may be placed on the metal ring so that the peripheral edge of the substrate is locked by a stepped portion on the inside of the metal ring.

[0018] The method for manufacturing a coin-type contactless information medium may further include mounting an inductor so as to be connected in series to the antenna formed on the substrate.

[0019] A method for manufacturing a coin-type contactless information medium according to one embodiment of the present invention comprises mounting an IC chip on a substrate, placing a metal ring on the substrate, the metal ring including a first recess recessed from the surface to the inside, so that the first recess covers the IC chip, and using injection molding to form a protective member that covers the substrate and the metal ring.

[0020] A metal ring may be disposed on the substrate so that the opening face of the first recess is covered by the substrate.

[0021] The manufacturing method for a coin-type contactless information medium may further include mounting an inductor so that it is connected in series with the antenna formed on the substrate, and the metal ring may further include a second recess recessed inward from the surface, and the metal ring may be positioned on the substrate so that the second recess covers the inductor.

[0022] The manufacturing method for a coin-type contactless information medium may further include mounting a capacitor so that it is connected in parallel with the IC chip, and the metal ring may further include a third recess recessed inward from the surface, and the metal ring may be arranged on the substrate so that the third recess covers the inductor.

[0023] The inductor may be a chip inductor mounted on a substrate. [Effects of the Invention]

[0024] The coin-type contactless information medium according to one embodiment of the present invention has high shock resistance because it can absorb shock transmitted to the IC chip. Furthermore, even when multiple coin-type contactless information media are placed close to each other, mutual interference between the coils is suppressed, resulting in small changes in the resonant frequency or voltage of the resonant circuit of the coin-type contactless information medium, enabling accurate wireless communication. Furthermore, even when multiple coin-type contactless information media are stacked, the change in the resonant frequency of each resonant circuit of the multiple coin-type contactless information media is small, thereby suppressing a drop in the voltage generated by the coin-type contactless information medium, thereby increasing the number of coin-type contactless information media that can be read by a reader / writer. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a perspective view showing an outline of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 2] 1 is a cross-sectional view of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 3] 1 is a side view of a substrate and a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 4]1 is a top view of a substrate and a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 5] 1 is an exploded perspective view of a substrate and a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 6] 1 is a block diagram showing the configuration of an IC chip of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 7] 1 is a circuit diagram of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 8] 1 is a flowchart showing a method for manufacturing a coin-type contactless information medium according to an embodiment of the present invention. [Figure 9] 1 is a side view of a substrate and a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 10] 1 is an exploded perspective view of a substrate and a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 11] 1 is a perspective view showing an outline of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 12] 1 is a cross-sectional view of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 13] 1 is a cross-sectional view of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 14] 1 is a top view of a substrate and a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. [Figure 15] 1 is a bottom view of a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. FIG. [Figure 16] 1 is a flowchart showing a method for manufacturing a coin-type contactless information medium according to an embodiment of the present invention. [Figure 17] 1 is a bottom view of a metal ring of a coin-type contactless information medium according to an embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, various embodiments of the present invention will be described with reference to the drawings. However, the present invention can be embodied in various forms without departing from the spirit of the present invention, and the present invention should not be construed as being limited to the description of the embodiments exemplified below.

[0027] In order to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements having the same functions as those explained in the previous drawings may be assigned the same reference numerals, and duplicate explanations may be omitted.

[0028] In this specification and drawings, when multiple identical or similar components are collectively referred to, they may be referred to by the same reference numeral or the same reference numeral with an uppercase alphabet. When multiple parts of a single component are to be distinguished from one another, the same reference numeral may be used, and a hyphen and a natural number may also be used.

[0029] In this specification, the letters "first," "second," or "third" attached to each component are convenient labels used to distinguish each component, and have no other meaning unless otherwise specified.

[0030] In this specification, the surface of the substrate included in the coin-type contactless information medium on which the IC chip is provided will be referred to as the "top surface," and the opposite surface of the substrate will be referred to as the "bottom surface." Furthermore, the surfaces that intersect with the top and bottom surfaces will be referred to as "side surfaces."

[0031] In this specification, "close to" includes not only a case where multiple coin-type contactless information media are close to each other with a space between them, but also a case where multiple coin-type contactless information media are in direct contact with each other. For example, "close to" includes a state where multiple coin-type contactless information media are overlapping each other.

[0032] First Embodiment A coin-type contactless information medium 10 according to one embodiment of the present invention will be described with reference to FIGS.

[0033] [1. Overview of the coin-type contactless information medium 10] Fig. 1 is a perspective view showing an outline of a coin-type contactless information medium 10 according to one embodiment of the present invention. As shown in Fig. 1, the coin-type contactless information medium 10 includes a substrate 110, a metal ring 120, and a protective member 130. The substrate 110 and the metal ring 120 are located inside the coin-type contactless information medium 10, and are both covered by the protective member 130.

[0034] The protective member 130 forms the external shape of the coin-type contactless information medium 10 and protects the substrate 110 and the metal ring 120 from external impacts. Therefore, in the coin-type contactless information medium 10, it is preferable that the substrate 110 and the metal ring 120 are completely covered by the protective member 130. The protective member 130 is made of a resin, and may be a thermosetting resin or a thermoplastic resin. For example, acrylonitrile butadiene styrene, polycarbonate, polyphthalamide, polyoxymethylene, polymethyl methacrylate, polyethylene, polypropylene, polybutylene terephthalate, or vinyl chloride may be used as the protective member 130.

[0035] 1 is in the shape of a circular flat plate, the shape of the coin-type contactless information medium 10 is not limited to this. The coin-type contactless information medium 10 may be in the shape of an elliptical flat plate or a polygonal flat plate. Furthermore, the coin-type contactless information medium 10 is preferably in the shape of a flat plate whose thickness is smaller than the diameter of its base, but may also be in the shape of a cylinder whose thickness is larger than the diameter of its base.

[0036] The coin-type contactless information medium 10 is, for example, a chip (coin or token) used in a casino or an amusement facility, but the use of the coin-type contactless information medium 10 is not limited to this. The coin-type contactless information medium 10 can be, for example, a tag for managing goods. It can also be used as a gadget.

[0037] [2. Configuration of coin-type contactless information medium 10] FIG. 2 is a cross-sectional view of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, FIG. 2 is a cross-sectional view of the coin-type contactless information medium 10 taken from the top to the bottom along line A1-A2 shown in FIG. 1. FIG. 3 is a side view of the substrate 110 and the metal ring 120 of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, FIG. 3 is a side view of the substrate 110 and the metal ring 120 from direction B in the coin-type contactless information medium 10 from which the protective member 130 has been removed. FIG. 4 is a top view of the substrate 110 and the metal ring 120 of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, FIG. 4 is a top view of the substrate 110 and the metal ring 120 in the coin-type contactless information medium 10 from which the protective member 130 has been removed. FIG. 5 is an exploded perspective view of the substrate 110 and the metal ring 120 of the coin-type contactless information medium 10 according to one embodiment of the present invention. Specifically, FIG. 5 is an exploded perspective view of the substrate 110 and the metal ring 120 in the coin-type contactless information medium 10 with the protective member 130 removed.

[0038] An antenna 140, an inductor 150, a capacitor 160, and an IC chip 170 are provided on the substrate 110 (see, for example, FIG. 4 or FIG. 5). That is, the substrate 110 can function as a base material that supports the antenna 140, the inductor 150, the capacitor 160, and the IC chip 170. The substrate 110 can be, for example, a paper phenol substrate, a paper epoxy substrate, a glass epoxy substrate, a composite substrate epoxy substrate, a glass composite substrate, a glass polyimide substrate, a BT substrate, a Teflon (registered trademark) substrate, or a PPO substrate.

[0039] The antenna 140 receives signals from a reader / writer that communicates wirelessly, or transmits signals to the reader / writer. The number of turns of the coil of the antenna 140 is preferably between one and three, and particularly preferably two. Compared to conventional antennas, the number of turns of the coil of the antenna 140 is significantly smaller. The antenna 140 is formed to have a predetermined shape on the substrate 110 using a conductive material such as metal. The antenna 140 can be formed using methods such as printing, coating, or etching. The inductor 150, the capacitor 160, and the IC chip 170 are mounted on the substrate 110. Therefore, the inductor 150 and the capacitor 160 are mountable chip inductors and chip capacitors, respectively. The inductor 150 is electrically connected in series with the antenna 140 (see, for example, FIG. 4 or FIG. 5). The capacitor 160 and the IC chip 170 are electrically connected to the antenna 140 at connection points 142 and 144 (see, for example, FIG. 4). The capacitor 160 and the IC chip 170 are electrically connected in parallel.

[0040] Now, with reference to FIG. 6, the IC chip 170 will be described.

[0041] FIG. 6 is a block diagram showing the configuration of the IC chip 170 of the coin-type contactless information medium 10 according to one embodiment of the present invention. As shown in FIG. 6, the IC chip 170 includes a control unit 172, a communication unit 174, and a storage unit 176. The control unit 172 controls the processing operations of the communication unit 174 and the storage unit 176. The communication unit 174 processes a signal received from the reader / writer via the antenna 140, and extracts information requested by the reader / writer from the storage unit 176. The communication unit 174 also transmits a signal corresponding to the extracted information to the reader / writer via the antenna 140. The storage unit 176 stores various information including identification information for identifying the coin-type contactless information medium 10.

[0042] An induced current is supplied to IC chip 170 from a resonant circuit formed by antenna 140, inductor 150, and capacitor 160. IC chip 170 starts operating when the voltage value corresponding to the induced current is equal to or greater than a threshold value (operable voltage value).

[0043] The configuration of the coin-type contactless information medium 10 will be described with reference to FIGS. 2 to 5 again.

[0044] The substrate 110 has a generally circular shape and includes a protruding portion 112 that protrudes outward (see, for example, FIG. 5). The IC chip 170 is provided on the protruding portion 112.

[0045] The metal ring 120 can function as a weight member that adds weight to the coin-type contactless information medium 10. For example, brass or aluminum can be used as the metal ring 120. The metal ring 120 has a generally annular shape and includes a slit portion 122 where a portion of the metal ring 120 is cut to expose the cross-sectional end portion of the metal ring 120 (see, for example, FIG. 5). In other words, the metal ring 120 has a C-shape that includes the slit portion 122.

[0046] The inner diameter of the metal ring 120 is approximately the same as or slightly larger than the diameter of the substrate 110. Furthermore, the width of the gap of the slit portion 122 of the metal ring 120 is approximately the same as or slightly larger than the width of the protrusion portion 112 of the substrate 110. Therefore, the substrate 110 can be inserted inside the metal ring 120 so that the protrusion portion 112 fits into the slit portion 122. In other words, the protrusion portion 112 is inserted into the gap of the slit portion 122. A step portion 124 is provided on the inside of the metal ring 120 (see, for example, FIG. 5). When the protrusion portion 112 is inserted into the gap of the slit portion 122, the substrate 110 is locked by the step portion 124 (see, for example, FIG. 2), and the position is fixed.

[0047] The IC chip 170 provided on the protrusion 112 is located within the gap of the slit 122, i.e., between the end faces (or cut faces) of the metal ring 120. In a side view, the top surface of the IC chip 170 is located lower than the top surface of the metal ring 120 (see, for example, FIG. 3).

[0048] It is sufficient that at least one slit portion 122 is provided, into which the protrusion portion 112 is fitted, and the metal ring 120 may include a plurality of slit portions 122.

[0049] As described above, in the coin-type contactless information medium 10, the IC chip 170 is located within the gap of the slit portion 122 and is protected by the end face of the metal ring 120. Therefore, even if the coin-type contactless information medium 10 is subjected to an external impact, such as when the coin-type contactless information medium 10 is dropped, the impact is absorbed by the metal ring 120, and the impact transmitted to the IC chip 170 can be alleviated.

[0050] [3. Electrical Characteristics of Coin-Type Contactless Information Medium 10] Fig. 7 is a circuit diagram of a coin-type contactless information medium 10 according to one embodiment of the present invention. As shown in Fig. 7, the antenna 140 and the inductor 150 are electrically connected in series, and a closed circuit is formed by the antenna 140, the inductor 150, and the capacitor 160. The closed circuit formed by the antenna 140, the inductor 150, and the capacitor 160 is a so-called resonant circuit.

[0051] The resonant frequency fr of the resonant circuit formed by the antenna 140, the inductor 150, and the capacitor 160 is expressed by the following equation (1).

[0052]

number

[0053] Here, La, Lb, and C in equation (1) are the inductance of antenna 140, the inductance of inductor 150, and the capacitance of capacitor 160, respectively.

[0054] When the resonant frequency fr of the resonant circuit of the coin-type contactless information medium 10 matches the frequency fc of the reader / writer, an induced current flows in the resonant circuit of the coin-type contactless information medium 10. The inductance La of the antenna 140 and the inductance Lb of the inductor 150 are set so that the resonant frequency fr of the resonant circuit of the coin-type contactless information medium 10 matches the frequency fc of the reader / writer, so that the coin-type contactless information medium 10 can receive power from the reader / writer with high efficiency.

[0055] As described above, the inductor 150 is a chip inductor, and therefore its size is sufficiently small. Therefore, the inductor 150 can also be called a lumped-parameter inductor, which allows for lumped parameters. In the coin-type contactless information medium 10, the number of turns of the coil of the antenna 140 is small, and the inductance La of the antenna 140 is smaller than the inductance Lb of the inductor 150. Therefore, in the coin-type contactless information medium 10, the inductance Lb of the inductor 150 is increased to increase the inductance of the resonant circuit, thereby matching the resonant frequency fr of the coin-type contactless information medium 10 with the frequency fc of the reader / writer. In the coin-type contactless information medium 10, even if the inductance La of the antenna 140 is small, it is sufficient to increase the inductance Lb of the inductor 150, and there is no need to increase the capacitance C of the capacitor 160. Therefore, the capacitance C of the capacitor 160 can be made approximately the same as the conventional capacitance. Therefore, the coin-type contactless information medium 10 can be miniaturized without increasing the size of the capacitor 160. Furthermore, in the coin type contactless information medium 10, the capacitance C of the capacitor 160 does not increase, and therefore the Q factor does not decrease. Therefore, the power generation efficiency does not decrease, and sufficient power can be supplied to the IC chip 170. As a result, in the coin type contactless information medium 10, malfunction of the IC chip 170 due to insufficient power is prevented. Therefore, the coin type contactless information medium 10 can perform stable wireless communication with the reader / writer.

[0056] Next, wireless communication between a plurality of coin-type contactless information media 10 and a reader / writer will be described.

[0057] In conventional coin-type contactless information media that do not have the inductor 150, the resonant frequency fr is adjusted by increasing the number of turns in the antenna coil to increase the antenna inductance. When antennas with a large number of turns are placed close to each other, mutual interference occurs between the coils. As a result, in conventional coin-type contactless information media, the resonant frequency or voltage of the resonant circuit formed by the antenna and capacitor changes, making it impossible to perform accurate wireless communication with the reader / writer.

[0058] In contrast, in the coin type contactless information medium 10, the number of turns of the coil of the antenna 140 is one, which is significantly less than the number of turns of the coil of the antenna of a conventional coin type contactless information medium. Therefore, even when multiple coin type contactless information media 10 are placed close to each other, mutual interference between the coils of the antenna 140 is unlikely to occur.

[0059] Furthermore, the shape of the coil also affects the mutual interference between the coils. The larger the coil shape, the greater the area where the coils overlap, making it more likely that mutual interference between the coils will occur. However, the inductor 150 included in the coin-type contactless information medium 10 is sufficiently small in size, and the shape of the coil is also small. Therefore, even if multiple coin-type contactless information media 10 are placed close to each other, mutual interference between the coils due to the inductor 150 is unlikely to occur.

[0060] Therefore, in the coin-type contactless information medium 10, mutual interference between coils is suppressed, so that accurate wireless communication can be performed between multiple coin-type contactless information media 10 and the reader / writer even when multiple coin-type contactless information media 10 are in close proximity.

[0061] Furthermore, the ratio of inductance to capacitance of the resonant circuit in the coin-type contactless information medium 10 is almost the same as that of conventional coin-type contactless information media. Therefore, even when multiple coin-type contactless information media 10 are close to each other, the resonance strength can be maintained at a predetermined value or higher, allowing efficient reception of power from the reader / writer. As a result, each of the multiple coin-type contactless information media 10 can smoothly start operation.

[0062] As described above, even when multiple coin-type contactless information media 10 are in close proximity, mutual interference between the coils is suppressed and power is supplied efficiently, enabling accurate wireless communication.

[0063] 4. Manufacturing Method of Coin-Type Contactless Information Medium 10 8 is a flowchart showing a method for manufacturing the coin-type contact-less information medium 10 according to one embodiment of the present invention. The coin-type contact-less information medium 10 is manufactured through steps S100 to S120. However, the method for manufacturing the coin-type contact-less information medium 10 is not limited to this and may include other steps.

[0064] In step S100, inductor 150, capacitor 160, and IC chip 170 are mounted on substrate 110 on which antenna 140 having a predetermined shape is formed. This electrically connects antenna 140 to inductor 150, capacitor 160, and IC chip 170. In addition, a closed circuit is formed by antenna 140, inductor 150, and capacitor 160.

[0065] In step S110, the substrate 110 is inserted into the inside of the metal ring 120 so that the protrusions 112 fit into the slits 122. The alignment of the substrate 110 and the metal ring 120 can be achieved by fitting the protrusions 112 into the slits 122, so there is no need to provide a separate alignment marker. The inserted substrate 110 is locked by a step 124 on the inside of the metal ring 120, and its position is fixed.

[0066] In step S120, injection molding is used to form the protective member 130 that covers the substrate 110 and the metal ring 120. Specifically, resin is injected onto the substrate 110 and the metal ring 120 that are placed in a mold, and the resin is molded under a predetermined temperature and pressure to form the protective member 130.

[0067] As described above, in the coin-type contactless information medium 10, the IC chip 170 is located in the slit portion 122 of the metal ring 120 and is protected by the end face of the metal ring 120. Therefore, the coin-type contactless information medium 10 has high impact resistance. Furthermore, in the coin-type contactless information medium 10, mutual interference can be suppressed by the inductor 150. Therefore, the coin-type contactless information medium 10 has a small change in the resonant frequency of the resonant circuit, enabling accurate wireless communication even when multiple coin-type contactless information media 10 are in close proximity. Even when multiple coin-type contactless information media 10 are stacked, the change in the resonant frequency of each of the resonant circuits of the multiple coin-type contactless information media 10 is small, suppressing a drop in voltage generated by the coin-type contactless information media 10. This increases the number of coin-type contactless information media 10 that can be read by a reader / writer. Furthermore, when multiple coin-type contactless information media 10 are stacked, the stacked metal rings 120 form a cylindrical body, allowing radio waves to pass through while being reflected within the cylindrical body. Therefore, the radio waves can reach the coin-type contactless information medium 10 that is far from the reader / writer, and the number of coin-type contactless information media 10 that can be read by the reader / writer increases.

[0068] <Modification of the first embodiment> 9 and 10, a description will be given of a coin type contactless information medium 10A, which is a modified example of the coin type contactless information medium 10. In the following, when the configuration of the coin type contactless information medium 10A is the same as that of the coin type contactless information medium 10, the description of the configuration of the coin type contactless information medium 10A may be omitted.

[0069] Fig. 9 is a side view of the substrate 110A and metal ring 120A of the coin-type contactless information medium 10A according to one embodiment of the present invention, and Fig. 10 is an exploded perspective view of the substrate 110A and metal ring 120A of the coin-type contactless information medium 10A according to one embodiment of the present invention.

[0070] An antenna 140, an inductor 150, a capacitor 160, and an IC chip 170 are provided on the substrate 110A (see, for example, FIG. 10). The metal ring 120A includes a slit portion 122A. The outer periphery of the metal ring 120A substantially coincides with the outer periphery of the substrate 110A, and the metal ring 120A is disposed on the substrate 110A (see, for example, FIG. 9).

[0071] In the coin-type contactless information medium 10A, the substrate 110A does not include a protrusion, and the metal ring 120A does not include a step. However, in the substrate 110A on which the metal ring 120A is arranged, the IC chip 170 is located within the gap of the slit portion 122A, i.e., between the end faces of the metal ring 120A, and is protected by the end faces of the metal ring 120A. In addition, the top surface of the IC chip 170 is located lower than the top surface of the metal ring 120A (see, for example, FIG. 9).

[0072] As described above, in the coin-type contactless information medium 10A, the IC chip 170 is located in the slit portion 122A of the metal ring 120A and is protected by the end face of the metal ring 120A. Therefore, the coin-type contactless information medium 10A has high impact resistance. Furthermore, in the coin-type contactless information medium 10A, the inductor 150 can suppress mutual interference, so the coin-type contactless information medium 10A has a small change in the resonant frequency of its resonant circuit, enabling accurate wireless communication even when multiple coin-type contactless information media 10A are in close proximity. Furthermore, even when multiple coin-type contactless information media 10A are stacked, the change in the resonant frequency of each of the multiple coin-type contactless information media 10A is small, suppressing a drop in voltage generated by the coin-type contactless information media, thereby increasing the number of coin-type contactless information media 10A that can be read by a reader / writer. Furthermore, when multiple coin-type contactless information media 10A are stacked, the overlapping metal rings 120A form a cylindrical body, and radio waves can pass through while being reflected inside the cylindrical body. As a result, radio waves can reach coin-type contactless information media 10A that are far from the reader / writer, and the number of coin-type contactless information media 10A that can be read by the reader / writer increases.

[0073] Second Embodiment 11 to 16, a coin-type contactless information medium 20 according to one embodiment of the present invention will be described. In the following, when the configuration of the coin-type contactless information medium 20 is the same as that of the coin-type contactless information medium 10, the description of the configuration of the coin-type contactless information medium 20 may be omitted.

[0074] [1. Overview of the coin-type contactless information medium 20] Fig. 11 is a perspective view showing an outline of a coin-type contactless information medium 20 according to one embodiment of the present invention. As shown in Fig. 11, the coin-type contactless information medium 20 includes a substrate 210, a metal ring 220, and a protective member 230. The substrate 210 and the metal ring 220 are located inside the coin-type contactless information medium 20, and are both covered by the protective member 230.

[0075] [2. Configuration of the coin-type contactless information medium 20] 12 and 13 are cross-sectional views of the coin-type contactless information medium 20 according to one embodiment of the present invention. Specifically, FIG. 12 is a cross-sectional view of the coin-type contactless information medium 20 taken from the top to the bottom along line C1-C2 shown in FIG. 11, and FIG. 13 is a cross-sectional view of the coin-type contactless information medium 20 taken from the top to the bottom along line D1-D2 shown in FIG. 11. FIG. 14 is a top view of the substrate 210 and the metal ring 220 of the coin-type contactless information medium 20 according to one embodiment of the present invention. Specifically, FIG. 14 is a top view of the substrate 210 and the metal ring 220 in the coin-type contactless information medium 20 from which the protective member 230 has been removed. FIG. 15 is a bottom view of the metal ring 220 of the coin-type contactless information medium 20 according to one embodiment of the present invention. Specifically, FIG. 15 is a bottom view of the metal ring 220 in the coin-type contactless information medium 20 from which the substrate 210 and the protective member 230 have been removed.

[0076] An antenna 240, an inductor 250, a capacitor 260, and an IC chip 270 are provided on the substrate 110 (see, for example, FIG. 14). The antenna 240 has a coil with one turn. The inductor 250 and the capacitor 260 are a chip inductor and a chip capacitor, respectively. The inductor 250 is electrically connected in series with the antenna 240. The capacitor 260 and the IC chip 270 are electrically connected to the antenna 240 at connection points 242 and 244. The capacitor 260 and the IC chip 270 are electrically connected in parallel.

[0077] The metal ring 220 is disposed on the substrate 210 (see, for example, FIG. 12 or FIG. 13). The metal ring 220 includes a slit portion 222 formed by cutting a portion of the metal ring 220 (see, for example, FIG. 14 or FIG. 15). Furthermore, a recess 224 recessed inward from the bottom surface is provided on the bottom surface (surface facing the substrate 210) of the metal ring 220 (see, for example, FIG. 13, FIG. 14, or FIG. 15). The recess 224 overlaps the substrate 210.

[0078] The opening area of ​​the recess 224 is larger than the mounting area of ​​the IC chip 270 (see, for example, FIG. 14). The depth of the recess 224 is larger than the height from the surface of the substrate 210 to the upper surface of the IC chip 270 (see, for example, FIG. 13). Therefore, when the metal ring 220 is placed on the substrate 210, a space enclosed by the substrate 210 and the recess 224 is formed, and the IC chip 270 is located within the formed space. Although it is sufficient that at least a portion of the opening surface of the recess 224 is blocked by the substrate 210, it is preferable that the entire opening surface of the recess 224 is blocked. When the opening surface of the recess 224 is completely blocked by the substrate 210, the formed space is surrounded by the substrate 210 and the metal ring 220, and therefore the IC chip 270 located within the space is not in contact with the protective member 230.

[0079] The opening shape of the recess 224 is not limited to a rectangle, but may be a circle, an ellipse, a polygon, or the like.

[0080] As described above, in the coin-type contactless information medium 20, the IC chip 270 is located in the recess 224 provided in the metal ring 220 and is protected by the recess 224. Therefore, even if the coin-type contactless information medium 20 is subjected to an external impact, such as when the coin-type contactless information medium 20 is dropped, the impact is absorbed by the metal ring 220, and it is possible to reduce the impact transmitted to the IC chip 270. Furthermore, even when multiple coin-type contactless information media 20 are in close proximity to each other, mutual interference between the coils is suppressed and power is supplied efficiently, enabling accurate wireless communication.

[0081] 3. Manufacturing method of coin-type non-contact information medium 20 16 is a flowchart showing a method for manufacturing the coin-type contact-less information medium 20 according to one embodiment of the present invention. The coin-type contact-less information medium 20 is manufactured through steps S200 to S220. However, the method for manufacturing the coin-type contact-less information medium 20 is not limited to this and may include other steps.

[0082] In step S200, inductor 250, capacitor 260, and IC chip 270 are mounted on substrate 210 on which antenna 240 having a predetermined shape is formed. This electrically connects antenna 240 to inductor 250, capacitor 260, and IC chip 270. In addition, a closed circuit is formed by antenna 240, inductor 250, and capacitor 260.

[0083] In step S210, the metal ring 220 is placed on the substrate 210 so that the recess 224 covers the IC chip 270. The alignment between the substrate 210 and the metal ring 220 may be performed using the slit portion 222 of the metal ring 220. For example, the alignment between the substrate 210 and the metal ring 220 can be performed by providing a slit portion of the same size as the slit portion 222 in the substrate 210 and aligning the slit portion 222 of the metal ring 220 with the slit portion of the substrate 210. Alternatively, the alignment between the substrate 210 and the metal ring 220 can be performed by providing a protrusion on the substrate that fits into the slit portion 222 of the metal ring 220 and fitting the slit portion 222 of the metal ring 220 into the protrusion of the substrate 210.

[0084] In step S220, protective member 230 that covers substrate 210 and metal ring 220 is molded using injection molding. Specifically, resin is injected onto substrate 210 and metal ring 220 placed in a mold, and the resin is molded under a predetermined temperature and pressure to form protective member 230. At this time, IC chip 270 is protected by recess 224 and is not in contact with the resin. Therefore, IC chip 270 is less susceptible to the effects of the temperature and pressure used in molding the resin, and damage to IC chip 270 during the injection molding process is reduced.

[0085] As described above, in the coin-type contactless information medium 20, the IC chip 270 is located in the recess 224 provided in the metal ring 220 and is protected by the recess 224. Therefore, the coin-type contactless information medium 10 has high impact resistance and reduces damage to the IC chip 270 during the injection molding process. Furthermore, in the coin-type contactless information medium 20, the inductor 250 can suppress mutual interference, so that the change in the resonant frequency of the resonant circuit of the coin-type contactless information medium 20 is small, allowing accurate wireless communication even when multiple coin-type contactless information media 20 are in close proximity. Furthermore, even when multiple coin-type contactless information media 20 are stacked, the change in the resonant frequency of each resonant circuit of the multiple coin-type contactless information media 20 is small, suppressing a drop in voltage generated in the coin-type contactless information medium, thereby increasing the number of coin-type contactless information media 20 that can be read by the reader / writer. Furthermore, when multiple coin-type contactless information media 20 are stacked, the stacked metal rings 220 form a cylindrical body, and radio waves can pass through the cylindrical body while being reflected inside. This allows radio waves to reach coin-type contactless information media 20 that are far from the reader / writer, increasing the number of coin-type contactless information media 20 that can be read by the reader / writer.

[0086] <Modification of the second embodiment> 17, a description will be given of a coin type contactless information medium 20A which is a modified example of the coin type contactless information medium 20. In the following, when the configuration of the coin type contactless information medium 20A is the same as that of the coin type contactless information medium 20, the description of the configuration of the coin type contactless information medium 20A may be omitted.

[0087] Fig. 17 is a bottom view of a metal ring 220A of a coin-type contactless information medium 20A according to one embodiment of the present invention. As shown in Fig. 17, the metal ring 220A includes a slit portion 222A formed by cutting a portion of the metal ring 220A. In addition, a first recess 224A-1 recessed inward from the bottom surface is provided on the bottom surface of the metal ring 220A.

[0088] Furthermore, metal ring 220A is provided with first protrusion 226A-1 and second protrusion 226A-2 on the inner side of the annular shape. Also, first protrusion 226A-1 and second protrusion 226A-2 are provided with second recess 224A-2 and third recess 224A-3 recessed inward from the bottom surface, respectively.

[0089] When the metal ring 220A is disposed on the substrate 210, the first recess 224A-1, the second recess 224A-2, and the third recess 224A-3 can cover the IC chip 270, the inductor 250, and the capacitor 260, respectively. That is, the IC chip 270 is located in the space formed by the substrate 210 and the first recess 224A-1, the inductor 250 is located in the space formed by the substrate 210 and the second recess 224A-2, and the capacitor 260 is located in the space formed by the substrate 210 and the third recess 224A-3. Because all of these spaces are surrounded by the substrate 210 and the metal ring 220A, the IC chip 270, the inductor 250, and the capacitor 260 located in the spaces are not in contact with the protective member.

[0090] As described above, in the coin type contactless information medium 20A, the IC chip 270, the inductor 250, and the capacitor 260 are protected by the first recess 244A-1, the second recess 244A-2, and the third recess 244A-3, respectively. Therefore, the coin type contactless information medium 20A has high impact resistance and reduces damage to the IC chip 270, the inductor 250, and the capacitor 260 during the injection process. Furthermore, in the coin type contactless information medium 20A, the inductor 250 can suppress mutual interference, so that the coin type contactless information medium 20A has a small change in the resonant frequency of the resonant circuit, and can perform accurate wireless communication even when multiple coin type contactless information media 20A are in close proximity. Furthermore, even when multiple coin-type contactless information media 20A are stacked, the change in the resonant frequency of each resonant circuit of the multiple coin-type contactless information media 20A is small, and a drop in the voltage generated by the coin-type contactless information media is suppressed, thereby increasing the number of coin-type contactless information media 20A that can be read by the reader / writer. Furthermore, when multiple coin-type contactless information media 20A are stacked, a cylindrical body is formed by the overlapping metal rings 220A, and radio waves can pass through while being reflected within the cylindrical body. Therefore, radio waves can reach coin-type contactless information media 20A that are far from the reader / writer, and the number of coin-type contactless information media 20A that can be read by the reader / writer is increased.

[0091] The above-described embodiments of the present invention may be combined as appropriate as long as they are not mutually inconsistent. Furthermore, even if a person skilled in the art appropriately adds or deletes components or modifies the design based on each embodiment, the addition, deletion, or modification of components is included in the scope of the present invention as long as the gist of the present invention is maintained.

[0092] Furthermore, even if there are other effects and advantages different from those brought about by the above-mentioned embodiments, those that are clear from the description in this specification or that can be easily predicted by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]

[0093] 10, 10A: coin-type contactless information medium, 110, 110A: substrate, 112: protrusion, 120, 120A: metal ring, 122, 122A: slit, 124: step, 130: protective member, 140: antenna, 142, 144: connection point, 150: inductor, 160: capacitor, 170: IC chip, 172: control unit, 174: communication unit, 176: memory unit, 20, 20A: coin-type contactless information medium, 210: substrate, 220, 220A: metal ring, 222, 222A: slit portion, 224, 224A: recess, 226A: protrusion, 230: protective member, 240: antenna, 242, 244: connection point, 250: inductor, 260: capacitor, 270: IC chip

Claims

1. a substrate on which an IC chip is provided; a metal ring including at least one slit portion and a first recess recessed from a surface thereof to an interior thereof; a protective member covering the substrate and the metal ring, the first recess overlaps the substrate; The coin-type contactless information medium, wherein the IC chip is located within a space formed by the first recess and the substrate.

2. The coin-type contactless information medium according to claim 1 , wherein an opening surface of the first recess is closed by the substrate.

3. The substrate further includes an antenna and an inductor connected in series to the antenna; the metal ring further includes a second recess recessed from the surface to the interior; 3. The coin-type contactless information medium according to claim 1, wherein the inductor is located within a space formed by the second recess and the substrate.

4. The substrate further includes a capacitor connected in parallel with the IC chip, the metal ring further includes a third recess recessed from the surface to the interior; 4. The coin-type contactless information medium according to claim 1, wherein the capacitor is located in a space formed by the third recess and the substrate.

5. 4. The coin-type contactless information medium according to claim 3, wherein the inductor is a chip inductor mounted on the substrate.

6. Mounting an IC chip on the board a metal ring including a first recess recessed from a surface thereof to an interior thereof is disposed on the substrate so that the first recess covers the IC chip; A method for manufacturing a coin-type contactless information medium, wherein a protective member that covers the substrate and the metal ring is formed by injection molding.

7. 7. The method for manufacturing a coin-type contactless information medium according to claim 6, wherein the metal ring is disposed on the substrate so that an opening surface of the first recess is covered by the substrate.

8. Furthermore, an inductor is mounted so as to be connected in series to the antenna formed on the substrate; the metal ring further includes a second recess recessed from the surface to the interior; 8. The method for manufacturing a coin-type contactless information medium according to claim 6, wherein the metal ring is disposed on the substrate so that the second recess covers the inductor.

9. Furthermore, a capacitor is mounted so as to be connected in parallel with the IC chip, the metal ring further includes a third recess recessed from the surface to the interior; 9. The method for manufacturing a coin-type contactless information medium according to claim 6, wherein the metal ring is disposed on the substrate so that the third recess covers the capacitor.

10. 9. The method for manufacturing a coin-type contactless information medium according to claim 8, wherein the inductor is a chip inductor.

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