Aqueous acid development or processing of organometallic photoresists
JP2025500211APending Publication Date: 2025-01-09LAM RES CORP
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Patent Information
- Application Number
- JP2024535624
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-12-16
- Filing Date
- 2022-12-12
- Publication Date
- 2025-01-09
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Figure 2025500211000001_ABST
Abstract
The present disclosure relates to the use of aqueous acids to develop or treat radiation-sensitive films. The aqueous acids can be used to form patterns by a positive tone wet development process or to treat the developed patterns by further removing residual resist components.
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