FOUP or Cassette Storage for Hybrid Substrate Bonding Systems

Abstract

Embodiments of an equipment front-end module (EFEM) are provided herein. In some embodiments, the EFEM includes two or more load ports for receiving two or more types of substrates, an overhead storage unit disposed above the two or more load ports and having a plurality of storage shelves configured to hold two or more types of front-opening unified pods (FOUPs) of different sizes, each storing the two or more types of substrates, with a horizontal array disposed between the plurality of storage shelves and the two or more load ports to provide a horizontal passage for the FOUPs during transport to the two or more load ports, and an overhead transport system disposed on opposite sides of the overhead storage unit and having a pair of vertical actuators configured to transport the FOUPs from the overhead storage unit to the two or more load ports.

Description

[Technical field]

[0001]

[0001] Embodiments of the present disclosure generally relate to substrate processing apparatus. [Background technology]

[0002]

[0002] Substrates undergo various processes during the manufacture of semiconductor integrated circuit devices. Some of these processes include wafer dicing, where the processed wafer is placed on a dicing tape and cut or separated into multiple dies or chiplets. Once the wafer is diced, the chiplets typically remain on the dicing tape until they are extracted and bonded to a substrate. Conventional processing tools for cleaning, dicing, and bonding the chiplets to a substrate typically include multiple tools or a single linear robot housed in a mainframe tool. However, such conventional processing tools have limitations in storage and automated processing of a variety of substrates.

[0003] Accordingly, the present inventors have provided an improved multi-chamber processing tool having an improved substrate storage system. Summary of the Invention

[0004]

[0004] Embodiments of an equipment front-end module (EFEM) are provided herein. In some embodiments, the EFEM includes: an overhead storage unit having two or more load ports for receiving two or more types of substrates, a plurality of storage shelves disposed above the two or more load ports and configured to hold two or more types of front-opening unified pods (FOUPs) of different sizes, each storing the two or more types of substrates, with a horizontal array disposed between the plurality of storage shelves and the two or more load ports to provide a horizontal passage for the FOUPs during transport to the two or more load ports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport the FOUPs from the overhead storage unit to the two or more load ports.

[0005]

[0005] In some embodiments, the EFEM includes two or more load ports for receiving two or more types of substrates, an overhead storage unit positioned above the two or more load ports and having a plurality of storage shelves each configured to hold a front-opening unified pod (FOUP) that stores the two or more types of substrates, and an overhead transport system configured to transport the FOUPs from the overhead storage unit to the two or more load ports, the overhead transport system including a pair of vertical actuators configured to transport the FOUP vertically, one or more horizontal actuators configured to transport the FOUP horizontally, and a gripper coupled to the one or more horizontal actuators to transport the FOUP.

[0006]

[0006] In some embodiments, a multi-chamber processing tool for processing substrates includes an equipment front-end module (EFEM) including two or more load ports for accepting two or more types of substrates, an overhead storage unit positioned above the two or more load ports and having a plurality of storage shelves each configured to hold a front-opening unified pod (FOUP) that stores the two or more types of substrates, and an overhead transport system configured to transport the FOUPs from the overhead storage unit to the two or more load ports, and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, each of the plurality of automation modules including a transfer chamber and one or more process chambers coupled to the transfer chamber, the transfer chamber including a buffer configured to hold a plurality of the two or more types of substrates.

[0007]

[0007] Further embodiments of the present disclosure are described below.

[0008]

[0008] The embodiments of the present disclosure summarized above and described in more detail below can be understood by reference to the exemplary embodiments of the present disclosure shown in the accompanying drawings. However, the accompanying drawings merely illustrate typical embodiments of the present disclosure and therefore should not be considered as limiting the scope, as the present disclosure may admit of other equally effective embodiments. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic top view illustrating a multi-chamber processing tool for bonding chiplets to a substrate, in accordance with at least some embodiments of the present disclosure. [Diagram 2] FIG. 2 illustrates a second type of substrate, in accordance with at least some embodiments of the present disclosure. [Diagram 3] FIG. 1 illustrates an isometric view of a transfer chamber of multiple automated modules, according to at least some embodiments of the present disclosure. [Figure 4] FIG. 1 is a schematic left isometric view of a multi-chamber processing tool having a front-end equipment module (EFEM) with overhead storage unit, in accordance with at least some embodiments of the present disclosure. [Diagram 5] FIG. 1 is an isometric schematic diagram of a portion of an EFEM in accordance with at least some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010]

[0014] To facilitate understanding, the same reference numbers have been used, whenever possible, to designate identical elements common to the drawings. The drawings are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further detail.

[0011]

[0015] Embodiments of a method and apparatus for processing a substrate are provided herein. The apparatus is generally modular and includes a multi-chamber processing tool including one or more front-end equipment modules (EFEMs) for loading substrates into and out of the multi-chamber processing tool coupled to a number of automation modules configured to perform one or more processing steps on the substrate. The one or more EFEMs generally include an overhead storage unit having a number of storage shelves for supporting a front-opening unified pod (FOUP) having a number of different types of substrates. The FOUP may support substrates directly on a number of holders or may support a cassette configured to hold one or more substrates therein. The number of automation modules may generally interface with the EFEM to deliver substrates from the number of different types of substrates to one or more process chambers associated with each automation module. The overhead storage unit increases the throughput of substrates in the multi-chamber processing tool.

[0012]

[0016] The one or more processing steps may be any suitable steps in the manufacturing or packaging of an integrated circuit. For example, the one or more processing steps may be configured to perform one or more of a bonding process to bond multiple chiplets onto a substrate, a plasma dicing or singulation process, a substrate cleaning process, a substrate plating or coating process, etc. Multiple storage shelves may advantageously facilitate in-situ storage of different types of substrates within a multi-chamber processing tool to increase substrate processing throughput.

[0013]

[0017] Each of the multiple automated modules includes a transfer robot, allowing the transfer robots to operate in parallel, advantageously increasing processing throughput by facilitating simultaneous processing of multiple substrates. For an exemplary process of bonding multiple chiplets onto a substrate, a multi-chamber processing tool advantageously allows for storing multiple different types of substrates (e.g., wafers with different sized chiplets, tape frames) and bonding multiple chiplets having different sizes onto a wafer in an all-in-one multi-chamber processing tool. Multiple chiplets can be bonded onto a wafer in multiple layers within the multi-chamber processing tool.

[0014]

[0018] 1 is a schematic top view illustrating a multi-chamber processing tool 100 for bonding chiplets to a substrate, according to at least some embodiments of the present disclosure. The multi-chamber processing tool 100 generally includes a front-end equipment module (EFEM) 102 and a number of automation modules 110 coupled in series to the EFEM 102. The number of automation modules 110 are configured to transport one or more types of substrates 112 back and forth from the EFEM 102 through the multi-chamber processing tool 100 and perform one or more processing steps on the one or more types of substrates 112. Each of the number of automation modules 110 generally includes a transfer chamber 116 and one or more process chambers 106 coupled to the transfer chamber 116 for performing one or more processing steps. The number of automation modules 110 are coupled to each other via their respective transfer chambers 116 to advantageously provide modular expandability and customization of the multi-chamber processing tool 100. As shown in FIG. 1, the plurality of automation modules 110 includes three automation modules, a first automation module 110a coupled to the EFEM 102, a second automation module 110b coupled to the first automation module 110a, and a third automation module 110c coupled to the second automation module 110b.

[0015]

[0019] The EFEM 102 includes a plurality of load ports 114 for receiving one or more types of substrates 112. In some embodiments, the one or more types of substrates 112 include 200 mm wafers, 300 mm wafers, 450 mm wafers, tape frame substrates, carrier substrates, silicon substrates, glass substrates, etc. In some embodiments, the plurality of load ports 114 include at least one of one or more first load ports 114a for receiving a first type of substrate 112a or one or more second load ports 114b for receiving a second type of substrate 112b. In some embodiments, the first type of substrate 112a has a different size than the second type of substrate 112b. In some embodiments, the second type of substrate 112b includes a tape frame substrate or a carrier substrate. In some embodiments, the second type of substrate 112b includes a plurality of chiplets disposed on a tape frame or carrier plate. In some embodiments, the second type of substrate 112b can hold chiplets of different types and sizes. As such, one or more second load ports 114b may have different sizes or receiving surfaces configured to load second type substrates 112b having different sizes.

[0016]

[0020] In some embodiments, multiple load ports 114 are positioned along a common side of the EFEM 102. Although a pair of first load ports 114a and a pair of second load ports 114b are shown in Figure 1, the EFEM 102 may include other combinations of load ports, such as one first load port 114a and three second load ports 114b.

[0017]

[0021] In some embodiments, the EFEM 102 includes a scan station 108 having a substrate ID reader for scanning one or more types of substrates 112 to identify information. In some embodiments, the substrate ID reader includes a barcode reader or an optical character recognition (OCR) reader. The multi-chamber processing tool 100 is configured to use any identification information from the scanned one or more types of substrates 112 to determine a processing step based on the identification information, for example, a different processing step for the first type of substrate 112a and the second type of substrate 112b. In some embodiments, the scan station 108 may also be configured to perform a rotational movement to align the first type of substrate 112a or the second type of substrate 112b. In some embodiments, one or more of the multiple automation modules 110 include the scan station 108.

[0018]

[0022] An EFEM robot 104 is disposed on the EFEM 102 and configured to transport a first type of substrate 112a and a second type of substrate 112b between a plurality of load ports 114 to a scanning station 108. The EFEM robot 104 may include a substrate end effector for handling the first type of substrate 112a and a second end effector for handling the second type of substrate 112b. The EFEM robot 104 may be capable of rotating or may be capable of rotating and moving linearly.

[0019]

[0023] FIG. 2 illustrates a second type substrate 112b according to at least some embodiments of the present disclosure. In some embodiments, the second type substrate 112b is a tape frame substrate that generally includes a layer of backing tape 202 surrounded by a tape frame 204. In use, a plurality of chiplets 206 can be attached to the backing tape 202. The plurality of chiplets 206 are typically formed via a singulation process that dices a semiconductor wafer 210 into a plurality of chiplets 206 or dies. In some embodiments, the tape frame 204 is made of a metal, such as stainless steel. The tape frame 204 can have one or more notches 208 to facilitate alignment and handling. For a semiconductor wafer 210 having a diameter of 300 mm, the tape frame 204 can have a width of about 340 mm to about 420 mm and a length of about 340 mm to about 420 mm. The second type substrate 112b can alternatively be a carrier plate configured to couple a plurality of chiplets 206 to the carrier plate.

[0020]

[0024] Referring back to FIG. 1 , the one or more process chambers 106 may be sealingly engaged to a transfer chamber 116. The transfer chamber 116 typically operates at atmospheric pressure, but may also be configured to operate at vacuum pressure. For example, the transfer chamber 116 may be a non-vacuum chamber configured to operate at atmospheric pressure of about 700 Torr or greater. Additionally, although the one or more process chambers 106 are generally illustrated as being orthogonal to the transfer chamber 116, the one or more process chambers 106 may be disposed at an angle to the transfer chamber 116, or a combination of orthogonal and orthogonal. For example, the second automated module 110b is illustrated with a pair of one or more process chambers 106 disposed at an angle to the transfer chamber 116.

[0021]

[0025] The transfer chamber 116 includes a buffer 120 configured to hold one or more first type substrates 112a. In some embodiments, the buffer 120 is configured to hold one or more first type substrates 112a and one or more second type substrates 112b. The transfer chamber 116 includes a transfer robot 126 configured to transfer the first type substrates 112a and the second type substrates 112b between the buffer 120, one or more process chambers 106, and a buffer disposed in an adjacent automated module of the plurality of automated modules 110. For example, the transfer robot 126 of the first automated module 110a is configured to transfer the first type substrates 112a and the second type substrates 112b between the buffer 120 of the first automated module 110a and the buffer 120 of the second automated module 110b. In some embodiments, the buffer 120 is disposed within an interior region of the transfer chamber 116, advantageously reducing the footprint of the overall tool. Additionally, the buffer 120 may be open to the interior region of the transfer chamber 116 to facilitate access by the transfer robot 126 .

[0022]

[0026] FIG. 3 is an isometric view of a transfer chamber 116 of a plurality of automated modules 110 according to at least some embodiments of the present disclosure. The transfer chamber 116 is illustrated in simplified form to illustrate major components. The transfer chamber 116 generally includes a frame 310 covered with plates (top plate 312 shown in FIG. 3, side plates not shown) to surround the transfer chamber 116. In some embodiments, the transfer chamber 116 has a width that is shorter than its length. The top plate 312 (or side plates) may include an access opening 316 that is selectively opened and closed to service the transfer chamber 116. The side plates include openings at their interface with at least one of the one or more process chambers 106, the EFEM 102, or an adjacent transfer chamber. Although FIG. 3 illustrates a rectangular or box-shaped transfer chamber 116, the transfer chamber 116 may have other suitable shapes, such as a cylindrical shape, a hexagonal shape, etc. The one or more process chambers 106 may be orthogonally coupled to the transfer chamber 116 or may be obliquely coupled to the transfer chamber 116 .

[0023]

[0027] The transfer chamber 116 may have one or more environmental controls. For example, an airflow opening (e.g., access opening 316) of the transfer chamber 116 may include a filter to filter the airflow entering the transfer chamber 116. Other environmental controls may include one or more of humidity control, static control, temperature control, or pressure control.

[0024]

[0028] The transfer robot 126 is generally housed within a frame 310. The transfer robot 126 is configured for rotational or rotational and linear motion within the transfer chamber 116. In some embodiments, the transfer robot 126 moves linearly via rails on the floor of the transfer chamber 116 or via wheels underneath the transfer robot 126. The transfer robot 126 includes a telescopic arm 320 having one or more end effectors 330 that can extend into one or more process chambers 106 and into adjacent automation modules. In some embodiments, the one or more end effectors 330 include a substrate end effector for handling the first type of substrate 112a and a second end effector for handling the second type of substrate 112b. In some embodiments, for a transfer chamber 116 having a length of about 2.0 to about 2.5 meters, the telescopic arm 320 may have a stroke length of up to about 1.0 meter. In some embodiments, the EFEM robot 104 is the same type and configuration as the transfer robot 126 to increase commonality of parts.

[0025]

[0029] The buffer 120 is housed within the frame 310, for example, in an interior region of the frame 310. In some embodiments, the buffer 120 is configured to rotate to align the first type substrate 112a and the second type substrate 112b in a desired manner. In some embodiments, the buffer 120 is configured to hold one or more types of substrates 112 in a vertical stack, advantageously reducing the footprint of the transfer chamber 116. For example, in some embodiments, the buffer 120 includes a plurality of shelves 322 for storing or holding one or more first type substrates 112a and one or more second type substrates 112b. In some embodiments, the plurality of shelves 322 are vertically spaced apart. In some embodiments, the buffer 120 includes six shelves. In some embodiments, the plurality of shelves includes two shelves for accommodating the second type substrates 112b.

[0026]

[0030] Referring back to FIG. 1 , the one or more process chambers 106 may include atmospheric chambers configured to operate under atmospheric pressure and vacuum chambers configured to operate under vacuum pressure. Examples of atmospheric chambers may generally include wet cleaning chambers, radiation chambers, heating chambers, metrology chambers, bonding chambers, etc. Examples of vacuum chambers may include plasma chambers. Atmospheric chambers of the types described above may also be configured to operate under vacuum, if desired. The one or more process chambers 106 may be any process chamber or module necessary to perform a bonding process, a dicing process, a cleaning process, a plating process, etc.

[0027]

[0031] In some embodiments, the one or more process chambers 106 of each of the plurality of automated modules 110 include at least one of a wet clean chamber 122, a plasma chamber 130, a degassing chamber 132, a radiation chamber 134, or a bonder chamber 140, such that the multi-chamber processing tool 100 includes at least one wet clean chamber 122, at least one plasma chamber 130, at least one degassing chamber 132, at least one radiation chamber 134, and at least one bonder chamber 140. The one or more process chambers 106 may be located in any suitable location in the multi-chamber processing tool 100.

[0028]

[0032] The wet cleaning chamber 122 is configured to perform a wet cleaning process to clean one or more types of substrates 112 via a fluid such as water. The wet cleaning chamber 122 may include a first wet cleaning chamber 122a for cleaning a first type of substrate 112a or a second wet cleaning chamber 122b for cleaning a second type of substrate 112b. The degassing chamber 132 is configured to perform a degassing process to remove moisture from the substrate 112 via, for example, a high temperature baking process. In some embodiments, the degassing chamber 132 includes a first degassing chamber 132a for the first type of substrate 112a and a second degassing chamber 132b for the second type of substrate 112b.

[0029]

[0033] The plasma chamber 130 may be configured to perform an etching process to remove unwanted materials, such as organic materials and oxides, from the first type substrate 112a or the second type substrate 112b. In some embodiments, the plasma chamber 130 includes a first plasma chamber 130a for the first type substrate 112a and a second plasma chamber 130b for the second type substrate 112b. The plasma chamber 130 may also be configured to perform an etching process to dice the substrate 112 into chiplets. In some embodiments, the plasma chamber 130 may be configured to perform a deposition process, such as, for example, a physical vapor deposition process, a chemical vapor deposition process, etc., to coat the first type substrate 112a or the second type substrate 112b with a layer of a desired material.

[0030]

[0034] The radiation chamber 134 is configured to perform an irradiation process on the second type substrate 112b to reduce adhesion between the plurality of chiplets 206 and the backing tape 202. For example, the radiation chamber 134 may be an ultraviolet radiation chamber configured to apply ultraviolet light to the backing tape 202 or may be a heating chamber configured to heat the backing tape 202. Reducing adhesion between the plurality of chiplets 206 and the backing tape 202 may facilitate easier removal of the plurality of chiplets 206 from the second type substrate 112b.

[0031]

[0035] The bonder chamber 140 is configured to transfer and bond at least a portion of the plurality of chiplets 206 to one of the first type substrates 112a. The bonder chamber 140 generally includes a first support 142 that supports one of the first type substrates 112a and a second support 144 that supports one of the second type substrates 112b.

[0032]

[0036] In some embodiments, the one or more process chambers 106 of the first automated module 110a include at least one of the plasma chamber 130 or the degassing chamber 132, and include the wet cleaning chamber 122. In the exemplary embodiment of FIG. 1, the first automated module 110a includes the first plasma chamber 130a and the second plasma chamber 130b on a first side of the first automated module 110a. In some embodiments, the first automated module 110a includes the first wet cleaning chamber 122a and the second wet cleaning chamber 122b on a second side of the first automated module 110a opposite the first side. In some embodiments, the second automated module includes the radiation chamber 134 and at least one of the plasma chamber 130 or the degassing chamber 132.

[0033]

[0037] In some embodiments, a terminal automated module of the plurality of automated modules 110, such as the third automated module 110c in FIG. 1, includes one or more bonder chambers 140 (two are shown in FIG. 1). In some embodiments, a first of the two bonder chambers is configured to remove and bond chiplets having a first size, and a second of the two bonder chambers is configured to remove and bond chiplets having a second size. In some embodiments, any of the plurality of automated modules 110 includes a metrology chamber 118 configured to perform measurements on one or more types of substrates 112. In FIG. 1, the metrology chamber 118 is illustrated as part of the second automated module 110b coupled to a transfer chamber 116 of the second automated module 110b. However, the metrology chamber 118 may be coupled to any of the transfer chambers 116 or may be within the transfer chamber 116.

[0034]

[0038] The controller 180 controls the operation of any of the multi-chamber processing tools described herein, including the multi-chamber processing tool 100. The controller 180 may use direct control of the multi-chamber processing tool 100, or alternatively, by controlling a computer (or controller) associated with the multi-chamber processing tool 100. In the process, the controller 180 enables the collection and feedback of data from the multi-chamber processing tool 100 to optimize the performance of the multi-chamber processing tool 100. The controller 180 generally includes a central processing unit (CPU) 182, a memory 184, and support circuits 186. The CPU 182 may be any form of general-purpose computer processor that can be used in an industrial environment. The support circuits 186 are conventionally coupled to the CPU 182 and may include cache, clock circuits, input / output subsystems, power supplies, etc. Software routines, such as the methods described below, stored in the memory 184 and executed by the CPU 182 can transform the CPU 182 into a special purpose computer (the controller 180). The software routines may also be stored and / or executed by a second controller (not shown) located remotely from the multi-chamber processing tool 100.

[0035]

[0039] The memory 184 is a form of computer-readable storage medium that includes instructions that, when executed by the CPU 182, facilitate the operation of semiconductor processes and equipment. The instructions in the memory 184 are in the form of a program product, such as a program that performs the methods of the present principles. The program code may conform to any one of a number of different programming languages. In one example, the present disclosure may be implemented as a program product stored in a computer-readable storage medium for use with a computer system. The program(s) of the program product define the functions of the aspects (including the methods described herein). Exemplary computer-readable storage media include, but are not limited to, non-writeable storage media in which information is permanently stored (e.g., a read-only memory device in a computer, such as a CD-ROM disk readable by a CD-ROM drive, a flash memory, a ROM chip, or any type of solid-state non-volatile semiconductor memory), and writeable storage media in which changeable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive, or any type of solid-state random access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are aspects of the present principles.

[0036]

[0040] 4 is a schematic left isometric view of a multi-chamber processing tool 100 having a front-end equipment module (EFEM) 102 with an overhead storage unit 410, according to at least some embodiments of the present disclosure. The overhead storage unit 410 generally includes a frame 402 and a number of storage shelves 412 coupled to the frame 402. In some embodiments, the number of storage shelves 412 are disposed above one or more load ports 114. In some embodiments, the one or more load ports include exactly four load ports.

[0037]

[0041] The plurality of storage shelves 412 are configured to hold front-opening unified pods (FOUPs) 416 that store one or more types of substrates 112. The plurality of storage shelves 412 may be configured to hold FOUPs 416 of different sizes. The FOUPs 416 may include one or more first FOUPs 416a configured to store one or more first types of substrates 112a and one or more second FOUPs 416b configured to store one or more second types of substrates 112b. In some embodiments, the one or more second FOUPs 416b are larger in size than the one or more first FOUPs 416a. For example, in some embodiments, the one or more second FOUPs 416b are larger in height than the one or more first FOUPs 216a. In some embodiments, the plurality of storage shelves 412 may all be the same size. In some embodiments, the plurality of storage shelves 412 may have a first size to accommodate one or more first FOUPs 416a and a second size to accommodate one or more second FOUPs 416b.

[0038]

[0042] In some embodiments, the plurality of storage shelves 412 are arranged along a plane common to the plurality of columns and the plurality of rows. In some embodiments, the plurality of columns includes more than two columns. In some embodiments, a horizontal array 420 is disposed between the plurality of storage shelves 412 and one or more load ports 114 to provide a horizontal passageway for the FOUP 416 during transport to the one or more load ports 114. In some embodiments, the plurality of storage shelves 412 are arranged such that one or more vertical arrays 430 are disposed between the plurality of columns, the vertical arrays 430 being configured to provide a vertical passageway for the FOUP 416 during transport to the one or more load ports 114.

[0039]

[0043] 5 is an isometric schematic diagram illustrating a portion of an EFEM 102 according to at least some embodiments of the present disclosure. The EFEM 102 includes an overhead transport system 502 configured to transport a FOUP 416 from an overhead storage unit 410 to one or more load ports 114. In some embodiments, the frame 402 includes a rear wall 508 and a side wall 510 extending from the rear wall 508 and at least partially enclosing a number of storage shelves 412.

[0040]

[0044] In some embodiments, the overhead transport system 502 includes a pair of vertical actuators 504. The pair of vertical actuators 504 are generally configured to vertically transport the FOUP 416. In some embodiments, the pair of vertical actuators 504 are disposed on opposite sides of the overhead storage unit 410. In some embodiments, the pair of vertical actuators 504 are horizontally fixed relative to one another. In some embodiments, the storage shelves 412 are horizontally disposed between the pair of vertical actuators 504. In some embodiments, the pair of vertical actuators 504 are coupled to a sidewall 510 of the frame 402. In some embodiments, the frame 402 may include a cutout 528 to accommodate one or more load ports 114.

[0041]

[0045] In some embodiments, the overhead transport system 502 includes one or more horizontal actuators 506 (one shown in FIG. 5 ) coupled to a pair of vertical actuators 504 and configured to transport the FOUP horizontally. In some embodiments, at least one of the one or more horizontal actuators 506 includes a gripper 512 configured to transport the FOUP 416. In some embodiments, the pair of vertical actuators 504 are configured to move the gripper 512 vertically and at least one of the one or more horizontal actuators 506 are configured to move the gripper 512 horizontally. The gripper 512 includes a clamp 516 configured to carry the FOUP 416 for transport. In some embodiments, the FOUP includes an upper handle 518 configured to engage the clamp 516 to facilitate transport of the FOUP. The upper handle 518 may have any suitable shape for selectively engaging the clamp 516. In some embodiments, the FOUP 416 includes one or more side handles 552 for transportation along with the clamp 516 or for manual transportation by an operator.

[0042]

[0046] In some embodiments, the overhead storage unit 410 includes one or more manual load stations 540. In some embodiments, the one or more manual load stations 540 are disposed below the horizontal array 420. The overhead transport system 502 is configured to transport the FOUPs 416 from the one or more manual load stations 540 to the one or more load ports 114. In some embodiments, the one or more manual load stations 540 include two manual load stations.

[0043]

[0047] In some embodiments, the frame 402 may form an enclosure (not shown) around the overhead storage unit 410. For example, the enclosure may include a front wall (not shown) having one or more doors for accessing one or more load ports 114, the FOUP 416, and one or more manual load stations 540. In some embodiments, the frame 402 may be in the form of a cabinet.

[0044]

[0048] In some embodiments, one of the plurality of storage shelves 412 is a loading station 530 for the FOUP 416. In some embodiments, all of the FOUPs 416 are loaded onto the overhead storage unit 410 from the loading station 530. In some embodiments, the multi-chamber processing tool 100 includes a transfer robot 550 for transferring the FOUPs 416 to the loading station 530. In some embodiments, another of the plurality of storage shelves 412 is an unloading station 534 for the FOUP 416. In some embodiments, the loading station 530 and the unloading station 534 are disposed along a top row 526 of the plurality of storage shelves 412. The transfer robot 550 may be configured to unload the FOUP 416 from the unloading station 534, for example, when it is depleted of one or more types of substrates 112. Alternatively, a separate transfer robot may be used to load and unload the FOUP 416.

[0045]

[0049] To facilitate transportation, in some embodiments, each of the plurality of storage shelves 412 is positioned adjacent to one of the one or more vertical arrays 430. In some embodiments, the plurality of storage shelves 412 are arranged along four or more columns. In some embodiments, at least some of the plurality of storage shelves 412 are aligned with and positioned vertically above one or more of the one or more load ports 114.

[0046]

[0050] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof.

Claims

1. An equipment front-end module (EFEM), comprising: two or more load ports for receiving two or more types of substrates; an overhead storage unit disposed above the two or more load ports, the overhead storage unit having a plurality of storage shelves configured to hold two or more types of front-opening unified pods (FOUPs) of different sizes each storing the two or more types of substrates, wherein a horizontal array is disposed between the plurality of storage shelves and the two or more load ports to provide a horizontal passageway for the two or more types of FOUPs during transport to the two or more load ports; an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more load ports, the plurality of storage shelves being disposed between the pair of vertical actuators; The EFEM comprises:

2. 2. The EFEM of claim 1, wherein the overhead transport system includes one or more horizontal actuators coupled to the pair of vertical actuators and configured to transport the FOUPs horizontally.

3. 3. The EFEM of claim 2, wherein at least one of the one or more horizontal actuators includes a gripper configured to transport the FOUP, the pair of vertical actuators configured to move the gripper vertically, and at least one of the one or more horizontal actuators configured to move the gripper horizontally.

4. The EFEM of claim 1 , wherein the plurality of storage shelves are arranged along a common plane in a plurality of columns and a plurality of rows.

5. 5. The EFEM of claim 4, further comprising one or more vertical arrays disposed between said plurality of columns and configured to provide a vertical pathway for FOUPs during transport to said two or more load ports.

6. The EFEM of claim 5 , wherein each of said plurality of storage shelves is disposed adjacent one of said one or more vertical arrays.

7. one or more first type FOUPs disposed in a respective one of the plurality of storage shelves; one or more second type FOUPs disposed on a respective one of the plurality of storage shelves; The EFEM of claim 1 , further comprising:

8. 7. The EFEM of claim 1, wherein the two or more load ports include at least one load port configured to accept a semiconductor wafer and at least one load port configured to accept a tape frame substrate.

9. 7. The EFEM of any one of claims 1 to 6, wherein one of the plurality of storage shelves is a loading station for the FOUP and another of the plurality of storage shelves is an unloading station for the FOUP, the loading station and the unloading station being disposed along a top row of the plurality of storage shelves.

10. 7. The EFEM of any one of claims 1 to 6, wherein the overhead transport system includes one or more horizontal actuators coupled to the pair of vertical actuators, at least one of the one or more horizontal actuators including a gripper configured to transport the FOUP, the gripper including a clamp configured to carry the FOUP for transport.

11. The EFEM of claim 1 , wherein the plurality of storage shelves are arranged along four or more columns.

12. The EFEM of claim 1 , wherein the plurality of storage shelves are horizontally disposed between the pair of vertical actuators.

13. 7. The EFEM of claim 1, wherein the two or more load ports include exactly four load ports.

14. 7. The EFEM of any one of claims 1 to 6, wherein the overhead storage unit includes a frame and a plurality of storage shelves coupled to the frame, the frame including a rear wall and a side wall extending from the rear wall and at least partially enclosing the plurality of storage shelves.

15. 1. A multi-chamber processing tool for processing a substrate, comprising: An equipment front-end module (EFEM) according to any one of claims 1 to 6, a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, each of the plurality of automation modules including a transfer chamber and one or more process chambers coupled to the transfer chamber, the transfer chamber including a buffer configured to hold a plurality of two or more types of substrates; A multi-chamber processing tool comprising:

16. 16. The multi-chamber processing tool of claim 15, wherein the transfer chamber comprises a transfer robot configured to transfer the two or more types of substrates between the buffer, the one or more process chambers, and a buffer located in an adjacent automated module of the plurality of automated modules.

17. 16. The multi-chamber processing tool of claim 15, wherein the one or more process chambers include one or more bonding chambers having a first support for supporting a first substrate type of the two or more types of substrates and a second support for supporting a second substrate type of the two or more types of substrates.

18. 16. The multi-chamber processing tool of claim 15, wherein the EFEM includes one or more manual load stations, and the overhead transport system is configured to transport FOUPs from the one or more manual load stations to the two or more load ports.

19. 16. The multi-chamber processing tool of claim 15, wherein the one or more process chambers include a wet clean chamber and a degassing chamber.

20. The multi-chamber processing tool of claim 15 , wherein the transfer chamber is a non-vacuum chamber.

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