Prober card lifting device

Abstract

The card lifting device of the prober according to one aspect of the present invention may include a fixed frame installed and fixed inside a stage chamber, a lifting means having one end fixed to the fixed frame and lifting an actuating rod, a transfer frame connected to the actuating rod of the lifting means and lifting and lowering relative to the fixed frame by the actuation of the lifting means, and a card support part installed on the transfer frame and supporting a provided probe card, thereby lifting and lowering the probe card to a probe card fixing part so that the probe card can be replaced.

Description

[Technical field]

[0001] The present invention relates to a card lifting device for a prober, and more particularly to a card lifting device for a prober that can be made compact because it does not require space for a card replacement module inside the prober. [Background technology]

[0002] Generally, a wafer prober, which is a semiconductor inspection device, is a device that checks the electrical characteristics of semiconductor elements on a wafer that has completed all semiconductor pre-processing to check for defects just before entering post-processing.

[0003] In a semiconductor wafer on which a large number of semiconductor elements are formed, a prober is used as a wafer inspection device to inspect the electrical characteristics of each semiconductor element. The prober has a disk-shaped probe card that faces the wafer, and the probe card has a number of contact probes that are columnar contact terminals that are arranged to face each electrode pad and each solder bump of the semiconductor elements on the wafer.

[0004] In a prober, each contact probe on a probe card comes into contact with the electrode pads and solder bumps of a semiconductor element, and an inspection signal is sent from each contact probe to the electrical circuits of the semiconductor element connected to each electrode pad or each solder bump, thereby inspecting the continuity of the electrical circuits.

[0005] According to the conventional prober 100, a wafer and a probe card are supplied and inspected inside a stage chamber in a sealed state. A wafer is provided to a shutter formed on one of the front and rear surfaces of the stage chamber, and a probe card is provided on the upper side of the stage chamber. The wafer is supplied inside the stage chamber and attached to a chuck. Then, with the wafer fixed to the chuck, the first, second, and third stages align the X, Y, and Z axes, and the wafer is tested by contacting the probe card from above. The first stage is a fixed stage, and the second stage is capable of linear movement along a rail in the X-axis direction relative to the first stage on a plane. The third stage is capable of linear movement in the Y-axis direction relative to the second stage on a plane, and the chuck is capable of linearly raising and lowering in the Z-axis direction relative to the third stage. Therefore, the wafer placed on the chuck can be aligned in three axes.

[0006] However, in the conventional prober, the probe card must be changed according to the type of wafer to be inspected. In order to change the probe card, a probe card handling module is installed inside the prober to receive the probe card provided from the outside and to fix it on the top of the wafer chuck. This takes up space inside the prober, which makes it difficult to miniaturize the prober. Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been made to solve the above problems, and an object of the present invention is to provide a prober card lifting device that is arranged around a wafer chuck and can hold and lift a probe card to be fixed to a handling arm.

[0008] Another object of the present invention is to provide a card lifting device for a prober that is installed on a wafer chuck capable of three-axis control and can fix the card to a handling arm through three-axis control after the probe card is accommodated, thereby eliminating the need to install a separate probe card module.

[0009] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a card lifting device for a prober, including: a fixed frame that is installed and fixed inside a stage chamber of a prober; a lifting means having one end fixed to the fixed frame and lifting and lowering an actuating rod; a transfer frame that is connected to an actuating rod of the lifting means and lifts and lowers relative to the fixed frame by operation of the lifting means; and a card support section that is installed on the transfer frame and supports a provided probe card, thereby lifting and lowering the probe card to a probe card fixing section so that the probe card can be replaced.

[0011] In this case, the fixing frame can be fixed to the wafer chuck or a base of the wafer chuck.

[0012] At this time, the fixing frame may be fixed to the outside of the lower part of the wafer chuck.

[0013] At this time, a plurality of card lifting devices of the prober may be installed outside the wafer chuck.

[0014] At this time, when the card support portion is raised by the lifting means, the card support portion can be positioned at a position higher than the upper surface of the wafer chuck.

[0015] At this time, the lifting means can be operated by an air cylinder so that the card support portion can have cushioning.

[0016] At this time, the card support may include a positioning pin for aligning the cards.

[0017] At this time, the card support part may include a card presence sensor for detecting whether a probe card is present at the probe card fixing part.

[0018] At this time, the card support may include a card installation sensor for detecting whether the probe card is installed.

[0019] In this case, the card insertion sensor may be a vacuum or contact sensor.

[0020] At this time, the transfer frame and the card support may be formed in a round shape along the outer surface of the wafer chuck.

[0021] At this time, a rail groove is formed in the fixed frame, and a rail is provided in the transfer frame to be inserted into the rail groove, thereby providing linear guidance.

[0022] At this time, the wafer chuck is provided with a three-axis control device so that the wafer chuck can be aligned in three axial directions, and the card support part can be elevated to the probe card fixing part after being aligned by the three-axis control device.

[0023] At this time, the card support section, while supporting the probe card, can be raised and lowered to the probe card fixing section by the lifting and lowering means of the wafer chuck. Effect of the Invention

[0024] Due to the above configuration, the card lifting device of the prober according to the embodiment of the present invention can be made compact since it is not necessary to provide a space inside the chamber for installing a separate card replacement module.

[0025] The card lifting device of the prober according to the embodiment of the present invention can absorb shocks that may occur due to collisions with other components when a probe card is loaded, transferred, and replaced by using air cushioning.

[0026] The card lifting device of the prober according to the embodiment of the present invention is installed so that the lifting device can be supported by the wafer chuck, so that the card can be aligned or lifted up and down by using the three-axis control device of the wafer chuck. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a front view of a prober according to an embodiment of the present invention. [Diagram 2] 1 is an internal perspective view of a stage chamber equipped with a card lifting device according to an embodiment of the present invention; [Diagram 3] 1 is a perspective view of a card lifting device of a prober according to an embodiment of the present invention; [Figure 4] FIG. 2 is a perspective view of a card lifting device of a prober according to an embodiment of the present invention fixed to a chuck, showing the state before lifting. [Diagram 5] FIG. 2 is a perspective view of a card lifting device of a prober according to an embodiment of the present invention fixed to a chuck, showing the state after lifting. [Figure 6] 4A to 4C are side views of a card lifting device of a prober according to an embodiment of the present invention, illustrating different operating stages; [Figure 7] 4A to 4C are side views of a card lifting device of a prober according to an embodiment of the present invention, illustrating different operating stages; [Figure 8] 4A to 4C are side views of a card lifting device of a prober according to an embodiment of the present invention, illustrating different operating stages; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily carry out the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention, parts not related to the description are omitted in the drawings, and the same reference numerals are used throughout the specification to refer to the same or similar components.

[0029] The words and terms used in this specification and the claims should not be interpreted in a limited manner based on their ordinary or dictionary meanings, but should be interpreted in a meaning and concept that corresponds to the technical idea of ​​the present invention in accordance with the principle that the inventor can define the terms and concepts in order to best describe his / her invention.

[0030] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent the entire technical idea of ​​the present invention, and therefore the relevant configurations may have various equivalents and modifications that replace them at the time of filing of the present invention.

[0031] In this specification, the terms "comprise" or "have" are intended to describe the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but should be understood as not precluding the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0032] A certain component being "in front," "in back," "above," or "below" another component means not only that it is immediately adjacent to the other component and is disposed "in front," "in back," "above," or "below," unless there are special circumstances, but also includes the case where another component is disposed between them. Furthermore, a certain component being "connected" to another component means not only that they are directly connected to each other, but also that they are indirectly connected to each other, unless there are special circumstances.

[0033] A card lifting device 10 for a prober according to an embodiment of the present invention will be described below with reference to the drawings.

[0034] 1 to 8, a card lifting device 10 of a prober according to an embodiment of the present invention may include fixed frames 21, 31, lifting means 22, 32, transfer frames 26, 36, and card support portions 27, 37.

[0035] The fixing frames 21 and 31 may be installed and fixed inside a stage chamber 110 of a prober 100, with reference to FIGS.

[0036] At this time, the fixing frames 21 and 31 may be fixed to the wafer chuck 134 or a base of the wafer chuck. The wafer chuck 134 may be a wafer chuck 134 or a wafer chuck module that is fixed to the upper part of the wafer chuck 134 when the wafer to be inspected is provided. Also, the fixing frames 21 and 31 may be fixed to the outer side of the lower part of the wafer chuck 134.

[0037] At this time, the wafer chuck 134 has a substantially cylindrical appearance, and the card lifting device 10 of the prober may be disposed on the outer surface of the wafer chuck 134. By being disposed on the outer surface of the wafer chuck 134 in this manner, it is hidden at the lower outer side of the wafer chuck 134 during wafer handling, and rises to the upper part of the wafer chuck 134 only during card handling to proceed with operation. Therefore, the prober card lifting device 10 according to an embodiment of the present invention shares a part of the space of the wafer chuck module, thereby making it possible to miniaturize the entire prober equipment.

[0038] At this time, a plurality of prober card lifting devices 10 may be installed outside the wafer chuck 134. Here, two sets, i.e., a pair of lifting devices 20, 30, are installed facing each other. That is, they may be installed at positions on the wafer chuck 134 facing each other.

[0039] 3 to 8, the lifting means 22, 32 has one end fixed to the fixed frames 21, 31 and can lift and lower an operating rod.

[0040] At this time, when the card support parts 27, 37 are raised by the lifting means 22, 32, the card support parts 27, 37 can be positioned at a position higher than the upper surface of the wafer chuck 134. That is, by the lifting means 22, 32, the card support parts 27, 37 are normally positioned at a position lower than the upper surface of the wafer chuck 134 to avoid interference with wafer handling, and when handling the probe card 1, the card support parts 27, 37 are raised to a position higher than the upper surface of the wafer chuck 134 to handle the probe card 1.

[0041] At this time, the lifting means 22, 32 may be operated by an air cylinder so that the card support parts 27, 37 may have cushioning. That is, an air cylinder operated by air pressure may be applied as the lifting means 22, 32, and due to the nature of the air cylinder, it can provide a role of cushioning by air against the load applied to the card support parts 27, 37. Of course, other lifting means, such as a hydraulic cylinder or a motor operating module, may be applied instead of the air cylinder. All that is required is to provide the cushioning effect of the air cylinder. This cushioning effect provides a shock mitigation effect that can mitigate the impact with an object, similar to a shock absorber.

[0042] 3 to 8, the transfer frames 26, 36 are connected to the operating rods of the lifting means 22, 32 and can be raised and lowered relative to the fixed frames 21, 31 by the operation of the lifting means 22, 32.

[0043] At this time, the transfer frames 26, 36 and the card supports 27, 37 may be formed in a round shape along the outer surface of the wafer chuck 134. Since the wafer chuck 134 and its modules are generally cylindrical in appearance, the transfer frames 26, 36 and the card supports 27, 37 disposed on the outer surface of the wafer chuck 134 may also be formed in a round shape following that shape in order to save as much space as possible.

[0044] At this time, the fixed frames 21, 31 are provided with rail guides 24, 34 having rail grooves formed therein, and the transport frame is provided with a rail 35 inserted into the rail groove to provide linear guidance. Of course, the rail groove and the rails 25, 35 may be provided in the opposite direction. Due to the guide of the rail groove and the rails 25, 35, the transport frames 26, 36 and the card supporters 27, 37 can be transported stably and accurately without shaking.

[0045] Referring to Figures 3 to 8, the card support parts 27 and 37 support the probe card 1 provided by being installed on the transfer frames 26 and 36, and can be raised and lowered to the probe card fixing part 40 so that the probe card 1 can be replaced.

[0046] At this time, the card support parts 27 and 37 may have positioning pins 27a, 37a, 27, 37b for card alignment. The positioning pins 27a, 37a, 27, 37b may be inserted into positioning grooves formed in the probe card 1 or a boat which is a receiving member for receiving the probe card. The positioning pins 27a, 37a, 27, 37b may be inserted into the predetermined positioning grooves, so that the probe card 1 may be mounted in the card support parts 27 and 37 at an accurate position.

[0047] At this time, the card support parts 27 and 37 may include card presence sensors 29 and 39 for detecting whether the probe card 1 is present at the probe card fixing part 40. Here, the card presence sensors 29 and 39 may be either contact type or non-contact type, but the non-contact type may be used here. This is because when replacing the probe card, if the card 1 is present at the probe card fixing part 40, the card 1 must first be removed from the chamber 110. If the card 1 is present, the card 1 is removed, and a new card 1 is supplied and fixed to the fixing part 40 to proceed with the test.

[0048] At this time, the card support parts 27 and 37 may be provided with card installation sensors 28 and 38 for detecting whether the probe card 1 is installed. At this time, the card installation sensors 28 and 38 may be vacuum or contact sensors. Of course, a non-contact type sensor may be used, but since the sensor detects the installation of an object, namely a card, a contact type sensor may be advantageous for reliable detection.

[0049] Meanwhile, the wafer chuck 134 is equipped with a three-axis control device so that it can be aligned in three axial directions, and the card support parts 27 and 37 can be raised and lowered to the probe card fixing part 40 after being aligned by the three-axis control device. The wafer chuck 134 can be installed so as to be capable of three-axis control by motorizing a plurality of stages 131, 132, and 133, and the card 1 can be aligned and raised and lowered instead of the wafer by using such three-axis control device.

[0050] At this time, the card support parts 27, 37 can be raised and lowered to the probe card fixing part 40 by the lifting means 133a of the wafer chuck 134 while supporting the probe card 1. Here, the lifting means 22, 32 for raising and lowering the card support parts 27, 37 only operate to raise the card support parts 27, 37 to a position higher than the upper surface of the wafer chuck 134 so that the card support parts 27, 37 can receive the probe card 1, so that the stroke to the card fixing part 40 can be achieved by motorizing the lifting means 133a in the Z-axis direction during the three-axis control of the wafer chuck 134. Of course, the Z-axis direction indicates the lifting direction.

[0051] 1, a front view of a prober according to an embodiment of the present invention is shown. The prober 100 has a substantially rectangular parallelepiped shape. Inside the prober 100, a probe card 1 and a stage chamber 110 are provided, which can be sealed so that a wafer is fed therein and tested in a constant environment. In some cases, a shutter or door for handling the wafer or card may be installed.

[0052] 2, an internal perspective view of the stage chamber 110 to which the card lifting device 10 according to the embodiment of the present invention is attached is shown. That is, a fixed stage 131 fixed to the stage chamber 110 is fixedly installed at the bottom. The first stage 131 is the fixed stage 131, and the second stage 132 is capable of linear movement along the rail 131a in the X-axis direction relative to the first stage 131 on a plane. The third stage 133 is capable of linear movement along the rail 132a in the Y-axis direction relative to the second stage 132 on a plane, and the wafer chuck 134 is capable of linear movement in the Z-axis direction relative to the third stage 133 by motorizing the lifting means 133a. Therefore, the wafer placed on the wafer chuck 134 can be aligned in three axial directions. Since the wafer chuck 134 can be aligned and moved in three axial directions, the card lifting device 10 installed and fixed thereto can be aligned and moved in three axial directions. Of course, although the card lifting device 10 is installed on the wafer chuck 134 here, it may also be installed on a third stage which is the wafer chuck base below, in which case it may be necessary to supplement the lifting means for lifting in the Z-axis direction or modify the lifting means so that a two-stage stroke can be used.

[0053] Referring to FIG. 3, a perspective view of the card lifting device 10 of the prober according to an embodiment of the present invention is shown. The card lifting device 10 is installed as a pair of lifting devices 20, 30. Of course, it may be installed as three sets. In this way, the card lifting device 10 is installed in two sets and arranged at positions opposite to each other, so that the card 1 is supported by the card support parts 27, 37 on both sides. At this time, the card support parts 27, 37 are arranged at the top end of the card lifting device 10, and the card support parts 27, 37 are fixed to and supported by the transfer frames 26, 36. In addition, the card support parts 27, 37 and the transfer frames 26, 36 are arranged on the outer surface of the wafer chuck 134, so that they are formed in a round shape. The card support parts 27, 37 are provided with a plurality of positioning pins 27a, 37a, 27, 37b that are inserted into the positioning grooves so that the card 1 can be mounted. When the positioning pins 27a, 37a, 27, 37b are all inserted into the positioning grooves, the card 1 can be mounted at a correct position. In this case, the positioning grooves can be formed in the boat that accommodates the card instead of the card 1, so that even if the card 1 is replaced, the same boat can be used to replace the card 1. That is, various cards 1 can be mounted in the boat and mounted on the card support parts 27, 37 using the boat as a medium. The transfer frames 26, 36 are provided with rails 25, 35, and the fixed frames 21, 31 are provided with grooves in the rail guides 24, 34 for guiding the rails 25, 35, so that the transfer frames 26, 36 can be raised and lowered in a straight line relative to the fixed frames 21, 31. The fixed frames 21, 31 can be fixed to the outer surface or the outer lower surface of the wafer chuck 134. The fixed frames 21, 31 can support the transfer frames 26, 36 and the lifting means 22, 32. One side of the lifting means 22, 32 can be fixed to the fixed frames 21, 31. Since the fixed frames 21, 31 are fixed to the wafer chuck 134, operation of the lifting means 22, 32 results in the operating rods of the lifting means 22, 32 moving up and down relative to the wafer chuck 134 and the fixed frames 21, 31. Supports 23, 33 that support the lower parts of the transfer frames 26, 36 are provided at the ends of the operating rods of the lifting means 22, 32.When the lifting means 22, 32 are operated, the operating rods are raised and lowered, and ultimately the receiving tables 23, 33 raise and lower the transfer frames 26, 36. At this time, the impact applied to the transfer frames 26, 36 will reach the air cylinders, which are the lifting means 22, 32, via the receiving tables 23, 33 and the operating rods, and the impact can be mitigated by the air cushioning of the air cylinders as described above.

[0054] 4 and 5 are perspective views of the card lifting device 10 of the prober according to the embodiment of the present invention fixed to the chuck 134, showing the state before and after lifting. FIG. 4 shows a normal state in which the card lifting device 10 is located under the wafer chuck 134. That is, the card support parts 27 and 37 are located at a position lower than the upper surface of the wafer chuck 134. In this state, after the wafer is supplied to the chuck 134 and aligned in three axes, the chuck 134 rises together with the wafer and is connected to the card 1, and a test can be performed. In the case of FIG. 5, the card support parts 27 and 37 are located at a position higher than the upper surface of the wafer chuck 134, and the probe card 1 can be attached. This state is the result of the lifting means 22 and 32 operating to raise the operating rods, and the receiving stands 23 and 33 raising the transfer frames 26 and 36. The probe card 1 can be attached to the card support parts 27 and 37 in this state. In addition, with the card support parts 27, 37 raised by the lifting means 22, 32 in this manner, air cushioning can be used to reduce impact.

[0055] 6 to 8 are side views of the card lifting device 10 of the prober according to an embodiment of the present invention, showing different operation stages. FIG. 6 shows a state in which the card support parts 27 and 37 are located at a position lower than the upper surface of the wafer chuck 134, which corresponds to the state of FIG. 4. FIG. 7 shows a state in which the lifting means 22 and 32 are operated to raise the card support parts 27 and 37 to a position higher than the upper surface of the wafer chuck 134, which corresponds to the state of FIG. 5. FIG. 8 shows a state in which the probe card 1 is attached in the same state as FIG. 7, and the wafer chuck 134 is raised by the three-axis control equipment to connect the probe card 1 to the card fixing part 40.

[0056] A description will now be given of replacing a probe card using a card lifting device of a prober according to an embodiment of the present invention.

[0057] When the probe card 1 is to be replaced in a state where the card support parts 27, 37 are located at the lowest position as shown in Figs. 4 and 6, the lifting means 22, 32 are operated to raise the card support parts 27, 37 to the maximum height as shown in Figs. 5 and 7. At the same time, the card presence / absence sensors 29, 39 check whether the card 1 is present in the card fixing part 40. If the card 1 is present, the wafer chuck 134 is raised by the three-axis control device, and the probe card 1 to be replaced is mounted on the card support parts 27, 37 in the state shown in Fig. 8. At this time, the card mounting sensors 28, 38 detect the mounting of the card 1. When the mounting of the card is detected, the wafer chuck 134 is lowered to the original height. After that, the probe card 1 is released from the card fixing part 40 as shown in Fig. 7, and at this time, the card handling arm outside the stage chamber 110 takes out the card 1.

[0058] Then, the handling arm mounts a new probe card 1 on the card support parts 27, 37. When the card mounting sensors 28, 38 detect this, the wafer chuck 134 is primarily aligned by the three-axis control equipment, so that the probe card 1 can be aligned. Then, the wafer chuck 134 is secondarily raised and the card 1 is connected to the card fixing part 40 as shown in Fig. 8, so that the card 1 is fixed. At this time, when the card 1 comes into contact with the card fixing part 40, the impact can be mitigated to some extent by the air cushioning. Such an impact can be generated due to errors caused by gaps or deformation, and such an impact can be eliminated by the air cushioning.

[0059] When a new probe card 1 is fixed to the card fixing portion 40, the wafer chuck 134 is lowered. At the same time, as shown in Figures 4 and 6, the lifting means 22, 32 are also lowered so that the card supports 27, 37 are positioned lower than the upper surface of the wafer chuck 134. Thereafter, a wafer is supplied, and the wafer chuck 134 is raised with the wafer accommodated therein to connect with the new probe card 1, and the test is then started.

[0060] Although an embodiment of the present invention has been described, the concept of the present invention is not limited to the embodiment presented in this specification, and a person skilled in the art who understands the concept of the present invention may easily propose other embodiments by adding, changing, deleting, or adding components within the scope of the same concept, which may also be considered to fall within the scope of the concept of the present invention. [Industrial Applicability]

[0061] The present invention can be applied to equipment for inspecting wafers.

Claims

1. A fixed frame that is fixedly installed inside a stage chamber of a prober; a lifting means having one end fixed to the fixed frame for lifting and lowering an actuating rod; a transfer frame connected to an actuating rod of the lifting means and adapted to move up and down relative to the fixed frame by the actuation of the lifting means; a card support part for supporting a probe card provided on the transfer frame and raising and lowering the probe card to the probe card fixing part so that the probe card can be replaced.

2. 2. The card lifting device of claim 1, wherein said fixed frame is fixed to a wafer chuck or a base of a wafer chuck.

3. 3. The card lifting device of claim 2, wherein said fixed frame is fixed to the outside of the lower part of said wafer chuck.

4. 3. The card lifting device of the prober according to claim 2, wherein a plurality of said card lifting devices of the prober are installed outside said wafer chuck.

5. 2. The card lifting device for a prober according to claim 1, wherein when said lifting means lifts said card support portion, said card support portion is positioned at a position higher than an upper surface of a wafer chuck.

6. 2. The card lifting device of claim 1, wherein said lifting means is actuated by an air cylinder so that said card support portion has cushioning.

7. 2. The card lifting device of claim 1, wherein said card support portion is provided with a positioning pin for aligning the card.

8. 2. The card lifting device of a prober according to claim 1, wherein the card support portion includes a card presence sensor for detecting whether a probe card is present at the probe card fixing portion.

9. 2. The card lifting device of a prober according to claim 1, wherein the card support portion includes a card installation sensor for detecting whether a probe card is installed.

10. 10. The card lifting device of claim 9, wherein the card insertion sensor is a vacuum or contact sensor.

11. 2. The card lifting device of claim 1, wherein said transfer frame and said card support are rounded along the outer surface of said wafer chuck.

12. 2. The card lifting device of claim 1, wherein the fixed frame is formed with a rail groove, and the transfer frame is provided with a rail that is inserted into the rail groove to provide a linear guide.

13. 3. The card lifting device of claim 2, wherein the wafer chuck is provided with a three-axis control device so that the wafer chuck can be aligned in three axial directions, and the card support portion is lifted up to the probe card fixing portion after being aligned by the three-axis control device.

14. 3. The card lifting device for a prober according to claim 2, wherein said card support section, while supporting a probe card, is lifted up and down to said probe card fixing section by means of a lifting means for said wafer chuck.

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