Multi-wafer inspection system

Abstract

A multiple wafer inspection system according to one aspect of the present invention is a multiple wafer inspection system capable of receiving wafers and inspecting a plurality of the wafers simultaneously, the multiple wafer inspection system may include a first stage unit including a plurality of first probers arranged in a first direction and controlled to inspect the plurality of wafers individually, a loader unit arranged on a second direction side of the first stage unit perpendicular to the first direction and supplying the plurality of wafers to the first probers, respectively, a chiller unit supplying a coolant to the first probers, a controller arranged on a side of the loader unit opposite to the first direction for controlling the first probers, and a plurality of first conductive members respectively connecting the plurality of first probers to the controller.

Description

[Technical field]

[0001] The present invention relates to a multi-wafer inspection system, and more particularly to a multi-wafer inspection system capable of controlling a plurality of probers, each of which is capable of being controlled. [Background technology]

[0002] Generally, a wafer prober, which is a semiconductor inspection device, is a device that checks the electrical characteristics of semiconductor devices made on a wafer after all semiconductor pre-processing is completed to check for defects immediately before the wafer enters post-processing.

[0003] In a semiconductor wafer on which a large number of semiconductor elements are formed, a prober is used as a wafer inspection device to inspect the electrical characteristics of each semiconductor element. The prober has a disk-shaped probe card that faces the wafer, and the probe card has a number of contact probes that are columnar contact terminals that are arranged to face each electrode pad and each solder bump of the semiconductor elements on the wafer.

[0004] In a prober, each contact probe on a probe card comes into contact with the electrode pads and solder bumps of a semiconductor element, and an inspection signal is sent from each contact probe to the electrical circuits of the semiconductor element connected to each electrode pad or each solder bump, thereby inspecting the continuity of the electrical circuits.

[0005] Recently, as semiconductor chips are increasingly integrated, the number of semiconductors arranged on one wafer is increasing, which not only increases the time required to inspect one wafer, but also requires a higher level of cleanliness in the inspection space to reduce inspection errors.

[0006] Recently, as the integration density of semiconductor devices on a wafer increases, the time it takes for one prober to inspect the wafer increases. Accordingly, in order to improve the efficiency of wafer inspection, a multi-wafer inspection system has been developed in which probers are stacked in multiple stages to inspect semiconductor devices on multiple wafers with multiple probers.

[0007] However, such a multi-wafer inspection system consisting of multiple stacked probers has a problem that it is difficult to transport the entire system at once because the entire system is large and heavy. Accordingly, the entire system must be assembled and installed at the installation site instead of being transported, which results in a long time and manpower consumption for preparing the system.

[0008] In particular, in the process of reducing the size of a multi-wafer inspection system, the internal space becomes narrower, making it difficult to efficiently arrange conductive members connected to multiple probers inside the system, and connecting multiple conductive members is complicated. Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention has been made to solve the above problems, and an object of the present invention is to provide a multiple wafer inspection system that can be easily installed since a plurality of conductive members can be efficiently arranged.

[0010] Another object of the present invention is to provide a multiple wafer inspection system capable of efficiently arranging a plurality of conductive members to reduce the overall size of the system.

[0011] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0012] A multiple wafer inspection system according to one aspect of the present invention is a multiple wafer inspection system capable of receiving a supply of wafers and inspecting a plurality of the wafers simultaneously, and includes: a first stage unit including a plurality of first probers arranged in a first direction and controlled to inspect the plurality of wafers individually; a loader unit arranged on a second direction side of the first stage unit perpendicular to the first direction and supplying the plurality of wafers to each of the first probers; a chiller unit supplying a coolant to the first probers; a control unit arranged on the opposite side of the loader unit in the first direction for controlling the first probers; and a plurality of first conductive members respectively connecting the first probers to the control unit.

[0013] In this case, the loader unit includes a connection space formed on a third direction side perpendicular to the first direction and the second direction of the loader unit, and the first conductive member can connect the first prober and the control unit via the connection space.

[0014] In this case, the first stage unit further includes a conductive member auxiliary space formed on one side of the first stage unit, and the first conductive member can connect the first prober to the control unit by sequentially passing through the conductive member auxiliary space and the connection space.

[0015] At this time, one side end of the loader unit may be extended to the conductive member auxiliary space of the first stage unit.

[0016] In this case, the first stage unit further includes a plurality of first electrical connection spaces extending in the third direction on one side of the plurality of first probers on the opposite side of the second direction of the first stage unit; and a second electrical connection space extending along the first direction on the opposite side of the third direction of the first stage unit but to which end portions of the opposite side of the third direction of the plurality of first electrical connection spaces are connected, and the first conductive member can connect the first prober to the control unit by sequentially passing through the first electrical connection space, the second electrical connection space, the conductive member auxiliary space and the connection space.

[0017] In this case, the first stage unit may further include a plurality of second probers arranged in the first direction, stacked on the third direction side of the plurality of first probers, and controlled by the control unit, and may further include a plurality of second conductive members connecting the plurality of second probers and the control unit, respectively.

[0018] At this time, the second conductive member may connect the second prober to the control unit by passing through the conductive member auxiliary space and the connection space in sequence.

[0019] In this case, the first prober includes a first electrical space formed on a side opposite to the second direction of the first prober, and the first conductive member can connect the first prober to the control unit by sequentially passing through the first electrical space, the first electrical connection space, the second electrical connection space, the conductive member auxiliary space, and the connection space.

[0020] In this case, the loader unit may further include a second stage unit including a plurality of third probers arranged in the first direction, which are detachably coupled to a first direction side of the first stage unit and controlled by the control unit so as to individually inspect the plurality of wafers; and a plurality of third conductive members respectively connecting the plurality of third probers to the control unit, and the loader unit may be detachably coupled to a second direction side of the first stage unit and the second stage unit perpendicular to the first direction, and may supply the plurality of wafers to the plurality of first probers and the third probers, respectively.

[0021] In this case, the second stage unit further includes a plurality of third electrical connection spaces extending in the third direction on one side of the plurality of third probers on the opposite side of the second direction of the second stage unit; and a fourth electrical connection space extending along the first direction on the opposite side of the third direction of the second stage unit but arranged at a position corresponding to the position of the second electrical connection space along the third direction by connecting ends of the opposite side of the third direction of the plurality of third electrical connection spaces, and the third conductive member may connect the third prober to the control unit sequentially through the third electrical connection space, the fourth electrical connection space, the second electrical connection space, the conductive member auxiliary space and the connection space.

[0022] In this case, the third prober includes a third electrical space formed on a side opposite to the second direction of the third prober, and the third conductive member can connect the third prober to the control unit by sequentially passing through the third electrical space, the third electrical connection space, the fourth electrical connection space, the second electrical connection space, the conductive member auxiliary space and the connection space. Effect of the Invention

[0023] A multiple wafer inspection system according to one embodiment of the present invention not only allows multiple conductive members to be arranged easily and efficiently by efficiently arranging the space through which the conductive members pass inside the stage unit, but also reduces the overall size of the system.

[0024] It should be understood that the effects of the present invention are not limited to the effects described above, but include all effects that can be inferred from the configuration of the invention described in the description of the present invention or the claims. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a perspective view of a multiple wafer inspection system in accordance with one embodiment of the present invention. [Diagram 2] FIG. 1 is an exploded perspective view of a multiple wafer inspection system in accordance with one embodiment of the present invention. [Diagram 3] FIG. 1 is a top view of a multiple wafer inspection system in accordance with one embodiment of the present invention. [Figure 4] FIG. 2 is a perspective view of a first stage unit and a second stage unit of a multiple wafer inspection system in accordance with one embodiment of the present invention. [Diagram 5] 13 is a perspective view of a third alignment member of a multiple wafer inspection system in accordance with one embodiment of the present invention. FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line AA in FIG. 5. [Figure 7] FIG. 4 is a cross-sectional view taken along line BB in FIG. 3; [Figure 8] FIG. 8 is an enlarged view of parts H and G in FIG. [Figure 9] FIG. 4 is a cross-sectional view taken along line CC in FIG. 3. [Figure 10] FIG. 4 is a cross-sectional view taken along line DD in FIG. 3; [Figure 11] FIG. 4 is a cross-sectional view taken along line EE in FIG. [Figure 12] FIG. 4 is a cross-sectional view taken along line FF in FIG. 3. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains can easily carry out the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present invention, parts not related to the description are omitted in the drawings, and the same reference numerals are used throughout the specification to refer to the same or similar components.

[0027] The words and terms used in this specification and the claims should not be interpreted in a limited manner based on their ordinary or dictionary meanings, but should be interpreted in a meaning and concept that corresponds to the technical idea of ​​the present invention in accordance with the principle that the inventor can define the terms and concepts in order to best describe his / her invention.

[0028] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent the entire technical idea of ​​the present invention, and therefore the relevant configurations may have various equivalents and modifications that replace them at the time of filing of the present invention.

[0029] In this specification, the terms "comprise" or "have" are intended to describe the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but should be understood as not precluding the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0030] A certain component being "in front," "in back," "above," or "below" another component means not only that it is immediately adjacent to the other component and is disposed "in front," "in back," "above," or "below," unless there are special circumstances, but also includes the case where another component is disposed between them. Furthermore, a certain component being "connected" to another component means not only that they are directly connected to each other, but also that they are indirectly connected to each other, unless there are special circumstances.

[0031] Hereinafter, a multiple wafer inspection system 1 according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a multiple wafer inspection system according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of a multiple wafer inspection system according to an embodiment of the present invention. FIG. 3 is a top view of a multiple wafer inspection system according to an embodiment of the present invention. FIG. 4 is a perspective view of a first stage unit and a second stage unit of a multiple wafer inspection system according to an embodiment of the present invention. FIG. 5 is a perspective view of a third alignment member of a multiple wafer inspection system according to an embodiment of the present invention. FIG. 6 is a cross-sectional view taken along line AA in FIG. 5. FIG. 7 is a cross-sectional view taken along line BB in FIG. 3. FIG. 8 is an enlarged view of parts H and G in FIG. 7. FIG. 9 is a cross-sectional view taken along line CC in FIG. 3. FIG. 10 is a cross-sectional view taken along line DD in FIG. 3. FIG. 11 is a cross-sectional view taken along line EE in FIG. 3. FIG. 12 is a cross-sectional view taken along line FF in FIG. 3.

[0032] In the following description, the direction of the X-axis in FIG. 1 is defined as the first direction or sideways, the direction of the Y-axis is defined as the second direction or forward, and the direction of the Z-axis is defined as the third direction or upward.

[0033] A multiple wafer inspection system 1 according to an embodiment of the present invention is a system capable of receiving a supply of wafers and inspecting a plurality of wafers simultaneously. To this end, as shown in FIG. 1 and FIG. 2, the multiple wafer inspection system 1 according to an embodiment of the present invention includes a first stage unit 100 and a loader unit 300.

[0034] The multiple wafer inspection system 1 according to an embodiment of the present invention is formed by combining a first stage unit 100 and a loader unit 300. At this time, the first stage unit 100 and the loader unit 300 may be formed integrally or detachably. In this embodiment, the first stage unit 100 and the loader unit 300 are described as being formed detachably.

[0035] At this time, the multiple wafer inspection system 1 according to an embodiment of the present invention may further include a second stage unit 200. The second stage unit 200 has the same function as the first stage unit 100. By providing the second stage unit 200, the stage unit on which the multiple probers of the multiple wafer inspection system 1 are disposed can be formed separably. Accordingly, the first stage unit 100 and the second stage unit 200 can be separated for easy transportation.

[0036] However, the second stage unit 200 is not necessarily required, and the multiple wafer inspection system 1 can be constructed by only combining the first stage unit 100 and the loader unit 300 depending on the installation space. In this embodiment, the second stage unit 200 is further included.

[0037] At this time, the multiple wafer inspection system 1 according to one embodiment of the present invention includes a loader unit 300, a first alignment member 410, a second alignment member 420, a third alignment member 430, a first connecting member 610, a second connecting member 620, a third connecting member 630, a fourth connecting member 640 and a chiller unit 700.

[0038] As shown in FIG. 2, a first stage unit 100 and a second stage unit 200 are provided with a plurality of first probers 110 and a third prober 210, respectively, which are controlled to individually inspect a plurality of wafers.

[0039] At this time, the first prober 110 and the third prober 210 inspect the wafer 2 supplied from the loader unit 300 described below. At this time, there is no limitation on the method of inspecting the wafer 2 inside the first prober 110 and the third prober 210, and various known components may be used. For example, as shown in Figures 3 and 10, a probe card 6 is provided on the upper side and a wafer chuck 5 is provided on the lower side, and the wafer chuck 5 is raised while the wafer 2 is placed on the wafer chuck 5 to bring one side of the wafer 2 into contact with the probe card 6, thereby inspecting the wafer 2.

[0040] 2 and 4, the first probers 110 are arranged in a first direction X. There is no limit to the number of the first probers 110. In this embodiment, it is assumed that two first probers 110 are arranged in the first direction X.

[0041] The first prober 110 is disposed on the side of a loader unit 300 (described later) so as to be openable and closable. Accordingly, it becomes possible to receive a supply of wafers from the loader unit 300.

[0042] 3 and 10, a first electrical equipment space 111 is formed behind the first prober 110. Electrical components 4 for operating the first prober 110 are disposed in the first electrical equipment space 111. The electrical components 4 are connected to a control unit 310, which will be described later, and are used to control the first prober 110.

[0043] The first electrical component space 111 may be formed to be openable and closable at the rear, so that a user can maintain the electrical components 4 arranged in the first electrical component space 111 through the outside at the rear of the first stage unit 100.

[0044] 10, the first electrical component space 111 is disposed on the opposite side to the loader unit 300. That is, the first electrical component space 111 is disposed adjacent to the loader unit 300 and spaced apart from a first refrigerant space 151 (described later) disposed adjacent to the loader unit 300. This prevents damage to the electrical components caused by cooling with the refrigerant that may occur when the electrical component space 111 is disposed adjacent to the first refrigerant flow path F1 disposed in the first refrigerant space 151.

[0045] Furthermore, by arranging the first refrigerant space 151 and the first electrical equipment space 111 at a distance from each other, the first refrigerant flow path F1, which does not require maintenance after installation, is arranged on the loader unit 300 side, and the electrical components 4 are arranged in the first electrical equipment space 111 located at the rear, so that the user can easily access the electrical components from the rear side to perform maintenance.

[0046] 2 and 4, the third probers 210 are arranged in a line in the first direction X. There is no limit to the number of the third probers 210. In this embodiment, it is assumed that two third probers 210 are arranged in the first direction X.

[0047] The third prober 210 is also disposed on the side of the loader unit 300, which will be described later, so as to be openable and closable. Accordingly, the wafer can be supplied from the loader unit 300. The first prober 110 and the third prober 210 may be the same prober. In this case, the criterion for distinguishing between the first prober 110 and the third prober 210 is whether each prober is included in the first stage unit 100 or the second stage unit 200, and does not change depending on the type of prober.

[0048] The third prober 210 is disposed at a position corresponding to the first prober 110 along the third direction Z. That is, the first prober 110 and the third prober 210 are disposed at the same height from the ground. Therefore, as shown in FIG 4, the first prober 110 and the third prober 210 are disposed side by side along the first direction X.

[0049] The third prober 210 also has a third electrical space 211 formed at the rear thereof, which corresponds to the first electrical space 111 of the first prober 110. At this time, the third electrical space 211 is only distinguished as being formed in the third prober 210, and has the same shape and function as the first electrical space 111, so the description thereof will be substituted for the description of the first electrical space 111.

[0050] There is no limitation on the manner in which the first prober 110 and the third prober 210 are disposed inside the first stage unit 100 and the second stage unit 200, respectively. For example, the first stage unit 100 and the second stage unit 200 may have a frame structure, and the first prober 110 and the third prober 210 may be detachably coupled to the frame of the first stage unit 100 and the second stage unit 200.

[0051] 3 and 10, a first tester space 150 is formed inside the first stage unit 100. The first tester space 150 is formed above the first prober 110. There is no limitation on the manner in which the first tester space 150 is formed. For example, it may be formed by a frame of the first stage unit 100.

[0052] The first tester space 150 accommodates a tester 3 connected to a probe card 6 disposed on the inside upper side of the first prober 110. The tester 3 provides an electrical signal through the probe card 6 to test the wafer 2.

[0053] 3 and 10, a second refrigerant space 161 is formed in the second direction Y, i.e., forward, of the first tester space 150. The second refrigerant space 161 is a space through which a second refrigerant flow path F3, which will be described later, passes.

[0054] A third tester space 250 is formed inside the second stage unit 200. The third tester space 250 is formed above the third prober 210. There is no limitation on the manner in which the third tester space 250 is formed. For example, it may be formed by a frame of the second stage unit 200.

[0055] The third tester space 250 accommodates a tester 3 connected to a probe card 6 disposed on the inner upper side of the third prober 210. The tester 3 provides an electrical signal through the probe card 6 to test the wafer 2.

[0056] A fourth refrigerant space 261 is formed in the second direction Y, i.e., forward, of the third tester space 250. The fourth refrigerant space 261 is a space through which a fourth refrigerant flow path F4, which will be described later, passes.

[0057] The second refrigerant space 161 and the fourth refrigerant space 261 are formed at the same height from the ground so that they can be arranged side by side in the first direction X. Accordingly, a second refrigerant flow path F3, which will be described later, can pass through the second refrigerant space 161 and the fourth refrigerant space 261.

[0058] By arranging the second refrigerant space 161 in front of the first tester space 150 and the fourth refrigerant space 261 in front of the third tester space 250, the multi-wafer inspection system 1 can be formed in a minimized size without interfering with the installation of the testers 3 arranged in the first tester space 150 and the third tester space 250.

[0059] In particular, the tester 3 can be inserted and installed in the first tester space 150 from behind the first prober 110 and the third prober 210, and since the second refrigerant flow path F3 and the fourth refrigerant flow path F4 are not positioned in the movement space of the tester 3, not only can the tester 3 be easily installed, but also damage to the second refrigerant flow path F3 and the fourth refrigerant flow path F4 can be prevented.

[0060] As shown in FIG. 4, the first stage unit 100 of the multi-wafer inspection system 1 according to one embodiment of the present invention may further include a plurality of second probers 120, and the second stage unit 200 may further include a plurality of fourth probers 220.

[0061] At this time, the second prober 120 and the fourth prober 220 are distinguished from the first prober 110 and the third prober 210 only by the positions at which they are arranged, and have the same functions, so detailed description of the functions will be omitted.

[0062] 4, a plurality of second probers 120 are arranged in line in a first direction X inside the first stage unit 100. There is no limit to the number of second probers 120, and in this embodiment, two are arranged to correspond to the number of first probers 110. Accordingly, the first stage unit 100 includes the first prober 110 and the second prober 120 stacked on the upper side of the first prober 110.

[0063] The first stage unit 100 includes second tester spaces 160 formed above the second probers 120 to accommodate testers 3 coupled to the second probers 120. The second tester spaces 160 may be formed by a frame of the first stage unit 100, like the first tester space 150. At this time, a fifth refrigerant space 171 may be formed in front of the second tester spaces 160. The fifth refrigerant space 171 is a space through which a fifth refrigerant flow path F5 described below passes.

[0064] 4, a plurality of fourth probers 220 are arranged in the second stage unit 200 in the first direction X. There is no limit to the number of fourth probers 220, and in this embodiment, two are arranged to correspond to the number of third probers 210. Accordingly, the second stage unit 200 includes the third prober 210 and the fourth prober 220 stacked on the upper side of the third prober 210.

[0065] The second stage unit 200 includes fourth tester spaces 260 formed above the plurality of fourth probers 220 to accommodate testers 3 coupled to the plurality of fourth probers 220. The fourth tester spaces 260 may be formed by a frame of the second stage unit 200, like the third tester space 250. At this time, a sixth refrigerant space 271 may be formed in front of the fourth tester space 260. The sixth refrigerant space 271 is a space through which a sixth refrigerant flow path F6 described below passes.

[0066] 3 and 7, the fifth refrigerant space 171 and the sixth refrigerant space 271 are formed at the same height from the ground so that they can be arranged side by side in the first direction X. Accordingly, a fifth refrigerant flow path F5, which will be described later, can pass through the fifth refrigerant space 171 and the sixth refrigerant space 271. At this time, the description of the effects of the fifth refrigerant space 171 and the sixth refrigerant space 271 will be replaced with the description of the second refrigerant space 161 and the fourth refrigerant space 261.

[0067] 4, the first stage unit 100 and the second stage unit 200 may further include additional probers in addition to the first prober 110 to the fourth prober 220. In this case, there is no limit to the number of additional probers.

[0068] In this embodiment, the first stage unit 100 further includes two fifth probers 130. In this case, the first stage unit 100 includes a fifth tester space 170 above the fifth probers 130 in order to place the tester 3 coupled to the fifth probers 130, as shown in FIG. 3 and FIG. 10.

[0069] Accordingly, the first stage unit 100 may include, from bottom to top, a first prober 110, a first tester space 150, a second prober 120, a second tester space 160, a fifth prober 130 and a fifth tester space 170.

[0070] Similarly, in this embodiment, the second stage unit 200 further includes two sixth probers 230. In this case, the second stage unit 200 includes a sixth tester space 270 above the sixth probers 230 to place the testers 3 coupled to the sixth probers 230.

[0071] Accordingly, the second stage unit 200 may include, from bottom to top, a third prober 210, a third tester space 250, a fourth prober 220, a fourth tester space 260, a sixth prober 230 and a sixth tester space 270.

[0072] That is, in this embodiment, the first stage unit 100 is provided with a total of six probers in three rows and two columns, and the second stage unit 200 is provided with a total of six probers in three rows and two columns, so that a total of twelve probers are arranged.

[0073] However, in the following, the first prober 110 to the fourth prober 220 will be mainly described, and the description of the fifth prober 130 and the sixth prober 230 will be replaced with the description of the first prober 110 to the fourth prober 220.

[0074] Further, the second prober 120, the fourth prober 220, the fifth prober 130 and the sixth prober 230 are formed with a second electrical component space 121, a fourth electrical component space 221, a fifth electrical component space 131 and a sixth electrical component space 231 in which electrical components are installed, respectively, in the rear thereof, similarly to the first prober 110 and the third prober 210 described above. At this time, the second electrical component space 121 to the sixth electrical component space 231 are only distinguished by the positions where they are formed, and have the same shape and function as the first electrical component space 111, so the description thereof will be substituted for the description of the first electrical component space 111.

[0075] 2, the first stage unit 100 and the second stage unit 200 can be combined or separated. Accordingly, when installing the multiple wafer inspection system 1, the multiple wafer inspection system 1 does not need to be installed by assembling all the components at the installation site, but can be easily installed by transporting and combining the modular first stage unit 100 and second stage unit 200.

[0076] At this time, the second stage unit 200 is disposed on the first direction X side of the first stage unit 100, and is aligned and then coupled so that the first prober 110 and the second prober 120 of the first stage unit 100 and the third prober 210 and the fourth prober 220 of the second stage unit 200 can be arranged side by side with each other.

[0077] In order to align the first stage unit 100 and the second stage unit 200, a first alignment member 410 is provided under the first stage unit 100. The first alignment member 410 aligns the position of the first stage unit 100 in the third direction Z.

[0078] For this purpose, a plurality of first alignment members 410 may be provided, and the plurality of first alignment members 410 may be arranged in a lattice pattern on the lower surface of the first stage unit 100 .

[0079] By providing a plurality of first alignment members 410, the first stage unit 100 can align its position in the third direction Z and can also adjust the horizontality of the first stage unit 100 with respect to its own weight. This makes it possible to prevent damage that may occur due to poor contact or minute impacts caused by erroneous coupling during the wafer inspection process.

[0080] The first alignment member 410 is a member whose length is adjustable, and various known parts may be used, and there is no limit to the shape or number.

[0081] In order to align the first stage unit 100 and the second stage unit 200, a second alignment member 420 is provided under the second stage unit 200. The second alignment member 420 aligns the position of the second stage unit 200 in the third direction Z. The second alignment member 420 differs from the first alignment member 410 in that it is provided on the second stage unit 200 and the first alignment member 410, but has the same function, so the description thereof will be substituted for the description of the first alignment member 410.

[0082] Meanwhile, a third alignment member 430 is provided to adjust the relative position in the first direction X and the second direction Y between the first alignment member 410 and the second alignment member 420 whose horizontal and relative heights are aligned by the first alignment member 410 and the second alignment member 420.

[0083] As shown in FIG. 4, the third alignment member 430 is fixed to the first stage unit 100 at one side and to the second stage unit 200 at the other side.

[0084] At this time, a plurality of third alignment members 430 may be provided in the vertical direction. In this embodiment, a total of two third alignment members 430 are provided, one on the upper side and one on the lower side. This allows the upper and lower sides to be precisely aligned, respectively, thereby eliminating the relative positional difference between the first stage unit 100 and the second stage unit 200 in the first direction X and the second direction Y.

[0085] The reason why the third alignment member 430 must be provided is that the first stage unit 100 and the second stage unit 200 are heavy, making it difficult to move the first stage unit 100 or the second stage unit 200 easily, and even if the first stage unit 100 or the second stage unit 200 is moved with difficulty, it is difficult to finely adjust its position.

[0086] As shown in FIG. 5, the third alignment member 430 of the multiple wafer inspection system 1 according to the embodiment of the present invention includes a first body 431, a second body 432, a first screw 433 and a second screw 434.

[0087] 5, the first body 431 is fixed to the first stage unit 100. That is, the first body 431 is one side of the third alignment member 430 and is firmly connected to the first stage unit 100.

[0088] As shown in FIG. 6, the first body 431 protrudes from the first stage unit 100 towards the loader unit 300 .

[0089] 5 and 6, the second body 432 formed separately from the first body 431 is fixed to the second stage unit 200. That is, the second body 432 is on the other side of the third alignment member 430 and is firmly connected to the second stage unit 200.

[0090] The second body 432 has a first pressing surface 432a perpendicular to the first direction X on the first stage unit 100 side. The first pressing surface 432a is formed facing the first body 431. A second pressing surface 432b perpendicular to the second direction Y is formed on one side of the first pressing surface 432a of the second body 432, on the loader unit 300 side.

[0091] That is, the first pressure surface 432a is formed perpendicular to the first direction X, and the second pressure surface 432b is formed perpendicular to the second direction Y.

[0092] At this time, as shown in FIG. 6, the first body 431 is bent so as to be disposed opposite the first pressure surface 432a and the second pressure surface 432b.

[0093] A first screw 433 is screwed to one side of the bent first body 431. At this time, the first screw 433 is screwed to be able to reciprocate along the first direction X. The tip of the first screw 433 is disposed to be in contact with the first pressure surface 432a perpendicularly.

[0094] When the first screw 433 is rotated in one direction, the first screw 433 moves in the first direction X or the direction opposite to the first direction X relative to the first body 431, and the tip presses the first pressure surface 432a. Accordingly, the first stage unit 100 and the second stage unit 200 can move relatively in the first direction X.

[0095] A second screw 434 is screwed to the other side of the bent first body 431. At this time, the second screw 434 is screwed to be able to reciprocate along the second direction Y. The tip of the second screw 434 is disposed to be in contact with the second pressure surface 432b perpendicularly.

[0096] When the second screw 434 is rotated in one direction, the second screw 434 moves in the second direction Y or the direction opposite to the second direction Y relative to the first body 431, and the tip presses the second pressure surface 432b. As a result, the first stage unit 100 and the second stage unit 200 can move relatively in the second direction Y.

[0097] 2, the loader unit 300 is detachably coupled to the first stage unit 100 and the second stage unit 200 on the second direction Y side. The loader unit 300 supplies a plurality of wafers to the first to sixth probers 110 to 230, respectively.

[0098] There is no limitation on the method in which the loader unit 300 supplies the wafer to the first prober 110 to the sixth prober 230, and various known methods may be applied. For example, as shown in Figures 3 and 10, a space is formed inside the loader unit 300, and the loader 330 is disposed in the internal space and moves to the first prober 110 to the sixth prober 230 to supply the wafer 2 and the probe card 6 to each prober.

[0099] 2, a control unit 310 is disposed in front of the right end of the loader unit 300. The control unit 310 controls the operation of the first prober 110 to the sixth prober 230. A user can determine whether the first prober 110 to the sixth prober 230 are operated or not and can check the status of the first prober 110 to the sixth prober 230 through the control unit 310. The control unit 310 is connected to each prober by a first conductive member L1 to a sixth conductive member L6, which will be described later.

[0100] A connecting space 301 that is not related to the operation of the loader 330 is formed at the upper right end of the loader unit 300. The connecting space 301 is a space through which the first conductive member L1 to the sixth conductive member L6 pass. Accordingly, the first conductive member L1 to the sixth conductive member L6 do not interfere with the operation of the loader 330 disposed inside the loader unit 300 in the process of connecting the first prober 110 to the sixth prober 230 and the control unit 310, respectively.

[0101] 10, a plurality of loader unit alignment members 340 are provided under the loader unit 300. The loader unit alignment members 340 are formed to be adjustable in length so that the loader unit 300 can be aligned horizontally.

[0102] At this time, there is no limitation on the manner in which the loader unit 300 is aligned horizontally by the loader unit alignment member 340. That is, various known parts may be used for the loader unit alignment member 340. Furthermore, the loader unit alignment members 340 may be arranged in a lattice-like arrangement structure, and there is no limitation on the number of the loader unit alignment members 340 that may be installed.

[0103] A first refrigerant space 151 through which a first refrigerant flow path F1 described later passes and a third refrigerant space 251 through which a third refrigerant flow path F2 described later passes are formed below the loader unit 300. The first refrigerant space 151 is disposed to correspond to the front and rear of the first stage unit 100, and the third refrigerant space 251 is disposed to correspond to the front and rear of the second stage unit 200. That is, the first refrigerant space 151 is disposed below the front of the first prober 110, and the third refrigerant space 251 is disposed below the front of the third prober 210.

[0104] 3 and 10, the first refrigerant space 151 and the third refrigerant space 251 may be formed outside under a frame constituting the loader unit 300. That is, the first refrigerant space 151 and the third refrigerant space 251 may be formed between a plurality of loader unit alignment members 340. This allows the first refrigerant passage F1 and the third refrigerant passage F2, which will be described later, to be efficiently arranged without forming a separate space inside the loader unit 300.

[0105] Meanwhile, the first stage unit 100 and the second stage unit 200 to be coupled to the loader unit 300 are coupled in an aligned state by the first alignment member 410 to the third alignment member 430 before being coupled to the loader unit 300.

[0106] More specifically, the first stage unit 100 and the second stage unit 200 are disposed adjacent to each other in a first direction X, as shown in FIG.

[0107] The first stage unit 100 is arranged on the right side of the second stage unit 200 and has its height and horizontality adjusted by the first alignment member 410 described above.

[0108] With the height and horizontality of the first stage unit 100 adjusted, the height and horizontality of the second stage unit 200 is adjusted by the second alignment member 420. Accordingly, the first prober 110 and the second prober 120 disposed in the first stage unit 100 become equal in height to the third prober 210 and the fourth prober 220 disposed in the second stage unit 200, respectively.

[0109] With the height and horizontality of the first stage unit 100 and the second stage unit 200 adjusted, the relative positions of the first stage unit 100 and the second stage unit 200 in the first direction X or the second direction Y are aligned using the third alignment member 430.

[0110] With the relative positions of the first stage unit 100 and the second stage unit 200 aligned, the first stage unit 100 and the second stage unit 200 are fixed together by a first connecting member 610 disposed between the first stage unit 100 and the second stage unit 200.

[0111] One end of the first coupling member 610 is fixed to the first stage unit 100, and the other end is fixed to the second stage unit 200. There is no limitation on the manner in which the first stage unit 100 and the second stage unit 200 are fixed by the first coupling member 610. For example, a screw can be inserted into both holes to fix the first stage unit 100 and the second stage unit 200, while a hole formed in the frame of the first stage unit 100 and a hole formed in the frame of the second stage unit 200 at a position corresponding to the hole are aligned by the third alignment member 430.

[0112] With the first stage unit 100 and the second stage unit 200 connected by the first connecting member 610, the loader unit 300 is connected to the first stage unit 100 and the second stage unit 200.

[0113] The loader unit 300 is provided with a moving member on its underside so that it can easily move towards the first stage unit 100 and the second stage unit 200. There is no limitation on the parts used for the moving member of the loader unit 300 as long as it can easily move the loader unit 300 even if the loader unit 300 is heavy. For example, it can be a wheel.

[0114] 4, when the loader unit 300 is moved toward the first stage unit 100 and the second stage unit 200, the right end of the loader unit 300 is coupled to the second coupling member 620. Also, the left end of the loader unit 300 is coupled to the third coupling member 630.

[0115] 3, the second coupling member 620 may be formed to extend in a right direction. A conductive member auxiliary space 141 may be formed at a right end of the first stage unit 100. The conductive member auxiliary space 141 may be formed inside the first stage unit 100, to the right of the first prober 110 and the second prober 120. Alternatively, the first stage unit 100 may include a conductive member cabinet 140 formed at a right end surface, and the conductive member auxiliary space 141 may be formed inside the conductive member cabinet 140.

[0116] The second coupling member 620 extending in the right direction allows the right end of the loader unit 300 to be extended to the front of the conductive member auxiliary space 141 formed at the right end of the first stage unit 100. That is, as shown in Fig. 3, the second coupling member 620 further extends to the right from the first prober 110 by a predetermined distance d so that the right end of the loader unit 300 and the conductive member auxiliary space 141 can be arranged side by side in the second direction Y.

[0117] Accordingly, the conductive member auxiliary space 141 can be disposed adjacent to the connecting space 301 in the loader unit 300. In addition, the first conductive member L1 to the sixth conductive member L6 described below can connect the first prober 110 and the third prober 210 to the control unit 310 of the loader unit 300 via the adjacent conductive member auxiliary space 141 and the connecting space 301 without interfering with the movement of the loader 330 inside the loader unit 300.

[0118] The third coupling member 630 fixes the end portion of the loader unit 300 in the first direction X, i.e., the left end portion, to the second stage unit 200. Accordingly, the right and left ends of the loader unit 300 can be coupled to the first stage unit 100 and the second stage unit 200, respectively.

[0119] A plurality of second and third coupling members 620 and 630 may be provided. Accordingly, the second and third coupling members 620 and 630 may be disposed at a predetermined interval in the up-down direction.

[0120] Meanwhile, the fourth coupling member 640 fixes the end portion of the loader unit 300 opposite to the third direction Z, i.e., the lower end portion, to the first stage unit 100 and the second stage unit 200. There is no limit to the number of fourth coupling members 640. That is, a plurality of fourth coupling members 640 may be provided at a predetermined interval on the lower end portion of the loader unit 300 to be coupled to the first stage unit 100 and the second stage unit 200.

[0121] There is no limitation on the manner in which the second connecting member 620, the third connecting member 630, and the fourth connecting member 640 are connected to the loader unit 300. For example, the second connecting member 620, the third connecting member 630, and the fourth connecting member 640 may be screw members that can directly fix the frames of the first stage unit 100 and the second stage unit 200 and the loader unit 300, or as shown in Fig. 4, the second connecting member 620, the third connecting member 630, and the fourth connecting member 640 may include a separate fixing bracket and connect the frames of the first stage unit 100 and the second stage unit 200 and the frame of the loader unit 300 through the bracket.

[0122] Meanwhile, as shown in FIG. 2, a chiller unit 700 is disposed on the left side of the second stage unit 200 to supply a refrigerant to the first prober 110, the third prober 210, the second prober 120, the fourth prober 220, the fifth prober 130 and the sixth prober 230.

[0123] 7 and 8, the chiller unit 700 is connected to the first prober 110 through a first refrigerant flow path F1. When a plurality of first probers 110 are provided, a plurality of first refrigerant flow paths F1 are also formed. The first refrigerant flow paths F1 connect the plurality of first probers 110 to the chiller unit 700 via the first refrigerant space 151 and the third refrigerant space 251, respectively. That is, the first refrigerant flow path F1 passes through both the first stage unit 100 and the second stage unit 200 and is connected to the external chiller unit 700.

[0124] At this time, similar to the first refrigerant flow path F1, the second refrigerant flow path F3 connects the multiple second probers 120 and the chiller unit 700 via the second refrigerant space 161 and the fourth refrigerant space 261, and the fifth refrigerant flow path F5 connects the multiple fifth probers 130 and the chiller unit 700 via the fifth refrigerant space 171 and the sixth refrigerant space 271.

[0125] The first refrigerant flow path F1 includes a first refrigerant supply flow path F11 that supplies a refrigerant to the first prober 110 and a first refrigerant recovery flow path F12 that recovers the refrigerant from the first prober 110. That is, the refrigerant circulates through the chiller unit 700, the first refrigerant supply flow path F11, the first prober 110, and the first refrigerant recovery flow path F12 to maintain the internal environment of the first prober 110 at a low temperature.

[0126] At this time, a first coolant supply port 112 and a first coolant recovery port 113 are formed in the first prober 110 so that the first coolant supply passage F11 and the first coolant supply passage F11 can be connected. As shown in Figures 3, 7, 8 and 10, the first coolant supply port 112 and the first coolant recovery port 113 are formed to protrude forward from the front surface of the first prober 110. That is, the first coolant supply port 112 and the first coolant recovery port 113 protrude toward the loader unit 300.

[0127] 10, one end of the first refrigerant supply passage F11 and one end of the first refrigerant return passage F12 are connected to the first refrigerant supply port 112 and the first refrigerant return port 113 with their ends facing upward. Accordingly, the first refrigerant supply passage F11 and the first refrigerant return passage F12 do not protrude toward the loader unit 300, and do not interfere with the movement of the loader 330.

[0128] Meanwhile, the third refrigerant flow path F2, the second refrigerant flow path F3, the fourth refrigerant flow path F4, the fifth refrigerant flow path F5 and the sixth refrigerant flow path F6 also respectively include a third refrigerant supply flow path F21, a second refrigerant supply flow path F31, a fourth refrigerant supply flow path F41, a fifth refrigerant supply flow path F51 and a sixth refrigerant supply flow path F61 corresponding to the first refrigerant supply flow path F11, and a third refrigerant recovery flow path F22, a second refrigerant recovery flow path F32, a fourth refrigerant recovery flow path F42, a fifth refrigerant recovery flow path F52 and a sixth refrigerant recovery flow path F62 corresponding to the first refrigerant recovery flow path F12. In this case, the explanations for the third refrigerant supply flow path F21, the second refrigerant supply flow path F31, the fourth refrigerant supply flow path F41, the fifth refrigerant supply flow path F51 and the sixth refrigerant supply flow path F61 and the third refrigerant recovery flow path F22, the second refrigerant recovery flow path F32, the fourth refrigerant recovery flow path F42, the fifth refrigerant recovery flow path F52 and the sixth refrigerant recovery flow path F62 are replaced with the explanations for the first refrigerant supply flow path F11 and the first refrigerant recovery flow path F12.

[0129] Also, the third prober 210 to the sixth prober 230 respectively include a third refrigerant supply port 212 to a sixth refrigerant supply port 232 corresponding to the first refrigerant supply port 112, and a third refrigerant recovery port 213 to a sixth refrigerant recovery port 233 corresponding to the first refrigerant recovery port 113. In this case, the explanation for the third refrigerant supply port 212 to the sixth refrigerant supply port 232 and the third refrigerant recovery port 213 to the sixth refrigerant recovery port 233 will be replaced with the explanation for the first refrigerant supply port 112 and the first refrigerant recovery port 113.

[0130] 7 and 8, the chiller unit 700 is connected to the third prober 210 through a third refrigerant flow path F2. When a plurality of third probers 210 are provided, a plurality of third refrigerant flow paths F2 are also formed. The third refrigerant flow paths F2 connect the plurality of third probers 210 and the chiller unit 700 via the third refrigerant spaces 251, respectively.

[0131] At this time, similar to the third refrigerant flow path F2, the fourth refrigerant flow path F4 connects multiple fourth probers 220 and the chiller unit 700 via the fourth refrigerant space 261, and the sixth refrigerant flow path F6 connects multiple sixth probers 230 and the chiller unit 700 via the sixth refrigerant space 271.

[0132] The first refrigerant flow path F1 to the sixth refrigerant flow path F6 are not limited in material or shape as long as the refrigerant cooled by passing through the chiller unit 700 can be supplied to the first prober 110 to the sixth prober 230. For example, the first refrigerant flow path F1 to the sixth refrigerant flow path F6 can be hoses or pipes through which the refrigerant can move. In this embodiment, the first refrigerant flow path F1 to the sixth refrigerant flow path F6 are described as being made of hoses that are easily attached and detached, in accordance with the purpose of providing a multiple wafer inspection system 1 that can be separated and attached, which is the core of the technical idea of ​​the present invention.

[0133] 7, in order to easily couple the plurality of first refrigerant channels F1 to the chiller unit 700, a refrigerant channel auxiliary space 241 is formed at a left end of the second stage unit 200. The refrigerant channel auxiliary space 241 may be formed inside the second stage unit 200 and to the left of the third prober 210 and the fourth prober 220. Alternatively, the second stage unit 200 may include a refrigerant channel cabinet 240 formed at a left end surface of the second stage unit 200, and the refrigerant channel auxiliary space 241 may be formed inside the refrigerant channel cabinet 240.

[0134] 11, a plurality of second refrigerant flow paths F3 to sixth refrigerant flow paths F6 may be arranged in the refrigerant flow path auxiliary space 241. The arranged plurality of second refrigerant flow paths F3 to sixth refrigerant flow paths F6 are arranged to be aligned and fixed inside the refrigerant flow path auxiliary space 241.

[0135] 2, a plurality of chiller units 700 may be provided. The number of chiller units 700 may vary depending on the number of probers provided in the multi-wafer inspection system 1. In this embodiment, the multi-wafer inspection system 1 has a total of 12 probers arranged in 3 rows and 4 columns, and accordingly, three chiller units 700 are provided so that one chiller unit 700 is responsible for one row and can supply coolant to a total of four probers.

[0136] To explain this in more detail, the second chiller unit 720 is connected to the second probers 1202 of the first stage unit 100 and the fourth probers 2202 of the second stage unit 200 by second refrigerant flow paths F3 and fourth refrigerant flow paths F4, respectively, and the third chiller unit 730 is connected to the fifth probers 1302 of the first stage unit 100 and the sixth probers 2302 of the second stage unit 200 by fifth refrigerant flow paths F5 and sixth refrigerant flow paths F6, respectively.

[0137] At this time, a flow path fixing member 500 may be provided in the refrigerant flow path auxiliary space 241 so that the second refrigerant flow path F3 and the fourth refrigerant flow path F4 connected to the second chiller unit 720 can be easily distinguished and a person assembling the multiple wafer inspection system 1 can connect to the second chiller unit 720 instead of the third chiller unit 730. There is no limitation on the shape of the flow path fixing member 500 as long as it can easily fix the second refrigerant flow path F3 and the fourth refrigerant flow path F4.

[0138] A plurality of flow path fixing members 500 may be provided. Accordingly, in addition to fixing the second refrigerant flow path F3 and the fourth refrigerant flow path F4 to the refrigerant flow path auxiliary space 241, the flow path fixing members 500 may fix the fifth refrigerant flow path F5 and the sixth refrigerant flow path F6.

[0139] The fifth refrigerant flow path F5 and the sixth refrigerant flow path F6 can be coupled to the third chiller unit 730 via the refrigerant flow path auxiliary space 241.

[0140] Meanwhile, as shown in FIG. 11, the first refrigerant flow path F1 and the third refrigerant flow path F2 may be directly connected to the third chiller unit 730 without passing directly through the refrigerant flow path auxiliary space 241, but is not limited to this and may be designed to pass through the refrigerant flow path auxiliary space 241.

[0141] Meanwhile, as shown in FIGS. 3 and 9, the first stage unit 100 includes a plurality of first electrical component connection spaces 180 and a second electrical component connection space 190. As shown in FIG.

[0142] The first electrical component connection spaces 180 extend vertically on one side of the first probers 110 in the opposite direction to the second direction Y, i.e., the rear side of the first stage unit 100. At this time, the position of one side of the first prober 110 where the first electrical component connection spaces 180 are formed may be the left or right side of the first prober 110. In this embodiment, as shown in FIG 9, the first electrical component connection spaces 180 are formed on the right side of the first prober 110, extending vertically.

[0143] The number of first electrical component connection spaces 180 varies depending on the number of first probers 110. When two first probers 110 are arranged on the left and right as in this embodiment shown in FIG 9, two first electrical component connection spaces 180 are formed corresponding to the number of first probers 110.

[0144] There is no limitation on the way in which the first electrical component connection space 180 is formed as long as it can be extended in the vertical direction to the above-mentioned position. For example, it may be formed inside the first stage unit 100 by a frame that constitutes the first stage unit 100, or it may be formed inside a pillar that supports the inside of the first stage unit 100.

[0145] The first electrical equipment connection space 180 is disposed apart from the second refrigerant space 161 and the fifth refrigerant space 171 formed in front of the first stage unit 100. This allows the first conductive member L1, the second conductive member L3, and the fifth conductive member L5, which will be described later, and the second refrigerant flow path F3 and the fifth refrigerant flow path F5, which will pass through the inside of the first electrical equipment connection space 180, to be disposed apart from each other. That is, the first conductive member L1, the second conductive member L3, and the fifth conductive member L5 are prevented from being affected by the second refrigerant flow path F3 and the fifth refrigerant flow path F5, and the first conductive member L1 and the second conductive member L3 can be prevented from being damaged.

[0146] In addition, the second refrigerant flow path F3 and the fifth refrigerant flow path F5 are arranged at a distance from the first conductive member L1, the second conductive member L3, and the fifth conductive member L5, and the second refrigerant flow path F3 and the fifth refrigerant flow path F5 are connected to the chiller unit 700 along the left-right direction, and the first conductive member L1, the second conductive member L3, and the fifth conductive member L5 are connected to the control unit 310 along the top-bottom direction, thereby enabling a person assembling the multiple wafer inspection system 1 to easily distinguish between the refrigerant flow paths and the conductive members.

[0147] Furthermore, the first conductive member L1, the second conductive member L3 and the fifth conductive member L5, which are relatively more likely to require maintenance, are positioned at the rear, allowing the user to easily perform maintenance outside the rear of the first stage unit 100.

[0148] 9, the second electrical component connection space 190 is connected to the lower ends of the plurality of first electrical component connection spaces 180. For this purpose, the second electrical component connection space 190 is formed at the rear lower end of the first stage unit 100 and extends in the left-right direction.

[0149] There is no limitation on the way in which the second electrical component connection space 190 is formed as long as it can be extended in the left-right direction to the above-mentioned position. For example, it may be formed inside the first stage unit 100 by a frame that constitutes the first stage unit 100, or it may be formed inside a frame that supports the inside of the first stage unit 100.

[0150] The second electrical equipment connection space 190 is formed behind the first stage unit 100, like the first electrical equipment connection space 180, so that, like the first electrical equipment connection space 180, the person assembling the multi-wafer inspection system 1 can easily install the refrigerant flow path and the conductive members separately.

[0151] Meanwhile, the second stage unit 200 also includes a third electrical component connection space 280 and a fourth electrical component connection space 290 which respectively correspond to the first electrical component connection space 180 and the second electrical component connection space 190 of the first stage unit 100. Here, the description of the third electrical component connection space 280 and the fourth electrical component connection space 290 that overlaps with the description of the first electrical component connection space 180 and the second electrical component connection space 190 will be omitted.

[0152] The third electrical connection space 280 extends vertically on one side of each of the third probers 210 at the rear of the second stage unit 200. At this time, the position of one side of the third prober 210 where the third electrical connection space 280 is formed may be the left or right side of the third prober 210. In this embodiment, as shown in FIG 9, the third electrical connection space 280 is formed on the right side of the third prober 210, extending vertically.

[0153] The number of the third electrical component connection spaces 280 varies depending on the number of the third probers 210. When two third probers 210 are arranged on the left and right as in the present embodiment shown in FIG 9, two third electrical component connection spaces 280 are formed corresponding to the number of the third probers 210.

[0154] 9, the fourth electrical component connection space 290 is connected to the lower ends of the third electrical component connection spaces 280. To this end, the fourth electrical component connection space 290 is formed at the rear lower end of the second stage unit 200 and extends in the left-right direction.

[0155] In addition, the fourth electrical component connecting space 290 is formed at the same height as the second electrical component connecting space 190. Accordingly, a third conductive member L2, a fourth conductive member L4, and a sixth conductive member L6, which will be described later, can be connected to the control unit 310 via the fourth electrical component connecting space 290 and the second electrical component connecting space 190.

[0156] 9 and 12, the first conductive member L1 connects the first prober 110 and the controller 310. The first conductive member L1 is a type of electric wire and may not only supply a control signal from the controller 310 to the first prober 110, but also supply power to the first prober 110 through the controller 310.

[0157] For this purpose, one end of the first conductive member L1 is connected to an electrical component 4 arranged in the first electrical equipment space 111, and the other end is connected to the control unit 310 via the first electrical equipment space 111, the first electrical equipment connection space 180, the second electrical equipment connection space 190 and the connection space 301 in sequence.

[0158] 9 and 12, the first conductive member L1 may further pass through the conductive member auxiliary space 141. That is, the first prober 110 and the control unit 310 may be connected to each other by passing through the first electrical component space 111, the first electrical component connection space 180, the second electrical component connection space 190, the conductive member auxiliary space 141, and the connection space 301 in that order.

[0159] At this time, the first conductive member L1 can be separated into a first prober conductive member L11 and a first control unit conductive member L12, and the first prober conductive member L11 and the first control unit conductive member L12 can be connected by a connecting member 800 arranged in the conductive member auxiliary space 141.

[0160] 9 and 12, the first prober conductive member L11 connects the electrical component 4 and the connecting member 800 through the first electrical component space 111, the first electrical component connecting space 180, the second electrical component connecting space 190 and the conductive member auxiliary space 141. In addition, the first control unit conductive member L12 connects the connecting member 800 and the control unit 310 through the conductive member auxiliary space 141 and the connecting space 301.

[0161] That is, the connecting member 800 serves to connect the first prober conductive member L11 and the first control unit conductive member L12. There are no limitations on the connecting member 800 as long as it can connect the first prober conductive member L11 and the first control unit conductive member L12 so that electricity can be conducted between them. For example, the connecting member 800 can connect the first prober conductive member L11 and the first control unit conductive member L12 in a socket type.

[0162] 9 and 12, the third conductive member L2 connects the third prober 210 and the controller 310. The third conductive member L2 is a type of electric wire, like the first conductive member L1, and may not only supply a control signal from the controller 310 to the third prober 210, but also supply power to the third prober 210 through the controller 310.

[0163] For this purpose, one end of the third conductive member L2 is connected to an electrical component 4 arranged in the third electrical equipment space 211, and the other end is connected to the control unit 310 via the third electrical equipment space 211, the third electrical equipment connection space 280, the fourth electrical equipment connection space 290 and the connection space 301 in sequence.

[0164] At this time, the third conductive member L2 can further pass through the conductive member auxiliary space 141. That is, the third prober 210 and the control unit 310 can be connected to each other by passing through the third electrical component space 211, the third electrical component connection space 280, the fourth electrical component connection space 290, the second electrical component connection space 190, the conductive member auxiliary space 141, and the connection space 301 in this order.

[0165] At this time, the third conductive member L2 can be separated into the second prober conductive member L21 and the third control unit conductive member L22, and the second prober conductive member L21 and the third control unit conductive member L22 can be connected by a connecting member 800 arranged in the conductive member auxiliary space 141.

[0166] 9, the second prober conductive member L21 connects the electrical component 4 and the connecting member 800 through the third electrical component space 211, the third electrical component connecting space 280, the fourth electrical component connecting space 290, the second electrical component connecting space 190 and the conductive member auxiliary space 141. In addition, the third control portion conductive member L22 connects the connecting member 800 and the control portion 310 through the conductive member auxiliary space 141 and the connecting space 301.

[0167] That is, if a person assembling the multiple wafer inspection system 1 is careful to only couple the first prober conductive member L11 and the second prober conductive member L21 to the connecting member 800, the first control unit conductive member L12 and the third control unit conductive member L22 can be easily connected to the control unit 310. This makes it easy to connect each prober to the control unit 310 when first combining the first stage unit 100 and the second stage unit 200 and then combining the loader unit 300.

[0168] As described above, by forming spaces in the first stage unit 100, the second stage unit 200 and the loader unit 300 that allow the first prober 110 and the third prober 210 to be easily connected to the control unit 310, a person assembling the multiple wafer inspection system 1 can not only arrange the positions of the first conductive member L1 and the third conductive member L2 without any special concern, but also optimize and minimize the overall size of the multiple wafer inspection system 1.

[0169] Meanwhile, the second conductive member L3 connects the second prober 120 and the control unit 310. At this time, in order to connect the electrical components 4 arranged in the second electrical equipment space 121 and the control unit 310, the second conductive member L3 has one end connected to the electrical components 4 arranged in the second electrical equipment space 121 and the other end connected to the control unit 310 via the second electrical equipment space 121, the first electrical equipment connecting space 180, the second electrical equipment connecting space 190, the conductive member auxiliary space 141 and the connecting space 301 in this order.

[0170] At this time, the second conductive member L3 may be separated into a second prober conductive member L31 and a second control unit conductive member L32, just like the first conductive member L1, but the description thereof will be substituted for the description of the first conductive member L1.

[0171] The fourth conductive member L4 connects the fourth prober 220 and the control unit 310. In this case, in order to connect the electrical component 4 arranged in the fourth electrical equipment space 221 to the control unit 310, the fourth conductive member L4 has one end connected to the electrical component 4 arranged in the fourth electrical equipment space 221 and the other end connected to the control unit 310 via the fourth electrical equipment space 221, the third electrical equipment connection space 280, the fourth electrical equipment connection space 290, the second electrical equipment connection space 190, the conductive member auxiliary space 141 and the connection space 301 in this order.

[0172] At this time, the fourth conductive member L4 may be separated into a fourth prober conductive member L41 and a fourth controller conductive member L42, like the third conductive member L2, but the description thereof will be substituted for the description of the third conductive member L2.

[0173] The fifth conductive member L5 connects the fifth prober 130 and the control unit 310. In this case, in order to connect the electrical components 4 arranged in the fifth electrical equipment space 131 and the control unit 310, the fifth conductive member L5 has one end connected to the electrical components 4 arranged in the fifth electrical equipment space 131 and the other end connected to the control unit 310 via the fifth electrical equipment space 131, the first electrical equipment connection space 180, the second electrical equipment connection space 190 and the connection space 301 in this order.

[0174] At this time, the fifth conductive member L5 may be separated into a fifth prober conductive member L51 and a fifth controller conductive member L52, like the first conductive member L1, but the description thereof will be substituted for the description of the first conductive member L1.

[0175] The sixth conductive member L6 connects the sixth prober 230 and the control unit 310. In this case, in order to connect the electrical component 4 arranged in the sixth electrical equipment space 231 and the control unit 310, the sixth conductive member L6 has one end connected to the electrical component 4 arranged in the sixth electrical equipment space 231, and the other end connected to the control unit 310 via the sixth electrical equipment space 231, the third electrical equipment connection space 280, the fourth electrical equipment connection space 290, the second electrical equipment connection space 190, the conductive member auxiliary space 141 and the connection space 301 in this order.

[0176] At this time, the sixth conductive member L6 may be separated into a sixth prober conductive member L61 and a sixth control unit conductive member L62, like the third conductive member L2, but the description thereof will be substituted for the description of the third conductive member L2.

[0177] The installation process of the multiple wafer inspection system 1 according to an embodiment of the present invention will be described below in detail.

[0178] The first stage unit 100 and the second stage unit 200 are arranged side by side such that the front of the first stage unit 100 and the front of the second stage unit 200 face the same direction.

[0179] The horizontal positions of the first stage unit 100 and the second stage unit 200 are adjusted by the first alignment member 410 and the second alignment member 420, respectively. At this time, the heights of the first stage unit 100 and the second stage unit 200 are also adjusted.

[0180] The first stage unit 100 and the second stage unit 200 whose heights have been adjusted are aligned relative to each other at the front and side of the first stage unit 100 and the second stage unit 200 via the third alignment member 430 .

[0181] After the heavy first stage unit 100 and second stage unit 200 are precisely aligned using the third alignment member 430 , the first stage unit 100 and second stage unit 200 are coupled together using the first coupling member 610 .

[0182] The loader unit 300 is disposed in front of the combined first stage unit 100 and second stage unit 200, and the first stage unit 100 and the loader unit 300, and the second stage unit 200 and the loader unit 300 are combined via the second combining member 620 to the fourth combining member 640.

[0183] The first refrigerant flow path F1 to the sixth refrigerant flow path F6 are arranged. More specifically, the first refrigerant flow path F1 is arranged so as to pass through the first refrigerant space 151 and the third refrigerant space 251 while one end is connected to the first prober 110, and the third refrigerant flow path F2 is arranged so as to pass through the third refrigerant space 251 while one end is connected to the third prober 210.

[0184] The second refrigerant flow path F3 to the sixth refrigerant flow path F6 are arranged in sequence in the same manner as the first refrigerant flow path F1 and the third refrigerant flow path F2, and are fixed by a flow path fixing member 500.

[0185] However, the second refrigerant flow path F3 to the sixth refrigerant flow path F6 are arranged to pass through the refrigerant flow path auxiliary space 241. At this time, the second refrigerant flow path F3 to the sixth refrigerant flow path F6 are fixed in the refrigerant flow path auxiliary space 241 by a flow path fixing member 500.

[0186] The first refrigerant flow path F1 and the third refrigerant flow path F2 are connected to the first chiller unit 710, the second refrigerant flow path F3 and the fourth refrigerant flow path F4 are connected to the second chiller unit 720, and the fifth refrigerant flow path F5 and the sixth refrigerant flow path F6 are connected to the third chiller unit 730.

[0187] The first conductive member L1 to the sixth conductive member L6 are arranged. More specifically, the first conductive member L1, the second conductive member L3 and the fifth conductive member L5 are respectively connected at one end to the first prober 110, the second prober 120 and the fifth prober 130, and then arranged to pass through the first electrical component connecting space 180, the second electrical component connecting space 190, the conductive member auxiliary space 141 and the connecting space 301, and connected at the other end to the control unit 310.

[0188] On the other hand, the third conductive member L2, the fourth conductive member L4 and the sixth conductive member L6 are respectively connected at one end to the third prober 210, the fourth prober 220 and the sixth prober 230, and then arranged to pass through the third electrical equipment connection space 280, the fourth electrical equipment connection space 290, the second electrical equipment connection space 190, the conductive member auxiliary space 141 and the connection space 301, and connected at the other end to the control unit 310.

[0189] Although the preferred embodiments of the present invention have been described above, it will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or scope of the present invention. Therefore, the above-described embodiments should be considered as illustrative rather than restrictive, and the present invention is not limited to the above description, but may be modified within the scope of the appended claims and their equivalents.

Claims

1. 1. A multiple wafer inspection system capable of receiving a supply of wafers and simultaneously inspecting a plurality of said wafers, comprising: a first stage unit including a plurality of first probers arranged side by side in a first direction and controlled so as to be able to individually inspect the plurality of wafers; a loader unit arranged on a second direction side of the first stage unit perpendicular to the first direction, the loader unit supplying a plurality of the wafers to a plurality of the first probers, respectively; a chiller unit that supplies a coolant to the first probers; a control unit disposed on the opposite side of the loader unit in the first direction for controlling the first prober; and a plurality of first conductive members respectively connecting the plurality of first probers to the controller.

2. the loader unit includes a connection space formed on a third direction side of the loader unit perpendicular to the first direction and the second direction, 2. The multi-wafer inspection system of claim 1, wherein the first conductive member connects the first prober and the control unit through the connection space.

3. the first stage unit further includes a conductive member auxiliary space formed on one side of the first stage unit, 3. The multiple wafer inspection system of claim 2, wherein the first conductive member connects the first prober to the controller via the conductive member auxiliary space and the connection space in sequence.

4. 4. The multiple wafer inspection system of claim 3, wherein one side end of the loader unit extends to the conductive member auxiliary space of the first stage unit.

5. The first stage unit a plurality of first electrical connection spaces extending in the third direction on a side of the first probers opposite to the second direction of the first stage unit; and a second electrical component connection space extending along the first direction on a side of the first stage unit opposite to the third direction and connected to ends of the first electrical component connection spaces opposite to the third direction, 4. The multiple wafer inspection system of claim 3, wherein the first conductive member connects the first prober to the control unit via the first electrical component connection space, the second electrical component connection space, the conductive member auxiliary space, and the connection space in sequence.

6. The first stage unit a plurality of second probers arranged in the first direction, stacked on the third direction side of the plurality of first probers, and controlled by the control unit; 6. The multi-wafer inspection system of claim 5, further comprising: a plurality of second conductive members respectively connecting the plurality of second probers to the controller.

7. 7. The multiple wafer inspection system of claim 6, wherein the second conductive member connects the second prober to the controller via the conductive member auxiliary space and the connection space in sequence.

8. the first prober includes a first electrical space formed on a side of the first prober opposite to the second direction; 6. The multiple wafer inspection system of claim 5, wherein the first conductive member connects the first prober to the control unit via the first electrical space, the first electrical connection space, the second electrical connection space, the conductive member auxiliary space, and the connection space in sequence.

9. a second stage unit including a plurality of third probers detachably coupled to a first direction side of the first stage unit, controlled by the control unit so as to be able to individually inspect a plurality of the wafers, and arranged side by side in the first direction; and a plurality of third conductive members respectively connecting the third probers and the control unit; 9. The multi-wafer inspection system of claim 8, wherein the loader unit is detachably coupled to a second direction side of the first stage unit and the second stage unit perpendicular to the first direction, and supplies a plurality of the wafers to a plurality of the first probers and a plurality of the third probers, respectively.

10. The second stage unit a plurality of third electrical connection spaces extending in the third direction on a side of the second stage unit opposite to the second direction and on one side of the third probers; and a fourth electrical component connection space extending along the first direction on a side of the second stage unit opposite to the third direction, the fourth electrical component connection space being arranged at a position corresponding to a position of the second electrical component connection space along the third direction by connecting ends of the third electrical component connection spaces opposite to the third direction, 10. The multiple wafer inspection system of claim 9, wherein the third conductive member connects the third prober to the control unit via the third electrical connection space, the fourth electrical connection space, the second electrical connection space, the conductive member auxiliary space, and the connection space in sequence.

11. the third prober includes a third electrical space formed on a side of the third prober opposite to the second direction; 11. The multiple wafer inspection system of claim 10, wherein the third conductive member connects the third prober to the control unit via the third electrical space, the third electrical connection space, the fourth electrical connection space, the second electrical connection space, the conductive member auxiliary space, and the connection space in sequence.

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