Solderless high current, high voltage, wide bandwidth test fixture
JP2025505740APending Publication Date: 2025-02-28KEITHLEY INSTRUMENTS LLC
Patent Information
- Application Number
- JP2024547641
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-02-10
- Filing Date
- 2023-02-10
- Publication Date
- 2025-02-28
AI Technical Summary
Benefits of technology
、以下で説明する。金属板170は、例えば、銅、真鍮又は他の類似の金属又は合金で形成されても良い。いくつかの実施形態では、金属板170は、厚さが約1~15mmであり、好ましくは厚さが約5~10mmである。この開示で使用される約とは、+/-20%以内を意味する。
✦ Generated by Eureka AI based on patent content.
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Figure 2025505740000001_ABST
Abstract
A test fixture for coupling devices under test (DUTs) to a measurement device includes a device interface board, which may be a solderless press-fit board, for electrically connecting to one or more DUTs, a power supply electrically coupled to the device interface board via a series of electrical contacts, a measurement coupling electrically coupled to the device interface board via a second series of electrical contacts and configured to be coupled to a measurement device, and a metal plate coupled between the measurement coupling and the power supply to provide an electrical return path, the metal plate being sized and shaped to provide physical protection from the DUT being destroyed during testing.
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Citation Information
Patent Citations
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