Semiconductor device test equipment

Abstract

According to one embodiment, a semiconductor device testing apparatus includes a thermoelectric element module having both sides that are converted into a heating surface or a cooling surface along a direction of current flow, a cooling module disposed on an upper portion of the thermoelectric element module and configured to cool the thermoelectric element, a pusher module disposed on a lower portion of the thermoelectric element module and configured to contact a test target element mounted on a holder and heat or cool the test target element, and a control module configured to control a direction of current supplied to the thermoelectric element module according to a target temperature value.

Description

[Technical field]

[0001] The present disclosure relates to a test apparatus for semiconductor devices. [Background technology]

[0002] Semiconductor devices must maintain their electrical characteristics even under low and high temperature environments. Therefore, during the manufacturing process of semiconductor devices, tests are performed on the electrical characteristics of the semiconductor devices under low and high temperature environments. An example of a test apparatus for performing a low and high temperature test on semiconductor devices is disclosed in Korean Patent Publication No. 2003-0028070.

[0003] A test apparatus for testing a semiconductor device may include a thermoelectric element. A pusher installed at a lower end of the thermoelectric element directly contacts an upper end of the semiconductor device, and the temperature of the pusher can be adjusted by controlling the operation of the thermoelectric element.

[0004] A typical example of a thermoelectric element used in a semiconductor device test device is a Peltier element. When a current is supplied to the Peltier element, heat is absorbed on one side of the Peltier element and released on the other side. Using the characteristics of these Peltier elements, it is possible to apply heat to a semiconductor device or freeze the semiconductor device before testing the electrical characteristics of the semiconductor device.

[0005] The above-mentioned test process is essential in the manufacturing process of semiconductor devices. Therefore, when testing is performed on a large number of semiconductor devices at once, the manufacturing speed of the semiconductor devices can be increased and the manufacturing cost can be reduced. Therefore, in order to provide more test equipment in the same space and increase the testing speed of the semiconductor devices, it is necessary to reduce the size of the test equipment for the semiconductor devices.

[0006] Meanwhile, when a current is supplied to the Peltier element during a semiconductor device test process, the surface and internal temperatures of the Peltier element rise. Therefore, the Peltier element is made of a heat-resistant material. However, if the temperature of the Peltier element rises excessively high during the test process and exceeds an allowable temperature range, the Peltier element may be damaged. Therefore, there is a need for a new pusher device that can prevent the temperature of the Peltier element from exceeding the allowable temperature range during the operation of a test device for testing semiconductor devices. Summary of the Invention [Problem to be solved by the invention]

[0007] It is an object of the present invention to provide a semiconductor device test apparatus having a reduced size.

[0008] An object of the present invention is to provide a semiconductor device testing apparatus capable of preventing the temperature of a Peltier element from falling outside an allowable temperature range during a semiconductor device testing process.

[0009] The object of the present specification is not limited to the object mentioned above, and other objects and advantages of the present specification not mentioned can be more clearly understood from the examples of the present specification described below. In addition, the object and advantages of the present specification can be realized by the elements and combinations thereof described in the claims. [Means for solving the problem]

[0010] According to one embodiment, a semiconductor device testing apparatus includes a thermoelectric element module having both sides that are converted into a heating surface or a cooling surface along a direction of current flow, a cooling module disposed on an upper portion of the thermoelectric element module and configured to cool the thermoelectric element, a pusher module disposed on a lower portion of the thermoelectric element module and configured to contact a test target element mounted on a holder and heat or cool the test target element, and a control module configured to control a direction of current supplied to the thermoelectric element module according to a target temperature value.

[0011] In one embodiment, the thermoelectric element module includes an upper substrate in contact with the cooling module, a lower substrate in contact with the pusher module, an intermediate substrate disposed between the upper substrate and the lower substrate, a plurality of first semiconductor elements and a plurality of second semiconductor elements disposed between the upper substrate and the intermediate substrate, and a plurality of third semiconductor elements and a plurality of fourth semiconductor elements disposed between the intermediate substrate and the lower substrate.

[0012] In one embodiment, a temperature sensor is disposed on one side of the intermediate substrate or inside the intermediate substrate.

[0013] In one embodiment, the control module controls the direction of the current supplied to the thermoelectric element module depending on the temperature value of the intermediate substrate measured by the temperature sensor.

[0014] In one embodiment, the control module controls the direction of current supplied to the thermoelectric element module based on the temperature value of the intermediate substrate, a preset intermediate rise target temperature value, and a preset intermediate fall target temperature value when increasing the temperature of the lower substrate to a preset final target temperature value.

[0015] In one embodiment, the control module controls a direction of a current supplied to the thermoelectric element module so that when the temperature of the lower substrate is increased according to the target temperature value of the intermediate rise, if the temperature value of the intermediate substrate exceeds a predetermined reference temperature value, the temperature of the lower substrate is decreased based on the target temperature value of the intermediate fall.

[0016] In one embodiment, the intermediate rise target temperature values ​​are multiple values ​​that are set to gradually increase by predetermined intervals.

[0017] In one embodiment, the reference temperature value is set to be smaller than a limit temperature value of the intermediate substrate.

[0018] In an embodiment, the first semiconductor chip, the second semiconductor chip, the third semiconductor chip, and the fourth semiconductor chip have a hexahedral shape, and the top and bottom surfaces are square shaped.

[0019] In one embodiment, a ratio of a length (W) of each side of an upper surface or a lower surface of the first semiconductor element, the second semiconductor element, the third semiconductor element, and the fourth semiconductor element to a height (H) of the first semiconductor element, the second semiconductor element, the third semiconductor element, and the fourth semiconductor element is set within a range of 1:1 to 1:1.4. Effect of the Invention

[0020] According to the embodiment, the size of a test apparatus for a semiconductor device can be reduced, so that more test apparatus for semiconductor devices can be arranged in the same space, thereby increasing the manufacturing speed of semiconductor devices and reducing manufacturing costs.

[0021] According to the embodiment, the temperature of the Peltier element does not deviate from the allowable temperature range during the operation of the test device, thereby enabling more stable testing of semiconductor devices. [Brief description of the drawings]

[0022] [Figure 1] 1 is a perspective view of a semiconductor device testing apparatus according to an embodiment; [Diagram 2] FIG. 2 is an exploded perspective view of a test apparatus for the semiconductor device shown in FIG. [Diagram 3] FIG. 1 is a vertical sectional view of a Peltier element according to a first embodiment. [Figure 4] FIG. 11 is a vertical sectional view of a Peltier element according to a second embodiment. [Diagram 5] 1 is a perspective view of a semiconductor element disposed inside a Peltier element according to an embodiment; [Figure 6] 11 is a graph showing a change in cooling temperature value of a Peltier element according to a change in height of a semiconductor element disposed inside the Peltier element according to an embodiment. [Figure 7]11 is a graph showing changes in temperature values ​​of a connector and an intermediate board according to temperature control of a semiconductor device test apparatus including a Peltier element according to an embodiment; [Figure 8] 13 is a graph showing changes in temperature values ​​of a connector and an intermediate board due to temperature control of a test apparatus for a semiconductor device including a Peltier element according to another embodiment. [Figure 9] 1 is a diagram showing a configuration of a semiconductor test system including a test apparatus for a semiconductor device to which a Peltier element according to a first embodiment is applied; [Figure 10] 1 is a diagram showing a configuration of a semiconductor test system including a test apparatus for a semiconductor device to which a Peltier element according to a first embodiment is applied; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023] The above-mentioned objects, features and advantages will be described in detail below with reference to the accompanying drawings, so that those skilled in the art to which the present specification pertains can easily implement the embodiments of the present specification. In describing the present specification, if a detailed description of a known technology related to the present specification is deemed to obscure the gist of the present specification, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present specification will be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings indicate the same or similar components.

[0024] FIG. 1 is a perspective view of a semiconductor device testing apparatus according to an embodiment, and FIG. 2 is an exploded perspective view of the semiconductor device testing apparatus shown in FIG.

[0025] The semiconductor device testing apparatus (A) according to one embodiment comes into contact with a test target device 4 (eg, a semiconductor device) mounted on a holder 3, and applies heat to the test target device 4 or freezes the test target device 4.

[0026] The test target devices 4 are placed on the tray 2 while being mounted on the holder 3. The holder 3 may have a hole formed therethrough so that the test target devices 4 are exposed to the outside. The tray 2, while being loaded on the loading plate 1, can be transported to the bottom of a handler (not shown) for testing.

[0027] A handler (not shown) may be disposed above the tray 2 on which the test target devices 4 are mounted. The handler (not shown) descends to test the test target devices 4, and a portion of a pusher module 600 of a semiconductor device test device (A) is inserted into a hole in the holder 3, causing the pusher module 600 to come into contact with the test target devices 4.

[0028] The semiconductor device testing device (A) according to one embodiment may include an upper housing 100 and a lower housing 200 that form the exterior, a thermoelectric element module 500 that is accommodated inside the upper housing and the lower housing and has both sides that are converted into a heating surface or a cooling surface according to the direction of current, a cooling module 400 that is accommodated inside the upper housing 100 and the lower housing 200 and is disposed on the top of the thermoelectric element module 500 to cool the thermoelectric element, and a pusher module 600 that is disposed on the bottom of the thermoelectric element module 500 and comes into contact with the test semiconductor device.

[0029] The upper housing 100 has a box shape with an open bottom. A lower housing 200 may be coupled to the bottom of the upper housing 100, and an elastic member 300, a cooling module 400, and a thermoelectric element module 500 may be housed therein.

[0030] An insertion space 110 into which the cooling module 400 is inserted is formed inside the upper housing 100. In addition, an opening 130 is formed on one side of the upper housing 100 to expose a portion of the cooling module 400 to the outside.

[0031] The insertion space 110 accommodates the elastic member 300 and the cooling module 400. The insertion space 110 is formed inside the upper housing 100 and concave toward the upper side. The insertion space 110 may have a shape corresponding to the shape of the cooling module 400. The cooling module 400 may be accommodated in the insertion space 110 with the elastic member 300 inserted therein.

[0032] The opening 130 is formed on one side of the upper housing 100. A portion of the cooling module 400 may be exposed to the outside of the upper housing 100 through the opening 130.

[0033] The elastic member 300 has a shape that protrudes convexly in one direction. For example, the elastic member 300 may be a leaf spring that protrudes in one direction. When the elastic member 300 is inserted into the insertion space 110, the protruding portion is disposed so as to face the cooling module 400. The elastic member 300 presses the cooling module 400 so that the cooling module 400 and the thermoelectric element module 500 are in close contact with each other. For this reason, the protruding portion of the elastic member 300 may be disposed so as to face the cooling module 400. When the cooling module 400 is attached, if the elastic member 300 is pressed by the cooling module 400, the protruding portion spreads under pressure. However, since the elastic member 300 has a restoring force that tries to return to its original shape, the restoring force acts toward the cooling module 400. Therefore, the elastic member 300 presses the cooling module 400 in the direction of the thermoelectric element module 500. This has the effect of closely bonding the cooling module 400 and the thermoelectric element module 500.

[0034] The elastic member 300 bonds the cooling module 400 and the thermoelectric element module 500 in close contact with each other. In addition, even if the thermoelectric element module 500 or the pusher module 600 heats and thermal expansion occurs, and the thermoelectric element module 500 is pressed or moved, the cooling module 400 can be pressed toward the thermoelectric element module 500, and the close contact state can be maintained. That is, the elastic member 300 can close the cooling module 400 and the thermoelectric element module 500 even if thermal expansion occurs in the thermoelectric element module 500 or the pusher module 600. Therefore, the elastic member 300 can be designed to have an elastic restoring force greater than the thermal expansion of the thermoelectric element module 500 or the pusher module 600.

[0035] The lower housing 200 is coupled to the lower side of the upper housing 100 and has a hexahedral shape with an open top. An accommodation space is formed inside the lower housing 200, and the thermoelectric element module 500 and a part of the pusher module 600 are accommodated therein.

[0036] An accommodating portion 210 having a shape corresponding to the shape of a pusher base 612 of a pusher module 600 described later is formed inside lower housing 200. A through hole 230 is formed on the bottom surface of accommodating portion 210 so that a part of pusher module 600 can be inserted and protrude outward. Through hole 230 is formed penetrating the center of the bottom surface of lower housing 200. The shape of through hole 230 corresponds to the shape of a connector 616 of pusher module 600 described later.

[0037] An opening 250 is formed on one side of the lower housing 200. The temperature sensor 701 can be exposed to the outside through the opening 250.

[0038] A plurality of grooves or holes 270 may be formed on the upper side of the side surface of the lower housing 200, facing the upper housing 100. Fastening members can be inserted into the plurality of grooves or holes 270, respectively, to connect the lower housing 200 to the upper housing 100. For example, a ball plunger can be used as the fastening member.

[0039] The upper housing 100 and the lower housing 200 may be made of a plastic or resin material having a high melting point. The upper housing 100 and the lower housing 200 are preferably made of a material that does not deform or melt at the temperature of the heating surface of the thermoelectric element module 500. For example, the upper housing 100 and the lower housing 200 may be made of a PEEK material. The upper housing 100 and the lower housing 200 may also be made by an injection molding method.

[0040] The thermoelectric element module 500 may include one or more Peltier elements. The thermoelectric element module 500 has two sides, a top side and a bottom side, which are converted into a heating side or a cooling side according to the direction of the electric current.

[0041] A temperature sensor may be disposed in at least one of the pusher module 600, the thermoelectric element module 500, or the cooling module 400. In one example, the temperature sensor 700 may be disposed on one side of the pusher module 600. In another example, a temperature sensor may be disposed on one side of the lower surface of the thermoelectric element module 500 or one side of the upper surface of the thermoelectric element module 500.

[0042] The cooling module 400 may be divided into a portion that is accommodated in the insertion space 110 of the upper housing 100 and a portion that protrudes to the outside. However, the accommodated portion and the protruding portion are not necessarily separate, and a portion of the cooling module 400 may protrude to the outside of the upper housing 100.

[0043] The upper layer 410 includes a cooling portion 410a having a shape corresponding to the shape of the thermoelectric element 500, and a pair of protrusions 410b formed by protruding from both ends of the cooling portion 410a by a predetermined width. The cooling portion 410a and the protrusions 410b of the upper layer 410 are integrally formed. A refrigerant can flow into the cooling module 400 through the protrusions 410b on one side of the cooling portion 410a and can be discharged through the protrusions on the other side.

[0044] The lower layer 430 includes a cooling portion 430a and a protruding portion 430b, similar to the upper layer 410. The cooling portion 430a is a portion that cools the thermoelectric element 500, and the protruding portion 430b is a portion that covers the protruding portion 410b of the upper layer 410. The protruding portion 430b is combined with the protruding portion 410b of the upper layer 410 and is exposed to the outside of the upper housing 100. The cooling portion 430a is located below the cooling portion 410a of the upper layer 410, and the protruding portion 430b is located below the protruding portion 410b of the upper layer 410. A refrigerant may be accommodated inside the upper layer 410 by combining the upper layer 410 and the lower layer 430.

[0045] A sensor mounting part 415 is formed on the upper surface of the cooling module 400. The bimetal sensor 900 is accommodated in the sensor mounting part 415. The bimetal sensor 900 contracts or expands depending on the temperature of the upper surface of the cooling module 400. The bimetal sensor 900 is electrically connected to the power supply module. When the bimetal sensor 900 contracts, the electrical connection with the power supply module is shorted, and when the bimetal sensor 900 is expanded, it can be electrically connected to the power supply module.

[0046] A pair of flow paths 6 for inflowing refrigerant into the cooling module 400 or for outflowing the refrigerant from the inside of the cooling module 400 to the outside are connected to one side of the cooling module 400, and a connecting member 5 for connecting each flow path 6 to the cooling module 400.

[0047] The pusher module 600 may include a first plate 612 that is in surface contact with the thermoelectric element module 500, a second plate 614 that is disposed below the first plate 612, and a connector 616 that is disposed below the second plate 614. The size of the first plate 612 may be larger than the size of the second plate 614, and the size of the second plate 614 may be larger than the size of the connector 616. The pusher module 600 is preferably made of a material with high thermal conductivity so that hot or cold air from the thermoelectric element module 500 can be transferred to the device under test 4. For example, the first plate 612, the second plate 614, and the connector 616 may be made of an aluminum material.

[0048] The first plate 612 is in contact with the thermoelectric element module 500 and supports the thermoelectric element module 500. The second plate 614 is disposed below the first plate 612 and transfers hot or cold air from the first plate 612 to the connector 616. The second plate 614 may be omitted depending on the embodiment.

[0049] The connector 616 may be connected to the bottom of the second plate 614 and coupled to the pusher 630. The connector 616 transmits hot or cold air from the second plate 614 to the device under test 4.

[0050] Therefore, the connector 616 must be in direct contact with the device under test 4. For this reason, the connector 616 is exposed to the outside through an opening formed in the lower surface of the lower housing 200. The connector 616 may also be coupled to a pusher 630, and the pusher 630 may be inserted into the holder 3 of the device under test 4, thereby contacting the device under test 4. The lower surface of the connector 616 is exposed to the outside through an opening formed in the lower surface of the pusher 630.

[0051] The pusher 630 is coupled to the connector 616 to protect the connector 616 exposed to the outside of the lower housing 200. Therefore, the pusher 630 has a shape corresponding to the shape of the connector 616.

[0052] The pusher 630 can be inserted into the holder 3 on which the device under test 4 is mounted, and pressurize the holder 3. When the pusher 630 is coupled to the holder 3, the lower surface of the connector 616 exposed to the outside through the lower surface of the pusher 630 can come into contact with the device under test 4. Hot or cold air emitted by the thermoelectric element module 500 can be transferred to the device under test 4 through the connector 616.

[0053] FIG. 3 is a vertical sectional view of the Peltier element according to the first embodiment.

[0054] In the first embodiment, the thermoelectric element module 500 includes a first Peltier element 511 , an adapter 513 , and second Peltier elements 512 and 520 .

[0055] The first Peltier element 511 includes a first upper substrate 514, a first lower substrate 515, a number of first semiconductor elements 511a, a number of second semiconductor elements 511b, and a number of metal plates 511c.

[0056] The first upper substrate 514 transfers hot or cold air in an upward direction. The first lower substrate 515 transfers hot or cold air in a downward direction. The first upper substrate 514 and the first lower substrate 515 may be made of a material (e.g., ceramic) having high thermal conductivity to facilitate the transfer of hot or cold air.

[0057] A number of first semiconductor elements 511a and a number of second semiconductor elements 511b are alternately arranged between the first upper substrate 514 and the first lower substrate 515. The first semiconductor elements 511a may be n-type (or p-type) semiconductors, and the second semiconductor elements 511b may be p-type (or n-type) semiconductors.

[0058] A metal plate 511c is attached to the top or bottom surface of each of the first and second semiconductor elements 511a and 511b. When a current is supplied to the first and second semiconductor elements 511a and 511b through the metal plate 511c, the temperature of the top surfaces of the first and second semiconductor elements 511a and 511b increases (or decreases) and the temperature of the bottom surfaces of the first and second semiconductor elements 511a and 511b decreases (or increases) due to the Peltier effect.

[0059] The second Peltier elements 512 and 520 are Peltier elements having a two-layer structure and include a second upper substrate 516, an intermediate substrate 517, a second lower substrate 521, a number of first semiconductor elements 512a, a number of second semiconductor elements 512b, a number of third semiconductor elements 520a, a number of fourth semiconductor elements 520b, and a number of metal plates 512c and 520c.

[0060] The second upper substrate 516 transfers hot or cold air in an upward direction. The second lower substrate 521 transfers hot or cold air in a downward direction. When the temperature of the second upper substrate 516 rises (falls), the temperature of the lower surface of the middle substrate 517 falls (rises), and when the temperature of the second lower substrate 521 rises (falls), the temperature of the upper surface of the middle substrate 517 falls (rises). The second upper substrate 516, the middle substrate 517, and the second lower substrate 521 may each be made of a material (e.g., ceramic) having high thermal conductivity to easily transfer hot or cold air.

[0061] A number of first semiconductor elements 512a and a number of second semiconductor elements 512b are alternately arranged between the second upper substrate 516 and the intermediate substrate 517. The first semiconductor elements 512a may be n-type (or p-type) semiconductors, and the second semiconductor elements 512b may be p-type (or n-type) semiconductors.

[0062] A metal plate 512c is attached to the top or bottom surface of each of the first and second semiconductor devices 512a and 512b. When a current is supplied to the first and second semiconductor devices 512a and 512b through the metal plate 512c, the temperature of the top surfaces of the first and second semiconductor devices 512a and 512b increases (or decreases) and the temperature of the bottom surfaces of the first and second semiconductor devices 512a and 512b decreases (or increases) due to the Peltier effect.

[0063] A number of third semiconductor elements 520a and a number of fourth semiconductor elements 520b are alternately arranged between the intermediate substrate 517 and the second lower substrate 521. The third semiconductor element 520a may be an n-type (or p-type) semiconductor, and the fourth semiconductor element 520b may be a p-type (or n-type) semiconductor.

[0064] A metal plate 520c is attached to the top or bottom surface of each of the third and fourth semiconductor devices 520a and 520b. When a current is supplied to the third and fourth semiconductor devices 520a and 520b through the metal plate 520c, the temperature of the top surfaces of the third and fourth semiconductor devices 520a and 520b increases (or decreases) and the temperature of the bottom surfaces of the third and fourth semiconductor devices 520a and 520b decreases (or increases) due to the Peltier effect.

[0065] The adapter 513 is disposed between the first Peltier element 511 and the second Peltier elements 512 and 520. The adapter 513 transfers hot or cold air from a lower surface of the first Peltier element 511 to upper surfaces of the second Peltier elements 512 and 520. The adapter 513 may be manufactured from a material (e.g., metal) having high thermal conductivity.

[0066] A pair of conductors 518a, 518b are connected to the metal plate 511c of the first Peltier element 511. A pair of conductors 519a, 519b are connected to the metal plates 512c, 520c of the second Peltier elements 512, 520. The conductors 518a, 518b and the conductors 519a, 519b are connected to the control module 10, respectively.

[0067] The control module 10 can supply current to the first Peltier element 511 and the second Peltier elements 512, 520 via the conductors 518a, 518b and the conductors 519a, 519b, respectively. Although not shown, the control module 10 may include a power supply module that supplies current to the first Peltier element 511 and the second Peltier elements 512, 520, and a control circuit that controls the direction of the current supplied to the first Peltier element 511 and the second Peltier elements 512, 520 in accordance with a target temperature value.

[0068] In one embodiment, the control circuit can change the direction of the current supplied to the first Peltier element 511 and the second Peltier elements 512, 520 by changing the polarity (+, -) of the power supply module. For example, the control circuit can supply current to the first Peltier element 511 and the second Peltier elements 512, 520 in a first direction, and can also supply current to the first Peltier element 511 and the second Peltier elements 512, 520 in a second direction by reversing the polarity (+, -) of the power supply module. For example, when current is supplied in a first direction, the temperature of the upper surfaces of the Peltier elements 511, 512, and 520, i.e., the upper surface of the second upper substrate 516, may decrease and the temperature of the lower surfaces of the Peltier elements 511, 512, and 520, i.e., the lower surface of the second lower substrate 521, may increase, and when current is supplied in a second direction, the temperature of the upper surfaces of the Peltier elements 511, 512, and 520 may increase and the temperature of the lower surfaces of the Peltier elements 511, 512, and 520 may decrease.

[0069] The control circuit can increase or decrease the temperature of the connector 616 of the pusher module 600, which is in contact with the lower surface of the second Peltier element 512, 520, by increasing or decreasing the temperature of the lower surface of the second Peltier element 512, 520, i.e., the lower surface of the second lower substrate 521.

[0070] In one embodiment, the control circuit may control the temperature of the lower surface of the first Peltier element 511 to rise when the temperature of the lower surface of the second Peltier element 512, 520, i.e., the lower surface of the second lower substrate 521, rises, and control the temperature of the lower surface of the first Peltier element 511 to fall when the temperature of the lower surface of the second Peltier element 512, 520 falls. When the temperature of the lower surface of the second Peltier element 512, 520 rises (falls), the temperature of the upper surface of the second Peltier element 512, 520, i.e., the upper surface of the second upper substrate 516, falls (rises). In this case, when the temperature of the lower surface of the first Peltier element 511 is raised (lowered), the temperature of the upper surface of the second Peltier element 512, 520 rises (falls).

[0071] In this way, when the temperature of the lower surface of the second Peltier element 512, 520, i.e., the lower surface of the second lower substrate 521, rises (falls), if the first Peltier element 511 is used to raise (fall) the temperature of the upper surface of the second Peltier element 512, 520, i.e., the upper surface of the second upper substrate 516, the temperature control range (minimum and maximum temperatures) of the lower surface of the second Peltier element 512 becomes wider than the temperature control range inherent to the second Peltier element 512, 520, making it possible to test the element to be tested over a wider temperature range.

[0072] FIG. 4 is a vertical sectional view of a Peltier element according to the second embodiment.

[0073] In the second embodiment, the thermoelectric element module 500 is a Peltier element having a two-layer structure. The thermoelectric element module 500 includes an upper substrate 524, a middle substrate 525, a lower substrate 526, a number of first semiconductor elements 522a, a number of second semiconductor elements 522b, a number of metal plates 522c, a number of third semiconductor elements 523a, a number of fourth semiconductor elements 523b, and a number of metal plates 523b.

[0074] The upper substrate 524 transfers hot or cold air in an upward direction. The lower substrate 526 transfers hot or cold air in a downward direction. When the temperature of the upper substrate 524 rises (falls), the temperature of the lower surface of the middle substrate 525 falls (rises), and when the temperature of the lower substrate 526 rises (falls), the temperature of the upper surface of the middle substrate 525 falls (rises). The upper substrate 524, the middle substrate 525, and the lower substrate 526 may each be made of a material (e.g., ceramic) having high thermal conductivity to facilitate the transfer of hot or cold air.

[0075] A number of first semiconductor elements 522a and a number of second semiconductor elements 522b are alternately arranged between the upper substrate 524 and the intermediate substrate 525. The first semiconductor elements 522a may be n-type (or p-type) semiconductors, and the second semiconductor elements 522b may be p-type (or n-type) semiconductors. Hereinafter, the layer consisting of the upper substrate 524 and the intermediate substrate 525 will be referred to as the upper layer.

[0076] A metal plate 522c is attached to the top or bottom surface of each of the first and second semiconductor devices 522a and 522b. When a current is supplied to the first and second semiconductor devices 522a and 522b through the metal plate 522c, the temperature of the top surfaces of the first and second semiconductor devices 522a and 522b increases (or decreases) and the temperature of the bottom surfaces of the first and second semiconductor devices 522a and 522b decreases (or increases) due to the Peltier effect.

[0077] In addition, a number of third semiconductor elements 523a and a number of fourth semiconductor elements 523b are alternately arranged between the intermediate substrate 525 and the lower substrate 526. The third semiconductor element 523a may be an n-type (or p-type) semiconductor, and the fourth semiconductor element 523b may be a p-type (or n-type) semiconductor. Hereinafter, the layer consisting of the intermediate substrate 525 and the lower substrate 526 will be referred to as a lower layer.

[0078] A metal plate 523c is attached to the top or bottom surface of each of the third and fourth semiconductor elements 523a and 523b. When a current is supplied to the third and fourth semiconductor elements 523a and 523b through the metal plate 523c, the temperature of the top surfaces of the third and fourth semiconductor elements 523a and 523b increases (or decreases) and the temperature of the bottom surfaces of the third and fourth semiconductor elements 523a and 523b decreases (or increases) due to the Peltier effect.

[0079] A pair of conductors 528a, 528b are connected to the metal plates 522c, 523c. The control module 10 can supply current to the first semiconductor element 522a, the second semiconductor element 522b, the third semiconductor element 523a, and the fourth semiconductor element 523b through the conductors 528a, 528b. Although not shown, the control module 10 may include a power supply module that supplies current to the first semiconductor element 522a, the second semiconductor element 522b, the third semiconductor element 523a, and the fourth semiconductor element 523b, and a control circuit that controls the direction of the current supplied to the first semiconductor element 522a, the second semiconductor element 522b, the third semiconductor element 523a, and the fourth semiconductor element 523b according to a target temperature value.

[0080] In the second embodiment, the lower layer is used for temperature control to test electrical characteristics of the device under test, and therefore preferably has a relatively large temperature control range. Also, the upper layer may have a relatively small temperature control range, since it is used for adjusting the temperature of the upper surface of the lower layer, i.e., the middle substrate 525. The smaller the size of the semiconductor device disposed between the upper substrate and the lower substrate of the Peltier device, the larger the temperature control range of the lower substrate. Thus, in one embodiment, the size of the first semiconductor device 522a and the second semiconductor device 522b may be set to be larger than the size of the third semiconductor device 523a and the fourth semiconductor device 523b.

[0081] A temperature sensor 530 may be disposed on one side of the intermediate substrate 525 or inside the intermediate substrate 525. A pair of conductors 531a and 531b are connected to the temperature sensor 530. The conductors 531a and 531b are connected to the control module 10. The control module 10 can obtain the temperature value of the intermediate substrate 525 measured by the temperature sensor 530 via the conductors 531a and 531b.

[0082] The control circuitry can increase or decrease the temperature of the lower substrate 526 , thereby increasing or decreasing the temperature of the connector 616 of the pusher module 600 that contacts the lower substrate 526 .

[0083] In one embodiment, the control circuit may control the temperature of the upper substrate 524 to decrease when the temperature of the lower substrate 526 increases, and control the temperature of the upper substrate 524 to increase when the temperature of the lower substrate 526 decreases. When the temperature of the lower substrate 526 increases (decreases), the temperature of the lower surface of the middle substrate 525 decreases (increases). Also, when the temperature of the upper substrate 524 decreases (increases), the temperature of the lower surface of the middle substrate 525 increases (decreases).

[0084] In this way, when the temperature of the lower surface of the lower layer rises (falls), using the upper layer to raise (fall) the temperature of the intermediate substrate 525 makes the temperature control range (minimum and maximum temperatures) of the lower substrate 526 wider than the temperature control range specific to the lower layer, thereby enabling testing of the device under test over a wider temperature range.

[0085] Thermoelectric element module 500 according to the first embodiment shown in Fig. 3 includes five boards 514, 515, 516, 517, and 521 and an adapter 513. However, thermoelectric element module 500 according to the second embodiment shown in Fig. 4 includes three boards 524, 525, and 526. Therefore, the height (D1) of the semiconductor device test apparatus including thermoelectric element module 500 according to the second embodiment is smaller than the height (D2) of the semiconductor device test apparatus including thermoelectric element module 500 according to the first embodiment. According to the second embodiment, since more semiconductor device test apparatuses can be arranged in the same amount of space, the manufacturing speed of semiconductor devices can be improved and the manufacturing costs can be reduced.

[0086] FIG. 5 is a perspective view of a semiconductor element disposed inside a Peltier element according to one embodiment, and FIG. 6 is a graph showing a change in the cooling temperature value of the Peltier element depending on a change in height of a semiconductor element disposed inside a Peltier element according to one embodiment.

[0087] 5 shows the shape and numerical value of the first semiconductor element 522a included in the thermoelectric element module 500. However, the semiconductor elements 522b, 523a, and 523b shown in FIG. 4 may also have the same shape and numerical ratio as the first semiconductor element 522a shown in FIG.

[0088] 5, the first semiconductor element 522a has a hexahedral shape with a height H. The top and bottom surfaces of the first semiconductor element 522a may have a square shape with each side having a length W.

[0089] 6 shows a graph showing the temperature change of the upper layer when the height (H) of the first semiconductor element 522a shown in FIG. 5 is changed from 0.5 to 1.5 mm while the length (W) of each side of the upper surface (or lower surface) of the first semiconductor element 522a shown in FIG. 5 is fixed at 1 mm, and the same amount of current is supplied to the upper layer via the control module so that the temperature of the upper substrate 524 decreases. The data values ​​of the graph shown in FIG. 6 are as shown in Table 1.

[0090] [Table 1]

[0091] When controlling the temperature of the upper substrate 524 to decrease (increase) through the control module, the lower (higher) the temperature of the upper substrate 524, the higher (lower) the temperature of the upper surface of the intermediate substrate 525 can be, and the higher (lower) the temperature of the upper surface of the intermediate substrate 525, the more advantageous it is for the upper layer to regulate the temperature of the lower layer.

[0092] Similarly, when controlling the temperature of the lower substrate 526 to decrease (increase) via the control module, the lower (higher) the temperature of the lower surface of the intermediate substrate 525, the higher (lower) the temperature of the lower substrate 526 can be, and the higher (lower) the temperature of the lower substrate 526, the wider the temperature range in which the device under test can be tested.

[0093] When the temperature of the upper layer in the data shown in Table 1 is maintained in the minimum range (below -37°C), the height (H) of the first semiconductor element 522a is expressed as 1 to 1.4. Therefore, it is preferable that the ratio of the length (W) of each side of the upper surface (or lower surface) of the first semiconductor element 522a and the other semiconductor elements 522b, 523a, and 523b shown in Fig. 4 to the height (H) is set within the range of 1:1 to 1:1.4.

[0094] In this way, when the ratio of the length (W) and height (H) of each side of the upper surface (or lower surface) of the semiconductor elements 522b, 523a, 523b included in the thermoelectric element module 500 having the structure shown in Fig. 4 is set within a range of 1:1 to 1:1.4, the temperature control range of the lower surface of the thermoelectric element module 500 can be further expanded. Thus, although the thermoelectric element module 500 having the structure shown in Fig. 4 does not include one Peltier element 511 and adapter 513 compared to the thermoelectric element module 500 having the structure shown in Fig. 3, it has been confirmed that the temperature control range of the lower surface of the thermoelectric element module 500 having the structure shown in Fig. 4 is similar to or wider than the temperature control range of the lower surface of the thermoelectric element module 500 having the structure shown in Fig. 3.

[0095] In addition, compared to the thermoelectric element module 500 having the structure shown in FIG. 3, the thermoelectric element module 500 having the structure shown in FIG. 4 does not include one Peltier element 511, and therefore has the advantage that the power consumption of the thermoelectric element module 500 having the structure shown in FIG. 4 is lower than the power consumption of the thermoelectric element module 500 having the structure shown in FIG. 3.

[0096] FIG. 7 is a graph showing changes in the temperature values ​​of the connector and the intermediate board due to temperature control of a semiconductor device test apparatus including a Peltier element according to an embodiment.

[0097] In one embodiment, the control module 10 controls the operation of the thermoelectric element module 500 according to a target temperature value. Here, the target temperature value means the temperature value of the connector 616 that the control module 10 is to change. Data 702 of the target temperature value is shown in FIG.

[0098] In one embodiment, the control module 10 may obtain the temperature value of the connector 616 through a temperature sensor 700 disposed on one side of the pusher module 600. However, in other embodiments, the control module 10 may use a temperature value obtained through a temperature sensor disposed on the lower surface of the thermoelectric element module 500, the connector 616, or one side of the pusher 630 as the temperature value of the connector 616. Temperature value data 704 of the connector 616 is shown in FIG.

[0099] In one embodiment, the control module 10 can obtain the temperature value of the intermediate substrate 525 through a temperature sensor 530 disposed on one side of the intermediate substrate 525 or inside the intermediate substrate 525. In FIG. 7, data 706 of the temperature value of the intermediate substrate 525 is shown.

[0100] 7, at time 0, the control module 10 sets the target temperature value 702 of the connector 616 to -20°C, and supplies a current to the thermoelectric element module 500 so as to lower the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the 0 to T1 section drops to -20°C.

[0101] Furthermore, at time T1, the control module 10 sets the target temperature value 702 of the connector 616 to -40°C, and supplies a current to the thermoelectric element module 500 so as to lower the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T1 to T2 drops to -40°C.

[0102] In the section from 0 to T2 in which the temperature of the lower substrate 526 is controlled to decrease, the temperature of the middle substrate 525 is maintained at a value between 0°C and -20°C.

[0103] At time T2, the control module 10 sets the target temperature value 702 of the connector 616 to 40°C, and supplies a current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T2 to T3 increases to 40°C.

[0104] However, at time T2, when the control module 10 supplies current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526, the temperature value of the middle substrate 525 rises rapidly and exceeds a predetermined limit temperature value (e.g., 120°C). For example, the temperature value of the middle substrate 525 is maintained at 140°C for a certain period of time, and then gradually decreases to about 60°C.

[0105] The limit temperature value is a temperature value at which the intermediate substrate 525 may be damaged or destroyed, and may be set differently depending on the material properties of the intermediate substrate 525 .

[0106] Furthermore, at time T3, the control module 10 sets the target temperature value 702 of the connector 616 to 80°C, and supplies a current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T3 to T4 increases to 80°C.

[0107] However, at time T3, when the control module 10 supplies current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526, the temperature value of the middle substrate 525 rises rapidly and exceeds a predetermined limit temperature value (e.g., 120°C). For example, the temperature value of the middle substrate 525 is maintained at 140°C for a certain period of time, and then gradually decreases to about 80°C.

[0108] Furthermore, at time T4, the control module 10 sets the target temperature value 702 of the connector 616 to 120°C, and supplies a current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T4 to T5 increases to 120°C.

[0109] However, at time T4, when the control module 10 supplies current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526, the temperature value of the middle substrate 525 rises rapidly and exceeds a predetermined limit temperature value (e.g., 120°C). For example, the temperature value of the middle substrate 525 is maintained at 140°C for a certain period of time and then gradually decreases to about 100°C.

[0110] At time T5, the control module 10 sets the target temperature value 702 of the connector 616 to 0° C. and supplies a current to the thermoelectric element module 500 so that the temperature of the lower substrate 526 drops. As a result, after time T5, the temperature value 704 of the connector 616 drops to 0° C. Also, after time T5, the temperature value of the middle substrate 525 drops to 0° C.

[0111] 7, the control module 10 supplies a current to the thermoelectric element module 500 so that the temperature of the lower substrate 526 rises, and at times (T2, T3, T4) when the temperature of the lower substrate 526 starts to rise, the temperature value of the intermediate substrate 525 rises suddenly and exceeds a predetermined limit temperature value. If this phenomenon in which the temperature value of the intermediate substrate 525 rises suddenly and exceeds the predetermined limit temperature value occurs repeatedly, there is a high possibility that the intermediate substrate 525 or other parts or elements in contact with the intermediate substrate 525 will be damaged by the high temperature.

[0112] 8 is a graph showing changes in the temperature value of the connector and the temperature value of the intermediate substrate due to temperature control of a test apparatus for a semiconductor device including a Peltier element according to another embodiment. In FIG. 8, target temperature data 802, temperature data 804 of the connector 616, and temperature data 806 of the intermediate substrate 525 are shown.

[0113] 8, the control module 10 sets the target temperature value 702 of the connector 616 to -20°C at time 0, and supplies a current to the thermoelectric element module 500 so as to lower the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the 0 to T1 section drops to -20°C.

[0114] Furthermore, at time T1, the control module 10 sets the target temperature value 702 of the connector 616 to -40°C, and supplies a current to the thermoelectric element module 500 so as to lower the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T1 to T2 drops to -40°C.

[0115] The temperature value of the middle substrate 525 in the section 0 to T2, in which the temperature of the lower substrate 526 is controlled to decrease, is maintained at a value between 0°C and -20°C.

[0116] The control module 10 sets the final target temperature value of the connector 616 to 40°C in the section T2 to T10.

[0117] At time T2, the control module 10 sets the intermediate rise target temperature value 702 of the connector 616 to 0° C., and supplies a current to the thermoelectric element module 500 so as to raise the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the period from T2 to T3 rises.

[0118] In the period from T2 to T3, the control module 10 checks whether the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (e.g., 80° C.). The reference temperature value may be set differently depending on the embodiment. Also, the reference temperature value may be set lower than the limit temperature value of the intermediate substrate 525.

[0119] When it is confirmed that the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (e.g., 80°C), at time T3, the control module 10 sets the intermediate drop target temperature value 702 to -20°C and supplies current to the thermoelectric element module 500 so as to drop the temperature of the lower substrate 526. This reduces the rate of increase in the temperature value 704 of the connector 616 in the section from T3 to T4.

[0120] At time T4, when a predetermined time has elapsed since time T3, the control module 10 sets the target temperature value 702 of the intermediate rise of the connector 616 to 10° C., and supplies a current to the thermoelectric element module 500 so as to raise the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T4 to T5 rises.

[0121] In the section from T4 to T5, the control module 10 checks whether the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (for example, 80° C.).

[0122] When it is confirmed that the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (e.g., 80°C), at time T5, the control module 10 sets the intermediate drop target temperature value 702 to -20°C and supplies current to the thermoelectric element module 500 so as to drop the temperature of the lower substrate 526. This reduces the rate of increase in the temperature value 704 of the connector 616 in the section from T5 to T6.

[0123] At time T6, when a predetermined time has elapsed since time T5, the control module 10 sets the target temperature value 702 of the intermediate rise of the connector 616 to 20° C., and supplies a current to the thermoelectric element module 500 so as to raise the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T6 to T7 rises.

[0124] In the section from T6 to T7, the control module 10 checks whether the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (for example, 80° C.).

[0125] When it is confirmed that the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (e.g., 80°C), at time T7, the control module 10 sets the intermediate drop target temperature value 702 to -20°C and supplies current to the thermoelectric element module 500 so as to drop the temperature of the lower substrate 526. This reduces the rate of increase in the temperature value 704 of the connector 616 in the section from T7 to T8.

[0126] At time T8, when a predetermined time has elapsed since time T7, the control module 10 sets the target temperature value 702 of the intermediate rise of the connector 616 to 30° C., and supplies a current to the thermoelectric element module 500 so as to raise the temperature of the lower substrate 526. As a result, the temperature value 704 of the connector 616 in the section from T8 to T9 rises.

[0127] In the section from T8 to T9, the control module 10 checks whether the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (for example, 80° C.).

[0128] When it is confirmed that the temperature value of the middle substrate 525 exceeds a predetermined reference temperature value (e.g., 80°C), at time T9, the control module 10 sets the target temperature value 702 for the middle drop to -20°C and supplies a current to the thermoelectric element module 500 so that the temperature of the lower substrate 526 drops. This reduces the rate of increase in the temperature value 704 of the connector 616 in the section from T9 to T10.

[0129] At time T10, a predetermined time after time T9, the control module 10 sets the intermediate rise target temperature value 702 of the connector 616 to 40° C., which is the final target temperature value, and supplies a current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526. As a result, the temperature value of the connector 616 in the period from T10 to T11 is maintained at 40° C., which is the final target temperature value.

[0130] In a similar manner, the control module 10 sets the final target temperature value of the connector 616 in the period T11 to T17 to 80° C., and can supply current to the thermoelectric element module 500 so that the temperature of the lower substrate 526 increases according to a number of intermediate rising target temperature values ​​(e.g., 50° C., 60° C., 70° C., 80° C.) that are set to gradually increase by a predetermined interval (e.g., 10° C.) for each time point (T11, T13, T15, T17). In addition, when it is confirmed that the temperature value of the intermediate substrate 525 exceeds a predetermined reference temperature value (e.g., 80° C.), the control module 10 can supply current to the thermoelectric element module 500 so that the temperature of the lower substrate 526 decreases according to an intermediate decreasing target temperature value (e.g., 20° C.) that is preset for each time point (T12, T14, T16).

[0131] In one embodiment, the interval (eg, 10° C.) between the intermediate rise target temperature values ​​may be set differently depending on the embodiment.

[0132] Also, the target temperature value of the intermediate drop does not need to be set to the same value at each time point, and the target temperature value of the intermediate drop can be set differently at each time point.

[0133] As described above, when the control module 10 increases the temperature of the lower substrate 526 to a preset final target temperature value, the control module 10 adjusts the temperature of the lower substrate 526 based on a preset intermediate rise target temperature value and a preset intermediate fall target temperature value. According to this control, when the control module 10 supplies a current to the thermoelectric element module 500 so as to increase the temperature of the lower substrate 526, the temperature value of the intermediate substrate 525 is prevented from rapidly increasing and exceeding the limit temperature value. Therefore, the intermediate substrate 525 or other parts or elements in contact with the intermediate substrate 525 are less likely to be damaged by high temperature, and the reliability of the semiconductor device test equipment is improved.

[0134] FIG. 9 shows the configuration of a semiconductor test system including a test apparatus for a semiconductor device to which a Peltier element according to the first embodiment is applied, and FIG. 10 shows the configuration of a semiconductor test system including a test apparatus for a semiconductor device to which a Peltier element according to the first embodiment is applied.

[0135] 9 shows semiconductor device test apparatuses 901, 902 including the thermoelectric element module 500 according to the first embodiment shown in FIG 3, control modules 903, 904 connected to the semiconductor device test apparatuses 901, 902, and a case 9 accommodating the control modules 903, 904. FIG 10 shows semiconductor device test apparatuses 911, 912, 913, 914 including the thermoelectric element module 500 according to the second embodiment shown in FIG 4, control modules 915, 916, 917, 918 connected to the semiconductor device test apparatuses 911, 912, 913, 914, and a case 900 accommodating the control modules 915, 916, 917, 918. The case 900 shown in FIG 9 and the case 900 shown in FIG 10 are the same in volume and size.

[0136] 9, the thermoelectric element module 500 according to the first embodiment includes two Peltier elements, and therefore requires two pairs of wires to be connected to each Peltier element, and therefore the control modules 903 and 904 must each be connected to two pairs of wires.

[0137] However, as shown in Fig. 10, the thermoelectric element module 500 according to the second embodiment includes one Peltier element and requires a pair of wires connected to each Peltier element, and thus the size of the control modules 915, 916, 917, and 918 shown in Fig. 10 is smaller than the size of the control modules 903 and 904 shown in Fig. 9.

[0138] 10, when the thermoelectric element module 500 according to the second embodiment is applied, more control modules can be accommodated in a case 900 having the same size and volume as in the first embodiment. Therefore, more semiconductor device test devices can be arranged in the same space, which can increase the manufacturing speed of the semiconductor devices and reduce the manufacturing cost.

[0139] As described above, the present specification has been described with reference to the illustrative drawings, but the present specification is not limited to the embodiments and drawings disclosed in the present specification, and various modifications may be made by those skilled in the art. Furthermore, even if the effects of the configurations of the present specification are not explicitly described and explained while the embodiments of the present specification are described above, the effects that can be predicted by the configurations should also be recognized.

Claims

1. A thermoelectric module having two sides that can be converted into a heating surface or a cooling surface according to the direction of current flow; a cooling module disposed on the upper portion of the thermoelectric element module to cool the thermoelectric element; a pusher module disposed under the thermoelectric element module and in contact with a test target element mounted on a holder to heat or cool the test target element; a control module for controlling a direction of a current supplied to the thermoelectric element module in response to a target temperature value; Including, The thermoelectric element module includes: an upper substrate in contact with the cooling module; a lower substrate in contact with the pusher module; an intermediate substrate disposed between the upper substrate and the lower substrate; a plurality of first semiconductor devices and a plurality of second semiconductor devices disposed between the upper substrate and the intermediate substrate; a plurality of third semiconductor devices and a plurality of fourth semiconductor devices disposed between the intermediate substrate and the lower substrate; Including, a temperature sensor is disposed on one side of the intermediate substrate or inside the intermediate substrate; The control module includes: controlling a direction of a current supplied to the thermoelectric element module in accordance with a temperature value of the intermediate substrate measured by the temperature sensor; Semiconductor device test equipment.

2. The control module includes: and controlling a direction of a current supplied to the thermoelectric element module based on a temperature value of the intermediate substrate, a preset intermediate rise target temperature value, and a preset intermediate fall target temperature value when increasing the temperature of the lower substrate to a preset final target temperature value.

2. A test apparatus for a semiconductor device according to claim 1.

3. The control module includes: and when the temperature value of the intermediate substrate exceeds a predetermined reference temperature value when the temperature of the lower substrate is increased according to the target temperature value of the intermediate rise, a direction of a current supplied to the thermoelectric element module is controlled so that the temperature of the lower substrate is decreased according to the target temperature value of the intermediate fall.

3. The semiconductor device test apparatus according to claim 2.

4. The intermediate rise target temperature value is a number of values ​​set to gradually rise at predetermined intervals.

3. The semiconductor device test apparatus according to claim 2.

5. the reference temperature value is set to be smaller than a limit temperature value of the intermediate substrate; 4. The semiconductor device test apparatus according to claim 3.

6. The first semiconductor chip, the second semiconductor chip, the third semiconductor chip, and the fourth semiconductor chip have a hexahedral shape, and upper and lower surfaces are square.

2. A test apparatus for a semiconductor device according to claim 1.

7. The ratio of the length (W) of each side of the upper surface or the lower surface of the first semiconductor element, the second semiconductor element, the third semiconductor element, and the fourth semiconductor element to the height (H) of the first semiconductor element, the second semiconductor element, the third semiconductor element, and the fourth semiconductor element is set within a range of 1:1 to 1:1.

4.

7. A semiconductor device test apparatus according to claim 6.

Images