Lid carve-out for processor lighting

Abstract

A package lid is described having a carve-out configured to expose lights directly connected to the internal components of the processor. The lid carve-out is configured to precisely align and mechanically secure a cooling device to the package lid by receiving a protrusion of the cooling device via a press-fit connection while maintaining visibility of the lights directly connected to the processor internal components when the cooling device is connected. The lid carve-out is configured to expose one or more connectors disposed on a processor surface that supports the internal components. When contacted by a corresponding connector of an auxiliary device, such as a light not integrated into the processor package or cooling device, the lid carve-out allows for a direct connection between the internal components of the package and the auxiliary device.

Description

[Technical field]

[0001] (Related Applications) This application claims priority to U.S. patent application Ser. No. 17 / 704,862, filed Mar. 25, 2022, entitled "Lid Carveouts for Processor Lighting," the disclosure of which is incorporated herein by reference in its entirety. [Background technology]

[0002] Computer processors are often manufactured to include an integrated heat spreader, commonly referred to as the processor "lid." The lid is typically configured as an enclosure that acts as a protective shell for the processor components (e.g., die). In many implementations, the lid is fabricated from a metal, such as plated copper, to provide a path for heat transfer from the processor components to a heat sink or processor cooling device connected to the lid surface.

[0003] The detailed description will now be described with reference to the accompanying drawings, in which: The entities depicted in the figures may represent one or more entities, and therefore, in the description, reference will be made interchangeably to singular or plural forms of the entities. [Brief description of the drawings]

[0004] [Figure 1] FIG. 1 illustrates an exemplary embodiment of a processor configured with a conventional lid. [Diagram 2] FIG. 1 illustrates an exemplary embodiment of a printed circuit board including a processor and a cooling device in accordance with one or more conventional embodiments. [Diagram 3] FIG. 1 illustrates an example of a processor having a lid that includes a carve-out for processor illumination. [Figure 4] 1 is an exploded view of an exemplary device including a processor substrate, a processor lid having a carve-out, and a processor cooling device. [Diagram 5]FIG. 1 illustrates an example of a processor having a lid that includes a carve-out to expose connections on the processor board. [Figure 6] FIG. 1 illustrates an example of a processor having a lid with a carve-out disposed within an open socket. [Figure 7] FIG. 1 illustrates an example of a processor having a lid with a carve-out secured within a socket. [Figure 8] FIG. 1 is a diagram of a digital media environment in which a processor communicates directly with a light exposed by a lid carve-out. [Figure 9] FIG. 13 is a flow diagram illustrating a procedure in an exemplary embodiment of a processor that communicates directly with a light connected to the processor through a lid carve-out. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0005] (overview) Processors, integrated circuits, and other semiconductor devices are packaged in a manner that protects the internal components (e.g., die) from potentially damaging influences such as contaminants, water damage, light exposure, etc. The processor package additionally connects the internal components to the external environment, such as a printed circuit board (PCB). In some embodiments, the processor is packaged with an integrated heat spreader or "lid" configured as an enclosure that also serves as a pathway for transferring heat away from the internal components.

[0006] For example, processor lids are often configured with a first surface that contacts the internal components and a second surface opposite the first surface that is configured to contact a cooling device such as a heat sink, water cooler block, or the like. Conventional approaches for interfacing a processor lid with a cooling device often rely on a press fit with a thermal compound that secures the processor lid to the heat transfer surface of the cooling device. To increase heat transfer away from the die, the lid is designed to have a large surface area that spans substantially the entirety of the processing device when viewed from above, such that the lid covers all of the die contained on the processing device substrate. Conventional heat sinks or other cooling devices are designed to cover the entirety of these conventional lids with a cooling interface having similar dimensions in an attempt to maximize heat transfer between the thermal heat spreader and the cooling device. As a result, conventional techniques for securing a cooling device to a processor package lid rely on either a thermal adhesive compound that exudes to the edge of the package lid, or mechanical attachment points in the external environment where the package is placed, such as attachment points located on the PCB beyond the perimeter of the package or the perimeter of the socket used to secure the package to the PCB.

[0007] However, such conventional techniques for fastening a cooling device to a package lid have several drawbacks. One such drawback is the physical footprint required to accommodate the mechanical attachment points of such a cooling device, which constrains the PCB to be larger than desired for many applications. Another drawback is that the cooling device visually blocks the processor device when a user is looking at the PCB. Due to this visual blockage, the user is unable to directly observe the processor device and is forced to rely on other sources of information to ascertain the status of the processor device. One example of another source of information is the Basic Input / Output System (BIOS) of the PCB on which the processor device is placed. For example, BIOS beep codes are traditionally used to inform a computing device user of various issues with the computing device. BIOS beep codes are configured to inform a user of various issues such as a card (e.g., video card, graphics card, etc.) not being found or improperly connected, a power rail not working, an inability to find memory, etc. These beep codes provide an audible indication of the detected problem and are particularly useful in scenarios where the computing device is unable to boot for further testing.

[0008] However, the BIOS has only limited visibility into the internal components of a processing device, such as a central processing unit (CPU), and often requires the CPU to be functional in order to perform BIOS problem detection and error reporting. Conversely, the CPU is aware of its own current state and has visibility into the state of computing device components that the BIOS cannot detect. For example, in an embodiment in which the BIOS is corrupted, the BIOS cannot output a beep code and, as a result, cannot inform the computing device user about the BIOS corruption, leaving the user ill-informed as to what problem may be preventing normal computing device operation. As an additional example, the system BIOS cannot detect whether a Dual In-Line Memory Module (DIMM) is plugged into the correct socket, while the CPU can detect such a scenario. As a further example, loose or otherwise improper connections between the CPU and components of the PCB on which the CPU is installed go undetected by the system BIOS. For example, the system BIOS cannot determine whether a peripheral component interconnect express (PCIe) device is improperly connected or incompatible with the CPU. As yet another example, if the BIOS code is incompatible with the CPU version, the CPU can identify such incompatibilities that would otherwise not be detected by the BIOS. As another example, the system BIOS cannot detect and report fault conditions during a previous boot (e.g., conditions that cause internal CPU errors, hangs, hard locks, etc.) that would otherwise be detectable and reportable by the CPU. As yet another drawback of these conventional approaches to inform computing device users of detected problems, system BIOS beep codes are inaccessible to users who are hard of hearing.

[0009] To address these conventional shortcomings, package lids are described having carve-outs configured to expose lights directly connected to internal processor components. As described herein, a carve-out refers to a portion of the package lid's edge that recesses from the lid's outer periphery. When viewed from a top view, each carve-out appears as an indentation in the package lid's edge such that the portion of the lid's edge at the carve-out is positioned closer to the center of the package lid than the portion of the lid's edge that does not include the carve-out. In some embodiments, the lid carve-outs are configured to precisely align and mechanically secure a cooling device to the package lid by receiving a protrusion of the cooling device via a press-fit connection while maintaining visibility of the processor lights when the cooling device is connected. As an example, some lid carve-outs are dimensioned differently than other lid carve-outs such that a cooling device with a similarly dimensioned protrusion can be mechanically attached to the lid in only one orientation.

[0010] In some embodiments, in addition to exposing the processor light, the lid carve-out is configured to expose one or more connectors (e.g., surface mount pads configured for electrical connection) disposed on the package. The connectors are configured to establish electrical connections between the internal components of the package and one or more auxiliary components, such as lights not integrated into the package substrate or cooling devices connected to the package lid. By creating a direct connection between the CPU and the auxiliary components, the lid carve-out allows for a high-speed connection configured to pass information directly between the CPU control circuitry and the auxiliary components (e.g., lights), allowing for direct notification of conditions detected by the CPU from the CPU. Meanwhile, some conventional workarounds rely on incorporating light emitting diodes (LEDs) into the PCB and additional components (e.g., system BIOS, thermocouples monitoring CPU temperature, etc.) wired to the LEDs to visually communicate the occurrence of conditions detected by these additional components. However, these conventional workarounds require slow communication paths and pass-throughs connecting the CPU to the LEDs.

[0011] In contrast to such conventional workarounds, the high speed connections utilized by the package lid carve-outs advantageously avoid the slower communication paths and pass-throughs implemented by conventional processor architectures that cannot indicate conditions detected by the CPU in the event of component failure, breakage, disconnection, etc. Furthermore, in contrast to conventional solutions that occupy an increased footprint of the PCB to support external LEDs and additional components that connect the CPU to the external LEDs, the package lid carve-outs described herein allow internal processor components to visually communicate information within the constraints of the package footprint. As another benefit, the package lid carve-outs described herein expose lights that can be used during debugging or while the processor is under load to visually indicate the current processor condition, which is not utilized by conventional package designs.

[0012] In some examples, the technology described herein relates to a processing device that includes a substrate including at least one processor core and one or more lights connected to the at least one processor core via electrical connections, and an integrated heat spreader bonded to the substrate and covering the at least one processor core, the integrated heat spreader including a plurality of carve-outs exposing at least one of the one or more lights, each of the plurality of carve-outs being disposed along an edge of the integrated heat spreader and recessed from an outer periphery of the integrated heat spreader.

[0013] In some examples, the technology described herein relates to a processing device in which at least one processor core includes one or more of a central processing unit, a graphics processing unit, or a parallel acceleration processor.

[0014] In some examples, the technology described herein relates to a processing device in which at least one processor core includes a system management component configured to manage power consumption by the at least one processor core and to output a visual indication regarding the power consumption via one or more lights.

[0015] In some examples, the technology described herein relates to a processing device in which at least one processor core includes a system management component configured to monitor a temperature of the at least one processor core and output a visual indication regarding the temperature via one or more lights.

[0016] In some examples, the technology described herein relates to a processing device including a system management component configured such that at least one processor core monitors whether one or more memory modules are properly connected to the at least one processor core and outputs a visual indication as to whether the one or more memory modules are properly connected via one or more lights.

[0017] In some examples, the technology described herein relates to a processing device in which at least one processor core includes a system management component configured to determine compatibility of peripheral component interconnect express devices connected to the processing device and to output a visual indication regarding the compatibility via one or more lights.

[0018] In some examples, the technology described herein relates to a processing device where the at least one processor core includes a plurality of processor cores, where each of the one or more lights includes a plurality of lights corresponding to one of the plurality of processor cores, and where at least one of the plurality of processor cores includes a system management component configured to visually indicate a state of the plurality of processor cores using the plurality of lights during operation of the processing device.

[0019] In some examples, the technology described herein relates to a processing device configured with multiple carve-outs to enable a press-fit connection between a cooling device and an integrated heat spreader and to maintain visibility of one or more lights when the cooling device is connected to the integrated heat spreader.

[0020] In some examples, the technology described herein relates to a processing device in which an integrated heat spreader includes a first surface configured to contact at least one processor core and a second surface disposed opposite the first surface and configured to transfer heat away from the at least one processor core by contacting a cooling device.

[0021] In some examples, the technology described herein relates to a processing device where at least one of the multiple carve-outs includes an additional surface oriented approximately perpendicular to the first surface and the second surface, the additional surface configured to mechanically align the integral heat spreader with a protrusion of a cooling device and transfer heat to the protrusion of the cooling device.

[0022] In some examples, the techniques described herein relate to a processing device in which at least one processor core is configured to detect an upcoming execution of an operation and visually indicate the upcoming execution of the operation via one or more lights prior to execution of the operation.

[0023] In some examples, the techniques described herein relate to a method that includes determining, by a processor, the occurrence of a condition in the processor, and outputting, by the processor, a light code indicating the occurrence of the condition via one or more lights connected to and attached to a substrate supporting the internal components of the processor and visibly exposed by at least one carve-out of a lid covering the internal components of the processor.

[0024] In some examples, the technology described herein relates to methods in which at least one carve-out is disposed along an edge of the lid and recessed from the perimeter of the lid.

[0025] In some examples, the technology described herein relates to methods in which a condition includes an internal component of a processor meeting a temperature threshold.

[0026] In some examples, the technology described herein relates to a method in which the condition includes a processor satisfying a power consumption threshold.

[0027] In some examples, the technology described herein relates to methods in which the condition includes an improper connection between a processor and one or more memory modules.

[0028] In some examples, the technology described herein relates to methods in which a condition includes connection to an incompatible device connected to a processor via a peripheral component interconnect express connection.

[0029] In some examples, the technology described herein relates to a system that includes a processing device including a substrate having at least one processor core and one or more contacts, an integral heat spreader bonded to the substrate and covering the at least one processor core, the integral heat spreader including a plurality of carve-outs exposing the one or more contacts, and a light connected to the one or more contacts and disposed in one of the plurality of carve-outs, and a cooling device including a plurality of protrusions that mechanically align the cooling device with the processing device using a subset of the plurality of carve-outs.

[0030] In some examples, the technology described herein relates to a system in which a subset of the carve-outs excludes any of the carve-outs in which a light is placed.

[0031] In some examples, the technology described herein relates to a system that is disposed within a computing device and where the light output is visible to a human eye observing the computing device.

[0032] 1 is a diagram illustrating an exemplary embodiment of a processor 100 configured with a conventional lid. The illustrated example shows a top portion 102 and a bottom portion 104 of the processor 100. The bottom portion 104 includes a number of pins disposed on a substrate 106 (e.g., silicon) for the processor. The number of pins included on the bottom portion 104 are configured to be contacted by corresponding pins of a processor socket that is attached to an external environment, such as a computing device motherboard. In conventional processor designs, the number of pins included on the bottom portion 104 are the exclusive means by which the processor communicates with the external environment, such that processor inputs and outputs are routed through the processor socket to other components (e.g., other PCB components) of the external environment.

[0033] The top portion 102 includes a lid 108 disposed on the substrate 106 opposite the side of the substrate 106 that includes the plurality of pins. The lid 108 is configured as an integral heat spreader that protects the internal components (e.g., die) of the processor 100 from overheating by dissipating heat generated by the internal components across a surface area of ​​the lid 108. A large flat surface of the lid 108 is conventionally configured as a plated copper sheet and is configured to contact a corresponding heat transfer surface of a cooling device, such as a heat sink, liquid cooling plate, or the like.

[0034] In many conventional processors, the lid 108 is secured to the substrate 106 using an adhesive (e.g., an epoxy compound) that bonds the lid 108 to the substrate 106. Some conventional processors include a gap 110 that allows for the escape of heat and trace gases and avoids harmful pressure build-up while the adhesive cures. However, in contrast to the processor lids described herein, the gap 110 included in conventional processors is not configured to expose the processor's lights or otherwise provide for a connection between the lights and the processor's internal components.

[0035] FIG. 2 illustrates an example 200 of a printed circuit board 202 including a processor 204 and a cooling device 208 connected to the printed circuit board 202 via a processor socket 206, according to one or more conventional embodiments. Specifically, the illustrated example 200 illustrates a top view of the printed circuit board 202. The processor 204 is shown disposed within the processor socket 206, which necessarily occupies a larger footprint of the printed circuit board 202 relative to the footprint of the processor 204 to receive and hold the processor 204. Various conventional methods mechanically couple the cooling device 208 to the processor 204 in a manner that allows for heat transfer. For example, thermal tape or thermal epoxy are conventional solutions that provide an adhesive bond between the processor 204 and the cooling device 208. However, thermal tape and thermal epoxy often overflow from the periphery of the processor 204 when the cooling device 208 is connected via a press-fit connection. Due to this overflow, conventional processors are prohibited from including integrated lights disposed along their periphery, such as integrated lights that are visually blocked by the thermal tape or epoxy.

[0036] Alternatively, some conventional methods for attaching the cooling device 208 to the processor 204 rely on mechanical attachment points that directly couple the cooling device 208 to the printed circuit board 202, such as attachment points 210. In an embodiment, the attachment points 210 are configured as holes or anchor points in the printed circuit board 202 configured to hold clips, screw fasteners, push pins, or the like that secure the cooling device 208 to the printed circuit board 202. While conventional approaches utilizing attachment points 210 provide a more reliable fit between the cooling device 208 and the processor 204 versus adhesive-only solutions such as thermal tape or thermal epoxy, the resulting footprint requires a no-go area that prevents other printed circuit board 202 components from being placed within the area encompassed by the cooling device 208 and visually blocks the processor 204 when viewing the printed circuit board 202.

[0037] For example, the illustrated example 200 shows a no-go area in which the footprint of the cooling device 208 encompasses the footprints of both the processor socket 206 and the processor 204, preventing other components of the printed circuit board 202 from being positioned within the area having the corners defined by the attachment points 210. The illustrated example 200 further shows a conventional connection between the processor 204 and a light 212 that is mounted on the printed circuit board 202 in a location other than the location used to mount the processor 204. In the illustrated example, the light 212 is connected to the processor 204 via a wire 214.

[0038] Wires 214 represent a low-speed signaling interface that routes communications through multiple low-speed buses and logic components (e.g., microcontrollers) rather than directly interfacing lights 212 with processor 204. These low-speed, conventional communication paths between processor 204 and lights 212 render processor 204 unable to visually indicate a detected condition in the event of a break, damage or failure of the buses, components and the like included in the signaling interface represented by wires 214. As a result, conventional processor package designs require a prohibitively large footprint to accommodate the connected lights and suffer from inefficient communications between the connected lights and the processor's internal components.

[0039] 3 illustrates an example of a processor 300 having a lid that includes a carve-out for connection to and visual exposure of one or more lights coupled to the processor 300. In the illustrated example, the processor 300 includes a lid 302. The lid 302 is configured as an integral heat spreader for the processor 300 that is bonded to a substrate 304 that includes at least one internal component of the processor 300. In some embodiments, the substrate 304 is configured as silicon that includes at least one processor core mounted on a die disposed on a surface of the substrate 304 to which the lid 302 is bonded. The at least one processor core may represent a CPU, a GPU, a parallel accelerated processor, multiple microprocessors, a digital signal processor (DSP), one or more microprocessors associated with a DSP core, a controller, a microcontroller, an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) circuit, any other type of integrated circuit (IC) and / or state machine, or a combination thereof.

[0040] The lid 302 is further shown as including a number of carve-outs disposed along an edge of the lid 302 connected to the substrate 304. Specifically, in the illustrated example, the lid 302 is shown as including carve-out 306, carve-out 308, carve-out 310, carve-out 312, carve-out 314, carve-out 316, carve-out 318, and carve-out 320. Each carve-out 306, 308, 310, 312, 314, 316, 318, 320 is configured to recess from a perimeter of the lid 302 as indicated by edge 322 to create a recess in the lid 302. In some embodiments, one or more carve-outs are sized differently than other carve-outs in the lid 302. For example, in some embodiments, each carve-out 306, 308, 310, 312, 314, 316, 318, 320 is dimensioned to recess a different length of the edge of the lid 302 and to a different depth toward an axis parallel to the edge of the lid 302 that intersects the center point of the lid 302.

[0041] In such an embodiment, each carve-out 306, 308, 310, 312, 314, 316, 318, 320 is configured to receive a protrusion of an auxiliary device (e.g., a light, a cooling device, etc.) having complementary dimensions such that the auxiliary device is mechanically constrained to align with the lid 302 in only a single possible orientation. Alternatively, in some embodiments, different carve-outs have common dimensions with each other. For example, in some embodiments, the carve-outs 306, 308, 314, 316 have a first set of common dimensions (e.g., recess width and depth) and the carve-outs 310, 310, 318, 320 have a second set of common dimensions (e.g., recess width and depth) such that an auxiliary device with a corresponding protrusion is permitted to mechanically align with the processor 300 in either of two possible orientations. For a more detailed view of how a lid with carve-outs can be used to mechanically align an auxiliary device with an internal component of a processor, consider FIG. 4.

[0042] 4 illustrates an exploded view of an exemplary device 400 including a processor lid 402 having a carve-out and configured for attachment to a processor board 404. The processor board 404 is shown as including internal components 406, 408, and 410. In some embodiments, internal components 406 are configured as an I / O die configured to include one or more GPU components and communicate with memory locations utilized by the processor. In some embodiments, internal components 408 represent a hardware cache configured to store copies of data from frequently used memory locations. In some embodiments, internal components 410 represent one or more processor cores, such as a CPU, a GPU, a parallel accelerated processor, multiple microprocessors, a DSP core, a controller, a microcontroller, an ASIC, an FPGA circuit, any other type of IC, and / or a state machine.

[0043] The processor lid 402 is configured to protect the internal components 406, 408, 410 and provide heat transfer for the internal components. Additionally, the processor lid 402 is configured to mechanically align an auxiliary device with the processor substrate 404 via carve-outs included in the processor lid 402. For example, the processor lid 402 represents an example of the lid 302 having its carve-outs 306, 308, 310, 312, 314, 316, 318, 320. In the illustrated example, the carve-outs of the processor lid 402 are configured to mechanically align and secure the auxiliary cooling device 412 to the processor lid 402. One or more of the carve-outs of the processor lid 402 are configured to mechanically align and secure the cooling device 412 to the processor lid 402 by receiving a corresponding one or more protrusions of the cooling device 412. For example, in the illustrated example of FIG. 4, an exploded view of device 400 shows four protrusions extending from cooling device 412 (protrusion 414, protrusion 416, protrusion 418, protrusion 420).

[0044] 3, the protrusion 414 is configured to be mechanically aligned with and secured by the carve-out 308 when the cooling device 412 is coupled with the processor lid 402. Similarly, the protrusion 416 is sized to complement the carve-out 310, the protrusion 418 is sized to complement the carve-out 312, and the protrusion 420 is sized to complement the carve-out 314. In this exemplary embodiment, the carve-outs of the processor lid 402 and the protrusions of the cooling device 412 are sized to permit the cooling device 412 to contact the heat transfer surface 422 of the processor lid 402 in a known alignment and orientation. The heat transfer surface 422 represents a surface of the processor lid 402 disposed opposite a surface of the processor lid 402 that is configured to contact the internal components 406, 408, 410 and thereby transfer heat from the internal components 406, 408, 410 to a corresponding surface of the cooling device 412 that contacts the heat transfer surface 422.

[0045] To further improve heat transfer away from the internal components 406, 408, 410, the carve-outs increase the surface area of ​​the processor lid 402 in contact with the cooling device 412. For example, surface 424 represents a surface of the carve-out 310 that is approximately perpendicular to the heat transfer surface 422 that contacts the surface of the protrusion 416 when the cooling device 412 is mechanically aligned with and secured to the processor lid 402. Similarly, surface 426 represents a surface of the carve-out 312 that is approximately perpendicular to the heat transfer surface 422 that contacts the surface of the protrusion 418 when the cooling device 412 and the processor lid 402 are mechanically aligned with and secured to one another. The additional areas of surfaces 424 and 426 that contact the respective protrusions 416 and 418 provide additional means by which the processor lid 402 can conduct heat from the internal components 406, 408, 410 to the cooling device 412, thus enabling more efficient heat transfer relative to conventional lid designs.

[0046] As an added advantage over conventional processor lids, because the carve-outs are set back from the perimeter of the processor lid 402, represented by dashed line 428 in the illustrated example of Figure 4, the processor lid 402 allows for mechanical alignment and connection with a connected auxiliary device (e.g., cooling device 412) even when the cooling device has a footprint smaller than the footprint of the processor lid 402 or the processor board 404. In contrast to the no-go areas required by the conventional processor lid design shown in Figure 2, for example, the processor lid 402 provides reliable and precise mechanical alignment with the auxiliary device that is independent of one or more attachment points of the circuit board to which the device 400 is mounted, allowing for implementation in a more compact device and reducing the required PCB size to accommodate the device 400.

[0047] Another advantage provided by the processor lid including carve-outs described herein is the exposure of components disposed on a surface of the processor substrate protected by the processor lid. For example, FIG. 5 shows an example of a processor 500 having a lid 502 including a carve-out that exposes components disposed on a processor substrate 504. In the illustrated example, the lid 502 is shown as including multiple carve-outs, such as carve-out 506. Carve-out 506 evidences a recessed depression from the periphery of the lid 502 that exposes components 508, 510, and 512 that would otherwise be covered by the lid 502 absent the carve-out 506. In some embodiments, each of components 508, 510, and 512 are configured as copper pads disposed on the processor substrate 504 and connected to internal components of the processor 500, such as the CPU, via one or more vias embedded in the processor substrate 504.

[0048] In an embodiment where the components 508, 510, 512 are configured as surface mount pads or other electrical connectors, the components are configured to establish electrical connections between the internal components of the processor 500 (e.g., CPU) and auxiliary devices such as cooling devices, LEDs, etc. For example, consider the embodiment of the previously described example where the lid 502 represents an example of the lid 302 such that the carve-out 506 corresponds to the carve-out 312 and is configured to receive the protrusion 418 of the cooling device 412. In an exemplary embodiment where the components 508, 510, 512 are configured as contacts, the components 508, 510, 512 are configured to establish electrical connections with corresponding electrical contacts disposed on a surface of the protrusion 418 that contacts the processor substrate 404 when mechanically aligned with the processor lid 402. Through the electrical connections enabled by the components 508, 510, 512, a high speed data bus is established communicatively coupling the internal components of the processor 500 (e.g., one or more of the internal components 406, 408, or 410) and the auxiliary devices. In this manner, the carve-out of lid 502 allows the internal components of processor 500 to directly control auxiliary devices, such as one or more LEDs, to visually output information describing conditions detected by the internal components of the processor.

[0049] In other embodiments, each of the components 508, 510, 512 represents an LED or other light source integrated into the processor board 504 and communicatively coupled to one or more internal components of the processor 500. In such an exemplary embodiment, the components 508, 510, 512 are configured to visually output information describing a condition detected by the internal components of the processor via an area exposed by the carve-out 506 that would otherwise be visually obstructed by conventional processor lid designs.

[0050] In embodiments where the lid carve-out is configured to expose a light source integrated into the processor board or otherwise enable secure mechanical alignment of an auxiliary light source, the carve-out is configured to preserve visibility of the light output when the processor is plugged into a socket that connects the processor to an external environment, such as a printed circuit board. For example, FIGS. 6 and 7 show examples of processors including a lid with a carve-out configured to expose a processor-integrated or auxiliary light source connected to the processor when the processor is placed into the processor socket. The illustrated example 600 of FIG. 6 shows a processor 602 including a lid with a carve-out configured to expose one or more components disposed on the processor board and configured to establish a communicative coupling between the internal components of the processor 602 and an auxiliary device. For example, the illustrated example 600 shows an implementation in which a light 604 is disposed within any of the lid carve-outs and communicatively coupled to the internal components of the processor 602 via one or more board connections exposed by the lid carve-out. Alternatively, the illustrated example 600 shows an embodiment in which a lid carve-out exposes lights 604 integrated into the substrate of the processor 602, such as LEDs integrated into the silicon substrate of the processor 602.

[0051] In the illustrated example 600 of FIG. 6, the processor 602 is shown engaging the processor socket 606 while the processor socket 606 is in an open position. In some embodiments, the processor socket 606 represents a zero-insertion force (ZIF) socket configured to connect the processor 602 to an external environment and retain the processor 602 when the processor socket 606 is in a closed position. The illustrated example 700 of FIG. 7 shows the processor socket 606 in a closed position retaining the processor 602. As is visible from the illustrated example 700, the outer lid perimeter of the processor 602 is covered by the retaining cover of the processor socket 606 in the closed position, while the lid carve-out is retracted to a sufficient extent to expose one or more lights that are integrated into the substrate of the processor 602, connected via contacts disposed on the substrate of the processor 602, or a combination thereof. For example, the illustrated example 700 shows an exemplary implementation in which a processor 602 is configured with a first light array 702 disposed within a first carve-out and a second light array 704 disposed within a second carve-out. Each of the first and second carve-outs is dimensioned such that the first light array 702 and the second light array 704 remain visible while the processor 602 is secured within a closed processor socket 606.

[0052] FIG. 8 is a diagram of a digital media environment 800 in which a processor 802 includes a light 804 connected to the processor 802 and exposed by a processor lid carve-out. In the illustrated example of FIG. 8, the processor 802 is shown as including a system management component 806. The system management component 806 represents the functionality of the processor 802 to manage power consumption by one or more processor cores included in the processor 802. For example, the system management component 806 is configured to control the voltage supplied to various components of the processor 802, determine what operation an individual processor core is performing at a given time, what frequency is applied, etc. In this manner, the system management component 806 is configured to control and dynamically change the operating environment of the processor 802 based on a current or upcoming task. As a result, the system management component 806 is informed of both the current tasks being performed by the individual components of the processor 802 and the next tasks to be performed by the individual components. In conventional systems, system management component 806 is configured to share information describing the internal components (e.g., the CPU) of processor 802 by visually displaying the information in an operating system user interface or similar utility output via a display of the computing device implementing processor 802.

[0053] However, such conventional embodiments rely on a successful operating system boot and are unable to communicate information from the system management component 806 in scenarios where the operating system is unable to boot. In contrast to these conventional shortcomings, the lid carve-out described herein visually exposes the light 804 to the human eye of a user observing the processor and communicatively couples the light 804 to the system management component 806. In this manner, the lid carve-out allows the system management component 806 to visually communicate information directly at the processor 802 without relying on a successful operating system boot on the computing device implementing the processor 802.

[0054] In some embodiments, the visual information output by the light is specified by the manufacturer of the processor 802. Alternatively or additionally, the visual information output by the light is specified via user input from a user of a computing device implementing the processor 802. For example, in some embodiments, the system management component 806 allows a user to specify a particular color, blinking pattern, or combination thereof to be output by the light 804 when the system management component 806 detects the occurrence of an identified condition in the processor 802. As an example, the light 804 is configured to emit a first combination of colors and / or blinking patterns to indicate different temperatures of the processor 802 or an internal component of the processor as detected by the system management component 806. Continuing with this example, the light 804 is configured to emit a second combination of colors and / or blinking patterns to indicate different power consumption by the processor 802 or an internal component of the processor 802 as detected by the system management component 806. The light 804 is configured to emit a third combination of colors and / or blinking patterns to indicate different communication rates between the processor 802 and one or more computing device components coupled to the processor (e.g., memory modules), etc., for any range of different conditions detected by the system management component.

[0055] As a further example, system management component 806 may be configured to cause lights 804 to output visual indications of various problems encountered by internal components of processor 802 during boot (e.g., whether a memory module is properly connected, whether a connected PCIe device is compatible, etc.) In this manner, lights 804 exposed by one or more lid covers out may enable visual communication of information detected by internal components of processor 802 that would otherwise not be available for communication to a user of the computing device implementing processor 802 or that would otherwise be undetectable by other components of the computing device.

[0056] The following description describes techniques implemented using the systems and devices described above. Aspects of the procedures are implemented in hardware, firmware, software, or a combination thereof. The procedures are illustrated as a set of blocks that specify operations performed by one or more devices and are not necessarily limited to the order shown for performing the operations by each block. Furthermore, although various operations are described that are performed by one or more devices, the techniques described herein may additionally or alternatively include additional operations. In parts of the following description, reference is made to Figures 3-8.

[0057] 9 is a flow diagram 900 illustrating a procedure in an exemplary embodiment of a processor that communicates directly with a light connected to the processor through a lid carve-out. In some embodiments, the operations of flow diagram 900 are performed by an internal component of the processor, such as the system management component 806 of the processor 802.

[0058] 9, the occurrence of a condition is detected in a processor (block 902). The system management component 806 detects, for example, that a condition of an internal component of the processor 802 satisfies a predefined condition for the internal component. Examples of the predefined condition include meeting a temperature threshold, meeting a power consumption threshold, meeting a communications bandwidth threshold, proper connection of a component (e.g., a memory module, a PCIe device, etc.) to the processor 802, etc.

[0059] Alternatively or in addition, the system management component 806 detects whether the processor 802 is properly communicatively coupled to one or more computing device components (e.g., whether DIMMs are plugged into the correct sockets, whether connections between the processor 802 and components of the PCB on which the processor 802 is installed are loose or otherwise improper, whether PCIe devices are properly connected, etc.). Alternatively or in addition, the system management component 806 detects whether the system BIOS is incompatible with the version of the processor 802. Alternatively or in addition, the system management component 806 detects whether a fault condition (e.g., an internal CPU error, a condition causing a hang, a hard lock, etc.) was present during a previous boot of the processor 802.

[0060] Alternatively or in addition, when the procedure of FIG. 9 is performed during a debugging implementation, the system management component 806 detects one or more conditions resulting from the processor 802 executing a set of instructions (e.g., completion of execution of a set of instructions, throttling performed during execution, clock stretching activity during execution, etc.).

[0061] In response to detecting the occurrence of the condition, a light code is identified (block 904), which visually indicates the occurrence of the condition, and the light code is output via at least one light of the processor (block 906). As described herein, a light code of a condition refers to any one or more colors, blinking patterns, or combinations thereof output by the light 804 to indicate the occurrence of the condition. For example, in an exemplary embodiment, the system management component 806 identifies a solid blue light corresponds to a first temperature threshold, and in response to detecting the first temperature threshold being met, causes the light 804 to display a solid blue color. Continuing with the example, the system management component 806 identifies a yellow light corresponds to a second temperature threshold, and in response to detecting the second temperature threshold being met, causes the light 804 to display a yellow color. The system management component 806 then identifies a flashing red light corresponds to a third temperature threshold, and in response to detecting the third temperature threshold being met, causes the light 804 to display a flashing red color.

[0062] In this manner, each condition detected by the system management component 806 is associated with a visual indicator such that the occurrence of the condition triggers the output of a visual indication via the lights 804. In some embodiments, the visual indicator of the condition is pre-specified by the manufacturer of the processor 802. Alternatively or additionally, the visual indicator of the condition is specified by a user of the computing device implementing the processor 802. Thus, the systems and techniques described herein enable customized communication of a specific condition of the processor 802 via a light that is directly coupled to the system management component 806 of the processor 802.

[0063] Although features and elements are described above in particular combinations, each feature or element can be used alone without the other features and elements, or in various combinations with or without the other features and elements. Thus, many variations are possible based on the disclosure herein.

[0064] The various functional units shown in the figures and / or described herein may be implemented in any of a variety of different ways, such as hardware circuits, software or firmware running on a programmable processor, or any combination of two or more of hardware, software, and firmware. The methods provided may be performed on any of a variety of devices, such as a general purpose computer, a processor, or a processor core. Suitable processors include, by way of example, a general purpose processor, a special purpose processor, a conventional processor, a CPU, a GPU, a parallel accelerated processor, multiple microprocessors, one or more microprocessors in association with a DSP core, a controller, a microcontroller, an ASIC, an FPGA circuit, any other type of integrated circuit IC, and / or a state machine.

[0065] In one or more embodiments, the methods and procedures provided herein are implemented in a computer program, software, or firmware embodied in a non-transitory computer-readable storage medium for execution by a general purpose computer or processor. Examples of non-transitory computer-readable storage media include read only memory (ROM), random-access memory (RAM), registers, cache memory, semiconductor memory devices, magnetic media such as internal hard disks and removable disks, magneto-optical media, and optical media such as CD-ROM disks and digital versatile disks (DVDs).

[0066] (Conclusion) Although the invention has been described in language specific to structural features and / or methodological acts, it is to be understood that the invention defined in the appended claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as exemplary forms of implementing the claimed invention.

Claims

1. 1. A processing device, comprising: a substrate including at least one processor core and one or more lights connected to the at least one processor core via an electrical connection; an integrated heat spreader bonded to the substrate and covering the at least one processor core, the integrated heat spreader including a plurality of carve-outs exposing at least one of the one or more lights, each of the plurality of carve-outs disposed along an edge of the integrated heat spreader and recessed from an outer periphery of the integrated heat spreader; Processing device.

2. the at least one processor core includes one or more of a central processing unit, a graphics processing unit, or a parallel acceleration processor; The processing device of claim 1 .

3. the at least one processor core includes a system management component configured to manage power consumption by the at least one processor core and to output a visual indication regarding the power consumption via the one or more lights. The processing device of claim 1 .

4. the at least one processor core includes a system management component configured to monitor a temperature of the at least one processor core and to output a visual indication regarding the temperature via the one or more lights. The processing device of claim 1 .

5. the at least one processor core includes a system management component configured to monitor whether one or more memory modules are properly connected to the at least one processor core and output a visual indication as to whether the one or more memory modules are properly connected via the one or more lights. The processing device of claim 1 .

6. the at least one processor core includes a system management component configured to determine compatibility of peripheral component interconnect express devices connected to the processing device and to output a visual indication of the compatibility via the one or more lights. The processing device of claim 1 .

7. the at least one processor core includes a plurality of processor cores, each of the one or more lights includes a plurality of lights corresponding to one of the plurality of processor cores, and at least one of the plurality of processor cores includes a system management component configured to visually indicate a state of the plurality of processor cores using the plurality of lights during operation of the processing device. The processing device of claim 1 .

8. the plurality of carve-outs are configured to enable a press-fit connection between a cooling device and the integrated heat spreader and to maintain visibility of the one or more lights when the cooling device is connected to the integrated heat spreader. The processing device of claim 1 .

9. the integrated heat spreader includes a first surface configured to contact the at least one processor core, and a second surface disposed opposite the first surface and configured to transfer heat from the at least one processor core by contacting a cooling device; The processing device of claim 1 .

10. at least one of the plurality of carve-outs includes an additional surface oriented substantially perpendicular to the first surface and the second surface, the additional surface configured to mechanically align the integral heat spreader with a protrusion of a cooling device and transfer heat to the protrusion of the cooling device; The processing device of claim 9.

11. the at least one processor core is configured to detect upcoming execution of an operation and, prior to execution of the operation, visually indicate the upcoming execution of the operation via the one or more lights. The processing device of claim 1 .

12. 1. A method comprising: a processor determining an occurrence of a condition in said processor; and outputting a light code indicating the occurrence of the condition via one or more lights connected to the internal components of the processor, mounted to a substrate supporting the internal components of the processor, and visibly exposed by at least one carve-out in a lid covering the internal components of the processor. method.

13. the at least one carve-out is disposed along an edge of the lid and recessed from a periphery of the lid; 13. The method of claim 12.

14. the condition includes the internal component of the processor meeting a temperature threshold; 13. The method of claim 12.

15. the condition includes satisfying the processor power consumption threshold; 13. The method of claim 12.

16. the condition includes an improper connection between the processor and one or more memory modules.

13. The method of claim 12.

17. the condition includes connection to an incompatible device connected to the processor via a peripheral component interconnect express connection; 13. The method of claim 12.

18. 1. A system comprising: A processing device; a cooling device including a plurality of protrusions; The processing device comprises: a substrate having at least one processor core and one or more contacts; an integrated heat spreader bonded to the substrate and covering the at least one processor core, the integrated heat spreader including a plurality of carve-outs exposing the one or more contacts; a light connected to the one or more contacts and disposed within any of the plurality of carve-outs; the plurality of protrusions mechanically align the cooling device with the processing device using a subset of the plurality of carve-outs. system.

19. the subset of the plurality of carve-outs excludes any of the plurality of carve-outs in which the light is placed; 20. The system of claim 18.

20. the system is disposed within a computing device and the light output is visible to a human eye observing the computing device; 20. The system of claim 18.

Images