Lid carve-out for processor connection and mating

Abstract

A package lid having a carve-out configured for processor connection and alignment is described. The lid carve-out is configured to align and mechanically secure the cooling device to the package lid by receiving a protrusion of the cooling device. The lid design allows for targeted cooling of discrete portions of the lid because the lid carve-out ensures precise alignment and orientation of the cooling device relative to the package lid. The lid carve-out is further configured to expose one or more connectors disposed on a surface that supports the package internal component. When contacted by a corresponding connector of the cooling device, the lid carve-out allows for a direct connection between the package and the attached cooling device. By creating a direct connection between the package component and the attached cooling device, the lid carve-out allows for a high speed connection for active, on-demand cooling actuation.

Description

[Technical field]

[0001] (Related Applications) This application claims priority to U.S. patent application Ser. No. 17 / 704,912, filed Mar. 25, 2022, entitled "Lid Carveouts for Processor Connection and Alignment," the disclosure of which is incorporated herein by reference in its entirety. [Background technology]

[0002] Computer processors are often manufactured to include an integrated heat spreader, commonly referred to as the processor "lid." The lid is typically configured as an enclosure that acts as a protective shell for the processor components (e.g., die). In many implementations, the lid is fabricated from a metal, such as plated copper, to provide a path for heat transfer from the processor components to a heat dissipation device or heat sink.

[0003] The detailed description will now be described with reference to the accompanying drawings, in which: The entities depicted in the figures may represent one or more entities, and therefore, in the description, reference will be made interchangeably to singular or plural forms of the entities. [Brief description of the drawings]

[0004] [Figure 1] FIG. 1 illustrates an exemplary embodiment of a processor configured with a conventional lid. [Diagram 2] FIG. 1 illustrates an exemplary embodiment of a printed circuit board including a processor and a cooling device, in accordance with one or more conventional embodiments. [Diagram 3] FIG. 1 illustrates an example of a processor having a lid that includes carve-outs for connection and alignment. [Figure 4] 1 is an exploded view of an exemplary device including a processor substrate, a processor lid having a carve-out, and a processor cooling device. [Diagram 5]FIG. 1 illustrates an example of a processor having a lid that includes a carve-out to expose connections on the processor board. [Figure 6] FIG. 1 illustrates an example of a processor having a lid with a carve-out disposed within an open socket. [Figure 7] FIG. 2 illustrates an example of a processor having a lid with a carve-out secured within a socket. [Figure 8] A diagram of a digital media environment in which a processor communicates directly with an enabled cooling device via at least one connection exposed by a lid carve-out. [Figure 9] FIG. 13 is a flow diagram illustrating a procedure in an exemplary embodiment of a processor that communicates directly with a cooling device enabled via at least one connection exposed by a lid carve-out. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0005] (overview) Processors, integrated circuits, and other semiconductor devices are packaged in a manner that protects the internal components (e.g., die) from potentially damaging influences such as contaminants, water damage, light exposure, etc. The processor package additionally connects the internal components to the external environment, such as a printed circuit board (PCB). In some embodiments, the processor is packaged with an integrated heat spreader or "lid" configured as an enclosure that also serves as a pathway for transferring heat away from the internal components.

[0006] For example, a processor lid is often configured with a first surface that contacts an internal component and a second surface opposite the first surface that is configured to contact a cooling device, such as a heat sink, water cooler block, or the like. Conventional approaches for interfacing a processor lid with a cooling device often rely on a press fit with a thermal compound that secures the processor lid to a heat transfer surface of the cooling device. However, these conventional approaches rely on the manual precision of a user installing the cooling device to achieve only a general alignment, within a wide range of imprecision, to the internal component areas of the component, potential die hot spots, etc. As a result, this general alignment often results in an imprecise alignment where portions of the heat transfer surface of the package lid or cooling device that are designed to contact or overlap specific areas cannot contact or overlap.

[0007] To increase the surface area for heat transfer between the processor lid and the cooling device, conventional lids are designed to cover a large portion of the package such that the perimeter of the lid often extends to the perimeter of the substrate on which the internal components are placed. For processors containing multiple dies, different portions of the package heat up at different rates depending on the operation of the processor. However, conventional lids are configured to provide a uniform heat transfer surface for the entire package and cannot account for the different heating rates of the underlying internal components. As a corollary of this conventional lid design, conventional cooling devices cannot account for the different component heating rates and instead treat the entire package lid as having uniform thermal properties (e.g., due to a lack of alignment accuracy). Thus, certain cooling devices, such as Peltier coolers, experience problems with condensation by maintaining a cooling solution below ambient temperature across the entire lid as a result of treating the conventional lid as having uniform thermal properties.

[0008] Due to conventional processor package designs, conventional cooling devices are unable to directly interface with internal components such as a central processing unit (CPU). For example, in conventional device configurations, communication between the processor and an external environment, such as a PCB, is routed through a socket that attaches the processor to the board. For cooling device control, conventional PCBs include a cooling device header located on the board near the processor socket. In embodiments where the cooling device is configured as a fan, the cooling device header provides a voltage to power the fan and specifies the fan speed during operation.

[0009] The communication paths between the processor socket and the fan header are traditionally low-speed signaling interfaces that route the communication through multiple low-speed buses and logic components (e.g., microcontrollers) rather than directly interfacing the fan with the processor. The resulting communication over these traditional paths is high-latency and slow, limiting the processor to only a general understanding of the cooling device operation (e.g., the cooling device's current operating speed). These slow, traditional communication paths between the processor and the cooling device further lack the ability to carry sufficient data to inform the cooling device of additional considerations, such as the specific lid coordinates for targeted processor cooling. As a result, traditional processor package designs result in inefficient heat transfer.

[0010] To address these conventional shortcomings, package lids having carve-outs configured for processor connection and alignment are described. As described herein, a carve-out refers to a portion of the package lid edge that recesses from the lid's outer periphery. When viewed from a top view, each carve-out appears as an indentation in the package lid edge such that the portion of the lid edge at the carve-out is positioned closer to the center of the package lid than the portion of the lid edge that does not include the carve-out. In some embodiments, the lid carve-outs are configured to precisely align and mechanically secure a cooling device to the package lid by receiving a protrusion of the cooling device via a press-fit connection. As an example, some lid carve-outs are dimensioned differently than other lid carve-outs such that a cooling device with a similarly dimensioned protrusion can be mechanically attached to the lid in only one orientation.

[0011] The lid design allows for targeted cooling of individual portions of the lid, as the lid carve-outs ensure the correct alignment and orientation of the cooling device relative to the package lid. As an example, for a current or upcoming processor workload, the processor knows which internal components (e.g., which portions of the die under the lid) will heat up first and at what rate relative to other portions of the die. The processor can further consider how the current workload and operating conditions affect which components and coordinates are generating heat. When coupled with a cooling device using the lid carve-outs described herein, the processor is also informed of the orientation of the cooling device relative to the processor lid, and can therefore precisely command the cooling device to focus cooling on the portion of the lid that is opposite the specific portion of the die that is generating the thermal gradient. In contrast to conventional lid designs, the lid carve-outs described herein allow the cooling device to avoid condensation issues by targeting portions of the lid below ambient temperature as needed, while maintaining other portions above ambient temperature to prevent condensation.

[0012] In some embodiments, the lid carve-out exposes one or more connectors (e.g., copper pads configured for electrical connection) disposed on a surface of the package that contains the internal components of the package. When contacted by a corresponding connector of the cooling device, the lid carve-out enables a connection (e.g., an electrical connection of a data bus) between the package and the attached cooling device. In some embodiments, the connector is wired directly to the internal component, such as directly to a CPU housed under the package lid. By creating a direct connection between the CPU and the attached cooling device, the lid carve-out enables a high-speed connection configured to pass information directly between the CPU control circuitry and the cooling device control circuitry, enabling on-demand cooling actuation. This high-speed connection advantageously avoids the slow communication paths and pass-throughs implemented by conventional processor architectures and enables direct processor control of the cooling device.

[0013] For example, in an exemplary embodiment where the processor includes separate CPU and graphics processing unit (GPU) portions located under the lid, the processor transfers power between the different portions according to the current operational task. Such power transfer is often referred to as "power sloshing" and allows for the shunting of power from the GPU to the CPU when performing a CPU task, and vice versa. In an embodiment, the processor is informed of the upcoming task and thus is informed if additional current is required, if the frequency is to be gradually increased, if power is to be sloshed between different portions of the die, etc. While conventional communication paths between the processor and the cooling device allow only limited information transfer, the direct connection enabled by the carve-out exposed connector described herein allows the processor to transfer sufficient information to proactively notify the cooling device of an expected temperature rise.

[0014] Thus, rather than responding purely to detecting heat generated in internal components and propagating through the package lid before initiating cooling, the package lid described herein enables proactive cooling techniques. For example, using the direct connections exposed by the lid carve-out, the CPU can instruct the cooling device to pre-cool the lid (e.g., increase fan speed or coolant flow rate before the lid reaches a temperature threshold), or to perform targeted cooling of a portion of the lid (e.g., focus airflow to a portion of the lid or apply extra cooling to a specified portion of the lid), or a combination thereof. This advantageously allows the cooling device to respond to heat before it recognizes its presence using conventional techniques.

[0015] Through a direct communication path through the processor and cooling device exposed by the package lid carve-out, the processor is further provided with additional feedback over conventional approaches. For example, in conventional embodiments where the cooling device is mechanically secured to the processor lid but communicatively coupled to the processor via a fan header, misalignment between the cooling device and the processor lid resulting from external forces, such as vibration, that do not affect the fan header connection is not detected by the processor. In contrast to these conventional configurations, by using the lid carve-out to mechanically secure and directly communicatively couple the cooling device to the processor lid, the processor is configured to detect improper alignment when the connections exposed by the lid carve-out are not properly connected to the corresponding cooling device connections. Thus, the package lid carve-outs described herein advantageously allow for mechanical alignment and direct connection between the processor and cooling device that is not permitted by conventional package lids.

[0016] In some examples, the technology described herein relates to a processing device that includes a substrate including at least one processor core and one or more contacts configured to establish an electrical connection with the at least one processor core, and an integral heat spreader bonded to the substrate and covering the at least one processor core, the integral heat spreader including a plurality of carve-outs exposing at least one of the one or more contacts, each of the plurality of carve-outs being disposed along an edge of the integral heat spreader and recessed from an outer periphery of the integral heat spreader.

[0017] In some examples, the technology described herein relates to a processing device in which at least one processor core includes one or more of a central processing unit, a graphics processing unit, or a parallel acceleration processor.

[0018] In some examples, the present invention relates to a processing device in which at least one processor core includes a system management component configured to manage power consumption by the at least one processor core and to regulate heat transfer for the processing device by communicating with a cooling device via one or more contacts.

[0019] In some examples, the technology described herein relates to a processing device in which a plurality of carve-outs are configured to enable a press-fit connection between a cooling device and at least one of one or more contacts exposed by the plurality of carve-outs.

[0020] In some examples, the technology described herein relates to a processing device in which an integrated heat spreader includes a first surface configured to contact at least one processor core and a second surface disposed opposite the first surface and configured to transfer heat from the at least one processor core by contacting a cooling device.

[0021] In some examples, the technology described herein relates to a processing device in which each of a plurality of carve-outs includes an additional surface oriented approximately perpendicular to the first surface and the second surface, the additional surface configured to mechanically align the integral heat spreader with a protrusion of a cooling device and transfer heat to the protrusion of the cooling device.

[0022] In some examples, the techniques described herein relate to a processing device in which at least one processor core is configured to determine, prior to execution of an operation, that execution of the operation will increase a temperature of the at least one processor core, and instruct a cooling device to begin cooling the integrated heat spreader in response to determining, prior to execution of the operation, that execution of the operation will increase a temperature of the at least one processor core.

[0023] In some examples, the technology described herein relates to a processing device in which at least one processor core is configured to instruct a cooling device to begin cooling an integrated heat spreader by sending an instruction to a controller of the cooling device via one or more contacts.

[0024] In some examples, the technology described herein relates to a processing device in which at least one processor core is configured to instruct a cooling device to initiate targeted cooling of a portion of a surface of an integrated heat spreader, the portion of the surface of the integrated heat spreader being co-located with the at least one processor core relative to the substrate.

[0025] In some examples, the technology described herein relates to a processing device in which at least one processor core instructs a cooling device to initiate targeted cooling of a portion of a surface of the integral heat spreader by concentrating airflow on the portion of the surface of the integral heat spreader at an increased rate relative to the airflow over at least one other portion of the surface of the integral heat spreader.

[0026] In some examples, the technology described herein relates to processing devices in which the substrate is silicon, the one or more contacts are surface mounted air pads, and the integral heat spreader is plated copper.

[0027] In some examples, the techniques described herein relate to a method that includes determining, by a processor, that performance of an operation will cause the processor to reach a temperature threshold; detecting, by the processor, the performance of the operation; and causing, by the processor, a cooling device to begin cooling the processor by sending an instruction via electrical contacts disposed on a substrate of the processor to contact electrical contacts of the cooling device.

[0028] In some examples, the techniques described herein relate to methods in which detecting performance of an operation and causing a cooling device to begin cooling the processor is performed before the processor begins performing the operation.

[0029] In some examples, the technology described herein relates to methods in which a processor includes a lid having a plurality of carve-outs recessed from a periphery of the lid, each carve-out being disposed along an edge of the lid, any of the plurality of carve-outs exposing electrical contacts disposed on a substrate of the processor.

[0030] In some examples, the technology described herein relates to methods in which the cooling device includes multiple protrusions that use multiple carve-outs to mechanically align the cooling device with the lid.

[0031] In some examples, the technology described herein relates to methods in which electrical contacts of a cooling device are disposed on any of a plurality of protrusions.

[0032] In some examples, the techniques described herein relate to a method that further includes, in response to determining that the processor reaches an additional temperature threshold, causing a cooling device to increase cooling of the processor.

[0033] In some examples, the techniques described herein relate to a method further including determining that performance of the operation causes an internal component of the processor to reach a temperature threshold, and where causing the cooling device to begin cooling the processor includes instructing the cooling device to target a portion of a lid of the processor that is disposed above a portion of a substrate that includes the internal component of the processor.

[0034] In some examples, the techniques described herein relate to a method that further includes outputting a notification indicative of a cooling device alignment error in response to detecting a disconnection between an electrical contact disposed on the substrate and an electrical contact of the cooling device.

[0035] In some examples, the technology described herein relates to a system including a processing device including a substrate having at least one processor core and one or more contacts; and an integral heat spreader bonded to the substrate and covering the at least one processor core, the integral heat spreader including a plurality of carve-outs exposing the one or more contacts; and a cooling device including a plurality of protrusions that mechanically align the cooling device with the processing device, at least one of the plurality of protrusions configured to establish an electrical connection with the at least one processor core using the one or more contacts.

[0036] 1 is a diagram illustrating an exemplary embodiment of a processor 100 configured with a conventional lid. The illustrated example shows a top portion 102 and a bottom portion 104 of the processor 100. The bottom portion 104 includes a number of pins disposed on a substrate 106 (e.g., silicon) for the processor. The number of pins included on the bottom portion 104 are configured to be contacted by corresponding pins of a processor socket that is attached to an external environment, such as a computing device motherboard. In conventional processor designs, the number of pins included on the bottom portion 104 are the exclusive means by which the processor communicates with the external environment, as the processor inputs and outputs are routed through the processor socket.

[0037] The top portion 102 includes a lid 108 disposed on the substrate 106 opposite the side of the substrate 106 that includes the plurality of pins. The lid 108 is configured as an integral heat spreader that protects the internal components (e.g., die) of the processor 100 from overheating by dissipating heat generated by the internal components across a surface area of ​​the lid 108. A large flat surface of the lid 108 is conventionally configured as a plated copper sheet and is configured to contact a corresponding heat transfer surface of a cooling device, such as a heat sink, liquid cooling plate, or the like.

[0038] In many conventional processors, the lid 108 is secured to the substrate 106 using an adhesive (e.g., an epoxy compound) that bonds the lid 108 to the substrate 106. Some conventional processors include a gap 110 that allows for the escape of heat and trace gases and avoids harmful pressure build-up while the adhesive cures. However, in contrast to the processor lids described herein, the gap 110 included in conventional processors is not configured for mechanical alignment of a cooling device with the lid 108 and does not utilize a communication connection between the cooling device and the internal processor components.

[0039] 2 illustrates an example 200 of a printed circuit board 202 including a processor 204 and a cooling device 208 connected to the printed circuit board 202 via a processor socket 206, according to one or more conventional embodiments. Specifically, the illustrated example 200 illustrates a top view of the printed circuit board 202. The processor 204 is shown disposed within the processor socket 206, which necessarily occupies a larger footprint of the printed circuit board 202 relative to the footprint of the processor 204 to receive and hold the processor 204. There are various conventional methods for mechanically coupling the cooling device 208 to the processor 204 in a manner that allows for heat transfer. For example, thermal tape or thermal epoxy are conventional solutions that provide an adhesive bond between the processor 204 and the cooling device 208. However, thermal tape and thermal epoxy rely on the manual precision of a user to install the cooling device, often resulting in misalignment between the processor 204 and the cooling device 208 due to human error and inaccuracy.

[0040] Alternatively, some conventional methods for attaching the cooling device 208 to the processor 204 rely on mechanical attachment points that directly couple the cooling device 208 to the printed circuit board 202, such as attachment points 210. In an embodiment, the attachment points 210 are configured as holes or anchor points in the printed circuit board 202 configured to hold clips, screw fasteners, push pins, or the like that secure the cooling device 208 to the printed circuit board 202. Although conventional approaches utilizing attachment points 210 provide a more reliable fit between the cooling device 208 and the processor 204 versus adhesive-only solutions such as thermal tape or thermal epoxy, the resulting footprint requires a no-go area that prevents other printed circuit board 202 components from being placed within the area encompassed by the cooling device 208.

[0041] For example, the illustrated example 200 shows a no-go area in which the footprint of the cooling device 208 encompasses the footprints of both the processor socket 206 and the processor 204, preventing other components of the printed circuit board 202 from being positioned within the area having the corners defined by the attachment points 210. The illustrated example 200 further shows a conventional connection between the processor 204 and the cooling device 208. In the illustrated example, the printed circuit board 202 includes a header 212 configured to establish a connection via the processor 204 and the cooling device 208 via wires 214.

[0042] Wires 214 represent a low-speed signaling interface that routes communications through multiple low-speed buses and logic components (e.g., microcontrollers) rather than directly interfacing cooling device 208 with processor 204. These low-speed, conventional communication paths between processor 204 and cooling device 208 limit processor 204 to only a general understanding of the operation of cooling device 208 and lack the ability to carry sufficient data to inform cooling device 208 about advanced considerations such as targeted processor cooling. As a result, conventional processor package designs suffer from imprecise alignment and inefficient heat transfer and communication between the processor and cooling device.

[0043] 3 shows an example of a processor 300 having a lid that includes a carve-out for connection to and alignment with a cooling device. In the illustrated example, the processor 300 includes a lid 302. The lid 302 is configured as an integral heat spreader for the processor 300 that is bonded to a substrate 304 that includes at least one internal component of the processor 300. In some embodiments, the substrate 304 is configured as silicon that includes at least one processor core mounted on a die disposed on a surface of the substrate 304 to which the lid 302 is bonded. The at least one processor core represents one or more microprocessors associated with a CPU, GPU, parallel accelerated processor, multiple microprocessors, digital signal processor (DSP) cores, controllers, microcontrollers, Application Specific Integrated Circuits (ASICs), Field Programmable Gate Array (FPGA) circuits, any other type of integrated circuit (IC) and / or state machine, or combinations thereof.

[0044] The lid 302 is further shown as including a number of carve-outs disposed along an edge of the lid 302 connected to the substrate 304. Specifically, in the illustrated example, the lid 302 is shown as including carve-out 306, carve-out 308, carve-out 310, carve-out 312, carve-out 314, carve-out 316, carve-out 318, and carve-out 320. Each carve-out 306, 308, 310, 312, 314, 316, 318, 320 is configured to recess from a perimeter of the lid 302 as indicated by edge 322 to create a recess in the lid 302. In some embodiments, one or more carve-outs are sized differently than other carve-outs in the lid 302. For example, in some embodiments, each carve-out 306, 308, 310, 312, 314, 316, 318, 320 is dimensioned to span a different length of the edge of the lid 302 and recess to a different depth toward an axis parallel to the edge of the lid 302 that intersects the center point of the lid 302. In such embodiments, each carve-out 306, 308, 310, 312, 314, 316, 318, 320 is configured to receive a protrusion of a cooling device having complementary dimensions such that the cooling device is mechanically constrained to align with the lid 302 in only a single possible orientation. Alternatively, in some embodiments, the different carve-outs have common dimensions to one another. For example, in some embodiments, carve-outs 306, 308, 314, 316 have a first set of common dimensions (e.g., recess width and depth) and carve-outs 310, 310, 318, 320 have a second set of common dimensions (e.g., recess width and depth) such that a cooling device with a corresponding protrusion is permitted to mechanically align with processor 300 in either of two possible orientations. For a more detailed view showing how a lid with carve-outs mechanically aligns a cooling device with an internal component of a processor, consider FIG.

[0045] 4 illustrates an exploded view of an exemplary device 400 including a processor lid 402 including a carve-out and configured for attachment to a processor board 404. The processor board 404 is illustrated as including internal components 406, 408, and 410. In some embodiments, the internal components 406 are configured as an I / O die including one or more GPU components and configured to communicate with memory locations utilized by the processor. In some embodiments, the internal components 408 represent a hardware cache configured to store copies of data from frequently used memory locations. In some embodiments, the internal components 410 represent one or more processor cores, such as a CPU, a GPU, a parallel accelerated processor, multiple microprocessors, one or more microprocessors associated with a DSP core, a controller, a microcontroller, an ASIC, an FPGA circuit, any other type of IC, and / or a state machine.

[0046] The processor lid 402 is configured to protect and provide heat transfer for the internal components 406, 408, 410 by mechanically aligning the cooling device 412 with the processor substrate 404 via carve-outs included in the processor lid 402. For example, the processor lid 402 represents an example of the lid 302 having its carve-outs 306, 308, 310, 312, 314, 316, 318, 320. One or more of the carve-outs of the processor lid 402 are configured to mechanically align and secure the cooling device 412 to the processor lid 402 by receiving a corresponding one or more protrusions of the cooling device 412. For example, in the illustrated example of FIG. 4, an exploded view of the device 400 shows four protrusions (protrusion 414, protrusion 416, protrusion 418, protrusion 420) extending from the cooling device 412.

[0047] 3, the protrusion 414 is configured to be mechanically aligned with and secured by the carve-out 308 when the cooling device 412 is coupled with the processor lid 402. Similarly, the protrusion 416 is sized to complement the carve-out 310, the protrusion 418 is sized to complement the carve-out 312, and the protrusion 420 is sized to complement the carve-out 314. In this exemplary embodiment, the carve-outs of the processor lid 402 and the protrusions of the cooling device 412 are sized to permit the cooling device 412 to contact the heat transfer surface 422 of the processor lid 402 in a known aligned orientation. The heat transfer surface 422 represents a surface of the processor lid 402 disposed opposite a surface of the processor lid 402 that is configured to contact the internal components 406, 408, 410 and thereby transfer heat from the internal components 406, 408, 410 to a corresponding surface of the cooling device 412 that contacts the heat transfer surface 422.

[0048] To further improve heat transfer away from the internal components 406, 408, 410, the carve-outs increase the surface area of ​​the processor lid 402 in contact with the cooling device 412. For example, surface 424 represents a surface of the carve-out 310 that is approximately perpendicular to the heat transfer surface 422 that contacts the surface of the protrusion 416 when the cooling device 412 is mechanically aligned with and secured to the processor lid 402. Similarly, surface 426 represents a surface of the carve-out 312 that is approximately perpendicular to the heat transfer surface 422 that contacts the surface of the protrusion 418 when the cooling device 412 and the processor lid 402 are mechanically aligned with and secured to one another. The additional areas of surfaces 424 and 426 that contact the respective protrusions 416 and 418 provide additional means by which the processor lid 402 can conduct heat from the internal components 406, 408, 410 to the cooling device 412, thus enabling more efficient heat transfer relative to conventional lid designs.

[0049] As an added advantage over conventional processor lids, because the carve-outs are set back from the perimeter of the processor lid 402, represented by dashed line 428 in the illustrated example of Figure 4, the processor lid 402 allows for mechanical alignment and connection with the cooling device 412 even when the cooling device 412 has a footprint smaller than the footprint of the processor lid 402 or the processor board 404. In contrast to the no-go areas required by the conventional processor lid design shown in Figure 2, for example, the processor lid 402 provides secure and precise mechanical alignment of the cooling device 412 that is independent of one or more attachment points of the circuit board to which the device 400 is mounted, allowing for implementation in a more compact device and reducing the required PCB size to accommodate the device 400.

[0050] Another advantage provided by the processor lids including carve-outs described herein is the exposure of contacts disposed on the surface of the processor substrate protected by the processor lid. For example, FIG. 5 shows an example of a processor 500 having a lid 502 including a carve-out that exposes connections of the processor substrate 504. In the illustrated example, the lid 502 is shown as including multiple carve-outs, such as carve-out 506. The carve-out 506 demonstrates a recessed depression from the periphery of the lid 502 that exposes contacts 508, 510, 512 that would otherwise be covered by the lid 502 absent the carve-out 506. In some embodiments, each of the contacts 508, 510, 512 is configured as a surface mounted free pad connected to an internal component of the processor 500, such as a CPU, via one or more vias embedded in the processor substrate 504. Although described and illustrated herein in the context of being surface mounted free pads, contacts 508, 510, 512 represent any suitable type of component configured to establish a connection with an internal component (e.g., a CPU) of processor 500, such as one or more pads disposed on processor substrate 504.

[0051] In some embodiments, the contacts 508, 510, 512 are designed to establish an electrical connection between an internal component of the processor 500 (e.g., CPU) and the cooling device. For example, consider the embodiment with respect to the previously described example, where the lid 502 represents an example of the lid 302, such that the carve-out 506 corresponds to the carve-out 312 and is configured to receive the protrusion 418 of the cooling device 412. In this embodiment, the contacts 508, 510, 512 are configured to mechanically align with the processor lid 402 and establish an electrical connection with a corresponding contact disposed on a surface of the protrusion 418 that contacts the processor substrate 404 when secured thereto. Through the electrical connection enabled by the contacts 508, 510, 512, a high-speed data bus is established that communicatively couples the internal components of the processor 500 (e.g., one or more of the internal components 406, 408, or 410) and the cooling device 412. In this manner, the carve-out of the lid 502 allows internal components of the processor 500 to directly control and receive feedback from a cooling device secured to the processor 500 via the lid 502 .

[0052] The lid carve-outs described herein are configured to enable secure mechanical alignment of the cooling device and the processor, and communicative coupling between the cooling device and the processor, when the processor is inserted into a socket that connects the processor to an external environment, such as a printed circuit board. For example, FIGS. 6 and 7 show examples of processors including a lid with a carve-out described herein disposed within a processor socket. In the illustrated example 600 of FIG. 6, a processor 602 including a lid with a carve-out configured to align and secure a cooling device is shown inserted into the processor socket 604 while the processor socket is in an open position. In some embodiments, the processor socket 604 represents a zero-insertion force (ZIF) socket configured to connect the processor 602 to an external environment and retain the processor 602 when the processor socket 604 is in a closed position. The illustrated example 700 of FIG. 7 shows the processor socket 604 in a closed position retaining the processor 602. As is visible from the illustrated example 700, the outer lid periphery of the processor 602 is covered by a retaining cover of the processor socket 604 in the closed position, while the lid carve-out is recessed to a sufficient extent configured to receive a protrusion of a cooling device and establish a direct connection between the internal components of the processor 602 and the cooling device.

[0053] 8 is a diagram of a digital media environment 800 in which a processor 802 communicates directly with an enabled cooling device 804 via at least one connection exposed by a lid carve-out. In the illustrated example of FIG. 8, the processor 802 is shown as including a carve-out lid 806, which represents any of the lids 302, 402, or 502 described herein. The processor 802 is further shown as including a system management component 808. The system management component 808 represents functionality of the processor 802 configured to manage power consumption by one or more processor cores included in the processor 802 and to regulate heat transfer by communicating with the cooling device 804 via one or more contacts exposed by the carve-out of the carve-out lid 806.

[0054] To do so, the system management component 808 sends data to and receives data from a controller 810 of the cooling device 804. The arrows connecting the system management component 808 and the controller 810 represent communication paths established between the internal components of the processor 802 and the cooling device 804 using contacts located on a substrate of the processor 802 exposed by the carve-out lid 806 that communicatively couple with contacts located on one or more protrusions of the cooling device 804.

[0055] The system management component 808 controls the voltages supplied to the various components of the processor 802, represents the functionality of the processor 802 determining what operations each individual processor core is performing at a given time, what frequency is applied, etc., so that the system management component 808 is configured to control and dynamically change the operating environment of the processor 802 based on current or upcoming tasks. For example, the system management component 808 is configured to monitor the load of all processor components and dynamically change the frequency and voltage of each individual component while simultaneously monitoring the instantaneous and sustained power consumption and temperature of the components. The system management component 808 is further configured to access pre-programmed modeling information that describes different combinations of voltage, current and power levels for a given circuit configuration affect temperature. In some embodiments, the system management component 808 is configured to obtain feedback in real time that describes the temperatures of the different processor components, such as from thermal diodes built into the processor 802, from thermocouples distributed throughout the cooling device 804, etc.

[0056] As a result, the system management component 808 is informed of both the current task being performed by an individual component of the processor 802 and the next task to be performed by the individual component. Given this information, the system management component 808 is configured to predict, prior to commencing performance of an operation, whether a component of the processor 802 will meet a temperature threshold during performance of an operation. Through direct communication between the system management component 808 and the controller 810, the system management component 808 is configured to preemptively command the cooling device 804 to begin cooling the carve-out lid 806, perform targeted cooling on a portion of the carve-out lid 806 that corresponds to the component scheduled to perform an operation, or a combination thereof.

[0057] For example, the system management component 808 is configured to anticipate that the processor core of the processor 802 will meet a temperature threshold during performance of a next operation. Because the cooling device 804 is mechanically aligned with the processor 802 via the carve-out lid 806 in a known orientation, the system management component 808 is configured to instruct the cooling device 804 to initiate targeted cooling of a portion of the surface of the carve-out lid 806 disposed above the processor core. The specific manner in which the cooling device 804 is instructed to effect targeted cooling of the portion of the surface of the carve-out lid 806 depends on the configuration of the cooling device 804. For example, in an embodiment in which the cooling device 804 is configured to effect heat transfer via forced air, the system management component 808 is configured to instruct the cooling device 804 to focus airflow on a portion of the carve-out lid 806 corresponding to the processor core at an increased rate relative to the airflow over at least one other portion of the surface of the carve-out lid 806.

[0058] The system management component 808 is further configured to receive data from the controller 810 and take action based on the current state of the cooling device 804. For example, the system management component 808 is configured to monitor the electrical connection between the processor 802 and the controller 810 and detect a disconnect between the contacts connecting the processor 802 and the cooling device 804. As an example, in an embodiment where an external force, such as vibration, causes a misalignment of the cooling device 804, the system management component 808 is configured to output a notification (e.g., a visual indication via one or more lights connected to the processor 802, an audible notification, or a combination thereof indicating a cooling device alignment error). In this manner, the carve-out lid 806 enables the processor 802 to detect issues that would otherwise go undetected using conventional lid designs and generate an alert to correct the issue.

[0059] The following description describes techniques implemented using the aforementioned systems and devices. Aspects of the procedures may be implemented in hardware, firmware, software, or a combination thereof. The procedures are illustrated as a set of blocks that identify operations performed by one or more devices and are not necessarily limited to the order shown for performing the operations by each block. Furthermore, although various operations are described that are performed by one or more devices, the techniques described herein may additionally or alternatively include additional operations. In parts of the following description, reference is made to Figures 3-8.

[0060] 9 is a flow diagram 900 illustrating a procedure in an exemplary embodiment of a processor that communicates directly with a cooling device enabled through at least one connection exposed by a lid carve-out. In some embodiments, the operations of flow diagram 900 are performed by an internal component of the processor, such as the system management component 808 of the processor 802.

[0061] 9, it is determined that performance of an operation will cause the processor to meet a temperature threshold (block 902). The system management component 808 determines, for example, that an internal component of the processor 802 is performing an operation or will perform an operation that is likely to cause the internal component to heat up to the temperature threshold. In an embodiment, the temperature threshold is dependent on the computing device implementing the processor. Alternatively or additionally, the temperature threshold is dependent on the internal component, such that different internal components are associated with different temperature thresholds.

[0062] In response to determining that performance of the operation causes the processor to meet the temperature threshold, cooling of the processor is activated (block 904). The system management component 808, for example, sends instructions to a cooling device 804 attached to the processor 802 to initiate cooling of the processor 802. In some embodiments, the instructions to activate cooling of the processor 802 are sent via a direct connection between the system management component 808 and the controller 810 of the cooling device 804, which is established via an electrical connection exposed by the carve-out lid 806 of the processor 802. For example, the processor 802 includes contacts 508, 510, 512 that are configured to establish an electrical connection with contacts disposed on the protrusion 418 of the cooling device 804 when the cooling device 804 is mechanically aligned with and secured to the carve-out lid 806. In some embodiments, the instructions to activate cooling of the processor 802 identify a discrete location of the carve-out lid 806 for targeted cooling by the cooling device 804.

[0063] After activating the processor cooling, the processor is monitored (block 906). The system management component 808, for example, continues to monitor the processor 802 and determine both current and upcoming workloads to perform various processor functions. As part of monitoring the processor, a determination is made as to whether the processor meets an additional temperature threshold (block 908). In response to determining that the processor meets the additional temperature threshold, the cooling of the processor is increased (block 910). The system management component 808, for example, determines that a current and / or upcoming operation of the processor is likely to meet the additional temperature threshold and instructs the cooling device 804 to increase the cooling of the processor 802. For forced air embodiments, the system management component 808 instructs the cooling device 804 to increase fan speed, focus the airflow, and / or direct the additional cooling power to a designated portion of the carve-out lid 806. For liquid cooling embodiments, the system management component 808 instructs the cooling device 804 to increase the coolant flow rate. For cryogenic embodiments, the system management component 808 commands the cooling device 804 to increase the current in a portion, portions, or all of one or more heat transfer surfaces of the carve-out lid 806. For thermoelectric cooling embodiments, the system management component 808 commands the cooling device 804 to generate a heat flux (e.g., using the Peltier effect) to increase cooling in a designated portion, portions, or all of one or more heat transfer surfaces of the carve-out lid 806. For phase change cooling embodiments, the system management component 808 commands the cooling device 804 to change the state of the thermally conductive medium in a designated portion, portions, or all of one or more heat transfer surfaces of the carve-out lid 806. After increasing the cooling of the processor, the operations return to monitoring the processor, as represented by the arrow from block 910 returning to block 906.

[0064] Alternatively, in response to determining that the processor does not satisfy the additional temperature threshold, a determination is made as to whether the processor continues to satisfy the temperature threshold (block 912). In response to determining that the processor continues to satisfy the temperature threshold, operations return to monitoring the processor, as represented by the arrow from block 912 returning to block 906.

[0065] Alternatively, in response to determining that the processor does not continue to meet the temperature threshold, cooling of the processor is decreased (block 914). The system management component 808 may, for example, instruct the cooling device 804 to decrease cooling of a portion, portions, or all of one or more heat transfer surfaces of the carve-out lid 806. For forced air embodiments, the system management component 808 may instruct the cooling device 804 to decrease fan speed and / or reduce airflow concentration over a designated portion of the carve-out lid 806. For liquid cooling embodiments, the system management component 808 may instruct the cooling device 804 to decrease coolant flow rate. For cryogenic embodiments, the system management component 808 may instruct the cooling device 804 to decrease current flow over a portion, portions, or all of one or more heat transfer surfaces of the carve-out lid 806. After increasing cooling of the processor, operations return to monitoring the processor, as represented by the arrow from block 910 returning to block 906. In some embodiments, operation returns to monitoring the processor, as indicated by the dashed arrow from block 914 back to block 906. Alternatively, in embodiments where further cooling of the processor is not required (e.g., in response to detecting a system shutdown and / or a thermal reduction below a temperature threshold), system management component 808 instructs cooling device 804 to stop cooling processor 802.

[0066] Although features and elements are described above in particular combinations, each feature or element can be used alone without the other features and elements, or in various combinations with or without the other features and elements. Thus, many variations are possible based on the disclosure herein.

[0067] The various functional units shown in the figures and / or described herein may be implemented in any of a variety of different ways, such as hardware circuits, software or firmware running on a programmable processor, or any combination of two or more of hardware, software, and firmware. The methods provided may be implemented in any of a variety of devices, such as a general purpose computer, a processor, or a processor core. Suitable processors include, by way of example, a general purpose processor, a special purpose processor, a conventional processor, a CPU, a GPU, a parallel accelerated processor, multiple microprocessors, one or more microprocessors in association with a DSP core, a controller, a microcontroller, an ASIC, an FPGA circuit, any other type of integrated circuit IC, and / or a state machine.

[0068] In one or more embodiments, the methods and procedures provided herein are implemented in a computer program, software, or firmware embodied in a non-transitory computer-readable storage medium for execution by a general purpose computer or processor. Examples of non-transitory computer-readable storage media include read only memory (ROM), random-access memory (RAM), registers, cache memory, semiconductor memory devices, magnetic media such as internal hard disks and removable disks, magneto-optical media, and optical media such as CD-ROM disks and digital versatile disks (DVDs).

[0069] (Conclusion) Although the invention has been described in language specific to structural features and / or methodological acts, it is to be understood that the invention defined in the appended claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as exemplary forms of implementing the claimed invention.

Claims

1. 1. A processing device, comprising: a substrate including at least one processor core and one or more contacts configured to establish an electrical connection with the at least one processor core; an integrated heat spreader bonded to the substrate and covering the at least one processor core, the integrated heat spreader including a plurality of carve-outs exposing at least one of the one or more contacts, each of the plurality of carve-outs disposed along an edge of the integrated heat spreader and recessed from an outer periphery of the integrated heat spreader; Processing device.

2. the at least one processor core comprises one or more of a central processing unit, a graphics processing unit, or a parallel acceleration processor; The processing device of claim 1 .

3. the at least one processor core comprising a system management component configured to manage power consumption by the at least one processor core and to regulate heat transfer of the processing device by communicating with a cooling device via the one or more contacts. The processing device of claim 1 .

4. the plurality of carve-outs are configured to enable a press-fit connection between a cooling device and the at least one of the one or more contacts exposed by the plurality of carve-outs. The processing device of claim 1 .

5. the integrated heat spreader comprises a first surface configured to contact the at least one processor core, and a second surface disposed opposite the first surface and configured to transfer heat from the at least one processor core by contacting a cooling device. The processing device of claim 1 .

6. each of the plurality of carve-outs includes an additional surface oriented substantially perpendicular to the first surface and the second surface, the additional surface configured to mechanically align the integral heat spreader with a protrusion of a cooling device to transfer heat to the protrusion of the cooling device; The processing device of claim 5.

7. the at least one processor core is configured to determine, prior to execution of an operation, that execution of the operation will increase a temperature of the at least one processor core, and in response to determining, prior to execution of the operation, that execution of the operation will increase a temperature of the at least one processor core, instruct a cooling device to begin cooling the integrated heat spreader. The processing device of claim 1 .

8. the at least one processor core is configured to instruct the cooling device to begin cooling the integrated heat spreader by sending an instruction to a controller of the cooling device via the one or more contacts. The processing device of claim 7.

9. the at least one processor core is configured to instruct a cooling device to initiate targeted cooling of a portion of a surface of the integrated heat spreader, the portion of the surface of the integrated heat spreader being co-located with the at least one processor core relative to the substrate; The processing device of claim 1 .

10. the at least one processor core instructs the cooling device to initiate targeted cooling of a portion of the surface of the integrated heat spreader by concentrating airflow on the portion of the surface of the integrated heat spreader at an increased rate relative to airflow on at least one other portion of the surface of the integrated heat spreader. The processing device of claim 9.

11. the substrate is silicon, the one or more contacts are surface mount air pads, and the integral heat spreader is plated copper; The processing device of claim 1 .

12. 1. A method comprising: A processor determining that execution of an operation will cause the processor to reach a temperature threshold; detecting execution of the action by the processor; causing the cooling device to begin cooling the processor by transmitting a command via electrical contacts disposed on a substrate of the processor and contacting electrical contacts of a cooling device; method.

13. detecting the performance of the operation and causing the cooling device to begin cooling the processor is performed before the processor begins performing the operation.

13. The method of claim 12.

14. the processor includes a lid having a plurality of carve-outs recessed from an outer periphery of the lid, each carve-out being disposed along an edge of the lid, any of the carve-outs exposing the electrical contacts disposed on a substrate of the processor; 13. The method of claim 12.

15. the cooling device includes a plurality of protrusions that mechanically align the cooling device with the lid using the plurality of carve-outs; 15. The method of claim 14.

16. the electrical contact of the cooling device is disposed on any of the plurality of protrusions; 16. The method of claim 15.

17. in response to determining that the processor reaches an additional temperature threshold, causing the cooling device to increase cooling of the processor.

13. The method of claim 12.

18. determining that performing the action causes an internal component of the processor to reach the temperature threshold; causing the cooling device to initiate cooling of the processor includes instructing the cooling device to target a portion of a lid of the processor disposed above a portion of the substrate that includes the internal components of the processor.

13. The method of claim 12.

19. outputting a notification indicative of a cooling device alignment error in response to detecting a disconnection between the electrical contacts disposed on the substrate and the electrical contacts of the cooling device.

13. The method of claim 12.

20. 1. A system comprising: A processing device; a cooling device, The processing device comprises: a substrate having at least one processor core and one or more contacts; an integrated heat spreader bonded to the substrate and covering the at least one processor core, the integrated heat spreader including a plurality of carve-outs exposing the one or more contacts; The cooling device comprises: a plurality of protrusions for mechanically aligning the cooling device with the processing device; at least one of the plurality of protrusions is configured to establish an electrical connection with the at least one processor core using the one or more contacts. system.

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