Modular Integrated System Module

Abstract

The present disclosure provides a modularly designed and constructed building that includes one or more Integrated System Modules (ISMs) configured to be shipped and assembled on-site to construct an operational infrastructure for one or more application environments, each of the ISMs including two or more distinct functional components integrated on and / or supported by a common structural floor.

Description

[Background technology]

[0001] (cross reference) This application claims priority to U.S. Patent Application No. 18 / 052,867, filed November 4, 2022, which claims the benefit of U.S. Provisional Application No. 63 / 321,991, filed March 21, 2022, each of which is incorporated herein by reference in their entirety.

[0002] The industrialization of construction of facilities such as data centers, manufacturing facilities, laboratories, and medical facilities is enabling industry to dramatically reduce construction times and costs. Summary of the Invention [Means for solving the problem]

[0003] The industrialization of the construction of facilities such as data centers, manufacturing facilities, laboratories, and medical facilities has enabled the industry to dramatically reduce construction time and costs. However, there remains a need to further refine the construction process and further reduce the cost and time required to build such facilities. By way of example, the disclosure herein discusses ways in which the amount of material, time, cost, number of loads or shipping divisions, and on-site construction may be reduced when building such facilities. Additionally, the disclosure discusses ways to modularize the infrastructure of such facilities to reduce the cost and time for maintenance, conversion, and / or upgrade of such facilities.

[0004] Provided in some embodiments herein is a modular design and build building comprising one or more integrated system modules (ISMs) configured to be shipped, assembled, and constructed an operational infrastructure for one or more application environments, each of the ISMs comprising two or more distinct functional components integrated onto and / or supported by a common structural floor.

[0005] In some embodiments, one or more application environments comprise (i) a data center, (ii) a location with information storage, processing, or communication capabilities or functionality, or (iii) a facility requiring one or more operational infrastructure elements.

[0006] In some embodiments, one or more ISMs are assembled to form one or more levels within one or more application environments. In some embodiments, the one or more levels are configured to increase vertical density and reduce one or more of the area, volume, or spatial footprint of the one or more application environments. In some embodiments, individual ISMs in one or more levels are removable or replaceable.

[0007] In some embodiments, one or more levels are configured to separate or divide volumes or spaces within one or more application environments, hi some embodiments, one or more levels comprise a porous layer that is permeable to air, gas, or fluid.

[0008] In some embodiments, one or more levels include a barrier layer that is impermeable to air, gas, or fluids. In some embodiments, one or more levels include at least one level that includes or forms an intermediate space.

[0009] In some embodiments, the two or more different functional components are associated with at least one or more of the following: electrical, power, mechanical, plumbing, cooling, heating, network connectivity, data transmission, sensors or sensing, fire suppression, and / or chemical or biological materials management.

[0010] In some embodiments, one or more ISMs are provided having a standardized size or format to facilitate ease of transportation such that the ISMs can be shipped using conventional modes of transportation and fewer shipping installments, and without requiring modification or customization of the size, weight, or height of a shipping container or vehicle, where conventional modes of transportation include ground, sea, rail, or air transportation modes.

[0011] In some embodiments, one or more ISMs utilize a platform base that allows for (i) interchangeability of functional components or their physical order / arrangement within the ISM, and / or (ii) changes in interchangeability, combinations, or arrangements between different ISMs.

[0012] In some embodiments, one or more ISMs are configured to facilitate rapid assembly using a smaller number of mechanical and / or electrical connections / connectors and in less time than other application environments not constructed using the ISMs.

[0013] Provided in some embodiments herein is a method for modularly constructing an operational infrastructure, the method including: (a) providing one or more integrated system modules (ISMs), each of the ISMs comprising two or more distinct functional components integrated on and / or supported by a common structural floor; and (b) assembling the one or more ISMs to construct an operational infrastructure for one or more application environments. [Brief description of the drawings]

[0014] The novel features of the present disclosure are set forth with particularity in the appended claims. A better understanding of the features and advantages of the present disclosure will be obtained by reference to the following detailed description that sets forth illustrative embodiments in which various principles are utilized and illustrated, and the accompanying drawings.

[0015] [Figure 1]FIG. 1 is a block diagram for an integrated system module (ISM) as described herein in accordance with some embodiments.

[0016] [Figure 2A] FIG. 2A is a perspective view of an ISM according to some embodiments.

[0017] [Figure 2B] FIG. 2B is a cross-sectional view of an ISM according to some embodiments.

[0018] [Figure 3A] 3A-3B illustrate an ISM with different functional components according to some embodiments. [Figure 3B] 3A-3B illustrate an ISM with different functional components according to some embodiments.

[0019] [Figure 4A] 4A-4B are perspective views of a cooling distribution unit (CDU) according to some embodiments. [Figure 4B] 4A-4B are perspective views of a cooling distribution unit (CDU) according to some embodiments.

[0020] [Figure 5A] 5A-5B are perspective views of a cooling device according to some embodiments. [Figure 5B] 5A-5B are perspective views of a cooling device according to some embodiments.

[0021] [Figure 5C] FIG. 5C is a cross-sectional view of a cooling device according to some embodiments.

[0022] [Figure 5D] FIG. 5D is a perspective view of a cooling system according to some embodiments.

[0023] [Figure 6]FIG. 6 is a top-down view of a data center according to some embodiments.

[0024] [Figure 7] 7-8 are block diagrams for an ISM integrated with an application environment according to some embodiments. [Figure 8] 7-8 are block diagrams for an ISM integrated with an application environment according to some embodiments.

[0025] [Figure 9A] FIG. 9A is a perspective view of a structure and application environment housing an ISM according to some embodiments.

[0026] [Figure 9B] FIG. 9B is a cross-sectional view of a structure housing an ISM and an application environment according to some embodiments.

[0027] [Figure 10] FIG. 10 is a perspective view of a structure and application environment housing an ISM according to some embodiments.

[0028] [Figure 11] FIG. 11 is a cross-sectional view of a structure and application environment housing an ISM according to some embodiments.

[0029] [Figure 12A] FIG. 12A is a top-down view of an ISM system according to some embodiments.

[0030] [Figure 12B] FIG. 12B is a cross-sectional view of an ISM and an application environment according to some embodiments.

[0031] [Figure 13A] 13A-13C illustrate the structural enclosure and application environment of an ISM according to some embodiments. [Figure 13B]13A-13C illustrate the structural enclosure and application environment of an ISM according to some embodiments. [Figure 13C] 13A-13C illustrate the structural enclosure and application environment of an ISM according to some embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Reference will now be made in detail to the exemplary embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the disclosure to refer to the same or like parts.

[0033] As used in this specification and the claims, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise.

[0034] As used herein, the term "about" a number refers to + or -10%, 9%, 8%, 7%, 6%, 5%, 4%, 3%, 2%, 1% of that number.

[0035] As used herein, and unless otherwise specified, the term "substantially" and similar terms are defined primarily, but not necessarily entirely, as defined, as would be understood by one of ordinary skill in the art. In any disclosed embodiment, the terms "substantially," "approximately," "generally," and "about" may be substituted "within [a percentage] of" what is specified, where the percentage includes 0.1, 1, 5, and 10 percent.

[0036] The terms "facility," "building," and "structure" may be used interchangeably herein.

[0037] The term "component" may be referred to synonymously as a system or a subsystem. In some cases, a component may be a system or a subsystem. In other cases, a component may be part of a system or a subsystem.

[0038] The term "Integrated System Module (ISM)" may be referred to herein interchangeably as a skid.

[0039] The term one or more ISMs may refer to one ISM, multiple ISMs, a subassembly of ISMs, or an assembly of ISMs.

[0040] The terms "modular assembly kit and kit" may be referred to interchangeably herein.

[0041] Disclosed herein is a modular integrated system module (ISM) for use in various application environments. The dimensions, weights, and inclusions of the different functional components of the ISM can be configured in such a way that the ISM can be modularly applied to one or more application environments. The dimensions, weights, and inclusions of the different functional components of the ISM can be configured in such a way that the ISM can be shipped using various shipping methods. The dimensions, weights, and inclusions of the different functional components of the ISM can be configured in such a way that different functional components can be removed from or added to an assembly or subassembly of the ISM to upgrade and / or adapt the ISM to different application environments. The ISM can be configured to be shipped and assembled in-site to build an operational infrastructure for one or more application environments. In some embodiments, one or more integrated system modules (ISMs) are configured to be shipped and assembled to build an operational infrastructure for one or more application environments, each of the ISMs comprising two or more different functional components integrated on and / or supported by a common structural floor. In some embodiments, the ISM may be configured to physically define the application environment (e.g., create an enclosure for the application environment). In some embodiments, the ISM may be integrated within the application environment itself (e.g., the ISM may be integrated within a data center). In some cases, Some of the ISMs can be assembled off-site to build an ISM sub-assembly that is shipped and later integrated on-site with existing ISMs already in the application. In some cases, a single / individual ISM can be shipped and installed in one or more applications. In some cases, one or more individual ISMs are shipped and installed in one or more applications. In some cases, a group or collection of ISMs (e.g., not yet assembled) are shipped and installed in one or more applications.

[0042] In some embodiments, a modular design and build building may comprise one or more ISMs that are configured to be shipped and assembled on-site to construct operational infrastructure for one or more application environments, and each of the ISMs may comprise two or more distinct functional components integrated on and / or supported by a common structural floor.

[0043] In some embodiments, the one or more application environments may comprise a data center. In some embodiments, the data center may comprise a land-based data center or a water-based data center. In some embodiments, the one or more application environments may comprise a manufacturing facility, a laboratory, or a medical facility, etc. In some embodiments, the one or more application environments may comprise a cryptocurrency mining facility, a vertical farming facility, etc. In some embodiments, the one or more application environments comprise a data center; a location with information storage, processing, or communication capabilities or functionality; or a facility requiring one or more operational infrastructure elements.

[0044] 1 illustrates a block diagram of an example ISM as described herein. As shown in FIG. 1, an ISM may include one or more functional components. By way of example, an ISM may include two or more different functional components integrated on and / or supported by a common structural floor.

[0045] The two or more functional components, in any embodiment described herein, may be associated with at least one or more of the following, as non-limiting examples: electrical, mechanical, plumbing, cooling, network connectivity, and / or fire suppression. In some embodiments, the two or more different functional components may be associated with at least one or more of the following: electrical, power, mechanical, plumbing, cooling, heating, network connectivity, data transmission, sensors or sensing, fire suppression, and / or chemical or biological material management. In some embodiments, the two or more functional components, in any embodiment described herein, may be associated with at least one or more of the following, as non-limiting examples: a gantry system for moving equipment, a heating, ventilation, and air conditioning (HVAC) system, a vacuum system, an air purification system, or any other equipment involved in the manufacturing of products (e.g., semiconductor manufacturing, drug manufacturing, food manufacturing, automobile manufacturing, etc.). Each of these different types of functional components will be described in further detail herein. In some embodiments, the two or more different functional components may comprise at least one functional component located below the structural floor. In some embodiments, the at least one functional component below the structural floor may comprise a first functional component consisting of a mechanical, electrical, and plumbing (MEP) package that may be located within an intermediate space below the upper surface of the structural floor. In some embodiments, the at least one functional component below the structural floor may comprise a second functional component consisting of one or more ceiling packages below and / or adjacent to the MEP package. In some embodiments, the ceiling package may be located above or overhead one or more application environments. In some embodiments, the ceiling package may be configured to vertically connect one or more application environments. In some embodiments, the two or more different functional components may comprise a first functional component and a second functional component, where the first functional component may be configured to be supported on the upper surface of the structural floor and the second functional component may be configured to be supported within an intermediate space below the upper surface of the structural floor.

[0046] In some embodiments, the first functional component may comprise a power equipment or a cooling distribution unit (CDU). In some embodiments, the second functional component may comprise a mechanical, electrical, and plumbing (MEP) package. In some embodiments, the two or more distinct functional components further comprise a third functional component adjacent to the intermediate space. In some embodiments, the third functional component may comprise a ceiling package configured to be connected to one or more application environments in an overhead manner. In some embodiments, the third functional component is located closer to the one or more application environments than the first functional component or the second functional component. In some embodiments, the third functional component is located closer to the second functional component than the first functional component. In some embodiments, the second functional component is located between the first functional component and the third functional component. In some embodiments, at least one of the first, second, or third functional components is functionally and / or operationally decoupled from the other functional components. In some embodiments, all of the first, second, and third functional components are functionally and / or operationally decoupled from each other.

[0047] 2A illustrates a perspective view of an example ISM comprising three functional components. As shown in FIG. 2A, the functional components may comprise a ceiling package 202, a structural floor 204, and power equipment 206. As an example, the ISM of FIG. 2A may be applicable for a data center. The ISM may also be applicable to one or more other application environments as described herein.

[0048] The ISM ceiling package 202 can be located below and in close proximity to the structural floor 204 so that it is the closest functional component to the application environment below the ISM. As an example, the ceiling package 202 can be located above or overhead a data center. The ceiling package 202 can include the necessary connections to connect to the data center. As an example, the ceiling package can include the necessary power and network connection cabling that is required by the data center to be powered at all times and to connect to the network. In addition, the ceiling package 202 can include the necessary power cables for use in providing power to different components of the data hall (e.g., lights, alarms, ventilation, and other equipment commonly used in a data hall environment). In some embodiments, the ceiling package allows one or more ISMs to be connected to servers, storage devices, and / or networking gear located within the data hall. As an additional example, the application environment can be a manufacturing facility and the ceiling package can house the power cables, compressed air lines, hydraulic lines, etc. required to run the manufacturing equipment below the ISM.

[0049] In some embodiments, the MEP package may be included and located below the structural floor 204. As shown in FIG. 2A, the MEP package and ceiling package 202 are located below the structural floor. The power equipment 206 is located above the structural floor 204. In some embodiments, the MEP package may include equipment necessary to properly operate and maintain a facility that houses an application environment (e.g., a data center, or a manufacturing facility) and / or equipment necessary to properly operate and maintain an application environment (e.g., a data center, or a manufacturing facility). As an example, the application environment may include a data center that includes a data hall that includes a plurality of data racks. The MEP package may include the necessary mechanical, electrical, and plumbing equipment required for a building that houses the data hall. In some embodiments, a facility may house two or more application environments. One or more ISM MEP packages may then be configured to house such a facility that includes two or more application environments.

[0050] In some embodiments, the MEP package may also include the equipment necessary to properly operate and maintain the application environment. By way of example, the application environment may be a data center and the MEP package may include the necessary cooling pipes for use in cooling the data center and keeping it at a desired temperature.

[0051] As shown in FIG. 2A, the MEP package may be located below the structural floor 204. In some embodiments, the MEP package is located within an intermediate space below the upper surface of the structural floor. As shown in FIG. 2A, the intermediate space below the upper surface of the structural floor may be partially encapsulated. In some embodiments, the intermediate space below the upper surface of the structural floor is partially encapsulated by columns, bulkheads, walls, gantries, and / or trusses. In some embodiments, the columns, bulkheads, walls, gantries, and / or trusses provide structural integrity to the structural floor. In some embodiments, the columns, bulkheads, walls, gantries, and / or trusses are designed to protect a second functional component located within the intermediate space. As shown in FIG. 2A, the intermediate space below the structural floor 204 is configured to encapsulate the MEP package.

[0052] 2A, the ceiling package 202 is below and in close proximity to the MEP package. In some embodiments, the ceiling package 202 can be configured with the necessary mechanical connections / connectors to connect the ceiling package 202 to the MEP package. In some embodiments, the ceiling package 202 is not connected to the MEP package.

[0053] FIG. 2B illustrates a cross-sectional view of the ISM. As shown in FIG. 2B, the power equipment 201 and 202 are mounted on top of the structural floor 204. The structural floor includes an intermediate space 203, in this example, which includes steel trusses for structural integrity and to provide a space in which the different functional components of the ISM can be housed and protected. In some embodiments, the intermediate space 203 can encase the MEP package. In some embodiments, the intermediate space 203 can encase both the MEP package and the ceiling package. In some embodiments, the intermediate space 203 can encase the MEP package and the ISM can include the ceiling package below the intermediate space 203. In some embodiments, the intermediate space can encase the MEP package and a portion of the ceiling package.

[0054] In some embodiments, one or more ISMs are provided having a standardized size or format to facilitate ease of transportation, whereby the ISMs can be shipped using conventional modes of transportation and fewer shipping installments, without requiring modification or customization of the size, weight, or height of a shipping container or vehicle, where conventional modes of transportation include ground, sea, rail, or air transportation modes.

[0055] In some embodiments, one or more ISMs utilize a platform base that allows for (i) interchangeability of functional components or their physical order / location within the ISM, and / or (ii) interchangeability, coupling, or modification in the order of placement between different ISMs. In some embodiments, the platform base for each ISM may vary in structure or size (e.g., steel size), but the manner in which each of the many functional components that the ISM may accommodate is coupled to the platform base may remain the same for each ISM. As will be described herein, each individual functional component of an ISM can be accessed, repaired, replaced, and / or upgraded with new or different functional components. This has greatly increased the flexibility of the ISM and the ease with which the ISM may be adjusted or modified to accommodate one or more application environments. This allows an existing ISM assembly to be modified to accommodate an entirely new application environment for which it was not previously designed, without the need for an entirely new assembly of the ISM, which would be necessary for a new building to accommodate the new application environment. In some embodiments, the standardized size / format allows for more production / fabrication during the manufacturing process in the factory compared to standard designs, and there is less on-site work to be done once the ISMs are delivered to their intended application environments. In some embodiments, one or more ISMs are configured to facilitate rapid assembly using fewer mechanical and / or electrical connections / connectors and less time compared to other data centers not built with ISMs. Reducing the number of mechanical and electrical connections allows for quicker and reduced on-site time to install the ISM system, and therefore requires less labor, time, and money to install the ISM system.

[0056] In some embodiments, conventional transportation modes that may be used to transport the ISM include ground, sea, rail, and air transportation modes. In some embodiments, in addition to requiring less on-site installation, the standardization of the ISM also allows for fewer shipment splits. As an example, current technology systems may require over 40 individual shipments to ship all the required equipment to install the system. In some embodiments, the ISM described herein allows more equipment to be included in each ISM (e.g., equipment can be connected / attached to the ISM prior to shipment, reducing the overall number of shipping containers required), thus reducing the total number of shipments required. For example, the ISM of the present invention can reduce the total number of shipments required by 50% or more. In some preferred embodiments, the ISM of the present invention can reduce the total number of shipments required by about 60% to about 90%.

[0057] In some embodiments, a standardized ISM also requires less material in the manufacturing / production process as compared to current technology systems. For example, materials may include concrete, steel, wiring, etc. to produce one or more ISMs. In some embodiments, a standardized ISM may reduce material usage by at least 30% or more as compared to current technology systems.

[0058] 2A, an ISM may have height (H), length (L), and width (W) dimensions. In some embodiments, the dimensions of the ISM may be constrained by standard shipping requirements such as bridge height, road width, and vehicle length. In some embodiments, the dimensions of the ISM may be constrained within the standardized dimensions of a shipping container.

[0059] In some embodiments, the height of the ISMs is configured in a manner that accommodates the shipping mode. For example, the height of each ISM may be based on the height of a bridge on a shipping road or the height of a shipping container that houses the ISM for shipping. In some embodiments, the height of each ISM may vary from ISM to ISM. In some embodiments, the height of each ISM is determined by two or more functional devices included in each ISM. In some embodiments, the height of each ISM may change as the functional components of the ISM are changed.

[0060] In some embodiments, the length of each ISM is configured in a manner to accommodate the shipping mode. For example, the length may be based on the maximum length of an open bed trailer or the maximum length of a shipping container that will accommodate the ISM for shipping.

[0061] In some embodiments, the width of each ISM is configured in a manner that accommodates the shipping mode. For example, the width of each ISM may be based on the width of the highways and / or interstates within the country to which the ISM is being shipped. In some embodiments, the country is the United States. In some embodiments, the country is a European country. In some embodiments, the country is any country.

[0062] In some embodiments, the length and width of each ISM constitutes the footprint size of the ISM. In some embodiments, the footprint size of each ISM is configured to accommodate the shipping mode or to accommodate the specific facility housing the application environment. The footprint size can be configured to allow a maximum number of ISMs to be installed in the application environment.

[0063] In some embodiments, the modularity of the ISM, particularly the manner in which the vertical height of the ISM can be scaled and adjusted, allows for a significantly reduced footprint compared to current technology systems. In some embodiments, the ISM of the present disclosure allows for a reduction in footprint of about 40% or more compared to current systems. In some preferred embodiments, the ISM of the present disclosure allows for a reduction in footprint of about 40% to about 60% compared to current systems. As an example, current systems for a 10 MW data center may require 36,000 square feet or more of building space to successfully operate and maintain the data center. A data center implementing one or more ISMs of the present disclosure may reduce its footprint to 18,000 square feet. This is because the ISM includes two or more functional components that are stacked vertically. Current systems require individual equipment for cooling, power supplies, piping, mechanical, wiring, plumbing, fire suppression, etc., and are not stackable.

[0064] In some embodiments, the length, width, and height of each ISM constitute the volume of the ISM. In some embodiments, the volume of each ISM is between about 3,500 cubic feet and about 5,000 cubic feet. In some embodiments, the volume of each ISM is between about 1,500 cubic feet and about 2,500 cubic feet. In some embodiments, the volume of each ISM is less than about 10,000 cubic feet.

[0065] In some embodiments, the weight of each ISM may be measured in a fully loaded state (e.g., including all functional components and equipment), an unloaded state (e.g., an ISM without any functional components or equipment), or a lightest state (e.g., an ISM without all functional components or equipment). In some embodiments, the weight of each ISM is heavier in a fully loaded state compared to each ISM in an unloaded or lightest state. In some embodiments, the weight of each of the ISMs may be the same or different. In some embodiments, the weight of each ISM is configured to accommodate transportation, shipping, and / or assembly / lifting requirements.

[0066] In some embodiments, the shape of each ISM can be linear. In some embodiments, the shape of each ISM can be non-linear (e.g., pod, circular, spherical). In some embodiments, one or more ISMs can include linear and non-linear (e.g., pod, circular, spherical) ISMs. As will be described herein, the shape of the ISMs can be configured to conform and match the shape of a particular building or facility that houses one or more application environments.

[0067] 3A-3B illustrate an ISM with different functional components 306 located / supported on an upper surface of a structural floor 304. As shown in FIG. 3A, the functional components on the upper surface of the structural floor 304 can be power equipment. In some embodiments, the ISM can be a primary electric ISM. In some embodiments, the primary electric ISM can provide up to 10 MW or more of power. In some embodiments, the power capacity of the primary electric ISM can be determined by the physical size of the ISM. For example, a larger ISM can provide a higher power capacity and a smaller ISM can provide a lower power capacity. In some embodiments, one or more ISMs can be configured to support power equipment and provide an uninterrupted power source to one or more devices / elements of the application environment. For example, the application environment can be a data center and one or more ISMs can be configured to have power equipment and provide an uninterrupted power source to the data center. In some embodiments, the power equipment can include a battery room, an uninterrupted power supply (UPS), and a static transfer switch (STS). In some embodiments, the battery room may be configured to house one or more batteries. In some embodiments, one or more batteries may be housed and provide supplemental power to the application environment. In some embodiments, one or more batteries may be stored and provide an adequate power source to the application environment in the event that the normal power source in the facility fails. In some embodiments, the one or more batteries may be charged by the normal power source in the facility or from one or more renewable energy sources (e.g., solar or wind sources). In some embodiments, the ISM ceiling package may house the necessary cabling and couple the power equipment to the application environment. For example, the application environment may be a data center and the ceiling package may be configured to house the necessary connections between the power equipment in the data center and the servers, storage devices, and / or networking gear.In some embodiments, the primary electric ISM may be configured to provide an amount of power of 2N (e.g., N is the amount of power required to run one or more applications, and 2N means that if one power source fails or requires maintenance, the other acts to fill in). In some embodiments, the primary electric ISM may be configured to provide higher or lower amounts of power depending on the power requirements of the application.

[0068] As shown in FIG. 3B, the functional components 306 above the structural floor 304 can be network and fire suppression equipment. In some embodiments, the ISM can be referred to as an accessory ISM. As an example, the application environment can be a data center. In some embodiments, one or more ISMs can be configured to stock fire suppression equipment as required by regulations (e.g., local, regional, or national regulations). For example, the fire suppression equipment can quickly extinguish any fire that may arise from the application environment. In some embodiments, one or more ISMs can house necessary fire suppression, network equipment, and other functions not included in any other ISM. For example, a ceiling package can include a fire retardant and the ceiling package can house the equipment necessary to apply the fire retardant to the application environment.

[0069] Returning to FIG. 3A, as an additional example, the ISM supporting the power equipment 306 on top of the structural floor 304 may be a reserve power ISM. In some embodiments, the reserve power ISM may provide at least 1.0 kW of power up to 10 MW of power. In some embodiments, the power capacity of the reserve power ISM may be determined by the physical size of the ISM. For example, a larger ISM may provide a higher power capacity and a smaller ISM may provide a lower power capacity. In some embodiments, the application environment may be configured to have one reserve power ISM. In some embodiments, the application environment may be configured to have two or more reserve power ISMs. In some embodiments, the application environment may be configured to have a ratio of reserve power ISM to primary power ISM of 1:1 to 1:N (where N is any integer greater than 2). As shown, the power equipment may include a battery room and a power distribution panel. In some embodiments, the battery room may be configured to store one or more batteries. In some embodiments, one or more batteries may be stored and provide supplemental power to the application environment. In some embodiments, one or more batteries may be stored and provide an adequate power source to the application environment in the event that the facility's normal power source fails. In some embodiments, the one or more batteries may be charged by the facility's normal power source or from one or more renewable energy sources (e.g., solar or wind sources). In some embodiments, the power distribution panel may be configured to distribute energy to the application environment or to one or more other ISMs. For example, there may be one or more ISMs with functional components that require power. The one or more ISMs with the power distribution panel may be connected to one or more other ISMs (e.g., in an assembly or subassembly of ISMs as will be described herein) to provide power to those functional components. In some embodiments, the ceiling package and / or MEP package may be configured to include the necessary cabling and connections to connect between one or more ISMs.

[0070] In some embodiments, one or more ISMs utilize a platform base that allows for interchangeability and / or upgrades of functional components within an ISM and between different ISMs. For example, an ISM may be configured to utilize power equipment as described above. In some embodiments, the power equipment may be removed and replaced with a CDU or fire suppression equipment. This greatly improves modularity and applicability of one or more ISMs to different applications. This allows individual components to be replaced (e.g., at a micro level) instead of replacing the entire ISM with a new ISM (e.g., at a macro level). In some embodiments, an ISM may be replaced with a new ISM. In some embodiments, the application may be a data center, and one or more ISMs may include a CDU, cooling equipment, fire suppression equipment, MPE packages, ceiling packages, and power equipment. As an example, a data center may expand and increase the need for cooling. One or more ISMs may be modified to support cooling equipment and increase cooling capacity. Or, as the data center becomes larger, it may increase power demands. One or more ISMs may be modified to support power equipment and meet needs. As another example, power equipment on one or more ISMs may fail. In some embodiments, new power equipment may replace the failed equipment on an existing ISM.

[0071] In some embodiments, a cooling system is implemented between one or more ISMs. In some embodiments, the cooling system is a closed loop water-based cooling system. In some embodiments, the cooling system is an open loop water-based cooling system. In some embodiments, the water is obtained from a natural source of water, such as from a river, ocean, lake, or other suitable body of water.

[0072] By way of example, the application environment may be a data center. In some embodiments, a data center is a facility designed to house, maintain, and power a plurality of computer systems. The computer systems in a data center are generally rack-mounted in support frames, referred to as racks. The data center is defined to maintain suitable internal ambient conditions therein for proper operation of the computer systems (e.g., based on requirements or expectations, as expressed via a service level agreement (SLA)).

[0073] A key constraint of a data center is cooling capacity. Each watt consumed by a computer system is a watt of waste heat that must be removed to maintain a suitable operating temperature. Traditional data centers employ a variety of cooling technologies, including refrigerants and water-based air-cooled systems. These systems have varying efficiency ranges and in some cases account for more than 30% of the total power consumed within the data center.

[0074] As power densities within data centers continue to increase, data center providers are often challenged with cooling demands that can quickly outstrip data center capacity. In some embodiments, the cooling systems described herein provide increased cooling capacity.

[0075] In some embodiments, the open loop and / or closed loop systems described herein may be implemented using any of the following techniques: , 11,224,145, or U.S. patent application Ser. Nos. 16 / 934,001, 17 / 588,363, 16 / 022,030, 17 / 524,749, 17 / 542,491, 17 / 381,182, 15 / 972,066, or 17 / 460,672 (all of which are incorporated by reference herein in their entireties).

[0076] As illustrated in FIG. 4A, the ISM may be configured to support one or more cooling distribution units (CDUs) 400 on top of the upper surface of the structural floor. One or more ISMs in an ISM assembly may have one or more CDUs configured to facilitate cooling of the application environment. For example, the CDUs may connect to an open and / or closed loop water-based cooling system and provide cooling water throughout the individual ISMs in the ISM assembly, which in turn provide cooling water to the application environment below. In some embodiments, each CDU may provide at least about 100 kW to about 10 MW of cooling capacity. In some embodiments, the cooling capacity of each CDU may be configured to be higher or lower to accommodate the cooling requirements of the application environment. In some embodiments, the number of CDUs included in an application environment may be N+1 (e.g., where N is the cooling capacity required to operate one or more applications and N+1 is the cooling capacity required to operate one or more applications taking into account additional components to compensate for failure or maintenance of one CDU). In some embodiments, the cooling system (e.g., the number of CDUs included in the application environment) may be configured to provide N, N+1, N+2, N+3, N+4, or N+5 or more cooling capacities, or 2N, 3N, 4N, or 5N or more cooling capacities.

[0077] As illustrated in FIG. 4B, one or more CDUs 400 may include a MEP distribution board 401, a heat exchanger 402, a buffer tank 403, a venturi 404, a pump 405, closed loop piping 406, and open loop piping 407. As shown, the piping required for the cooling system may be housed within the MEP package space in the intermediate space below the upper surface of the structural floor. In some embodiments, the piping required for the cooling system may span between the MEP spaces of several ISMs and connect to the application environment via a ceiling package connection to provide the required cooling to the application environment. Integrating the piping required for the cooling system and the CDU into one or more ISMs simplifies the installation and start-up of the assembly of the ISMs. In some embodiments, four CDUs may be aggregated on a dual CDU skid, as shown in FIG. 4B. Dual CDUs 408 and 409 may be included on a dual CDU skid such that the skid may include four CDUs. In some embodiments, one or more CDUs are located above the closed loop system, which can reduce entrained air and simplify installation and start-up.

[0078] 5A-5C illustrate further examples of cooling equipment 500 that may be implemented in one or more embodiments herein. As shown in FIG. 5A, the cooling equipment may be configured to be supported below a top surface of a structural floor of the ISM 520. In some embodiments, the cooling equipment is included in a ceiling package with distribution piping included in an intermediate space. In some embodiments, the ISM shown in FIGS. 5A-5C does not have functional components above the top of the structural floor of the ISM. In some embodiments, the ISM shown in FIGS. 5A-5C has any one or more of the functional components described herein. In some embodiments, the cooling equipment may be hot aisle cooling equipment. In some embodiments, the cooling equipment is connected to one or more CDUs above the structural floor. In some embodiments, the cooling equipment of FIGS. 4A-4B and 5A-5C may comprise a cooling system. In some embodiments, the application environment is a data center comprising multiple cabinets. In some embodiments, the cooling system may be configured to accommodate the cooling requirements of the application environment. For example, the application environment can be a data center and the cooling system can be configured to provide the required cooling based on the number of data racks and the number of cabinets per data rack included in the data center. In some embodiments, a rear door can be added to the cooling system for higher density cooling.

[0079] As shown in FIG. 5B, the cooling equipment may include two pods 507 with up to 20 racks in each pod. In some embodiments, the cooling equipment provides a hot aisle cooling system. The hot aisle cooling system may be implemented to control and optimize airflow within a data center by isolating exhausted heated air from one or more application environments and conditioning the hot air with cooling units (e.g., as described herein) proximate to (e.g., above) the heat source. In some embodiments, the hot aisle cooling system described herein may include a hot aisle cooling system as disclosed in U.S. Patent Application No. 16 / 022,030 (herein incorporated by reference in their entirety).

[0080] In some embodiments, the pod configuration (e.g., the number of pods, the number of racks in each pod, and the size of the racks) can be configured to accommodate the cooling requirements of the application environment. For example, the application environment can be a data center, and the pod configuration can be configured to provide the required cooling based on the number and size of data racks and the number of cabinets per data rack included in the data center. In some embodiments, the pod configuration can be configured to comply with industry standards based on secure entry / exit requirements. In some embodiments, the pod 507 is included in the MEP and / or intermediate space of the ISM. In some embodiments, the pod 507 extends below the MEP and / or intermediate space of the ISM. As illustrated in FIG. 12B, the pod 305 extends below the MEP and / or intermediate space and toward the application environment 304. In some embodiments, the pod 507 is included in the ceiling package of the ISM. In some embodiments, the ceiling package includes the necessary connectors to connect the pod 507 to the application environment. In some embodiments, the ISM may not or need not have any functional components on top of the structural floor. Instead, the functional components of the ISM may be entirely contained, installed, or located below the structural floor (e.g., in and / or below the intermediate space). In some embodiments, such an ISM may be more general and occupy a larger proportion of modules than other ISM designs in a given system. Containing the cooling equipment within the ISM may greatly improve the installation (e.g., reducing the number of piping connections required) and movement of the ISM and cooling system, and may also improve operation and maintenance. This may also simplify operation and maintenance of the ISM compared to current technology systems. In some embodiments, there may be a reduction (e.g., optimization) in the number of piping connections required compared to current technology systems for cooling systems (e.g., liquid cooling or chilled water systems).In some embodiments, the piping may utilize quick connect couplers and valves, including Victaulic® connections / connectors, for rapid assembly and to reduce (i) the number of couplers / valves required in the system and (ii) the difficulty of connecting the system. For example, the quick connect couplers and valves may include mechanical groove couplers configured to join mechanical pipes together and create a watertight joint.

[0081] 5D, the cooling equipment may also include a closed loop supply 501, a spare take off valve 502, a fan 503, controls 504, one or more coils 505, and a closed loop return 506. In some embodiments, the piping required for the cooling equipment is contained / encased within the MEP and / or intermediate space located below the upper surface of the structural floor of the ISM.

[0082] In some embodiments, the cooling equipment can be configured to implement a rear door cooling system, an immersion cooling system, and / or a direct-to-tip cooling system in addition to hot aisle cooling. In some embodiments, the ISM ceiling package includes the necessary connections to connect one or more ISM cooling equipment to a rear door, immersion, and / or direct-to-tip cooling system.

[0083] In some embodiments, a rear door cooling system is used to remove heat loads from an application environment. By way of example, one or more application environments may include a data center, and the rear door cooling system may remove heat from the IT load of the data center. In some embodiments, a rear door heat exchanger may be configured to attach to a rear of each of one or more data racks in the data center. In some embodiments, each rear door heat exchanger is configured to cool hot air exhausted from a rear of each of one or more data racks in the data center.

[0084] In some embodiments, an immersion cooling system is used to remove heat loads from an application environment. As an example, one or more application environments may include a data center, and an immersion cooling system may remove heat from the IT load of the data center. In some embodiments, one or more components of the data center (e.g., electrical components, a range of hardware) may be immersed in a non-conductive liquid to provide increased cooling capacity compared to air cooling. In such cases, heat generated by the data center components is directly and efficiently transferred to the fluid. Immersing the data center components in the fluid may also protect the components from air-borne particulates, humidity, oxidation, and eliminate fan vibrations (e.g., fan vibrations caused by air-cooled systems, etc.).

[0085] In some embodiments, a direct-to-chip cooling system is used to remove heat loads from an application environment. By way of example, one or more application environments may include a data center, and the direct-to-chip cooling system may remove heat from the IT load of the data center. In some embodiments, the cooling components are applied directly to one or more data center components (e.g., computer chips, CPUs, GPUs, memory modules, servers, etc.), and a liquid coolant is applied to the one or more components to directly absorb heat generated by the one or more components.

[0086] In some embodiments, each pod provides an amount of cooling capacity, and the sum of the cooling capacities of each pod within a given application environment can be configured to provide the necessary cooling capacity requirements of the given application environment.

[0087] 5B can include additional equipment (e.g., cooling doors) that can increase heat exchange over a targeted area. In some embodiments, one or more ISMs can be configured to use the same cooling medium as the rest of the cooling equipment in the application environment (e.g., the cooling doors and cooling equipment in an ISM can draw from the same water source).

[0088] In some embodiments, cooling equipment is included such that it provides N+2 (e.g., where N is the cooling capacity required to operate one or more application environments and N+2 is the cooling capacity required to operate one or more application environments taking into account two additional components to compensate for failure or maintenance of two pieces of cooling equipment). In some embodiments, cooling equipment is included such that it provides N+2, N+3, N+4, or N+5 cooling capacity for one or more application environments.

[0089] 5C illustrates a cross-sectional view of cooling equipment integrated into the ISM. Coolant pipes / plumbing (e.g., chilled water inlet and hot water return pipes) 501 and 502 may be in the mid-space below the structural floor of the ISM, surrounded by steel trusses 503. Racks 504 are shown extending below the ISM mid-space.

[0090] FIG. 5D illustrates a cooling system 500 including a ceiling cooling package 501, a closed loop supply 502, CDUs 503 and 504, a closed loop return 505, and a spare take-off valve 506. The CDUs 503 and 504 may be integrated onto the ISM as described herein. The remaining equipment including the four individual cooling equipment with connected piping as described in FIGS. 5A-5C may be implemented within the space between the four ISMs and the MEP package and ceiling package areas as described herein. Constructing the cooling ISM system in this manner significantly reduces the time to install and also significantly reduces the amount of time / labor required to install the cooling system piping since the modular ISM nature allows the majority of this construction / installation to be completed at the manufacturing facility. This significantly saves time / money / labor in the field to install. In this manner, the entire subassembly of the ISM may be configured to provide cooling to the application environment associated with the ISM.

[0091] 6 is a top-down view of a data center with data racks configured to create a hot aisle 602 and a cold aisle 604. One or more hot aisle cooling ISMs can be located directly above the hot aisle 602 and configured to implement the hot aisle cooling. In some embodiments, the aisle width can be configured to accommodate industry standards for standard aisle widths to accommodate server removal and installation. The aisle width can be configured to accommodate a variety of industry standard cabinets, including custom cabinets built for a particular data center. In some embodiments, the number of cabinets per aisle can be configured to accommodate industry standards to accommodate server removal and installation.

[0092] In some embodiments, the application environment may require one or more functional components of the ISM to be sealed. In some embodiments, the application environment may require the ISM floor to seal a portion of the application environment. In some embodiments, the structural floor of the ISM may comprise a sealed portion that is impermeable to air, gas, and / or liquid. In some embodiments, at least one of the first, second, or third functional components is sealed. In some embodiments, the second functional component is sealed within a top or bottom portion of an intermediate space of the ISM. For example, the application environment may comprise a manufacturing facility adapted to produce fragile or complex products (e.g., semiconductors) that require a sterile environment at one or more steps in the manufacturing process. Sealing one or more of the functional components or sealing a portion of the manufacturing facility with one or more ISMs may provide the necessary sterile environment required for a particular manufacturing step.

[0093] In some embodiments, the structural floor and / or intermediate spaces of the ISMs define an elongated continuous zone, with at least a portion of the elongated continuous zone being configured to either allow or restrict access to a human operator or user. FIG. 12A illustrates a top-down view of an assembly or subassembly of ISMs as will be described herein. As illustrated in FIG. 12A, the assembly of ISMs includes a continuous zone 1800 defined by the structural floor of the assembly of ISMs. In this embodiment, the continuous zone 1800 allows a human operator to walk between the individual ISMs 302. This may allow the human operator to access and repair and maintain the individual ISMs. This may provide the human operator with access to remove individual functional components of the ISMs and replace them with new or upgraded functional components. This significantly increases the ease of access for maintenance personnel and reduces the amount of time and cost required to repair, maintain, or replace an ISM or a functional component of the ISM. The contiguous zones 1800 may also be configured to accommodate the clearance requirements necessitated by any equipment (eg, electrical panels) included in the ISM.

[0094] In some embodiments, at least a portion of the ISM or structural floor is configured to serve as a walkway for a human operator or user. As shown in FIG. 12A, a continuous zone 1800 of the structural floor defines a walkway for human access. In some embodiments, at least a portion of the walkway is removable or detachable to allow access to an intermediate space below the surface of the structural floor. This feature greatly increases the ease with which an operator may access equipment contained below the structural floor. This can increase the ease with which components below the structural floor may be repaired, maintained, or replaced with new or upgraded components.

[0095] In some embodiments, one or more ISMs are configured to receive a walkway structure attached to one or more ISMs. For example, this may form a walkway between one or more functional components that are separate components to one or more ISMs. In some embodiments, equipment between adjacent ISMs is separated by a space between, at least a portion of the space is configured to function as a walkway for a human operator or user.

[0096] 7-8 are block diagrams illustrating an ISM / ISM system (e.g., an assembly and / or subassembly of ISMs) integrated with an application environment inside a facility. In some embodiments, one or more ISMs are assembled to form one or more floors within one or more application environments. In some embodiments, one or more floors are configured to increase vertical density and reduce one or more of the area, volume, or spatial footprint of one or more application environments. For example, the area of ​​the application environment is reduced by configuring one or more ISMs to be integrated above / above the application environment, as depicted in FIG. 7-8. Further, returning to FIG. 2A, the vertical density is increased and the area footprint is reduced by incorporating a structural floor 204 that can support functional components above and below the structural floor 204. In some embodiments, individual ISMs in one or more floors are removable or replaceable. In some embodiments, one or more floors are configured to separate or divide volumes or spaces within one or more application environments. In some embodiments, one or more floors include a porous layer that is permeable to air, gas, or fluid. For example, this may allow for ventilation of air within the application environment. In some embodiments, one or more floors include a barrier layer that is impermeable to air, gas, or fluid. For example, this may allow for a sterile application environment where sterility of air within the application environment is important (e.g., semiconductor manufacturing facilities, etc.). In some embodiments, one or more floors include at least one floor that includes (or forms) an intermediate space.

[0097] As shown in FIG. 7, in some embodiments, the application environment may be located on a first floor of a facility, and one or more ISMs may be assembled and span an intermediate space below the ceiling of the first floor and above the application environment. A second floor of the facility may be located above the ceiling and contents of the first floor. In some embodiments, the facility may not / does not need to have a second floor. In some embodiments, one or more ISMs are directly adjacent to each other, creating a structural floor of the second floor. In some embodiments, one or more ISMs may be assembled directly below the ceiling of the first floor to form the floor of the second floor. This may reduce costs and time associated with the need to specifically construct a second floor to install equipment and remodel the second floor to incorporate the functional components described herein (e.g., cooling systems, power distribution systems, etc.). In some embodiments, the application environment may include a data hall located on the first floor, and one or more ISMs are assembled in an intermediate space below the ceiling of the first floor and above the data hall. In some embodiments, the configuration of the ISMs in the intermediate space is adjustable, hi some embodiments, individual ISMs in the intermediate space are removable or replaceable.

[0098] In some embodiments, the application environment can be on a second level of the facility such that the application environment is above one or more ISMs. In some embodiments, the one or more ISMs are assembled in an intermediate space above the floor of the second level and below the application environment.

[0099] In some embodiments, there may be two application environments. One application environment may be located on a first floor and a second application environment may be located on a second floor. One or more ISMs may be assembled in an intermediate space above the floor of the second floor and below the application environments on the second floor.

[0100] In some embodiments, the height of the application environment of the first floor can be increased. The height of the application environment can depend on the type of application environment. For example, the height of the first floor can be higher for a data center than the height of the first floor for a manufacturing facility. In any application environment, the height of the second floor can be adjustable. In some embodiments, one or more ISMs can be assembled in an intermediate space below the ceiling of the first floor and above the application environment and configured to accommodate the height of the first floor and the overall height of the facility. For example, the height of the one or more ISMs can be designed to accommodate the overall height of the facility and the height of one or more application environments within the facility.

[0101] In some embodiments, the first floor is a ground floor. In some embodiments, the first floor is located below ground level. In some embodiments, the facility (e.g., a water-based data center) may be located on a body of water and the application environment may be below the water line of the body of water. In some embodiments, a portion of the application environment may be above the water line and a portion of the application environment may be below the water line. In some embodiments, the application environment may be above the water line.

[0102] 8 illustrates a facility 1400 that encloses a first floor 1410 comprising an application environment and a second floor 1420 comprising one or more ISMs. The one or more ISMs may comprise a ceiling package 1422, an MEP package 1424, a structural floor 1428, and one or more additional functional components 1426 above the structural floor 1428. As disclosed herein, the one or more additional functional components may comprise power equipment, a CDU, or fire suppression equipment.

[0103] 9A illustrates a perspective view of a facility 1500 configured to house an application environment 1510 on a first floor and one or more ISMs 1520 on a second floor. In some embodiments, the one or more ISMs are configured to be assembled in-site without being constrained by the geographic location, shape, size, and / or volume of the space or building (e.g., facility) in which the ISMs are to be assembled. The modularity of the ISMs allows them to fit the size constraints of a given facility.

[0104] In some embodiments, the one or more ISMs are configured to be assembled on-site in a regular or irregular building. In some embodiments, a regular building may include a rectangular, square, cuboid, spherical, or hemispherical building or the like. In some embodiments, an irregular building may include an irregularly shaped structure or any other building that does not have a continuous (or segmented) shape. The one or more ISMs may correspond to any type of building and are not limited by the specific type and shape of the building.

[0105] In some embodiments, the application environment 1510 of the building 1500 may be configured to accommodate a data center. In some embodiments, the application environment of the building may be desired to be changed. In some embodiments, one or more ISMs are configured to be assembled on-site for a desired application environment in an existing building, where the existing building was previously used as another application environment different from the desired application environment. In this manner, the ISMs are highly adaptable and can be matched to any type of building to accommodate any type of application environment.

[0106] In some embodiments, when there is a desire to change from one application environment to another, one or more ISMs may already be installed. In some embodiments, one or more ISMs are configured to be interchangeable or replaceable to allow a first application environment to be reconfigured, converted, or repurposed for a second application environment different from the first application environment. In some embodiments, the first application environment may comprise a data center and the second application environment may comprise a manufacturing facility. In such a case, the ISM for the data center (e.g., comprising a CDU, power equipment, fire suppression equipment, etc., as described herein) may be swapped out for an ISM applicable to the upcoming manufacturing facility. For example, the ISM replacing the data center ISM may comprise the power equipment, ventilation system, and / or lighting system, etc., required for the manufacturing facility. In some embodiments, individual functional components of the ISM may be swapped out to accommodate for the new application environment, instead of the entire ISM. In some embodiments, the first application environment may comprise a manufacturing facility and the second application environment may comprise a data center. In such instances, the ISM for the manufacturing facility can be replaced with a CDU, power equipment, and / or fire suppression ISM as described herein that is applicable to a data center. In some embodiments, individual functional components of the ISM can be swapped out to accommodate and house the functional components required for a data center.

[0107] In some embodiments, one or more ISMs are configured to be assembled in-site in a new building to be constructed for a desired application environment. The modularity and adaptability of the ISMs allows for more architectural freedom when designing the space and geometric requirements of a new building.

[0108] FIG. 9B illustrates a cross-sectional view of a facility 1500 housing a data center 1510 on a first floor and one or more ISMs 1520 on a second floor. In some embodiments, one or more ISMs are configured to be assembled to form a subassembly of ISMs. In some embodiments, a complete assembly of ISMs may consist of two subassemblies 1520a and 1520b. In some embodiments, a complete assembly of ISMs may consist of two or more subassemblies of ISMs. In some embodiments, a subassembly of ISMs is configured to be assembled to an existing assembly of ISMs to expand / extend the performance, functionality, capacity, and / or capability of one or more application environments to form a larger assembly of ISMs. As an example, looking at FIG. 9B, a facility may start with a first subassembly of ISMs 1520a with an application environment directly below the first subassembly. For example, the application environment may be a data center. In some embodiments, a data center may be expanded into the open space to increase the size of the data center, and an ISM second subassembly 1520b can be installed above the expanded area of ​​the data center to accommodate the demands of the newly expanded data center, such as increased cooling, power supplies, etc.

[0109] In some embodiments, the ISM subassembly is configured to be assembled to an existing assembly of the ISM in two or more dimensions. In some embodiments, the two or more dimensions are on the same plane. In some embodiments, the two or more dimensions are on different planes. In some embodiments, the two or more dimensions may include at least one direction that is horizontal / lateral and at least one other direction that is vertical. For example, an additional story of the ISM may be installed above or below an existing story of the ISM to accommodate the application environment due to an increase in size. Additionally, the ISM subassembly may be added horizontally to an existing subassembly of the ISM as described in the FIG. 9B scenario above. In some embodiments, the ISM subassembly may be installed above or below and horizontally to an existing subassembly of the ISM.

[0110] In some embodiments, one or more ISMs are configured to be assembled in series or parallel in two or more dimensions to expand / increase / expand the performance, functionality, capacity, and / or capabilities of one or more application environments. In some embodiments, one or more ISMs are configured to be assembled in a manner that allows the capacity of one or more application environments to be increased on demand without the need to modify or remodel the one or more application environments for the expansion. For example, the application environment may comprise a data center. In this manner, the capacity of the data center can be increased without the need to expand the facility that houses the data center.

[0111] Returning to FIG. 9B, the facility 1500 may include one or more columns 1530 that may be configured to support the vertical load of one or more ISMs. In some embodiments, the one or more ISMs rest on one or more beams. In some embodiments, the one or more beams are configured to be attached to and / or coupled to the one or more columns 1530 in such a manner that the vertical components of the one or more ISMs are supported. In some embodiments, these columns 1530 may be adjustable such that the height of the one or more ISMs above the application environment may be adjusted. For example, the columns may be adjusted to lower an existing ISM and accommodate an additional floor of an ISM above an existing floor. As an additional example, the columns may be adjusted to raise a floor of an ISM higher above the application environment. This may be done to accommodate a new height of a new application environment or to accommodate a new height as a result of a modification / expansion of an existing application environment.

[0112] In some embodiments, the one or more ISMs include one or more vertical load-bearing structures. In some embodiments, the one or more vertical load-bearing structures are configured to allow the ISMs to be stacked vertically in succession. In some embodiments, a story of an ISM can include the necessary mechanical, plumbing, network, etc. connections required to accommodate a new story of the ISM above or below an existing story of the ISM.

[0113] 9A-9B, 10, and 11, the application environment may include one or more corridors 1540. In some embodiments, one or more ISMs are configured to be integrated with or connected to one or more corridors within the application environment or environments. As shown in FIG. 9B, subassemblies 1520a and 1520b are assembled directly above the application environment 1510 with a corresponding open area above the corridor 1540. In this manner, one or more ISMs are integrated with the corridors of the application environment. As shown in FIG. 9B, one or more corridors 1540 may extend along an edge or a central portion of the application environment or environments.

[0114] In some embodiments, one or more corridors are configured to serve as an interface for coupling with one or more additional ISMs. In some embodiments, one or more corridors are configured to serve as an interface / area for coupling one or more ISMs to an external system and / or structure. By way of example, an external system may include third party equipment specific to the application environment, such as an air filter or ventilation system configured to control particle concentrations within a particular area of ​​the application environment. By way of example, an external structure may include a structural component of a building configured to support one or more ISMs.

[0115] In some embodiments, the one or more corridors may be above, below, or to the side of one or more ISMs. In some embodiments, the one or more corridors are configured to divide and / or control operator or user access to the one or more ISMs. In some embodiments, the one or more corridors are configured to contain or surround a portion of the ISM. For example, a portion of the ISM may contain equipment that is fragile, expensive, or otherwise critical to the application environment that is desirable to be sealed off from general human access. The one or more corridors may be configured to seal off such portion of the ISM. Additionally, in some embodiments, the one or more corridors are configured to generate a special environment that surrounds a portion of the ISM and a portion of the application environment below the portion of the ISM. This may be used in addition to the ability to seal one or more functional components of the ISM (e.g., as described above) to provide a sterile environment for a critical step in a manufacturing process (e.g., such as in a semiconductor manufacturing process).

[0116] 13A-13C illustrate an example ISM system 1920 integrated with one or more application environments 1910 that may be constructed on a barge or ship 1900. A staircase is in the center of the barge and may allow a human operator or user to travel between levels (e.g., ISM level, application environment level). The one or more ISMs may be any other ISM described herein and may provide or restrict access to the human operator or user on the ISM level. Implementing one or more application environments with one or more ISMs on the barge allows for cooling water to be sourced from a body of water.

[0117] In some embodiments, a building of any one of the embodiments described herein is implemented using one or more modular assembly kits, at least partially composed of one or more ISMs. In some embodiments, the kits may be suitable for any type of ISM described herein and any type of application environment described herein. In some embodiments, there may be different kits configured to be suitable for different application environments. For example, the application environment may be a data center and the kit may comprise one or more ISMs necessary to operate the data center. As an additional example, the application environment may be a manufacturing facility and the kit may comprise ISMs necessary for the manufacture of a desired product in the manufacturing facility. In some embodiments, the kits may be used in any building / facility / structure described herein that includes one or more application environments. In some embodiments, the kits may be shipped / transported using methods as described herein for one or more ISMs. In some embodiments, the kits are configured to facilitate rapid assembly of one or more ISMs as described herein. In some embodiments, the kits may be used for new installation of one or more ISMs in one or more application environments. In some embodiments, the kits may be for interchanging / substituting / replacing one or more ISMs in an existing assembly of ISMs in one or more application environments. In some embodiments, the kits may include one or more ISMs for configuring an initial ISM assembly in one or more application environments. In some embodiments, the kits may include one or more ISMs for reconfiguring an existing ISM assembly for use in either the same one or more application environments or one or more different application environments. In some embodiments, the kits may include one or more ISMs for expanding the capacity of an initial ISM assembly for use in either the same one or more application environments or one or more different application environments.

[0118] While preferred embodiments of the present invention have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the invention. It is understood that various alternatives to the embodiments of the invention described herein can be employed in practicing the invention. It is intended that the following claims define the scope of the invention, and that methods and structures within the scope of these claims, and their equivalents, are covered thereby.

Claims

1. 1. A modular design and construction building, comprising:

1. A building comprising one or more integrated system modules (ISMs) configured to be shipped and assembled to construct an operational infrastructure for one or more application environments, each of said ISMs comprising two or more distinct functional components, said two or more distinct functional components integrated on and / or supported by a common structural floor.

2. 2. The building of claim 1, wherein the one or more application environments comprise: (i) a data center; (ii) a location with information storage, processing, or communication capabilities or functionality; or (iii) a facility requiring one or more operational infrastructure elements.

3. The building of claim 1 , wherein the one or more ISMs are assembled to form one or more floors within the one or more application environments.

4. 4. The building of claim 3, wherein the one or more stories are configured to increase vertical density and reduce one or more of an area, volume, or spatial footprint of the one or more application environments.

5. 4. The building of claim 3, wherein individual ISMs on the one or more floors are removable or replaceable.

6. The building of claim 3 , wherein the one or more levels are configured to separate or divide volumes or spaces within the one or more application environments.

7. 4. The building of claim 3, wherein the one or more floors include a porous layer that is permeable to air, gas, or fluid.

8. 4. The building of claim 3, wherein the one or more floors are provided with a barrier layer that is impermeable to air, gas, or fluid.

9. 4. The building of claim 3, wherein the one or more levels include at least one level that includes or forms an intermediate space.

10. 10. The building of claim 1, wherein the two or more different functional components are associated with at least one or more of electrical, power, mechanical, plumbing, cooling, heating, network connectivity, data transmission, sensors or sensing, fire suppression, and / or chemical or biological materials management.

11. 10. The building of claim 1, wherein the one or more ISMs are provided having a standardized size or format to facilitate ease of transportation, whereby the ISMs can be shipped using conventional modes of transportation and fewer shipping installments and without requiring modification or customization of size, weight, or height of shipping containers or vehicles, the conventional modes of transportation comprising ground, sea, rail, or air modes of transportation.

12. 2. The building of claim 1, wherein the one or more ISMs utilize a platform base that enables (i) interchangeability of functional components or their physical order / location within the ISMs, and / or (ii) changes in interchangeability, combinations, or placement order between different ISMs.

13. 10. The building of claim 1, wherein the one or more ISMs are configured to facilitate rapid assembly using a fewer number of mechanical and / or electrical connections / connectors and in less time as compared to other application environments not constructed using the ISMs.

14. 1. A method for modularly constructing an operational infrastructure, the method comprising: a) providing one or more integrated system modules (ISMs), each of said ISMs comprising two or more distinct functional components integrated on and / or supported by a common structural floor; b) assembling said one or more ISMs and constructing said operational infrastructure for one or more application environments; A method comprising:

15. 15. The method of claim 14, wherein the one or more application environments comprise: (i) a data center; (ii) a location with information storage, processing, or communication capabilities or functionality; or (iii) a facility requiring one or more operational infrastructure elements.

16. The method of claim 14 , wherein the one or more ISMs are assembled in b) to form one or more floors within the one or more application environments.

17. 20. The method of claim 16, wherein the one or more levels are configured to increase vertical density and reduce one or more of an area, volume, or spatial footprint of the one or more application environments.

18. 17. The method of claim 16, further comprising removing or replacing individual ISMs from or in the one or more floors.

19. 20. The method of claim 16, further comprising using the one or more levels to separate or divide volumes or spaces within the one or more application environments.

20. 17. The method of claim 16, wherein the one or more floors comprise a porous layer that is permeable to air, gas, or fluid.

21. 17. The method of claim 16, wherein the one or more floors include a barrier layer that is impermeable to air, gas, or fluid.

22. 17. The method of claim 16, wherein the one or more levels comprises at least one level that includes or forms an intermediate space.

23. 15. The method of claim 14, wherein the two or more different functional components are associated with at least one or more of electrical, power, mechanical, plumbing, cooling, heating, network connectivity, data transmission, sensors or sensing, fire suppression, and / or chemical or biological materials management.

24. 15. The method of claim 14, wherein the one or more ISMs are provided having a standardized size / format to facilitate ease of transportation, whereby the ISMs can be shipped using conventional modes of transportation and fewer shipping installments and without requiring modification or customization of size, weight, or height of shipping containers or vehicles, the conventional modes of transportation comprising ground, sea, rail, or air modes of transportation.

25. 15. The method of claim 14, wherein the one or more ISMs utilize a platform base that enables (i) interchangeability of functional components or their physical order / location within an ISM, and / or (ii) changes in interchangeability, combinations, or placement order between different ISMs.

26. 15. The method of claim 14, wherein the one or more ISMs are configured to facilitate rapid assembly using a fewer number of mechanical and / or electrical connections / connectors and in less time as compared to other application environments not constructed using the ISMs.

Images