CMP conditioning disk, CMP conditioning disk manufacturing device and manufacturing method

Abstract

The CMP conditioning disk manufacturing apparatus includes a diamond jig providing a jig pocket in which a diamond can be seated, a suction unit selectively providing suction force to the jig pocket, and a moving unit for fixing the diamond seated in the jig pocket to a shank base, the suction unit being capable of providing suction force to the jig pocket when the diamond is seated in the jig pocket and removing the suction force when the diamond is fixed to the shank base.

Description

[Technical field]

[0001] The present invention relates to a CMP conditioning disk, and an apparatus and method for manufacturing a CMP conditioning disk. [Background technology]

[0002] Generally, the planarization process using the polishing technology (CMP: Chemical Mechanical Planarization) is a processing method in which a carrier holds a wafer, which is the object to be polished, and the platen and the carrier are moved relative to each other while supplying slurry onto the polishing pad of the platen.

[0003] The numerous foamed pores on the surface of the polishing pad serve to hold new polishing liquid, enabling a certain polishing efficiency and polishing uniformity across the entire surface of the wafer to be achieved. However, as pressure and relative speed are applied during polishing, the surface of the polishing pad deforms unevenly over processing time, and the pores on the polishing pad become clogged with polishing residue, making the polishing pad unable to fulfill its function.

[0004] In order to solve the uneven deformation and clogging of pores of the polishing pad, a CMP pad conditioner is used. The CMP pad conditioner can form new micro-pores in the polishing pad by finely polishing the surface of the polishing pad. In the diamond setting process for adjusting the diamond direction of the conventional CMP pad conditioner, when a diamond is passed through a hole of a certain size (e.g., 250 μm) formed in an etched mask substrate, the metal powder layer (MPL) on the shank is filled with the metal powder. The diamonds are seated on the disk by an adhesive that is spread on the Powder Layer.

[0005] However, there is a problem in that there is no control over the orientation of the diamond, so the diamond is fixed to the surface of the final disk in any orientation on the disk. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent Publication No. 10-2012-0058303 Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the embodiments of the present invention is to provide a CMP conditioning disk having improved wear resistance and high grinding performance, and a CMP conditioning disk manufacturing apparatus and manufacturing method. [Means for solving the problem]

[0008] A CMP conditioning disk manufacturing apparatus according to one embodiment of the present invention includes a diamond jig that provides a jig pocket in which a diamond can be seated; a suction unit that selectively provides a suction force to the jig pocket; and a moving unit for fixing the diamond seated in the jig pocket to a shank base.

[0009] The diamond jig may further include a vibration unit that vibrates the diamond jig so that the diamond is guided into the jig pocket when the suction unit provides suction force to the jig pocket.

[0010] The moving unit may also include a jig rotation unit that turns the diamond jig over so that the diamond faces downward; and a jig movement unit that moves the diamond jig toward or away from the shank base.

[0011] The jig pocket may also include a jig groove portion whose upper edge can at least support a lower portion of the diamond; and a jig flow path portion formed below the jig groove portion so that the suction force is transmitted to the jig groove portion.

[0012] In addition, a plurality of jig pockets may be provided, and the jig groove portion may include a first symmetrical inclined surface extending from the bottom end toward the surface of the diamond jig at an incline in one direction; and a second symmetrical inclined surface extending from the bottom end of the jig groove portion toward the surface of the diamond jig at an incline in the other direction so as to be symmetrical with respect to the first symmetrical inclined surface with respect to a virtual line extending perpendicular to the surface of the jig pocket.

[0013] In addition, a plurality of jig pockets may be provided, and the jig groove portion may include a first asymmetric inclined surface extending from the bottom end toward the surface of the diamond jig at an incline in one direction; and a second asymmetric inclined surface extending from the bottom end of the jig groove portion toward the surface of the diamond jig at an incline in the other direction so as to be asymmetric with respect to the first asymmetric inclined surface with respect to a virtual line extending perpendicular to the surface of the jig pocket.

[0014] Additionally, the plurality of jig grooves may be oriented along a predetermined pattern or direction.

[0015] In addition, a plurality of the zig flow path portions may be provided, ends of the plurality of the zig flow path portions may be connected to the zig groove portion, and the ends of the zig flow path portions may be disposed at different heights.

[0016] In addition, a plurality of the zig flow path portions may be provided, ends of the plurality of the zig flow path portions may be connected to the zig groove portion, and the ends of the zig flow path portions may be disposed at the same height as each other.

[0017] The apparatus may further include a sensing sensor that measures the internal pressure of the jig pocket when suction force is applied to the jig pocket; and a controller that controls the vibration unit to increase the vibration intensity of the vibration unit when the measured internal pressure is maintained lower than a preset reference pressure for a predetermined reference time.

[0018] A method for manufacturing a CMP conditioning disk according to another aspect of the present invention includes a jig preparation step of preparing a diamond jig having a jig pocket formed therein; a diamond providing step of providing at least one diamond on a surface of the diamond jig; a jig fixing step of temporarily fixing the diamond in the jig pocket of the diamond jig; a bonding layer formation step of forming a bonding layer on a surface of a shank base; a diamond fixing step of fixing the diamond to the bonding layer of the shank base; and a jig separation step of separating the diamond from the diamond jig.

[0019] The jig fixing step may also include applying suction to the jig pocket to temporarily fix the diamond in the jig pocket.

[0020] The jig fixing step may also include vibrating the diamond jig so that the diamond is guided into the jig pocket when suction is applied to the jig pocket.

[0021] In addition, the jig fixing step may include measuring an internal pressure of the jig pocket when suction force is applied to the jig pocket, and stopping the supply of the suction force when the measured internal pressure reaches a preset reference pressure.

[0022] In addition, the diamond fixing step may include turning the diamond jig over so that the diamond faces downward, and moving the turned diamond jig toward the bonding layer, thereby fixing the diamond to the bonding layer of the shank base.

[0023] A CMP conditioning disk according to still another embodiment of the present invention can be manufactured by the above-mentioned manufacturing apparatus or manufacturing method. Effect of the Invention

[0024] According to an embodiment of the present invention, the diamond direction can be adjusted to any angle using a diamond jig with a jig pocket formed therein. Therefore, when the diamond is fused to the shank base, the operator can position the diamond on the shank base in a desired, constant direction, thereby achieving a high pad cut rate (PCR).

[0025] In addition, according to the embodiments of the present invention, the shape and direction of the jig pocket in which the diamond is seated can be formed in various ways, thereby making it possible to determine the diamond direction in various ways, and each jig pocket can be formed in various diamond directions according to the shape / characteristics of the diamond, thereby making it possible to realize various pad polishing characteristics (PCR) according to the shape / characteristics of the diamond.

[0026] Furthermore, the embodiments of the present invention have the advantage that the diamonds are oriented in one direction on the shank base, thereby improving wear resistance and enhancing grinding performance against the polishing pad. [Brief description of the drawings]

[0027] [Figure 1] FIG. 1 is a perspective view showing a diamond jig of an apparatus for manufacturing a CMP conditioning disk according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II of FIG. [Diagram 3] FIG. 3 is a plan view of FIG. 2 seen from above. [Figure 4] FIG. 4 is a diagram showing a state in which a diamond is seated in the jig pocket of FIG. [Diagram 5] FIG. 5 is a cross-sectional view taken along line II-II of FIG. 1 according to a modified embodiment of the present invention. [Figure 6] FIG. 6 is a diagram showing the state in which different types of diamonds are seated in the jig pockets of FIG. [Figure 7] FIG. 7 is a block diagram showing a control flow of an apparatus for manufacturing a CMP conditioning disk according to an embodiment of the present invention. [Figure 8] FIG. 8 is a state diagram showing a state before turnover of a diamond jig of an apparatus for manufacturing a CMP conditioning disk according to one embodiment of the present invention. [Figure 9] FIG. 9 is a state diagram showing a state after turnover of a diamond jig of a CMP conditioning disk manufacturing apparatus according to one embodiment of the present invention. [Figure 10] FIG. 10 is a state diagram showing a state where a diamond jig of a CMP conditioning disk manufacturing apparatus is turned over and moved to a shank base and pressed according to an embodiment of the present invention. [Figure 11] FIG. 11 is a diagram showing a state in which the diamond jig of the CMP conditioning disk manufacturing apparatus is separated from the shank base according to one embodiment of the present invention. [Figure 12] FIG. 12 is a cross-sectional view showing a diamond jig of a CMP conditioning disk manufacturing apparatus according to another embodiment of the present invention. [Figure 13] FIG. 13 is a state diagram showing a state before turnover of a diamond jig of a CMP conditioning disk manufacturing apparatus according to another embodiment of the present invention. [Figure 14] FIG. 14 is a state diagram showing a state after turnover of a diamond jig of a CMP conditioning disk manufacturing apparatus according to another embodiment of the present invention. [Figure 15] FIG. 15 is a state diagram showing a state where a diamond jig of a CMP conditioning disk manufacturing apparatus according to another embodiment of the present invention is turned over and moved to a shank base and pressed. [Figure 16]FIG. 16 is a diagram showing a state in which a diamond jig of a CMP conditioning disk manufacturing apparatus according to another embodiment of the present invention is separated from a shank base. [Figure 17] FIG. 17 is a block diagram illustrating a method for manufacturing a CMP conditioning disk according to the present invention. [Figure 18] FIG. 18 is a graph showing the pad polishing characteristics (PCR) of a CMP conditioning disk according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments for embodying the technical concept of the present invention will be described in detail with reference to the accompanying drawings.

[0029] In the description of the present invention, if it is determined that a specific description of related publicly known configurations or functions may obscure the gist of the present invention, the detailed description will be omitted.

[0030] Additionally, when a component is referred to as being "coupled," "supported," "connected," "supplied," "transmitted," or "in contact with" another component, it should be understood that the component may be directly coupled, supported, connected, supplied, transmitted, or in contact with the other component, but there may also be other components in between.

[0031] The terms used in this specification are merely used to describe specific embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless it has a clearly different meaning in the context.

[0032] In addition, expressions such as upper side, lower side, side, etc. in this specification are described based on what is shown in the drawings, and it is to be made clear in advance that they may be expressed differently when the direction of the object is changed. For the same reason, some components in the attached drawings are exaggerated, omitted, or illustrated diagrammatically, and the dimensions of each component do not reflect the actual dimensions.

[0033] Furthermore, terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by such terms, and these terms are used only to distinguish one component from another.

[0034] As used herein, the meaning of "comprising" is to embody certain properties, regions, constants, steps, operations, elements, components and / or groups and does not exclude the presence or addition of other certain properties, regions, constants, steps, operations, elements, components and / or groups.

[0035] Hereinafter, specific configurations of a CMP conditioning disk, a CMP conditioning disk manufacturing apparatus, and a manufacturing method thereof according to the present invention will be described with reference to the drawings.

[0036] 1 to 7, an apparatus 10 for manufacturing a CMP conditioning disk according to an embodiment of the present invention can manufacture a CMP conditioning disk 30 in which the direction of a diamond 31 is adjusted. The apparatus 10 for manufacturing a CMP conditioning disk can include a diamond jig 100, a suction unit 200, a moving unit 300, a vibration unit 400, a detection sensor 500, and a controller 600.

[0037] Specifically, the diamond jig 100 may be a jig for adjusting the direction of the diamond 31. The diamond 31 can be oriented and seated in the diamond jig 100. When the diamond 31 is seated, the diamond jig 100 can arrange the diamond 31 in a direction desired by an operator. Such a diamond jig 100 can include a jig body 110 and a jig pocket 120.

[0038] The jig body 110 may be a disk / cylinder-shaped jig that can stably support the diamond jig 100 when the diamond 31 is seated in it. The jig body 110 may be made of a ductile material. When the diamond 31 is seated in the jig body 110, the ductile material of the jig body 110 can minimize the gap between the diamond 31 and the jig body 110.

[0039] The jig pocket 120 can provide a space that allows the diamond 31 to be arranged in a directional manner. The jig pocket 120 may be a groove formed on the surface of the jig body 110. The jig pocket 120 may be provided in a pocket shape that can receive at least a part of the diamond 31. The jig pocket 120 may be provided in a pocket shape that corresponds to at least a part of the diamond 31 that is accommodated therein.

[0040] The jig pocket 120 may be provided in a plurality of pieces spaced apart in one direction on the surface of the jig body 110. The plurality of jig pockets 120 may be spaced apart to form a pattern of a certain shape on the surface of the jig body 110. Each of the jig pockets 120 may include a jig groove portion 121 and a jig channel portion 122.

[0041] The jig groove 121 can at least support the lower part of the diamond 31. As an example, when the diamond 31 is seated in the jig pocket 120, the upper edge of the jig groove 121 can support the lower edge of the diamond 31. The jig groove 121 may be formed in a groove shape symmetrical to each other with respect to the bottom end groove in a direction perpendicular to the surface of the jig body 110. Such a jig groove 121 may include a first symmetric inclined surface 121-11 and a second symmetric inclined surface 121-12. The first symmetric inclined surface 121-11 may be a slope surface formed by extending from the bottom end groove toward the surface of the diamond jig 100 in one direction. The second symmetric inclined surface 121-12 may be a slope surface extending from the bottom end groove toward the surface of the diamond jig 100 in the other direction. The first symmetric inclined surface 121-11 and the second symmetric inclined surface 121-12 may be symmetrical to each other with respect to the bottom end groove in a direction perpendicular to the surface of the jig body 110.

[0042] The jig groove 121 can change the orientation of the diamond 31 in various ways depending on the shape. In this embodiment, when the center of the jig pocket 120 is viewed in a vertical section, the vertical section of the jig groove 121 may be a triangle corresponding to the lower vertical section of the diamond 31, but is not limited thereto, and the vertical section of the jig groove 121 can be formed in various shapes other than a triangle depending on the shape / characteristics of the diamond 31 seated in the diamond jig 100. For example, the vertical section of the jig groove 121 may be a square.

[0043] The jig channel portion 122 can provide a channel communicating between the jig groove portion 121 and the suction unit 200. When the diamond 31 is seated in the jig pocket 120, the jig channel portion 122 can receive suction force from the suction unit 200 and transmit it to the jig groove portion 121. The jig channel portion 122 may be smaller than the size of the diamond 31 and the size of the jig groove portion 121. For example, when the size of the diamond 31 is 150 to 200 micrometers, the diameter of the jig channel portion 122 may be 50 micrometers or less. The jig channel portion 122 can be processed into the jig body through an etching process.

[0044] A plurality of jig channel portions 122 may be formed below the jig groove portion 121. The jig channel portion 122 may be formed at a point corresponding to the lower end of the diamond 31, and at least one may be provided. As an example, the jig channel portion 122 may include a first channel portion 122-1, a second channel portion 122-2, and a third channel portion 122-3. The first channel portion 122-1 may be one channel connected to the lowest end groove of the jig groove portion 121. The second channel portion 122-2 may be a plurality of channels connected to the corners of the jig groove portion 121. The third channel portion 122-3 may be a plurality of channels connected to the bottom surface of the jig groove portion 121 (see FIG. 6).

[0045] The suction unit 200 can selectively provide suction to the jig pocket 120. As an example, the suction unit 200 can be a negative pressure device that can provide suction. When the diamond 31 is seated in the jig pocket 120 of the diamond jig 100, the suction unit 200 can fix the diamond 31 seated in the jig pocket 120 by providing suction to the jig pocket 120. The suction unit 200 can stop providing suction to the jig pocket 120, thereby allowing the diamond 31 seated in the jig pocket 120 to be removed from the jig pocket 120. The operation of the suction unit 200 can be controlled by the controller 600.

[0046] The moving unit 300 can rotate or move the diamond jig 100. The moving unit 300 can position the diamond 31 downward by rotating the diamond jig 100 on which the diamond 31 is seated downward. The diamond 31 seated in the jig pocket 120 can be fixed to the shank base 32 by moving the diamond jig 100 on which the diamond 31 is seated downward downward. Such a moving unit 300 can include a jig rotation unit 310 and a jig movement unit 320.

[0047] The jig rotating unit 310 can provide the diamond jig 100 with a rotational force capable of turning over the diamond jig 100. When the diamond 31 is seated in the jig pocket 120 of the diamond jig 100, the jig rotating unit 310 can turn over the diamond jig 100 by rotating the diamond jig 100 180 degrees so that the diamond 31 faces downward. The jig rotating unit 310 can be a motor that is drivingly connected to the diamond jig 100 so as to rotate the diamond jig 100.

[0048] The jig moving unit 320 can provide the diamond jig 100 with a moving force for moving the diamond jig 100 toward the shank base 32. The jig moving unit 320 can move the diamond jig 100 away from or toward the shank base 32. For example, when the diamond jig 100 is turned over so that the diamond 31 faces downward, the jig moving unit 320 can move the diamond jig 100 toward the shank base 32, thereby applying pressure so that the diamond 31 of the diamond jig 100 is in close contact with the surface of the shank base 32. The jig moving unit 320 can be an actuator that is drivingly connected to the diamond jig 100 so as to be able to move the diamond jig 100.

[0049] The vibration unit 400 can provide a driving force for vibrating the diamond jig 100. For example, the vibration unit 400 can be a vibration device that can provide a driving force for repeatedly moving the diamond jig 100 in the left-right direction. When the vibration unit 400 vibrates the diamond jig 100, the diamond 31 can move freely up, down, left, and right on the surface of the diamond jig 100, and when a suction force is provided to the jig pocket 120, the diamond 31 can move to and sit in the jig pocket 120. The vibration unit 400 can be disposed at the bottom of the diamond jig 100. The operation of the vibration unit 400 can be controlled by the controller 600.

[0050] The sensing sensor 500 may be a sensor capable of measuring the internal pressure of the jig pocket 120. When suction is provided to the jig pocket 120, the sensing sensor 500 may measure the internal pressure of the jig pocket 120. Information regarding the internal pressure measured by the sensing sensor 500 may be transmitted to the controller 600.

[0051] The controller 600 can control the operations of the suction unit 200, the moving unit 300, and the vibration unit 400 based on the information obtained from the detection sensor 500. The controller 600 can adjust the operation of the suction unit 200 according to the internal pressure of the jig pocket 120 measured by the detection sensor 500.

[0052] For example, if the internal pressure measured by the sensing sensor 500 remains lower than a preset reference pressure for a predetermined reference time, the controller 600 can control the operation of the vibration unit 400 to increase the vibration strength. That is, if the diamond 31 does not seat in the jig pocket 120 within the reference time, the controller 600 can increase the vibration strength of the vibration unit 400 to seat the diamond 31 in the jig pocket 120 immediately.

[0053] In addition, if the internal pressure measured by the sensing sensor 500 is maintained lower than a predetermined reference pressure for a predetermined reference time, the controller 600 can control the operation of the suction unit 200 to increase the magnitude of the suction force. That is, if the suction force of the suction unit 200 is insufficient to seat the diamond 31 in the jig pocket 120 within the reference time, the controller 600 can increase the suction force of the suction unit 200 to quickly seat the diamond 31 in the jig pocket 120.

[0054] The operation and effect of the CMP conditioning disk manufacturing apparatus according to one embodiment of the present invention will be described below.

[0055] 8, in a state where the diamond jig 100 having the jig pocket 120 formed therein is prepared, at least one diamond 31 may be provided in a dispersed manner on the surface of the diamond jig 100. When the diamond 31 is provided on the surface of the diamond jig 100, if the suction force of the suction unit 200 is applied to the jig pocket 120, the diamond 31 located in the jig pocket 120 of the diamond jig 100 may be temporarily fixed to the diamond jig 100.

[0056] When the suction force is provided to the jig pocket 120 by the suction unit 200, the diamond jig 100 can be vibrated by the vibration unit. When the diamond jig 100 is vibrated, the diamond 31 provided on the surface of the diamond jig 100 can be effectively guided to a point located in the jig pocket 120 of the diamond jig 100. A bonding layer B can be formed on the surface of the shank base 32. The bonding layer B can be an adhesive material for fusion between the diamond 31 and the shank base 32. The bonding layer B can include a metal powder layer B1 and an adhesive layer B2 applied to the surface of the metal powder layer B1.

[0057] Referring to Figure 9, once the diamond 31 is temporarily fixed to the diamond jig 100, the diamond 31 is turned over so that it faces downward by rotating the diamond jig 100, and the turned over diamond 31 can be fixed to the bonding layer B of the shank base 32 by moving the turned over diamond jig 100 towards the bonding layer B.

[0058] 10, when the diamond 31 is fixed to the bonding layer B of the shank base 32, if the diamond 31 is pressed by the diamond jig 100, the diamond 31 can be firmly fixed to the bonding layer B of the shank base 32. If the turned-over diamond jig 100 moves toward the bonding layer B and adheres closely to it, the diamond 31 can be semi-fixed to the adhesive layer B2 of the bonding layer B, and if the diamond jig 100 is pressed more strongly toward the bonding layer B, the diamond 31 can be pushed up to the metal powder layer B1 of the bonding layer B and fixed.

[0059] 11, the diamond jig 100 can be separated from the diamond 31. To separate the diamond jig 100, the suction force applied to the jig pocket 120 of the diamond jig 100 can be stopped. When the suction force is stopped, the diamond 31 fixed to the diamond jig 100 by the suction force can be separated from the diamond jig 100. When the diamond jig 100 is separated from the diamond 31, the diamond jig 100 moves upward, and the CMP conditioning disk 30 on which the diamonds 31 are symmetrically arranged can be completed by fusion heat treatment.

[0060] Meanwhile, in addition to the above configuration, a CMP conditioning disk manufacturing apparatus 10 according to another embodiment of the present invention can be provided. Hereinafter, the other embodiment of the present invention will be described with reference to Figures 12 to 16. In describing the other embodiment, there is a difference in the configuration of the movement limiting unit compared to the above-mentioned embodiment, so the following description will focus on the differences, and the same descriptions and reference numerals will be used.

[0061] 12, the diamond jig 100 may include a jig pocket 120 having an asymmetrical cross-sectional shape when viewed in a vertical cross section at the center of the jig pocket 120. The asymmetrical jig pocket 120 may be arranged in one direction on the surface of the diamond jig 100 in consideration of the disk rotation direction (clockwise or counterclockwise) in which the CMP conditioning disk 30 rotates. The jig pocket 120 may include a jig groove portion 121 having a first asymmetric inclined surface 121-21 and a second asymmetric inclined surface 121-22.

[0062] The first asymmetric inclined surface 121-21 may be a slope surface formed by extending from the lowest end groove toward the surface of the diamond jig 100 in one direction. The first asymmetric inclined surface 121-21 may extend from the lowest end groove toward the surface of the diamond jig 100 in one direction. The second asymmetric inclined surface 121-22 may be a slope surface extending from the lowest end groove toward the surface of the diamond jig 100 in the other direction. The second asymmetric inclined surface 121-22 may extend from the lowest end groove toward the surface of the diamond jig 100 in the other direction. The first asymmetric inclined surface 121-21 and the second asymmetric inclined surface 121-22 may be asymmetric with respect to each other with respect to the lowest end groove with respect to the perpendicular direction to the surface of the jig pocket 120.

[0063] The operation and effect of the CMP conditioning disk manufacturing apparatus according to another embodiment of the present invention will be described below.

[0064] 13, in a state where the diamond jig 100 having the asymmetrically shaped jig pocket 120 is prepared, at least one diamond 31 can be distributed on the surface of the diamond jig 100. When the diamond 31 is provided on the surface of the diamond jig 100, the suction force of the suction unit 200 is applied to the jig pocket 120, so that the diamond 31 located in the jig pocket 120 of the diamond jig 100 can be temporarily fixed to the diamond jig 100.

[0065] When suction force is provided to the jig pocket 120 by the suction unit 200, the diamond jig 100 can be vibrated by the vibration unit. When the diamond jig 100 vibrates, the diamond 31 provided on the surface of the diamond jig 100 can be effectively guided to a point located in the jig pocket 120 of the diamond jig 100. A bonding layer B can be formed on the surface of the shank base 32.

[0066] Referring to Figure 14, once the diamond 31 is temporarily fixed to the diamond jig 100, the diamond 31 is turned over so that it faces downward by rotating the diamond jig 100, and the turned over diamond 31 can be fixed to the bonding layer B of the shank base 32 by moving the turned over diamond jig 100 towards the bonding layer B.

[0067] 15, when the diamond 31 is fixed to the bonding layer B of the shank base 32, if the diamond 31 is pressed by the diamond jig 100, the diamond 31 can be firmly fixed to the bonding layer B of the shank base 32. If the turned-over diamond jig 100 moves toward the bonding layer B and is in close contact with it, the diamond 31 can be semi-fixed to the adhesive layer B2 of the bonding layer B, and if the diamond jig 100 is pressed more strongly toward the bonding layer B, the diamond 31 can be pushed up to the metal powder layer B1 of the bonding layer B and fixed.

[0068] 16, the diamond jig 100 can be separated from the diamond 31. In order to separate the diamond jig 100, the suction force applied to the jig pocket 120 of the diamond jig 100 can be stopped. When the suction force is stopped, the diamond 31 fixed to the diamond jig 100 by the suction force can be separated from the diamond jig 100. When the diamond jig 100 is separated from the diamond 31, the diamond jig 100 moves upward, and the CMP conditioning disk 30 that provides the diamond 31 arranged asymmetrically in one direction can be fused and heat treated to complete the manufacturing.

[0069] A method for producing a CMP conditioning disk according to the present invention will now be described.

[0070] 17 and 18, a method for manufacturing a CMP conditioning disk according to an embodiment of the present invention may include a jig preparation step S100, a diamond 31 provision step S200, a jig fixing step S300, a bonding layer formation step S400, a diamond 31 fixing step S500, and a jig separation step S600. After the jig separation step S600, a heat treatment (fusion) process may be performed on the CMP conditioning disk. The heat treatment process corresponds to a typical heat treatment process for heat treating a conditioning disk, and therefore a detailed description thereof will be omitted.

[0071] In the jig preparation step S100, a diamond jig 100 having a zig pocket 120 formed therein may be prepared. A plurality of zig pockets 120 may be formed on a surface of the diamond jig 100, spaced apart in one direction, and a suction unit that provides suction force may be connected to the zig pocket 120.

[0072] In the diamond 31 providing step S200, at least one diamond 31 may be provided on the surface of the prepared diamond jig 100. The at least one diamond 31 may be provided in a dispersed manner on the surface of the diamond jig 100.

[0073] In the jig fixing step S300, the suction force is provided to the jig pocket 120 by the suction unit 200, so that the diamond 31 provided on the surface of the diamond jig 100 can be guided and seated in the jig pocket 120 of the diamond jig 100. The diamond 31 provided on the surface of the diamond jig 100 can be provisionally fixed in the jig pocket 120 by the suction force of the suction unit 200.

[0074] In the jig fixing step S300, when the suction force is provided to the jig pocket 120 by the suction unit 200, the diamond jig 100 can be vibrated by the vibration unit. The diamonds 31 provided on the surface of the diamond jig 100 can be more easily guided to the jig pocket 120 by the vibration of the diamond jig 100. The diamonds 31 that are not seated in the jig pocket 120 can also be removed from the surface of the diamond jig 100 by the vibration of the diamond jig 100.

[0075] In the jig fixing step S300, when suction force is provided to the jig pocket 120 by the suction unit 200, the internal pressure of the jig pocket 120 can be measured by the sensor 500. If the internal pressure measured by the sensor 500 is lower than a preset reference pressure, the magnitude of the suction force can be increased to more strongly guide and seat the diamond 31 in the jig pocket 120.

[0076] In the bonding layer formation step S400, a bonding layer B can be formed on the surface of the shank base 32. The bonding layer B can be an adhesive material for fusion between the diamond 31 and the shank base 32. The bonding layer B can include a metal powder layer B1 and an adhesive layer B2 applied to the surface of the metal powder layer B1.

[0077] In the diamond 31 fixing step S500, the diamond 31 can be fixed to the bonding layer B of the shank base 32. In the diamond 31 fixing step S500, the diamond jig 100 can be turned over so that the diamond 31 faces downward by rotating the diamond jig 100, and the turned over diamond 31 can be fixed to the bonding layer B of the shank base 32 by moving the turned over diamond jig 100 toward the bonding layer B. When the diamond 31 is fixed to the bonding layer B of the shank base 32, the diamond 31 is pressed by the diamond jig 100, so that the diamond 31 can be firmly fixed to the bonding layer B of the shank base 32.

[0078] In the jig separation step S600, the diamond jig 100 may be separated from the diamond 31. To separate the diamond jig 100, the suction unit 200 may stop providing suction force. When the suction force is stopped, the diamond 31 fixed to the diamond jig 100 by the suction force may be separated from the diamond jig 100. When the diamond jig 100 is separated from the diamond 31, the diamond jig 100 may move upward.

[0079] The diamond 31 fixed to the bonding layer B of the shank base 32 can be subjected to a heat treatment (fusion) process to complete the manufacture of the CMP conditioning disk 30. For example, after the jig separation step S600, the prepared shank base 32 is subjected to a fusion step so that the diamond 31 is finally fixed to the shank base 32. At this time, the direction of the diamond 31 is aligned along the direction of the metal powder layer (MPL) described above. By optimizing the thickness of the powder layer, the diamond orientation before fusion is maintained.

[0080] Meanwhile, the CMP conditioning disk 30 manufactured by the above-mentioned CMP conditioning disk manufacturing apparatus 10 or CMP conditioning disk manufacturing method 20 can finely polish the surface of a polishing pad. Such a CMP conditioning disk 30 can include a shank base 32 and a diamond 31 fused to the shank base 32.

[0081] Specifically, the shank base 32 may be a backing plate of the disk. A bonding layer B may be formed on the surface of the shank base 32. The bonding layer B may be an adhesive material for fusing the diamond 31 and the shank base 32. The bonding layer B may include a metal powder layer B1 and an adhesive layer B2 applied to the surface of the metal powder layer B1. The metal powder layer B1 may be applied to the surface of the shank base 32, and then dried and pre-sintered to form a solid phase pre-sintered body. The adhesive layer B2 may be an adhesive coating layer for temporarily bonding the diamond on the surface of the metal powder layer B1. The diamond 31 may be bonded and fixed to the metal powder layer B1 to which the adhesive layer B2 is applied. The shank base 32 corresponds to a typical shank base 32 applied to the CMP conditioning disk 30, and therefore a detailed description thereof will be omitted.

[0082] The diamond 31 can be applied to the CMP conditioning disk 30 manufactured by the above-mentioned CMP conditioning disk manufacturing apparatus 10 or CMP conditioning disk manufacturing method 20. At least a part of the diamond 31 according to another embodiment of the present invention may be arranged on the bonding layer B in a position where the face arranged at the uppermost end while meeting the long axis is upright downward from the upper end of the long axis. At least a part of the diamond 31 according to another embodiment of the present invention may be arranged on the bonding layer B in a position where the face arranged at the uppermost end while meeting the long axis is inclined downward from the upper end of the long axis.

[0083] In this embodiment, the imaginary line connecting the two vertices of the diamond 31 that are facing each other and are farthest from each other can be defined as an "axis," and the axis with the longest length among the multiple "axes" can be defined as the "major axis." Furthermore, a "vertex" can be defined as a point where adjacent edges meet.

[0084] As described above, the present invention has the excellent advantages that the diamond direction can be adjusted to any angle using a diamond jig with a jig pocket formed therein, so that when the diamond is fused to the shank base, the worker can position the diamond on the shank base in a desired fixed direction, thereby realizing high pad polishing characteristics, and that the diamond direction can be determined in a variety of ways by forming the shape and direction of the jig pocket in which the diamond sits in a variety of ways, and that each jig pocket can be formed in various diamond directions according to the shape / characteristics of the diamond, thereby realizing various pad polishing characteristics (PCR) according to the shape / characteristics of the diamond.

[0085] Although the examples of the present invention have been described above as specific embodiments, these are merely examples, and the present invention is not limited thereto, and should be construed as having the broadest scope according to the basic ideas disclosed in this specification. Those skilled in the art may combine / replace the disclosed embodiments to implement patterns of shapes not shown, but this would not depart from the scope of the present invention. Furthermore, those skilled in the art may easily modify or change the embodiments disclosed based on this specification, and it is clear that such modifications or changes also fall within the scope of the present invention.

Claims

1. a diamond jig that provides a jig pocket into which a diamond can be seated; a suction unit for selectively providing suction to the jig pocket; and A moving unit for fixing the diamond seated in the jig pocket to a shank base. CMP conditioning disk manufacturing equipment.

2. 2. The CMP conditioning disk manufacturing apparatus of claim 1, further comprising a vibration unit for vibrating the diamond jig so that the diamond is guided into the jig pocket when the suction unit provides suction force to the jig pocket.

3. The moving unit is A jig rotation unit that turns the diamond jig over so that the diamond faces downward; and 2. The CMP conditioning disk manufacturing apparatus of claim 1, further comprising a jig moving section for moving the diamond jig toward or away from the shank base.

4. The jig pocket is a jig groove whose upper edge can at least support a lower portion of the diamond; and 2. The apparatus of claim 1, further comprising a jig passage portion formed below the jig groove portion so that the suction force is transmitted to the jig groove portion.

5. The jig pocket is provided in a plurality of pieces, The jig groove portion is a first symmetrical inclined surface extending in one direction from the bottom end toward the surface of the diamond jig; and 5. The CMP conditioning disk manufacturing apparatus of claim 4, further comprising a second symmetric inclined surface extending in the other direction from the bottom end of the jig groove portion toward the surface of the diamond jig so as to be symmetrical with respect to the first symmetric inclined surface with respect to a virtual line extending perpendicular to the surface of the jig pocket.

6. The jig pocket is provided in a plurality of pieces, The jig groove portion is a first asymmetric inclined surface extending obliquely in one direction from the bottom end toward the surface of the diamond jig; and 5. The CMP conditioning disk manufacturing apparatus of claim 4, further comprising a second asymmetric inclined surface extending in the other direction from the bottom end of the jig groove portion toward the surface of the diamond jig so as to be asymmetric with respect to the first asymmetric inclined surface with respect to a virtual line extending perpendicular to the surface of the jig pocket.

7. 7. The CMP conditioning disk manufacturing apparatus of claim 6, wherein the plurality of jig grooves are oriented along a predetermined pattern or a predetermined direction.

8. The jig flow path portion is provided in plurality, 5. The CMP conditioning disk manufacturing apparatus according to claim 4, wherein ends of a plurality of the jig flow passage portions communicate with the jig groove portion, and the ends of the jig flow passage portions are disposed at different heights from each other.

9. The jig flow path portion is provided in plurality, 5. The CMP conditioning disk manufacturing apparatus according to claim 4, wherein ends of the plurality of jig flow passage portions communicate with the jig groove portion, and the ends of the jig flow passage portions are disposed at the same height as each other.

10. a sensing sensor for measuring the internal pressure of the jig pocket when suction is applied to the jig pocket; and 3. The CMP conditioning disk manufacturing apparatus of claim 2, further comprising a controller that controls the vibration unit so that a vibration intensity by the vibration unit is increased when the measured internal pressure is maintained lower than a preset reference pressure for a predetermined reference time.

11. a jig preparation step of preparing a diamond jig having a jig pocket formed therein; providing at least one diamond on a surface of a diamond jig; a jig fixing step of temporarily fixing the diamond in a jig pocket of the diamond jig; a bonding layer forming step of forming a bonding layer on a surface of the shank base; a diamond fixing step of fixing the diamond to a bonding layer of the shank base; and a jig separation step of separating the diamond from the diamond jig; A method for making a CMP conditioning disk.

12. The jig fixing step includes:

12. The method for manufacturing a CMP conditioning disk according to claim 11, further comprising applying suction to the jig pocket to temporarily fix the diamond in the jig pocket.

13. The jig fixing step includes:

13. The method of claim 12, further comprising vibrating the diamond jig so that the diamond is directed into the jig pocket when suction is applied to the jig pocket.

14. The jig fixing step includes:

13. The method for manufacturing a CMP conditioning disk according to claim 12, further comprising the steps of: measuring an internal pressure of the jig pocket when suction force is applied to the jig pocket; and stopping the supply of the suction force when the measured internal pressure reaches a preset reference pressure.

15. The diamond fixing step comprises:

13. The method of claim 12, further comprising: turning the diamond jig over so that the diamond faces downward; and moving the turned diamond jig toward the bonding layer, thereby fixing the diamond to the bonding layer of the shank base.

16. Produced by the production apparatus according to claim 1 or the production method according to claim 11. CMP conditioning discs.

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