Measurement and Movement Analysis of the Movement Speed of a High-Speed Laser Movement System

Abstract

【Solution means】 A system and method for analyzing laser beam characteristics in a high-speed laser movement system, wherein the laser beam characteristics include the movement speed of the laser, the speed, and the acceleration, and the high-speed laser movement system has a laser for generating a laser beam, comprising the steps of determining the position of a first pinhole sensor within a predetermined field of view, determining the position of a second pinhole sensor within the predetermined field of view, defining the movement distance of the laser beam, measuring the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor, and dividing the movement distance by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the second pinhole sensor.

Description

Technical Field

[0001] The disclosed technology relates to a laser system having high speed motion capability, and more specifically, to a system, apparatus, and method for characterizing, analyzing, and verifying the appropriate functions and performance of a laser used in a laser processing system having high speed motion capability.

Background Art

[0002] Laser processing generally includes a process of changing a workpiece in a predetermined manner using a laser beam. Laser processing ranges from high-intensity laser ablation processing to processing with significantly lower intensity such as heat treatment where melting is avoided. Almost all of the abbreviations of laser processing technologies include a process of forming a laser beam into a specific size and shape at a specific position or working distance from a laser system. Accurately identifying the position where a laser system produces a focus or image with desired characteristics is an important aspect in performing efficient and optimized laser processing.

[0003] Laser processing technology includes laser beam welding (LBW), which is a fusion welding used to join materials of various configurations. A laser beam welding system typically includes a laser light source, a laser light transmission system, an optical device for transmitting the laser light to the workpiece, and often a movement system for moving either the laser or the workpiece. A laser beam welding (LBW) system may include a beam transmitted by a fiber, an open beam path, a fixed optical system, or a galvanometer system that enables rapid deflection of the laser beam. The mechanical movement system can include a high-speed system or a low-speed system depending on the intended application. In laser beam welding (LBW) processing, the laser light is focused using an optical device that includes a collimation lens or mirror that prevents divergence of the laser light from the light source and transmits the laser light to a focusing lens or mirror (or other optical system). Next, this focusing lens or mirror irradiates the workpiece to be welded with the highly focused laser light. This highly intense laser light is used to melt the material of the workpiece to weld two or more parts or components.

[0004] The use of laser processing systems, particularly laser beam welding (LBW) systems, in manufacturing has become common and is used in many manufacturing facilities around the world. The functional success of all laser processing systems depends on established, stable, and reproducible laser beam characteristics, including focus or image shape, distribution, and position. Therefore, there is a continuing need for accurate, easy-to-use, and inexpensive systems, devices, and methods for analyzing the quality and dynamic accuracy of laser foci and images formed by laser processing systems having a movement function. Summary of the Invention Means for Solving the Problems

[0005] The following provides an overview of certain exemplary embodiments of the disclosed technology. This overview is not an extensive overview and is not intended to identify key aspects or elements of the disclosed technology or to define the scope of the disclosed technology. It should be understood that when an indefinite article is used in the terms employed to describe and claim the disclosed technology, it is not intended to limit the technology being described. Rather, when "a" or "an" is used, it should be construed to mean "at least one" or "one or more."

[0006] One embodiment of the disclosed technology is a method for analyzing laser beam characteristics in a high-speed laser movement system, where the laser beam characteristics include the movement speed, speed, and acceleration of the laser, and the high-speed laser movement system has a laser that generates a laser beam. The method includes placing a first pinhole sensor within a predetermined field of view of the laser to determine the position of the first pinhole sensor within the predetermined field of view, placing a second pinhole sensor within the predetermined field of view of the laser to determine the position of the second pinhole sensor within the predetermined field of view, using the determined positions of the first pinhole sensor and the second pinhole sensor to define the movement distance of the laser beam, measuring the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor, dividing the movement distance by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the second pinhole sensor, and dividing the calculated speed of the laser beam by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the acceleration of the laser beam between the first pinhole sensor and the second pinhole sensor.

[0007] The method may further include the steps of: disposing a third pinhole sensor within the predetermined field of view to determine the position of the third pinhole sensor within the predetermined field of view; defining a second travel distance of the laser beam using the determined positions of the first pinhole sensor and the third pinhole sensor; measuring the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor; dividing the second travel distance by the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor to calculate the velocity of the laser beam between the first pinhole sensor and the third pinhole sensor; subtracting the velocity of the laser beam between the first pinhole sensor and the second pinhole sensor from the velocity of the laser beam between the first pinhole sensor and the third pinhole sensor to calculate the change in velocity of the laser beam; summing the travel time from the position of the first pinhole sensor to the position of the second pinhole sensor and the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor to calculate a total measurement time; and dividing the change in velocity of the laser beam by the total measurement time to calculate the acceleration of the laser beam between the first pinhole sensor and the third pinhole sensor.

[0008] Another embodiment of the disclosed technology is a system for analyzing laser beam characteristics in a high-speed laser movement system, where the laser beam characteristics include the movement speed of the laser, speed, and acceleration. The high-speed laser movement system has a laser that generates a laser beam. The system includes a first pinhole sensor disposed within a predetermined field of view of the laser, and the first pinhole sensor has a predetermined position within the predetermined field of view. The system also includes a second pinhole sensor disposed within the predetermined field of view of the laser, and the second pinhole sensor has a predetermined position within the predetermined field of view. The predetermined positions of the first pinhole sensor and the second pinhole sensor are used to define the movement distance of the laser beam. The movement time from the position of the first pinhole sensor to the position of the second pinhole sensor is measured. The movement distance is divided by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the second pinhole sensor. The calculated speed of the laser beam is divided by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the acceleration of the laser beam between the first pinhole sensor and the second pinhole sensor. A system is provided.

[0009] The first pinhole sensor and the second pinhole sensor are attached to a portable test device, and each pinhole sensor is arranged to receive laser light generated by an unsteady laser beam, and each pinhole sensor extends from the upper surface of the portable test device by a predetermined height. The system further has a third pinhole sensor disposed within the predetermined field of view of the laser, and the third pinhole sensor has a predetermined position within the predetermined field of view. The predetermined positions of the first pinhole sensor and the third pinhole sensor are used to define a second travel distance of the laser beam, and the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor is measured. The second travel distance is divided by the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the third pinhole sensor, and the speed change of the laser beam is calculated by subtracting the speed of the laser beam between the first pinhole sensor and the second pinhole sensor from the speed of the laser beam between the first pinhole sensor and the third pinhole sensor. The travel time from the position of the first pinhole sensor to the position of the second pinhole sensor and the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor are summed to calculate a total measurement time. The acceleration of the laser beam between the first pinhole sensor and the third pinhole sensor is calculated by dividing the speed change of the laser beam by the total measurement time.

[0010] Yet another embodiment of the disclosed technology is a system for analyzing laser beam characteristics in a high-speed laser movement system, wherein the laser beam characteristics include the movement speed of the laser, speed, and acceleration, and the high-speed laser movement system has a laser that generates a laser beam, and arranging a portable test device within a predetermined field of view of the laser, the portable test device including a first pinhole sensor attached to a predetermined position of the portable test device and extending a predetermined height from the upper surface of the portable test device, the first pinhole sensor, and a second pinhole sensor attached to a predetermined position of the portable test device and extending a predetermined height from the upper surface of the portable test device, the second pinhole sensor, and arranging the portable test device, defining the movement distance of the laser beam using the predetermined positions of the first pinhole sensor and the second pinhole sensor, measuring the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor, dividing the movement distance by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the second pinhole sensor, and dividing the calculated speed of the laser beam by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the acceleration of the laser beam between the first pinhole sensor and the second pinhole sensor, and providing a system having the above steps.

[0011] The system further includes a third pinhole sensor attached to a predetermined position of the portable test device and extending a predetermined height from the upper surface of the portable test device. The predetermined positions of the first pinhole sensor and the third pinhole sensor are used to define a second travel distance of the laser beam, and a travel time from the position of the first pinhole sensor to the position of the third pinhole sensor is measured. The second travel distance is divided by the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the third pinhole sensor. The speed of the laser beam between the first pinhole sensor and the third pinhole sensor is subtracted from the speed of the laser beam between the first pinhole sensor and the second pinhole sensor to calculate a change in the speed of the laser beam. The travel time from the position of the first pinhole sensor to the position of the second pinhole sensor and the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor are summed to calculate a total measurement time. The change in the speed of the laser beam is divided by the total measurement time to calculate an acceleration of the laser beam between the first pinhole sensor and the third pinhole sensor.

[0012] It should be understood that all combinations of the foregoing concepts and additional concepts to be described in greater detail below (so long as these concepts are not mutually inconsistent) are considered to be part of the technology disclosed herein and can be implemented to realize the advantages described herein. Those skilled in the art will appreciate that additional features and aspects of the disclosed technology will become apparent by reading and understanding the detailed description of the following exemplary embodiments. As will be understood by those skilled in the art, further embodiments of the disclosed technology are possible without departing from the scope and spirit of the disclosed technology. Accordingly, the description provided herein is illustrative and is to be regarded as essentially non-limiting.

Brief Description of the Drawings

[0013] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more exemplary embodiments of the disclosed technology and, together with the foregoing general description and the following detailed description, serve to explain the principles of the disclosed subject matter.

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[0014] Next, exemplary embodiments of the present invention will be described with reference to the above drawings. In the detailed description of the invention, reference numerals are used to refer to various components and structures. The following detailed description includes a number of specific details for the purpose of illustration, but those skilled in the art will appreciate that many modifications and alternative forms are within the scope of the present invention. Accordingly, the following embodiments of the present invention do not lose the generality of the subject matter recited in the claims, nor are they limiting.

[0015] The embodiments described in this specification are merely illustrative and are provided to supplement the description of the devices, apparatuses, systems, and methods described herein. None of the functions or components shown in the drawings or described below should be regarded as essential to a particular embodiment of the device, apparatus, system, or method, unless otherwise specified. Specific components, modules, or methods may be described in relation to only a particular figure for reasons of readability and clarity. Even if a given combination or partial combination of components is not specifically described, it should not be understood that such a combination or partial combination is impossible. Also, for any method described, whether or not the method is described with a flowchart, the explicit or implicit order of the steps taken during the execution of the method does not mean that they must be executed in the presented order, unless otherwise specified or required in the context, and it should be understood that they may be executed in a different order or in parallel.

[0016] U.S. Patent No. 10,976,219 and U.S. Patent No. 10,627,311 are relevant to the disclosed technology, and the entire content of each of these patents is hereby expressly incorporated by reference into this specification and made a part of this patent application for all purposes. These documents disclose, for example, systems used in additive manufacturing, which is an industrial process of continuously laminating ultra-thin layers of materials to produce three-dimensional objects. Each successive layer is joined or fused to a preceding layer consisting of a molten or partially molten material and various substances for the laminated material, including metal powders, thermoplastic plastics, ceramics, composite materials, glass, and other materials. Laser Powder Bed Fusion (L-PBF) is a specific processing method used in additive manufacturing to build three-dimensional components or parts by an additive technique utilizing a high-power laser. The Laser Powder Bed Fusion (L-PBF) method typically includes (i) a step of spreading a layer of powder material (such as metal, etc.) on a build platform or plate, (ii) a step of using a laser to fuse the first layer or a cross-section of the first layer of the part, (iii) a step of spreading a new powder layer over the entire preceding layer using a roller, recoater arm, coating blade, or similar device, (iv) a step of using a laser to fuse a new layer or a new cross-section of the part, (v) a step of laminating and fusing successive layers or cross-sections, and (vi) a step of repeating the above steps until the entire part is fabricated. Unfused powder remains in place but is removed during post-processing.

[0017] Whether a laser powder bed fusion (L-PBF) system functions depends on whether there is a known and stable laser focus on the working surface of the powder bed. The techniques disclosed in U.S. Patent No. 10,976,219 and U.S. Patent No. 10,627,311 provide a portable test device for analyzing the focus quality and dynamic accuracy of various laser powder bed fusion (L-PBF) systems and apparatuses. This test device further includes a laser powder bed fusion type additive manufacturing device having at least one laser that generates an unsteady laser beam with known or predetermined characteristics, and a shaping surface disposed at a predetermined position with respect to the unsteady laser beam, wherein the unsteady laser beam translates (i.e., traverses) across the shaping surface in a controlled manner during the additive manufacturing process. This test device includes a support having an upper surface configured to receive and absorb the laser light generated by the unsteady laser beam, a plurality of pinhole defining structures, each pinhole defining structure being arranged to receive the laser light generated by the unsteady laser beam, each pinhole extending a predetermined height from the upper surface of the support and being formed parallel to the upper surface of the support, the plurality of pinhole defining structures, and an optical fiber cable disposed within each pinhole defining structure, each optical fiber cable having a proximal end that receives laser light through the pinhole and a distal end through which the laser light is transmitted, the optical fiber cable, and a photodetector disposed at the distal end of each optical fiber cable, the photodetector converting the laser light transmitted to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole. FIGS. 1-4, FIGS. 5A-5C, FIGS. 6A-6B, FIGS. 7A-7F, and FIGS. 8A-8C provide various diagrams showing exemplary test devices for analyzing the quality and dynamic accuracy of laser foci in various laser-using manufacturing systems including laser powder bed fusion (L-PBF) systems and laser beam welding (LBW) systems.

[0018] As best shown in FIGS. 1 - 4, an exemplary test apparatus 10 includes a support 100, a base 200, pinhole defining structures or pinhole sensors 300, 400, 500, and 600 attached to the support 100, and a photodetector 700 disposed on the base 200. The support 100, which is substantially square in shape and also referred to as a calibration plate, includes an absorbent upper surface 110. The upper surface may further include a series of raised portions or other raised structures (see FIG. 4) arranged concentrically to absorb and dissipate heat generated by a laser beam, thereby preventing damage to the upper surface 110 and the support 100. The support 100 further includes a first mounting recess 120 (for receiving the first pinhole defining structure 300), a first setscrew opening 122 (for receiving a setscrew for fixing the first pinhole defining structure 300 within the first mounting recess 120), a second mounting recess 130 (for receiving the second pinhole defining structure 400), a second setscrew opening 132 (for receiving a setscrew for fixing the second pinhole defining structure 400 within the second mounting recess 130), a third mounting recess 140 (for receiving the third pinhole defining structure 500), a third setscrew opening 142 (for receiving a setscrew for fixing the third pinhole defining structure 500 within the third mounting recess 140), a fourth mounting recess 150 (for receiving the fourth pinhole defining structure 600), and a fourth setscrew opening 152 (for receiving a setscrew for fixing the fourth pinhole defining structure 600 within the fourth mounting recess 150). The support 100 also includes a first opening 160 for receiving a first coolant fitting 162, a second opening 164 for receiving a second coolant fitting 166, and a flow path 170 for receiving and transporting a liquid coolant or a gas coolant that transfers the energy absorbed by the support 100 away from the test apparatus 10.

[0019] Also, as best shown in FIGS. 1-4, the base 200 has a shape corresponding to the shape of the support 100 and forms a housing together with the support 100. The base 200 includes a photodetector 700 and an internal cavity 212 in which various optical fiber cables attached to the pinhole defining structure are disposed. The base 200 also includes an opening 214 for receiving a bayonet neill-concelman (BNC) partition portion 216 to which a bayonet neill-concelman (BNC) connector 218 is attached, a second opening 220 for receiving a gas joint portion 222, and a third opening 224 for receiving a gas escape valve 226. In a particular embodiment, a pressurized gas supply source is connected to the gas joint portion 222, and gas flowing outward through each pinhole is supplied, thereby preventing contamination of the pinholes by debris or other fragments generated during the test process.

[0020] Referring to FIGS. 1-4, FIGS. 5A-5C, and FIGS. 6A-6B, an exemplary embodiment of the illustrated test apparatus 10 includes four pinhole defining structures, also referred to as "pedestals". FIGS. 5A-C and FIGS. 6A-6B show only the first pinhole defining structure 300, but the remaining pinhole defining structures (400, 500, and 600) are configured similarly to the first pinhole defining structure 300. Thus, FIGS. 5A-5C and FIGS. 6A-6B are intended to be representative views of the entire illustrated pinhole defining structure.

[0021] As shown in FIGS. 5A-5C and FIGS. 6A-6B, the first pinhole defining structure or pedestal 300 includes a first pinhole 302 formed at a tip 304 through which a channel 306 passes. The diameter of the pinhole 302 is typically one-third to one-thirtieth of the diameter of the laser beam whose characteristics are evaluated by the test apparatus 10 (for example, the pinhole diameter is 5-50 μm). The tip 304 typically includes a highly reflective material such as gold, copper, or other reflective metals to minimize damage to the pinhole and the pinhole defining structure caused by absorption of energy from the laser beam. The tip 304 is mounted inside a main body 310 that includes a tapered portion 312 and a cylindrical portion 326 through which a channel 328 passes. The first set screw opening 330 is configured to receive a first set screw 332 that secures the first optical fiber cable 350 inside the main body 310. The first optical fiber 352 is inserted into the channel 306 and disposed close to the first pinhole 302. The first pinhole defining structure or pedestal 300 is mounted within the support 100 such that the pinhole extends a predetermined height (for example, 20-40 mm) above the upper surface 110, thereby minimizing damage that may be caused by the energy of the non-steady laser beam.

[0022] FIGS. 7A-7F show a test apparatus 10 used to analyze the characteristics of a non-steady laser beam generated by a laser light source within a laser powder bed fusion bonding system used for additive manufacturing. In these figures, a laser light source or laser 800 generates a laser beam 802 that contacts the upper surface 110 of the test apparatus 10 at a plurality of positions or locations including the position containing the pinhole described above. During normal operation of the test apparatus 10, the laser beam 802 is continuously operated at normal operating power to operate all elements of the laser beam transmission element of the laser powder bed fusion bonding apparatus or system at normal operating temperature and function, thereby making it possible to detect misalignment of the laser beam 802 or loss of laser focus quality.

[0023] FIG. 8A is a cross-sectional view of a pinhole defining structure 300 that is attached to a support 100 and receives laser light from a laser beam 802 during normal operation of a laser powder bed fusion system to be analyzed. FIG. 8B is a detailed view of the upper part of FIG. 8A, showing the laser light reflected by the pinhole defining structure 300. FIG. 8C illustrates a test apparatus 10 that is used to analyze the characteristics of an unsteady laser beam 802 generated by a laser light source 800, showing the state in which the laser beam 802 is reflected by a pinhole defining structure 400. In FIGS. 8A-8B, the light from the laser beam 802 is shown passing through a pinhole 302 and entering an optical fiber 352, and a signal is transmitted through this optical fiber 352 to a photodetector 700 (see FIG. 1). The laser light passing through the pinhole 302 is only a very small part of the laser light generated by the laser beam 802. For example, in the case of a laser beam with an overall diameter of about 0.1 mm, the diameter of the part passing through the pinhole 302 is about 0.025 mm. The laser light collected from each pinhole can be transmitted to one or more measuring devices via an optical fiber coupling. The test apparatus 10 includes a data collection device that communicates with the photodetector 700, and this data collection device receives, stores, organizes, and analyzes an electrical signal as a function of time or time and position related to the pinhole that received the laser light. A data analysis algorithm associated with the data collection device calculates and determines the quality of the laser beam based on data obtained by the unsteady laser beam passing over a plurality of pinholes multiple times. This data collection device can also include hardware and / or software (e.g., Bluetooth (registered trademark)) that enables data transmission to a receiver outside the additive manufacturing apparatus.

[0024] The systems, devices, and methods described in the above and (incorporated herein by reference in its entirety) U.S. Patent Application Publication No. 2021 / 0223140 are useful for analyzing various aspects of a high-speed laser movement system. In one embodiment, the disclosed technology is used in a method of analyzing the time required for a high-speed moving device to move a laser beam to two or more positions by at least two measuring devices (i.e., pinhole sensors). By adding measuring devices, the accuracy can be improved and the acceleration and other movement-related parameters can be evaluated. When the devices are arranged in a planned manner, adding an array of measuring devices can reduce the required alignment accuracy.

[0025] FIG. 9 shows an exemplary embodiment of the disclosed technology, in which the system is configured to measure speed and moving speed. To accurately analyze the moving speed of the laser beam, two measuring devices are accurately arranged within the field of view of a high-speed movement system (such as a laser scanner). To determine the positions of the measuring devices, the system rasterizes the field of view area, and the software analyzes the received signals based on the position of the system and reports the acquired information as the measurement start position. The system rasterizes the second position again and repeats this process for each additional measurement position. Next, each reported position is used along the movement path during the speed test. After identifying each position, the system moves the beam to those positions and measures the time required to move from one position to another. The distance X1 shown in FIG. 9 is a known precise measurement value, and the measurement time shown in Equation 1 below is the time recorded during the test. The calculation shown in Equation 1 is performed to analyze the speed or moving speed of the system. Next, the calculated moving speed is compared with the commanded speed.

[0026]

Equation

[0027] FIG. 10 shows an exemplary embodiment of the disclosed technology, in which the system is configured to measure acceleration. As shown in FIG. 10, additional measurement devices can be used to make additional or different measurements, including changes in acceleration and travel speed, important geometries, and position reproducibility when the mobile system changes direction. Using the same calculations as above, these characteristics can be analyzed. As shown in Equation 2, these measurements and calculations are made possible by the change in time between known positions.

[0028] [Number]

[0029] Advantages of the disclosed technology are that the speed (i.e., travel speed) can be analyzed at a minimum of two measurement positions (e.g., pinholes), and additional measurement positions enable analysis of the system's acceleration and other travel characteristics. Additionally, measurement positions can be detected using software and beam movement. In prior art systems, including the Primes Scan Field Monitor and Ophir Beam Watch AM, the sampling function and positions are limited (or sampling is not possible). These systems have limited or no ability to sample a moving beam, such as the beam used during processing, and currently have no ability to sample the beam during construction. There are numerous entities such as original equipment manufacturers (OEMs), users, custom manufacturers, and analysts for laser processing system end-user products, including laser powder bed fusion bonding systems and remote laser welding systems. Commercially available analysis systems have design limitations in that they require a stationary beam, and large analysis systems have limited field-of-view areas that are insufficient for analyzing laser processing systems. Furthermore, industrial standards such as AMS 7003 are creating a demand for systems that are not subject to the design limitations of existing systems, such as the disclosed technology. The disclosed technology is particularly useful for ensuring operation within the acceptable quality criteria of a given high-speed laser mobile system.

[0030] FIG. 9 is an exemplary embodiment of a test apparatus 10 used to analyze the travel speed, velocity, and acceleration of an unsteady laser beam 802 generated from a laser 800 of a high-speed laser movement system. As shown in FIG. 9, the test apparatus 10 includes pinhole sensors 300, 400, 500, 600 at predetermined positions. In this exemplary embodiment, the laser 800 first generates an unsteady laser beam 802 that is irradiated onto the pinhole sensor 300. Next, the unsteady laser beam 802 is irradiated onto the pinhole sensor 600. Using the predetermined positions of the pinhole sensor 300 and the pinhole sensor 600, a distance X1, which is the travel distance of the unsteady laser beam 802, is defined, and the time it takes for the unsteady laser beam 802 to travel the distance X1 is measured. Next, using Equation 1 defined above, the travel speed or velocity of the unsteady laser beam 802 between the pinhole sensors 300 and 600 is calculated. Further, using Equation 2 defined above, the acceleration of the unsteady laser beam 802 between the pinhole sensors 300 and 600 is calculated. It is understood that the travel speed, velocity, and acceleration of the unsteady laser beam 802 can be determined between any of the pinhole sensors 300, 400, 500, 600.

[0031] Figure 10 is another exemplary embodiment of a test apparatus 10 used to analyze the moving speed, velocity, and acceleration of an unsteady laser beam 802 generated from a laser 800 of a high-speed laser moving system. As shown in Figure 10, the test apparatus 10 includes pinhole sensors 300, 400, 500, 600 at predetermined positions, and additional pinhole sensors 900, 1000 are arranged between the pinhole sensors 300, 600. In this exemplary embodiment, the laser 800 first generates an unsteady laser beam 802 that is irradiated onto the pinhole sensor 300. Next, the unsteady laser beam 802 is irradiated onto the pinhole sensor 900 and then onto the pinhole sensor 1000. Using the predetermined positions of the pinhole sensor 300 and the pinhole sensor 900, a distance X2, which is the moving distance of the unsteady laser beam 802 between the pinhole sensors 300, 900, is defined, and using the predetermined positions of the pinhole sensor 300 and the pinhole sensor 1000, a distance X3, which is the moving distance of the unsteady laser beam 802 between the pinhole sensors 300, 1000, is defined. Next, the time taken for the unsteady laser beam 802 to travel the distances X2 and X3 is measured. Next, using Equation 1 defined above, the moving speed or velocity of the unsteady laser beam 802 between the pinhole sensors 300, 1000 is calculated. Further, using Equation 2 defined above, the acceleration of the unsteady laser beam 802 between the pinhole sensors 300, 1000 is calculated. By arranging additional pinhole sensors that function similarly to the pinhole sensors 300, 400, 500, 600, 900, 1000 at various predetermined positions within the test apparatus 10, the moving speed, velocity, and acceleration of the unsteady laser beam 802 can be determined between any of the additional pinhole sensors.

[0032] All documents and similar materials (including, but not limited to, patents, patent applications, articles, books, papers, and web pages) cited in this application are hereby expressly incorporated by reference in their entirety, regardless of the form of such documents and similar materials. If one or more of the incorporated documents and similar materials differ from or conflict with this application in terms of, for example, but not limited to, defined terms, usage of terms, described technologies, etc., this application shall prevail.

[0033] As described above, as used herein, the singular forms "a", "an", and "the" refer to both the singular and plural forms unless the context clearly dictates otherwise. The term "comprising" as used herein is synonymous with "including", "containing", or "characterized by", and is inclusive or non-limiting and does not exclude additional elements or additional steps of a method. Many methods and materials similar or equivalent to those described herein can be used, but particularly preferred methods and materials are described herein. Unless the context indicates otherwise, the recitation of numerical ranges by endpoints includes all numbers within that range. Further, the use of the phrase "one embodiment" is not intended to be construed as excluding the existence of additional embodiments incorporating the recited features. Further, unless expressly stated otherwise, an embodiment "having" or "comprising" one or more elements with a particular characteristic can include additional elements, whether or not it has that particular characteristic.

[0034] As used throughout this specification, the terms "substantially" and "about" account for and describe minor variations due to processing changes. For example, these terms may refer to ±5% or less, ±2% or less, ±1% or less, ±0.5% or less, ±0.2% or less, ±0.1% or less, ±0.05% or less, and / or 0%.

[0035] Headings and subheadings in underline and / or italic are used for convenience only, are not intended to limit the disclosed subject matter, and are not to be referred to in interpreting the description of the disclosed subject matter. All structural and functional elements equivalent to the elements of the various embodiments described throughout this disclosure that are known or later become known to those of ordinary skill in the art are hereby expressly incorporated by reference into this specification and are intended to be embraced by the disclosed subject matter. Further, the disclosure of this specification is not intended to be dedicated to the public regardless of whether or not it is expressly stated in the above description.

[0036] There are numerous alternative ways to implement the disclosed technology. The various functions and elements described herein may be divided in a manner different from that shown without departing from the scope of the disclosed technology. The general principles defined herein are applicable to other embodiments. Different numbers may be used for a given module or unit, different types or multiple different types of a given module or unit may be employed, and a given module or unit may be added or omitted.

[0037] In the present disclosure, the term "plurality" refers to two or more. The directions or positional relationships indicated by terms such as "upper" and "lower" are based on the directions or positional relationships shown in the drawings unless specifically defined, and such directions or positional relationships are only for the purpose of facilitating and simplifying the description of the disclosed technology, and do not indicate or imply that the device or element mentioned needs to be in a specific direction or needs to be constructed or operated in a specific direction. Therefore, it should not be construed as limiting the disclosed technology. Terms such as "connected", "attached", "fixed", etc. should be understood in a broad sense. For example, "connected" may be a fixed connection, a detachable connection, an integral connection, a direct connection, an indirect connection through an intermediate medium, etc. Those skilled in the art are considered to be able to understand the specific meanings of the above terms in the disclosed technology according to specific situations.

[0038] In the above description, specific details are shown to provide a complete understanding of the disclosed technology, but it is understood that the disclosed embodiments can be implemented without such specific details. For example, in order to avoid obscuring the disclosed embodiments with unnecessary details, the circuits can be shown in block diagrams. In another example, in order to avoid obscuring the disclosed embodiments, well-known circuits, processes, algorithms, structures, and technologies can be shown with unnecessary details omitted.

[0039] The implementation of the above technologies, blocks, processes, and means can be realized in various ways. For example, these technologies, blocks, processes, and means can be implemented in hardware, software, or a combination thereof. When implemented in hardware, one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the above functions, and / or a combination thereof, can implement the processing unit.

[0040] The disclosed technology can be described as a process described as a flowchart, flow diagram, data flow diagram, structural diagram, or block diagram. A flowchart can describe operations as sequential steps, but many of such operations can be executed in parallel or simultaneously. Furthermore, the order of operations can be changed. The process ends when the operations are completed, but it can also have additional steps not included in the figure. The process corresponds to a method, function, procedure, subroutine, subprogram, etc. When the process corresponds to a function, its end corresponds to the function returning to the calling function or the main function.

[0041] Furthermore, the disclosed technology can be implemented by hardware, software, script languages, firmware, middleware, microcode, hardware description languages, and / or any combination thereof. When implemented in software, firmware, middleware, script languages, and / or microcode, the program code or code segments for performing the necessary tasks can be stored in a machine-readable medium such as a storage medium. Code segments or machine-executable instructions can represent procedures, functions, subprograms, programs, routines, subroutines, modules, software packages, scripts, classes, or any combination of instructions, data structures, and / or program statements. A code segment can be coupled to another code segment or hardware circuit by passing information, data, arguments, parameters, and / or storage contents. Information, arguments, parameters, data, etc. can be passed, transferred, or transmitted via any suitable means including memory sharing, message passing, ticket passing, network transmission, etc.

[0042] It should be understood that all combinations of the concepts described above and the additional concepts detailed herein are considered to be part of the disclosed technology (as long as these concepts do not conflict with each other). In particular, all combinations of the subject matter of the claims described at the end of this disclosure are considered to be part of the technology disclosed herein. Although the disclosed technology has been described by way of illustration of exemplary embodiments and has been described in some detail with respect to the embodiments, it is in no way intended to limit the appended claims to such details. Those skilled in the art will likely readily envision additional advantages and modifications. Accordingly, the broader aspects of the disclosed technology are not limited to any specific details, representative devices and methods, and / or exemplary examples illustrated and described herein. Thus, departures from such details are possible without departing from the spirit and scope of the inventive concepts having patentable novelty.

Claims

1. A method for analyzing laser beam characteristics in a high-speed laser movement system, wherein the laser beam characteristics include the movement speed, speed, and acceleration of the laser, and the high-speed laser movement system has a laser for generating a laser beam, and this method comprises: (a) arranging a first pinhole sensor within a predetermined field of view of the laser and determining the position of the first pinhole sensor within the predetermined field of view; (b) arranging a second pinhole sensor within the predetermined field of view of the laser and determining the position of the second pinhole sensor within the predetermined field of view; (c) defining the movement distance of the laser beam using the determined positions of the first pinhole sensor and the second pinhole sensor; (d) measuring the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor; (e) dividing the movement distance by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the second pinhole sensor; and (f) dividing the calculated speed of the laser beam by the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the acceleration of the laser beam between the first pinhole sensor and the second pinhole sensor. A method having the above steps.

2. In the method according to Claim 1, further comprising: arranging a third pinhole sensor within the predetermined field of view and determining the position of the third pinhole sensor within the predetermined field of view. A method having the above step.

3. In the method according to Claim 2, further comprising: defining a second movement distance of the laser beam using the determined positions of the first pinhole sensor and the third pinhole sensor. A method having the above step.

4. In the method according to Claim 3, further comprising: measuring the movement time from the position of the first pinhole sensor to the position of the third pinhole sensor. A method having the above step.

5. In the method according to Claim 4, further comprising: Step (a): Divide the second moving distance by the moving time from the position of the first pinhole sensor to the position of the third pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the third pinhole sensor. Step (b): Subtract the speed of the laser beam between the first pinhole sensor and the second pinhole sensor from the speed of the laser beam between the first pinhole sensor and the third pinhole sensor to calculate the change in speed of the laser beam. A method comprising the above steps. **Claim 6** In the method according to claim 5, further comprising: Step of calculating the total measurement time by adding up the moving time from the position of the first pinhole sensor to the position of the second pinhole sensor and the moving time from the position of the first pinhole sensor to the position of the third pinhole sensor. A method comprising the above step. **Claim 7** In the method according to claim 6, further comprising: Step of calculating the acceleration of the laser beam between the first pinhole sensor and the third pinhole sensor by dividing the change in speed of the laser beam by the total measurement time. A method comprising the above step. **Claim 8** A system for analyzing laser beam characteristics in a high-speed laser moving system, wherein the laser beam characteristics include the moving speed, speed, and acceleration of the laser, and the high-speed laser moving system has a laser for generating a laser beam. (a) A first pinhole sensor disposed within a predetermined field of view of the laser, the first pinhole sensor having a predetermined position within the predetermined field of view. (b) A second pinhole sensor disposed within the predetermined field of view of the laser, the second pinhole sensor having a predetermined position within the predetermined field of view. The system having the above components. The predetermined positions of the first pinhole sensor and the second pinhole sensor are used to define the moving distance of the laser beam. The moving time from the position of the first pinhole sensor to the position of the second pinhole sensor is measured. The moving distance is divided by the moving time from the position of the first pinhole sensor to the position of the second pinhole sensor, and the speed of the laser beam between the first pinhole sensor and the second pinhole sensor is calculated. The calculated speed of the laser beam is divided by the moving time from the position of the first pinhole sensor to the position of the second pinhole sensor, and the acceleration of the laser beam between the first pinhole sensor and the second pinhole sensor is calculated. System.

9. In the system according to claim 8, the first pinhole sensor and the second pinhole sensor are attached to a portable test device, each pinhole sensor is arranged to receive laser light generated by an unsteady laser beam, each pinhole sensor extends from the upper surface of the portable test device by a predetermined height. System.

10. In the system according to claim 8, further, it has a third pinhole sensor arranged within the predetermined field of view of the laser, the third pinhole sensor has a predetermined position within the predetermined field of view. System.

11. In the system according to claim 10, the predetermined positions of the first pinhole sensor and the third pinhole sensor are used to define a second moving distance of the laser beam, the moving time from the position of the first pinhole sensor to the position of the third pinhole sensor is measured. System.

12. In the system according to claim 11, the second moving distance is divided by the moving time from the position of the first pinhole sensor to the position of the third pinhole sensor, and the speed of the laser beam between the first pinhole sensor and the third pinhole sensor is calculated, the speed change of the laser beam is calculated by subtracting the speed of the laser beam between the first pinhole sensor and the second pinhole sensor from the speed of the laser beam between the first pinhole sensor and the third pinhole sensor. System.

13. In the system according to claim 12, a total measurement time is calculated by adding the travel time from the position of the first pinhole sensor to the position of the second pinhole sensor and the travel time from the position of the first pinhole sensor to the position of the third pinhole sensor. System.

14. In the system according to claim 13, the acceleration of the laser beam between the first pinhole sensor and the third pinhole sensor is calculated by dividing the change in the speed of the laser beam by the total measurement time. System.

15. A system for analyzing laser beam characteristics in a high-speed laser movement system, wherein the laser beam characteristics include the moving speed, speed, and acceleration of the laser, and the high-speed laser movement system has a laser that generates a laser beam. (a) arranging a portable test device within a predetermined field of view of the laser, wherein the portable test device (i) a first pinhole sensor attached to a predetermined position of the portable test device, extending a predetermined height from the upper surface of the portable test device, the first pinhole sensor; (ii) a second pinhole sensor attached to a predetermined position of the portable test device, extending a predetermined height from the upper surface of the portable test device, the second pinhole sensor; arranging the portable test device including; (b) defining the travel distance of the laser beam using the predetermined positions of the first pinhole sensor and the second pinhole sensor; (c) measuring the travel time from the position of the first pinhole sensor to the position of the second pinhole sensor; (d) dividing the travel distance by the travel time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the second pinhole sensor; (e) dividing the calculated speed of the laser beam by the travel time from the position of the first pinhole sensor to the position of the second pinhole sensor to calculate the acceleration of the laser beam between the first pinhole sensor and the second pinhole sensor having, system.

16. In the system according to claim 15, further, it has a third pinhole sensor attached to a predetermined position of the portable test device, and it extends from the upper surface of the portable test device by a predetermined height. A system.

17. In the system according to claim 16, the predetermined positions of the first pinhole sensor and the third pinhole sensor are used to define a second movement distance of the laser beam, and a movement time from the position of the first pinhole sensor to the position of the third pinhole sensor is measured. A system.

18. In the system according to claim 17, the second movement distance is divided by the movement time from the position of the first pinhole sensor to the position of the third pinhole sensor to calculate the speed of the laser beam between the first pinhole sensor and the third pinhole sensor, and the speed change of the laser beam is calculated by subtracting the speed of the laser beam between the first pinhole sensor and the second pinhole sensor from the speed of the laser beam between the first pinhole sensor and the third pinhole sensor. A system.

19. In the system according to claim 18, the movement time from the position of the first pinhole sensor to the position of the second pinhole sensor and the movement time from the position of the first pinhole sensor to the position of the third pinhole sensor are added together to calculate a total measurement time. A system.

20. In the system according to claim 19, the acceleration of the laser beam between the first pinhole sensor and the third pinhole sensor is calculated by dividing the speed change of the laser beam by the total measurement time. A system.

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