A conductive paste composition containing a nickel complex compound ink composition, and an internal electrode containing the same

Abstract

This application can provide a conductive paste composition that has excellent viscosity characteristics, is easy to print and disperse, even with a low content of conductive metal powder, by substituting part of it, such as conductive metal powder, with a nickel complex compound ink composition. This application can also provide an internal electrode with a thin thickness through the conductive paste composition as described above.

Description

Technical Field

[0001] (Cross - reference to related applications) This application claims the benefit of priority based on Korean Patent Application No. 10 - 2022 - 0053232 filed on April 29, 2022, and all the contents disclosed in the literature of the Korean patent application are incorporated herein by reference in their entirety.

[0002] The present invention relates to a conductive paste composition containing a nickel complex compound ink composition and an internal electrode including the same.

Background Art

[0003] Nickel powder is used as a material for capacitors, which are electronic components constituting electronic circuits, particularly as a material for thick - film conductors constituting internal electrodes of multilayer ceramic components such as multilayer ceramic capacitors (MLCC; Multi - Layered Ceramic Capacitor) and multilayer ceramic substrates.

[0004] Recently, as the capacity of multilayer ceramic capacitors has been increased, the amount of internal electrode paste used for forming the thick - film conductors constituting the internal electrodes of multilayer ceramic capacitors has also increased significantly. Therefore, as the metal powder for internal electrode paste, inexpensive non - precious metals such as nickel are mainly used instead of expensive precious metals.

[0005] Currently, the production of commercially available multilayer ceramic capacitors generally involves the following steps. First, an internal electrode paste obtained by kneading nickel powder, a binder resin, an organic solvent, etc. is screen-printed onto a dielectric green sheet. Subsequently, for the dielectric green sheet printed with the internal electrode paste, a laminate is obtained by laminating and pressing it so that the internal electrode paste and the dielectric green sheet overlap alternately. Thereafter, the obtained laminate is cut into a predetermined size, heated to remove the binder resin (hereinafter referred to as "debinding treatment"), and then fired at a high temperature of about 1,300 °C to obtain a ceramic molded body. Finally, an external electrode is installed on the obtained ceramic molded body to obtain a multilayer ceramic capacitor.

[0006] At this time, since a non-metal such as nickel is used as the metal powder in the internal electrode paste, the debinding treatment of the laminate must be carried out in an atmosphere with an extremely low oxygen concentration, such as an inert atmosphere, so that the non-metal does not oxidize.

[0007] On the other hand, with the miniaturization and high capacitance of multilayer ceramic capacitors, recently, the thinning of both internal electrodes and dielectrics has been studied together. In particular, for the thinning of internal electrodes, the refinement of nickel powder particles used in the internal electrode paste has been promoted, and thus nickel powder with an average particle size of 0.5 μm or less is required.

[0008] In connection with this, a paste composition technology that minimizes the particle size, such as using an internal electrode paste containing functional particles with a particle size close to 50 nm to minimize the thickness during electrode formation, has been proposed. However, there is still a limit that the particle content cannot be simply reduced due to the dispersion stability of the paste composition, and thus it is a reality that there is a limit to the thinning of internal electrodes. Summary of the Invention Problems to be Solved by the Invention

[0009] One object of the present invention is to provide a conductive paste composition that has excellent viscosity characteristics, is easy to print and disperse, even with a low content of conductive metal powder, by replacing part of the conductive metal powder or the like with a nickel complex compound ink composition. Another object of the present invention is to provide an internal electrode with a thin thickness by using the conductive paste composition as described above. **Means for Solving the Problems**

[0010] One aspect of the present invention relates to a conductive paste composition.

[0011] The conductive paste composition of the present invention may contain, for example, a conductive metal powder, a ceramic powder, and / or a nickel complex compound ink composition.

[0012] The conductive metal powder may contain, for example, at least one selected from the group consisting of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and combinations thereof.

[0013] The ceramic powder may contain, for example, at least one selected from the group consisting of BaTiO 3 , Ba(TiZr)O 3 , CaZrO 3 , SrZrO 3 , and combinations thereof.

[0014] The nickel complex compound ink composition may contain, for example, nickel and a polar part containing a compound represented by the following Chemical Formula 1 coordinated to the nickel.

[0015] <Chemical Formula 1> NR 1 R 2 R 3

[0016] In Chemical Formula 1, R 1 ~R 3may each independently be an alkyl group, an alkylene group, an alkoxy group, an alkenyl group, an alkynyl group, an aryl group, or an arylene group substituted with a substituent selected from the group consisting of a hydrogen atom, a hydroxy group, an amine group, a nitro group, a cyano group, an acryloyl group, a methacryloyl group, a halogen atom, and combinations thereof.

[0017] The molar ratio of the compound represented by Chemical Formula 1 to the nickel may be, for example, from 0.1 to 10.

[0018] R in the Chemical Formula 1 1 ~R 3 At least one of them may be, for example, an alkyl group, an alkylene group, an alkoxy group, an alkenyl group, an alkynyl group, an aryl group, or an arylene group substituted with a substituent selected from the group consisting of a hydroxy group, an amine group, a nitro group, a cyano group, an acryloyl group, a methacryloyl group, a halogen atom, and combinations thereof.

[0019] The alkyl group, alkylene group, alkoxy group, alkenyl group, alkynyl group, aryl group, or arylene group in Chemical Formula 1 may have, for example, 10 or fewer carbon atoms.

[0020] The compound represented by Chemical Formula 1 may be selected from the group consisting of, for example, ethylenediamine, 2-amino-1-methyl-1-propanol, normal hexylamine, hexylamine, cyclohexylamine, methylcyclohexylamine, normal octylamine, octylamine, dodecylamine, oleylamine, benzylamine, diphenylamine, diethylenetriamine, triethylenetetramine, 1-dimethylamino-2-propanol, 2-(dimethylamino)ethanol, diethylethanolamine, 2-(ethylamino)ethanol, 2-(butylamino)ethanol, 2-(isopropylamino)ethanol, 3-ethoxypropylamine, and combinations thereof.

[0021] The nickel complex compound ink composition may further contain, for example, a solvent.

[0022] The solvent may include, for example, at least one selected from the group consisting of terpineol, α-terpineol, dihydro-terpineol, terpinyl acetate, dihydro terpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl isobutyrate, ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, dipropylene glycol, dipropylene glycol monomethyl ether, ethylene glycol phenyl ether, propylene glycol phenyl ether, ethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, propanol, isopropyl alcohol, isooctyl alcohol, butanol, diacetone alcohol, 1,2-pentanediol, 1,5-pentanediol, 2-methyl-2,4-pentanediol, 3-methyl-1,5-pentanediol, and combinations thereof.

[0023] The nickel complex compound ink composition may further include, for example, other additives.

[0024] The other additives may include, for example, at least one selected from the group consisting of a binder resin, a plasticizer, a stabilizer, a dispersant, a release agent, a reducing agent, a surfactant, a wetting agent, a thixotropic agent, a leveling agent, and combinations thereof.

[0025] The binder resin may include, for example, at least one selected from the group consisting of polyvinyl butyral, ethyl cellulose, polyvinyl pyrrolidone, acryl, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and combinations thereof.

[0026] The conductive paste composition of the present invention may be, for example, one in which the conductive metal powder is 20 to 50 parts by weight with respect to 100 parts by weight of the conductive paste composition.

[0027] In the present invention, the ceramic powder may be, for example, 1 to 20 parts by weight with respect to 100 parts by weight of the conductive paste composition.

[0028] The conductive paste composition of the present invention may be, for example, one in which the nickel complex compound ink composition is 40 to 80 parts by weight with respect to 100 parts by weight of the conductive paste composition.

[0029] The conductive paste composition of the present invention may be, for example, one in which nickel resulting from the nickel complex compound ink composition is 0.1 to 10 parts by weight with respect to 100 parts by weight of the conductive paste composition.

[0030] Another aspect of the present invention relates to an internal electrode.

[0031] The internal electrodes of the present invention may contain, for example, the above-described conductive paste composition.

Advantages of the Invention

[0032] By substituting part of conductive metal powder or the like with the nickel complex compound ink composition, the present invention can provide a conductive paste composition that has excellent viscosity characteristics, is easy to print and disperse, even with a small content of conductive metal powder. Further, the present invention can provide an internal electrode with a thin thickness by using the conductive paste composition as described above.

Brief Description of the Drawings

[0033]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0034] Among the physical properties mentioned in this specification, for physical properties where the measurement temperature and / or measurement pressure affect the results, unless otherwise specified, they are the results measured at normal temperature and / or normal pressure.

[0035] The term "normal temperature" refers to the natural temperature without heating or cooling, for example, any temperature between 10°C and 30°C, a temperature of about 23°C or about 25°C. Also, in this specification, unless otherwise specified, the unit of temperature is "°C".

[0036] The term "normal pressure" refers to the natural pressure without pressurization or depressurization, and usually means about 1 atmosphere at the atmospheric pressure level.

[0037] In this specification, in the case of physical properties where the measured humidity affects the results, unless otherwise specified, the physical properties are those measured at the normal temperature and / or normal pressure state with the humidity in its natural state without any particular adjustment.

[0038] In this specification, unless otherwise specified, the terms alkyl group, alkylene group, or alkoxy group mean a linear or branched alkyl group, alkylene group, or alkoxy group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms, or may mean a cyclic alkyl group, alkylene group, or alkoxy group having 3 to 20 carbon atoms, 3 to 16 carbon atoms, 3 to 12 carbon atoms, 3 to 8 carbon atoms, or 3 to 6 carbon atoms.

[0039] In this specification, unless otherwise mentioned, the terms alkenyl group or alkynyl group mean a linear or branched alkenyl group or alkynyl group having 2 to 20 carbon atoms, 2 to 16 carbon atoms, 2 to 12 carbon atoms, 2 to 8 carbon atoms, or 2 to 4 carbon atoms, or may mean a cyclic alkenyl group or alkynyl group having 3 to 20 carbon atoms, 3 to 16 carbon atoms, 3 to 12 carbon atoms, 3 to 8 carbon atoms, or 3 to 6 carbon atoms.

[0040] In this specification, unless otherwise specified as different, the terms aryl group or arylene group may mean an aryl group or arylene group having 6 to 24 carbon atoms, 6 to 18 carbon atoms, or 6 to 12 carbon atoms, and may be, for example, a phenyl group or a phenylene group.

[0041] In this specification, for the ink composition to be transparent, for example, when the ink composition is coated on glass to a thickness of about 30 μm, it may mean that the transmittance measured by the ASTM D1003 method using a haze meter is 90% or more. In this specification, for the ink composition to be transparent, as another example, it may mean that the transmittance is 91% or more, 92% or more, 93% or more, 94% or more, 95% or more, 96% or more, or 97% or more.

[0042] The present invention may relate to a conductive paste composition containing, for example, a conductive metal powder, a ceramic powder, and / or a nickel complex compound ink composition.

[0043] In the conductive paste composition of the present invention, the conductive metal powder may contain at least one selected from the group consisting of, for example, silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and combinations thereof.

[0044] The conductive metal powder may be, for example, 20 to 50 parts by weight based on 100 parts by weight of the conductive paste composition. As another example, the conductive metal powder may be 22 parts by weight or more, 24 parts by weight or more, 26 parts by weight or more, or 28 parts by weight or more, or 48 parts by weight or less, 46 parts by weight or less, 44 parts by weight or less, 42 parts by weight or less, 40 parts by weight or less, 38 parts by weight or less, 36 parts by weight or less, 34 parts by weight or less, or 32 parts by weight or less based on 100 parts by weight of the conductive paste composition.

[0045] Despite containing the conductive metal powder within the above-described range, the conductive paste composition of the present invention can form a thin film with excellent viscosity characteristics suitable for printing and dispersion by combination with the nickel complex compound ink composition and / or ceramic powder, etc. described later.

[0046] In the conductive paste composition of the present invention, the ceramic powder is, for example, BaTiO 3 , Ba(TiZr)O 3 , CaZrO 3 , SrZrO 3 , and may contain at least one selected from the group consisting of combinations thereof.

[0047] The ceramic powder may be, for example, 1 to 20 parts by weight with respect to 100 parts by weight of the conductive paste composition. As another example, the ceramic powder may be contained in an amount of 1.5 or more, 2.0 or more, 2.5 or more, or 3.0 or more, or may be 18 or less, 16 or less, 14 or less, 12 or less, 10 or less, 8 or less, 6 or less, or 4 or less with respect to 100 parts by weight of the conductive paste composition.

[0048] By containing the ceramic powder within the above range, the conductive paste composition of the present invention may be configured such that nickel particles are formed from a nickel complex compound ink composition having the characteristics described below. As a result, even though it contains less conductive metal powder, it has excellent viscosity characteristics and can realize a thin film with a thin thickness.

[0049] The nickel complex compound ink composition of the present invention may include, for example, nickel and a polar part containing a compound represented by the following Chemical Formula 1 coordinated to the nickel.

[0050] <Chemical Formula 1> NR 1 R 2 R 3

[0051] In Chemical Formula 1, R 1 ~R 3 may each independently be a hydrogen atom, a hydroxy group, an amine group, a nitro group, a cyano group, an acryloyl group, a methacryloyl group, a halogen atom, or an alkyl group, an alkylene group, an alkoxy group, an alkenyl group, an alkynyl group, an aryl group, or an arylene group substituted with a substituent selected from the group consisting of these and combinations thereof.

[0052] R 1 ~R 3At least one of them may be an alkyl group, an alkylene group, an alkoxy group, an alkenyl group, an alkynyl group, an aryl group, or an arylene group substituted with a substituent selected from the group consisting of, for example, a hydroxy group, an amine group, a nitro group, a cyano group, an acryloyl group, a methacryloyl group, a halogen atom, and combinations thereof.

[0053] The alkyl group, alkylene group, alkoxy group, alkenyl group, alkynyl group, aryl group, or arylene group in Chemical Formula 1 may have, for example, 10 or fewer carbon atoms.

[0054] In the nickel complex compound ink composition of the present invention, the compound represented by Chemical Formula 1 may be, for example, ethylenediamine, 2-amino-1-methyl-1-propanol, normal hexylamine, hexylamine, cyclohexylamine, methylcyclohexylamine, normal octylamine, octylamine, dodecylamine, oleylamine, benzylamine, diphenylamine, diethylenetriamine, triethylenetetramine, 1-dimethylamino-2-propanol, 2-(dimethylamino)ethanol, diethylethanolamine, 2-(ethylamino)ethanol, 2-(butylamino)ethanol, 2-(isopropylamino)ethanol, 3-ethoxypropylamine, and combinations thereof.

[0055] The nickel complex compound ink composition of the present invention may be, for example, one in which the molar ratio of the compound represented by Chemical Formula 1 to the nickel is 0.1 to 10. As another example, the nickel complex compound ink composition of the present invention may have a molar ratio of the compound represented by Chemical Formula 1 to the nickel of 0.5 or more, 1 or more, 1.5 or more, 2 or more, 2.5 or more, 3 or more, or 3.5 or more, or 9 or less, 8 or less, 7 or less, 6 or less, or 5 or less.

[0056] The conductive paste composition of the present invention can replace a part of the conductive metal powder with the nickel complex compound ink composition described above and / or combine it with the ceramic powder etc. described above, so that while reducing the content of the conductive metal powder in the conductive paste composition, it can embody viscosity characteristics suitable for printing and dispersion, and enable the formation of a thin film with a thin thickness.

[0057] In the present invention, the nickel complex compound ink composition may further contain a solvent.

[0058] The solvent may include at least one selected from the group consisting of, for example, terpineol, α-terpineol, dihydro-terpineol, terpinyl acetate, dihydro terpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl isobutyrate, ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, dipropylene glycol, dipropylene glycol monomethyl ether, ethylene glycol phenyl ether, propylene glycol phenyl ether, ethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, propanol, isopropyl alcohol, isooctyl alcohol, butanol, diacetone alcohol, 1,2-pentanediol, 1,5-pentanediol, 2-methyl-2,4-pentanediol, 3-methyl-1,5-pentanediol, and combinations thereof.

[0059] The solvent may be, for example, 5 to 50 parts by weight with respect to 100 parts by weight of the conductive paste composition. As another example, the solvent may be contained in an amount of 10 parts by weight or more, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, or 30 parts by weight or more, or may be 45 parts by weight or less, 40 parts by weight or less, or 35 parts by weight or less with respect to 100 parts by weight of the conductive paste composition.

[0060] In the present invention, the nickel complex compound ink composition may further contain, for example, other additives.

[0061] The other additives may include, for example, at least one selected from the group consisting of a binder resin, a plasticizer, a stabilizer, a dispersant, a release agent, a reducing agent, a surfactant, a wetting agent, a thixotropic agent, a leveling agent, and combinations thereof.

[0062] The binder resin may include, for example, at least one selected from the group consisting of polyvinyl butyral, ethyl cellulose, polyvinyl pyrrolidone, acryl, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and combinations thereof.

[0063] The binder resin may be, for example, 0.1 to 10 parts by weight with respect to 100 parts by weight of the nickel complex compound ink composition. As another example, the binder resin may be contained in an amount of 0.5 parts by weight or more, 1 part by weight or more, 1.5 parts by weight or more, 2 parts by weight or more, 2.5 parts by weight or more, 3 parts by weight or more, 3.5 parts by weight or more, or 4 parts by weight or more, or may be 9 parts by weight or less, 8 parts by weight or less, 7 parts by weight or less, 6 parts by weight or less, or 5 parts by weight or less with respect to 100 parts by weight of the nickel complex compound ink composition.

[0064] In the present invention, the nickel complex compound ink composition may be, for example, 40 to 80 parts by weight with respect to 100 parts by weight of the conductive paste composition. As another example, the nickel complex compound ink composition may be contained in an amount of 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, or 65 parts by weight or more, or may be 75 parts by weight or less or 70 parts by weight or less with respect to 100 parts by weight of the conductive paste composition.

[0065] In the present invention, nickel resulting from the nickel complex compound ink composition may be, for example, 0.1 to 10 parts by weight with respect to 100 parts by weight of the conductive paste composition. As another example, nickel resulting from the nickel complex compound ink composition may be contained in an amount of 0.3 parts by weight or more, 0.5 parts by weight or more, 0.7 parts by weight or more, 0.9 parts by weight or more, 1.1 parts by weight or more, 1.3 parts by weight or more, 1.5 parts by weight or more, 1.7 parts by weight or more, 1.9 parts by weight or more, 2.1 parts by weight or more, 2.3 parts by weight or more, or 2.5 parts by weight or more, or may be 9 parts by weight or less, 8 parts by weight or less, 7 parts by weight or less, 6 parts by weight or less, 5 parts by weight or less, 4 parts by weight or less, or 3 parts by weight or less with respect to 100 parts by weight of the conductive paste composition.

[0066] By combining the above-described conductive metal powder, ceramic powder, and / or nickel complex compound ink composition within a predetermined range, the conductive paste composition of the present invention contains a small amount of the conductive metal powder and enables the formation of a thin film, and as described above, has an effect of correcting the viscosity by nickel or the like resulting from the nickel complex compound ink composition, and can also have excellent printability and dispersibility.

[0067] The viscosity of the conductive paste composition of the present invention may be, for example, 5000 cP or more. As another example, the viscosity of the conductive paste composition of the present invention may be 5100 cP or more, 5200 cP or more, 5300 cP or more, 5400 cP or more, 5500 cP or more, 5600 cP or more, 5700 cP or more, 5800 cP or more, 5900 cP or more, 6000 cP or more, 6100 cP or more, 6200 cP or more, 6300 cP or more, 6400 cP or more, 6500 cP or more, 6600 cP or more, 6700 cP or more, 6800 cP or more, or 6900 cP or more, or may be 20000 cP or less, 16000 cP or less, 12000 cP or less, or 8000 cP or less. The viscosity of the conductive paste composition may be measured by the test examples described later, and when the viscosity measurement method changes, the viscosity range may change.

[0068] The present invention may further relate to, for example, an internal electrode. The internal electrode of the present invention may contain the conductive paste composition described above.

[0069] The thickness of the internal electrode may be, for example, 5 μm or less. As another example, the thickness of the internal electrode may be 4 μm or less, 3 μm or less, 2.9 μm or less, 2.8 μm or less, 2.7 μm or less, 2.6 μm or less, 2.5 μm or less, 2.4 μm or less, 2.3 μm or less, or 2.2 μm or less, or may be 0.1 μm or more, 0.5 μm or more, or 1.0 μm or more. The thickness of the internal electrode in this specification may mean the thickness before firing. In this specification, the firing may mean debinding at a temperature of, for example, about 1000 °C or higher, 1100 °C or higher, 1200 °C or higher, or 1300 °C or higher. The thickness of the internal electrode in this specification may mean, for example, the thickness of the internal electrode formed by coating and drying the conductive paste composition.

[0070] By including the conductive paste composition having the above-described characteristics, the internal electrode of the present invention can be apparently formed with a thin thickness without damage.

[0071] The present invention may further relate to an MLCC. The MLCC may have, for example, a structure in which a dielectric layer and the internal electrodes are alternately laminated. The dielectric layer may be formed of a substance containing BaTiO 3 etc. and known in the art.

[0072] By including the internal electrodes described above, the MLCC of the present invention can exhibit excellent performance such as improved capacitance characteristics due to an increase in the number of laminations of the internal electrodes and the like.

[0073] Hereinafter, the present invention will be specifically described by way of examples, but the scope of the present invention is not limited by the following examples.

[0074] Production Example 1. Production of Nickel Complex Compound Ink Composition A polar part produced by mixing nickel acetate and diethylethanolamine in a molar ratio of 1:4 was 64.5% by weight, dihydroterpinyl acetate was 31.1% by weight, and PVB (polyvinyl butyral) was 4.4% by weight. The mixture was stirred at 100 °C to produce a transparent nickel complex compound ink composition.

[0075] Example 1. Production of Conductive Paste Composition With respect to 100 parts by weight of the conductive paste composition, 30 parts by weight of nickel powder (average particle size 120 nm), 2.7 parts by weight of nickel formed from the ink composition of Production Example 1, 31.1 parts by weight of diethylethanolamine, 2.2 parts by weight of PVB (polyvinyl butyral), ceramic powder (BaTiO 3) 3.3 parts by weight and 30.7 parts by weight of dihydroterpinyl acetate, the ink composition of Production Example 1, nickel powder, and dihydroterpinyl acetate were mixed and homogeneously mixed using a three-roll mill (3-Roll Mill; TX-3501, manufactured by Intec) and a vacuum degassing machine (ARV-310, manufactured by Shinchi). As a result, the conductive paste composition of the present invention was formed.

[0076] Comparative Example 1. Production of Conductive Paste Composition With respect to 100 parts by weight of the conductive paste composition, 32.7 parts by weight of nickel powder (average particle size 120 nm), 22.3 parts by weight of diethylethanolamine, 2.2 parts by weight of PVB (polyvinyl butyral), ceramic powder (BaTiO 3 ) 3.3 parts by weight, and 39.5 parts by weight of dihydroterpinyl acetate, each substance was mixed and homogeneously mixed using a three-roll mill (TX-3501, manufactured by Intec) and a vacuum degassing machine (ARV-310, manufactured by Shinchi). As a result, the conductive paste composition of Comparative Example 1 was formed.

[0077] Comparative Example 2. Production of Conductive Paste Composition With respect to 100 parts by weight of the conductive paste composition, 40.0 parts by weight of nickel powder (average particle size 120 nm), 22.3 parts by weight of diethylethanolamine, 2.2 parts by weight of PVB (polyvinyl butyral), ceramic powder (BaTiO 3 ) 4.0 parts by weight, and 31.5 parts by weight of dihydroterpinyl acetate, each substance was mixed and homogeneously mixed using a three-roll mill (TX-3501, manufactured by Intec) and a vacuum degassing machine (ARV-310, manufactured by Shinchi). As a result, the conductive paste composition of Comparative Example 2 was formed.

[0078] Comparative Example 3. Production of Conductive Paste Composition For 100 parts by weight of the conductive paste composition, 32.7 parts by weight of nickel powder (average particle size 120 nm), 19.6 parts by weight of 2-(isopropylamino)ethanol, 2.2 parts by weight of PVB (polyvinyl butyral), 3.3 parts by weight of ceramic powder (BaTiO 3 ) and 42.2 parts by weight of dihydroterpinyl acetate were mixed so that each substance was added in the above amounts, and they were homogeneously mixed using a three-roll mill (TX-3501, INTEC) and a vacuum degassing machine (ARV-310, manufactured by Shin-Kee). As a result, the conductive paste composition of Comparative Example 3 was formed.

[0079] Comparative Example 4. Production of Conductive Paste Composition For 100 parts by weight of the conductive paste composition, 35 parts by weight of nickel powder (average particle size 120 nm), 35.9 parts by weight of 1-dimethylamino-2-propanol, 1.3 parts by weight of PVB (polyvinyl butyral), 3.5 parts by weight of ceramic powder (BaTiO 3 ) and 24.3 parts by weight of dihydroterpinyl acetate were mixed so that each substance was added in the above amounts, and they were homogeneously mixed using a three-roll mill (TX-3501, INTEC) and a vacuum degassing machine (ARV-310, manufactured by Shin-Kee). As a result, the conductive paste composition of Comparative Example 3 was formed.

[0080] Test Example 1. Appearance of Ink Composition Thin Film The nickel complex ink composition of Production Example 1 was coated on glass to a thickness of about 30 μm and then dried at 100°C, and the appearance of the formed thin film was confirmed. As a result, as shown in FIG. 1, the thin film was extremely transparent, and it was confirmed that it was difficult to observe visually.

[0081] Test Example 2. Transmittance of Ink Composition Thin Film Regarding the test piece of Test Example 1, the transmittance was measured by the method of ASTM D1003 using a haze meter equipment, and as a result, it was confirmed that the transmittance was 99.71%.

[0082] Test Example 3. Viscosity of Conductive Paste Composition The paste compositions of the examples and comparative examples were measured for viscosity using a rheometer at a shear rate of 2.5 s -1 and the results are summarized in Table 1 below.

[0083] [Table 1]

[0084] Test Example 4. Appearance of Thin Film of Conductive Paste Composition The paste compositions of the examples and comparative examples were coated on glass to a thickness of about 5 μm and dried at 100 °C to form thin films, and then the appearances were compared.

[0085] As a result, in the case of the examples containing the ink composition of the present invention and Comparative Example 2 in which the nickel content was as high as about 40% by weight, it was confirmed that the viscosity was sufficient for printing and dispersion and no scratches occurred during coating. However, in the case of the thin films formed by coating Comparative Examples 1, 3, and 4 in which only the nickel content was decreased, the viscosity was low, printing and dispersion were difficult, particles having a particle size of 5 μm or more were present, and scratches occurred during coating (Figure 2).

[0086] Test Example 5. Thickness of Thin Film of Conductive Paste Composition The paste compositions of the examples and comparative examples were coated on glass to a thickness of about 30 μm and dried at 100 °C to form thin films, and then the thickness of the thin films was measured using SEM (S4800, manufactured by Hitachi) (Figure 3).

[0087] As a result, the results as shown in Table 2 below were obtained.

[0088] [Table 2]

Claims

1. A conductive paste composition comprising a conductive metal powder, a ceramic powder, and a nickel complex compound ink composition.

2. The conductive paste composition according to claim 1, wherein the conductive metal powder contains at least one selected from the group consisting of silver (Ag), lead (Pb), platinum (Pt), nickel (Ni), copper (Cu), and combinations thereof.

3. The ceramic powder is BaTiO ３ , Ba(TiZr)O ３ , CaZrO ３ , SrZrO ３ The conductive paste composition according to claim 1, comprising at least one selected from the group consisting of these and combinations thereof.

4. The conductive paste composition according to claim 1, wherein the nickel complex compound ink composition contains a polar part containing nickel and a compound represented by the following Chemical Formula 1 coordinated to the nickel: <Chemical Formula 1> NR １ R ２ R ３ (In the above chemical formula 1, R １ ~R ３ are each independently an alkyl group, an alkylene group, an alkoxy group, an alkenyl group, an alkynyl group, an aryl group, or an arylene group substituted with a substituent selected from the group consisting of a hydrogen atom, a hydroxy group, an amine group, a nitro group, a cyano group, an acryloyl group, a methacryloyl group, a halogen atom, and combinations thereof).

5. The conductive paste composition according to claim 4, wherein the molar ratio of the compound represented by Chemical Formula 1 to nickel is 0.1 to 10.

6. R in the chemical formula (1) １ to R ３ At least one of them is an alkyl group, an alkylene group, an alkoxy group, an alkenyl group, an alkynyl group, an aryl group, or an arylene group substituted with a substituent selected from the group consisting of a hydroxy group, an amine group, a nitro group, a cyano group, an acryloyl group, a methacryloyl group, a halogen atom, and combinations thereof. The conductive paste composition according to claim 4.

7. The conductive paste composition according to claim 4, wherein the alkyl group, alkylene group, alkoxy group, alkenyl group, alkynyl group, aryl group, or arylene group of Chemical Formula 1 has 10 or less carbon atoms.

8. The compound represented by Chemical Formula 1 is at least one selected from the group consisting of ethylenediamine, 2-amino-1-methyl-1-propanol, normal hexylamine, hexylamine, cyclohexylamine, methylcyclohexylamine, normal octylamine, octylamine, dodecylamine, oleylamine, benzylamine, diphenylamine, diethylenetriamine, triethylenetetramine, 1-dimethylamino-2-propanol, 2-(dimethylamino)ethanol, diethylethanolamine, 2-(ethylamino)ethanol, 2-(butylamino)ethanol, 2-(isopropylamino)ethanol, 3-ethoxypropylamine, and combinations thereof. The conductive paste composition according to claim 4.

9. The conductive paste composition according to claim 1, wherein the nickel complex compound ink composition further contains a solvent.

10. The solvent contains at least one selected from the group consisting of terpineol, alpha-terpineol, dihydro-terpineol, terpinyl acetate, dihydro terpinyl acetate, isobornyl acetate, isobornyl propionate, isobornyl isobutyrate, ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, dipropylene glycol, dipropylene glycol monomethyl ether, ethylene glycol phenyl ether, propylene glycol phenyl ether, ethylene glycol monobutyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, propanol, isopropyl alcohol, isooctyl alcohol, butanol, diacetone alcohol, 1,2-pentanediol, 1,5-pentanediol, 2-methyl-2,4-pentanediol, 3-methyl-1,5-pentanediol, and combinations thereof, and is the conductive paste composition according to claim 9.

11. The nickel complex compound ink composition further contains other additives, and is the conductive paste composition according to claim 1.

12. The other additive includes at least one selected from the group consisting of a binder resin, a plasticizer, a stabilizer, a dispersant, a release agent, a reducing agent, a surfactant, a wetting agent, a thixotropic agent, a leveling agent, and combinations thereof, and the conductive paste composition according to claim 11.

13. The binder resin includes at least one selected from the group consisting of polyvinyl butyral, ethyl cellulose, polyvinyl pyrrolidone, acrylic, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and combinations thereof, and the conductive paste composition according to claim 12.

14. The conductive metal powder is 20 to 50 parts by weight with respect to 100 parts by weight of the conductive paste composition, and the conductive paste composition according to claim 1.

15. The ceramic powder is 1 to 20 parts by weight with respect to 100 parts by weight of the conductive paste composition, and the conductive paste composition according to claim 1.

16. The nickel complex compound ink composition is 40 to 80 parts by weight with respect to 100 parts by weight of the conductive paste composition, and the conductive paste composition according to claim 1.

17. The nickel resulting from the nickel complex compound ink composition is 0.1 to 10 parts by weight with respect to 100 parts by weight of the conductive paste composition, and the conductive paste composition according to claim 1.

18. An internal electrode including the conductive paste composition according to claim 1.

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