Metal card with an insert coil and method for manufacturing the same

By incorporating an insert coil structure that connects wiredly to the antenna coil, the metal card's antenna sensitivity and data transmission efficiency are improved, addressing the communication challenges faced by conventional metal cards.

JP2025518160AActive Publication Date: 2025-06-12KONAM
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Patent Information

Application Number
JP2024570402
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-06-10
Filing Date
2023-06-01
Publication Date
2025-06-12
Estimated Expiration
2043-06-01

AI Technical Summary

Technical Problem

Conventional metal cards face challenges in non-contact communication due to interference between the wireless antenna coil and the metal, leading to decreased antenna sensitivity and data transmission/reception efficiency.

Method used

The introduction of an insert coil structure that supports a wireless IC chip, where a part of the insert coil is connected wiredly to the antenna coil of the antenna layer, enhancing both antenna sensitivity and data transmission/reception efficiency.

Benefits of technology

This solution improves the antenna sensitivity and data transmission/reception efficiency of metal cards, enabling more effective non-contact communication and enhanced RF functionality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The metal card according to an embodiment of the present invention includes an antenna layer, a wireless IC chip having a chip coil for wireless communication with the antenna layer built therein, and an insert coil structure for supporting the wireless IC chip. The insert coil structure is fitted into an upper portion of a support body adjacent to the chip coil, and includes an insert coil in which a path is formed to transmit a wireless signal of the chip coil to an antenna coil of the antenna layer by wire.
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Description

Technical Field

[0001] The present invention relates to a metal card and a method for manufacturing the same. More specifically, the present invention is a metal card provided with an insert coil and a method for manufacturing the same.

Background Art

[0002] Generally, credit cards can be used not only as a substitute for cash, but recently, they have been developed as smart cards incorporating an IC chip capable of recording a large amount of information, and are actively used not only for settlement but also as various membership cards and the like.

[0003] In such a smart card market, efforts have been made to develop special cards using various materials. In particular, efforts have been made to develop credit cards made of metal materials differentiated for VIP customers, and metal cards have been provided to special customers by realizing high-quality credit cards with a metallic luster.

[0004] However, conventional metal cards are difficult to operate the antenna when communicating with a reader in a non-contact manner due to the characteristics of the metal, so the RF function and the use of automated teller machines (ATMs) are often restricted.

[0005] More specifically, in conventional metal cards, due to the interference that occurs between the wireless antenna coil of the wireless IC chip and each metal from the characteristics of the metal, communication failure of the antenna occurs, and the problem of a decrease in the transmission and reception efficiency of the antenna data occurs.

[0006] In order to prevent the phenomenon that the transmission and reception efficiency of the antenna of the metal card decreases, a method has been proposed in which a shielding layer or the like is arranged between the metals, and further an intermediate coil such as a wireless booster coil is provided to increase the transmission and reception efficiency of the antenna and interlock it with the wireless antenna coil of the wireless IC chip.

[0007] As described above, a metal card of the type proposed heretofore with a wireless booster coil is configured such that inside the metal card, the wireless booster coil and the wireless antenna coil of the IC chip are separated by a certain distance and are configured to be inductively connected to the antenna layer. However, it is by no means easy to adjust the distance between the wireless booster coil and the wireless antenna coil of the IC chip during manufacturing. As a result of the communication between the wireless booster coil and the IC chip not being smoothly performed depending on the separation distance between them, there is a problem that it becomes difficult to operate the metal card.

[0008] Accordingly, even if a wireless booster coil is utilized, with the current technology, in the non-contact communication of a metal card, there still remains a problem that a decrease in antenna sensitivity and a decrease in the data transmission / reception efficiency of the antenna occur, resulting in a limitation in the RF function. Summary of the Invention Problems to be Solved by the Invention

[0009] The present invention was created to solve the above problems. An insert coil structure that supports a wireless IC chip incorporates an insert coil that communicates wirelessly with the wireless IC chip, and a part of the insert coil is configured to be connected wiredly to the antenna coil of the antenna layer, thereby achieving both an improvement in the antenna sensitivity of the metal card and an improvement in the data transmission / reception efficiency of the antenna. The object is to provide a metal card and a manufacturing method. Means for Solving the Problems

[0010] A metal card including an insert coil according to an embodiment of the present invention for solving the above problems includes an antenna layer, a wireless IC chip having a chip coil for wireless communication with the antenna layer built therein, and an insert coil structure for supporting the wireless IC chip. The insert coil structure is inserted into an upper portion of a support body adjacent to the chip coil, and includes an insert coil in which a path is formed to transmit a wireless signal of the chip coil to an antenna coil of the antenna layer by wire.

[0011] A method for manufacturing a metal card including an insert coil according to an embodiment of the present invention for solving the above problems includes steps of laminating a metal layer, an electromagnetic wave shielding layer, and an antenna layer in this order to form a metal card body; milling an insert coil structure accommodating portion in a certain region of the metal card body so that an antenna coil of the antenna layer is exposed; milling a through hole in a previously prepared insert coil structure; inserting the processed insert coil structure into the insert coil structure accommodating portion; and inserting a wireless IC chip into an upper portion of a support body of the insert coil structure.

Advantages of the Invention

[0012] According to an embodiment of the present invention, it is possible to improve the antenna sensitivity of a metal card by including an insert coil and enhance the transmission and reception efficiency of antenna data.

[0013] According to an embodiment of the present invention, a part of the insert coil is wired to the antenna coil of the antenna layer through a through hole formed perpendicular to the depth from the insert coil built in the insert coil structure supporting the wireless IC chip to the lower part of the support body of the insert coil structure and a contact pad attached to the through hole, thereby enabling both improvement of the antenna sensitivity of the metal card and improvement of the transmission and reception efficiency of the antenna data. A metal card and a manufacturing method thereof can be provided.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0015] The following content merely exemplifies the principles of the present invention. Therefore, those skilled in the art can invent various devices and methods that realize the principles of the present invention and are included in the concept and scope of the present invention, even if they are not explicitly described or illustrated in this specification. Note that all conditional terms and embodiments listed in this specification are, in principle, only explicitly intended for the purpose of enabling the concept of the present invention to be understood, and should not be construed as being limited to the specifically listed embodiments and states.

[0016] For example, throughout the specification, if a portion is "connected" to another portion, this includes not only the case where it is "directly connected", but also the case where it is "indirectly connected" with other members interposed therebetween. Note that when a portion "comprises" a certain component, this means that, unless otherwise specified, it does not exclude other components, and it may further comprise other components.

[0017] Also, it should be understood that all the detailed descriptions listing specific embodiments are intended to include structural and functional equivalents of such matters, not only in terms of the principles, aspects and embodiments of the present invention, but also including equivalents that are currently known and those to be developed in the future, i.e., all elements invented to perform the same function regardless of structure.

[0018] The above-described objects, features and advantages should become even more apparent from the following detailed description taken in conjunction with the accompanying drawings, whereby those of ordinary skill in the technical field to which the present invention pertains should be able to easily implement the technical idea of the present invention. Note that when it is recognized that a specific description of known technology related to the present invention may obscure the gist of the present invention, the detailed description thereof may be omitted.

[0019] FIG. 1 is an exploded perspective view of a metal card including an insert coil according to an embodiment of the present invention.

[0020] Referring to FIG. 1, a metal card 100 according to an embodiment of the present invention may include an antenna layer 160, a wireless IC chip 110 having a chip coil for wireless communication with the antenna layer 160, and an insert coil structure 120 that supports the wireless IC chip 110.

[0021] Also, an insert coil may be inserted into the upper part of the support body of the insert coil structure 120 adjacent to the chip coil, and a path may be formed such that the insert coil transmits the wireless signal of the chip coil to the antenna coil of the antenna layer 160 by wire.

[0022] And the metal card 100 can form a metal card body by laminating the antenna layer 160, the electromagnetic wave shielding layer 150, and the metal layer 140 in this order.

[0023] Here, in order to accommodate the insert coil structure 120, the metal card body may be opened to a depth up to a location where the antenna coil of the antenna layer 160 is exposed in a certain region of the metal card body, and insert coil structure accommodating portions 141 and 151 may be formed.

[0024] And an epoxy sheet 170 may be disposed on the lower surface of the antenna layer 160, and a printed sheet 180 may be disposed on the lower surface of the epoxy sheet 170.

[0025] Here, the epoxy sheet 170 can be manufactured using an epoxy material with high heat resistance and difficult to bend, which can reduce the distortion of the metal card 100 and improve the precision and uniformity of the product. The printed sheet 180 may be formed by printing magnetic or user information.

[0026] FIG. 2 is a diagram for explaining the structure of the antenna layer according to an embodiment of the present invention, and FIG. 3 is a diagram for explaining the upper pattern and the lower pattern of the insert coil according to an embodiment of the present invention.

[0027] Referring to FIG. 2, the structure of the antenna layer 160 according to an embodiment of the present invention may be formed such that the antenna coil of the antenna layer 160 is wound along the outer edge region of the antenna layer 160.

[0028] And the insert coil structure housing portion 151 may be formed by opening a certain region of the antenna layer 160 to a depth up to a location where the antenna coil is exposed in order to house the insert coil structure 120.

[0029] As a result, the insert coil structure 120 is housed in the insert coil structure housing portion 151, and the insert coil structure 120 can support the wireless IC chip 110 for wireless communication with the antenna layer 160.

[0030] Here, a chip coil for wireless communication with the antenna layer 160 is built in the wireless IC chip 110, and an insert coil may be built in the upper part of the support body of the insert coil structure 120 adjacent to the chip coil.

[0031] Further, the insert coil may be a path formed to transmit the wireless signal of the chip coil to the antenna coil of the antenna layer 160 by wire.

[0032] Therefore, the wireless IC chip 110 supported by the insert coil structure 120 can communicate wirelessly with the antenna layer 160.

[0033] And Fig. 3(a) is a diagram showing the upper pattern of the insert coil 121 when the insert coil structure 120 according to the embodiment of the present invention is inserted into the insert coil structure housing portion.

[0034] Referring to Fig. 3(a), the insert coil 121 according to the embodiment of the present invention is formed with a path so as to transmit the wireless signal of the chip coil to the antenna coil of the antenna layer 160 by wire, and may be inserted into the upper part of the support body of the insert coil structure 120 adjacent to the chip coil.

[0035] Here, a through-hole may be vertically formed such that a part of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160, and the through-hole may include a first through-hole 125 and a second through-hole 126.

[0036] More specifically, the first through-hole 125 may be vertically formed at one end of the insert coil 121 adjacent to the upper part of the support body to a depth up to the lower part of the support body.

[0037] Also, the second through-hole 126 may be vertically formed at the other end of the insert coil 121 to a depth up to the lower part of the support body.

[0038] Here, the first through-hole 125 and the second through-hole 126 may be vertically formed from a conductive material such that a part of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160. For example, the conductive material may be the metal itself, or examples of the conductive material include electrically conductive plastic, conductive adhesive, and other conductive polymer materials.

[0039] For example, the first through-hole 125 and the second through-hole 126 may be formed by plating the inside of the first through-hole 125 and the second through-hole 126 with copper, iron, aluminum, gold, or silver having excellent electrical conductivity, or may be formed by a method such as applying a resin solution of an anisotropic conductive film or other conductive adhesive or conductive polymer material having metal powder and then solidifying as it hardens over time.

[0040] And FIG. 3(b) is a diagram showing the lower pattern of the insert coil 121 when the insert coil structure 120 according to the embodiment of the present invention is inserted into the insert coil structure housing portion.

[0041] Referring to FIG. 3(b), the first through-hole 125 and the second through-hole 126 may be formed vertically from the insert coil 121 fitted into the upper part of the support body of the insert coil structure 120 to the lower part of the support body.

[0042] Here, contact pads can be arranged at the lower part of the support body so that a part of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160 through the first through-hole 125 and the second through-hole 126.

[0043] More specifically, the contact pads may include a first contact pad 131 and a second contact pad 132. The first contact pad 131 may be attached to the first through-hole 125 so that one end of the insert coil 121 is electrically connected to the antenna coil.

[0044] Also, the second contact pad 132 may be attached to the second through-hole 126 so that the other end of the insert coil 121 is electrically connected to the antenna coil.

[0045] And, if moisture or dust enters the remaining space inside the first through-hole 125 and the second through-hole 126, there is a risk of operating errors in the metal card 100. Therefore, to prevent this, either a conductive substance or a non-conductive substance may be packed.

[0046] For example, the remaining space inside the first through-hole 125 and the second through-hole 126 may be filled with a conductive substance or an electrically conductive adhesive (ECA). When having sufficient electrical conductivity, in order to achieve weight reduction, it is also possible to fill it with a substance of a non-conductive plastic material such as a polyvinyl chloride (PVC) material.

[0047] FIG. 4 is a side cross-sectional view of a metal card including an insert coil according to an embodiment of the present invention.

[0048] Referring to FIG. 4, the metal card 100 may form a metal card body by laminating a metal layer 140, an electromagnetic wave shielding layer 150, and an antenna layer 160 in this order, and an insert coil structure 120 for supporting a wireless IC chip 110 may be inserted into the metal card body.

[0049] Here, in order to accommodate the insert coil structure 120, the metal card body may be opened to a depth up to a location where the antenna coil of the antenna layer 160 is exposed in a certain region of the metal card body to form insert coil structure accommodating portions 141 and 151.

[0050] And an insert coil structure 120 for supporting the wireless IC chip 110 may be inserted into the insert coil structure accommodating portions 141 and 151, and a chip coil 111 may be built in the wireless IC chip 110 for wireless communication with the antenna layer 160.

[0051] Here, an upper adhesive sheet which is a thermoplastic resin may be applied between the upper portion of the support body of the insert coil structure 120 adjacent to the chip coil 111 and the chip coil 111.

[0052] And an insert coil 121 having a path formed therein for wired transmission of the wireless signal of the chip coil 111 to the antenna coil of the antenna layer 160 may be inserted into the upper portion of the support body.

[0053] Also, a first through hole 125 and a second through hole 126 may be vertically formed from a conductive material so that a part of the insert coil 121 is electrically connected to the antenna coil of the antenna layer 160.

[0054] And the first through hole 125 and the second through hole 126 may be formed vertically to the depth from the insert coil 121 fitted into the upper part of the support body of the insert coil structure 120 to the lower part of the support body.

[0055] Here, contact pads may be attached to the lower part of the support body so as to be connected to the first through hole 125 and the second through hole 126 by wire, and a part of the insert coil 121 may be electrically connected to the antenna coil of the antenna layer 160.

[0056] More specifically, the contact pad may include a first contact pad 131 and a second contact pad 132, and the first contact pad 131 may be connected perpendicular to the first through hole 125 so that one end of the insert coil 121 is electrically connected to the antenna coil.

[0057] Also, the second contact pad 132 may be connected perpendicular to the second through hole 126 so that the other end of the insert coil 121 is electrically connected to the antenna coil.

[0058] Here, a lower adhesive sheet which is a thermoplastic resin may be applied to the contact pad including the first contact pad 131 and the second contact pad 132 in a bonding region with the insert coil structure 120.

[0059] And as an embodiment of the present invention, the upper adhesive sheet and the lower adhesive sheet may be hot melt sheets.

[0060] Here, the hot melt sheet is melted by heating, and a material such as a thermoplastic resin has a characteristic that it solidifies when cooled after being heated and melted. Therefore, such a material can be used as a film-like hot melt adhesive.

[0061] As an embodiment, the upper adhesive sheet and the lower adhesive sheet may be adhesive sheets that take into account the adhesive force of the bonding region between the chip coil 111 built in the wireless IC chip 110 and the insert coil structure 120 and the bonding region between the insert coil structure 120 and the contact pads 131 and 132.

[0062] Further, unlike the adhesive used for the plastic sheet, the upper adhesive sheet and the lower adhesive sheet can realize a hot melt sheet with a substance suitable for a metal material.

[0063] Then, in order for the wireless IC chip 110 to perform wireless communication with the antenna coil of the antenna layer 160, a part of the insert coil 121 is vertically connected to the contact pads 131 and 132 through the through holes 125 and 126, thereby forming efficient wireless communication sensitivity of the metal card 100.

[0064] As shown in FIG. 4, the insert coil 121 may be fixed so as to be in close contact at a very close distance from the wireless IC chip 110, whereby the communication sensitivity between the insert coil 121 and the wireless IC chip 110 is greatly improved.

[0065] That is, in the case of the conventional technology, since a wireless booster coil or the like is arranged at a position such as the lower layer of the molding position in which the wireless IC chip is accommodated, the communication performance and sensitivity are formed to be low, whereas the insert coil 121 according to the embodiment of the present invention is fixed in close contact at a very close distance from the wireless IC chip 110 and is formed to have high communication performance and sensitivity.

[0066] Furthermore, since the transmission and reception signals of the insert coil 121 according to the embodiment of the present invention are directly connected to the antenna layer 160 located at the lower part by a wired connection, direct communication between the wireless IC chip 110 and the antenna layer 160 can be performed immediately without the induction process of the wireless signal between a separate wireless booster coil and the antenna layer. Therefore, without separate interference or obstruction of the wireless signal, it becomes possible to maintain efficient communication performance between the antenna layer 160 and the wireless IC chip 110.

[0067] In addition, since the insert coil structure 120 is formed in a shape that supports the wireless IC chip 110, there is an advantage of enhancing communication performance while facilitating the attachment of the wireless IC chip 110.

[0068] FIG. 5 is a process flowchart for explaining a method of manufacturing a metal card including an insert coil according to an embodiment of the present invention.

[0069] First, a metal layer 140, an electromagnetic wave shielding layer 150, and an antenna layer 160 are laminated in this order to form a metal card body (S101).

[0070] Then, a milling process is performed on the insert coil structure accommodating portion so that the antenna coil of the antenna layer is exposed in a certain region of the metal card body (S103).

[0071] After that, a milling process is performed on the through hole in the previously prepared insert coil structure (S105).

[0072] Here, at one end of the insert coil 121 adjacent to the upper part of the support body of the insert coil structure 120 into which the wireless IC chip 110 is inserted, the first through hole 125 formed vertically to the depth up to the lower part of the support body may be milled and processed.

[0073] Also, at the other end of the insert coil 122, a second through hole 126 formed perpendicular to the depth to the lower part of the support body may be milled and processed.

[0074] Then, the processed insert coil structure is inserted into the insert coil structure accommodating portion (S107).

[0075] Here, the respective through holes 125 and 126 formed to the depth to the lower part of the support body and the contact pads 131 and 132 may be connected by wire and electrically connected to the antenna coil of the antenna layer 160.

[0076] More specifically, the insert coil 121 may be electrically connected by wire to the antenna coil of the antenna layer 160 through the first contact pad 131 attached to the first through hole 125.

[0077] And the insert coil 121 may be electrically connected by wire to the antenna coil of the antenna layer 160 through the second contact pad 132 attached to the second through hole 126.

[0078] Also, a thermoplastic resin may be applied to the joint region between the contact pads 131 and 132 and the insert coil structure 120 to form a lower adhesive sheet.

[0079] Then, an insert coil 121 having a path formed so as to transmit the wireless signal of the chip coil 111 to the antenna coil of the antenna layer 160 by wire may be inserted into the upper part of the support body of the insert coil structure 120.

[0080] After this, a wireless IC chip is inserted into the upper part of the support body of the insert coil structure and a first pressing process is performed (S109).

[0081] Here, a thermoplastic resin may be applied between the upper part of the support body of the insert coil structure 120 adjacent to the chip coil 111 and the chip coil 111 to form an upper adhesive sheet.

[0082] In the above, the preferred embodiments of the present invention have been illustrated and described. However, the present invention is not limited to the specific embodiments described above at all. Needless to say, various modifications can be made by those having ordinary knowledge in the technical field to which the invention pertains without departing from the gist of the present invention claimed in the claims. These modified embodiments should not be individually understood from the technical idea and perspective of the present invention.

Claims

1. In a metal card, an antenna layer, a wireless IC chip incorporating a chip coil for wireless communication with the antenna layer, an insert coil structure for supporting the wireless IC chip, comprising: the insert coil structure is provided with an insert coil that is fitted into the upper part of a support body adjacent to the chip coil and has a path formed so as to transmit the wireless signal of the chip coil to the antenna coil of the antenna layer by wire, a wireless metal card.

2. The wireless metal card according to claim 1, further comprising a through hole formed vertically from a conductive material so that a part of the insert coil is electrically connected to the antenna coil of the antenna layer.

3. The through hole at one end of the insert coil adjacent to the upper part of the support body into which the wireless IC chip is fitted, a first through hole formed vertically to a depth up to the lower part of the support body, at the other end of the insert coil, a second through hole formed vertically to a depth up to the lower part of the support body, The wireless metal card according to claim 2, comprising:

4. The insert coil structure The wireless metal card according to claim 1, further comprising a contact pad that is connected by wire to the lower part of the support body and is electrically connected to the antenna coil of the antenna layer.

5. The contact pad a first contact pad attached to the first through hole so that the insert coil is electrically connected to the antenna coil, a second contact pad attached to the second through hole so that the insert coil is electrically connected to the antenna coil, The wireless metal card according to claim 4, comprising:

6. The wireless metal card according to claim 4, further comprising a lower adhesive sheet formed by applying a thermoplastic resin to a bonding region between the contact pad and the insert coil structure.

7. The wireless metal card according to claim 1, further comprising an upper adhesive sheet formed by applying a thermoplastic resin between the upper part of the support body adjacent to the chip coil and the chip coil.

8. The metal card comprises a metal card body formed by laminating a metal layer, an electromagnetic wave shielding layer, and the antenna layer in this order, the metal card body To accommodate the insert coil structure, an insert coil structure accommodating portion is formed by opening a certain area of the metal card body to a depth up to the location where the antenna coil of the antenna layer is exposed. The wireless metal card according to claim 1, comprising the above.

9. In a method for manufacturing a metal card, a step of forming a metal card body by laminating a metal layer, an electromagnetic wave shielding layer, and an antenna layer in this order; a step of milling an insert coil structure accommodating portion in a certain area of the metal card body so that the antenna coil of the antenna layer is exposed; a step of milling a through hole in a pre-prepared insert coil structure; a step of fitting the processed insert coil structure into the insert coil structure accommodating portion; a step of fitting a wireless IC chip into the upper part of the support body of the insert coil structure; A method for manufacturing a wireless metal card, including the above.

10. The step of milling the through hole includes a step of milling a first through hole formed vertically to a depth up to the lower part of the support body at one end of the insert coil adjacent to the upper part of the support body of the insert coil structure into which the wireless IC chip is to be fitted; a step of milling a second through hole formed vertically to a depth up to the lower part of the support body at the other end of the insert coil; The method for manufacturing a wireless metal card according to claim 9, including the above.

11. The step of fitting the insert coil structure includes a step of connecting the respective through holes formed to the depth up to the lower part of the support body and the contact pads by wire so as to be electrically connected to the antenna coil of the antenna layer; a step of applying a thermoplastic resin to the bonding region between the contact pad and the insert coil structure to form a lower adhesive sheet; The method for manufacturing a wireless metal card according to claim 9, further including the above.

12. The step of connecting the insert coil structure to the antenna coil includes a step of electrically connecting the insert coil to the antenna coil of the antenna layer by wire through a first contact pad attached to the first through hole. The step of electrically and wiredly connecting the insert coil to the antenna coil of the antenna layer via a second contact pad attached to the second through hole; The method for manufacturing a wireless metal card according to claim 11, comprising:

13. In the step of inserting the insert coil structure, An insert coil having a path formed thereon for transmitting the wireless signal of the chip coil to the antenna coil of the antenna layer in a wired manner is inserted onto the upper portion of the support body of the insert coil structure adjacent to the chip coil built in the wireless IC chip. The method for manufacturing a wireless metal card according to claim 9, characterized in that:

14. The step of inserting the wireless IC chip, The method for manufacturing a wireless metal card according to claim 9, further comprising the step of applying a thermoplastic resin between the upper portion of the support body of the insert coil structure adjacent to the chip coil and the chip coil to form an upper adhesive sheet.

Citation Information

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