Condensing device and heat pump system including the same

The condensation device in the heat pump system addresses the complexity of managing heat in different modes by incorporating two independent sets of heat exchange tube bundles within a single shell, allowing for efficient heat management and reduced system complexity.

JP2025518972APending Publication Date: 2025-06-19YORK (WUXI) AIR CONDITIONING & REFRIGERATION CO LTD +1
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Patent Information

Application Number
JP2024573642
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-06-14
Filing Date
2023-06-02
Publication Date
2025-06-19

AI Technical Summary

Technical Problem

Existing heat pump systems require additional heat exchangers to manage heat released by the condensation device for different operating modes, increasing complexity and space requirements.

Method used

A condensation device with two independent sets of heat exchange tube bundles within a single shell, allowing separate circulation of cooling media for different applications, and featuring different numbers of pipelines to meet varying temperature difference requirements.

Benefits of technology

Enables efficient heat management in multiple operating modes without the need for additional heat exchangers, reducing system complexity and space occupancy while maintaining effective heat transfer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application discloses a condensation device and a heat pump system including the same. The condensation device includes a shell and at least two sets of heat exchange tube bundles. Each set of heat exchange tube bundles includes a condensation tube bundle and a subcooling tube bundle. The subcooling tube bundle is disposed below the corresponding condensation tube bundle. The at least two sets of heat exchange tube bundles are configured to circulate the cooling medium independently so that the cooling medium in each set of heat exchange tube bundles can independently exchange heat with the refrigerant in the heat exchange accommodation cavity. Two subcoolers are disposed in the same shell of the condensation device of the present application. One subcooler can be used in an independent cooling mode, and the other subcooler can be used in a water heating mode. In the independent cooling mode, the subcooler can improve the cooling performance of the heat pump system. In the water heating mode, in addition to improving the performance of the heat pump system, the subcooler can further reduce the size of the economizer in the heat pump system and ultimately reduce the occupied area of the unit.
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Description

Technical Field

[0001] The present application relates to the field of heat pump systems, and more particularly to heat pump systems including a condensation device.

Background Art

[0002] A heat pump system mainly includes components such as a compressor, a condensation device, a throttling device, and an evaporation device, and a refrigerant flows through the components to form a refrigerant circuit. In the refrigerant circuit, the high-pressure gaseous refrigerant discharged from the compressor first enters the condensation device, provides heat to the heat exchange medium flowing in the heat exchange tube in the condensation device, and is condensed into a high-pressure liquid refrigerant. Next, the high-pressure liquid refrigerant is discharged from the condensation device to the throttling device and throttled into a low-pressure refrigerant in the throttling device. Then, the low-pressure refrigerant enters the evaporation device, absorbs heat from the heat exchange medium flowing in the heat exchange tube in the evaporation device, and evaporates into a low-pressure gaseous refrigerant. Finally, the low-pressure gaseous refrigerant is discharged from the evaporation device and returns to the compressor. In this way, the circulating flow of the refrigerant is completed. The refrigerant releases heat and is condensed in the condensation device, thereby providing heat to the outside, and the refrigerant absorbs heat and evaporates in the evaporation device, thereby providing cooling to the outside.

[0003] Generally, a heat pump system has multiple operating modes. In the water heating mode, the heat pump system needs to provide heat to the outside by the condensation device. In the independent cooling mode, the heat pump system only needs to provide cooling to the outside by the evaporation device and does not need to provide heat to the outside by the condensation device. In this case, the heat provided by the condensation device needs to be released by a cooling component such as a cooling tower.

Summary of the Invention

[0004] The heat pump system provides heat to the outside through heat exchange between the refrigerant and the heat exchange medium. Depending on the different uses of the condensation device in different operating modes of the heat pump system, the heat exchange medium after heat exchange with the refrigerant needs to transfer heat to different final equipment. In existing condensation devices, two heat exchangers are usually additionally arranged to perform heat exchange again with the heat exchange medium after heat exchange in order to achieve different uses of the heat released by the condensation device.

[0005] At least one object of the first aspect of the present application is to provide a condensation device, the condensation device being a shell, the shell having a length direction, a width direction, and a height direction, a heat exchange accommodation cavity being provided in the shell, the heat exchange accommodation cavity being used for accommodating a refrigerant, the shell, and at least two sets of heat exchange tube bundles, each set of heat exchange tube bundles being arranged in the heat exchange accommodation cavity and extending in the length direction, the inside of each set of heat exchange tube bundles being used for circulating a cooling medium, each set of heat exchange tube bundles including a condensation tube bundle and a subcooling tube bundle, the subcooling tube bundle being arranged below the corresponding condensation tube bundle, at least two sets of heat exchange tube bundles, and at least two sets of heat exchange tube bundles are configured to circulate the cooling medium independently in order to enable the cooling medium in each set of heat exchange tube bundles to independently perform heat exchange with the refrigerant in the heat exchange accommodation cavity.

[0006] According to the first aspect, the condensation device further includes at least two sets of cooling medium storage boxes arranged corresponding to at least two sets of heat exchange tube bundles. Each set of cooling medium storage boxes includes a pair of cooling medium storage boxes, a cooling medium inlet, and a cooling medium outlet. The cooling medium inlet and the cooling medium outlet are arranged on the pair of cooling medium storage boxes. The cooling medium storage boxes are used to store the cooling medium. The cooling medium inlet is configured to input the cooling medium into the cooling medium storage boxes. The cooling medium outlet is configured to output the cooling medium from the cooling medium storage boxes. The pair of cooling medium storage boxes are respectively arranged at two ends of the heat exchange tube bundle in the length direction. The cooling medium inlet and the cooling medium outlet are in fluid communication with the corresponding heat exchange tube bundle through the pair of cooling medium storage boxes to enable the cooling medium to flow independently through each set of heat exchange tube bundles.

[0007] According to the first aspect, at least two sets of heat exchange tube bundles include a first set of heat exchange tube bundles and a second set of heat exchange tube bundles. The first set of heat exchange tube bundles and the second set of heat exchange tube bundles are arranged on two opposite side surfaces of the shell in the width direction. The first set of heat exchange tube bundles and the second set of heat exchange tube bundles each have at least one pipeline. At least two sets of cooling medium storage boxes include a first set of cooling medium storage boxes and a second set of cooling medium storage boxes. The first set of cooling medium storage boxes and the second set of cooling medium storage boxes are correspondingly arranged on two opposite side surfaces of the shell in the width direction.

[0008] According to the first aspect, the first cooling medium containing box set includes at least one first flow path partition plate, and at least one first flow path partition plate is disposed within at least one of a pair of cooling medium containing boxes of the first cooling medium containing box set. The at least one first flow path partition plate is configured to enable the set of first heat exchange tube bundles to have at least two pipelines. The second cooling medium containing box set includes at least one second flow path partition plate, and at least one second flow path partition plate is disposed within at least one of a pair of cooling medium containing boxes of the second cooling medium containing box set. The at least one second flow path partition plate is configured to enable the set of second heat exchange tube bundles to have at least two pipelines.

[0009] According to the first aspect, the set of first heat exchange tube bundles and the set of second heat exchange tube bundles have different numbers of pipelines.

[0010] According to the first aspect, the shell includes a cylinder and a pair of tube plates. The pair of tube plates are connected to two ends of the cylinder in the longitudinal direction. The cylinder and the pair of tube plates surround a heat exchange containing cavity. The pair of cooling medium containing boxes are respectively disposed outside the pair of tube plates. Two ends of each of at least two sets of heat exchange tube bundles in the longitudinal direction independently pass through the pair of tube plates and are in fluid communication with the cooling medium inlet and the cooling medium outlet of the corresponding pair of cooling medium containing boxes.

[0011] According to the first aspect, the subcooling tube bundle of each set of heat exchange tube bundles is in direct fluid communication with the corresponding cooling medium inlet such that at least one portion of the cooling medium input from the cooling medium inlet first flows through the subcooling tube bundle and then through the corresponding condensation tube bundle.

[0012] At least one object of the second aspect of the present application is to provide a heat pump system including a compressor, a condensing device, a throttling device, and an evaporating device, which are arranged in a refrigerant circuit, and the condensing device is a condensing device according to any one of the items of the first aspect.

[0013] According to the second aspect, at least two sets of heat exchange tube bundles include a first set of heat exchange tube bundles and a second set of heat exchange tube bundles. The heat pump system has an independent cooling mode and an independent water heating mode. In the independent cooling mode, the heat pump system circulates a cooling medium in the first set of heat exchange tube bundles of the condensing device, and in the independent water heating mode, the heat pump system circulates a cooling medium in the second set of heat exchange tube bundles of the condensing device.

[0014] According to the second aspect, the number of pipelines in the first set of heat exchange tube bundles is less than the number of pipelines in the second set of heat exchange tube bundles.

[0015] Two independently operating subcoolers are arranged in the same shell of the condensing device of the present application. In the heat pump system including the condensing device of the present application, one subcooler can be used in the independent cooling mode, and the other subcooler can be used in the water heating mode. In the independent cooling mode, the subcooler can improve the cooling performance of the heat pump system. In the water heating mode, in addition to improving the performance of the heat pump system, the subcooler can further reduce the size of the economizer in the heat pump system and finally reduce the occupied area of the unit. The performance of the heat pump system is more remarkable under operating conditions where the temperature difference between the input water and the output water of the condensing device is large.

Brief Description of the Drawings

[0016]

Figure 1A

Figure 1B

Figure 2

Figure 3A

Figure 3B

Figure 4A

Figure 4B

Figure 4C

Figure 4D

Figure 4E

Figure 5A

Figure 5B

Figure 5C

DETAILED DESCRIPTION OF THE INVENTION

[0017] Various embodiments of the present invention will be described below with reference to the accompanying drawings that form a part of this specification. Directional terms such as "front", "rear", "top", "bottom", "left", "right", "top", "bottom", etc. are used in this application to describe various exemplary structural components and elements of the present application. However, it should be understood that these terms used in this specification are for convenience of explanation only and are determined based on the exemplary orientation shown in the accompanying drawings. Since the embodiments disclosed in the present application can be arranged according to different orientations, these directional terms are used for illustration only and should not be regarded as limiting.

[0018] Figures 1A and 1B show three-dimensional structural views of the condensation device 100 from two perspectives according to an embodiment of the present application. Figure 1A is a three-dimensional structural view of the condensation device 100 seen from the front to the back, and Figure 1B is a three-dimensional structural view of the condensation device 100 seen from the back to the front. As shown in Figures 1A and 1B, the condensation device 100 includes a shell 101, and the shell 101 has a length direction L, a width direction W, and a height direction H. The inside of the shell 101 is hollow and has a heat exchange accommodation cavity 220 (shown in Figure 2) used to accommodate a refrigerant. Specifically, the shell 101 includes a cylinder 109 having a substantially cylindrical shape, and a pair of tube plates 107 and 108. The pair of tube plates 107 and 108 are respectively connected to two ends of the cylinder 109 in the length direction L to close the heat exchange accommodation cavity 220. That is, the cylinder 109 and the pair of tube plates 107 and 108 surround the heat exchange accommodation cavity 220. A plurality of holes are arranged in each of the tube plates 107 and 108 to enable the heat exchange tube bundle in the heat exchange accommodation cavity 220 to be supported on the tube plates 107 and 108.

[0019] The condensing device 100 further includes two refrigerant inlets 102 and 103, and two refrigerant outlets 105 and 106. Since the refrigerant inlets and outlets are in fluid communication with the heat exchange containment cavity 220, gaseous refrigerant can enter the heat exchange containment cavity 220 from the refrigerant inlets. The complete heat exchange within the heat exchange containment cavity 220 condenses into liquid refrigerant, which is then discharged from the refrigerant outlets. In this embodiment, the two refrigerant inlets 102 and 103 are disposed at the top of the center of the cylinder 109 and are located at the top of the cylinder 109 near the left and right sides, respectively, in the width direction W. The two refrigerant outlets 105 and 106 are disposed at the bottom of the center of the cylinder 109 and are located side by side at the bottom of the cylinder 109 in the length direction L. Those skilled in the art will understand that since the refrigerant entering the heat exchange containment cavity 220 from the refrigerant inlets 102 and 103 is gaseous, the refrigerant inlets 102 and 103 may also be disposed at other positions on the cylinder 109, and since the refrigerant discharged from the refrigerant outlets 105 and 106 out of the heat exchange containment cavity 220 is liquid, the refrigerant outlets 105 and 106 generally need to be disposed at the bottom of the cylinder 109. Further, in this embodiment, since the heat exchange containment cavity 220 of the condensing device 100 includes two sets of heat exchange tube bundles 251 and 252 (shown in FIG. 2), the two refrigerant inlets and the two refrigerant outlets can be correspondingly arranged. Since the gaseous refrigerant can diffuse into the heat exchange containment cavity 220, in other embodiments, the refrigerant inlets and outlets may also be arranged in other positions and in other numbers.

[0020] The condensation device 100 further includes a cooling medium containing box set. The cooling medium containing box set is configured to contain a heat exchange medium, for example, a cooling medium, and is in fluid communication with the inside of the heat exchange tube bundle in the condensation device 100. Some cooling medium containing box sets are configured to correspond to some sets of the heat exchange tube bundles in the condensation device 100, so that each cooling medium containing box provides the cooling medium inside one set of the heat exchange tube bundles. In this embodiment, the cooling medium is water. Since two sets of heat exchange tube bundles are arranged, two cooling medium containing box sets are also arranged. In other embodiments, when more or fewer sets of heat exchange tube bundles are arranged, more or fewer cooling medium containing box sets are also correspondingly arranged. The two cooling medium containing box sets 111 and 112 are arranged on two opposite side surfaces in the width direction W.

[0021] The cooling medium containing box set 111 includes a pair of cooling medium containing boxes 111a and 111b, and the cooling medium containing box set 112 includes a pair of cooling medium containing boxes 112a and 112b. Specifically, the cooling medium containing boxes 111a and 112a are arranged outside the tube plate 107, and the cooling medium containing boxes 111b and 112b are arranged outside the tube plate 108. The heat exchange tube bundles 251 and 252 extend in the length direction L, and its two ends in the length direction L are respectively supported on a pair of tube plates 107 and 108 and pass through the tube plates 107 and 108. The pair of cooling medium containing boxes of each cooling medium containing box set are respectively arranged at the two ends of the heat exchange tube bundles 251 and 252 in the length direction L, so that the heat exchange tube bundles 251 and 252 can be in fluid communication with the corresponding cooling medium containing boxes, and thus the cooling medium in the cooling medium containing boxes can flow through the inside of the heat exchange tube bundles 251 and 252.

[0022] Each of the cooling medium containing box sets 111 and 112 further includes a cooling medium inlet and a cooling medium outlet. The cooling medium inlet is used to input the cooling medium into the corresponding cooling medium containing box set, and the cooling medium outlet is used to output the cooling medium from the corresponding cooling medium containing box set. In this embodiment, the cooling medium inlet and the cooling medium outlet of the cooling medium containing box set 111 are arranged on the same cooling medium containing box, and the cooling medium inlet and the cooling medium outlet of the cooling medium containing box set 112 are arranged on different cooling medium containing boxes. Specifically, the cooling medium containing box set 111 includes a cooling medium inlet 114 and a cooling medium outlet 116, and both the cooling medium inlet 114 and the cooling medium outlet 116 are arranged on the cooling medium containing box 111a and are in fluid communication with the inside of the cooling medium containing box 111a. The corresponding cooling medium inlet and cooling medium outlet are not arranged on the cooling medium containing box 111b. The cooling medium containing box set 112 includes a cooling medium inlet 115 and a cooling medium outlet 117. The cooling medium inlet 115 is arranged on the cooling medium containing box 112a and is in fluid communication with the inside of the cooling medium containing box 112a. The cooling medium outlet 117 is arranged on the cooling medium containing box 112b and is in fluid communication with the inside of the cooling medium containing box 112b. In this embodiment, the cooling medium inlet is arranged below the cooling medium outlet in the height direction H, that is, the cooling medium substantially enters the condensation device from the bottom of the condensation device 100, flows through the inside of the heat exchange tube bundle, then performs heat exchange with the refrigerant outside the heat exchange tube bundle, and then flows out from the top of the condensation device 100. The specific flow path of the cooling medium will be described in detail below with reference to FIGS. 3A and 3B.

[0023] Figure 2 is a cross-sectional view of the condensation device 100 in the width direction W, which is used to substantially show a specific structure inside the condensation device 100. In this embodiment, Figure 2 is a view obtained by vertically cutting the condensation device 100 shown in Figure 1A from the rear side of the condensation device 100 and observing the condensation device 100 from the rear to the front. As shown in Figure 2, the condensation device 100 includes a heat exchange accommodation cavity 220 and two sets of heat exchange tube bundles 251 and 252. In this embodiment, the first set of heat exchange tube bundles 251 and the second set of heat exchange tube bundles 252 are arranged on two opposite side surfaces of the condensation device 100 in the width direction. The heat exchange accommodation cavity 220 is in fluid communication with the refrigerant inlets 102 and 103 so that the refrigerant enters the heat exchange accommodation cavity 220 from the refrigerant inlets 102 and 103 and exchanges heat with the cooling medium circulating in the first set of heat exchange tube bundles 251 and / or the second set of heat exchange tube bundles 252. The condensation device 100 further includes two impingement baffles 228, and the impingement baffles 228 are respectively arranged directly opposite the refrigerant inlets 102 and 103 to prevent the gaseous refrigerant from directly colliding with the heat exchange tube bundle.

[0024] The first set of heat exchange tube bundles 251 is used to be in fluid communication with the cooling medium accommodation box set 111, and the second set of heat exchange tube bundles 252 is used to be in fluid communication with the cooling medium accommodation box set 112. That is, the first set of heat exchange tube bundles 251 and the second set of heat exchange tube bundles 252 are in fluid communication with different cooling medium accommodation box sets. Therefore, the inside of each set of heat exchange tube bundles can independently circulate the cooling medium so that the cooling medium in each set of heat exchange tube bundles can independently exchange heat with the refrigerant in the heat exchange accommodation cavity 220.

[0025] As shown in FIG. 2, in this embodiment, the set of the first heat exchange tube bundles 251 and the set of the second heat exchange tube bundles 252 have different numbers of pipelines. In the example shown in the dashed box of FIG. 2, the set of the first heat exchange tube bundles 251 has two pipelines, and the set of the second heat exchange tube bundles 252 has three pipelines. The dashed boxes 218 and 219 respectively indicate the heat exchange tube bundles in the two pipelines of the set of the first heat exchange tube bundles 251. The dashed boxes 224, 225, and 226 respectively indicate the heat exchange tube bundles in the three pipelines of the set of the second heat exchange tube bundles 252. Those skilled in the art can understand that under the same amount of heat exchange, a larger required temperature difference between the cooling medium flowing into the heat exchange tube bundle and the cooling medium flowing out of the heat exchange tube bundle indicates a lower flow rate of the cooling medium. In order to maintain the flow rate of the cooling medium required by heat exchange, the heat exchange tube bundle has more pipelines. That is, in this embodiment, the cooling medium can achieve a larger temperature difference after flowing through the set of the second heat exchange tube bundles 252 compared to flowing through the set of the first heat exchange tube bundles 251. The number of pipelines refers to the number of times the cooling medium flows through each set of the heat exchange tube bundles. The specific flow path of the cooling medium will be described in detail with reference to FIGS. 3A and 3B.

[0026] Each set of the heat exchange tube bundles includes a condensation tube bundle and a subcooling tube bundle. The subcooling tube bundle is arranged under the corresponding condensation tube bundle, so the subcooling tube bundle can further cool the refrigerant after heat exchange by condensation. Specifically, the set of the first heat exchange tube bundles 251 includes a condensation tube bundle 221 and subcooling tube bundles 241 and 242, and the subcooling tube bundles 241 and 242 are located under the condensation tube bundle 221. The set of the second heat exchange tube bundles 252 includes a condensation tube bundle 222 and subcooling tube bundles 243 and 244, and the subcooling tube bundles 243 and 244 are located under the condensation tube bundle 222.

[0027] The condensing device 100 further includes a first subcooler 245 and a second subcooler 246. The first subcooler 245 and the second subcooler 246 are arranged side by side in the width direction W and are in fluid communication with the refrigerant outlets 105 and 106 respectively. Specifically, the first subcooler 245 is disposed below the condensing tube bundle 221. The first subcooler 245 includes a subcooler shell 247, and subcooling tube bundles 241 and 242. The bottom of the first subcooler 245 is in fluid communication with the refrigerant outlet 105. The first subcooler 245 further includes a partition plate 257 and a "C"-shaped cover plate 231. Similarly, the second subcooler 246 is disposed below the condensing tube bundle 222. The second subcooler 246 includes a subcooler shell 248, and subcooling tube bundles 243 and 244. The bottom of the second subcooler 246 is in fluid communication with the refrigerant outlet 106. The second subcooler 246 further includes a partition plate 258 and a "C"-shaped cover plate 232. A more specific structure of the first subcooler 245 and the second subcooler 246 will be described in detail with reference to FIGS. 4A to 4E.

[0028] Therefore, according to the present application, by utilizing the feature that the gaseous refrigerant can diffuse into the heat exchange accommodation cavity 220 of the condensing device 100, the gaseous refrigerant in the heat exchange accommodation cavity 220 can selectively perform heat exchange with one of the cooling media of the set of heat exchange tube bundles only by controlling the flow path of the cooling media such that the gaseous refrigerant is condensed into the liquid refrigerant and the cooling media flowing through the set of heat exchange tube bundles is heated. The liquid refrigerant accumulates at the bottom of the cylinder 109 to form a liquid level at a specific height. When the subcooler shell is immersed below the liquid level, the liquid refrigerant enters the inside of the subcooler shell from the subcooler inlet at the top of the subcooler shell and can perform heat exchange with the subcooling tube bundles in the subcooler shell for further cooling. Finally, the further cooled subcooled liquid refrigerant is discharged from the refrigerant outlet.

[0029] Furthermore, the two sets of heat exchange tube bundles and the two sets of cooling medium accommodation boxes of the present embodiment are correspondingly arranged side by side in the width direction W to achieve better condensation and subcooling effects without affecting the flow path of the gaseous refrigerant flowing substantially from the top to the bottom.

[0030] Figures 3A and 3B are two different longitudinal cross-sectional views of the condensation device 100 along line A-A and line B-B of FIG. 2, which are used to show specific flow paths of the cooling medium. The heat exchange tube bundle is not shown in FIGS. 3A and 3B, and the arrows represent the flow paths of the cooling medium.

[0031] FIG. 3A shows the flow path of the cooling medium within the cooling medium containment box set 111 and the set of first heat exchange tube bundles 251. As shown in FIG. 3A, the cooling medium containment box 111a includes a flow path partition plate 333, which is disposed horizontally within the cooling medium containment box 111a to partition the cooling medium containment box 111a into a water inlet portion 328a and a water outlet portion 329a, with the water inlet portion 328a located below the water outlet portion 329a. In this embodiment, the flow path partition plate 333 is substantially disposed at half the height of the cooling medium containment box 111a. The cooling medium inlet 114 is disposed above the water inlet portion 328a, and the cooling medium outlet 116 is disposed above the water outlet portion 329a. No flow path partition plate is disposed in the cooling medium containment box 111b. By disposing the flow path partition plate 333, the set of first heat exchange tube bundles 251 has two pipelines.

[0032] The cooling medium first enters from the cooling medium inlet 114 into the water inlet portion 328a of the cooling medium containment box 111a, and then flows substantially from left to right through a part of the heat exchange tube bundles of the set of first heat exchange tube bundles 251 (i.e., the heat exchange tube bundles shown in the dashed box 218 of FIG. 2) until the cooling medium flows into the cooling medium containment box 111b. Then, the cooling medium flows into the water outlet portion 329a of the cooling medium containment box 111a and finally flows substantially from right to left through the other part of the heat exchange tube bundles of the set of first heat exchange tube bundles 251 (i.e., the heat exchange tube bundles shown in the dashed box 219 of FIG. 2) until it flows out from the cooling medium outlet 116. Since the cooling medium flows through the set of first heat exchange tube bundles 251 twice, the set of first heat exchange tube bundles 251 has two pipelines.

[0033] Figure 3B shows the flow path of the cooling medium within the set of the cooling medium storage box set 112 and the second heat exchange tube bundle 252. As shown in Figure 3B, the cooling medium storage box 112a includes a flow path partition plate 334, and the cooling medium storage box 112b includes a flow path partition plate 335. The flow path partition plate 334 and the flow path partition plate 335 are each disposed horizontally within the cooling medium storage box 112a and the cooling medium storage box 112b, partitioning the cooling medium storage box 112a into a water inlet portion 328b and partitioning the cooling medium storage box 112b into a water outlet portion 329b. In this embodiment, the flow path partition plate 334 is substantially disposed at two-thirds of the height of the cooling medium storage box 112a, and the flow path partition plate 335 is substantially disposed at one-third of the height of the cooling medium storage box 112b. The cooling medium inlet 115 is disposed above the water inlet portion 328b, and the cooling medium outlet 117 is disposed above the water outlet portion 329b. By disposing the flow path partition plates 334 and 335, the set of the second heat exchange tube bundle 252 has three pipe lines.

[0034] The cooling medium first enters from the cooling medium inlet 115 into the water inlet portion 328b of the cooling medium storage box 112a, and then flows substantially from right to left through a part of the heat exchange tube bundle of the set of the second heat exchange tube bundle 252 (i.e., the heat exchange tube bundle shown in the dashed box 224 of Figure 2) until the cooling medium flows into the cooling medium storage box 112b. Then, until the cooling medium flows back into the cooling medium storage box 112a, it flows substantially from left to right through a part of the heat exchange tube bundle of the set of the second heat exchange tube bundle 252 (i.e., the heat exchange tube bundle shown in the dashed box 225 of Figure 2). Next, the cooling medium flows into the water outlet portion 329a of the cooling medium storage box 112a, and finally flows substantially from right to left through the other part of the heat exchange tube bundle of the set of the second heat exchange tube bundle 252 (i.e., the heat exchange tube bundle shown in the dashed box 226 of Figure 2) until it flows out from the cooling medium outlet 117. Since the cooling medium flows through the set of the second heat exchange tube bundle 252 three times, the set of the second heat exchange tube bundle 252 has three pipe lines.

[0035] Depending on different system requirements, cooling medium containment box sets with different structures are arranged, for example, by arranging different flow path partition plates or the positions of the cooling medium inlet and the cooling medium outlet, and the heat exchange tube bundle may also have more or fewer pipelines.

[0036] Referring to FIGS. 2, 3A, and 3B, the cooling medium inlet 114 is in direct fluid communication with the subcooling tube bundles 241 and 242 and is in direct fluid communication with a part of the condensation tube bundle 221 within the dashed box 218. The cooling medium inlet 115 is in direct fluid communication with the subcooling tube bundles 243 and 244 and is in direct fluid communication with a part of the condensation tube bundle 222 within the dashed box 224. In such an arrangement, the cooling medium can first flow directly through the subcooling tube bundle and then sequentially flow from the bottom to the top through the condensation tube bundle, so that the cooling medium having a lower temperature can be used to subcool the liquid refrigerant within the subcooling tube bundle.

[0037] FIGS. 4A - 4E show the specific structures of the first subcooler 245 and the second subcooler 246. FIG. 4A shows a three - dimensional structure diagram of the first subcooler 245 and the second subcooler 246, FIG. 4B shows a three - dimensional exploded view of FIG. 4A from a certain perspective, FIG. 4C shows a three - dimensional exploded view of FIG. 4A from another perspective, FIG. 4D shows a top view of FIG. 4A, and FIG. 4E shows a cross - sectional view of FIG. 4D along line C - C. The hollow arrow represents the flow direction of the refrigerant. To more clearly show the structure of the subcooler, the subcooling tube bundle is not shown.

[0038] As shown in FIGS. 4A - 4E, the first subcooler 245 and the second subcooler 246 are arranged side by side in the width direction W and extend in the length direction L. In this embodiment, the first subcooler 245 is arranged under the condensation tube bundle 221, and the second subcooler 246 is arranged under the condensation tube bundle 222. After implementing heat exchange with the cooling medium within the condensation tube bundle, the refrigerant is condensed into a liquid refrigerant, and the liquid refrigerant gathers at the bottom of the condensation device and then enters the corresponding subcooler for further cooling and is finally discharged from the corresponding refrigerant outlet.

[0039] Specifically, the first subcooler 245 is substantially strip-shaped. In order to close the internal space of the first subcooler 245, end plates (not shown) exist at two ends of the subcooler shell 247 of the first subcooler in the length direction L. A substantially top opening 453 exists at the middle position of the top of the subcooler shell 247, and the liquid refrigerant can enter the inside of the first subcooler 245 from the top opening 453. A substantially bottom opening 465 exists at the middle position of the bottom of the subcooler shell 247, and the further cooled liquid refrigerant can be discharged from the first subcooler 245 through the bottom opening 465.

[0040] The inside of the first subcooler 245 includes an upper accommodation cavity 261 and a lower accommodation cavity 262. The partition plate 257 is connected to two ends of the subcooler shell 247 in the width direction W to partition the upper accommodation cavity 261 and the lower accommodation cavity 262. At least one opening 455 is arranged on the partition plate 257 so that the upper accommodation cavity 261 and the lower accommodation cavity 262 can communicate with each other through the opening 455. In this embodiment, at least one opening 455 includes two openings 455, and the two openings 455 are respectively arranged at two ends of the partition plate 257 in the length direction L. The subcooling tube bundle 241 is accommodated in the upper accommodation cavity 261, and the subcooling tube bundle 242 is accommodated in the lower accommodation cavity 262. After entering the first subcooler 245 from the top opening 453, the liquid refrigerant first exchanges heat with the cooling medium in the subcooling tube bundle 241 in the upper accommodation cavity 261, then flows to the two ends in the length direction L, enters the lower accommodation cavity 262 through the opening 455, exchanges heat with the cooling medium in the subcooling tube bundle 242 in the lower accommodation cavity 262, and finally flows to the center in the length direction L and is discharged outside the first subcooler 245 through the bottom opening 465.

[0041] The "C"-shaped cover plate 231 is disposed directly above the top opening 453 of the first subcooler 245, and there is a gap through which the refrigerant flows between the two side portions and the top of the "C"-shaped cover plate 231 and the corresponding subcooler shell 247. The edge of the gap is hermetically connected to the corresponding subcooler shell 247. Therefore, the liquid refrigerant forming the liquid level flows through the gap between the bottom of the "C"-shaped cover plate 231 and the side wall of the subcooler shell 247 and enters the inside of the subcooler shell 247 from the top opening 453, thereby preventing the liquid refrigerant from directly entering the inside of the first subcooler 245 from the top opening 453. By disposing the "C"-shaped cover plate 231, the liquid refrigerant can enter the inside of the first subcooler 245 more stably.

[0042] The first subcooler 245 further includes a semi-circular groove 268, and the semi-circular groove 268 is connected to the bottom of the first subcooler 245. The shape of the semi-circular groove 268 is arranged to match the shape of the bottom of the cylinder 109 (shown in FIG. 2). There is an opening 472 at the top of the semi-circular groove 268. The opening 472 is aligned with the bottom opening 465 of the first subcooler 245 and receives the refrigerant discharged from the inside of the first subcooler 245 through the bottom opening 465. The refrigerant outlet 105 is in fluid communication with the semi-circular groove 268 and extends from the bottom of the semi-circular groove 268 to the outside of the cylinder 109 so that the refrigerant flowing through the first subcooler 245 is discharged from the condensing device 100.

[0043] The structure of the second subcooler 246 is the same as that of the first subcooler 245. The inside of the second subcooler 246 also includes an upper accommodation cavity 263 and a lower accommodation cavity 264 formed by partitioning with a partition plate 258, and the upper accommodation cavity 263 and the lower accommodation cavity 264 communicate with each other through two openings 456 at two ends in the longitudinal direction L. The subcooling tube bundle 243 is arranged in the upper accommodation cavity 263, and the subcooling tube bundle 244 is arranged in the lower accommodation cavity 264. Further, the second subcooler 246 also has a top opening 454 and a bottom opening 466. The "C"-shaped cover plate 232 is arranged right above the top opening 454, the semi-circular groove 469 is connected to the bottom of the second subcooler 246, and the opening 471 of the semi-circular groove 469 is aligned with the bottom opening 466. In one example, the top opening 454 of the second subcooler 246 is slightly offset from the top opening 453 of the first subcooler 245 in the longitudinal direction L, and the bottom opening 466 is also slightly offset from the bottom opening 465 of the first subcooler 245 towards another side. For example, in the figures shown in FIGS. 4A to 4C, the top opening 454 is arranged on the right side of the top opening 453, and the bottom opening 466 is arranged on the left side of the bottom opening 465. In this configuration, the liquid refrigerant can have a substantially consistent flow distance inside each subcooler, and the semi-circular groove 268 and the semi-circular groove 469 can be arranged side by side in the longitudinal direction L. In other examples, the first subcooler 245 and the second subcooler 246 can also be configured to have exactly the same structure.

[0044] Furthermore, as shown in FIGS. 4D and 4E, after the liquid refrigerant enters the upper accommodation cavity 261 of the first subcooler 245 from the top opening 453, it flows separately towards the two ends in the length direction L. First, it exchanges heat with the cooling medium in the subcooling tube bundle 241. Next, the liquid refrigerant enters the lower accommodation cavity 262 from the two openings 455 and flows towards the center, exchanging heat with the cooling medium in the subcooling tube bundle 242. Finally, the liquid refrigerant enters the semi-circular groove 268 from the bottom opening 465 at a substantially middle position and is discharged from the refrigerant outlet 105. Therefore, the subcooling tube bundle in the first subcooler 245 has two pipelines. The flow process of the liquid refrigerant in the second subcooler 246 is the same as that of the liquid refrigerant in the first subcooler 245, and the details will not be described again in this specification.

[0045] Those skilled in the art can understand that other structures of subcoolers can also be used instead of the subcooler of this embodiment.

[0046] FIGS. 5A to 5C show schematic block diagrams of a heat pump system 590 to which the condensation device 100 of the present application is applicable. FIG. 5A shows the structure of the heat pump system 590, FIG. 5B shows the flow direction of the refrigerant in the heat pump system 590 in an independent cooling mode, and FIG. 5C shows the flow direction of the refrigerant in the heat pump system 590 in a water heating mode. In this embodiment, solid arrows indicate the flow paths of the refrigerant, and hollow arrows indicate the flow paths of the cooling medium.

[0047] As shown in FIGS. 5A to 5C, the heat pump system 590 is a two-stage compression system, including a first-stage compressor 591, a second-stage compressor 592, a condensation device 100, an evaporator 593, an economizer 594, a first throttling device 595, a second throttling device 596, and a third throttling device 597. These are connected by pipes to form a closed system, and the system is filled with refrigerant. The condensation device 100 includes a set of first heat exchange tube bundles 251 and a set of second heat exchange tube bundles 252.

[0048] Specifically, the exhaust port of the first-stage compressor 591 is in fluid communication with the refrigerant inlet 102 of the condenser device 100, the refrigerant outlet 105 of the condenser device 100 is in fluid communication with the inlet of the evaporator 593 through the third throttling device 597, and the outlet of the evaporator 593 is in fluid communication with the suction port of the first-stage compressor 591.

[0049] Furthermore, the exhaust port of the second-stage compressor 592 is in fluid communication with the refrigerant inlet 103 of the condenser device 100, the refrigerant outlet 106 of the condenser device 100 is in fluid communication with the economizer 594 through the second throttling device 596. The gas outlet of the economizer 594 is in fluid communication with the suction port of the second-stage compressor 592, the liquid outlet of the economizer 594 is in fluid communication with the inlet of the evaporator 593 through the first throttling device 595, the outlet of the evaporator 593 is in fluid communication with the suction port of the first-stage compressor 591, and the exhaust port of the first-stage compressor 591 is in fluid communication with the suction port of the second-stage compressor 592.

[0050] The heat pump system 590 further includes a water supply and return pipe 598 and a water supply and return pipe 599, which are used to circulate the cooling medium. The water supply and return pipe 598 is in fluid communication with the inside of the heat exchange tube bundle 251 in the condenser device 100, and the water supply and return pipe 599 is in fluid communication with the inside of the set of the second heat exchange tube bundle 252 in the condenser device 100. In this embodiment, the water supply and return pipe 598 is used to be in fluid communication with a cooling tower (not shown in the figure) to re-cool the heated cooling medium flowing through the water supply and return pipe 598 to the required temperature. The water supply and return pipe 599 is used to be in fluid communication with the final equipment to provide the heated cooling medium flowing through the water supply and return pipe 599 to the final equipment for hot water supply.

[0051] In the heat pump system 590 of this embodiment, in different operating modes, the cooling medium flowing out from each set of heat exchange tube bundles has different temperatures. In one example, the cooling medium flowing out from the heat exchange tube bundles has a higher temperature in the water heating mode, and the cooling medium has a lower temperature in the cooling mode. Therefore, in the cooling mode, only the first-stage compressor 591 needs to be used, and the economizer 594 does not need to be used. However, in the water heating mode, the first-stage compressor 591 and the second-stage compressor 592 need to be used simultaneously, and it is further necessary for the economizer 594 to be used to improve the performance of the heat pump system.

[0052] Therefore, by controlling the operations of the first-stage compressor 591, the second-stage compressor 592, the first throttling device 595, the second throttling device 596, and the third throttling device 597, and selecting the water supply and return pipe 598 or the water supply and return pipe 599 for circulating the cooling medium, the heat pump system 590 can have multiple operating modes. For example, it can include at least an independent cooling mode, an independent water heating mode, and a simultaneous cooling and water heating mode. FIG. 5B shows a diagram of the flow directions of the refrigerant and the cooling medium in the heat pump system 590 in the independent cooling mode. FIG. 5C shows a diagram of the flow directions of the refrigerant and the cooling medium in the heat pump system 590 in the independent water heating mode or the simultaneous cooling and water heating mode.

[0053] As shown in FIG. 5B, in the independent cooling mode, the water supply and return pipe 598 and the set of the first heat exchange tube bundle 251 are used to circulate the cooling medium, the evaporator 593 is used to cool the outside, the second-stage compressor 592 stops operating, the first-stage compressor 591 maintains operation, the first throttling device 595 and the second throttling device 596 are in a closed state, and the third throttling device 597 is in an open state.

[0054] The high-pressure gaseous refrigerant discharged from the compressor 591 in the first stage enters the heat exchange accommodation cavity 220 through the refrigerant inlet 102 of the condensation device 100, and performs heat exchange with the cooling medium within the set of the first heat exchange tube bundles 251. The high-pressure gaseous refrigerant is first condensed into a high-pressure liquid refrigerant by the cooling medium within the condensation tube bundle 221 in the heat exchange accommodation cavity 220. Subsequently, the high-pressure liquid refrigerant is further cooled into a high-pressure subcooled liquid refrigerant by the subcooling tube bundles 241 and 242 in the first subcooler 245. Next, the high-pressure subcooled liquid refrigerant is discharged through the refrigerant outlet 105 of the condensation device 100, flows into the third throttling device 597, is throttled into a low-pressure two-phase refrigerant, and then the low-pressure two-phase refrigerant flows into the evaporator 593. The low-pressure two-phase refrigerant performs heat exchange with the cooling medium (not shown in the figure) within the evaporator 593, absorbs heat, and evaporates into a low-pressure gaseous refrigerant. Finally, the low-pressure gaseous refrigerant flows out from the evaporator 593 and re-enters the first-stage compressor 591, thereby completing the circulation of the refrigerant.

[0055] In this case, the cooling medium flowing through the set of the first heat exchange tube bundles 251 is heated by the high-pressure gaseous refrigerant, output to a cooling tower (not shown in the figure) through the water supply and return pipe 598, and the temperature of the cooling medium is reduced again by the heat dissipation of the cooling tower. Therefore, the cooling medium can enter the condensation device 100 again to perform heat exchange with the refrigerant. Furthermore, the cooling medium (not shown in the figure) within the evaporator 593 is cooled, thereby providing cooling to the final equipment (not shown in the figure).

[0056] As shown in FIG. 5C, in the water heating mode, for example, in the independent water heating mode or the simultaneous cooling and water heating mode, the water supply and return pipe 599 and the set of the second heat exchange tube bundles 252 are used to circulate the cooling medium, and the evaporator 593 may not cool the outside or does not need to cool the outside. The first-stage compressor 591 and the second-stage compressor 592 operate simultaneously, and the first throttling device 595 and the second throttling device 596 are in an open state. The third throttling device 597 is in a closed state.

[0057] The high-pressure gaseous refrigerant discharged from the compressor 592 in the second stage enters the heat exchange accommodation cavity 220 through the refrigerant inlet 103 of the condensation device 100 and performs heat exchange with the cooling medium in the set of the second heat exchange tube bundles 252. The high-pressure gaseous refrigerant is first condensed into a high-pressure liquid refrigerant by the cooling medium in the condensation tube bundle 222 in the heat exchange accommodation cavity 220, and then the high-pressure liquid refrigerant is further cooled into a high-pressure subcooled liquid refrigerant by the subcooling tube bundles 243 and 244 in the second subcooler 246. Next, the high-pressure subcooled liquid refrigerant is discharged through the refrigerant outlet 106 of the condensation device 100, flows into the second throttling device 596, is throttled into a medium-pressure two-phase refrigerant, and then the medium-pressure two-phase refrigerant flows into the economizer 594. In the economizer 594, gas-liquid separation is performed on the medium-pressure two-phase refrigerant, and the obtained gaseous refrigerant is directly discharged to the suction port of the compressor 592 in the second stage. The medium-pressure liquid refrigerant in the economizer is throttled into a low-pressure liquid refrigerant through the first throttling device 595, and then the low-pressure liquid refrigerant flows into the evaporator 593. The low-pressure liquid refrigerant performs heat exchange with the cooling medium (not shown in the figure) in the evaporator 593, absorbs heat, and evaporates into a low-pressure gaseous refrigerant. The low-pressure gaseous refrigerant flows out of the evaporator 593 and reflows into the compressor 591 in the first stage. After the low-pressure gaseous refrigerant is first compressed by the compressor 591 in the first stage, the obtained gaseous refrigerant enters the compressor 592 in the second stage, and the second compression is performed, thereby completing the circulation of the refrigerant.

[0058] In this case, the cooling medium flowing through the set of the second heat exchange tube bundles 252 is heated by the high-pressure gaseous refrigerant and output to the final equipment (not shown in the figure) through the water supply and return pipes 599 to provide heat to the outside by providing warm water to the final equipment. Therefore, the cooling medium that has released heat can enter the condensation device 100 again to perform heat exchange with the refrigerant. Similarly, the cooling medium in the evaporator 593 is cooled. When the cooled cooling medium is not in fluid communication with the final equipment, for example, when the cooling is directly released to the external environment, the heat pump system 590 is in an independent water heating mode. When the cooled cooling medium is in fluid communication with the final equipment, the heat pump system 590 is in a simultaneous cooling and water heating mode.

[0059] Those skilled in the art can understand that the condensation device 100 of the present application is also applicable to heat pump systems having other structures.

[0060] In a heat pump system, in the independent refrigeration mode and water heating mode, the cooling medium for circulating to the cooling tower and the cooling medium for circulating to the final equipment to provide warm water in the condensation device need to be provided separately. In some existing heat pump systems, only one set of heat exchange tube bundles is used in the condensation device for heat exchange with the refrigerant. Therefore, two heat exchange devices need to be additionally provided to transfer the heat of the cooling medium heated after heat exchange to the cooling tower or the final equipment respectively. Alternatively, the heat pump system needs to have two condensation devices used in the independent cooling mode and water heating mode respectively.

[0061] In the condensation device of the present application, two independent sets of heat exchange tube bundles are arranged within one shell so that cooling media for different applications can flow through different tube bundles. For example, the cooling media circulating in a cooling tower and the cooling media circulating in end equipment flow separately within the corresponding heat exchange tube bundles, and gaseous refrigerant filling the heat exchange accommodation cavity can conduct heat exchange to meet the requirements of multiple modes of a heat pump system, thereby preventing two cooling media for different applications from contaminating the hot water due to mixing.

[0062] Furthermore, in the condensation device of the present application, since two independent sets of heat exchange tube bundles are arranged, each set of heat exchange tube bundles can be arranged with different numbers of pipelines according to requirements so that the cooling media flowing inside and outside each set of heat exchange tube bundles can meet different temperature difference requirements. For example, in the water heating mode, by selecting the first set of heat exchange tube bundles with more pipelines and circulating the cooling media, the cooling media flowing inside and outside the heat exchange tube bundles can have a larger temperature difference. In the independent cooling mode, by selecting the second set of heat exchange tube bundles with a smaller number of pipelines and circulating the cooling media, the cooling media flowing inside and outside the heat exchange tube bundles can have a smaller temperature difference.

[0063] In addition, each set of heat exchange tube bundles of the condensation device of the present application includes respective condensation tube bundles and subcooling tube bundles. Therefore, regardless of the set of heat exchange tube bundles through which the cooling media flow, the refrigerant can be condensed and subcooled in sequence. In particular, in the water heating mode, the condensed liquid refrigerant can be subcooled to subcooled liquid refrigerant, which can improve the operating efficiency of the economizer. Under the same conditions, the size required for the economizer can be smaller, and the occupied space of the heat pump system can be reduced.

[0064] This application is described with reference to specific embodiments shown in the accompanying drawings, but it should be understood that the condensation device and cooling system of this application may have many variations without departing from the spirit, scope, and context of this application. Those skilled in the art will also recognize that all the various ways of changing the structural details of the embodiments disclosed in this application are within the spirit and scope of the invention and the claims.

Claims

1. A condensing device, A shell (101), the shell (101) having a length direction (L), a width direction (W), and a height direction (H), a heat exchange accommodation cavity (220) being provided within the shell (101), the heat exchange accommodation cavity (220) being used for accommodating a refrigerant, the shell (101), At least two sets of heat exchange tube bundles (251, 252), each set of heat exchange tube bundles (251, 252) being disposed within the heat exchange accommodation cavity (220) and extending in the length direction (L), the inside of each set of heat exchange tube bundles (251, 252) being used for circulating a cooling medium, each set of heat exchange tube bundles (251, 252) comprising a condensing tube bundle (221, 222) and a subcooling tube bundle (241, 242, 243, 244), the subcooling tube bundle (241, 242, 243, 244) being disposed below the corresponding condensing tube bundle (221, 222), at least two sets of heat exchange tube bundles (251, 252), characterized by comprising, The at least two sets of heat exchange tube bundles (251, 252) are configured to circulate the cooling medium independently so that the cooling medium within each set of heat exchange tube bundles (251, 252) can independently effect heat exchange with the refrigerant within the heat exchange accommodation cavity (220). A condensing device.

2. The condensation device (100) further comprises at least two sets of cooling medium containing boxes (111, 112) arranged corresponding to at least two sets of the heat exchange tube bundles (251, 252), each of the sets of cooling medium containing boxes (111, 112) comprising a pair of cooling medium containing boxes (111a, 111b, 112a, 112b), a cooling medium inlet (114, 115), and a cooling medium outlet (116, 117), the cooling medium inlet (114, 115) and the cooling medium outlet (116, 117) being arranged on the pair of cooling medium containing boxes (111a, 111b, 112a, 112b), the cooling medium containing boxes (111a, 111b, 112a, 112b) being used to contain the cooling medium, the cooling medium inlet (114, 115) being configured to input the cooling medium into the cooling medium containing boxes (111a, 111b, 112a, 112b), and the cooling medium outlet (116, 117) being configured to output the cooling medium from the cooling medium containing boxes (111a, 111b, 112a, 112b). The pair of cooling medium containing boxes (111a, 111b, 112a, 112b) are respectively arranged at two ends of the corresponding heat exchange tube bundles (251, 252) in the length direction, and the cooling medium inlet (114, 115) and the cooling medium outlet (116, 117) are in fluid communication with the corresponding heat exchange tube bundles (251, 252) through the pair of cooling medium containing boxes (111a, 111b, 112a, 112b) to enable the cooling medium to flow independently through each set of the heat exchange tube bundles (251, 252). The condensation device according to claim 1, characterized in that.

3. At least two sets of the heat exchange tube bundles (251, 252) include a set of the first heat exchange tube bundles (251) and a set of the second heat exchange tube bundles (252), the set of the first heat exchange tube bundles (251) and the set of the second heat exchange tube bundles (252) are arranged on two opposite side surfaces of the shell (101) in the width direction (W), and the set of the first heat exchange tube bundles (251) and the set of the second heat exchange tube bundles (252) each have at least one pipeline. The at least two cooling medium containing box sets (111, 112) include a first cooling medium containing box set (111) and a second cooling medium containing box set (112), and the first cooling medium containing box set (111) and the second cooling medium containing box set (112) are correspondingly arranged on the two opposite side surfaces of the shell (101) in the width direction (W). The condensation device according to claim 2, characterized in that.

4. The first cooling medium containing box set (111) includes at least one first flow path partition plate (333), the at least one first flow path partition plate (333) is arranged in at least one of the pair of cooling medium containing boxes (111a, 111b) of the first cooling medium containing box set (111), and the at least one first flow path partition plate (333) is configured to enable the set of the first heat exchange tube bundles (251) to have at least two pipelines. The second cooling medium containing box set (112) includes at least one second flow path partition plate (334, 335), the at least one second flow path partition plate (334, 335) is arranged in at least one of the pair of cooling medium containing boxes (112a, 112b) of the second cooling medium containing box set (112), and the at least one second flow path partition plate (334, 335) is configured to enable the set of the second heat exchange tube bundles (252) to have at least two pipelines. The condensation device according to claim 3, characterized in that.

5. The condensation device according to claim 4, characterized in that the set of the first heat exchange tube bundles (251) and the set of the second heat exchange tube bundles (252) have different numbers of pipelines.

6. The shell (101) includes a cylinder (109) and a pair of tube plates (107, 108), the pair of tube plates (107, 108) are connected to two ends of the cylinder (109) in the longitudinal direction, the cylinder (109) and the pair of tube plates (107, 108) surround the heat exchange accommodation cavity (220), and the pair of cooling medium accommodation boxes (111a, 111b, 112a, 112b) are respectively arranged outside the pair of tube plates (107, 108), The condensation device according to claim 2, characterized in that two ends of each of at least two sets of the heat exchange tube bundles (251, 252) in the longitudinal direction (L) independently pass through the pair of tube plates (107, 108) so as to be in fluid communication with the cooling medium inlet (114, 115) and the cooling medium outlet (116, 117) of the corresponding pair of cooling medium accommodation boxes (111a, 111b, 112a, 112b).

7. For each set of the heat exchange tube bundles (251, 252), the subcooling tube bundles (241, 242, 243, 244) are in direct fluid communication with the corresponding cooling medium inlet (114, 115) so that at least one part of the cooling medium input from the cooling medium inlet (114, 115) first flows through the subcooling tube bundles (241, 242, 243, 244) and then through the corresponding condensation tube bundles (221, 222). The condensation device according to claim 2, characterized by this.

8. A heat pump system, A heat pump system, comprising a compressor (591, 592), a condensing device (100), a throttling device (595, 596, 597), and an evaporating device (593), which are arranged in a refrigerant circuit, wherein the condensing device (100) is the condensing device according to any one of claims 1 to 8.

9. At least two sets of the heat exchange tube bundles (251, 252) include a set of the first heat exchange tube bundle (251) and a set of the second heat exchange tube bundle (252). The heat pump system (590) has an independent cooling mode and an independent water heating mode, and the heat pump system (590) circulates the cooling medium in the set of the first heat exchange tube bundle (251) of the condensing device (100) in the independent cooling mode. The heat pump system according to claim 8, characterized in that it is configured to circulate the cooling medium in the set of the second heat exchange tube bundle (252) of the condensing device (100) in the independent water heating mode.

10. The heat pump system according to claim 9, characterized in that the number of pipelines in the set of the first heat exchange tube bundle (251) is less than the number of pipelines in the set of the second heat exchange tube bundle (252).

Citation Information

Patent Citations

  • Shell and tube type condenser and air conditioning system

    CN106196755A

  • JP1972014301U

  • JP1975005255U

  • Heat exchanger

    JP1986099096A

  • Shell and tube type condenser

    JP1996233408A