Cover for a cleaning module for cleaning a semiconductor wafer and method for cleaning a semiconductor wafer in a cleaning line

Abstract

A cover and method for a cleaning module for cleaning a semiconductor wafer, the cover and method being such that the semiconductor wafer is processed in a vertically oriented state using a fluid during a cleaning process, the cover comprising: a base member having a wedge-shaped cross-section; a sealing frame for disposing the cover on the cleaning module; a hood covering the base member and having a slot for guiding the semiconductor wafer into the cleaning module; a bracket fixed to the hood so as to be displaceable across the slot, the bracket having a first drainage channel incorporated in an upper surface of the bracket along an edge boundary of the bracket that is parallel to and close to the slot; a panel displaceable across the base member and the slot, the panel having a second drainage channel incorporated in an upper surface of the panel along an edge boundary of the panel that is parallel to and close to the slot. When the bracket and the panel are pressed against each other, the width of the slot is restricted to a range required for the movement of the gripping system when the semiconductor wafer is lifted or lowered using the gripping system.

Description

Technical Field

[0001] The present invention relates to a cover for a cleaning module for cleaning a semiconductor wafer, the cover being for a semiconductor wafer to be processed in a vertically oriented state using a fluid during a cleaning process. The present invention also relates to a method for cleaning a semiconductor wafer in a cleaning line comprising at least one cleaning module having such a cover.

Background Art

[0002] Prior Art / Problems U.S. Patent No. 20060254715 describes a method in which a semiconductor wafer is transported between cleaning modules of a cleaning line arranged in sequence to perform a single wafer cleaning operation in each cleaning module. During this time, at least one robot moves along a guide to one of the cleaning modules to take the semiconductor wafer in and out of the cleaning module, and a manipulator descends into the cleaning module. The drawback here is that fluid dripping from the manipulator or the semiconductor wafer may reach the cleaning module, which may endanger the success of the cleaning process.

[0003] According to U.S. Patent Application Publication No. 2014 / 0209239, a cleaning module having a closable cover may be provided. In the open state, the cover is intended to guarantee access to the cleaning module, and in the closed state, it is intended to prevent fluid from the cleaning module from being sprayed into the environment during the cleaning of the semiconductor wafer.

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to limit the possibility that fluid can reach the cleaning module unintentionally.

Means for Solving the Problems

[0005] An object of the present invention is a cover for a cleaning module for cleaning a semiconductor wafer, the cover being for a semiconductor wafer to be processed in a vertically oriented state using a fluid during a cleaning process, the cover comprising: a base member having a wedge-shaped cross section; a sealing frame for arranging the cover on the cleaning module; a hood covering the base member and having a slot for guiding the semiconductor wafer into the cleaning module; and a bracket fixed to the hood so as to be displaceable across the slot, the cover being characterized by a first drainage channel incorporated in an upper surface of the bracket along an edge boundary of the bracket that is parallel to the slot and close to the slot, a panel displaceable across the base member and the slot, and a second drainage channel incorporated in an upper surface of the panel along an edge boundary of the panel that is parallel to the slot and close to the slot.

[0006] The panel and the bracket displaceable across the slot of the hood are used to minimize the width of the slot as much as possible when the slot is open. Droplets that can fall into the cleaning module through the slot are prevented from colliding with the bracket or the panel. Droplets falling on the bracket or the panel are discharged outward from the cleaning module by the first drainage channel on the upper surface of the bracket or the second drainage channel on the upper surface of the panel.

[0007] The present invention also relates to a method for cleaning a semiconductor wafer in a cleaning line comprising at least one cleaning module in which a vertically oriented semiconductor wafer is processed using the fluid of the cleaning process, the method comprising: moving a gripping system for lifting or lowering the semiconductor wafer into the cleaning module through a slot in a hood of a cover of the cleaning module. The method is characterized in that the cleaning module comprises a cover according to the present invention, and when the bracket and the panel are pushed against each other, thereby lifting or lowering the semiconductor wafer using the gripping system, the width of the slot is restricted to an extent necessary for the movement of the gripping system. Preferably, it is ensured that an additional play of 2 mm or less is provided for such movement to the bracket or the panel.

[0008] Preferably, the method is used in a cleaning line comprising two or more cleaning modules, each provided with a cover according to the invention.

[0009] The present invention will be described below with reference to the drawings in terms of embodiments.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Modes for Carrying Out the Invention

[0011] Detailed description of embodiments of the present invention The cover shown in FIG. 1 comprises a base member 1, a sealing frame 12, a hood 2 having a slot 3, a bracket 4, and a panel 5. The base member 1 has a wedge-shaped cross-section and is positioned on a cleaning module (not shown) by the sealing frame 12. The hood 2 having the slot 3 for guiding a semiconductor wafer to the cleaning module by a gripping system is fixed to the base member 1 by a sleeve 6 of the base member 1 and covers it. In the open state of the shown cover, the slot 3 is located on the side surfaces of the bracket 4 on one side of the slot 3 and the panel 5 on the opposite side of the slot 3. The bracket 4 is fixed to a guide rail 7 of the hood 2 so as to be displaceable across the slot 3. The bracket 4 is displaceable in the direction of the slot 3 so as to completely cover the slot 3 and thus move the cover to the closed state. The panel 5 on the other side of the slot 3 has a long hole 8 through which it can be pushed along the slot 3 so as to adjust the width of the slot 3 in the open state of the cover. Below the hood 2, an impact bar 9 is arranged and fixed to the lower surface of the bracket 4. The slot 3 is in the open state of the cover located on the side surfaces of the drain channels 10, 11. The drain channel 10 is incorporated in the upper surface of the bracket 4 close to the edge of the bracket 4 adjacent to the slot 3 and is oriented parallel to the slot 3. The drain channel 11 is incorporated in the upper surface of the panel 5 close to the edge of the panel adjacent to the slot 3 and is oriented parallel to the slot 3.

[0012] FIG. 2 is a side view of the cover. As a result of the base member 1 having a wedge-shaped cross-section, there is a downward gradient towards the guide rail 7. The bracket 4 and the panel 5 are inclined according to this downward gradient so that droplets of fluid falling on the bracket 4 or the panel 5 are drained along the drain channel 10 or the drain channel 11 and as a result are prevented from falling into the cleaning module through the slot 3.

[0013] Figure 3 is a top view of the cover in the open state. The width of the slot depends on the length of the displacement path along which the brackets 4 and the panel 5 are pushed into the slot. When the semiconductor wafer is inserted and removed by the gripping system, the brackets 4 and the panel 5 are pushed against each other so that the width of the slot is limited to the dimensions required for the movement of the gripping system.

[0014] The possibility that fluid can reach the cleaning module unintentionally through the slot when the cover is in the open state is effectively limited by adjusting the width of the slot in this way.

Explanation of reference numerals

[0015] Explanation of the reference numerals used 1 Base member 2 Hood 3 Slot 4 Bracket 5 Panel 6 Sleeve 7 Guide rail 8 Long hole 9 Impact bar 10 Drain channel 11 Drain channel 12 Sealing frame

Claims

Claim 1 A cover for a cleaning module for cleaning a semiconductor wafer, the cover being for a semiconductor wafer to be processed in a vertically oriented state using a fluid during a cleaning process, the cover comprising: a base member having a wedge-shaped cross-section; a sealing frame for disposing the cover on the cleaning module; a hood covering the base member and having a slot for guiding the semiconductor wafer into the cleaning module; and a bracket fixed to the hood so as to be displaceable across the slot, the bracket having a first drainage channel incorporated in an upper surface of the bracket along an edge boundary of the bracket that is parallel to and close to the slot, the cover further having a panel displaceable across the base member and the slot, the panel having a second drainage channel incorporated in an upper surface of the panel along an edge boundary of the panel that is parallel to and close to the slot. Claim 2 A method for cleaning a semiconductor wafer in a cleaning line comprising at least one cleaning module in which a vertically oriented semiconductor wafer is processed using a fluid of the cleaning process during the cleaning process, the method comprising: a gripping system for lifting and lowering the semiconductor wafer moving into the cleaning module through a slot in a hood of a cover of the cleaning module, the cleaning module comprising the cover according to claim 1, and the width of the slot being restricted to a range required for movement of the gripping system when the gripping system is used to lift and lower the semiconductor wafer by pressing the bracket and the panel towards each other. Claim 3 The method according to claim 2, wherein an additional play of 2 mm or less is guaranteed for movement of the gripping system to the bracket or the panel. Claim 4 The method according to claim 2 or 3, wherein the cleaning line comprises two or more cleaning modules each comprising the cover according to claim 1.

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