In-Motion Laser Beam Analysis and Analysis at Both Ends of the Field of View for a High-Speed Laser Motion System
The system uses pinhole sensors and optical fiber cables to analyze and adjust laser beam characteristics at both ends of the field of view, addressing inconsistencies in high-speed laser processing systems, ensuring consistent quality.
Patent Information
- Application Number
- JP2024565899
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-05-09
- Filing Date
- 2023-05-08
- Publication Date
- 2025-07-10
AI Technical Summary
Existing laser processing systems, particularly those with high-speed motion capabilities, struggle to accurately analyze and adjust for changes in laser beam characteristics, especially at extreme positions within the field of view, leading to inconsistencies in laser processing quality.
A system and method utilizing pinhole sensors and optical fiber cables to measure laser beam characteristics at both ends of the field of view, capturing differences in spot size, shape, and irradiance, and adjusting processing parameters accordingly.
Enables precise analysis and adjustment of laser beam characteristics during high-speed motion, ensuring consistent laser processing quality across the entire field of view, overcoming limitations of prior systems that can only measure stationary beams at the center.
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Figure 2025521406000001_ABST
Abstract
Description
Technical Field
[0001] The disclosed technology relates to a laser system having a high-speed motion function, and more particularly, to a system, apparatus, and method for characterizing, analyzing, and verifying the appropriate functions and performance of a focused spot or image of a laser beam used in a laser processing system having a high-speed beam motion function.
Background Art
[0002] Laser processing generally involves modifying a workpiece in a predetermined manner using a laser beam. Laser processing ranges from high-intensity laser ablation processing to significantly low-intensity processing such as heat treatment that avoids melting. Almost all laser processing techniques involve shaping the laser beam into a specific size and shape at a specific position or working distance from the laser system. Accurately identifying the location where the laser system forms a focused spot or beam image with the desired characteristics is important for performing efficient and optimized laser processing.
[0003] Laser processing technology includes laser beam welding (LBW), which is a fusion welding process used to join materials of various configurations. A laser beam welding system typically includes a laser light source, a laser light irradiation system, an optical arrangement for irradiating the workpiece with the laser light, and often a motion system for moving either the laser beam or the workpiece. The LBW system includes a fiber transmission beam or an open beam path, a fixed optical system, or a galvanometer system that enables rapid deflection of the laser beam. The mechanical motion system includes a high-speed system or a low-speed system depending on the application. In the LBW process, an optical arrangement including a collimation lens or mirror that stops the divergence of the laser light from the light source and sends the light to a focusing lens or mirror is used to focus the laser light. The focusing lens or mirror irradiates the workpiece with the highly intense and focused laser light. The high-intensity laser light is used to melt the material of the workpiece and fuse two or more parts or components.
[0004] The use of laser processing systems, particularly LBW systems, in manufacturing has become common, and such systems have become prevalent in many manufacturing facilities around the world. The functional success of all laser processing systems depends on the characteristics of a given stable and reproducible laser beam, including the shape, size, distribution, and position of the focused spot. Accordingly, there is a continuing need for accurate, user-friendly, and cost-effective systems, devices, and methods for analyzing the quality and dynamic accuracy of laser focused spots or images formed by laser processing systems having motion capabilities. SUMMARY OF THE INVENTION
[0005] The following presents an overview of specific embodiments of the disclosed technology. This summary is not an extensive overview and is not intended to identify key aspects or elements of the disclosed technology or to delineate its scope. However, it should be understood that the use of the indefinite article in the language used to describe and claim the disclosed technology is not intended to limit the described technology in any way. Rather, the use of "a" or "an" should be construed to mean "at least one" or "one or more."
[0006] One embodiment of the disclosed technology provides a system for analyzing laser beam characteristics at both ends of a field of view or at other selected positions in a high-speed laser motion system, the high-speed laser motion system having a laser that generates a non-steady laser beam and a build platform disposed at a predetermined position with respect to the non-steady laser beam, the system having a known or pre-defined field of view of the laser, where the laser beam characteristics are known or determined at a central position of the field of view, the field of view, and a plurality of pinhole sensors attached to both ends of the field of view such that each pinhole sensor is arranged to receive the laser light generated by the non-steady laser beam, each pinhole sensor measuring the characteristics of the laser beam at both ends of the field of view, and the difference between the laser beam characteristics at the central position and the laser beam characteristics at both ends of the field of view being incorporated into and understood by the high-speed laser motion system during processing, and adjustments necessary in processing being made based on the difference, the plurality of pinhole sensors.
[0007] The system further includes a portable test device, which includes a support having an upper surface. The upper surface is disposed parallel to and above the build platform of the high-speed laser motion system, and is adapted to receive and absorb the laser light generated by the laser beam. The plurality of pinhole sensors are attached to both ends of the field of view within the support. The system further includes an optical fiber cable coupled to each pinhole sensor. Each optical fiber cable has a proximal end through which the laser light is received through the pinhole sensor and a distal end from which the laser light is transmitted. The system further includes a photodetector disposed at the distal end of each optical fiber cable. The photodetector converts the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole sensor. The characteristics of the laser beam to be measured include spot size, shape, and irradiance within the spot size. A calibration plate is used to predefine the field of view of the laser.
[0008] Another embodiment of the disclosed technology is a system for analyzing the characteristics of a laser beam at both ends of a field of view or at other selected positions in a high-speed laser motion system, the high-speed laser motion system comprising a laser for generating a laser beam and a build platform disposed at a predetermined position with respect to the laser beam, the system being a portable test device, the portable test device including a support having an upper surface, the upper surface being disposed parallel to and above the build platform of the high-speed laser motion system, the upper surface being adapted to receive and absorb laser light generated by the laser beam, the portable test device, a field of view of the laser that is known or predefined, the laser beam characteristics being known or determined at a central position of the field of view, the field of view, and a plurality of pinhole sensors attached to both ends of the field of view such that each pinhole sensor is arranged to receive the laser light generated by the non-steady laser beam, each pinhole sensor measuring the characteristics of the laser beam at both ends of the field of view, a difference between the laser beam characteristics at the central position and the laser beam characteristics at both ends of the field of view being incorporated into and accounted for in the high-speed laser motion system during processing, and adjustments required in processing being made based on the difference, the plurality of pinhole sensors.
[0009] The system further has an optical fiber cable coupled to each pinhole sensor, and each optical fiber cable has a proximal end through which the laser light is received through the pinhole sensor and a distal end from which the laser light is transmitted. The system may further have a photodetector disposed at the distal end of each optical fiber cable, and the photodetector converts the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole sensor. The characteristics of the laser beam to be measured include spot size, shape, and irradiance within the spot size. The calibration plate is used to pre-define the field of view of the laser.
[0010] Yet another embodiment of the disclosed technology is a method of analyzing laser beam characteristics at both ends of the field of view or at other selected positions in a high-speed laser motion system, wherein the high-speed laser motion system has a laser that generates an unsteady laser beam and a build platform disposed at a predetermined position with respect to the unsteady laser beam. The method includes defining the field of view of the laser, attaching a plurality of pinhole sensors at both ends of the field of view such that each pinhole sensor receives the laser light generated by the unsteady laser beam, measuring the characteristics of the laser beam at both ends of the field of view through each pinhole sensor, capturing and understanding the difference between the characteristics of the laser beam at both ends of the field of view and the characteristics of the laser beam at a known or determined central position of the field of view during processing, and adjusting the processing required for machining based on the difference.
[0011] The method further includes a step of coupling an optical fiber cable to each pinhole sensor, each optical fiber cable having a proximal end through which the laser light is received through the pinhole sensor and a distal end to which the laser light is irradiated. The method further includes a step of disposing a photodetector at the distal end of each optical fiber cable, the photodetector converting the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole sensor. The characteristics of the laser beam to be measured include spot size, shape, and irradiance within the spot size. A calibration plate is used to define the field of view of the laser.
[0012] It is assumed that all combinations of the foregoing concepts and additional concepts described in further detail below, provided such concepts are not mutually inconsistent, are part of the technology disclosed herein and can be implemented to achieve the advantages as described herein. Additional features and aspects of the disclosed systems, devices, and methods will become apparent to those skilled in the art by reading and understanding the following detailed description of the exemplary embodiments. As will be understood by those skilled in the art, further embodiments are possible without departing from the scope and spirit of what is disclosed herein. Accordingly, the description provided herein is to be considered illustrative and not restrictive in nature.
Brief Description of the Drawings
[0013] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more exemplary embodiments of the disclosed technology and, together with the general description above and the detailed description below, serve to explain the principles of the disclosed subject matter:
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Best Mode for Carrying Out the Invention
[0014] Next, the embodiments will be described with reference to the figures. The reference numerals are used throughout the detailed description to refer to various elements and structures. The following detailed description includes many specific details for purposes of explanation, but those skilled in the art will understand that many variations and modifications to the following details are within the scope of the disclosed technology. Accordingly, the following embodiments are described without limiting the generality of the claimed subject matter and without imposing limitations on the claimed subject matter.
[0015] The embodiments described in this specification are merely illustrative and are provided to assist in the description of the apparatuses, devices, systems, and methods described in this specification. None of the features or components shown in the drawings or described hereinafter should be considered necessary for a particular implementation of any of these apparatuses, devices, systems, or methods, unless specifically so designated. For the sake of readability and clarity, a particular component, module, or method may be described only in relation to a particular figure. Even if a combination or partial combination of components is not specifically described, it should not be understood that such combination or partial combination is impossible. Also, with respect to the methods described, unless otherwise specified or required by the context, whether or not the method is described in association with a flowchart, the explicit or implicit ordering of the steps executed in the execution of the method does not mean that those steps must be executed in the order in which they are presented. Instead, it should be understood that they may be executed in a different order or in parallel.
[0016] U.S. Patent No. 10,976,219 and U.S. Patent No. 10,627,311 are related to the disclosed technology, and the entire content of each of these patents is hereby expressly incorporated by reference into this specification and made a part of this patent application for all purposes. These documents disclose, for example, systems for use in additive manufacturing, which is an industrial process of adding successive ultra-thin layers of material to create three-dimensional objects. Each successive layer bonds or fuses with the preceding layer of a different material, including molten or partially molten materials, metal powders, thermoplastic plastics, ceramics, composite materials, glass, and other materials. Laser powder bed fusion (L-PBF) is a particular process used in additive manufacturing that forms three-dimensional parts or components with a layer-by-layer approach using a high-power laser. L-PBF typically includes the steps of: (1) spreading a layer of powder material (such as metal) on a build platform or plate; (2) using a laser to fuse the first layer or first cross-section of the part; (3) spreading a new layer of powder over the entire previous layer using a roller, recoater arm, coating blade, or similar device; (4) using a laser to fuse the new layer or new cross-section of the part; (5) adding and fusing successive layers or cross-sections; and (6) repeating the process until the entire part is created. Loose, unfused powder material remains in place but is removed during post-processing.
[0017] The functional success of an L-PBF system depends on the presence of a known and stable laser focus spot on the powder bed working plane. The techniques disclosed in U.S. Patent No. 10,976,219 and U.S. Patent No. 10,627,311 provide a portable test device for analyzing the quality and dynamic accuracy of laser focusing spots in various L-PBF systems and apparatuses. This test device is further used with a laser powder bed fusion additive manufacturing apparatus that includes at least one laser that generates an unsteady laser beam having known or predetermined characteristics, and a shaping surface disposed at a predetermined position with respect to the unsteady laser beam, wherein the unsteady laser beam translates (i.e., traverses) across the shaping surface in a controlled manner during the additive manufacturing process. The apparatus includes a support having an upper surface adapted to receive and absorb the laser light generated by the unsteady laser beam, and a plurality of pinhole defining structures positioned to receive the laser light generated by the unsteady laser beam, each pinhole being arranged parallel at a predetermined height from the upper surface of the support, and an optical fiber cable disposed within a structure defining each pinhole, each optical fiber cable having a proximal end where the laser light is received through the pinhole and a distal end to which the laser light is sent, and a photodetector disposed at the distal end of each optical fiber cable, the photodetector converting the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole. FIGS. 1-4, 5A-C, 6A-B, 7A-F, and 8A-C provide various exemplary views of an example of a test device for analyzing the quality and dynamic accuracy of laser focus spots in various laser-based manufacturing systems including L-PBF systems and laser beam welding (LBW) systems.
[0018] As best shown in FIGS. 1-4, the exemplary test apparatus 10 includes a support 100, a base 200, structures or pinhole sensors 300, 400, 500, 600 that define pinholes attached to the support 100, and a photodetector 700 disposed on the base 200. The support 100, which is generally square in shape and may also be referred to as a calibration plate, further includes an absorbent upper surface 110, which may include a series of concentrically arranged ridges or other raised structures (see FIG. 4) that absorb and dissipate heat generated by the laser beam to prevent damage to the upper surface 110 and the support 100. The support 100 further includes a first mounting recess 120 (for receiving the structure 300 that defines the first pinhole), a first set screw opening 122 (for receiving a set screw that secures the structure 300 that defines the first pinhole within the first mounting recess 120), a second mounting recess 130 (for receiving the structure 400 that defines the second pinhole), a second set screw opening 132 (for receiving a set screw that secures the structure 400 that defines the second pinhole within the second mounting recess 130), a third mounting recess 140 (for receiving the structure 500 that defines the third pinhole), a third set screw opening 142 (for receiving a set screw that secures the structure 500 that defines the third pinhole within the third mounting recess 140), a fourth mounting recess 150 (for receiving the structure 600 that defines the fourth pinhole), and a fourth set screw opening 152 (for receiving a set screw that secures the structure 600 that defines the fourth pinhole within the fourth mounting recess 150). The support 100 also includes a first opening 160 for receiving a first coolant fitting 162, a second opening 164 for receiving a second coolant fitting 166, and a flow path 170 for receiving and transporting a liquid or gaseous coolant that transfers the energy absorbed by the support 100 away from the test apparatus 10.
[0019] Also, as best shown in FIGS. 1-4, a base 200 having a shape corresponding to the shape of the support 100 cooperates with the support 100 to form a housing. The base 200 includes an outer wall 210 and an internal cavity 212 in which various optical fiber cables attached to the structure defining the photodetector 700 and the pinhole are disposed. The base 200 also includes an opening 214 for receiving a Bayonet Neill-Concelman (BNC) partition 216 to which a BNC connector 218 is attached, a second opening 220 for receiving a gas joint 222, and a third opening 224 for receiving a gas bleed valve 226. In certain embodiments, a source of pressurized gas is connected to a gas joint 222 for supplying gas flowing outwardly to and through each pinhole to prevent contamination of the pinholes by debris or other fragments generated during the test process.
[0020] Referring to FIGS. 1-4, FIGS. 5A-C, and FIGS. 6A-6B, an example of the test apparatus 10 shown in the figures includes a structure defining four pinholes, also referred to as a "pedestal". FIGS. 5A-C and FIGS. 6A-6B illustrate only the structure 300 defining the first pinhole, but the structures (400, 500, and 600) defining the remaining pinholes are configured similarly to the structure 300 defining the first pinhole. Thus, FIGS. 5A-C and FIGS. 6A-6B are meant to be representative of the structures defining all of the pinholes depicted in the figures.
[0021] As shown in FIGS. 55A - C and FIGS. 6A - 6B, the structure or pedestal 300 that defines the first pinhole includes a first pinhole 302 formed at the tip 304 through which the flow path 306 passes. The diameter of the pinhole 302 is typically one - third to one - thirtieth of the diameter of the laser beam characterized by the test apparatus 10 (e.g., pinhole diameter: 5 - 50 μm). The tip 304 typically includes a highly reflective material such as gold, copper, or other reflective metals to minimize damage to the pinhole and the structure defining the pinhole caused by absorption of energy from the laser beam. The tip 304 is mounted within a body 310 that includes a tapered portion 312 and a cylindrical portion 326 through which the flow path 328 passes. The first set - screw opening 330 is adapted to receive a first set - screw 332 that secures the first optical fiber cable 350 within the body 310. The first optical fiber 352 is inserted into the flow path 306 and is proximate to the first pinhole 302. The structure or pedestal 300 that defines the first pinhole is mounted within the support 100 such that the pinhole is higher than the upper surface 110 by a height (e.g., 20 - 40 mm) that minimizes damage to the pinhole and the pedestal that may be caused by the energy of the non - stationary laser beam.
[0022] FIGS. 7A - 7F are diagrams of a test apparatus 10 used to analyze the characteristics of a non - stationary laser beam generated by a laser light source present in a laser powder bed fusion system used for additive manufacturing. In these figures, the laser light source or laser 800 generates a laser beam 802 that contacts the upper surface 110 of the test apparatus 10 at a plurality of positions or locations including the position containing the aforementioned pinhole. During normal operation of the test apparatus 10, the laser beam 802 is continuously operated at a typical operating power to bring all laser beam transmission elements of the laser powder bed fusion machine or system close to their normal operating temperature and functionality so that any deviation of the laser beam 902 or loss of laser focus quality can be detected.
[0023] FIG. 8A is a cross-sectional view of a structure 300 that defines a pinhole for receiving laser light from a laser beam 802 during normal operation of a laser powder bed fusion system attached to a support 100 and to be analyzed. FIG. 8B is a detailed view of the upper part of FIG. 8A showing the laser light reflected by the structure 300 that defines the pinhole. FIG. 8C is an explanatory view of a test device 10 used to analyze the characteristics of an unsteady laser beam 802 generated by a laser source 800. The laser beam 802 is reflected from a structure 400 that determines the pinhole. In FIGS. 8A - 8B, it is shown that the light from the laser beam 802 passes through the pinhole 302 and is incident on an optical fiber 352, and the signal is transmitted through the optical fiber 352 to a photodetector 700 (see FIG. 1). The laser light passing through the pinhole 302 is only a very small amount of the laser light generated by the laser beam 802. For example, in the case of a laser beam having a total diameter of about 0.1 mm, the diameter of the portion passing through the pinhole 302 is about 0.025 mm. The laser light collected from each pinhole may be transmitted to one or more optical measurement devices via an optical fiber coupling. The inspection device 10 includes a data acquisition device that communicates with the photodetector 700. The data acquisition device receives, stores, arranges, and analyzes an electrical signal as a function of time or time and position with respect to the pinhole where the laser light is received. A data analysis algorithm associated with the data collection device calculates and determines the quality of the laser beam based on data obtained from multiple paths of the unsteady laser beam on the plurality of pinholes. The data acquisition device may also include hardware and / or software (e.g., Bluetooth, etc.) that enables data transmission to a receiver located outside the additive manufacturing device.
[0024] The above-described systems, devices, and methods, as well as U.S. Patent Publication No. 2021 / 0223140, which is incorporated herein by reference in its entirety, are useful for analyzing many aspects of high-speed laser motion systems. In one embodiment, the disclosed techniques are used in a method for analyzing a moving laser beam at an extreme of the field of view of a particular high-speed laser system or anywhere within the field of view (as if the laser beam were in use). The extreme portions or portions off-center of the field of view of the laser system are generally where anomalies in the laser beam occur and are similar to the expected changes in the characteristics of the laser beam that are identified and explained when determining appropriate process parameters. Moving the laser beam across a pinhole causes the laser beam to move as it does during processing and utilize all portions of the lens included as the focusing optics to heat, enabling more realistic measurements.
[0025] Laser powder bed fusion machine operators and remote laser welding system operators need to understand the system characteristics while the laser is actually moving when performing processes where the laser beam needs to move during processing. When the laser beam is moving (e.g., a galvanometer scanner system), the focus spot of the laser beam can be affected by the focusing optics (e.g., a telecentric lens or an f-theta lens) being used, resulting in a distortion where the focus spot moves away from the center of the field of view. The ability to capture the characteristics of the laser beam in a moving state is a major advantage of the disclosed system, and due to its design and shape, the system can be placed at both ends of the field of view for analysis during movement in areas or regions where analysis is difficult. Prior art systems are essentially only stationary beams and measurements can only be made at or near the center of the field of view and cannot detect or indicate changes in the laser beam at extreme positions. This is problematic and limiting because as the laser beam moves away directly below the center of the field of view, beam ellipse, focus changes, and other anomalies occur.
[0026] The main aspects and advantages of the disclosed technology are as follows: (1) With the same device, it is possible to evaluate near both ends of the field of view and in the center of the field of view; (2) It is possible to evaluate while moving the laser beam, similar to during an actual shaping / welding process; (3) It is possible to correct process parameters in order to make the laser processing accessing the field of view more consistent by using evaluation data away from the center. Prior art systems, including Primes Scan Field Monitor and Ophir Beam Watch AM, have limited (or no) sampling capabilities and positions. These systems have limited ability to sample the moving beam as used during processing, and currently have no ability to sample the beam moving at the processing speed. There are numerous end-product manufacturers, users, customizers, and analysts of laser processing systems, including laser powder bed fusion systems and remote laser welding systems. Commercially available analysis systems are not sufficient for the analysis of laser processing systems due to design limitations that require a stationary beam and limited field-of-view areas analyzable in large analysis systems. Furthermore, industry standards such as AMS 7003 are creating a demand for systems such as the disclosed technology that are not subject to the design limitations of existing systems.
[0027] Referring to FIGS. 9A-9C, an exemplary test apparatus 10 having pinhole sensors 300, 400, 500, 600 is placed on a build platform 930 within a housing 910. The test apparatus 10 is arranged on the build platform 930 such that the pinhole sensors 300, 400, 500, 600 are located within a field of view 1000 formed by a laser 800. The pinhole sensors 300, 400, 500, 600 are arranged at both ends of the field of view 1000. As shown in FIG. 9A, the laser 800 generates an unsteady laser beam 802 at a central position within the field of view 1000. The unsteady laser beam 802 has measurable characteristics that are known or determined at the central position of the field of view 1000. The measurable characteristics of the unsteady laser beam 802 include spot size, shape, and irradiance within the spot size. As shown in FIG. 9B, the unsteady laser beam 802 is directed towards a pinhole sensor 600 located at an extreme within the field of view 1000, and the pinhole sensor 600 measures the characteristics of the unsteady laser beam 802 including spot size, shape, and irradiance within the spot size. As shown in FIG. 9C, the unsteady laser beam 802 is directed towards a pinhole sensor 400 located at the other end of the field of view 1000, and the pinhole sensor 400 measures the characteristics of the unsteady laser beam 802. The unsteady laser beam 802 can be directed towards any of the pinhole sensors 300, 400, 500, 600 to determine the characteristics of the unsteady laser beam 802 at each respective location. The difference in the laser beam characteristics between the central position of the field of view 1000 and the two end positions of the field of view 1000 is captured and explained during processing.
[0028] All documents and similar materials cited in this application, including but not limited to patents, patent applications, papers, books, monographs, and web pages, are hereby expressly incorporated by reference in their entirety regardless of their format. If one or more of the incorporated documents and similar materials differ from or conflict with this application, including but not limited to defined terms, term usage, described techniques, etc., this application shall govern.
[0029] As noted above and as used herein, the singular forms "a," "an," and "the" refer to both the singular and plural forms unless the context clearly indicates otherwise. As used herein, the term "comprising" is synonymous with "including," "containing," or "characterized by" and is inclusive or open-ended and does not exclude additional, unrecited elements or method steps. Although many methods and materials similar or equivalent to those described herein can be used, particular preferred methods and materials are described herein. References to numerical ranges by endpoints include all numbers within that range unless the context indicates otherwise. Further, references to "one embodiment" are not intended to be construed as excluding the existence of additional embodiments that also incorporate the recited features. Further, unless the contrary is explicitly stated, embodiments having an element or elements with a particular property can include additional elements whether or not they have that property.
[0030] The terms "substantially" and "about," as used throughout or when used herein, account for and describe minor variations, such as due to variations in processing. For example, these terms can refer to ±5% or less, such as ±2% or less, such as ±1% or less, such as ±0.5% or less, such as ±0.2% or less, such as ±0.1% or less, such as ±0.05% or less, and / or 0%.
[0031] Underlined and / or italic headings and subheadings are used for convenience only and do not limit the disclosed subject matter nor are they to be referred to in connection with the interpretation of the description of the disclosed subject matter. All structural and functional equivalents to the various elements of the various embodiments described throughout this disclosure that are known or later become known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be embraced by the disclosed subject matter. Further, what is disclosed herein is not intended to be generally dedicated regardless of whether or not such disclosure is explicitly recited in the above description.
[0032] There may be many alternative ways to implement the disclosed technology. The various functions and elements described herein may be divided differently from that shown without departing from the scope of the disclosed technology. The general principles defined herein may be applied to other implementations. Different numbers of a given module or unit may be employed, different types or kinds of a given module or unit may be employed, a given module or unit may be added, or a given module or unit may be omitted.
[0033] In this disclosure, "a plurality of" means two or more. Unless specifically defined otherwise, the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is only based on the orientation or positional relationship shown in the figures for the convenience of explaining the disclosed technology and simplifying the description, and does not indicate or imply that the referenced device or element must be in a particular orientation or must be configured or operated in a particular orientation, and thus should not be construed as limiting the disclosed technology. Terms such as "connected", "attached", "fixed", etc. should be understood in a broad sense. For example, "connected" means a fixed connection, a detachable connection, an integral connection, a direct connection, an indirect connection through an intermediate medium, etc. Those of ordinary skill in the art can understand the specific meaning of the above terms in the disclosed technology according to a particular situation.
[0034] In the above description, specific details have been shown in order to fully understand the disclosed technology. However, it is understood that the disclosed embodiments and implementations can be carried out without these specific details. For example, the circuits can be shown in block diagrams so as not to obscure the disclosed embodiments with unnecessary detail. In other instances, well-known circuits, processes, algorithms, structures, and techniques can be shown without unnecessary detail so as not to obscure the disclosed embodiments.
[0035] The implementation of the above-described technologies, blocks, processes, and means can be realized in various ways. For example, these technologies, blocks, processes, and means can be implemented in hardware, software, or a combination thereof. In the case of hardware implementation, the processing unit can be implemented within one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic units designed to perform the above functions, and / or combinations thereof.
[0036] The disclosed technology can be described as a process depicted as a flowchart, flow diagram, data flow diagram, structure diagram, or block diagram. A flowchart can describe operations as a sequential process, but many operations can be executed in parallel or concurrently. Further, the order of the operations can be rearranged. A process ends when its operations are completed, but it can also have additional steps not included in the figure. A process corresponds to a method, function, procedure, subroutine, subprogram, etc. When a process corresponds to a function, its end corresponds to the function returning to the calling function or main function.
[0037] Furthermore, the disclosed technology can be implemented by hardware, software, script languages, firmware, middleware, microcode, hardware description languages, and / or any combination thereof. When implemented in software, firmware, middleware, script languages, and / or microcode, the program code or code segments for performing the necessary tasks can be stored in a machine-readable medium such as a storage medium. The code segments or machine-executable instructions can represent a procedure, function, subprogram, program, routine, subroutine, module, software package, script, class, or any combination of instructions, data structures, and / or program statements. The code segments can be coupled to another code segment or hardware circuit by passing information, data, arguments, parameters, and / or memory contents. The information, arguments, parameters, data, etc. can be passed, transferred, or transmitted via any suitable means including memory sharing, message passing, ticket passing, network transmission, etc.
[0038] It should be understood that all combinations of the foregoing concepts and additional concepts discussed in more detail herein (provided such concepts are not mutually inconsistent) are intended to be part of the disclosed technology. In particular, all combinations of the claimed subject matter appearing at the end of this disclosure are intended to be part of the technology disclosed herein. The disclosed technology is illustrated by the description of exemplary embodiments, which have been described in certain details, but there is no intention to limit the appended claims to such details or to limit in any way. Additional advantages and modifications will readily occur to those skilled in the art. Accordingly, the disclosed technology is not limited in its broad aspects to any of the specific details, representative apparatus and methods, and / or exemplary examples shown and described. Thus, departures from such details can be made without departing from the spirit or scope of the general inventive concept.
Claims
1. A system for analyzing laser beam characteristics at both ends of the field of view or at other selected positions in a high-speed laser motion system, wherein the high-speed laser motion system includes a laser that generates an unsteady laser beam and a build platform disposed at a predetermined position with respect to the unsteady laser beam, the system comprising: (a) the field of view of the laser, which is known or pre-defined, and wherein the laser beam characteristics are known or determined at the central position of the field of view; (b) a plurality of pinhole sensors attached to both ends of the field of view such that each pinhole sensor is arranged to receive the laser light generated by the unsteady laser beam, (1) each pinhole sensor measures the characteristics of the laser beam at both ends of the field of view, (2) the differences between the laser beam characteristics at the central position and at both ends of the field of view are incorporated into and understood by the high-speed laser motion system during processing, and the adjustments required in processing are made based on the differences; the plurality of pinhole sensors; and a system.
2. The system according to claim 1, further comprising: a portable test device, the portable test device including a support having an upper surface, the upper surface being disposed parallel to and above the build platform of the high-speed laser motion system and adapted to receive and absorb the laser light generated by the laser beam.
3. The system according to claim 2, wherein the plurality of pinhole sensors are attached to both ends of the field of view within the support.
4. The system according to claim 2, further comprising: an optical fiber cable coupled to each pinhole sensor, each optical fiber cable having a proximal end through which the laser light is received through the pinhole sensor and a distal end from which the laser light is transmitted.
5. The system according to claim 4, further comprising: A system having a photodetector disposed at the distal end of each optical fiber cable, the photodetector converting the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole sensor.
6. The system according to claim 1, wherein the characteristics of the laser beam to be measured include spot size, shape, and irradiance within the spot size.
7. The system according to claim 1, wherein the calibration plate is used to pre-define the field of view of the laser.
8. A system for analyzing the characteristics of a laser beam at both ends of a field of view or at other selected positions in a high-speed laser motion system, the high-speed laser motion system having a laser for generating a laser beam and a build platform disposed at a predetermined position with respect to the laser beam, the system comprising: (a) A portable test device, the portable test device including a support having an upper surface, the upper surface being disposed parallel to and above the build platform of the high-speed laser motion system, the upper surface being adapted to receive and absorb the laser light generated by the laser beam; (b) The known or pre-defined field of view of the laser, wherein the laser beam characteristics are known or determined at the central position of the field of view; (c) A plurality of pinhole sensors attached to both ends of the field of view within the support such that each pinhole sensor is arranged to receive the laser light generated by the laser beam, (1) each pinhole sensor measures the characteristics of the laser beam at both ends of the field of view, (2) the difference between the laser beam characteristics at the central position and the laser beam characteristics at both ends of the field of view is incorporated into and grasped by the high-speed laser motion system during processing, and the necessary adjustments in processing are made based on the difference. the plurality of pinhole sensors and having.
9. The system according to claim 8, wherein the system further comprises: A system having an optical fiber cable coupled to each pinhole sensor, each optical fiber cable having a proximal end through which the laser light is received through the pinhole sensor and a distal end from which the laser light is transmitted.
10. In the system according to claim 9, the system further has a photodetector disposed at the distal end of each optical fiber cable, the photodetector converting the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole sensor.
11. In the system according to claim 8, the characteristics of the laser beam to be measured include spot size, shape, and irradiance within the spot size.
12. In the system according to claim 8, the calibration plate is used to pre-define the field of view of the laser.
13. A method for analyzing the characteristics of a laser beam at both ends or other selected positions of a field of view in a high-speed laser motion system, the high-speed laser motion system having a laser that generates a non-steady laser beam and a build platform disposed at a predetermined position with respect to the non-steady laser beam, the method comprising: (a) defining the field of view of the laser; (b) attaching a plurality of pinhole sensors at both ends of the field of view such that each pinhole sensor receives the laser light generated by the non-steady laser beam; (c) measuring the characteristics of the laser beam at both ends of the field of view through each pinhole sensor; (d) capturing and grasping the difference between the characteristics of the laser beam at both ends of the field of view and the characteristics of the laser beam at a known or determined central position of the field of view during processing; (e) making adjustments necessary for processing based on the difference. A method having.
14. In the method according to claim 13, further comprises coupling an optical fiber cable to each pinhole sensor, each optical fiber cable having a proximal end through which the laser light is received through the pinhole sensor and a distal end to which the laser light is irradiated.
15. In the method according to claim 14, further A method having a step of disposing a photodetector at the distal end of each optical fiber cable, wherein the photodetector converts the laser light sent to the photodetector into a voltage output signal based on the intensity of the laser light received through each pinhole sensor.
16. The method according to claim 13, wherein the characteristics of the laser beam to be measured include spot size, shape, and irradiance within the spot size.
17. The method according to claim 13, wherein a calibration plate is used to define the field of view of the laser.
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