Modules and related methods for a delivery system

Abstract

A system comprising a chemical substance supply cabinet (e.g., a chemical substance supply cabinet configured to accommodate ampoules, etc.), a module configured to modify a surface, and a control unit connected to the module, wherein the control unit is configured to instruct the modification of the surface.

Description

Technical Field

[0001] The present disclosure generally relates to delivery systems.

[0002] Related Literature The present disclosure claims the benefit of U.S. Provisional Patent Application No. 63 / 356,256, filed Jun. 28, 2022, which is hereby incorporated by reference herein.

Background Art

[0003] Delivery systems designed for the transport of solid precursor materials can be used in manufacturing processes. Such systems can include an ampoule configured to contain a solid precursor material.

Summary of the Invention

[0004] Delivery systems designed to transport vapor from solid or liquid precursor materials can be used in manufacturing processes. The delivery systems can be placed within an enclosure or cabinet to isolate different potential hazards from each other and from occupied manufacturing areas. Some examples include separating potential leaks of toxic or flammable vapors from ignition sources or human interaction. The delivery systems can also be placed in different parts of a factory, such as a sub-manufacturing area of a semiconductor manufacturing plant. Such delivery systems can include an ampoule configured to contain a solid precursor material.

[0005] In addition to being potentially toxic or flammable, vapors can also be corrosive. In the case of vapors that are corrosive or reactive to piping from the cabinet to the point of use or to "wet" surfaces, surface treatments and coatings can be used to inhibit or eliminate corrosion or reaction. Currently available surface treatments and coatings are time-consuming and sometimes require dangerous procedures to effectively coat or treat all wet surfaces from, or including, all of the delivery system, piping from one area of the factory to another, and the desired surfaces at the time of vapor use. Further, the installation and removal of surface treatment systems can cause contamination and may leave small areas of wet surfaces untreated.

[0006] Vapors delivered from a chemical supply cabinet can be corrosive. In some instances, when tool or line maintenance is performed, the line is exposed to shop air. The line is fully pump purged at an elevated temperature, but reaction by-products (e.g., FeCl3 or CrCl3) still remain on the surface. The reaction by-products can cause corrosion during exposure to shop air or during subsequent elevated temperature cycles.

[0007] Some embodiments of the delivery system include a chemical supply cabinet (e.g., a chemical supply cabinet configured to house an ampule such as an ampule containing a vapor source material) and a module configured to modify a surface. In some embodiments, a control unit can be connected to the module and the control unit is configured to direct the modification of the surface.

[0008] In some instances, coatings can be applied to components prior to installation, thereby significantly reducing corrosion. However, some lines are very long and are welded in place from a sub-manufacturing process or installation. Other parts of the delivery system, such as lines and manifolds, may have uncoated connections.

[0009] One solution is to coat the components of the manufacturing system after the manufacturing system is fully installed. The wet components can be heated, including the lines and / or valves from the chemical supply cabinet to the tool, the lines and / or valves within the cabinet, and / or the lines and / or valves within the tool. The coating can be performed with the original equipment of the manufacturing system. Recoating can be performed after a specific maintenance event, after a predetermined amount of time, and / or after a specific event (e.g., detection of corrosion on the surface of the manufacturing system including the delivery system or tool). Other surface treatment options such as surface deposition of vapors such as fluorine (F2) or nitrogen (N2) can also be incorporated into the cabinet.

[0010] At least some of these embodiments of the delivery system are used in atomic layer deposition (ALD), chemical vapor deposition (CVD), or both processes. The solid precursor materials can be used in the fabrication of microelectronic devices. In some embodiments, the solid precursor materials are various organic precursors, inorganic precursors, metal organic precursors, or combinations thereof.

[0011] In some aspects, the technology described herein relates to a system including a chemical supply cabinet, a module configured to modify a surface, and a control unit connected to the module, the control unit being configured to direct the modification of the surface.

[0012] In some aspects, the technology described herein relates to a system configured such that the system is connected to a semiconductor processing tool.

[0013] In some aspects, the technology described herein relates to a system in which the surface includes the inner surface of a semiconductor processing tool.

[0014] In some aspects, the technology described herein relates to a system in which the module is configured to modify the surface by changing the composition of the surface.

[0015] In some aspects, the technology described herein relates to a system in which a module is configured to modify a surface by forming a coating on the surface.

[0016] In some aspects, the technology described herein relates to a system in which the module is an atomic layer deposition coating module.

[0017] In some aspects, the technology described herein relates to a system in which a module is configured to be connected to a chemical supply cabinet from outside the chemical supply cabinet.

[0018] In some aspects, the technology described herein relates to a system in which a control unit is configured to automatically instruct a module to modify a surface of the system.

[0019] In some aspects, the technology described herein relates to a method including connecting a module to a chemical supply cabinet, controlling the module to modify a surface after connecting the module to the chemical supply cabinet, and modifying the surface via the module.

[0020] In some aspects, the technology described herein relates to a method in which the module is an atomic layer deposition coating module.

[0021] In some aspects, the technology described herein relates to a method in which modifying a surface includes forming a coating on the surface.

[0022] In some aspects, the technology described herein relates to a method in which forming a coating on a surface includes using atomic layer deposition.

[0023] In some aspects, the techniques described herein relate to a method further including connecting an ampoule to a chemical supply cabinet, connecting a supply line to the chemical supply cabinet, connecting a tool to the supply line, or a combination thereof.

[0024] In some aspects, the techniques described herein relate to a method including connecting a module to a chemical supply cabinet while leaving the module outside the chemical supply cabinet.

[0025] In some aspects, the techniques described herein relate to a method including controlling a module, including controlling the module via a control unit to automatically modify a surface.

[0026] In some aspects, the techniques described herein relate to a system including a chemical supply cabinet having a structure that defines an internal volume of the chemical supply cabinet, a module connected to the internal volume of the chemical supply cabinet, a tool connected to the module, and a supply line connecting the chemical supply cabinet to the tool, wherein the module is configured to modify a surface after connecting the module to the chemical supply cabinet.

[0027] In some aspects, the techniques described herein relate to a system in which a control unit is connected to a module and is configured to direct the module.

[0028] In some aspects, the techniques described herein relate to a system in which the module is an atomic layer deposition coating module.

[0029] In some aspects, the techniques described herein relate to a system in which the tool is a semiconductor processing tool.

[0030] In some aspects, the technology described herein relates to a system where the surface includes the inner surface of a chemical supply cabinet, the inner surface of a supply line, the wetted surface of a tool, or a combination thereof.

[0031] Some embodiments of the present disclosure will be described herein by way of example with reference to the accompanying drawings. Referring specifically to the drawings in detail, it is emphasized that the embodiments shown are illustrative only and are for the purpose of providing an exemplary description of the embodiments of the present disclosure. In this regard, the description made using the drawings will clarify to those skilled in the art how the embodiments of the present disclosure can be implemented. Like numbers represent the same or similar parts throughout.

Brief Description of the Drawings

[0032]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0033] Among these disclosed advantages and improvements, other objects and advantages of the present disclosure will become apparent from the following description in conjunction with the accompanying drawings. Although detailed embodiments of the present disclosure are disclosed herein, it should be understood that the disclosed embodiments are merely exemplary of the present disclosure that can be embodied in various forms. Furthermore, each of the examples given with respect to the various embodiments of the present disclosure is intended to be illustrative and not limiting.

[0034] Throughout the specification and the claims, the following terms take the meanings explicitly associated herein, unless the context clearly indicates otherwise. As used herein, the phrases "in one embodiment," "in embodiments," and "in some embodiments" do not necessarily refer to the same embodiment, but may. Further, as used herein, the phrases "in another embodiment" and "in some other embodiments" do not necessarily refer to different embodiments, but may. All embodiments of the present disclosure are intended to be combinable without departing from the scope or spirit of the present disclosure.

[0035] As used herein, the term "ampoule" means a sealed container that holds a chemical substance (e.g., a liquid chemical substance, a solid chemical substance, or a gaseous chemical substance).

[0036] As used herein, the term "based on" is not exclusive and allows for being based on additional factors not recited, unless the context clearly dictates otherwise. Further, throughout this specification, the meanings of "a," "an," and "the" include plural references. The meaning of "in" includes "in" and "on."

[0037] As used herein, the term "between" does not necessarily require being disposed immediately adjacent to other elements. Generally, this term means a configuration where something is sandwiched between two or more other things. At the same time, the term "between" can represent something that is immediately adjacent to one of two opposing things. Thus, in any one or more of the embodiments disclosed herein, a particular structural component disposed between two other structural elements is disposed directly between both of the two other structural elements such that the particular structural component is in direct contact with both of the two other structural elements; is disposed immediately adjacent to only one of the two other structural elements such that the particular structural component is in direct contact with only one of the two other structural elements; A particular structural component is disposed indirectly adjacent to only one of two other structural elements such that it does not contact directly only one of the two other structural elements, and there is another element juxtaposing the particular structural component and only one of the two other structural elements; A particular structural component is disposed indirectly between both of two other structural elements such that it does not contact directly both of the two other structural elements, and other features may be disposed therebetween; or It can be any combination thereof.

[0038] As used herein, "embedded" means that a first material is distributed throughout a second material.

[0039] FIG. 1 shows a manufacturing system 100 having a delivery system 102 according to some embodiments. The delivery system 102 includes a chemical supply cabinet 110 and a supply line 120. The manufacturing system 100 further includes a tool 130, a vacuum pump line 140, and a vacuum pump 150. The chemical supply cabinet 110 includes a first ampoule 112A, a second ampoule 112B (collectively referred to as ampoules 112), a module 114, and a control unit 116. In some embodiments, the chemical supply cabinet 110 does not include a control unit 116.

[0040] Ampoule 112 is configured to modify the surface by changing the surface composition (e.g., chemical composition). In some embodiments, the surface is the surface of the manufacturing system 100. For example, the surface can be all the wetted surfaces of the manufacturing system 100. In some embodiments, the wetted surfaces of the manufacturing system 100 include the inner surfaces within the chemical supply cabinet 110 (e.g., the processing lines of the chemical supply cabinet 110), the inner surfaces of the supply lines 120, and the wetted surfaces of the tool 130. In some embodiments, the surface is the surface of the delivery system 102 (i.e., the surfaces within the chemical supply cabinet 110 and the supply lines 120) and the tool 130. The surface of the chemical supply cabinet 110 can refer to the lines of the chemical supply cabinet 110. For example, refer to the processing line 260 of the chemical supply cabinet 210 in FIG. 2, the processing line 360 of the supply cabinet 310 in FIG. 3, and the processing line 460 of the module 414 in FIG. 4.

[0041] In some embodiments, the structure of the chemical supply cabinet 110 defines the internal volume of the chemical supply cabinet 110. In some embodiments, the module 114 is connected to the internal volume of the chemical supply cabinet 110. In some embodiments, the tool 130 can be connected to the module 114 (e.g., via a processing line). In some embodiments, the supply line 120 connects the chemical supply cabinet 110 to the tool 130. In some embodiments, after connecting the module 114 to the chemical supply cabinet 110 (the module 114 can remain outside the chemical supply cabinet 110 or can be located inside the chemical supply cabinet 110), the module 114 is configured to modify the surface.

[0042] In some embodiments, the ampoule 112 is a precursor ampoule. In some embodiments, the first ampoule 112A and the second ampoule 112B are the same ampoule. In some embodiments, the first ampoule 112A and the second ampoule 112B are different. For example, the first ampoule 112A and the second ampoule 112B may differ from each other in size, shape, and content. In some embodiments, the ampoule 112 is a metal (e.g., a sealed metal container). The ampoule 112 is not limited to a particular shape and / or size.

[0043] In some embodiments, the precursor includes a precursor that can be vaporized by the application of thermal energy and irradiation. The vaporizable precursor may exist as a solid, as a liquid, or as a solid and a liquid. For example, in some embodiments, the vaporizable precursor includes a vaporizable solid precursor. In some embodiments, the vaporizable precursor includes a vaporizable liquid precursor. In some embodiments, the vaporizable precursor includes a vaporizable solid precursor and a vaporizable liquid precursor. It will be understood that other types of vaporizable precursors may be used herein without departing from the scope of the present disclosure.

[0044] The vaporizable precursor can include, consist of, or consist essentially of at least one of elemental metals, metal halides, metal oxyhalides, organometallic compounds, organometallic complexes, or any combination thereof.

[0045] In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one or any combination of dimethylhydrazine, trimethylaluminum (TMA), hafnium chloride (HfCl4), zirconium chloride (ZrCl4), indium trichloride, indium monochloride, aluminum trichloride, titanium iodide, tungsten carbonyl, Ba(DPM)2, bis(dipivaloylmethanato)strontium (Sr(DPM)2), TiO(DPM)2, tetrakis(dipivaloylmethanato)zirconium (Zr(DPM)4), decaborane, octadecaborane, indium, antimony, sodium tetrafluoroborate, a precursor incorporating an alkylamidinato ligand, a metalorganic precursor, zirconium tert-butoxide (Zr(t-OBu)4), tetrakis(diethylamino)zirconium (Zr(Net2)4), tetrakis(diethylamino)hafnium (Hf(Net2)4), tetrakis(dimethylamino)titanium (TDMAT), tert-butylimino tris(diethylamino)tantalum (TBTDET), pentakis(dimethylamino)tantalum (PDMAT), pentakis(ethylmethylamino)tantalum (PEMAT), tetrakis(dimethylamino)zirconium (Zr(NMe2)4), hafnium tert-butoxide (Hf(tOBu)4), xenon difluoride (XeF2), xenon tetrafluoride (XeF4), xenon hexafluoride (XeF6).

[0046] In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of decaborane, hafnium tetrachloride, zirconium tetrachloride, indium trichloride, metal-organic β-diketonate complexes, tungsten hexafluoride, cyclopentadienylcycloheptatriene titanium (CpTiCht), aluminum trichloride, titanium iodide, cyclooctatetraene cyclopentadienyl titanium, biscyclopentadienyl titanium diazide, trimethyl gallium, trimethyl indium, an alkyl aluminum such as trimethyl aluminum, triethyl aluminum, trimethylamine alane, dimethyl zinc, tetramethyl tin, trimethyl antimony, diethyl cadmium, tungsten carbonyl, or any combination thereof.

[0047] In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of elemental boron, phosphorus, decaborane, gallium halides, indium halides, antimony halides, arsenic halides, gallium halides, aluminum iodide, titanium iodide, MoO2Cl2, MoOCl4, MoCl5, WCl5, WOCl4, WCl6, cyclopentadienylcycloheptatriene titanium (CpTiCht), cyclooctatetraene cyclopentadienyl titanium, biscyclopentadienyl titanium diazide, In(CH3)2(hfac), dibromomethylstibine, tungsten carbonyl, metal-organic β-diketonate complexes, metal-organic alkoxide complexes, metal-organic carboxylate complexes, metal-organic aryl complexes, metal-organic amide complexes, or any combination thereof. In some embodiments, the vaporizable precursor comprises, consists of, or consists essentially of at least one of MoO2Cl2, MoOCl4, WO2Cl2, WOCl4, or any combination thereof.

[0048] In some embodiments, the vaporizable precursor is, for example, but not limited to, decaborane (B 10 14H), pentaborane (B5H9), octadecaborane (B18H22 )、At least one or any combination of boric acid (H3BO3), SbCl3, and SbCl5, including at least one of any type of source material that can be liquefied by heating or solubilizing in a solvent, consisting of, or essentially consisting of. In some embodiments, the volatile precursor is AsCl3, AsBr3, AsF3, AsF5, AsH3, As4O6, As2Se3m As2S2, As2S3, As2S5, As2Te3, B4H 11 , B4H 10 , B3H6N3, BBr3, BCl3, BF3, BF3.O(C2H5)2, BF3.HOCH3, B2H6, F2, HF, GeBr4, GeCl4, GeF4, GeH4, H2, HCl, H2Se, H2Te, H2S, WF6, SiH4, SiH2Cl2, SiHCl3, SiCl4, SiH3Cl, NH3, NH3, Ar, Br2, HBr, BrF5, CO2, CO, COCl2, COF2, Cl2, ClF3, CF4, C2F6, C3F8, C4F8, C5F8, CHF3, CH2F2, CH3F, CH4, SiH6, He, HCN, Kr, Ne, Ni(CO)4, HNO3, NO, N2, NO2, NF3, N2O, C8H 24 O4Si4, PH3, POCl3, PCl5, PF3, PFS, SbH3, SO2, SF6, SF4, Si(OC2H5)4, C4H16Si4O4, Si(CH3)4, SiH(CH3)3, TiCl4, Xe, SiF4, WOF4, TaBr5, TaCl5, TaF5, Sb(C2H5)3, Sb(CH3)3, In(CH3)3, PBr5, PBr3, RuF5, including at least one or any combination of at least one of them, consisting of, or essentially consisting of.

[0049] In some embodiments, module 114 can modify the surface by forming a coating on the surface. For example, module 114 can modify the surface by coating the inner surface of the wet flow path. In some embodiments, module 114 is an atomic layer deposition coating module.

[0050] In some embodiments, module 114 can be used to provide other surface treatment options in addition to providing a coating. For example, module 114 can be used to provide passivation of delivery system 102 as well as manufacturing system 100. The surface material can react with the vapor to form a chemically resistant layer. Some examples of useful reactions are those that form or improve passive oxide layers such as trioxygen (O3), peroxide, or permanganate. Other reactions can form stable carbides or nitrides on the surface, such as those from nitrogen (N2), methane, ammonia, etc. Additional reactions can form stable halides on the surface, such as those from fluorine (F2), NF3 plasma or XeF2. Other useful reactions can leave a surface terminated with inert species, as is well known from hexamethyldisilane.

[0051] In some embodiments, modifying the surface includes applying a chemical source from module 114 to a surface within manufacturing system 100, such as delivery system 102 (e.g., chemical supply cabinet 110).

[0052] In some embodiments, modifying the surface can include exposing the surface to a single chemical species that passivates or chemisorbs to the surface. The surface modification can include periodic exposure to at least two different species (e.g., fluorine (F2) and nitrogen (N2)).

[0053] In some embodiments, modifying the surface includes surface modification that does not add material to the surface. For example, modifying the surface can include modifying the surface without adding a specific coating.

[0054] In some embodiments, a plurality of modules 114 can be used. In some embodiments, the plurality of modules 114 may be the same as each other. In some embodiments, the plurality of modules 114 may be different from each other. For example, the first module 114 can be a coating module (e.g., an atomic layer deposition coating module), and the second module 114 can be a vapor deposition module (e.g., a chemical vapor deposition module).

[0055] In some embodiments, the module 114 can be connected to the chemical substance supply cabinet 110 from outside the chemical substance supply cabinet 110. Alternatively, the module 114 can be connected to the chemical substance supply cabinet 110 from inside the chemical substance supply cabinet 110.

[0056] The control unit 116 includes a microprocessor having a non-volatile program memory and a read / write memory for variable storage. In some embodiments, the control unit 116 is configured to automatically instruct the module 114 to modify a surface (e.g., the surface of the manufacturing system 100). In some embodiments, the control unit 116 is connected to the module 114 via Wi-Fi, Bluetooth, a network, the cloud, etc. For example, the control unit 116 can be physically separated from the module 114 and connected via Wi-Fi, Bluetooth, a network, the cloud, etc. In some embodiments, the control unit 116 controls the module 114 by controlling the module 114 via the control unit 116 to automatically modify the surface. The control unit 116 can also be used to manually control the module 114.

[0057] In some embodiments, the control unit 116 is used to control the passivation process when the module 114 is used to change the composition of the surface. For example, the control unit 116 can be used to automate the passivation process. In some embodiments, the passivation process includes the following steps. The first step can be to separate the ampoule 112 (e.g., a chemical ampoule) within the chemical supply cabinet 110 (e.g., via a valve function). The second step can include purging the supply line 120. In some embodiments, purging may require establishing a connection to a pump (downstream of the tool 130). In some embodiments, it may not be desirable to modify (e.g., coat) the inner surface of the tool 130. In some embodiments, this can be achieved by establishing a bypass connection (via various valve switching functions) so that the materials (e.g., chemicals) required for the modification / coating do not pump through the tool 130.

[0058] The third step can include releasing the module 114 to perform a modification / coating / passivation sequence. In some embodiments, multiple modules 114 are used during the execution of the modification / coating / passivation sequence. In some embodiments, the sequence can include at least two options. These options include the use of a processing line connected to the module 114. The processing line connecting the module 114 and the supply line 120 can include a gas line, a manifold, valves, orifices, pressure transducers, and other supply line mechanisms.

[0059] Option 1 can include the following steps: (i) establishing a carrier gas flow (e.g., an inert gas called "Chemical A" such as nitrogen or argon); (ii) "n" times [pulsing the carrier gas (e.g., "Chemical A") for "x" seconds - waiting - pulsing "Chemical B" for "y" seconds - waiting]; in some embodiments, all of this must pass through a bypass line before entering tool 130. In some embodiments, the "waiting" is about 5 to 60 seconds. In some embodiments, "n" is between 1 and 10,000. In some embodiments, the "x" and "y" seconds can vary from less than 1 second to more than 120 seconds.

[0060] In some embodiments, Option 1 can provide a thickness in the range of 1 nanometer to 1 micron. In some embodiments, the thickness is in the range of 20 nanometers to 120 nanometers.

[0061] In the case of Option 1, "Chemical A" and "Chemical B" are different from each other. Chemical A and Chemical B can be any compound or chemical element described herein.

[0062] In some embodiments, the method can include the step of purging or exhausting the carrier gas (e.g., "Chemical A") after pulsing the carrier gas for "x" seconds and after "waiting". Purging can include flowing a new gas to push out "Chemical A". Exhausting can include evacuating to draw out "Chemical A". Similarly, the method can include purging or exhausting "Chemical B" after pulsing "Chemical B" for "y" seconds.

[0063] Option 2 can include the following steps: (i) closing the pump valve; (ii) pulsing "Chemical A" for "x" seconds - waiting (for a long time (e.g., from several minutes to several hours)); (iii) opening the pump valve and then discharging or purging "Chemical A"; (iv) repeating steps (i) to (iii) "n" times. In some embodiments, the "waiting" is about 5 seconds to 60 seconds. In some embodiments, "n" can range from 1 to 10,000. In some embodiments, "x" seconds can vary from less than 1 second to more than 120 seconds. "Chemical A" can be any compound or chemical element described herein.

[0064] In some embodiments, Option 2 can provide a single monolayer or multiple monolayers. In some embodiments, the single monolayer can have a thickness of up to 50 nanometers. In some embodiments, the multiple monolayers can have a cumulative thickness of several microns.

[0065] In some embodiments, coatings of the present disclosure, such as protective coatings, can include one or more of coating materials selected from the group consisting of Al2O3, oxides of the formula MO (where M is Ca, Mg, or Be); oxides of the formula M’O2 (where M’ is a stoichiometrically acceptable metal); and oxides of the formula Ln2O3 (where Ln is a lanthanide element, such as La, Sc, or Y). More generally, the coating can include a metal oxide for which the free energy of reaction with a material that contacts the surface (e.g., a metal surface) during operation of the system is 0 or greater.

[0066] In various embodiments, the metal oxides, nitrides, or halides may include at least one oxide, nitride, or halide of one or more of Cr, Fe, Co, and Ni. In other embodiments, they may include at least one oxide, nitride, or halide of one or more of Cr, Fe, and Ni, or any other suitable metal oxide, nitride, or halide species. Gases that react with the metal oxides, nitrides, or halides to form reaction products harmful to the structure, material, or system and its use or operation may include Al2Cl6, WCl5, MoCl5, WCl6, MoO2Cl2, MoOCl4, or WOCl4.

[0067] The coatings in the foregoing methods (such as protective coatings applied to the surface) can include one or more of coating materials selected from the group consisting of Al2O3, oxides of the formula MO (where M is Ca, Mg, or Be); oxides of the formula M’O2 (where M’ is a stoichiometrically acceptable metal); and oxides of the formula Ln2O3 (where Ln is a lanthanide element, such as La, Sc, or Y). More generally, the protective coating can include a metal oxide for which the free energy of reaction with a gas in contact with the surface (e.g., a metal surface) during the use or operation of the structure, material, or system is 0 or greater.

[0068] The fourth step can include purging the supply line 120 by closing at least one module 114 (e.g., the module 114 can be a reactant source for the delivery system 102), simply pumping (through a bypass line), or using a pump and purge cycle with an inert gas introduced from the chemical supply cabinet 110 (e.g., refer to the inert gas line 270 in FIG. 2 and the inert gas line 370 in FIG. 3).

[0069] The fifth step can include performing a leak-back sequence of the supply line 120.

[0070] The sixth step can include opening the ampoule 112 (e.g., a chemical ampoule) within the chemical substance supply cabinet 110 (e.g., via a valve function), and, if necessary, pulsing (within the tool 130 or still via a bypass connection) to re - establish the appropriate chemical gas line state of the supply line 120.

[0071] The supply line 120 can include a gas line, a manifold, valves, orifices, pressure transducers, and other supply line mechanisms.

[0072] In some embodiments, the tool 130 can be a processing tool such as a semiconductor processing tool. In some embodiments, the surface can be the surface of the tool 130 (e.g., the surface of a semiconductor processing tool).

[0073] The vacuum pump line 140 can include a gas line, a manifold, valves, orifices, pressure transducers, and other supply line mechanisms.

[0074] FIG. 2 shows the delivery system 202. For the sake of brevity in this specification, unless otherwise specified, the features of the delivery system 202 described above in FIG. 1 will not be re - described in further detail. The delivery system 202 includes a chemical substance supply cabinet 210 and a supply line 220. The chemical substance supply cabinet 210 can include a first ampoule 212A, a second ampoule 212B (collectively referred to as ampoule 212), a module 214, a control unit 216, a processing line 260, and an inert gas line 270. In some embodiments, the chemical substance supply cabinet 110 does not include a control unit 116.

[0075] In some embodiments, only one ampoule is connected to the supply line 220. For example, after the first ampoule 212A is emptied, the first ampoule 212A can be disconnected from the supply line 220. Next, the second ampoule 212B can be connected to the supply line 220. The processing line 260 can include a gas line, a manifold, valves, orifices, pressure transducers, and other supply line mechanisms.

[0076] FIG. 3 shows a delivery system 302. For the sake of brevity, and unless otherwise specified, the features of the delivery system 302 described above in FIGS. 1 and 2 respectively will not be re-described in further detail. The delivery system 302 includes a chemical supply cabinet 310 and a supply line 320. The chemical supply cabinet 310 can include an ampoule 312, a module 314, a control unit 316, a processing line 360, and an inert gas line 370. In some embodiments, the delivery system 302 does not include a control unit 316. During use of the delivery system 302, the ampoule 312 can be disconnected from the processing line 360 and the module 314 can be connected to the processing line 360. Alternatively, the ampoule 312 can be connected to the processing line 360 and the module 314 can be disconnected from the processing line 360.

[0077] Figure 4 shows module 414. For the sake of simplicity of this specification, unless otherwise specified, the features of module 414 described above in each of FIGS. 1-3 will not be re-described in further detail. In some embodiments, module 414 can be an atomic layer deposition coating module. Module 414 can include a precursor source 406 and a co-reactant source 408. In some embodiments, precursor source 406 and / or co-reactant source 408 can be ampoules. Module 414 can include an inert gas line 470A connected to precursor source 406. Module 414 can include an inert gas line 470B connected to co-reactant source 408. Module 414 can include a processing line 460 configured to be inserted into a chemical supply cabinet (e.g., supply cabinet 110, supply cabinet 210, or supply cabinet 310) to connect to another device such as a supply line (e.g., supply line 120, supply line 220, or supply line 320).

[0078] In some embodiments, instead of being inserted into the chemical supply cabinet, module 414 can be connected to the chemical supply cabinet externally.

[0079] Figure 5 shows an exemplary flowchart according to some embodiments of a method 500 for modifying a surface. The method includes connecting a module to a chemical supply cabinet 510. The method further includes controlling the module to modify the surface 520 after connecting the module to the chemical supply cabinet. The method further includes modifying the surface by modifying the surface via the module 530.

[0080] In some embodiments, the module is an atomic layer deposition coating module. Modifying the surface can include forming a coating on the surface. Forming a coating on the surface can include using atomic layer deposition.

[0081] In some embodiments, the module is a chemical vapor deposition module. Modifying the surface includes, for example, changing the composition of the surface via vapor from the chemical vapor deposition module.

[0082] In some embodiments, method 500 includes connecting an ampoule to a chemical supply cabinet, connecting a supply line to the chemical supply cabinet, connecting a tool to the supply line, or combinations thereof. In some embodiments, connecting the module to the chemical supply cabinet includes connecting the module to the chemical supply cabinet while leaving the module outside the chemical supply cabinet. In some embodiments, method 500 includes controlling the module, for example, the surface. Controlling the module via a control unit to automatically modify the module.

[0083] Aspect The following describes various aspects. It should be understood that any one or more of the features described in the following aspects can be combined with any one or more of the other aspects.

[0084] Aspect 1. A system comprising a chemical supply cabinet, a module configured to modify a surface, and a control unit connected to the module, the control unit being configured to instruct the modification of the surface.

[0085] Aspect 2. The system according to aspect 1, wherein the system is configured to be connected to a semiconductor processing tool.

[0086] Aspect 3. The system according to aspect 1 or aspect 2, wherein the surface includes the inner surface of a semiconductor processing tool.

[0087] Aspect 4. The system according to any one of aspects 1 to 3, wherein the module is configured to modify the surface by changing the composition of the surface.

[0088] Aspect 5. The system according to any one of Aspects 1 to 4, wherein the module is configured to modify the surface by forming a coating on the surface.

[0089] Aspect 6. The system according to any one of Aspects 1 to 5, wherein the module is an atomic layer deposition coating module.

[0090] Aspect 7. The system according to any one of Aspects 1 to 6, wherein the module is configured to be connected to the chemical substance supply cabinet from outside the chemical substance supply cabinet.

[0091] Aspect 8. The system according to any one of Aspects 1 to 7, wherein the control unit is configured to automatically instruct the module to modify the surface of the system.

[0092] Aspect 9. A method comprising connecting a module to a chemical substance supply cabinet, controlling the module to modify the surface after connecting the module to the chemical substance supply cabinet, and modifying the surface via the module.

[0093] Aspect 10. The method according to Aspect 9, wherein the module is an atomic layer deposition coating module.

[0094] Aspect 11. The method according to Aspect 9 or 10, wherein modifying the surface includes forming a coating on the surface.

[0095] Aspect 12. The method according to Aspect 11, wherein forming a coating on the surface includes using atomic layer deposition.

[0096] Aspect 13. The method according to any one of Aspects 9 to 12, further comprising connecting an ampoule to the chemical substance supply cabinet, connecting a supply line to the chemical substance supply cabinet, connecting a tool to the supply line, or a combination thereof.

[0097] Aspect 14. The method according to any one of Aspects 9 to 13, wherein connecting the module to the chemical substance supply cabinet includes connecting the module to the chemical substance supply cabinet while leaving the module outside the chemical substance supply cabinet.

[0098] Aspect 15. The method according to any one of Aspects 9 to 14, wherein controlling the module includes controlling the module via a control unit to automatically modify the surface.

[0099] Aspect 16. A system, comprising: a chemical substance supply cabinet, wherein the structure of the chemical substance supply cabinet defines the internal volume of the chemical substance supply cabinet; a module connected to the internal volume of the chemical substance supply cabinet; a tool connected to the module; and a supply line connecting the chemical substance supply cabinet to the tool. After connecting the module to the chemical substance supply cabinet, the module is configured to modify the surface.

[0100] Aspect 17. The system according to Aspect 16, wherein a control unit is connected to the module and is configured to instruct the module.

[0101] Aspect 18. The system according to Aspect 16 or Aspect 17, wherein the module is an atomic layer deposition coating module.

[0102] Aspect 19. The system according to any one of Aspects 16 to 18, wherein the tool is a semiconductor processing tool.

[0103] Aspect 20. The system according to any one of Aspects 16 to 19, wherein the surface includes the inner surface within the chemical substance supply cabinet, the inner surface of the supply line, the wetted surface of the tool, or a combination thereof.

[0104] The terms used in this specification are intended to describe embodiments and not to limit them. The terms "a", "an", and "the" include the plural unless otherwise specified. The terms "comprises" and / or "comprising" used herein specify the presence of the described features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, and / or components.

[0105] It should be understood that any of the embodiments, or any part thereof, may be combined with any of the other embodiments without departing from the scope of the present disclosure. Also, it should be understood that detailed changes to the construction materials utilized, as well as the shape, size, and arrangement of the components, may be made without departing from the scope of the present disclosure. This specification and the described embodiments are examples, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A system comprising: a chemical substance supply cabinet; a module configured to modify a surface; a control unit connected to the module, the control unit being configured to instruct the modification of the surface. The system according to claim 1.

2. The system according to claim 1, wherein the system is configured to be connected to a semiconductor processing tool.

3. The system according to claim 2, wherein the surface includes the inner surface of the semiconductor processing tool.

4. The system according to claim 1, wherein the module is configured to modify the surface by changing the composition of the surface.

5. The system according to claim 1, wherein the module is configured to modify the surface by forming a coating on the surface.

6. The system according to claim 1, wherein the module is an atomic layer deposition coating module.

7. The system according to claim 1, wherein the module is configured to be connected to the chemical substance supply cabinet from outside the chemical substance supply cabinet.

8. The system according to claim 1, wherein the control unit is configured to automatically instruct the module to modify the surface of the system.

9. Connecting a module to a chemical substance supply cabinet; After connecting the module to the chemical substance supply cabinet, controlling the module to modify a surface; Modifying the surface via the module. A method comprising the steps of:

10. The method according to claim 9, wherein the module is an atomic layer deposition coating module.

11. The method according to claim 9, wherein modifying the surface includes forming a coating on the surface.

12. The method according to claim 11, wherein forming the coating on the surface includes using atomic layer deposition.

13. The method according to claim 9, further comprising connecting an ampoule to the chemical substance supply cabinet, connecting a supply line to the chemical substance supply cabinet, connecting a tool to the supply line, or a combination thereof.

14. The method according to claim 9, wherein connecting the module to the chemical substance supply cabinet includes connecting the module to the chemical substance supply cabinet while leaving the module outside the chemical substance supply cabinet.

15. The method according to claim 9, wherein controlling the module includes controlling the module via a control unit to automatically modify the surface.

16. A system comprising: A chemical substance supply cabinet, wherein the structure of the chemical substance supply cabinet defines the internal volume of the chemical substance supply cabinet; A module connected to the internal volume of the chemical substance supply cabinet; A tool connected to the module; A supply line connecting the chemical substance supply cabinet to the tool and a system, wherein after connecting the module to the chemical substance supply cabinet, the module is configured to modify a surface.

17. The system according to claim 16, wherein a control unit is connected to the module and is configured to instruct the module.

18. The system according to claim 16, wherein the module is an atomic layer deposition coating module.

19. The system according to claim 16, wherein the tool is a semiconductor processing tool.

20. The system according to claim 16, wherein the surface includes the inner surface of the chemical substance supply cabinet, the inner surface of the supply line, the wetted surface of the tool, or a combination thereof.

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