LED Substrate Heater for Deposition Use

Abstract

A pedestal configured to deposit a material on a substrate includes a stem portion of the pedestal and a base portion of the pedestal attached to the stem portion of the pedestal. The base portion includes an array of optical elements configured to emit light to optically heat the substrate.

Description

Technical Field

[0001] [Cross - Reference to Related Applications] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 388,721, filed Jul. 13, 2022. The entire disclosure of the above application is incorporated herein by reference.

[0002] The present disclosure generally relates to semiconductor processing systems, and more particularly, to LED substrate heaters for deposition applications.

Background Art

[0003] The background description provided here is for the purpose of generally presenting the content of the present disclosure. Within the scope described in this background art section, the research by the inventors named at the present time, as well as aspects of the description that cannot be separately regarded as prior art at the time of filing, are not admitted as prior art against the present disclosure, whether explicitly or implicitly.

[0004] Substrate processing systems typically include multiple processing chambers (also called process modules) for performing processes such as deposition, etching, and other processes on substrates such as semiconductor wafers. Examples of processes that can be performed on a substrate include chemical vapor deposition (CVD), plasma - enhanced CVD (PECVD), chemically - enhanced plasma vapor deposition (CEPVD), atomic layer deposition (ALD), and plasma - enhanced ALD (PEALD). Further examples of processes that can be performed on a substrate include etching (e.g., chemical etching, plasma etching, reactive ion etching, etc.).

[0005] During processing, the substrate is placed on a pedestal, a substrate support such as an electrostatic chuck (ESC), or a susceptor within the processing chamber of the substrate processing system. In some processes, during deposition, a gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma can be struck to activate a chemical reaction. In other processes, during etching, a gas mixture containing an etching gas is introduced into the processing chamber, and a plasma can be struck to activate a chemical reaction. By using a computer-controlled robot, the substrate is transported from one processing chamber to another during the sequence of processing the substrate.

[0006] Atomic layer deposition (ALD) is a thin film deposition method in which a thin film is deposited on the surface of a material (e.g., the surface of a substrate such as a semiconductor wafer) by sequentially performing gas chemical processes. Most ALD reactions use at least two chemical substances called precursors (reactants), and the precursors react with the surface of the material in a self-limiting manner, one precursor at a time, sequentially. By repeatedly exposing to separate precursors, a thin film is gradually deposited on the surface of the material. Thermal ALD (T-ALD) is typically performed in a heated processing chamber. The processing chamber is maintained at a near-atmospheric pressure using a vacuum pump and a controlled flow of inert gas. The substrate to be coated with the film is placed in the processing chamber before starting the ALD process and brought into equilibrium with the temperature of the processing chamber. SUMMARY OF THE INVENTION

[0007] A pedestal configured to deposit a material on a substrate includes a stem portion of the pedestal and a base portion of the pedestal attached to the stem portion of the pedestal. The base portion includes an array of optical elements configured to emit light to optically heat the substrate.

[0008] In an additional feature, the optical element includes a light-emitting diode.

[0009] In an additional feature, the optical element includes a light-emitting diode configured to emit light having a wavelength between 530 nm and 1000 nm.

[0010] In an additional feature, the base portion and the array are on the same plane.

[0011] In an additional feature, the base portion and the array are circular, and the optical elements are arranged concentrically from the inner diameter to the outer diameter of the array.

[0012] In an additional feature, the base portion and the array are circular, and the outer diameter of the array is less than or equal to the outer diameter of the base portion.

[0013] In an additional feature, the base portion and the array are circular, and the outer diameter of the array is less than or equal to the outer diameter of the substrate.

[0014] In an additional feature, the base portion and the array are circular, and the outer diameter of the array is at least equal to the outer diameter of the substrate.

[0015] In an additional feature, the array is embedded in a cavity formed in the upper region of the base portion, and the array further includes an optically transparent window covering the optical element.

[0016] In an additional feature, the array further includes an optically transparent window having a first surface covering the optical element and a second surface facing the substrate.

[0017] In an additional feature, the optical element is disposed on a printed circuit board (PCB). The array further includes an optically transparent window hermetically attached to the PCB. A reflective material is disposed on the inner portion of the optical array to reflect light from the optical element to the substrate.

[0018] In an additional feature, the array further includes one or more drive circuits configured to control the power supply to the optical element.

[0019] In an additional feature, the array further includes one or more drive circuits configured to control the operation of selected ones of the optical elements.

[0020] In an additional feature, the array includes a printed circuit board on which the optical elements are disposed, and one or more drive circuits for driving the optical elements. The one or more drive circuits and the optical elements are disposed on the same surface of the printed circuit board.

[0021] In an additional feature, the array includes a printed circuit board on which the optical elements are disposed, and one or more drive circuits for driving the optical elements. The one or more drive circuits and the optical elements are disposed on opposite surfaces of the printed circuit board.

[0022] In an additional feature, the array includes a printed circuit board and a plurality of drive circuits for driving the optical elements. At least one of the optical elements and the drive circuits is disposed on the same surface of the printed circuit board. At least one of the drive circuits is disposed on the surface of the printed circuit board opposite to the surface on which the optical elements are disposed.

[0023] In an additional feature, the pedestal further includes a stem portion, a base portion, a shaft disposed through the center of the array, and an actuator coupled to the shaft and configured to move the substrate relative to the pedestal.

[0024] In an additional feature, the pedestal further includes a stem portion, a base portion, a shaft disposed through the center of the array, and an actuator coupled to the shaft and configured to move the substrate perpendicular to the plane in which the base portion is located.

[0025] In an additional feature, the pedestal further includes a stem portion, a base portion, a shaft disposed through the center of the array, and an actuator coupled to the shaft and configured to rotate the substrate relative to the base portion.

[0026] In an additional feature, the array further includes an optically transparent window that covers the optical element. The pedestal further includes a shaft and an actuator. The shaft is disposed through a stem portion, a base portion, and the center of the array. The shaft includes a conduit for receiving gas and a plurality of holes that are in fluid communication with the conduit in the vicinity of a first end of the shaft proximal to the array. The actuator is connected to a second end of the shaft and is configured to move the substrate perpendicular to the plane in which the base portion is located. The plurality of holes supply gas radially above the window when the shaft is raised above the array.

[0027] In an additional feature, the array further includes an optically transparent window having a first surface that covers the optical element and a second surface that faces the substrate. The window includes a plurality of mesas on the second surface.

[0028] In an additional feature, the array further includes an optically transparent window having a first surface that covers the optical element and a second surface that faces the substrate. The window includes a plurality of mesas spaced apart from the arrangement of the optical elements within the array and disposed on the second surface.

[0029] In an additional feature, the base portion and the array are circular. The optical elements are arranged concentrically from the inner diameter to the outer diameter of the array. The array further includes a circular and optically transparent window having a first surface that covers the optical element and a second surface that faces the substrate. The window includes a plurality of mesas arranged concentrically on the second surface and spaced apart from the optical elements.

[0030] In an additional feature, the pedestal further includes a shaft and an actuator. The shaft is disposed through a stem portion, a base portion, and the center of the array. The shaft includes a conduit for receiving gas and a plurality of holes that are in fluid communication with the conduit in the vicinity of a first end of the shaft proximal to the array. The actuator is connected to a second end of the shaft and is configured to move the substrate perpendicular to the plane in which the base portion is located. The plurality of holes supply gas radially above the window and the mesas when the shaft is raised above the array.

[0031] In an additional feature, the pedestal includes a plurality of conduits disposed within the stem portion and the base portion for receiving gas, and a plurality of holes located on the outer periphery of the base portion. The holes are at the same height as the mesa on the window and are in fluid communication with the conduits. The holes supply gas radially above the window and the mesa.

[0032] In an additional feature, the array further includes an optically transparent window covering the optical element, and a plurality of electrodes disposed within the window for electrostatically clamping the substrate to the pedestal.

[0033] In an additional feature, the window and the electrodes are on the same plane.

[0034] In an additional feature, the electrodes include an optically transparent and conductive material.

[0035] In an additional feature, the electrodes include a metal material. The electrodes include holes aligned with the optical elements.

[0036] In an additional feature, the pedestal further includes a layer of optically transparent and conductive material disposed between the electrodes and the optical elements.

[0037] In an additional feature, the window, the electrodes, the layer, and the optical elements are located within corresponding parallel planes parallel to the base portion of the pedestal.

[0038] In an additional feature, the pedestal further includes a layer of optically transparent and conductive material disposed within the window, one side of the layer facing the electrodes and the opposite side of the layer facing the optical elements.

[0039] In an additional feature, the window, the electrodes, the layer, and the optical elements are located within corresponding parallel planes parallel to the base portion of the pedestal.

[0040] In an additional feature, the pedestal further includes a plurality of conduits provided through the stem portion, the base portion, and the array, and a vacuum pump configured to clamp the substrate to the pedestal using vacuum clamping.

[0041] In an additional feature, the pedestal further includes a plurality of clamp pins disposed on the outer periphery of the base portion, and an actuator coupled to the clamp pins and configured to clamp the substrate.

[0042] In an additional feature, the pedestal further includes a ring disposed within the base portion adjacent to the array and coupled to the actuator, and a plurality of shafts disposed within the base portion. The shafts are coupled to the ring and attached to corresponding ones of the clamp pins.

[0043] In an additional feature, the shafts are disposed around the perimeter of the array.

[0044] In an additional feature, the shafts pass through the array.

[0045] In an additional feature, the actuator is configured to clamp the substrate by actuating the ring in a first direction and to unclamp the substrate by actuating the ring in a second direction.

[0046] In an additional feature, the array further includes an optically transparent window that covers the optical elements and extends to the outer periphery of the base portion. The pedestal further includes a plurality of clamp pins disposed on the window near the outer periphery of the base portion, and an actuator coupled to the clamp pins and configured to clamp the substrate.

[0047] In an additional feature, a method of depositing material on a substrate within a processing chamber, the method including loading the substrate into the processing chamber and optically heating the substrate using an array of optical elements embedded within a base portion of a pedestal within the processing chamber.

[0048] In an additional feature, the method further includes holding the substrate above the pedestal and preheating the substrate by supplying power at a first power level to the optical elements.

[0049] In an additional feature, the method further includes lowering the substrate onto the pedestal after preheating and heating the substrate by supplying power at a second power level different from the first power level to the optical element.

[0050] In an additional feature, the method further includes heating the substrate by supplying power at a second power level different from the first power level to the optical element after preheating and lowering the substrate onto the pedestal.

[0051] In an additional feature, the method further includes clamping the substrate to the pedestal using electrostatic clamping, vacuum clamping, or mechanical clamping.

[0052] In an additional feature, the method further includes establishing other conditions for processing the substrate. The other conditions include supplying gas flow and vapor flow through the showerhead, adjusting the substrate-showerhead gap, and exciting plasma within the processing chamber.

[0053] In an additional feature, the method further includes depositing a material onto the substrate using plasma enhanced chemical vapor deposition or atomic layer deposition.

[0054] In an additional feature, the method further includes reducing the power supplied to the array to a third power level.

[0055] In an additional feature, the method further includes lifting the substrate from the pedestal and removing the substrate from the processing chamber.

[0056] In additional features, the method further includes establishing other conditions for processing the substrate. The other conditions include supplying gas flow and vapor flow through the showerhead, adjusting the gap between the substrate and the showerhead, and exciting plasma in the processing chamber. The method further includes depositing a material on the substrate using plasma-enhanced chemical vapor deposition or atomic layer deposition. The method further includes lowering the power supplied to the array to a third power level. The method further includes lifting the substrate from the pedestal and removing the substrate from the processing chamber.

[0057] In additional features, the method further includes clamping the substrate to the pedestal using electrostatic clamping, vacuum clamping, or mechanical clamping. The method further includes establishing other conditions for processing the substrate. The other conditions include supplying gas flow and vapor flow through the showerhead, adjusting the gap between the substrate and the showerhead, and exciting plasma in the processing chamber. The method further includes depositing a material on the substrate using plasma-enhanced chemical vapor deposition or atomic layer deposition. The method further includes lowering the power supplied to the array to a third power level. The method further includes lifting the substrate from the pedestal and removing the substrate from the processing chamber.

[0058] In additional features, the method further includes placing the substrate on the pedestal and heating the substrate by supplying power to the array. The method further includes establishing other conditions for processing the substrate. The other conditions include supplying gas flow and vapor flow through the showerhead, adjusting the gap between the substrate and the showerhead, and exciting plasma in the processing chamber. The method further includes depositing a material on the substrate using plasma-enhanced chemical vapor deposition or atomic layer deposition. The method further includes lowering the power supplied to the array. The method further includes lifting the substrate from the pedestal and removing the substrate from the processing chamber.

[0059] Other applicable fields of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure.

Brief Description of the Drawings

[0060] The present disclosure will be more fully understood from the detailed description and the accompanying drawings.

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[0084] In the drawings, reference numerals may be reused to refer to like and / or identical elements.

Best Mode for Carrying Out the Invention

[0085] Typically, a resistively heated pedestal or susceptor is used to heat a substrate in a deposition application. The pedestal includes a heat conductor. The heat conductor is generally made of a metal such as aluminum and monolithically houses a heater element that heats the heat conductor. The heat conductor heats the substrate disposed on the pedestal during processing by diffusing the heat flux. The substrate is thermally coupled to the pedestal by gas conduction combined with radiation between the substrate and the heated pedestal.

[0086] A resistively heated pedestal has a limited ability to adjust or regulate locally heating the substrate in a recipe controllable manner. This is because it is difficult to implement heating elements for local heating in the monolithic body of the pedestal. Since the local heat diffusion by the heat conductor uniformly raises the overall temperature across the pedestal, the ability to adjust or regulate the local heating of the substrate is further limited. In contrast, it is difficult for a low thermal conductivity material such as ceramic to balance a sufficiently low thermal resistance that enables local heating with a sufficiently high fracture toughness and thermal shock resistance to prevent unintentional breakage.

[0087] Instead, the present disclosure provides an optical array, such as an LED array, disposed within or on a pedestal for heating a substrate. Unlike other heating elements, the optical array includes optical elements, such as LEDs, that can optically heat the substrate by emitting light. The optical array can adjust or regulate the local heating of the substrate in a recipe - controllable manner. The substrate can be heated by light of shorter wavelengths, but photo - induced corrosion may occur at wavelengths less than 530 nm. Thus, the wavelength for optical heating of the substrate is preferably selected between 530 nm and 1000 nm. Array - based heating provides heat uniformity adjustment, improves unit processes, and compensates for issues in upstream or downstream processes by providing recipe - controlled and highly adjustable substrate heating.

[0088] In vacuum deposition applications, the optical array is encapsulated within a sealed housing. Light from the optical array is generally shone onto the substrate through an optically transparent window formed of quartz or sapphire. In some examples, the substrate and the optical array may be stationary relative to each other. Alternatively, the substrate and the optical array may rotate relative to each other.

[0089] To prevent the optical transmission efficiency of the window from drifting due to parasitic deposition on the window's surface, the window needs to be kept clean. In applications where the substrate is placed directly on the window, a purging scheme, such as edge purging through an annular or ring arrangement of gas purge holes, can be used to keep the window clean. Alternatively, when the substrate is separated from the window and the process pressure is higher than a threshold (e.g., at least about 40 Torr), a cross - flow gas purge arrangement utilizing the Coanda effect can be used. Alternatively, the window may be subjected to periodic dry and / or wet chemical cleaning. These features can also be utilized in aqueous (wet) deposition applications.

[0090] From an environmental, social, and governance (ESG) perspective, LEDs exhibit superior performance compared to other heating elements. LED heating can be inefficient from the perspective of converting electricity to heat output. However, due to the low temperature of LEDs, LED heating can prevent radiative losses to the rest of the processing chamber. Additionally, a resistively heated pedestal or susceptor typically requires a significant amount of heating time for the initial establishment of a stable temperature and subsequent heating of the substrate. In contrast, LED heating does not require such a long heating time to heat the substrate. Further, during the maintenance cycle, a resistively heated pedestal typically requires a significant cooling time before maintenance can be performed. In contrast, the LED heater is cold and does not require such a long waiting period before maintenance can be performed. Additionally, the interior of the housing (e.g., the bottom and sides) can be formed of a reflective material (e.g., a reflective ring) and / or can include a reflective material (e.g., a reflective ring), thereby reflecting and / or directing the light emitted by the LEDs onto the substrate. By the heating directed by the LEDs, the optical array heats only the substrate and not the processing chamber. Further, LED heating can also provide discrete heating control for non-plasma applications that involve only heat. Thus, LED heating provides a more efficient wafer heating system than other forms of heating.

[0091] As described in detail below, the present disclosure provides various configurations of a pedestal that includes an LED array for heating a substrate in a deposition application. For example, the LED array can heat the substrate within the pedestal while utilizing different types of clamping systems to clamp the substrate to the pedestal. Examples of clamping systems include vacuum clamping, electrostatic clamping, and mechanical clamping. For each clamping system, various systems for rotating the substrate relative to the LED array are described. Further, for each clamping system and rotation system, various purging systems are described. These and other features of the present disclosure are described in detail below.

[0092] This disclosure is organized into multiple sections as follows. In Section 1, with reference to FIG. 1, an example of a system for substrate processing according to this disclosure is shown and described. The system provides an example of an environment in which various optical arrays and pedestals as shown and described with reference to FIGS. 2A to 13 can be implemented. In Section 2, with reference to FIGS. 2A to 2C, an example of an optical array used within the pedestal of the system of FIG. 1 for heating a substrate according to this disclosure is shown and described. In Section 3, with reference to FIGS. 3A and 3B, an example of a pedestal including an optical array used in the system of FIG. 1 for heating a substrate while using vacuum clamping is shown and described. In Section 4, with reference to FIGS. 4A and 4B, an example of an optical array including a mesa for supporting a substrate when the optical array is used within the pedestal of the system of FIG. 1 for heating the substrate is shown and described. Additionally, with reference to FIGS. 4C to 4F, an example of a pedestal including an optical array having a mesa that can be used in the system of FIG. 1 for heating a substrate is shown and described. In Section 5, with reference to FIGS. 5A to 6C, an example of an optical array including a transparent clamping electrode and an opaque clamping electrode used for electrostatically clamping a substrate to a pedestal in the system of FIG. 1 is shown and described. Additionally, with reference to FIGS. 7A and 7B, an example of a pedestal including an optical array including a clamping electrode that can be used in the system of FIG. 1 is shown and described. In Section 6, with reference to FIGS. 8A to 9B, an example of an optical array including a clamping electrode and further including a Faraday shield used within the pedestal in the system of FIG. 1 is shown and described. Additionally, with reference to FIGS. 10A and 10B, an example of a pedestal including an optical array including a clamping electrode and a Faraday shield that can be used in the system of FIG. 1 is shown and described. In Section 7, with reference to FIGS. 11A to 12C, an example of a pedestal including the optical array of FIG. 2A that can be used in the system of FIG. 1 for heating a substrate while using mechanical clamping is shown and described. In Section 8, with reference to FIG. 13, a method of processing a substrate using any one of the optical arrays and pedestals of FIGS. 2A to 12C in the system of FIG. 1 is shown and described. Section 1: Example of a Substrate Processing System

[0093] FIG. 1 shows an example of a substrate processing system (hereinafter, System 100). System 100 can be used to process a substrate using a chemical vapor deposition (CVD) process, a plasma-enhanced CVD (PECVD) process, a chemically-excited plasma vapor deposition (CEPVD) process, an atomic layer deposition (ALD) process, or a plasma-enhanced ALD (PEALD) process. An example of a method of processing a substrate using System 100 is shown and described in detail with reference to FIG. 13.

[0094] System 100 includes a processing chamber 101 and a gas distribution system 102. The gas distribution system 102 includes a plurality of gas sources 104, a plurality of valves 106 connected to the gas sources 104, and a plurality of mass flow controllers (MFCs) 108 connected to the valves 106. The gas sources 104 supply various gases including process gases, precursors, purge gases, inert gases, cleaning gases, and the like. The MFCs 108 control the mass flow rate of the gases.

[0095] In some applications, the gas distribution system 102 further includes a vapor delivery system 110 to supply one or more vaporized precursors through one or more valves 112. One or more gases from the MFCs 108, and one or more vaporized precursors if used, are supplied to a mixing manifold 114. The gas or gas mixture from the mixing manifold 114 is supplied to the processing chamber 101 through a valve assembly (e.g., a pulse valve manifold or PVM assembly) 116.

[0096] The processing chamber 101 includes a showerhead 120 and a pedestal 130. The showerhead 120 is attached to the upper plate of the processing chamber 101. The showerhead 120 receives a gas or a gas mixture from the mixing manifold 114 through the valve assembly 116. The showerhead 120 includes a base portion 122 and a stem portion 124. The stem portion 124 extends from the center of the base portion 122 and is attached to the upper plate of the processing chamber 101. The base portion 122 is cylindrical and includes a plurality of through holes (not shown), and the gas or gas mixture is supplied into the processing chamber 101 through the plurality of through holes.

[0097] The pedestal 130 includes a base portion 132 and a stem portion 134. The stem portion 134 can be generally cylindrical or Y-shaped and has a tapered portion (i.e., the upper part of the Y) attached to the bottom of the base portion 132. The stem portion 134 extends from the base portion 132 and is attached to the bottom of the processing chamber 101. The base portion 132 is also cylindrical. During processing, the substrate 140 is placed on the upper surface of the base portion 132 of the pedestal 130.

[0098] Although not shown, the base portion 132 of the pedestal 130 may include lift pins for holding and raising and lowering the substrate 140 relative to the base portion 132 of the pedestal 130. Optionally, a shaft (shown and described below) extending through the stem portion 132 and the base portion 132 of the pedestal 130 may be used to hold and raise and lower the substrate 140 relative to the base portion 132 of the pedestal 130. The lift pins and the shaft may be used in combination to hold and raise and lower the substrate 140 relative to the base portion 132 of the pedestal 130.

[0099] The substrate 140 may be clamped to the base portion 132 using one of many clamping schemes. Examples of clamping schemes include vacuum clamping, electrostatic clamping, and mechanical clamping. Various examples of pedestals 130 with these clamping schemes are shown and described below. Any of the pedestals shown and described below may be used as the pedestal 130 within the processing chamber 101.

[0100] The base portion 132 includes an optical array (e.g., an LED array) 150 for heating the substrate 140, as shown and described in detail below. The optical array 150 includes optical elements (e.g., LEDs) and a transparent window (shown and described below). Through the window, light from the optical elements within the optical array 150 is incident on the bottom surface of the substrate 140, thereby heating the substrate 140. The substrate 140 may be heated while being held above the optical array 150 (e.g., by lift pins passing through the optical array 150 or by a shaft). The substrate 140 may be heated when placed on the optical array 150 without being clamped (e.g., on a mesa shown and described below). The substrate 140 may be heated when clamped to the pedestal 130 using any of the clamping methods described below and placed on the optical array 150. Examples of methods for processing the substrate 140 using the optical array 150 and for heating the substrate 140 are shown and described in detail with reference to FIG. 13. The LEDs preferably emit light having a wavelength selected from between 530 nm and 1000 nm for optical heating of the substrate 140.

[0101] Purge gas (e.g., an inert gas) from one of the gas sources 104 is supplied to the stem portion 134 through the valve 152. The purge gas flows radially across above the window of the optical array 150 to clean the window and maintain its transparency as described in detail below. Various examples of the pedestal 130 including the optical array 150 and different purging schemes are shown and described below. Any of the pedestals shown and described below can be used as the pedestal 130 in the processing chamber 101.

[0102] In some applications (e.g., PECVD process and PEALD process), plasma may be used to process the substrate 140. The system 100 includes a radio frequency (RF) system 142 used to generate plasma in the processing chamber 101. The RF system 142 includes an RF generator 144 and a matching circuit 146. The RF system 142 supplies RF power to the showerhead 120 with the pedestal 130 grounded. Alternatively, although not shown, RF power can be supplied to the pedestal 130 with the showerhead 120 grounded. The RF power activates the gas or gas mixture supplied through the showerhead 120 to generate plasma between the showerhead 120 and the substrate 140 disposed on the pedestal 130.

[0103] The showerhead 120 and the pedestal 130 sense the temperatures of the showerhead 120 and the pedestal 130 by including temperature sensors 126, 136. The showerhead 120 and the pedestal 130 include cooling channels (not shown). The temperature of the showerhead 120 and the pedestal 130 is controlled by circulating a coolant through the cooling channels. The coolant source 160 may supply the coolant to the cooling channels in the showerhead 120 and the pedestal 130 via valves 162, 164.

[0104] By using one or more actuators generally indicated at 170, the pedestal 130 may be moved relative to the showerhead 120. One of the actuators 170 may be used to move, as well as rotate, a shaft (shown and described in detail below). The shaft passes through the stem portion 134 of the pedestal 130 to lift, as well as rotate, the substrate 140. The purge gas used to clean the window of the optical array 150 is supplied through a conduit within the shaft through valve 152 as shown and described in detail below.

[0105] The vacuum pump 180 is connected to the bottom of the processing chamber 101 through valve 182. By using the vacuum pump 180, the vacuum within the processing chamber 101 is maintained and reactants and process by-products are exhausted from the processing chamber 101. Additionally, when vacuum clamping is used, the vacuum pump 180 is connected to the stem portion 134 of the pedestal 130 through valve 184. The vacuum pump 180 clamps the substrate 140 to the pedestal 130 by maintaining a vacuum through an annular volume around the shaft within the stem portion 134 of the pedestal 130 (shown and described below).

[0106] Further, the stem portion 134 includes conduits (shown and described below) through which electrical connections are provided to various electrical elements disposed within the base portion 132 of the pedestal 130. For example, the electrical elements include the optical array 150, temperature sensors 126, 136, and other electrical elements (e.g., clamp electrodes shown and described below) disposed within the base portion 132 of the pedestal 130.

[0107] The controller 190 controls various elements of the system 100 (e.g., the gas distribution system 102, valves, the RF system 142, the optical array 150, the coolant source 160, the actuator 170, the vacuum pump 180, etc.). The controller 190 receives data from the temperature sensors 126, 136 and controls the temperature of the showerhead 120 and the pedestal 130 by controlling the optical array 150 and the coolant source 160. These and other features of the system 100 are described in more detail below. Section 2: Optical Array

[0108] Figures 2A - 2C show an example of the optical array 150. Figure 2A shows a top view of the optical array 150. Figure 2B shows a cross-sectional view of the optical array 150 taken along the A - A cross-section line of Figure 2A. Figure 2C shows a block diagram of the circuit for controlling the optical array 150.

[0109] In FIG. 2A, the optical array 150 is oval and has a radius smaller than the outer diameter (OD) of the base portion 132 of the pedestal 130. The radius of the optical array 150 is approximately equal to or at least equivalent (i.e., similar) to the radius of the substrate 140. For example, the optical array 150 includes a plurality of LEDs 200 disposed on a printed circuit board (PCB) 201. For example, the LEDs 200 are arranged in concentric circles 202 on the PCB 201. For example, the radius of the outermost concentric circle 202 including the LEDs 200 can be approximately equal to the radius of the substrate 140. Thus, the radius of the optical array 150 can be slightly larger than the radius of the substrate 140. Only some of the concentric circles 202 are illustrated for illustrative purposes, but the number of concentric circles 202 may be different. For example, the concentric circles 202 may be more densely packed than shown. Further, the number of LEDs 200 in each concentric circle 202 may be more than shown. Thus, the concentric circles 202 and the LEDs 200 may be arranged more densely within the optical array 150 than shown. The concentric circles 202 and the LEDs 200 extend from the inner annular region 204 of the optical array 150 to the OD of the optical array 150. The LEDs 200 preferably emit light having a wavelength selected from between 530 nm and 1000 nm for optical heating of the substrate 140. The substrate 140 is optically heated by the light emitted by the LEDs 200.

[0110] The LEDs 200 may be arranged in concentric circles 202 in different patterns. For example, in some of the concentric circles 202, the LEDs 200 may be arranged more densely than in other concentric circles 202. For example, in a portion (e.g., a zone or quadrant) of the optical array 150, the LEDs 200 may be arranged more densely than in other portions of the optical array 150. Further, the size, luminous intensity, and / or wavelength(s) of the LEDs 200 may be different depending on the concentric circles 202 or the portions. Any combination of these and additional features of the LEDs 200 may be used in the optical array 150.

[0111] The optical array 150 includes one or more drive circuits (hereinafter, drivers) 206 disposed on the PCB 201. Although multiple drivers 206 are shown, a single driver 206 may be used. The following description of the driver 206 applies to a single driver if used. The driver 206 controls the LEDs 200 as will be described in detail below. For example, the driver 206 may be disposed on the same side of the PCB 201 as the LEDs 200, on the opposite side of the PCB 201, or on both sides of the PCB 201. For example, one or more of the drivers 206 may be disposed along different radii on the PCB 201. For example, the driver 206 may be disposed on the PCB 201 in a regular pattern or an irregular pattern (e.g., randomly). Further, FIGS. 2A, 4A, 5A, 6A, 8A, and 9A are merely representative. In use, the optical array 150 in all of these drawings is fully implemented over the entire pedestal from the inner annular region 204 of the optical array 150 out to the OD of the optical array 150. Specifically, the LEDs 200 are also implemented in the region of the optical array 150 above the driver 206.

[0112] In FIG. 2B, the optical array 150 includes a transparent window (hereinafter, window) 210. For example, the window 210 may be formed of an optically transparent, chemically resistant, and electrically insulating material such as quartz or sapphire. The window 210 has an opening in a central region that coincides with the inner annular region 204 of the optical array 150. The diameter of the opening coincides with the diameter of the inner annular region 204 of the optical array 150. The inner annular region 204 is provided such that a shaft (described later) can move and rotate the substrate 140 by passing through the inner annular region 204 (e.g., as described later, the substrate 140 can be lifted above the window 210 to purge the window 210). In an implementation where no shaft is used, the provision of the inner annular region 204 and the corresponding opening is not necessary, and the LEDs 200 can be provided up to the center of the optical array 150. The inner and outer circumferences of the window 210 are each sealed and attached to the inner and outer circumferences of the optical array 150. Thus, the optical array 150 and the window 210 form a sealed enclosure that houses the LEDs 200 and the PCB 201. Further, a part of the interior of the sealed enclosure (e.g., the bottom and sides) can be molded with a reflective material (e.g., a reflective ring) and / or can include a reflective material (e.g., a reflective ring), thereby reflecting and / or directing the light emitted by the LEDs 200 onto the substrate 140.

[0113] In FIG. 2C, each driver 206 may control a set of LEDs 200. The controller 190 may control the LEDs 200 by controlling the driver 206. For example, as described below with reference to FIG. 13, when the substrate 140 is loaded into the processing chamber 101, before the substrate 140 is lowered onto the pedestal 130 to deposit a film on the substrate 140, while the substrate 140 is held above the pedestal 130, the driver 206 may preheat the substrate 140 by supplying power at a first power level to the LEDs 200. Subsequently, after the substrate 140 has been preheated for a predetermined time, before or after the substrate 140 is lowered onto the pedestal 130, the driver 206 may heat the substrate 140 by supplying a reduced amount of power at a second power level to the LEDs 200. Subsequently, after the film has been deposited on the substrate 140, before the substrate 140 is lifted from the pedestal 130 and removed from the processing chamber 101, the driver 206 may supply a reduced amount of power at a third power level to the LEDs 200.

[0114] In addition, in any of the above steps, driver 206 may further control the power supplied to LEDs 200. For example, each driver 206 may control the duty ratio (on / off time) of each of LEDs 200. For example, each driver 206 may control the intensity (brightness) of each of LEDs 200. For example, controller 190 may control driver 206 such that only the selected concentric circles 202, or only the LEDs of the selected portions of concentric circles 202, are turned on or off at different times. For example, controller 190 may control driver 206 such that only one or more LEDs 200 of a certain set (e.g., a certain zone or portion of optical array 150) are turned on or off at different times. For example, controller 190 may control driver 206 such that LEDs 200 or different portions of LEDs 200 can output various amounts of light (i.e., light heating power) at different times. Driver 206 may control the power supplied to LEDs 200 gradually or stepwise. Any combination of these controls and additional controls may be used to control LEDs 200.

[0115] In some examples, some or all of the control provided by controller 190 may be offloaded into one or more drivers 206 (in the form of hardware, firmware, or a combination thereof). In some examples, one or more drivers 206 may control the remaining drivers 206. Further, substrate 140 is rotatable with respect to optical array 150, as will be described later. Controller 190 and / or driver 206 may vary the control of LEDs 200 before and after substrate 140 is rotated. Thus, the light heating of different portions of substrate 140 is controllable by controlling one or more LEDs 200. Section 3: Vacuum Clamping

[0116] Figures 3A and 3B show an example of an optical array 150 mounted in a pedestal 130 when vacuum clamping is used to clamp a substrate 140 to the pedestal 130. Further, together with the vacuum clamping, these drawings show a purging scheme and a rotation scheme used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150. FIG. 3A shows an example of vacuum clamping. FIG. 3B shows the purging of the window 210 when the substrate 140 is lifted from the pedestal 130 and rotated.

[0117] In FIG. 3A, the optical array 150 together with the window 210 is disposed in an annular cavity 138 formed in the base portion 132 of the pedestal 130. The annular cavity 138 is formed by removing material from the upper surface of the base portion 132 of the pedestal 130 (excluding the central region of the upper surface of the base portion 132 of the pedestal 130). The depth of the annular cavity 138 is equal to the height of the optical array 150 and the window 210. The optical array 150 and the base portion 132 of the pedestal 130 are in the same plane. Accordingly, the upper surface of the window 210 is at the same height as the upper edge 139 of the base portion 132 of the pedestal 130. The substrate 140 is disposed on the upper surface of the window 210 during processing. The vacuum clamping described below is used to clamp the substrate 140 to the pedestal 130.

[0118] The stem portion 134 of the pedestal 130 includes a shaft 250. The shaft 250 extends through the centers of the stem portion 134 and the base portion 132 of the pedestal 130. The shaft 250 includes a T-shaped end (i.e., the horizontal portion forming the upper part of the T) and a distal end (i.e., the vertical portion forming the bottom of the T). The T-shaped end of the shaft 250 extends through the inner annular region 204 of the optical array 150, the opening of the window 210, and the central region of the upper surface of the base portion 132 of the pedestal 130. The upper surface of the T-shaped end of the shaft 250 is at the same height as the upper surface of the window 210. The bottom surface of the T-shaped end of the shaft 250 is at the same height as the central region of the upper surface of the base portion 132 of the pedestal 130 and is placed thereon. The diameter of the T-shaped end of the shaft 250 is slightly smaller than the diameters of the inner annular region 204 of the optical array 150 and the opening of the window 210.

[0119] The distal end of the shaft 250 extends through the bottom end of the stem portion 134 of the pedestal 130. The distal end of the shaft 250 extends through a vacuum pump 180 attached to the bottom end of the stem portion 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can move the substrate 140 up and down by moving the shaft 250 through the vacuum pump 180 and through the stem portion 134 and the base portion 132 of the pedestal 130. In FIG. 3B, when the substrate 140 is lifted, the substrate 140 is held by the T-shaped end of the shaft 250. When the substrate 140 is lifted, the actuator 170 can also rotate the substrate 140 relative to the optical array 150 by rotating the shaft 250.

[0120] The conduit 252 is drilled through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 and extends to the T-shaped end of the shaft 250. The shaft 250 includes a plurality of holes 254 drilled radially through the T-shaped end of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 is connected to the plurality of holes 254. The distal end of the conduit 252 extends outside the distal end of the shaft 250. The distal end of the conduit 252 is connected to one of the gas sources 104 through a valve 152 (shown in FIG. 1). In FIG. 3B, when the shaft 250 lifts the substrate 140, purge gas is supplied through the conduit 252. The purge gas flows through the conduit 252, flows out through the holes 254, and cleans the window 210 by flowing radially across the upper side of the window 210 in the direction of the illustrated arrow.

[0121] The stem portion 134 of the pedestal 130 further includes a conduit 256 through which an electrical connection (e.g., an insulated wire or conductor) to an electrical element within the base portion 132 of the pedestal 130 is provided. The distal end of the electrical connection is connected to a controller 190 (shown in FIG. 1). The conduit 256 is drilled through and extends through the stem portion 134 of the pedestal 130. The conduit 256 extends within the base portion 132 of the pedestal 130 across the inner annular region 204 of the optical array 150. The conduits 252, 256, and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0122] The stem portion 134 of the pedestal 130 further includes a conduit 258. The diameter of the conduit 258 is larger than the diameter of the conduit 256 and smaller than the diameter of the stem portion 134 of the pedestal 130. The conduits 258, 252, 256, and the shaft 250 are coaxial. The first end of the conduit 258 is in fluid communication with a vacuum pump 180. The second end of the conduit 258 extends through the stem portion 134 of the pedestal 130 into the base portion 132 of the pedestal 130. The second end of the conduit 258 extends within the base portion 132 of the pedestal 130 across a point below the optical array 150. At the second end, the conduit 258 connects to a first set of conduits (or passages) 260 that are radially drilled through the base portion 132 of the pedestal 130 below the optical array 150. The conduits 260 extend across the OD of the base portion 132 of the pedestal 130. The conduits 260 are in fluid communication with the conduit 258.

[0123] The second set of conduits 262 is drilled through the base portion 132 of the pedestal 130 at a right angle to the first set of conduits 260. The conduits 262 extend from the conduits 260 through the optical array 150 and the window 210. The conduits 262 are in fluid communication with the conduits 260, 258. Thus, when clamping the substrate 140 to the pedestal 130, the controller 190 creates a vacuum in the conduits 258, 260, 262 by operating the vacuum pump 180 to open the valve 184 (shown in FIG. 1). The vacuum in the conduits 258, 260, 262 clamps the substrate 140 to the pedestal 130. After the substrate 140 is clamped to the pedestal 130, the controller 190 heats the substrate 140 as described above according to the process performed on the substrate 140 by controlling the optical array 150.

[0124] In FIG. 3B, when it is necessary to rotate the substrate 140 relative to the optical array 150, the controller 190 controls the vacuum pump 180 and the valve 184 so that the vacuum in the conduits 258, 260, 262 decreases. When the vacuum in the conduits 258, 260, 262 is sufficiently reduced, the shaft 250 can lift the substrate 140. The controller 190 operates the actuator 170 so that the shaft 250 lifts and rotates the substrate 140. In some applications, the substrate 140 can be lifted and held stationary, and the pedestal 130 can be rotated to rotate the optical array 150 relative to the substrate 140.

[0125] When the substrate 140 is lifted, the controller 190 enables purge gas to flow through the conduit 252 and the holes 254 by opening the valve 152 (shown in FIG. 1). The purge gas flows through the conduit 252 and the holes 254 and radially across above the window 210 as indicated by the arrow in FIG. 3B. The flow of the purge gas across above the window 210 removes any material that may be deposited on the window 210. The controller 190 controls the valves 152 and 184 (shown in FIG. 1) so that the vacuum pump 180 continues to draw air through the conduits 258, 260, 262, and the processing chamber 101 (shown in FIG. 1). Thus, the material removed from the window 210 is discharged from the processing chamber 101.

[0126] Subsequently, the actuator 170 relocates the substrate 140 onto the pedestal 130 by lowering the shaft 250. The substrate 140 is then vacuum clamped as described above. The optical array 150 reheats the substrate 140 as described above. The procedure is repeated as necessary until the processing of the substrate 140 is completed. Section 4: Array with mesa for substrate support

[0127] FIGS. 4A - 4E show an example of an optical array 150 implemented in the pedestal 130 that includes a mesa on the upper surface of the window 210 for supporting the substrate 140 during processing. No other clamping method is used to clamp the substrate 140 to the pedestal 130. Further, these figures show the purging scheme and the rotation scheme used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150.

[0128] Figures 4A and 4B show an example of an optical array 150 with a window 210 including a mesa. Figure 4A shows a top view of the optical array 150 with the mesa disposed on the top surface of the window 210. Figure 4B shows a cross-sectional view of the optical array 150 taken along the A-A cross-section line of Figure 4A. Figure 4C shows a first example of a pedestal 130 with the optical array 150 including a mesa. Figure 4D shows a first method of purging the window 210 when the substrate 140 is lifted and rotated from the pedestal 130. Figure 4E shows a second example of a pedestal 130 with the optical array 150 including a mesa. Figure 4F shows a second method of purging the window 210 when the substrate 140 is lifted and rotated from the pedestal 130.

[0129] Figures 4A and 4B are similar to Figures 2A and 2B, except that they additionally include a mesa 214 on the top surface of the window 210. Accordingly, all other descriptions of Figures 2A - 2C apply to Figures 4A - 4E and are not repeated for the sake of brevity. The mesa 214 is a small raised bump or a small generally cylindrical element that rises above the top surface of the window 210. The mesa 214 is integrally (i.e., homogeneously) formed on the top surface of the window 210. Thus, the mesa 214 is made of the same optically transparent, chemically resistant, and electrically insulating material as the window 210, such as quartz or sapphire. The mesa 214 can be distributed at any position among the LEDs 200 on the top surface of the window 210 and protrudes towards the substrate 140. The number, size, and shape of the mesa 214 can be diverse. The mesa 214 can be circular, square, hexagonal, or any other polygon (or any combination thereof). Although only some of the mesa 214 are illustrated for the purpose of example, it is understood that the mesa 214 is distributed across the entire top surface of the window 210, similar to the extent to which the LEDs 200 are distributed across the entire optical array 150.

[0130] The mesa 214 is arranged on the upper surface of the window 210 such that the mesa 214 is interposed with respect to the LEDs 200. For example, the mesa 214 can be arranged in a concentric circle that coincides with the concentric circle 202 on which the LEDs 200 are arranged on the window 210. For example, in each concentric circle on the window 210, the mesa 214 can be arranged such that each mesa 214 is located between two adjacent LEDs 200 arranged in the corresponding concentric circle 202.

[0131] In addition, the mesa 214 can be arranged in an additional concentric circle 203 on the window 210 such that each additional circle 203 including the mesa 214 is located between two consecutive concentric circles 202 on which the LEDs 200 are arranged. On the window 210, the concentric circle 203 including the mesa 214, as well as the concentric circle that coincides with the concentric circle 202 and includes the mesa 214, can extend alternately from the central opening of the window 210 to the OD of the window 210. In some examples, a plurality of concentric circles 203 including the mesa 214 can be arranged between two consecutive concentric circles that coincide with the concentric circle 202 and include the mesa 214. The mesa 214 can be arranged on the window 210 in various other arrangements. When the substrate 140 is arranged on the mesa 214, the controller 190 heats the substrate 140 by controlling the optical array 150 as described above.

[0132] Figures 4C and 4D illustrate a first method of purging window 210. In the first method, the purge gas flows radially outward from hole 254 in shaft 250 above mesa 214 on window 210, as described below. In Figure 4C, optical array 150 together with window 210 including mesa 214 is disposed in annular cavity 138 formed in base portion 132 of pedestal 130 as described above. The depth of annular cavity 138 is equivalent to the height of optical array 150 and window 210, excluding the height of mesa 214. Optical array 150 and base portion 132 of pedestal 130 are in the same plane. Thus, the upper surface of window 210 is located within the plane in which the lowermost portion of mesa 214 and upper edge 139 of base portion 132 of pedestal 130 are located. The upper end of mesa 214 extends above the plane in which the upper surface of window 210 and upper edge 139 of base portion 132 of pedestal 130 are located. The upper end of mesa 214 supports substrate 140 during processing.

[0133] Stem portion 134 of pedestal 130 includes shaft 250. Shaft 250 extends through the center of stem portion 134 and base portion 132 of pedestal 130. Shaft 250 includes a T-shaped end (i.e., the horizontal portion forming the top of the T) and a distal end (i.e., the vertical portion forming the bottom of the T). The T-shaped end of shaft 250 extends through inner annular region 204 of optical array 150, the opening of window 210, and the central region of the upper surface of base portion 132 of pedestal 130. The upper surface of the T-shaped end of shaft 250 is at the same height as the upper surface of window 210. The bottom surface of the T-shaped end of shaft 250 is at the same height as the central region of the upper surface of base portion 132 of pedestal 130 and is placed thereon. The diameter of the T-shaped end of shaft 250 is slightly smaller than the diameters of inner annular region 204 of optical array 150 and the opening of window 210.

[0134] The distal end of the shaft 250 extends through the bottom end of the stem portion 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can raise and lower the substrate 140 by moving the shaft 250 through the stem portion 134 and the base portion 132 of the pedestal 130. In FIG. 4D, when the substrate 140 is lifted, the substrate 140 is held by the T-shaped end of the shaft 250. When the substrate 140 is lifted, the actuator 170 can also rotate the substrate 140 relative to the optical array 150 by rotating the shaft 250.

[0135] The conduit 252 is drilled through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 and extends to the T-shaped end of the shaft 250. The shaft 250 includes a plurality of holes 254 radially drilled through the T-shaped end of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 is connected to the plurality of holes 254. The distal end of the conduit 252 extends outside the distal end of the shaft 250. The distal end of the conduit 252 is connected to one of the gas sources 104 through a valve 152 (shown in FIG. 1). In FIG. 4D, when the shaft 250 lifts the substrate 140, purge gas is supplied through the conduit 252. The purge gas flows through the conduit 252, out through the holes 254, and across the window 210 radially in the direction of the arrow shown, thereby cleaning the window 210 and the mesa 214.

[0136] In some examples, the shaft 250 may extend above the window 210 such that the upper surface of the T-shaped end of the shaft 250 is at the same height as the upper end of the mesa 214. Accordingly, the substrate 140 is placed on the mesa 214 and on the upper surface of the T-shaped end of the shaft 250. The hole 254 may be located within the T-shaped end of the shaft 250 such that the hole 254 is above the upper surface of the window 210 (i.e., above the lowermost portion of the mesa 214) while being below the upper surface of the T-shaped end of the shaft 250 (i.e., below the uppermost portion of the mesa 214). Accordingly, purge gas may be supplied through the conduit 252 and the hole 254 with the substrate 140 placed on the upper surface of the T-shaped end of the shaft 250 and on the mesa 214. The purge gas flows through the conduit 252, exits through the hole 254, and flows radially across above the window 210 and the mesa 214 to clean the window 210 and the mesa 214 during processing of the substrate 140.

[0137] The stem portion 134 of the pedestal 130 further includes a conduit 256 through which an electrical connection (e.g., an insulated wire or an insulated conductor) to an electrical element within the base portion 132 of the pedestal 130 is provided. The distal end of the electrical connection is connected to a controller 190 (shown in FIG. 1). The conduit 256 is drilled through and extends through the stem portion 134 of the pedestal 130. The conduit 256 extends within the base portion 132 of the pedestal 130 and extends into the inner annular region 204 of the optical array 150. The conduits 252, 256, and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0138] In FIG. 4D, when it is necessary to rotate the substrate 140 relative to the optical array 150, the controller 190 actuates the actuator 170 such that the shaft 250 lifts and rotates the substrate 140. In some applications, the substrate 140 can be lifted and held stationary, and the pedestal 130 can be rotated to rotate the optical array 150 relative to the substrate 140.

[0139] When the substrate 140 is lifted, the controller 190 enables purge gas to flow through the conduit 252 and the hole 254 by opening the valve 152 (shown in FIG. 1). The purge gas flows through the conduit 252 and the hole 254 and radially across above the window 210 and the mesa 214 as indicated by the arrows in FIG. 4D. The flow of the purge gas radially across above the window 210 and the mesa 214 removes any material that may be deposited on the window 210 and the mesa 214. The controller 190 controls the valves 152 and 184 (shown in FIG. 1) such that the material removed from the window 210 and the mesa 214 by the vacuum pump 180 is discharged from the processing chamber 101.

[0140] Subsequently, the actuator 170 relocates the substrate 140 onto the mesa 214 by lowering the shaft 250. The optical array 150 reheats the substrate 140 as described above. The procedure is repeated as necessary until the processing of the substrate 140 is completed.

[0141] FIGS. 4E and 4F illustrate a second method of purging the window 210. In the second method, the purge gas is supplied through a hole 141 in the upper edge 139 of the base portion 132 of the pedestal 130. The purge gas flows from the hole 141 radially inwardly above the mesa 214 on the window 210 as described below.

[0142] In FIG. 4E, the optical array 150 together with the window 210 including the mesa 214 is disposed in an annular cavity 138 formed in the base portion 132 of the pedestal 130 as described above. The depth of the annular cavity 138 is greater than the height of the optical array 150 and the window 210 plus the height of the mesa 214. The optical array 150 and the base portion 132 of the pedestal 130 are on the same plane. Thus, the upper surface of the window 210 and the upper end of the mesa 214 are located below the plane at which the upper edge 139 of the base portion 132 of the pedestal 130 is located. The diameter of the substrate 140 is smaller than the inner diameter (ID) of the annular cavity 138. Thus, the substrate 140 is placed on the upper end of the mesa 214 and surrounded by the upper edge 139 of the base portion 132 of the pedestal 130.

[0143] The stem portion 134 of the pedestal 130 includes a shaft 250. The shaft 250 extends through the centers of the stem portion 134 and the base portion 132 of the pedestal 130. The shaft 250 includes a T-shaped end (i.e., the horizontal portion forming the upper part of the T) and a distal end (i.e., the vertical portion forming the bottom of the T). The T-shaped end of the shaft 250 extends through the inner annular region 204 of the optical array 150, the opening of the window 210, and the central region of the upper surface of the base portion 132 of the pedestal 130. The upper surface of the T-shaped end of the shaft 250 is at the same height as the upper surface of the window 210. The bottom surface of the T-shaped end of the shaft 250 is at the same height as the central region of the upper surface of the base portion 132 of the pedestal 130 and is placed thereon. The diameter of the T-shaped end of the shaft 250 is slightly smaller than the diameters of the inner annular region 204 of the optical array 150 and the opening of the window 210.

[0144] The distal end of the shaft 250 extends through the bottom end of the stem portion 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can raise and lower the substrate 140 by moving the shaft 250 through the stem portion 134 and the base portion 132 of the pedestal 130. In FIG. 4F, when the substrate 140 is lifted, the substrate 140 is held by the T-shaped end of the shaft 250. When the substrate 140 is lifted, the actuator 170 can also rotate the substrate 140 relative to the optical array 150 by rotating the shaft 250.

[0145] The stem portion 134 of the pedestal 130 includes a conduit 256 through which an electrical connection (e.g., an insulated wire or an insulated conductor) to electrical components within the base portion 132 of the pedestal 130 is provided. The distal end of the electrical connection is connected to a controller 190 (shown in FIG. 1). The conduit 256 is drilled through the stem portion 134 of the pedestal 130 and extends through the stem portion 134. The conduit 256 extends within the base portion 132 of the pedestal 130 across the inner annular region 204 of the optical array 150. The conduit 256 and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0146] The pedestal 130 further includes a conduit 252 that is perforated through the stem portion 134 of the pedestal 130 and extends through the stem portion 134. The diameter of the conduit 252 is larger than the diameter of the conduit 256 and smaller than the diameter of the stem portion 134 of the pedestal 130. The conduit 252 surrounds the conduit 256. The conduits 252, 256, and the shaft 250 are coaxial.

[0147] The first end of the conduit 252 is connected to one of the gas sources 104 through the valve 152 shown in FIG. 1. The second end of the conduit 252 extends through the stem portion 134 of the pedestal 130 and into the base portion 132 of the pedestal 130. The second end of the conduit 252 extends within the base portion 132 of the pedestal 130 to a point below the optical array 150. At the second end, the conduit 252 connects to a first set of conduits (or passages) 261 that are radially perforated through the base portion 132 of the pedestal 130 below the optical array 150. The conduits 261 extend along the OD of the base portion 132 of the pedestal 130. The conduits 261 are in fluid communication with the conduit 252.

[0148] A second set of conduits 263 are perforated through the outer periphery of the base portion 132 of the pedestal 130 (i.e., near the OD) at a right angle to the first set of conduits 261. The conduits 263 extend from the conduits 261 and surround the optical array 150 and the window 210. The conduits 263 are in fluid communication with the conduits 261, 252. The distal end of the conduit 263 extends radially inwardly near the upper edge 139 of the base portion 132 of the pedestal 130 and forms a hole 141 at the upper edge 139 of the base portion 132 of the pedestal 130.

[0149] Thus, when the substrate 140 is placed on and being processed on the mesa 214, the controller 190 supplies purge gas through conduits 252, 261, 263 by opening the valve 152 (shown in FIG. 1). The purge gas in the conduits 252, 261, 263 flows out through the holes 141 in the upper edge 139 of the base portion 132 of the pedestal 130. The purge gas from the holes 141 flows radially across above the mesa 214 on the window 210 to clean the window 210 and the mesa 214. The flow of the purge gas radially across above the window 210 removes any material that may be deposited on the window 210 and the mesa 214. The controller 190 controls the valves 152 and 184 (shown in FIG. 1) such that the material removed from the window 210 by the vacuum pump 180 is discharged from the processing chamber 101.

[0150] In FIG. 4F, when it is necessary to rotate the substrate 140 relative to the optical array 150, the controller 190 actuates the actuator 170 such that the shaft 250 lifts and rotates the substrate 140. In some applications, the substrate 140 can be lifted and held stationary, and the pedestal 130 can be rotated to rotate the optical array 150 relative to the substrate 140.

[0151] When the substrate 140 is lifted, purge gas is supplied through the conduits 252, 261, 263. The purge gas in the conduits 252, 261, 263 flows out through the holes 141 in the upper edge 139 of the base portion 132 of the pedestal 130. The purge gas from the holes 141 flows radially across above the mesa 214 on the window 210 to clean the window 210 and the mesa 214 as indicated by the arrows in FIG. 4F. The flow of the purge gas radially across above the window 210 removes any material that may be deposited on the window 210 and the mesa 214. The controller 190 controls the valves 152 and 184 (shown in FIG. 1) such that the material removed from the window 210 by the vacuum pump 180 is discharged from the processing chamber 101.

[0152] Subsequently, the actuator 170 relocates the substrate 140 onto the mesa 214 by lowering the shaft 250. The optical array 150 reheats the substrate 140 as described above. The procedure is repeated as necessary until the processing of the substrate 140 is complete. Section 5: Electrostatic Clamping

[0153] This section is organized as follows. FIGS. 5A - 7B show examples of the optical array 150 implemented within the pedestal 130 when electrostatic clamping is used to clamp the substrate 140 to the pedestal 130. FIGS. 5A and 5B show an example of the optical array 150 including a clamping electrode formed of a conductive material that is also optically transparent. FIG. 5A shows a top view of the optical array 150 including a clamping electrode formed of a conductive and optically transparent material. FIG. 5B shows a cross-sectional view of the optical array 150 taken along the A - A cross-section line of FIG. 5A. FIGS. 6A and 6B show an example of the optical array 150 including a clamping electrode formed of a metal material. FIG. 6A shows a top view of the optical array 150 including a clamping electrode formed of a metal material. FIG. 6B shows a cross-sectional view of the optical array 150 taken along the A - A cross-section line of FIG. 6A. FIG. 6C shows a bias system including a DC power supply and an AC (i.e., RF) power supply for applying a bias to the clamping electrodes shown in FIGS. 5A - 6B. FIGS. 7A and 7B show the pedestal 130 including the optical array 150, where the optical array 150 can include the clamping electrodes shown in FIGS. 5A and 5B, or the clamping electrodes shown in FIGS. 6A and 6B. Further, FIGS. 7A and 7B show a purging scheme and a rotation scheme used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150. The use of a Faraday shield (also called a Faraday cage) is shown and described with reference to FIGS. 8A - 10B.

[0154] Figures 5A and 5B are the same as Figures 2A and 2B, except that the optical array 150 shown in Figures 5A and 5B further includes a clamp electrode 300 formed of an optically transparent material. Therefore, all other descriptions of Figures 2A - 2C apply to Figures 5A - 10B and will not be repeated for the sake of brevity. For example, the clamp electrode 300 can be formed of a conductive and optically transparent material such as indium tin oxide. The clamp electrode 300 needs to be optically transparent in addition to being conductive in order to assist in the reflection of radiation and the transmission of photons. The material should not significantly reduce the heating efficiency of the optical array 150. Further, the material should not reflect much of the light emitted from the LEDs 200 towards the PCB 201, and thus does not overheat the LEDs 200. Therefore, sufficient heat flux can be provided to the substrate 140 even in high - temperature applications. The clamp electrode 300 needs to be located near the upper surface of the optical array 150, such as being embedded as an individual layer within the window 210 as shown in Figure 5B. The optical array 150 needs to be located much further below the plane in which the clamp electrode 300 is embedded within the window 210. The clamp electrode 303 and the window 210 are in the same plane.

[0155] The number, size, and shape of the clamp electrodes 300 can be diverse. The electrical connection to the clamp electrode 300 is provided through the inner annular region 204 of the optical array 150 and the corresponding openings in the window 210. The electrical connection to the clamp electrode 300 is routed through a conduit 256 (shown in Figures 7A - 7B and 10A - 10B) to one or more power sources (shown in Figure 6C). The controller 190 (shown in Figure 6C) clamps the substrate 140 to the pedestal 130 by controlling the power source for biasing the clamp electrode 300, as will be described later.

[0156] Figures 6A and 6B are the same as Figures 2A and 2B, except that the optical array 150 shown in Figures 6A and 6B further includes a clamp electrode 302 formed of a metallic material. Accordingly, all other descriptions of Figures 2A - 2C apply to Figures 6A - 10B and are not repeated for the sake of brevity. For example, the clamp electrode 302 can be formed of a conductive and optically opaque material such as metal. The clamp electrode 302 is embedded within the window 210. The clamp electrode 302 and the window 210 are in the same plane. The clamp electrode 302 has a via pattern that coincides with the pattern in which the LEDs 200 are arranged on the PCB 201. Accordingly, the light emitted from the LEDs 200 passes through the holes and the window 210 within the clamp electrode 302 and reaches the substrate 140 disposed on the window 210. The clamp electrode 302 needs to be positioned near the upper surface of the optical array 150, such as being embedded as an individual layer within the window 210 as shown in Figure 6B. The optical array 150 needs to be positioned much lower than the plane in which the clamp electrode 300 is embedded within the window 210.

[0157] Unlike the clamp electrode 300, the clamp electrode 302 may not assist in reflecting radiation and transmitting photons. The clamp electrode 302 can reduce the heating efficiency of the optical array 150. Further, the clamp electrode 302 can reflect a portion of the light emitted from the LEDs 200 to the PCB 201 and thus heat the LEDs 200. Accordingly, sufficient heat flux may not be provided to the substrate 140, except for low-temperature applications (e.g., patterning of ALD oxides, which is processed at about 50°C). To minimize these effects, an anti-reflection coating may be applied to the surface of the clamp electrode 302 facing the LEDs 20.

[0158] The number, size, and shape of the clamp electrodes 302 can be diverse. The electrical connection to the clamp electrodes 302 is provided through corresponding openings in the inner annular region 204 and the window 210 of the optical array 150. The electrical connection to the clamp electrodes 302 is routed through a conduit 256 (shown in FIGS. 7A and 7B) to one or more power supplies (shown in FIG. 6C). The controller 190 (shown in FIG. 6C) clamps the substrate 140 to the pedestal 130 by controlling a power supply for applying a bias to the clamp electrodes 302 as described below.

[0159] FIG. 6C shows a bias system that includes a DC power supply 310 and an AC (i.e., RF) power supply 312 for applying a bias to the clamp electrodes 300, 302 when used within the pedestal 130 as shown in FIGS. 7A-7B and FIGS. 10A-10B. The description of FIG. 6C applies to FIGS. 5A-6B and FIGS. 8A-10B. Although a single DC power supply 310 and a single AC power supply 312 are shown, a plurality of DC power supplies and a plurality of AC power supplies may alternatively be used. Throughout the following description of FIGS. 6C-10B, when an electrode or a clamp electrode is referred to without using reference numerals 300 or 302, it is understood that the electrode or the clamp electrode is referring to either the clamp electrode 300 or the clamp electrode 302. In each of the clamp electrodes 300 and the clamp electrodes 302, the electrodes are electrically insulated from each other. The electrodes are electrically separated from each other by the dielectric material of the window 210. An electrical separation is provided between them by the presence of a small finite gap between the electrodes.

[0160] In some examples, all the electrodes may be in the same plane and function as clamping electrodes, and a DC bias may be applied by a DC power supply 310. For example, the electrodes may be pie-shaped, arcuate, or any other shape. In other examples, the electrodes may be arranged such that all but one of the electrodes constitute inner electrodes located in a first plane, and one of the electrodes constitutes an outer electrode located in a second plane parallel to the first plane. For example, the inner electrodes may be pie-shaped, arcuate, or any other shape, while the outer electrode may be annular and may surround the inner electrodes. For example, the inner electrodes may be pie-shaped, arcuate, or any other shape, while the outer electrode may have the shape of an annular plate. The inner electrodes may have portions that partially overlap the outer electrodes. The inner electrodes clamp the substrate 140 to the pedestal 130 by applying a DC bias by the DC power supply 310. The outer electrodes may be independently applied with a DC bias or an RF bias from the DC power supply 310 and the AC power supply 312 relative to the inner electrodes.

[0161] For example, the inner electrodes may be preferentially arranged in a plane parallel to the upper surface of the window 210 (i.e., parallel to the substrate 140). However, the inner electrodes do not have to be in the same plane and may be respectively arranged in one or more planes parallel to the upper surface of the window 210. Further, by using an even number of inner electrodes, the electrodes can be used in pairs, so that the DC bias for electrostatic clamping can be simplified. For example, the first pair of electrodes can be connected to the first tap of a bipolar voltage source (e.g., the DC power supply 310), and the second pair of electrodes can be connected to the second tap of a bipolar voltage source (e.g., the DC power supply 310).

[0162] The switching circuit 314 includes switches. The switches are controlled by the controller 190 to provide electrode pairing and switching between the supply of DC power and AC power to the selected electrodes. In some examples, the inner electrodes may be paired differently. For example, the inner electrodes may be paired by pairing adjacent electrodes or pairing electrodes that face each other diagonally. In some examples, the inner electrodes may be connected to a single DC power supply 310 or to each DC power supply 310. Alternatively, the inner electrodes may be connected instead to one or more RF power supplies (i.e., AC power supply 312). The outer electrodes may be connected to an RF power supply (i.e., AC power supply 312) or a DC power supply 310. Any combination of DC power and AC power may be used to bias any of the electrodes.

[0163] Since the bias system uses both DC bias and RF bias, a blocking circuit 316 including DC blocking elements and RF blocking elements such as inductors and capacitors is used. Generally, the inductor prevents damage to the DC power supply 310 by high frequencies, and the capacitor prevents damage to the RF generator (i.e., AC power supply 312) by low frequencies such as DC. For example, the inductor and capacitor (i.e., blocking circuit 316), as well as the switching circuit 314, may be disposed within a facility plate (not shown) of the pedestal 130. In practice, these generalized elements are implemented as a local circuit network adjusted to block specific frequencies, thereby protecting adjacent power supplies from damage or interference by other frequencies present within the system (e.g., system 100 shown in FIG. 1). The electrical connection between the clamp electrodes and the switching circuit 314 and the blocking circuit 316 is provided through a conduit 256 (shown in FIGS. 7A-7B and FIGS. 10A-10B).

[0164] Figures 7A and 7B show a pedestal 130 that includes an optical array 150, which may include the clamp electrodes 300 shown in FIGS. 5A and 5B, or the clamp electrodes 302 shown in FIGS. 6A and 6B. Thus, the pedestal 130 shown in FIGS. 7A and 7B may be referred to as electrostatic chucks (ESCs). Further, FIGS. 7A and 7B show a purging scheme and a rotation scheme that are used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150.

[0165] In FIG. 7A, the optical array 150, together with the window 210 that includes the clamp electrode (300 or 302), is disposed within an annular cavity 138 formed within the base portion 132 of the pedestal 130 as described above. The depth of the annular cavity 138 is equal to the height of the optical array 150 and the window 210. The optical array 150 and the base portion 132 of the pedestal 130 are on the same plane. Thus, the upper surface of the window 210 is at the same height as the upper edge 139 of the base portion 132 of the pedestal 130. The substrate 140 is disposed on the upper surface of the window 210 during processing. The controller 190 clamps the substrate 140 to the pedestal 130 by actuating the clamp electrode (300 or 302) as described above, but the clamping procedure is not described again for the sake of brevity. Once the substrate 140 is clamped to the pedestal 130, the controller 190 heats the substrate 140 as described above by controlling the optical array 150.

[0166] The stem portion 134 of the pedestal 130 includes a shaft 250. The shaft 250 extends through the centers of the stem portion 134 and the base portion 132 of the pedestal 130. The shaft 250 includes a T-shaped end (i.e., the horizontal portion forming the upper part of the T) and a distal end (i.e., the vertical portion forming the bottom of the T). The T-shaped end of the shaft 250 extends through the inner annular region 204 of the optical array 150, the opening of the window 210, and the central region of the upper surface of the base portion 132 of the pedestal 130. The upper surface of the T-shaped end of the shaft 250 is at the same height as the upper surface of the window 210. The bottom surface of the T-shaped end of the shaft 250 is at the same height as the central region of the upper surface of the base portion 132 of the pedestal 130 and is placed thereon. The diameter of the T-shaped end of the shaft 250 is slightly smaller than the diameters of the inner annular region 204 of the optical array 150 and the opening of the window 210.

[0167] One of the actuators 170 is attached to the distal end of the shaft 250. After the clamp electrode (300 or 302) is declamped by the controller 190, the actuator 170 can move the substrate 140 up and down by moving the shaft 250 through the stem portion 134 and the base portion 132 of the pedestal 130.

[0168] A conduit 252 is drilled through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 and extends to the T-shaped end of the shaft 250. The shaft 250 includes a plurality of holes 254 drilled radially through the T-shaped end of the shaft 250. Near the T-shaped end of the shaft 250, one end of the conduit 252 is connected to the plurality of holes 254. The distal end of the conduit 252 extends outside the distal end of the shaft 250. The distal end of the conduit 252 is connected to one of the gas sources 104 through a valve 152 (shown in FIG. 1). In FIG. 7B, when the shaft 250 lifts the substrate 140 after the substrate 140 is declamped, purge gas is supplied through the conduit 252. The purge gas flows through the conduit 252, flows out through the holes 254, and flows radially across the upper part of the window 210 in the direction of the illustrated arrow to clean the window 210.

[0169] The stem portion 134 of the pedestal 130 further includes a conduit 256 through which an electrical connection (e.g., an insulated wire or conductor) to an electrical element within the base portion 132 of the pedestal 130 is provided. The distal end of the electrical connection is connected to the controller 190 (shown in FIG. 1). The conduit 256 is drilled through and extends through the stem portion 134 of the pedestal 130. The conduit 256 extends within the base portion 132 of the pedestal 130 and extends over the inner annular region 204 of the optical array 150. The conduits 252, 256, and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0170] In FIG. 7B, to lift the substrate, the controller 190 stops the operation of the clamping electrode (300 or 302). When the substrate 140 is lifted, the substrate 140 is held by the T-shaped end of the shaft 250. When the substrate 140 is lifted, the actuator 170 can also rotate the substrate 140 relative to the optical array 150 by rotating the shaft 250. When it is necessary to rotate the substrate 140 relative to the optical array 150, the controller 190 activates the actuator 170 such that the shaft 250 lifts and rotates the substrate 140. In some applications, the substrate 140 can be lifted and held stationary, and the pedestal 130 can be rotated to rotate the optical array 150 relative to the substrate 140.

[0171] When the substrate 140 is lifted, the controller 190 enables purge gas to flow through the conduit 252 and the holes 254 by opening the valve 152 (shown in FIG. 1). The purge gas flows through the conduit 252 and the holes 254 and radially across above the window 210 as indicated by the arrow in FIG. 7B. The flow of the purge gas across above the window 210 removes any material that may be deposited on the window 210. The flow of the purge gas can also prevent any material from flowing to and depositing on the window 210. Further, the flow of the purge gas can also wash or remove any unwanted contamination that may occur on the window 210. The controller 190 controls the valves 152 and 184 (shown in FIG. 1) so that the material removed from the window 210 by the vacuum pump 180 is discharged from the processing chamber 101.

[0172] Subsequently, the controller 190 places the substrate 140 on the window 210 by actuating the actuator 170 to lower the shaft 250. The controller 190 clamps the substrate 140 to the pedestal 30 by actuating the clamp electrodes (300 or 302). The optical array 150 reheats the substrate 140 as described above. The procedure is repeated as necessary until the processing of the substrate 140 is completed. Section 6: Faraday Shield

[0173] This section is organized as follows. FIGS. 8A - 10B show examples of an optical array 150 that includes a clamping electrode (300 or 302) and additionally includes a Faraday shield 350, which are implemented within pedestal 130 when electrostatic clamping is used to clamp substrate 140 to pedestal 130. FIGS. 8A and 8B show an example of an optical array 150 that includes a clamping electrode and a Faraday shield 350, both of which are formed of a conductive material that is also optically transparent. FIG. 8A shows a top view of an optical array 150 that includes a clamping electrode and a Faraday shield 350, both formed of a conductive and optically transparent material. FIG. 8B shows a cross-sectional view of the optical array 150 taken along the A - A cross-section line of FIG. 8A. FIGS. 9A and 9B show an example of an optical array 150 that includes a clamping electrode formed of a metal material and a Faraday shield 350 formed of a conductive and optically transparent material. FIG. 9A shows a top view of an optical array 150 that includes a clamping electrode formed of a metal material and a Faraday shield 350 formed of a conductive and optically transparent material. FIG. 9B shows a cross-sectional view of the optical array 150 taken along the A - A cross-section line of FIG. 9A. FIGS. 10A and 10B show pedestal 130 that includes optical array 150, which includes a Faraday shield 350 formed of a conductive and optically transparent material and may include the clamping electrode shown in FIGS. 8A and 8B or the clamping electrode shown in FIGS. 9A and 9B. Further, FIGS. 10A and 10B show a purging scheme and a rotation scheme that are used to keep window 210 clean and to rotate substrate 140 relative to optical array 150.

[0174] Figures 8A and 8B are similar to Figures 5A and 5B, except that the optical array 150 shown in Figures 8A and 8B further includes a Faraday shield 350. Accordingly, all other descriptions of Figures 5A and 5B apply to Figures 8A - 10B and are not repeated for the sake of brevity. In Figures 8A and 8B, similar to the clamp electrode 300, the Faraday shield 350 is also formed of the same optically transparent and conductive material (e.g., indium tin oxide) as the clamp electrode 300. The Faraday shield 350 prevents interference by the LEDs 200 to the RF system 142 used to generate plasma within the processing chamber 101. To prevent interference, the Faraday shield 350 is positioned below the clamp electrode 300 and above the LEDs 200. The Faraday shield 350 is embedded as an individual layer within the window 210 below the clamp electrode 300. The dielectric material of the window 210 electrically insulates the Faraday shield 350, resulting in an electrical separation between the clamp electrode 300 and the Faraday shield 350. In some examples, although not shown, the Faraday shield 350 may be disposed below the window 210 and above the LEDs 200. The window 210, the clamp electrode 300, the Faraday shield 350, and the LEDs 200 are located in corresponding parallel planes parallel to the base portion 132 of the pedestal 130. When implemented within the pedestal 130 as shown in Figures 10A and 10B, the Faraday shield 350 can be grounded.

[0175] Figures 9A and 9B are the same as Figures 6A and 6B, except that the optical array 150 shown in Figures 9A and 9B further includes a Faraday shield 350. Accordingly, all other descriptions of Figures 6A and 6B apply to Figures 9A - 10B and are not repeated for the sake of brevity. In Figures 9A and 9B, the clamp electrode 352 is formed of a conductive and optically opaque material such as metal, while the Faraday shield 350 is formed of an optically transparent and conductive material (e.g., indium tin oxide). The Faraday shield 350 prevents interference by the LEDs 200 to the RF system 142 used to generate plasma in the processing chamber 101. To prevent interference, the Faraday shield 350 is positioned below the clamp electrode 302 and above the LEDs 200. The Faraday shield 350 is embedded as an individual layer within the window 210 below the clamp electrode 302. The dielectric material of the window 210 electrically insulates the Faraday shield 350, providing electrical separation between the clamp electrode 302 and the Faraday shield 350. In some examples, although not shown, the Faraday shield 350 may be disposed below the window 210 and above the LEDs 200. The window 210, the clamp electrode 302, the Faraday shield 350, and the LEDs 200 are located in corresponding parallel planes parallel to the base portion 132 of the pedestal 130. When implemented within the pedestal 130 as shown in Figures 10A and 10B, the Faraday shield 350 can be grounded.

[0176] Figures 10A and 10B show a pedestal 130 that includes an optical array 150, which may include the clamp electrodes 300 and the Faraday shield 350 shown in FIGS. 8A and 8B, or the clamp electrodes 302 and the Faraday shield 350 shown in FIGS. 9A and 9B. Thus, the pedestal 130 shown in FIGS. 10A and 10B may be referred to as electrostatic chucks (ESCs). Further, FIGS. 10A and 10B show a purging scheme and a rotation scheme that are used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150. FIGS. 10A and 10B are similar to FIGS. 7A and 7B, except that the Faraday shield 350 is added. Thus, the description of FIGS. 7A and 7B applies to FIGS. 10A and 10B and is not repeated for the sake of brevity. In FIGS. 10A and 10B, an additional electrical connection for grounding the Faraday shield 350 is provided through the conduit 256. Section 7: Mechanical Clamping

[0177] This section is organized as follows. FIGS. 11A - 12C show examples of an optical array 150 mounted within a pedestal 130 when mechanical clamping is used to clamp a substrate 140 to the pedestal 130. FIGS. 11A - 11C show a pedestal 130 including an optical array 150 and a clamping pin 400 mounted on the upper edge 139 of the base portion 132 of the pedestal 130. In FIGS. 11A - 11C, a window 210 is included within the extent of the upper edge 139 of the base portion 132 of the pedestal 130. Further, FIGS. 11A - 11C show a purging scheme and a rotation scheme used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150. FIGS. 12A - 12C show a pedestal 130 including an optical array 150 and a clamping pin 400 mounted on a window 210 that extends above the upper edge 139 of the base portion 132 of the pedestal 130 and covers the upper edge 139. Further, FIGS. 12A - 12C show a purging scheme and a rotation scheme used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150. Examples of mechanical clamping are shown in FIGS. 11A - 12C, but alternatively, other types of mechanical clamping may be used to clamp the substrate 140.

[0178] FIGS. 11A - 11C show a pedestal 130 including an optical array 150 and a clamping pin 400 mounted on the upper edge 139 of the base portion 132 of the pedestal 130. In FIG. 11A, together with the window 210, the optical array 150 is disposed within an annular cavity 138 formed within the base portion 132 of the pedestal 130 as described above. The depth of the annular cavity 138 is equal to the height of the optical array 150 excluding the height of the window 210. The optical array 150 and the base portion 132 of the pedestal 130 are in the same plane. Thus, the upper surface of the window 210 is located within the plane in which the upper edge 139 of the base portion 132 of the pedestal 130 is located.

[0179] A plurality of clamp pins 400 are arranged on the upper edge 139 of the base portion 132 of the pedestal 130. The substrate 140 is clamped and unclamped by rotating the clamp pins 400 in opposite directions as follows. A ring 402 having gear-shaped teeth (not shown) disposed on the OD portion of the ring 402 is disposed within the base portion 132 of the pedestal 130. The ring 402 is disposed below the optical array 150 in a plane parallel to the optical array.

[0180] A plurality of shafts 404 extend vertically from the OD of the ring 402 through the upper edge 139 of the base portion 132 of the pedestal 130 and connect to the lowermost part of the clamp pin 400. The first end of each shaft 404 is connected to the lowermost part of the corresponding clamp pin 400. The second end of each shaft 404 includes a gear (not shown) that engages with teeth in the corresponding part of the ring 402. The shafts 404 are disposed around the optical array 150.

[0181] An actuator 406 is connected to the ring 402. A controller 190 controls the actuator 406. The actuator 406 is capable of rotating the ring 402 in a first direction (e.g., clockwise) and a second direction opposite to the first direction (e.g., counterclockwise) about the vertical axis of the pedestal 130. When the actuator 406 rotates the ring 402 in the first direction, the shafts 404 and the clamp pins 400 connected to the shafts 404 rotate (spin) in the second direction. Conversely, when the actuator 406 rotates the ring 402 in the second direction, the shafts 404 and the clamp pins 400 connected to the shafts 404 rotate (spin) in the first direction.

[0182] When the clamping pin 400 rotates (spins) in a certain direction (for example, the first direction), the substrate 140 is held (clamped) within a depression near the upper part of the clamping pin 400. Conversely, when the clamping pin 400 rotates (spins) in the reverse direction (for example, the second direction), the substrate 140 is released (unclamped) from the clamping pin 400. The controller 190 controls the actuator 406, adjusts the clamping and unclamping of the substrate 140, and at the same time controls the movement of the shaft 250 as shown in FIGS. 11B and 11C. When the substrate is clamped using the clamping pin 400, the controller 190 heats the substrate 140 as described above by controlling the optical array 150.

[0183] In FIG. 11B, the stem portion 134 of the pedestal 130 includes the shaft 250. The shaft 250 extends through the centers of the stem portion 134 and the base portion 132 of the pedestal 130. The shaft 250 includes a T-shaped end (i.e., the horizontal portion forming the upper part of the T) and a distal end (i.e., the vertical portion forming the bottom of the T). The T-shaped end of the shaft 250 extends through the inner annular region 204 of the optical array 150, the opening of the window 210, and the central region of the upper surface of the base portion 132 of the pedestal 130. The upper surface of the T-shaped end of the shaft 250 is at the same height as the upper surface of the window 210. The bottom surface of the T-shaped end of the shaft 250 is at the same height as the central region of the upper surface of the base portion 132 of the pedestal 130 and is placed thereon. The diameter of the T-shaped end of the shaft 250 is slightly smaller than the diameters of the inner annular region 204 of the optical array 150 and the opening of the window 210.

[0184] The distal end of the shaft 250 extends through the bottom end of the stem portion 134 of the pedestal 130. One of the actuators 170 is attached to the distal end of the shaft 250. The actuator 170 can raise and lower the substrate 140 by moving the shaft 250 through the stem portion 134 and the base portion 132 of the pedestal 130. In FIG. 11B, when the substrate 140 is lifted, the substrate 140 is held by the T-shaped end of the shaft 250. When the substrate 140 is lifted, the actuator 170 can also rotate the substrate 140 relative to the optical array 150 by rotating the shaft 250.

[0185] The conduit 252 is drilled through the shaft 250. The conduit 252 and the shaft 250 are coaxial. The conduit 252 extends through the shaft 250 to a point below the T-shaped end of the shaft 250 (i.e., not within the T-shaped end of the shaft 250). Near a point below the T-shaped end of the shaft 250, the shaft 250 includes a plurality of holes 255 drilled radially through the vertical portion of the shaft 250. The vertical portion of the shaft 250 forms the bottom of the T of the shaft 250. Near a point below the T-shaped end of the shaft 250, one end of the conduit 252 is connected to the plurality of holes 255. The distal end of the conduit 252 extends outside the distal end of the shaft 250. The distal end of the conduit 252 is connected through a valve 152 (shown in FIG. 1) to one of the gas sources 104. In FIG. 11C, when the substrate is unclamped and the shaft 250 lifts the substrate 140, purge gas is supplied through the conduit 252. The purge gas flows through the conduit 252, out through the holes 255, and across the upper portion of the window 210 radially in the direction of the illustrated arrow to clean the window 210.

[0186] In some examples, the conduit 252 may further extend into the T-shaped end of the shaft 250, and the shaft 250 may additionally include a plurality of holes 254 (shown in previous drawings) that are radially perforated through the T-shaped end of the shaft 250. The shaft 250 may extend above the window 210 such that the upper surface of the T-shaped end of the shaft 250 is above the upper surface of the window. Thus, with the substrate 140 placed on the clamp pin 400, purge gas may be supplied through the conduit 252 and the holes 254. The purge gas can flow through the conduit 252, out through the holes 254, and flow radially across above the window 210 to clean the window 210 during processing of the substrate 140.

[0187] The stem portion 134 of the pedestal 130 further includes a conduit 256 through which an electrical connection (e.g., an insulated wire or an insulated conductor) to an electrical element within the base portion 132 of the pedestal 130 is provided. The distal end of the electrical connection is connected to the controller 190 (shown in FIG. 1). The conduit 256 is perforated through and extends through the stem portion 134 of the pedestal 130. The conduit 256 extends within the base portion 132 of the pedestal 130 and extends across the inner annular region 204 of the optical array 150. The conduits 252, 256, and the shaft 250 are coaxial. The diameter of the conduit 256 is larger than the diameter of the shaft 250.

[0188] In FIG. 11C, when it is necessary to rotate the substrate 140 relative to the optical array 150, the actuator 406 unclamps the substrate 140, and the controller 190 actuates the actuator 170 such that the shaft 250 lifts and rotates the substrate 140. In some applications, the substrate 140 can be lifted and held stationary, and the pedestal 130 can be rotated to rotate the optical array 150 relative to the substrate 140. In some applications, although not shown, the substrate 140 clamped by the clamp pin 400 can be rotated by rotating the base portion 132 of the pedestal 130. In this scenario, the optical array 150 is stationary and is held by the central portion of the stationary stem portion 256 of the pedestal 130.

[0189] When the substrate 140 is lifted, the controller 190 enables purge gas to flow through the conduit 252 and the hole 254 by opening the valve 152 (shown in FIG. 1). The purge gas flows through the conduit 252 and the hole 255 (and additionally through the hole 254 as described above), radially across above the window 210 as indicated by the arrow, and cleans the window. The flow of purge gas radially across above the window 210 removes any material that may be deposited on the window 210. The controller 190 controls the valves 152 and 184 (shown in FIG. 1) so that the material removed from the window 210 by the vacuum pump 180 is discharged from the processing chamber 101.

[0190] Subsequently, the actuator 170 relocates the substrate 140 onto the clamp pin 400 by lowering the shaft 250. The controller 190 clamps the substrate 140 to the clamp pin 400 as described above by controlling the actuator 406. The optical array 150 reheats the substrate 140 as described above. The procedure is repeated as necessary until the processing of the substrate 140 is complete.

[0191] FIGS. 12A - 12C show the pedestal 130 including the optical array 150 and the clamp pin 400 mounted to the window 210 that extends above and covers the upper edge 139 of the base portion 132 of the pedestal 130. Further, FIGS. 12A - 12C show the purging scheme and the rotation scheme used to keep the window 210 clean and to rotate the substrate 140 relative to the optical array 150.

[0192] The differences between FIGS. 12 to 12C and FIGS. 11A to 11C are only as follows. In FIGS. 12A to 12C, the window 210 extends around the upper edge 139 of the base portion 132 of the pedestal 130 and covers the upper edge 139. Accordingly, the clamp pin 400 is disposed on the upper surface of the window 210 along the OD of the window 210 instead of on the upper edge 139 of the base portion 132 of the pedestal 130. The shaft 404 extends vertically from the OD of the ring 402 through the upper edge 139 of the base portion 132 of the pedestal 130 and the window 210 and connects to the lowermost portion of the clamp pin 400. In some examples, depending on the arrangement of the optical array 150 and the clamp pin 400, the shaft 404 may pass through the optical array 150 and connect to the clamp pin 400. All other descriptions of FIGS. 11A to 11C apply to FIGS. 12A to 12C and are therefore not repeated for the sake of brevity. Section 8: Method

[0193] FIG. 13 shows a method 500 of processing a substrate using either the optical array and pedestal of FIGS. 2A to 12C in the system of FIG. 1 according to the present disclosure. At 502, the substrate 140 is loaded into the processing chamber 101 (shown in FIG. 1). The substrate 140 is not yet disposed on the pedestal 130 that includes the optical array 150. For example, the substrate 140 may be held above the pedestal 130 and supported by lift pins or other lift mechanisms (e.g., the shaft 250).

[0194] At 504, optionally, with the substrate 140 held above the pedestal 130, the optical array 150 is turned on and the substrate 140 is preheated by supplying power at a first power level to the LEDs 200. For example, the substrate 140 is preheated for a predetermined time.

[0195] At 506, the substrate 140 is lowered onto the pedestal 130 and the power supplied to the LEDs 200 is reduced to a second power level. Alternatively, the power supplied to the LEDs 200 is reduced to a second power level and the substrate 140 is lowered onto the pedestal 130.

[0196] At 508, optionally, the substrate 140 is clamped to the pedestal 130 using any of the clamping methods described above. For example, when using the mesa 214 to support the substrate 140 instead of using any of the other clamping methods described above, the clamping may be optional.

[0197] At 510, other process conditions for depositing a film on the substrate 140 are established, such as the gas flow and vapor flow passing through the showerhead 120, the wafer - showerhead gap, plasma excitation, etc. At 512, a film is deposited on the substrate 140 by a continuous method such as PECVD or using a cyclic deposition method such as ALD. At 514, other process conditions such as the gas flow and vapor flow, the wafer - showerhead gap, plasma excitation, etc. are turned off or mostly invalidated.

[0198] At 516, the power to the LEDs 200 is reduced to a third power level. At 518, after a predetermined time, the substrate 140 is lifted from the pedestal 130. At this point, the substrate 140 may be rotated if necessary, and steps 508 - 518 may be repeated. At 520, the substrate 140 is removed from the processing chamber 101.

[0199] The foregoing description is merely illustrative in nature and is not intended to limit the present disclosure, its application, or its use. The broad teachings of the present disclosure can be implemented in various forms. Accordingly, although the present disclosure includes specific examples, other variations will become apparent upon review of the drawings, the specification, and the following claims, and the true scope of the present disclosure should not be so limited.

[0200] It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without changing the principles of the present disclosure. Further, while each embodiment has been described as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure may be implemented in and / or combined with any of the features of other embodiments, even if the combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitutions between one or more embodiments remain within the scope of the present disclosure.

[0201] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms including "connected", "engaged", "coupled", "adjacent", "next to", "on", "above", "below", and "disposed". Unless explicitly described as "direct", when a relationship between a first element and a second element is described in the above disclosure, the relationship can be a direct relationship with no other intervening elements between the first element and the second element, but can also be an indirect relationship with one or more intervening elements (spatially or functionally) between the first element and the second element. As used herein, the expression "at least one of A, B, and C" should be interpreted to mean the logic (A OR B OR C) using non-exclusive logical OR, and should not be interpreted to mean "at least one of A, at least one of B, and at least one of C".

[0202] In some implementations, the controller is part of a system, and the system may be part of the examples described above. Such a system may include semiconductor processing equipment that includes one or more process tools, one or more chambers, one or more processing platforms, and / or certain processing components (such as wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronic devices to control the operation of the electronic devices before, during, and after the processing of semiconductor wafers or substrates. The electronic device may be referred to as a "controller" that can control various components or sub-parts of one or more systems.

[0203] The controller may be programmed to control any of the processes disclosed herein, depending on the processing requirements and / or the type of system. Such processes include, for example, delivery of processing gases, temperature setting (e.g., heating and / or cooling), pressure setting, vacuum setting, power setting, radio frequency (RF) generator setting, RF matching circuit setting, frequency setting, flow rate setting, fluid delivery setting, position and motion setting, loading and unloading of wafers to and from the tool, and loading and unloading of wafers to and from other transfer tools and / or load locks connected or coupled to a particular system.

[0204] Generally, the controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that, for example, receives commands, issues commands, controls operations, enables cleaning operations, and enables endpoint measurements. The integrated circuits may include chips in the form of firmware that stores program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (such as software).

[0205] Program instructions may be instructions transmitted to a controller in the form of various individual settings (or program files), defining operating parameters for performing a specific process on or for a semiconductor wafer, or for a system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer to achieve one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or wafer dies.

[0206] In some implementations, the controller may be part of a computer integrated with, coupled to, or otherwise network-connected to the system, or may be coupled to such a computer, or a combination thereof. For example, the controller may be within the "cloud" or part of the entire fab host computer system, thereby enabling remote access to wafer processing. The computer may monitor the current progress of the fabrication operation, verify the history of past fabrication operations, and verify trends or performance criteria from multiple fabrication operations, by enabling remote access to the system, to change the parameters of the current process, set the processing steps following the current process, or initiate a new process.

[0207] In some examples, a remote computer (e.g., a server) may provide a process recipe to the system through a network that may include a local network or the Internet. The remote computer may include a user interface that enables the input or programming of parameters and / or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify the parameters for each processing step executed during one or more operations. It should be understood that the parameters may be specific to the type of process being executed and the type of tool configured to be coupled or controlled by the controller.

[0208] Thus, as described above, the controller may be distributed, such as by including one or more separate controllers that are networked together and operate towards a common purpose such as the processes and controls described herein. Examples of controllers distributed for such purposes include one or more integrated circuits on a chamber that are remotely located (such as at the platform level or as part of a remote computer) and communicate with one or more integrated circuits on the chamber to collaboratively control the process on the chamber.

[0209] Exemplary systems include, but are not limited to, plasma etching chambers or modules, deposition chambers or modules, metal plating chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing systems associated with or used in the fabrication and / or manufacture of semiconductor wafers.

[0210] As described above, depending on one or more process steps performed by a tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a main computer, another controller, or a tool used for material transport to and from the tool position and / or load port of a wafer container within a semiconductor manufacturing factory.

Claims

1. A pedestal configured to deposit a material on a substrate, the stem portion of the pedestal, a base portion of the pedestal attached to the stem portion of the pedestal, the base portion including an array of optical elements configured to emit light for optically heating the substrate, A pedestal comprising.

2. The pedestal according to claim 1, wherein the optical element includes a light emitting diode.

3. The pedestal according to claim 1, wherein the optical element includes a light emitting diode configured to emit light having a wavelength between 530 nm and 1000 nm.

4. The pedestal according to claim 1, wherein the base portion and the array are in the same plane.

5. The pedestal according to claim 1, wherein the base portion and the array are circular, and the optical elements are arranged concentrically from the inner diameter to the outer diameter of the array.

6. The pedestal according to claim 1, wherein the base portion and the array are circular, and the outer diameter of the array is less than or equal to the outer diameter of the base portion.

7. The pedestal according to claim 1, wherein the base portion and the array are circular, and the outer diameter of the array is less than or equal to the outer diameter of the substrate.

8. The pedestal according to claim 1, wherein the base portion and the array are circular, and the outer diameter of the array is at least equal to the outer diameter of the substrate.

9. The pedestal according to claim 1, wherein the array is embedded in a cavity formed in an upper region of the base portion, and the array further includes an optically transparent window covering the optical elements.

10. The pedestal according to claim 1, wherein the array further includes an optically transparent window having a first surface covering the optical elements and a second surface facing the substrate.

11. The pedestal according to claim 1, the optical elements are arranged on a printed circuit board (PCB), the array further includes an optically transparent window hermetically attached to the PCB, A reflective material is disposed on an inner portion of the optical array to reflect the light from the optical elements to the substrate.

12. The pedestal according to claim 1, wherein the array further includes one or more drive circuits configured to control power supply to the optical elements.

13. The pedestal according to claim 1, wherein the array further includes one or more drive circuits configured to control the operation of selected ones of the optical elements.

14. The pedestal according to claim 1, wherein the array a printed circuit board on which the optical element is disposed, one or more drive circuits for driving the optical element, comprises, the one or more drive circuits and the optical element are disposed on the same surface of the printed circuit board.

15. The pedestal according to claim 1, wherein the array a printed circuit board on which the optical element is disposed, one or more drive circuits for driving the optical element, comprises, the one or more drive circuits and the optical element are disposed on opposite surfaces of the printed circuit board.

16. The pedestal according to claim 1, wherein the array a printed circuit board, a plurality of drive circuits for driving the optical element, comprises, at least one of the optical element and the drive circuits is disposed on the same surface of the printed circuit board, and at least one of the drive circuits is disposed on the surface of the printed circuit board opposite to the surface on which the optical element is disposed.

17. The pedestal according to claim 1, a shaft disposed through the center of the stem portion, the base portion, and the array, an actuator coupled to the shaft and configured to move the substrate relative to the pedestal. further comprises.

18. The pedestal according to claim 1, a shaft disposed through the center of the stem portion, the base portion, and the array, an actuator coupled to the shaft and configured to move the substrate perpendicular to the plane in which the base portion is located. further comprises.

19. The pedestal according to claim 1, a shaft disposed through the center of the stem portion, the base portion, and the array, an actuator coupled to the shaft and configured to rotate the substrate relative to the base portion. further comprises.

20. The pedestal according to claim 1, wherein the array further includes an optically transparent window covering the optical element, the pedestal is A shaft disposed through the center of the stem portion, the base portion, and the array, the shaft including a conduit for receiving gas and a plurality of holes in fluid communication with the conduit near a first end of the shaft proximal to the array. An actuator coupled to a second end of the shaft and configured to move the substrate perpendicular to the plane in which the base portion is located. Further comprising The plurality of holes are a pedestal that radially supplies the gas above the window when the shaft is raised above the array.

21. The pedestal according to claim 1, wherein the array further includes an optically transparent window having a first surface covering the optical element and a second surface facing the substrate, and the window includes a plurality of mesas on the second surface.

22. The pedestal according to claim 1, wherein the array further includes an optically transparent window having a first surface covering the optical element and a second surface facing the substrate, and the window includes a plurality of mesas spaced apart from the arrangement of the optical elements in the array and disposed on the second surface.

23. The pedestal according to claim 1, The base portion and the array are circular, The optical elements are arranged concentrically from the inner diameter to the outer diameter of the array, The array further includes a circular and optically transparent window having a first surface covering the optical element and a second surface facing the substrate, The window includes a plurality of mesas concentrically arranged on the second surface at intervals with respect to the optical element.

24. The pedestal according to claim 23, wherein the pedestal A shaft disposed through the center of the stem portion, the base portion, and the array, the shaft including a conduit for receiving gas and a plurality of holes in fluid communication with the conduit near a first end of the shaft proximal to the array. An actuator coupled to a second end of the shaft and configured to move the substrate perpendicular to the plane in which the base portion is located. Further comprising The plurality of holes are a pedestal that radially supplies the gas above the window and the mesa when the shaft is raised above the array.

25. The pedestal according to claim 23, wherein the pedestal A plurality of conduits disposed within the stem portion and the base portion for receiving the gas; A plurality of holes located on the outer periphery of the base portion, at the same height as the mesa on the window, and in fluid communication with the conduits; Further comprising; The pedestal that supplies the gas radially above the window and the mesa.

26. The pedestal according to claim 1, wherein the array comprises: An optically transparent window covering the optical element; A plurality of electrodes disposed within the window for electrostatically clamping the substrate to the pedestal; Further comprising a pedestal.

27. The pedestal according to claim 26, wherein the window and the electrodes are in the same plane.

28. The pedestal according to claim 26, wherein the electrodes comprise an optically transparent and conductive material.

29. The pedestal according to claim 26, wherein the electrodes comprise a metal material, and the electrodes include holes aligned with the optical element.

30. The pedestal according to claim 26, further comprising a layer of an optically transparent and conductive material disposed between the electrodes and the optical element.

31. The pedestal according to claim 30, wherein the window, the electrodes, the layer, and the optical element are located in corresponding parallel planes parallel to the base portion of the pedestal.

32. The pedestal according to claim 29, further comprising a layer of an optically transparent and conductive material disposed within the window, one surface of the layer facing the electrodes, and the opposite surface of the layer facing the optical element.

33. The pedestal according to claim 32, wherein the window, the electrodes, the layer, and the optical element are located in corresponding parallel planes parallel to the base portion of the pedestal.

34. The pedestal according to claim 1, A plurality of conduits provided through the stem portion, the base portion, and the array; A vacuum pump configured to clamp the substrate to the pedestal using vacuum clamping; Further comprising a pedestal.

35. The pedestal according to claim 1, A plurality of clamp pins disposed on the outer periphery of the base portion; An actuator connected to the clamp pins and configured to clamp the substrate; Further comprising a pedestal.

36. The pedestal according to claim 35, A ring disposed within the base portion adjacent to the array and connected to the actuator, A plurality of shafts disposed within the base portion, connected to the ring and attached to corresponding ones of the clamp pins, A pedestal further comprising.

37. The pedestal according to claim 36, wherein the shafts are disposed around the array.

38. The pedestal according to claim 36, wherein the shafts pass through the array.

39. The pedestal according to claim 36, wherein the actuator is configured to clamp the substrate by operating the ring in a first direction and unclamp the substrate by operating the ring in a second direction.

40. The pedestal according to claim 1, wherein the array further includes an optically transparent window that covers the optical element and extends to the outer periphery of the base portion, The pedestal is A plurality of clamp pins disposed on the window near the outer periphery of the base portion, An actuator connected to the clamp pins and configured to clamp the substrate, A pedestal further comprising.

41. A method of depositing a material on a substrate in a processing chamber, Loading the substrate into the processing chamber, Optically heating the substrate using an array of optical elements embedded within a base portion of a pedestal within the processing chamber. A method including.

42. The method according to claim 41, Holding the substrate above the pedestal, Preheating the substrate by supplying power at a first power level to the optical elements. A method further including.

43. The method according to claim 42, after the preheating, Lowering the substrate onto the pedestal, Heating the substrate by supplying power at a second power level different from the first power level to the optical elements. A method further including.

44. The method according to claim 42, after the preheating, Heating the substrate by supplying power at a second power level different from the first power level to the optical elements, Lowering the substrate onto the pedestal. A method further including.

45. The method according to claim 43, further comprising clamping the substrate to the pedestal using electrostatic clamping, vacuum clamping, or mechanical clamping.

46. The method according to claim 45, further comprising establishing other conditions for processing the substrate, the other conditions including supplying gas flow and vapor flow through a showerhead, adjusting a substrate-showerhead gap, and exciting plasma in the processing chamber.

47. The method according to claim 46, further comprising depositing the material on the substrate using plasma-enhanced chemical vapor deposition or atomic layer deposition.

48. The method according to claim 47, further comprising reducing the power supplied to the array to a third power level.

49. The method according to claim 48, lifting the substrate from the pedestal, removing the substrate from the processing chamber, and further comprising.

50. The method according to claim 44, further comprising establishing other conditions for processing the substrate, the other conditions including supplying gas flow and vapor flow through a showerhead, adjusting a substrate-showerhead gap, and exciting plasma in the processing chamber.

51. The method according to claim 50, further comprising depositing the material on the substrate using plasma-enhanced chemical vapor deposition or atomic layer deposition.

52. The method according to claim 51, further comprising reducing the power supplied to the array to a third power level.

53. The method according to claim 52, lifting the substrate from the pedestal, removing the substrate from the processing chamber, and further comprising.

54. The method according to claim 41, further comprising clamping the substrate to the pedestal using electrostatic clamping, vacuum clamping, or mechanical clamping.

55. The method according to claim 54, further comprising establishing other conditions for processing the substrate, said other conditions including supplying gas flow and vapor flow through a showerhead, adjusting the gap between the substrate and the showerhead, and exciting plasma in the processing chamber.

56. The method according to claim 55, further comprising depositing the material on the substrate using plasma enhanced chemical vapor deposition or atomic layer deposition.

57. The method according to claim 56, further comprising reducing the power supplied to the array to a third power level.

58. The method according to claim 57, lifting the substrate from the pedestal, removing the substrate from the processing chamber, and further comprising.

59. The method according to claim 41, placing the substrate on the pedestal, heating the substrate by supplying power to the array, and further comprising.

60. The method according to claim 59, further comprising establishing other conditions for processing the substrate, said other conditions including supplying gas flow and vapor flow through a showerhead, adjusting the gap between the substrate and the showerhead, and exciting plasma in the processing chamber.

61. The method according to claim 60, further comprising depositing the material on the substrate using plasma enhanced chemical vapor deposition or atomic layer deposition.

62. The method according to claim 61, further comprising reducing the power supplied to the array.

63. The method according to claim 62, lifting the substrate from the pedestal, removing the substrate from the processing chamber, and further comprising.

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