Advanced Packaging High-Volume Mode Digital Lithography Tool

Abstract

An exemplary method of packaging a substrate may include rotating and aligning the substrate to a predetermined angular position. The method may include transporting the substrate to a measurement station. The method may include measuring the topology of the substrate at the measurement station. The method may include applying a first chucking force to the substrate to flatten the substrate. The method may include generating a mapping of die patterns on the exposed surface of the substrate. The method may include transporting the substrate to a printing station. The method may include applying a second chucking force to the substrate to flatten the substrate against the surface of the printing station. The method may include adjusting a printing pattern based on the mapping of die patterns. The method may include printing the printing pattern on the exposed surface of the substrate.

Description

Technical Field

[0001] Cross - Reference to Related Applications

[0001] This application claims the benefit and priority of U.S. Patent Application No. 17 / 872,546, entitled "ADVANCED - PACKAGING HIGH - VOLUME - MODE DIGITAL - LITHOGRAPHY - TOOL", filed on July 25, 2022, which is hereby incorporated by reference in its entirety.

[0002]

[0002] This technology relates to components and devices for semiconductor manufacturing. More specifically, this technology relates to lithography systems and other semiconductor processing equipment used in advanced packaging.

Background Art

[0003]

[0003] Integrated circuits are realized by a process that creates a complexly patterned layer of material on the surface of a substrate. After the integrated circuit is formed on the substrate, the substrate is typically diced into individual dies. When the semiconductor manufacturing of the die is complete, the die is usually attached to a PCB board or positioned to communicate electrically with other die components so that the die can perform the functions for which it was designed. To achieve these purposes, first, one or several dies need to be "packaged" to connect signals and adapt to the difference in feature dimensions between the die and the PCB board. When packaging dies using conventional techniques, the dies must be positioned within a tolerance of several hundred to several tens of micrometers. However, following Moore's Law, as dies become smaller and more powerful, packaging also needs to evolve to the next generation so as not to affect the performance of the dies.

[0004]

[0004] In recent dies, the dimensional tolerances for die handling may be on the order of a few micrometers or sub-micrometers. Further, due to the "warping effect" resulting from heterogeneous integration and the "die shift / rotation problem" resulting from the tolerances of die pick & place mechanisms, conventional packaging solutions can no longer provide sufficient accuracy to handle more advanced dies and are thus no longer suitable for current challenges.

[0005]

[0001] Accordingly, there is a need for improved systems and methods that can be used to efficiently package dies. These and other needs are addressed by the present technology.

Summary of the Invention

[0006]

[0005] An exemplary method of packaging a substrate may include rotating and aligning the substrate to a predetermined angular position. The method may include transporting the substrate to a measurement station. The method may include measuring the topology of the substrate at the measurement station. The method may include applying a first chucking force to the substrate to flatten the substrate. The method may include generating a mapping of the die pattern on the exposed surface of the substrate. The method may include transporting the substrate to a printing station. The method may include applying a second chucking force to the substrate to flatten the substrate against the surface of the printing station. The method may include adjusting the printing pattern based on the mapping of the die pattern. The method may include printing the printing pattern on the exposed surface of the substrate.

[0007]

[0006] In some embodiments, the method may include varying the magnitude of a first chucking force in a region of the substrate based on the topology of the substrate. The first chucking force may be applied using one or both of a vacuum chuck and an electrostatic chuck. The method may include re-measuring the topology of the substrate after applying the first chucking force. Measuring the topology of the substrate may include collecting data from one or both of a capacitance sensor and an optical sensor. Adjusting the printed pattern based on the die pattern mapping may include adjusting at least a portion of the printed pattern based on one or both of the lateral position and the rotational position of at least one die of the substrate. The substrate may include a first substrate. The method may include rotating and aligning a second substrate to a predetermined angular position while printing a printed pattern on an exposed surface of the first substrate, transporting the second substrate to a metrology station, measuring a second topology of the second substrate at the metrology station, applying a third chucking force to the second substrate to flatten the second substrate, and generating a second mapping of the die pattern on the exposed surface of the second substrate. The method may include transporting the second substrate to a buffer station. The method may include transporting the second substrate to a printing station. The method may include applying a fourth chucking force to the substrate to flatten the second substrate relative to the surface of the printing station. The method may include adjusting a second printed pattern of the second substrate based on the second mapping of the die pattern. The method may include printing the second printed pattern on the exposed surface of the substrate.

[0008]

[0007] Some embodiments of the present technology may include a method of packaging a substrate. The method may include rotating and aligning a plurality of substrates to a predetermined angular position. The method may include measuring the topology of each substrate. The method may include applying a first chucking force to each substrate to flatten each substrate. The method may include generating a mapping of the die pattern with respect to the exposed surface of the substrate. The method may include transporting each substrate to a printing station. The method may include applying a second chucking force to each substrate to flatten each substrate with respect to the surface of the printing station. The method may include adjusting a respective printing pattern for each substrate based on the mapping of the die pattern for each respective substrate. The method may include printing a respective printing pattern on the exposed surface of each respective substrate.

[0009]

[0008] In some embodiments, the method may include determining the magnitude of the first chucking force at several locations across the area of each substrate required to flatten each substrate. The method may include varying the magnitude of the first chucking force across the area of each substrate based on the determination. Rotating and aligning each substrate to a predetermined angular position includes identifying alignment marks on each substrate and rotating each substrate to align the alignment marks to the predetermined angular position It may include. The method may include inverting each substrate to expose the unprinted surface of each substrate. The method may include rotating and aligning each substrate to a predetermined angular position. The method may include measuring the topology of each substrate. The method may include applying a third chucking force to each substrate to flatten each substrate. The method may include generating a mapping of an additional die pattern on the unprinted surface of each substrate. The method may include transporting each substrate to a printing station. The method may include applying a fourth chucking force to each substrate to flatten each substrate against the surface of the printing station. The method may include adjusting an additional printing pattern based on the mapping of the additional die pattern. The method may include printing an additional printing pattern on the unprinted surface of each substrate. The first chucking force may be different for at least one of the plurality of substrates. The first chucking force of each substrate and the second chucking force of each substrate may be equal. The method may include transporting at least some of the plurality of substrates to a buffer station. Each of at least some of the plurality of substrates may be transported from the buffer station to the printing station. The method may include measuring a bevel on the packaging edge of each substrate It may include. Adjusting the printing pattern based on the mapping of the die pattern may include calculating one or more differences between the printing pattern and the mapping of the die pattern, and adjusting the position of at least a portion of the printing pattern based on the one or more differences.

[0010]

[0009] Some embodiments of the present technology may include a substrate packaging system. The system may include a robotic transfer system having a plurality of robotic arms. The system may include a substrate aligner for aligning the substrate to a predetermined angular position. The system may include at least one measurement station. The at least one measurement station may include a topology sensor. The at least one measurement station may include a die pattern sensor. The at least one measurement station may include an adaptive chuck mechanism communicatively coupled to the topology sensor. The system may include a printing station. In some embodiments, the system may include a substrate buffer station disposed between the at least one measurement station and the printing station.

[0011]

[0010] Such technology may provide a number of advantages over conventional systems and techniques. For example, embodiments of the present technology can provide solutions to address the problem of substrate warping when printing on a substrate. In particular, in embodiments, an adaptive chuck mechanism can be implemented to effectively flatten the substrate prior to the measurement and / or printing process. Embodiments of the present technology can provide solutions to address the problem of die position drift prior to printing on a substrate. In particular, embodiments can implement an in-line pattern correction function to effectively reduce printing pattern errors prior to the printing process. Further, the systems described herein can print several substrates sequentially and simultaneously, enabling preparation for printing and improving the throughput of the system. These and other embodiments, along with their many advantages and features, are described in more detail by the following description and the accompanying drawings.

[0012]

[0011] A further understanding of the nature and advantages of the disclosed technology can be realized by reference to the following portions of this specification and the drawings.

Brief Description of the Drawings

[0013]

Figure 1

[0012] Schematic top view of an exemplary packaging system according to some embodiments of the present technology.

Figure 1A

[0013] Schematic top view of an exemplary packaging system according to some embodiments of the present technology.

Figure 1B

[0014] Schematic side cross-sectional view of an exemplary packaging system according to some embodiments of the present technology.

Figure 2

[0015] Schematic isometric view of an exemplary buffer station according to some embodiments of the present technology.

Figure 3

[0016] Operations of an exemplary method for packaging a substrate according to some embodiments of the present technology.

Figure 4A - 4B

[0017] Schematic top view of a sequence for packaging a plurality of substrates according to some embodiments of the present technology.

Figure 4C - 4D

Figure 4E - 4F

Figure 4G - 4H

Figure 4I

DETAILED DESCRIPTION OF THE INVENTION

[0014]

[0018] Some of the figures are included as schematic diagrams. It should be understood that the figures are for illustrative purposes and should not be considered to be to scale unless expressly stated to be so. Further, as schematic diagrams, the figures are provided to aid understanding and may not include all aspects or information compared to a realistic depiction, and may include content emphasized for illustrative purposes.

[0015]

[0019] In the accompanying drawings, similar components and / or features may have the same reference numerals. Further, various components of the same type may be distinguished according to the reference numerals by letters that distinguish between similar components. When only a first reference numeral is used in this specification, the description is applicable to any one of the similar components having the same first reference numeral regardless of the letters.

[0016]

[0020] Substrate processing may include time-consuming processes for adding, removing, or otherwise changing materials on a wafer or semiconductor substrate. By efficiently moving the substrate, the waiting time can be shortened and the throughput of the substrate can be improved. To increase the number of substrates processed in a cluster tool, additional chambers can be incorporated on the mainframe. Although transfer robots and processing chambers can be continuously added by increasing the length of the tool, the space efficiency may deteriorate as the installation area of the cluster tool expands. Correspondingly, the present technology may include a cluster tool in which the number of processing chambers is increased within a specified installation area. To accommodate the limited installation area around the transfer robot, in the present technology, the number of processing chambers can be increased laterally outward from the robot. For example, some conventional cluster tools may include one or two processing chambers positioned around a section of a centrally located transfer robot to maximize the number of chambers radially around the robot. The present technology can develop this concept by incorporating additional chambers laterally outward as other chamber rows or other chamber groups. For example, the present technology can be applied to a cluster tool including three, four, five, six, or more processing chambers accessible at each of one or more robot access positions.

[0017]

[0021] As the features of the device become smaller, the tolerances across the entire substrate surface can become smaller. In many cases, films and / or other material layers deposited on the substrate during processing steps can cause the substrate to warp and / or otherwise distort. This warping can lead to problems during lithography (and other) processes, as the design patterns applied to the substrate can be affected by the distorted shape of the substrate. This can result in defects in the integrated circuits and / or other components created from the substrate, potentially reducing the die yield. Further, due to the tolerances of the robotic pick-and-place machine that applies the die to the substrate, as well as the viscous flow of the epoxy covering the substrate and die, some or all of the die positioned on the substrate can shift slightly or rotate from their intended positions. This can lead to defects such as conduction problems in the final integrated circuit, potentially reducing the yield of a given substrate.

[0018]

[0022] This technology overcomes these challenges by providing a new design platform that incorporates a digital lithography system with other modules to create an advanced packaging system. The digital lithography system described herein can address issues related to smaller critical dimensions required when packaging smaller dies and / or more powerful dies. Embodiments can include different variations for each individual packaging product and / or process to meet the needs of a particular application. Embodiments of the technology can include measuring the topology of a substrate and using an adaptive chuck to substantially flatten the substrate. Some measurements of the substrate, including the actual layout of the die on the substrate, may be captured while the substrate is being flattened. The substrate is then transported to a printing station, which can change the print layout to adjust the location of one or more print connections based on the actual layout of the die. The substrate is flattened again, and a print pattern can be printed on the substrate. Embodiments can also provide a modular station approach to substrate packaging, which can help improve the throughput of the substrate by preparing some substrates while other substrates are being printed. Thus, the technology can improve yield, create dies with better conductance, and / or improve throughput through the packaging system.

[0019]

[0023] The remaining disclosure routinely identifies specific lithography processes that utilize the disclosed technology, but it will be readily understood that the systems and methods are equally applicable to other chambers and processes that may occur in the described chambers. Accordingly, the technology should not be considered limited to use only with these specific lithography processes or chambers. Before additional variations and adjustments to this system according to embodiments of the technology are described, one possible system and chamber that may include lid stack components according to embodiments of the technology will be discussed.

[0020]

[0024] Figure 1 shows a schematic top view of an exemplary substrate packaging system 100 according to some embodiments of the present technology. System 100 can be used to perform semiconductor processing steps including lithography steps, as well as other deposition, etching, removal, and cleaning steps. Any aspect of system 100 may also be combined with other processing chambers or systems, as will be readily understood by those skilled in the art.

[0021]

[0025] System 100 can include several different stations or modules, and each station or module performs one or more specific tasks related to the processing of substrates. Substrates can be transported between various stations using a robotic transport system 105. The robotic transport system 105 can include one or more robotic arms 110 that can grip and / or otherwise engage each substrate to transport it between various stations. System 100 can include several storage units 115 (e.g., front-opening unified pod (FOUP)) that can be used to store substrates before and / or after a printing process. In some embodiments, one or more of the storage units 115 can function as an intermediate storage area after one or more printing processes have been performed, but before additional printing and / or other packaging processes are initiated. Although four storage units 115 are shown, it will be understood that any number of storage units 115 can be included in a single system 100. For example, system 100 can include at least about 1 storage unit, at least about 2 storage units, at least about 3 storage units, at least about 4 storage units, at least about 5 storage units, at least about 6 storage units, at least about 7 storage units, at least about 8 storage units, or more. In some embodiments, some or all of the storage units 115 can be used for multiple functions (e.g., pre-print storage, intermediate storage, post-print storage, etc.), and in other embodiments, some or all of the storage units 115 can be used for different functions.

[0022]

[0026] System 100 may include one or more substrate aligners 120 that each align a substrate to a predetermined angular position. For example, each substrate aligner 120 may include one or more rotating supports and one or more optical sensors. A robotic transfer system 105 can transfer substrates from a storage unit 115 to the rotating supports. The substrate aligner 120 can rotate the substrate until a corresponding optical sensor detects that a mark (e.g., a notch or other visible alignment mark) on the edge of the substrate has moved to a predetermined angular position. This alignment process can ensure that each substrate is properly oriented in subsequent printing processes. Although a single substrate aligner 120 is shown, it will be understood that system 100 may include any number of substrate aligners 120. For example, system 100 may include at least about one substrate aligner, at least about two substrate aligners, at least about three substrate aligners, at least about four substrate aligners, or more. Further, each substrate aligner 120 may include any number of sets of rotating supports and optical sensors, thereby enabling a single substrate aligner 120 to align multiple substrates simultaneously, which can help improve the throughput of system 100.

[0023]

[0027] System 100 may include at least one measurement station 125. Each measurement station may include at least one topology sensor, which may be used to determine the topology of each substrate along the z - direction (which may be orthogonal to the support surface of the measurement station 125). For example, a film layer deposited on a substrate may cause different stresses that result in warping or other deflections of the substrate. The topology sensor may be used to identify any z - direction variability (i.e., contours or other non - planar regions) present on the substrate. The topology sensor may include an optical sensor (e.g., a depth camera, mm - wave sensor, proximity sensor, etc.), a capacitance sensor that can determine the distance between the bottom surface of the substrate and the support surface of the measurement station 125 at different locations on the substrate by detecting capacitance at various locations, and / or other sensors that can detect the shape of the substrate in the z - direction. Each measurement station 125 may include one or more chuck mechanisms coupled to the support surface of the measurement station 125. The chuck mechanism may include a vacuum chuck, an electrostatic chuck, and / or other types of chuck mechanisms. The chuck mechanism can vary the chucking force across the area of the substrate, whereby the chuck can adaptively clamp the substrate to the support surface of the measurement station 125. For example, if a particular substrate includes regions with significant warping and regions with little warping, the clamping force can be increased in the region of significant warping or in its vicinity, and / or decreased in the region with little warping. This adaptive chucking force control allows the chuck mechanism to adjust the clamping force applied to each substrate to flatten the substrate into a substantially planar shape with little warping or other deflections. Thus, in some embodiments, it is also possible to customize the chucking force for each substrate, and each substrate receives a chucking force that flattens any given substrate into a substantially planar shape regardless of the topology of the substrate. As used herein, substantially planar may be understood to mean about 95% or more planar, about 96% or more planar, about 97% or more planar, about 98% or more planar, about 99% or more planar, about 99.5% or more planar, or more.The chucking force can vary based on measurements from the topology sensor(s). For example, regions with large and small warpage can be detected (such as by mapping the topology of the substrate), and the chucking force can be changed accordingly. In some embodiments, the chucking force can be adjusted sequentially. For example, a chucking force of a first magnitude (which may or may not be uniform across a region of the substrate) can be applied, and the topology can be re-measured. If the substrate is not substantially planar, the magnitude of the chucking force can be adjusted at one or more locations, and the topology can be measured again. This process can be sequentially repeated any number of times until the substrate is substantially planar.

[0024]

[0028] Each measurement station 125 may include one or more die pattern sensors. Each die pattern sensor may include an optical sensor, such as a camera, that can measure the position of each die present on the substrate. For example, many dies may be attached to the exposed surface of the substrate or otherwise connected prior to the printing process. The positions of these dies may deviate from the designed positions due to pick and place errors and / or the pressure of the molding flow. If printing is performed without correction, the printed electrical lines may not be correctly connected to specific pads on the die. In a die pattern sensor, the position and / or rotation (e.g., angular orientation) of each die may be measured by the die pattern sensor, thereby enabling the generation and / or other recording of a mapping of the die pattern on the substrate. The mapping may be provided to the printing system to correct and / or otherwise adjust the printing pattern to account for die position drift prior to starting the printing process. In some embodiments, each measurement station 125 may include one or more bevel sensors. The bevel sensors may be optical sensors that can be used to measure the bevel angle and / or topography of the edges of the packaging of each substrate. Although different topology sensors, die pattern sensors, and bevel sensors are shown, it will be understood that in some embodiments, one or more of the sensors may be combined into a single sensor. For example, a single optical sensor can be used to measure any combination of the topology, die pattern, and / or bevel angle of a given substrate.

[0025]

[0029] As shown, system 100 includes two measurement stations 125, which are disposed on opposite sides of substrate aligner 120. However, it will be understood that various embodiments may include any number of measurement stations 125. For example, system 100 may include at least about one measurement station, at least about two measurement stations, at least about three measurement stations, at least about four measurement stations, at least about five measurement stations, at least about six measurement stations, or more. Each measurement station 125 may include one or more substations, and each substation may perform some or all of the measurement functions described according to measurement station 125. For example, each substation may include a dedicated topology sensor, a dedicated chuck mechanism, a dedicated die pattern sensor, and / or a dedicated bevel sensor. Any number of substations may be provided for a given measurement station 125. For example, each measurement station 125 may include at least about one substation, at least about two substations, at least about three substations, at least about four substations, or more. By providing multiple substations, each measurement station 125 can perform measurement operations on multiple substrates simultaneously, which can help improve the throughput of system 100.

[0026]

[0030] System 100 may include at least one printing station 135. Each printing station 135 may include one or more stages and / or other support surfaces that can support the lower surface of the substrate. In some embodiments, each stage may be movable such that movement of the stage moves the substrate (or the carrier of the substrate) relative to the printing mechanism of printing station 135. In some embodiments, the printing mechanism is movable while the substrate remains stationary. The printing station can use digital lithography techniques to print various features on the substrate. For example, the connection of dies and electrical connectors (such as copper pillars) can be printed onto the substrate using printing station 135.

[0027]

[0031] In some embodiments, system 100 may include a thermal module that can be used to bake or otherwise heat the substrate after the printing process is completed. For example, the substrate can be baked to help stabilize the printed pattern before performing other processing or packaging steps, such as removing the photosensitive material processed during photolithography and / or removing the non-photosensitive material after photolithography. Incorporating the thermal module into system 100 can help process a larger number of substrates / dies and improve the throughput of system 100.

[0028]

[0032] System 100 may include several buffer stations 130. Each buffer station 130 may include several load slots and / or unload slots that can be used to hold individual substrates before and / or after the printing process is performed. For example, each buffer station 130 can be disposed between each of the measurement stations 125 and each of the printing stations 135. While one or more substrates are being printed, the substrates that have completed the measurement operation can be transported by the robot transport system 105 from the measurement station 125 to a load slot of one of the buffer stations 130. When the printing process(es) is completed, the printed substrates are transported by the robot transport system 105 from the printing station 135 to an unload slot of one of the buffer stations 130, and the non-printed substrates can be transported from the load slot to the printing station 135. While the non-printed substrates are being printed, the previously printed substrates can be transported from the unload slot to their respective storage units 115.

[0029]

[0033] As shown, measurement station 125 can be positioned adjacent to printing station 135, although measurement station 125 may be positioned elsewhere within system 100. For example, as shown in FIGS. 1A and 1B, measurement station 125a may be positioned within the frame of factory interface 140 (which may include some or all of robot transport system 105), measurement station 125b may be positioned alongside factory interface 140, measurement station 125c may be positioned in front of and / or instead of one or more of storage units 115, and / or measurement station 125d may be positioned adjacent to printing station 135 (similar to measurement station 125 shown in FIG. 1). In various embodiments, other locations for the measurement station are possible.

[0030]

[0034] Figure 2 shows a schematic isometric view of an exemplary buffer station 200 according to some embodiments of the present technology. Figure 2 may show further details regarding components within system 100 (e.g., buffer station 130). Buffer station 200 is understood to include any features or aspects of buffer station 130 described above in some embodiments. Any aspect of buffer station 200 may also be combined with other processing chambers or systems as would be readily understood by one of ordinary skill in the art. Buffer station 200 may include a number of slots 205. Each slot 205 may be sized to receive substrates that can be transported to and from the slot 205 by a robotic transport system (e.g., robotic transport system 105). The slots 205 can be arranged in one or more vertical columns, each column including a number of slots 205. As shown, buffer station 200 includes two columns each having nine slots 205, although other configurations are possible. For example, each buffer station 200 may include at least about one column, at least about two columns, at least about three columns, at least about four columns, or more. Each column may include at least about one slot, at least about two slots, at least about three slots, at least about four slots, at least about five slots, at least about six slots, at least about seven slots, at least about eight slots, at least about nine slots, at least about ten slots, at least about twelve slots, at least about fourteen slots, at least about sixteen slots, at least about eighteen slots, or more. In some embodiments, each slot 205 may be designated as either an unload slot (e.g., to receive substrates printed from a printing station) or a load slot (e.g., to receive unprinted substrates from a metrology station). In other embodiments, some or all of the slots 205 can be used interchangeably as both unload slots and load slots.

[0031]

[0035] FIG. 3 shows the operation of an exemplary method 300 for packaging a substrate, according to some embodiments of the present technology. The method may be executed in various processing systems, including any of the measurement stations and / or buffer stations described above, such as the processing system 100 described above, which may include measurement stations and / or buffer stations according to embodiments of the present technology. Method 300 may include some optional steps, which may or may not be particularly associated with some embodiments of the method according to the present technology.

[0032]

[0036] Method 300 may include a packaging method that may include steps for a packaging die, such as an integrated circuit and / or other electrical components. The method may include optional steps before starting method 300, or the method may include additional steps. For example, method 300 may include steps that are executed in an order different from that shown. Method 300 may include, at operation 305, rotating and aligning the substrate to a predetermined angular position. For example, the substrate may be transported from a storage unit (e.g., storage unit 115) to a substrate aligner and / or transported in other ways. The substrate may include some dies arranged on one or both sides of the substrate. Some electrical connectors, such as copper pillars, may be arranged for some or all of the dies. The packaging process may involve electrically connecting the die and the electrical connector, such as by printing a conductive connection between each of the die and the electrical connector.

[0033]

[0037] The transport of the substrate may be executed by a robotic transport system (e.g., robotic transport system 105) that includes one or more transport robots, each of which includes at least one robotic arm that can grip, support, and / or engage the substrate in other ways. Once positioned on the substrate aligner, alignment marks on the substrate may be identified, such as by using an optical sensor. The substrate can be rotated to align the alignment marks to a predetermined angular position. This alignment can ensure that the substrate is properly oriented in subsequent steps of the packaging process.

[0034]

[0038] When the substrate is aligned, in operation 310, the substrate can be transported to the measurement station by a robot transport system or the like. At the measurement station, in operation 315, the topology of the substrate can be measured. For example, one or more optical sensors, capacitance sensors, and / or other z-direction sensors can be used to collect data at several locations across the area of the substrate. This data can be used to determine whether there are any contours or other deformations that prevent the substrate from being substantially planar. In operation 320, a first chucking force can be applied to the substrate to flatten it. The chucking force can be utilized to reduce or eliminate warping or other warpage of the substrate prior to other measurement and / or printing processes and can be utilized to make the substrate at least substantially planar. The magnitude of the first clamping force can vary in a region of the substrate based on the topology of the substrate. For example, if a particular substrate includes regions with significant warping and regions with little warping, the clamping force can be increased in the regions with significant warping or in the vicinity thereof, and / or the clamping force can be decreased in the regions with little warping. With this adaptive chucking force control, the chucking mechanism can adjust the clamping force applied to each substrate to flatten the substrate into a substantially planar shape and to a state with little or no warping or other warping. The chucking force can vary based on measurements from the topology sensor(s). In some embodiments, the chucking force can be adjusted sequentially. For example, a chucking force of a first magnitude (which may or may not be uniform across a region of the substrate) can be applied and the topology can be re-measured. If the substrate is not substantially planar, the magnitude of the chucking force can be adjusted and the topology can be measured again. This process can be sequentially repeated any number of times until the substrate is substantially planar.

[0035]

[0039] While the first clamping force is applied, method 300 may include, in operation 325, generating a mapping of the die pattern on the exposed surface of the substrate. The mapping may include data indicating the exact position (e.g., lateral position and / or angular orientation) of each die on the substrate. For example, while the substrate is clamped in a substantially planar shape, one or more optical sensors can be used to image and / or otherwise determine the actual layout of the dies disposed on the substrate. This layout may deviate from the designed layout due to factors such as the tolerances of the robot pick-and-place device, bevel topography, and shifts that may occur during the application of an epoxy coating on the die. In certain embodiments, the sensors can detect the positions of the corners and / or marks provided thereon of each die, whereby the sensors can more accurately determine the position and / or orientation of each die. The method may optionally include measuring the bevel angle on the packaging edge of each substrate, and this measurement may be performed using one or more optical sensors. Once the die pattern mapping and / or bevel angle measurements are generated, the chucking force can be reduced and / or eliminated, whereby, in operation 330, the substrate can be transported to the printing station.

[0036]

[0040] At the printing station, in operation 335, a second chucking force can be applied to the substrate to flatten the substrate against the surface of the printing station. For example, a similar adaptive chucking mechanism can be included in the printing station and used to selectively apply a chucking force to the substrate to make the substrate substantially planar. In some embodiments, the chucking force can vary across the area of the substrate. For example, the second chucking force may be based on the previously measured topology of the substrate and / or the final chucking force used by the metrology station, and the second chucking force is the same as or substantially the same as the final first chucking force applied by the chucking mechanism of the metrology station, whereby it can be ensured that the substrate is substantially planar on the surface of the printing station. In particular, by using the same chucking force at the metrology station and the printing station, the actually measured die layout can be reproduced at the printing station, and the accuracy of the printing process can be improved. In some embodiments, the method optionally includes measuring the topology of the substrate before and / or after applying the second chucking force in a manner similar to the process used at the metrology station (e.g., using one or more topology sensors). Thereby, the printing station can confirm that the substrate is substantially planar when the printing process is started.

[0037]

[0041] In operation 340, the printed pattern can be adjusted based on the mapping of the die pattern and / or bevel topography. For example, the processor of the printing station can receive and analyze the mapping and calculate any deviation of the die present on the substrate (e.g., lateral position shift and / or rotation and / or unexpected topography near the bevel). Based on the deviation, the printed pattern can be adjusted taking such shift into account so that the connection between the die and any electrical connectors (e.g., copper pillars and / or other contacts) is ensured when printing is completed. For example, the arrangement of printable connectors can be changed so that the connection between the die and the associated electrical connectors is properly made even though one or more dies are shifted from their designed positions. When the printed pattern is adjusted taking the deviation into account, in operation 345, the printed pattern can be printed on the exposed surface of the substrate.

[0038]

[0042] In some embodiments, after printing the printed pattern, the substrate can be conveyed to a storage unit (e.g., storage unit 115). In some embodiments, the substrate may be conveyed directly from the printing station to the storage unit, but in other embodiments, intermediate conveyance of the substrate to a buffer station may be performed before conveying the substrate to the storage unit. For example, the printed substrate can be conveyed to the buffer station, a new substrate can be loaded into the printing station, and then the printed substrate can be conveyed to the storage unit while other substrates are being printed. Such an arrangement can help improve the throughput of the processing system.

[0039]

[0043] In some embodiments, once printed, the substrate can undergo additional processing steps. As an example, dies can also be positioned on the lower surface of the substrate. In such embodiments, the substrate can be inverted and the measurement / printing process can be repeated for the non-printed side of the substrate.

[0040]

[0044] Often, several substrates can be measured and / or printed simultaneously. For example, a processing system may include a plurality of substrate aligners, measurement stations, buffer stations, and / or printing stations, and each component of the processing system can accommodate one or more substrates at a time. This enables the preparation and printing of a large number of substrates simultaneously. Additionally, several substrates can be processed sequentially, and some substrates can be prepared while other substrates are being printed. For example, while some substrates are being printed, some substrates can be aligned by one or more substrate aligners, measured at a measurement station, transferred to a storage unit, and / or stored at a buffer station.

[0041]

[0045] Figures 4A - 4I illustrate an exemplary sequence 400 for processing several substrates 480. Sequence 400 can include any number of substrate processing systems, including the substrate processing system 100 described herein. Sequence 400 can illustrate various steps of method 300 or other processing steps. Although illustrated as being able to print and / or prepare four substrates simultaneously, it will be understood that any number of substrates can be processed simultaneously at a given station. In operation 405, several substrates 480a can be engaged from one or more storage units 115. Each substrate 480a can be transported to one or more substrate aligners 120 in operation 410, where the substrates 480a are aligned in a predetermined angular direction. In some embodiments, the substrates can be aligned sequentially, while in other embodiments, each substrate 480a can be aligned simultaneously. Once aligned, in operation 415, each of the substrates 480a can be transported to a measurement station 125. There can be one measurement station 125 or multiple measurement stations 125, each corresponding to one or more substrates 480a. At each measurement station 125, each substrate 480a can be chucked and / or measured as described herein. Once the measurement operation is complete, in operation 420, each substrate 480a can be transported to a printing station 135, which can adjust the printing pattern based on the measurements from the measurement station 125 and / or print various features (e.g., connections between dies and corresponding connectors such as copper pillars) on the substrate 480a as described elsewhere herein.

[0042]

[0046] While substrate 480a is being printed, several substrate 480b can be prepared for printing. For example, in operation 425, substrate 480b can be engaged from one or more storage units 115 and conveyed to one or more substrate aligners 120. Once aligned, in operation 430, each of substrate 480b can be conveyed to measurement station 125. When the measurement operation is completed, in operation 435, each substrate 480b can be conveyed to buffer station 130. Substrate 480b can stay at buffer station 130 while substrate 480a completes the printing process. In operation 440, substrate 480a is conveyed to an open slot in buffer station 130, and then substrate 480b can be conveyed to printing station 135. While substrate 480b is being printed, substrate 480a can be conveyed to storage unit 115 in operation 445. The above-described process flow may be continuous, and it will be understood that when one or more of the stations in the processing system become available, additional substrates 480 can be introduced into the flow, which can help further improve the throughput of the processing system.

[0043]

[0047] In the above description, for the purpose of facilitating the understanding of various embodiments of the present technology, a number of detailed matters have been specified for the purpose of explanation. However, it will be apparent to those skilled in the art that a particular embodiment can be practiced without some of these detailed matters or with additional detailed matters.

[0044]

[0048] Although several embodiments are disclosed, it will be recognized by those skilled in the art that various modifications, alternative structures, and equivalents can be used without departing from the essence of the embodiments. In addition, some well-known processes and elements are not described in order to avoid unnecessarily obscuring the present technology. Therefore, the above description should not be construed as limiting the scope of the present technology.

[0045]

[0049] When a range of values is provided, each intervening value between the upper and lower limits of that range is also to be understood as specifically disclosed, to the smallest unit of the lower limit, unless clearly indicated otherwise in the context. A narrower range between any of the recited values or between any intervening values not recited in the recited range, and other recited values or intervening values in such recited range are included. The upper and lower limits of such narrower ranges may individually be included in or excluded from the range. Each range where either, neither, or both of the limiting values are included in the narrower range is also included in the art, subject to the condition that there are no limiting values specifically excluded within the recited range. When the recited range includes one or both of the limiting values, ranges excluding either or both of the included limiting values are also included.

[0046]

[0050] In this specification and the appended claims, the singular forms "a", "an", and "the" include the plural meaning unless clearly indicated otherwise in the context. Thus, for example, when "a region" is recited, a plurality of such regions are included, and when "the aperture" is recited, reference is included to one or more apertures and equivalents known to those skilled in the art, and the same applies to other cases.

[0047]

[0051] Also, the terms "comprise(s) / comprising", "contain(s) / containing", and "include(s) / including", as used in this specification and the subsequent claims, are intended to specify the presence of the recited features, integers, components, or steps, but do not preclude the presence or addition of one or more other features, integers, components, steps, acts, or groups.

Claims

1. A method for packaging a substrate, comprising: rotating and aligning the substrate to a predetermined angular position; transferring the substrate to a measurement station; measuring the topology of the substrate at the measurement station; applying a first chucking force to the substrate to flatten the substrate; generating a mapping of die patterns on the exposed surface of the substrate; transferring the substrate to a printing station; applying a second chucking force to the substrate to flatten the substrate against the surface of the printing station; adjusting a printing pattern based on the mapping of the die patterns; and printing the printing pattern on the exposed surface of the substrate. A method as described above.

2. The method for packaging a substrate according to Claim 1, further comprising changing the magnitude of the first chucking force in a region of the substrate based on the topology of the substrate. A method for packaging a substrate according to Claim 1, further comprising re-measuring the topology of the substrate after applying the first chucking force.

3. The method for packaging a substrate according to Claim 1, wherein the first chucking force is applied using one or both of a vacuum chuck and an electrostatic chuck.

4. The method for packaging a substrate according to Claim 1, further comprising re-measuring the topology of the substrate after applying the first chucking force. A method for packaging a substrate according to Claim 1, further comprising re-measuring the topology of the substrate after applying the first chucking force.

5. The method for packaging a substrate according to Claim 1, wherein measuring the topology of the substrate includes collecting data from one or both of a capacitance sensor and an optical sensor.

6. The method for packaging a substrate according to Claim 1, wherein adjusting the printing pattern based on the mapping of the die patterns includes adjusting at least a portion of the printing pattern based on one or both of the lateral position and the rotational position of at least one die of the substrate. A method for packaging a substrate according to Claim 1, wherein adjusting the printing pattern based on the mapping of the die patterns includes adjusting at least a portion of the printing pattern based on one or both of the lateral position and the rotational position of at least one die of the substrate.

7. The substrate includes a first substrate, and the method includes, while printing the printing pattern on the exposed surface of the first substrate, rotating and aligning a second substrate to the predetermined angular position; transferring the second substrate to the measurement station; measuring a second topology of the second substrate at the measurement station; applying a third chucking force to the second substrate to flatten the second substrate; and generating a second mapping of die patterns on the exposed surface of the second substrate. A method for packaging the substrate according to claim 1, comprising

8. Further comprising transporting the second substrate to a buffer station A method for packaging a substrate according to claim 7, further comprising

9. Transporting the second substrate to the printing station; Applying a fourth chucking force to the substrate to flatten the second substrate against the surface of the printing station; Adjusting a second printing pattern of the second substrate based on the second mapping of the die pattern; Printing the second printing pattern on the exposed surface of the substrate A method for packaging a substrate according to claim 8, further comprising

10. A method for packaging a substrate, comprising: Rotating and aligning a plurality of substrates at a predetermined angular position; Measuring the topology of each substrate; Applying a first chucking force to each substrate to flatten each substrate; Generating a mapping of the die pattern onto the exposed surface of the substrate; Transporting each substrate to a printing station; Applying a second chucking force to each substrate to flatten each substrate against the surface of the printing station; Adjusting a respective printing pattern for each substrate based on the mapping of the die pattern for each substrate; Printing the respective printing patterns on the exposed surfaces of each substrate A method comprising

11. Determining the magnitude of the first chucking force at several locations over the area of each substrate required to flatten each substrate; Varying the magnitude of the first chucking force over the area of each substrate based on the determination A method for packaging a substrate according to claim 10, further comprising

12. Rotating and aligning each substrate at the predetermined angular position is Identifying alignment marks on each of the substrates; Rotating each of the substrates to align the alignment marks at the predetermined angular position A method for packaging a substrate according to claim 10, comprising

13. Inverting each substrate to expose the non-printed surface of each substrate; Rotating and aligning each substrate at the predetermined angular position; Measuring the topology of each substrate; Applying a third chucking force to each substrate to flatten each substrate; Generating a mapping of an additional die pattern on the non-printed surface of each substrate; Conveying each substrate to the printing station; Applying a fourth chucking force to each substrate to flatten each substrate against the surface of the printing station; Adjusting an additional printing pattern based on the mapping of the additional die pattern; Printing the additional printing pattern on the non-printed surface of each substrate; The method of packaging a substrate according to claim 10, further comprising:

14. The method of packaging a substrate according to claim 10, wherein the first chucking force is different for at least one of the plurality of substrates.

15. The method of packaging a substrate according to claim 10, wherein the first chucking force of each substrate is equal to the second chucking force of each substrate.

16. Further comprising conveying at least some of the plurality of substrates to a buffer station, wherein each of the at least some of the plurality of substrates is conveyed from the buffer station to the printing station. The method of packaging a substrate according to claim 10.

17. The method of packaging a substrate according to claim 10, further comprising measuring a bevel angle on a packaging edge for each substrate.

18. Adjusting the printing pattern based on the mapping of the die pattern includes calculating one or more differences between the printing pattern and the mapping of the die pattern, and adjusting at least a portion of the printing pattern based on the one or more differences. The method of packaging a substrate according to claim 10.

19. A substrate packaging system, comprising: A robotic transport system comprising a plurality of robotic arms; A substrate aligner for aligning a substrate at a predetermined angular position; At least one measurement station, comprising: A topology sensor; A die pattern sensor; and An adaptive chucking mechanism communicatively coupled to the topology sensor; At least one measurement station; A printing station; A system.

20. A substrate buffer station disposed between the at least one measurement station and the printing station. ​ ​ The substrate packaging system according to claim 19, further comprising

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