Dual channel monoblock gas manifold

Abstract

The present disclosure relates to compact monoblock manifolds for dual channel gas delivery for semiconductor processing tools. Some such manifolds can be designed with surface mount flow component interfaces on opposite sides of the manifold, thereby reducing the overall footprint of the manifold block.

Description

[Technical Field]

[0001] Related Applications A PCT application is being filed concurrently herewith as part of this application, and each application identified in that concurrently filed PCT application to which this application claims benefit or priority is incorporated herein by reference in its entirety for all purposes. [Background technology]

[0002] Semiconductor processing tools typically require the delivery of different reactant gases to a wafer processing space located within one or more semiconductor processing chambers. Surface-mounted valves and other surface-mounted flow components are typically used to provide flow control of the various gases used during semiconductor processing operations in such tools.

[0003] Described herein are various improvements to manifolds that can be used with surface mount flow control components. Summary of the Invention

[0004] The details of one or more embodiments of the subject matter described herein are set forth in the accompanying drawings and the description below. Other features, aspects, and advantages will become apparent from the description, drawings, and claims.

[0005] In some embodiments, an apparatus can be provided that includes a manifold block having a set of at least five surface-mount flow component interfaces (SMFCIs). The set of at least five surface-mount flow component interfaces (SMFCIs) can include a first SMFCI having a first central axis, a second SMFCI having a second central axis, a third SMFCI having a third central axis, a fourth SMFCI having a fourth central axis, and a fifth SMFCI having a fifth central axis. The first central axis can be parallel to and coincident with a first reference plane, and the fourth central axis can be parallel to and coincident with a second reference plane. The first SMFCI can be configured to mate with a first surface-mount flow component, the second SMFCI can be configured to mate with a second surface-mount flow component, the third SMFCI can be configured to mate with a third surface-mount flow component, the fourth SMFCI can be configured to mate with a fourth surface-mount flow component, and the fifth SMFCI can be configured to mate with a fifth surface-mount flow component. The manifold block can include a first passage extending between the first SMFCI and the second SMFCI, a second passage extending between the second SMFCI and the third SMFCI, and a third passage extending between the fourth SMFCI and the fifth SMFCI, and the first through third passages can be fluidly isolated from one another within the manifold block.

[0006] In some embodiments, the first through fifth SMFCIs may be located on the same side of the manifold block.

[0007] In some embodiments, the first SMFCI may be located on an opposite side of the manifold block from the second SMFCI.

[0008] In some such embodiments, the second SMFCI and the third SMFCI may be on the same side of the manifold block.

[0009] In some embodiments, the first passage may extend along a first passage axis that is perpendicular to a second passage axis along which the second passage extends, and the first passage axis may be perpendicular to the first SMFCI.

[0010] In some embodiments, the first passageway may be a straight passageway.

[0011] In some embodiments, the second and third central axes may be parallel to and coincident with the first reference plane.

[0012] In some embodiments, the fifth central axis may be parallel to and coincident with the second reference plane.

[0013] In some embodiments, the first reference plane may be parallel to the second reference plane.

[0014] In some embodiments, the manifold block may further include a cross passageway internal to the manifold block that fluidly connects the third SMFCI and the fifth SMFCI.

[0015] In some embodiments, the manifold block may be connected with a cross passage that is external to the manifold block and fluidly connects the third SMFCI with the fifth SMFCI.

[0016] In some embodiments, the apparatus may further include an outlet flow path segment having a first end fluidly connected to the intersecting passage and a second end configured to connect to one or more components of a gas distribution system of the semiconductor processing tool.

[0017] In some embodiments, the device may further include a first inlet flow path segment and a second inlet flow path segment, wherein the first inlet flow path segment may be fluidly connected to the first SMFCI, the second inlet flow path segment may be fluidly connected to the fourth SMFCI, and the first inlet flow path segment and the second inlet flow path segment may be fluidly isolated from each other.

[0018] In some embodiments, the first inlet flow path segment may extend through a first side of the manifold block spanning between the side of the manifold block having the first SMFCI and the side of the manifold block opposite the side of the manifold block having the first SMFCI, and the second inlet flow path segment may extend through a second side of the manifold block spanning between the side of the manifold block having the first SMFCI and the side of the manifold block opposite the side of the manifold block having the first SMFCI.

[0019] In some embodiments, both the first inlet flow path segment and the second inlet flow path segment may extend through a first side of the manifold block spanning between the side of the manifold block having the first SMFCI and a second side of the manifold block opposite the side of the manifold block having the first SMFCI.

[0020] In some embodiments, the manifold block may have a width in a first direction perpendicular to the first reference plane that is 225% or less of the width of the SMFCI in the first direction, and the manifold block may have a length in a second direction parallel to the first reference plane that is 300% or less of the length of the SMFCI in the second direction.

[0021] In some embodiments, the set of at least five SMFCIs may include a sixth SMFCI, and the manifold block may further include a fourth passage extending between the fifth SMFCI and the sixth SMFCI, and the sixth SMFCI may be fluidly isolated from the first through fifth SMFCIs within the manifold block.

[0022] In some embodiments, the apparatus may further include first, second, third, fourth, and fifth surface mount flow components, as well as a sixth surface mount flow component. The first surface mount flow component may be connected to the first SMFCI, the second surface mount flow component may be connected to the second SMFCI, the third surface mount flow component may be connected to the third SMFCI, the fourth surface mount flow component may be connected to the fourth SMFCI, the fifth surface mount flow component may be connected to the fifth SMFCI, and the sixth surface mount flow component may be connected to the sixth SMFCI.

[0023] In some such implementations, the first and fourth surface-mounted flow components may be filters, and the second, third, fifth, and sixth surface-mounted flow components may be valves.

[0024] In some embodiments, the first SMFCI may include four first holes arranged in a circular pattern around a first central axis, a first central port located along the first central axis, and at least a first off-center port located radially outward of the first central port relative to the first central axis; the second SMFCI may include four second holes arranged in a circular pattern around a second central axis, a second central port located along the second central axis, and at least a second off-center port located radially outward of the second central port relative to the second central axis; and the third SMFCI may include four third holes arranged in a circular pattern around a third central axis, and at least a second off-center port located radially outward of the second central port relative to the second central axis. a fourth SMFCI may include four fourth holes arranged in a circular pattern about the fourth central axis, a fourth central port located along the fourth central axis, and at least a fourth off-center port located radially outward from the fourth central port relative to the fourth central axis; and a fifth SMFCI may include four fifth holes arranged in a circular pattern about a fifth central axis, a fifth central port located along the fifth central axis, and at least a fifth off-center port located radially outward from the fifth central port relative to the fifth central axis.The first central port and the first off-center port may each include a corresponding first bore and a corresponding first counterbore having a diameter larger than that of the corresponding first bore and centered on the corresponding first bore; the second central port and the second off-center port may each include a corresponding second bore and a corresponding second counterbore having a diameter larger than that of the corresponding second bore and centered on the corresponding second bore; and the third central port and the third off-center port each include a corresponding third bore and a corresponding second counterbore having a diameter larger than that of the corresponding third bore. The fourth central port and the fourth off-center port may each include a corresponding fourth bore and a corresponding fourth counterbore having a larger diameter than the corresponding fourth bore and centered about the corresponding fourth bore, and the fifth central port and the fifth off-center port may each include a corresponding fifth bore and a corresponding fifth counterbore having a larger diameter than the corresponding fifth bore and centered about the corresponding fifth bore. [Brief explanation of the drawings]

[0025] In the following description, reference will be made to the following figures, which are not intended to be limiting in scope but are provided merely to facilitate the following description:

[0026] [Figure 1] FIG. 1 is a diagram illustrating an exemplary flow component assembly.

[0027] [Figure 2] FIG. 2 illustrates the exemplary flow component assembly of FIG. 1 in a partially exploded view.

[0028] [Figure 3] FIG. 3 is an isometric view of a surface mount flow component interface.

[0029] [Figure 4]FIG. 4 is a top isometric view of an exemplary manifold block and some connected components. [Figure 5] FIG. 5 is a bottom isometric view of an exemplary manifold block and some connected components.

[0030] [Figure 6] FIG. 6 is a top view of the example manifold block of FIGS. 4 and 5, with section lines added to show the cross sections of FIGS. 8-10. [Figure 7] FIG. 7 is a side view of the exemplary manifold block of FIGS. 4 and 5, with section lines added to show the cross sections of FIGS. 8-10.

[0031] [Figure 8] FIG. 8 is a cross-sectional view taken along section line 8 in FIG.

[0032] [Figure 9] FIG. 9 is a cross-sectional view taken along section line 9 in FIG.

[0033] [Figure 10] FIG. 10 is a cross-sectional view taken along section line 10 in FIG.

[0034] [Figure 11] FIG. 11 is a top isometric view of another example manifold block and some connected components. [Figure 12] FIG. 12 is a bottom isometric view of another example manifold block and some connected components.

[0035] [Figure 13] FIG. 13 is a side view of the exemplary manifold block of FIGS. 11 and 12, with the section lines indicating the cross sections of FIGS. 14-16.

[0036] [Figure 14] FIG. 14 is a cross-sectional view taken along line 14 in FIG.

[0037] [Figure 15] FIG. 15 is a cross-sectional view taken along line 15 in FIG.

[0038] [Figure 16] FIG. 16 is a cross-sectional view taken along line 16 in FIG.

[0039] [Figure 17] FIG. 17 is an isometric view of a flow component assembly using the exemplary manifold block of FIGS.

[0040] [Figure 18] FIG. 18 is a cross-sectional view of a modified example of the manifold block of FIGS.

[0041] [Figure 19] FIG. 19 is a diagram illustrating an example of a prior art flow component assembly.

[0042] [Figure 20] FIG. 20 is a diagram of various manifold block designs. [Figure 21] FIG. 21 is a diagram of various manifold block designs. [Figure 22] FIG. 22 is a diagram of various manifold block designs. [Figure 23] FIG. 23 is a diagram of various manifold block designs. [Figure 24] FIG. 24 is a diagram of various manifold block designs. [Figure 25] FIG. 25 is a diagram illustrating an exemplary semiconductor processing system having a flow component assembly described herein.

[0043] The above-described figures are provided to facilitate understanding of the concepts described in this disclosure and are intended to illustrate some embodiments falling within the scope of this disclosure, but are not intended to be limiting; embodiments consistent with this disclosure and not shown in the figures are also considered to be within the scope of this disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0044] As previously mentioned, providing reactant and other gases to a semiconductor processing chamber typically involves the use of multiple, often dozens of, valves between the source of such gases and the processing chamber to which the gases are delivered. In most semiconductor processing chambers, such gases are delivered from a showerhead or gas distributor positioned above a pedestal within the chamber, whereby gases exiting the showerhead or gas distributor flow across the pedestal and the wafer supported by the pedestal. In most cases, many of the valves and other flow control components used may be implemented in what the industry calls a "gas box," a large enclosure that can house multiple sets of flow control components, one set for each of several different gases, that can be controlled to produce the desired flow of gases to be delivered to the semiconductor processing chamber.

[0045] However, there may also be several valves or other flow control components located immediately adjacent to the exterior of the semiconductor processing chamber near where the gases are delivered, thereby reducing or minimizing the distance the gases flowing therethrough must travel before reaching the wafer. Such valves or other flow control components are sometimes referred to herein as “point-of-use” valves or flow control components. Point-of-use valves and flow control components enhance control over the timing of when such gas flows reach the wafer and may reduce the amount of gas that may be wasted during such flows (by reducing the delay between when a particular gas flow to the chamber is turned off or adjusted and when the effect of such adjustment becomes apparent in the gas flow reaching the wafer). In some semiconductor processing tools, it may be desirable to mix two or more reactants to form a more reactive compound, e.g., two reactants that do not form a deposition layer by themselves but that form a deposition layer when combined with a particular compound. In such tools, it may be desirable to mix two or more reactants near the delivery point to reduce or minimize exposure of the gas delivery lines and components to compounds formed thereby (thereby reducing the possibility of deposition on the gas delivery lines / components or other undesirable interactions of the compounds with the gas delivery lines / components).

[0046] In typical semiconductor processing tools where a showerhead or gas distribution system is positioned above a pedestal, point-of-use valves and flow control component assemblies for controlling gas flow in proximity to the showerhead or gas distributor may, in some cases, be mounted directly on the top plate or lid of the chamber to which the gases are delivered. Such locations are often generally free of large, bulky equipment and may typically be relatively easy to access for maintenance purposes.

[0047] However, in some semiconductor processing tools, reactants may be delivered to the underside of the wafer. In such tools, the pedestal may effectively be an inverted showerhead or gas distributor, and the wafer may actually be supported above the pedestal by a ring or support posts, thereby creating a gap between the wafer and the pedestal. In such tools, point-of-use valves and flow control components may instead need to be implemented below the chamber to which the process gases are delivered. However, there is typically much less flexibility regarding the location of such equipment below the processing chamber. For example, many semiconductor processing tools may have large-diameter exhaust pipes, vertical drive systems for moving the pedestal up and down, high-voltage power supplies for providing radio frequency power to electrodes in the chamber, and support structures for supporting the chamber located below the chamber. In addition, there may be clearance requirements that must be met to provide sufficient access to various systems located below the chamber for maintenance purposes. These issues make it difficult to find space to place point-of-use valves and flow control components below the processing chamber.

[0048] The inventors have devised a compact, dual-channel, monoblock manifold for surface-mounted valves and flow control components, which allows two separate input streams to be filtered and controlled by valves before being combined into a common outlet flow path. Such manifolds have a compact packaging footprint, making them more suitable for implementation in space-constrained locations, such as beneath semiconductor processing chambers. At the same time, such manifolds, thanks to their "monoblock" design, may also reduce the number of potential leak points, thereby reducing the likelihood of leaks and the potential need for maintenance / repair.

[0049] FIG. 1 illustrates an exemplary point-of-use flow component assembly utilizing such a dual-channel monoblock manifold. FIG. 2 illustrates an exemplary point-of-use flow component assembly in a partially disassembled state. As shown in FIGS. 1 and 2 , flow component assembly 100 is provided by mounting surface-mount flow components 126, such as filters 128, valves 130, etc., to manifold block 104 using fasteners 134. Each surface-mount flow component can mate with a corresponding surface-mount flow component interface (SMFCI) 106 on manifold block 104. Surface-mount flow components may include, for example, valves, filters, pressure regulators, pass-through caps (which may be used when the number of SMFCIs provided for a particular channel in manifold block 104 is greater than the number of flow components required for that channel), etc.

[0050] SMFCIs are industry-standard fluid interfaces that allow for a modular approach to assembling fluid control systems. They are commonly used in the semiconductor processing industry, and there are a wide variety of types of flow components offered by various manufacturers that use SMFCIs. FIG. 3 is an isometric view of a typical SMFCI 306. As can be seen, the SMFCI 306 is a square area, e.g., approximately 1.125 inches (28.575 mm) on a side, with holes 310 in a circular or square pattern centered on the central axis 320 of the SMFCI 306. The holes 310 are through-holes, which may allow threaded fasteners to be inserted to secure surface-mounted flow components, e.g., using nuts threaded onto the threaded ends of the fasteners. Alternatively, the holes 310 may be threaded, allowing fasteners to be threaded directly into the threaded holes 310. Because of the radially symmetrical arrangement of the square regions and holes 310 around the central axis 320, it is apparent that a surface-mounted flow component can generally mate with the SMFCI 306 in any of four possible orientations, each 90° away from the adjacent orientation. The SMFCI 306 can also include bores 316, each of which can lead to a separate flow path within the component bearing the SMFCI 306. One of the bores 316 is generally centered about the central axis 320 so as to align with a corresponding opening on the surface-mounted flow component, regardless of the orientation of the surface-mounted flow component. One or more additional bores 316 may be provided at locations radially offset from the bore 316 centered relative to the central axis 320. Each bore 316 may be provided with a counterbore 318 sized to accommodate an annular seal, such as an O-ring or C-seal. Although FIG. 3 shows only two bores 316 for the illustrated SMFCI 306, other SMFCIs 306 may have three, four, or five bores 316 (in some later examples herein, an SMFCI having three bores 316 is shown).

[0051] Fluid flowing through the SMFCI 306 typically enters a flow component mated to the SMFCI 306 through one of the bores 316 and then exits the flow component via the other bore 316. The SMFCI 306 is generally planar because it is designed to mate against a flat flange on the flow component.

[0052] 1 and 2, the illustrated manifold block 104 has a total of six SMFCIs 106: two on the top side (visible in FIG. 2) and four on the bottom side (not visible in FIG. 2). Also attached to the manifold block 104 are a pair of inlet fittings 136 and outlet fittings 138. Each inlet fitting 136 is fluidly connected to a corresponding inlet flow path segment that leads to one of the SMFCIs 106. Similarly, the outlet fitting 138 is fluidly connected to the outlet flow path segments that lead to two of the SMFCIs 106, for example, via a crossover passage 156.

[0053] As can be seen, an optional seal plate 108 may be sandwiched between each flow component 126 and the SMFCI 106 in which the flow component 126 is mounted. Each seal plate 108 may take the form of, for example, a thin metal square of the same size and shape as the SMFCI, with through-holes at locations corresponding to the various holes and bores in the SMFCI 106. The holes at locations corresponding to the bores in the SMFCI may be provided with C-seals, e.g., tubular metal toroids with circumferential slits along their outermost circumference, and the holes for each such bore may be sized slightly smaller than the C-seals, so that the C-seals trap the metal squares within the circumferential slits, thus retaining the C-seals in the seal plate 108. The seal plate 108 allows the seals retained therein to be easily and simultaneously positioned within the SMFCI 106 in which they are used, reducing the likelihood of losing one of the seals during installation.

[0054] 4 and 5 illustrate isometric views of the manifold block 104 without the flow components 126 attached. All six SMFCIs 106 are visible in FIGS. 4 and 5 (in the figures, the central axes of the SMFCIs 106 are represented by arrows perpendicular to each SMFCI 106). Also visible in FIGS. 4 and 5 are a first inlet flow path segment 160 and a second inlet flow path segment 162, each of which fluidly connects one of the inlet fittings 136 (not shown in these figures) to a corresponding one of the SMFCIs 106. For reference, the SMFCIs 106 in FIGS. 4 and 5 are sub-designated as SMFCIs 106a / b / c / d / e / f and may be referred to herein as the first / second / third / fourth / fifth / sixth SMFCIs, respectively. Thus, for example, a first inlet flow path segment 160 can be fluidly connected to one of the ports of the first SMFCI 106a, and a second inlet flow path segment 162 can be fluidly connected to one of the ports of the fourth SMFCI 106d. An outlet flow path segment 158 ​​is also provided and can, for example, fluidly connect the outlet fitting 138 to two of the SMFCIs 106 via a crossover passage 156.

[0055] 4 and 5 also show a first reference plane 122 and a second reference plane 124. In this example, the first reference plane 122 and the second reference plane 124 are parallel to one another, although in other implementations, a non-parallel arrangement of the first reference plane 122 and the second reference plane 124 may occur. Further reference to these reference planes will be made in the description below.

[0056] Figures 6 and 7 illustrate top and side views of manifold block 104 (and some connected hardware), with section lines indicating the cross sections of Figures 8-10. Thus, Figure 8 is a cross section of manifold block 104 (and some connected hardware) through the section line of Figure 7, Figure 9 is a cross section of manifold block 104 and intersecting passage 156 through a vertical section line of Figure 6, and Figure 10 is a cross section of manifold block 104 through one of the horizontal section lines of Figure 6 (in this example, both cross sections are the same).

[0057] As seen in FIG. 8 , the manifold block 104 can have two flow paths, from a first inlet flow path segment 162 and a second inlet flow path segment 162, which are fluidly isolated from each other within the manifold block 104, at least until the point where the fluid flow exits the last SMFCI 106. For example, a first flow path can begin at the first inlet flow path segment 160 and flow through the first SMFCI 106a. The first flow path can further include a first passage 144 (in this case, a straight passage extending through the manifold block 104 in a direction perpendicular to the first SMFCI 106a (e.g., along the central axis of the first SMFCI 106a); see FIG. 10 ) that fluidly connects the first SMFCI 106a and the second SMFCI 106b. A second passage 146, which is part of the first flow path, can similarly fluidly connect the second SMFCI 106b and the third SMFCI 106c. The second passageway 146 may be provided, for example, by a hole drilled at one end of the manifold block 104, through the third SMFCI 106c, and to the second SMFCI 106b. A plug 152 may then be inserted into the drilled hole and welded or brazed in place to seal the drilled hole. The plug 152 may, for example, extend to a depth of the drilled hole that is shallower than the depth to which the drilled hole can be fluidly connected with the third SMFCI 106c.

[0058] Similarly, a second flow path can begin at second inlet flow path segment 162 and flow through fourth SMFCI 106d. The second flow path may further include a third passage 148 fluidly connecting fourth SMFCI 106d and fifth SMFCI 106e within manifold block 104, and a fourth passage 150 fluidly connecting fifth SMFCI 106e and sixth SMFCI 106f within manifold block 104. In this example, both first passage 144 and second passage 146 are linear passages with central axes that lie on first reference plane 122, e.g., coincident with and parallel to first reference plane 122, and both third passage 148 and fourth passage 150 are linear passages with central axes that lie on second reference plane 124. In the illustrated arrangement, the sections of the first and second flow paths, including the first through fourth passages 144-150, are generally duplicates of each other (including plugs 152) and should therefore have similar or identical gas flow characteristics.

[0059] In the example of manifold block 104, the two flow paths remain fluidly isolated from one another within manifold block 104 at all times, but are then fluidly connected to one another through a crossover passage 156 (see FIG. 9 ) provided by a welded tube structure welded or brazed to manifold block 104. Crossover passage 156 is fluidly connected to outlet flow path segment 158, thereby allowing gas delivered through both flow paths to be delivered in combination from outlet flow path segment 158.

[0060] An alternative embodiment of the manifold block 104 is shown in FIGS. 11 and 12, which are top-down isometric views of the manifold block 1104. Similar to the manifold block 104, the manifold block 1104 is connected to the inlet fitting 1136 via a first inlet flow channel segment 1160 and a second inlet flow channel segment 1162, and to the outlet fitting 1138 via an outlet flow channel segment 1158. The manifold block 1104 may also have associated therewith a first reference surface 1122 and a second reference surface 1124. SMFCIs 1106a-f are also shown. This design also has crossover passages, but they are integrated into the manifold block 1104, including the raised portion where the plug 1152 is visible, as shown in FIG. 12.

[0061] FIG. 13 illustrates a side view of manifold block 1104 (and some additional components) with section lines indicating the cross sections of FIGS. 14-16. As is apparent from FIG. 14, the first through fourth passages 1144-1150 between SMFCIs 1106a-f are arranged substantially identically to the first through fourth passages 144-150 of manifold block 104, respectively. However, as is apparent from FIGS. 15 and 16, manifold block 1104 differs from manifold block 104 in that it incorporates an internal cross passage 1156. The cross passage 1156 in this example makes several turns, initially extending along short passages from ports for the third SMFCI 1106c and the sixth SMFCI 1106f to short riser passages (extending along a direction perpendicular to the SMFCI 1106) and then extending from these short passages to crossover segments connecting the two riser passages. The outlet flow path segment 1158 may be fluidly connected to the cross-passage 1156, for example, via a connection to a hole in the side of the manifold block 1104 that leads to the cross-passage 1156. This design eliminates some of the external flow components, e.g., elbows and tubing segments, to which the manifold block 104 connects to provide the cross-passage 156, and therefore may be less susceptible to damage (but may require more machining / material in the manifold block 1104).

[0062] 1, Figure 17 shows a manifold block 1104 with various flow components attached to form a flow component assembly 1102. As can be seen, the two manifold blocks 104 and 1104 generally occupy the same packaging volume.

[0063] In the above example, it will be appreciated that each of the two flow paths to manifold blocks 104 and 1104 may pass through three different SFMCIs in series. This allows for a variety of different configurations of surface-mounted flow components to be implemented in the manifold blocks to provide different functionality. For example, in some embodiments, surface-mounted filters may be installed in the SMFCIs closest to the first and second inlet flow path segments, thereby allowing for filtration of the process gases passing through them just before they reach the semiconductor processing chamber. In such embodiments, one or two surface-mounted valves may be installed immediately downstream. For example, a shut-off valve (e.g., one that can be quickly switched between fully open and fully closed, but does not allow for finer flow control) may be installed in one or both of the second and fifth SMFCIs, while a flow control valve (e.g., one that can be switched between at least two different non-zero flow rates) may be installed in one or both of the third and sixth SMFCIs. Such a configuration may allow for variable or single-rate flow control of the gases flowing along each flow path.

[0064] For example, as in the example for the fourth SMFCI above, it will be further understood that if a flow control component is omitted from an SMFCI, a pass-through cap, such as pass-through cap 132, can be used to deliver gas to that SMFCI with low or minimal increase in flow resistance. Alternatively, a manifold block may be designed with one of the SMFCIs on either or both flow paths omitted entirely, potentially reducing the number of passages between the SMFCIs. For example, as shown in FIG. 18, a manifold block 1804 is shown that is identical to manifold block 104 except that the first SMFCI 106a has been omitted. The first inlet flow path segment 1860 is extended to reach the bore of the second SMFCI 1806b, thereby providing equivalent functionality (albeit a more streamlined equivalent) to when a pass-through cap is used.

[0065] Additionally, while the SMFCIs shown in the accompanying figures are all the same size, it will be understood that different sizes of SMFCIs may be used in different situations, and a mixture of different sizes of SMFCIs may be used in the manifold blocks described herein.

[0066] From the above description and the figures illustrated therein, it will be apparent that the manifold blocks of the above example provide a very compact valve system. For example, when compared to a conventional system such as that shown in FIG. 19, it was found that in the above example, the size of the packaging envelope was reduced by approximately 72%, allowing two such manifold block assemblies to fit within the same volume occupied by one equivalent valve system such as that shown in FIG. 19. To give an idea of ​​scale, some manifold blocks such as those described above may have a width in a first direction perpendicular to a first reference plane that is less than 225%, e.g., 200% to 225%, of the width of one of the SMFCIs in the first direction, and a length in a second direction parallel to the first reference plane and perpendicular to the first direction that is less than 300%, e.g., 230% to 300%, of the width of one of the SMFCIs in the first direction. For example, in the embodiment shown in Figures 1-10, the height parallel to the central axis of the SMFCI (excluding inlet and outlet flow path hardware extending from manifold block 104) may be on the order of less than 8 inches (203.2 mm), the width perpendicular to the first reference plane may be on the order of 2.5 inches (63.5 mm), and the length parallel to the SMFCI and perpendicular to the width may be on the order of 3.375 inches (85.725 mm).

[0067] Such a compact footprint is facilitated in part by locating some of the SMFCIs on opposite sides of the manifold block, which allows the footprints of the SMFCIs to overlap when viewed along their central axes, thereby increasing the number of SMFCIs that can fit within a given area compared to an arrangement of SMFCIs where the SMFCIs are all positioned so that they do not overlap. It will be understood that such overlap is not strictly necessary, but a manifold block in which the SMFCIs are all on the same side without overlapping may not be usable to provide an assembly as compact as the illustrated valve assembly.

[0068] An alternative arrangement of the manifold block that may provide a similar, but perhaps less space-efficient, reduction in packaging volume (SMFCI footprints do not overlap) is shown in Figures 20-24. In Figures 20-24, the SMFCI is shown in dashed lines, while passages internal to the manifold block, for example, passages between ports on the SMFCI or between SMFCI ports and external tubular passages, elbow fittings, or T-fittings, are shown in dotted lines.

[0069] 20 shows a manifold block 2004 having five SMFCIs arranged therein, where SMFCIs 2006a and 2006b may be fluidly connected in series with a first inlet flow path 2060, thereby allowing a first surface-mounted flow component, e.g., a filter, to be mounted on the first SMFCI 2006a and a second surface-mounted flow component, e.g., a valve, to be mounted on the second SMFCI 2006b, thereby controlling the flow of filtered gas to an intersecting passage 2056 leading to an outlet flow path segment 2058. A second inlet flow path 2062 may be fluidly connected in series with a third SMFCI 2006c, a fourth SMFCI 2006d, and a fifth SMFCI 2006e. The fourth SMFCI 2006d and the fifth SMFCI 2006e may also be fluidly connected to a cross-passage 2056, such that gas flowing through either or both of the fourth SMFCI 2006d and the fifth SMFCI 2006e mixes with gas flowing from the second SMFCI 2006b into the cross-passage 2056. As can be seen, the first SMFCI 2006a is fluidly connected to the second SMFCI 2006b by a first passage 2044, and the third SMFCI 2006c is fluidly connected to the fourth SMFCI 2006d by a second passage 2046. The first passage 2044 and the second passage 2046 may, for example, extend along parallel directions and be generally the same length. The third passage 2048 may fluidly connect the fourth SMFCI 2006d and the fifth SMFCI 2006e, and the third passage 2048 may, for example, be perpendicular to the first passage 2044 and the second passage 2046 and extend along a direction parallel to the SMFCI 2006.

[0070] Manifold block 2004 provides a compact assembly that is nearly as compact in the plane of the SMFCI as shown above for manifold blocks 104 and 1104, but is also more compact in directions perpendicular to the SMFCI. It is also observed that the second flow path in manifold block 2004 has two fluid connection points with cross passage 2056, as opposed to the second flow path's single fluid connection point with cross passage 156 or 1156 of manifold block 104 or 1104, respectively. SMFCI 2006d, in this example, is a three-port SMFCI that, when interfaced with a surface-mounted diaphragm valve, can, for example, operate the valve to isolate the center port from the two side ports (which may remain fluidly connected by a toroidal plenum surrounding the sealed center port). In this case, one of the side ports in SMFCI 2006d can be connected to second passage 2046, thereby supplying gas to the second side port in SMFCI 2006d, and therefore to SMFCI 2006e, regardless of the valve state of the valve connected to SMFCI 2006d. When the valve in SMFCI 2006d is actuated to an open state, gas can be directed to cross-passage 2056 through the center port of SMFCI 2006d. Similarly, when the valve in SMFCI 2006e is actuated to an open state, gas can be directed to cross-passage 2056 through one of the ports of SMFCI 2006e. For example, if the two flow paths from SMFCIs 2006d and 2006e to the cross passage 2056 have different flow resistances, for example, by using one or more flow restrictors or restrictions that may be fluidly interposed between the cross passage 2056 and one or both of SMFCIs 2006d and 2006e, this effectively allows the flow through SMFCIs 2006d and 2006e to be switched between two or three different flow rates (e.g., via a low flow path from one of SMFCIs 2006d and 2006e, via a high flow path from the other of SMFCIs 2006d and 2006e, or via both flow paths from SMFCIs 2006d and 2006e).

[0071] 21 illustrates a manifold block 2104 in which six SMFCIs are arranged, where SMFCIs 2106a, 2106b, and 2106c may be fluidly connected in series with a first inlet flow path 2160, whereby a first surface-mounted flow component, e.g., a filter, may be mounted on the first SMFCI 2106a, and second and third surface-mounted flow components, e.g., valves, may be mounted on the second SMFCI 2106b and third SMFCI 2106c, thereby controlling the flow of filtered gas into an intersecting passage 2156 leading to an outlet flow path segment 2158. A second inlet flow path 2162 may be fluidly connected in series with a fourth SMFCI 2106d, a fifth SMFCI 2106e, and a sixth SMFCI 2106f. The sixth SMFCI 2106f may also be fluidly connected to the crossover passage 2156, such that gas flowing through the sixth SMFCI 2106f mixes with gas flowing into the crossover passage 2156 from the third SMFCI 2106c. As can be seen, the second SMFCI 2106b is fluidly connected to the third SMFCI 2106c by the first passage 2144, and the first SMFCI 2106a is fluidly connected to the second SMFCI 2106b by an external fluid passage provided, for example, by tubing and elbow fittings, external to the manifold block 2104. For example, a filter may be connected to the fourth SMFCI 2106d, and a valve may be connected to the fifth SMFCI 2106e and the sixth SMFCI 2106f. The two valves in series may include, for example, an upstream shutoff valve and a downstream variable flow valve.

[0072] The fourth SMFCI 2106d and the fifth SMFCI 2106e, and the fifth SMFCI 2106e and the sixth SMFCI 2106f are also fluidly connected via external fluid passages in this example. Also in this example, five of the SMFCIs are arranged along a common axis, for example, linearly, but the direction of fluid flow through each of these SMFCIs (or at least some of these SMFCIs) is along a direction perpendicular to the arrangement axis.

[0073] 22 illustrates a manifold block 2204 that is similar to manifold block 2104, except that the first SMFCI 2106a is omitted and the first flow path flows directly into what becomes the second SMFCI 2106b of manifold block 2104. Features of manifold block 2204 that have callouts with the same last two digits as similar features in manifold block 2104 can be assumed to be the same, and the descriptions of those similar features in the description of manifold block 2104 above are equally applicable to the corresponding portions of those features in FIG.

[0074] 23 illustrates a manifold block 2304 that is similar to manifold block 2104, except that all six SMFCIs 2306a-f are arranged in a linear array. Also, there are no passages inside manifold block 2304 connecting two SMFCIs; instead, a first SMFCI 2306a is fluidly connected to a second SMFCI 2306b by an external flow path, which in turn is fluidly connected to a third SMFCI 2306c by another external flow path. Similarly, a fourth SMFCI 2306d is fluidly connected to a fifth SMFCI 2306e by an external flow path, which in turn is fluidly connected to a sixth SMFCI 2306f by another external flow path. Both the third SMFCI 2306c and the sixth SMFCI 2306f are fluidly connected with a cross passage 2356 that leads to an outlet flow path segment 2358. Flow control components may be connected with the SMFCIs 2306a-f in a manner similar to the way flow control components may be connected with the SMFCIs 2106a-f. Features of manifold block 2304 that have callouts with the same last two digits as similar features in manifold block 2104 can be assumed to be the same, and the descriptions of those similar features in the description of manifold block 2104 above are equally applicable to the corresponding portions of those features in FIG. 23 .

[0075] FIG. 24 illustrates a manifold block 2404 including five SMFCIs 2406a-e, which can provide a fluid circuit having similar functionality and operation to that of FIG. 20, except that the SMFCIs 2406a-e are arranged in a linear array. In this example, only one passageway 2444 is provided internal to the manifold block, fluidly connecting the fourth SMFCI 2406d with the fifth SMFCI 2406e, with the remaining fluid connections between the SMFCIs being made via external tubing connections. Features of manifold block 2404 that have callouts with the same last two digits as similar features in manifold block 2104 can be assumed to be the same, and the descriptions of those similar features in the description of manifold block 2104 above are equally applicable to the corresponding portions of those features in FIG. 24.

[0076] As noted above, the manifold blocks described herein, as well as the valve assemblies employing them, can be installed beneath a semiconductor processing chamber. FIG. 25 illustrates one example of such an installation. Shown in FIG. 25 is a semiconductor processing chamber 2564 including a showerhead 2570 that can be used to provide process gases to a wafer 2572 that can be supported within the chamber 2564 by a wafer support 2574 connected to a shower pedestal 2568. The shower pedestal 2568 can have a plurality of orifices on its upper surface that can be used to deliver process gases to the underside of the wafer 2572. Gases can be provided to the orifices through an internal plenum (not shown) of the shower pedestal 2568, which receives gases from a flow component assembly 2502, e.g., an assembly similar to flow component assembly 102, via a stem 2566. If desired, a lift mechanism 2576 can be provided so that the stem 2566 (and shower pedestal 2568) can be moved vertically up and down within the chamber 2564. The flow component assembly 2502 may be connected to the stem 2566 for movement in conjunction with the stem 2566 .

[0077] Control of flow component assemblies as described herein may be facilitated through the use of a controller, which may be included as part of a semiconductor processing tool having the flow component assembly. The above-described systems may be integrated with electronics for controlling pre- and post-processing operations of a semiconductor wafer or substrate. Such electronics may be referred to as a "controller" and may control various components or subcomponents of one or more systems. The controller may be programmed to control any of the systems disclosed herein, including the operation of various valves or other components that may be included in the flow control assembly, depending on the processing requirements and / or type of system.

[0078] Broadly, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software to receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, i.e., microcontrollers, that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific gas flow operations using the flow component assemblies described herein.

[0079] In some embodiments, the controller may be part of, coupled to, or a combination of a computer integrated with, coupled to, or otherwise networked to the system. For example, the controller may be in the “cloud” or all or part of a fab host computer system. This allows for remote access of wafer processing. The computer may provide remote access to the system to monitor the current progress of a fabrication operation, review the history of past fabrication operations, review trends or performance criteria from multiple fabrication operations, modify parameters of a current process, configure processing steps following a current process, or initiate a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to the system over a network. Such a network may include a local network or the Internet. The remote computer may include a user interface that allows entry or programming of parameters and / or settings, which are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data. Such data identifies parameters for each processing step performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is configured to interface with or control. Thus, as noted above, the controller may be distributed, for example, by having one or more individual controllers networked together and working together toward a common purpose (such as the processes and controls described herein).An example of a distributed controller for such purposes would include one or more integrated circuits (e.g., VTM) on the chamber that communicate with one or more integrated circuits located remotely (e.g., at the platform level or as part of a remote computer) and coupled to control gas flow operations using flow component assemblies as described herein.

[0080] Without limitation, the flow component assemblies described herein may be interfaced with one or more other pieces of equipment including a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a tracking chamber or module, and any other semiconductor processing system that may be associated with or used in the fabrication and / or manufacturing of semiconductor wafers.

[0081] As noted above, depending on the process step or steps being performed by the tool, the controller may communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to and from tool locations and / or load ports of wafers (e.g., FOUPs) within a semiconductor fabrication factory.

[0082] For purposes of this disclosure, the term "fluidically connected" is used in reference to volumes, plenums, holes, etc. that may be connected to one another directly or through one or more intervening components or volumes to form a fluid connection, similar to the way the term "electrically connected" is used in reference to components that are connected to one another to form an electrical connection. The term "fluidically interposed," when used, may refer to a component, volume, plenum, or hole that is fluidly connected to at least two other components, volumes, plenums, or holes, such that fluid flowing from one of those other components, volumes, plenums, or holes to the other or another of those components, volumes, plenums, or holes first flows through the "fluidically interposed" component before reaching the other or another of those components, volumes, plenums, or holes. For example, if a pump is fluidly interposed between a reservoir and an outlet, fluid flowing from the reservoir to the outlet first flows through the pump before reaching the outlet. The term "fluidically adjacent," when used, refers to placing a fluid element relative to another fluid element such that there are no potential fluidically interposed structures between the two elements that could potentially impede fluid flow between the two elements. For example, in a flow path having a first valve, a second valve, and a third valve arranged in sequence, the first valve is fluidly adjacent to the second valve, the second valve is fluidly adjacent to both the first valve and the third valve, and the third valve is fluidly adjacent to the second valve.

[0083] The use of ordinal markers, e.g., (a), (b), (c)... or (1), (2), (3),..., etc., in this disclosure and claims, when present, should be understood as not conveying a particular order or sequence (except to the extent such order or sequence is explicitly indicated). For example, where there are three steps labeled (i), (ii), and (iii), it should be understood that these steps may be performed in any order (or simultaneously, unless contraindicated) unless otherwise indicated. For example, if step (ii) involves handling an element formed in step (i), step (ii) can be considered to occur at some point after step (i). Similarly, if step (i) involves handling an element formed in step (ii), the reverse should be understood. It should also be understood that the use of the ordinal marker "first" herein, e.g., "first item," should not be construed as suggesting, implicitly or inherently, that a "second" instance, e.g., "second item," is necessarily present.

[0084] As used herein, phrases such as "for each <item> of one or more <items>," "for each <item> of one or more <items>," and the like, should be understood to include both single and multiple items; i.e., the phrase "for each..." is understood to be used in the sense that it is used in programming languages ​​to refer to each item in a referenced population of items. For example, if the referenced population of items is a single item, "each" refers only to that single item (despite the fact that dictionary definitions of "each" often define the term to refer to "one of two or more things") and does not imply that there must be at least two of those items. Similarly, the terms "set" or "subset" should not, in and of themselves, be considered to necessarily encompass multiple items; it will be understood that a set or subset can encompass only one member or multiple members (unless the context dictates otherwise).

[0085] The term "between," as used herein, and when used in relation to a range of values, should be understood to include the beginning and ending values ​​of the range, unless otherwise indicated. For example, between 1 and 5 should be understood to include the numbers 1, 2, 3, 4, and 5, not just the numbers 2, 3, and 4.

[0086] The term "operably connected" should be understood to refer to two components and / or systems being directly or indirectly connected, e.g., at least one component or system being able to control the other. For example, a controller may be described as operably connected with a resistive heating unit, including the controller being connected to a sub-controller of the resistive heating unit that is electrically connected to a relay configured to controllably connect or disconnect the resistive heating unit from a power source, the power source being capable of providing an amount of power to the resistive heating unit to generate a desired degree of heating. While the controller itself likely cannot directly provide such power to the resistive heating unit due to the currents involved, the controller is still understood to be operably connected with the resistive heating unit.

[0087] It will be understood that the examples and embodiments described herein are for illustrative purposes only, and that various modifications or changes thereto will be suggested to those skilled in the art. Various details have been omitted for clarity, but various design alternatives can be implemented. Therefore, the examples should be considered illustrative rather than restrictive, and the disclosure should not be limited to the details provided herein, but may be modified within the scope of the disclosure.

[0088] While the above disclosure has focused on several specific exemplary embodiments, it should be understood that it is not limited to only the described examples, but may also apply to similar modifications and features, and such similar modifications and features are also considered to be within the scope of the present disclosure.

Claims

1. 1. An apparatus comprising a manifold block having a set of at least five surface mounted flow component interfaces, the set of at least five surface mounted flow component interfaces (SMFCIs) includes a first SMFCI having a first central axis, a second SMFCI having a second central axis, a third SMFCI having a third central axis, a fourth SMFCI having a fourth central axis, and a fifth SMFCI having a fifth central axis; the first central axis is parallel to and coincident with a first reference plane; the fourth central axis is parallel to and coincides with the second reference plane; the first SMFCI is configured to mate with a first surface mount flow component, the second SMFCI is configured to mate with a second surface mount flow component, the third SMFCI is configured to mate with a third surface mount flow component, the fourth SMFCI is configured to mate with a fourth surface mount flow component, and the fifth SMFCI is configured to mate with a fifth surface mount flow component; the manifold block includes a first passage extending between the first SMFCI and the second SMFCI, a second passage extending between the second SMFCI and the third SMFCI, and a third passage extending between the fourth SMFCI and the fifth SMFCI; the first to third passages are fluidly isolated from one another within the manifold block; Device.

2. 10. The apparatus of claim 1, The apparatus wherein the first through fifth SMFCIs are located on the same side of the manifold block.

3. 10. The apparatus of claim 1, The apparatus wherein the first SMFCI is located on an opposite side of the manifold block from the second SMFCI.

4. 4. The apparatus of claim 3, The apparatus, wherein the second SMFCI and the third SMFCI are on the same side of the manifold block.

5. 4. The apparatus of claim 3, the first passage extends along a first passage axis perpendicular to a second passage axis along which the second passage extends; the first passage axis is perpendicular to the first SMFCI; Device.

6. 6. The apparatus of claim 5, The apparatus, wherein the first path is a straight path.

7. The device according to any one of claims 1 to 6, The corresponding second and third central axes are parallel to and coincident with the first reference plane.

8. 8. The apparatus of claim 7, The fifth central axis is parallel to and coincident with the second reference plane.

9. 9. The apparatus of claim 8, The apparatus, wherein the first reference plane is parallel to the second reference plane.

10. 10. The apparatus of claim 9, The apparatus, wherein the manifold block further includes a cross passage within the manifold block, the cross passage fluidly connecting the third SMFCI and the fifth SMFCI.

11. 11. The apparatus of claim 10, The apparatus wherein the manifold block is connected to a cross passage external to the manifold block, the cross passage fluidly connecting the third SMFCI and the fifth SMFCI.

12. 11. The apparatus of claim 10, the apparatus further comprising an outlet flow path segment having a first end fluidly connected to the intersecting passage and a second end configured to connect to one or more components of a gas distribution system of a semiconductor processing tool.

13. 10. The apparatus of claim 1, further comprising a first inlet flow path segment and a second inlet flow path segment; the first inlet flow path segment is fluidly connected to the first SMFCI; the second inlet flow path segment is fluidly connected to the fourth SMFCI; the first inlet flow path segment and the second inlet flow path segment are fluidly isolated from each other. Device.

14. 14. The apparatus of claim 13, the first inlet flow path segment extends through a first side of the manifold block spanning between a side of the manifold block having the first SMFCI and a side of the manifold block opposite the side of the manifold block having the first SMFCI; the second inlet flow path segment extends through a second side of the manifold block spanning between the side of the manifold block having the first SMFCI and a side of the manifold block opposite the side of the manifold block having the first SMFCI; Device.

15. 14. The apparatus of claim 13, both the first inlet flow path segment and the second inlet flow path segment extend through a first side of the manifold block spanning between a first side of the manifold block having the first SMFCI and a second side of the manifold block opposite the side of the manifold block having the first SMFCI; Device.

16. 16. The apparatus of claim 15, the manifold block has a width in a first direction perpendicular to the first reference plane that is less than or equal to 225% of a width of the SMFCI in the first direction; the manifold block has a length in a second direction parallel to the first reference plane that is less than or equal to 300% of a length of the SMFCI in the second direction; Device.

17. 17. The apparatus of claim 16, the set of at least five SMFCIs includes a sixth SMFCI; the manifold block further includes a fourth passage extending between the fifth SMFCI and the sixth SMFCI; the sixth SMFCI is fluidly isolated from the first to fifth SMFCIs within the manifold block; Device.

18. 18. The apparatus of claim 17, the first surface mount flow component; the second surface mount flow component; the third surface mount flow component; the fourth surface mount flow component; the fifth surface mount flow component; a sixth surface mount flow component; and Furthermore, the first surface mount flow component is connected to the first SMFCI; the second surface mount flow component is connected to the second SMFCI; the third surface mount flow component is connected to the third SMFCI; the fourth surface mount flow component is connected to the fourth SMFCI; the fifth surface mount flow component is connected to the fifth SMFCI; the sixth surface mount flow component is connected to the sixth SMFCI; Device.

19. 19. The apparatus of claim 18, The apparatus, wherein the first and fourth surface mounted flow components are filters and the second, third, fifth, and sixth surface mounted flow components are valves.

20. 10. The apparatus of claim 1, the first SMFCI includes four first holes arranged in a circular pattern around the first central axis, a first central port located along the first central axis, and at least a first off-center port located radially outward of the first central port relative to the first central axis, the first central port and the first off-center port each including a corresponding first bore and a corresponding first counterbore having a larger diameter than the corresponding first bore and centered about the corresponding first bore; the second SMFCI includes four second holes arranged in a circular pattern around the second central axis, a second central port located along the second central axis, and at least a second off-center port located radially outward of the second central port relative to the second central axis, the second central port and the second off-center port each including a corresponding second bore and a corresponding second counterbore having a larger diameter than the corresponding second bore and centered about the corresponding second bore; the third SMFCI includes four third holes arranged in a circular pattern around the third central axis, a third central port located along the third central axis, and at least a third off-center port located radially outward of the third central port relative to the third central axis, the third central port and the third off-center port each including a corresponding third bore and a corresponding third counterbore having a larger diameter than the corresponding third bore and centered about the corresponding third bore; the fourth SMFCI includes four fourth holes arranged in a circular pattern around the fourth central axis, a fourth central port located along the fourth central axis, and at least a fourth off-center port located radially outward of the fourth central port relative to the fourth central axis, the fourth central port and the fourth off-center port each including a corresponding fourth bore and a corresponding fourth counterbore having a larger diameter than the corresponding fourth bore and centered about the corresponding fourth bore; the fifth SMFCI includes four fifth holes arranged in a circular pattern around the fifth central axis, a fifth central port located along the fifth central axis, and at least a fifth off-center port located radially outward of the fifth central port relative to the fifth central axis, the fifth central port and the fifth off-center port each including a corresponding fifth bore and a corresponding fifth counterbore having a larger diameter than the corresponding fifth bore and centered about the corresponding fifth bore; Device.

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