Heat dissipation devices for electronic devices

Abstract

To provide a heat dissipation device for electronic equipment that can greatly improve the overall heat dissipation performance. The heat dissipation device for electronic devices includes a heat conduction panel body having a refrigerant flow space formed therein where a refrigerant filled therein changes phase and circulates as a gas or liquid, and an absorber disposed in the refrigerant flow space of the heat conduction panel body, absorbing and retaining the liquid phase refrigerant and dispersing the liquid phase refrigerant in the direction of gravity or at least in the direction opposite to the direction of gravity. The absorber maintains its absorption rate for the liquid phase refrigerant through its own material while preventing deformation in the direction of gravity.

Description

[Technical Field]

[0001] The present invention relates to a heat dissipation apparatus for electronic devices, and more particularly to a heat dissipation apparatus for electronic devices that can improve heat dissipation performance by preventing shape deformation due to gravity while maintaining the absorption capacity of a liquid-state refrigerant (liquid-phase refrigerant). [Background technology]

[0002] Related technologies in various industrial fields such as communications, electronics, and electricity are continually being developed to be more advanced so that they can be applied to more advanced industries. High-level technological development requires high-power energy, and devices that use high-power energy inevitably face the problem of high heat generation, so the development of suitable cooling systems is also required.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, air mobility, electric vehicles, energy storage devices, displays, etc. These heat dissipation systems are one of the main causes of power consumption, which tends to increase with industrial development.

[0004] Generally, cooling devices can be broadly divided into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection using a fan, while passive cooling devices can be classified as a technology that utilizes natural convection without using a fan.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously advancing advanced technologies. As a result, related industries are currently in need of innovative technology that can solve these problems, and heat dissipation devices using phase change materials have been developed as part of the solution.

[0006] However, it is preferable that a heat dissipation device using a phase change material is structurally designed so that the liquid refrigerant changes phase to gas refrigerant at the location closest to the heat generating element, which is the target of heat dissipation. However, if the heat generating element is installed at a distance in the direction of gravity, the liquid refrigerant will be stored biased downward due to gravity. Therefore, the most important factor in improving heat dissipation performance is to properly distribute the liquid refrigerant at the location of each heat generating element.

[0007] In the case of conventional heat dissipation devices such as vapor chambers, a technical configuration is adopted in which a wick member with numerous pores is integrated into the space where the refrigerant circulates (refrigerant flow space) using a sintering method as a structure for dispersing the liquid refrigerant, and then the surface tension of the liquid is utilized to disperse the refrigerant.

[0008] However, there are limitations to dispersing liquid refrigerant in the direction of gravity by utilizing the surface tension of the liquid, and there is also the problem that the manufacturing and installation methods of the wick member are very complicated, which reduces product productivity.

[0009] In addition, due to the limitations on the dispersion of the liquid refrigerant due to the surface tension of the liquid, heat dissipation devices such as vapor chambers typically have a structure in which they are horizontally placed on the top surface of a flat heating element to transfer or dissipate heat, which has the problem of very limited usability. Summary of the Invention [Problem to be solved by the invention]

[0010] The present invention has been made to solve the above-mentioned technical problems, and aims to provide a heat dissipation device for electronic equipment that includes an absorbent body that can maintain its shape even when absorbing a liquid-phase refrigerant by generating a dispersion force higher than the surface tension of the liquid in the direction opposite to the direction of gravity due to the liquid absorption rate of the material itself.

[0011] Another object of the present invention is to provide a heat dissipation device for electronic devices that can be generally applied regardless of the layout design of the heat generating element.

[0012] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0013] According to one embodiment of the present invention, a heat dissipation device for an electronic device includes a heat conduction panel body having a refrigerant flow space formed therein, through which a refrigerant filled therein changes phase and circulates from gas to liquid, and an absorber disposed in the refrigerant flow space of the heat conduction panel body, absorbing and retaining liquid-phase refrigerant from the refrigerant and dispersing the liquid-phase refrigerant in a direction of gravity or at least in a direction opposite to the direction of gravity, wherein the absorber maintains its absorption rate for the liquid-phase refrigerant by its own material while being prevented from deforming in the direction of gravity.

[0014] Here, the absorber may include an absorbent body portion that has an absorption rate for the liquid-phase refrigerant and that deforms in shape due to an external force including a predetermined gravity or greater, and a skeleton holding portion that is connected to the absorbent body portion and prevents the absorbent body portion from deforming in shape due to the external force.

[0015] The absorbent body may be made of at least one of nonwoven fabric, cotton, and sponge.

[0016] The skeleton holding portion may be made of a metal material and have a hollow tube shape in which the absorbing body portion is located.

[0017] The skeleton holding portion may be formed by braiding a metal wire into the tubular shape.

[0018] The skeleton holding portion may be braided to have gaps through which at least the liquid phase refrigerant of the refrigerant is transferred from the outside to the absorbent body portion inside by surface tension.

[0019] The metal material of the skeleton support portion can be a material having a predetermined thermal conductivity or higher.

[0020] The metal material of the skeleton holder may include copper.

[0021] The skeleton holding portion may be formed in a cylindrical shape, and the absorbing body portion may be formed in a columnar shape so as to be inserted into the skeleton holding portion which is formed in a cylindrical shape.

[0022] The heat conduction panel body may be made of a metal panel member having a predetermined thermal conductivity or higher, and may include a first heat conduction panel forming one side of the refrigerant flow space and a second heat conduction panel forming the other side of the refrigerant flow space, and the absorber may be disposed adjacent to one end of the refrigerant flow space between the first heat conduction panel and the second heat conduction panel, the end being adjacent to an external heat source.

[0023] The refrigerant flow space may include a first refrigerant flow path forming the one side end where the absorber is provided, and a second refrigerant flow path formed at an angle in the gravity direction with respect to the first refrigerant flow path and defined by an inclined guide formed on the one-side heat conduction panel and the other-side heat conduction panel such that a thickness of the refrigerant flow space decreases, and the absorber may be provided in the first refrigerant flow path.

[0024] In addition, when the first refrigerant flow path in which the absorber is provided is provided so that heat from the heat generating element is transferred, at least one end and the other end of the absorber may be disposed a predetermined distance apart in the direction of gravity. [Effects of the Invention]

[0025] The heat dissipation device for an electronic device according to an embodiment of the present invention can achieve the following various effects.

[0026] First, it overcomes the limitation of liquid-phase refrigerant dispersion in the direction opposite to the direction of gravity due to the inherent surface tension of the liquid, and makes it possible to evenly disperse the liquid-phase refrigerant in the direction of gravity, thereby increasing the gas-liquid circulation rate and significantly improving heat dissipation performance.

[0027] Second, since there is no restriction on the position design of the heating element, the diversity of the coupling design for the heating element can be improved. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a perspective view showing a rear surface of an antenna device provided with a heat dissipation device for an electronic device according to an embodiment of the present invention; [Figure 2] 2 is an exploded perspective view showing a rear part of the antenna device of FIG. 1. FIG. [Figure 3] 1 is a perspective view illustrating a heat dissipation device for an electronic device according to an embodiment of the present invention; [Figure 4] FIG. 4 is an exploded perspective view of FIG. 3. [Figure 5] 4A is a cutaway perspective view of FIG. 3, FIG. 4B is a partially enlarged view of the cutaway perspective view, and FIG. 4C is a cross-sectional view of the part. [Figure 6] 6A to 6C are perspective views showing various embodiments of the absorber in the configuration of FIG. 5. [Figure 7] 6A to 6C are perspective views showing various embodiments of the absorber in the configuration of FIG. 5. DETAILED DESCRIPTION OF THE INVENTION

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a heat dissipation device for an electronic device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0030] When assigning reference numerals to components in each drawing, it should be noted that the same components are assigned the same numerals as much as possible even if they are shown in different drawings. Furthermore, when describing the embodiments of the present invention, if it is determined that a detailed description of such well-known configurations or functions would hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0031] When describing components of an embodiment of the present invention, terms such as "first," "second," "A," "B," "(a)," and "(b)" may be used. These terms are merely used to distinguish the component from other components and do not limit the nature, order, or procedure of the components. Furthermore, unless otherwise specified, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted to have a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0032] FIG. 1 is a perspective view showing the rear portion of an antenna device provided with a heat dissipation device for electronic equipment according to one embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the rear portion of the antenna device of FIG.

[0033] Generally, electronic devices are manufactured in various forms throughout the industry, but the applicant of the present invention is a company engaged in the manufacture of other wireless communication devices, and will explain the antenna device as a specific example of a typical electronic device. The antenna device contains digital elements such as FPGAs, which are one of the typical heat-generating elements, and analog elements such as PAs and LNAs, which amplify signals, and the performance of the device can be determined by effectively dissipating the heat generated by these elements.

[0034] However, the heat dissipation device according to the embodiment of the present invention described below should not necessarily be interpreted as being limited to the antenna device.

[0035] An antenna device 100 to which a heat dissipation device 200 for an electronic device according to one embodiment of the present invention is applied includes a heat dissipation housing main body 110 formed in a rectangular parallelepiped shape, which forms an accommodation space that is open to the front, and has a long and thin front-to-back accommodation width in the approximately vertical direction, as shown in Figures 1 and 2.

[0036] Inside the storage space of the heat dissipation housing main body 110, although not shown, multiple MBF (Micro Bellows Filter) elements are mounted on the front side via a clamshell as a substrate for a PAU (Power Amplifier Unit) and a DTU (Digital Transceiving Unit), and a main board with a heating element mounted on the back side can be stacked.

[0037] Here, a heat-generating element (heat generating body) that generates a large amount of heat during operation, such as an FPGA element, an RFIC element, a PA element, or an LNA element, can be mounted on the rear side of the main board.

[0038] However, it should be noted that in one embodiment of the present invention, the electronic device is merely described as an antenna device, and the heating element is not limited to the above configuration. For example, the heating element may be a semiconductor, which is a typical heating element.

[0039] A radome panel (not shown in the drawing) is installed on the front surface of the receiving space of the heat dissipation housing body 110 to protect the radiating element realized by the antenna element from the outside while also allowing smooth radiation from the radiating element.

[0040] Meanwhile, a heat dissipation device 200 according to an embodiment of the present invention may be installed on the rear surface of the heat dissipation housing body 110 .

[0041] The heat dissipation device 200 of the electronic device according to one embodiment of the present invention is provided in the form of a type of heat dissipation fin, and strictly speaking, unlike the fixed type heat dissipation fin 200F described later, it can be characterized as being provided in the form of a thin plate heat exchanger (PTX) type that essentially includes an absorber 300 described later inside that absorbs the liquid phase refrigerant among the refrigerants.

[0042] As shown in Figures 1 and 2, heat dissipation devices 200 according to an embodiment of the present invention may be arranged vertically on the back surface of the heat dissipation housing main body 110, and multiple devices may be arranged adjacent to each other with a predetermined distance between them in the left and right directions.

[0043] However, although not shown, it goes without saying that the multiple heat dissipation devices 200 do not necessarily have to be arranged vertically up and down, but can also be arranged with an upward inclination toward the left and right ends based on the middle part of the back of the heat dissipation housing main body 110.

[0044] The reason why the heat dissipation devices 200 of the electronic device according to one embodiment of the present invention are arranged vertically and tilted upwards is to allow the rising air current of the heat generated by heat exchange with the external air to smoothly escape between adjacent heat dissipation devices 200 and along the tilted heat dissipation devices 200 to the outside with minimal airflow resistance.

[0045] Meanwhile, in addition to the heat dissipation device 200 for an electronic device according to an embodiment of the present invention, fixed heat dissipation fins 200F may be arranged on the rear surface of the heat dissipation housing main body 110. Like the heat dissipation device 200 for an electronic device according to an embodiment of the present invention, the fixed heat dissipation fins 200F are manufactured separately and then detachably coupled to the rear surface of the heat dissipation housing main body 110. However, the fixed heat dissipation fins 200F are not filled with a refrigerant and can be defined as a structure that dissipates heat from a heat-generating element solely through the thermal conductivity of the metal material itself.

[0046] Here, the fixed heat dissipation fins 200F can be arranged on the underside of the rear portion of the heat dissipation housing main body 110 that is not occupied by the heat dissipation device 200 of the electronic device according to one embodiment of the present invention, as shown in Figures 1 and 2.

[0047] In addition, as shown in Figures 1 and 2, a press-fit portion 150 may be formed on the back of the heat dissipation housing main body 110 for press-fitting and installing a plurality of heat dissipation devices 200 according to one embodiment of the present invention.

[0048] The press-fitting portion 150 may be generally formed in a slot shape so that a part of the front end portion of the heat dissipation device 200 according to an embodiment of the present invention can be inserted therein.

[0049] Here, the meaning that the press-fit portion 150 is provided in a slot shape includes the concept that a pair of slot ribs (not shown in the drawing) protrude backward from the back surface of the heat dissipation housing main body 110, and a groove-like insertion space is provided between the pair of slot ribs, into which the front end (or part of the front end) of the heat dissipation device 200 of an electronic device according to one embodiment of the present invention is inserted.

[0050] At this time, it is preferable that the press-fit portion 150 is press-fitted after being treated with thermal epoxy (not shown) in order to improve heat transfer efficiency.

[0051] Here, the press-fit portion 150 can be positioned so as to pass through at least one of the heat-generating type mating surfaces (not shown) that are recessed rearward and protruded so that the heat-generating surface of the heat-generating element is accommodated on the inner surface corresponding to the back side of the heat-dissipating housing main body 110.

[0052] FIG. 3 is a perspective view showing a heat dissipation device according to one embodiment of the present invention, FIG. 4 is an exploded perspective view of FIG. 3, and FIG. 5 is a cutaway perspective view (a) of FIG. 3, an enlarged partial view (b) of the cutaway perspective view, and a cross-sectional view (c) of the relevant part.

[0053] As shown in FIGS. 3 to 5, a heat dissipation device 200 for an electronic device according to an embodiment of the present invention may include a heat conduction panel body 200P having a refrigerant flow space 205 filled with a refrigerant and providing a space for gas-liquid circulation so that the refrigerant changes phase within the closed space and releases heat.

[0054] Here, the heat conduction panel body 200P can be defined as a structure formed by pressing a single metal panel member and then bending or joining it to have the above-mentioned refrigerant flow space 205 therein.

[0055] Meanwhile, the refrigerant flow space 205 may include a first refrigerant flow path 210 which forms an evaporation region in which the liquid phase refrigerant among the filled refrigerant is collected by at least one of gravity and capillary force, and evaporates while changing phase to gas phase refrigerant by heat transferred from the heating element.

[0056] The first refrigerant flow path 210 is the front end portion in the width direction of the heat conduction panel body 200P formed by the bending or joining process described above, and can be defined as a space occupying a part of the refrigerant filling and flow space where the liquid phase refrigerant enters, separated from the press-fit portion 150 equipped with the heating element by a distance corresponding to the thickness of the material of the heat conduction panel body 200P made of a metal panel member.

[0057] Specifically, the "separation distance according to the thickness of the material" refers to the distance between the first refrigerant flow path 210 and the heat generating element or the press-fit portion 150 equipped with the heat generating element. However, the definition of the first refrigerant flow path 210 is not simply a space where only the liquid phase refrigerant is collected, but rather has a greater meaning as an evaporation region at one end in the width direction where heat is supplied to the heat conduction panel body 200P from the heat generating element to be dissipated.

[0058] Meanwhile, the refrigerant flow space 205 may further include a plurality of second refrigerant flow paths 220 that guide the flow of the liquid-phase refrigerant toward the first refrigerant flow path 210 .

[0059] Here, if the area where the first refrigerant flow path 210 is provided is defined as the evaporation area as described above, the remaining area other than the evaporation area can be defined as the condensation area, and the second refrigerant flow path 220 may be provided in the condensation area, which is the remaining area other than the evaporation area.

[0060] When the gas-phase refrigerant in the condensation region condenses and condenses into a liquid-phase refrigerant due to heat transfer with the outside air, the volume of the second refrigerant increases at its original position in the refrigerant flow space 205 where condensation occurs. At this time, when the refrigerant flows down in the direction of gravity, the second refrigerant flow paths 220 can serve to provide a flow path that guides the liquid refrigerant to be supplied in a uniform amount to the first refrigerant flow paths 210 arranged vertically.

[0061] In particular, the second refrigerant flow path 220 can be defined as a space between a plurality of inclined guides 215, as described below. When the liquid refrigerant condensed in the condensation region flows down toward the first refrigerant flow path 210, surface tension prevents the refrigerant from dispersing and flowing on the side of the second refrigerant flow path 220 adjacent to the second refrigerant flow path 220, which is the self-flow path.

[0062] In other words, since the multiple inclined guides 215 have a space narrower than the thickness formed by the second refrigerant flow path 220, surface tension acts during the condensation process of the refrigerant, suppressing the flow toward the adjacent second refrigerant flow path 220, and uniformly guiding the flow toward the first refrigerant flow path 210 along each self-flow path.

[0063] Meanwhile, as shown in Figures 3 to 5, the heat conduction panel body 200P may include a one-side heat conduction panel 200-1 that forms one side of the refrigerant flow space and an other-side heat conduction panel 200-2 that forms the other side of the refrigerant flow space.

[0064] Here, the heat dissipation device 200 for an electronic device according to one embodiment of the present invention may further include a plurality of strength reinforcement parts 240 formed on at least one surface of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2, protruding a predetermined length toward the refrigerant flow space from the inner surfaces of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2, and formed facing each other.

[0065] The plurality of strength reinforcing portions 240 are formed on at least one of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2, which are generally flat, and serve to reinforce the strength to prevent sagging or compression due to external pressure.

[0066] Here, the plurality of strength reinforcing portions 240 may be formed so that their tip surfaces protrude into the refrigerant flow space beyond the tips of the plurality of inclined guides 215. At this time, it is preferable that the tip surfaces of the plurality of strength reinforcing portions 240 protrude into the refrigerant flow space to an extent that opposing portions of the one side heat conduction panel 200-1 and the other side heat conduction panel 200-2 are in contact with each other so that they can be joined together when they are joined together.

[0067] However, the plurality of strength reinforcing portions 240 do not necessarily have to be flush with each other within the refrigerant flow space, and may be spaced apart from each other within the refrigerant flow space, like the inclined guide 215. This is because the formation of the plurality of strength reinforcing portions 240 themselves is sufficient to reinforce the strength of the one-side thermal conduction panel 200-1 and the other-side thermal conduction panel 200-2.

[0068] In addition, the plurality of strength reinforcing portions 240 may be formed symmetrically with respect to an arbitrary reference line on the one side thermal conduction panel 200-1 and the other side thermal conduction panel 200-2, and may be formed only on the plurality of inclined guides 215.

[0069] Here, the plurality of strength reinforcing parts 240 are formed on the mutually facing surfaces of the one-side heat conduction panel 200-1 and the other-side heat conduction panel 200-2 of the heat conduction panel body 200P, and can be arranged with their tip surfaces facing each other inside the refrigerant flow space 205. Furthermore, the plurality of strength reinforcing parts 240 arranged facing each other can be joined at their facing and contacting surfaces by laser welding.

[0070] In particular, it is preferable that the plurality of strength reinforcement portions 240 are formed on the plurality of inclined guides 215 that define the second refrigerant flow path 220, which mainly serves as a flow path for the gas phase refrigerant, so as to increase the condensation surface area on which the gas phase refrigerant that has changed phase to a gas state comes into contact and condenses during flow.

[0071] Here, the liquid phase refrigerant in the first refrigerant flow path 210, which is located closest to the heating element in the refrigerant flow space 205, changes phase from liquid phase refrigerant to gas phase refrigerant when heat is supplied from the heating element and the refrigerant reaches its boiling point.

[0072] However, the refrigerant filling the refrigerant flow space 205 of the heat conduction panel body 200P must secure a gas refrigerant space (volume) for the phase change to gas refrigerant, so the refrigerant must not be completely filled with only liquid refrigerant, and only a small amount of liquid refrigerant fills the refrigerant flow space 205. In this case, when the first refrigerant flow path 210 is arranged vertically in the direction of gravity, the upper side of the first refrigerant flow path 210 is only an empty space without liquid refrigerant. In this case, the evaporation rates differ between the side of the first refrigerant flow path 210 corresponding to the empty space without liquid refrigerant and the side of the first refrigerant flow path 210 occupied by the liquid refrigerant, making it difficult to ensure uniform heat dissipation performance overall.

[0073] To solve these problems, the heat dissipation device 200 of the electronic device according to one embodiment of the present invention may further include an absorber 300 that absorbs the liquid phase refrigerant from the refrigerant induced through the second refrigerant flow path 220 and then uniformly distributes the liquid phase refrigerant on the first refrigerant flow path 210, as shown in FIGS. 3 to 5.

[0074] The absorber 300 here is a concept including a wick member having a wick structure provided inside a general vapor chamber, but is not limited to this, and can be a concept including any material or configuration that can maximize heat dissipation performance by collecting and dispersing liquid phase refrigerant all over the first refrigerant flow path 210 arranged vertically relative to the direction of gravity, thereby raising the thermal conductivity material limit of existing general heat dissipation fins.

[0075] On the other hand, it is preferable that the absorber 300 be installed on the first refrigerant flow path 210 side as close to the inside of the press-in end 201 as possible, because the closer it is to the press-in end 201, the more easily the phase change from liquid phase refrigerant to gas phase refrigerant can be actively carried out by the heat transferred from the heating element.

[0076] However, it goes without saying that the absorber 300 does not necessarily have to be provided so as to be close only to the press-fit end 201 side, but can also be provided so as to be evenly distributed over the entire evaporation area where the refrigerant can evaporate.

[0077] 6 and 7 are perspective views showing various embodiments of the absorber in the configuration of FIG.

[0078] In the heat dissipation device 100 for an electronic device according to one embodiment of the present invention, the absorber 300 is disposed in the refrigerant flow space 205 of the thermal conduction panel body 200P, and serves to absorb and retain the liquid phase refrigerant among the refrigerant, and disperse the liquid phase refrigerant in the direction of gravity or at least in the direction opposite to the direction of gravity.

[0079] More specifically, as shown in Figures 6 and 7, the absorber 300 may include an absorbent body portion 310 made of a material that has a predetermined absorption rate for liquid-phase refrigerant and that changes shape when subjected to an external force including a predetermined gravity or greater, and a skeleton holding portion 320 that is connected to the absorbent body portion 310 and prevents the absorbent body portion 310 from changing shape due to the external force.

[0080] Here, the absorbent body 310 may be made of at least one of nonwoven fabric, cotton, and sponge, which form a large number of pores (a kind of wick structure). Although the absorbent body 310 made of nonwoven fabric, cotton, and sponge can be arranged vertically in the direction of gravity due to the characteristics of the material, when liquid is contained in the large number of pores, the weight of the liquid may cause the outer shape (shape) to deform, such as sagging in the direction of gravity.

[0081] The skeleton holder 320 serves to prevent deformation, such as the sagging phenomenon, of the absorbent body 310. To this end, the skeleton holder 320 is tubular and forms a hollow space (not shown) in which the absorbent body 310 is located.

[0082] Preferably, the skeleton support part 320 is also made of a metal material having a predetermined thermal conductivity or higher, since it is a structure that must transfer heat transferred from an external heating element to the internal absorbing body part 310. For example, the metal material forming the skeleton support part 320 may be copper.

[0083] In addition, the skeleton holding portion 320 may be braided into a tubular shape as shown in FIG. 6 (see reference numeral "321"), or may be provided so as to be wound in a spiral shape as shown in FIG. 7 (see reference numeral "322").

[0084] More specifically, referring to FIG. 6, the skeleton holding portion 321 may be provided with metal (copper) wires braided into a tubular shape so that the liquid-phase refrigerant guided to the first refrigerant flow path 210 through each of the second refrigerant flow paths 220 can permeate the absorbent body portion 310 therein.

[0085] In this case, the skeleton holding portion 321 may be braided to have gaps through which at least the liquid phase refrigerant of the refrigerant is transferred by surface tension from the outside to the internal absorbent body portion 310. In this case, the gas phase refrigerant that has undergone a phase change from the liquid phase refrigerant by the absorbent body portion 310 can easily disperse to the outside through the gaps in the braid.

[0086] Also, referring to FIG. 7, the skeleton holding portion 322 may be provided by winding a metal (copper) panel (or wire) around the outside of the absorbing body portion 310 in a spiral shape.

[0087] Here, it is preferable that the metal panel (or metal wire) has enough shape retention to prevent downward sagging due to gravity even when the absorbent body portion 310 contains a sufficient amount of liquid-phase refrigerant.

[0088] On the other hand, as shown in FIG. 6, the skeleton holding portion 321 may be formed in a cylindrical shape, and the absorbing body portion 310 may be formed in a columnar shape so as to be inserted into the skeleton holding portion 321 formed in a cylindrical shape.

[0089] As described above, in the heat dissipation device 200 for an electronic device according to one embodiment of the present invention, the absorber 300 is formed by separately manufacturing and combining the absorbing body portion 310 and the skeleton holding portion 320. However, it is not necessary to additionally provide the skeleton holding portion 320. In case where the shape holding power of the absorbing body portion 310 itself does not cause deformation such as sagging even when the liquid-phase refrigerant is contained therein, it may be sufficient to provide only the absorbing body portion 310.

[0090] The absorber 300 according to the above-described embodiment includes an absorbent body portion 310 made of one of nonwoven fabric, cotton, and sponge, and a skeleton holding portion 320 made of a metal (copper) wire material braided into a tubular shape or wound in a spiral shape. This prevents the liquid refrigerant from dripping downward regardless of the amount contained in the absorbent body portion 310, thereby allowing a uniform amount of liquid refrigerant to change phase in the first refrigerant flow path 210.

[0091] Meanwhile, the heat dissipation device 200 of the electronic device according to one embodiment of the present invention may further include a plurality of absorber fixing guides (not shown) that are molded simultaneously with the above-mentioned first refrigerant flow path, second refrigerant flow path 210-220, and a plurality of inclined guides 215 or a plurality of strength reinforcement portions 240 when the heat conduction panel body 200P is molded by a press process, although not shown.

[0092] The absorber 300, which is made of nonwoven fabric, may sag in the direction of gravity when it absorbs liquid-phase refrigerant. To prevent this, the plurality of absorber fixing guides are formed to protrude toward the refrigerant flow space, and serve to press and stably fix the absorber 300 when joining the one side heat conduction panel 200-1 and the other side heat conduction panel 200-2.

[0093] In addition, the plurality of absorber fixing guides can also press the outer surface of the absorbent body part 310 or the skeleton holding part 320 made of a flexible material, thereby securing space for the flow of the evaporated gaseous refrigerant (gas-phase refrigerant) in the first refrigerant flow path 210.

[0094] In this way, since the absorber 300 is installed inside the first refrigerant flow path 210, the liquid-phase refrigerant that has liquefied from the heat dissipation plate portion 203 side moves to a location close to the heating element by the absorption force (or capillary force) of the absorber 300, and then the gas-phase refrigerant that has changed phase due to the heat transferred from the heating element moves again to the heat dissipation plate portion 203 side, thereby enabling gas-liquid circulation.

[0095] The gas phase refrigerant that moves to the heat dissipation plate portion 203 side is evenly distributed throughout and condenses while dissipating heat, and the condensed liquid phase refrigerant can easily move again along the second refrigerant flow path 220, which is relatively larger in thickness direction than the multiple inclined guides 215, toward the first refrigerant flow path 210, which is in the direction of its own weight.

[0096] The heat generated from the heating element is preferentially transferred to the first refrigerant flow path 210 side where the absorber 300 is installed, and the refrigerant stored on the first refrigerant flow path 210 side where the absorber 300 is installed is mostly in a liquid phase. After changing to a gas phase due to the heat transferred from the heating element, the refrigerant flows throughout the heat dissipation plate portion 203 of the thermal conduction panel body 200P and dissipates heat.

[0097] The heat dissipation device 200 for an electronic device according to an embodiment of the present invention has been described in detail above with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the above embodiment and that various modifications and equivalent changes may be made by those skilled in the art. Therefore, the true scope of the present invention is defined by the following claims. [Industrial Applicability]

[0098] The present invention provides a heat dissipation device for electronic devices that includes an absorbent body that can maintain its shape even when absorbing a liquid-phase refrigerant by forming a dispersion force higher than the surface tension of the liquid in the direction opposite to the direction of gravity due to the liquid absorption rate of the material itself. [Explanation of symbols]

[0099] 100: Antenna device, 110: Heat dissipation housing body 150: press-fitting portion, 200: heat dissipation device 200P: Heat conduction panel body, 200-1: One-side heat conduction panel 200-2: other side heat conduction panel, 205: refrigerant flow space 210: first refrigerant flow path, 215: multiple inclined guides 220: second refrigerant flow path, 240: multiple strength reinforcement portions 300: absorber, 310: absorber body 320, 321, 322: Skeleton support part

Claims

1. a heat conduction panel body having a refrigerant flow space formed therein where the refrigerant filled therein changes phase and circulates between gas and liquid; an absorber that is disposed in a refrigerant flow space of the heat conduction panel body and that absorbs and holds a liquid phase refrigerant among the refrigerant and disperses the liquid phase refrigerant in a direction of gravity or at least in a direction opposite to the direction of gravity, The heat dissipation device for electronic equipment, wherein the absorber maintains an absorption rate for the liquid-phase refrigerant by its own material while being prevented from deforming in the direction of gravity.

2. The absorbent body is an absorbent body portion having an absorption rate for the liquid-phase refrigerant and deforming in shape by an external force including a predetermined gravity or greater; The heat dissipation device for electronic equipment according to claim 1 , further comprising: a skeleton holding portion coupled to the absorbing body portion to prevent the absorbing body portion from being deformed by the external force.

3. The heat dissipation device for electronic equipment according to claim 2 , wherein the absorbent body portion is made of at least one of nonwoven fabric, cotton, and sponge.

4. 3. The heat dissipation device for electronic equipment according to claim 2, wherein the skeleton holding portion is made of a metal material and has a tubular shape forming a hollow space inside which the absorbing body portion is located.

5. The heat dissipation device for electronic equipment according to claim 4 , wherein the skeleton holding portion is formed by braiding a metal wire into the tubular shape.

6. 6. The heat dissipation device for electronic equipment according to claim 5, wherein the skeleton holding portion is braided to have gaps through which at least the liquid phase refrigerant of the refrigerant is transferred from the outside to the absorbent body portion inside by surface tension.

7. 5. The heat dissipation device for electronic equipment according to claim 4, wherein the metal material of the skeleton support portion is a material having a predetermined thermal conductivity or higher.

8. The heat dissipation device for electronic equipment according to claim 7 , wherein the metal material of the skeleton support portion includes copper.

9. The skeleton holding portion is formed in a cylindrical shape, The heat dissipation device for electronic equipment according to claim 2 , wherein the absorbing body portion is formed in a cylindrical shape so as to be inserted into the skeleton holding portion which is formed in a cylindrical shape.

10. the heat-conducting panel body is made of a metal panel member having a predetermined thermal conductivity or higher; a heat conduction panel that forms one side of the refrigerant flow space; an other heat conduction panel forming another side of the refrigerant flow space, The heat dissipation device of claim 1 , wherein the absorber is disposed adjacent to one end of a refrigerant flow space between the one heat conduction panel and the other heat conduction panel, the one end being adjacent to an external heat generating element.

11. The refrigerant flow space is a first refrigerant flow path forming the one end portion in which the absorber is provided; a second refrigerant flow path defined by an inclined guide formed in the one-side heat conduction panel and the other-side heat conduction panel such that a thickness of the refrigerant flow space is reduced, the second refrigerant flow path being inclined in a gravity direction relative to the first refrigerant flow path, The heat dissipation device for an electronic device according to claim 10 , wherein the absorber is provided in the first refrigerant flow path.

12. 12. The heat dissipation device of claim 11, wherein the first refrigerant flow path in which the absorber is provided is configured so that at least one end and the other end of the absorber are spaced apart by a predetermined distance in a gravity direction when the first refrigerant flow path in which the absorber is provided is configured to transfer heat from the heat generating element.

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