Power module including power chip, substrate and cooling block

Abstract

The present invention relates to a power module (10) comprising: a substrate (30) having at least one power chip (20), at least one electrical connection layer (32) connected to the power chip, and at least one electrical insulation layer (34) disposed relative to the electrical connection layer; a cooling block (40) having a vapor chamber boundary wall (42), a first portion (442) of the vapor chamber (44), an opening (46) penetrating the electrical insulation layer (34) and extending from the first portion to an evaporator surface (322V) on the inner surface of the electrical connection layer to form a second portion (444) of the vapor chamber; an electrically insulating support (48) separating the vapor chamber boundary wall (42) from the electrical insulation layer (34); a liquid-cooled block (50) having a cooling body (52) and a cooling channel (54); and an insulating electrical fluid in the vapor chamber.

Description

[Technical Field]

[0001] The present invention relates to the field of cooling blocks for dissipating heat from heat sources such as power chips.

[0002] The invention particularly relates to a power module comprising a power chip, a substrate and a cooling block provided with a vapor chamber. [Background technology]

[0003] Power modules are generally well known in the art. According to the example shown in FIG. 1, a power module 1 includes: Power Chip 20 and A substrate 3, At least one electrical connection layer 32 having an outer surface 324 connected to the power chip 20 for supplying electrical power to the power chip 20 and an inner surface 322 facing away from the power chip 20; and a substrate 3 comprising an electrical insulating layer 33 in contact with an inner surface 322 of the electrical connection layer 32, the electrical insulating layer 33 having a contact surface 334 covering the entire inner surface 322 and a chamber surface 332 facing away from the electrical connection layer 32; A cooling block 4, a liquid-cooled block 50 including a vapor chamber housing 43 enclosing a vapor chamber 430, a cooling body 52, and a cooling channel 54 through which a coolant flows; a cooling block 4 with a working fluid in a vapor chamber housing 43, in liquid or gaseous state; Equipped with.

[0004] According to the embodiment shown in FIG. 1, the power chip 20 is located below the substrate 3 located below the cooling block 4 of the power module 1 in the vertical direction V of the VLT standard.

[0005] The power chip 20 corresponds to an electrical component that forms the heat source of the power module 1, such as a power electronic switch or a processor or a DEL.

[0006] The substrate 3 corresponds to a direct bond copper (DBC) substrate, which provides interconnections to form electrical circuits. In particular, the electrical connection layer 32 of the substrate 3 comprises traces (not shown in FIG. 1 ) held in appropriate positions on the electrical insulation layer 33 of the substrate 3, so as to be connected to different connectors of the power chip 20. Typically, the electrical connection layer 32 of the substrate 3 is made of a thermally conductive material, such as copper, and the electrical insulation layer 33 of the substrate 3 is made of a non-conductive material, such as ceramic.

[0007] The cooling block 4 is designed to cool the electronic components, namely the power chips 20 of the power module 1 .

[0008] 1 , the cooling body 52 of the liquid cooling block 50 of the cooling block 4 comprises multiple portions (only two of which are shown in FIG. 1 ) including a first portion 52A having a contact surface 524A facing the vapor chamber 430 and an inner surface 522A that defines the cooling flow passages 54 of the liquid cooling block 50, and a second portion 52B facing the inner surface 522A of the first portion 52A of the cooling body 52 and having a first inner surface 522B that defines the cooling flow passages 54. The second portion 52B also comprises a second surface 524B facing the opposite side of the first inner surface 522B, which may be the outer surface facing the air or the inner surface of another cooling flow passage.

[0009] The vapor chamber 430 is a vacuum-sealed portion enclosed by the vapor chamber housing 43 of the cooling block 4, which contains the working fluid. The vapor chamber 430 is defined in the vertical direction V between the chamber surface 332 of the electrical insulation layer 33 and the contact surface 524A of the first portion 52A of the cooling body 52 of the liquid cooling block 50. Generally, the vapor chamber housing 43 of the cooling block 4 is made of a thermally conductive material, preferably metal. Preferably, the working fluid is a coolant, such as untreated water, which is electrically conductive. Therefore, the electrical insulation layer 33 electrically insulates the electrical connection layer 32 of the cooling block 4.

[0010] The process of cooling the power chip 20 of the power module 1 is as follows: diffusing heat from the power chip 20 to the substrate 3 of the power module 1 and to the vapor chamber housing 43; increasing the temperature of the working fluid contained in the vapor chamber 430 in a liquid state; diffusing heat from the vapor chamber housing 43 to the liquid cooling block 50 to convert the working fluid into a gaseous state; cooling the working fluid in the vapor chamber housing 43, which is in a gaseous state, to a liquid state by heat exchange between the cooling block 50 cooled by the flow of coolant and the vapor chamber housing 43; dispersing the working fluid in a liquid state by gravity onto a portion of the vapor chamber housing 43 in contact with the chamber surface 332 of the electrically insulating layer 33 of the substrate 3 facing away from the power chip 20, thereby cooling the power chip 20; Includes.

[0011] All these steps are performed in a loop and even simultaneously.

[0012] However, the thermal conductivity of the electrical insulating layer 33 of the substrate 3 of the power module 1 is relatively low, which affects the heat transfer from the power chip 20 to the cooling block 4, and therefore the cooling of the power chip 20 is not optimal. As a result, the power chip must have a higher temperature limit, which increases the price of the power chip. Summary of the Invention [Means for solving the problem]

[0013] The present invention proposes a solution to the above-mentioned problems by providing a power module comprising a power chip, a substrate and a cooling block with a particular structure.

[0014] The present invention provides at least one power chip; A substrate, At least one electrical connection layer connected to the power chip for supplying power to the power chip, the electrical connection layer having an inner surface facing away from the power chip; a substrate including an electrically insulating layer disposed against an inner surface of the electrical connection layer and including a chamber surface facing away from the electrical connection layer; A cooling block comprising: a vapor chamber boundary wall having a condensation surface; a vapor chamber first portion defined in a first direction between a condensation surface of the vapor chamber boundary wall and a chamber surface of the electrically insulating layer; an opening forming a second portion of the vapor chamber through the electrical insulating layer and extending from the first portion to an evaporator surface of the inner surface of the electrical connection layer facing away from the power chip; an electrically insulating support separating the vapor chamber boundary wall from the electrically insulating layer, the electrically insulating support having an inner surface extending through the electrically insulating support and defining, in a second direction, a first portion of the vapor chamber; a liquid-cooled block including a cooling body and a cooling flow path through which a cooling liquid flows; an insulating electrical fluid in a vapor chamber; a cooling block comprising: The present invention relates to a power module comprising:

[0015] The power module according to the invention improves the thermal conductivity of the substrate, particularly in the region of the electrical connection layer facing the power chip, due to the presence of openings formed in the electrical insulating layer facing the power chip, so that the heater part of the substrate (region of the electrical connection layer) is in direct contact with the vapor chamber. The use of an insulating electrical fluid makes it possible to insulate the electrical connection layer from the vapor chamber boundary wall.

[0016] Preferably, the electrically insulating layer of the substrate has an inner surface that defines a vapor chamber, extending from the inner surface of the electrical connection layer to the inner surface of the electrically insulating support of cooling block 40. The electrical insulator has a contact surface of the electrically insulating layer that contacts the inner surface of the electrical connection layer.

[0017] In one example, the inner surface extends from the contact surface of the electrically insulating layer to the inner surface of the electrically insulating support.

[0018] Advantageously, the vapor chamber boundary wall of the cooling block is made of copper, as are the electrical connection layers of the substrate, this feature preventing electrolysis in the vapor chamber between the electrical insulating layer and the vapor chamber boundary wall.

[0019] According to one example of the first embodiment, the cooling block includes an additional insulating plate located on the condensation surface of the vapor chamber boundary wall facing the opening of the cooling block, which prevents the formation of an electrical arc between the electrical connection layer of the substrate and the vapor chamber boundary wall of the cooling block.

[0020] Preferably, according to the above example, the additional insulating plate of the vapor chamber boundary wall of the cooling block completely covers the condensation surface of the vapor chamber boundary wall and has a thickness smaller than the thickness of the vapor chamber boundary wall.

[0021] Advantageously, the insulating electrical fluid is pure water, i.e., a non-conductive fluid, such as treated water free of impurities. The use of pure water in the vapor chamber makes it possible to maintain adequate electrical insulation within the power module.

[0022] The cooling body of the liquid cooling block is preferably made of aluminum, which is a highly efficient heat conductor.

[0023] Advantageously, the cooling body of the liquid cooling block includes fins extending outward to be cooled by the air surrounding the liquid cooling block. The presence of the fins cools the cooling body, which in turn cools the flow of cooling liquid and the insulating electrical fluid within the vapor chamber boundary wall and the cooling channels. In particular, the fins can be hollow and form part of the cooling channels of the liquid cooling block.

[0024] According to a second embodiment, the vapor chamber boundary wall and the electrically insulating support of the cooling block form a single part, a feature that reduces the total number of parts in the power module.

[0025] According to a third embodiment, the power module includes a wicking material disposed in the vapor chamber of the cooling block, which allows the insulating electrical fluid in a liquid state to be dispersed by capillary action onto the evaporator surface of the electrical connection layer of the substrate, thereby cooling the power chips of the power module.

[0026] According to a first example of the third embodiment, the wick material fills first and second portions of the vapor chamber of the cooling block.

[0027] According to a second example of the third embodiment, the wick material covers all surfaces within the vapor chamber of the cooling block.

[0028] The invention will be further elucidated in the description given by the accompanying drawings. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a cross-sectional view of a power module comprising a power chip, a substrate and a cooling block according to the prior art, as already described; [Figure 2] 1 is a cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a first example of a first embodiment of the present invention. [Figure 3] 3 is a cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a second example of the first embodiment of the present invention. FIG. [Figure 4] FIG. 2 is a perspective cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a third example of the first embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a fourth example of the first embodiment of the present invention. [Figure 6] FIG. 4 is a cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a second embodiment of the present invention. [Figure 7] FIG. 10 is a cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a first example of a third embodiment of the present invention. [Figure 8] FIG. 10 is a cross-sectional view of a power module including a power chip, a substrate, and a cooling block according to a second example of the third embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0030] An example of a power module according to the present invention will now be described in detail with reference to the accompanying drawings, which illustrate the features and advantages of the present invention.

[0031] Unless otherwise specified, identical elements appearing in different figures have unique reference numbers.

[0032] For the purposes of understanding the present invention, the vertical, longitudinal and lateral orientations are adopted according to the VLT standard shown in the figures, with the longitudinal L axis and the lateral T axis extending in a horizontal plane.

[0033] 2 to 8 show the power module 10, where FIGS. 2 to 5 correspond to different examples of the first embodiment, FIG. 6 corresponds to the second embodiment, and FIGS. 7 and 8 correspond to two examples of the third embodiment.

[0034] The power module 10 according to the first, second and third embodiments includes at least one power chip 20; A substrate 30, At least one electrical connection layer 32 having an outer surface 324 connected to the power chip 20 for supplying electrical power to the power chip 20 and an inner surface 322 facing away from the power chip 20; and The substrate 30 includes an electrically insulating layer 34 with a contact surface 344 positioned against the inner surface 322 of the electrical connection layer 32 and a chamber surface 342 facing away from the electrical connection layer 32 .

[0035] The power module 10 according to the first, second and third embodiments also includes a cooling block 40 having a vapor chamber boundary wall 42 having a condensation surface 424 and a contact surface 422, and a vapor chamber 44 defined by the vapor chamber boundary wall 42.

[0036] The vapor chamber 44 is a first portion 442 defined in a vertical direction V between the chamber surface 342 of the electrically insulating layer 34 and the condensation surface 424 of the vapor chamber boundary wall 42; an opening 46 that forms a second portion 444 of the vapor chamber 44, the opening 46 extending through the electrical insulating layer 34 from the first portion 442 to the evaporator surface 322V of the inner surface 322 of the electrical connection layer 32 facing away from the power chip 20; Equipped with.

[0037] Furthermore, the cooling block 40 of each power module 10 according to the first, second and third embodiments has an electrically insulating support 48 separating the vapor chamber boundary wall 42 from the electrically insulating layer 34; Equipped with. The electrically insulating support 48 has an inner surface 480 that extends through the electrically insulating support 48 and defines, in the longitudinal direction L, a first portion 442 of the vapor chamber 44 .

[0038] Furthermore, the cooling block 40 of each power module 10 according to the first, second and third embodiments has a liquid-cooled block 50 having a cooling body 52 and a cooling channel 54 through which a cooling liquid flows; an insulating electrical fluid in a vapor chamber 44, which may be in a liquid or gaseous state; Equipped with.

[0039] Each power chip 20 corresponds to an electrical component that forms the heat source of the power module 10, such as a power electronic switch or a processor or DEL.

[0040] Contact between the power chip 20 and the outer surface 324 of the electrical connection layer 32 of the substrate 30 defines a contact surface on the outer surface 324 of the electrical connection layer 32, a thermal contact area of ​​the electrical connection layer 32. By vertically projecting this contact surface, the thermal contact area of ​​the electrical connection layer 32 extends from this contact surface of the outer surface 324 to at least a portion of the evaporator surface 322V. This thermal contact area extends in the longitudinal direction L along a length L10 shown in Figures 2 and 3 (however, the thermal contact area is also defined by a length in the transverse direction T, not shown).

[0041] The substrate 30 corresponds to a direct bond copper (DBC) substrate that provides interconnections to form electrical circuits. In particular, the electrical connection layer 32 of the substrate 30 includes traces 326 (shown in FIG. 4) that are held in place on the electrical insulation layer 34 of the substrate 30 for connection to different connectors of the power chip 20.

[0042] The electrical insulation layer 34 of the substrate 30 includes an inner surface 346 that extends from a contact surface 344 of the electrical insulation layer 34 that contacts the inner surface 322 of the electrical connection layer 32 to the chamber surface 342 of the electrical insulation layer 34. The inner surface 346 defines an opening 46 that forms a second portion 444 of the vapor chamber 44.

[0043] The chamber surface 342 of the electrical insulation layer 34 faces the condensation surface 424 of the vapor chamber boundary wall 42 of the cooling block 40 .

[0044] The first portion 444 extends from the second portion 442 of the vapor chamber 44 and comprises a portion vertically defined between the chamber surface 342 of the electrically insulating layer 34 and the condensation surface 424 of the vapor chamber bounding wall 42 .

[0045] Preferably, the electrical connection layer 32 of the substrate 30 is made of a thermally conductive material such as copper, and the electrical insulation layer 34 of the substrate 30 is made of a non-conductive material such as ceramic.

[0046] The cooling block 40 is designed to cool the electronic components, namely the power chips 20 of the power module 10 .

[0047] According to the example shown in Figures 2 to 8, the cooling body 52 of the liquid cooling block 50 of the cooling block 4 has multiple parts (only two are shown in Figure 2) including a first part 52A and a second part 52B that form a cooling flow path 54 therebetween.

[0048] The first portion 52A includes a contact surface 524A that contacts the vapor chamber boundary wall 42 and an inner surface 522A that defines the cooling flow passages 54 of the liquid cooling block 50.

[0049] The second portion 52B has a first inner surface 522B facing the inner surface 522A which together define the cooling flow path 54 of the liquid cooling block 50, and a second inner surface 524B facing the opposite side of the inner surface 522B of the second portion 52B of the cooling body 52.

[0050] The first portion 52A and the vapor chamber boundary wall 42 separate the cooling passage 54 from the vapor chamber 44.

[0051] The vapor chamber 44 is a vacuum-sealed portion that contains an insulating electrical fluid. The first portion 442 of the vapor chamber 44 extends in the longitudinal direction L along a length L1 between two inner surfaces 480 of the electrically insulating support 48.

[0052] The inner surface 480 of the electrically insulating support 48 may have a circular cross section, for example cylindrical or conical, or the inner surface 480 may have a polygonal, for example rectangular, cross section, and be polyhedral.

[0053] The opening 46 forming the second portion 444 of the vapor chamber 44 is defined in the longitudinal direction L between the two faces of the inner surface 346 of the electrically insulating layer 34 of the substrate 30 along a length L2.

[0054] Furthermore, the length L2 of the opening 46 is equal to or greater than the length L10 of the contact surface between the power chip 20 and the outer surface 324 of the electronic connection layer 32 of the substrate 30.

[0055] Thus, the thermal contact area comprises at least a portion of the evaporator surface 322V of the inner surface 322 of the electrical connection layer 32, which corresponds to the heater portion of the substrate 30 and is in direct contact with the first portion 442 of the vapor chamber 44. The length L1 of the first portion 442 of the vapor chamber 44 is greater than the length L2 of the second portion 442 of the vapor chamber 44 to provide a larger vapor chamber 44.

[0056] The opening 46 may have a circular cross section, for example cylindrical or conical, or the opening 46 may have a polygonal, for example rectangular, cross section, and be polyhedral.

[0057] The inner surface 480 of the electrically insulating support 48 of the cooling block 40 extends from the chamber surface 342 of the electrically insulating layer 34 to the condensation surface 424 of the vapor chamber bounding wall 42 .

[0058] Advantageously, the vapor chamber boundary wall 42 of the cooling block 40 is made of a thermally conductive material such as copper, and the electrically insulating support 48 is made of a non-conductive material such as plastic. Preferably, the insulating electrical fluid is a cooling liquid, such as pure treated water, i.e., non-conductive water.

[0059] 1 to 6, each power chip 20 is located below the substrate 30, which is located below the cooling block 40 of the power module 10, in the vertical direction V. Therefore, the insulating electrical fluid in a liquid state is dispersed by gravity onto the evaporator surface 322V of the electrical connection layer 32 to cool the power chip 20 of the power module 10.

[0060] 2 shows a power module 10 according to a first example of the first embodiment, which includes only one power chip 20. The length L10 of the contact surface between the power chip 20 and the outer surface 324 of the electrical connection layer 32 of the substrate 30 corresponds to the length of the single power chip 20 of the power module 10. Furthermore, the evaporator surface 322V of the inner surface 322 of the electrical connection layer 32 of the substrate 30 faces the single power chip 20. In particular, the evaporator surface 322V corresponds to the surface (of the inner surface 322) of the thermal contact area of ​​the electrical connection layer 32. Therefore, the length L2 is equal to the length L10.

[0061] 3 shows a power module 10 according to a second example of the first embodiment. This example differs from the first example of the first embodiment in that it includes three power chips 20 and an additional insulating plate 45.

[0062] In this example, the three power chips 20 are longitudinally arranged on the outer surface 324 of the electrical connection layer 32 of the substrate such that the central power chip 20 is located between two lateral power chips 20 separated from each other by a gap. Thus, the length L10 of the contact surface between the power chips 20 and the outer surface 324 of the electrical connection layer 32 of the substrate 30 corresponds to the sum of the lengths of the three power chips 20 and the length of the gap between them. Furthermore, the evaporator surface 322V of the inner surface 322 of the electrical connection layer 32 of the substrate 30 faces the three power chips 20. In particular, the evaporator surface 322V is larger than, but includes, the surface (of the inner surface 322) of the thermal contact region of the electronic connection layer 32. Thus, the length L2 is longer than the length L10.

[0063] The additional insulating plate 45 is disposed on the condensation surface 424 of the vapor chamber boundary wall 42, facing the opening 46 of the cooling block 40. If the vapor chamber boundary wall 42 is in direct contact with the cooling body 52 of the liquid cooling block 50, the use of the additional insulating plate 45 prevents the formation of an electrical arc between the electrical connection layer 32 of the substrate 30 and the vapor chamber boundary wall 42 of the cooling block 40. Preferably, the additional insulating plate 45 has a thickness smaller than that of the vapor chamber boundary wall 42 and should be as thin as possible. Furthermore, the additional insulating plate 45 is made of a non-conductive material, such as ceramic.

[0064] 4 shows a power module 10 according to a third example of the first embodiment. This example differs from the second example of the first embodiment in that the additional insulating plate 45 of the vapor chamber boundary wall 42 of the cooling block 40 completely covers the condensation surface 424 of the vapor chamber boundary wall 42. This figure also shows the traces 326 of the electrical connection layer 32 of the substrate 30.

[0065] 5 shows a power module 10 according to a fourth example of the first embodiment. This example differs from the first example of the first embodiment in that the electrical insulating support 48 of the cooling block 40 has a unique structure that surrounds the electrical connection layer 32 and the electrical insulating layer 34 of the substrate 30 and the cooling body 52 of the liquid cooling block 50. The electrical insulating support 48 has notches 482, 484, and 486 for assembling the substrate 30 and the cooling block 50 to the electrical insulating support 48. In particular, the electrical insulating support 48 has a first notch 482 designed to receive the electrical connection layer 32 of the substrate 30, a second notch 484 designed to receive the electrical insulating layer 34 of the substrate 30, and a third notch 486 designed to receive the first portion 522A of the cooling body 52 of the liquid cooling block 52. In this example, the inner surface 480 of the electrically insulating support 48 extends from a second notch 484 that contacts the chamber surface 342 of the electrically insulating layer 34 to a third notch 486 that contacts the condensation surface 424 of the vapor chamber boundary wall 42 .

[0066] Furthermore, this fourth example differs from the first example of the first embodiment in that the first portion 52A of the cooling body 52 of the liquid cooling block 50 has a unique structure that surrounds the vapor chamber boundary wall 42 of the cooling block 40. The first portion 52A of the cooling body 52 of the liquid cooling block 50 includes a notch 526 for assembling the vapor chamber boundary wall 42 of the cooling block 40 to the first portion 52A of the cooling body 52. ​​In particular, the notch 526 of the first portion 52A of the cooling body 52 is designed to receive the vapor chamber boundary wall 42 along its entire length in the longitudinal direction L.

[0067] 6 shows a power module 10 according to a second embodiment. This embodiment differs from the first embodiment in that the vapor chamber boundary wall 42 and the electrically insulating support 48 of the cooling block 4 form a monoblock assembly 428 in the same part, which monoblock assembly 428 surrounds the entire substrate 30. Advantageously, the monoblock assembly 428 is made of a non-conductive material, such as plastic.

[0068] 7 and 8 show a power module 10 according to a third embodiment. This embodiment differs from the second embodiment in that the power chips 20 are located above the substrate 30, which is located above the cooling block 40 of the power module 10, in the vertical direction V. The power module 10 therefore comprises a wick material 49 disposed in the vapor chamber 44 of the cooling block 40. The wick material 49 is designed to absorb the insulating electrical fluid in a liquid state and distribute the insulating electrical fluid by capillary action to the evaporator surface 322V of the electrical connection layer 32, thereby cooling the power chips 20 of the power module 10.

[0069] FIG. 7 shows a first example of the third embodiment in which wick material 49 fills a first portion 442 and a second portion 444 of vapor chamber 44 of cooling block 40 .

[0070] 8 shows a second example of the third embodiment in which the wick material 49 coats all surfaces within the vapor chamber 44 of the cooling block 40. In particular, the wick material 49 is a coating that covers the evaporator surface 322V of the inner surface 322 of the electrical connection layer 32, the chamber surface 342 and the inner surface 346 of the electrical insulation layer 34 of the substrate 30, the condensation surface 424 of the vapor boundary wall 42, and the inner surface 480 of the electrical insulation support 48 of the cooling block 40.

[0071] The wick material 49 used in the third embodiment can be made of sintered copper, fibrous materials, sintered plastic powder, and microfiber-type materials. Furthermore, because copper is a thermally conductive material, copper cannot be used for the wick material 49 when the vapor chamber 44 of the cooling block 40 must be electrically insulated.

[0072] According to another embodiment, not shown, the cooling body 52 of the liquid cooling block 50 includes fins that extend into the cooling channels 54 of the liquid cooling block 50 to cool the insulating electrical fluid in the cooling channels 54.

[0073] The process of cooling the power chips 20 of the power module 10 according to the present invention comprises the following steps: spreading heat from each power chip 20 of the power module 10 into the thermal contact area of ​​the substrate 30, particularly the electrical connection layer 32; increasing the temperature of the insulating electrical fluid contained within the vapor chamber 44 in a liquid state in the second portion 444 of the vapor chamber 44 until a portion of the insulating electrical fluid in the liquid state transitions to a gaseous state; cooling the insulating electrical fluid in the gaseous state in the first portion 442 of the vapor chamber 44 by the liquid cooling block 50 until a portion of the insulating electrical fluid in the gaseous state transitions to a liquid state; dispersing the insulating electrical fluid in a liquid state onto the evaporator surface 322V of the electrical connection layer 32 by gravity (when the power chips 20 are located below) or by capillary action (when the power chips 20 are located above and the wick material 49 is disposed within the vapor chamber 44), thereby cooling the power chips 20 of the power module 10; Includes.

[0074] All these steps are performed in a loop and even simultaneously.

[0075] Such a power module 10 according to the present invention improves the heat transfer from the power chips 20 to the cooling block 40, optimizing the cooling of the power chips 20. Furthermore, such a structure of the power module 10 improves the ratio of the heat transfer to the effective thermal conductivity of the power module 10 due to the presence of the openings 46 formed in the electrical insulating layer 34 facing the power chips 20 and the use of a non-conductive fluid such as pure water.

Claims

1. at least one power chip (20); A substrate (30), At least one electrical connection layer (32) connected to the power chip (20) for supplying power to the power chip (20), the electrical connection layer having an inner surface (322) facing away from the power chip (20); and a substrate (30) including an electrical insulating layer (34) disposed against the inner surface (322) of the electrical connection layer (32) and including a chamber surface (342) facing away from the electrical connection layer (32); A power module (10) comprising: The power module (10) comprises a cooling block (40); The cooling block (40) a vapor chamber boundary wall (42) having a condensation surface (424); a vapor chamber (44) having a first portion (442) defined in a first direction between the condensation surface (424) of the vapor chamber boundary wall (42) and the chamber surface (342) of the electrical insulation layer (34); an opening (46) that penetrates the electrical insulating layer (34) and forms a second portion (444) of the vapor chamber (44), the opening extending from the first portion (442) to an evaporator surface (322V) of the inner surface (322) of the electrical connection layer (32) facing away from the power chip (20); an electrically insulating support (48) separating the vapor chamber boundary wall (42) from the electrically insulating layer (34), the electrically insulating support (48) having an inner surface (480) that penetrates the electrically insulating support (48) and defines, in a second direction, the first portion (442) of the vapor chamber (44); a liquid-cooled block (50) having a cooling body (52) and a cooling channel (54) through which a cooling liquid flows; an insulating electrical fluid in the vapor chamber (44); A power module (10) comprising:

2. 2. The power module (10) according to claim 1, characterized in that the vapor chamber boundary wall (42) of the cooling block (40) is made of copper, as is the electrical connection layer (32) of the substrate (30).

3. 3. The power module (10) according to claim 1 or 2, characterized in that the cooling block (40) comprises an additional insulating plate (45) arranged on a condensation surface (424) of the vapor chamber boundary wall (42) facing the opening (46) of the cooling block (40).

4. 4. The power module (10) according to claim 3, characterized in that the additional insulating plate (45) of the vapor chamber boundary wall (42) of the cooling block (40) completely covers the condensation surface (424) of the vapor chamber boundary wall (42) and has a thickness smaller than the thickness of the vapor chamber boundary wall (42).

5. A power module (10) according to any one of claims 1 to 4, characterized in that the insulating electrical fluid is pure water.

6. The power module (10) according to any one of claims 1 to 5, characterized in that the cooling body (52) of the liquid cooling block (50) is made of aluminum.

7. The power module (10) according to any one of claims 1 to 6, characterized in that the cooling body (52) of the liquid-cooled block (50) has fins extending outward so as to be cooled by air surrounding the liquid-cooled block (50).

8. The power module (10) according to any one of claims 1 to 7, characterized in that the power module (10) comprises a wick material (49) disposed in the vapor chamber (44) of the cooling block (40).

9. 9. The power module (10) of claim 8, wherein a wick material (49) fills the first portion (442) and the second portion (444) of the vapor chamber (44) of the cooling block (40).

10. 9. The power module (10) of claim 8, wherein the wick material (49) covers all surfaces (322V, 342, 346, 424, 480) within the vapor chamber (44) of the cooling block (40).

Images