Thermal processing apparatus and thermal processing method

Abstract

To provide a thermal processing device and a thermal processing method capable of simplifying wiping work even when a liquid is used during thermal processing.SOLUTION: The container 1 can store the liquid LI. The support body 2c is provided in the vessel 1 and has a mounting part 2d for supporting the lower surface of the workpiece WO. The nozzle pipe 11 has a plurality of air blowing ports 11a for blowing out air. The controller 50 controls to blow air between the liquid LI and the lower surface of the workpiece WO from the plurality of air blowing ports 2c in a state where the liquid level of the liquid LI in the vessel 1 is adjusted to be above the lower end position LL of the support body 11a.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to thermal processing apparatus and methods. [Background technology]

[0002] When using liquids such as water during processing in thermal processing equipment (plasma, laser), the workpiece may become wet with the liquid. If the processed material is to be shipped as a product, it will look bad if it remains wet with the liquid. Furthermore, when the liquid dries, the dirt contained in the liquid will remain on the processed material as stains, making the dirt more noticeable. Furthermore, even if a rust inhibitor is added to the liquid, the material is more likely to rust if it becomes wet with the liquid. For this reason, if the processed material becomes wet with the liquid, it will be necessary to wipe off the liquid that has adhered to the surface of the processed material with a mop or rag when sorting the processed material after processing.

[0003] A technique for simplifying the process of wiping off liquid with a mop or rag when the workpiece becomes wet with liquid as described above is disclosed, for example, in Japanese Patent Laid-Open Publication No. 2023-40727 (Patent Document 1). In Patent Document 1, an air blow nozzle is attached to a processing head equipped with a plasma torch or laser head, and the air blow nozzle scans the entire surface of the steel plate (workpiece) while folding back and forth. This blows away the liquid (water) on the surface of the steel plate, accelerating the drying of the surface of the steel plate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-40727 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the method described in Patent Document 1 can blow away water wetness on the surface of the workpiece facing the processing head, but the wetness remains on the backside of the workpiece, and the process of wiping the backside of the workpiece cannot be simplified. A typical workpiece is 2 m x 6 m in size, and dozens to hundreds of components are cut out from it by laser cutting. After cutting, wiping off the water wetness on the backside of the cut components requires removing each component one by one, which is very time-consuming.

[0006] An object of the present disclosure is to provide a thermal processing apparatus and a thermal processing method that can simplify the wiping work even when a liquid is used during thermal processing. [Means for solving the problem]

[0007] One thermal processing apparatus disclosed herein is a thermal processing apparatus that thermally processes a workpiece using laser light or plasma, and includes a container, a support member, a blower, and a controller. The container is capable of storing a liquid. The support member is provided on the container and has a mounting portion that supports the lower surface of the workpiece. The blower has at least one blower port for blowing air. The controller controls the blower port to blow air between the liquid and the lower surface of the workpiece, while adjusting the liquid level in the container to be above the lower end of the support member.

[0008] Another thermal processing apparatus disclosed herein is a thermal processing apparatus for thermally processing a workpiece using laser light or plasma, and includes a container, a support member, a blower, and a controller. The container is capable of storing a liquid. The support member has a mounting portion provided on the container and supporting the underside of the workpiece. The blower has at least one blower port for blowing air. The container has a first side wall and a second side wall facing each other in a top view. The support member has a plurality of supports, each having a mounting portion. Each of the plurality of supports extends parallel to one another from the first side wall toward the second side wall. The controller controls the at least one blower port to blow air between the liquid and the underside of the workpiece while adjusting the liquid level in the container to be above the lower end of the support member, thereby blowing air blown from the at least one blower port between the liquid and the underside of the workpiece through gaps between the plurality of supports.

[0009] The thermal processing method of the present disclosure comprises the following steps.

[0010] The workpiece is placed on a mounting portion of a support member provided in the container. With liquid stored in the container, the workpiece is thermally processed using laser light or plasma. After thermal processing, the liquid level is adjusted so that it is above the bottom end of the support member. With the liquid level adjusted to be above the bottom end of the support member, air is blown between the liquid and the bottom surface of the workpiece. [Effects of the Invention]

[0011] According to the present disclosure, it is possible to realize a thermal processing device and a thermal processing method that can simplify the wiping work even when a liquid is used during thermal processing. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a configuration of a laser processing apparatus according to an embodiment; [Figure 2] FIG. 2 is an enlarged view of a region R in FIG. [Figure 3] FIG. 2 is a cross-sectional view showing the configuration of the laser processing apparatus of FIG. [Figure 4] FIG. 1 is a flow chart showing a laser processing method according to an embodiment. [Figure 5] 5A is a diagram showing the air flow when the water level is above the lower end of the support member, and FIG. 5B is a cross-sectional view taken along line VB-VB in FIG. 5A. [Figure 6] FIG. 10 is a diagram showing the relationship between the liquid level and the wind speed in the container of the laser processing device. [Figure 7] 7A is a diagram showing the air flow when the water level is below the lower end of the support member, and FIG. 7B is a cross-sectional view taken along line VIIB-VIIB in FIG. 7A. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0014] In the specification and drawings, the same or corresponding components are denoted by the same reference numerals, and redundant descriptions will not be repeated. Furthermore, in the drawings, configurations may be omitted or simplified for the sake of convenience. Note that, although a laser processing device using a laser beam will be described below as an example of a thermal processing device, the thermal processing device of the present disclosure may also be a plasma processing device using plasma.

[0015] <Configuration of laser processing equipment>

[0016] The configuration of the laser processing device in this embodiment will be described with reference to FIGS.

[0017] Fig. 1 is a perspective view showing the configuration of a laser processing apparatus in one embodiment, Fig. 2 is an enlarged view of a region R in Fig. 1, and Fig. 3 is a cross-sectional view showing the configuration of the laser processing apparatus in Fig. 1.

[0018] As shown in Figures 1 to 3, the laser processing apparatus 20 of this embodiment mainly has a container 1, a crosspiece unit 2, a scrap tray 3, a liquid level adjustment tank 4, a laser head 10, a drive mechanism 25, and an operation panel 30.

[0019] As shown in FIG. 1, the container 1 has a rectangular bottom wall and four side walls 1sa, 1sb, 1sc, and 1sd rising from each of the four sides of the bottom wall. The container 1 has a cylindrical shape with a bottom that opens upward. The container 1 has an opening at the top end and an internal space extending from the opening into the container 1. The side walls 1sa and 1sb face each other in a top view. The side walls 1sc and 1sd face each other in a top view. In a top view, the side wall 1sa of the container 1 corresponds to the first side of the rectangle, and the side wall 1sb corresponds to the second side opposite the first side. In addition, in a top view, the side wall 1sc of the container 1 corresponds to the third side of the rectangle, and the side wall 1sd corresponds to the fourth side opposite the third side. The side wall 1sa corresponds to the first side wall of the present disclosure, and the side wall 1sb corresponds to the second side wall of the present disclosure.

[0020] 3, the container 1 is configured to store the liquid LI therein. Each of the side walls 1sa, 1sb is provided with a rail unit support portion 1c. The rail unit support portion 1c protrudes laterally from the wall surface of the side walls 1sa, 1sb toward the interior space of the container 1.

[0021] The level adjustment tank 4 is disposed within the internal space of the vessel 1. The level adjustment tank 4 has a box shape with an opening at the bottom end. The internal space of the level adjustment tank 4 is connected to the internal space of the vessel 1 through this opening.

[0022] The level adjustment tank 4 is configured so that gas can be stored in the internal space of the level adjustment tank 4. It is possible to supply or discharge gas to or from the internal space of the level adjustment tank 4. By supplying gas to the internal space of the level adjustment tank 4, the liquid LI in the level adjustment tank 4 can be pushed out of the level adjustment tank 4. Furthermore, by discharging gas from the internal space of the level adjustment tank 4, it is possible to introduce the liquid LI from the outside to the inside of the level adjustment tank 4. This makes it possible to adjust the liquid level (liquid surface height) of the liquid LI in the container 1.

[0023] The scrap tray 3 is disposed above the liquid level adjustment tank 4. The scrap tray 3 has a box shape with an opening at the top end. The scrap tray 3 is capable of storing sludge generated when the workpiece WO is cut by laser processing. The sludge generated during laser processing falls from the workpiece WO and is stored inside the scrap tray 3 through the opening at the top end of the scrap tray 3.

[0024] The crosspiece unit 2 is supported on the container 1 by the crosspiece unit support portion 1c. The crosspiece unit 2 is disposed within the internal space of the container 1 above the scrap tray 3. The crosspiece unit 2 includes a plurality of first support plates 2a, a plurality of second support plates 2b, and a plurality of supports 2c (support members). The plurality of supports 2c correspond to the support members of the present disclosure. The plurality of first support plates 2a and the plurality of second support plates 2b are arranged vertically and horizontally to form a lattice pattern. Each of the plurality of second support plates 2b is joined to the upper part of each of the plurality of first support plates 2a. The plurality of second support plates 2b and the plurality of supports 2c are arranged vertically and horizontally to form a lattice pattern. Each of the plurality of supports 2c is joined to the upper part of each of the plurality of second support plates 2b. Each of the plurality of supports 2c has a plate shape and extends from the side wall 1sa side toward the side wall 1sb side, running parallel to each other with gaps between them. Each of the multiple second support plates 2b has a plate shape, extends from the side wall 1sc side toward the side wall 1sd side, and runs parallel to each other with a gap therebetween. Each of the multiple first support plates 2a has a plate shape, extends from the side wall 1sa side toward the side wall 1sb side, and runs parallel to each other with a gap therebetween. In top view, the extension direction of each of the multiple supports 2c is the same as the extension direction of each of the multiple first support plates 2a. Furthermore, in top view, the extension direction of each of the multiple supports 2c and the extension direction of each of the multiple second support plates 2b are, for example, perpendicular to each other.

[0025] Each of the multiple supports 2c has a mounting portion 2d that supports the underside of the workpiece WO. In the present disclosure, the upper end of each of the multiple supports 2c is formed in a wavy shape. The apex of the wavy upper end of the support 2c becomes the mounting portion 2d that contacts the underside of the workpiece WO. Therefore, one support 2c has multiple mounting portions 2d. The lower end of each of the multiple supports 2c is formed, for example, in a straight line. Note that the upper end of each of the multiple supports 2c may also be formed in a straight line rather than a wavy line. In this case, the mounting portion of one support 2c is straight.

[0026] The upper end of the container 1 (the upper ends of the side walls 1sa, 1sb, 1sc, and 1sd) is located at a higher position than the lower end position (height position of the lower end) LL of the support 2c. As a result, when the container 1 is filled with liquid LI, the liquid LI can be stored up to a position higher than the lower end position LL of the support 2c. Furthermore, the upper end of the container 1 is located at a higher position than the height position ML of the mounting portion 2d. As a result, when the container 1 is filled with liquid LI, the liquid LI can be stored up to a position higher than the height position ML of the mounting portion 2d. Furthermore, the upper end of the container 1 is located at a higher position than the upper surface position (height position of the upper surface) UL of the workpiece WO when the workpiece WO is placed on the mounting portion 2d. As a result, when the container 1 is filled with liquid LI when the workpiece WO is placed on the mounting portion 2d, the liquid LI can be stored up to a position higher than the upper surface position UL of the workpiece WO.

[0027] 1, the driving mechanism 25 moves the laser head 10 in the X direction (the longitudinal direction of the container 1), the Y direction (the lateral direction of the container 1), and the Z direction (the up-down direction). The driving mechanism 25 mainly includes a support table 21, an X-direction movable table 22, a Y-direction movable table 23, and the laser head 10.

[0028] The support base 21 is arranged along, for example, the side wall 1sb of the container 1. The support base 21 extends in the X direction. The X-direction movable base 22 extends in the Y direction and is supported by the support base 21 in a cantilever structure. The X-direction movable base 22 is driven in the X direction along the support base 21 by an X-axis motor (not shown). Note that a pair of left and right support bases 21 may be arranged to sandwich the container 1 in the Y direction. In this case, the X-direction movable base 22 may be supported by the pair of left and right support bases 21 in a double-support structure.

[0029] The Y-direction movable table 23 is supported by, for example, a rack and pinion mechanism so as to be movable in the Y direction relative to the X-direction movable table 22. The Y-direction movable table 23 is driven in the Y direction relative to the X-direction movable table 22 by a Y-axis motor (not shown).

[0030] The laser head 10 is supported by, for example, a rack and pinion mechanism so as to be movable in the Z direction relative to the Y-direction movable base 23. The laser head 10 is driven in the Z direction relative to the Y-direction movable base 23 by a Z-axis motor (not shown).

[0031] The operation panel 30 receives input of processing conditions such as the thickness, material, and speed of the workpiece WO. The operation panel 30 has a display, switches, an alarm, etc. The display shows a screen for inputting processing conditions, a screen showing the operating status of the laser processing device 20, etc.

[0032] 3, the laser head 10 has a head main body 5. The head main body 5 has a hollow cylindrical shape and houses a condenser lens and the like inside. The head main body 5 emits laser light condensed by the condenser lens inside toward the workpiece WO.

[0033] The laser light RL used in the laser processing apparatus 20 of this embodiment has a wavelength of any of visible light, near-infrared light, mid-infrared light, and far-infrared light, and has a wavelength of 0.7 μm or more and 10 μm or less. This laser light RL is laser light whose light source is, for example, a fiber laser, or may be laser light whose light source is a solid-state laser containing YAG (Yttrium Aluminum Garnet). A fiber laser is a type of solid-state laser that uses an optical fiber as an amplification medium. In a fiber laser, the core at the center of the optical fiber is doped with the rare earth element Yb (ytterbium). The laser light RL emitted from a fiber laser is near-infrared light having a wavelength of approximately 1.06 μm. Fiber lasers have lower running and maintenance costs than carbon dioxide lasers.

[0034] A supply pipe 36 is provided to supply the liquid LI to the inside of the container 1. A supply valve 31 is attached to the supply pipe 36. By opening the supply valve 31, the supply of the liquid LI to the internal space of the container 1 is started, and by closing the supply valve 31, the supply of the liquid LI to the internal space of the container 1 is stopped.

[0035] A gas pipe 37 is connected to the level adjustment tank 4 from the outside of the container 1. A pressurization valve 32 and a decompression valve 33 are attached to the gas pipe 37. By opening the pressurization valve 32, gas is supplied into the level adjustment tank 4, and by closing the pressurization valve 32, the supply of gas into the level adjustment tank 4 is stopped. By opening the decompression valve 33, gas inside the level adjustment tank 4 is discharged to the outside, and by closing the decompression valve 33, the discharge of gas from the level adjustment tank 4 is stopped. The level adjustment tank 4, gas pipe 37, pressurization valve 32, and decompression valve 33 are included in a liquid level adjustment mechanism. This liquid level adjustment mechanism adjusts the level of the liquid LI in the container 1 based on the detection result of a liquid level detection sensor 41, as will be described later.

[0036] An overflow pipe (not shown) is attached to the container 1. When the liquid level of the liquid LI in the container 1 reaches or exceeds a predetermined level, the liquid LI in the container 1 is discharged through the overflow pipe into a liquid storage tank 35. The liquid storage tank 35 is disposed outside the container 1.

[0037] A liquid discharge pipe 39 is attached to the container 1. A discharge valve 34 is attached to the liquid discharge pipe 39. By opening the discharge valve 34, the liquid LI in the container 1 is discharged into the liquid storage tank 35, and by closing the discharge valve 34, the discharge of the liquid LI from the container 1 is stopped.

[0038] The liquid LI stored in the container 1 is, for example, a transmission suppression liquid LI that suppresses the transmission of laser light. The transmission suppression liquid LI absorbs light to suppress the transmission of laser light. The transmission suppression liquid LI suppresses the transmission of light with a wavelength of 0.7 μm or more and 10 μm or less, for example.

[0039] The transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is, for example, 10% / cm or less. Furthermore, the transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is preferably, for example, 5% / cm or less. Furthermore, the transmittance of the transmission suppression liquid LI in the wavelength range of 0.7 μm to 10 μm is more preferably, for example, 3% / cm or less.

[0040] The transmission suppression liquid LI contains an additive that absorbs or scatters light in the wavelength range of 0.7 μm to 10 μm in order to suppress the transmission of light in the wavelength range of 0.7 μm to 10 μm. This additive contains, for example, carbon. The additive is preferably black. The transmission suppression liquid LI is, for example, an aqueous solution in which carbon is added to water. The transmission suppression liquid LI is, for example, an aqueous solution in which 0.1 volume % of India ink is added to water. In this specification, water may be tap water or pure water. The India ink is prepared by dispersing carbon black in an aqueous solution of glue or other water-soluble resin, and the carbon black content is 4.0 to 20.0 wt %, preferably 5.0 to 10.0 wt %, of the total amount. The India ink is, for example, the commercially available "Kuretake Koinoku Ink Drop BA7-18."

[0041] The permeation suppression liquid LI preferably contains a rust inhibitor. The rust inhibitor is a corrosion inhibitor that suppresses corrosion of steel materials and the like. The rust inhibitor is, for example, water-soluble. Examples of the rust inhibitor that may be used include a precipitated film-type inhibitor, a passive inhibitor, and an oxygen-scavenging inhibitor.

[0042] As shown in FIGS. 1 to 3, the laser processing apparatus 20 has a nozzle pipe unit 15. The nozzle pipe unit 15 has a nozzle pipe 11, a holder 12, and an air blowing adjustment section 13. The nozzle pipe 11 is for blowing air into the container 1. The nozzle pipe 11 has a tubular shape and is capable of passing air inside. The nozzle pipe 11 is attached to the holder 12. The nozzle pipe unit 15 corresponds to the air blowing device of the present disclosure.

[0043] The holder 12 is used to attach the nozzle pipe 11 to the container 1. The holder 12 has an inverted U shape and extends linearly. The holder 12 is attached by, for example, fitting it onto the upper end of the side wall 1sa of the container 1.

[0044] With the holder 12 attached to the side wall 1sa of the container 1, the nozzle pipe 11 and the holder 12 each extend along the side surface of the side wall 1sa in the longitudinal direction (X direction) of the container 1, and extend in a direction approximately perpendicular to the direction in which the multiple supports 2c extend. The nozzle pipe 11 faces the multiple supports 2c in the lateral direction (Y direction) of the container 1.

[0045] The nozzle pipe 11 has a plurality of air outlets 11a. Air sent into the nozzle pipe 11 is blown into the container 1 through the plurality of air outlets 11a. The plurality of air outlets 11a are arranged in a row in the X direction at intervals from one another. The air blown out from the plurality of air outlets 11a is sent obliquely downward toward the support body 2c. The air blown out from the plurality of air outlets 11a passes through the gaps between adjacent supports 2c and is sent to the underside of the workpiece WO. The pitch P1 of the air outlets 11a of the nozzle pipe 11 is smaller than the pitch P2 of the supports 2c. The pitch P1 of the air outlets 11a may be the same as the pitch P2 of the supports 2c.

[0046] 3, each of the plurality of air outlets 11a is located above a height position ML of the mounting portion 2d of the support body 2c. Each of the plurality of air outlets 11a may be located above a top surface position UL of the support body 2c when the workpiece WO is placed on the support body 2c.

[0047] An air supply adjustment unit 13 is connected to the nozzle pipe 11. The air supply adjustment unit 13 may be a blower or an on-off valve that opens and closes the air supply path to the nozzle pipe 11. The air supply adjustment unit 13 switches the air supply to the nozzle pipe 11 between an on state and an off state in response to a command from the controller 50. The air supply being on means that air is supplied from the air supply adjustment unit 13 to the nozzle pipe 11 and the air is blown out from the air outlet 11a into the container 1. The air supply being off means that the air supply to the nozzle pipe 11 is stopped and the blowing of air from the air outlet 11a into the container 1 is stopped.

[0048] When the airflow adjusting unit 13 is a blower, the air supply is turned on when the blower is operating, and turned off when the blower is stopped. When the airflow adjusting unit 13 is an on-off valve, the air supply is turned on when the on-off valve is open, and turned off when the on-off valve is closed.

[0049] Furthermore, both the air blower and the on-off valve can adjust the amount of air supplied to the nozzle pipe 11 (air blown from the air outlet 11a) by commands from the controller 50. When the air blowing adjustment unit 13 is a air blower, the amount of air supplied to the nozzle pipe 11 can be adjusted by changing the rotation speed of the air blower with the controller 50. When the air blowing adjustment unit 13 is an on-off valve, the amount of air supplied to the nozzle pipe 11 can be adjusted by changing the opening of the on-off valve with the controller 50. Furthermore, the temperature of the air blown from the air outlet 11a is not particularly limited, and the blown air may be any of cool air, warm air, and hot air.

[0050] The controller 50 controls the opening and closing of the supply valve 31, the pressurization valve 32, the decompression valve 33, and the exhaust valve 34. The controller 50 controls the movement of the laser head 10 in the X, Y, and Z directions, the laser irradiation from the laser head 10, and the like.

[0051] The controller 50 receives a signal indicating the liquid level of the liquid LI in the container 1 detected by the liquid level detection sensor 41. The controller 50 receives a signal indicating a command from the processing start switch 60 to start processing.

[0052] The controller 50 controls the opening and closing of the pressurization valve 32 or the decompression valve 33 based on the detection result of the liquid level detection sensor 41. This adjusts the amount of gas stored in the liquid level adjustment tank 4, and adjusts the liquid level of the liquid LI stored in the container 1. As the controller 50 controls the opening and closing of the pressurization valve 32 or the decompression valve 33 in this way, the liquid level adjustment mechanism (the liquid level adjustment tank 4, the gas piping 37, the pressurization valve 32, and the decompression valve 33) adjusts the liquid level of the liquid LI stored in the container 1.

[0053] The controller 50 controls the opening and closing of the supply valve 31, the pressurization valve 32, the decompression valve 33, and the discharge valve 34 so that the level of the liquid LI in the container 1 is above the lower end of the support 2c. The level of the liquid LI may be above a portion of the lower end of the support 2c, but is preferably above the entire lower end of the support 2c. When adjusting the level of the liquid LI, the controller 50 determines whether the level of the liquid LI in the container 1 is above the lower end of the support 2c based on a signal indicating the level of the liquid LI in the container 1 detected by the liquid level detection sensor 41.

[0054] The controller 50 controls the air blowing adjustment unit 13 to blow air from the plurality of air blowing ports 11a to between the liquid LI and the lower surface of the workpiece WO, with the liquid level of the liquid LI in the container 1 adjusted to be higher than the lower end of the support 2c. At this time, the controller 50 controls the air blowing adjustment unit 13 to turn on the supply of air to the nozzle pipe 11.

[0055] The controller 50 includes a processor, a main memory, and a storage. The processor is, for example, a CPU (Central Processing Unit). The main memory includes, for example, a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory).

[0056] The controller 50 may be mounted on the operation panel 30 or may be stored in a server remote from the thermal processing apparatus 20. The controller 50 reads a program stored in storage, loads it into main memory, and executes predetermined processing in accordance with the program. The program may also be distributed to the controller 50 via a network.

[0057] <Laser processing method>

[0058] Next, a laser processing method using the laser processing device of this embodiment will be described with reference to FIGS.

[0059] FIG. 4 is a flow diagram illustrating a laser processing method according to one embodiment. FIG. 5(A) illustrates the air flow when the water level is above the lower end of the support member, and FIG. 5(B) is a cross-sectional view taken along line VB-VB in FIG. 5(A). As illustrated in FIGS. 3 and 4, liquid LI is supplied into the container 1 of the laser processing apparatus 20. At this time, the controller 50 controls the supply valve 31 to open. This allows the liquid LI to be supplied into the container 1 from the supply pipe 36. At this time, the controller 50 detects the level of the liquid LI in the container 1 using the liquid level detection sensor 41. When the controller 50 determines, based on the detection result of the liquid level detection sensor 41, that the level of the liquid LI in the container 1 has reached a desired level, it controls the supply valve 31 to close. At this time, the liquid LI is supplied to a position lower than the height of the mounting portion 2d of the crosspiece unit 2, for example.

[0060] A workpiece WO is carried into the laser processing device 20. The workpiece WO is placed on the mounting portion 2d of the support 2c of the crosspiece unit 2 (step S1: FIG. 4). The workpiece WO is, for example, a steel material. In this state, the laser processing operation by the laser processing device 20 is started.

[0061] The laser processing operation in the laser processing device 20 is started, for example, by operating the processing start switch 60. When the controller 50 receives a signal from the processing start switch 60 to start the laser processing operation, the controller 50 starts the laser processing operation by the laser processing device 20.

[0062] When the laser processing operation is started, the controller 50 adjusts the level of the liquid LI stored in the container 1 based on the detection result of the liquid level detection sensor 41. Specifically, the controller 50 controls, for example, to open the pressurizing valve 32. This causes gas to be supplied into the liquid level adjustment tank 4, and the level of the liquid LI stored in the container 1 is adjusted to be higher.

[0063] By adjusting the level of the liquid LI, the level of the liquid LI is adjusted to a position higher than the upper surface position UL of the workpiece WO, so that the entire workpiece WO is submerged (immersed) in the liquid LI.

[0064] In this state, the laser head 10 moves to the start position of laser processing. The movement of the laser head 10 is controlled by the controller 50. Specifically, as shown in Fig. 1, the X-direction movable table 22 moves in the X direction relative to the pair of left and right support tables 21. Furthermore, the Y-direction movable table 23 moves in the Y direction relative to the X-direction movable table 22. Furthermore, the laser head 10 moves in the Z direction relative to the Y-direction movable table 23.

[0065] As shown in Fig. 3, after the laser head 10 moves to the laser processing start position, laser processing is started by the laser processing device 20. Laser processing is performed in a state where the liquid LI is stored in the container 1 and the liquid level of the liquid LI is higher than the upper surface position UL of the workpiece WO (step S2: Fig. 4). During laser processing, a laser beam is irradiated from the laser head 10 toward the workpiece WO. Also, an assist gas is blown from the laser head 10 toward the workpiece WO.

[0066] The blowing force of the assist gas pushes away the liquid LI at the processing point of the workpiece WO, thereby exposing the upper surface of the workpiece WO from the liquid LI at the processing point of the workpiece WO.

[0067] A laser beam is irradiated onto the upper surface of the workpiece WO exposed from the liquid LI. The workpiece WO is processed by this irradiation of the laser beam. As a result, the workpiece WO is cut, for example. The laser beam that penetrates the workpiece WO by cutting it is incident on the liquid LI stored below the workpiece WO.

[0068] The sludge generated when cutting the workpiece WO by laser processing sinks into the liquid LI and accumulates in the scrap tray 3. The sludge S is, for example, particles of iron oxide that have solidified from molten iron.

[0069] When the above laser processing is completed, the controller 50 controls the laser head 10 to move to its initial position. Specifically, as shown in Fig. 1, the X-direction movable base 22 moves in the X direction relative to the pair of left and right support bases 21. The Y-direction movable base 23 moves in the Y direction relative to the X-direction movable base 22. The laser head 10 also moves in the Z direction relative to the Y-direction movable base 23.

[0070] After the laser head 10 has moved to the initial position, the level of the liquid LI is adjusted to a position below the lower surface position ML of the workpiece WO and above the lower end position LL of the support 2c (step S3: FIG. 4). As a result, the lower surface of the workpiece WO is exposed from the liquid LI.

[0071] Specifically, after detecting the end of laser processing, the controller 50 controls, for example, the pressure reducing valve 33 to open. This reduces the amount of gas stored in the liquid level adjustment tank 4, and the liquid LI flows into the liquid level adjustment tank 4. As a result, the level of the liquid LI in the container 1 drops. At this time, the controller 50 detects the level of the liquid LI in the container 1 using the liquid level detection sensor 41. When the controller 50 determines that the level of the liquid LI in the container 1 has reached a predetermined level (a position below the lower surface position ML of the workpiece WO and above the lower end position LL of the support body 2c), it controls the pressure reducing valve 33 to close.

[0072] After the liquid level of the liquid LI in the container 1 reaches a predetermined level, air blowing by the nozzle pipe unit 15 is started. The start of air blowing is executed by the controller 50 controlling the air blowing adjustment unit 13. Specifically, the controller 50 controls the air blowing adjustment unit 13 to switch the supply of air to the nozzle pipe 11 from an off state to an on state. If the air blowing adjustment unit 13 is a blower, the controller 50 controls the blower to switch from a stopped state to an operating state. Furthermore, if the air blowing adjustment unit 13 is an on-off valve, the controller 50 controls the on-off valve to switch from a closed state to an open state.

[0073] As a result, air is supplied to the nozzle pipe 11, and the air is blown out from the plurality of air outlets 11a of the nozzle pipe 11. The air is blown out obliquely downward from each of the plurality of air outlets 11a toward the support bodies 2c. The air blown out from each of the plurality of air outlets 11a is blown into between the liquid LI and the underside of the workpiece WO through gaps between the plurality of support bodies 2c (step S4: FIG. 4).

[0074] 5(A) and 5(B), the air blown between the liquid LI and the lower surface of the workpiece WO is sent from the side wall 1sa to the side wall 1sb within the space surrounded by the adjacent supports 2c, the lower surface of the workpiece WO, and the liquid LI. This allows the liquid LI adhering to the lower surface of the workpiece WO to be effectively dried by exposing it to the blown air.

[0075] After continuing to blow air for a predetermined time, the nozzle pipe unit 15 stops blowing air. The controller 50 controls the air blow adjustment unit 13 to stop blowing air. Specifically, the controller 50 controls the air blow adjustment unit 13 to switch the supply of air to the nozzle pipe 11 from an on state to an off state. If the air blow adjustment unit 13 is a blower, the controller 50 controls the blower to switch from an operating state to a stopped state. If the air blow adjustment unit 13 is an on-off valve, the controller 50 controls the on-off valve to switch from an open state to a closed state.

[0076] After the bottom surface of the workpiece WO has been dried, the workpiece WO is carried out from the laser processing device 20. If necessary, the crosspiece unit 2 and the scrap tray 3 are removed from the container 1. Thereafter, the sludge S in the scrap tray 3 is removed.

[0077] As described above, laser processing and drying of the workpiece WO are performed using the laser processing apparatus 20 in this embodiment. Note that although a method for cutting the workpiece WO has been described above as the laser processing method, the laser processing method may also be a processing method such as welding using laser light. Furthermore, the thermal processing method disclosed herein is not limited to laser processing methods using laser light, and may also be a plasma processing method using plasma.

[0078] In the above embodiment, the case where laser processing is performed in a state where the liquid level of the liquid LI is higher than the upper surface position UL of the workpiece WO has been described, but the present disclosure is not limited to this, and laser processing may be performed in a state where the liquid level of the liquid LI is lower than the upper surface position UL of the workpiece WO. Laser processing may also be performed in a state where the liquid level of the liquid LI is above the lower surface position ML of the workpiece WO.

[0079] <Effects of this embodiment>

[0080] Next, the effects of this embodiment will be described.

[0081] The present inventors have investigated how the wind speed when air is blown between the bottom surface of the workpiece and the liquid changes depending on the change in the distance between the bottom surface of the workpiece and the liquid level.

[0082] In this study, the apparatus shown in Figure 3 was used. In the apparatus shown in Figure 3, air was blown from the air outlet 11a of the nozzle pipe 11 between the underside of the workpiece WO and the liquid LI from the side wall 1sa side to the side wall 1sb side. In this state, the wind speed of the air flowing between the workpiece WO and the liquid LI was detected on the side wall 1sb side. The results are shown in Figure 6.

[0083] FIG. 6 shows the relationship between the liquid level and the wind speed in the container of the laser processing device. In FIG. 6, the horizontal axis represents the distance between the bottom surface of the workpiece WO and the liquid level of the liquid LI. When this distance is "0," the bottom surface position ML of the workpiece WO and the liquid level of the liquid LI are the same. The further to the right on the horizontal axis, the greater the distance between the bottom surface position ML of the workpiece WO and the liquid level of the liquid LI. The distance D indicated by the dashed line on the horizontal axis indicates that the bottom end position LL of the support 2c and the liquid level of the liquid LI are the same position. The vertical axis of FIG. 6 represents the wind speed of the air flowing between the bottom surface of the workpiece WO and the liquid LI, i.e., the wind speed of the air flowing near the bottom surface of the workpiece WO. The wind speed of the air flowing between the bottom surface of the workpiece WO and the liquid LI is greater the higher on the vertical axis.

[0084] From the results in Figure 6, when the distance between the lower surface position ML of the workpiece WO and the liquid level LI is smaller than distance D, a high wind speed is maintained. On the other hand, when the distance between the lower surface position ML of the workpiece WO and the liquid level LI is larger than distance D, the wind speed drops sharply and becomes almost zero. From these results, it was found that the wind speed changes significantly at the boundary of distance D.

[0085] This is thought to be because, when the liquid level of the liquid LI is below the lower end position LL of the support 2c as shown in Fig. 7, the rectifying effect of the support 2c is not produced, and therefore the wind speed near the lower surface of the workpiece WO is reduced. On the other hand, when the liquid level of the liquid LI is above the lower end position LL of the support 2c as shown in Fig. 5, the rectifying effect of the support 2c is produced, and therefore the wind speed near the lower surface of the workpiece WO is increased.

[0086] 5, in this embodiment, the liquid level of the liquid LI in the container 1 is adjusted to be higher than the lower end position LL of the support 2c, and air is blown from the air outlet 11a between the liquid LI and the underside of the workpiece WO. This creates a rectifying effect with the support 2c, increasing the air speed near the underside of the workpiece WO, thereby accelerating drying of the underside of the workpiece WO. Therefore, even when using the liquid LI during thermal processing such as laser processing or plasma processing, the work of wiping the workpiece WO can be simplified.

[0087] 3, according to this embodiment, the air outlet 11a is located above the height position of the mounting portion 2d of the support body 2c. As a result, even if the liquid level of the liquid LI is adjusted above the lower end position LL of the support body 2c, as long as the liquid level is up to the lower surface position ML of the workpiece WO, the air outlet 11a is prevented from being submerged in the liquid LI.

[0088] 2, according to this embodiment, the air blown out from the air outlet 11a is sent between the liquid LI and the lower surface of the workpiece WO through the gaps between the multiple supports 2c. As a result, even if the air outlet 11a is located above the height position of the mounting portion 2d of the supports 2c, air can be sent between the lower surface of the workpiece WO and the liquid level of the liquid LI.

[0089] 2, according to this embodiment, the plurality of supports 2c extend parallel to one another from the side wall 1sa (first side) to the side wall 1sb (second side), so that the air blown between the lower surface of the workpiece WO and the liquid level of the liquid LI flows from the side wall 1sa to the side wall 1sb along the gaps between the adjacent supports 2c, preventing the airflow from diffusing.

[0090] 2, according to this embodiment, the pitch P1 of the plurality of air outlets 11a is smaller than the pitch P2 of the plurality of support bodies 2c, so that air can be reliably sent between the adjacent support bodies 2c.

[0091] According to this embodiment, as shown in Fig. 3, the upper end of each support 2c having the mounting portion 2d is formed in a wavy shape. This reduces the contact area between the support 2c and the lower surface of the workpiece WO, facilitating drying of the lower surface of the workpiece WO. Note that the upper end of each support 2c having the mounting portion 2d may also be formed in a straight line.

[0092] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0093] 1 container, 1c crosspiece unit support portion, 1sa, 1sb, 1sc, 1sd side wall, 2 crosspiece unit, 2a first support plate, 2b second support plate, 2c support, 2d placement portion, 3 scrap tray, 4 liquid level adjustment tank, 5 head body, 10 laser head, 11 nozzle pipe, 11a air outlet, 12 holder, 13 air flow adjustment portion, 15 nozzle pipe unit, 20 laser processing device, 21 support base, 22 X-direction movable base, 23 Y-direction movable base, 25 drive mechanism, 30 operation panel, 31 supply valve, 32 pressure valve, 33 pressure reduction valve, 34 discharge valve, 35 liquid storage tank, 36 supply piping, 37 gas piping, 39 liquid discharge piping, 41 liquid level detection sensor, 50 controller, 60 processing start switch, LI liquid, WO workpiece.

Claims

1. A thermal processing device that thermally processes a workpiece using laser light or plasma, a container capable of storing a liquid; a support member provided in the container and having a mounting portion for supporting a lower surface of the workpiece; a blower having at least one blower port for blowing out air; a controller; The controller A thermal processing device that controls air to be blown between the liquid and the underside of the workpiece from at least one air outlet while adjusting the liquid level in the container so that it is above the lower end of the support member.

2. A thermal processing device that thermally processes a workpiece using laser light or plasma, a container capable of storing a liquid; a support member provided in the container and having a mounting portion for supporting a lower surface of the workpiece; a blower having at least one blower port for blowing out air; a controller; the container has a first side wall and a second side wall facing each other in a top view, the support member includes a plurality of supports each having the mounting portion; the plurality of supports extend parallel to one another from the first side wall toward the second side wall, A thermal processing device in which the controller controls the at least one air outlet to blow air between the liquid and the underside of the workpiece while adjusting the liquid level in the container to be above the lower end of the support member, thereby blowing air from the at least one air outlet between the liquid and the underside of the workpiece through gaps between the multiple supports.

3. 3. The thermal processing apparatus according to claim 1, wherein the at least one air outlet is located above the mounting portion of the support member.

4. the at least one air outlet is a plurality of air outlets; The thermal processing apparatus according to claim 2 , wherein the pitch of the plurality of air blowing ports is smaller than the pitch of the plurality of supports.

5. placing a workpiece on a placement portion of a support member provided on a container; a step of thermally processing the workpiece using laser light or plasma while the liquid is stored in the container; After the thermal processing, adjusting the liquid level so that it is above the lower end of the support member; and blowing air between the liquid and the lower surface of the workpiece while adjusting the liquid level to be above the lower end of the support member.

6. the support member includes a plurality of supports each having the mounting portion; The thermal processing method according to claim 5 , wherein air is blown between the liquid and the lower surface of the workpiece through gaps between the plurality of supports.

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