Wired circuit board

Abstract

To provide a wiring circuit board excellent in reliability.SOLUTION: The wired circuit board 1 includes an insulating base layer 2, a metal supporting layer 3, and a conductive layer 4. The base insulating layer 2 continuously extends in the first direction and the second direction. The metal supporting layer 3 is disposed on one surface 21 in the thickness direction of the base insulating layer 2. The metal supporting layer 3 includes a first metal portion 31, a second metal portion 32, and a plurality of third metal portions 33. The second metal portion 32 is spaced apart from the first metal portion 31 in the first direction. The multiple third metal portions 33 are separated from each other in the second direction. The conductor layer 4 is disposed on the other surface 22 in the thickness direction of the base insulating layer 2. The conductor layer 4 includes a plurality of first terminals 41, a second terminal 42, and a plurality of wires 43. The base insulating layer 2 includes a slit 6. The slit 6 is disposed between the plurality of third metal portions 33 and is along the first direction between the first metal portion 31 and the second metal portion 32 when projected in the thickness direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board. [Background technology]

[0002] A wired circuit board is known that includes a plurality of wiring portions spaced apart from one another in the width direction (see, for example, Patent Document 1 below). Each of the plurality of wiring portions of the wired circuit board described in Patent Document 1 includes a metal layer, an insulating layer, and a wiring layer toward one side in the thickness direction. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Application No. 2019-212656 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the wiring portion of the wired circuit board described in Patent Document 1, when stress is applied to the insulating layer, metal layers adjacent in the width direction tend to come into contact with each other and / or wiring layers adjacent in the width direction tend to come into contact with each other, which causes metal powder to be generated due to the contact, resulting in a problem of reduced reliability in the transmission of electrical signals.

[0005] The present invention provides a highly reliable printed circuit board. [Means for solving the problem]

[0006] The present invention (1) includes a wired circuit board comprising: an insulating layer extending continuously in a first direction perpendicular to a thickness direction and in a second direction perpendicular to the thickness direction and the first direction; a metal support layer disposed on one surface of the insulating layer in the thickness direction, the metal support layer comprising a first metal portion, a second metal portion spaced apart from the first metal portion in the first direction, and a plurality of third metal portions connecting the first metal portion and the second metal portion and spaced apart from each other in the second direction; and a conductor layer disposed on the other surface of the insulating layer in the thickness direction, the conductor layer comprising, when projected in the thickness direction, a plurality of first terminals included in the first metal portion, a plurality of second terminals included in the second metal portion, and a plurality of wirings included in the third metal portion and connecting each of the plurality of first terminals to each of the plurality of second terminals; the insulating layer, when projected in the thickness direction, being disposed between the plurality of third metal portions, and comprising a slit along the first direction between the first metal portion and the second metal portion.

[0007] In this wired circuit board, even if stress is applied to the insulating layer between the first metal part and the second metal part, the slits can alleviate the stress, thereby suppressing the generation of metal powder caused by contact between multiple third metal parts and the generation of conductor powder caused by contact between adjacent wires.

[0008] The present invention (2) includes the wired circuit board according to (1), in which the ratio of the length of the slit in the second direction to the length between adjacent third metal portions in the second direction is 0.3 or less.

[0009] In this wired circuit board, the above ratio is 0.3 or less, so that short circuits between the metal support layer and the conductor layer between adjacent third metal portions can be effectively suppressed.

[0010] The present invention (3) includes the wired circuit board according to (1) or (2), in which the ratio of the length of the insulating layer from the third metal portion to the slit in the second direction to the length of the slit in the second direction is 3 or more.

[0011] In this wired circuit board, the above ratio is 3 or more, so that short circuits between the metal support layer and the conductor layer through the slits can be effectively suppressed.

[0012] The present invention (4) includes the wired circuit board according to any one of (1) to (3), wherein the slit extends from the first metal portion or its vicinity to the second metal portion or its vicinity.

[0013] In this wired circuit board, the slits can sufficiently relieve stress acting on the insulating layer from the first metal portion or its vicinity to the second metal portion or its vicinity.

[0014] The present invention (5) includes the wired circuit board according to any one of (1) to (3), wherein the slits are arranged in plurality at intervals in the first direction.

[0015] The present invention (6) includes the wired circuit board according to any one of (1) to (5), wherein the slit is a notch.

[0016] In this wired circuit board, the slits are notches, so the structure is simple.

[0017] The present invention (7) includes a wired circuit board according to any one of (1) to (6), wherein the insulating layer further comprises a second slit arranged outside the third metal portion arranged on the furthest one side and / or furthest other side in the second direction, the second slit being arranged between the first metal portion and the second metal portion and extending along the first direction.

[0018] In this wired circuit board, even if stress is applied to the insulating layer arranged on the outer side of the third metal portion arranged on the extreme one side and / or the extreme other side in the second direction, the stress can be alleviated by the second slit.

[0019] Furthermore, the slit and the second slit can relieve stress applied to the insulating layer in the second direction.

[0020] The present invention (8) includes the wired circuit board according to (7), in which the second slit is a notch.

[0021] In this wired circuit board, the second slit is a notch, and therefore the configuration is simple. [Effects of the Invention]

[0022] The wired circuit board of the present invention is highly reliable. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 2 is a bottom view of one embodiment of the wired circuit board of the present invention. [Figure 2] 2 is a cross-sectional view taken along the line AA of the printed circuit board shown in FIG. [Figure 3] 2 is a cross-sectional view of the printed circuit board shown in FIG. 1 taken along the line BB. [Figure 4] 4A to 4D are diagrams showing steps in manufacturing the wired circuit board shown in FIG. 2. FIG. 4A shows the first step, FIG. 4B shows the second step, FIG. 4C shows the third step, and FIG. 4D shows the fourth step. [Figure 5] FIG. 10 is a bottom view of a modified example of the printed circuit board. [Figure 6] FIG. 10 is a bottom view of a modified example of the printed circuit board. [Figure 7] FIG. 10 is a bottom view of a modified example of the printed circuit board. [Figure 8] FIG. 10 is a bottom view of a modified example of the printed circuit board. DETAILED DESCRIPTION OF THE INVENTION

[0024] 1. One embodiment of a printed circuit board An embodiment of the wired circuit board of the present invention will be described with reference to FIGS. 1 to 3. As shown in FIG. 1, the wired circuit board 1 extends in a first direction and a second direction. The first direction is perpendicular to the thickness direction. The second direction is perpendicular to the thickness direction and the first direction. The wired circuit board 1 has a generally rectangular shape in a plan view that is long in the first direction. The wired circuit board 1 has one end 11 in the first direction, the other end 12 in the first direction, and an intermediate portion 13. The other end 12 is spaced apart from the one end 11 in the first direction. The intermediate portion 13 is disposed between the one end 11 and the other end 12 in the first direction.

[0025] 1.1 Layer structure of the printed circuit board 1 As shown in FIGS. 2 and 3, the wired circuit board 1 includes a base insulating layer 2, a metal support layer 3, a conductor layer 4, and a cover insulating layer 5.

[0026] 1.2 Base insulating layer 2 The base insulating layer 2 extends continuously in the first direction and the second direction. The base insulating layer 2 has the same outer shape as the wired circuit board 1 in a plan view. The base insulating layer 2 has a generally rectangular shape that is long in the first direction. The base insulating layer 2 is disposed across one end 11, the other end 12, and an intermediate portion 13 of the wired circuit board 1. The base insulating layer 2 has one surface 21 and the other surface 22 in the thickness direction. The other surface 22 is spaced apart from the one surface 21 in the thickness direction.

[0027] The thickness of the base insulating layer 2 is, for example, 1 μm or more, or preferably 5 μm or more, and for example, 100 μm or less, or preferably 50 μm or less. Examples of materials for the base insulating layer 2 include insulating resins. Examples of insulating resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0028] 1.3 Metal support layer 3 The metal support layer 3 is disposed on one surface 21 in the thickness direction of the base insulating layer 2. As shown in Fig. 1 , the metal support layer 3 is included in the base insulating layer 2 in plan view. The metal support layer 3 includes a first metal portion 31, a second metal portion 32, and a plurality of third metal portions 33.

[0029] 1.3.1 First metal part 31 As shown in Figures 1 and 3, the first metal portion 31 is arranged at one end in the first direction of the metal support layer 3. The first metal portion 31 is arranged at one end 11 of the wired circuit board 1. The first metal portion 31 is included in the base insulating layer 2 at the one end 11. The first metal portion 31 extends in the second direction. In this embodiment, the first metal portion 31 has a generally rectangular shape in plan view. When projected in the thickness direction, the first metal portion 31 does not overlap both end edges in the second direction and one end edge in the first direction of the base insulating layer 2 at the one end 11.

[0030] 1.3.2 Second metal part 32 The second metal portion 32 is arranged at the other end portion in the first direction of the metal support layer 3. The second metal portion 32 is arranged at the other end portion 12 of the wired circuit board 1. The first metal portion 31 is included in the base insulating layer 2 at the other end portion 12. The second metal portion 32 is spaced apart from the first metal portion 31 in the first direction. The second metal portion 32 extends in the second direction. In this embodiment, the second metal portion 32 has a generally rectangular shape in plan view. When projected in the thickness direction, the second metal portion 32 does not overlap both end edges in the second direction and the other end edge in the first direction of the base insulating layer 2 at the other end portion 12.

[0031] 1.3.3 Multiple third metal parts 33 As shown in FIGS. 1 and 2 , the multiple third metal portions 33 are arranged between the first metal portion 31 and the second metal portion 32 in the first direction. The multiple third metal portions 33 are arranged in the intermediate portion 13 of the wired circuit board 1. When projected in the thickness direction, the multiple third metal portions 33 are included in the base insulating layer 2 of the intermediate portion 13. The multiple third metal portions 33 are spaced apart from one another in the second direction. Each of the multiple third metal portions 33 extends along the first direction. Each of the multiple third metal portions 33 connects each of the first metal portions 31 and each of the second metal portions 32. The multiple (two in this embodiment) third metal portions 33 do not overlap both end portions (both end regions) and the center portion in the second direction of the base insulating layer 2 in the intermediate portion 13.

[0032] The length L4 in the second direction of each of the multiple third metal portions 33 is shorter than the length L5 in the second direction of each of the first metal portion 31 and the second metal portion 32. Specifically, the ratio (L4 / L5) of the length L4 in the second direction of each of the multiple third metal portions 33 to the length L5 in the second direction of each of the first metal portion 31 and the second metal portion 32 is, for example, 0.7 or less, preferably 0.5 or less, more preferably 0.2 or less, even more preferably 0.1 or less, and is, for example, 0.001 or more.

[0033] The length L1 between the third metal portions 33 adjacent to each other in the second direction is, for example, 10 μm or more, preferably 30 μm or more, more preferably 50 μm or more, and is, for example, 1000 μm or less.

[0034] The ratio (L1 / L4) of the length L1 between adjacent third metal parts 33 in the second direction to the length L4 in the second direction of each of the multiple third metal parts 33 is, for example, 0.1 or more, preferably 0.5 or more, and is, for example, 100 or less, preferably 50 or less.

[0035] The length L6 in the first direction of each of the multiple third metal portions 33 is longer than the length L7 in the first direction of each of the first metal portion 31 and the second metal portion 32. Specifically, the ratio (L6 / L7) ​​of the length L6 in the first direction of each of the multiple third metal portions 33 to the length L7 in the first direction of each of the first metal portion 31 and the second metal portion 32 is, for example, 2 or more, preferably 5 or more, more preferably 10 or more, even more preferably 100 or more, particularly preferably 1,000 or more, and is, for example, 100,000 or less.

[0036] The metal supporting layer 3 has a thickness of, for example, 30 μm or more, preferably 50 μm or more, preferably 75 μm or more, more preferably 100 μm or more. The metal supporting layer 3 has a thickness of, for example, 1000 μm or less, preferably 500 μm or less.

[0037] The material of the metal support layer 3 is a metal. Examples of metals include metal elements classified into Groups 1 to 16 of the Periodic Table (IUPAC, 2018) and alloys containing two or more of these metal elements. The metal may be either a transition metal or a typical metal. More specifically, examples of metals include Group 2 metal elements, Group 4 metal elements, Group 5 metal elements, Group 6 metal elements, Group 7 metal elements, Group 8 metal elements, Group 9 metal elements, Group 10 metal elements, Group 11 metal elements, Group 12 metal elements, Group 13 metal elements, and Group 14 metal elements. Examples of Group 2 metal elements include calcium. Examples of Group 4 metal elements include titanium and zirconium. Examples of Group 5 metal elements include vanadium. Examples of Group 6 metal elements include chromium, molybdenum, and tungsten. Examples of Group 7 metal elements include manganese. Examples of Group 8 metal elements include iron. Examples of Group 9 metal elements include cobalt. Examples of Group 10 metal elements include nickel and platinum. Examples of Group 11 metal elements include copper, silver, and gold. Examples of Group 12 metal elements include zinc. Examples of Group 13 metal elements include aluminum and gallium. Examples of Group 14 metal elements include germanium and tin. These can be used alone or in combination. As the metal, preferred are Group 11 metal elements, more preferably copper and copper alloys.

[0038] 1.4 Conductor layer 4 2 and 3, the conductor layer 4 is disposed on the other surface 22 in the thickness direction of the base insulating layer 2. As shown in FIG. 1, the conductor layer 4 includes a plurality of first terminals 41, a plurality of second terminals 42, and a plurality of wirings 43.

[0039] 1.4.1 Multiple first terminals 41 1 and 3, the multiple first terminals 41 are included in the first metal portion 31 when projected in the thickness direction. The multiple first terminals 41 are included in one end portion 11 of the wired circuit board 1. In this embodiment, the multiple first terminals 41 are spaced apart from one another in the second direction. The multiple first terminals 41 have, for example, a generally rectangular shape (a square land shape) in a plan view.

[0040] 1.4.2 Multiple second terminals 42 The multiple second terminals 42 are included in the second metal portion 32 when projected in the thickness direction. The multiple second terminals 42 are included in the other end portion 12 of the wired circuit board 1. In this embodiment, the multiple second terminals 42 are spaced apart from one another in the second direction. Each of the multiple second terminals 42 has, for example, a generally rectangular shape (a square land shape) in plan view.

[0041] 1.4.3 Multiple Wires43 1 and 2, each of the plurality of wirings 43 is included in each of the plurality of third metal portions 33 in a plan view. The plurality of wirings 43 are arranged in the intermediate portion 13 of the wired circuit board 1. Each of the plurality of wirings 43 connects each of the plurality of first terminals 41 to each of the plurality of second terminals 42. The plurality of wirings 43 are spaced apart in the second direction. Each of the plurality of wirings 43 extends in the first direction.

[0042] The thickness of the conductor layer 4 is, for example, 1 μm or more, or preferably 5 μm or more, and for example, 50 μm or less, or preferably 30 μm or less.

[0043] Examples of materials for the conductor layer 4 include conductors, such as copper, silver, gold, iron, aluminum, chromium, and alloys thereof. Copper is preferred from the viewpoint of obtaining good electrical properties.

[0044] 1.5 Cover insulating layer 5 As shown in FIG. 2 , the cover insulating layer 5 is disposed on the other surface 22 in the thickness direction of the base insulating layer 2. The cover insulating layer 5 covers the wiring 43. In this embodiment, a plurality of cover insulating layers 5 are provided corresponding to the plurality of wirings 43. The cover insulating layer 5 exposes the plurality of first terminals 41 and the plurality of second terminals 42. The thickness of the cover insulating layer 5 is, for example, 1 μm or more, preferably 5 μm or more, and for example, 100 μm or less, preferably 50 μm or less. Examples of materials for the cover insulating layer 5 include insulating resins. Examples of insulating resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The insulating resin also includes a solder resist.

[0045] 1.6 Slit 6 As shown in Figures 1 and 2, the above-mentioned base insulating layer 2 has a slit 6. The slit 6 is arranged in the intermediate portion 13 of the wired circuit board 1. When projected in the thickness direction, the slit 6 is arranged between the plurality of third metal portions 33 and extends along the first direction between the first metal portion 31 and the second metal portion 32. In this embodiment, the slit 6 extends from the first metal portion 31 to the second metal portion 32. The slit 6 is continuous in the first direction. In this embodiment, the slit 6 is a notch. The slit 6 penetrates the base insulating layer 2 in the thickness direction.

[0046] The ratio (L2 / L1) of the length L2 of the slit 6 in the second direction to the length L1 between adjacent third metal portions 33 in the second direction is, for example, 0.3 or less, preferably 0.2 or less, more preferably 0.1 or less, and even more preferably 0.05 or less, and for example, 0.0001 or more, preferably 0.001 or more. When the ratio (L2 / L1) is equal to or less than the upper limit, short circuits between the metal support layer 3 and the conductor layer 4 between adjacent third metal portions 33 can be effectively suppressed. When the ratio (L2 / L1) is equal to or greater than the lower limit, stress applied to the base insulating layer 2 can be alleviated. Specifically, the length L2 of the slit 6 in the second direction is, for example, 1000 μm or less, preferably 500 μm or less, more preferably 100 μm or less, even more preferably 30 μm or less, particularly preferably 10 μm or less, and for example, 0.1 μm or more, preferably 1 μm or more.

[0047] The ratio (L2 / L3) of the length L2 of the slit 6 in the second direction to the length L3 of the base insulating layer 2 from the third metal portion 33 to the slit 6 in the second direction is, for example, 0.3 or less, preferably 0.2 or less, more preferably 0.1 or less, even more preferably 0.05 or less, and for example, 0.0001 or more, preferably 0.001 or more. When the above ratio is not more than the above upper limit, a short circuit between the metal support layer 3 and the conductor layer 4 through the slit 6 can be effectively suppressed. When the above ratio is not less than the above lower limit, stress applied to the base insulating layer 2 can be alleviated. The length L3 of the base insulating layer 2 from the third metal portion 33 to the slit 6 in the second direction is, for example, 5000 μm or less, preferably 1000 μm or less, more preferably 500 μm or less, even more preferably 200 μm or less, particularly preferably 100 μm or less, and for example, 1 μm or more, preferably 10 μm or more.

[0048] 2. Manufacturing method of the wired circuit board 1 A method for manufacturing the wired circuit board 1 will be described with reference to Figures 4A to 4D. The method for manufacturing the wired circuit board 1 includes a first step, a second step, a third step, and a fourth step.

[0049] 2.1 First step 4A, the first step is to prepare a circuit laminate material 20. The circuit laminate material 20 includes, in order toward the other side in the thickness direction, an insulating base layer 2, a conductor layer 4, and an insulating cover layer 5.

[0050] To prepare the circuit laminate 20, for example, first, a two-layer substrate (not shown) is prepared that includes a base insulating layer 2 and a conductor plate (not shown) in that order in the thickness direction. Next, the conductor plate of the two-layer substrate is formed into a conductor layer 4, for example, by a subtractive method, and then a cover insulating layer 5 is formed.

[0051] 2.2 Second process As shown in FIG. 4B , a metal plate 23 is placed on one surface 21 of the base insulating layer 2 of the circuit laminate material 20. The metal plate 23 is the metal support layer 3 before its outer shape is processed. The metal plate 23 extends continuously in the first direction and the second direction. For example, the metal plate 23 is attached to the one surface 21 via an adhesive layer (not shown). Alternatively, the metal plate 23 can be laminated on the one surface 21 without using an adhesive layer.

[0052] 2.3 Third step As shown in FIG. 4C , the metal plate 23 is subjected to contour processing. Examples of contour processing include etching. This forms a metal support layer 3 including a first metal portion 31 (see FIG. 1 ), a second metal portion 32 (see FIG. 1 ), and a plurality of third metal portions 33. One surface 21 in the thickness direction of the base insulating layer 2 between the plurality of third metal portions 33 and one surface 21 in the thickness direction of the base insulating layer 2 on the outside of the third metal portions 33 arranged on the most one side and the most other side in the second direction are exposed on one side in the thickness direction. In this embodiment, the other surface 22 in the thickness direction of the base insulating layer 2 between the plurality of third metal portions 33 and the other surface 22 in the thickness direction of the base insulating layer 2 on the outside of the third metal portions 33 arranged on the most one side and the most other side in the second direction are also exposed on the other side in the thickness direction.

[0053] 2.4 4th step As shown in Fig. 4D, in a fourth step, slits 6 are formed in the insulating base layer 2. Methods for forming the slits 6 include, for example, laser processing and cutting processing with a blade. In this way, the wired circuit board 1 is manufactured.

[0054] 3. Effects of one embodiment In this wired circuit board 1, even if stress is applied to the base insulating layer 2 between multiple third metal portions 33, the slits 6 can alleviate the stress, thereby suppressing the generation of metal powder caused by contact between multiple third metal portions 33 and the generation of conductor powder caused by contact between adjacent wirings 43.

[0055] In this wired circuit board 1, the slits 6 can sufficiently relieve the stress applied to the base insulating layer 2 from the first metal portion 31 to the second metal portion 32.

[0056] In this wired circuit board 1, the slits 6 are cuts, so the structure is simple.

[0057] 4. Variations In the following modifications, the same components and steps as those in the above-described embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, each modification can achieve the same effects as those in the above-described embodiment unless otherwise specified. Furthermore, the embodiment and modifications can be combined as appropriate.

[0058] As shown in FIG. 5, in this modification, the slit 6 extends from the vicinity of the first metal portion 31 (first vicinity portion 311) to the vicinity of the second metal portion 32 (second vicinity portion 321).

[0059] The first vicinity portion 311 includes an area extending from the other edge of the first metal portion 31 in the first direction toward the other side (and one side; the aspect of the one side is not shown) by 10%, preferably 5%, and more preferably 1% of the first direction length L6 of each of the multiple third metal portions 33.

[0060] The second vicinity portion 321 includes an area extending to a distance toward one side (and the other side; the aspect of the other side is not shown) that is 10%, preferably 5%, and more preferably 1% of the first direction length L6 of each of the multiple third metal portions 33.

[0061] Although not shown, the slit 6 may extend from the first vicinity portion 311 to the second metal portion 32. The slit 6 may extend from the first metal portion 31 to the second vicinity portion 321.

[0062] 6, a plurality of slits 6 are arranged at intervals in the first direction. The interval L8 between adjacent slits 6 in the first direction is, for example, 10,000 μm or less, preferably 1,000 μm or less, more preferably 500 μm or less, and for example, 10 μm or more.

[0063] The length L9 in the first direction of each of the plurality of slits 6 is, for example, 10,000 μm or less, preferably 1,000 μm or less, more preferably 500 μm or less, or for example, 10 μm or more. The ratio (L9 / L8) of the length L9 in the first direction of each of the plurality of slits 6 to the interval L8 between adjacent slits 6 in the first direction is, for example, 1 or more, preferably 2 or more, and for example, 100 or less, preferably 10 or less.

[0064] 7, the base insulating layer 2 further includes second slits 7 in addition to the above-described slits 6. The second slits 7 are cutouts. In this embodiment, the second slits 7 include a one-side second slit 7A and an other-side second slit 7B.

[0065] The one-side second slit 7A is arranged on one side (outside) of the third metal portion 33 that is arranged on the most one side in the second direction.

[0066] The other-side second slit 7B is arranged on the other side (outside) of the third metal part 33 that is arranged on the other side furthest in the second direction. The other-side second slit 7B is arranged on the opposite side of the one-side second slit 7A with respect to the slit 6.

[0067] According to this modified example, even if stress is applied to the base insulating layer 2 located outside the third metal portion 33 located on the furthest one side and / or furthest the other side in the second direction, the stress can be alleviated by the second slits 7A, 7B.

[0068] Furthermore, the slits 6 and the second slits A and 7B can relieve the stress applied to the base insulating layer 2 in the second direction.

[0069] Furthermore, in this modified example, the second slits 7 are cuts, so the structure is simple.

[0070] 8, the cover insulating layer 5 may also have slits 6. The cover insulating layer 5 collectively covers the plurality of wirings 43. The cover insulating layer 5 contacts the other surface 22 of the base insulating layer 2 between the plurality of wirings 43. [Explanation of symbols]

[0071] 1 Wiring circuit board 2 Base insulation layer 3 Metal support layer 4 Conductor Layer 6 Slit 7 Second slit 21 One side 22 Other side 31 1st metal part 32 Second metal part 33 Third metal part 41 1st terminal 42 2nd terminal 43 Wiring 311 First Neighborhood 321 Second Neighborhood L1: Length between adjacent third metal parts in the second direction L2 Length of the slit in the second direction L3 Length of the base insulating layer from the third metal part to the slit in the second direction

Claims

1. an insulating layer extending continuously in a first direction perpendicular to a thickness direction and in a second direction perpendicular to the thickness direction and the first direction; a metal support layer disposed on one surface of the insulating layer in a thickness direction, the metal support layer including a first metal portion, a second metal portion spaced apart from the first metal portion in the first direction, and a plurality of third metal portions connecting the first metal portion and the second metal portion and spaced apart from each other in the second direction; a conductor layer disposed on the other surface of the insulating layer in the thickness direction, the conductor layer including, when projected in the thickness direction, a plurality of first terminals included in the first metal portion, a plurality of second terminals included in the second metal portion, and a plurality of wirings included in the third metal portion, the wirings connecting each of the plurality of first terminals and each of the plurality of second terminals; the insulating layer is disposed between the plurality of third metal portions when projected in the thickness direction, and includes a slit along the first direction between the first metal portion and the second metal portion; The length of the slit in the second direction is 500 μm or less.

2. The printed circuit board according to claim 1 , wherein the length of the slit in the second direction is 100 μm or less.

3. 3. The wired circuit board according to claim 1, wherein a ratio of a length of the slit in the second direction to a length between adjacent third metal portions in the second direction is 0.3 or less.

4. 4. The wired circuit board according to claim 1, wherein a ratio of a length of the insulating layer from the third metal portion to the slit in the second direction to a length of the slit in the second direction is 3 or more.

5. The printed circuit board according to claim 1 , wherein the slit extends from the first metal portion or a vicinity thereof to the second metal portion or a vicinity thereof.

6. The printed circuit board according to claim 1 , wherein a plurality of the slits are arranged at intervals in the first direction.

7. The printed circuit board according to claim 1 , wherein the slit is a notch.

8. 8. The wired circuit board according to claim 1, wherein the insulating layer further comprises a second slit arranged outside the third metal portion arranged on the furthest one side and / or furthest other side in the second direction, the second slit being arranged between the first metal portion and the second metal portion and extending along the first direction.

9. The printed circuit board according to claim 8 , wherein the second slit is a notch.

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