Printed circuit board (PCB) jointed board for improving dielectric thickness and warping performance of symmetrical layer

Abstract

The utility model provides a PCB jointed board capable of improving dielectric thickness and warping performance of symmetrical layers. The PCB jointed board comprises a front surface and a back surface; the front surface of the PCB jointed board comprises one or more front surface units and one or more back surface units; wherein the front surface unit comprises a plurality of single PCBs with upward front surfaces, and the back surface unit comprises a plurality of single PCBs with upward back surfaces; the front surface units and the back surface units are sequentially and alternately arranged along the length direction of the PCB jointed board; the front surface of the PCB jointed board and the back surface of the PCB jointed board are correspondingly arranged; wherein the front surface of the PCB jointed board is the front surface unit, and the corresponding position of the back surface of the PCB jointed board is the back surface unit.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of semiconductor packaging carrier board and electronic printed circuit board manufacturing, and particularly relates to a PCB panel for improving the thickness and warping performance of symmetrical layers. BACKGROUND

[0002] PCB (printed circuit board) is a key component in the electronic industry. In the production process of PCB, due to its small size, it cannot meet the requirements of the production equipment clamps, and therefore a panel production process is usually adopted. Specifically, a plurality of small panels (sets or strips) are spliced into a working panel for production and processing, so that a plurality of circuit boards can be produced at the same time, thereby improving production efficiency and reducing production cost.

[0003] However, as shown in Figure 1 and Figure 2 , due to different circuit designs, the density of the circuit patterns on the front side (A side) and the back side (B side) of a single small panel is often inconsistent, and even greatly different. Since the circuit patterns are composed of copper conductors, the proportion of the overall copper pattern on the front side and the back side of the PCB (i.e., the copper coverage rate) also greatly differs.

[0004] In the prior art, as shown in Figure 3 and Figure 4 , differential copper pattern processing can be performed in the non-product area of the working panel, i.e., the edge area. For example, the edge area of the front side is fully coppered to increase the copper coverage rate, and the edge area of the back side is coppered with copper blocks of various shapes at a certain pitch to reduce the difference between the copper coverage rates of the front side and the back side. However, in actual design processes, this method cannot completely solve the problem of the large difference between the copper coverage rates of the front side and the back side of the working panel.

[0005] Further, in the subsequent pressing process of the multi-layer PCB, due to the difference between the copper coverage rates of the front side and the back side of the panel, different thicknesses of prepreg need to be used for pressing. For example, if the copper coverage rate of the front side of the PCB panel is low, a slightly thicker prepreg needs to be selected, and if the copper coverage rate of the back side is high, a slightly thinner prepreg needs to be selected, so as to make the dielectric thickness between the layers of the PCB panel after pressing as consistent as possible. However, due to the limited types of prepreg, this method cannot completely solve the problem of inconsistent dielectric thickness between the layers of the multi-layer PCB after pressing. CONTENT OF THE INVENTION

[0006] In order to overcome or alleviate the deficiencies of the prior art, one purpose of the present application is to provide a PCB panel which improves the thickness of symmetrical layers and warping performance. The PCB panel can make the copper coverage of the front and back of the whole PCB panel completely consistent, thereby improving the warping performance of the PCB panel during production. At the same time, it also ensures the consistency of the thickness of each symmetrical layer after pressing, which is beneficial to improve the electrical stability of the PCB panel after mounting or packaging.

[0007] In order to achieve the above-mentioned purposes, the present application can adopt the following technical solutions.

[0008] One embodiment of the present application provides a PCB panel which improves the thickness of symmetrical layers and warping performance, the PCB panel comprising a front surface and a back surface;

[0009] The front surface of the PCB panel comprises one or more front surface units and one or more back surface units; wherein the front surface units comprise a plurality of front surface upward PCB single boards, and the back surface units comprise a plurality of back surface upward PCB single boards; the front surface units and the back surface units are arranged alternately along the length direction of the PCB panel;

[0010] The front surface of the PCB panel is arranged correspondingly to the back surface of the PCB panel; wherein when the front surface of the PCB panel is the front surface unit, the corresponding position of the back surface of the PCB panel is the back surface unit.

[0011] In at least one embodiment, the front surface of the PCB panel is provided with an upper row and a lower row along the width direction of the PCB panel, and when the upper row is the front surface unit, the lower row corresponding to the upper row is the back surface unit.

[0012] In at least one embodiment, the plurality of front surface upward PCB single boards in the same front surface unit are arranged in an array along the width direction of the PCB panel, and the plurality of back surface upward PCB single boards in the same back surface unit are arranged in an array along the width direction of the PCB panel.

[0013] In at least one embodiment, the thickness of the prepreg between each layer of the PCB panel is consistent.

[0014] In at least one embodiment, the orientations of the plurality of front surface upward PCB single boards of the front surface unit are the same, and the orientations of the plurality of back surface upward PCB single boards of the back surface unit are the same.

[0015] In at least one embodiment, the front surface of the PCB panel comprises the same number of front surface units and back surface units.

[0016] In at least one embodiment, the orientations of the plurality of front-side units are the same, and the orientations of the plurality of back-side units are the same.

[0017] In at least one embodiment, the orientations of the plurality of front-side units within the PCB panel are the same, and the orientations of the plurality of back-side units within the PCB panel are the same.

[0018] In at least one embodiment, at least a portion of the non-product area of the PCB panel is at least partially copper filled, and at least a portion of the non-product area of the PCB panel is at least partially copper filled.

[0019] By using the above technical solution, the present application provides a PCB panel which improves the thickness of symmetrical layers and warping performance. When producing and processing the PCB panel, part of the PCB panels are flipped and arranged, so that the front-side units and the back-side units are arranged alternately. In this way, the copper filling rate of the front side and the back side of the entire PCB panel remains the same, and there is no need to adjust the copper pattern proportion of the edge area of the PCB panel and the panel, thereby saving the data editing and processing time of the PCB panel and the panel. In addition, the dielectric thickness of each symmetrical layer of the PCB panel after pressing remains the same. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a top view structural schematic diagram of a front-side unit of a PCB panel;

[0021] Figure 2 is a top view structural schematic diagram of a back-side unit of a PCB panel;

[0022] Figure 3 is a top view structural schematic diagram of a front side of a panel during production of a PCB panel of the prior art;

[0023] Figure 4 is a top view structural schematic diagram of a back side of a panel during production of a PCB panel of the prior art;

[0024] Figure 5 is a top view structural schematic diagram of a PCB panel of one embodiment of the present application;

[0025] Figure 6 is a sectional view structural schematic diagram of a PCB panel of one embodiment of the present application.

[0026] REFERENCE SIGNS

[0027] 100 front-side unit;

[0028] 200 back-side unit;

[0029] 110 PCB panel with the front side facing up;

[0030] 210 PCB panel with the back side facing up;

[0031] W width direction;

[0032] L length direction. DETAILED DESCRIPTION

[0033] Exemplary embodiments of the present application are described herein with reference to the accompanying drawings. It is to be understood that the specific arrangements or instrumentalities shown are merely illustrative of the application and do not limit the scope of the application.

[0034] In the present application, the W direction represents the width direction of the PCB panel, and the L direction represents the length direction of the PCB panel. However, this is merely a directional term given for ease of illustration, and does not mean that the size in the width direction cannot be equal to or greater than the size in the length direction.

[0035] The present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] As shown in FIG. 1, an embodiment of the present application provides a PCB panel that improves the symmetric layer dielectric thickness and warping performance, which can include a front side and a back side. Figure 5 In the present embodiment, specifically, the front side of the PCB panel can include one or more front side units 100 and one or more back side units 200, and the front side units 100 and the back side units 200 can be arranged and disposed alternately along the length direction L of the PCB panel.

[0037] Further, in the present embodiment, the front side of the PCB panel can include the same number of front side units 100 and back side units 200.

[0038] As shown in FIG. 1, the front side of the PCB panel can be divided into an upper row and a lower row along the width direction W of the PCB panel. Specifically, when the upper row is a front side unit 100, then the lower row corresponding to the upper row is a back side unit 200; and when the upper row is a back side unit 200, then the lower row corresponding to the upper row is a front side unit 100.

[0039] Figure 5 Further, as shown in FIG. 1, in the present embodiment, the front side unit 100 can include a plurality of front side PCB single boards 110, and the back side unit 200 can include a plurality of back side PCB single boards 210.

[0040] Further, as shown in FIG. 1, in the present embodiment, the front side unit 100 can include a plurality of front side PCB single boards 110, and the back side unit 200 can include a plurality of back side PCB single boards 210. Figure 5 As a preference, the orientations of the plurality of front side PCB single boards 110 in the front side unit 100 are the same (i.e., the placing directions of the respective PCB single boards 110 in the plane are the same), and the orientations of the plurality of back side PCB single boards 210 in the back side unit 200 are the same.

[0041]

[0042] ​​As preferred, the orientations of the plurality of front-side units 100 in the PCB panel are the same, and the orientations of the plurality of back-side units 200 in the PCB panel are the same.

[0043] In this way, the PCB single panel, the front-side unit 100 and the back-side unit 200 are convenient to place and handle.

[0044] For the same front-side unit 100, a plurality of PCB single panels 110 with front side up can be arranged in sequence along the width direction W of the PCB panel. Similarly, for the same back-side unit 200, a plurality of PCB single panels 210 with back side up can be arranged in sequence along the width direction W of the PCB panel. Further, the plurality of PCB single panels can be connected by connecting ribs.

[0045] Further, the arrangement directions of the plurality of PCB single panels 110 with front side up in the front-side unit 100 can be the same. And for the plurality of back-side units 200, the directions of the plurality of PCB single panels 210 with back side up can also be the same.

[0046] Further, according to actual production needs, the number of PCB single panels in the front-side unit 100 and the back-side unit 200 can be flexibly adjusted. For example, it can be set to 2, 4 or 8, etc.

[0047] As preferred, in the present embodiment, 2 PCB single panels 110 with front side up are arranged in the front-side unit 100, and 2 PCB single panels 210 with back side up are arranged in the back-side unit 200.

[0048] In the present embodiment, as shown in Figure 5 , the front side of the PCB panel is arranged corresponding to the back side of the PCB panel. In actual production, due to different circuit designs, the densities of the circuit patterns on the front side and the back side of the PCB single panel are often inconsistent. For example, as shown in Figure 1 and Figure 2 , the density of the circuit pattern on the front side of the PCB single panel is low (the black area in the figure represents the copper conductor), that is, the copper coverage rate of the front side of the PCB single panel is low; while the density of the circuit pattern on the back side is high, that is, the copper coverage rate of the back side of the PCB single panel is high.

[0049] As shown in Figure 3 and Figure 4 , when the front side of the PCB panel is composed of a plurality of PCB single panels with front side up, the back side of the PCB panel is also composed of a plurality of PCB single panels with back side up. Due to the difference in copper coverage rate between the front side and the back side of the PCB single panel, the copper coverage rate of the front side and the back side of the PCB panel also has a significant difference.

[0050] Due to the difference in copper coverage rate between the front and back surfaces of the PCB panel, if the same thickness of prepreg is used to press the front and back surfaces of the PCB panel in the subsequent pressing process, there may be a large difference in the dielectric thickness between the front and back surfaces of the PCB panel. For example, if the copper coverage rate of the front surface of the PCB panel is low and the copper coverage rate of the back surface is high, after using the same thickness of prepreg for pressing, the interlayer dielectric thickness of the front surface of the PCB panel may be qualified, but the dielectric thickness of the back surface may exceed the design specification. Such design deviation in dielectric thickness may affect the electrical stability of the PCB panel after surface packaging.

[0051] If different thicknesses of prepreg are selected for pressing, due to the limited types of prepreg, the problem of inconsistent interlayer dielectric thickness of the PCB panel cannot be completely solved.

[0052] Figure 6 A schematic diagram of the cross-sectional structure of the PCB panel of an embodiment of the present application is shown in FIG. 1. As shown in FIG. 1, M1 to M8 represent each layer in the multi-layer PCB structure, respectively, wherein M1 and M8, M2 and M7, M3 and M6, M4 and M5 are symmetric layers in the design of the PCB panel, respectively. Figure 6

[0053] In the present embodiment, since the front surface units and the back surface units of the PCB panel are arranged alternately in sequence, and the front surface and the back surface of the PCB panel are arranged one by one, the overall layout of the front and back surfaces of the panel is consistent. Therefore, the copper coverage rates of the front and back surfaces of the PCB panel are consistent.

[0054] Since the copper coverage rates of the front and back surfaces of the PCB panel are completely consistent, there is no need to adjust the copper pattern proportion of the non-product area on the PCB panel and the PCB single board during design, thereby saving the data editing and processing time of the PCB panel and the PCB single board, and improving the production efficiency.

[0055] As preferred, as shown in FIG. 1, in the present embodiment, at least part of the non-product area of the PCB panel can be fully coppered, and at least part of the non-product area of the PCB single board can be fully coppered. Figure 5 Further, the consistent copper coverage rate of the front and back surfaces also helps to reduce the warping caused by the stress between the layers in the subsequent pressing process, thereby improving the product quality of the PCB panel after mounting or packaging, and further improving the qualification rate of the product.

[0056] Further, when the PCB panel is cut into a PCB single board, the warping problem of the PCB single board can also be improved to a certain extent.

[0057]

[0058] ​​In the embodiment, the prepreg thicknesses between the layers of the PCB panel are consistent. Since the copper deposition rates of the symmetrical layers of the PCB panel are consistent, in the subsequent PCB lamination process, different thicknesses of prepregs do not need to be selected for lamination on the front and back surfaces of the PCB panel, thereby ensuring that the interlayer dielectric thicknesses after lamination are consistent.

[0059] The application provides a PCB panel for improving the symmetrical layer dielectric thickness and warping performance. By flipping and arranging part of the PCB single boards, the front surface units and the back surface units are arranged alternately, so that the copper deposition rates of the front and back surfaces of the entire PCB panel are consistent. The step of adjusting the copper pattern proportion of the edge area of the PCB panel and the PCB single board is avoided, the production efficiency is improved, and the warping performance of the PCB panel is improved.

[0060] In addition, in the lamination process, the prepreg thicknesses of the symmetrical layers of the PCB panel are consistent, thereby ensuring that the symmetrical layer dielectric thicknesses after lamination are consistent, and the electrical stability of the PCB panel after mounting or packaging is improved.

Claims

1. A PCB panel that improves symmetric layer dielectric thickness and warpage performance, characterized by, The PCB panel comprises a front surface and a back surface; The front surface of the PCB panel comprises one or more front surface units and one or more back surface units; wherein the front surface units comprise a plurality of front surface PCB single panels, and the back surface units comprise a plurality of back surface PCB single panels; the front surface units and the back surface units are arranged alternately along the length direction of the PCB panel; The front surface of the PCB panel is arranged correspondingly to the back surface of the PCB panel; wherein when the front surface of the PCB panel is the front surface unit, the corresponding position of the back surface of the PCB panel is the back surface unit.

2. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 1, wherein, The front surface of the PCB panel is provided with an upper row and a lower row along the width direction of the PCB panel; when the upper row is the front surface unit, the lower row corresponding to the upper row is the back surface unit.

3. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 2, wherein, The plurality of front surface PCB single panels in the same front surface unit are arranged in an array along the width direction of the PCB panel; the plurality of back surface PCB single panels in the same back surface unit are arranged in an array along the width direction of the PCB panel.

4. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 1, wherein, The prepreg thickness between the layers of the PCB panel is consistent.

5. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 1, wherein, The orientations of the plurality of front surface PCB single panels of the front surface unit are the same, and the orientations of the plurality of back surface PCB single panels of the back surface unit are the same.

6. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 1, wherein, The front surface of the PCB panel comprises the same number of front surface units and back surface units.

7. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 6, wherein, The orientations of the plurality of front surface units are the same, and the orientations of the plurality of back surface units are the same.

8. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 1, wherein, The orientations of the plurality of front surface units in the PCB panel are the same, and the orientations of the plurality of back surface units in the PCB panel are the same.

9. The PCB panel that improves the symmetric layer dielectric thickness and warpage performance of claim 1, wherein, At least part of the non-product area of the PCB panel is coppered, and at least part of the non-product area of the PCB single panel is coppered.

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