Dressing board, method for manufacturing dressing board, and dressing method

Abstract

To provide a dress board capable of solving such a problem that machining chips are scattered in a machining area, and the machining chips adhere and remain with time to contaminate the machining area.SOLUTION: Dressing boards 10A and 10B for dressing a machining tool for cutting or grinding a workpiece are formed by impregnating a board obtained by kneading and sintering a resin and abrasive grains with at least one of a surfactant and a rust preventive.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a dressing board for dressing a processing tool that cuts or grinds a workpiece, a method for manufacturing a dressing board, and a dressing method using a processing device that includes processing means that processes a wafer held on a chuck table with the processing tool while supplying processing water to the wafer. [Background technology]

[0002] A wafer has multiple devices such as ICs and LSIs formed on its surface, separated by planned dividing lines. The back surface is ground by a grinding machine to form the wafer to a specified thickness, and then the wafer is divided into individual device chips by a cutting machine, and these are used in electrical equipment such as mobile phones and personal computers.

[0003] The grinding device is configured to include a chuck table that holds the wafer, a grinding means that rotatably mounts a grinding wheel with a ring-shaped arrangement of grinding stones that grind the wafer held on the chuck table, and a grinding water supply means that supplies grinding water to the wafer and the grinding stone, and can grind the wafer to a desired thickness (see, for example, Patent Document 1).

[0004] The cutting device is configured to include a chuck table that holds the wafer, cutting means having a rotatably mounted cutting blade that cuts the wafer held on the chuck table, and cutting water supply means that supplies cutting water to the wafer and the cutting blade, and can divide the wafer into individual device chips with high precision (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-016770 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-079833 Summary of the Invention [Problem to be solved by the invention]

[0006] However, when a wafer is ground or cut, processing debris scatters into the processing area, and over time the processing debris adheres and remains, contaminating the processing area.

[0007] The present invention has been made in consideration of the above facts, and its main technical objective is to provide a dressing board, a method for manufacturing a dressing board, and a dressing method that can solve the problem of processing debris scattering into the processing area and adhering and remaining over time, thereby contaminating the processing area. [Means for solving the problem]

[0008] In order to solve the above-mentioned main technical problem, the present invention provides a dressing board for dressing a processing tool that cuts or grinds a workpiece, which is a board made by kneading and sintering resin and abrasive grains and impregnating it with at least one of a surfactant and a rust inhibitor.

[0009] Furthermore, according to the present invention, there is provided a method for manufacturing a dress board, in which a board made by kneading and sintering resin and abrasive grains is impregnated with at least one of a surfactant and a rust inhibitor to produce a dress board, the method comprising the steps of: an immersion step of immersing the board in a solution composed of at least one of a surfactant and a rust inhibitor; a simmering step of heating the solution and simmering the board; and a cooling step of cooling the board while immersed in the solution, thereby impregnating the board with the solution.

[0010] Furthermore, according to the present invention, there is provided a dressing method using a processing apparatus comprising a chuck table for holding a wafer and processing means for processing the wafer held on the chuck table with a processing tool while supplying processing water to the wafer, the dressing method including a holding step for holding the above-mentioned dress board on the chuck table and a dressing step for dressing the processing tool while supplying processing water to the dress board held on the chuck table, and coating the processing area with at least one of a surfactant and a rust inhibitor using waste liquid scattered in the dressing step.

[0011] The surfactant preferably contains either polyoxyalkylene glycol or alkyl betaine, and the rust inhibitor preferably contains either polymerized phosphate, zinc salt, mercaptobenzothiazole, benzotriazole, or alkanolamine. The processing tool is preferably a cutting blade having a cutting edge on its outer periphery or a grinding wheel having grinding stones arranged in an annular shape. [Effects of the Invention]

[0012] The dressing board of the present invention is a dressing board for dressing a processing tool that cuts or grinds a workpiece, and is made by kneading and sintering a resin and abrasive grains and impregnating at least one of a surfactant and a rust inhibitor. By performing dressing using this dressing board, processing debris that scatters when the workpiece is processed with the processing tool and adheres to the inside or inner wall of the processing area is washed away and washed away, and the inside or inner wall of the processing area is coated with a solution containing at least one of a surfactant and a rust inhibitor. In this way, coating with this solution makes it difficult for processing debris generated during processing to adhere, eliminating the problem of grinding debris contaminating the processing area over time.

[0013] The method for producing a dressing board of the present invention includes a step of immersing the board in a solution containing at least one of a surfactant and a rust inhibitor, a step of heating the solution and simmering the board, and a step of cooling the board while immersed in the solution to impregnate the board with the solution. This method allows the production of the dressing board described above, and allows for the removal of debris scattered during processing of the workpiece with a processing tool and adhering to the inside or inner wall of the processing area to be washed away, while the inside or inner wall of the processing area is coated with the solution containing at least one of a surfactant and a rust inhibitor. By coating the workpiece with the solution, debris generated during processing is less likely to adhere, eliminating the problem of grinding debris contaminating the processing area over time.

[0014] Furthermore, the dressing method of the present invention is a dressing method using a processing apparatus comprising a chuck table for holding a wafer and processing means for processing the wafer held on the chuck table with a processing tool while supplying processing water to the wafer held on the chuck table, the method comprising: a holding step for holding the dress board on the chuck table; and a dressing step for dressing the processing tool while supplying processing water to the dress board held on the chuck table. The dressing step coats the processing area with at least one of a surfactant and a rust inhibitor using waste liquid dispersed during the dressing step. This allows for the processing debris dispersed during processing of the workpiece with the processing tool and adhering to the inside or inner wall of the processing area to be washed away and cleaned, and the inside or inner wall of the processing area is coated with the solution containing at least one of a surfactant and a rust inhibitor. By coating with the solution, processing debris generated during processing is less likely to adhere, eliminating the problem of grinding debris contaminating the processing area over time. [Brief explanation of the drawings]

[0015] [Figure 1]FIG. 2 is a perspective view showing a base board constituting the dress board of the present embodiment. [Figure 2] 2 is a conceptual diagram showing a cross section of a part of a dipping means for dipping the board shown in FIG. 1 into a solution. FIG. [Figure 3] FIG. 2 is a perspective view showing a dress board according to the present embodiment. [Figure 4] 1 is a perspective view of a cutting device to which a dressing method according to an embodiment of the present invention is applied. [Figure 5] FIG. 10 is a perspective view showing an embodiment of the dressing step of the present embodiment. [Figure 6] 1A is a perspective view of a grinding apparatus to which the dressing method of the present embodiment is applied, and FIG. 1B is a perspective view showing an embodiment of a dressing step in the grinding apparatus shown in FIG. 1A. DETAILED DESCRIPTION OF THE INVENTION

[0016] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a dressing board, a method for manufacturing a dressing board, and a dressing method configured based on the present invention will be described in detail with reference to the accompanying drawings.

[0017] The dressing board constructed according to the present invention is a dressing board for dressing a processing tool that cuts or grinds a workpiece, and is constructed by impregnating a board made by kneading and sintering resin and abrasive grains with at least one of a surfactant and a rust inhibitor, and is manufactured by the manufacturing method described below.

[0018] To carry out the manufacturing method of the dressing board described below, first, a base board for the dressing board according to the present invention, as shown in FIGS. 1(a) and 1(b), is prepared. The board is a board made by kneading and sintering a resin and abrasive grains. The board is formed by kneading well-known abrasive grains into a resin bond and firing the mixture. More specifically, abrasive grains, such as carborundum, white alundum, or alundum, with a particle size of 0.1 to 1.0 μm, are kneaded into a resin bond made of phenolic resin at a ratio of approximately 30 to 50%, and then molded into, for example, a rectangular board 10a as shown in FIG. 1(a) or a circular board 10b as shown in FIG. 1(b), and then fired at a temperature of 200 to 300°C. Note that the shape of the base board for the dressing board according to the present invention is not limited to the boards 10a and 10b shown in FIG. 1 and may be appropriately formed depending on the processing tool to be dressed and the processing device equipped with the processing tool.

[0019] (Soaking process) Once the board 10a or 10b is prepared, an immersion step is carried out in which the board is immersed in a solution composed of at least one of a surfactant and a rust inhibitor.

[0020] 2 shows an immersion means 20 suitable for carrying out the immersion step in this embodiment, as well as the stewing step and cooling step described below. The immersion means 20 includes a container 21 (shown in cross section) and a heater 22 disposed on the underside of the container 21 and connected to a power source (not shown). The container 21 stores a solution W composed of at least one of a surfactant and a rust inhibitor.

[0021] The solution W composed of at least one of a surfactant and a rust inhibitor used in the immersion means 20 and the immersion process includes not only a solution composed of only one of a surfactant and a rust inhibitor, but also a solution composed of both a surfactant and a rust inhibitor.

[0022] The surfactant may include, for example, polyoxyalkylene glycol or alkyl betaine. The rust inhibitor may include, for example, polymerized phosphate, zinc salt, mercaptobenzothiazole, benzotriazole, or alkanolamine. The solution W may include an appropriate surfactant or rust inhibitor selected from the above surfactants and rust inhibitors.

[0023] By heating the solution W in the container 21 with the heater 22, it is possible to adjust the temperature of the solution W stored in the container 21 to a desired temperature. In the following description, an example will be described in which the manufacturing method of a dress board configured based on the present invention is applied to the board 10a.

[0024] 2, once the immersion means 20 and the board 10a are prepared, the board 10a is immersed in the solution W. When immersing the board 10a in the solution W, a portion of the underside of the board 10a is supported by a support member 24 as shown in the figure so that the entire board 10a comes into contact with the solution W, and the board 10a is supported in a floating state in the solution W.

[0025] (Stewing process) After the board 10a has been immersed in the solution W, a boiling step is carried out in which the solution W stored in the immersion means 20 is heated by operating the heater 22 to boil the board 10a. The target temperature for heating the solution W is set to, for example, 100°C. By heating the board 10a with the solution W heated to 100°C, the air contained in the countless minute cavities formed within the board 10a is released to the outside. The boiling step is carried out for 30 minutes or more, and more preferably for 1 hour or more.

[0026] (cooling process) After the boiling step has been carried out as described above, a cooling step is carried out in which the board 10a is cooled while immersed in the solution W, and the inside of the board 10a is impregnated with the solution W. The cooling of the solution W does not need to be forced cooling, and natural cooling is preferred. That is, after the boiling step is carried out and the heater 22 is turned off, the immersion means 20 with the board 10a immersed therein is left to cool at room temperature. The cooling is carried out over, for example, one day.

[0027] By carrying out the cooling step as described above, the solution W permeates the numerous minute cavities formed in the board 10a and into which air has been released during the boiling step. The boiling step and cooling step described above may be repeated multiple times. Once the solution W has permeated the board 10a as described above, the board 10a is removed from the soaking means 20 and allowed to dry naturally. By drying naturally in this manner, the surfactant and rust inhibitor impregnated inside the board 10a are retained inside the board 10a.

[0028] The above completes the manufacturing method for the dress board of this embodiment, resulting in the dress board 10A configured according to the present invention as shown in FIG. 3(a). While detailed explanations are omitted, by preparing the circular board 10b described above and performing the immersion, boiling, and cooling processes described above, a dress board 10B is completed, as shown in FIG. 3(b), which is impregnated with and retains the solution W therein, similar to the dress board 10A. The dimensions of the dress boards 10A and 10B can be set arbitrarily. For example, the dress board 10A is formed in a rectangular shape with sides of 100 mm x 100 mm and a thickness of 2 mm. The dress board 10B is formed, for example, in a disk shape with a diameter of 100 mm and a thickness of 2 mm.

[0029] A method for dressing a machining tool, which is carried out using the dressing boards 10A and 10B manufactured as described above, will be described below with reference to FIGS.

[0030] The dressing method of this embodiment is preferably carried out by a processing apparatus including a chuck table for holding a workpiece and processing means for processing the workpiece held on the chuck table with a processing tool while supplying processing water to the workpiece. Figure 4 shows a cutting apparatus 30 as an example of a processing apparatus in which the dressing method using a dressing board constructed according to the present invention is preferably carried out.

[0031] The cutting device 30 has a housing 32 having an approximately rectangular parallelepiped shape, a cassette 34 placed on a cassette table 34a of the housing 32, a transfer means 33 for transferring the workpiece (e.g., a silicon wafer) from the cassette 34 to a temporary storage table 35, a transfer means 36 having a swivel arm for transferring the workpiece transferred to the temporary storage table 35 to a chuck table 37, a cutting means 38 having a cutting blade 384 for cutting the workpiece held on the chuck table 37, an alignment means 39 for imaging the workpiece held on the chuck table 37 and detecting the area to be cut by the cutting means 38, and a cleaning and transfer means 41 for transferring the workpiece from the transfer position where the chuck table 37 is positioned in Figure 4 to a cleaning device 40 (details omitted). The chuck table 37 has a breathable holding surface 371, and a plurality of clamps 372 (four in the illustrated embodiment) are arranged at equal intervals around the periphery of the chuck table 37. The clamps 372 grip an annular frame F (see FIG. 5) that supports the workpiece. Suction means (not shown) is connected to the holding surface 371, and negative pressure can be generated on the holding surface 371. Furthermore, the cutting device 1 is provided with control means, display means, etc. (not shown).

[0032] A cover 321 is disposed in the machining area where the workpiece held on the chuck table 37 is cut by the cutting means 38. The cover 321 covers the machining area (not shown in FIG. 4 , and its outer edge is indicated by a two-dot chain line). When the workpiece is cut by the cutting device 30, the workpiece is transported from the cassette 4 of the cutting device 30 to the chuck table 37 and held by suction. The workpiece held on the chuck table 37 is machined by the cutting means 38, cleaned by the cleaning device 40, and returned to the cassette 34. When the workpiece is cut by the cutting blade 384 of the cutting means 38, machining water is supplied from a machining water supply means (not shown), and cutting chips are scattered around along with the machining water. In the prior art, cutting chips scattered inside the cover 321 and on the wall surface of the housing 32 covering the machining area, adhering and remaining over time, contaminating the machining area.

[0033] In order to solve such problems, the dressing method of this embodiment uses the above-described dressing board 10A to carry out the dressing method described below periodically or at any timing.

[0034] (holding process) When carrying out the dressing method of this embodiment, a holding step is carried out in which the dress board 10A is held on the chuck table 37. More specifically, as shown in Fig. 5, the dress board 10A is supported on an annular frame F via adhesive tape T. Next, the dress board 10A is placed on the holding surface 371 of the chuck table 37 of the cutting device 30, and a suction means (not shown) is activated to generate negative pressure on the holding surface 371 to suck the dress board 10A, and the dress board 10A is held by a clamp 372 (the chuck table 37 and the clamp 372 are omitted from Fig. 5 for convenience of explanation).

[0035] (Dressing process) After the holding step has been carried out as described above, a dressing step is carried out in which the cutting blade 384 is dressed while the processing water L is supplied to the dress board 10A held on the chuck table 37.

[0036] FIG. 5 shows an enlarged view of the main components of the cutting means 38 and illustrates an embodiment of the dressing process. As shown, the cutting means 38 includes a spindle housing 382, ​​a spindle 383 rotatably supported by the spindle housing 382, ​​a cutting blade 384 with a cutting edge fixed to the tip of the spindle 383, and a blade cover 385 composed of multiple components to protect the cutting blade 384. A pair of processing water supply nozzles 386 (the opposite side is not visible) are arranged on the blade cover 385 adjacent to each other across the cutting blade 384. Processing water L is introduced through a pair of processing water inlets 385a arranged in the blade cover 385 and supplied from the processing water supply nozzles 386. A rotary drive source such as a motor (not shown) is housed at the other end of the spindle housing 382. The rotary drive source rotates the spindle 383, thereby rotating the cutting blade 384 in the direction indicated by arrow R1.

[0037] To perform the dressing process of this embodiment, the alignment means 39 captures an image of the dress board 10A, aligns a predetermined direction along one side of the dress board 10A with the X-axis direction, and aligns the cutting blade 384 with the intended cutting line. Next, the cutting blade 384, rotating at high speed (e.g., 20,000 rpm) in the direction indicated by arrow R1, is positioned on the intended cutting line aligned with the X-axis direction. While supplying processing water L through the processing water inlet 385a toward the dress board 10A, the cutting blade 384 cuts the surface of the dress board 10A to a depth of, e.g., 1 mm, and feeds the dress board 10A in the X-axis direction to form a dress groove 100. Furthermore, the cutting blade 384 of the cutting means 38 is indexed and fed in the Y-axis direction to a portion of the dress board 10A adjacent to the dress groove 100 but without a dress groove 100. The dress groove 100 is formed while supplying processing water L in the same manner as described above. By repeating these steps a predetermined number of times, clogging of the cutting blade 384 is eliminated, the dressing process is completed, and the dressing method of this embodiment is completed.

[0038] As described above, the inside of the dressing board 10A is impregnated with at least one of a surfactant and a rust inhibitor, and in the dressing process described above, cutting chips from the dressing board 10A generated when the cutting blade 384 cuts into the dressing board 10A and waste liquid containing at least one of the surfactant and the rust inhibitor are scattered into the processing area. As a result, when the workpiece held on the chuck table 37 is cut by the cutting blade 384, the cutting chips scattered and attached to the inside of the cover 321 covering the processing area and the inner wall of the housing 32 are washed away and washed away, and the inside of the cover 321 covering the processing area and the inner wall of the housing 32 are coated with at least one of the surfactant and the rust inhibitor contained in the waste liquid. In this way, by performing the dressing method of this embodiment periodically or at any timing, the processing area is coated with at least one of a surfactant and a rust inhibitor, making it difficult for processing debris generated when performing normal cutting processing on a workpiece to adhere, and eliminating the problem of processing debris generated when performing cutting processing scattering within the processing area and contaminating the processing area over time. The above-mentioned effects are not limited to when the above-mentioned dressing method is performed using the dressing board 10A, but it is also possible to perform the above-mentioned dressing method using the dressing board 10B, and the same effects as those described above can be obtained.

[0039] The dressing method of the present invention is not limited to dressing the cutting blade 384 of the cutting device 30 described above. For example, the same effect can be obtained when dressing the grinding wheel of a grinding device. With reference to Figure 6, a case where the dressing method of the present invention is applied to a grinding device will be described.

[0040] 6(a) shows a grinding apparatus 50 in which the dressing method using the dress board of this embodiment is carried out. The grinding apparatus 50 includes at least a chuck table 54 for holding a workpiece (e.g., a silicon wafer), grinding means 53 for grinding the back surface of the workpiece held on the chuck table 54, and feeding means 539 for feeding the grinding means 53 in the vertical direction for processing.

[0041] The chuck table 54 has a holding surface 54a that suction-holds the workpiece. The holding surface 54a is made of a porous material that has air permeability, and suction means (not shown) is connected to the chuck table 54. By operating the suction means, a negative pressure is generated on the holding surface 54a of the chuck table 54, making it possible to suction-hold the workpiece.

[0042] The chuck table 54 is configured to be rotatable by a rotary drive means (not shown), and is moved by a moving means (not shown) housed inside the device housing 51 to a loading / unloading position on the front side of the figure where the workpiece is loaded and unloaded, and to a grinding processing position directly below the grinding means 53 where grinding processing is performed.

[0043] The grinding means 53 includes at least a rotating shaft 532 rotatably supported by a rotating shaft housing 531, a wheel mount 533 disposed at the lower end of the rotating shaft 532, a grinding wheel 534 attached to the wheel mount 533 and having a plurality of grinding stones 535 disposed annularly on its underside, an electric motor 536 for rotating the rotating shaft 532, a support part 537 for supporting the grinding means 53, and a movable base 538 supported on the vertical wall part 52 of the device housing 51 so as to be movable up and down together with the support part 537. The feed means 539 converts the rotational motion of a pulse motor 539a into linear motion via a ball screw 539b rotated by the pulse motor 539a and transmits the linear motion to the movable base 538, thereby enabling the grinding means 53 to move to a desired position in the vertical direction.

[0044] Machining water L is supplied to the upper end 532a of the rotating shaft 532 from a grinding water supply source (not shown), and is supplied through the inside of the rotating shaft 532 to a position where the workpiece held on the chuck table 54 is machined by the grinding wheel 535. The grinding device 50 is equipped with control means (not shown), and the above-mentioned operating parts are controlled by control signals issued from the control means.

[0045] A cover 511 (shown by a two-dot chain line) is disposed in a processing area where a workpiece held on the chuck table 54 is ground by the grinding means 353. In the prior art, when a workpiece held on the chuck table 54 is ground by the grinding means 53 of the grinding device 50, processing water L is supplied from a processing water supply means (not shown) to an upper end 532a of the rotating shaft 532, and the processing water L is supplied via the rotating shaft 532 to a processing position where the workpiece held on the chuck table 54 is ground by the grinding stone 535 of the grinding means 53. As a result, the processing water L containing grinding debris is scattered around the processing area and remains attached over time to the cover 511 and the inner wall surface of the device housing 51 which covers the processing area, contaminating the processing area.

[0046] In order to solve the above-mentioned problems in the grinding apparatus 50, a dressing method using a dressing board 10B configured according to the present invention is carried out periodically or at any timing.

[0047] (holding process) When carrying out the dressing method of this embodiment, first, a holding step is carried out in which a dress board configured according to the present invention, for example, the dress board 10B, is held on the chuck table 54. In this embodiment, as shown in Fig. 6(b), an adhesive tape T is adhered to one surface of the dress board 10B, and the adhesive tape T side is placed on the chuck table 54 and held by suction.

[0048] (Dressing process) After the dress board 10B is held on the chuck table 54 by the above-described holding step, the rotation shaft 532 of the grinding means 53 is rotated in the direction indicated by arrow R2 in FIG. 6(b) at, for example, 6000 rpm, while the chuck table 54 is rotated in the direction indicated by arrow R3 at, for example, 300 rpm. Then, while supplying processing water L onto the dress board 10B using a processing water supply means (not shown), the grinding wheel 535 is brought into contact with the dress board 10B, and the grinding wheel 534 is ground and fed downward, as indicated by arrow R4, at a grinding feed rate of, for example, 1 μm / sec. By performing this type of dressing of the grinding wheel 535 for a predetermined time, clogging of the grinding wheel 535 is eliminated, completing the dressing step using the dress board 10B and the dressing method of this embodiment.

[0049] As described above, the interior of the dressing board 10B is impregnated with at least one of a surfactant and a rust inhibitor. By dressing the dressing board 10B by bringing the grinding wheel 535 into contact with the dressing board 10B during the dressing process, grinding chips from the dressing board 10B and waste liquid containing at least one of the surfactant and the rust inhibitor are dispersed into the processing area. This allows the grinding chips dispersed during grinding of the workpiece with the grinding wheel 535 and adhering to the inside of the cover 511 covering the processing area and the inner wall of the device housing 51 to be washed away and cleaned. Furthermore, the inside of the cover 511 covering the processing area and the inner wall of the device housing 51 are coated with at least one of the surfactant and the rust inhibitor. By coating the processing area with at least one of the surfactant and the rust inhibitor, grinding chips generated during normal grinding are less likely to adhere, eliminating the problem of grinding chips contaminating the processing area over time. The above-mentioned effects are not limited to the case where the above-mentioned dressing method is carried out using the dressing board 10B, but it is also possible to carry out the above-mentioned dressing method using the dressing board 10A, and the same effects as those described above can be obtained. When using a rectangular dressing board 10A, for example, the dressing board 10A can be attached to a circular plate. [Explanation of symbols]

[0050] 10a, 10b: Board 10A, 10B: Dress board 20: Immersion means 21: Container 22: Heater 24: Support member 30: Cutting equipment 32: Housing 321: Cover 33: Carrying in / out means 34: Cassette 35: Temporary table 36: Means of transport 37: Chuck table 371: Holding surface 372: Clamp 38:Cutting means 382: Spindle housing 383: Spindle 384: Cutting blade 385: Blade cover 385a: Processing water inlet 386: Processing water supply nozzle 39: Alignment means 40: Cleaning equipment 41: Cleaning transport means 50: Grinding equipment 51: Device housing 511: Cover 53: Grinding means 531: Rotating shaft housing 532: Rotation axis 533: Wheel mount 534: Grinding wheel 535: Grinding wheel 536: Electric motor 537: Support part 538;Mobile base 539:Transportation means 54: Chuck table 54a: Holding surface 100: Dress groove W: Solution

Claims

1. A dressing board for dressing a processing tool that cuts or grinds a workpiece, A dress board is a board made by kneading and sintering resin and abrasive grains and then impregnating it with at least one of a surfactant and a rust inhibitor.

2. A method for manufacturing a dress board, comprising the steps of kneading a resin and abrasive grains and sintering the kneaded resin and abrasive grains, impregnating the kneaded resin and a sintered board with at least one of a surfactant and a rust inhibitor, and manufacturing the dress board, an immersion step of immersing the board in a solution comprising at least one of a surfactant and a rust inhibitor; a simmering step in which the solution is heated and the board is simmered; and a cooling step of cooling the board while immersed in the solution, thereby impregnating the board with the solution.

3. A dressing method using a processing device including a chuck table that holds a workpiece, and processing means that processes the workpiece held on the chuck table with a processing tool while supplying processing water to the workpiece, comprising: a holding step of holding the dress board according to claim 1 on the chuck table; a dressing step of dressing the machining tool while supplying machining water to a dressing board held on the chuck table, The dressing method involves coating the processed area with at least one of a surfactant and a rust inhibitor using the waste liquid scattered during the dressing step.

4. The surfactant contains either a polyoxyalkylene glycol or an alkyl betaine, 2. The dress board according to claim 1, wherein the rust inhibitor comprises any one of polymerized phosphate, zinc salt, mercaptobenzothiazole, benzotriazole, and alkanolamine.

5. 2. The dressing board according to claim 1, wherein the processing tool is a cutting blade having a cutting edge on the outer periphery or a grinding wheel having grinding stones arranged in an annular shape.

Images