Thermal control device for electronic components

Abstract

To provide a thermal control device for thermally controlling an electronic component under severe conditions.SOLUTION: The thermal control device 100 includes an integrated circuit (IC) 104 and a heater film 108 disposed in thermal communication with the IC. The heater film is arranged to selectively heat the IC under relatively low temperature conditions or when a temperature associated with the IC reaches a threshold value. The thermal control device also includes a heat sink 128 disposed in thermal communication with the IC for dissipating heat generated by the IC under relatively high temperature conditions.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] Aspects of the present disclosure relate to a thermal control device for providing thermal control of an electronic component. [Background technology]

[0002]

[0002] Electronic components, such as integrated circuits (ICs) used in aerospace applications, can be exposed to harsh environments, with temperatures ranging from -40°C to over +85°C. Many commercially available ICs are designed for operation in the 0°C to +70°C range. Consequently, component selection for ICs exposed to temperatures below 0°C is somewhat limited, even for new technologies / applications. While some ICs can be screened to function in such extended temperature environments, this can increase costs and affect the reliability of such ICs. Furthermore, some existing solutions modify the environment around the IC, but such solutions are limited by space, power consumption, and IC package types. Therefore, improved solutions for thermally controlling electronic components in harsh conditions are needed. Summary of the Invention

[0003] The present disclosure provides, according to one aspect, a thermal control device that includes an integrated circuit (IC), a heater film disposed in thermal communication with the IC, the heater film configured to selectively heat the IC when a temperature associated with the IC reaches a threshold value, and a heat sink disposed in thermal communication with the IC for dissipating heat generated by the IC.

[0004]

[0004] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the thermal control device further includes a thermal pad positioned between the IC and the heater film, and the heater film is positioned directly on the thermal pad.

[0005]

[0005] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the thermal control device further includes a frame defining a cutout in which the heater film is positioned.

[0006]

[0006] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the thermal control device further includes a plurality of heat columns attached to a frame at a first end of each of the plurality of heat columns and attached to a base of a heat sink at a second end of each of the plurality of heat columns.

[0007]

[0007] In one aspect, in combination with any of the exemplary thermal control devices described above or below, at least a portion of the thermal pad directly contacts the frame.

[0008]

[0008] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the thermal control device further includes a printed circuit board (PCB), the IC being disposed on the PCB, and captive screws connecting the frame to the PCB.

[0009] In one aspect, in combination with any example thermal control device described above or below, the thermal control device further includes a sensor positioned to sense a temperature associated with the IC, a power source electrically coupled to the heater film, and one or more processors communicatively coupled to the sensor and the power source, the one or more processors configured to receive input from the sensor indicative of a temperature associated with the IC, and cause the power source to supply power to the heater film when the temperature associated with the IC reaches a threshold value.

[0010] In one aspect, in combination with any exemplary thermal control device described above or below, the power supplied to the heater membrane is varied according to a heating profile based at least in part on a temperature associated with the IC.

[0011] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the heater film is disposed directly on the base of the heat sink.

[0012]

[0012] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the heat sink has a plurality of pillars and the heater film defines a plurality of openings through which the plurality of pillars extend.

[0013]

[0013] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the base of the heat sink has mounting posts through which respective captive screws extend, connecting the heat sink to a printed circuit board.

[0014]

[0014] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the thermal control device further includes a heat sink thermal pad disposed on the heat sink, and an upper plate disposed on the heat sink thermal pad, the upper plate being in thermal communication with the remote heat sink.

[0015] In one aspect, in combination with any example thermal control device described above or below, the thermal control device further includes a second IC and a second thermal pad disposed on the second IC, where a heater film is disposed in thermal communication with the second IC, the heater film is disposed to selectively heat the IC and the second IC when a temperature associated with the IC, the second IC, or both, reaches a threshold value, and a heat sink is disposed in thermal communication with the second IC to dissipate heat generated by the second IC.

[0016]

[0016] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the thermal control device further includes a second IC, a second thermal pad disposed on the second IC, and a second heater film disposed in thermal communication with the second IC, the second heater film disposed to selectively heat the second IC when a temperature associated with the second IC reaches a threshold value, and the heat sink disposed in thermal communication with the second IC to dissipate heat generated by the second IC.

[0017]

[0017] According to another aspect, the present disclosure provides a thermal control device that includes a printed circuit board (PCB), an integrated circuit (IC), a thermal pad disposed on the IC, a frame that secures the IC and the thermal pad to the PCB, the frame defining a cutout and having a frame body and a heat column extending from the frame body, a heater film disposed on the IC and within the cutout, the heater film positioned to selectively heat the IC when a temperature associated with the IC reaches a threshold value, and a heat sink supported by the heat column and positioned in thermal communication with the IC for dissipating heat generated by the IC.

[0018] In one aspect, in combination with any example thermal control device described above or below, the thermal control device further includes a sensor positioned to sense a temperature associated with the IC, a power source electrically coupled to the heater film, and one or more processors communicatively coupled to the sensor and the power source, the one or more processors configured to receive input from the sensor indicative of a temperature associated with the IC, and cause the power source to supply power to the heater film when the temperature associated with the IC reaches a threshold value.

[0019]

[0019] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the one or more processors are further configured to cause the power source to stop supplying power to the heater membrane when the temperature associated with the IC reaches a deactivation threshold temperature.

[0020] According to yet another aspect, the present disclosure provides a thermal control device that includes an integrated circuit (IC), a heat sink disposed in thermal communication with the IC for dissipating heat generated by the IC, the heat sink having a base and a plurality of pillars extending from the base, and a heater film disposed on the base, the heater film defining a plurality of openings through which the plurality of pillars extend, the heater film being positioned to selectively heat the IC when a temperature associated with the IC reaches a threshold value.

[0021] In one aspect, in combination with any example thermal control device described above or below, the thermal control device further includes a sensor positioned to sense a temperature associated with the IC, a power source electrically coupled to the heater film, and one or more processors communicatively coupled to the sensor and the power source, the one or more processors configured to receive input from the sensor indicative of a temperature associated with the IC, and cause the power source to supply power to the heater film when the temperature associated with the IC reaches a threshold value.

[0022]

[0022] In one aspect, in combination with any of the exemplary thermal control devices described above or below, the one or more processors are further configured to cause the power source to stop supplying power to the heater membrane when the temperature associated with the IC reaches a deactivation threshold temperature.

[0023]

[0023] So that the above-described features of the present disclosure can be understood in detail, a more detailed description of the present disclosure than that briefly summarized above can be made by reference to several exemplary embodiments, some of which are illustrated in the accompanying drawings. [Brief explanation of the drawings]

[0024] [Figure 1A]

[0024] An exploded perspective view of a thermal control device according to one aspect of the present disclosure is shown. [Figure 1B]

[0025] 1B shows a side view of the thermal control device of FIG. 1A. [Figure 1C]

[0026] 1B shows an enlarged view of section C shown in FIG. 1B. [Figure 1D]

[0027] FIG. 1C shows a close-up view of an alternative arrangement of section C shown in FIG. 1B. [Figure 1E]

[0028] FIG. 2 shows a system diagram of a heater control system of the thermal control device of FIGS. 1A and 1B. [Figure 2A]

[0029] 1 shows a perspective exploded view of a thermal control device according to another aspect of the present disclosure. [Figure 2B]

[0030] 2B shows a side view of the thermal control device of FIG. 2A. [Figure 2C]

[0031] FIG. 3 shows a system diagram of a heater control system of the thermal control device of FIGS. 2A and 2B. [Figure 3]

[0032] 1 illustrates a thermal control device according to one aspect of the present disclosure. [Figure 4]

[0033] 1 illustrates a thermal control device according to one aspect of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0025]

[0034] The present disclosure relates to a thermal control device for providing thermal control of electronic components, such as integrated circuits (ICs), in extreme or harsh temperature environments, such as temperature environments ranging from −40° C. to greater than +85° C. The thermal control device disclosed herein may be particularly suitable for aerospace applications, such as for aircraft or spacecraft avionics.

[0026]

[0035] In one aspect, a thermal control device is disclosed. The thermal control device can provide a dual-purpose thermal solution for heating or cooling an electronic component, such as an IC, depending on the conditions. The thermal control device can include at least one IC, a heat sink, and an integrated thin-film smart heater. The heat sink can be used to cool the IC in a high-temperature environment. Meanwhile, the smart heater can be selectively activated to heat the IC in a low-temperature environment. The smart heater can be used to heat the IC, for example, to a temperature above the IC's minimum working temperature. The heater can be controlled based on feedback from sensors, and in some aspects, based on a heating profile. In this manner, the IC can meet qualification and performance requirements, such as those for aerospace applications.

[0027]

[0036] The thermal control device of the present disclosure may provide certain advantages, benefits, and / or technical effects. For example, the thermal control device of the present disclosure enables the use of commercial off-the-shelf (COTS) ICs for avionics applications, or aerospace applications in general. The thermal control provided by the thermal control device may eliminate or reduce the need for customized ICs capable of withstanding harsh conditions. Utilizing COTS ICs may broaden the range of component options for ICs in the aerospace domain. Thus, technological advances in ICs can be easily adapted to the aerospace domain as well as other harsh conditions domains. Furthermore, the smart heater of the thermal control device of the present disclosure can be controlled based on feedback from temperature sensors and a heating profile specific to the IC. This control scheme may result in space and power consumption savings. Furthermore, the smart heater can be integrated into the device as a thin film and placed in thermal communication with the IC, allowing the IC to be heated to meet specific time limit requirements, such as the startup time limit of an avionics IC. The thermal control device of the present disclosure may have other advantages, benefits, and / or technical effects in addition to those described hereinabove.

[0028]

[0037] 1A and 1B illustrate a thermal control device 100 according to an exemplary embodiment of the present disclosure. For reference, the thermal control device 100 may define a first direction X, a second direction Y, and a third direction Z, which are mutually orthogonal to each other.

[0029]

[0038] As shown, the thermal control device 100 may include a printed circuit board (PCB) or PCB 102 and electronic components disposed on the PCB 102. For example, the electronic components may be integrated circuits (ICs) or ICs 104. The ICs 104 may be, for example, application specific integrated circuits (ASICs), graphics processing units (GPUs), central processing units (CPUs), field programmable gate arrays (FPGAs), digital signal processors (DSPs), memory devices, etc. The thermal control device 100 may also include a thermal pad 106 disposed on the ICs 104. The thermal pad 106 may be formed of a thermal interface material (TIM). In some embodiments, the thermal pad 106 may be disposed directly on the ICs 104, for example, as shown in FIGS. 1A and 1B. In at least some embodiments, the area of ​​the thermal pad 106 is equal to or greater than the area of ​​the ICs 104. In this manner, the thermal pad 106 may be disposed on the ICs 104. This causes the thermal pad 106 to overhang the IC 104, for example, so that the thermal pad 106 overhangs each side of the IC 104.

[0030]

[0039] The thermal control device 100 may further include a thin-film smart heater or heater film 108. The heater film 108 may be disposed in thermal communication with the IC 104, thereby enabling the heater film 108 to heat the IC 104, for example, under relatively low temperature conditions. In some embodiments, the heater film 108 may be disposed on the thermal pad 106, for example, directly on the thermal pad 106, as shown in FIG. 1B.

[0031]

[0040] The thermal control device 100 may further include a frame 110 that secures the IC 104, the thermal pad 106, and the heater film 108 to the PCB 102 by way of captive screws. The frame 110 may be formed, for example, of copper or another thermally conductive material. The frame 110 may include a frame body 114 and mounting posts 116 that protrude from corners of the frame body 114 (either side corners, as shown in FIG. 1A ). The frame 110, or more specifically, the frame body 114, may define a notch 118. In the embodiment of FIGS. 1A and 1B , the notch 118 is rectangular, although other shapes are possible. The heater film 108 may be at least partially disposed within the notch 118, for example, as shown in FIG. 1B . The cutout 118 may be defined to have an area complementary to that of the heater film 108 (the heater film 108 has a slightly smaller XY area, allowing the heater film 108 to be received within the cutout 118). In at least some embodiments, the area of ​​the heater film 108 is smaller than that of the thermal pad 106. In this regard, as shown in FIG. 1C , a gap G unobstructed by the heater film 108 may be defined between the upper surface of the thermal pad 106 and the lower surface of the frame body 114. In other embodiments, as shown in FIG. 1D , stacked components may be positioned such that the lower surface of the frame body 114 contacts the upper surface of the thermal pad 106. This may create a direct thermal conduction path between the thermal pad 106 and the frame 110, which may be beneficial for cooling the IC 104. In FIG. 1D , the heater film 108 (shown in phantom lines) may be positioned within the cutout 118 ( FIG. 1A ). Thereby, its lower surface is flush with or at the same vertical height as the lower surface of the frame body 114 .

[0032]

[0041] 1A and 1B, the thermal control device 100 may also include electrically conductive columns, or heat columns 120. The heat columns 120 may be formed, for example, of copper or another thermally conductive material. The heat columns 120 have respective lower ends 122 and respective upper ends 124. The respective lower ends 122 of the heat columns 120 may be attached to an upper surface 126 of the frame 110, and the respective upper ends 124 of the heat columns 120 may be attached to a heat sink 128. The heat sink 128 is supported by the heat columns 120. The heat sink 128 is positioned in thermal communication with the IC 104 to dissipate heat generated by the IC 104, for example, under relatively high temperature conditions. The heat sink 128 may include a base 130 and a plurality of fins 132 extending from the base 130. The base 130 is disposed in an XY plane (having a thickness along the third direction Z) that is spaced apart from the XY plane in which the frame body 114 is disposed (the frame body 114 also has a thickness along the third direction Z). Thus, the base 130 and the frame body 114 are oriented parallel to and spaced apart from each other. An upper end 124 of each of the heat columns 120 may be attached to a lower surface of the base 130. In at least some embodiments, the heat column 120 may include a wick structure for transferring heat from the IC 104 to the heat sink 128. In at least some embodiments, the wick structure may be a screen mesh, a sintered metal powder layer, a grooved layer, or some combination thereof.

[0033]

[0042] In at least some embodiments, the heater film 108 may be a thin-film polyamide heater and may include circuitry that can be selectively activated to heat the IC 104, for example, under relatively low temperature conditions. The heater film 108 may be a commercial off-the-shelf (COTS) smart heater or may be a custom heater implemented with one or more sensing elements as part of a heater control system. An example is provided below.

[0034]

[0043] 1E shows one exemplary heater control system 134 for controlling the heater film 108, for example, under relatively low temperature conditions. The heater control system 134 may include a sensor 136 (or multiple sensors), a processor 138 (or multiple processors), a memory device 140 (e.g., one or more non-transitory memory devices), a power source 142, and the heater film 108. In some aspects, the processor 138 and the memory device 140 may be embodied within a computing device or controller. The computing device may have a communication interface to facilitate communication between the computing device and other devices, such as the sensor 136 and the power source 142. The sensor 136 is communicatively coupled to the processor 138, for example, by one or more wired or wireless communication links. The sensor 136 may be positioned to sense the temperature of the IC 104. The sensor 136 may be attached to, integrated into, or positioned proximate to the IC 104. The temperature of the IC 104 may thereby be sensed. The processor 138 may receive an input 144 from the sensor 136 that is indicative of the temperature of the IC 104 .

[0035]

[0044] The processor 138 receives an input 144, and based on the input 144, the processor 138 may determine the temperature of the IC 104. Based on the temperature of the IC 104, the heater film 108 may be selectively activated. For example, under relatively low temperature conditions, such as when the temperature of the IC 104 is at or below zero degrees Celsius (0°C), the processor 138 may control a power supply 142 electrically coupled to the heater film 108 to provide power to the heater film 108. In at least some aspects, when the temperature associated with the IC 104 reaches an activation threshold temperature 146 (e.g., zero degrees Celsius (0°C)), the processor 138 may send a command 148 (or multiple commands) to the power supply 142. In this regard, the processor 138 is communicatively coupled to the power supply 142, for example, by one or more wired or wireless communication links. Based on the command 148, a controllable device (e.g., a switch) of the power supply 142 may be controlled to direct power 150 to the heater film 108. Power 150 supplied to the heater film 108 may cause the heater film 108 to generate heat, for example, by passing a current through an electrical resistance element (e.g., a resistor) in the heater film 108. In this manner, the heater film 108 may heat the IC 104 under relatively low temperature conditions.

[0036]

[0045] In some aspects, the heater film 108 may be heated according to a heating profile 152 based on the temperature of the IC 104. A memory device 140 communicatively coupled to the processor 138 may store the heating profile 152 (or multiple heating profiles). The processor 138 may access the heating profile 152, and based at least in part on the temperature associated with the IC 104, the processor 138 may control the power source 142 such that the power 150 supplied to the heater film 108 is supplied according to the heating profile 152. In some instances, the power 150 supplied to the heater film 108 may be varied according to the heating profile 152. As one example, the power 150 supplied to the heater film 108 may be supplied at rated power until the temperature of the IC 104 falls within a predetermined range of the deactivation threshold temperature 154, at which point the power 150 supplied to the heater film 108 may be varied (e.g., ramped up or down) based on the temperature of the IC 104 according to a heating profile 152. Controlling the heat output of the heater film 108 according to the heating profile 152 may be beneficial, such as for power consumption purposes.

[0037]

[0046] In at least some embodiments, when the temperature of the IC 104 reaches the deactivation threshold temperature 154, the heater film 108 can be selectively deactivated, such that the IC 104 is no longer heated by the heater film 108. In some embodiments, the activation threshold temperature 146 can be the same as the deactivation threshold temperature 154. In other embodiments, the activation threshold temperature 146 can be different from the deactivation threshold temperature 154. In some other embodiments, the heater film 108 can be selectively activated, and after a predetermined heating time has elapsed, the heater film 108 can be selectively deactivated.

[0038]

[0047] 1B , under relatively high temperature conditions, such as when the temperature of the IC 104 is above zero degrees Celsius (0° C.), heat may be transferred from the IC 104 to the heat sink 128 along a thermal path. Specifically, during operation, the IC 104 generates heat. The generated heat may be transferred to the thermal pad 106. The thermal pad 106 may transfer heat, for example, through the heater film 108 to the frame 110 and / or directly to the frame 110. For example, heat may move from the thermal pad 106 to the frame 110 by convection through the gap G ( FIG. 1C ), or by both convection and conduction when the thermal pad 106 is in contact with the frame 110, as in FIG. 1D . Heat may also move from the thermal pad 106 to the heater film 108 (when deactivated) and then from the heater film 108 to the frame 110. Heat may travel through the frame body 114 of the frame 110 to the heat column 120. Heat may travel vertically upward through the heat column (which may be facilitated by an internal wick structure) and may reach the base 130 of the heat sink 128. Heat may spread from the base 130 to the fins 132. Thus, heat may be transferred from the IC 104 to the heat sink 128. In some aspects, an air moving device or fan (not shown) may be used to move air across the thermal control device 100, for example, under relatively high temperature conditions. The air moving device or fan may be deactivated, for example, under relatively low temperature conditions.

[0039]

[0048] 1B , the thermal control device 100 may include a heatsink thermal pad 156 and a top plate 158. The heatsink thermal pad 156 may be formed of a TIM and may be disposed on top of the fins 132. The top plate 158 may be disposed on top of the heatsink thermal pad 156. In such embodiments, heat may be transferred from the fins 132 to the heatsink thermal pad 156 and then to the top plate 158. The top plate 158 may be formed of a thermally conductive material and may then carry the heat further away from the IC 104, such as to a remote heat sink 160, which is schematically represented in FIG. 1B . The remote heat sink 160 may be, for example, the chassis or casing of the computing system, another heat sink with fins, or some other component.

[0040]

[0049] Thus, thermal control device 100 provides a dual-purpose thermal solution in the form of a heat sink with an integrated smart heater, allowing an electronic component or IC 104 to be cooled using the heat sink in high-temperature environments. The smart heater can be controlled to heat the electronic component above its minimum operating temperature in low-temperature environments. In this regard, thermal control device 100 may facilitate meeting qualification and performance requirements.

[0041]

[0050] 2A and 2B illustrate a thermal control device 200 according to an exemplary embodiment of the present disclosure. For reference, the thermal control device 200 may define a first direction X, a second direction Y, and a third direction Z, which are mutually orthogonal to each other.

[0042]

[0051] As shown in FIGS. 2A and 2B , the thermal control device 200 may include a PCB 202 and an electronic component disposed on the PCB 202. For example, the electronic component may be an IC 204. The IC 204 may be, for example, an ASIC, a memory device, or the like. The thermal control device 200 may also include a thermal pad 206 disposed on the IC 204. The thermal pad 206 may take the form of a thermal interface material (TIM). In some embodiments, the thermal pad 206 may be disposed directly on the IC 204, for example, as shown in FIGS. 2A and 2B . In at least some embodiments, the area of ​​the thermal pad 206 may be equal to the area of ​​the IC 204. In other embodiments, the area of ​​the thermal pad 206 may differ from the area of ​​the IC 204.

[0043]

[0052] The thermal control device 200 may further include a thin-film smart heater or heater film 208. The heater film 208 may be disposed in thermal communication with the IC 204, such that the heater film 208 can heat the IC 204, for example, under relatively low temperature conditions. In at least some embodiments, the heater film 208 may be a thin-film polyamide heater and may include circuitry that can be selectively activated to heat the IC 204, for example, under relatively low temperature conditions. The heater film 208 may be a commercial off-the-shelf (COTS) smart heater or a custom heater implemented with one or more sensing elements as part of a heater control system.

[0044]

[0053] The thermal control device 200 may also include a heat sink 210. The heat sink 210 is disposed in thermal communication with the IC 204 to dissipate heat generated by the IC 204, for example, under relatively high temperature conditions. The heat sink 210 may include a base 212 and a plurality of fins 214 extending from the base 212. The heat sink 210 may be stacked on the thermal pad 206 and the IC 204. In some embodiments, the lower surface of the base 212 may contact the upper surface of the thermal pad 206. Mounting posts 216 may protrude from corners of the base 212, such as from both corners as shown in FIGS. 2A and 2B. Captive screws 218 may be inserted through the mounting posts 216 to secure the heat sink 210 to the PCB 202. For example, pillars 214 extend from an upper surface 220 of the base 212 along the third direction Z. The pillars 214 have a rectangular cross-section when viewed along the third direction Z, but in other embodiments may have other cross-sectional shapes. The pillars 214 are arranged in rows and columns in an XY array, totaling twenty (20). However, the heat sink 210 may have more or fewer than twenty (20) pillars in other exemplary embodiments, and other arrangements of the pillars 214 are contemplated. In some embodiments, the pillars 214 may be hollow and have a wick structure embedded therein.

[0045]

[0054] The heater film 208 defines a plurality of openings 222. The openings 222 are complementary shaped to and sized to receive the pillars 214. In this manner, the openings 222 can be aligned with the pillars 214. The heater film 208 can be slid downward along the third direction Z so that the heater film 208 is disposed on or in contact with the top surface 220 of the base 212, for example, as shown in FIG. 2B . Thus, when the thermal control device 200 is assembled, the IC 204 is disposed on the PCB 202, the thermal pad 206 is disposed on the IC 204, the base 212 of the heat sink 210 is disposed on the thermal pad 206, and the heater film 208 is disposed on the base 212 of the heat sink 210.

[0046]

[0055] 2C illustrates one exemplary heater control system 234 for controlling the heater film 208, for example, under relatively low temperature conditions. The heater control system 234 may include a sensor 236 (or multiple sensors), a processor 238 (or multiple processors), a memory device 240 (e.g., one or more non-transitory memory devices), a power source 242, and the heater film 208. In some aspects, the processor 238 and the memory device 240 may be embodied within a computing device or controller. The computing device may have a communications interface to facilitate communications between the computing device and other devices, such as the sensor 236 and the power source 242. The sensor 236 is communicatively coupled to the processor 238, for example, by one or more wired or wireless communication links. The sensor 236 may be positioned to sense the temperature of the IC 204. The sensor 236 may be attached to, integrated into, or positioned proximate to the IC 204. The temperature of the IC 204 may thereby be sensed. The processor 238 may receive an input 244 from the sensor 236 that is indicative of the temperature of the IC 204 .

[0047]

[0056] The processor 238 receives an input 244, and based on the input 244, the processor 238 may determine the temperature of the IC 204. Based on the temperature of the IC 204, the heater film 208 may be selectively activated. For example, under relatively low temperature conditions, such as when the temperature of the IC 204 is at or below zero degrees Celsius (0°C), the processor 238 may control a power source 242 electrically coupled to the heater film 208 to provide power to the heater film 208. In at least some aspects, when the temperature associated with the IC 204 reaches an activation threshold temperature 246 (e.g., zero degrees Celsius (0°C)), the processor 238 may send a command 248 (or multiple commands) to the power source 242. In this regard, the processor 238 is communicatively coupled to the power source 242, for example, by one or more wired or wireless communication links. Based on the command 248, a controllable device (e.g., a switch) of the power source 242 may be controlled to direct power 250 to the heater film 208. Power 250 supplied to the heater film 208 may cause the heater film 208 to generate heat, for example, by passing an electric current through an electrical resistance element (e.g., a resistor) in the heater film 208. Thus, when the heater film 208 is selectively activated (e.g., under relatively low temperature conditions), a conductive thermal path may be defined between the heater film 208 and the IC 204, this thermal path extending through the base 212 and the thermal pad 206. Thus, heat generated by the heater film 208 may travel from the heater film 208 to the base 212, from the base 212 to the thermal pad 206, and from the thermal pad 206 to the IC 204. In this manner, the heater film 208 may heat the IC 204 under relatively low temperature conditions.

[0048]

[0057] In some aspects, the heater film 208 may be heated according to a heating profile 252 based on the temperature of the IC 204. A memory device 240 communicatively coupled to the processor 238 may store the heating profile 252 (or multiple heating profiles). The processor 238 may access the heating profile 252, and based at least in part on the temperature associated with the IC 240, the processor 238 may control the power source 242 such that the power 250 supplied to the heater film 208 is supplied according to the heating profile 252. In some instances, the power 250 supplied to the heater film 208 may be varied according to the heating profile 252. As one example, the power 250 supplied to the heater film 208 may be supplied at rated power until the temperature of the IC 204 falls within a predetermined range of the deactivation threshold temperature 254, at which point the power 250 supplied to the heater film 208 may be varied (e.g., ramped up or down) based on the temperature of the IC 204 according to a heating profile 252. Controlling the heat output of the heater film 208 according to the heating profile 252 may be beneficial, such as for power consumption purposes.

[0049]

[0058] In at least some embodiments, when the temperature of the IC 204 reaches the deactivation threshold temperature 254, the heater film 208 can be selectively deactivated, such that the IC 204 is no longer heated by the heater film 208. In some embodiments, the activation threshold temperature 246 can be the same as the deactivation threshold temperature 254. In other embodiments, the activation threshold temperature 246 can be different from the deactivation threshold temperature 254. In some other embodiments, the heater film 208 can be selectively activated, and after a predetermined heating time has elapsed, the heater film 208 can be selectively deactivated.

[0050]

[0059] 2B , under relatively high temperature conditions, such as when the temperature of the IC 204 is above zero degrees Celsius (0° C.), heat may be transferred from the IC 204 to the heat sink 210 along a thermal path. Specifically, when the heater film 208 is selectively deactivated or not activated (e.g., under relatively high temperature conditions), heat generated by the IC 204 may move from the IC 204 to the thermal pad 206, from the thermal pad 206 to the base 212 of the heat sink 210, and from the base 212 of the heat sink 210 to the heater film 208 and to the pillars 214. The heat may move vertically upward through the pillars 214. The pillars 214 may be formed of copper or another thermally conductive material. Thus, heat may be transferred from the IC 204 to the heat sink 210. In some aspects, an air moving device or fan (not shown) may be used to move air across the thermal control device 200, for example, under relatively high temperature conditions. The air moving device or fan may be deactivated, for example, under relatively cold conditions.

[0051]

[0060] In some exemplary embodiments, as shown in FIG. 2B , the thermal control device 200 may include a heatsink thermal pad 256 and a top plate 258. The heatsink thermal pad 256 may be formed of a TIM and may be disposed on top of the fins 214. The top plate 258 may be disposed on the heatsink thermal pad 256. In such embodiments, heat may be transferred from the pillars 214 to the heatsink thermal pad 256 and then to the top plate 258. The top plate 258 may be formed of a thermally conductive material and may then carry the heat further away from the IC 204, such as to a remote heat sink 260, which is schematically represented in FIG. 2B . The remote heat sink 260 may be, for example, the chassis or casing of the computing system, another heat sink, or some other component.

[0052]

[0061] Thus, thermal control device 200 provides a dual-purpose thermal solution in the form of a heat sink with an integrated smart heater, allowing an electronic component or IC 204 to be cooled using the heat sink in high-temperature environments. The smart heater can be controlled to heat the electronic component above its minimum operating temperature in low-temperature environments. In this regard, thermal control device 200 may facilitate meeting qualification and performance requirements.

[0053]

[0062] FIG. 3 illustrates a thermal control device 300 according to another exemplary embodiment of the present disclosure. The thermal control device 300 of FIG. 3 is arranged as a multi-chip module (MCM). Accordingly, the thermal control device 300 may include a PCB 302 and at least first and second electronic components disposed thereon. The first and second electronic components may be a first IC 304A and a second IC 304B. A first thermal pad 306A and a second thermal pad 306B may be disposed on the first IC 304A and the second IC 304B, respectively. In some embodiments, such as the embodiment of FIG. 3, the thermal control device 300 may include a thin-film smart heater, or heater film 308. The heater film 308 functions to heat both the first IC 304A and the second IC 304B, for example, under relatively low-temperature conditions. The heater film 308 can be disposed directly on the first thermal pad 306A and the second thermal pad 306B, for example, as shown in FIG. 3 . The heater film 308 can be disposed within a cutout defined by a frame 310. A heat column 320 can extend from the frame 310. A heat sink 328 can be disposed on the heat column 320. In other embodiments, the heater film 308 can be disposed on top of the base of a heat sink, for example, similar to the embodiment of FIGS. 2A and 2B . In that case, the heater film 208 is disposed on the base 212 of the heat sink 210. The heater film 308 can have a corresponding heater control system 334. This heater control system 334 can include similar components and function in a similar manner to the heater control systems 134, 234 described above.

[0054]

[0063] The heater film 308 of the thermal control device 300 can thus heat multiple chips, i.e., ICs 304A and 304B. In some embodiments, the heater control system 334 can include a temperature sensor at or near each one of the ICs 304A and 304B. The heater film 308 can be activated when the temperature of one of the ICs 304A and 304B is detected to be below the temperature activation threshold temperature. In some exemplary embodiments, the heater 308 can be activated when the average temperature at the ICs 304A and 304B is below the activation threshold temperature. In other exemplary embodiments, the heater film 308 can be activated only when the temperatures of both ICs 304A and 304B are below the activation threshold temperature. In further embodiments, the heater control system 334 can include a single temperature sensor at or near one of the ICs 304A and 304B. The heater film 308 can be activated when the temperature of the IC is detected to be below the activation threshold temperature. When the temperature at one, both, or the average temperature thereof reaches a deactivation threshold temperature, the heater membrane 308 can be deactivated.

[0055]

[0064] In some aspects, an air moving device or fan (not shown) can be used to move air across the temperature control device 300, for example, under relatively hot conditions. The air moving device or fan can be deactivated, for example, under relatively cold conditions.

[0056]

[0065] FIG. 4 illustrates a thermal control device 400 according to a further exemplary embodiment of the present disclosure. The thermal control device 400 of FIG. 4 is configured as an MCM. Accordingly, the thermal control device 400 may include a PCB 402 and at least first and second electronic components disposed thereon. The first and second electronic components may be a first IC 404A and a second IC 404B. A first thermal pad 406A and a second thermal pad 406B may be disposed on the first IC 404A and the second IC 404B, respectively. In some embodiments, such as the embodiment of FIG. 4, the thermal control device 400 may include at least two thin-film smart heaters, including a first heater film 408A and a second heater film 408B. The first heater 408A and the second heater 408B may be positioned and operative to heat the first IC 404A and the second IC 404B, respectively, under relatively low temperature conditions, for example. The first heater 408A and the second heater 408B may be disposed directly on the first thermal pad 406A and the second thermal pad 406B, as shown in FIG. 4, for example, or may be disposed on top of the base of a heat sink, as in the embodiment of FIGS. 2A and 2B. The first heater 408A and the second heater 408B may each have a heater control system. For example, the first heater film 408A may have a first heater control system 434A, and the second heater film 408B may have a second heater control system 434B. The first heater control system 434A and the second heater control system 434B may include similar components and function in a similar manner to the heater control systems 134 and 234 described above. Advantageously, having a heater in each one of the electronic components of the thermal control device 400 may enable the heater to heat those respective electronic components according to a heating profile specific to the electronic component.

[0057]

[0066] In some aspects, the heater control systems 434A, 434B for controlling the first heater 408A and the second heater 408B may share at least one component, such as a processor, a memory device, and / or a power supply. In this manner, the number of components in the thermal control device 400 may be reduced.

[0058]

[0067] In some aspects, an air moving device or fan (not shown) can be used to move air across the temperature control device 400, for example, under relatively hot conditions. The air moving device or fan can be deactivated, for example, under relatively cold conditions.

[0059]

[0068] In the present disclosure, reference is made to various embodiments. However, it should be understood that the disclosure is not limited to the particular described embodiments. Instead, any combination of the following features and elements, whether associated with various embodiments or not, is contemplated for implementing and practicing the teachings provided herein. Furthermore, when elements of an embodiment are described in the form of "at least one of A and B," it should be understood that embodiments including element A only, element B only, and elements A and B are each contemplated. Furthermore, while some embodiments may realize other potential solutions and / or advantages over the prior art, whether or not a particular advantage is realized by a given embodiment does not limit the disclosure. Accordingly, the embodiments, features, and advantages disclosed herein are merely exemplary and should not be considered elements of or limit the scope of the appended claim(s) unless expressly recited in the claim(s).

[0060]

[0069] As will be appreciated by one of ordinary skill in the art, aspects described herein may be embodied as a system, method, and / or computer program product. Accordingly, aspects may take the form of entirely hardware aspects, entirely software aspects (including firmware, resident software, microcode, etc.), or aspects combining software and hardware aspects, all of which may be broadly referred to herein as "circuits," "modules," or "systems." Furthermore, aspects described herein may take the form of a computer program product embodied in one or more computer-readable storage medium(s) having computer-readable program code embodied therein.

[0061]

[0070] The program code embodied in the computer readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, fiber optic cable, RF, etc., or any suitable combination thereof.

[0062]

[0071] Computer program code for carrying out operations of aspects of the present disclosure may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" programming language or similar programming languages. The program code may run entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet Service Provider).

[0063]

[0072] Aspects of the present disclosure are described herein with reference to flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to aspects of the present disclosure. It will be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general-purpose or special-purpose computer or other programmable data processing device to produce a machine. These instructions, executed via the processor of the computer or other programmable data processing device, thereby create means for performing the function(s) / acts identified in the block(s) of the flowcharts and / or block diagrams.

[0064]

[0073] These computer program instructions may also be stored on a computer-readable medium that may direct a computer, other programmable data processing apparatus, or other device to function in a particular manner. The instructions stored in the computer-readable medium thereby produce an article of manufacture. The instructions include instructions that implement the functions / acts identified in the flowchart and / or block diagram block(s).

[0065]

[0074] Computer program instructions may also be loaded into a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be executed on the computer, other programmable data processing apparatus, or other device to generate computer-implemented processes, whereby the instructions executed on the computer, other programmable data processing apparatus, or other device provide steps for performing the functions / acts identified in the flowchart and / or block diagram block(s).

[0066]

[0075] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various aspects of the present disclosure. As such, each block in the flowcharts and block diagrams may represent a module, segment, or portion of code, including one or more executable instructions for implementing specific logical function(s). In some alternative implementations, the functions shown in the blocks need not occur in the order depicted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially simultaneously, or the blocks may be executed in reverse or out of order, depending on the functionality involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a special-purpose hardware-based system that performs particular functions or functions, or by a combination of special-purpose hardware and computer instructions.

[0067]

[0076] While the foregoing is directed to aspects of the disclosure, other and further aspects of the disclosure may be devised without departing from the basic scope thereof, the scope of which is defined by the following claims.

Claims

1. A thermal control device (100, 200) comprising: Integrated circuits (ICs) (104, 204), a heater film (108, 208) disposed in thermal communication with the IC (104, 204), the heater film (108, 208) being configured to selectively heat the IC (104, 204) when a temperature associated with the IC (104, 204) reaches a threshold value (146, 246); and A thermal control device (100, 200) comprising a heat sink (128, 210) disposed in thermal communication with the IC (104, 204) for dissipating heat generated by the IC (104, 204).

2. 2. The thermal control device (100, 200) of claim 1, further comprising a thermal pad (106, 206) disposed between the IC (104, 204) and the heater film (108, 208), the heater film (108, 208) being disposed directly on the thermal pad (106, 206).

3. The thermal control device (100, 200) of claim 1, further comprising a frame (110) defining a notch (118) in which the heater film (108) is disposed.

4. 4. The thermal control device (100, 200) of claim 3, further comprising a plurality of heat columns (120) attached to the frame (110) at a first end (122) of each of the plurality of heat columns (120) and attached to a base (130) of the heat sink (128) at a second end (124) of each of the plurality of heat columns (120).

5. The thermal control device (100, 200) of claim 3, wherein at least a portion of the thermal pad (106) is in direct contact with the frame (110).

6. a printed circuit board (PCB) (102) on which the IC (104) is disposed; and The thermal control device (100, 200) of claim 3, further comprising captive screws (112) coupling the frame (110) to the PCB (102).

7. a sensor (136, 236) associated with the IC (104, 204) and positioned to sense the temperature; a power source (142, 242) electrically coupled to the heater membrane (108, 208); and one or more processors (138, 238) communicatively coupled to the sensor (136, 236) and the power source (142, 242), the one or more processors (138, 238) comprising: receiving an input (144, 244) from the sensor (136, 236) indicative of the temperature associated with the IC (104, 204); and 2. The thermal control device (100, 200) of claim 1, configured to: cause the power source (142, 242) to supply power to the heater film (108, 208) when the temperature associated with the IC (104, 204) reaches the threshold (146, 246).

8. 8. The thermal control device (100, 200) of claim 7, wherein the power supplied to the heater film (108, 208) is varied according to a heating profile (152, 252) based at least in part on the temperature associated with the IC (104, 204).

9. The thermal control device (100, 200) of claim 1, wherein the heater film (208) is disposed directly on a base (212) of the heat sink (210).

10. 10. The thermal control device of claim 9, wherein the heat sink has a plurality of pillars, and the heater film defines a plurality of openings through which the pillars extend.

11. 10. The thermal control device of claim 9, wherein the base of the heat sink includes mounting posts through which respective captive screws extend, the mounting posts coupling the heat sink to a printed circuit board.

12. a heat sink thermal pad (156, 256) disposed on the heat sink (128, 210); and 10. The thermal control device of claim 1, further comprising a top plate disposed on the heat sink thermal pad, the top plate being in thermal communication with a remote heat sink.

13. a second IC (304B), and a second thermal pad (306B) disposed on the second IC (304B); the heater film (108, 208) is disposed in thermal communication with the second IC (304B), the heater film (108, 208) is configured to selectively heat the IC (104, 204) and the second IC (304B) when a temperature associated with the IC (104, 204), the second IC (304B), or both, reaches a threshold value; 2. The thermal control device (100, 200) of claim 1, wherein the heat sink (128, 210) is positioned in thermal communication with the second IC (304B) to dissipate heat generated by the second IC (304B).

14. a second IC (404B); a second thermal pad (406B) disposed on the second IC (404B); and a second heater film (408B) disposed in thermal communication with the second IC (404B), the second heater film (408B) being configured to selectively heat the second IC (404B) when a temperature associated with the second IC (404B) reaches a threshold value; 2. The thermal control device (100, 200) of claim 1, wherein the heat sink (128, 210) is positioned in thermal communication with the second IC (404B) to dissipate heat generated by the second IC (404B).

15. A thermal control device (100), comprising: a printed circuit board (PCB) (102); Integrated circuit (IC) (104), a thermal pad (106) disposed on the IC (104); a frame (110) for fixing the IC (104) and the thermal pad (106) to the PCB (102), the frame (110) defining a notch (118) and having a frame body (114) and a heat column (120) extending from the frame body (114); a heater film (108) disposed on the IC (104) and within the notch (118), the heater film (108) configured to selectively heat the IC (104) when a temperature associated with the IC (104) reaches a threshold (146); and A thermal control device (100) comprising a heat sink (128) supported by the heat column (120) and arranged in thermal communication with the IC (104) for dissipating heat generated by the IC (104).

16. a sensor (136) associated with the IC (104) and positioned to sense the temperature; a power source (142) electrically coupled to the heater membrane (108); and one or more processors communicatively coupled to the sensor and the power source, the one or more processors being: receiving an input (144) from the sensor (136) indicative of the temperature associated with the IC (104); and 16. The thermal control device (100) of claim 15, configured to: cause the power source (142) to supply power to the heater film (108) when the temperature associated with the IC (104) reaches the threshold (146).

17. The one or more processors (138) 17. The temperature control device (100) of claim 16, further configured to cause the power source (142) to cease supplying power to the heater membrane (108) when the temperature associated with the IC (104, 204) reaches a deactivation threshold temperature (154).

18. A thermal control device (200), comprising: Integrated circuit (IC) (204), a heat sink (210) disposed in thermal communication with the IC (204) for dissipating heat generated by the IC (204), the heat sink (210) having a base (212) and a plurality of pillars (214) extending from the base (212); and 1. A thermal control device (200) comprising: a heater film (208) disposed on the base (212), the heater film (208) defining a plurality of openings (222) through which the plurality of pillars (214) extend, the heater film (208) being configured to selectively heat the IC (204) when a temperature associated with the IC (204) reaches a threshold (246).

19. a sensor (236) associated with the IC (204) and positioned to sense the temperature; a power source (242) electrically coupled to the heater membrane (208); and one or more processors communicatively coupled to the sensor and the power source, the one or more processors being configured to: receiving an input (244) from the sensor (236) indicative of the temperature associated with the IC (204); and 20. The thermal control device (200) of claim 18, configured to: cause the power source (242) to supply power to the heater film (208) when the temperature associated with the IC (204) reaches the threshold (244).

20. The one or more processors (238) 20. The temperature control device (200) of claim 19, further configured to cause the power source (242) to cease supplying power to the heater membrane (208) when the temperature associated with the IC (204) reaches a deactivation threshold temperature (254).

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