Board production procedure determining method, board production procedure determining program, recording medium, and board production procedure optimizing device

Abstract

To rationally measure the height of a measurement point of a substrate when producing a component-mounted substrate by sharing the mounting of a component on the substrate by a plurality of mounting work parts.SOLUTION: The target measurement point Ph whose height is to be measured by the mounting work units 1A, 3a, 3b, and 1C is selected from the plurality of measurement point Ph according to the conditions (the position of the assigned mounting point Pm) of the mounting work units 1A, 3a, 3b, and 1C (steps S202 to, measurement point selection processing). S208. That is, it is possible to select a reasonable target measurement point Ph according to the conditions of the mounting work units 1A, 3a, 3b, and 1C and measure the height with respect to the measurement point Ph.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] This invention relates to a technology for optimizing the procedure for producing component-mounted boards by transporting a board having multiple measurement points to multiple mounting work sections in sequence, and having each of the multiple mounting work sections measure the height of a predetermined point on the transported board and then mount components on the board. [Background technology]

[0002] In the component mounter of Patent Document 1, in order to properly mount components on a board, the height of each of multiple measurement points provided on the board is measured before the components are mounted on the board. However, with such component mounters, the time required to measure the height of the measurement points is an issue. Therefore, Patent Document 1 limits the number of measurement points by providing theoretical points between three or more measurement points and using theoretical values ​​of the theoretical points in addition to measured heights of the measurement points. This makes it possible to shorten the time required to measure the height of the measurement points. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] WO2014 / 033856 Summary of the Invention [Problem to be solved by the invention]

[0004] Furthermore, mounting components on a board can be divided among multiple mounting work sections (component mounters, component mounting tables) to produce a board with components mounted on it. In this case, it is necessary for each of the multiple mounting work sections to measure the height of the measurement points on the board. However, there are cases where it is not practical for each of the multiple mounting work sections to measure the height of each of the multiple measurement points.

[0005] The present invention has been made in consideration of the above-mentioned problems, and has as its object to enable rational measurement of the height of measurement points on a board when multiple mounting work units share the task of mounting components on a board to produce a board with components mounted on it. [Means for solving the problem]

[0006] The board production procedure determination method of the present invention is a board production procedure optimization method that optimizes a procedure for producing a component-mounted board by transporting a board having a plurality of measurement points to a plurality of mounting work units in sequence, having each of the plurality of mounting work units measure the height of the measurement points on the board that has been transported, and mounting components onto the board, and includes a step of executing, for each of the plurality of mounting work units, a measurement point selection process in which the mounting work unit selects, from the plurality of measurement points, a target measurement point whose height is to be measured, and in the measurement point selection process, the target measurement point is selected according to the conditions of the mounting work unit.

[0007] A board production procedure determination program according to the present invention causes a computer to execute the board production procedure determination method described above.

[0008] A recording medium according to the present invention records the above-described board production procedure determination program in a computer-readable manner.

[0009] The board production procedure optimization device of the present invention optimizes a procedure for producing a component-mounted board by transporting a board having a plurality of measurement points to a plurality of mounting work units in sequence, having each of the plurality of mounting work units measure the height of the measurement points on the board that has been transported, and mounting components onto the board.The device comprises a memory unit that stores the conditions of the mounting work unit for each of the plurality of mounting work units, and a calculation unit that executes a measurement point selection process for each of the plurality of mounting work units, in which the mounting work unit selects from the plurality of measurement points a target measurement point whose height is to be measured, and in the measurement point selection process, the target measurement point is selected in accordance with the conditions of the mounting work unit.

[0010] In the present invention configured as described above, the target measurement point at which the mounting work unit measures the height is selected from among multiple measurement points in accordance with the conditions of the mounting work unit (measurement point selection process). In other words, the mounting work unit can select a target measurement point that is reasonable in accordance with its conditions, and perform height measurement for that target measurement point. As a result, when multiple mounting work units share the task of mounting components on a board to produce a board with components mounted on it, it is possible to measure the height of the measurement points on the board in a reasonable manner.

[0011] The board production procedure determination method may also be configured such that the board has multiple mounting points, each of the multiple measurement points being located at a different position from the multiple mounting points, multiple mounting work units mounting components at different mounting points among the multiple mounting points to share the responsibility of mounting components at the multiple mounting points, the conditions including the positions of the assigned mounting points among the multiple mounting points for which the mounting work unit is responsible for mounting components, and the measurement point selection process selects a predetermined number of measurement points from the multiple measurement points that satisfy a predetermined positional relationship with the positions of the assigned mounting points as target measurement points. In this configuration, the target measurement points at which the mounting work unit measures height are selected from the multiple measurement units based on their positional relationship with the assigned mounting points for which the mounting work unit is responsible for mounting (measurement point selection process). Therefore, by limiting the number of measurement points whose height is measured by each of the multiple mounting work units, it is possible to avoid having each of the multiple mounting work units measure the height of each of the multiple measurement points on the board. As a result, when a plurality of mounting work units share the task of mounting components on a board to produce a board on which components are mounted, the effect on throughput of measuring the height of measurement points on the board can be reduced.

[0012] The board production procedure determination method may further include a step of executing a mounting point determination process to determine the mounting points assigned to each of multiple mounting work units, where the multiple mounting points include a first mounting point and a second mounting point different from the first mounting point. The measurement point selection process may determine whether the first mounting point and the second mounting point are assigned to the same mounting work unit among the multiple mounting work units based on a result of determining whether a predetermined number of measurement points that satisfy a positional relationship with the first mounting point overlap with a predetermined number of measurement points that satisfy a positional relationship with the second mounting point. This configuration avoids having two mounting work units each measure the measurement points that satisfy the predetermined positional relationship with the first mounting point and the second mounting point, thereby reducing the number of times measurement points are measured. As a result, when multiple mounting work units share the task of mounting components on a board to produce component-mounted boards, the impact of measuring the height of the measurement points on the board on throughput can be reduced.

[0013] Furthermore, the board production procedure determination method may be configured such that, when it is determined that a predetermined number of measurement points that satisfy a positional relationship with the first mounting point overlap with a predetermined number of measurement points that satisfy a positional relationship with the second mounting point, the measurement point selection process determines that the first mounting point and the second mounting point are to be assigned to the same mounting work unit among multiple mounting work units. This configuration can avoid having two mounting work units individually measure the measurement points that satisfy a predetermined positional relationship with the first mounting point and the second mounting point, thereby reducing the number of times that measurement of the measurement points is performed. As a result, when multiple mounting work units share the task of mounting components on a board to produce component-mounted boards, the impact of measuring the heights of the measurement points on the board on throughput can be reduced.

[0014] The board production procedure determination method may also be configured so that the multiple mounting work units include a first mounting work unit and a second mounting work unit different from the first mounting work unit, and in the measurement point selection process, when it is determined that a predetermined number of measurement points that satisfy a positional relationship with the first mounting point overlap with a predetermined number of measurement points that satisfy a positional relationship with the second mounting point, it is determined which is more efficient: a distributed allocation in which the first mounting point is the mounting point responsible for the first mounting work unit and the second mounting point is the mounting point responsible for the second mounting work unit, or a consolidated allocation in which the first mounting point and the second mounting point are the mounting points responsible for the first mounting work unit; when it is determined that distributed allocation is efficient, it is determined that the first mounting point is the mounting point responsible for the first mounting work unit and the second mounting point is the mounting point responsible for the second mounting work unit; and when it is determined that consolidated allocation is efficient, it is determined that the first mounting point and the second mounting point are the mounting points responsible for the first mounting work unit. With this configuration, it is possible to avoid having two mounting work units measure the measurement points that satisfy a predetermined positional relationship with the first mounting point and the second mounting point, thereby reducing the number of times measurements of the measurement points are performed.As a result, when multiple mounting work units share the task of mounting components on a board to produce component-mounted boards, it is possible to reduce the impact of measuring the heights of the measurement points on the board on throughput.

[0015] The board production procedure determination method may also be configured such that the conditions include a measurable range in which the mounting operation unit can perform height measurements, and the measurement point selection process selects, from among the multiple measurement points, measurement points within the measurable range as target measurement points. With this configuration, the target measurement points can be appropriately selected by limiting them to measurement points within the measurable range. [Effects of the Invention]

[0016] As described above, according to the present invention, when multiple mounting work units share the task of mounting components on a board to produce a board with components mounted on it, it is possible to rationally measure the height of measurement points on the board. [Brief explanation of the drawings]

[0017] [Figure 1A]FIG. 1 is a diagram schematically illustrating an example of a board production system that produces boards on which components are mounted. [Figure 1B] 1B is a diagram schematically showing an example of a board on which components are mounted by the board production system of FIG. 1A. FIG. [Figure 2] FIG. 2 is a diagram schematically showing a first example of a component mounter used in the board production system of FIG. 1A. [Figure 3A] FIG. 10 is a plan view schematically showing a configuration and part of an operation of another example of a component mounter. [Figure 3B] FIG. 10 is a plan view schematically showing a configuration and part of an operation of another example of a component mounter. [Figure 4] 3A and 3B. FIG. 4 is a flowchart showing an example of a measurement and mounting process executed by the component mounter of FIG. 2 or the mounting stage of FIGS. 3A and 3B. [Figure 5] 10 is a flowchart showing an example of an optimization process. [Figure 6] 6 is a flowchart showing an example of measurement point extraction executed in the optimization process of FIG. 5; [Figure 7A] FIG. 6 is a diagram illustrating an example of a calculation executed in the optimization process of FIG. 5. [Figure 7B] FIG. 6 is a diagram illustrating an example of a calculation executed in the optimization process of FIG. 5. [Figure 8] FIG. 2 is a diagram schematically showing the range of the entire board in which each mounting stage can measure the height. DETAILED DESCRIPTION OF THE INVENTION

[0018] FIG. 1A is a diagram schematically illustrating an example of a board production system that produces component-mounted boards, and FIG. 1B is a diagram schematically illustrating an example of a board on which components are mounted by the board production system of FIG. 1A. As shown in FIG. 1B, a plurality of mounting points Pm (lands) are arranged on board B, and a component C (FIG. 2) is mounted on each of the plurality of mounting points Pm. Furthermore, a plurality of measurement points Ph are arranged on board B. Each of the plurality of measurement points Ph is provided at a different position from each of the plurality of mounting points Pm. Note that the number and positions of the mounting points Pm and measurement points Ph are not limited to the example of FIG. 1B and can be changed as appropriate.

[0019] As shown in FIG. 1A, the board production system S includes a server computer 100. The server computer 100 includes a calculation unit 110 and a storage unit 120. The calculation unit 110 is configured with a processor such as a CPU (Central Processing Unit), and the storage unit 120 is configured with a storage device such as an SSD (Solid State Drive). The storage unit 120 stores an optimization program 121 that causes the calculation unit 110 to execute an optimization process (FIG. 5), which will be described later. The optimization program 121 is downloaded from, for example, an external server (recording medium) and stored in the storage unit 120.

[0020] Furthermore, the board production system S includes a plurality of (three) component mounters 1A, 1B, and 1C. The multiple component mounters 1A, 1B, and 1C share the task of mounting components C at multiple mounting points Pm on a single board B, thereby producing component-mounted boards. That is, the multiple component mounters 1A, 1B, and 1C are arranged in series in the X direction, which is the board transport direction, and the board B being transported in the X direction is carried in order into the multiple component mounters 1A, 1B, and 1C. Each of the multiple component mounters 1A, 1B, and 1C mounts a component at the mounting point Pm that it is responsible for, out of the multiple mounting points Pm on the carried-in board B.

[0021] Figure 2 is a diagram showing a first example of a component mounter used in the board production system of Figure 1 A. In this specification, the horizontal X direction, the horizontal Y direction perpendicular to the X direction, and the vertical Z direction are indicated as appropriate.

[0022] 2 includes a transport unit 21 that transports a board B in the X direction (board transport direction). This transport unit 21 has a pair of conveyors 211 arranged in parallel in the X direction, and transports the board B in the X direction by the conveyors 211. The spacing between these conveyors 211 is changeable in the Y direction (width direction) that is perpendicular to the X direction, and the transport unit 21 adjusts the spacing between these conveyors 211 according to the width of the board B being transported. This transport unit 21 transports the board B from the upstream side in the X direction, which is the board transport direction, to a predetermined work position L, and transports the board B, on which components C have been mounted at work position L, from work position L to the downstream side in the X direction.

[0023] This component mounter 2 is provided with a total of four component supply carts 22. Specifically, two component supply carts 22 are lined up in the X direction on each side of the transport unit 21 in the Y direction. On each component supply cart 22, multiple tape feeders 23 are lined up in the X direction, and multiple component supply reels are arranged corresponding to the multiple tape feeders 23. A component storage tape is wound around the component supply reel. This component storage tape has multiple pockets arranged in a row, and components C are stored in each pocket. Each tape feeder 23 has a component supply position 231 at its tip on the transport unit 21 side in the Y direction, and supplies components C in the component storage tape to the component supply position 231 by intermittently feeding the component storage tape pulled out from the component supply reel toward the transport unit 21.

[0024] The component mounter 2 is also provided with a pair of Y-axis rails 241 extending in the Y direction, a Y-axis ball screw 242 extending in the Y direction, a Y-axis motor 243 that rotates and drives the Y-axis ball screw 242, and an X-axis rail 244. The X-axis rail 244 is fixed to a nut of the Y-axis ball screw 242 while being supported by the pair of Y-axis rails 241 so as to be movable in the Y direction. An X-axis ball screw 245 extending in the X direction and an X-axis motor 246 that rotates and drives the X-axis ball screw 245 are attached to the X-axis rail 244. The component mounter 2 is provided with a head unit 25, and the head unit 25 is fixed to a nut of the X-axis ball screw 245 while being supported by the X-axis rail 244 so as to be movable in the X direction. Therefore, the Y-axis motor 243 can rotate the Y-axis ball screw 242 to move the head unit 25 in the Y direction, or the X-axis motor 246 can rotate the X-axis ball screw 245 to move the head unit 25 in the X direction.

[0025] 2, the head unit 25 is an inline type having multiple mounting heads 26 arranged linearly in the X direction. However, the specific configuration of the head unit 25 is not limited to the example in FIG. 2, and the head unit 25 may be a rotary type having multiple mounting heads 26 arranged circumferentially. Furthermore, the number of mounting heads 26 that the head unit 25 has is not limited to multiple, and may be a single mounting head.

[0026] A nozzle is detachably attached to the lower end of the mounting head 26, and the mounting head 26 picks up the component C using the nozzle. In this component mounter 2, the component C is mounted at the mounting point Pm on the board B. That is, the component mounter 2 moves the mounting head 26 using the X-axis motor 246 and the Y-axis motor 243, so that the nozzle of the mounting head 26 faces the component C supplied to the component supply position 231 from above. Next, the component mounter 2 lowers the nozzle so that the nozzle abuts against the upper surface of the component C supplied to the component supply position 231, and then the nozzle picks up the component C. Furthermore, the component mounter 2 raises the nozzle. In this way, the head unit 25 picks up the component C from the component supply position 231 using the nozzle of the mounting head 26. Next, the component mounter 2 moves the mounting head 26 using the X-axis motor 246 and the Y-axis motor 243, thereby causing the component C, which is picked up by the nozzle of the mounting head 26, to face the mounting point Pm on the board B from above. Furthermore, the component mounter 2 lowers the nozzle to place the component C on the mounting point Pm on the board B. In this way, the component C is mounted on the mounting point Pm.

[0027] The component mounter 2 also includes a distance sensor 27 attached to the head unit 25. This distance sensor 27 moves in the X and Y directions integrally with the head unit 25. The distance sensor 27 faces the board B from above and measures the distance to the board B, i.e., the height of the board B.

[0028] In particular, the distance sensor 27 is used to measure the height of the measurement point Ph of the board B supported at the work position L by the transport unit 21. That is, the component mounter 2 adjusts the position (XY coordinates) of the distance sensor 27 using the X-axis motor 246 and the Y-axis motor 243, thereby positioning the distance sensor 27 at the position (XY coordinates) of the mounting point Pm. As a result, the distance sensor 27 faces the mounting point Pm from above. The distance sensor 27 then measures the height of the opposing mounting point Pm. The height of the mounting point Pm measured by the distance sensor 27 in this way is used to obtain the shape of the board B.

[0029] Of the multiple component mounters 1A, 1B, and 1C, the component mounter 1A located most upstream in the X direction and the component mounter 1C located most downstream in the X direction have the same configuration as the component mounter 2 shown in Fig. 2. On the other hand, the component mounter 1B located between the component mounters 1A and 1C in the X direction has a configuration shown in Fig. 3A and 3B that differs from the component mounter 2 in Fig. 2. Here, Fig. 3A and Fig. 3B are plan views that schematically show part of the configuration and operation of another example of a component mounter.

[0030] Specifically, the mounter 1B is provided with a transport unit 31 capable of transporting two boards B to two work positions La and Lb, instead of the transport unit 21. Furthermore, the mounter 1B is provided with two head units 25a and 25b corresponding to the two work positions La and Lb, respectively.

[0031] The transport unit 31 includes transport units 32, 33, 34, and 35 arranged in series in the X direction. Each of the transport units 32, 33, 34, and 35 is composed of a pair of conveyors arranged in parallel in the X direction, and transports the substrate B in the X direction by the pair of conveyors. In particular, the transport unit 34 is movable in the Y direction between a transport position Lc (FIG. 3A) between the transport units 33 and 35 and an operation position Lb (FIG. 3B) offset from the transport position Lc in the Y direction. When the transport unit 34 is located at the transport position Lc, it is aligned in series with the transport units 33 and 35 in the X direction, and can receive the substrate B from the transport unit 33 and deliver the substrate B to the transport unit 35.

[0032] The transport unit 32 delivers the board B received from the upstream side in the X direction to the transport unit 33. The transport unit 33 holds the board B received from the transport unit 32 at the work position La, and the head unit 25a mounts the component C on the board B held at the work position La. At this time, the head unit 25a mounts the component C supplied by the tape feeder 23 supported by the component supply cart 22 closer to the work position La (the lower component supply cart 22 in FIG. 2) out of the component supply carts 22 provided on both sides in the Y direction, onto the board B at the work position La.

[0033] When mounting of components C on board B held at work position La is completed, transport unit 33 hands over board B to transport unit 34 located at transfer position Lc. After receiving board B from transport unit 33, transport unit 34 moves from transfer position Lc to work position Lb and holds board B at work position Lb. Then, head unit 25b mounts components C on board B held at work position Lb. Head unit 25b mounts components C supplied by tape feeder 23 supported on component supply cart 22 closer to work position Lb (upper component supply cart 22 in FIG. 2) of component supply carts 22 provided on both sides in the Y direction, onto board B at work position Lb. When mounting of components C on board B held at work position Lb is completed, transport unit 34 moves from work position Lb to transfer position Lc and hands over board B to transport unit 35.

[0034] That is, component mounter 1B has mounting stage 3a configured with transport section 33 and head unit 25a, and mounting stage 3b configured with transport section 34 and head unit 25b. Mounting stage 3a mounts components C on board B with head unit 25a while holding board B at work position La with transport section 33. Mounting stage 3b mounts components C on board B with head unit 25b while holding board B at work position Lb with transport section 34.

[0035] As described above, board production system S is equipped with multiple mounting work units 1A, 3a, 3b, 1C (component mounter 1A, mounting stages 3a, 3b, and component mounter 1C), each of which carries in a board B and mounts components C on the board B. Boards B are carried in turn into the multiple mounting work units 1A, 3a, 3b, 1C, and the multiple mounting work units 1A, 3a, 3b, 1C mount components C at different mounting points Pm. In this way, the multiple mounting work units 1A, 3a, 3b, 1C share the task of mounting components C at the multiple mounting points Pm on board B.

[0036] Fig. 4 is a flowchart showing an example of measurement and mounting processing executed by the component mounter of Fig. 2 or the mounting stage of Figs. 3A and 3B. In step S101, board B is carried into work position L, LaLb. Specifically, in the component mounter 2 of Fig. 2, the transport unit 21 carries board B into work position L, in the mounting stage 3a of Fig. 3, the transport unit 33 carries board B into work position La, and in the mounting stage 3b of Fig. 3, the transport unit 34 carries board B into work position Lb.

[0037] In step S102, the height of a measurement point Ph on the board B is measured. Specifically, in the component mounter 2 of FIG. 2, the distance sensor 27 faces the measurement point Ph from above and measures the height of the measurement point Ph. This height measurement is performed for each measurement point Ph whose height needs to be measured in order to mount a component C on a mounting point Pm that the component mounter 2 is responsible for. In the mounting stage 3a of FIG. 3, the distance sensor 27 attached to the head unit 25a faces the measurement point Ph from above and measures the height of the measurement point Ph. This height measurement is performed for each measurement point Ph whose height needs to be measured in order to mount a component C on a mounting point Pm that the mounting stage 3a is responsible for. In the mounting stage 3b of FIG. 3, the distance sensor 27 attached to the head unit 25b faces the measurement point Ph from above and measures the height of the measurement point Ph. This height measurement is performed for each measurement point Ph whose height needs to be measured in order to mount a component C on a mounting point Pm that the mounting stage 3b is responsible for. The measurement point Ph, whose height needs to be measured in order to mount the component C at the mounting point Pm, is the measurement point Ph selected for the mounting point Pm in the measurement point extraction process (FIG. 6) described below.

[0038] In step S103, components C are mounted on mounting points Pm on board B. Specifically, in component mounter 2 of FIG. 2, head unit 25 mounts components C on each mounting point Pm that is handled by that component mounter 2. At this time, the height of component C for mounting component C on mounting point Pm is adjusted based on the height of mounting point Pm obtained from the measurement results of the height of measurement point Ph on board B carried into work position L. At mounting stage 3a of FIG. 3B, head unit 25a mounts components C on each mounting point Pm that is handled by that mounting stage 3a. At this time, the height of component C for mounting component C on mounting point Pm is adjusted based on the height of mounting point Pm obtained from the measurement results of the height of measurement point Ph on board B carried into work position La. At mounting stage 3b of FIG. 3B, head unit 25b mounts components C on each mounting point Pm that is handled by that mounting stage 3b. At this time, the height of component C for mounting component C at mounting point Pm is adjusted based on the height of mounting point Pm obtained from the measurement results of the height of measurement point Ph of board B brought into work position Lb.

[0039] In step S104, the board B is carried out from the work positions L, La, and Lb. Specifically, in the component mounter 2 of Fig. 2, the transport unit 21 carries out the board B from the work position L, in the mounting stage 3a of Fig. 3, the transport unit 33 carries out the board B from the work position La, and in the mounting stage 3b of Fig. 3, the transport unit 34 carries out the board B from the work position Lb.

[0040] In this way, each of the component mounters 1A, 1B's mounting stages 3a and 3b, and 1C executes a measurement and mounting process in which the height of the measurement point Ph on the board B is measured and then the component C is mounted at the mounting point Pm on the board B. In response to this, the server computer 100 executes an optimization process (FIG. 5) that optimizes the procedure executed in the measurement and mounting process.

[0041] Fig. 5 is a flowchart showing an example of optimization processing, Fig. 6 is a flowchart showing an example of measurement point extraction executed in the optimization processing of Fig. 5, and Figs. 7A and 7B are diagrams schematically showing an example of calculation executed in the optimization processing of Fig. 5. The optimization processing of Fig. 5 is defined by optimization program 121 and is executed by calculation unit 110 in accordance with optimization program 121.

[0042] In step S201, the calculation unit 110 confirms, among the multiple mounting points Pm on the board B, the mounting points Pm (responsible mounting points) for which the component mounter 1A, the mounting stages 3a and 3b of the component mounter 1B, and the component mounter 1C are responsible for mounting the component C. Specifically, information (board data) indicating the mounting points Pm for which the component mounter 1A, the mounting stages 3a and 3b of the component mounter 1B, and the component mounter 1C are responsible is stored in the storage unit 120, and the calculation unit 110 performs the confirmation in step S201 based on this board data.

[0043] In step S202, the calculation unit 110 extracts target measurement points Ph that need to be measured in order to mount a component C on a mounting point Pm from among the multiple measurement points Ph (FIG. 6). Here, the target measurement points Ph that need to be measured in order to mount a component C on a mounting point Pm are measurement points Ph whose height measurement results are used to calculate the height of the mounting point Pm.

[0044] 6, count values ​​M (M=1, 2, 3, 4) for identifying component mounter 1A, mounting stages 3a and 3b of component mounter 1B, and component mounter 1C are reset to zero. For example, count value M=1 indicates component mounter 1A, count value M=2 indicates mounting stage 3a of component mounter 1B, count value M=3 indicates mounting stage 3b of component mounter 1B, and count value M=4 indicates component mounter 1C.

[0045] In step S302, the count value M is incremented by 1 to become 1. In step S303, the count value N for identifying the mounting point Pm for which the component mounter 1A indicated by the count value M (= 1) is responsible for mounting the component C is reset to zero, and in step S304, the count value N is incremented by 1. Then, the calculation unit 110 selects, from among the multiple measurement points Ph on the board B, the three measurement points Ph (target measurement points Ph) that are closest to the mounting point Pm indicated by the count value N. Here, the three measurement points Ph closest to the mounting point Pm are the first to third measurement points Ph among the multiple measurement points Ph in order of closestness to the mounting point Pm. In this way, three target measurement points Ph are selected for the mounting point Pm of the count value N. In step S306, it is determined whether the count value N has reached the maximum value Nx. Here, the maximum value Nx is the number of mounting points Pm at which the component mounter 1A indicated by the count value M (= 1) is responsible for mounting the component C. By repeating steps S304 to S305 until the count value N reaches the maximum value Nx, three target measurement points Ph are selected for each mounting point Pm at which the component mounter 1A indicated by the count value M (= 1) is responsible for mounting the component C.

[0046] When the count value N reaches the maximum value Nx, it is determined whether the count value M has reached the maximum value Mx (step S307). The maximum value Mx is the number (=4) of mounting work units (i.e., component mounter 1A, mounting stages 3a and 3b of component mounter 1B, and component mounter 1C) that perform the measurement and mounting process. Steps S302 to S306 are repeated until count value M reaches the maximum value Mx. As a result, three target measurement points Ph are selected for each mounting point Pm where component C is mounted by mounting stage 3a of component mounter 1B, indicated by count value M (=2). Furthermore, three target measurement points Ph are selected for each mounting point Pm where component C is mounted by mounting stage 3b of component mounter 1B, indicated by count value M (=3). Furthermore, three target measurement points Ph are selected for each mounting point Pm where component C is mounted by component mounter 1C, indicated by count value M (=4).

[0047] When the count value M reaches the maximum value Mx, it is determined whether or not there is an overlap of the measurement points Ph in step S203 of Fig. 5. If it is determined that there is an overlap of the measurement points Ph ("YES" in step S203), step S204 is executed.

[0048] In the example of Fig. 7A, the measurement points Ph selected for the mounting point Pm1A handled by the mounter 1A overlap with the measurement points Ph selected for the mounting point Pm3b handled by the mounting stage 3b of the mounter 1B. In Fig. 7A, the unhatched white mounting point Pm1A is the mounting point Pm handled by the mounter 1A, and the hatched mounting point Pm3b is the mounting point Pm handled by the mounting stage 3b of the mounter 1B. In other words, the mounting points Pm1A and the mounting point Pm3b are included inside a triangle with the three common measurement points Ph as vertices, and the three measurement points Ph closest to the mounting point Pm1A coincide with the three measurement points Ph closest to the mounting point Pm3b. In this case, the heights of the three measurement points Ph, which were measured in order to mount component C at mounting point Pm1A in component mounter 1A, are also measured in order to mount component C at mounting point Pm3b in component mounter 1B. In other words, the heights of the same three measurement points Ph are measured twice.

[0049] Therefore, in step S204, the assigned mounting points are temporarily switched as follows. In the example of Fig. 7A, there are multiple pairs of mounting points Pm1A and Pm3b whose selected measurement points Ph overlap each other. Therefore, for some (e.g., half) of the multiple pairs, the person responsible for mounting point Pm1A is temporarily switched from component mounter 1A to mounting stage 3b of component mounter 1B, and for another portion (e.g., half) of the pairs, the person responsible for mounting point Pm1A is temporarily switched from mounting stage 3b of component mounter 1B to component mounter 1A. As a result, as shown in Fig. 7B, the overlap of measurement points Ph, such as height measurements being performed for the same measurement points Ph on component mounter 1A and mounting stage 3b of component mounter 1B, is eliminated.

[0050] In step S205, the calculation unit 110 estimates the time required to execute the measurement and mounting process (FIG. 4) in the state of FIG. 7A before the assigned mounting points Pm are swapped (pre-replacement time), and the time required to execute the measurement and mounting process (FIG. 4) in the state of FIG. 7B after the assigned mounting points Pm are swapped (post-replacement time). Then, if it is determined that the post-replacement time is less than the pre-replacement time and that swapping the assigned mounting points Pm will reduce the time required for the measurement and mounting process (YES in step S206), the calculation unit 110 adopts the swapping of the assigned mounting points Pm (step S207). As a result, the assigned mounting points Pm of each of the mounting stages 3a of the component mounters 1A and 1B are set as shown in FIG. 7B. On the other hand, if it is determined that the post-replacement time is equal to or greater than the pre-replacement time and that the time required for the measurement mounting process will not be shortened by switching the assigned mounting points Pm (step S206: NO), the calculation unit 110 discards the switching of the assigned mounting points Pm (step S208). As a result, the assigned mounting points Pm of the mounting stages 3a of the component mounters 1A and 1B are set as shown in Fig. 7A.

[0051] In the embodiment described above, the target measurement point Ph at which the mounting work unit 1A, 3a, 3b, or 1C measures the height is selected from among multiple measurement points Ph according to the conditions (the position of the assigned mounting point Pm) of the mounting work unit 1A, 3a, 3b, or 1C (steps S202 to S208, measurement point selection process). That is, the mounting work unit 1A, 3a, 3b, or 1C can select a target measurement point Ph that is appropriate for the conditions, and measure the height of that measurement point Ph. As a result, when the multiple mounting work units 1A, 3a, 3b, or 1C share the task of mounting components C on a board B to produce a component-mounted board, it is possible to rationally measure the height of the measurement point Ph on the board B.

[0052] Furthermore, the board B has a plurality of mounting points Pm, and each of the plurality of measurement points Ph is provided at a different position from each of the plurality of mounting points Pm. In response to this, the plurality of mounting work units 1A, 3a, 3b, and 1C share the responsibility of mounting components C at the plurality of mounting points Pm by mounting components C at mutually different mounting points Pm among the plurality of mounting points Pm. The conditions for selecting the measurement points Ph include the positions of the assigned mounting points Pm at which the mounting work units 1A, 3a, 3b, and 1C are responsible for mounting components C among the plurality of mounting points Pm. In other words, in the optimization process (measurement point selection process), three (a predetermined number) of measurement points Ph that satisfy a predetermined positional relationship (the three closest points) with the position of the assigned mounting point Pm are selected as target measurement points Ph. In this configuration, the target measurement points Ph at which the mounting work units 1A, 3a, 3b, and 1C measure heights are selected from among the multiple measurement points Ph in accordance with their positional relationship with the assigned mounting points Pm for which the mounting work units 1A, 3a, 3b, and 1C are responsible (measurement point selection process). Therefore, by limiting the number of measurement points Ph at which heights are measured by each of the multiple mounting work units 1A, 3a, 3b, and 1C, it is possible to avoid the heights of each of the multiple measurement points Ph on the board B being measured by each of the multiple mounting work units 1A, 3a, 3b, and 1C. As a result, when the multiple mounting work units 1A, 3a, 3b, and 1C share the task of mounting components C on the board B to produce component-mounted boards, it is possible to reduce the impact on throughput of measuring the heights of the measurement points Ph on the board B.

[0053] Furthermore, steps S203 to S208 (mounting point determination processing) are provided in which a mounting point Pm assigned to each of the multiple mounting work units 1A, 3a, 3b, and 1C is determined. The multiple mounting points Pm include a mounting point Pm1A (first mounting point) and a mounting point Pm3b (second mounting point) different from the mounting point Pm1A. In response to this, steps S203 to S208 (measurement point selection processing) determine whether the three measurement points Ph closest to mounting point Pm1A overlap with the three measurement points Ph closest to mounting point Pm3b (step S203), and then determine whether mounting point Pm1A and mounting point Pm3b are assigned to the same mounting work unit 1A or 3b among the multiple mounting work units 1A, 3a, 3b, and 1C (steps S204 to S208). With this configuration, it is possible to avoid having the two mounting work units 1A, 3b measure the three measurement points Ph closest to mounting point Pm1A and mounting point Pm3b, thereby reducing the number of times that measurement of measurement point Ph is performed. As a result, when multiple mounting work units 1A, 3a, 3b, and 1C share the task of mounting components C on board B to produce component-mounted boards, it is possible to reduce the impact that measuring the height of measurement point Ph on board B has on throughput.

[0054] Furthermore, the multiple mounting work units 1A, 3a, 3b, and 1C include a mounter 1A (first mounting work unit) and a mounting stage 3b (second mounting work unit) different from the mounter 1A. When the calculation unit 110 determines that the three measurement points Ph closest to the mounting point Pm1A overlap with the three measurement points Ph closest to the mounting point Pm3b, it determines whether distributed allocation (step S208) or consolidated allocation (step S207) is more efficient (steps S205 to S206). Here, distributed allocation refers to the process of designating the mounting point Pm1A as the mounting point Pm of the component mounter 1A and the mounting point Pm3b as the mounting point Pm of the mounting stage 3b for the mounting points Pm1A and Pm3b whose corresponding measurement points Ph overlap. On the other hand, intensive allocation is a method in which, for mounting point Pm1A and mounting point Pm3b whose corresponding measurement points Ph overlap, mounting point Pm1A and mounting point Pm3b are assigned as the mounting points Pm of the same component mounter 1A (or mounting stage 3b). In this example, the measurement points Ph corresponding to mounting point Pm are the three measurement points Ph closest to mounting point Pm. Then, if it is determined that distributed allocation is efficient ("NO" in step S206), for mounting point Pm1A and mounting point Pm3b whose corresponding measurement points Ph overlap, mounting point Pm1A is assigned as the mounting point Pm of the component mounter 1A, and mounting point Pm3b is assigned as the mounting point Pm of the mounting stage 3b (step S208). On the other hand, if it is determined that the aggregated allocation is efficient ("YES" in step S206), for mounting points Pm1A and Pm3b whose corresponding measurement points Ph overlap, it is determined that mounting points Pm1A and Pm3b are to be assigned as mounting points Pm to the same component mounter 1A (or mounting stage 3b) (step S207). With this configuration, it is possible to avoid having the two mounting work units 1A and 3b measure the three measurement points Ph closest to mounting points Pm1A and Pm3b, respectively, thereby reducing the number of times that measurement of measurement point Ph is performed. As a result, when multiple mounting work units 1A, 3a, 3b, and 1C share the task of mounting components C on board B to produce component-mounted boards, it is possible to reduce the impact on throughput of measuring the height of measurement points Ph on board B.

[0055] As explained above, in this embodiment, measurement point Ph corresponds to an example of a "measurement point" of the present invention, board B corresponds to an example of a "board" of the present invention, mounting work units 1A, 3a, 3b, and 1C correspond to an example of "multiple mounting work units" of the present invention, mounting point Pm corresponds to an example of a "mounting point" of the present invention, optimization program 121 corresponds to an example of a "board production procedure determination program" of the present invention, server computer 100 corresponds to an example of a "computer" or "board production procedure optimization device" of the present invention, memory unit 120 corresponds to an example of a "recording medium" or "memory unit" of the present invention, and calculation unit 110 corresponds to an example of a calculation unit of the present invention.

[0056] 5, steps S204 to S206 and S208 may be omitted, and if it is determined in step S203 that there is an overlap of measurement points Ph (YES), the mounting points Pm may be swapped in step S207. In this modification, when the calculation unit 110 determines that the three measurement points Ph closest to mounting point Pm1A overlap with the three measurement points Ph closest to mounting point Pm3b, it determines that mounting point Pm1A and mounting point Pm3b, which correspond to the overlapping measurement points Ph, are to be the mounting points Pm assigned to the same component mounter 1A (or mounting stage 3b). With this configuration, it is possible to avoid having the two mounting work units 1A, 3b measure the three measurement points Ph closest to mounting point Pm1A and mounting point Pm3b, thereby reducing the number of times that measurement of measurement point Ph is performed. As a result, when multiple mounting work units 1A, 3a, 3b, and 1C share the task of mounting components C on board B to produce component-mounted boards, it is possible to reduce the impact that measuring the height of measurement point Ph on board B has on throughput.

[0057] Alternatively, in step S305 of extracting measurement points in FIG. 6 , the range for selecting the three closest points may be limited to a portion of board B rather than the entire board B. FIG. 8 is a diagram schematically illustrating the range of the entire board in which each mounting stage can measure height. That is, the mounters 1A and 1C can measure the height of any point on the entire board B using the distance sensor 27. In contrast, the mounting stage 3a of the mounter 1B cannot measure the height of a point within the end I3a on one side of the board B in the X direction (the right side in FIG. 8 ) using the distance sensor 27. This is because the distance sensor 27 is provided on the other side of the head unit 25a in the X direction (the left side in FIG. 8 ). Furthermore, the mounting stage 3b of the mounter 1B cannot measure the height of a point within the end I3b on the other side of the board B in the X direction (the left side in FIG. 8 ) using the distance sensor 27. This is because the distance sensor 27 is provided on one side of the head unit 25b in the X direction (the right side in FIG. 8 ).

[0058] Therefore, in step S305 executed for the mounting stage 3a, three measurement points Ph closest to the mounting point Pm are selected from within the range of the board B other than the end I3a. Also, in step S305 executed for the mounting stage 3b, three measurement points Ph closest to the mounting point Pm are selected from within the range of the board B other than the end I3b.

[0059] In this modified example configured as above, the target measurement point Ph at which mounting work units 1A, 3a, 3b, and 1C measure height is selected from among multiple measurement points Ph according to the conditions (range in which height can be measured) of the mounting work units 1A, 3a, 3b, and 1C (measurement point selection process). In other words, it is possible to select a target measurement point Ph that is reasonable according to the conditions of the mounting work units 1A, 3a, 3b, and 1C, and perform height measurement on that target measurement point Ph. As a result, when multiple mounting work units 1A, 3a, 3b, and 1C share the task of mounting components C on board B to produce component-mounted boards, it is possible to reasonably measure the height of measurement point Ph on board B.

[0060] Specifically, the mounting work units 1A, 3a, 3b, and 1C select, from among the multiple measurement points Ph, measurement points Ph within the measurable range as target measurement points Ph, based on the condition that the mounting work units 1A, 3a, 3b, and 1C can measure heights within the measurable range. With this configuration, the target measurement points Ph can be appropriately selected by limiting the measurement points within the measurable range.

[0061] Furthermore, various methods are conceivable for determining the height of the mounting point Pm from the three measurement points Ph selected for the mounting point Pm. Therefore, the height of the mounting point Pm may be determined as the height of the mounting point Pm on a surface (flat or curved surface) that passes through the three measurement points Ph. The number of measurement points Ph selected in step S305 is not limited to three, and may be one or two. When one measurement point Ph is selected, the height of the measurement point Ph may be determined as the height of the mounting point Pm. When two measurement points Ph are selected, the height of the mounting point Pm on a line (straight or curved) that passes through the two measurement points Ph may be determined as the height of the mounting point Pm.

[0062] Furthermore, the number and types of component mounters 1 provided in the board production system S can be changed as appropriate. [Explanation of symbols]

[0063] 100...Server computer 110...Arithmetic section 120...Storage section 121...Optimization program 1A...Installation work section B...Substrate Ph…Measurement point Pm...Mounting point

Claims

1. 1. A board production procedure optimization method for optimizing a procedure for producing a component-mounted board by transporting a board having a plurality of measurement points to a plurality of mounting work units in order, and having each of the plurality of mounting work units measure the height of the measurement points on the transported board, and then mounting components on the board, comprising: a step of executing, for each of the plurality of mounting work units, a measurement point selection process for selecting a target measurement point for which the mounting work unit is to measure height from among the plurality of measurement points, A board production procedure determination method, wherein in the measurement point selection process, the target measurement points are selected in accordance with conditions held by the mounting work unit.

2. the substrate has a plurality of mounting points; each of the plurality of measurement points is provided at a position different from each of the plurality of mounting points; the plurality of mounting work units share the task of mounting components at the plurality of mounting points by mounting components at different mounting points among the plurality of mounting points; the conditions include the positions of the assigned mounting points at which the mounting work unit is responsible for mounting components, among the plurality of mounting points; 2. The board production procedure determination method according to claim 1, wherein the measurement point selection process selects, from among the plurality of measurement points, a predetermined number of measurement points that satisfy a predetermined positional relationship with the position of the assigned mounting point as the target measurement points.

3. a step of executing a mounting point determination process for determining the assigned mounting points of each of the plurality of mounting work units, the plurality of mounting points include a first mounting point and a second mounting point different from the first mounting point, 3. The board production procedure determination method according to claim 2, wherein the measurement point selection process determines whether the first mounting point and the second mounting point are to be the assigned mounting points of a same mounting work unit among the plurality of mounting work units, depending on a result of determining whether the predetermined number of measurement points that satisfy the positional relationship with the first mounting point and the predetermined number of measurement points that satisfy the positional relationship with the second mounting point overlap.

4. 4. The board production procedure determination method according to claim 3, wherein, in the measurement point selection process, if it is determined that the predetermined number of measurement points that satisfy the positional relationship with the first mounting point overlap with the predetermined number of measurement points that satisfy the positional relationship with the second mounting point, it is determined that the first mounting point and the second mounting point are to be the assigned mounting points of a same mounting work unit among the plurality of mounting work units.

5. the plurality of mounting work units include a first mounting work unit and a second mounting work unit different from the first mounting work unit, In the measurement point selection process, when it is determined that the predetermined number of measurement points that satisfy the positional relationship with the first mounting point and the predetermined number of measurement points that satisfy the positional relationship with the second mounting point overlap, determining which is more efficient: a distributed allocation in which the first mounting point is the assigned mounting point of the first mounting work unit and the second mounting point is the assigned mounting point of the second mounting work unit, or a consolidated allocation in which the first mounting point and the second mounting point are the assigned mounting points of the first mounting work unit; When it is determined that the distributed allocation is efficient, it is determined that the first mounting point is the assigned mounting point of the first mounting work unit and the second mounting point is the assigned mounting point of the second mounting work unit; 4. The board production procedure determination method according to claim 3, further comprising the step of determining that the consolidated allocation is efficient, and then determining that the first mounting point and the second mounting point are the responsible mounting points of the first mounting operation unit.

6. the conditions include a measurable range in which the mounting operation unit can measure the height, 6. The board production procedure determination method according to claim 1, wherein the measurement point selection process selects, from among the plurality of measurement points, the measurement points within the measurable range as the target measurement points.

7. A board production procedure determination program that causes a computer to execute the board production procedure determination method of claim 1.

8. A recording medium on which the board production procedure determination program according to claim 7 is recorded so as to be readable by a computer.

9. 1. A board production procedure optimization device that optimizes a procedure for producing a component-mounted board by transporting a board having a plurality of measurement points to a plurality of mounting work units in order, measuring the height of the measurement points on the board transported by each of the plurality of mounting work units, and mounting components on the board, a storage unit that stores the conditions of the mounting work units for each of the plurality of mounting work units; a calculation unit that executes, for each of the plurality of mounting work units, a measurement point selection process that selects a target measurement point for which the mounting work unit is to measure height from among the plurality of measurement points; Equipped with In the measurement point selection process, the target measurement points are selected in accordance with the conditions of the mounting work unit.

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