Wiring board with built-in component and method of manufacturing the same

Abstract

To improve productivity of a wiring board with a built-in component.SOLUTION: A component built-in wiring board 10 of the present disclosure includes a core substrate 20, a plurality of electronic components, a build-up portion 60, and a first resin portion 80, wherein the plurality of electronic components include a first component 72 having a terminal on a first surface 20A side and a second component 74 having a terminal on a second surface 20B side, and the first component 72 and the second component 74 are connected to each other by a second resin portion 90, through conductors 92, which are connected to the terminals of the second component 74 on the second surface 20B side in a state of passing through the second surface 20B side, are formed in the second resin component 90.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present disclosure relates to a component-embedded wiring board and a method for manufacturing a component-embedded wiring board. [Background technology]

[0002] Patent Document 1 discloses a wiring board structure that includes a core substrate having an opening, a plurality of electronic components arranged in the opening while spaced apart from each other with gaps therebetween, and a build-up portion arranged on the core substrate and on the electronic components, the gaps being filled with resin. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-147049 Summary of the Invention [Problem to be solved by the invention]

[0004] In a configuration in which the first component and the second component connected by the second resin part are inserted into an opening in the core substrate, the second component having a terminal on the second surface may not be able to be connected via the second surface. [Means for solving the problem]

[0005] The component-embedded wiring board of the present disclosure is a component-embedded wiring board comprising: a core substrate having a first surface and a second surface opposite the first surface and having an opening penetrating from the first surface to the second surface; a plurality of electronic components inserted into the opening while spaced apart from each other; a build-up portion disposed on the core substrate; and a first resin portion filling the opening, wherein the plurality of electronic components are connected by the second resin portion to a first component having terminals on the first surface side and a second component having terminals on the second surface side, and the second resin portion has a through conductor formed therein that penetrates the second surface side and is connected to the terminals on the second surface side of the second component.

[0006] The present disclosure also provides a method for manufacturing a wiring board with built-in components, the method including: preparing a plurality of electronic components including a first component having terminals on a first surface side of a core substrate and a second component having terminals on a second surface side of the core substrate; penetrating an opening from the first surface to the opposite second surface of the core substrate; inserting the plurality of electronic components into the opening while spaced apart from each other; filling the opening with a first resin portion; and stacking a build-up portion on the core substrate, wherein preparing the plurality of electronic components includes forming a through conductor connected to the terminal on the second surface side of the second component in a state where the through conductor penetrates the second surface side of the second resin portion connecting the first component and the second component.

[0007] According to the component-embedded wiring board and the method for manufacturing the component-embedded wiring board of the present disclosure, in a configuration in which a first component and a second component connected by a second resin portion are inserted into an opening in a core substrate, a through conductor is formed in the second resin portion, so that the second component is via-connected on the second surface. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a cross-sectional view showing a core substrate according to an embodiment of the present disclosure. [Figure 2] FIG. 10 is a cross-sectional view showing a state in which an opening is formed in a core insulating layer of a core substrate. [Figure 3] FIG. 10 is a cross-sectional view showing a state in which adhesive tape T2 is attached to an end surface of a land. [Figure 4] 10 is a cross-sectional view showing a state in which a connecting part connected by a molded resin part is inserted into an opening of a core substrate. FIG. [Figure 5] 10 is a cross-sectional view showing a state in which a resin that constitutes a resin portion is filled in a gap between an opening and a connecting component, and an interlayer insulating layer is laminated. FIG. [Figure 6] FIG. 3 is a cross-sectional view showing the core substrate with the adhesive tape attached to the first surface removed. [Figure 7]7 is a cross-sectional view showing a state in which the core substrate from which the adhesive tape in FIG. 6 has been peeled off has been turned upside down and an interlayer insulating layer has been laminated on the first surface side. [Figure 8] FIG. 10 is a cross-sectional view showing a state in which a via hole is formed in an interlayer insulating layer. [Figure 9] FIG. 10 is a cross-sectional view showing a state in which lands and via conductors are formed in an interlayer insulating layer. [Figure 10] Regarding the formation of through conductors in the molded resin part, (A) is a cross-sectional view showing a state in which one surface of the base material of the connecting part is attached to an adhesive tape with the adhesive surface facing upward. (B) is a cross-sectional view showing a state in which multiple through holes of the same diameter are formed in the molded resin part on the other surface of the base material. (C) is a cross-sectional view showing a state in which through conductors and a skin layer are formed by plating the through holes and the other surface of the base material. (D) is a cross-sectional view showing a state in which the other surface of (C) has been polished. DETAILED DESCRIPTION OF THE INVENTION

[0009] Next, an example of an embodiment of the technology of the present disclosure will be described with reference to the drawings.

[0010] <Overall structure> FIG. 9 is a cross-sectional view showing a portion of component-built-in wiring board 10 according to an embodiment of the present disclosure (hereinafter referred to as "the present embodiment").

[0011] 9, component-embedded wiring board 10 of this embodiment has multiple electronic components embedded inside a laminated plate-like body. Component-embedded wiring board 10 includes core substrate 20, connecting components 70, embedded resin portion 80, and build-up portion 60.

[0012] (core substrate) The core substrate 20 is a laminate, with one surface being a first surface 20A and the opposite surface being a second surface 20B. The core substrate 20 has a core insulating layer 30, through-hole conductors 42, and lands 44 and 46.

[0013] ((Core insulation layer)) The core insulating layer 30 is an insulator that forms the structural core of the core substrate 20. The core insulating layer 30 has an insulating substrate 32, a reinforcing material 34, and a resin layer 36. Specifically, the core insulating layer 30 is configured such that the resin layer 36 is formed on both the first surface 20A side and the second surface 20B side of the insulating substrate 32 containing the reinforcing material 34. The core insulating layer 30 also has an opening 50 that penetrates the core substrate 20 by the height H from the first surface 20A to the second surface 20B. The insulating substrate 32 does not necessarily have to include the reinforcing material 34.

[0014] The resin layer 36 is formed using a thermosetting resin sheet, such as prepreg, and has a first resin layer 36A formed on the surface of the core substrate 20 facing the first surface 20A, and a second resin layer 36B formed on the surface of the core substrate 20 facing the second surface 20B.

[0015] ((Through-hole conductor)) The through-hole conductor 42 is formed by forming a metal plating film such as copper plating on the inner wall of the through hole in the core insulating layer 30, filling the inside with resin, and then applying cap plating to the end surface. The through-hole conductor 42 is formed from the first surface 20A to the second surface 20B at a position different from the opening 50.

[0016] ((land)) The lands 44, 46 are formed on the surface of the resin layer 36 opposite to the core insulating layer 30. Specifically, the land 44 is formed by plating on the first resin layer 36A side, and the land 46 is formed by plating on the second resin layer 36B side. Portions of the lands 44, 46 and the through-hole conductor 42 are configured to be electrically connected.

[0017] In this way, the core substrate 20 is formed.

[0018] (Connecting parts) Next, the connecting part 70 will be described.

[0019] The connecting component 70 is a component group in which a plurality of electronic components are connected by a molded resin portion while being spaced apart from each other. The connecting component 70 is inserted inside the opening 50.

[0020] The connecting component 70 includes a first component 72, a second component 74, a third component 76, a molded resin portion 90, and a through conductor 92. The first component 72, the second component 74, and the third component 76 included in the connecting component 70 are, for example, passive components such as capacitors and inductors, or semiconductor elements.

[0021] ((First part)) The first component 72 is box-shaped with a rectangular cross section. The first component 72 has terminals on the first surface 20A side. Furthermore, no terminals are arranged on the top surface 72B side, which is the surface opposite to the terminal surface 72A of the first component 72. In other words, the first component 72 has terminals on only one surface. The terminal surface 72A of the first component 72 is arranged on the first surface 20A of the core substrate 20. The height from the terminal surface 72A to the top surface 72B is defined as a first height H1. The first height H1 is set to be smaller than the height (thickness) H of the core substrate 20.

[0022] ((Second part)) The second component 74 is shaped like a box having a rectangular cross section and is spaced apart from the first component 72 in a direction perpendicular to the height direction of the first component 72.

[0023] The second component 74 has terminals on both end surfaces, on the first surface 20A side and the second surface 20B side. The terminal surface 74A on the first surface 20A side of the second component 74 is disposed on the first surface 20A of the core substrate 20. The terminal surface 74B on the second surface 20B side is disposed closer to the first surface 20A than the second surface 20B. The height from the terminal surface 74A to the terminal surface 74B of the second component 74 is defined as a second height H2. The second height H2 is set lower than the height (thickness) H of the core substrate 20 and the first height H1.

[0024] ((Third part)) The third component 76 has a box shape with a rectangular cross section. The third component 76 is disposed on the opposite side of the second component 74 and spaced apart from the first component 72, with the first component 72 sandwiched between the third component 76 and the second component 74.

[0025] The third component 76 has terminals on both end surfaces, on the first surface 20A side and the second surface 20B side. The third component 76 is an example of a first component that also has terminals on the second surface side. The terminal surface 76A on the first surface 20A side of the third component 76 is disposed on the first surface 20A of the core substrate 20. The terminal surface 76B on the second surface 20B side is disposed closer to the first surface 20A than the second surface 20B. The height from the terminal surface 76A to the terminal surface 76B of the third component 76 is defined as a third height H3. The third height H3 is set to be lower than the height (thickness) H of the core substrate 20 and the first height H1, and higher than the second height.

[0026] ((Molded resin part)) The molded resin portion 90 is a portion where the molded resin has solidified while including the first component 72, the second component 74, and the third component 76. The molded resin portion 90 is an example of a second resin portion. The molded resin portion 90 fills the opening 50 from the first surface 20A to the second surface 20B while aligning the terminal surface 72A of the first component 72, the terminal surface 74A of the second component 74, and the terminal surface 76A of the third component 76 flush with each other.

[0027] ((through conductor)) The through conductors 92 are conductors formed by filling through holes 94 formed in the molded resin portion 90 with plating. The through conductors 92 are formed from the terminal surfaces 74B of the second component 74 and the terminal surfaces 76B of the third component 76 toward the second surface of the core substrate 20, respectively, and have end faces that extend along the second surface. In other words, the through conductors 92 are formed so as to penetrate the second surface 20B side of the molded resin portion 90 and to be connected to the terminal surfaces 74B of the second component 74 and the terminal surfaces 76B of the third component 76. The "through state" of the through conductors 92 refers to a state in which the through conductors 92 open on the second surface and fill a predetermined space leading to the terminal surfaces. The formation of the through conductors 92 will be described later.

[0028] The connecting part 70 is thus formed.

[0029] (embedded resin part) Next, the embedded resin portion 80 is formed by solidifying the embedded resin filled between the opening 50 and the connecting component 70. The embedded resin portion 80 fills the opening 50. The embedded resin portion 80 is an example of a first resin portion. The embedded resin of the embedded resin portion 80 is formed of, for example, epoxy resin. Both end faces in the height (thickness) direction of the embedded resin portion 80 are disposed on the first surface 20A and the second surface 20B of the core substrate 20, respectively.

[0030] (build-up section) The buildup section 60 is a laminate disposed on the core substrate 20. The buildup section 60 includes an interlayer insulating layer 62, lands 64, and via conductors 66. The buildup section 60 also includes a first buildup section 60A and a second buildup section 60B. The first buildup section 60A is formed on the first surface 20A side of the core substrate 20. The second buildup section 60B is formed on the second surface 20B side of the core substrate 20. In other words, the first buildup section 60A and the second buildup section 60B are disposed so as to sandwich the core substrate 20 in the height (thickness) direction. In this embodiment, for convenience of explanation, one layer of interlayer insulating layer 62 is laminated on each of the first buildup section 60A and the second buildup section 60B, but multiple layers may be laminated.

[0031] The interlayer insulating layer 62 is an insulating layer laminated in a direction away from the first surface 20A and the second surface 20B of the core substrate 20. The interlayer insulating layer 62 is made of the same resin as the embedded resin portion 80.

[0032] The lands 64 are conductor patterns formed on the interlayer insulating layer 62 .

[0033] The via conductor 66 is a conductor formed by plating a via hole 68 formed in the interlayer insulating layer 62. The via conductor 66 is electrically connected to the lands 44, 46, and 64, each terminal of the connecting component 70, the through conductor 92, and a land (not shown).

[0034] <Formation of through conductor> Next, a preparation step of the manufacturing method for component-embedded wiring board 10 of this embodiment will be described. Specifically, a step of preparing connecting component 70 by forming through conductors 92 in base material M of connecting component 70 will be described. Note that in this specification, base material M will be described as being composed of a single unit including one each of first component 72, second component 74, and third component 76, but this is not limited to this. For example, base material M may be composed of multiple units. In this case, base material M is diced (divided into individual pieces) at a predetermined time.

[0035] First, a base material M of the connecting component 70 is prepared. The base material M is covered with a molded resin portion 90 in a state in which the terminal surface 72A of the first component 72, the terminal surface 74A of the second component 74, and the terminal surface 76A of the third component 76 are flush with each other.

[0036] As shown in FIG. 10(A), one surface of the base material M is attached to an adhesive tape T1 with the adhesive surface facing upward.

[0037] 10(B), through holes 94 of the same diameter are formed in the molded resin portion 90 on the surface opposite to the one surface of the base material M (hereinafter referred to as the other surface). The through holes 94 are formed to the terminal surface 74B of the second component 74 and the terminal surface 76B of the third component 76. The through holes 94 are formed, for example, by a laser, but are not limited to this.

[0038] 10(C), the through holes 94 and the other surface of the base material M are plated to form the through conductors 92 and the skin layer S. For example, copper is used as the plating material for plating.

[0039] Then, as shown in FIG. 10(D), the other surface of the base material M is subjected to CMP (Chemical Mechanical Polishing) to polish the skin layer S and a part of the base material M, thereby preparing a connecting part 70.

[0040] <Method of manufacturing a component-embedded wiring board> Next, a method for manufacturing component built-in wiring board 10 of this embodiment will be described.

[0041] As shown in FIG. 1, a core substrate 20 is prepared.

[0042] As shown in FIG. 2, an opening 50 is formed in the core insulating layer 30 of the core substrate 20 .

[0043] As shown in FIG. 3, adhesive tape T2 is attached to the end face of land 44 of core substrate 20 so that the adhesive surface faces land 44.

[0044] 4, connecting parts 70 are inserted into opening 50 from terminal surface 72A, terminal surface 74A, and terminal surface 76A. When inserting connecting parts 70 into opening 50, connecting parts 70 are attached to the adhesive surface of adhesive tape T2.

[0045] As shown in Fig. 5, an embedding resin is embedded in the gap between the opening 50 and the connecting component 70. The embedding resin solidifies to form an embedding resin portion 80, which fixes the connecting component 70 to the inside of the opening 50. In this embodiment, after the embedding resin portion 80 is formed above the second surface 20B of the core substrate 20, the surface of the embedding resin portion 80 is polished (not shown). As a result of the polishing, a single interlayer insulating layer 62 is laminated.

[0046] As shown in FIG. 6, the adhesive tape T2 attached to the first surface 20A of the core substrate 20 is peeled off.

[0047] As shown in Figure 7, the core substrate 20 from which the adhesive tape T2 has been peeled is prepared by turning it upside down. Note that Figure 7 differs from Figures 1 to 5 in that the first surface 20A and the second surface 20B are upside down. An interlayer insulating layer 62 is laminated on the first surface 20A side of the upside-down core substrate 20 using the resin that will form the embedded resin portion 80.

[0048] 8, via holes 68 are formed from above and below the interlayer insulating layers 62 formed on both sides of the core substrate 20. In detail, the via holes 68 are formed toward the lands 44, 46, the terminal surfaces 72A, 74A, 76A, and the through conductors 92.

[0049] Then, as shown in FIG. 9, via conductors 66 are formed in the via holes 68, and lands 64 are formed around the via conductors 66.

[0050] In detail, electroless plating is formed on the surface of each interlayer insulating layer 62 and on the inner walls of the via holes 68. Next, a plating resist pattern is formed on the electroless plating. Furthermore, electrolytic plating is formed inside the openings (not shown) of the plating resist on the surface of the interlayer insulating layer 62 and in the via holes 68. Then, the plating resist is peeled off. Finally, the electroless plating film is removed by etching. As a result of the above, the lands 64 and via conductors 66 are formed.

[0051] Depending on the product specifications, a plurality of interlayer insulating layers 62 may be stacked.

[0052] In this manner, component-embedded wiring board 10 is manufactured.

[0053] <Action and effect> The component-embedded wiring board 10 of this embodiment is a component-embedded wiring board 10 that includes a core substrate 20 having a first surface 20A and a second surface 20B, and an opening 50 that penetrates from the first surface 20A to the second surface 20B, a connecting component 70 inserted inside the opening 50, a build-up portion 60 arranged on the core substrate 20, and an embedded resin portion 80 that fills the opening 50, in which the connecting component 70 is connected by a molded resin portion 90 to a first component 72 having a terminal on the first surface 20A side and a second component 74 having terminals on both the first surface 20A side and the second surface 20B side so that the terminal surfaces 72A, 74A on the first surface 20 side are flush with each other, and a through conductor 92 is formed in the molded resin portion 90, penetrating the second surface 20B side and connected to the terminal on the terminal surface 74B of the second component 74.

[0054] Furthermore, the method for manufacturing component-embedded wiring board 10 of this embodiment includes preparing connecting component 70 including first component 72 and second component 74 having terminals on both sides, penetrating opening 50 from first surface 20A of core substrate 20 to opposite second surface 20B, inserting terminal surfaces 72A and 74A of each electronic component of connecting component 70 into opening 50, filling opening 50 with embedded resin portion 80, and stacking build-up portion 60 on core substrate 20, in which preparing connecting component 70 includes forming through conductor 92 connected to a terminal associated with terminal surface 74B of second component 74 in a state where the through conductor 92 penetrates through molded resin portion 90 that connects first surface 20A of first component 72 and second component 74 so that terminal surfaces 72A, 74A on the first surface 20A are flush with each other.

[0055] According to this configuration, when the first component 72 and the second component 74 connected by the molded resin portion 90 are inserted into the opening 50 of the core substrate 20, a through conductor 92 is formed in the molded resin portion 90, so that the second component 74 is via-connected on both the first surface 20A and the second surface 20B.

[0056] Furthermore, in component-built-in wiring board 10 of this embodiment, through conductors 92 are formed of a plating material that fills through holes 94 formed in molded resin portion 90 .

[0057] According to this configuration, the component-built-in wiring board is easier to manufacture than in a configuration in which through conductors 92 are formed from a material different from the plating that fills through holes 94 .

[0058] In addition, in the component-embedded wiring board 10 of this embodiment, via conductors 66 connected to the terminals on the first surface 20A side of the first component 72 and the second component 74 are formed in the first build-up portion 60A formed on the first surface 20A side of the core substrate 20, and via conductors 66 connected to the through conductors 92 are formed in the second build-up portion 60B formed on the second surface 20B side of the core substrate 20.

[0059] According to this configuration, the second component 74 is connected up to the second built-up section 60B.

[0060] In component-built-in wiring board 10 of this embodiment, first component 72 has a first height H1, and second component 74 has a second height H2 that is lower than first height H1.

[0061] According to this configuration, even for a short component, via connections can be made on both the first surface 20A and the second surface 20B.

[0062] Furthermore, component-built-in wiring board 10 of this embodiment includes, in addition to second component 74, third component 76 having terminal surfaces 76A, 76B on both sides thereof.

[0063] According to this configuration, even if there are variations in height of electronic components, any component can be connected via holes on both the first surface 20A and the second surface 20B. In component-built-in wiring board 10 and the manufacturing method of this embodiment, mold resin part 90 fills opening 50 from first surface 20A to second surface 20B.

[0064] According to this configuration, the amount of resin that constitutes the embedded resin portion 80 can be reduced compared to a configuration in which the opening 50 is filled from the first surface 20A to a position lower than the second surface 20B.

[0065] Although the present disclosure has been described in detail above with respect to specific embodiments, it will be apparent to those skilled in the art that the present disclosure is not limited to such embodiments and that various other embodiments of the present disclosure are possible within the scope of the present disclosure. For example, there are the following modifications, but the present disclosure is not limited to these.

[0066] <Modification> In the above embodiment, through conductors 92 of wiring board 10 with built-in components are formed from a plating material that fills through holes 94 formed in molded resin part 90, but this is not limited to this. Through conductors 92 may be formed from a material different from the plating material that fills through holes 94.

[0067] In the above embodiment, in the component-embedded wiring board 10, the build-up portion 60 formed on the first surface 20A side of the core substrate 20 has via conductors 66 formed therein that are connected to the terminals of the first component 72 and the second component 74, and the second build-up portion 60B formed on the second surface side of the core substrate 20 has via conductors 66 formed therein that are connected to the through conductors 92, but this is not limited to this.

[0068] In the above embodiment, in component-embedded wiring board 10, first component 72 has first height H1 and second component 74 has second height H2 that is lower than first height H1, but this is not limiting. First height H1 and second height H2 may be the same or may be reversed.

[0069] In the above embodiment, in component-embedded wiring board 10 and the manufacturing method, molded resin part 90 fills opening 50 from first surface 20A to second surface 20B, but this is not limited to this. Molded resin part 90 may fill opening 50 from first surface 20A to an arbitrary height on the first surface 20A side of second surface 20B, or may fill opening 50 from an arbitrary height on the second surface 20B side of first surface 20A to second surface 20B. In this case, the resin filling the gap between molded resin part 90 and second surface 20B or first surface 20A may be selected appropriately.

[0070] In the above embodiment, the second component 74 has terminals on both end surfaces on the first surface 20A side and the second surface 20B side, but this is not limiting. For example, the second component 74 may have a terminal only on the end surface on the second surface 20B side. [Explanation of symbols]

[0071] 10. Component-embedded wiring board 20 Core Board 20A Page 1 20B 2nd side 30 Core insulation layer 32 Insulating substrate 36 Resin layer 42 through-hole conductor 44, 46 rand 50 Opening 60 Build-up section 60A First build-up section 60B Second build-up section 62 Interlayer insulation layer 64 rand 66 Via conductor 68 via holes 70 Connecting parts 72 First Part 72A terminal surface 72B top 74 2nd part 74A terminal surface 74B Terminal surface 76 Third Part 76A terminal surface 76B Terminal surface 80 embedded resin portion (an example of a first resin portion) 90 Molded resin part (an example of the second resin part) 92 Through conductor 94 Through holes T1, T2 adhesive tape

Claims

1. a core substrate having a first surface, a second surface opposite to the first surface, and an opening penetrating from the first surface to the second surface; a plurality of electronic components inserted into the opening in a spaced-apart relationship; a build-up portion disposed on the core substrate; a first resin portion that fills the opening; A component-embedded wiring board comprising: The plurality of electronic components are configured such that a first component having a terminal on the first surface side and a second component having a terminal on the second surface side are connected by a second resin portion, The second resin portion has a through conductor formed therein, the through conductor penetrating the second surface side and connected to a terminal on the second surface side of the second component.

2. 2. The component-embedded wiring board according to claim 1, the second component further has a terminal on the first surface side, The first component and the second component are connected by the second resin portion so that the terminal surfaces on the first surface side of each component are flush with each other.

3. 2. The component-embedded wiring board according to claim 1, The through conductor is made of a plating material that fills the hole formed in the second resin portion.

4. 2. The component-embedded wiring board according to claim 1, via conductors connected to terminals on the first surface side of the first component are formed in the build-up portion formed on the first surface side of the core substrate; The build-up portion formed on the second surface side of the core substrate has via conductors formed therein, the via conductors being connected to the through conductors.

5. 2. The component-embedded wiring board according to claim 1, the first component has a first height; The second component has a second height that is less than the first height.

6. The component-built-in wiring board according to any one of claims 1 to 5, The second resin portion fills the opening from the first surface to the second surface.

7. Preparing a plurality of electronic components including a first component having terminals on a first surface side of a core substrate and a second component having terminals on a second surface side of the core substrate; providing an opening from the first surface to the opposite second surface of the core substrate; inserting the plurality of electronic components into the opening in a spaced-apart relationship; Filling the opening with a first resin portion; laminating a build-up portion on the core substrate; A method for manufacturing a component-embedded wiring board, comprising: Preparing the plurality of electronic components includes forming a through conductor in a second resin portion that connects the first component and the second component, the through conductor penetrating the second surface side and connected to a terminal on the second surface side of the second component.

8. 8. A method for manufacturing a component-embedded wiring board according to claim 7, comprising: preparing the plurality of electronic components includes connecting the first component and a second component, the second component further having a terminal on the first surface side, by a second resin portion so that terminal surfaces on the first surface side are flush with each other; When inserting, insert from the terminal surface side.

9. 9. A method for manufacturing a component-embedded wiring board according to claim 7 or 8, comprising: The second resin portion is filled in the opening from the first surface to the second surface.

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