Processing apparatus and workpiece processing method

Abstract

To provide a processing apparatus capable of reducing the probability of breakage of a workpiece due to holding of the workpiece via foreign matter adhering to the workpiece.SOLUTION: The processing apparatus includes a holding table for holding the workpiece in a state in which one surface of the workpiece is exposed, a processing unit for processing the one surface side of the workpiece held by the holding table, a support table for supporting the workpiece in a state in which the one surface of the workpiece whose one surface side has been processed by the processing unit is exposed, a holding section for holding the workpiece supported by the support table, a conveying unit including a moving mechanism for moving the holding section that holds the workpiece, and a foreign matter removing unit provided above the support table and for removing foreign matter adhering to at least one of the holding section in a state of not holding the workpiece and the workpiece held by the holding section.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a processing device for processing one side of a workpiece including one side and another side located opposite the one side, and a processing method for a workpiece for processing one side of the workpiece. [Background technology]

[0002] Chips, such as integrated circuits (ICs), are essential components in various electronic devices, including mobile phones and personal computers. These chips are manufactured by dividing a disk-shaped workpiece, such as a wafer, along the boundaries of the devices. The workpiece may be thinned prior to division in order to reduce the height of the resulting chips.

[0003] Thinning of a workpiece is performed, for example, by grinding the workpiece in a grinding device (see, for example, Patent Document 1). This grinding device includes a holding table for holding the workpiece with its back surface exposed, and a grinding unit for grinding the back surface of the workpiece held on the holding table. Furthermore, the grinding unit includes a spindle, the tip of which is attached with a grinding wheel having a plurality of grinding stones arranged discretely in an annular shape.

[0004] When grinding a workpiece with this grinding device, the workpiece is first held on the holding table so that its backside is exposed. Next, while both the spindle and holding table are rotated, the grinding wheels and holding table are brought close to each other so that the multiple grinding stones come into contact with the backside of the workpiece, and grinding fluid is supplied to the contact interface between the two. This results in the workpiece being ground to a thinner surface. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-141176 Summary of the Invention [Problem to be solved by the invention]

[0006] Grinding a workpiece generates grinding chips. While most of these chips are washed away by the grinding fluid, some of them may scatter inside the grinding machine. The scattered chips may then temporarily adhere to a transport unit or the like used to transport the workpiece, and then adhere to the workpiece when the transport unit is used to transport the unground workpiece.

[0007] If a workpiece is held on a holding table via a foreign object, a strong external force may be applied locally to the workpiece, causing the workpiece to be damaged. Note that this type of problem does not occur only in grinding machines, but is a common problem that can occur in all processing machines that process a workpiece while holding it.

[0008] In view of this, an object of the present invention is to provide a processing device and a method for processing a workpiece that can reduce the likelihood of the workpiece being damaged due to holding the workpiece via foreign matter attached to the workpiece. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a processing device for processing one side of a workpiece including one side and another side located opposite the one side, the processing device comprising: a holding table for holding the workpiece with the one side of the workpiece exposed; a processing unit for processing the one side of the workpiece held on the holding table; a support table for supporting the workpiece with the one side of the workpiece processed by the processing unit exposed; a conveying unit including a holding part for holding the workpiece supported on the support table and a moving mechanism for moving the holding part holding the workpiece; and a foreign matter removal unit provided above the support table and for removing foreign matter adhering to at least one of the holding part when not holding the workpiece or the workpiece held by the holding part.

[0010] Preferably, the foreign matter removal unit removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holder. Also, preferably, the foreign matter removal unit removes foreign matter adhering to at least one of the support table when not supporting the workpiece and the workpiece supported on the support table.

[0011] Furthermore, the foreign matter removal unit preferably has a blower for blowing gas diagonally downward and rearward, and a suction unit provided behind the blower for sucking the gas. Alternatively, the foreign matter removal unit preferably has a static eliminator for blowing gas containing ions downward.

[0012] According to another aspect of the present invention, there is provided a method for processing one surface of a workpiece, the one surface of which is located opposite to the one surface, the method including a first transport step of holding the workpiece stored in a cassette by a holding part of a transport unit and then transporting the workpiece from the cassette by moving the holding part, a holding step of holding the workpiece on a holding table with the one surface exposed after the first transport step, a processing step of processing the one surface of the workpiece held on the holding table after the holding step, and a step of removing the one surface of the workpiece whose one surface has been processed from the exposed surface after the processing step. a second transport step, after the supporting step, of holding the workpiece supported on the support table by the holding part and then transporting the workpiece to the cassette by moving the holding part; and a removal step, before the first transport step, of removing foreign matter adhering to the holding part by using a foreign matter removal unit provided above the support table and / or, during the first transport step, of removing foreign matter adhering to the workpiece held by the holding part by using the foreign matter removal unit.

[0013] Preferably, the removing step removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holder. Also, preferably, the method further includes a second removing step of removing foreign matter adhering to the support table using the foreign matter removing unit before the supporting step and / or removing foreign matter adhering to the workpiece using the foreign matter removing unit during the supporting step.

[0014] Furthermore, in the removing step, it is preferable that a gas be blown toward the holder or the workpiece from an obliquely upper front direction, and the gas that has collided with the holder or the workpiece be sucked upward. Alternatively, it is preferable that a gas containing ions be blown toward the holder or the workpiece from above. [Effects of the Invention]

[0015] In the present invention, a foreign matter removal unit provided above the support table can be used to remove foreign matter adhering to at least one of the holder of the transport unit when the workpiece is not being held and the workpiece held by the holder, thereby reducing the likelihood of the workpiece being damaged due to being held via foreign matter adhering to the workpiece. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a workpiece. [Figure 2] FIG. 2 is a block diagram that schematically shows an example of a grinding device for grinding a workpiece. [Figure 3] FIG. 3 is a perspective view schematically showing a cassette table that supports a cassette containing a workpiece. [Figure 4] FIG. 4 is a perspective view schematically showing a transport unit for transporting a workpiece. [Figure 5] FIG. 5 is a diagram schematically illustrating a grinding unit of a grinding device. [Figure 6] FIG. 6 is a perspective view schematically showing an inspection unit of the grinding device. [Figure 7] FIG. 7 is a flowchart schematically illustrating an example of a method for grinding a workpiece in a grinding device. [Figure 8] FIG. 8 is a flow chart schematically showing the specific contents of the transport step for transporting the workpiece from the cassette to the position adjustment unit. DETAILED DESCRIPTION OF THE INVENTION

[0017] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing an example of a workpiece. The workpiece 11 shown in Fig. 1 includes, for example, a wafer 13 having a circular front surface 13a and a back surface 13b, and made of a semiconductor material such as silicon (Si).

[0018] A plurality of devices 15 are formed in a matrix on the front surface 13a of the wafer 13. In other words, the boundaries of the plurality of devices 15 extend in a grid pattern. The workpiece 11 may also include a film-like tape provided on the front surface 13a of the wafer 13 so as to cover the plurality of devices 15. This tape has a diameter approximately equal to the diameter of the wafer 13 and is made of, for example, resin.

[0019] This tape protects the multiple devices 15 by absorbing the impact applied to the front surface 13a of the wafer 13 when the back surface 13b of the wafer 13 is ground. There are no limitations on the material, shape, structure, size, etc. of the wafer 13. Furthermore, the workpiece 11 may include a portion made of a semiconductor material other than silicon, ceramic, resin, or metal, in addition to or instead of the wafer 13 and the tape provided on its front surface 13a.

[0020] Fig. 2 is a block diagram schematically showing an example of a grinding device for grinding workpiece 11. In Fig. 2, the movement path of workpiece 11 before one surface (specifically, back surface 13b of wafer 13) is ground is indicated by a dashed arrow, and the movement path of workpiece 11 after one surface is ground is indicated by a solid arrow.

[0021] The grinding apparatus 2 shown in Fig. 2 includes a cassette table 4 for supporting a cassette containing a workpiece 11. Fig. 3 is a perspective view showing a schematic view of the cassette table 4 supporting the cassette containing the workpiece 11. The cassette table 4 has a rectangular upper surface 4a that is substantially vertical in the up-down direction, and a cassette 6 is placed on this upper surface 4a.

[0022] The cassette 6 has a flat top panel 6a. The top panel 6a has a rectangular shape with a pair of adjacent corners chamfered and the remaining pair of corners remaining unchamfered. The upper ends of side panels (not shown) extending in a direction perpendicular to the top panel 6a (height direction) are fixed to the underside of the end (rear end) of the top panel 6a located between the pair of chamfered corners.

[0023] The upper ends of side plates 6b and 6c extending in the height direction are fixed to the lower sides of the two ends (left and right ends) of the tabletop 6a that are located between the chamfered portion and the non-chamfered corner. On the other hand, there is no side plate below the end (front end) of the tabletop 6a that is located between the pair of non-chamfered corners. In other words, the lower side of the front end of the tabletop 6a is open.

[0024] Furthermore, a plurality of grooves 6d extending in the front-rear direction are formed on the inner surfaces of the side plates 6b and 6c at approximately equal intervals in the height direction. Specifically, each of the plurality of grooves 6d formed on the inner surface of the side plate 6b is arranged to face one of the plurality of grooves 6d formed on the inner surface of the side plate 6c.

[0025] The cross-sectional shape of the groove 6d is generally rectangular. In other words, the groove 6d has a pair of side surfaces that are generally perpendicular to the height direction and a bottom surface that is generally parallel to the height direction. The workpiece 11 is accommodated in the cassette 6 by placing the outer periphery of the workpiece 11 on the side surface of each of the pair of side surfaces of the plurality of grooves 6d that is farther from the top plate 6a. In other words, the workpiece 11 is supported on the inner surface of the pair of opposing grooves 6d that is farther from the top plate 6a.

[0026] There is no limit to the number of grooves 6d formed on the inner surfaces of side plate 6b and side plate 6c. For example, cassette 6 may be formed with grooves 6d in the number corresponding to one lot (approximately 25 pieces) of workpieces 11. The lower part of side plate 6b and the lower part of side plate 6c are connected via a long, thin, plate-like connecting member 6e.

[0027] The workpiece 11 stored in the cassette 6 is transported by a transport unit 8 (see FIG. 2). FIG. 4 is a perspective view showing a schematic view of the transport unit 8. The transport unit 8 includes a robot hand (holding unit) 10 for holding the workpiece 11, and a movement mechanism 12 for moving the robot hand 10 holding the workpiece 11.

[0028] The movement mechanism 12 has a cylindrical first drive unit 14 that extends in the vertical direction. This first drive unit 14 includes, for example, an actuator (not shown) such as an air cylinder that can raise and lower a rod that extends in the vertical direction, a rotation mechanism (not shown) such as a motor that rotates the actuator around a straight line that follows the rod as a rotation axis, and a case 14a that houses the actuator and the rotation mechanism.

[0029] A horizontal movement mechanism (not shown) is connected to the case 14a. This horizontal movement mechanism includes, for example, a support plate that supports the case 14a, a ball screw for moving the support plate in the horizontal direction, and a motor for rotating the screw shaft of the ball screw. When this motor is operated, the first drive unit 14 moves in the horizontal direction together with the support plate.

[0030] An opening through which a rod passes is formed in the top plate of case 14a. An arm 16 is connected to the upper end of the rod. Therefore, when the actuator of first drive unit 14 is operated, arm 16 moves (lifts and lowers) in the vertical direction, and when the rotation mechanism is operated, arm 16 rotates around a rotation axis that is a straight line along the rod.

[0031] The arm 16 has a plurality of joints. Specifically, the arm 16 has a plate-shaped first arm portion 16a extending in a direction perpendicular to the up-down direction. The lower side of one end of the first arm portion 16a is connected to the upper end of a rod of an actuator included in the first driving unit 14 so as to move and rotate together with the rod. The lower side of a cylindrical first joint portion (not shown) is connected to the upper side of the other end of the first arm portion 16a.

[0032] A plate-shaped second arm 16b extending in a direction perpendicular to the up-down direction is connected to the upper side of the first joint. The lower side of one end of this second arm 16b is connected to the upper side of the other end of the first arm 16a via the first joint in a manner that allows it to rotate around a straight line along the up-down direction as a rotation axis. Furthermore, the lower side of a cylindrical second joint 16c is connected to the upper side of the other end of the second arm 16b. The second drive unit 18 is connected to the upper side of the second joint 16c.

[0033] The second driving unit 18 has a rectangular parallelepiped case 18a extending in a direction perpendicular to the up-down direction, and a spindle 18b inserted into the case 18a through an opening formed in a side plate located at one end of the case 18a. The lower side of one end of the case 18a is connected to the upper side of the other end of the second arm 16b via the second joint 16c in a manner that allows rotation about a straight line along the up-down direction as a rotation axis.

[0034] The case 18a also houses a motor (not shown) connected to the base end of the spindle 18b. When the motor is operated, the spindle 18b rotates around a rotation axis that is a straight line perpendicular to the up-down direction. Furthermore, a U-shaped robot hand 10 is connected to the tip of the spindle 18b.

[0035] Specifically, the robot hand 10 has a base end 10a to which the tip of the spindle 18b is connected at the center, and a pair of arms 10b extending from both ends of the base end 10a so as to be parallel to the spindle 18b. The distance between the pair of arms 10b is smaller than the diameter of the workpiece 11. Each robot hand 10 has a generally flat front and back surface, and a plurality of suction holes (not shown) are formed in these surfaces.

[0036] The plurality of suction holes formed on the surface of the robot hand 10 can be connected to a suction source (not shown) or a gas supply source (not shown). The suction source includes, for example, an ejector. The gas supply source includes, for example, a tank for storing gas such as air, a filter for removing foreign matter mixed in the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

[0037] When a suction source communicating with the plurality of suction holes formed on the surface of the robot hand 10 is operated, the pressure in the plurality of suction holes becomes negative, and a suction force acts on the space near the surface of the robot hand 10. By applying this suction force to the workpiece 11, it is possible to hold the workpiece 11 on the surface side of the robot hand 10.

[0038] Furthermore, when the operation of the suction source is stopped and the gas supply source communicating with the plurality of suction holes is operated while the workpiece 11 is held in this manner, the pressure in the plurality of suction holes returns to normal pressure, and the workpiece 11 is no longer sucked toward the surface of the robot hand 10. Furthermore, since this suction force no longer acts on the workpiece 11, it becomes easier to separate the workpiece 11 from the surface of the robot hand 10.

[0039] Furthermore, when the motor connected to the base end of the spindle 18b is operated while the workpiece 11 is held on the surface side of the robot hand 10, the robot hand 10 and the workpiece 11 rotate together with the spindle 18b. Therefore, by rotating the spindle 18b, for example, by 180°, it is possible to turn the workpiece 11 upside down.

[0040] The workpiece 11 is transported from the cassette 6, for example, in the following order: First, the moving mechanism 12 is operated so that one surface of the workpiece 11 (the back surface 13b of the wafer 13) accommodated in the cassette 6 and the front surface of the robot hand 10 are brought close to each other and face each other. Next, a suction source communicating with a plurality of suction holes formed on the front surface of the robot hand 10 is operated so that the workpiece 11 is held on the front surface side of the robot hand 10.

[0041] Next, the moving mechanism 12 is operated to transport the workpiece 11 to a desired position (for example, the position adjustment unit 20 (see FIG. 2)) while holding the workpiece 11 on the surface side of the robot hand 10. Next, the operation of the suction source is stopped and the gas supply source communicating with the multiple suction holes is operated so that the workpiece 11 is separated from the surface of the robot hand 10.

[0042] The position adjustment unit 20 is provided with a disk-shaped positioning table 20a whose diameter is smaller than the workpiece 11, and a position adjustment mechanism 20b for aligning the center of the workpiece 11 placed on the positioning table 20a to a predetermined position. The position adjustment mechanism 20b includes, for example, a plurality of pins arranged around the positioning table 20a and each of which is movable radially of the positioning table 20a in a plan view.

[0043] Then, in the position adjustment unit 20, for example, the workpiece 11 is placed on the positioning table 20a so that one surface of the workpiece 11 is exposed, and then the multiple pins are moved radially inward until they come into contact with the workpiece 11. This aligns the center of the workpiece 11 to a predetermined position.

[0044] The workpiece 11, whose center is aligned to a predetermined position, is transferred from the position adjustment unit 20 to the grinding unit 22 and ground. Fig. 5 is a diagram showing a schematic view of the grinding unit 22. The grinding unit 22 is provided with a disk-shaped chuck table (holding table) 24 having a diameter larger than that of the workpiece 11. The chuck table 24 has a frame 26 made of ceramics or the like.

[0045] The frame 26 has a disk-shaped bottom wall 26a and a cylindrical side wall 26b extending from the outer periphery of the bottom wall 26a. That is, a recess is defined by the bottom wall 26a and the side wall 26b on the upper surface of the frame 26. A disk-shaped porous plate 28 made of porous ceramics or the like is fixed in this recess.

[0046] The diameter of the porous plate 28 is smaller than the diameter of the workpiece 11. The upper surfaces of the side walls 26b of the frame 26 and the upper surface of the porous plate 28 have shapes corresponding to the side surfaces of a cone, and function as holding surfaces of the chuck table 24 when holding the workpiece 11. The bottom wall 26a is formed with a flow path 26c that opens at the bottom surface of the recess and penetrates the bottom wall 26a.

[0047] Flow path 26c communicates with suction source 32a via valve 30a and with gas supply source 32b via valve 30b. Suction source 32a includes, for example, an ejector. Gas supply source 32b includes, for example, a tank for storing gas such as air, a filter for removing foreign matter mixed in the gas supplied from the tank, and a regulator for adjusting the pressure of the gas supplied from the tank.

[0048] Furthermore, the chuck table 24 is connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a motor and a pulley. When this rotation mechanism is operated, the chuck table 24 rotates around a rotation axis that is a straight line passing through the center of the holding surface of the chuck table 24.

[0049] The chuck table 24 is supported by a tilt adjustment mechanism (not shown) via bearings (not shown) or the like. This tilt adjustment mechanism includes, for example, two movable shafts and one fixed shaft that are arranged at approximately equal angular intervals along the circumferential direction of the chuck table 24. When at least one of the two movable shafts partially raises or lowers the chuck table 24, the tilt of the rotation axis of the chuck table 24 is adjusted.

[0050] The chuck table 24 is connected to a rotation mechanism (not shown). This rotation mechanism includes, for example, a turntable to which the chuck table 24 is connected in an area near its outer periphery, and a motor for rotating the turntable. When the rotation mechanism is operated, the chuck table 24 rotates around a rotation axis that passes through the center of the turntable and is aligned in the vertical direction.

[0051] A grinding unit (processing unit) 34 is provided above the chuck table 24. The grinding unit 34 has a spindle 36 extending in the vertical direction. The lower end (tip) of the spindle 36 is a disk-shaped mount 36a whose diameter is larger than the radius of the workpiece 11.

[0052] A plurality of holes (not shown) are formed on the outer periphery of the mount 36a, penetrating the mount 36a in the thickness direction, and a bolt (not shown) is inserted into each hole. Furthermore, a grinding wheel 38 is attached to the underside of the mount 36a using a plurality of bolts.

[0053] The grinding wheel 38 has an annular base 38a made of a metal material such as stainless steel or an aluminum alloy. The outer diameter of the base 38a is approximately equal to the diameter of the mount 36a, and a plurality of grinding stones 38b are provided on the underside of the base 38a in a circular, discrete arrangement.

[0054] Each of the grinding wheels 38b includes a bond material such as vitrified or resinoid, and abrasive grains such as diamond dispersed in the bond material. The abrasive grains are exposed on the lower surface of each of the grinding wheels 38b, and this lower surface functions as a grinding surface when grinding the workpiece 11.

[0055] Furthermore, a motor (not shown) is connected to the base end (upper end) of the spindle 36. When this motor is operated, the grinding wheels 38 rotate together with the spindle 36, with the rotation axis being a straight line along the direction in which the spindle 36 extends (here, the up-and-down direction). At this time, the grinding surfaces of the plurality of grinding stones 38b each trace a circular locus whose outer diameter is larger than the radius of the workpiece 11.

[0056] The spindle 36 is also connected to a vertical movement mechanism (not shown). This vertical movement mechanism includes, for example, a motor and a ball screw. When the vertical movement mechanism is operated, the spindle 36 moves in the vertical direction.

[0057] In addition, a grinding fluid supply unit (not shown) is provided near the grinding wheel 38. This grinding fluid supply unit includes, for example, a grinding fluid nozzle located inside the grinding wheel 38 in a plan view, and a grinding fluid pump communicating with this grinding fluid nozzle.

[0058] Then, by operating the rotation mechanism so that the center of the holding surface of the chuck table 24 is positioned directly below the trajectory of each grinding surface of the multiple grinding wheels 38b when the spindle 36 is rotated, and then operating the grinding fluid pump, grinding fluid (e.g., water) is supplied from the grinding fluid nozzle toward the chuck table 24.

[0059] Grinding of the workpiece 11 in the grinding unit 22 is performed, for example, in the following order: First, the workpiece 11 is placed on the chuck table 24 so that one surface thereof is exposed, and then the suction source 32a is operated and the valve 30a is opened.

[0060] As a result, a negative pressure is created in flow path 26c formed in bottom wall 26a of frame 26 of chuck table 24, and a suction force acts on workpiece 11 via porous plate 28. As a result, workpiece 11 is held on chuck table 24 in a state where it is elastically deformed so as to fit along the holding surface of chuck table 24, specifically, so that the other surface has a shape corresponding to the side surface of a cone.

[0061] Next, the turning mechanism is operated so that the center of the holding surface of the chuck table 24 is positioned directly below the trajectory of each grinding surface of the multiple grinding wheels 38b when the spindle 36 is rotated. Next, the inclination of the chuck table 24 is adjusted so that the portion of the holding surface of the chuck table 24 that overlaps with the trajectory is approximately perpendicular to the up-down direction.

[0062] Next, both the chuck table 24 and the spindle 36 are rotated, and the spindle 36 is lowered while supplying grinding fluid from the grinding fluid nozzle toward the chuck table 24. As a result, one side of the workpiece 11 is ground by the multiple grinding wheels 38b in a state where the grinding fluid is supplied to the contact interfaces (processing points) between one side of the workpiece 11 and the grinding surfaces of each of the multiple grinding wheels 38b. This grinding continues until the workpiece 11 reaches a predetermined thickness.

[0063] When the workpiece 11 reaches a predetermined thickness, the spindle 36 is raised so as to move the grinding wheels 38b away from one surface of the workpiece 11, and the rotation of both the chuck table 24 and the spindle 36 is stopped. Next, the operation of the suction source 32a is stopped and the valve 30a is closed, and then the gas supply source 32b is operated and the valve 30b is opened.

[0064] As a result, the flow path 26c formed in the bottom wall 26a of the frame 26 of the chuck table 24 returns to normal pressure, and the suction force acting on the workpiece 11 disappears. As a result, the workpiece 11 is no longer held by the chuck table 24 but simply placed thereon. This completes the grinding of one surface of the workpiece 11 in the grinding section 22.

[0065] The workpiece 11, one surface of which has been ground, is transported from the grinding section 22 to the cleaning section 40 for cleaning (see FIG. 2). The cleaning section 40 is provided with a spinner table 40a that can hold the workpiece 11 and rotate it in the circumferential direction, and a cleaning unit 40b that cleans the workpiece 11 held on the spinner table 40a.

[0066] The cleaning unit 40b includes, for example, a cleaning liquid nozzle, a cleaning liquid pump connected to the cleaning liquid nozzle, and a swing mechanism that can swing the cleaning liquid nozzle between a position where it overlaps with the spinner table 40a in a plan view and a position where it does not overlap with the spinner table 40a. When the swing mechanism is operated to position the cleaning liquid nozzle at a position where it overlaps with the spinner table 40a in a plan view and then the cleaning liquid pump is operated, a cleaning liquid (e.g., water) is supplied from the cleaning liquid nozzle toward the spinner table 40a.

[0067] In the cleaning section 40, for example, the workpiece 11 is held on the spinner table 40a so that one side of the workpiece 11 is exposed, and then a cleaning liquid is supplied from a cleaning liquid nozzle toward the spinner table 40a while the spinner table 40a is rotated, thereby cleaning the one side of the workpiece 11.

[0068] The workpiece 11, one side of which has been cleaned, is transported by the transport unit 8 from the cleaning section 40 to the inspection section 42 and inspected; specifically, it is checked whether the workpiece 11 has been ground normally (for example, whether the workpiece 11 has been damaged during grinding).

[0069] 6 is a perspective view that schematically shows the inspection unit 42. The inspection unit 42 is provided with an inspection table (support table) 44 that can be pulled out from the housing of the grinding device 2. The inspection table 44 has a similar structure to the chuck table 24 provided in the grinding unit 22, except that the upper surface of the inspection table 44 is generally flat rather than having a shape that corresponds to the side surface of a cone.

[0070] That is, the inspection table 44 has a frame 44a having a disk-shaped bottom wall and a cylindrical side wall extending from the outer periphery of the bottom wall, and a porous plate 44b fixed to a recess formed in the upper surface of the frame 44a. The bottom wall of the frame 44a is formed with a flow path that opens at the bottom surface of the recess and penetrates the bottom wall.

[0071] This flow path communicates with a suction source (not shown) via a valve (not shown) and also communicates with a gas supply source (not shown) via another valve (not shown). The suction source and gas supply source that can communicate with the flow path formed in the bottom wall of frame 44a have the same structures as, for example, suction source 32a and gas supply source 32b described above.

[0072] A foreign matter removal unit 46 is provided above the inspection table 44. This foreign matter removal unit 46 is used, for example, to remove foreign matter adhering to the inspection table 44 and the workpiece 11 held on the inspection table 44, as well as foreign matter adhering to the robot hand 10 and the workpiece 11 held on the surface side of the robot hand 10.

[0073] The foreign matter removal unit 46 has a cover 48 including a flat top plate 48a and a rectangular cylindrical side plate 48b. A through-hole is formed at the front end of the side plate 48b, penetrating the side plate 48b in the left-right direction, and a pipe nozzle (air blower) 50 is inserted into this through-hole.

[0074] The pipe nozzle 50 is connected to, for example, a gas supply source having a structure similar to the gas supply source 32b described above via a hose (not shown) etc. A plurality of nozzles are formed in the lower rear side of the pipe nozzle 50 so as to be aligned in the left-right direction, and when the gas supply source is operated, gas is sprayed diagonally downward and rearward from the plurality of nozzles.

[0075] In addition, a suction unit 52 is provided behind the pipe nozzle 50. Specifically, a through-hole that passes through the top plate 48a in the vertical direction is formed in the central rear part of the top plate 48a, and the suction unit 52 is provided so as to communicate with this through-hole.

[0076] The suction unit 52 has a duct hose 52a whose lower end is connected to the rear center of the top plate 48a, and a fan 52b connected to the upper end of the duct hose 52a. When the fan 52b is operated, gas present inside and below the cover 48 is sucked upward through the duct hose 52a.

[0077] Furthermore, the foreign object removal unit 46 (specifically, the cover 48) is connected to a front-to-rear movement mechanism (not shown) and a vertical movement mechanism. Each of these movement mechanisms includes, for example, a motor and a ball screw. When the front-to-rear movement mechanism is operated, the foreign object removal unit 46 moves in the front-to-rear direction, and when the vertical movement mechanism is operated, the foreign object removal unit 46 moves in the vertical direction.

[0078] The inspection unit 42 inspects whether the workpiece 11 has been ground normally, for example, in the following order: First, the pipe nozzle 50 is positioned diagonally above and in front of the rear end of the inspection table 44, and the forward / backward movement mechanism and / or the vertical movement mechanism is operated to move the two closer together until the gap between them in the vertical direction becomes less than a predetermined distance (for example, 1 cm).

[0079] Next, the foreign matter removal unit 46 is used to remove foreign matter adhering to the inspection table 44. Specifically, while the gas supply source and fan 52b, which are connected to the pipe nozzle 50 via a hose or the like, are both operating, the forward / backward movement mechanism is operated to gradually move the foreign matter removal unit 46 forward.

[0080] As a result, gas is blown from an upper front diagonally upward toward the region near the rear end of the upper surface (holding surface) of the inspection table 44, in order from the region near the front end, and the gas that hits each region is sucked upward. At this time, foreign matter adhering to the inspection table 44 is also sucked upward together with the gas. As a result, the foreign matter adhering to the inspection table 44 is removed.

[0081] When using the foreign matter removal unit 46 to remove foreign matter adhering to the inspection table 44, a gas supply source communicating with a flow path formed in the bottom wall of the frame 44a of the inspection table 44 may be operated. In this case, foreign matter stuck in the porous plate 44b can be easily removed.

[0082] Next, the workpiece 11 is carried into the inspection table 44 by the transport unit 8. Specifically, first, while holding one side of the workpiece 11 on the front side of the robot hand 10, the moving mechanism 12 is operated so that the other side of the workpiece 11 comes into contact with the holding surface of the inspection table 44.

[0083] Next, the operation of the suction source is stopped and then the gas supply source communicating with the multiple suction holes is operated so that the workpiece 11 is separated from the surface of the robot hand 10. This completes the loading of the workpiece 11 onto the inspection table 44.

[0084] Next, a suction source communicating with a flow path formed in the bottom wall of the frame 44a of the inspection table 44 is operated so that the workpiece 11 is held on the inspection table 44 with one side exposed.

[0085] Next, the foreign matter adhering to the workpiece 11 is removed using the foreign matter removal unit 46. Note that the foreign matter adhering to the workpiece 11 is removed in the same procedure as that for foreign matter adhering to the inspection table 44, and therefore a detailed description thereof will be omitted.

[0086] Next, for example, the operator pulls out the inspection table 44 from the housing of the grinding device 2. Next, the operator visually checks the workpiece 11 held on the inspection table 44 to confirm whether the workpiece 11 has been ground normally.

[0087] Once it is confirmed whether the workpiece 11 has been ground normally, the operator, for example, pushes the inspection table 44 into the housing of the grinding device 2. Then, the operation of the suction source communicating with the flow path formed in the bottom wall of the frame 44a of the inspection table 44 is stopped, and then the gas supply source communicating with this flow path is operated.

[0088] As a result, the flow path formed in the bottom wall of the frame 44a of the inspection table 44 returns to normal pressure, and the suction force acting on the workpiece 11 disappears. As a result, the workpiece 11 is no longer held by the inspection table 44 but simply placed thereon. This completes the inspection in the inspection unit 42 to determine whether the workpiece 11 has been ground normally.

[0089] 7 is a flowchart showing a schematic example of a method for grinding the workpiece 11 in the grinding device 2. In the following, explanations of the specific contents of each step included in this method that overlap with the above-mentioned contents will be omitted as appropriate, and only the main points of the operation of each step will be explained.

[0090] In this method, first, foreign matter adhering to the robot hand 10 is removed (removal step S1). In this removal step S1, first, the movement mechanism 12 (specifically, the motor connected to the base end of the spindle 18b of the second drive unit 18) is operated so that the surface of the robot hand 10 faces upward.

[0091] Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the actuator and arm 16 of the first drive unit 14) are operated so that the pipe nozzle 50 is positioned diagonally above and in front of the rear end of the robot hand 10 (e.g., the tip of the pair of arms 10b of the robot hand 10) and the two are brought closer together until the vertical distance between them becomes less than a predetermined distance (e.g., 1 cm).

[0092] Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the arm 16) are operated so as to gradually move the robot hand 10 backward while operating the gas supply source and the fan 52b, which are connected to the pipe nozzle 50 via a hose or the like.

[0093] As a result, gas is sprayed from an upper front diagonal direction from the area near the rear end of the robot hand 10 to the area near the front end (for example, the base end 10a of the robot hand 10), and the gas that hits each area is sucked upward. At this time, foreign matter adhering to the surface of the robot hand 10 is also sucked upward together with the gas. As a result, the foreign matter adhering to the surface of the robot hand 10 is removed.

[0094] Furthermore, in the removal step S1, foreign matter adhering to not only the front surface but also the back surface of the robot hand 10 may be removed. Note that foreign matter adhering to the back surface of the robot hand 10 is removed in the same procedure as foreign matter adhering to the front surface, and therefore detailed description thereof will be omitted.

[0095] After the removing step S1, the workpiece 11 is transported from the cassette 6 to the position adjusting unit 20 (transporting step S2). Fig. 8 is a flowchart showing the specific details of the transporting step S2. In this transporting step S2, first, one surface of the workpiece 11 stored in the cassette 6 is held on the front surface side of the robot hand 10, and then the robot hand 10 is moved to transport the workpiece 11 out of the cassette 6 (transporting step S21).

[0096] After the carry-out step S21, the foreign matter removal unit 46 is used to remove foreign matter adhering to the workpiece 11 held on the front surface side of the robot hand 10 (removal step S22). In this removal step S22, first, the moving mechanism 12 (specifically, the motor connected to the base end of the spindle 18b of the second drive unit 18) is operated so that the other surface of the workpiece 11 faces upward, that is, so that the workpiece 11 is positioned above the robot hand 10.

[0097] Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the actuator and arm 16 of the first drive unit 14) are operated so that the pipe nozzle 50 is positioned diagonally above and in front of the rear end of the workpiece 11 and the two are brought closer together until the vertical distance between them becomes less than a predetermined distance (e.g., 1 cm).

[0098] Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the arm 16) are operated so as to gradually move the workpiece 11 backward while operating the gas supply source and the fan 52b which are connected to the pipe nozzle 50 via a hose or the like.

[0099] As a result, gas is blown from an upper front obliquely toward the area near the rear end of the other surface of the workpiece 11 in order from the area near the front end to the area near the front end, and the gas that hits each area is sucked upward. At this time, foreign matter adhering to the other surface of the workpiece 11 is also sucked upward together with the gas. As a result, the foreign matter adhering to the other surface of the workpiece 11 is removed.

[0100] Furthermore, in the removal step S22, foreign matter adhering to one surface (specifically, an area of ​​one surface that does not overlap with the robot hand 10) as well as the other surface of the workpiece 11 may be removed. Note that foreign matter adhering to one surface of the workpiece 11 is removed in the same procedure as foreign matter adhering to the other surface, and therefore detailed description thereof will be omitted.

[0101] After the removing step S22, the workpiece 11 is loaded onto the positioning table 20a so that the workpiece 11 is supported with one surface exposed (loading step S23). In this loading step S23, first, the moving mechanism 12 (specifically, the motor connected to the base end of the spindle 18b of the second driving unit 18) is operated so that the other surface of the workpiece 11 faces downward, i.e., so that the workpiece 11 is positioned below the robot hand 10.

[0102] Next, the horizontal movement mechanism connected to the case 14a of the first drive unit 14 and the movement mechanism 12 (specifically, the actuator and arm 16 of the first drive unit 14) are operated so as to bring the top surface of the positioning table 20a into contact with the other surface of the workpiece 11. Next, the operation of the suction source is stopped and the gas supply source communicating with the multiple suction holes is operated so that the workpiece 11 is separated from the surface of the robot hand 10. This completes the transfer step S2.

[0103] After the transport step S2, the position of the workpiece 11 is adjusted in the position adjustment unit 20 (adjustment step S3). In this adjustment step S3, for example, a plurality of pins arranged around the positioning table 20a are moved radially inward of the positioning table 20a in a plan view to contact the workpiece 11.

[0104] After the adjustment step S3, the workpiece 11 is held on the chuck table 24 with one surface exposed (holding step S4). In this holding step S4, the workpiece 11 is placed on the chuck table 24 so that one surface is exposed, and then the suction source 32a is operated and the valve 30a is opened.

[0105] After the holding step S4, the grinding unit 34 is used to grind one surface of the workpiece 11 held on the chuck table 24 (grinding step S5). In this grinding step S5, the spindle 36 is lowered with the plurality of grinding wheels 38b in contact with one surface of the workpiece 11 while both the chuck table 24 and the spindle 36 are rotated and grinding fluid is supplied from the grinding fluid nozzle toward the chuck table 24.

[0106] After grinding step S5, one surface of workpiece 11 is cleaned in cleaning section 40 (cleaning step S6). In this cleaning step S6, for example, workpiece 11 is held on spinner table 40a so that one surface is exposed, and then cleaning liquid is supplied from a cleaning liquid nozzle toward spinner table 40a while spinner table 40a is rotated.

[0107] After the cleaning step S6, the workpiece 11 is held on the inspection table 44 with one surface exposed (holding step S7). In this holding step S7, the workpiece 11 is placed on the inspection table 44 so that one surface is exposed, and then a suction source communicating with a flow path formed in the bottom wall of the frame 44a of the inspection table 44 is operated.

[0108] After the holding step S7, it is inspected whether or not grinding of the workpiece 11 has been performed normally (inspection step S8). In this inspection step S8, for example, the operator pulls out the inspection table 44 from the housing of the grinding device 2, and then the operator visually inspects the workpiece 11 held on the inspection table 44.

[0109] After the inspection step S8, the workpiece 11 is transported from the inspection unit 42 to the cassette 6 (transport step S9). In this transport step S9, one surface of the workpiece 11 is held on the front surface side of the robot hand 10, and then the robot hand 10 is moved to transport the workpiece 11 from the inspection unit 42 to the cassette 6.

[0110] In the grinding device 2, the foreign matter removal unit 46 provided above the inspection table 44 can be used to remove foreign matter adhering to the robot hand 10 of the transport unit 8 when it is not holding the workpiece 11 in removal step S1, and to remove foreign matter adhering to the workpiece 11 held on the surface side of the robot hand 10 in removal step S22.

[0111] Therefore, in the grinding device 2, it is possible to reduce the probability of the workpiece 11 being damaged due to holding the workpiece 11 via foreign matter attached to the workpiece 11 in the holding step S7.

[0112] It should be noted that the above is one aspect of the present invention, and the present invention is not limited to the above. For example, the processing device of the present invention may be any device that processes the workpiece 11 while holding the workpiece 11. In other words, the processing device of the present invention is not limited to a grinding device, and may be, for example, a cutting device or a laser processing device.

[0113] Furthermore, the processing apparatus of the present invention may be provided with a transport unit 8 having a robot hand capable of holding the workpiece 11 on either of its two sides (front and back) instead of the robot hand 10. In this case, it is preferable because it can reduce the possibility of foreign matter adhering from the robot hand 10 to the workpiece 11.

[0114] Specifically, in this case, the unground workpiece 11 can be held only on the front side of the robot hand, and the ground workpiece 11 can be held only on the back side. In other words, in this case, even if a foreign object adheres to the back side of the robot hand from the ground workpiece 11, the unground workpiece 11 will not be transported on this back side. Therefore, in this case, the possibility of foreign object adhering to the workpiece 11 from the robot hand 10 can be reduced.

[0115] On the other hand, a robot hand capable of holding the workpiece 11 on either side thereof tends to be thicker than the robot hand 10. If the robot hand is thicker, there is a higher probability that the workpiece 11 will come into contact with the robot hand when carrying the workpiece 11 out of or into the cassette 6, and that the workpiece 11 will be damaged.

[0116] Therefore, compared to a robot hand that can hold the workpiece 11 on either side, the robot hand 10 is preferable in that it can transport the workpiece 11 out of the cassette 6 and transport it into the cassette 6 without damaging the workpiece 11.

[0117] Furthermore, the processing apparatus of the present invention may be provided with a transport unit 8 having, as a holding part, a gripping mechanism capable of gripping the outer periphery of the workpiece 11, instead of the robot hand 10. This gripping mechanism includes three or more gripping members that are arranged at approximately equal angular intervals in a plan view.

[0118] In such a transport unit 8, the workpiece 11 is held by gripping the outer periphery of the workpiece 11 with each gripping member. In this case, it is preferable to use the foreign matter removal unit 46 in order to remove foreign matter adhering to almost the entire area of ​​both surfaces (one surface and the other surface) of the workpiece 11 held by the gripping mechanism.

[0119] On the other hand, when the workpiece 11 is held by such a gripping mechanism, the workpiece 11 is likely to fall, for example, when the workpiece 11 is turned upside down. If the workpiece 11 falls, there is a risk that the workpiece 11 will be damaged, and it is necessary to stop all processing in the grinding device 2 and recover the fallen workpiece 11.

[0120] Therefore, compared to such a gripping mechanism, the robot hand 10 is preferable in that it can reduce the probability of damage to the workpiece 11 and improve the throughput of the grinding device 2.

[0121] Furthermore, the processing apparatus of the present invention does not need to include the position adjustment unit 20 and / or the cleaning unit 40. In this case, the workpiece 11 may be carried onto the chuck table 24 and / or carried out from the chuck table 24 using the transport unit 8.

[0122] Furthermore, the processing apparatus of the present invention may be provided with an inspection unit 42 provided with an inspection table for simply supporting the workpiece 11 without holding it, instead of the inspection table 44. In this case, the structure of the inspection unit 42 is simplified, which is preferable in that the manufacturing cost thereof is reduced.

[0123] On the other hand, if the inspection table is pulled out from the housing of the grinding device 2 while the workpiece 11 is simply supported, the workpiece 11 is likely to fall off the inspection table. If the workpiece 11 falls, there is a risk that the workpiece 11 will be damaged, and it will be necessary to stop all processing in the grinding device 2 and recover the fallen workpiece 11.

[0124] Therefore, the inspection table 44 is preferable to an inspection table that simply supports the workpiece 11 without holding it, in that it reduces the likelihood of damage to the workpiece 11 and can improve the throughput of the grinding device 2.

[0125] The processing apparatus of the present invention may also include an inspection section 42 in which a blow-type ionizer (static eliminator) is provided as a foreign matter removal unit instead of or in addition to the pipe nozzle (blower) 50 and the duct hose 52a and fan 52b (suction section 52). This ionizer is provided, for example, inside the cover 48 and is capable of blowing ion-containing gas downward.

[0126] Furthermore, the method for processing a workpiece of the present invention may be any method that removes foreign matter adhering to at least one of the robot hand 10 when not holding the workpiece 11 or the workpiece 11 held on the surface side of the robot hand 10 prior to holding the workpiece 11 on the chuck table 24.

[0127] For example, the method for processing a workpiece of the present invention may be a method for processing a workpiece that includes the steps shown in Figures 7 and 8 except that it does not include the removing step S1 before the conveying step S2 that includes the removing step S22. Alternatively, the method for processing a workpiece of the present invention may be a method for processing a workpiece that includes the steps shown in Figures 7 and 8 except that it does not include the removing step S22.

[0128] Furthermore, in the method for processing the workpiece of the present invention, the removal step S1 may be performed every time before the transport step S2, or the removal step S1 may be performed every time the transport step S2 is performed a predetermined number of times (for example, a number corresponding to one lot of workpieces 11 contained in the cassette 6 (for example, 25 times)).

[0129] In addition, in the method for processing a workpiece of the present invention, between the cleaning step S6 and the holding step S7, foreign matter adhering to the workpiece 11 held on the surface side of the robot hand 10 may be removed using a foreign matter removal unit 46.

[0130] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0131] 2: Grinding equipment 4: Cassette table (4a: top) 6: Cassette (6a: top plate, 6b, 6c: side plates, 6d: groove, 6e: connecting member) 8: Transport unit 10: Robot hand (holding part) (10a: proximal end, 10b: arm) 11: Workpiece 12: Movement mechanism 13: Wafer (13a: front surface, 13b: back surface) 14: First drive unit (14a: Case) 15: Device 16: Arm (16a: first arm, 16b: second arm, 16c: second joint) 18: Second drive unit (18a: case, 18b: spindle) 20: Position adjustment unit (20a: positioning table, 20b: position adjustment mechanism) 22: Grinding section 24: Chuck table (holding table) 26: Frame (26a: bottom wall, 26b: side wall, 26c: flow path) 28: Porous plate 30a, 30b: Valve 32a: Suction source 32b: Gas supply source 34: Grinding unit (processing unit) 36: Spindle (36a: Mount) 38: Grinding wheel (38a: base, 38b: grinding stone) 40: cleaning section (40a: spinner table, 40b: cleaning unit) 42: Inspection Department 44: Inspection table (support table) (44a: frame, 44b: porous plate) 46: Foreign body removal unit 48: Cover (48a: top plate, 48b: side plate) 50: Pipe nozzle (blower) 52: Suction part (52a: duct hose, 52b: fan)

Claims

1. A processing device for processing one surface of a workpiece including one surface and another surface located opposite to the one surface, a holding table for holding the workpiece with the one surface of the workpiece exposed; a processing unit for processing the one surface side of the workpiece held on the holding table; a support table for supporting the workpiece in a state in which the one surface of the workpiece processed by the processing unit is exposed; a conveying unit including a holder for holding the workpiece supported on the support table, and a moving mechanism for moving the holder holding the workpiece; a foreign matter removal unit provided above the support table for removing foreign matter adhering to at least one of the holder when not holding the workpiece and the workpiece held by the holder; A processing device comprising:

2. 2. The processing apparatus according to claim 1, wherein the foreign matter removal unit removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holder.

3. 2. The processing apparatus according to claim 1, wherein the foreign matter removal unit removes foreign matter adhering to at least one of the support table when not supporting the workpiece and the workpiece supported on the support table.

4. The foreign matter removal unit comprises: a blower for blowing gas diagonally downward toward the rear; 4. The processing apparatus according to claim 1, further comprising a suction section provided behind the blower section for sucking the gas.

5. 4. The processing apparatus according to claim 1, wherein the foreign matter removal unit has a static eliminator for blowing a gas containing ions downward.

6. A method for processing a workpiece, the method comprising: processing one surface of a workpiece including one surface and another surface located opposite to the one surface; a first conveying step of holding the workpiece accommodated in a cassette by a holding portion of a conveying unit and then conveying the workpiece from the cassette by moving the holding portion; a holding step of holding the workpiece on a holding table with the one surface exposed after the first conveying step; a processing step of processing the one surface side of the workpiece held on the holding table after the holding step; a supporting step of supporting the workpiece on a support table in a state where the one surface of the workpiece whose one surface has been processed is exposed after the processing step; a second conveying step of, after the supporting step, holding the workpiece supported on the support table by the holding unit and then moving the holding unit to convey the workpiece to the cassette; a removal step of removing foreign matter adhering to the holder using a foreign matter removal unit provided above the support table before the first transport step, and / or removing foreign matter adhering to the workpiece held by the holder using the foreign matter removal unit during the first transport step; A method for processing a workpiece, comprising:

7. 7. The method for processing a workpiece according to claim 6, wherein the removing step removes foreign matter adhering to each of the one surface and the other surface of the workpiece held by the holding portion.

8. The method for processing a workpiece according to claim 6, further comprising a second removal step of using the foreign matter removal unit to remove foreign matter adhering to the support table before the supporting step, and / or using the foreign matter removal unit to remove foreign matter adhering to the workpiece during the supporting step.

9. A method for processing a workpiece according to any one of claims 6 to 8, wherein in the removal step, gas is blown toward the holding part or the workpiece from above and diagonally in front, and the gas that collides with the holding part or the workpiece is sucked upward.

10. 9. The method for processing a workpiece according to claim 6, wherein in the removing step, a gas containing ions is blown from above toward the holder or the workpiece.

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