Method for manufacturing ceramic component

Abstract

To provide a technique for improving the durability of a ceramic component in a method for manufacturing the ceramic component.SOLUTION: A method of manufacturing a ceramic component includes removing a part of a ceramic porous body from a surface side of the ceramic component, filling a portion from which the part of the ceramic porous body is removed with a filler containing ceramic powder and a pore former, and irradiating the portion filled with the filler with a laser beam to thermally decompose the pore former and sinter the ceramic powder.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a ceramic component. [Background technology]

[0002] BACKGROUND ART Conventionally, ceramic parts used in electrostatic chucks have been known that have a ceramic porous body in a gas flow path that suppresses the occurrence of discharge (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7255659 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even with prior art such as that disclosed in Patent Document 1, there is still room for improvement in the technology for improving the durability of ceramic parts in the manufacturing method of ceramic parts.

[0005] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a technique for improving the durability of a ceramic part in a manufacturing method of the ceramic part. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following aspects.

[0007] (1) According to one aspect of the present invention, there is provided a method for manufacturing a ceramic part used in a holding device for holding an object, the ceramic part having a ceramic as its main component, a gas flow path formed therein, and a ceramic porous body within the gas flow path. This method for manufacturing the ceramic part includes removing a portion of the ceramic porous body from the surface side of the ceramic part, filling the removed portion of the ceramic porous body with a filler material containing ceramic powder and a pore-forming material, and irradiating the filled portion with laser light to thermally decompose the pore-forming material and sinter the ceramic powder.

[0008] According to this configuration, if the ceramic porous body of a ceramic part is damaged, the damaged portion of the ceramic porous body is removed, and the removed portion is filled with a filler containing ceramic powder and a pore-forming material. The filler filled in the ceramic porous body is irradiated with laser light to sinter the ceramic powder, so that the sintered ceramic powder becomes part of the ceramic porous body, repairing the damaged ceramic porous body and forming a new ceramic porous body. This makes it possible to repair a damaged ceramic porous body without using an adhesive containing, for example, a resin. Therefore, the heat resistance of a ceramic part in use can be improved while maintaining plasma resistance, thereby improving the durability of the ceramic part.

[0009] (2) In the method for manufacturing a ceramic part according to the above aspect, the filler may contain carbon powder as the pore-forming material. According to this configuration, the filler contains carbon powder that easily absorbs laser light. This improves the sinterability of the ceramic powder in the filler, which becomes part of the ceramic porous body upon irradiation with laser light.

[0010] (3) In the method for manufacturing a ceramic part according to the above aspect, the filler may contain, as the filler, a powder composed of the same type of ceramic as the ceramic that constitutes the ceramic porous body. According to this configuration, the filler contains, as the ceramic powder, a powder composed of the same type of ceramic as the ceramic that constitutes the ceramic porous body. As a result, a new ceramic porous body formed by sintering the ceramic powder of the filler is made of the same material as the ceramic porous body before repair, and therefore can have the same level of plasma resistance as the ceramic part before damage.

[0011] (4) In the method for manufacturing a ceramic part according to the above aspect, the laser beam may be irradiated using a continuous wave laser. According to this configuration, the laser beam is irradiated using a continuous wave laser that can irradiate a relatively wide area with the laser beam uniformly. This allows the ceramic powder to be sintered relatively uniformly throughout the entire area where the filler is filled, thereby further improving the heat resistance of the ceramic part.

[0012] (5) In the method for manufacturing a ceramic part according to the above aspect, the laser light irradiation may be performed so that the entire filler is maintained at a temperature in the range of 1200°C to 1600°C for 10 seconds to 30 minutes. According to this configuration, the laser light irradiation is performed so that the entire filler is maintained at a temperature in the range of 1200°C to 1600°C for 10 seconds to 30 minutes. This can improve the sinterability of the ceramic powder.

[0013] The present invention can be realized in various forms, such as a method for repairing ceramic parts, a method for joining a ceramic porous body to a holding device, a method for manufacturing a holding device, a system including a holding device, a control method for these devices and systems, a computer program for causing these devices and systems to hold objects, a server device for distributing the computer program, and a non-transitory storage medium on which the computer program is stored. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 2 is a perspective view of the holding device of the first embodiment. [Figure 2] FIG. 2 is a cross-sectional view of the holding device of the first embodiment. [Figure 3] FIG. 3 is an enlarged view of part A in FIG. 2. [Figure 4] FIG. 3 is a partially enlarged view of a ceramic portion provided in the holding device of the first embodiment. [Figure 5] FIG. 3 is a first view illustrating a method for repairing the holding device of the first embodiment. [Figure 6] FIG. 10 is a second view illustrating the repair method for the holding device of the first embodiment. [Figure 7] FIG. 10 is a third view illustrating the repair method for the holding device of the first embodiment. [Figure 8] FIG. 10 is a fourth diagram illustrating the repair method for the holding device of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] First Embodiment FIG. 1 is a perspective view of a holding device according to this embodiment. FIG. 2 is a cross-sectional view of the holding device according to this embodiment. The holding device 100a according to this embodiment is an electrostatic chuck that attracts and holds an object, such as a wafer W, by electrostatic attraction. The electrostatic chuck is used, for example, as a table on which the wafer W is placed in an etching process using plasma in a chamber equipped with the electrostatic chuck. The holding device 100a includes a ceramic part 10, a base part 20, and a bonding part 30. In the holding device 100a according to this embodiment, as shown in FIG. 1, the ceramic part 10, the bonding part 30, and the base part 20 are stacked in this order. For convenience, in FIGS. 1 and 2, the stacking direction of the ceramic part 10, the bonding part 30, and the base part 20 is defined as the z-axis direction, and an x-axis that intersects perpendicularly with the z-axis and a y-axis that intersects perpendicularly with the z-axis and the x-axis are shown.

[0016] 2, a gas flow path 40 is formed inside the holding device 100a. The gas flow path 40 opens to the surface 10a on the positive side in the z-axis direction of the ceramic part 10 and to the surface 20b on the negative side in the z-axis direction of the base part 20. In the gas flow path 40, an inert gas such as helium gas flows from the surface 20b side of the base part 20 to the surface 10a side of the ceramic part 10.

[0017] The ceramic portion 10 is a generally disk-shaped component whose main component is ceramic. Here, "main component" refers to the component with the highest content. The ceramic portion 10 of this embodiment is mainly composed of alumina (Al2O3). That is, the ceramic portion 10 contains aluminum oxide. The ceramic portion 10 includes a base portion 11, a chuck electrode 12, and a ceramic porous body 13.

[0018] The base 11 is a component made of ceramic and has a substantially circular disk shape. The base 11 of this embodiment is made of alumina and has substantially the same shape as the ceramic part 10. Note that the material forming the base 11 may also be other ceramic materials such as aluminum nitride (AlN) or silicon carbide (SiC).

[0019] Gas flow channels 41a, 41b, and 41c are formed inside the base 11 as part of the gas flow channel 40. The gas flow channel 41a is formed on the base portion 20 side of the ceramic part 10 along the z-axis direction and communicates with a gas flow channel 43 formed in the joining part 30, which will be described later. The gas flow channel 41b is formed along a direction substantially parallel to a plane including the x-axis and y-axis and communicates with the gas flow channel 41a. The gas flow channel 41c is formed on the surface 10a side of the ceramic part 10 along the z-axis direction and opens to the outside of the ceramic part 10 at the surface 10a of the ceramic part 10. The gas flow channel 41c communicates with the gas flow channel 41b and the outside of the surface 10a of the ceramic part 10.

[0020] The chuck electrode 12 is disposed inside the base 11. The chuck electrode 12 is formed of a conductive material such as tungsten (W), molybdenum (Mo), or platinum (Pt). The chuck electrode 12 is connected to an external power supply via an electrode terminal (not shown). When power is supplied from the external power supply, the chuck electrode 12 generates an electrostatic attraction force capable of attracting and holding the wafer W on the surface 10a of the ceramic part 10. In addition to the chuck electrode 12, a high-frequency electrode or a heater electrode may be disposed in the ceramic part 10.

[0021] 2, the surface 10a of the ceramic part 10 is formed in an annular shape with the outer peripheral part 101a protruding in the positive direction of the z-axis beyond the inner part 102a of the outer peripheral part 101a. As a result, when the wafer W is attracted and held on the surface 10a by the electrostatic attraction force generated by the chuck electrode 12, a gap G is formed between the wafer W and the inner part 102a of the surface 10a, as shown in FIG.

[0022] The ceramic porous body 13 is a substantially cylindrical member made of ceramic such as alumina, yttria, or a rare earth oxide having relatively high plasma resistance. The ceramic porous body 13 has insulating properties and is provided to suppress discharge that occurs through the gas flow path 40 during a plasma-based etching process.

[0023] The ceramic porous body 13 has numerous pores formed as traces of a particulate pore-forming material that has been burned (disappeared) during the manufacturing process of the ceramic porous body 13. Examples of the pore-forming material used when manufacturing the ceramic porous body 13 include synthetic resin beads and carbon powder. Some of the pores formed in the ceramic porous body 13 are interconnected, forming paths through which the inert gas flowing through the gas flow path 40 can pass. This makes the ceramic porous body 13 gas permeable.

[0024] FIG. 3 is an enlarged view of portion A in FIG. 2. FIG. 4 is a partially enlarged view of the ceramic part included in the holding device of this embodiment. FIG. 4 is a view of the holding device 100a as seen from the positive side in the z-axis direction, and is an enlarged view of a part of the surface 10a of the ceramic part 10, including the porous ceramic body 13. As shown in FIGS. 3 and 4, the porous ceramic body 13 is installed in the gas flow path 41c. The pores of the porous ceramic body 13 communicate with the gas flow path 41b and the outside of the surface 10a of the ceramic part 10.

[0025] The base portion 20 is a generally disk-shaped component made primarily of a metal such as aluminum or an aluminum alloy, a composite of metal and ceramic such as Al-SiC, or a ceramic such as SiC. In this embodiment, the base portion 20 is made of aluminum. The base portion 20 is larger than the ceramic portion 10. For example, if the diameter of the ceramic portion 10 is 300 mm, the diameter of the base portion 20 is 340 mm. The size relationship between the ceramic portion 10 and the base portion 20 is not limited to this; they may be the same size.

[0026] A plurality of coolant flow paths 21 are formed inside the base portion 20. A coolant such as a fluorine-based inert liquid or water flows through the coolant flow paths 21. When the holding device 100a is used in a plasma etching process, the heat of the plasma is removed from the holding device 100a by the coolant. Furthermore, when the coolant flows through the coolant flow paths 21, the base portion 20 is cooled, and the ceramic portion 10 is cooled via the bonding portion 30. As a result, the wafer W held on the surface 10a of the ceramic portion 10 is cooled.

[0027] A gas flow path 42 constituting the gas flow path 40 is formed inside the base portion 20. The gas flow path 42 is formed in the base portion 20 so as to penetrate the base portion 20 along the z-axis direction. The gas flow path 42 is in communication with a gas flow path 43 formed in the joint portion 30.

[0028] The bonding portion 30 bonds the ceramic portion 10 and the base portion 20. The bonding portion 30 is, for example, a bonding sheet containing a silicone-based organic bonding agent, an inorganic bonding agent, or an Al-based metal adhesive. It is desirable for the bonding portion 30 to have high adhesive strength to both the ceramic portion 10 and the base portion 20, as well as high pressure resistance and high thermal conductivity.

[0029] A gas flow channel 43 constituting the gas flow channel 40 is formed inside the joint portion 30. The gas flow channel 43 is formed in the joint portion 30 so as to penetrate the joint portion 30 along the z-axis direction. The gas flow channel 43 communicates with the gas flow channel 41a formed in the ceramic portion 10 and the gas flow channel 42 formed in the base portion 20.

[0030] Next, a method for manufacturing the retaining device 100a of this embodiment will be described. In the method for manufacturing the retaining device 100a, the ceramic part 10 and the base part 20 are manufactured separately, and the separately manufactured ceramic part 10 and base part 20 are joined together by the joining part 30.

[0031] The method for manufacturing the ceramic portion 10 involves preparing a slurry for the green sheet and a metallization paste. The slurry for the green sheet is prepared by, for example, adding an organic solvent to a mixture containing alumina powder, an acrylic binder, a dispersant, a plasticizer, etc., and mixing the mixture using a ball mill. The metallization paste is prepared by, for example, adding a conductive powder such as tungsten or molybdenum to a mixture of alumina powder, an acrylic binder, and an organic solvent, and kneading the mixture.

[0032] The prepared green sheet slurry is formed into a sheet using a casting device, and the formed product is dried. This results in a green sheet. The portions that will become gas flow channels 41a, 41b, and 41c are processed on some of the green sheets. The portions that will become chuck electrode 12 are printed on specific green sheets of the multiple green sheets using a metallization paste, for example, using a screen printing device. Then, multiple green sheets, including the green sheets with the processed portions that will become gas flow channels 41a, 41b, and 41c and the specific green sheets with the printed metallization paste, are stacked to produce a green sheet laminate.

[0033] In the method for manufacturing the ceramic part 10, the ceramic porous body 13 is manufactured separately from the manufacturing of the green sheet laminate. In the method for manufacturing the ceramic porous body 13, first, a roughly cylindrical molded body is manufactured by injection molding using a paste for the ceramic porous body obtained by kneading a mixture containing, for example, alumina powder, a pore-forming material, a binder, an organic solvent, etc. The manufactured molded body is fitted into a portion that will become the gas flow path 41c, which is formed in the green sheet laminate. The green sheet laminate with the fitted molded body is fired in an electric furnace, thereby manufacturing the ceramic part 10 in which the base 11 and the ceramic porous body 13 are integrated. However, the manufacturing method for the ceramic part 10 is not limited to this.

[0034] In the method for manufacturing the base portion 20, a plurality of metal plates, each having portions that become the refrigerant flow path 21 and the gas flow path 42, are laminated together to manufacture the base portion 20. However, the method for manufacturing the base portion 20 is not limited to this.

[0035] In the manufacturing method of the holding device 100a, a bonding sheet that becomes the bonding portion 30 is placed on the surface of either the ceramic portion 10 or the base portion 20, which are manufactured separately. The bonding sheet has a portion that becomes the gas flow path 43 processed therein, and is arranged so as to fit the portion that becomes the gas flow path 41a of the ceramic portion 10 and the portion that becomes the gas flow path 42 of the base portion 20, respectively. For example, the bonding sheet is placed on the surface of the base portion 20, and the bonding sheet is sandwiched between the ceramic portion 10 and the base portion 20, and the entire assembly is heated, thereby bonding the ceramic portion 10 and the base portion 20 at the bonding portion 30. In this manner, the holding device 100a is manufactured. However, the manufacturing method of the holding device 100a is not limited to this.

[0036] Next, a method for repairing the holding device 100a, which is a manufacturing method of the holding device of this embodiment, will be described. In the repair method for the holding device 100a, for example, if a crack occurs in the ceramic porous body 13 due to use of the holding device 100a and a portion of the body is damaged, the ceramic porous body 13 can be repaired to prevent a decrease in the plasma resistance of the holding device. This can improve the durability of the ceramic part 10.

[0037] FIG. 5 is a first diagram illustrating a method for repairing a holding device according to this embodiment. In the repair method for the holding device 100a according to this embodiment, a portion of the porous ceramic body 13 is removed from the surface 10a of the ceramic portion 10 (removal step, indicated by an open arrow R11 in FIG. 5). Specifically, a damaged portion 13a, for example, where a crack is formed, of the porous ceramic body 13 disposed inside the gas flow path 41c is cut using a machining center or the like. This leaves a remaining portion 13b of the porous ceramic body 13 in the ceramic portion 10, excluding the damaged portion 13a. The remaining portion 13b of the porous ceramic body 13 is a normal portion free of defects such as cracks. The presence or absence of cracks in the porous ceramic body 13 can be detected using X-ray CT, ultrasonic flaw detection, or the like. The method for removing the damaged portion 13a of the porous ceramic body 13 from the ceramic portion 10 is not limited to cutting using a machining center.

[0038] FIG. 6 is a second diagram illustrating a method for repairing a holding device according to this embodiment. In the method for repairing a holding device 100a according to this embodiment, after the removal step, a filler containing ceramic powder and a pore-forming material is filled into the area where the damaged portion 13a of the ceramic porous body 13 has been removed (filling step). Specifically, as indicated by the white arrow R12 in FIG. 6, the filler F0 is filled into the hole 13c where the damaged portion 13a of the ceramic porous body 13 has been removed. In the repair method for a holding device 100a according to this embodiment, the filler F0 includes ceramic powder F1, pore-forming material F2, and a binder (not shown). In this embodiment, the ceramic powder F1 is a powder composed of the same type of ceramic as the ceramic constituting the ceramic porous body 13, i.e., alumina, and the pore-forming material F2 is carbon powder. The ceramic powder F1 contained in the filler F0 may be a powder of yttria or a rare earth oxide having relatively high plasma resistance. The pore-forming material F2 may be resin beads. The filler F0 fills the inside of the hole 13c by being poured into the hole 13c from the surface 10a side of the ceramic part 10. The hole 13c corresponds to "a portion where a part of the ceramic porous body has been removed" in the claims.

[0039] FIG. 7 is a third diagram illustrating a method for repairing a holding device according to this embodiment. In the repair method for the holding device 100a according to this embodiment, after the filling step, the hole 13c filled with the filler F0 is irradiated with laser light L1 to thermally decompose the pore-forming material F2 and sinter the ceramic powder F1 (sintering step). In this embodiment, the laser light L1 is irradiated using a continuous-wave laser. In this embodiment, a Ne:YAG laser (wavelength: 1064 nm) is used. This allows the laser light L1 to be irradiated over a relatively wide area at once, allowing the ceramic powder F1 contained in the filler F0 to be sintered at a relatively uniform timing. In this embodiment, the laser light L1 is irradiated so that the entire filler F0 is maintained at a temperature range of 1200°C to 1600°C for 10 seconds to 30 minutes. The temperature of the filler F0 is detected by a radiation thermometer (not shown) included in the laser device that irradiates the laser light L1. The temperature of the filler F0 can be adjusted by controlling the output power and scanning speed of the laser light L1. The output power and scanning speed of the laser beam L1 are controlled according to the detection results of a radiation thermometer included in the laser device. The laser beam L1 may be irradiated by a pulsed laser. When the laser beam L1 is irradiated by a pulsed laser, the temperature of the filler F0 can be adjusted by controlling the on / off frequency.

[0040] In the repair method for the holding device 100a of this embodiment, when the filler F0 is irradiated with laser light L1 in the sintering step, the pore-forming material F2, which is a carbon powder with a relatively low combustion temperature, is burned and degreased. Subsequently, as the irradiation of the laser light L1 continues, the temperature of the filler F0 increases, and the ceramic powder F1, which is made of alumina, is sintered. As a result, the remaining portion 13b of the ceramic porous body 13 and the ceramic powder F1 sintered by the irradiation of the laser light L1 are integrated.

[0041] FIG. 8 is a fourth diagram illustrating the method for repairing a holding device according to this embodiment. FIG. 8 shows an enlarged cross-sectional view of a holding device 100b obtained by repairing the holding device 100a described in FIGS. 5 to 7. The holding device 100b includes a ceramic portion 50, a base portion 20, and a joint portion 30. The ceramic portion 50 includes a base portion 11, a chuck electrode 12, and a porous ceramic body 53. The porous ceramic body 53 is a new porous ceramic body obtained by repairing a partially damaged porous ceramic body 13. Like the porous ceramic body 13, the porous ceramic body 53 is made of insulating ceramic and suppresses discharges that occur through the gas flow path 40. The porous ceramic body 53 includes a porous ceramic portion 531, which was the remaining portion 13b of the porous ceramic body 13, and a porous ceramic portion 532, which is the portion where the ceramic powder F1 is sintered. In this embodiment, the ceramic powder F1 is a powder composed of the same type of ceramic as the ceramic that composes the ceramic porous body 13, and therefore the ceramic porous portions 531 and 532 have the same degree of insulating properties. As a result, the ceramic porous body 53 can suppress discharge that uses the gas flow path 40 as a discharge path during an etching process using plasma.

[0042] In the ceramic porous portion 532 of the ceramic porous body 53 of this embodiment, the size of the pores formed in the ceramic porous portion 532 is larger than the grain size of the ceramic particles forming the ceramic porous portion 532. This indicates that the binder contained in the filler F0 is easily removed from the filler F0 when the ceramic powder F1 is sintered in the sintering process described above. When the binder is easily removed, the occurrence of cracks during the sintering process can be suppressed. The size of the pores in the ceramic porous portion 532 can be measured by observing a cross section of the ceramic porous portion 532. The size of the pores and the grain size of the ceramic particles forming the ceramic porous portion 532 can be measured by electron backscatter diffraction (EBSD).

[0043] According to the manufacturing method of the holding device 100b of this embodiment described above, when the porous ceramic body 13 of the ceramic part 10 is damaged, the damaged portion 13a of the porous ceramic body 13 is removed, and the removed portion is filled with a filler F0 containing a ceramic powder F1 and a pore-forming material F2. The filler F0 filled in the porous ceramic body 13 is irradiated with laser light L1 to sinter the ceramic powder F1, whereby the sintered ceramic powder F1 becomes part of the porous ceramic body, and the damaged porous ceramic body 13 is repaired to form a new porous ceramic body 53. This makes it possible to repair a damaged porous ceramic body 13 without using an adhesive containing, for example, resin. Therefore, by repairing the ceramic part 10 during use, the ceramic part 50 can be made into a ceramic part 50 with improved heat resistance while retaining the plasma resistance provided by the porous ceramic body 53, thereby improving the durability of the ceramic part 50.

[0044] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, carbon powder that easily absorbs the laser beam L1 is used as the pore-forming material F2 in the filler F0, which improves the sinterability of the ceramic powder F1 in the filler F0, which becomes part of the ceramic porous body 53 upon irradiation with the laser beam L1.

[0045] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, the filler F0 contains, as ceramic powder F1, a powder made of the same type of ceramic as the ceramic making up the ceramic porous body 13. As a result, the new ceramic porous body 53 formed by sintering the ceramic powder F1 of the filler F0 is made of the same material as the ceramic porous body 13 before repair, and therefore the repaired ceramic part 50 can have plasma resistance at the same level as the ceramic part 10 before it was damaged.

[0046] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, the laser beam L1 is irradiated using a continuous wave laser that can irradiate the laser beam L1 uniformly over a relatively wide area, which allows the ceramic powder F1 to be sintered relatively uniformly throughout the hole 13c filled with the filler F0, thereby further improving the heat resistance of the ceramic portion 50.

[0047] Furthermore, according to the manufacturing method of the holding device 100b of this embodiment, the laser light L1 is irradiated so that the entire filler F0 is kept at a temperature in the range of 1200° C. to 1600° C. for 10 seconds to 30 minutes, thereby further improving the sinterability of the ceramic powder F1.

[0048] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0049] [Variation 1] In the above-described embodiment, carbon powder is used as the pore-forming material contained in the filler. However, the type of pore-forming material is not limited to this. Resin beads may also be used, as long as they are made of a material that disappears when irradiated with laser light L1 in the sintering step included in the above-described method for repairing a holding device.

[0050] [Variation 2] In the above-described embodiment, the porous ceramic body 13 is repaired using a filler containing a powder made of alumina, the same type of ceramic as that of the porous ceramic body 13. The type of powder contained in the filler for repairing the porous ceramic body is not limited to this. By using a powder made of the same type of ceramic as that of the porous ceramic body to be repaired as the powder for repairing the porous ceramic body, the new porous ceramic body is made of the same material as the porous ceramic body before repair, and the repaired ceramic part can have the same level of plasma resistance as the ceramic part before damage.

[0051] [Variation 3] In the above-described embodiment, the laser light irradiated in the sintering step included in the above-described method for repairing a holding device is a continuous wave laser, and the laser light irradiated is performed so that the entire filler is maintained at a temperature range of 1200°C to 1600°C for 10 seconds to 30 minutes. The characteristics of the irradiated laser light are not limited to this. A pulsed laser, in which the laser light irradiation is repeatedly turned on and off, may also be used.

[0052] [Variation 4] In the above-described embodiment, the holding device includes a ceramic portion made of ceramic, a base portion made mainly of metal, and a joining portion joining the ceramic portion and the base portion. The configuration of the holding device is not limited to this. The entire holding device may be made of ceramic, or may be made of a composite material of ceramic and metal.

[0053] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0054] <Application example 1> A method for manufacturing a ceramic part used in a holding device for holding an object, comprising: the ceramic part is mainly composed of ceramic, has a gas flow path formed therein, and has a ceramic porous body within the gas flow path; The manufacturing method includes: removing a portion of the ceramic porous body from the surface side of the ceramic component; Filling the removed portion of the ceramic porous body with a filler containing ceramic powder and a pore-forming material; The method is characterized in that a laser beam is irradiated onto the portion filled with the filler, so that the pore-forming material is thermally decomposed and the ceramic powder is sintered. Manufacturing methods for ceramic parts. <Application example 2> A method for producing a ceramic part according to Application Example 1, The filler contains carbon powder as the pore-forming material. Manufacturing methods for ceramic parts. <Application example 3> A method for producing a ceramic part according to Application Example 1 or Application Example 2, The filler is characterized in that a filler containing, as the ceramic powder, a powder made of the same type of ceramic as the ceramic that constitutes the ceramic porous body is used. Manufacturing methods for ceramic parts. <Application Example 4> A method for producing a ceramic part according to any one of Application Examples 1 to 3, The laser light irradiation is performed using a continuous wave laser. Manufacturing methods for ceramic parts. <Application example 5> A method for producing a ceramic part according to any one of Application Examples 1 to 4, The laser light irradiation is performed so that the entire filler is kept at a temperature range of 1200°C or higher and 1600°C or lower for 10 seconds or higher and 30 minutes or lower. Manufacturing methods for ceramic parts. [Explanation of symbols]

[0055] 10,50...Ceramic section 10a...(ceramic part) surface 13,53...Porous ceramic 13a...Damaged part 13c…hole part 40, 41a, 41b, 41c, 42, 43...Gas flow paths 100a,100b…holding device F0...Filler F1...ceramic powder F2…Pore forming material L1...laser light W...wafer

Claims

1. A method for manufacturing a ceramic part used in a holding device for holding an object, comprising: the ceramic part is mainly composed of ceramic, has a gas flow path formed therein, and has a ceramic porous body within the gas flow path; The manufacturing method includes: removing a portion of the ceramic porous body from the surface side of the ceramic component; Filling the removed portion of the ceramic porous body with a filler containing ceramic powder and a pore-forming material; The method is characterized in that a laser beam is irradiated onto the portion filled with the filler, so that the pore-forming material is thermally decomposed and the ceramic powder is sintered. Manufacturing methods for ceramic parts.

2. 2. A method for manufacturing a ceramic part according to claim 1, comprising: The filler contains carbon powder as the pore-forming material. Manufacturing methods for ceramic parts.

3. 2. A method for manufacturing a ceramic part according to claim 1, comprising: The filler is characterized in that a filler containing, as the ceramic powder, a powder made of the same type of ceramic as the ceramic that constitutes the ceramic porous body is used. Manufacturing methods for ceramic parts.

4. 2. A method for manufacturing a ceramic part according to claim 1, comprising: The laser light irradiation is performed using a continuous wave laser. Manufacturing methods for ceramic parts.

5. 2. A method for manufacturing a ceramic part according to claim 1, comprising: The laser light irradiation is performed so that the entire filler is kept at a temperature in the range of 1200°C to 1600°C for 10 seconds to 30 minutes. Manufacturing methods for ceramic parts.

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