Aluminum substrate, transfer jig, and substrate transfer set

The aluminum substrate and transport jig with grooves and notches address the issue of substrates detaching during air pressure by creating an air exhaust path, maintaining stability and heat dissipation.

JP2026014526APending Publication Date: 2026-01-29NIPPON SEIKI CO LTD
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Patent Information

Application Number
JP2024115659
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-19
Publication Date
2026-01-29

AI Technical Summary

Technical Problem

The risk of substrates coming off a pallet during transport due to air pressure in reflow soldering processes is a challenge in existing technologies.

Method used

An aluminum substrate with grooves on its back surface and a transport jig with corresponding grooves and notches on its mounting surface, which create an air exhaust path to prevent substrates from being dislodged by air pressure during air blowing processes.

Benefits of technology

Prevents substrates from detaching from the transport jig by effectively managing air pressure, ensuring stable positioning and efficient heat dissipation.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an aluminum substrate, a transfer jig, and a substrate transfer set capable of preventing the substrate from coming off the transfer jig.SOLUTION: The aluminum substrate 40 includes a mounting face that is a front face, and a back face 41B that is a face on the opposite side of the mounting face. A groove 42A and a groove 42B extending in the X direction and crossing the back surface side 41B are formed in the back surface side 41B.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The present disclosure relates to an aluminum substrate, a transport jig, and a substrate transport set. [Background technology]

[0002] Patent Document 1 discloses a reflow soldering device in which a substrate having electronic components mounted on a circuit surface coated with paste-like solder is placed on a metal pallet and transported by a transport device, and the pallet is heated in stages by multiple induction heating devices installed in the pallet's travel path to melt the solder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5045387 Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration described in Patent Document 1, when air is blown onto a pallet on which a substrate is placed, there is a risk that the substrate may come off the pallet due to the air pressure.

[0005] The present disclosure has been made in consideration of the above-mentioned situation, and aims to provide an aluminum substrate, a transport jig, and a substrate transport set that can prevent the substrate from coming off the transport jig. [Means for solving the problem]

[0006] In order to achieve the above object, an aluminum substrate according to a first aspect of the present disclosure comprises: a mounting surface, which is the surface; a back surface that is the surface opposite to the mounting surface, A groove is formed on the rear surface, extending in the longitudinal direction of the rear surface and traversing the rear surface.

[0007] In order to achieve the above object, a conveying jig according to a second aspect of the present disclosure comprises: A transport jig for transporting a substrate, a bottom portion having a mounting surface on which the substrate is placed; a wall portion provided upright on the outer peripheral edge of the mounting surface and facing the outer peripheral side surface of the substrate; a groove formed between two opposing locations of the wall portion with the placement surface in between, The wall portion has a notch formed therein that is continuous with both ends of the groove portion in the extending direction of the groove portion.

[0008] In order to achieve the above object, a substrate transfer set according to a third aspect of the present disclosure comprises: The aluminum substrate; the conveying jig for conveying the aluminum substrate, When the aluminum substrate is placed on the placement surface, the groove portion of the aluminum substrate faces the groove portion of the transport jig, and the longitudinal end portion of the groove portion of the aluminum substrate is positioned opposite the cutout portion of the transport jig. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to prevent the substrate from coming off the transport jig. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram of a vehicle equipped with a head-up display device according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a plan view of the aluminum substrate according to the embodiment. [Figure 3] FIG. 2 is a bottom view of the aluminum substrate according to the embodiment. [Figure 4] FIG. 2 is a plan view of the substrate transfer set according to the embodiment. [Figure 5] FIG. 2 is a perspective view of a transport jig according to the embodiment. [Figure 6] FIG. 2 is a partial perspective view of the substrate transfer set according to the embodiment; [Figure 7] FIG. 7 is a diagram of FIG. 6 with the aluminum substrate removed. [Figure 8] FIG. 2 is a partial plan view of the substrate transfer set according to the embodiment. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8. [Figure 10] FIG. 2 is a partial perspective view of the aluminum substrate according to the embodiment. [Figure 11] FIG. 2 is a partial perspective view of the aluminum substrate according to the embodiment. [Figure 12] FIG. 10 is a plan view of an aluminum substrate according to a modified example of the present disclosure. [Figure 13] FIG. 10 is a bottom view of an aluminum substrate according to a modified example of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] An aluminum substrate, a transport jig, and a substrate transport set according to an embodiment of the present disclosure will be described with reference to the drawings. As shown in Fig. 1, the head-up display device 100 is installed in the dashboard of a vehicle 200. The head-up display device 100 emits display light L that displays an image toward a windshield 201, which is the front glass of the vehicle 200. The display light L is reflected by the windshield 201 and reaches a viewer 1 (mainly the driver of the vehicle 200). As a result, a virtual image V is displayed through the windshield 201 as seen by the viewer 1, superimposed on a real scene.

[0012] The head-up display device 100 includes a display device 10, a folding mirror 20, a concave mirror 30, a control unit 50, and a housing 60.

[0013] The housing 60 is made of non-transparent resin or metal and is a hollow, approximately rectangular parallelepiped. An opening is formed in the housing 60 at a position facing the windshield 201. The housing 60 has a window 62 that closes the opening. The window 62 is made of a translucent resin such as acrylic, through which the display light L passes. The housing 60 accommodates the display device 10, the concave mirror 30, and the folding mirror 20.

[0014] The folding mirror 20 and the concave mirror 30 constitute an optical relay that guides the display light L from the display device 10 to the windshield 201. The folding mirror 20 reflects the display light L from the display device 10 toward the concave mirror 30. The folding mirror 20 is a flat mirror. Note that the folding mirror 20 is not limited to a flat mirror, and may be a free-form mirror. The concave mirror 30 reflects the display light L from the folding mirror 20 toward the windshield 201 while magnifying the light.

[0015] The display device 10 comprises a display panel 12 and an aluminum substrate 40 having a plurality of light sources 48 that irradiate the display panel 12 with illumination light. The display panel 12 is a TFT (Thin Film Transistor) type liquid crystal display panel that displays an image including vehicle information. When the display panel 12 receives illumination light from each light source 48 that passes through an optical lens (not shown) while displaying an image, the display panel 12 emits display light L that represents the image. The display panel 12 is shaped like a rectangular plate that is long in a direction corresponding to the left-right direction of the virtual image V.

[0016] The control unit 50 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), etc. The control unit 50 displays an image on the display panel 12 and controls the lighting of each light source 48. In this embodiment, the control unit 50 lights each light source 48 with uniform brightness.

[0017] As shown in FIG. 2, the aluminum substrate 40 includes a substrate main body 41, a plurality of light sources 48, and a connector 49. In the following description, of the X, Y, and Z directions relative to the aluminum substrate 40, the X direction corresponds to the left-right direction (horizontal direction) of the virtual image V as seen by the viewer 1, and is the longitudinal direction of the substrate main body 41. The Y direction corresponds to the up-down direction (vertical direction) of the virtual image V as seen by the viewer 1, and is the short-side direction of the substrate main body 41. The Z direction corresponds to the depth direction of the virtual image V as seen by the viewer 1, and is the thickness direction of the substrate main body 41. In particular, in the Y direction, the direction from a recess 41c (described later) toward the connector 49 is defined as the lower side, and conversely, the direction from the connector 49 toward the recess 41c is defined as the upper side.

[0018] The substrate body 41 is formed by laminating an insulating layer, a copper foil layer, and a protective layer on an aluminum base material. The substrate body 41 is a single-sided mounting substrate. The substrate main body 41 has a generally rectangular plate shape that is long in the X direction. The substrate main body 41 has a recess 41c and protrusions 41d and 41e. The recess 41c is formed as a notch in the center in the X direction of one of the two side surfaces (the upper side surface in FIG. 2) extending in the X direction of the substrate main body 41. The recess 41c opens upward and has a substantially rectangular space that is long in the X direction. The protrusion 41e is formed in a protruding shape at the center in the X direction of the other of the two side surfaces (the lower side surface in FIG. 2) of the substrate main body 41 that extend in the X direction. The protrusion 41e has a generally rectangular plate shape that is long in the X direction. The two protrusions 41d are located at both corners of the upper part on both sides in the X direction. The protrusion 41d has a generally rectangular plate shape that is long in the Y direction.

[0019] As shown in FIGS. 2 and 3, the board body 41 has a mounting surface 41A which is the front surface, and a back surface 41B which is the surface opposite to the mounting surface 41A. A plurality of light sources 48 and a connector 49 are mounted on the mounting surface 41A. The multiple light sources 48 are arranged in a matrix on the mounting surface 41A in the X and Y directions. In this example, five light sources 48 are arranged in the X direction and two in the Y direction. The number of light sources 48 arranged in the X direction is greater than the number of light sources 48 arranged in the Y direction. Each light source 48 is an LED (Light Emitting Diode) and emits illumination light. The connector 49 is located on the protrusion 41e of the mounting surface 41 A. The connector 49 is electrically connected to the control unit 50 via an electric wire (not shown) such as a flexible flat cable.

[0020] The substrate body 41 has a plurality of through holes 411 to 414 formed therein. The through holes 411 and 412 are aligned in the X direction at positions sandwiching the light sources 48 in the upper row. The through hole 411 is a round hole, and the through hole 412 is formed as a long hole that is elongated in the X direction. The through holes 411 and 412 are holes for fastening with screws (not shown). These screws are used to fix the aluminum substrate 40 to a case (not shown) of the display device 10.

[0021] The through holes 413 and 414 are located below the through holes 411 and 412 and are aligned in the X direction. The through hole 413 is aligned with the through hole 412 in the Y direction, and the through hole 414 is aligned with the through hole 411 in the Y direction. The through holes 413 and 414 are located below the light sources 48 in the lower row. The through hole 413 is located near the lower right corner of the substrate main body 41, and the through hole 414 is located near the lower left corner of the substrate main body 41. The through hole 413 is a circular hole, and the through hole 414 is formed as an elongated hole that is long in the X direction. The through holes 413 and 414 are holes through which a positioning pin (not shown) passes. This positioning pin is formed in a cylindrical shape on a case (not shown) of the display device 10.

[0022] 3, two parallel grooves 42A and 42B are formed on the rear surface 41B. The two grooves 42A and 42B extend in a straight line in the X direction and are formed to traverse the entire area of ​​the rear surface 41B in the X direction. 8 and 9, each of the grooves 42A, 42B is formed as a V-shaped groove. The depth of each of the grooves 42A, 42B is set to, for example, 0.3 to 0.5 mm, preferably about 0.4 mm (±0.1 mm). The angle θ formed by the two inclined surfaces 42c, 42d of this V-shaped groove is an obtuse angle. The angle θ may be an acute angle.

[0023] As shown in FIGS. 2 and 3, a plurality of light sources 48 are arranged on the mounting surface 41A on the rear surface 41B opposite to the area sandwiched between the two grooves 42A and 42B. The groove 42A is located above the plurality of light sources 48 and the through holes 413 and 414, and the groove 42B is located below the plurality of light sources 48.

[0024] Grooves 42A and 42B are formed to pass through a portion (lower portion in this example) of through holes 413 and 414. As shown in Figures 10 and 11, through holes 413 and 414 are arranged such that lower end portions Bp of the inner circumferential surfaces of through holes 413 and 414 are spaced apart from deepest portion 42z of groove 42B. In this example, deepest portion 42z is formed to reach the internal space of through holes 413 and 414. Furthermore, lower end portions Bp of the inner circumferential surfaces of through holes 413 and 414 are located on lower inclined surface 42d of two inclined surfaces 42c and 42d that form groove 42B.

[0025] In a comparative example, if the lower end Bp or the upper end of the inner circumferential surface of the through holes 413, 414 coincides with the deepest portion 42z of the groove 42B, the area of ​​the inner circumferential surface of the through holes 413, 414 would be small. In contrast, in the present embodiment, the lower end Bp or the upper end of the inner circumferential surface of the through holes 413, 414 is out of alignment with the deepest portion 42z of the groove 42B, so the area of ​​the inner circumferential surface of the through holes 413, 414 can be secured. This makes it possible to prevent damage to the inner circumferential surface of the through holes 413, 414. Furthermore, when a positioning pin (not shown) is inserted into the through holes 413, 414, uneven contact between the inner circumferential surface of the through holes 413, 414 and the outer circumferential surface of the positioning pin is prevented, thereby stably positioning the aluminum substrate 40.

[0026] In the reflow process, which is one of the manufacturing processes for the aluminum substrates 40, a substrate transfer set 5 having the aluminum substrates 40 placed on a transfer jig 70 is transferred into a reflow device (not shown). Prior to this reflow process, paste solder is applied to the mounting surface 41A of each aluminum substrate 40, and electronic components such as light sources 48 and connectors 49 are mounted, and in the reflow process, the substrate transfer set 5 is heated in stages to melt the solder and secure the electronic components to the mounting surface 41A. The substrate transfer set 5 includes a plurality of aluminum substrates 40 and a transfer jig 70 on which the plurality of aluminum substrates 40 are placed.

[0027] The following describes the transport jig 70. The X, Y, and Z directions of the transport jig 70 are defined to be the same as the X, Y, and Z directions of the aluminum substrate 40 placed on the transport jig 70. 4 and 5, the transport jig 70 is formed as a plate-like pallet that stores a plurality of aluminum substrates 40 at positions spaced apart from one another. The transport jig 70 has a plurality of storage recesses 75 that can each store an aluminum substrate 40. The transport jig 70 has a rectangular plate shape, specifically, a rectangular plate shape that is long in the X direction. The multiple accommodating recesses 75 are formed in a concave shape on the front surface of the transport jig 70, and have a generally rectangular shape that is long in the X direction. The multiple accommodating recesses 75 are arranged in a matrix in the X and Y directions on the front surface of the transport jig 70. The multiple accommodating recesses 75 are arranged in groups of three in the X direction and five in the Y direction.

[0028] 7, the accommodating recess 75 includes a bottom 71 having a mounting surface 71A, a wall 72, and two grooves 73A and 73B. The mounting surface 71A is formed on the front side of the bottom 71, and has substantially the same shape as the back surface 41B of the aluminum substrate 40, but is slightly larger in size than the back surface 41B.

[0029] The wall portion 72 is erected on the outer peripheral end of the mounting surface 71A and is formed to face the outer peripheral side surface of the aluminum substrate 40 across a gap Sk. The wall portion 72 is formed to face the entire periphery of the outer peripheral side surface of the aluminum substrate 40 excluding the side surface of the protruding portion 41e of the aluminum substrate 40.

[0030] The two grooves 73A and 73B are parallel to each other, extend in a straight line in the X direction, and are formed to traverse the entire X-direction area of ​​the mounting surface 71A. When the aluminum substrate 40 is placed on the mounting surface 71A, the groove 73A faces the groove 42A in the Z direction, and as shown in FIG. 9, the groove 73B faces the groove 42B in the Z direction. The widths (lengths in the Y direction) of the grooves 73A and 73B on the mounting surface 71A are greater than the widths (lengths in the Y direction) of the grooves 42A and 42B on the back surface 41B. The widths of the grooves 73A and 73B on the mounting surface 71A are set to be, for example, two to four times, preferably about three times, the widths of the grooves 42A and 42B on the back surface 41B. The grooves 42A and 42B are located at the centers of the grooves 73A and 73B in the Y direction. As a result, even if the aluminum substrate 40 is displaced in the Y direction relative to the transport jig 70, the grooves 42A and 42B are maintained facing the grooves 73A and 73B. The depth of the grooves 73A and 73B is greater than the depth of the grooves 42A and 42B. The cross section of the grooves 73A and 73B taken along the YZ plane is trapezoidal. The grooves 73A and 73B each have a bottom surface 73C and two inclined surfaces 73D and 73E. The two inclined surfaces 73D and 73E are formed so that the inter-surface distance between the two inclined surfaces 73D and 73E increases as the distance approaches the mounting surface 71A from both ends of the bottom surface 73C in the Y direction.

[0031] 6 to 8, the wall portion 72 has a plurality of notches 72A, 72B formed in positions facing both ends of the groove portions 73A, 73B. The notches 72A, 72B are recessed into the wall surface of the wall portion 72 and have a U-shape that opens toward the side surface of the aluminum substrate 40. The notches 72A are located at both ends of the groove portion 73A in the X direction and communicate with the groove portion 73A. The notches 72B are located at both ends of the groove portion 73B in the X direction and communicate with the groove portion 73B.

[0032] 4 and 5, the transport jig 70 has a hole 71B formed in an area that includes the protrusion 41e of the aluminum substrate 40. The hole 71B is used to remove the aluminum substrate 40 from the transport jig 70, and is also formed to release air, which is a fluid that has passed through the grooves 73A, 73B, 42A, and 42B, to the outside. 7, hole 71B penetrates conveying jig 70 in the thickness direction and has a rectangular shape, in this example, a rectangular shape that is long in the X direction. Two hole 71B are positioned so as to divide grooves 73A and 73B that extend in the X direction. That is, grooves 73A and 73B are formed in a straight line with hole 71B interposed therebetween.

[0033] Two holes 71B, namely holes 71B1 and 71B2, are formed in the mounting surface 71A of a predetermined accommodating recess 75. Hole 71B1 is formed between the mounting surface 71A of this predetermined accommodating recess 75 and the mounting surface 71A of an upper accommodating recess 75 of this predetermined accommodating recess 75. Hole 71B1 is formed in a range that includes the protrusion 41e of the aluminum substrate 40 that is accommodated in this upper accommodating recess 75. The hole 71B2 is formed across the mounting surface 71A of the predetermined accommodating recess 75 and the mounting surface 71A of the accommodating recess 75 below the predetermined accommodating recess 75. As shown in FIG. 6, the hole 71B2 is formed in a range that includes the protrusion 41e of the aluminum substrate 40 accommodated in the predetermined accommodating recess 75.

[0034] Next, a description will be given of the effect when air is blown onto the substrate transfer set 5. This air blowing is performed, for example, to remove foreign matter, dry, or form a Sn (tin) based solder layer. 6, in the air blowing process, air from the air supply source 90 is supplied toward the mounting surface 41A of the board main body 41, as indicated by arrow B. This air enters the gap Sk between the wall portion 72 and the outer peripheral side surface of the aluminum board 40, and passes through the gap Sk to reach the cutouts 72A and 72B, as indicated by arrow A1 in FIG. 8. Note that the air from the air supply source 90 may also enter the cutouts 72A and 72B directly without passing through the gap Sk. 8, the air flows from the cutouts 72A and 72B through the grooves 42A, 42B, 73A, and 73B toward the holes 71B1 and 71B2. When the air reaches the holes 71B1 and 71B2, it is released to the outside through the holes 71B1 and 71B2. By setting the air exhaust path in this manner, the aluminum substrate 40 is prevented from coming off the transport jig 70 due to the air pressure (fluid pressure) during the air blowing process.

[0035] (effect) According to the embodiment described above, the following effects are achieved. (1) The aluminum substrate 40 has a mounting surface 41A, which is a front surface, and a back surface 41B, which is a surface opposite to the mounting surface 41 A. Grooves 42A and 42B are formed on the back surface 41B, extending in the X direction, which is an example of a longitudinal direction of the back surface 41B, and traversing the back surface 41B. According to this configuration, when air is blown, air passes between the grooves 42A, 42B and the transport jig 70. This prevents pressure from increasing in the gap Sk between the outer peripheral side surface of the aluminum substrate 40 and the transport jig 70, and prevents the aluminum substrate 40 from coming off the transport jig 70.

[0036] (2) Through holes 413, 414 are formed in the aluminum substrate 40, penetrating the aluminum substrate 40 in the thickness direction. Groove portions 42A, 42B are formed so as to cross the through holes 413, 414. The deepest portions 42z of the groove portions 42A, 42B are formed on the inner circumferential surfaces of the through holes 413, 414 at positions away from the end portions (for example, the lower end portions Bp) in the Y direction, which is an example of a short direction perpendicular to the longitudinal direction of the back surface 41B. In a comparative example, if the Y-direction end of the inner circumferential surface of the through holes 413, 414 coincides with the deepest part 42z, the area of ​​the inner circumferential surface of the through holes 413, 414 becomes small, making positioning unstable when the through holes 413, 414 are used for positioning. In this regard, according to the above configuration, the Y-direction end (e.g., the lower end Bp) of the inner surface of the through holes 413, 414 is separated from the deepest part 42z, thereby ensuring the area of ​​the inner surface of the through holes 413, 414 and stabilizing positioning using the through holes 413, 414.

[0037] (3) A plurality of light sources 48 are mounted on the mounting surface 41A. The grooves 42A and 42B are formed at positions away from the rear side of the positions where the plurality of light sources 48 are mounted. The grooves 42A and 42B create areas where the thickness of the aluminum substrate 40 is thin, and heat dissipation is poor in these areas. According to the above configuration, by positioning the grooves 42A and 42B, which are areas with poor heat dissipation, away from the rear side of the mounting position of the light source 48, the heat dissipation from the light source 48 is prevented from becoming poor.

[0038] (4) A transport jig 70 for transporting an aluminum substrate 40, which is an example of a substrate, includes a bottom 71 having a mounting surface 71A on which the aluminum substrate 40 is placed, a wall 72 erected on the outer periphery of the mounting surface 71A and facing the outer periphery of the aluminum substrate 40, and grooves 73A and 73B formed between two opposing locations on the wall 72 across the mounting surface 71A. Notches 72A and 72B are formed in the wall 72 and are continuous with both ends of the grooves 73A and 73B in the X direction. According to this configuration, when air is blown, air flows from the gap Sk between the side surface of the aluminum substrate 40 and the wall portion 72 through the cutout portions 72A and 72B to between the groove portions 73A and 73B and the aluminum substrate 40. By setting the air exhaust path in this manner, it is possible to prevent the aluminum substrate 40 from coming off the transport jig 70.

[0039] (5) A hole 71B is formed in the bottom 71, penetrating the transport jig 70 in the thickness direction and for removing the aluminum substrate 40. The grooves 42A and 42B are formed on a straight line that is interrupted midway via the hole 71B. According to this configuration, air flowing between the grooves 73A, 73B and the aluminum substrate 40 can be discharged to the outside through the hole 71B.

[0040] (6) The substrate transfer set 5 includes an aluminum substrate 40 and a transfer jig 70 for transferring the aluminum substrate 40. When the aluminum substrate 40 is placed on the placement surface 71A, the grooves 42A, 42B of the aluminum substrate 40 face the grooves 42A, 42B of the transfer jig 70, and the longitudinal (X-direction) ends of the grooves 42A, 42B of the aluminum substrate 40 are positioned opposite the cutouts 72A, 72B of the transfer jig 70. According to this configuration, an air exhaust path is set by the grooves 73A, 73B and the grooves 42A, 42B, so that the air supplied to the substrate transfer set 5 can be efficiently exhausted to the outside.

[0041] (Variation) The present disclosure is not limited to the above-described embodiments and drawings, and modifications (including deletion of components) may be made as appropriate within the scope of the present disclosure. In the above embodiment, the cross-sectional shape of the grooves 73A and 73B cut in the YZ plane is trapezoidal, but is not limited to this and may be rectangular, V-shaped, semicircular, or the like. The cross-sectional shape of the grooves 42A and 42B cut in the YZ plane is V-shaped, but is not limited to this and may be rectangular, trapezoidal, semicircular, or the like. In the above embodiment, the widths of groove portions 73A and 73B were larger than the widths of groove portions 42A and 42B, respectively, but this is not limited thereto, and they may be smaller than the widths of groove portions 42A and 42B, or may be the same as the widths of groove portions 42A and 42B. In the above embodiment, the shape of the hole 71B is not limited to a rectangular shape, but may be a circle, an ellipse, or another polygon such as a triangle or a pentagon. In the above embodiment, the aluminum substrate 40 may be a substrate on which electronic components other than the light source 48 are mounted. Also, the aluminum substrate 40 may be a resin substrate other than aluminum.

[0042] The shape of the substrate body 41 in the above embodiment can be changed as appropriate. For example, the recess 41c and any one of the protrusions 41d and 41e may be omitted.

[0043] In the above embodiment, two grooves 42A, 42B are formed in the aluminum substrate 40, but the number of grooves 42A, 42B may be one or three or more. Similarly, the number of grooves 73A, 73B may be one or three or more. The positions of the grooves 42A, 42B, 73A, 73B can also be changed as appropriate. The positions of the cutouts 72A, 72B can also be changed depending on the positions of the grooves 42A, 42B, 73A, 73B. At least one of the four cutout portions 72A and 72B can be omitted. At least one of the through holes 411 to 414 in the above embodiment may be omitted. Either the grooves 42A, 42B of the aluminum substrate 40 or the grooves 73A, 73B of the transport jig 70 may be omitted. Even in this case, the other groove will still provide an air exhaust path. In the above embodiment, the grooves 42A and 42B may be formed so that the area overlapping with the hole 71B is omitted. In the above embodiment, the holes 71B of the transport jig 70 can be omitted.

[0044] In the above embodiment, the control unit 50 lights up each light source 48 at a uniform brightness, but this is not limited to this. The control unit 50 may have a local dimming function that can adjust the brightness on an area-by-area basis on the display surface by dividing the multiple light sources 48 into groups and adjusting the brightness of the light sources 48 for each group. For example, as shown in FIG. 12 , the control unit 50 may classify the light sources 48 in the upper row as a first group and the light sources 48 in the lower row as a second group, and adjust the light source luminance of the first group and the light source luminance of the second group individually. For example, the light sources 48 in either the first group or the second group may illuminate an image that is always displayed during driving, such as vehicle speed, while the light sources 48 in the other group may illuminate an image that is only displayed when necessary during driving, such as route guidance. In this modification, the grooves 142 may be formed to separate the light sources 48 in the first group from the light sources 48 in the second group. The grooves 142 reduce the thickness of the aluminum substrate 40, and therefore have the function of suppressing heat transfer. Therefore, when the light sources 48 in one group are turned off and the light sources 48 in the other group are turned on, heat transfer from the other group to the first group in the aluminum substrate 40 is suppressed. This modification provides the following advantages. The light sources 48 are arranged in a matrix on the mounting surface 41A, and are divided into groups and their lighting is controlled by local dimming, which allows the lighting brightness of each group to be adjusted. Grooves 42A and 42B are formed between the light sources 48 that belong to different groups. In addition to the groove 142, the grooves 42A and 42B of the above embodiment may be formed.

[0045] In the above embodiment, the cutouts 72A and 72B are formed in the conveying jig 70. However, instead of or in addition to the cutouts 72A and 72B, cutouts may be formed in the aluminum substrate 40. Specifically, as shown in FIG. 13 , cutouts 48A and 48B may be formed at both ends of the grooves 42A and 42B. The cutouts 48A and 48B penetrate in the Z direction and open outward in the X direction. The cutouts 48A and 48B take in air to be circulated into the grooves 42A and 42B.

[0046] In the above embodiment, the folding mirror 20 may be omitted and the display light L from the display device 10 may be emitted directly to the concave mirror 30, or both the folding mirror 20 and the concave mirror 30 may be omitted and the display light L from the display device 10 may be emitted directly to the windshield 201.

[0047] In the above embodiment, the head-up display device 100 projects the display light L onto the windshield 201, but the display light L may be projected onto a combiner constituted by a plate-shaped half mirror, a hologram element, or the like, instead of the windshield 201.

[0048] The type of vehicle 200 on which the head-up display device 100 is mounted is not limited, and the head-up display device 100 can be applied to various vehicles such as four-wheeled automobiles, motorcycles, construction machinery vehicles, etc. The head-up display device 100 may also be mounted on vehicles other than the vehicle 200, such as an airplane, a ship, or a snowmobile, or may not be mounted on a vehicle. Furthermore, the aluminum substrate 40 may be used as a light source substrate for a vehicle instrument other than the head-up display device 100, and may also be used in devices other than the display device .

[0049] Although an example has been shown in which the display panel 12 provided in the display device 10 is a TFT-type liquid crystal display panel, the display device 10 is not limited to this configuration and may be, for example, a projector. In this case, the display device includes a screen (including a diffuser and a microlens array) and a projection device (including display elements such as DMD, LCOS, and a liquid crystal panel, and an illumination device), and the light source substrate of the illumination device provided in the projection device may be an aluminum substrate.

[0050] Heat from the aluminum substrate 40 may be dissipated by a heat dissipation unit (including a heat sink or a thermally conductive sheet) included in the head-up display 100. In this case, the shape of the groove may be formed to follow the outline of the thermally conductive sheet. This configuration is preferable because it makes it easy to form a guide for the mounting position of the thermally conductive sheet. [Explanation of symbols]

[0051] 1...Viewer 5...Board transport set 10...display device, 12...display panel 20...Folding mirror 30...Concave mirror 40...Aluminum substrate, 41...Substrate main body, 41A...Mounting surface, 41B...Back surface, 41c...Concave portion, 41d, 41e...Convex portion, 411 to 414...Through hole, 42A, 42B, 142...Groove portion, 42c, 42d...Inclined surface, 42z...Deepest portion, 48...Light source, 48A, 48B...Notch portion, 49...Connector 50...Control unit 60...casing, 62...window portion, 70...Transport jig, 71...bottom, 71A...mounting surface, 72...wall, 72A, 72B...notch, 73A, 73B...groove, 73C...bottom, 73D, 73E...inclined surface, 71B, 71B1, 71B2...hole, 75...accommodating recess 90...Air supply source 100...Head-up display device 200...Vehicle, 201...Windshield L...display light, V...virtual image, Bp...bottom edge, Sk...gap

Claims

1. a mounting surface, which is the surface; a back surface that is the surface opposite to the mounting surface, A groove portion is formed on the rear surface, the groove portion extending in the longitudinal direction of the rear surface and traversing the rear surface. Aluminum substrate.

2. a through hole penetrating the aluminum substrate in a thickness direction of the aluminum substrate; The groove is formed to cross the through hole, the deepest portion of the groove is formed on the inner circumferential surface of the through hole at a position away from an end portion in a lateral direction perpendicular to the longitudinal direction of the back surface, The aluminum substrate according to claim 1 .

3. a plurality of light sources are mounted on the mounting surface; The groove portion is formed at a position away from the rear side of the mounting positions of the plurality of light sources. The aluminum substrate according to claim 1 .

4. the plurality of light sources are arranged in a matrix on the mounting surface, and lighting of the plurality of light sources is controlled by local dimming in which lighting brightness of each of the groups is adjustable by dividing the plurality of light sources into a plurality of groups, the grooves are formed between the plurality of light sources belonging to different groups, The aluminum substrate according to claim 3.

5. The aluminum substrate has a notch formed therein, the notch being positioned at an end of the groove in the longitudinal direction and penetrating the aluminum substrate in a thickness direction. The aluminum substrate according to claim 1 .

6. A transport jig for transporting a substrate, a bottom portion having a mounting surface on which the substrate is placed; a wall portion provided upright on the outer peripheral edge of the mounting surface and facing the outer peripheral side surface of the substrate; a groove formed between two opposing locations of the wall portion with the placement surface in between, The wall portion has a notch portion formed on both ends of the groove portion in the extending direction of the groove portion. Transport jig.

7. a hole portion that is used to remove the substrate from the transport jig and that penetrates the transport jig in a thickness direction; The groove portion is formed on a straight line that is interrupted midway through the hole portion. The transport jig according to claim 6.

8. The aluminum substrate according to any one of claims 1 to 4, and a conveying jig according to claim 6 or 7 for conveying the aluminum substrate, When the aluminum substrate is placed on the placement surface, the groove of the aluminum substrate and the groove of the transport jig face each other, and an end of the groove of the aluminum substrate in the longitudinal direction is positioned opposite the notch of the transport jig. Board transport set.

Citation Information

Patent Citations

  • JP1975045387A