Liquid ejection head substrate and liquid ejection head

Abstract

To provide a substrate for a liquid discharge head capable of performing high-quality recording.SOLUTION: A liquid ejection head substrate (element substrate 1) provided in a liquid ejection head having a plurality of ejection orifices for ejecting a liquid includes a plurality of element rows 30 in which a plurality of functional elements corresponding to the ejection orifices are arranged and which are arranged in an arrangement direction (X direction) intersecting an arrangement direction (Y direction) of the functional elements, and a pseudo functional element row 50 in which a plurality of pseudo functional elements 51 that are not electrically driven are arranged along the arrangement direction (Y direction).SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a substrate for a liquid ejection head and a liquid ejection head. [Background technology]

[0002] An example of a liquid ejection device is an inkjet recording device. An inkjet recording device is equipped with a liquid ejection head that ejects liquid such as ink. The liquid ejection head provided in an inkjet recording device is also called a recording head. The recording head includes an element substrate and a liquid chamber-forming member (orifice plate). The liquid chamber-forming member is provided with a number of ejection ports (nozzles). The liquid chamber-forming member is bonded to the element substrate, forming liquid flow paths (liquid chambers) between the element substrate and the liquid chamber-forming member, which communicate with the ejection ports. The element substrate is provided with functional elements such as ejection elements and ejection detection elements corresponding to the numerous ejection ports, as well as supply ports for supplying liquid to the liquid flow paths. The ejection elements are also called ejection energy generating elements. Examples of ejection elements include electrothermal conversion elements and piezoelectric elements. Electrothermal conversion elements eject liquid from ejection ports by using thermal energy generated by the electrothermal conversion element to cause bubbles in the liquid. Piezoelectric elements eject liquid from ejection ports using kinetic energy generated by deformation of the piezoelectric element. The ejection detection element detects the behavior of the liquid in the liquid flow path, such as ejection or non-ejection of the liquid from the ejection port.

[0003] A print head records an image by discharging liquid from discharge ports by generating discharge energy from discharge elements such as electrothermal transducers and piezoelectric elements. By allocating multiple types of ink (liquid) to multiple discharge port arrays in which discharge ports are arranged, it is possible to record a multicolor image with the print head. Furthermore, functional elements such as discharge elements and discharge detection elements are arranged in roughly rows corresponding to the discharge port arrays in which discharge ports are arranged. A protective film is formed on the functional elements to protect them. The surface of the protective film is exposed to the liquid flow path and functions as an action portion that imparts discharge energy generated by the discharge elements to the liquid. The protective film also functions as an insulating portion that insulates the functional elements from the liquid.

[0004] In such a print head, to prevent a decrease in print quality, it is necessary for the volume of the droplets ejected from each ejection port to be uniform. To achieve uniform droplet volume, it is preferable that the physical properties and shape of the functional elements corresponding to each ejection port are also uniform. Patent Document 1 discloses a technology for a liquid jet print head having multiple functional elements formed by etching, in which pseudo-functional elements that do not contribute to the ejection of liquid are disposed at both ends of an element array in which the multiple functional elements are aligned. This prevents the pseudo-functional elements from affecting the functional elements due to the circulation of the etching liquid that may occur on both sides of the element array, thereby making the shapes of the multiple functional elements uniform and enabling high-quality printing. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 62-191156 Summary of the Invention [Problem to be solved by the invention]

[0006] When a print head has multiple ejection port arrays, the element substrate has multiple element arrays corresponding to the multiple ejection port arrays. In such cases, the dimensional accuracy of the element arrays located on the edge of the element substrate is lower than that of the element arrays located in the center of the element substrate, which can result in a decrease in print quality.

[0007] An object of the present disclosure is to provide a liquid ejection head substrate that is capable of performing high-quality printing. [Means for solving the problem]

[0008] A substrate for a liquid ejection head according to one aspect of the present disclosure is a substrate for a liquid ejection head provided in a liquid ejection head having a plurality of ejection ports for ejecting liquid, and comprises a plurality of element rows in which a plurality of functional elements corresponding to the ejection ports are arranged in an alignment direction intersecting the alignment direction of the functional elements, and a pseudo-functional element row in which a plurality of pseudo-functional elements that are not electrically driven are arranged along the alignment direction, and the pseudo-functional element row is arranged to the side of the plurality of element rows along the alignment direction. [Effects of the Invention]

[0009] According to the present disclosure, high-quality recording can be performed. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view of a liquid ejection head. [Figure 2] FIG. 2 is a plan view of an element substrate according to the first embodiment. [Figure 3] FIG. 2 is an enlarged plan view showing a part of an element substrate. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Figure 5] FIG. 2 is a block diagram schematically showing electrical connections in an element substrate. [Figure 6] FIG. 10 is a plan view schematically showing an element substrate according to a second embodiment. [Figure 7] FIG. 10 is a plan view schematically showing an element substrate according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the present disclosure, and not all combinations of features described in the following embodiments are necessarily essential to the solutions of the present disclosure. Note that the same components will be described with the same reference numerals.

[0012] <<First Embodiment>> <Configuration of liquid ejection head> 1 is a perspective view of a liquid ejection head 500 that uses a liquid ejection head substrate according to this embodiment. In the following description, the liquid ejection head substrate will be referred to as an element substrate 1. The direction in which ejection elements provided on the element substrate 1 are arranged is referred to as the Y direction, and the direction perpendicular to the direction in which the ejection elements are arranged is referred to as the X direction. The direction in which liquid is ejected from the element substrate 1 is referred to as the Z direction. In this embodiment, a configuration that enables high-quality printing will be described.

[0013] As shown in FIG. 1, the liquid ejection head 500 has a plurality of liquid ejection modules 510 arranged in a row in the longitudinal direction (Y direction). Each liquid ejection module 510 has an element substrate 1, a liquid chamber forming member 520 (see FIG. 4), and a flexible wiring board 530 for supplying power to the ejection elements provided on the element substrate 1. The flexible wiring board 530 is commonly connected to an electrical wiring board 550 on which power supply terminals, ejection signal input terminals, etc. are arranged. The liquid ejection modules 510 can be easily attached to and detached from the liquid ejection head 500. The liquid ejection head 500 is capable of ejecting multiple types of ink from ejection ports 521 (see FIG. 4) of the liquid chamber forming member 520. The liquid ejection head 500 may eject not only ink but also liquids such as primers.

[0014] <Configuration of Liquid Ejection Head Substrate> Next, the element substrate 1 (liquid ejection head substrate) will be described. Fig. 2 is a plan view of the element substrate 1 according to the first embodiment. Fig. 3 is an enlarged plan view showing the portion of the element substrate 1 where the ejection elements and pseudo-functional elements are arranged. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3. The up-down relationship described below refers to the relative positional relationship within the cross section of the element substrate 1. If the mounting direction of the element substrate 1 is reversed, the up-down relationship will also be reversed.

[0015] As shown in FIG. 2, the element substrate 1 is formed to have a rectangular outer shape. The element substrate 1 includes a silicon substrate 10, three element sections 20, two external connection terminal rows 40 in which a plurality of external connection terminals 41 are arranged, and a plurality of pseudo-function element rows 50 in which a plurality of pseudo-function elements 51 are arranged. The silicon substrate 10 is formed using a disk-shaped single-crystal silicon substrate. After forming a thin film on the disk-shaped silicon substrate, the disk-shaped silicon substrate is cut out by blade dicing to create the rectangular silicon substrate 10. The silicon substrate 10 may also have a substrate heating layer (not shown) for heating the element substrate 1. The substrate heating layer includes a heating resistor that converts electric power into thermal energy to heat the element substrate 1. The substrate heating layer (heating resistor) is formed using tantalum silicon nitride (TaSiN), polysilicon, or the like.

[0016] A liquid chamber-forming member 520 is formed on one surface (+Z direction side) of the element substrate 1 (silicon substrate 10) (see also FIG. 4). The liquid chamber-forming member 520 is formed in a box shape extending in the Y direction and covering one surface of the silicon substrate 10. As shown in FIG. 4, the liquid chamber-forming member 520 forms a liquid chamber 525 between itself and the element substrate 1, the liquid chamber-forming member 520 communicating with an ejection port 521 formed in the liquid chamber-forming member 520. The liquid chamber-forming member 520 is preferably formed using a photosensitive resin. This makes it possible to easily form a pattern, such as an ejection port, in the liquid chamber-forming member 520 using a photolithography method. In the example shown in FIG. 4, the liquid chamber-forming member 520 is formed using a photosensitive resin, and the ejection port 521 and the liquid chamber 525 are formed in the liquid chamber-forming member 520 using a photolithography method. When the liquid chamber 525 is formed using a photolithography method, a flow path mold material (not shown) that serves as a mold for the flow path is formed using a solvent or a material that can be dissolved by a solvent. Then, by forming the liquid chamber forming member 520 on the flow path mold and then removing the flow path mold, a liquid chamber 525 that serves as a liquid flow path communicating with the ejection port 521 can be formed. The liquid chamber forming member 520 may be formed using a metal material or an inorganic material, in addition to a resin material. An example of a metal material used for the liquid chamber forming member 520 is a stainless steel plate. An example of an inorganic material used for the liquid chamber forming member 520 is silicon (Si), silicon nitride (SiN), silicon carbide (SiC), silicon carbonitride (SiCN), etc.

[0017] Furthermore, the liquid chamber-forming member 520 is not limited to a single layer, and may have multiple layers. When the liquid chamber-forming member 520 has multiple layers, an adhesion layer that improves adhesion to the silicon substrate 10 may be formed on the bottom layer of the liquid chamber-forming member 520. When the silicon substrate 10 has multiple layers, an adhesion layer that improves adhesion to the liquid chamber-forming member 520 may be formed on the top layer of the silicon substrate 10.

[0018] A plurality of ejection ports 521 for ejecting ink are formed in the liquid chamber forming member 520. Each ejection port 521 is formed to correspond to an ejection element 31 of the element substrate 1 (element section 20) and to communicate with a liquid chamber 525. Here, the correspondence between an ejection port 521 and an ejection element 31 means that an ejection element 31 that contributes to ejection from a certain ejection port 521 is disposed opposite the ejection port 521. Alternatively, the correspondence between an ejection port 521 and an ejection element 31 may mean that the center position of an ejection element 31 that contributes to ejection from a certain ejection port 521 is shifted from the center position of the ejection port 521 in a direction parallel to the substrate surface according to a certain rule.

[0019] As shown in FIGS. 2 and 3, the element portion 20 is disposed in a portion (liquid chamber 525) surrounded by the liquid chamber forming member 520 on one surface side (+Z direction side) of the silicon substrate 10. In this embodiment, three element portions 20 and three liquid chambers 525 corresponding to three types of ink are formed. The three liquid chambers 525 are spaced apart from one another and aligned in the X direction, and extend in the Y direction in the shape of a rectangular parallelepiped. In this embodiment, the X direction is parallel to the short side of the outer shape (rectangle) of the element substrate 1. The Y direction is parallel to the long side of the outer shape (rectangle) of the element substrate 1.

[0020] Each element unit 20 has a plurality of supply ports 25 and three element arrays 30 in which a plurality of ejection elements 31 and ejection detection elements 36 are arranged as functional elements. The supply ports 25 are formed to penetrate the silicon substrate 10 in the Z direction and are connected to an ink tank (not shown) that stores ink and the liquid chamber 525. For example, the through-hole-shaped supply ports 25 are formed in the silicon substrate 10 by crystal anisotropic etching using a chemical solution or dry etching using plasma. Examples of chemical solutions used for crystal anisotropic etching include a tetramethylammonium hydroxide (TMAH) aqueous solution and a potassium hydroxide (KOH) aqueous solution. The supply ports 25 are also arranged in the Y direction in the gaps between the three element arrays 30 arranged in the X direction in each element unit 20.

[0021] The ejection elements 31 and ejection detection elements 36 that make up the element array 30 are arranged in a direction (Y direction) parallel to the long side of the (rectangular) outer shape of the element substrate 1. This allows for efficient use of the area within the element substrate 1. The three element arrays 30 of each element section 20 are arranged side by side in the X direction that intersects (specifically, is perpendicular to) the arrangement direction of the ejection elements 31 and ejection detection elements 36. As a result, the ejection elements 31 and ejection detection elements 36 are arranged in a matrix in each element section 20.

[0022] As shown in FIG. 4 , the ejection element 31 is disposed in the liquid chamber 525, facing the ejection port 521 of the liquid chamber-forming member 520. The ejection element 31 includes a heating resistor layer 32, a wiring layer 33, a protective layer 34, and an upper protective layer 35. The ejection element 31 is an electrothermal conversion element formed by connecting the wiring layer 33 to the heating resistor layer 32. For example, a gap is formed by removing a portion of the wiring layer 33 formed to overlap the thin-film heating resistor layer 32, and the heating resistor layer 32 located in the gap is exposed, thereby forming a heating portion of the ejection element 31. The ejection element 31 converts electrical power into thermal energy to bubble the ink in the liquid chamber 525, thereby ejecting the ink from the ejection port 521. Ink supplied to the liquid chamber 525 from an ink tank (not shown) via the supply port 25 is given thermal energy by the ejection element 31, and is ejected from the ejection port 521.

[0023] The heating resistor layer 32 is formed using tantalum silicon nitride (TaSiN) or the like. For example, after forming a TaSiN film, a mask pattern is formed using photolithography, and unnecessary portions are removed by wet etching or dry etching, thereby forming the heating resistor layer 32.

[0024] The wiring layer 33 forms wiring that electrically connects the heating resistor layer 32 and the external connection terminals 41. The wiring layer 33 is formed using a conductive material. Examples of conductive materials used for the wiring layer 33 include metals such as aluminum (Al) and alloys containing aluminum as a main component, such as aluminum-copper (Al-Cu) alloys. The wiring layer 33 is formed to extend from the heating resistor layer 32 to the end of the silicon substrate 10 in the X direction. The external connection terminals 41 that are electrically connected to a flexible wiring substrate 530 (see FIG. 1 ) are formed at the tip of the wiring layer 33 located at the end of the silicon substrate 10. As a result, the external connection terminals 41 are located at the end of the silicon substrate 10, making it easier to electrically connect to the outside using the flexible wiring substrate 530 or the like.

[0025] The external connection terminals 41 do not have to be disposed at the end of the silicon substrate 10, but may be disposed at a portion of the silicon substrate 10 that is easily electrically connected to the outside. For example, when the wiring layer 33 extends to the other surface (-Z direction side) of the silicon substrate 10 via a through hole (not shown), the external connection terminals 41 may be disposed on the surface of the silicon substrate 10 opposite to the surface on which the ejection elements 31 are disposed. The wiring layer 33 may also serve as wiring that electrically connects the external connection terminals 41 to functional elements other than the ejection elements 31, such as the ejection detection elements 36, and may also serve as wiring that electrically connects the external connection terminals 41 to pseudo-functional elements 51 (described later). The wiring layer connected to the functional elements other than the ejection elements 31 and the wiring layer connected to the pseudo-functional elements 51 may be stacked as a layer different from the wiring layer 33 connected to the heating resistor layer 32.

[0026] In the example shown in FIG. 4, the wiring layer 33 is formed below the heating resistor layer 32 in FIG. 4, but it may also be formed above the heating resistor layer 32. The wiring layer 33 may also be connected to the heating resistor layer 32 via an insulating film laminated above or below the heating resistor layer 32. In this case, the heating resistor layer 32 and the wiring layer 33 may be electrically connected by a conductive connecting member inserted through the insulating film. To ensure uniform volume of droplets (ink droplets) ejected from the ejection ports 521, it is preferable that the ejection elements 31 are flat. Therefore, it is preferable that no wiring pattern be disposed directly below or around the ejection elements 31. When a wiring pattern is provided directly below or around the ejection elements 31 to reduce the size of the element substrate 1, it is necessary to eliminate the influence of steps caused by the wiring pattern. Therefore, it is preferable that the wiring and each layer underlying the ejection elements 31 be planarized by processes such as CMP (chemical mechanical polishing) and etch-back.

[0027] Furthermore, a selection circuit (not shown) for selecting the ejection elements 31 to be driven is provided in a portion of the wiring layer 33 between the heating resistor layer 32 and the external connection terminals 41. This selection circuit may be provided outside the silicon substrate 10 and connected to the ejection elements 31 (heating resistor layer 32) via the external connection terminals 41. The ejection elements 31 are provided on the silicon substrate 10. Providing the ejection elements 31 on the silicon substrate 10 does not necessarily mean that the ejection elements 31 are provided in contact with the surface of the silicon substrate 10. For example, the ejection elements 31 may be provided on the silicon substrate 10 via a thin film or the like, or the ejection elements 31 may be provided inside the silicon substrate 10. Furthermore, a heat storage layer (not shown) that comes into contact with the silicon substrate 10 and prevents heat from escaping may be provided at the bottom layer of the ejection elements 31. The heat storage layer is formed using a silicon oxide film (SiO film), a boron phosphorus silicate glass film (BPSG film), or the like. The ejection element 31 may have the function of an ejection detection element 36 that detects the behavior of the liquid by including an ejection detection layer 37 described later.

[0028] The protective layer 34 is provided between the heating resistor layer 32 and the wiring layer 33 and the ejection detection layer 37, and between the heating resistor layer 32 and the upper protective layer 35. The protective layer 34 is formed using an SiO film, SiN film, or the like, and functions as an insulating layer. The protective layer 34 may be formed as a single layer, or may be formed by laminating multiple layers. The protective layer 34, which is formed by laminating multiple layers, is formed by a film formation method such as plasma-based chemical vapor deposition (CVD) or sputter deposition. The protective layer 34 is patterned by etching using a photoresist mask.

[0029] The upper protective layer 35 is provided on the surface side of the protective layer 34. By covering the surface of the protective layer 34, the upper protective layer 35 protects the ejection elements 31 from chemical and physical effects associated with ink (liquid) bubbling. The upper protective layer 35 is formed using a chemically and physically strong metal film, such as tantalum (Ta) or iridium (Ir). The upper protective layer 35 may be formed as a single layer or as a laminate of multiple layers. The upper protective layer 35, which is a laminate of multiple layers, is formed by a film formation method such as chemical vapor deposition or sputtering deposition, similar to the protective layer 34. The upper protective layer 35 is patterned by etching using a photoresist mask. If the protective layer 34 alone can protect the ejection elements 31 from chemical and physical effects associated with ink bubbling, the upper protective layer 35 may not be provided.

[0030] The discharge detection element 36 detects the behavior of ink (liquid) discharged from the discharge port 521 by the discharge element 31. The discharge detection element 36 has a discharge detection layer 37. The discharge detection layer 37 is provided between the silicon substrate 10 and the protective layer 34 of the discharge element 31. In this way, the discharge detection element 36 is disposed at the same position as the discharge element 31 on the silicon substrate 10.

[0031] The discharge detection layer 37 is formed by laminating, for example, a titanium layer and a titanium nitride layer. The width of the portion of the discharge detection layer 37 that overlaps with the heating resistor layer 32 (heat generating portion) is narrower than the width of other portions of the discharge detection layer 37. The discharge detection layer 37 is electrically connected to the external connection terminals 41 via another wiring layer (not shown) that is electrically independent from the wiring layer 33 of the discharge elements 31. As with the discharge elements 31, when a wiring pattern is provided directly below and around the discharge detection layer 37, it is necessary to eliminate the influence of steps caused by the wiring pattern. For this reason, it is preferable that the layers underlying the wiring and the discharge detection elements 36 be planarized by processes such as CMP (chemical mechanical polishing) and etch-back. As with the heating resistor layer 32, the discharge detection layer 37 is formed by forming a mask pattern using photolithography and removing unnecessary portions by wet etching or dry etching.

[0032] In this embodiment, the ejection detection element 36 is disposed at the same position as the ejection element 31 on the silicon substrate 10, but this is not limiting. For example, the ejection detection element 36 may be disposed at a different position on the silicon substrate 10 from the ejection element 31. In this embodiment, the ejection detection layer 37 of the ejection detection element 36 is provided between the silicon substrate 10 and the protective layer 34 of the ejection element 31, but this is not limiting. For example, the ejection detection layer 37 may be provided between the heating resistor layer 32 of the ejection element 31 and the protective layer 34. The ejection detection layer 37 may be provided at a position away from the surface of the silicon substrate 10, as long as it is near the ejection element 31. If the ejection detection layer 37 is away from the surface of the silicon substrate 10, it may be formed on the same plane as the heating resistor layer 32.

[0033] The discharge detection layer 37 is formed using a metal material or inorganic material having a physical property that causes its electrical resistance to change depending on temperature. The discharge detection layer 37 may be formed as a single layer, or may be formed by laminating multiple layers. The material used for the discharge detection layer 37 is preferably a material that has a large ratio of change in electrical resistance depending on temperature to resistivity. Examples of metal materials used for the discharge detection layer 37 include aluminum-copper (Al-Cu) alloys. Examples of inorganic materials used for the discharge detection layer 37 include titanium (Ti), titanium nitride (TiN), and tantalum silicon nitride (TaSiN).

[0034] When the discharge detection layer 37 is a conductor, the discharge detection layer 37 itself may be used as wiring. For example, the discharge detection element 36 may be formed by thinning a desired portion of the discharge detection layer 37. Furthermore, another wiring layer electrically independent from the wiring layer 33 of the discharge element 31 may be connected to the discharge detection element 36. For example, another wiring layer electrically independent from the wiring layer 33 is connected to a portion of the discharge detection element 36 excluding the portion that changes with temperature. The other wiring layer has a smaller change in electrical resistance with temperature than the discharge detection layer 37 and a higher electrical conductivity than the discharge detection layer 37. This allows the proportion of the change in electrical resistance with temperature to be higher in the total electrical resistance, making it easier for the discharge detection element 36 to detect the behavior of the liquid.

[0035] When the heating resistor layer 32 of the ejection element 31 has a thin-film shape, the central portion of the heating resistor layer 32 experiences the greatest temperature change. Therefore, it is preferable to provide the ejection detection layer 37 at least directly above or below the central portion of the heating resistor layer 32. Furthermore, by increasing the resistance of the ejection detection layer 37, minute temperature changes can be detected as larger changes, improving the signal-to-noise ratio of the output signal from the ejection detection element 36 and making it easier to detect the behavior of the liquid. For example, the resistance of the ejection detection layer 37 can be increased by using a material whose electrical resistance changes more significantly with temperature. The resistance of the ejection detection layer 37 can be increased by narrowing the width of the ejection detection layer 37. By shaping the ejection detection layer 37 in a meandering shape in the plane directly above or below the heating resistor layer 32, the electrical length of the ejection detection layer 37 is extended, thereby increasing the resistance of the ejection detection layer 37.

[0036] When power is supplied to the discharge detection layer 37 of the discharge detection element 36 via the external connection terminal 41, a voltage or current that changes as the electrical resistance changes depending on the temperature is output from the discharge detection layer 37. The change in the output signal of the discharge detection element 36 (discharge detection layer 37) output via the external connection terminal 41 is processed by a circuit such as an amplifier provided in the recording device main body (not shown), thereby making it possible to detect behavior such as ink (liquid) discharge or non-discharge. The output signal from the discharge detection element 36 may be processed by any one or a combination of the recording device main body, a circuit provided on the element substrate 1, and a processing device connected to the recording device main body via a network.

[0037] The direction in which the element arrays 30 are arranged in the element unit 20 is referred to as the "arrangement direction." The direction in which the functional elements (ejection elements 31 and ejection detection elements 36) are arranged in the element array 30 is referred to as the "arrangement direction." In this embodiment, the functional elements (ejection elements 31 and ejection detection elements 36) are arranged linearly at equal intervals, but this is not limited to this. For example, the functional elements may be arranged in a staggered pattern. Furthermore, when dpi (dots per inch) is not used as a unit of printing resolution (e.g., when design is performed using the metric system), the arrangement pitch of the functional elements may not be equal. When the liquid ejection head 500 ejects multiple types of ink (liquid), the liquid chamber forming member 520 is configured to form multiple liquid chambers 525 isolated for each color of ink. Due to the space required for the liquid chamber forming member 520 to form the multiple liquid chambers 525, the spacing between adjacent element units 20 in the arrangement direction is greater than the spacing between each element unit 20 in the arrangement direction of the element array 30. The spacing between adjacent element sections 20 in the arrangement direction, in other words, the spacing between element rows 30 located at the boundary between adjacent element sections 20 in the arrangement direction, is also referred to as the color spacing. The area of ​​the element substrate 1 excluding the element sections 20 is also referred to as the ear portion. The ear portion of the element substrate 1 may be arranged with an external connection terminal array 40, wiring (not shown), a driver 61 (see FIG. 5), etc. The larger the area of ​​the ear portion occupies in the element substrate 1, the smaller the area ratio of the element sections 20 to the element substrate 1, and the more likely it is that the dimensional accuracy of the element rows 30 (functional elements) located on the edge side of the element substrate 1 in the element section 20 will be reduced. In this embodiment, the element substrate 1 is formed in a rectangular (quadrilateral) shape. Even if the element substrate 1 is formed in a polygonal shape with the corners of a quadrangle rounded off, if the shape of the element sections 20 is quadrangular, the dimensional accuracy of the element rows 30 located on the edge side of the element substrate 1 in the element section 20 will also be reduced.

[0038] As shown in FIG. 2 , the external connection terminal array 40 is disposed on both ends of the element substrate 1 in the X direction (the arrangement direction of the element array 30). The external connection terminals 41 constituting the external connection terminal array 40 are arranged in the Y direction along the long sides of the (rectangular) outer shape of the element substrate 1. In other words, the external connection terminals 41 are arranged along the arrangement direction of the functional elements (ejection elements 31 and ejection detection elements 36). The external connection terminals 41 are arranged linearly at equal intervals, but this is not limiting. For example, the external connection terminals 41 may be arranged in a staggered pattern. The arrangement pitch of the external connection terminals 41 does not have to be equal. Note that the arrangement along the outer shape of the element substrate 1 refers to an arrangement in which deviation from a straight line fitted to the outer shape of the element substrate 1 is minimized. When the external connection terminals 41 are electrically connected to the outside (flexible wiring substrate 530), some of the external connection terminals 41 function as power supply terminals 41A, and other parts of the external connection terminals 41 function as ground terminals 41B. The number of power supply terminals 41A and ground terminals 41B included in the plurality of external connection terminals 41 is sufficient to supply the necessary power to the element substrate 1. The external connection terminal array 40 may be arranged at the end of the long side of the element substrate 1 or at the end of the short side of the element substrate 1. When the external connection terminal array 40 is arranged at the end of the short side of the element substrate 1, the width of the lug between the external connection terminal array 40 and the element section 20 becomes wider, thereby enhancing the effect of arranging the pseudo-functional elements 51. Furthermore, as the number of element arrays 30 increases, it becomes difficult to run wiring across each functional element from the external connection terminal array 40 arranged only on one side of the element substrate 1. Therefore, by arranging the external connection terminal array 40 at both ends of the element substrate 1, wiring can be easily performed from the external connection terminal array 40 arranged at both ends of the element substrate 1.

[0039] As shown in FIG. 2, the pseudo-functional element arrays 50 are arranged between the three element sections 20, i.e., the nine element arrays 30, in the arrangement direction (X direction) from the side to the external connection terminal array 40. The pseudo-functional element arrays 50 are also arranged in the gaps between adjacent element sections 20, i.e., in the gaps between element arrays 30 located on the boundaries between adjacent element sections 20. For example, six pseudo-functional element arrays 50 are arranged side by side in the X direction between three element sections 20 and the external connection terminal arrays 40 on both sides. One pseudo-functional element array 50 is arranged in each gap between two rows of three element sections 20. For example, the elements in the 23-row aggregate array, which is the sum of the element arrays 30 and the pseudo-functional element arrays 50, are arranged in a matrix (rectangular shape) at similar intervals.

[0040] The pseudo-functional elements 51 constituting the pseudo-functional element array 50 are arranged along the arrangement direction (Y direction) of the functional elements (ejection elements 31 and ejection detection elements 36). The pseudo-functional elements 51 are arranged at the same arrangement pitch as the functional elements. Since the pseudo-functional elements 51 are arranged in a row at the same arrangement pitch as the functional elements, the density of the pseudo-functional elements 51 is equivalent to the density of the functional elements. The pseudo-functional elements 51 may be arranged linearly at equal intervals or in a staggered pattern, depending on the arrangement pitch of the functional elements. The arrangement pitch of the external connection terminals 41 does not have to be equal, depending on the arrangement pitch of the functional elements. The pseudo-functional elements 51 have layers (heating resistor layer 32 and ejection detection layer 37) that function as functional elements and are formed to have the same size as the functional elements. However, wiring for supplying power to the functional elements is not electrically connected to the pseudo-functional elements 51. As a result, the pseudo-functional elements 51 are not electrically driven and therefore do not function as functional elements. The pseudo-functional element 51 is not electrically connected to the electrodes of the functional elements (ejection elements 31 and ejection detection elements 36) or the wiring connected to the electrodes, thereby preventing the pseudo-functional element 51 from being electrically driven. Furthermore, the pseudo-functional element 51 may be electrically connected to the electrodes of the functional elements or the wiring connected to the electrodes, but may not be selected by a selection circuit such as a driver 61 (see FIG. 5), preventing the pseudo-functional element 51 from being electrically driven. Because the pseudo-functional element 51 does not function as a functional element, it does not generate ejection energy as an ejection element, and does not detect the behavior of the liquid as an ejection detection element. The pseudo-functional element 51 is arranged so as not to face the liquid chamber 525, but since it is not electrically driven, it may be arranged so as to face the liquid chamber 525.

[0041] When the heating resistor layer 32 of the ejection elements 31 is formed by wet etching, the heating resistor layer 32 located on the edge of the element substrate 1 has a different post-etching dimension compared to the heating resistor layer 32 located on the center of the element substrate 1 due to an edge effect of etching. Even when the heating resistor layer 32 is formed by dry etching, the local opening ratio of the etching pattern has a different distribution between the center and edge of the element substrate 1, resulting in variations in the post-etching dimension of the heating resistor layer 32. In this embodiment, when the heating resistor layer 32 is formed, layers corresponding to the heating resistor layers 32 of the pseudo-functional elements 51 constituting the pseudo-functional element array 50 are formed on the sides along the arrangement direction (X direction) of the nine element arrays 30 in which the ejection elements 31 are arranged. This reduces the dimensional accuracy of the pseudo-functional elements 51 that do not function as ejection elements 31, but prevents a reduction in the dimensional accuracy of the ejection elements 31 (heating resistor layers 32) located on both ends (in the X direction) of the element substrate 1. Furthermore, when the ejection detection layer 37 is formed, a layer corresponding to the ejection detection layer 37 of the pseudo-functional elements 51 constituting the pseudo-functional element array 50 is formed on the side along the arrangement direction (X direction) of the nine element arrays 30 in which the ejection detection elements 36 are arranged. This reduces the dimensional accuracy of the pseudo-functional elements 51 that do not function as the ejection detection elements 36, but it is possible to suppress a decrease in the dimensional accuracy of the ejection detection elements 36 (ejection detection layer 37) located on both end sides (in the X direction) of the element substrate 1. Therefore, it is possible to suppress ejection unevenness caused by uneven shapes of the functional elements (ejection elements 31 and ejection detection elements 36) located on both end sides (in the X direction) of the element substrate 1, thereby enabling high-quality recording.

[0042] When a relatively large gap (between colors) exists between adjacent element units 20, the dimensional accuracy of the element arrays 30 (sandwiching the color gap) located at both ends (in the X direction) of each element unit 20 decreases. Therefore, when the gap between adjacent element units 20 is at least twice as wide as the gap between the element arrays 30 within each element unit 20, pseudo-functional element arrays 50 may be disposed in the gap between the adjacent element units 20. For example, when the gap between the element arrays 30 located at the boundary between adjacent element units 20 is twice as wide as the gap between the element arrays 30 within each element unit 20, one pseudo-functional element array 50 may be disposed in each gap between the element arrays 30 located at the boundary between adjacent element units 20. This prevents a decrease in the dimensional accuracy of the functional elements (ejection elements 31 and ejection detection elements 36) located at the boundary between adjacent element units 20, thereby preventing ejection irregularities caused by non-uniform shapes of the functional elements and enabling high-quality recording. The pseudo-functional elements 51 of the pseudo-functional element arrays 50 arranged in the gaps between adjacent element sections 20 are formed in the same manner as the pseudo-functional elements 51 of the pseudo-functional element arrays 50 arranged laterally along the arrangement direction (X direction) of the three element sections 20. The gaps between the three element arrays 30 in each element section 20 are the smallest gaps among the gaps between the nine element arrays 30.

[0043] Next, the electrical connection between the element section 20 and the pseudo-functional element array 50 will be described using FIG. 5. FIG. 5 is a block diagram schematically illustrating the electrical connection between the element section 20 and the pseudo-functional element array 50 on the element substrate 1. As shown in FIG. 5, each functional element (ejection element 31 and ejection detection element 36) of the element section 20 and the driver 61 are electrically connected to a power supply terminal 41A and a ground terminal 41B constituting the external connection terminal 41 of the external connection terminal array 40 via wiring. On the other hand, each pseudo-functional element 51 of the pseudo-functional element array 50 is not electrically connected to the power supply terminal 41A or the ground terminal 41B. The wiring connecting each functional element of the element section 20 to the power supply terminal 41A is a solid pattern wiring that spans each functional element. Each functional element of the element section 20 is electrically connected to the ground terminal 41B via the driver 61. The wiring connecting each functional element of the element section 20 to the ground terminal 41B via the driver 61 is a solid pattern wiring that straddles each functional element and is formed on a wiring layer different from the wiring connected to the power terminal 41A. The power terminal 41A is an external connection terminal (41) for supplying power from the outside to each functional element of the element section 20. The ground terminal 41B is an external connection terminal (41) that is electrically connected to the outside and serves as a reference potential. As described above, the power terminals 41A and ground terminals 41B are provided in sufficient numbers to supply the necessary power to the element substrate 1. The driver 61 is disposed in an area of ​​the element substrate 1 other than the element section 20, the external connection terminal array 40, and the pseudo-functional element array 50. For example, the driver 61 may be disposed between the element section 20 and the end of the element substrate 1 in the Y direction, or may be disposed in the gap between adjacent element sections 20. The driver 61 is configured with a selection circuit that selects an ejection element 31 to eject from among the multiple ejection elements 31 in the element section 20. The selection circuit that constitutes the driver 61 is configured using transistors such as DMOS (Double-Diffused MOSFET).

[0044] Note that the driver 61 is not limited to a selection circuit and may include other circuits. Each functional element of the element section 20 may be electrically connected to the ground terminal 41B, or may be electrically connected to the power supply terminal 41A via the driver 61. In this case, a ground terminal for the driver 61 may be provided in addition to the ground terminal 41B for each functional element. The pseudo-functional element 51 may be electrically connected to the ground terminal 41B if it is not connected to the power supply terminal 41A of the external connection terminal array 40. The pseudo-functional element 51 may be connected to the power supply terminal 41A of the external connection terminal array 40 via the driver 61, but the driver 61 may not select the supply of power to the pseudo-functional element 51.

[0045] As described above, the first embodiment enables high-quality recording. That is, in this embodiment, the pseudo-functional element array 50 is arranged between the three element units 20, i.e., the nine element arrays 30, along the arrangement direction (X direction) from the side to the external connection terminal array 40. This reduces the dimensional accuracy of the pseudo-functional elements 51, which do not function as functional elements, but suppresses the reduction in dimensional accuracy of the functional elements (ejection elements 31 and ejection detection elements 36) located on the end side (X direction) of the element substrate 1. Therefore, it is possible to suppress ejection irregularities caused by uneven shapes of the functional elements located on the end side of the element substrate 1. Furthermore, the pseudo-functional element array 50 is arranged in the gap between adjacent element units 20, i.e., the gap between element arrays 30 located on the boundary between adjacent element units 20. The gap between element arrays 30 located on the boundary between adjacent element units 20 is at least twice the width of the smallest gap among the nine element arrays 30. This makes it possible to prevent a decrease in the dimensional accuracy of the functional elements located on the boundary between adjacent element portions 20, thereby preventing uneven discharge caused by uneven shapes of the functional elements. In this way, high-quality recording becomes possible.

[0046] Furthermore, the external connection terminal rows 40 are provided on both end portions in the arrangement direction (X direction) of the element substrate 1. This allows for easy wiring from the external connection terminal rows 40 provided on both end portions of the element substrate 1.

[0047] Furthermore, the functional elements (ejection elements 31 and ejection detection elements 36) are arranged parallel to the long side (or short side) of the outer shape (rectangle) of the element substrate 1. This allows the area within the element substrate 1 to be used efficiently.

[0048] <<Second embodiment>> Next, a second embodiment will be described. Since the individual components in the second embodiment have the same configuration as those in the first embodiment, they will be described using the same reference numerals as those in the first embodiment. Figure 6 is a plan view schematically showing an element substrate 1 (liquid ejection head substrate) according to the second embodiment.

[0049] <Configuration of Liquid Ejection Head Substrate> As shown in FIG. 6, the element substrate 1 according to the second embodiment is formed to have a trapezoidal outer shape. After a thin film is formed on a disk-shaped silicon substrate, a trapezoidal silicon substrate 10 is formed by stealth dicing. In stealth dicing, a laser beam is focused inside the silicon substrate to form a pattern of a localized process-affected layer, and then an external stress is applied to the silicon substrate to divide the silicon substrate. Because the outer shape of the element substrate 1 (silicon substrate 10) is trapezoidal, it is possible to produce more element substrates 1 from a disk-shaped silicon substrate compared to when the outer shape of the element substrate 1 is rectangular.

[0050] In the second embodiment, the functional elements (ejection elements 31 and ejection detection elements 36) constituting the element array 30 are arranged in a direction (Y direction) parallel to the base of the outer shape (trapezoid) of the element substrate 1. The three element arrays 30 of each element unit 20 are arranged side by side in the X direction intersecting (specifically, perpendicular to) the arrangement direction of the functional elements. Alternatively, the three element arrays 30 of each element unit 20 may be arranged side by side in a direction parallel to one of the oblique sides of the outer shape (trapezoid) of the element substrate 1 intersecting the arrangement direction of the functional elements. The three liquid chambers 525 are formed side by side in the X direction and extend trapezoidally in the Y direction.

[0051] The external connection terminal array 40 is arranged on both ends of the bottom side of the element substrate 1. The external connection terminals 41 that make up the external connection terminal array 40 are arranged in the Y direction along both bottom sides of the trapezoidal outline of the element substrate 1. In other words, the external connection terminals 41 are arranged along the arrangement direction of the functional elements (ejection elements 31 and ejection detection elements 36).

[0052] The pseudo-functional element arrays 50 are arranged between the three element sections 20, i.e., the nine element arrays 30, along the arrangement direction (X direction) from the side to the external connection terminal array 40. The pseudo-functional element arrays 50 are also arranged in the gaps between adjacent element sections 20, i.e., in the gaps between element arrays 30 located on the boundaries between adjacent element sections 20. For example, six pseudo-functional element arrays 50 are arranged side by side between three element sections 20 and the external connection terminal arrays 40 on both sides. One pseudo-functional element array 50 is arranged in each gap between two rows of three element sections 20. For example, the elements in the combined array of 23 element arrays 30 and pseudo-functional element arrays 50 are arranged at equal intervals in a trapezoidal shape. The arrangement direction of the element arrays 30 and pseudo-functional element arrays 50 is the X direction, which intersects (specifically, is perpendicular to) the arrangement direction of the functional elements. The arrangement direction of the element array 30 and the pseudo-functional element array 50 may be parallel to one of the oblique sides of the outer shape (trapezoid) of the element substrate 1, which intersects with the arrangement direction of the functional elements.

[0053] As a result, although the dimensional accuracy of the pseudo-functional elements 51 that do not function as functional elements decreases, it is possible to suppress a decrease in the dimensional accuracy of the functional elements (ejection elements 31 and ejection detection elements 36) located on the end side of the bottom side of the element substrate 1. Therefore, it is possible to suppress ejection unevenness caused by uneven shapes of the functional elements located on the end side of the bottom side of the element substrate 1, and high-quality recording can be performed. Furthermore, since it is possible to suppress a decrease in the dimensional accuracy of the functional elements located on the boundary between adjacent element sections 20, it is possible to suppress ejection unevenness caused by uneven shapes of the functional elements, and high-quality recording can be performed.

[0054] As described above, according to the second embodiment, it is possible to perform high-quality recording, similar to the first embodiment.

[0055] In the second embodiment, the functional elements (ejection elements 31 and ejection detection elements 36) are arranged parallel to the base of the trapezoidal outer shape of the element substrate 1. Furthermore, the external connection terminal arrays 40 are arranged on both ends of the base of the element substrate 1. As a result, by arranging the element substrates 1 formed to have a trapezoidal outer shape in the Y direction so that the upper and lower bases of the trapezoids are alternately connected, it is possible to realize a liquid ejection head in which a plurality of element substrates 1 (liquid ejection modules) are arranged in a line in the Y direction.

[0056] <<Third Embodiment>> Next, a third embodiment will be described. Since the individual components in the third embodiment have the same configuration as those in the first embodiment, they will be described using the same reference numerals as those in the first embodiment. Figure 7 is a plan view schematically showing an element substrate 1 (liquid ejection head substrate) according to the third embodiment.

[0057] <Configuration of Liquid Ejection Head Substrate> 7, the element substrate 1 according to the third embodiment is formed so that its outer shape is a parallelogram. As in the second embodiment, after a thin film is formed on a disk-shaped silicon substrate, a parallelogram-shaped silicon substrate 10 is formed by stealth dicing.

[0058] In the third embodiment, the functional elements (ejection elements 31 and ejection detection elements 36) constituting the element array 30 are arranged in a direction (Y direction) parallel to one set of opposite sides of the outline (parallelogram) of the element substrate 1. The three element arrays 30 of each element unit 20 are arranged side by side in a direction parallel to the other set of opposite sides of the outline (parallelogram) of the element substrate 1, which intersects with the arrangement direction of the functional elements. The three liquid chambers 525 are formed side by side in a direction parallel to the other set of opposite sides of the outline (parallelogram) of the element substrate 1, and extend in the shape of a parallelogram in the Y direction.

[0059] The external connection terminal array 40 is arranged at both ends of one set of opposite sides of the element substrate 1. The external connection terminals 41 that make up the external connection terminal array 40 are arranged in the Y direction along one set of opposite sides of the outline (parallelogram) of the element substrate 1. In other words, the external connection terminals 41 are arranged along the arrangement direction of the functional elements (ejection elements 31 and ejection detection elements 36).

[0060] The pseudo-functional element arrays 50 are arranged between the three element sections 20, i.e., the nine element arrays 30, from the side along the arrangement direction to the external connection terminal array 40. The pseudo-functional element arrays 50 are also arranged in the gaps between adjacent element sections 20, i.e., in the gaps between element arrays 30 located on the boundaries between adjacent element sections 20. For example, six pseudo-functional element arrays 50 are arranged side by side between three element sections 20 and the external connection terminal arrays 40 on both sides. One pseudo-functional element array 50 is arranged in each gap between two arrays of three element sections 20. Furthermore, for example, the elements in the combined array of 23 element arrays 30 and pseudo-functional element arrays 50 are arranged at equal intervals in the shape of a parallelogram. The arrangement direction of the element arrays 30 and the pseudo-functional element arrays 50 is parallel to the opposite side of the other pair of the outline (parallelogram) of the element substrate 1.

[0061] As a result, while the dimensional accuracy of the pseudo-functional elements 51 that do not function as functional elements decreases, it is possible to suppress a decrease in the dimensional accuracy of the functional elements (ejection elements 31 and ejection detection elements 36) located on the end side of one set of the opposite side of the element substrate 1. Therefore, it is possible to suppress ejection unevenness caused by uneven shapes of the functional elements located on the end side of one set of the opposite side of the element substrate 1, and high-quality recording can be performed. Furthermore, since it is possible to suppress a decrease in the dimensional accuracy of the functional elements located on the boundary between adjacent element sections 20, it is possible to suppress ejection unevenness caused by uneven shapes of the functional elements, and high-quality recording can be performed.

[0062] As described above, according to the third embodiment, it is possible to perform high-quality recording, similar to the first embodiment.

[0063] In the third embodiment, the functional elements (ejection elements 31 and ejection detection elements 36) are arranged parallel to one set of opposite sides of the external shape (parallelogram) of the element substrate 1. Furthermore, the external connection terminal arrays 40 are arranged at both ends of one set of opposite sides of the element substrate 1. As a result, by arranging element substrates 1 formed so that the external shape is a parallelogram in the Y direction so as to connect one set of opposite sides of the parallelogram, it is possible to realize a liquid ejection head in which a plurality of element substrates 1 (liquid ejection modules) are arranged in a line in the Y direction.

[0064] In each of the above-described embodiments, the functional element may include, in addition to the ejection elements 31 and the ejection detection elements 36, a resistor that heats the element substrate 1 by converting electric power into thermal energy. This resistor may be disposed at the same position as the ejection elements 31 on the silicon substrate 10 as a substrate heating layer for heating the element substrate 1, or may be disposed at a different position from the ejection elements 31 on the silicon substrate 10. Note that the pseudo-functional element 51 does not function as a functional element, and therefore does not heat the element substrate 1 as a resistor (substrate heating layer).

[0065] In each of the above-described embodiments, the external connection terminal arrays 40 are arranged at both end portions of the element substrate 1, but this is not limiting. For example, the external connection terminal array 40 may be arranged at one end portion of the element substrate 1. In this case, a different number of pseudo-function element arrays 50 may be arranged on the side of the nine element arrays 30 on the side where the external connection terminal array 40 is arranged and on the side of the nine element arrays 30 on the side where the external connection terminal array 40 is not arranged.

[0066] In each of the above-described embodiments, three element units 20 and three liquid chambers 525 corresponding to three types of ink are formed, but this is not limiting. For example, four element units 20 and four liquid chambers 525 corresponding to four types of ink may be formed, as long as the number of element units 20 and liquid chambers 525 formed corresponds to the type of ink.

[0067] In each of the above-described embodiments, the ejection element 31 is an electrothermal conversion element that uses thermal energy to bubble the liquid, thereby ejecting ink (liquid) from the ejection orifice 521, but is not limited to this. For example, the ejection element may be a piezoelectric element that uses kinetic energy generated by deformation to eject ink (liquid) from the ejection orifice.

[0068] In each of the above-described embodiments, the liquid ejection head 500 is a so-called full-line type liquid ejection head that can eject ink across the entire width of the recording medium without moving in the main scanning direction, but is not limited to this. The liquid ejection head may also be a so-called serial type liquid ejection head that ejects ink while moving in the main scanning direction.

[0069] In each of the above-described embodiments, the silicon substrate 10 is formed using a single-crystal silicon substrate, but is not limited to this. For example, the silicon substrate 10 may be formed using an SOI (Silicon On Insulator) wafer in which an oxide film layer is sandwiched between two silicon layers, or an annealed wafer whose surface has been modified by heat treatment.

[0070] <<Other embodiments>> The disclosure of this embodiment includes configurations represented by the following examples of a substrate for a liquid ejection head and examples of a liquid ejection head.

[0071] <Configuration 1> A liquid ejection head substrate provided in a liquid ejection head having a plurality of ejection ports for ejecting liquid, a plurality of element rows in which a plurality of functional elements corresponding to the ejection ports are arranged in an arrangement direction intersecting with the arrangement direction of the functional elements; a pseudo-functional element array in which a plurality of pseudo-functional elements that are not electrically driven are arranged along the arrangement direction; Equipped with The liquid ejection head substrate is characterized in that the pseudo-function element array is disposed on a side of the plurality of element arrays in the direction of arrangement.

[0072] <Configuration 2> A liquid ejection head substrate provided in a liquid ejection head having a plurality of ejection ports for ejecting liquid, a plurality of element rows in which a plurality of functional elements corresponding to the ejection ports are arranged in an arrangement direction intersecting with the arrangement direction of the functional elements; a pseudo-functional element array in which a plurality of pseudo-functional elements that are not electrically driven are arranged along the arrangement direction; Equipped with The liquid ejection head substrate is characterized in that the pseudo-function element arrays are disposed in the gaps between the plurality of element arrays.

[0073] <Configuration 3> 2. The liquid ejection head substrate according to configuration 1, wherein the pseudo-function element arrays are arranged on the sides of the plurality of element arrays in the arrangement direction and in the gaps between the plurality of element arrays.

[0074] <Configuration 4> 4. The liquid ejection head substrate according to configuration 2 or 3, wherein the gap between the plurality of element rows is at least twice as wide as the smallest gap between the plurality of element rows.

[0075] <Configuration 5> an external connection terminal row in which a plurality of external connection terminals electrically connected to the outside are arranged along the arrangement direction; the external connection terminal array is provided at an end of the liquid ejection head substrate in the arrangement direction, 4. The liquid ejection head substrate according to configuration 1 or 3, wherein the pseudo-function element array is arranged between the side of the plurality of element arrays in the arrangement direction and the external connection terminal array.

[0076] <Configuration 6> 6. The liquid ejection head substrate according to configuration 5, wherein the external connection terminal arrays are provided on both end portions of the liquid ejection head substrate in the arrangement direction.

[0077] <Configuration 7> the functional element includes an ejection element that generates ejection energy for ejecting liquid from the ejection port, 7. The liquid ejection head substrate according to any one of configurations 1 to 6, wherein the pseudo-functional element does not generate ejection energy.

[0078] <Configuration 8> the functional element includes an ejection detection element that detects the behavior of the liquid; 8. The liquid ejection head substrate according to configuration 7, wherein the pseudo-functional element does not detect the behavior of the liquid.

[0079] <Configuration 9> the functional element includes a resistor that heats the liquid ejection head substrate, 9. The liquid ejection head substrate according to configuration 7 or 8, wherein the pseudo-functional element does not heat the liquid ejection head substrate.

[0080] <Configuration 10> The outer shape of the liquid ejection head substrate is formed in a rectangular shape, 10. The liquid ejection head substrate according to any one of configurations 1 to 9, wherein the functional elements are arranged parallel to a long side or a short side of the rectangle.

[0081] <Configuration 11> The outer shape of the liquid ejection head substrate is formed in a trapezoidal shape, 10. The liquid ejection head substrate according to any one of configurations 1 to 9, wherein the functional elements are arranged parallel to the base of the trapezoid.

[0082] <Configuration 12> The outer shape of the liquid ejection head substrate is formed in a parallelogram shape, 10. The liquid ejection head substrate according to any one of configurations 1 to 9, wherein the functional elements are arranged parallel to one pair of opposite sides of the parallelogram.

[0083] <Configuration 13> 13. The liquid ejection head substrate according to any one of configurations 1 to 12, wherein wiring for supplying power to the functional element is not electrically connected to the pseudo-functional element.

[0084] <Configuration 14> 14. The liquid ejection head substrate according to any one of configurations 1 to 13, wherein the underlying layer on which the functional elements are arranged is flat.

[0085] <Configuration 15> 15. A liquid ejection head using the liquid ejection head substrate according to any one of configurations 1 to 14. [Explanation of symbols]

[0086] 1. Element substrate 30 element array 31 Discharge element 36 Discharge detection element 40 External connection terminal row 41 External connection terminal 50 pseudo-functional element array 51 Pseudo-functional elements 500 Liquid ejection head 520 Liquid chamber forming member 521 Discharge port 525 Liquid chamber

Claims

1. A liquid ejection head substrate provided in a liquid ejection head having a plurality of ejection ports for ejecting liquid, a plurality of element rows in which a plurality of functional elements corresponding to the ejection ports are arranged in an arrangement direction intersecting with the arrangement direction of the functional elements; a pseudo-functional element array in which a plurality of pseudo-functional elements that are not electrically driven are arranged along the arrangement direction; Equipped with The liquid ejection head substrate is characterized in that the pseudo-function element array is disposed on a side of the plurality of element arrays in the direction of arrangement.

2. A liquid ejection head substrate provided in a liquid ejection head having a plurality of ejection ports for ejecting liquid, a plurality of element rows in which a plurality of functional elements corresponding to the ejection ports are arranged in an arrangement direction intersecting with the arrangement direction of the functional elements; a pseudo-functional element array in which a plurality of pseudo-functional elements that are not electrically driven are arranged along the arrangement direction; Equipped with The liquid ejection head substrate is characterized in that the pseudo-function element arrays are disposed in the gaps between the plurality of element arrays.

3. The liquid ejection head substrate according to claim 1 , wherein the pseudo-function element arrays are arranged on the sides of the plurality of element arrays in the arrangement direction and in the gaps between the plurality of element arrays.

4. 4. The liquid ejection head substrate according to claim 2, wherein the gap between the plurality of element rows is at least twice as wide as the smallest gap between the plurality of element rows.

5. an external connection terminal row in which a plurality of external connection terminals electrically connected to the outside are arranged along the arrangement direction; the external connection terminal array is provided at an end of the liquid ejection head substrate in the arrangement direction, 4. The liquid ejection head substrate according to claim 1, wherein the pseudo-function element array is arranged between a side of the plurality of element arrays along the arrangement direction and the external connection terminal array.

6. 6. The liquid discharge head substrate according to claim 5, wherein the external connection terminal arrays are provided on both end portions of the liquid discharge head substrate in the arrangement direction.

7. the functional element includes an ejection element that generates ejection energy for ejecting liquid from the ejection port, 3. The liquid ejection head substrate according to claim 1, wherein the pseudo-functional element does not generate ejection energy.

8. the functional element includes an ejection detection element that detects the behavior of the liquid; The liquid ejection head substrate according to claim 7 , wherein the pseudo-functional element does not detect the behavior of the liquid.

9. the functional element includes a resistor that heats the liquid ejection head substrate, The liquid discharge head substrate according to claim 7 , wherein the pseudo-functional element does not heat the liquid discharge head substrate.

10. The outer shape of the liquid ejection head substrate is formed in a rectangular shape, 3. The liquid ejection head substrate according to claim 1, wherein the functional elements are arranged parallel to a long side or a short side of the rectangle.

11. The outer shape of the liquid ejection head substrate is formed in a trapezoidal shape, 3. The liquid ejection head substrate according to claim 1, wherein the functional elements are arranged parallel to a base of the trapezoid.

12. The outer shape of the liquid ejection head substrate is formed in a parallelogram shape, 3. The liquid ejection head substrate according to claim 1, wherein the functional elements are arranged parallel to one pair of opposite sides of the parallelogram.

13. 3. The liquid ejection head substrate according to claim 1, wherein wiring for supplying power to said functional element is not electrically connected to said pseudo-functional element.

14. 3. The liquid ejection head substrate according to claim 1, wherein the underlying layer on which the functional elements are arranged is flat.

15. A liquid ejection head using the liquid ejection head substrate according to claim 1 or 2.

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