Electron tube unit

Abstract

To provide an electron tube unit capable of being further miniaturized.SOLUTION: The electron tube unit 100 includes the flash lamp 1, the first substrate 10 to which the flash lamp 1 is electrically connected, and the second substrate 20 on which the boosting circuit 5 is provided. The first substrate 10 and the second substrate 20 are disposed so as to be separated from each other and overlap each other via a plurality of third substrates 30. The third substrate 30 includes a first conductive portion 51 and a third conductive portion 53 that transmit power supplied from the booster circuit 5 to the flash lamp 1.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to an electron tube unit. [Background technology]

[0002] As a technology relating to an electron tube unit, for example, Patent Document 1 describes a flash light source device that includes an electron tube (flash lamp), a first board (wiring board) to which the electron tube is electrically connected, and a second board (wiring board) on which a boost circuit is provided. The flash light source device described in Patent Document 1 uses multiple boards to make the device more compact. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6783531 Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology described above, the first and second substrates are positioned via a spacer, and power is supplied from the boost circuit to the electron tube using pins and sockets. With this configuration, it may be difficult to further miniaturize the electron tube unit.

[0005] The present disclosure has been made in view of the above circumstances, and has an object to provide an electron tube unit that can be further miniaturized. [Means for solving the problem]

[0006] The electron tube unit of the present disclosure is [1] "an electron tube unit comprising: an electron tube; a first substrate to which the electron tube is electrically connected; and a second substrate on which at least a part of a boost circuit is provided, the first substrate and the second substrate being arranged so as to be separated from each other and at least partially overlap each other via one or more third substrates, the third substrate including a conductive portion that transmits power supplied from the boost circuit to the electron tube."

[0007] In this electron tube unit, the third board positions the first and second boards and supplies power from the boost circuit to the electron tube, eliminating the need for spacers, pins, and sockets in the electron tube unit and enabling further miniaturization of the electron tube unit.

[0008] The electron tube unit of the present disclosure may be [2] "the electron tube unit according to [1], wherein the third substrate extends along an edge of at least one of the first substrate and the second substrate." In this case, it is possible to secure a large area for component placement on at least one of the first substrate and the second substrate.

[0009] The electron tube unit of the present disclosure may be [3] "the electron tube unit according to [2], wherein the third substrate is formed in an L-shape when viewed in the thickness direction." In this case, it is possible to ensure the mechanical strength of the electron tube unit while widening the area in which components can be arranged on at least one of the first and second substrates.

[0010] The electron tube unit of the present disclosure may be [4] "the electron tube unit according to any one of [1] to [3], wherein the conductive portion has an end face through-hole formed so as to be exposed on a side surface of the third substrate, and a conductive member disposed in the end face through-hole." In this case, the conductive portion can be easily formed.

[0011] The electron tube unit of the present disclosure may be [5] "the electron tube unit according to [4], in which the conductive portion connects the first substrate, the second substrate, and the third substrate." In this case, the first substrate, the second substrate, and the third substrate can be fixed using the conductive portion.

[0012] The electron tube unit of the present disclosure may be [6] "the electron tube unit according to any one of [1] to [5], further comprising a fastening member that connects the first substrate, the second substrate, and the third substrate." In this case, the first substrate, the second substrate, and the third substrate can be fixed by the fastening member.

[0013] The electron tube unit of the present disclosure may be [7] "the electron tube unit according to [6], wherein the fastening member is provided so as to penetrate the edge portions of the first substrate and the second substrate." In this case, it is easier to ensure an insulating distance between the fastening member and the high-voltage portions of the first substrate and the second substrate.

[0014] The electron tube unit of the present disclosure may be [8] "the electron tube unit according to any one of [1] to [7], wherein the third substrate has an asymmetric shape when viewed in the thickness direction." In this case, the asymmetric shape of the third substrate makes it easy to determine the assembly orientation of the third substrate, and makes it possible to prevent incorrect assembly of the third substrate.

[0015] The electron tube unit of the present disclosure may be [9] "the electron tube unit according to [8], wherein the third substrate includes a first straight portion extending along a first direction as viewed in the thickness direction, and a second straight portion continuing from the first straight portion and extending along a second direction intersecting the first direction as viewed in the thickness direction, and a corner of one end of either the first straight portion or the second straight portion is chamfered." In this case, the chamfering of the third substrate makes it easy to determine the assembly orientation of the third substrate, and makes it possible to prevent incorrect assembly of the third substrate.

[0016] The electron tube unit of the present disclosure may be

[10] "the electron tube unit according to any one of [1] to [9], wherein the first substrate, the second substrate, and the third substrate are made of the same material." In this case, it is possible to prevent deformation and damage of the electron tube unit due to thermal expansion.

[0017] The electron tube unit of the present disclosure may be

[11] "the electron tube unit according to any one of [1] to

[10] , wherein the electron tube is a flash lamp." In this case, a flash light source device can be obtained.

[0018] The electron tube unit of the present disclosure may be

[12] "the electron tube unit according to any one of [1] to

[11] , wherein the third substrate includes another conductive part that supplies a reference potential to the electron tube." In this case, the third substrate can be used to supply a reference potential to the electron tube. [Effects of the Invention]

[0019] According to the present disclosure, it is possible to provide an electron tube unit that can be further miniaturized. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a perspective view showing an electron tube unit according to the first embodiment. [Figure 2] FIG. 2 is another perspective view showing the electron tube unit of FIG. [Figure 3] Fig. 3(a) is a plan view illustrating the first substrate of Fig. 1. Fig. 3(b) is a plan view illustrating the second substrate of Fig. 1. [Figure 4] FIG. 4 is a plan view illustrating the third substrate of FIG. [Figure 5] 5 is a perspective view showing a cross section along the XY plane of the electron tube unit of FIG. [Figure 6] FIG. 6 is a side view showing the electron tube unit of FIG. [Figure 7] FIG. 7 is a block diagram of the electron tube unit of FIG. [Figure 8]FIG. 8 is a perspective view showing an electron tube unit according to the second embodiment. [Figure 9] FIG. 9 is a perspective view showing an electron tube unit according to the third embodiment. [Figure 10] Fig. 10(a) is a plan view showing the first and second substrates of Fig. 9. Fig. 10(b) is a plan view showing the third substrate of Fig. 9. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, the embodiments will be described in detail with reference to the drawings. In each drawing, the same or corresponding parts are designated by the same reference numerals, and duplicated explanations will be omitted.

[0022] [First embodiment] 1 and 2, the electron tube unit 100 according to the first embodiment is a flash light source device used in, for example, an analytical device. The electron tube unit 100 includes a flash lamp (electron tube) 1, a first substrate 10, a second substrate 20, and multiple third substrates 30. In the following description, the axial direction of the flash lamp 1 is defined as the Z direction, the direction perpendicular to the Z direction is defined as the X direction, and the direction perpendicular to both the X and Z directions is defined as the Y direction.

[0023] The flash lamp 1 has a configuration in which multiple lead pins 1x protrude from one end of a sealed container 1y. A discharge gas (e.g., xenon gas) is sealed inside the sealed container 1y. This type of flash lamp 1 has a shorter inter-electrode distance than a straight-tube flash lamp, making it suitable for lighting at high frequencies, such as 10 Hz or higher.

[0024] As shown in FIGS. 1, 2, and 3(a), the first substrate 10 is a printed circuit board with its thickness direction aligned in the Z direction (a direction perpendicular to the surface of the first substrate 10 on which various elements are mounted). The first substrate 10 is a circuit board on which components are mounted. The first substrate 10 is a rectangular flat plate when viewed from the Z direction. In the illustrated example, the first substrate 10 is formed in a square shape with sides extending in the X and Y directions when viewed from the Z direction. For example, the first substrate 10 is formed from an insulating material (such as a resin, e.g., glass epoxy). One of the four corners of the first substrate 10 is chamfered (e.g., rounded) to form a curved surface 15. Through holes 14 are formed in a pair of diagonally opposite corners of the four corners on the surface 10a of the first substrate 10. The through holes 14 are circular holes that penetrate the first substrate 10 in the Z direction.

[0025] Each lead pin 1x of the flash lamp 1 is connected to the surface 10a of the first substrate 10 by solder or the like. This electrically connects the flash lamp 1 to the circuit of the first substrate 10. A step-up transformer 2 and a main discharge capacitor 3 are mounted on the first substrate 10. The step-up transformer 2 is a component that converts (e.g., converts several hundred volts to several kV) the input voltage charged to a trigger capacitor included in part 6 of the trigger circuit, which will be described later. The voltage converted by the step-up transformer 2 is used to generate a preliminary discharge in the flash lamp 1. The main discharge capacitor 3 is one of the components that supplies input energy to the flash lamp 1. The input energy is determined by the capacitance of the main discharge capacitor 3 and the value of the main discharge voltage charged to it. The light output of the flash lamp 1 is approximately proportional to the input energy.

[0026] As shown in FIGS. 3(a) and 6, a first land portion 11, a second land portion 12, and a third land portion 13 are formed on the edge portion of the first substrate 10. The first land portion 11, the second land portion 12, and the third land portion 13 are portions for electrically connecting the first substrate 10 to the second substrate 20 and the third substrate 30 (in other words, electrically connecting the first substrate 10 and the second substrate 20 via the third substrate 30). In the example shown, the first land portion 11 is formed on one end side of the edge portion corresponding to one side of the square shape of the first substrate 10. The second land portion 12 is formed adjacent to the first land portion 11 at a position closer to the center than the first land portion 11 on the edge portion of the first substrate 10. The third land portion 13 is formed away from the second land portion 12 at a position closer to the other end of the center on the edge portion of the first substrate 10.

[0027] The first land portion 11 has an end face through hole 11z formed so as to be exposed on the side surface of the first substrate 10, and solder (conductive member) 9 arranged in the end face through hole 11z. The solder 9 is, for example, solder. The end face through hole 11z includes multiple rows of grooves with semicircular cross sections extending along the Z direction, and a conductive pattern formed on the inner surface of the groove and around the groove. Similar to the first land portion 11, the second land portion 12 has an end face through hole 12z formed so as to be exposed on the side surface of the first substrate 10, and solder 9 arranged in the end face through hole 12z. Similar to the first land portion 11 and the second land portion 12, the third land portion 13 has an end face through hole 13z formed so as to be exposed on the side surface of the first substrate 10, and solder 9 arranged in the end face through hole 13z.

[0028] As shown in Figures 1, 2 and 3(b), the second substrate 20 is a printed circuit board whose thickness direction is the Z direction (a direction perpendicular to the surface of the second substrate 20 on which various elements are mounted). The second substrate 20 is a circuit board on which components are mounted. The second substrate 20 is a rectangular flat plate when viewed from the Z direction. The second substrate 20 here has the same square shape as the first substrate 10. The second substrate 20 has the same thickness as the first substrate 10. The second substrate 20 is made of the same material as the first substrate 10. For example, the second substrate 20 is made of an insulating material (such as a resin such as glass epoxy).

[0029] One of the four corners of the second substrate 20 is chamfered (e.g., rounded) to form a curved surface 25. The curved surface 25 has a radius of curvature corresponding to that of the curved surface 15 of the first substrate 10, for example. Through holes 24 are formed in a pair of diagonally opposite corners of the four corners of the front surface 20a of the second substrate 20. The through holes 24 are circular holes that penetrate the second substrate 20 in the Z direction. The diameter of the through hole 24 corresponds to the diameter of the through hole 14 of the first substrate 10.

[0030] An input connector 4, a boost circuit 5, and part of a trigger circuit 6 are mounted on the second substrate 20. The input connector 4 is a connector for connecting an external power supply wiring, etc. The boost circuit 5 is a circuit for boosting the power supplied from the outside via the input connector 4. There are no particular limitations on the boost circuit 5, and various circuits may be used. The part of the trigger circuit 6 is a part for generating a preliminary discharge in the flash lamp 1. The part of the trigger circuit 6 includes, as components, a trigger capacitor and a circuit for charging the trigger capacitor.

[0031] As shown in FIGS. 3(b) and 6, a first land portion 21, a second land portion 22, and a third land portion 23 are formed on the edge portion of the second substrate 20. The first land portion 21, the second land portion 22, and the third land portion 23 are portions for electrically connecting the second substrate 20 to the first substrate 10 and the third substrate 30 (in other words, electrically connecting the second substrate 20 and the first substrate 10 via the third substrate 30). In the example shown, the first land portion 21 is formed on one end side of the edge portion corresponding to one side of the square shape of the second substrate 20. The second land portion 22 is formed adjacent to the first land portion 21 at a position closer to the center than the first land portion 21 on the edge portion of the second substrate 20. The third land portion 23 is formed away from the second land portion 22 at a position closer to the other end of the center on the edge portion of the second substrate 20.

[0032] The first land portion 21 has an end face through hole 21z formed so as to be exposed on the side surface of the second substrate 20, and solder 9 provided in the end face through hole 21z. The end face through hole 21z includes multiple rows of grooves with semicircular cross sections extending along the Z direction, and a conductive pattern formed on the inner surface of the groove and its periphery. Similar to the first land portion 21, the second land portion 22 has an end face through hole 22z formed so as to be exposed on the side surface of the second substrate 20, and solder 9 provided in the end face through hole 22z. Similar to the first land portion 21 and the second land portion 22, the third land portion 23 has an end face through hole 23z formed so as to be exposed on the side surface of the second substrate 20, and solder 9 provided in the end face through hole 23z.

[0033] 1, 2, and 6, such a second substrate 20 is disposed on the rear surface 10b side of the first substrate 10 so as to overlap with a space therebetween via a plurality of third substrates 30. The second substrate 20 is overlapped with the first substrate 10 so that their outer edges coincide with each other when viewed from the Z direction.

[0034] As shown in FIGS. 1, 2, and 4 to 6, the third substrate 30 is a printed circuit board with its thickness direction in the Z direction. The third substrate 30 is a substrate that electrically and mechanically connects the first substrate 10 and the second substrate 20. The third substrate 30 is a flat plate. A plurality of third substrates 30 are stacked and disposed between the first substrate 10 and the second substrate 20. As a result, the first substrate 10 and the second substrate 20 are positioned so as to be separated by a certain distance according to the thickness and number of the third substrates 30. Therefore, depending on the desired characteristics, only one third substrate 30 may be disposed between the first substrate 10 and the second substrate 20.

[0035] The third substrate 30 has the same thickness as the first substrate 10 and the second substrate 20. The third substrate 30 is formed of the same material as the first substrate 10 and the second substrate 20. For example, the third substrate 30 is formed of an insulating material (such as a resin, such as glass epoxy). The third substrate 30 closest to the first substrate 10 abuts against the first substrate 10, and the third substrate 30 closest to the second substrate 20 abuts against the second substrate 20. The number of third substrates 30 is set, for example, so that the first substrate 10 and the second substrate 20 are separated by an insulation distance or more. Note that the insulation distance in this embodiment refers to a distance that can ensure insulation that is determined to be able to suppress the occurrence of abnormal discharge between the first substrate 10 and the second substrate 20 in order to ensure safety and prevent loss of function due to abnormal discharge.

[0036] The third substrate 30 is formed in an L-shape when viewed from the Z direction. The third substrate 30 extends along the edges of the first substrate 10 and the second substrate 20. The third substrate 30 has a first straight line portion 31 and a second straight line portion 32 that is continuous with the first straight line portion 31 and perpendicular to the first straight line portion 31. When viewed from the Z direction, the first straight line portion 31 extends along the X direction at an edge portion corresponding to a side of the first substrate 10 and the second substrate 20 that is along the X direction (first direction). The second straight line portion 32 extends along the Y direction (second direction intersecting with the first direction) at an edge portion corresponding to a side of the first substrate 10 and the second substrate 20 that is along the Y direction.

[0037] A through hole 34 is formed at the outer end of each of the first straight portion 31 and the second straight portion 32 (on the side opposite the corner of the L-shape). The through hole 34 is a circular hole that penetrates the third substrate 30 in the Z direction. The diameter of the through hole 34 corresponds to the diameter of the through hole 14 of the first substrate 10 and the diameter of the through hole 24 of the second substrate 20. The corner at the outer end of the first straight portion 31 is chamfered (e.g., R-chamfered) to form a curved surface 35. The curved surface 35 has a curvature radius corresponding to the curved surfaces 15 and 25. Such a third substrate 30 has an asymmetric shape when viewed from the Z direction. Specifically, the shape of the third substrate 30 when viewed from the Z direction is asymmetric (so-called left-right asymmetric) in that the portion on the X-direction side and the portion on the Y-direction side do not coincide with each other, based on the corner of the L-shape.

[0038] The third substrate 30 includes a conductive section 50 that electrically connects the first substrate 10 and the second substrate 20. The conductive section 50 has end face through holes 50z formed so as to be exposed on the side surfaces of the third substrate 30, and solder 9 provided in the end face through holes 50z. The end face through holes 50z include multiple rows of grooves with semicircular cross sections that extend along the thickness direction, and a conductive pattern formed on the inner surface of and around the grooves.

[0039] The conductive portion 50 is configured to include a first conductive portion 51, a second conductive portion 52, and a third conductive portion 53. The first conductive portion 51 is formed at the end portion on the inner side (the corner side of the L-shape) of the second straight portion 32. The second conductive portion 52 is formed at a position on the second straight portion 32 outside the first conductive portion 51 so as to be adjacent to the first conductive portion 51. The third conductive portion 53 is formed at a position on the second straight portion 32 closer to the outer side of the center, away from the second conductive portion 52.

[0040] The multiple third substrates 30 are stacked so that their outer edges coincide when viewed from the Z direction. In the multiple stacked third substrates 30, the curved surfaces 35 are continuous and the through holes 34 are connected to each other. In the multiple stacked third substrates 30, the first conductive portions 51 are continuous and electrically connected to each other, the second conductive portions 52 are continuous and electrically connected to each other, and the third conductive portions 53 are continuous and electrically connected to each other.

[0041] The multiple third substrates 30 are interposed between the back surface 10b of the first substrate 10 and the front surface 10a of the second substrate 20. The multiple third substrates 30 are stacked so as to follow the edges of the first substrate 10 and the second substrate 20 when viewed from the Z direction. When viewed from the thickness direction, the curved surface 35 is continuous with the curved surface 15 of the first substrate 10 and the curved surface 25 of the second substrate 20, and the through hole 34 is continuous with the through hole 14 of the first substrate 10 and the through hole 24 of the second substrate 20.

[0042] The first conductive portion 51 is continuous with the first land portion 11 of the first substrate 10 and the first land portion 21 of the second substrate 20, and the first land portions 11, 21 are electrically connected to each other. More specifically, the side surface of the first conductive portion 51 facing the first substrate 10 is electrically connected to the side surface of the first land portion 11 of the first substrate 10 facing the second substrate 20, and the side surface of the first conductive portion 51 facing the second substrate 20 is electrically connected to the side surface of the first land portion 21 of the second substrate 20 facing the first substrate 10, and thus the first land portions 11, 21 are electrically connected to each other. The second conductive portion 52 is continuous with the second land portion 12 of the first substrate 10 and the second land portion 22 of the second substrate 20, and the second land portions 12, 22 are electrically connected to each other. More specifically, the side surface of the second conductive portion 52 facing the first substrate 10 is electrically connected to the side surface of the second land portion 12 of the first substrate 10 facing the second substrate 20, and the side surface of the second conductive portion 52 facing the second substrate 20 is electrically connected to the side surface of the second land portion 22 of the second substrate 20 facing the first substrate 10, thereby electrically connecting the second land portions 12 and 22 to each other. The third conductive portion 53 is continuous with the third land portion 13 of the first substrate 10 and the third land portion 23 of the second substrate 20, thereby electrically connecting the third land portions 13 and 23 to each other. More specifically, the side surface of the third conductive portion 53 facing the first substrate 10 is electrically connected to the side surface of the third land portion 13 of the first substrate 10 facing the second substrate 20, and the side surface of the third conductive portion 53 facing the second substrate 20 is electrically connected to the side surface of the third land portion 23 of the second substrate 20 facing the first substrate 10, thereby electrically connecting the third land portions 13 and 23 to each other.

[0043] As shown in FIGS. 3(a), 3(b), 4, and 6, the first conductive portion 51 and the third conductive portion 53 transmit power supplied from the boost circuit 5 to the flash lamp 1. Specifically, the first conductive portion 51 transmits power output from the boost circuit 5 of the second board 20 and input to the main discharge capacitor 3 of the first board 10. The third conductive portion 53 transmits power output from a portion 6 of the trigger circuit of the second board 20 and input to the step-up transformer 2 of the first board 10. The second conductive portion 52 electrically connects the flash lamp 1, the main discharge capacitor 3, and the step-up transformer 2 to ground (reference potential). The first conductive portion 51 and the third conductive portion 53 constitute a conductive portion, and the second conductive portion 52 constitutes another conductive portion. The conductive portion 50 mechanically connects the first board 10, the second board 20, and the third board 30.

[0044] 1 and 5, the electron tube unit 100 further includes fastening members 7 that connect the first substrate 10, the second substrate 20, and the third substrate 30. The fastening members 7 are, for example, screws. The fastening members 7 are inserted through the through holes 14 of the first substrate 10, the through holes 24 of the second substrate 20, and the through holes 34 of the third substrate 30. The fastening members 7 are provided so as to penetrate the edges of the first substrate 10 and the second substrate 20.

[0045] As shown in FIGS. 3(a), 3(b), 6, and 7, the electron tube unit 100 performs the following operation, for example. First, power a, for example, of several volts, is input to the boost circuit 5 from the input connector 4. The boost circuit 5 boosts power a to power b of several hundred volts, and power b is input from the boost circuit 5 to the main discharge capacitor 3. At the same time, power d, also of several hundred volts, is input from the boost circuit 5 to a part 6 of the trigger circuit. The part 6 of the trigger circuit converts the voltage to power e of several hundred volts (power d > power e), and power e is input to the step-up transformer 2. Power f, about several kV, is input from the step-up transformer 2 to the flash lamp 1, causing a preliminary discharge in the flash lamp 1. At the same time, power c, about several hundred volts plus several kV, is supplied from the main discharge capacitor 3 to the flash lamp 1. At this time, the flash lamp 1, step-up transformer 2, main discharge capacitor 3, step-up circuit 5, and part of the trigger circuit 6 are electrically connected to the input connector 4 with the ground g of 0 V as the reference potential. As a result, the flash lamp 1 emits pulsed light.

[0046] As described above, in the electron tube unit 100, the third substrate 30 positions the first substrate 10 and the second substrate 20, and also allows power to be supplied from the boost circuit 5 to the flash lamp 1. This eliminates the need for components such as spacers, pins, and sockets in the electron tube unit 100, making it possible to further reduce the size of the electron tube unit 100. It also makes it possible to further reduce the weight of the electron tube unit 100. In addition, the reduction in components, the simplification of the structure, and the resulting simplification of the manufacturing process make it possible to reduce the cost of the electron tube unit 100.

[0047] In the electron tube unit 100, the third substrate 30 extends along the edges of the first substrate 10 and the second substrate 20. In this case, for example, it is possible to secure a large area for component placement on the first substrate 10 and the second substrate 20. The third substrate is less likely to interfere with the circuit layout on the first substrate 10 and the second substrate 20, making it possible to minimize restrictions on the circuit layout.

[0048] In the electron tube unit 100, the third substrate 30 is formed in an L-shape when viewed from the Z direction. In this case, it is possible to ensure the mechanical strength of the electron tube unit 100 while widening the area in which components can be arranged on the first substrate 10 and the second substrate 20.

[0049] In the electron tube unit 100, the conductive section 50 has an end face through hole 50z and solder 9 arranged in the end face through hole 50z. In this case, the arrangement of the solder 9 when forming the conductive section 50 (for example, an operation such as soldering to the area released by the end face through hole 50z) can be easily realized, and the conductive section 50 can be easily formed.

[0050] In the electron tube unit 100, the conductive portion 50 connects the first substrate 10, the second substrate 20, and the third substrate 30. In this case, the conductive portion 50 can be used to fix the first substrate 10, the second substrate 20, and the third substrate 30 together.

[0051] The electron tube unit 100 further includes a fastening member 7 that connects the first substrate 10, the second substrate 20, and the third substrate 30. In this case, the first substrate 10, the second substrate 20, and the third substrate 30 can also be fixed by the fastening member 7.

[0052] The fastening members 7 are often made of conductive materials such as metal, and when the fastening members 7 are inserted into the first substrate 10 and the second substrate 20, an insulating distance is required between the fastening members 7 and the high-voltage portions of the first substrate 10 and the second substrate 20. In this regard, in the electron tube unit 100, the fastening members 7 are provided so as to penetrate the edges of the first substrate 10 and the second substrate 20, making it easier to ensure the insulating distance.

[0053] In the electron tube unit 100, the third substrate 30 has an asymmetric shape when viewed from the Z direction. In this case, the asymmetric shape of the third substrate 30 makes it easy to grasp the assembly orientation of the third substrate 30, and makes it possible to prevent incorrect assembly of the third substrate 30.

[0054] In the electron tube unit 100, the third substrate 30 includes a first straight portion 31 extending along the X direction when viewed from the Z direction, and a second straight portion 32 that is continuous with the first straight portion 31 and extends along the Y direction when viewed from the Z direction. The corners at the ends of the first straight portion 31 are chamfered. In this case, the chamfering of the third substrate 30 makes it easy to determine the assembly orientation of the third substrate 30, and makes it possible to prevent incorrect assembly of the third substrate 30.

[0055] In the electron tube unit 100, the first substrate 10, the second substrate 20, and the third substrate 30 are made of the same material. In this case, the thermal expansion coefficients of the first substrate 10, the second substrate 20, and the third substrate 30 can be made uniform, making it possible to prevent deformation and damage of the electron tube unit 100 due to thermal expansion.

[0056] The electron tube unit 100 includes a flash lamp 1. In this case, the electron tube unit 100 can be obtained as a flash light source device.

[0057] In the electron tube unit 100, the third substrate 30 includes a second conductive part 52 that supplies a reference potential to the flash lamp 1 and the main discharge capacitor 3. In this case, the third substrate 30 can be used to supply a reference potential to the flash lamp 1 and the main discharge capacitor 3.

[0058] The electron tube unit 100 includes a first substrate 10 and a second substrate 20 as circuit boards on which components are mounted, i.e., the circuit boards on which components are mounted are divided into multiple boards. This makes it possible to reduce the footprint of the electron tube unit 100, facilitating the design of devices that include the electron tube unit 100.

[0059] [Second embodiment] Next, a second embodiment will be described.

[0060] As shown in Fig. 8, the electron tube unit 200 according to the second embodiment differs from the first embodiment in that it further includes a fourth board 40 as a circuit board on which components are mounted, in addition to the first board 10 and the second board 20. The fourth board 40 has a similar configuration to the second board 20. The above-mentioned step-up transformer 2, main discharge capacitor 3, input connector 4, step-up circuit 5, part of the trigger circuit 6, etc. are appropriately provided on any one of the first board 10, the second board 20, and the fourth board 40, or so as to straddle at least two of these boards.

[0061] In the electron tube unit 200 according to the second embodiment, the second substrate 20 is arranged on the rear surface 10b side of the first substrate 10 so as to overlap with, but be spaced apart from, one third substrate 30. The fourth substrate 40 is arranged on the rear surface 20b side of the second substrate 20 so as to overlap with, but be spaced apart from, one third substrate 30.

[0062] As described above, the electron tube unit 200 according to the second embodiment also achieves the above-mentioned advantageous effects, such as enabling further miniaturization of the electron tube unit 100. Note that in this embodiment, of the upper, middle, and lower circuit boards, the flash lamp 1 is electrically connected to the upper circuit board, and the upper circuit board is the first board 10, but the circuit board to which the flash lamp 1 is electrically connected is not particularly limited. For example, the flash lamp 1 may be electrically connected to the middle circuit board, in which case the middle circuit board corresponds to the first board 10. For example, the flash lamp 1 may be electrically connected to the lower circuit board, in which case the lower circuit board corresponds to the first board 10.

[0063] [Third embodiment] Next, a third embodiment will be described.

[0064] 9, 10(a), and 10(b), the electron tube unit 300 according to the third embodiment differs from the first embodiment in that, instead of the first substrate 10 and second substrate 20 that are rectangular when viewed from the Z direction, the electron tube unit 300 according to the third embodiment includes a first substrate 310 and a second substrate 320 that are circular when viewed from the Z direction. Also, the electron tube unit 300 according to the third embodiment differs from the first embodiment in that, instead of the multiple third substrates 30 that are L-shaped when viewed from the Z direction, the electron tube unit 300 according to the third embodiment includes a third substrate 330 that is arc-shaped when viewed from the Z direction.

[0065] The first substrate 310 has the same configuration as the first substrate 10, except that it has a circular outer shape. The second substrate 320 has the same configuration as the second substrate 20, except that it has a circular outer shape. The third substrate 330 has the same configuration as the third substrate 30, except that it has an arc-shaped outer shape. The above-mentioned step-up transformer 2, main discharge capacitor 3, input connector 4, step-up circuit 5, part of the trigger circuit 6, etc. are appropriately provided on any one of the first substrate 10, second substrate 20, and fourth substrate 40, or so as to straddle at least two of these. In the electron tube unit 300, the second substrate 320 is arranged on the back surface 310b of the first substrate 310 so as to overlap with but be spaced apart from each other, with the third substrate 330 interposed therebetween.

[0066] As described above, the electron tube unit 300 according to the third embodiment also achieves the above-mentioned advantageous effects, such as enabling further miniaturization of the electron tube unit 100.

[0067] [Variations] As described above, one aspect of the present disclosure is not limited to the above embodiment.

[0068] In the above embodiment, a flash lamp 1 is used as the electron tube, but the electron tube is not particularly limited, and for example, other discharge tubes or various known electron tubes may be used. In the above embodiment, the number of circuit boards on which components are mounted is not particularly limited, and may be four or more. In the above embodiment, a specific circuit block may be arranged across multiple circuit boards. In the above embodiment, insulating tape may be wrapped around the side surfaces of the first substrate 10, the second substrate 20, and the third substrate 30, and the conductive portion 50 may be covered with insulating tape.

[0069] In the above embodiment, the conductive portion 50 is formed by the end face through-holes 50z and the solder 9, but the configuration of the conductive portion 50 is not particularly limited and may be of various configurations as long as it is capable of transmitting power. Furthermore, if electrical connection between the respective boards can be ensured only by the conductor patterns of the end face through-holes 50z, the solder 9 may not be necessary.

[0070] In the above embodiment, the type of conductive material exemplified as solder 9 is preferably a material that can be filled and placed inside the end face through-holes. Other than solder, examples include conductive adhesives. However, there are no particular limitations on the type of conductive material as long as it contributes to the electrical connection between the conductor patterns in the end face through-holes of opposing substrates, and various conductive materials can be used. Furthermore, solder 9 is not limited to grooves in end face through-holes, and may also be placed between substrates (especially in the conductor pattern formation areas in end face through-holes). In this case, solder 9 contributes to fixing the substrates together in addition to electrical connection. Furthermore, the number of grooves in the end face through-hole is not limited to multiple, and may be single.

[0071] In the above embodiment, the first substrate 10 and the second substrate 20 do not have to be substrates of the same size, thickness, or material. In this case, the third substrate 30 may be disposed along an edge of at least one of the first substrate 10 and the second substrate 20 when viewed from the Z direction. The multiple third substrates 30 do not have to be substrates of the same size, thickness, or material.

[0072] In the above embodiment, the first substrate 10 and the second substrate 20 do not necessarily have to be arranged opposite to each other so as to overlap entirely, but may be arranged opposite to each other so as to overlap at least partially. That is, the first substrate 10 and the second substrate 20 may be arranged so as to be spaced apart and at least partially overlap with each other via the third substrate 30.

[0073] In the above embodiment, one layer of third substrate 30 may be composed of multiple substrates. In the above embodiment, the shape of third substrate 30 is not limited to an L-shape, and may be a U-shape, a linear shape, a rectangular shape, an elliptical shape, or a shape that forms a part of any of these shapes. In the above embodiment, third substrate 30 is not limited to being disposed on the edge portions of first substrate 10 and second substrate 20, and may be disposed in the central regions of first substrate 10 and second substrate 20.

[0074] In the above embodiment, the first land portion 11, the second land portion 12, and the third land portion 13 may not be provided only on the edge of a single side of the first substrate 10, but may be provided along the edge of multiple sides of the first substrate 10. Similarly, the first land portion 21, the second land portion 22, and the third land portion 23 may not be provided only on the edge of a single side of the second substrate 20, but may be provided along the edge of multiple sides of the second substrate 20. In the above embodiment, the type of chamfering is not particularly limited to R-chamfering, and various other chamfering shapes may be used, such as shapes in which corners are simply rounded.

[0075] The components in the above-described embodiment and modified examples are not limited to the materials and shapes described above, and various materials and shapes can be applied. Furthermore, the components in the above-described embodiment and modified examples can be arbitrarily applied to the components in other embodiments or modified examples. [Explanation of symbols]

[0076] 1...flash lamp (electron tube), 5...booster circuit, 7...fastening member, 9...solder, 10,310...first board, 20,320...second board, 30,330...third board, 50...conductive part, 51...first conductive part (conductive part), 52...second conductive part (other conductive part), 53...third conductive part (conductive part), 50z...end face through hole, 100,200,300...electron tube unit.

Claims

1. An electron tube, a first substrate to which the electron tube is electrically connected; a second substrate on which at least a part of the boost circuit is provided, the first substrate and the second substrate are disposed so as to be spaced apart and at least partially overlap each other via one or more third substrates; the third substrate includes a conductive portion that transmits power supplied from the boost circuit to the electron tube;

2. The electron tube unit according to claim 1 , wherein the third substrate extends along an edge of at least one of the first substrate and the second substrate.

3. The electron tube unit according to claim 2 , wherein the third substrate is formed in an L-shape when viewed in a thickness direction.

4. The conductive portion is an end face through hole formed so as to be exposed on a side surface of the third substrate; 2. The electron tube unit according to claim 1, further comprising: a conductive member disposed in the end face through hole.

5. The electron tube unit according to claim 4 , wherein the conductive portion connects the first substrate, the second substrate, and the third substrate.

6. The electron tube unit according to claim 1 , further comprising a fastening member that connects the first substrate, the second substrate, and the third substrate.

7. The electron tube unit according to claim 6 , wherein the fastening members are provided so as to penetrate through edge portions of the first substrate and the second substrate.

8. 2. The electron tube unit according to claim 1, wherein the third substrate has an asymmetric shape when viewed in a thickness direction.

9. the third substrate includes a first linear portion extending along a first direction as viewed in a thickness direction, and a second linear portion extending along a second direction that is continuous with the first linear portion and intersects with the first direction as viewed in the thickness direction, The electron tube unit according to claim 8 , wherein a corner of an end of either the first straight portion or the second straight portion is chamfered.

10. The electron tube unit according to claim 1 , wherein the first substrate, the second substrate, and the third substrate are made of the same material.

11. 2. The electron tube unit according to claim 1, wherein the electron tube is a flash lamp.

12. The electron tube unit according to claim 1 , wherein the third substrate includes another conductive portion that supplies a reference potential to the electron tube.

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