Three dimensional loop type heat exchanger

The three-dimensional loop heat exchanger addresses flow direction issues by connecting heat pipes to the vapor chamber top cover with through-holes and support structures, ensuring stable fluid flow and efficient operation.

JP2026019646AActive Publication Date: 2026-02-05NIDEC CHAUN-CHOUNG TECH CORP
View PDF 7 Cites 0 Cited by

Patent Information

Application Number
JP2024121356
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-26
Publication Date
2026-02-05
Estimated Expiration
2044-07-26

AI Technical Summary

Technical Problem

Conventional three-dimensional radiators or heat exchangers face difficulties in manufacturing loop-type heat exchange devices due to the connection of heat pipe ports with the lower plate of the vapor chamber, hindering the flow of evaporated vapor or working fluid.

Method used

A three-dimensional loop heat exchanger design that connects heat pipes to the top cover of the vapor chamber, featuring large through-holes and support structures to guide the flow direction, using capillary materials to facilitate the flow of vaporized working fluid.

Benefits of technology

Enables stable installation and directional flow of working fluid, ensuring effective operation of the loop heat exchanger by integrating a support structure to restrict and guide the flow, enhancing manufacturing efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2026019646000001_ABST
    Figure 2026019646000001_ABST
Patent Text Reader

Abstract

To provide a three dimensional loop type heat exchanger.SOLUTION: The vapor chamber 1 includes a bottom plate 10 and a cover 11, the loop heat pipe 2 is disposed on the cover 11 and has a curved portion and a first end portion 21 and a second end portion 22 respectively extending from two ends of the curved portion, the first end portion 21 extends into the first through hole 110 and has a first abutting edge overlapping an inner surface of the cover 11, and the second end portion 22 extends into the second through hole 111 and has a second abutting edge overlapping the inner surface of the cover. The vapor chamber 1 is further provided with at least one first supporting structure 12 corresponding to a lower portion of the first engaging edge, and at least one second supporting structure 13 corresponding to the second engaging edge and covering a lower portion of the opening of the second end portion 22, and the second supporting structure 13 is made of a capillary material.SELECTED DRAWING: Figure 2
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present invention relates to a heat exchanger, and more particularly to a three-dimensional loop-type heat exchanger. [Background technology]

[0002] Conventional three-dimensional radiators or heat exchangers are primarily constructed by connecting multiple heat pipes via a vapor chamber. To stabilize the connection between the vapor chamber and the heat pipes, holes are typically drilled into the heat pipe ports, which are then welded and bonded to the bottom plate of the vapor chamber, increasing the number of connection points. The holes also allow for the creation of a vacuum chamber within the vapor chamber and heat pipe, achieving a thermal conduction effect through a joint gas-liquid phase transition between the two vacuum chambers. Summary of the Invention [Problem to be solved by the invention]

[0003] However, in the above-mentioned conventional technology, when controlling the flow direction of the internal gas-liquid phase transition, the ports of the heat pipes of conventional three-dimensional radiators or heat exchangers are often connected to the lower plate of the vapor chamber, making it difficult for the evaporated vapor or working fluid to flow through the heat pipe, which makes it difficult to manufacture a loop-type heat exchange device.

[0004] Therefore, the present inventors believed that the above drawbacks could be improved, and as a result of extensive research, they came up with the proposal of the present invention, which effectively improves the above problems through rational design.

[0005] The present invention was developed in consideration of the above-mentioned problems through extensive research by the inventor, and its purpose is to provide a three-dimensional loop heat exchanger. In other words, by connecting a heat pipe to the top cover of the vapor chamber, the heat pipe port has a large through-hole for the vaporized vapor or working fluid to enter, and by combining a support structure to support the heat pipe and restrict the flow direction, the purpose of the loop heat exchanger is achieved. [Means for solving the problem]

[0006] To achieve the above object, one embodiment of the present invention provides a three-dimensional loop heat exchanger including a vapor chamber and at least one loop heat pipe. The vapor chamber includes a bottom plate and a cover, and the cover covers the bottom plate to form an accommodation space therebetween. The cover further includes at least one first through-hole and at least one second through-hole. The loop heat pipe is mounted on the cover and has a curved portion and first and second ends extending from both ends of the curved portion, respectively. The first end has a first joining edge that penetrates into the first through-hole and overlaps the inner surface of the cover, and the second end has a second joining edge that penetrates into the second through-hole and overlaps the inner surface of the cover. At least one first support structure corresponding to a lower portion of the first joining edge and at least one second support structure corresponding to the second joining edge and blocking a lower portion of the port at the second end are further mounted within the vapor chamber. The second support structure is made of a capillary material.

[0007] Other features of the present invention will become apparent from the description of this specification and the accompanying drawings. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic assembly diagram showing a three-dimensional loop heat exchanger according to an embodiment of the present invention; [Figure 2] 1 is a schematic exploded view showing a three-dimensional loop heat exchanger according to an embodiment of the present invention; [Figure 3] 1 is a schematic plan view of a three-dimensional loop heat exchanger according to an embodiment of the present invention; [Figure 4] FIG. 1 is a first schematic diagram showing the process steps of the loop heat pipe and cover of a three-dimensional loop heat exchanger according to an embodiment of the present invention. [Figure 5] FIG. 2 is a second schematic diagram showing the process steps of the loop heat pipe and cover of the three-dimensional loop heat exchanger according to one embodiment of the present invention. [Figure 6] FIG. 2 is a partial schematic cross-sectional view showing a first support structure of the present invention. [Figure 7] FIG. 4 is a partial schematic cross-sectional view showing a second support structure of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following describes in detail the embodiments of the present invention, but the present invention is not limited to these, and various modifications are possible within the scope of the description. Embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the present invention.

[0010] Fig. 1 is a schematic assembly diagram of a three-dimensional loop heat exchanger according to an embodiment of the present invention. Fig. 2 is a schematic exploded view of a three-dimensional loop heat exchanger according to an embodiment of the present invention. Fig. 3 is a schematic plan view of a three-dimensional loop heat exchanger according to an embodiment of the present invention.

[0011] The three-dimensional loop heat exchanger according to the present invention comprises a vapor chamber 1 and at least one loop heat pipe 2 installed on the vapor chamber 1. The configuration of each component will be described below.

[0012] The vapor chamber 1 includes a bottom plate 10 and a cover 11, and the cover 11 covers the bottom plate 10, forming a sealed storage space 100 between the cover 11 and the bottom plate 10, with a capillary layer 101 (FIG. 6) provided within the storage space 100. The cover 11 is further provided with at least one first through-hole 110 and at least one second through-hole 111, the first through-hole 110 having a first flange 110a protruding outward, and the second through-hole 111 having a second flange 111a protruding outward, to which the loop heat pipe 2 is connected.

[0013] The loop heat pipe 2 is curved into an inverted U shape and is installed in the cover 11 of the vapor chamber 1. It has a curved portion 20 and a first end 21 and a second end 22 extending from both ends of the curved portion 20. A capillary structure (not shown), such as sintered powder, a woven mesh, or a groove, is installed in the loop heat pipe 2. The first end 21 penetrates into the first through-hole 110 of the cover 11, and the second end 22 penetrates into the second through-hole 111 of the cover 11, with the curved portion 20 protruding from the cover 11 of the vapor chamber 1.

[0014] As shown in Figure 4, when the first end 21 and second end 22 of the loop heat pipe 2 are inserted into the first through-hole 110 and second through-hole 111 of the cover 11, a first expansion port 210a is first formed at the first end 21, and a second expansion port 220a is then formed at the second end 22. The first expansion port 210a and second expansion port 220a are both horn-shaped. Using a punch press or a press, pressure is applied to the first expansion port 210a and second expansion port 220a toward the inner surface of the cover 11 (see the arrows in Figure 4). This presses the first expansion port 210a flat to form the first joining edge 210, and the second expansion port 220a flat to form the second joining edge 220. These are then placed on the inner surface of the cover 11.

[0015] 5 , a welding process without welding material, such as laser welding or diffusion bonding, is then performed on the inner surfaces of the first and second joining edges 210 and 220 facing the cover 11, thereby joining the first and second joining edges 210 and 220 to the inner surface of the cover 11 by laser welding or diffusion bonding, respectively, and welding the loop heat pipe 2 to the first through-hole 110 and the second through-hole 111 without leaving welding marks that may affect the appearance on the outer surface of the cover 11. In addition, the gap between the first end 21 and the first flange 110a of the loop heat pipe 2 or the gap between the second end 22 and the second flange 111a may be further sealed by welding with welding material, etc.

[0016] 1 and 2, at least one first support structure 12 corresponding to the lower portion of the first joining edge 210 and at least one second support structure 13 corresponding to the second joining edge 220 and blocking the lower portion of the port at the second end 22 are further installed in the vapor chamber 1, and at least the second support structure 13 is made of a capillary material. As shown in FIG. 6, a plurality of first support structures 12 are arranged to wrap around the lower portion of each first joining edge 210, and the opening of the first end 21 communicates with the accommodating space 100, allowing the vaporized working fluid in the vapor chamber 1 to enter the loop heat pipe 2 from the first end 21. The working fluid, which has returned to a liquid after being cooled and condensed in the curved portion 20, flows into the accommodating space 100 from the second end 22 due to capillary action occurring in the second support structure 13 (see FIG. 7). In addition, the second support structure 13 blocks the lower part of the port at the second end 22, thereby providing resistance to the vaporized working fluid in the accommodating space 100, causing the vaporized working fluid to flow toward the first end 21, and the second support structure 13 circulates the vaporized working fluid back into liquid working fluid, which then flows into the accommodating space 100. Furthermore, referring to Figures 2, 6 and 7, the exterior of the first support structure 12 is covered with a capillary circle 120, and a plurality of support pillars 130 are arranged around the exterior of the second support structure 13, and the support pillars 130 are solid.

[0017] By configuring the above structure, the three-dimensional loop heat exchange device according to the present invention is obtained.

[0018] Therefore, the three-dimensional loop heat exchanger of the present invention allows the working fluid installed in the vapor chamber 1 and the loop heat pipe 2 to flow in a certain direction, forming a loop heat exchanger and enabling the loop heat pipe 2 to be firmly installed in the vapor chamber 1.

[0019] Although the embodiment of the present invention has been described above in detail with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like are also included within the scope that does not deviate from the gist of the present invention. [Explanation of symbols]

[0020] 1 Vapor Chamber 10 Bottom plate 100 storage spaces 101 Capillary Layer 11 Cover 110 First through hole 110a First flange 111 Second through hole 111a Second flange 12 First support structure 120 Capillary Circle 13 Second support structure 130 Support column 2 Loop Heat Pipe 20 curved part 21 First end 210 First joining edge 210a 1st Expansion Port 22 Second end 220 Second Joint Edge 220a Second Expansion Port

Claims

1. a vapor chamber including a bottom plate and a cover, the cover covering the bottom plate to form an accommodation space therebetween, and the cover having at least one first through hole and at least one second through hole; at least one loop heat pipe installed in the cover, the loop heat pipe having a curved portion and a first end and a second end extending from both ends of the curved portion, the first end having a first joining edge that penetrates into the first through-hole and overlaps the inner surface of the cover, and the second end having a second joining edge that penetrates into the second through-hole and overlaps the inner surface of the cover; A three-dimensional loop-type heat exchange device characterized in that at least one first support structure corresponding to the underside of the first joint edge and at least one second support structure corresponding to the second joint edge and blocking the underside of the port at the second end are further installed within the vapor chamber, and the second support structure is made of capillary material.

2. 2. The three-dimensional loop heat exchange device according to claim 1, wherein the loop heat pipe is curved to present an inverted U-shape.

3. 2. The three-dimensional loop heat exchange device according to claim 1, wherein the inner surfaces of the first and second joining edges facing the cover are welded together without a welding material.

4. The three-dimensional loop heat exchanger according to claim 3, wherein the welding without welding material refers to laser welding or diffusion bonding.

5. A three-dimensional loop-type heat exchanger device as described in any one of claims 1 to 4, characterized in that the first through hole is provided with a first flange protruding outward, and the second through hole is provided with a second flange protruding outward.

6. 6. The three-dimensional loop heat exchanger according to claim 5, wherein the gap between the first end and the first flange or the gap between the second end and the second flange is sealed by welding with a welding material.

7. The three-dimensional loop heat exchange device according to claim 1 , wherein a plurality of the first support structures are arranged so as to wrap around the lower part of the first joining edge.

8. 10. The three-dimensional loop heat exchange device according to claim 1 or 7, wherein the exterior of the first support structure is covered with a capillary circle.

9. 2. The three-dimensional loop heat exchanger according to claim 1, wherein a plurality of support columns are provided around the exterior of the second support structure.

10. 10. The three-dimensional loop heat exchanger according to claim 9, wherein the support columns are solid.

Citation Information

Patent Citations

  • Heat dissipation element combination structure

    CN111076583A

  • Production method of high-power efficient heat exchange transpiration loop module

    CN116399148A

  • Vapor chamber and heat pipe combination structure

    CN218270325U

  • Heat plate with capillary supporting structure and manufacturing method thereof

    US20090260785A1

  • Three-dimensional heat dissipating device

    US20220018609A1