Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of preventing transfer of particles between substrates during processing.SOLUTION: The substrate processing device 1000 includes a first substrate processing part 100n and a transfer mechanism 400. The first substrate processing part 100n processes the substrates W one by one by immersing the substrates W in a vertical attitude in the first processing liquid. The transport mechanism 400 receives the substrate W in a horizontal attitude, changes the attitude of the substrate W from a horizontal attitude to a vertical attitude, and carries the substrate W in a vertical attitude into the first substrate processing part 100n. The first substrate processing unit 100n includes a processing tank 103 and a substrate arrangement mechanism 141. The processing tank 103 has a capacity corresponding to one substrate W. In the processing tank 103, only one substrate W in a vertical posture is disposed, and a first processing liquid is stored. The substrate disposing mechanism 141 receives the substrate W from the transport mechanism 400, and disposes only one substrate W in a vertical posture in the first processing liquid.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] The substrate processing apparatus described in Patent Document 1 includes a processing unit, a processing tank, and a transport device. The processing unit processes one substrate. The processing tank can accommodate multiple substrates simultaneously. The processing tank stores a processing liquid in which the substrates are immersed for processing. The transport device can simultaneously transport a number of substrates less than the number of substrates that the processing tank can accommodate. The transport device can receive substrates from the processing tank and the processing unit. The transport device can also deliver substrates to the processing tank and the processing unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-218906 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the substrate processing apparatus described in Patent Document 1, the processing tank processes a plurality of substrates simultaneously, and therefore, particle transfer may occur between the substrates being processed in the processing tank.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus that can prevent the transfer of particles between substrates being processed. [Means for solving the problem]

[0006] According to one aspect of the present invention, a substrate processing apparatus includes a first substrate processing unit and a transport mechanism. The first substrate processing unit processes substrates one by one in a vertical position by immersing the substrates in a first processing liquid. The transport mechanism receives the substrates in a horizontal position, changes the position of the substrate from the horizontal position to the vertical position, and loads the substrates in the vertical position into the first substrate processing unit. The first substrate processing unit includes a processing tank and a substrate placement mechanism. The processing tank has a capacity corresponding to one substrate. The processing tank places only one substrate in the vertical position and stores the first processing liquid. The substrate placement mechanism receives the substrate from the transport mechanism and places only one substrate in the vertical position in the first processing liquid.

[0007] In one aspect of the present invention, the first substrate processing unit preferably further includes a chamber and a drying unit. The chamber accommodates the processing bath. The drying unit preferably dries the substrate within the chamber after it is removed from the processing bath.

[0008] In one aspect of the present invention, the substrate processing apparatus preferably includes a plurality of the first substrate processing units. The plurality of first substrate processing units are preferably arranged side by side along a first direction that is substantially parallel to a horizontal direction. The transport mechanism preferably transports the substrate in the vertical position into each of the plurality of first substrate processing units by moving along a transport path that extends along the first direction.

[0009] In one aspect of the present invention, the substrate processing apparatus preferably further includes a plurality of second substrate processing units. The plurality of second substrate processing units are preferably arranged side by side along the first direction. Each of the plurality of second substrate processing units preferably processes the substrate one by one by discharging a second processing liquid onto the substrate in the horizontal position while rotating. The transport mechanism preferably moves along the transport path to load the substrate in the horizontal position to be processed by the second substrate processing unit into each of the plurality of second substrate processing units. The plurality of first substrate processing units are preferably arranged on one side of the transport path in the second direction. The plurality of second substrate processing units are preferably arranged on the other side of the transport path in the second direction. The second direction is preferably approximately perpendicular to the first direction.

[0010] In one aspect of the present invention, the substrate processing apparatus preferably further includes a control device. The control device preferably controls the transport mechanism, the first substrate processing unit, and the second substrate processing unit. The control device preferably causes the transport mechanism to transport the substrate, thereby causing one or more of the first substrate processing units and one or more of the second substrate processing units to perform a plurality of processes in a predetermined order in sequence.

[0011] In one aspect of the present invention, the substrate processing apparatus preferably further includes a second substrate processing unit and a control unit. The second substrate processing unit preferably processes the substrates one by one by discharging a second processing liquid onto the rotating substrate in a horizontal position. The control unit preferably controls the transport mechanism. The control unit preferably controls the transport mechanism to load the substrate for which a processing time exceeding a specified time has been set into the first substrate processing unit. The control unit preferably controls the transport mechanism to load the substrate for which a processing time equal to or shorter than the specified time has been set into the second substrate processing unit. [Effects of the Invention]

[0012] According to the present invention, it is possible to prevent the transfer of particles between substrates during processing. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention; [Figure 2] 2 is a schematic cross-sectional view showing a first substrate processing section of the substrate processing apparatus according to the present embodiment. FIG. [Figure 3] FIG. 4 is a side view showing a lifting section of the first substrate processing section according to the present embodiment. [Figure 4] FIG. 2 is a view showing a processing liquid supply unit of the substrate processing apparatus according to the embodiment. [Figure 5] FIG. 3 is a schematic cross-sectional view showing a second substrate processing section of the substrate processing apparatus according to the present embodiment. [Figure 6] (a) is a side view showing a state in which the transport mechanism of the substrate processing apparatus according to this embodiment holds a substrate in a horizontal position, and (b) is a plan view showing a state in which the transport mechanism holds a substrate in a horizontal position. [Figure 7] (a) is a side view showing the state in which the transport mechanism of the substrate processing apparatus according to this embodiment holds a substrate in a vertical position, and (b) is a plan view showing the state in which the transport mechanism holds a substrate in a vertical position. [Figure 8] FIG. 2 is a view showing a state in which a transport mechanism of the substrate processing apparatus according to the present embodiment is transferring a substrate to a first substrate processing section. [Figure 9] FIG. 10 is a view showing a state in which the transport mechanism of the substrate processing apparatus according to the present embodiment is transferring the substrate to a second substrate processing section. [Figure 10] FIG. 2 is a diagram showing the first stage (loading of a substrate) of an example of a substrate processing method using the substrate processing apparatus according to the present embodiment. [Figure 11] FIG. 10 is a diagram showing the middle stage (substrate immersion) of an example of a substrate processing method using the substrate processing apparatus according to the present embodiment. [Figure 12] FIG. 10 is a diagram showing the latter stage (unloading of the substrate) of the example of the substrate processing method by the substrate processing apparatus according to the present embodiment. [Figure 13] 10 is a flowchart showing the first stage of another example of a substrate processing method by the substrate processing apparatus of the present embodiment. [Figure 14] 10 is a flowchart showing the latter stage of another example of the substrate processing method performed by the substrate processing apparatus of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In addition, in the drawings, X-axis, Y-axis, and Z-axis are appropriately illustrated to facilitate understanding. The X-axis, Y-axis, and Z-axis are mutually orthogonal, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. In addition, "planar view" means viewing an object from vertically above.

[0015] First, a substrate processing apparatus 1000 will be described with reference to Fig. 1. Fig. 1 is a plan view showing the substrate processing apparatus 1000 according to an embodiment of the present invention. The substrate processing apparatus 1000 shown in Fig. 1 processes a substrate W with a processing liquid.

[0016] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The semiconductor wafer has, for example, a pattern for forming a three-dimensional flash memory (e.g., a three-dimensional NAND flash memory). In the following description, as an example, the substrate W is a semiconductor wafer.

[0017] The processing liquid is a chemical liquid or a rinse liquid. The chemical liquid includes a chemical liquid diluted with a diluent. The diluent is similar to the rinse liquid.

[0018] The chemical liquid is, for example, an etching liquid. Also, the chemical liquid is, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acid (e.g., citric acid, oxalic acid), organic alkali (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), surfactant, corrosion inhibitor, or hydrophobizing agent.

[0019] The rinse liquid is, for example, deionized water, carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm). The rinse liquid is a liquid for washing away chemical liquids, by-products of chemical processing, and / or foreign matter from the substrate W. The rinse process is a process for washing away chemical liquids, by-products of chemical processing, and / or foreign matter from the substrate W.

[0020] The substrate processing apparatus 1000 includes an indexer unit 1 , a processing unit 2 , a substrate placement unit 3 , and a control device 4 .

[0021] The indexer section 1 includes a transport section 11, an indexer robot 12, a plurality of containers 13, and a plurality of container placement tables .

[0022] The processing section 2 includes at least one first substrate processing section 100n and a transport mechanism 400. In the example of FIG. 1, the processing section 2 includes a plurality of first substrate processing sections 100n. In this specification, the "n" included in a reference symbol indicates an integer of 1 or more. In the example of FIG. 1, n=1 to 12. The plurality of first substrate processing sections 100n are arranged side by side along a first direction D1. The first direction D1 is approximately parallel to the horizontal direction.

[0023] Furthermore, the processing section 2 preferably includes at least one second substrate processing section 200k. In the example of Fig. 1, the processing section 2 includes a plurality of second substrate processing sections 200k. In this specification, the "k" included in the reference numeral denotes an integer of 1 or more. In the example of Fig. 1, k = 1 to 4. The plurality of second substrate processing sections 200k are arranged side by side along the first direction D1.

[0024] The processing section 2 has a transport path 300. A plurality of first substrate processing sections 100n are arranged on one side of the transport path 300 in the second direction D2. A plurality of second substrate processing sections 200k are arranged on the other side of the transport path 300 in the second direction D2. The second direction D2 is approximately perpendicular to the first direction D1. The second direction D2 is approximately parallel to the horizontal direction.

[0025] In the indexer unit 1, the container mounting table 14 is connected to the transport unit 11. A container 13 is placed on the container mounting table 14. The container 13 stores a plurality of substrates W in a horizontal position.

[0026] In this specification, the horizontal position of the substrate W refers to a state in which the substrate W is approximately parallel to the horizontal direction. The horizontal position of the substrate W does not necessarily mean that the substrate W is strictly horizontal in the horizontal direction.

[0027] An indexer robot 12 is disposed in the transfer section 11. The indexer robot 12 transfers a substrate W in a horizontal position from a container 13 to the substrate platform 3. The indexer robot 12 also transfers a substrate W in a horizontal position from the substrate platform 3 to the container 13.

[0028] The substrate mounting part 3 includes a mounting table on which the substrate W is placed in a horizontal position. The substrate mounting part 3 is disposed between the transport part 11 and the transport path 300. The substrate mounting part 3 is provided for transferring the substrate W between the indexer robot 12 and the transport mechanism 400.

[0029] In the processing section 2, the first substrate processing section 100n processes the substrates W one by one by immersing the substrates W in a vertical position in a first processing liquid. The first processing liquid is an example of the processing liquid described above. Each of the plurality of first substrate processing sections 100n includes a first chamber CH1n, a processing bath 103, and a substrate positioning mechanism 141. The substrate positioning mechanism 141 includes a substrate holder 143, a support 149, and an elevator 155. These will be described in detail below.

[0030] The first chamber CH1n corresponds to an example of the "chamber" of the present invention.

[0031] In this specification, the vertical position of the substrate W refers to a state in which the substrate W is approximately parallel to the vertical direction. The vertical position of the substrate W does not necessarily mean that the substrate W is strictly parallel to the vertical direction.

[0032] The second substrate processing unit 200k processes the substrates W one by one by discharging a second processing liquid onto the substrates W in a horizontal position while rotating. Each of the second substrate processing units 200k includes a second chamber CH2k. The second processing liquid is an example of the processing liquid described above.

[0033] The transport path 300 is disposed between an area where a plurality of first substrate processing units 100n are disposed and an area where a plurality of second substrate processing units 200k are disposed. A transport mechanism 400 is disposed on the transport path 300. The transport path 300 extends along a first direction D1.

[0034] The transport mechanism 400 receives the substrate W in a horizontal position from the substrate platform 3, changes the position of the substrate W from the horizontal position to a vertical position, and loads the substrate W in the vertical position into the first substrate processing unit 100n.

[0035] The transport mechanism 400 unloads the substrate W in a vertical position from the first substrate processing unit 100n, changes the position of the substrate W from the vertical position to a horizontal position, and transports the substrate W in the horizontal position to the substrate platform 3.

[0036] The transport mechanism 400 receives the substrate W in a horizontal position from the substrate platform 3, and loads the substrate W in a horizontal position into the second substrate processing unit 200k.

[0037] The transport mechanism 400 unloads the substrate W in a horizontal position from the second substrate processing unit 200k and transports the substrate W in a horizontal position to the substrate platform 3.

[0038] The transport mechanism 400 unloads the substrate W in a vertical position from the first substrate processing unit 100n, changes the position of the substrate W from the vertical position to a horizontal position, and loads the substrate W in the horizontal position into the second substrate processing unit 200k.

[0039] The transport mechanism 400 unloads the substrate W in a horizontal position from the second substrate processing unit 200k, changes the position of the substrate W from the horizontal position to a vertical position, and loads the substrate W in the vertical position into the first substrate processing unit 100n.

[0040] The transport mechanism 400 moves in a first direction D1 on the transport path 300. By moving along the transport path 300, the transport mechanism 400 loads a vertically oriented substrate W to be processed by the first substrate processing unit 100n into each of the plurality of first substrate processing units 100n. Therefore, according to this embodiment, the transport mechanism 400 can quickly transport a substrate W from one first substrate processing unit 100n to another first substrate processing unit 100n by moving along the transport path 300 in the first direction D1 from one first substrate processing unit 100n to another first substrate processing unit 100n. As a result, adhesion of particles to the substrate W can be suppressed.

[0041] Furthermore, the transport mechanism 400 moves along the transport path 300 to load horizontally oriented substrates W to be processed by the second substrate processing units 200k into each of the plurality of second substrate processing units 200k. Therefore, according to this embodiment, the transport mechanism 400 moves along the transport path 300 in the first direction D1 from one second substrate processing unit 200k to another second substrate processing unit 200k, thereby enabling the substrates W to be quickly transported from one second substrate processing unit 200k to another second substrate processing unit 200k. As a result, adhesion of particles to the substrates W can be suppressed.

[0042] The posture of the substrate W while being transported along the transport path 300 is not particularly limited.

[0043] The control device 4 controls the indexer robot 12, the first substrate processing unit 100n, the second substrate processing unit 200k, and the transport mechanism 400. The control device 4 is, for example, a computer. Specifically, the control device 4 includes a processor such as a CPU (Central Processing Unit). The control device 4 also includes a storage device. The storage device stores data and computer programs. The storage device includes a main storage device such as a semiconductor memory, and an auxiliary storage device such as a semiconductor memory and a hard disk drive. The processor of the control device 4 executes the computer program stored in the storage device of the control device 4 to control the indexer robot 12, the first substrate processing unit 100n, the second substrate processing unit 200k, and the transport mechanism 400.

[0044] As described above with reference to FIG. 1 , according to this embodiment, the plurality of first substrate processing units 100n are arranged on one side of the transport path 300 in the second direction D2. The plurality of second substrate processing units 200k are arranged on the other side of the transport path 300 in the second direction D2. Therefore, the transport mechanism 400 arranged on the transport path 300 can quickly transport the substrate W from the first substrate processing unit 100n to the second substrate processing unit 200k. Similarly, the transport mechanism 400 can quickly transport the substrate W from the second substrate processing unit 200k to the first substrate processing unit 100n. Therefore, adhesion of particles to the substrate W can be suppressed.

[0045] Next, the first substrate processing unit 100n will be described in detail with reference to FIG. 2. FIG. 2 is a schematic cross-sectional view showing the first substrate processing unit 100n. As shown in FIG. 2, the first substrate processing unit 100n includes a first chamber CH1n, a processing tank 103, a processing liquid supply unit 105, a drainage unit 125, and a substrate positioning mechanism 141. The first substrate processing unit 100n preferably further includes a drying unit 115. The first substrate processing unit 100n may also include a pressure reduction unit 131. The substrate processing apparatus 1000 also includes at least one processing liquid supply unit 5m. In the example of FIG. 2, the substrate processing apparatus 1000 includes multiple processing liquid supply units 5m. In this specification, the letter "m" included in the reference symbol represents an integer equal to or greater than 0. In the example of FIG. 2, m=0, 1, or the like.

[0046] The processing liquid supply unit 105 includes at least one valve 107m, at least one nozzle 111, and a pipe 113. In the example of FIG.

[0047] The drying section 115 includes a valve 117, a valve 119, at least one nozzle 121, and a pipe 123. In the example of FIG.

[0048] The drainage unit 125 includes a valve 127 and a pipe 129. The pressure reduction unit 131 includes an exhaust unit 133 and a pipe 135.

[0049] Substrate placement mechanism 141 includes a substrate holding unit 143, a support unit 149, and an elevation unit 155. Substrate holding unit 143 includes a base unit 147 and a plurality of holding members 145. Support unit 149 includes a first support unit 151 and a second support unit 153.

[0050] The first chamber CH1n accommodates a processing bath 103, a substrate holder 143, and nozzles 111 and 121. The first chamber CH1n has, for example, a substantially box shape. The first chamber CH1n includes a cover 101. The cover 101 is disposed at an upper opening 102 of the first chamber CH1n. The cover 101 can be opened and closed.

[0051] The first chamber CH1n also includes a sidewall 110 that is substantially parallel to the vertical direction Dz, and a shutter 106. The sidewall 110 has an opening 108. The opening 108 extends in the vertical direction Dz. The opening 108 (opening edge) has a shape that corresponds to the substrate W in a vertical position. The shutter 106 moves along the vertical direction Dz to close or open the opening 108. That is, the shutter 106 closes or opens the opening 108. For example, the shutter 106 is driven by a drive unit (not shown). The drive unit includes, for example, a ball screw mechanism and a motor. The shutter 106 may open and close the opening 108 by moving in a first direction D1 (FIG. 1).

[0052] The processing tank 103 stores a first processing liquid LQ1m. When "m=0", the first processing liquid LQ10 is a rinse liquid. When "m>0", the first processing liquid LQ1m is a chemical liquid. In this case, different m's indicate different types of chemical liquids. The first processing liquid LQ11 is a chemical liquid.

[0053] Specifically, the processing tank 103 has a capacity corresponding to one substrate W. Only one substrate W in a vertical position is placed in the processing tank 103. Therefore, in the processing tank 103, only one substrate W is processed with the first processing liquid LQ1m. As a result, according to this embodiment, it is possible to suppress "particle transfer between substrates W during processing," which occurs when multiple substrates W are processed at the same time.

[0054] Furthermore, in this embodiment, the processing tank 103 has a capacity corresponding to one substrate W. Therefore, when the first processing liquid LQ1m is a chemical liquid, the dissolved oxygen concentration of the first processing liquid LQ1m can be easily reduced and the first processing liquid LQ1m can be easily maintained at a low dissolved oxygen concentration, compared to when the processing tank has a large capacity corresponding to the batch processing of multiple substrates W. Therefore, while improving the processing amount of substrates W with the first processing liquid LQ1m (e.g., the etching amount), variations in the processing amount can be suppressed.

[0055] The processing liquid supply unit 105 supplies the first processing liquid LQ1m to the processing tank 103. Specifically, in the processing liquid supply unit 105, a plurality of nozzles 111 are arranged inside the processing tank 103. The plurality of nozzles 111 are connected to a pipe 113. A valve 107m is arranged in the pipe 113. The pipe 113 is connected to the processing liquid supply unit 5m via the valve 107m. The processing liquid supply unit 5m supplies the first processing liquid LQ1m. Therefore, when the valve 107m is opened, the first processing liquid LQ1m is supplied to the plurality of nozzles 111 via the pipe 113. As a result, the plurality of nozzles 111 supply the first processing liquid LQ1m to the processing tank 103.

[0056] In this embodiment, when one of the multiple valves 107m is open, the other valves 107m are closed. Therefore, when the valve 1070 is open, the valve 1071 is closed, and the first processing liquid LQ10 (rinse liquid) from the processing liquid supply unit 50 is discharged from the nozzle 111 into the processing tank 103. On the other hand, when the valve 1071 is open, the valve 1070 is closed, and the first processing liquid LQ11 (chemical liquid) from the processing liquid supply unit 51 is discharged from the nozzle 111 into the processing tank 103.

[0057] The drying unit 115 supplies a fluid into the first chamber CH1n, thereby drying the substrate W, which has been lifted up from the processing bath 103, in the first chamber CH1n. The fluid is a gas or a liquid. Specifically, in the drying unit 115, a plurality of nozzles 121 are disposed inside the first chamber CH1n and outside the processing bath 103. The plurality of nozzles 121 are connected to a pipe 123. Valves 117 and 119 are disposed on the pipe 123. The pipe 123 is connected to an organic solvent supply source TKA via the valve 117. The pipe 123 is also connected to an inert gas supply source TKB via the valve 119.

[0058] Therefore, when valve 117 is opened and valve 119 is closed, organic solvent vapor is supplied from organic solvent supply source TKA to multiple nozzles 121 via pipe 123. As a result, multiple nozzles 121 supply organic solvent vapor into first chamber CH1n. In this specification, the organic solvent is water-soluble and has a lower surface tension than the rinse liquid. For example, the organic solvent is a low-carbon monohydric alcohol, ethylene glycol, or a lower ketone. The low-carbon monohydric alcohol is, for example, methanol, ethanol, or IPA (isopropyl alcohol). In this embodiment, the organic solvent is IPA.

[0059] On the other hand, when the valve 117 is closed and the valve 119 is opened, the inert gas is supplied from the inert gas supply source TKB to the plurality of nozzles 121 through the pipe 123. As a result, the plurality of nozzles 121 supplies the inert gas into the first chamber CH1n. In this specification, the inert gas is nitrogen or argon. In this embodiment, the inert gas is nitrogen.

[0060] 2, according to this embodiment, when the substrate W is immersed in the processing tank 103 with the first processing liquid LQ11 (chemical liquid) stored therein, the substrate W is processed by the first processing liquid LQ11. When the substrate W is immersed in the processing tank 103 with the first processing liquid LQ10 (rinse liquid) stored therein, the substrate W is cleaned by the first processing liquid LQ10. Furthermore, when the substrate W is pulled out of the processing tank 103, the drying unit 115 dries the substrate W.

[0061] Therefore, in this embodiment, in the first chamber CH1n accommodating the processing tank 103 for processing only one substrate W, not only can the substrate W be processed with the first processing liquid LQ1m, but also the substrate W can be dried. As a result, the transport mechanism 400 can immediately load the substrate W processed in the first substrate processing unit 100n into another first substrate processing unit 100n or the second substrate processing unit 200k. This improves the throughput of substrate W processing.

[0062] If the first substrate processing unit 100n does not have the drying unit 115, the substrates W must be dried outside the first substrate processing unit 100n, which may prevent improvement in the throughput of processing the substrates W. However, the inclusion of the drying unit 115 in the first substrate processing unit 100n is a preferred example, and the first substrate processing unit 100n does not necessarily have to have the drying unit 115 in the present invention.

[0063] 2, the drain unit 125 drains the first treatment liquid LQ1m from the treatment tank 103. Specifically, a pipe 129 of the drain unit 125 is connected to the bottom of the treatment tank 103. A valve 127 is disposed on the pipe 129. When the valve 127 is opened, the first treatment liquid LQ1m in the treatment tank 103 is drained through the pipe 129.

[0064] The pressure reducing unit 131 reduces the pressure inside the first chamber CH1n to below atmospheric pressure. Specifically, the exhaust unit 133 of the pressure reducing unit 131 is connected to the first chamber CH1n via piping 135. The exhaust unit 133 reduces the pressure inside the first chamber CH1n to below atmospheric pressure by exhausting gas inside the first chamber CH1n. The exhaust unit 133 includes, for example, an exhaust pump.

[0065] The substrate positioning mechanism 141 lowers the substrate W to immerse the substrate W in the first processing liquid LQ1m in the processing tank 103. Specifically, the substrate positioning mechanism 141 receives the substrate W in a vertical position from the transport mechanism 400 (FIG. 1) and places only one vertically oriented substrate W in the first processing liquid LQ1m in the processing tank 103. Alternatively, the substrate positioning mechanism 141 raises the substrate W to lift it out of the first processing liquid LQ1m in the processing tank 103.

[0066] That is, the substrate positioning mechanism 141 raises or lowers only one substrate W between an in-tank position and an out-tank position. The in-tank position indicates the position where the substrate holder 143 is placed in the processing tank 103. Therefore, when the first processing liquid LQ1m is stored in the processing tank 103, the in-tank position indicates the position where the substrate W is immersed in the first processing liquid LQ1m in the processing tank 103.

[0067] On the other hand, the extra-tank position indicates a position where the substrate holding part 143 is disposed outside the processing tank 103. In other words, the extra-tank position indicates a position where the substrate holding part 143 is disposed above the processing tank 103. Therefore, when the first processing liquid LQ1m is stored in the processing tank 103, the extra-tank position indicates a position where the substrate W is positioned above the processing tank 103 and is therefore not in contact with the first processing liquid LQ1m.

[0068] More specifically, in the substrate arrangement mechanism 141, the substrate holding unit 143 holds only one substrate W in a vertical position. The substrate holding unit 143 includes a base unit 147 and a plurality of holding members 145. The plurality of holding members 145 are fixed to the base unit 147. The plurality of holding members 145 hold only one substrate W in a vertical position. For example, the plurality of holding members 145 are protrusions protruding from the base unit 147 in the first direction D1 (FIG. 1). The plurality of holding members 145 are also arranged at intervals along the periphery of the substrate W, and support part of the periphery of the substrate W from below. Note that the configuration of the substrate holding unit 143 is not particularly limited as long as it is capable of holding only one substrate W in a vertical position.

[0069] Furthermore, the support portion 149 is connected to the substrate holding portion 143. The support portion 149 supports the substrate holding portion 143. In the support portion 149, the first support portion 151 extends in the vertical direction Dz. The first support portion 151 is, for example, a substantially columnar or substantially plate-shaped member. A lower end portion of the first support portion 151 is connected to the base portion 147. The second support portion 153 extends along the second direction D2. One end portion of the second support portion 153 in the second direction D2 is connected to an upper end portion of the first support portion 151. The other end portion of the second support portion 153 in the second direction D2 is connected to the lifting portion 155. The second support portion 153 is, for example, a substantially columnar or substantially plate-shaped member.

[0070] Furthermore, the lifting unit 155 raises or lowers the support 149, thereby raising or lowering the substrate holder 143 connected to the support 149. As a result, one substrate W held by the substrate holder 143 is raised or lowered. Specifically, the lifting unit 155 lowers the support 149, thereby lowering the substrate holder 143, and the one substrate W is immersed in the first processing liquid LQ1m in the processing bath 103. As a result, the substrate W is disposed at an in-tank position. Alternatively, the lifting unit 155 raises the support 149, thereby raising the substrate holder 143, and the one substrate W is lifted up from the first processing liquid LQ1m in the processing bath 103. As a result, the substrate W is disposed at an out-tank position.

[0071] Next, the lifting / lowering unit 155 will be described in detail with reference to FIG. 3. FIG. 3 is a side view showing the lifting / lowering unit 155. As shown in FIG. 3, the lifting / lowering unit 155 includes a ball screw mechanism 157 and a plurality of fixing members 175. The plurality of fixing members 175 fix the support unit 149 to the ball screw mechanism 157. Therefore, the ball screw mechanism 157 raises or lowers the support unit 149, thereby raising or lowering the substrate holding unit 143. Specifically, the plurality of fixing members 175 fix the other end of the second support unit 153 in the second direction D2 to the ball screw mechanism 157. Note that the fixing method is not particularly limited as long as the support unit 149 is fixed to the ball screw mechanism 157.

[0072] In detail, the ball screw mechanism 157 includes a base 159 , a plurality of guide rails 161 , a screw shaft 163 , a motor 165 , a first bearing 167 , a second bearing 169 , a nut 171 , and a slider 173 .

[0073] The rotating shaft of the motor 165 is connected to the screw shaft 163. The motor 165 rotates the screw shaft 163. The screw shaft 163 extends along the vertical direction Dz. The lower end of the screw shaft 163 is supported by a first bearing 167. The upper end of the screw shaft 163 is supported by a second bearing 169. The first bearing 167 and the second bearing 169 are fixed to the base 159. In addition, the screw shaft 163 is threadedly engaged with a nut 171 and passes through the nut 171.

[0074] The nut 171 is fixed to a slider 173. The slider 173 is connected to a plurality of guide rails 161 so as to be slidable along the vertical direction Dz. The plurality of guide rails 161 extend along the vertical direction Dz. The plurality of guide rails 161 are fixed to a base 159.

[0075] A plurality of fixing members 175 are fixed to the slider 173. The plurality of fixing members 175 fix the support portion 149 (specifically, the second support portion 153) to the slider 173.

[0076] When the motor 165 rotates, the screw shaft 163 rotates, and the slider 173 rises or falls along the plurality of guide rails 161. As a result, the support part 149 fixed to the slider 173 rises or falls. Therefore, the substrate holder 143 (FIG. 2) connected to the support part 149 rises or falls.

[0077] Next, the processing liquid supply unit 51 (FIG. 2) will be described in detail with reference to Fig. 4. Fig. 4 is a diagram showing the processing liquid supply unit 51. As shown in Fig. 4, the processing liquid supply unit 51 includes a processing liquid tank 181, a pump 183, a heater 185, a filter 187, a plurality of circulation valves 189, a circulation pipe 191, a chemical liquid supply unit 193, and a diluent supply unit 199.

[0078] An upstream end 191 a of the circulation pipe 191 is connected to the treatment liquid tank 181 , and a downstream end 191 b of the circulation pipe 191 is connected to the treatment liquid tank 181 .

[0079] The first processing liquid LQ11 (chemical liquid) in the processing liquid tank 181 is circulated by the processing liquid tank 181 and the circulation pipe 191. The circulation pipe 191 supplies the first processing liquid LQ11 to multiple processing tanks 103 in common. Pipes 113 provided corresponding to the processing tanks 103 are branched off and connected to the circulation pipe 191, so that the first processing liquid LQ11 flowing through the circulation pipe 191 is supplied to the processing tanks 103 via the pipe 113.

[0080] Specifically, as an example, a predetermined number of processing tanks 103 constitute a processing tank group 104. In the example of Fig. 4, the processing tank group 104 is constituted by three processing tanks 103. The substrate processing apparatus 1000 shown in Fig. 1 has 12 processing tanks 103, and therefore has four processing tank groups 104. The circulation pipe 191 supplies the first processing liquid LQ11 to the four processing tank groups 104.

[0081] More specifically, the circulation pipe 191 includes a common pipe 192 extending downstream from the treatment liquid tank 181, and a plurality of individual pipes 194 branching off from the common pipe 192. The plurality of individual pipes 194 branch off from the common pipe 192 at branch positions 196. An upstream end 191a of the common pipe 192 is connected to the treatment liquid tank 181. A downstream end 191b of each individual pipe 194 is connected to the treatment liquid tank 181.

[0082] The multiple individual pipes 194 correspond to the multiple treatment tank groups 104, respectively. Fig. 4 shows one entire individual pipe 194 and parts of the remaining three individual pipes 194. One individual pipe 194 supplies the first treatment liquid LQ11 to each treatment tank 103 in one treatment tank group 104, and the remaining three individual pipes 194 supply the first treatment liquid LQ11 to each treatment tank 103 in the remaining three treatment tank groups 104.

[0083] A circulation valve 189 is disposed in each individual pipe 194. When the circulation valve 189 is opened, the first processing liquid LQ11 circulates through the individual pipes 194. Then, the first processing liquid LQ11 is supplied to each processing tank 103 in the processing tank group 104 through a plurality of pipes 113 branching off from the individual pipes 194.

[0084] The pump 183 sends the first processing liquid LQ11 in the processing liquid tank 181 to the circulation pipe 191. The heater 185 heats the first processing liquid LQ11 flowing through the circulation pipe 191, thereby adjusting the temperature of the first processing liquid LQ11 in the processing liquid tank 181. The filter 187 captures particles contained in the first processing liquid LQ11 flowing through the circulation pipe 191. The pump 183, heater 185, and filter 187 are arranged in this order from upstream to downstream in the circulation pipe 191 (specifically, the common pipe 192).

[0085] Furthermore, the chemical liquid supply unit 193 supplies the chemical liquid to the processing liquid tank 181. The chemical liquid supply unit 193 includes a valve 195 and a pipe 197. When the valve 195 is opened, the chemical liquid is supplied from the pipe 197 to the processing liquid tank 181. The diluent supply unit 199 supplies the diluent to the processing liquid tank 181. The diluent supply unit 199 includes a valve 201 and a pipe 203. When the valve 201 is opened, the diluent is supplied from the pipe 203 to the processing liquid tank 181. As an example, the first processing liquid LQ11 is formed by diluting the chemical liquid with the diluent.

[0086] Next, the second substrate processing unit 200k will be described in detail with reference to FIG. 5. FIG. 5 is a schematic cross-sectional view showing the second substrate processing unit 200k. As shown in FIG. 5, the second substrate processing unit 200k includes a second chamber CH2k, a spin chuck 213, a spin motor 215, at least one processing liquid supply unit Aq, a nozzle movement unit 219, and multiple guards 221. In the example of FIG. 5, the second substrate processing unit 200k includes multiple processing liquid supply units Aq. In this specification, the letter "q" included in the reference symbol indicates an integer equal to or greater than 0. In the example of FIG. 5, q=0, 1.

[0087] The processing liquid supply unit A0 includes a nozzle 223, a valve 233, and a pipe 235. The processing liquid supply unit A1 includes a nozzle 217, a valve 227, and a pipe 229.

[0088] The second chamber CH2k has a substantially box shape and accommodates a spin chuck 213, a spin motor 215, nozzles 217 and 223, a nozzle moving part 219, and a plurality of guards 221. Valves 227 and 233 may also be accommodated in the second chamber CH2k.

[0089] The spin chuck 213 holds the substrate W. Specifically, the spin motor 215 rotates the spin chuck 213 about a rotation axis AX1. Therefore, the spin chuck 213 rotates the substrate W about the rotation axis AX1 while holding the substrate W horizontally. Specifically, the spin chuck 213 includes a plurality of chuck members 216 and a spin base 214. The spin base 214 is substantially disk-shaped and supports the plurality of chuck members 216 in a horizontal position. The plurality of chuck members 216 hold the substrate W in a horizontal position. The spin chuck 213 may be, for example, a vacuum chuck or a Bernoulli chuck that utilizes the Bernoulli effect, and is not particularly limited.

[0090] The processing liquid supply unit Aq supplies a second processing liquid LQ2q to the substrate W. When "q=0", the second processing liquid LQ20 is a rinse liquid. When "q>0", the second processing liquid LQ2q is a chemical liquid. In this case, different qs indicate different types of chemical liquids. The second processing liquid LQ21 is a chemical liquid.

[0091] Specifically, the processing liquid supply unit A1 supplies a second processing liquid LQ21 (chemical liquid) to the substrate W. In the processing liquid supply unit A1, the nozzle 217 discharges the second processing liquid LQ21 onto the substrate W. The nozzle movement unit 219 raises and lowers the nozzle 217 and rotates the nozzle 217 horizontally about the rotation axis AX2. In order to raise and lower the nozzle 217, the nozzle movement unit 219 includes, for example, a ball screw mechanism and a motor that provides a driving force to the ball screw mechanism. The nozzle movement unit 219 also includes, for example, a motor to rotate the nozzle 217 horizontally.

[0092] More specifically, the pipe 229 is connected to the nozzle 217. A valve 227 is arranged in the pipe 229. The valve 227 opens and closes the flow path of the pipe 229, switching between supplying and stopping the supply of the second processing liquid LQ21 to the nozzle 217. When the valve 227 opens the flow path of the pipe 229, the nozzle 217 discharges the second processing liquid LQ21 onto the substrate W.

[0093] Furthermore, the processing liquid supply unit A0 supplies a second processing liquid LQ20 (rinse liquid) to the substrate W. In the processing liquid supply unit A0, the nozzle 223 ejects the second processing liquid LQ20 onto the substrate W. More specifically, a pipe 235 is connected to the nozzle 223. A valve 233 is arranged on the pipe 235. The valve 233 opens and closes the flow path of the pipe 235, switching between supplying and stopping the supply of the second processing liquid LQ20 to the nozzle 223. When the valve 233 opens the flow path of the pipe 235, the nozzle 223 ejects the second processing liquid LQ20 onto the substrate W.

[0094] Each guard 221 has a generally cylindrical shape. Each guard 221 receives the second processing liquid LQ2q discharged from the substrate W.

[0095] In the present embodiment described above with reference to FIGS. 1 to 5, preferably, when a relatively long period of chemical processing is required, the substrate W is processed in the processing tank 103 of the first substrate processing unit 100n. This reduces the amount of chemical consumed compared to when the substrate W is processed with the chemical while being rotated in the second substrate processing unit 200k. The reason for this reduction in chemical consumption is that the first substrate processing unit 100n stores the chemical (first processing liquid LQ1m) in the processing tank 103 to process the substrate W, and therefore does not require the continuous discharge of the chemical (second processing liquid LQ2q) as in the second substrate processing unit 200k. The continuous discharge of the chemical refers to the continuous discharge of the chemical from the nozzle 217 of the second substrate processing unit 200k.

[0096] Preferably, when performing chemical processing for a relatively short time or performing fine processing using a chemical liquid, the second substrate processing unit 200k processes the substrate W while discharging the chemical liquid (second processing liquid LQ2q) from the nozzle 217. This is because a relatively short chemical processing time consumes less chemical liquid. Furthermore, in the second substrate processing unit 200k, the substrate W is processed using the chemical liquid discharged from the nozzle 217, so processing of the substrate W using the chemical liquid containing particles can be prevented. Therefore, the influence of particles can be minimized, making this suitable for fine processing of the substrate W. Another reason why this is suitable for fine processing of the substrate W is that the flow rate at which the chemical liquid is discharged from the nozzle 217 can be adjusted.

[0097] In the first substrate processing unit 100n, substrates W are processed one by one, so particles are not transferred between substrates W during processing. However, because multiple substrates W are processed one by one in the same processing tank 103, there is a possibility that previous particles may remain in the chemical liquid (first processing liquid LQ1m) in the processing tank 103. However, even in this case, the number of remaining particles is significantly smaller than in a processing tank that processes multiple substrates W collectively. Therefore, in the first substrate processing unit 100n of this embodiment, the effects of particles can be significantly reduced.

[0098] As a result of the above, preferably, the controller 4 (FIG. 1) controls the transport mechanism 400 so as to load the substrate W, for which a processing time exceeding the specified time T has been set, into the first substrate processing unit 100n. The controller 4 then controls the first substrate processing unit 100n so as to treat the loaded substrate W with the first processing liquid LQ1m. As a result, the first substrate processing unit 100n processes the substrate W, for which a processing time exceeding the specified time T has been set, with the first processing liquid LQ1m. This makes it possible to reduce the amount of first processing liquid LQ1m consumed.

[0099] On the other hand, the controller 4 controls the transport mechanism 400 to load the substrate W, for which a processing time equal to or shorter than the specified time T, into the second substrate processing unit 200k. The controller 4 then controls the second substrate processing unit 200k to process the loaded substrate W with the second processing liquid LQ2q. As a result, the second substrate processing unit 200k processes the substrate W, for which a processing time equal to or shorter than the specified time T has been set, with the second processing liquid LQ2q. This makes it possible to perform fine processing while suppressing consumption of the second processing liquid LQ2q.

[0100] In this embodiment, the first substrate processing unit 100n and the second substrate processing unit 200k are configured to process one substrate W at a time. Therefore, compared to a substrate processing apparatus having a processing tank that processes multiple substrates W at once, the first substrate processing unit 100n and the second substrate processing unit 200k can be made smaller and the amount of chemical liquid consumed can be reduced.

[0101] Furthermore, the substrate processing apparatus 1000 according to this embodiment includes not only the second substrate processing unit 200k, which processes substrates W by discharging a chemical liquid from the nozzle 217, but also the first substrate processing unit 100n, which processes substrates W using a chemical liquid stored in the processing tank 103. Therefore, the chemical liquid discharge capacity of the processing liquid supply unit 5m and the processing liquid supply unit Aq can be reduced compared to when all substrate processing units in the substrate processing apparatus are configured using the second substrate processing unit 200k. As a result, the processing liquid supply unit 5m and the processing liquid supply unit Aq can be made smaller. Note that if all substrate processing units in the substrate processing apparatus are configured using the second substrate processing unit 200k, for example, when all second substrate processing units 200k are used simultaneously, the processing liquid supply unit 5m and the processing liquid supply unit Aq may be required to have a relatively large chemical liquid discharge capacity.

[0102] Next, the transport mechanism 400 will be described in detail with reference to Figures 6 and 7. Figure 6(a) is a side view showing a state in which the transport mechanism 400 holds a substrate W in a horizontal position, and Figure 6(b) is a plan view showing a state in which the transport mechanism 400 holds a substrate W in a horizontal position. Figure 7(a) is a side view showing a state in which the transport mechanism 400 holds a substrate W in a vertical position, and Figure 7(b) is a plan view showing a state in which the transport mechanism 400 holds a substrate W in a vertical position.

[0103] As shown in Figures 6(a) and 6(b), the transport mechanism 400 includes a hand unit 401, an arm unit 403, and a base unit 405. The hand unit 401 grips the substrate W. The arm unit 403 supports the hand unit 401. The arm unit 403 rotates the hand unit 401 about a rotation axis AX3. The rotation axis AX3 is approximately parallel to the horizontal direction. The base unit 405 supports the arm unit 403. The base unit 405 rotates the arm unit 403 about a rotation axis AX4. The rotation axis AX4 is approximately parallel to the vertical direction Dz. Therefore, when the arm unit 403 rotates about the rotation axis AX4, the hand unit 401 supported by the arm unit 403 rotates about the rotation axis AX4. In this case, the hand unit 401 rotates approximately horizontally. Furthermore, the base unit 405 raises or lowers the arm unit 403 along the vertical direction Dz. Therefore, when the arm unit 403 rises or lowers, the hand unit 401 supported by the arm unit 403 rises or lowers.

[0104] The arm unit 403 extends along the radial direction Da relative to the rotation axis AX4. The arm unit 403 expands and contracts along the radial direction Da. Therefore, the arm unit 403 can move the hand unit 401 outward in the radial direction Da, and move the hand unit 401 inward in the radial direction Da.

[0105] The radial direction Da is substantially perpendicular to the rotation axis AX4 and can take any direction within 360 degrees.

[0106] In detail, the hand unit 401 includes a plurality of gripping members 407, a plurality of finger units 409, a hand base unit 411, and a connecting member 413. The arm unit 403 includes an arm base unit 419, an extendable unit 417, and a support unit 415. The base unit 405 includes a main body unit 421 and a shaft unit 423.

[0107] In the hand unit 401, the connecting member 413 connects the hand base unit 411 to the arm unit 403. Specifically, the connecting member 413 connects the hand base unit 411 to the support unit 415. The hand base unit 411 is a member that extends in a radial direction Db relative to a center line AX5 of the hand base unit 411. The multiple finger units 409 are arranged at equal intervals along a circumferential direction Dc relative to the center line AX5. The multiple finger units 409 extend from the hand base unit 411 along the radial direction Db. The finger units 409 are expandable and contractible along the radial direction Db. That is, the finger units 409 can expand outward in the radial direction Db and contract inward in the radial direction Db. For example, the finger units 409 are driven by an air cylinder. The finger units 409 are, for example, substantially columnar members.

[0108] The gripping members 407 are fixed to the tips of the finger portions 409 in the radial direction Db. Therefore, the multiple gripping members 407 are arranged at equal intervals along the circumferential direction Dc. When the multiple finger portions 409 extend outward in the radial direction Db, the multiple gripping members 407 move outward in the radial direction Db. On the other hand, when the multiple finger portions 409 contract inward in the radial direction Db, the multiple gripping members 407 move inward in the radial direction Db.

[0109] Therefore, when the hand portion 401 grips the substrate W, the multiple gripping members 407 are moved radially outward in the direction Db, and then the multiple gripping members 407 are moved radially inward in the direction Db, so that the peripheral edge of the substrate W is gripped by the multiple gripping members 407.

[0110] In the arm unit 403, the support unit 415 is connected to the hand base unit 411 by a connecting member 413. Therefore, the support unit 415 supports the hand unit 401. The support unit 415 is attached to the tip of the extendable unit 417 in the radial direction Da. The extendable unit 417 extends from the arm base unit 419 along the radial direction Da. The extendable unit 417 is extendable and retractable along the radial direction Da. In other words, the extendable unit 417 can extend outward in the radial direction Da and contract inward in the radial direction Da. For example, the extendable unit 417 is driven by an air cylinder.

[0111] The arm base unit 419 rotates the extension / contraction unit 417 around the rotation axis AX3. As a result, the support unit 415 rotates around the rotation axis AX3, and the hand unit 401 rotates around the rotation axis AX3. The extension / contraction unit 417 is, for example, a substantially columnar member. For example, the arm base unit 419 has a motor that rotates the extension / contraction unit 417 around the rotation axis AX3.

[0112] In the base unit 405, the shaft unit 423 extends from the main body unit 421 along the vertical direction Dz. The shaft unit 423 is, for example, approximately columnar. The shaft unit 423 is connected to the arm base unit 419. Specifically, the upper end of the shaft unit 423 is connected to the arm base unit 419. Therefore, the shaft unit 423 supports the arm base unit 419. The main body unit 421 raises or lowers the shaft unit 423. As a result, the arm base unit 419 rises or lowers. Therefore, the extendable unit 417 and the support unit 415 rise or lower, and the hand unit 401 rises or lowers. In order to raise or lower the shaft unit 423, the main body unit 421 includes, for example, a ball screw mechanism and a motor that provides a driving force to the ball screw mechanism.

[0113] Furthermore, the main body 421 rotates the shaft 423 about the rotation axis AX4. As a result, the arm base 419 rotates about the rotation axis AX4. Therefore, the extension / contraction unit 417 and the support unit 415 rotate about the rotation axis AX4, and the hand unit 401 rotates about the rotation axis AX4. For example, the main body 421 has a motor, and the motor rotates the shaft 423 about the rotation axis AX4.

[0114] 6(a) and 6(b), the hand unit 401 holds the substrate W in a horizontal position. Specifically, the hand unit 401 holds the substrate W in a horizontal position with the substrate W facing downward.

[0115] Then, when the arm portion 403 rotates the hand portion 401, which is holding the substrate W in a horizontal position, approximately 90 degrees around the rotation axis AX3, the hand portion 401 holds the substrate W in a vertical position, as shown in Figures 7(a) and 7(b).

[0116] Furthermore, when the arm portion 403 rotates the hand portion 401, which is holding the substrate W in a vertical position, by approximately 90 degrees around the rotation axis AX3, the hand portion 401 holds the substrate W in a horizontal position, as shown in Figures 6(a) and 6(b).

[0117] In this embodiment, the hand unit 401 gripping the substrate W is synonymous with the hand unit 401 holding the substrate W. Note that the arm unit 403 can also grip the substrate W in a horizontal position where the substrate W faces upward.

[0118] Next, the loading of the substrate W from the transport mechanism 400 into the first substrate processing section 100n will be described with reference to Figures 6 to 8. Figure 8 shows a state in which the transport mechanism 400 is delivering the substrate W to the first substrate processing section 100n.

[0119] 6, the transport mechanism 400 receives the substrate W in a horizontal position. Then, as shown in FIG. 7, the transport mechanism 400 changes the position of the substrate W from the horizontal position to a vertical position.

[0120] 8, the transport mechanism 400 loads the substrate W in a vertical position into the first substrate processing unit 100n. Specifically, first, the shutter 106 opens the opening 108 of the first chamber CH1n. Next, the arm unit 403 extends outward in the radial direction Da. Then, the hand unit 401 holding the substrate W in a vertical position enters the first chamber CH1n through the opening 108. Then, the hand unit 401 hands the substrate W in a vertical position to the substrate holder 143 waiting in the first chamber CH1n. Then, the substrate holder 143 holds the substrate W in a vertical position. In this way, the transport mechanism 400 loads the substrate W in a vertical position into the first substrate processing unit 100n.

[0121] For example, when the hand unit 401 is caused to enter the first chamber CH1n, the transport mechanism 400 causes the hand unit 401 to enter the first chamber CH1n from a position where the hand unit 401 is shifted in the first direction D1 (FIG. 1) relative to the substrate holding unit 143. Thereafter, the transport mechanism 400 moves the hand unit 401 in the first direction D1 so that the hand unit 401 approaches the substrate holding unit 143, and hands over the substrate W to the substrate holding unit 143. This operation prevents the hand unit 401 from coming into contact with the substrate holding unit 143 in the radial direction Da (second direction D2) when the hand unit 401 is caused to enter the first chamber CH1n.

[0122] The transfer mechanism 400 moves in the first direction D1 (FIG. 1), thereby moving the hand unit 401 in the first direction D1.

[0123] Next, the transfer of the substrate W from the transport mechanism 400 to the second substrate processing unit 200k will be described with reference to Fig. 9. Fig. 9 is a diagram showing the state in which the transport mechanism 400 hands over the substrate W to the second substrate processing unit 200k. As shown in Fig. 9, the transport mechanism 400 transfers the substrate W in a horizontal position into the second substrate processing unit 200k.

[0124] Specifically, first, a shutter (not shown) opens an opening (not shown) in the sidewall of the second chamber CH2k. Next, the arm unit 403 extends outward in the radial direction Da. Then, the hand unit 401, holding the substrate W in a horizontal position, passes through the opening (not shown) and enters the second chamber CH2k. Then, the hand unit 401 transfers the substrate W in a horizontal position to the spin chuck 213 waiting in the second chamber CH2k. Then, the spin chuck 213 holds the substrate W in a horizontal position. In this way, the transport mechanism 400 loads the substrate W in a horizontal position into the second substrate processing unit 200k.

[0125] Next, with reference to FIGS. 10 to 12, an example of a substrate processing method will be described, showing the procedure from loading a substrate W into the first substrate processing unit 100n, through processing, to unloading the substrate W. FIGS. 10 to 12 are diagrams showing an example of the substrate processing method. FIG. 10 shows loading of the substrate W. FIG. 11 shows immersion of the substrate W. FIG. 12 shows unloading of the substrate W. The substrate processing method is performed by the substrate processing apparatus 1000. Specifically, the substrate processing method is performed by the control device 4 controlling the first substrate processing unit 100n, the second substrate processing unit 200k, and the transport mechanism 400. As shown in FIGS. 10 to 12, the substrate processing method includes steps S1 to S9. Steps S1 to S9 are performed in the same first substrate processing unit 100n (for example, the first substrate processing unit 1001).

[0126] First, in step S1, the shutter 106 opens the opening 108. Then, the arm 403 of the transport mechanism 400 extends in the second direction D2, and the hand 401 holding the substrate W in a vertical position enters the first chamber CH1n through the opening 108. As a result, the substrate W is carried in from the first substrate processing unit 100n. In this case, the substrate placement mechanism 141 causes the substrate holder 143 to wait in the processing bath 103. In other words, the substrate holder 143 waits at a position inside the bath. In step S1, as an example, the first processing liquid LQ11 is not stored in the processing bath 103.

[0127] Next, in step S2, the substrate positioning mechanism 141 raises the substrate holding part 143 from the processing bath 103 to a position outside the bath, and causes the substrate holding part 143 to receive the vertically oriented substrate W from the hand part 401. Furthermore, the nozzle 111 supplies a first processing liquid LQ11 to the processing bath 103. The first processing liquid LQ11 is a chemical liquid.

[0128] Next, in step S3, the arm unit 403 of the transport mechanism 400 retracts in the second direction D2 and retracts the hand unit 401 from inside the first chamber CH1n to outside the first chamber CH1n through the opening 108. After the hand unit 401 has retracted, the shutter 106 closes the opening 108. In step S3, the first processing liquid LQ11 is stored in the processing bath 103. Furthermore, the substrate holder 143, which has received the substrate W in a vertical position, waits at a position outside the processing bath 103 above the processing bath 103.

[0129] 11, in step S4, the substrate positioning mechanism 141 lowers the substrate holder 143, which holds the substrate W in a vertical position, from an outside-tank position into the processing tank 103, thereby immersing the substrate W in the first processing liquid LQ11. As a result, the substrate W is processed with the first processing liquid LQ11. In this case, the substrate holder 143 is disposed in an inside-tank position.

[0130] Next, in step S5, the drain unit 125 and the nozzle 111 replace the first processing liquid LQ11 in the processing tank 103 with the first processing liquid LQ10. In this case, the drain unit 125 discharges the first processing liquid LQ11 out of the processing tank 103, and the nozzle 111 supplies the first processing liquid LQ10 into the processing tank 103. The first processing liquid LQ10 is a rinse liquid. Therefore, the substrate W held by the substrate holder 143 is cleaned with the first processing liquid LQ10. After the substrate W has been cleaned with the first processing liquid LQ10, the drain unit 125 discharges the first processing liquid LQ10 out of the processing tank 103.

[0131] Next, in step S6, the substrate positioning mechanism 141 raises the substrate holder 143, which holds the substrate W in a vertical position, from inside the processing bath 103 to a position outside the bath, thereby raising the substrate W from inside the processing bath 103. Then, the nozzle 121 supplies vapor of an organic solvent (e.g., IPA) having a lower surface tension than the first processing liquid LQ10 (rinse liquid) into the first chamber CH1n in which the raised substrate W exists. As a result, the first processing liquid LQ10 adhering to the substrate W is replaced with the organic solvent, which promotes drying of the substrate W while suppressing collapse of structures constituting the pattern of the substrate W. In this way, in step S6, the substrate W is dried in the first chamber CH1n. Note that in step S6, the processing bath 103 is empty, for example.

[0132] Preferably, the nozzle 121 supplies the organic solvent vapor into the first chamber CH1n, and then supplies the inert gas into the first chamber CH1n. As a result, drying of the substrate W can be further promoted. More preferably, the substrate W is dried in a state where the pressure inside the first chamber CH1n is reduced by the decompression unit 131 (FIG. 2). This is because drying of the substrate W can be further promoted. For example, the nozzle 121 supplies the organic solvent vapor into the first chamber CH1n in a state where the pressure inside the first chamber CH1n is reduced. Also, for example, the nozzle 121 supplies the inert gas into the first chamber CH1n in a state where the pressure inside the first chamber CH1n is reduced.

[0133] 12, in step S7, the shutter 106 opens the opening 108. In this case, the substrate holder 143 holds the dried substrate W and waits outside the first chamber CH1n. Then, the arm 403 of the transport mechanism 400 extends in the second direction D2, and moves the hand 401 into the first chamber CH1n through the opening 108.

[0134] Next, in step S8, the hand unit 401 receives the dried substrate W from the substrate holding unit 143. Then, the substrate positioning mechanism 141 lowers the substrate holding unit 143 from the position outside the tank into the processing tank 103. As a result, the substrate holding unit 143 is placed at the position inside the tank.

[0135] Next, in step S9, the arm portion 403 of the transport mechanism 400 retracts in the second direction D2, and retracts the hand portion 401 holding the dried substrate W in a vertical position from inside the first chamber CH1n to outside the first chamber CH1n through the opening 108. As a result, the substrate W is unloaded from the first substrate processing unit 100n. Then, after the hand portion 401 has retracted, the shutter 106 closes the opening 108. The substrate processing method then ends.

[0136] Next, another example of the substrate processing method according to this embodiment will be described with reference to Figures 1, 2, 8, 9, 13, and 14. The substrate processing method is performed by the substrate processing apparatus 1000. Specifically, the control device 4 controls the first substrate processing unit 100n, the second substrate processing unit 200k, and the transport mechanism 400 to perform the substrate processing method.

[0137] 13 and 14, the substrate processing method uses, as an example, a first substrate processing unit 1001 (first chamber CH11) of the plurality of first substrate processing units 100n in FIG. 1. That is, n=1. Also, as an example, a second substrate processing unit 2001 (second chamber CH21) and a second substrate processing unit 2002 (second chamber CH22) of the plurality of second substrate processing units 200k in FIG. 1. That is, k=1, 2.

[0138] 13 and 14 are flowcharts showing another example of the substrate processing method. As shown in Fig. 13 and 14, the substrate processing method includes steps S21 to S40.

[0139] First, as shown in Figures 9 and 13, in step S21, the transport mechanism 400 loads one horizontally oriented substrate W into the second chamber CH21 (k = 1 in Figure 9) of the second substrate processing unit 2001 (k = 1 in Figure 9).

[0140] Next, in step S22, the spin motor 215 rotates the spin chuck 213, thereby starting the rotation of the substrate W.

[0141] Next, in step S23, the nozzle 217 discharges the second processing liquid LQ21 (q=1 in FIG. 5) onto the substrate W. The second processing liquid LQ21 is a chemical liquid. Therefore, the substrate W is processed by the second processing liquid LQ21. The chemical liquid is, for example, hydrofluoric acid. In this case, for example, an oxide film formed on the substrate W is removed by the hydrofluoric acid. The nozzle 217 stops discharging the second processing liquid LQ21 after a first predetermined time has elapsed.

[0142] Next, in step S24, the nozzle 223 discharges the second processing liquid LQ20 (q=0 in FIG. 5) onto the substrate W. The second processing liquid LQ20 is a rinse liquid. Therefore, the substrate W is cleaned with the second processing liquid LQ20. After a second predetermined time has elapsed, the nozzle 223 stops discharging the second processing liquid LQ20.

[0143] Next, in step S25, the spin chuck 213 is rotated by the spin motor 215 to dry the substrate W.

[0144] Next, in step S26, the spin motor 215 stops the rotation of the spin chuck 213, thereby stopping the rotation of the substrate W.

[0145] Next, in step S27, the transfer mechanism 400 transfers one horizontally oriented substrate W out of the second chamber CH21.

[0146] 8 and 13, in step S28, the transport mechanism 400 changes the orientation of one substrate W from a horizontal orientation to a vertical orientation, and loads the substrate W into the first chamber CH11 (n=1 in FIG. 8) of the first substrate processing unit 1001 (n=1 in FIG. 8). In this case, the hand unit 401 of the transport mechanism 400 hands over the substrate W in the vertical orientation to the substrate holder 143 of the first substrate processing unit 1001.

[0147] Next, in step S29, the substrate positioning mechanism 141 lowers the substrate holder 143 holding one vertically oriented substrate W, thereby immersing the substrate W in the first processing liquid LQ11 (m=1 in FIG. 8) in the processing bath 103. The first processing liquid LQ11 is a chemical liquid. Therefore, the substrate W is processed with the first processing liquid LQ11. The chemical liquid is, for example, phosphoric acid. In this case, for example, a nitride film formed on the substrate W is etched by the phosphoric acid. In step S29, the substrate W is processed with the first processing liquid LQ11 in the processing bath 103 for a third predetermined time.

[0148] Next, in step S30, the drainage unit 125 (FIG. 2) discharges the first processing liquid LQ11 from the processing tank 103, and the nozzle 111 supplies the first processing liquid LQ10 (m=0 in FIG. 8) to the processing tank 103. As a result, the first processing liquid LQ11 is replaced with the first processing liquid LQ10. Then, in the processing tank 103, the substrate W is cleaned with the rinse liquid, which is the first processing liquid LQ10.

[0149] Next, in step S31, the substrate positioning mechanism 141 raises the substrate holder 143 that holds one vertically oriented substrate W, thereby lifting the substrate W from the processing bath 103.

[0150] Next, in step S32, the drying section 115 dries the substrate W in the first chamber CH11.

[0151] Next, in step S33, the transfer mechanism 400 transfers one substrate W in a vertical position out of the first chamber CH11.

[0152] 9 and 14, in step S34, the transport mechanism 400 changes the orientation of one substrate W from a vertical orientation to a horizontal orientation, and loads the substrate W into the second chamber CH22 (k=2 in FIG. 9) of the second substrate processing unit 2002 (k=2 in FIG. 9). In this case, the hand unit 401 of the transport mechanism 400 delivers the substrate W in the horizontal orientation to the spin chuck 213 of the second substrate processing unit 2002.

[0153] Next, in step S35, the spin motor 215 rotates the spin chuck 213, thereby starting the rotation of the substrate W.

[0154] Next, in step S36, the nozzle 217 discharges the second processing liquid LQ22 (q=2 in FIG. 5) onto the substrate W. The second processing liquid LQ22 is a chemical liquid. Therefore, the substrate W is processed with the second processing liquid LQ22. The chemical liquid is, for example, SC1. In this case, for example, organic matter adhering to the substrate W is removed. After a fourth predetermined time, the nozzle 217 stops discharging the second processing liquid LQ22.

[0155] Next, in step S37, the nozzle 223 discharges the second processing liquid LQ20 (q=0 in FIG. 5) onto the substrate W. The second processing liquid LQ20 is a rinse liquid. Therefore, the substrate W is cleaned with the second processing liquid LQ20. After a fifth predetermined time, the nozzle 223 stops discharging the second processing liquid LQ20.

[0156] Next, in step S38, the spin chuck 213 is rotated by the spin motor 215 to dry the substrate W.

[0157] Next, in step S39, the spin motor 215 stops the rotation of the spin chuck 213, thereby stopping the rotation of the substrate W.

[0158] Next, in step S40, the transfer mechanism 400 transfers one horizontally oriented substrate W out of the second chamber CH22, and the substrate processing method is then completed.

[0159] 13 and 14, the processing time (third predetermined time) with the first processing liquid LQ11 (chemical liquid) in the first chamber CH11 is longer than the processing time (first predetermined time) with the second processing liquid LQ21 (chemical liquid) in the second chamber CH21, and is longer than the processing time (fourth predetermined time) with the second processing liquid LQ22 (chemical liquid) in the second chamber CH22. Therefore, according to this embodiment, the amount of chemical liquid consumed can be reduced compared to when processing with the same chemical liquid as the first processing liquid LQ11 (chemical liquid) is performed in the second chamber CH2k. This is because the chemical liquid is not continuously discharged in the processing tank 103 of the first chamber CH11, but the substrate W is processed with the chemical liquid stored in the processing tank 103.

[0160] The embodiments of the present invention (including modified examples) have been described above with reference to the drawings. However, the present invention is not limited to the above-described embodiments and can be implemented in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above-described embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0161] Furthermore, the drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0162] (1) In the substrate processing apparatus 1000 shown in FIG. 1, the control device 4 may cause the transport mechanism 400 to transport the substrate W, so that multiple processes with a predetermined order are performed in sequence by two or more different first substrate processing units 100n.

[0163] In the substrate processing apparatus 1000, the control device 4 may cause the transport mechanism 400 to transport the substrate W, so that a plurality of processes in a predetermined order are performed in sequence by two or more different second substrate processing units 200k.

[0164] Furthermore, in the substrate processing apparatus 1000, the control device 4 may cause one or more first substrate processing units 100n and one or more second substrate processing units 200k to sequentially perform a plurality of processes in a predetermined order by causing the transport mechanism 400 to transport the substrate W. In this case, by taking advantage of the characteristics of the first substrate processing unit 100n (e.g., effective for long-term processing) and the characteristics of the second substrate processing unit 200k (e.g., effective for short-term processing or fine processing), the plurality of processes can be optimally allocated to the first substrate processing unit 100n and the second substrate processing unit 200k.

[0165] (2) In FIG. 1, the substrate processing apparatus 1000 may include a plurality of transfer mechanisms 400 . [Industrial Applicability]

[0166] The present invention relates to a substrate processing apparatus and has industrial applicability. [Explanation of symbols]

[0167] 4. Control device 100n First substrate processing section 103 Treatment tank 115 Drying section 141 Board placement mechanism 200k Second substrate processing section 400 Conveyor mechanism 1000 Substrate Processing Equipment CH1n 1st chamber (chamber) W substrate

Claims

1. a first substrate processing unit that processes the substrates one by one in a vertical position by immersing the substrates in a first processing liquid; a transfer mechanism that receives the substrate in a horizontal position, changes the position of the substrate from the horizontal position to the vertical position, and carries the substrate in the vertical position into the first substrate processing section; Equipped with The first substrate processing section a processing tank having a capacity corresponding to one substrate, in which only one substrate in the vertical position is placed, and in which the first processing liquid is stored; a substrate placement mechanism that receives the substrate from the transport mechanism and places only one of the substrates in the vertical position in the first processing liquid; A substrate processing apparatus comprising:

2. The first substrate processing section a chamber that accommodates the treatment tank; a drying section in the chamber that dries the substrate pulled out of the processing bath; The substrate processing apparatus of claim 1 , further comprising:

3. a plurality of the first substrate processing units are provided, the plurality of first substrate processing units are arranged side by side along a first direction that is substantially parallel to a horizontal direction, 3 . The substrate processing apparatus according to claim 1 , wherein the transport mechanism transports the substrate in the vertical position into each of the plurality of first substrate processing sections by moving along a transport path extending along the first direction.

4. further comprising a plurality of second substrate processing units arranged side by side along the first direction; each of the plurality of second substrate processing units processes the substrates one by one by discharging a second processing liquid onto the substrates in the horizontal position while the substrates are rotating; the transport mechanism moves along the transport path to load the substrate in the horizontal position to be processed by the second substrate processing units into each of the second substrate processing units; the plurality of first substrate processing units are arranged on one side of the transport path in a second direction, the second substrate processing units are disposed on the other side of the transport path in the second direction, The substrate processing apparatus according to claim 3 , wherein the second direction is substantially perpendicular to the first direction.

5. a control device that controls the transport mechanism, the first substrate processing section, and the second substrate processing section; The substrate processing apparatus of claim 4, wherein the control device causes the transport mechanism to transport the substrate, thereby causing one or more of the first substrate processing units and one or more of the second substrate processing units to perform a plurality of processes in a predetermined order in sequence.

6. a second substrate processing unit that processes the substrates one by one by discharging a second processing liquid onto the substrates in the horizontal position while the substrates are rotating; a control device that controls the transport mechanism; Further provided with The control device controlling the transport mechanism to transport the substrate for which a processing time exceeding a specified time has been set into the first substrate processing section; 3 . The substrate processing apparatus according to claim 1 , wherein the transport mechanism is controlled so that the substrate for which the processing time set is equal to or shorter than the specified time is transported into the second substrate processing section.

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