Electronic device

Abstract

To efficiently cool a plurality of heat sources respectively arranged on different stories.SOLUTION: An electronic device includes a partition plate that partitions a part of an inside of a housing into an upper space and a lower space, intake ports that are respectively provided in a right side surface and a left side surface of the housing at positions corresponding to at least the upper space, an exhaust port that is provided in either a front surface or a back surface of the housing, at least one exhaust unit that is provided in the exhaust port, and a plurality of cooling targets that are respectively disposed in the upper space and the lower space. The exhaust unit on the front surface or the back surface of the housing is disposed at a position closer to a cooling target having a large heat generation amount than to a cooling target having a small heat generation amount among the plurality of cooling targets in either the upper space or the lower space in the left-right direction, and is disposed at a position across the upper space and the lower space in the up-down direction.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to an electronic device that incorporates a plurality of objects to be cooled. [Background technology]

[0002] Conventionally, electronic devices that relay images from a pan-tilt device, power to the pan-tilt device, commands from an operating device, etc. have been known. The electronic devices are connected to various devices such as the pan-tilt device, a controller, and a display, and play an important role in a video distribution system. The electronic devices have multiple heat sources. For example, heat sources include a board that processes images from the pan-tilt device and a transformer that boosts the power supplied to the pan-tilt device.

[0003] In electronic devices with such heat sources, cooling the heat sources becomes an issue. In Patent Document 1, there are upper and lower partitions inside the housing, and in order to efficiently cool the multiple heat sources arranged in the upper and lower spaces, an intake fan is placed in a position spanning the upper and lower parts. An intake fan is provided on one of the front and rear surfaces, and an exhaust port is provided on the other surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-185592 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the above-mentioned conventional example cannot efficiently cool multiple heat sources on the same floor. Also, since the intake or exhaust port is provided on the rear surface, the rear interface surface cannot be used effectively.

[0006] In view of the above, the present invention aims to efficiently cool not only multiple heat sources on different floors, but also multiple heat sources on the same floor. Another aim is to effectively utilize the interface surface by devising the position of the intake and exhaust ports. [Means for solving the problem]

[0007] In order to solve the above problem, an electronic device according to one embodiment of the present invention comprises a partition plate that divides a portion of the interior of a housing into an upper space and a lower space, air intakes provided on the right and left sides of the housing at positions corresponding to at least the upper space, an exhaust port provided on either the front or back of the housing, at least one exhaust means provided in the exhaust port, and a plurality of cooling objects arranged in the upper space and the lower space, respectively, wherein the exhaust means on the front or back of the housing is arranged in a position in the left-right direction closer to a cooling object with a large heat generation amount than a cooling object with a small heat generation amount among the plurality of cooling objects in either the upper space or the lower space, and is arranged in a position that straddles the upper space and the lower space in the up-down direction. [Effects of the Invention]

[0008] According to the present invention, it is possible to efficiently cool a plurality of heat sources arranged on different floors. [Brief explanation of the drawings]

[0009] [Figure 1] Perspective view of electronic device [Figure 2] Front view of electronic device [Figure 3] Back view of electronic device [Figure 4] Electronic equipment system block diagram [Figure 5] YZ cross section of a relay device for electronic equipment [Figure 6] XY cross section of the first floor of the electronic equipment [Figure 7] ZX cross section of electronic device [Figure 8]XY cross section of the second floor of the electronic equipment [Figure 9] XY cross-sectional view explaining the airflow on the second floor of the electronic equipment building [Figure 10] XY cross-sectional view explaining the airflow on the first floor of the electronic equipment [Figure 11] YZ cross-sectional diagram illustrating the airflow between the first and second floors of the electronic equipment building [Figure 12] XY cross section of the second floor of an electronic device when dissipating heat with a heat sink [Figure 13] XY cross section of the second floor of an electronic device when dissipating heat with a copper plate [Figure 14] XY cross section of the second floor of an electronic device when the gap between the upper and lower partitions is large DETAILED DESCRIPTION OF THE INVENTION

[0010] First Embodiment

[0011] The configuration of the electronic device of the present invention will be described with reference to FIG. 1. In the description, the directions indicated by arrows in FIG. 1 are defined as the X-axis direction (left-right direction), the Y-axis direction (front-back direction), and the Z-axis direction (up-down direction), respectively. The front-back direction is a direction that intersects the left-right direction and the up-down direction. The origin of the coordinate system is O. Of the exterior XY planes of electronic device 101, the one closer to origin O is defined as the bottom surface, and the other XY plane is defined as the top surface. Of the exterior YZ planes of electronic device 101, the one closer to origin O is defined as the right side surface, and the other YZ plane is defined as the left side surface. Of the exterior ZX planes of electronic device 101, the one closer to origin O is defined as the front surface, and the other ZX plane is defined as the back surface.

[0012] The exterior of electronic device 101 is mainly composed of main case 102 and main cover 103. Air intakes 104 are arranged on the right and left sides of main cover 103. Air intakes 104 have a louvered shape to prevent foreign matter from entering from the outside. An exhaust port 105 is arranged on the front of main case 102. Air is taken in through air intake 104, cools the object to be cooled inside electronic device 101, and is exhausted through exhaust port 105.

[0013] The front configuration of electronic device 101 will be described with reference to Figure 2. An exhaust fan 201 is arranged on the front of electronic device 101 to exhaust air. A finger guard 202 is arranged on the rotating part of exhaust fan 201 to protect fingers from the rotation of the fan. Also, a power switch 203 is arranged on the front of electronic device 101.

[0014] The rear configuration of the electronic device 101 will be described with reference to Figure 3. An AC inlet 301 is located near the bottom left of the rear face, and power is supplied to the electronic device 101 from the AC inlet 301. A command receiving terminal 302 is located near the top left of the rear face, and an operation command for the pan-tilt device is input from the command receiving terminal 302 to the electronic device 101. An optical multi-terminal 303 is located near the bottom right of the rear face, and images and power are exchanged between the electronic device 101 and the pan-tilt device main body via the optical multi-terminal 303. A video output terminal 304 is located above the optical multi-terminal 303. Video can be output from the video output terminal 304.

[0015] The system of electronic device 101 will be described with reference to Fig. 4. Electronic device 101 is powered by an AC power supply 401. Electronic device 101 and pan-tilt device 403 are connected by an optical multi-cable. Commercial power of approximately 100V supplied from AC power supply 401 is boosted by the function of electronic device 101 and sent to pan-tilt device 403 through the optical multi-cable.

[0016] The electronic device 101 is connected to an operating device 402, and commands from the operating device 402 are transmitted to a pan-tilt device 403 via the electronic device 101. The pan-tilt device 403 operates based on commands from the operating device 402 and captures images. The captured images are transmitted to the electronic device 101 via an optical multi-cable, and the images are displayed on a video display 404 connected to the electronic device 101.

[0017] The internal structure of electronic device 101 will be described with reference to Figures 5, 6, 7, and 8. First, the YZ cross-sectional structure of electronic device 101 will be described with reference to Figure 5.

[0018] An upper and lower partition board 501 is arranged inside electronic device 101, and divides a part of the internal space of electronic device 101 into two large sections. Of the spaces divided by upper and lower partition board 501, the side of origin O is defined as the first floor (lower space), and the space on the other side is defined as the second floor (upper space).

[0019] Additionally, an exhaust fan 201 is installed across the first and second floors. The primary power supply system is mainly installed on the first floor, and the video control system is installed on the second floor. This is designed to prevent the risk of easily touching the primary power supply system when the main cover 103 is removed. Additionally, the video control system is installed on the second floor so that the boards of the video control system can be easily accessed when the main cover 103 is removed.

[0020] Next, the structure of the first floor of electronic device 101 will be described with reference to Fig. 6. Transformer 602 is a primary power supply system and is located on the first floor. When power switch 203 is turned on, power input from AC inlet 301 is sent to fuse board 601. Power is sent from fuse board 601 to transformer 602, where it is boosted.

[0021] After that, the power is supplied from the optical multi-terminal 303 to the pan-tilt device via the fuse board 601. Furthermore, the power that has not been boosted is supplied from the fuse board 601 to the AC-DC power supply board 603. The power is then sent from the AC-DC power supply board 603 to the main board on the second floor.

[0022] Next, the ZX cross-sectional structure of electronic device 101 will be described with reference to Fig. 7. A power supply board cover plate 701 is disposed above AC-DC power supply board 603. Power supply board cover plate 701 is U-shaped to prevent the risk of easily touching the periphery of AC-DC power supply board 603 when main cover 103 is opened.

[0023] The U-shaped bends of the power supply board cover plate 701 face the right and left sides of the electronic device 101, making it difficult to access the AC-DC power supply board 603 from the air intake port.

[0024] The second floor structure of electronic device 101 will be described using Figure 8. Main board 801 is arranged on upper and lower partition board 501, and control IC 802, which is a heat source, is located near the center of main board 801. In order to cool control IC 802, which is a heat source, graphite sheet 803 is attached to the top of control IC 802, which is a heat source. Graphite sheet 803 transfers heat from control IC 802, which is a heat source, to upper and lower partition board 501, making it possible to cool control IC 802, which is a heat source.

[0025] The main board 801 is connected to the AC-DC power supply board 603 on the first floor via a harness and receives power.

[0026] An optical module board 804 is also arranged on the upper and lower partition board 501. The optical module board 804 is connected to the optical multi-terminal 303 by a harness and receives the video from the camera platform body. The received video is sent to the main board 801, and then the video is output from the video output terminal 304.

[0027] An interface board 805 is also fixed onto the upper and lower partition plates 501. The main board 801 and the interface board 805 are connected by a harness, and commands received by the command receiving terminal 302 of the interface board 805 are sent to the main board 801.

[0028] The upper and lower partition board 501 has a harness window (1) 807 and a harness window (2) 808, which allow harnesses to pass from the first floor to the second floor. Video harnesses, optical cables, power harnesses, etc. pass through the harness window (1) 807 and the harness window (2) 808.

[0029] In addition, the harness window (1) 807 and the harness window (2) 808 also serve to allow air to pass between the first and second floors.

[0030] Electronic device 101 has a gap 809 between the first and second floors on the front side, a gap 810 between the first and second floors on the right side, a gap 811 between the first and second floors on the back side, and a gap 812 between the first and second floors on the left side, allowing air to easily move between the first and second floors.

[0031] The air flow will be explained using Figures 9, 10, and 11. In Figures 9, 10, and 11, the direction of the arrows indicates the direction of air flow, and the length of the arrows indicates the relative wind speed. By providing gaps around the upper and lower partition plates 501 in the XY cross section in this way, it is possible to increase the degree of freedom in designing the distribution of airflow between the first and second floors and the wind speed distribution on each floor.

[0032] 9 is a diagram illustrating the air flow on the second floor. Electronic device 101 is provided with right side air intake 813 and left side air intake 814. Right side air intake 813 is located near optical module board 804, allowing sufficient cooling air to flow over optical module board 804. Left side air intake 814 is located near main board 801, allowing sufficient cooling air to flow over main board 801.

[0033] In this embodiment, right side air intake 813 and left side air intake 814 are provided only on the second floor (at positions corresponding to the upper space), as shown in air intake 104 in Fig. 1. Note that it is sufficient that the two air intakes are located at positions corresponding to at least the upper space, and there may be a space of about several millimeters at the position corresponding to the lower space.

[0034] Air enters from the second floor of electronic device 101, but as mentioned above, because air flows easily between the first and second floors, cooling air also flows on the first floor. Because main board 801 generates more heat than optical module board 804, exhaust fan 201 is positioned closer to main board 801 in the X-axis direction.

[0035] Furthermore, main board 801, which is an object to be cooled that generates a large amount of heat, is arranged closer to exhaust fan 201, which is an exhaust means, than optical module board 804, which is an object to be cooled that generates a small amount of heat. This arrangement allows sufficient cooling air to flow from left side air intake 814 to exhaust fan 201, allowing main board 801 to be cooled.

[0036] Furthermore, since the wind speed increases as the air approaches the exhaust fan 201, the main board 801, which is the cooling target that generates a large amount of heat, can be efficiently cooled.

[0037] Furthermore, a graphite sheet 803 is placed on the flow path, which is expected to further enhance the cooling effect. The cooling air that enters from the right side air intake 813 passes through the optical module board 804 and main board 801, and is exhausted from the exhaust fan 201.

[0038] The cooling air flowing from the right side air intake 813 to the exhaust fan 201 has a smaller air volume than the cooling air flowing from the left side air intake 814 to the exhaust fan 201, but is still able to sufficiently cool the optical module substrate 804.

[0039] Next, the air flow on the first floor will be described using Figure 10. Air that flows into electronic device 101 from left side air intake 814 passes through first-floor-second-floor gap 812 on the left side, and moves from the second floor to the first floor. Air that flows into electronic device 101 from right side air intake 813 passes through first-floor-second-floor gap 810 on the right side, and moves from the second floor to the first floor.

[0040] 11, air flowing in from left side air intake 814 and right side air intake 813 moves from the second floor to the first floor through gap 811 between the first and second floors on the rear side. On the first floor, AC-DC power supply board 603 and transformer 602 need to be cooled, but cooling is possible even on the first floor because cooling air flows from the rear side toward exhaust fan 201.

[0041] As shown in Figure 8, by providing an exhaust means on the front and intake ports on both sides, and by providing no intake port or exhaust means on the rear, it is possible to arrange many input / output terminals on the rear. In other words, the number of input / output terminals provided on the rear, where neither intake port nor exhaust means is provided, can be greater than the number of input / output terminals provided on the other sides (front, right side, left side).

[0042] The above-described configuration ensures sufficient space for terminals on the rear surface, while also allowing the cooling target within electronic device 101 to be sufficiently cooled. Second Embodiment

[0043] In the first embodiment, graphite sheet 803 was used as a heat dissipation member for control IC 802, which is a heat source. Graphite sheet 803 is placed between left side air intake 814 and exhaust fan 201, where the flow rate is high, to efficiently cool the control IC. In the second embodiment, a case where a heat dissipation member other than graphite sheet 803 is used will be described.

[0044] First, a case where a heat sink is used as a heat dissipation member will be described with reference to Fig. 12. Heat sink 901 is fixed above control IC 802, which is a heat source, and is located between left side air intake 814 and exhaust fan 201. Heat from control IC 802, which is a heat source, is transferred to heat sink 901 and is cooled by the sufficient cooling air between left side air intake 814 and exhaust fan 201.

[0045] Next, the use of a copper plate as a heat dissipation member will be described with reference to Figure 13. Copper plate 1001 is fixed above control IC 802, which is a heat source, and is located between left side air intake 814 and exhaust fan 201. The edges of copper plate 1001 are fixed to upper and lower partition plates 501 made of metal or other material, allowing heat dissipation. As with graphite sheet 803 and heat sink 901, sufficient cooling air hits copper plate 1001, making it possible to cool control IC 802, which is a heat source. <Third embodiment>

[0046] A third embodiment will be described with reference to Figure 14. Here, we consider a case where there are only air intakes on the second floor, but it is desired to send more air to the first floor as well. In order to send more of the air that has flowed into the second floor to the first floor, it is necessary to enlarge the gap between the first and second floors of upper and lower partition board 501.

[0047] Therefore, in upper and lower partition board 501, gaps (1) 1101 between the first floor and second floor and gaps (2) 1102 between the first floor and second floor are provided near right side air intake port 813 and left side air intake port 814. This makes it easier for air that enters from the second floor to reach the first floor, making it possible to further cool the objects to be cooled on the first floor.

[0048] If it is necessary to send more air to the first floor, a further gap is created in the upper and lower partition boards 501. For example, the gap (1) 1101 between the first floor and the second floor and the gap (2) 1102 between the first floor and the second floor can be enlarged, or a new gap can be created in the vacant space. <Other>

[0049] The disclosure of the above-described embodiment includes the following configurations. (Configuration 1) a partition plate that divides a part of the interior of a housing of the electronic device into an upper space and a lower space; air intakes provided on the right and left sides of the housing at positions corresponding to at least the upper space; an exhaust port provided on either the front or rear surface of the housing; At least one exhaust means provided at the exhaust port; a plurality of cooling targets disposed in the upper space and the lower space, respectively; Equipped with An electronic device characterized in that the exhaust means on the front or back of the housing is positioned in a position in the left-right direction closer to a cooling object with a large heat generation amount than to a cooling object with a small heat generation amount among the multiple cooling objects in either the upper space or the lower space, and is positioned in a position spanning the upper space and the lower space in the up-down direction. (Configuration 2) The electronic device according to configuration 1, wherein the object to be cooled that generates a large amount of heat and the object to be cooled that generates a small amount of heat are contained in the upper space. (Configuration 3) 3. The electronic device according to configuration 1 or 2, characterized in that in a front-to-back direction that intersects the left-to-right direction and the up-to-down direction, the object to be cooled that generates a large amount of heat is positioned closer to the exhaust means than the object to be cooled that generates a small amount of heat. (Configuration 4) 4. The electronic device according to any one of configurations 1 to 3, wherein a cooling target for a primary power supply system is disposed in the lower space, and a cooling target for a video control system is disposed in the upper space. (Configuration 5) 5. The electronic device of any one of configurations 1 to 4, wherein gaps that serve as flow paths for air from the upper space to the lower space are provided between the front, rear, right side, and left side of the housing and the partition plate. (Configuration 6) 6. The electronic device of any one of configurations 1 to 5, wherein the number of input / output terminals provided on one of the front, rear, right side, and left side surfaces of the housing on which neither the air intake port nor the exhaust means is located is greater than the number of input / output terminals provided on the other surfaces. (Configuration 7) 7. The electronic device of any one of configurations 1 to 6, wherein a heat dissipation member for cooling the cooling target that generates a large amount of heat is disposed on an air flow path connecting the exhaust means and the intake port provided on a side surface closer to the exhaust means in the left-right direction. (Configuration 8) 8. The electronic device according to any one of configurations 1 to 7, wherein the air intake is not provided at positions on the right side surface and the left side surface corresponding to the lower space.

[0050] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0051] 101 Electronic equipment 102 Main Case 103 Main cover 104 Air intake 105 Exhaust port 201 Exhaust fan 501 Upper and lower partition board 602 Trans 603 AC-DC power supply board 801 Main board 802 control IC 803 Graphite Sheet 813 Right side air intake 814 Left side air intake

Claims

1. a partition plate that divides a part of the interior of a housing of the electronic device into an upper space and a lower space; air intakes provided on the right and left sides of the housing at positions corresponding to at least the upper space; an exhaust port provided on either the front or rear surface of the housing; At least one exhaust means provided at the exhaust port; a plurality of cooling targets disposed in the upper space and the lower space, respectively; Equipped with An electronic device characterized in that the exhaust means on the front or back of the housing is positioned in a position in the left-right direction closer to a cooling object with a large heat generation amount than to a cooling object with a small heat generation amount among the multiple cooling objects in either the upper space or the lower space, and is positioned in a position spanning the upper space and the lower space in the up-down direction.

2. The electronic device according to claim 1 , wherein the object to be cooled that generates a large amount of heat and the object to be cooled that generates a small amount of heat are contained in the upper space.

3. 2. The electronic device according to claim 1, wherein the object to be cooled that generates a large amount of heat is arranged closer to the exhaust means than the object to be cooled that generates a small amount of heat in a front-rear direction that intersects the left-right direction and the up-down direction.

4. 2. The electronic device according to claim 1, wherein a cooling target for a primary power supply system is disposed in the lower space, and a cooling target for a video control system is disposed in the upper space.

5. The electronic device according to claim 1, characterized in that a gap is provided between each of the front, back, right side, and left side of the housing and the partition plate, which serves as an air flow path from the upper space to the lower space.

6. 2. The electronic device according to claim 1, wherein the number of input / output terminals provided on one of the front, rear, right side, and left side surfaces of the housing on which neither the intake port nor the exhaust means is located is greater than the number of input / output terminals provided on the other surfaces.

7. The electronic device according to claim 1, characterized in that a heat dissipation member for cooling the cooling object that generates a large amount of heat is arranged on the air flow path connecting the air intake port provided on the side closer to the exhaust means in the left-right direction and the exhaust means.

8. 2. The electronic device according to claim 1, wherein the air intake is not provided at a position on the right side surface and the left side surface corresponding to the lower space.

Images