Light emitting device

Abstract

To improve reliability of a light-emitting device.SOLUTION: The light-emitting device includes a substrate including a conductive member having a recess and including a first conductive portion and a second conductive portion disposed on a bottom surface defining the recess, and an insulating base material supporting the conductive member, a first element having a first upper surface on which an electrode 35 is disposed, a first lower surface located on a side opposite to the first upper surface, and a first side surface located between the first upper surface and the first lower surface, and a second element including a second upper surface, a second lower surface located on a side opposite to the second upper surface, and a second side surface located between the second upper surface and the second lower surface. The electronic component is provided with: a second element having a second side surface facing the first side surface; a conductive first wire having one end connected to the electrode of the first element and the other end connected to a first region located between the first lower surface and the second lower surface of the second conductive section; and a sealing member which is arranged in the recessed section and seals the first element, the second element, the conductive member, and the first wire.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a semiconductor light-emitting device having a plurality of semiconductor light-emitting elements, a covering member such as a sealing resin made of a translucent resin containing at least one type of phosphor and covering the plurality of semiconductor light-emitting elements, and a conductive wire such as a bonding wire connected to the semiconductor light-emitting elements. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-299879 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure aims to improve the reliability of light-emitting devices. [Means for solving the problem]

[0005] A light emitting device according to an embodiment of the present disclosure includes a substrate having a recess, a conductive member including a first conductive portion and a second conductive portion disposed on a bottom surface defining the recess, and an insulating base material supporting the conductive member; a first element having a first upper surface on which an electrode is disposed, a first lower surface located on the opposite side of the first upper surface, and a first side surface located between the first upper surface and the first lower surface; and a second element spaced apart from the first element, a second upper surface, a second lower surface located on the opposite side of the second upper surface, and a second element located between the second upper surface and the second lower surface and facing the first side surface. a second element having a second side surface facing the electrode of the first element; a conductive first wire having one end connected to the electrode of the first element and the other end connected to a first region of the second conductive portion located between the first lower surface and the second lower surface; and a sealing member disposed within the recess and sealing the first element, the second element, the conductive member, and the first wire, wherein an upper end of the second side surface is located closer to the first side surface than a lower end of the second side surface, and the other end of the first wire overlaps the second side surface in a top view. [Effects of the Invention]

[0006] According to an embodiment of the present disclosure, the reliability of a light emitting device can be improved. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a top view schematically illustrating a light emitting device according to an embodiment. [Figure 2] FIG. 2 is a top view schematically showing the light emitting device in a state where the sealing member is omitted. [Figure 3] FIG. 2 is a cross-sectional view schematically showing the light emitting device taken along line III-III in FIG. [Figure 4A] FIG. 10 is a cross-sectional view schematically showing an example of a conductive first wire of a reference example that has been deformed due to thermal expansion of a sealing member. [Figure 4B] 4 is a cross-sectional view schematically illustrating an example of a conductive first wire of the embodiment that is deformed due to thermal expansion of a sealing member. FIG. [Figure 5] FIG. 10 is a top view schematically showing a light emitting device according to a first modified example of the embodiment. [Figure 6] 6 is a cross-sectional view schematically showing the light emitting device taken along line VI-VI in FIG. 5. [Figure 7] FIG. 10 is a top view schematically showing a light emitting device according to a second modified example of the embodiment. [Figure 8] FIG. 8 is a cross-sectional view schematically showing the light emitting device taken along line VIII-VIII in FIG. [Figure 9] FIG. 10 is a top view schematically showing a light emitting device according to a third modified example of the embodiment. [Figure 10] 10 is a cross-sectional view schematically showing the light emitting device taken along line XX in FIG. 9. DETAILED DESCRIPTION OF THE INVENTION

[0008] Light-emitting devices according to embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the following embodiments are merely illustrative of light-emitting devices that embody the technical concepts of the embodiments and are not limited thereto. Furthermore, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of components described in the embodiments are merely illustrative examples and are not intended to limit the scope of the present disclosure. The size, positional relationships, etc. of components shown in each drawing may be exaggerated for clarity. In the following description, the same names and symbols indicate identical or similar components, and detailed descriptions will be omitted as appropriate. An end view showing only a cut surface may be used as a cross-sectional view.

[0009] In the figures shown below, directions may be indicated by the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are mutually perpendicular. The direction of the arrow in the X-axis direction is referred to as the +X direction or +X side, and the direction opposite to the +X direction is referred to as the -X direction or -X side. The direction of the arrow in the Y-axis direction is referred to as the +Y direction or +Y side, and the direction opposite to the +Y direction is referred to as the -Y direction or -Y side. The direction of the arrow in the Z-axis direction is referred to as the up, +Z direction, or +Z side, and the direction opposite to the +Z direction is referred to as the down, -Z direction, or -Z side. Furthermore, the term "top view" in the embodiments refers to viewing an object from the +Z direction or +Z side. However, these do not limit the orientation of the light-emitting device during use, and the orientation of the light-emitting device is arbitrary. In the embodiments, the surface in the +Z direction (i.e., the surface of the object when viewed in the +Z direction or from the +Z side) is referred to as the "upper surface," and the surface in the -Z direction (i.e., the surface of the object when viewed in the -Z direction or from the -Z side) is referred to as the "lower surface." In the embodiments described below, "orthogonal" includes a difference of within ±5° between two lines, surfaces, etc., relative to 90°.

[0010] Furthermore, in this disclosure, unless otherwise specified, polygons such as rectangles are referred to as polygons, including shapes in which the corners of the polygon have been processed, such as rounded, chamfered, or corner-removed. Shapes in which processing has been applied not only to the corners (i.e., the edges of the sides), but also to the middle portions of the sides, are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygon as a base are included in the interpretation of "polygon" described in this disclosure.

[0011] The same applies to terms that represent specific shapes, such as trapezoids, circles, and irregular shapes, as well as polygons. The same also applies to terms that refer to the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed parts.

[0012] Furthermore, "covering" is not limited to direct contact, but also includes indirect covering, for example, via another member. Furthermore, "placing" is not limited to direct contact, but also includes indirect placing, for example, via another member.

[0013] [Embodiment] An example of the overall configuration of a light emitting device 1 according to an embodiment will be described with reference to FIGS. 1 to 4B. FIG. 1 is a top view schematically showing the light emitting device 1 according to an embodiment. FIG. 2 is a top view schematically showing the light emitting device 1 in a state in which the sealing member 50 is omitted. FIG. 3 is a cross-sectional view schematically showing the light emitting device 1 taken along line III-III in FIG. 1. FIG. 4A is a cross-sectional view schematically showing an example of a conductive first wire 40 according to a reference example that has been deformed due to thermal expansion of the sealing member 50. FIG. 4B is a cross-sectional view schematically showing an example of a conductive first wire 40 according to an embodiment that has been deformed due to thermal expansion of the sealing member 50.

[0014] 1 to 3, the light emitting device 1 includes a substrate 10, a first element 20, a second element 30, a conductive first wire 40, and a sealing member 50. The light emitting device 1 may also include a conductive second wire 60, a conductive third wire 70, and a conductive fourth wire 80.

[0015] <Substrate 10> The substrate 10 has an upper surface 10a, a lower surface 10b located opposite the upper surface 10a, and an outer surface 10c located between the upper surface 10a and the lower surface 10b. The outer surface 10c forms the outer edge of the substrate 10. In the example shown in FIG. 2, the substrate 10 has a substantially rectangular shape when viewed from above. However, the shape of the substrate 10 when viewed from above is not limited to a substantially rectangular shape. The shape of the substrate 10 when viewed from above may also be a substantially circular shape, a substantially elliptical shape, or a substantially polygonal shape other than a rectangle.

[0016] The substrate 10 has a recess 11. That is, the substrate 10 has a bottom surface 10d and an inner surface 10e that define the recess 11. The bottom surface 10d is located below (toward the -Z side) the top surface 10a and above (toward the +Z side) the bottom surface 10b. The inner surface 10e is located between the top surface 10a and the bottom surface 10d, and connects the top surface 10a and the bottom surface 10d. The first element 20 and the second element 30 are each disposed on the bottom surface 10d that defines the recess 11. The recess 11 opens at the top surface 10a of the substrate 10 and is recessed downward (toward the -Z side).

[0017] The substrate 10 has a conductive member 12 and an insulating base material 13. The conductive member 12 is electrically connected to an external power supply. The conductive member 12 includes a first conductive portion 121 and a second conductive portion 122. In the example shown in FIGS. 1 to 3, the first conductive portion 121 and the second conductive portion 122 are leads.

[0018] Examples of materials constituting the first conductive portion 121 and the second conductive portion 122 include metal materials such as copper, aluminum, gold, silver, tungsten, iron, and nickel, alloy materials such as iron-nickel alloys and phosphor bronze, and clad materials. The first conductive portion 121 and the second conductive portion 122 may have a conductive thin film on their surfaces that is composed of at least one of silver, aluminum, nickel, palladium, gold, and alloys thereof. The conductive thin film may have a single-layer structure or a multilayer structure. The conductive member 12 may further include one or more conductive portions different from the first conductive portion 121 and the second conductive portion 122.

[0019] 2 and 3, the first conductive portion 121 and the second conductive portion 122 are each disposed on the bottom surface 10d that defines the recess 11. The upper surface of the first conductive portion 121 and the upper surface of the second conductive portion 122 are exposed from the base material 13 at the bottom surface 10d of the substrate 10. That is, the upper surfaces of the first conductive portion 121 and the second conductive portion 122 constitute part of the bottom surface 10d of the substrate 10. The lower surface of the first conductive portion 121 and the lower surface of the second conductive portion 122 are exposed from the base material 13 at the lower surface 10b of the substrate 10. That is, the lower surface of the first conductive portion 121 and the lower surface of the second conductive portion 122 constitute part of the lower surface 10b of the substrate 10.

[0020] The substrate 13 supports the conductive member 12. In the example shown in FIG. 3 , the substrate 13 has a base 131 and a wall 132. The base 131 is located below (on the -Z side) the upper surface of the conductive member 12, and the wall 132 is located above (on the +Z side) the upper surface of the conductive member 12. The wall 132 is disposed on the upper surfaces of the first conductive portion 121 and the second conductive portion 122. The wall 132 is disposed in a frame shape when viewed from above. The upper surface of the base 131 constitutes a part of the bottom surface 10d that defines the recess 11 in the substrate 10. The lower surface of the base 131 constitutes a part of the lower surface 10b of the substrate 10. The outer surface of the base 131 and the outer surface of the wall 132 constitute the outer surface 10c of the substrate 10. The inner surface of the wall 132 constitutes the inner surface 10e of the substrate 10.

[0021] An example of a material constituting the substrate 13 is a thermosetting resin. Examples of thermosetting resins include epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin. The substrate 13 may contain light-reflective particles in addition to an insulating material such as a thermosetting resin. Examples of light-reflective particles include inorganic particles such as titanium oxide, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, barium titanate, zinc oxide, silicon nitride, aluminum nitride, boron nitride, calcium carbonate, calcium hydroxide, and calcium silicate.

[0022] <First element 20> The first element 20 is a light-emitting element such as an LED (Light Emitting Diode). However, the first element 20 may be an electronic component other than a light-emitting element. Furthermore, the first element 20 may be a protection element such as a Zener diode if the second element 30 described below is a light-emitting element.

[0023] The first element 20 has a first upper surface 21, a first lower surface 22, and one or more side surfaces including a first side surface 23. The first element 20 has four side surfaces including the first side surface 23. The first element 20 is disposed on a first conductive portion 121.

[0024] The first element 20 includes an electrode 25 and an electrode 26 disposed on the first upper surface 21. The electrodes 25 and 26 have opposite polarities. The electrode 25 is electrically connected to the first conductive portion 121 via a third wire 70. The electrode 26 is electrically connected to the second conductive portion 122 via a first wire 40.

[0025] The first side surface 23 is located between the first upper surface 21 and the first lower surface 22 located on the opposite side of the first upper surface 21. The first side surface 23 is a side surface located on the second element 30 side. In the example shown in FIG. 3, the first side surface 23 is a vertical surface that is perpendicular to the first lower surface 22.

[0026] The side surfaces of first element 20 other than first side surface 23 may be vertical surfaces that are perpendicular to first lower surface 22 or may be inclined surfaces that are inclined relative to first lower surface 22.

[0027] When the first element 20 is a light-emitting element, the first element 20 includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer. The first semiconductor layer, the light-emitting layer, and the second semiconductor layer are configured as a stacked body. The first element 20 includes an element substrate that supports the stacked body. The element substrate is made of an insulating material such as sapphire, spinel, or glass. The element substrate is located on the first lower surface 22 side of the first element 20.

[0028] The first semiconductor layer and the second semiconductor layer have different conductivity types. For example, when the first semiconductor layer is an n-type semiconductor layer, the second semiconductor layer is a p-type semiconductor layer. When the first semiconductor layer is a p-type semiconductor layer, the second semiconductor layer is an n-type semiconductor layer. One of the first semiconductor layer and the second semiconductor layer is electrically connected to electrode 25. The other of the first semiconductor layer and the second semiconductor layer is electrically connected to electrode 26. The light emitting layer may have a single quantum well (SQW) structure, or may have a multi quantum well (MQW) structure including multiple well layers.

[0029] Each of the first semiconductor layer, the light emitting layer, and the second semiconductor layer may be a semiconductor layer made of a nitride semiconductor. x Al y Ga 1-x-y The term "light-emitting layer" includes semiconductors of all compositions in which the composition ratios x and y in the chemical formula N (0≦x, 0≦y, x+y≦1) are varied within the respective ranges. The emission peak wavelength of the light-emitting layer can be appropriately selected depending on the purpose. The light-emitting layer is configured to be able to emit, for example, visible light or ultraviolet light.

[0030] When a structure including the first semiconductor layer, the light emitting layer, and the second semiconductor layer is one laminate, the first element 20 may include a plurality of laminates. In this case, for example, the plurality of laminates may be stacked in order in the Z-axis direction. The plurality of light emitting layers included in each of the plurality of laminates may include well layers having different emission peak wavelengths, or may include well layers having the same emission peak wavelength.

[0031] The combination of emission peak wavelengths of the multiple laminates can be selected as appropriate. For example, when the first element 20 includes two laminates, the combination of light emitted by the light-emitting layers of the respective laminates can be blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, ultraviolet light and blue light, blue light and green light, blue light and red light, or green light and red light. For example, when the first element 20 includes three laminates, the combination of light emitted by the light-emitting layers of the respective laminates can be blue light, green light, and red light.

[0032] <Second element 30> 2 and 3, the second element 30 is a light-emitting element such as an LED. However, the second element 30 may be an electronic component other than a light-emitting element. Furthermore, if the first element 20 is a light-emitting element, the second element 30 may be a protective element such as a Zener diode, or a structure made of glass or the like. In the example shown in FIG. 3, the second element 30 is a structure that covers the upper side (+Z side) of the first wire 40 and the lateral sides in a direction from one end 41 to the other end 42 of the first wire 40 in a top view (+X direction), but does not cover the lateral sides in directions (+Y direction and −Y direction) perpendicular to the direction from one end 41 to the other end 42 of the first wire 40 in a top view. However, without being limited thereto, the second element 30 may be a structure having a recess that can cover the upper side of the first wire 40, the lateral sides in a direction from one end 41 to the other end 42 of the first wire 40 in a top view (+X direction), and the lateral sides in directions (+Y direction and −Y direction) perpendicular to the direction from one end 41 to the other end 42 of the first wire 40 in a top view. Alternatively, the second element 30 may be a structure having a recess that covers the upper side of the first wire 40 and the lateral sides in directions (+Y direction and −Y direction) perpendicular to the direction from one end 41 to the other end 42 of the first wire 40 in a top view, but does not cover the lateral sides in a direction from one end 41 to the other end 42 of the first wire 40 in a top view (+X direction).

[0033] The second element 30 is spaced apart from the first element 20. The second element 30 has a second upper surface 31, a second lower surface 32, and two or more side surfaces including a second side surface 33 and a third side surface 34. In the example shown in Figures 2 and 3, the second element 30 has four side surfaces including the second side surface 33 and the third side surface 34.

[0034] In the example shown in FIGS. 2 and 3, the second element 30 is disposed on the second conductive portion 122. However, the second element 30 may also be disposed on the first conductive portion 121. Furthermore, in the example shown in FIGS. 2 and 3, the first element 20 and the second element 30 are disposed on different conductive portions. However, this is not limited thereto, and the first element 20 and the second element 30 may also be disposed on the same conductive portion. In other words, the first element 20 and the second element 30 may be disposed on the first conductive portion 121 or the second conductive portion 122.

[0035] When the first element 20 is disposed on the first conductive portion 121 or the second conductive portion 122, an adhesive member can be disposed between the first element 20 and the first conductive portion 121 or the second conductive portion 122. Similarly, when the second element 30 is disposed on the first conductive portion 121 or the second conductive portion 122, an adhesive member can be disposed between the second element 30 and the first conductive portion 121 or the second conductive portion 122. Examples of the adhesive member include resin and a solder material such as a gold-tin alloy. The adhesive member that adheres the first element 20 may or may not extend beyond the outer edge of the first element 20. Similarly, the adhesive member that adheres the second element 30 may or may not extend beyond the outer edge of the second element 30.

[0036] The second element 30 includes an electrode 35 and an electrode 36 disposed on the second upper surface 31. The electrodes 35 and 36 have opposite polarities. The electrode 35 is electrically connected to the first conductive portion 121 via a fourth wire 80. The electrode 36 is electrically connected to the second conductive portion 122 via a second wire 60.

[0037] 2, the electrode 35 arranged on the second upper surface 31 overlaps with the second side surface 33 in top view. However, this is not limiting, and the electrode 35 arranged on the second upper surface 31 does not have to overlap with the second side surface 33 in top view.

[0038] The electrodes 35 and 36 do not necessarily have to be arranged on the second upper surface 31 of the second element 30, but may also be arranged on the second lower surface 32 side of the second element 30. When the electrodes 35 and 36 are arranged on the second lower surface 32 side, one of the electrodes 35 and 36 is arranged, for example, on the second conductive portion 122 of the conductive member 12, and the other of the electrodes 35 and 36 is arranged, for example, on a conductive portion of the conductive member 12 that is different from the first conductive portion 121 and the second conductive portion 122.

[0039] The second side surface 33 is located between the second upper surface 31 and the second lower surface 32 located on the opposite side of the second upper surface 31. The second side surface 33 faces the first side surface 23 of the first element 20. Here, "facing" refers to a state in which, in a top view, the upper end of the first side surface 23 of the first element 20 and the upper end 331 of the second side surface 33 of the second element 30 are parallel to and face each other, and also includes a state in which, in a top view, a perpendicular line drawn from the upper end of the first side surface 23 reaches the upper end 331 of the second side surface 33, and a perpendicular line drawn from the upper end 331 of the second side surface 33 reaches the upper end of the first side surface 23.

[0040] An upper end 331 of the second side surface 33 is located closer to the first side surface 23 than a lower end 332 of the second side surface 33. In the example shown in FIG. 3 , the second side surface 33 is configured as an inclined surface that is inclined so that the upper end 331 is closer to the first side surface 23 than the lower end 332. The inclination angle α of the second side surface 33 with respect to the upper surface of the second conductive portion 122 is, for example, 45 degrees. However, the region of the second side surface 33 on the upper end 331 side may be configured as a vertical surface perpendicular to the second lower surface 32, and the region of the lower end 332 side may be configured as an inclined surface. Instead of an inclined surface, the second side surface 33 may be configured as a convex or concave curved surface, or may be configured as one or more step portions, or may be configured as a surface that combines these.

[0041] 3, the upper end 331 of the second side surface 33 is located closest to the first side surface 23. However, this is not limiting, and the area of ​​the second side surface 33 other than the upper end 331 and the lower end 332 of the second side surface 33 may be located closest to the first side surface 23.

[0042] The third side surface 34 is located between the second upper surface 31 and the second lower surface 32. For example, in the third side surface 34, an upper end 341 of the third side surface 34 is located closer to the second side surface 33 than a lower end 342 of the third side surface 34. In the example shown in FIG. 3 , the third side surface 34 is configured as an inclined surface that is inclined so that the upper end 341 is closer to the second side surface 33 than the lower end 342. However, like the second side surface 33, the third side surface 34 may be configured such that the region on the upper end 331 side is configured as a vertical surface perpendicular to the second lower surface 32, and the region on the lower end 332 side is configured as an inclined surface. Furthermore, instead of an inclined surface, the third side surface 34 may be configured as a convex or concave curved surface, or may be configured as one or more step portions, or may be configured as a surface that combines these.

[0043] 2, the other side surfaces of the second element 30 other than the second side surface 33 and the third side surface 34 are formed as vertical surfaces perpendicular to the second lower surface 32. However, the other side surfaces of the second element 30 other than the second side surface 33 and the third side surface 34 may be formed in the same shape as the second side surface 33 or the third side surface 34.

[0044] When the second element 30 is a light-emitting element, the second element 30 includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer. The first semiconductor layer, the light-emitting layer, and the second semiconductor layer are configured as a stacked body. The second element 30 includes an element substrate that supports the stacked body. The element substrate is made of an insulating material such as sapphire, spinel, or glass. The element substrate is located on the second lower surface 32 side of the second element 30.

[0045] One of the first semiconductor layer and the second semiconductor layer is electrically connected to an electrode 35. The other of the first semiconductor layer and the second semiconductor layer is electrically connected to an electrode 36. When each of the first element 20 and the second element 30 is a light-emitting element, the emission peak wavelength of light emitted by the second element 30 may be the same as or different from the emission peak wavelength of light emitted by the first element 20.

[0046] <Sealing member 50> 1 and 3, the sealing member 50 is disposed in the recess 11 of the substrate 10. The sealing member 50 seals the first element 20, the second element 30, the conductive member 12, and the first wire 40. The sealing member 50 also seals the second wire 60, the third wire 70, and the fourth wire 80.

[0047] The sealing member 50 contains, as a main component, a thermosetting resin such as epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, or urethane resin. The sealing member 50 is preferably hard in order to protect the components it seals. Furthermore, the sealing member 50 is preferably made of a resin that has excellent heat resistance, weather resistance, and light resistance. The linear expansion coefficient of the sealing member 50 is, for example, 200 ppm / °C or more and 300 ppm / °C or less. The sealing member 50 may contain a wavelength converting material.

[0048] For example, a phosphor can be used as the wavelength conversion material. For example, an yttrium-aluminum-garnet phosphor (e.g., Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate phosphors (e.g., Ca8MgSiO 16 Cl2:Eu), β-sialon phosphors (e.g., (Si,Al)3(O,N)4:Eu), α-sialon phosphors (e.g., Ca(Si,Al) 12 (O,N) 16:Eu), SLA-based phosphors (e.g., SrLiAlN:Eu), CASN-based phosphors (e.g., CaAlSiN:Eu), or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN:Eu); fluoride-based phosphors such as KSF-based phosphors (e.g., KSiF:Mn), KSAF-based phosphors (e.g., K(Si,Al)F:Mn), or MGF-based phosphors (e.g., 3.5MgO·0.5MgF·GeO:Mn); phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)); or quantum dot phosphors (e.g., CdSe, InP, AgInS, or AgInSe).

[0049] <First wire 40> The first wire 40 electrically connects the first element 20 and the second conductive portion 122. As shown in FIGS. 2 and 3 , the first wire 40 has one end 41 and the other end 42. The one end 41 of the first wire 40 is connected to the electrode 26 of the first element 20. The other end 42 of the first wire 40 is connected to the first region 122a of the second conductive portion 122. The first region 122a of the second conductive portion 122 is located between the first lower surface 22 of the first element 20 and the second lower surface 32 of the second element 30 in a top view. Furthermore, the other end 42 of the first wire 40 overlaps the second side surface 33 of the second element 30 in a top view.

[0050] Gold can be used as the material forming the first wire 40. The linear expansion coefficient of the first wire 40 made of gold is approximately 14 ppm / °C. Because the linear expansion coefficient of the first wire 40 is smaller than the linear expansion coefficient of the sealing member 50, the first wire 40 may be deformed when subjected to stress caused by thermal expansion of the sealing member 50.

[0051] The first wire 40 can be connected using a known wire bonding method. For example, the first wire 40 is connected by first bonding to the electrode 25 disposed on the first upper surface 21 of the first element 20, and then by second bonding to the first region 122a of the second conductive portion 122. One end 41 of the first wire 40 has a squashed ball shape. The other end 42 of the first wire 40 has a shape in which the thickness of the first wire 40 decreases toward the tip (i.e., in the direction away from the one end 41). The second wire 60, third wire 70, and fourth wire 80, which will be described later, can also be connected using a similar method. In addition, to reduce the possibility of breakage of the other end 42 of the first wire 40, a metal bump made of gold can be disposed on the other end of the first wire 40. Similarly, a metal bump made of gold can be disposed on the other end of each of the second wire 60, third wire 70, and fourth wire 80.

[0052] The first wire 40 is sealed in the sealing member 50 with one end 41 connected to the first element 20 and the other end 42 connected to the second conductive portion 122. When a current is supplied to the first element 20 from an external power source, if the first element 20 is a light-emitting element, the first element 20 emits light and generates heat. The heat from the first element 20 is transferred to the sealing member 50, causing the sealing member 50 to thermally expand. For this reason, there is a risk that the first wire 40 will be deformed due to stress caused by the thermal expansion of the sealing member 50 (i.e., a force exerted by the sealing member 50 to push the first wire 40 upward (towards the +Z side)).

[0053] 3, an upper (+Z side) region of the sealing member 50 is exposed from the substrate 10, and regions other than the upper (+Z side) region of the sealing member 50 (i.e., the +X side region, -X side region, +Y side region, -Y side region, and -Z side region of the sealing member 50) are covered by the substrate 10. Therefore, when the sealing member 50 thermally expands, the sealing member 50 expands in a direction in which expansion is not restricted by the substrate 10 (i.e., upward (+Z side)).

[0054] 4A and 4B, an example of the difference in the effect of thermal expansion of the sealing member 50 on the first wire 40 will be described for the light emitting devices of the reference example and the embodiment. In Fig. 4A and 4B, the first wire 40 before the thermal expansion of the sealing member 50 is indicated by a dashed line, and the first wire 40 after the thermal expansion of the sealing member 50 is indicated by a solid line.

[0055] As shown in FIG. 4A, in the light emitting device of the reference example, the second side surface 33R of the second element 30 is a vertical surface perpendicular to the second lower surface 32. Therefore, the upward thermal expansion (toward the +Z side) of the sealing member 50 covering the other end 42 of the first wire 40X is not restricted by the second side surface 33R. Therefore, as shown by the solid line in FIG. 4A, in the region on the other end 42 side of the first wire 40X, the first wire 40 is deformed upward (toward the +Z side) due to stress caused by the thermal expansion of the sealing member 50. At this time, the inclination angle of the other end 42 side of the first wire 40 (the angle indicated by the symbol θR in FIG. 4A) becomes large.

[0056] In contrast, as shown in FIG. 4B , in the light emitting device 1 according to the embodiment, the second side surface 33 of the second element 30 is an inclined surface that is inclined with respect to the second lower surface 32. Furthermore, the second side surface 33 overlaps the other end 42 of the first wire 40 in a top view. Therefore, the upward (+Z side) thermal expansion of the sealing member 50 covering the other end 42 of the first wire 40 is restricted by the second side surface 33. This reduces the stress caused by the thermal expansion of the sealing member 50 from being applied to the region of the other end 42 of the first wire 40, as shown in FIG. 4B , thereby reducing the upward (+Z side) deformation of the first wire 40. At this time, the region of the other end 42 of the first wire 40 on the side of the other end 42 of the first wire 40 can be prevented from becoming too large in the inclination angle (the angle indicated by θ1 in FIG. 4B ) of the other end 42 side of the first wire 40.

[0057] As shown in Figures 4A and 4B, the amount of deformation of the first wire 40 before and after thermal expansion of the sealing member 50 is reduced compared to the amount of deformation of the first wire 40X of the reference example, thereby reducing the possibility of the first wire 40 breaking or peeling off.

[0058] Furthermore, in the light emitting device 1, the amount of deformation of the first wire 40 due to thermal expansion of the sealing member 50 is reduced, and therefore, even if the sealing member 50 repeatedly thermally expands and contracts in response to repeated supply and stop of current to the first element 20, the possibility of the first wire 40 breaking or peeling off can be reduced. This improves the reliability of the light emitting device 1.

[0059] As shown in FIG. 1 , the sealing member 50 is surrounded by the base material 13. Therefore, when heat is applied to the sealing member 50, the sealing member 50 thermally expands upward (toward the +Z side), with the thermal expansion of the central region 50a of the sealing member 50 being greater than the thermal expansion of the peripheral region 50b. The other end 42 of the first wire 40 is located in the central region 50a of the sealing member 50 in a top view. Therefore, the region of the other end 42 of the first wire 40 is subject to a large stress due to the thermal expansion of the sealing member 50, and is more likely to deform upward (toward the +Z side). Therefore, according to the light-emitting device 1, the other end 42 of the first wire 40 overlaps with the second side surface 33 in a top view. Therefore, the thermal expansion of the sealing member 50 covering the other end 42 of the first wire 40 in the upward direction (toward the +Z side) is limited by the second side surface 33. This reduces the stress caused by thermal expansion of the sealing member 50 from being applied to the area of ​​the other end 42 of the first wire 40, thereby reducing the deformation of the area of ​​the other end 42 of the first wire 40 upward (towards the +Z side).

[0060] When the other end 42 of the first wire 40 is positioned in the central region 50a of the sealing member 50 when viewed from above, the first region 122a of the second conductive part 122 connected to the other end 42 of the first wire 40 is located closer to the center when viewed from above than the second region 122b, which will be described separately.

[0061] As shown in FIG. 3 , the vertex 40t between the one end 41 and the other end 42 of the first wire 40 is preferably located closer to the one end 41 than the midpoint 40c that bisects the first wire 40 in a top view. This allows the other end 42 of the first wire 40 to be connected to the first conductive portion 121 side of the second conductive portion 122, thereby shortening the length of the first wire 40 in the +X direction. As a result, the distance between the first element 20 and the second element 30 can be shortened, thereby reducing the size of the light-emitting device 1. Furthermore, the inclination angle θ1 of the other end 42 side relative to the first region 122a can be made smaller than the inclination angle α of the second side surface 33 of the second element 30. This reduces the possibility of contact between the first wire 40 and the second element 30. Furthermore, since the vertex 40t of the first wire 40 is located closer to the one end 41 than the midpoint 40c, the inclination angle of the other end 42 side relative to the first region 122a can be made smaller than the inclination angle of the one end 41 side relative to the first upper surface 21 of the first element 20. This reduces the volume of the sealing member 50 present below (on the -Z side) the portion of the first wire 40 on the other end 42 side. As a result, it is possible to reduce upward (on the +Z side) deformation of the region of the first wire 40 on the other end 42 side due to stress caused by thermal expansion of the sealing member 50. Furthermore, it is possible to reduce the possibility that the first wire 40 will come into contact with the second side surface 33 of the second element 30.

[0062] <Second wire 60> The second wire 60 electrically connects the second element 30 and the second conductive portion 122. As shown in Figures 2 and 3, the second wire 60 has one end 61 and the other end 62. The one end 61 of the second wire 60 is connected to the electrode 36 of the second element 30.

[0063] The other end 62 of the second wire 60 is connected to the second region 122b of the second conductive portion 122. As shown in Figures 2 and 3, the second region 122b of the second conductive portion 122 is located on the third side surface 34 side of the second element 30 in top view. In other words, the second region 122b of the second conductive portion 122 is located outside the third side surface 34 (i.e., on the +X side) in top view.

[0064] 3, the second wire 60 is connected to the electrode 36 arranged on the second upper surface 31 of the second element 30 by first bonding, and then to the first region 122a of the second conductive portion 122 by second bonding. One end 61 of the second wire 60 has the same shape as the one end 41 of the first wire 40. The other end 62 of the second wire 60 has the same shape as the other end 42 of the first wire 40.

[0065] 3, the upper end 341 of the third side surface 34 is located closer to the second side surface 33 than the lower end 342 of the third side surface 34. Therefore, even if the other end 62 of the second wire 60 is brought closer to the third side surface 34, the inclination angle of the other end 62 of the second wire 60 with respect to the second region 122b of the second conductive portion 122 can be maintained small. This reduces the stress generated in the other end 62 when the second wire 60 is connected, and also reduces the length of the second wire 60 in the +X direction. As a result, the reliability of the light emitting device 1 can be improved, and the light emitting device 1 can be made smaller.

[0066] <Third wire 70> The third wire 70 electrically connects the first element 20 and the first conductive portion 121. As shown in FIGS. 2 and 3 , the third wire 70 has one end 71 and the other end 72. The one end 71 of the third wire 70 is connected to the electrode 25 of the first element 20.

[0067] 2 and 3, the other end 72 of the third wire 70 is located outside (i.e., on the -X side) of the side surface 24 of the first element 20 in top view. The side surface 24 is one of the side surfaces of the first element 20 that is located opposite the first side surface 23.

[0068] 3, the third wire 70 is connected to the electrode 25 disposed on the first upper surface 21 of the first element 20 by first bonding, and then to the first conductive portion 121 by second bonding. One end 71 of the third wire 70 has the same shape as the one end 41 of the first wire 40. The other end 72 of the third wire 70 has the same shape as the other end 42 of the first wire 40.

[0069] <4th wire 80> The fourth wire 80 electrically connects the second element 30 and the first conductive portion 121. As shown in Figures 2 and 3, the fourth wire 80 has one end 81 and the other end 82. The one end 81 of the fourth wire 80 is connected to, for example, the electrode 35 of the second element 30.

[0070] The other end 82 of the fourth wire 80 is connected to the first conductive portion 121. In the example shown in FIGS. 2 and 3 , the other end 82 of the fourth wire 80 is disposed near the inner surface 10e of the substrate 10. The other end 82 of the fourth wire 80 is located in the outer circumferential region 50b of the sealing member 50 in a top view. The outer circumferential region 50b of the sealing member 50 tends to be less susceptible to thermal expansion than the central region 50a of the sealing member 50 in a top view. By disposing the other end 82 of the fourth wire 80 in the outer circumferential region 50b of the sealing member 50, which is relatively less susceptible to thermal expansion, it is possible to reduce the stress caused by thermal expansion of the sealing member 50 from being applied to the region on the other end 82 side of the fourth wire 80. This reduces upward (to the +Z side) deformation of the region on the other end 82 side of the fourth wire 80. As a result, it is possible to reduce the possibility of the fourth wire 80 breaking or peeling off.

[0071] [Variation 1] Next, a light emitting device 1A according to Modification 1 of the embodiment will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a top view schematically showing the light emitting device 1A according to Modification 1 of the embodiment. The sealing member 50 is omitted in Fig. 5. Fig. 6 is a cross-sectional view schematically showing the light emitting device 1A taken along line VI-VI in Fig. 5. Note that in Modification 1, components similar to those in the embodiment are given the same reference numerals, and descriptions thereof may be omitted as appropriate.

[0072] In the light emitting device 1A according to the first modification, similarly to the light emitting device 1, the other end 42 of the first wire 40 overlaps the second side surface 33 of the second element 30 in a top view, and therefore the thermal expansion of the sealing member 50 covering the other end 42 of the first wire 40 in the upward direction (toward the +Z side) is restricted by the second side surface 33, thereby reducing deformation of the first wire 40. This improves the reliability of the light emitting device 1A.

[0073] 5 and 6, in the light emitting device 1A according to the first modification, the lower end 232 of the first side surface 23 of the first element 20 is located closer to the second side surface 33 of the second element 30 than the upper end 231 of the first side surface 23. This allows the first element 20 to be disposed closer to the second element 30 while keeping the first wire 40 out of contact with the first side surface 23. As a result, the light emitting device 1A can be made smaller.

[0074] The first side surface 23 is configured as an inclined surface that is inclined so that the lower end 232 is closer to the second side surface 33 than the upper end 231. However, like the second side surface 33, the region of the first side surface 23 on the upper end 231 side may be configured as a vertical surface that is perpendicular to the first lower surface 22, and the region on the lower end 232 side may be configured as an inclined surface. Furthermore, instead of an inclined surface, the first side surface 23 may be configured as a convex or concave curved surface, or may be configured as one or more step portions, or may be configured as a surface that combines these.

[0075] [Variation 2] Next, a light emitting device 1B according to Modification 2 of the embodiment will be described with reference to Figs. 7 and 8. Fig. 7 is a top view schematically showing the light emitting device 1B according to Modification 2 of the embodiment. The sealing member 50 is omitted in Fig. 7. Fig. 8 is a cross-sectional view schematically showing the light emitting device 1B taken along line VIII-VIII in Fig. 7. Note that in Modification 2, components similar to those in the embodiment and Modification 1 are given the same reference numerals, and descriptions thereof may be omitted as appropriate.

[0076] In light emitting device 1B according to Modification 2, similarly to the light emitting devices of the embodiment and Modification 1, the other end 42 of first wire 40 overlaps with second side surface 33 of second element 30 in top view, and therefore the upward thermal expansion (toward the +Z side) of sealing member 50 covering the other end 42 of first wire 40 is restricted by second side surface 33, thereby reducing deformation of first wire 40. This improves the reliability of light emitting device 1B.

[0077] 8, in the light emitting device 1B according to the second modification, the second upper surface 31 of the second element 30 is located higher than the first upper surface 21 of the first element 20. Here, "located higher" means located relatively higher (on the +Z side) with respect to the lower surface 10b of the substrate 10.

[0078] Since the second top surface 31 of the second element 30 is located higher than the first top surface 21 of the first element 20, the area of ​​the first wire 40 covered by the second side surface 33 of the second element 30 can be increased compared to when the second top surface 31 of the second element 30 is located at the same position as the first top surface 21 of the first element 20. In other words, the sealing member 50 located below (on the -Z side of) the second side surface 33 of the second element 30 and covering the first wire 40 can be increased. As a result, upward deformation (on the +Z side) of the first wire 40 is further reduced.

[0079] When the first element 20 and the second element 30 are each a light-emitting element, the second upper surface 31 of the second element 30 is positioned higher than the first upper surface 21 of the first element 20, thereby shortening the distance between the first upper surface 21 of the first element 20 and the second upper surface 31 of the second element 30 in a top view. As a result, when the emission color of the light emitted from the first upper surface 21 of the first element 20 is different from the emission color of the light emitted from the second upper surface 31 of the second element 30, the color mixing ability of the light emitted from the first upper surface 21 of the first element 20 and the light emitted from the second upper surface 31 of the second element 30 can be improved.

[0080] 8, the thickness of the second element 30 is made thicker than the thickness of the first element 20, so that the second upper surface 31 of the second element 30 is positioned higher than the first upper surface 21 of the first element 20. However, the thickness of the second element 30 may be made the same as the thickness of the first element 20, and a support member may be disposed between the second element 30 and the bottom surface 10d of the substrate 10, so that the second upper surface 31 of the second element 30 is positioned higher than the first upper surface 21 of the first element 20.

[0081] As shown in FIGS. 7 and 8, the light emitting device 1B includes a third element 90. The third element 90 shown in FIGS. 7 and 8 is a light emitting element. The third element 90 is disposed on the side 24 of the first element 20, opposite the first side 23. The third element 90 has a third upper surface 91 and a third lower surface 92, and includes electrodes 93a and 93b disposed on the third upper surface 91. The electrodes 93a and 93b have opposite polarities. The light emitting device 1B also includes a conductive fifth wire 95 and a conductive sixth wire 96. The fifth wire 95 electrically connects the electrode 93a disposed on the third upper surface 91 of the third element 90 to the first conductive portion 121. The sixth wire 96 electrically connects the electrode 93b disposed on the third upper surface 91 of the third element 90 to the second conductive portion 122. The sealing member 50 seals the third element 90, the fifth wire 95, and the sixth wire 96.

[0082] Furthermore, in light emitting device 1B, the other end 72 of third wire 70 overlaps with side surface 94 of third element 90 on the first element 20 side in top view, and therefore the thermal expansion of sealing member 50 covering the other end 72 of third wire 70 in the upward direction (toward the +Z side) is restricted by side surface 94, thereby reducing deformation of third wire 70. This can further improve the reliability of light emitting device 1B.

[0083] [Variation 3] Next, a light emitting device 1C according to Modification 3 of the embodiment will be described with reference to Figs. 9 and 10. Fig. 9 is a top view schematically showing the light emitting device 1C according to Modification 3 of the embodiment. The sealing member 50C is omitted from Fig. 9. Fig. 10 is a cross-sectional view schematically showing the light emitting device 1C taken along line XX in Fig. 9. Note that in Modification 3, components similar to those in the embodiment and each modification are given the same reference numerals, and descriptions thereof may be omitted as appropriate.

[0084] The first element 20 shown in Figures 9 and 10 is a protective element (for example, a Zener diode). The first element 20, which is a protective element, has electrodes of opposite polarities, one electrode 27 arranged on the first upper surface 21 side and the other electrode arranged on the first lower surface 22 side. The second element 30 shown in Figures 9 and 10 is a light-emitting element. As shown in Figures 9 and 10, the light-emitting device 1C includes a third element 90, a fifth wire 95, and a sixth wire 96. The third element 90 shown in Figures 9 and 10 is a light-emitting element.

[0085] The light emitting device 1C includes a sealing member 50C having a light-transmitting portion 51 and a light-reflecting portion 52. Examples of materials constituting the light-transmitting portion 51 include the resins listed for the sealing member 50. The light-transmitting portion 51 may also contain a wavelength converting material. Examples of wavelength converting materials constituting the light-transmitting portion 51 include the wavelength converting materials listed for the sealing member 50. Examples of materials constituting the light-reflecting portion 52 include the resins listed for the sealing member 50. The light-reflecting portion 52 also contains a light-reflecting material such as titanium oxide. The resins used for the light-transmitting portion 51 and the light-reflecting portion 52 may be the same type of resin or different types of resin. By including a light-reflecting material, the light-reflecting portion 52 can have a higher hardness than the light-transmitting portion 51. This allows the light-reflecting portion 52 to be less deformed due to thermal expansion than the light-transmitting portion 51. As a result, the light-reflecting portion 52 covers the first wire 40, thereby reducing deformation of the light-reflecting portion 52.

[0086] In the example shown in FIG. 10 , a light-reflecting portion 52 is disposed on the bottom surface 10d defining the recess of the substrate 10, and a light-transmitting portion 51 is disposed on the light-reflecting portion 52. The light-reflecting portion 52 covers each side surface, including the first upper surface 21 and the first side surface 23, of the first element 20. The light-reflecting portion 52 also covers at least a portion of each side surface of the second element 30 and the third element 90. In this case, the upper surfaces of the second element 30 and the third element 90 are exposed through the light-reflecting portion 52. The light-reflecting portion 52 also covers the first wire 40. The upper surface of the light-reflecting portion 52 may be flat, may have an irregularity, or may have a centrally recessed or bulging shape. The light-transmitting portion 51 is disposed on the upper surface of the light-reflecting portion 52, the second upper surface 31 of the second element 30, and the third upper surface 91 of the third element 90. The upper surface of the light-transmitting portion 51 constitutes a portion of the upper surface of the light-emitting device 1C. It should be noted that the light reflecting portion 52 can cover only the first element 20 without covering the side surfaces of the second element and the third element.

[0087] In the light emitting device 1C according to Modification 3, similarly to the light emitting devices according to the embodiment, Modification 1, and Modification 2, the other end 42 of the first wire 40 overlaps the second side surface 33 of the second element 30 in a top view, and therefore the thermal expansion of the sealing member 50C covering the other end 42 of the first wire 40 in the upward direction (toward the +Z side) is restricted by the second side surface 33, thereby reducing deformation of the first wire 40. This improves the reliability of the light emitting device 1C.

[0088] The exterior of the first element 20, which is a protective element, has a color with high light absorption, such as black. By covering the first element 20 with the light reflecting portion 52, it is possible to reduce the possibility that part of the light emitted from the second element 30 and the third element 90 will be absorbed by the first element 20. Furthermore, by covering the first wire 40 with the light reflecting portion 52, it is possible to reduce the possibility that part of the light emitted from the second element 30 and the third element 90 will be absorbed by the first wire 40 and will not be emitted from the upper surface of the light emitting device 1C. These factors reduce the possibility that the light extraction efficiency of the light emitting device 1C will be impaired.

[0089] The substrate 10 may have a configuration in which a conductive member 12 is disposed on an insulating base material 13. In this case, the base material 13 may be made of ceramic such as aluminum oxide or aluminum nitride. The conductive member 12 may be made of gold, for example. The base material 13 may or may not have a wall portion.

[0090] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0091] Aspects of the present disclosure are, for example, as follows. <Item 1> A substrate having a recess, a conductive member including a first conductive portion and a second conductive portion arranged on a bottom surface defining the recess, and an insulating base material supporting the conductive member; a first element having a first upper surface on which an electrode is arranged, a first lower surface located opposite to the first upper surface, and a first side surface located between the first upper surface and the first lower surface; a second element spaced apart from the first element and having a second upper surface, a second lower surface opposite the second upper surface, and a second side surface between the second upper surface and the second lower surface and facing the first side surface; a conductive first wire having one end connected to the electrode of the first element and the other end connected to a first region of the second conductive portion located between the first lower surface and the second lower surface; a sealing member disposed in the recess and sealing the first element, the second element, the conductive member, and the first wire; an upper end of the second side surface is located closer to the first side surface than a lower end of the second side surface; The other end of the first wire overlaps with the second side surface in a top view. Light-emitting device. <Item 2> The second element has an electrode disposed on the second upper surface, a third side surface located between the second upper surface and the second lower surface and opposite the second side surface; the second conductive portion has a second region located on a third side surface side of the second element, an upper end of the third side surface is located closer to the second side surface than a lower end of the third side surface; a second conductive wire having one end connected to the electrode of the second element and the other end connected to the second region of the second conductive portion; Equipped with The light emitting device according to <Item 1>. <Item 3> When viewed from above, the first region is located closer to the center than the second region, The light emitting device according to <Item 2>. <Item 4> The first element is disposed on the first conductive portion, the second element is disposed on the second conductive portion. The light emitting device according to any one of <Item 1> to <Item 3>. <Item 5> The first element, the second element, the first conductive portion, and the second conductive portion are arranged on the insulating base material and spaced apart from each other. The light emitting device according to any one of <Item 1> to <Item 4>. <Item 6> The lower end of the first side surface is located closer to the second side surface than the upper end of the first side surface, The light emitting device according to any one of <Item 1> to <Item 5>. <Item 7> The second upper surface of the second element is located at a higher position than the first upper surface of the first element. The light emitting device according to any one of <Item 1> to <Item 6>. <Item 8> The first element and the second element are each a light-emitting element, The color of the light emitted from the first element is different from the color of the light emitted from the second element. The light emitting device according to <Item 7>. <Item 9> A vertex between the one end and the other end of the first wire is located on the one end side of a midpoint that bisects the first wire in a top view. The light emitting device according to any one of <Item 1> to <Item 8>. [Explanation of symbols]

[0092] 1, 1A, 1B, 1C Light-emitting device 10 Substrate 11 Recess 12 Conductive material 121 First conductive part 122 Second conductive part 122a 1st area 122b 2nd area 13 Base material 20 First element 21 1st top surface 22 1st bottom surface 23 First aspect 25,26 electrode 30 Second element 31 2nd top surface 32 2nd bottom surface 33 Second aspect 34 Third aspect 35,36 electrode 40 Conductive first wire 41 One end of a first conductive wire 42 the other end of the first conductive wire 50,50C Sealing member 51 Translucent part 52 Light reflecting part 60 Conductive second wire 70 Conductive third wire 80 Conductive fourth wire

Claims

1. a substrate including a conductive member having a recess, the conductive member including a first conductive portion and a second conductive portion disposed on a bottom surface defining the recess, and an insulating base material supporting the conductive member; a first element having a first upper surface on which an electrode is arranged, a first lower surface located opposite the first upper surface, and a first side surface located between the first upper surface and the first lower surface; a second element spaced apart from the first element and having a second upper surface, a second lower surface opposite the second upper surface, and a second side surface between the second upper surface and the second lower surface and facing the first side surface; a conductive first wire having one end connected to the electrode of the first element and the other end connected to a first region of the second conductive portion located between the first lower surface and the second lower surface; a sealing member disposed in the recess and sealing the first element, the second element, the conductive member, and the first wire; an upper end of the second side surface is located closer to the first side surface than a lower end of the second side surface; The other end of the first wire overlaps with the second side surface in a top view. Light-emitting device.

2. the second element has an electrode disposed on the second upper surface; a third side surface located between the second upper surface and the second lower surface and opposite the second side surface; the second conductive portion has a second region located on a third side surface side of the second element, an upper end of the third side surface is located closer to the second side surface than a lower end of the third side surface; a second conductive wire having one end connected to the electrode of the second element and the other end connected to the second region of the second conductive portion; Equipped with The light emitting device according to claim 1 .

3. When viewed from above, the first region is located closer to the center than the second region. The light emitting device according to claim 2 .

4. the first element is disposed on the first conductive portion; the second element is disposed on the second conductive portion; The light emitting device according to claim 1 or 2.

5. the first element, the second element, the first conductive portion, and the second conductive portion are disposed on the insulating base material and spaced apart from each other. The light emitting device according to claim 1 or 2.

6. a lower end of the first side surface is located closer to the second side surface than an upper end of the first side surface; The light emitting device according to claim 1 or 2.

7. the second upper surface of the second element is located at a higher position than the first upper surface of the first element; The light emitting device according to claim 1 or 2.

8. the first element and the second element are each a light-emitting element, The color of the light emitted from the first element is different from the color of the light emitted from the second element. The light emitting device according to claim 7 .

9. a vertex between the one end and the other end of the first wire is located closer to the one end than a midpoint that bisects the first wire in a top view; The light emitting device according to claim 1 or 2.

Images