Paste transfer apparatus and electronic component mounting apparatus

Abstract

To easily attach and detach a film forming squeegee.SOLUTION: A paste transfer device includes a transfer stage to which a paste to be transferred to an electronic component is supplied, a film-forming squeegee capable of forming a paste coating film on the transfer stage, and a squeegee fixing member to which the film-forming squeegee is attached, a position of the film-forming squeegee with respect to the squeegee fixing member is regulated by a position regulating member, at least one of the film-forming squeegee and the squeegee fixing member includes a magnetic body, and the film-forming squeegee and the squeegee fixing member are fixed by a magnetic force of the magnetic body.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a paste transfer device and an electronic component mounting machine. [Background technology]

[0002] In the electronic component mounting field, electronic component mounting machines are used that have the function of soldering electronic components to a substrate via solder bumps formed on the underside of the electronic components. In soldering, a paste (soldering bonding aid) such as flux or solder paste is supplied to the solder bumps, and then the solder bumps are landed on the electrodes of the substrate. For this reason, electronic component mounting machines are equipped with a paste transfer device that transfers the paste to the bumps. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-115477 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, the paste transfer device of Patent Document 1 is equipped with a film-forming squeegee that forms a paste coating. The film-forming squeegee requires periodic maintenance, so it is required to be easily detachable. However, the paste transfer device of Patent Document 1 does not take into consideration the ease of attaching and detaching the film-forming squeegee.

[0005] The present disclosure has been devised in view of the above-described conventional situation, and aims to enable easy attachment and detachment of a film deposition squeegee. [Means for solving the problem]

[0006] The present disclosure provides a paste transfer device comprising: a transfer stage to which paste for transfer to an electronic component is supplied; a film-forming squeegee capable of forming a paste coating on the transfer stage; and a squeegee fixing member to which the film-forming squeegee is attached; the position of the film-forming squeegee relative to the squeegee fixing member is regulated by a position regulating member; at least one of the film-forming squeegee and the squeegee fixing member comprises a magnetic body; and the film-forming squeegee and the squeegee fixing member are fixed by the magnetic force of the magnetic body.

[0007] The present disclosure also provides an electronic component mounting machine comprising: an electronic component supply unit that supplies electronic components; a mounting head that picks up electronic components from the electronic component supply unit and mounts them on a substrate; and a paste transfer device that transfers paste to the electronic components picked up by the mounting head, wherein the paste transfer device comprises: a transfer stage to which the paste is supplied; a film-forming squeegee that can form a paste coating on the transfer stage; and a squeegee fixing member to which the film-forming squeegee is attached, wherein the position of the film-forming squeegee relative to the squeegee fixing member is regulated by a position regulating member, at least one of the film-forming squeegee and the squeegee fixing member comprises a magnetic body, and the film-forming squeegee and the squeegee fixing member are fixed by the magnetic force of the magnetic body.

[0008] Any combination of the above components, and conversion of the expression of the present disclosure into a method, device, system, storage medium, computer program, etc., are also valid aspects of the present disclosure. [Effects of the Invention]

[0009] According to the present disclosure, it is possible to easily attach and detach the film-forming squeegee. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view of an electronic component mounter according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is a perspective view of a paste transfer device provided in an electronic component mounting machine according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a structural explanatory diagram of a paste transfer device provided in an electronic component mounting machine according to an embodiment of the present disclosure; [Figure 4] FIG. 1 is a perspective view of a transfer stage included in an electronic component mounter according to an embodiment of the present disclosure. [Figure 5] FIG. 10 is an explanatory diagram illustrating the operation of a paste transfer device provided in an electronic component mounting machine according to an embodiment of the present disclosure. [Figure 6] FIG. 1 is a side view including a partial cross section for illustrating a film-forming squeegee and a squeegee fixing member provided in an electronic component mounter according to an embodiment of the present disclosure. [Figure 7] FIG. 1 is a perspective view of a film-forming squeegee included in an electronic component mounter according to an embodiment of the present disclosure. [Figure 8] FIG. 1 is a perspective view of a film-forming squeegee included in an electronic component mounter according to an embodiment of the present disclosure. [Figure 9] FIG. 1 is a perspective view of a squeegee fixing member included in an electronic component mounter according to an embodiment of the present disclosure. [Figure 10] FIG. 1 is a side view including a partial cross section of a film-forming squeegee provided in an electronic component mounter according to an embodiment of the present disclosure. [Figure 11] FIG. 1 is a side view including a partial cross section of a squeegee fixing member provided in an electronic component mounter according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, with reference to the drawings as appropriate, detailed descriptions will be provided of specific embodiments of a paste transfer device and an electronic component mounting machine according to the present disclosure. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure and are not intended to limit the subject matter of the claims.

[0012] (Embodiment) First, the overall configuration of an electronic component mounter 1 according to an embodiment of the present disclosure will be described with reference to Fig. 1. Fig. 1 is a plan view of the electronic component mounter 1 according to an embodiment of the present disclosure. The electronic component mounter 1 has the function of mounting electronic components on a board, and a board transport mechanism 2 is disposed on a base 1a in the X direction, which is the board transport direction. The board transport mechanism 2 transports a board 3 that is the target of component mounting work.

[0013] Component supply units that supply electronic components are arranged on both sides of the substrate transport mechanism 2, and the electronic component supply unit 4A on one side has a plurality of tape feeders 6 that supply electronic components 5 (see FIG. 2) held on tape, and a paste transfer device 7 arranged in parallel. The paste transfer device 7 has the function of transferring paste P, which is a viscous fluid such as flux, onto the electronic components 5 picked up by the mounting head 11A described below. The electronic component supply unit 4B on the other side has a tray feeder 8 that supplies trays 8a containing tray components (not shown), which are large electronic components.

[0014] At one end of the base 1a in the X direction, a Y-axis table 9 is disposed in the Y direction perpendicular to the substrate transport mechanism 2. Two X-axis tables 10A and 10B are coupled to the Y-axis table 9 so as to be freely movable in the Y direction, and mounting heads 11A and 11B are attached to the X-axis tables 10A and 10B, respectively.

[0015] By driving the X-axis table 10A and the Y-axis table 9, the mounting head 11A uses a nozzle 11a (see FIG. 2) attached to its bottom to pick up electronic components 5 from the tape feeder 6 of the electronic component supply unit 4A, accesses the paste transfer device 7 for paste transfer, and transfers and mounts the electronic components 5 after paste transfer onto the substrate 3 positioned and held by the substrate conveying mechanism 2. That is, the mounting head 11A picks up electronic components 5 from the electronic component supply unit 4A and mounts them on the substrate 3. The X-axis table 10A and the Y-axis table 9 constitute a head moving means that moves the mounting head 11A to access the substrate 3 and the paste transfer device 7. Furthermore, by driving the X-axis table 10B and the Y-axis table 9, the mounting head 11B picks up tray components from the tray 8a held in the tray feeder 8 of the electronic component supply unit 4B and transfers and mounts them onto the substrate 3 positioned and held by the substrate conveying mechanism 2.

[0016] The X-axis tables 10A, 10B are equipped with board recognition cameras 12 that move integrally with the mounting heads 11A, 11B, and as the mounting heads 11A, 10B move above the board 3, the board recognition cameras 12 also move integrally to capture an image of the board 3. On the base 1a, between each of the electronic component supply units 4A, 4B and the board transport mechanism 2, a component recognition camera 13 and a nozzle stocker 14 are disposed.

[0017] The nozzle stocker 14 stores nozzles 11a to be attached to the mount heads 11A and 11B for multiple component types. By having the mount heads 11A and 11B access the nozzle stocker 14 and performing a predetermined nozzle replacement operation, the nozzles 11a of the mount heads 11A and 11B can be replaced according to the component type. By moving the mount head 11A holding the electronic component 5 relatively in the X direction above the component recognition camera 13, the component recognition camera 13 reads an image of the electronic component 5 from below, thereby recognizing the type and shape of the electronic component 5 held by the mount head 11A. When the mount head 11A mounts the electronic component 5, the mount position on the board 3 is corrected taking into account the board recognition results from the board recognition camera 12 and the component recognition results from the component recognition camera 13. The same applies when the mount head 11B mounts components for the tray.

[0018] Next, the structure of the paste transfer device 7 will be described with reference to FIGS. 2, 3, and 4. FIG. 2 is a perspective view of the paste transfer device 7 provided in the electronic component mounter 1 according to an embodiment of the present disclosure. FIG. 3 is a structural explanatory diagram of the paste transfer device 7 provided in the electronic component mounter 1 according to an embodiment of the present disclosure. FIG. 4 is a perspective view of a transfer stage 24 provided in the electronic component mounter 1 according to an embodiment of the present disclosure. FIG. 3(b) shows a cross section A in FIG. 3(a). As shown in FIG. 2, the paste transfer device 7 has a configuration in which the following components are provided on an elongated unit base 20. The unit base 20 is detachably attached to a feeder base 16 (see FIG. 3(a)) provided in the electronic component supply unit 4A with its longitudinal direction aligned in the Y direction, from the side opposite the access direction (arrow a) of the mounting head 11A. In this specification, the access side of the mounting head 11A is defined as the front side, and the opposite side is defined as the rear side.

[0019] 2 and 3, the paste transfer device 7 is provided with an engagement portion 20a for engaging with the feeder base 16 to fix the unit base portion 20, and furthermore, a handle 21 is provided protruding rearward from the engagement portion 20a. When attaching the paste transfer device 7 to the feeder base 16, the lower surface of the unit base portion 20 is aligned with the upper surface of the feeder base 16, and the handle 21 is grasped and pushed forward, whereby the engagement portion 20a engages with the rear end portion of the feeder base 16, and the unit base portion 20 is attached in the predetermined position.

[0020] A guide rail 22 is disposed in the longitudinal direction on the upper surface of the unit base part 20, and a slider 23 slidably fitted onto the guide rail 22 is fixed to the underside of the transfer stage 24. In Figures 3(a) and (b), a feed screw 26 is threaded into a nut 25 coupled to the underside of the transfer stage 24, and the feed screw 26 is driven to rotate by a motor 27 disposed on the rear end side of the unit base part 20. Therefore, by driving the motor 27, the transfer stage 24 reciprocates in the longitudinal direction (Y direction) on the upper surface of the unit base part 20.

[0021] That is, the guide rail 22, slider 23, nut 25, feed screw 26, and motor 27 constitute a stage driving means that moves the transfer stage 24 back and forth in the longitudinal direction relative to the unit base part 20. This stage driving means is covered with a safety cover 28 to ensure the safety of the operator.

[0022] In FIG. 4, the transfer stage 24 mainly comprises a rectangular plate-like base portion 30 having a smooth upper surface, and has a concave structure with sidewalls 31A rising from both longitudinal sides of the base portion 30 and sidewalls 31B rising from both widthwise sides of the base portion 30. The transfer stage 24 is supplied with paste P to be transferred to the electronic components 5, and the upper surface of the base portion 30 serves as a transfer surface 30a (see FIGS. 3(a) and 3(b)) for forming a coating of the paste P and transferring it to the electronic components 5. In FIG. 2, a transfer area 32 is defined at the front end of the transfer surface 30a, where a coating of the paste P is transferred to the electronic components 5 held by the mounting head 11A. The size of the transfer area 32 is set so that the paste P can be transferred simultaneously to multiple electronic components 5 held by multiple (eight in this embodiment) nozzles 11a of the mounting head 11A.

[0023] As shown in FIG. 3(a), a film-forming squeegee 37 and a scraping unit 34 are disposed above the transfer stage 24, behind the transfer area 32, in a position where they do not interfere with the mounting head 11A. Furthermore, a needle 35a of a paste supply syringe 35 is inserted between the film-forming squeegee 37 and the scraping unit 34. The paste supply syringe 35 and the needle 35a constitute a paste supply means that supplies paste P to the transfer stage 24. The film-forming squeegee 37 is configured as a squeegee member that extends downward and whose lower end maintains a coating film formation gap g1 between itself and the transfer surface 30a. The film-forming squeegee 37 is held by a squeegee fixing member 100 that is erected on the unit base 20, thereby fixing its horizontal position relative to the unit base 20.

[0024] A vertically disposed lifting member 43 is coupled to the squeegee fixing member 100, and a cam follower 44 is coupled to the lower end of the lifting member 43 that penetrates into the unit base portion 20. A motor 45 is disposed horizontally inside the unit base portion 20, and a disk cam 46 coupled to the rotary shaft of the motor 45 abuts against the cam follower 44. By driving and rotating the motor 45 in this state, the lifting member 43 moves up and down in accordance with the cam characteristics of the disk cam 46, and thereby the film deposition squeegee 37 moves up and down relative to the transfer surface 30a.

[0025] In other words, the lifting member 43, cam follower 44, motor 45 and disc cam 46 constitute a squeegee position adjustment means for adjusting the vertical position of the film-forming squeegee 37, and in the film-forming operation described below, the vertical position of the film-forming squeegee 37 can be adjusted to change the film-forming gap between the lower end of the film-forming squeegee 37 and the transfer surface 30a, thereby making it possible to vary the thickness of the film of paste P on the transfer surface 30a.

[0026] By horizontally moving the transfer stage 24 in the Y direction with the transfer surface 30a supplied with the paste P by the stage driving means, the film-forming squeegee 37 moves relative to the transfer stage 24 along the longitudinal direction of the sidewall 31A. As a result, the paste P is spread on the transfer surface 30a to form a paste film of a thickness corresponding to the film-forming gap g1. Then, by moving the transfer stage 24 in the direction opposite to the access direction of the mounting head 11A (the direction of arrow a in FIG. 2 ) after the paste film has been formed, the transfer area 32 on which the paste film has been formed can be positioned to transfer the paste P using the mounting head 11A, as shown in FIG. 3( a). In this way, the film-forming unit 33 functions as a paste film-forming unit that forms a paste film on the transfer stage 24 by moving horizontally relative to the transfer stage 24 along the first direction (Y direction) parallel to the longitudinal direction of the sidewall 31A.

[0027] The scraping unit 34 is configured by attaching a scraper 47 (a scraping squeegee serving as a squeegee member) to a block-shaped base 48. The scraper 47 is biased downward, so that its lower end is always in contact with the transfer surface 30a regardless of the height position of the transfer stage 24. The scraper 47 scrapes the paste coating film (paste P) on the transfer stage 24 by reciprocating the transfer stage 24 in the Y direction using a stage driving means. In other words, the scraping unit 34 functions as a paste scraping section that scrapes the paste coating film formed on the transfer stage 24 by moving horizontally relative to the transfer stage 24 in a first direction parallel to the longitudinal direction of the side wall 31A.

[0028] 3(a), an engagement portion 20a provided on the underside of the unit base portion 20 is provided with an air coupler 50a and an electric connector 50b that constitute the unit side connection portion 50, and the air coupler 50a and the electric connector 50b are connected to a control and drive unit 51 built into the paste transfer device 7 by air piping and electric wiring, respectively. The control and drive unit 51 has the function of controlling and driving the motor 27 that is the drive source of the stage drive means and the motor 45 that is the drive source of the film formation unit 33, and of controlling the supply and control of compressed air for discharging the paste P from the paste supply syringe 35.

[0029] A base-side connection part 52 consisting of an air coupler 52a and an electric connector 52b is provided at the rear end of the feeder base 16, and the air coupler 52a and the electric connector 52b are connected to a control / power supply part 53 and a compressed air supply source 54 by air piping and electric wiring, respectively. When the paste transfer device 7 is slid forward along the feeder base 16 and attached, the unit-side connection part 50 fits into the base-side connection part 52. This electrically connects the control / power supply part 53 to the control / drive unit 51, and further enables compressed air to be supplied to the control / drive unit 51 from the compressed air supply source 54. These connections are then interrupted by sliding the paste transfer device 7 backward. In this way, the paste transfer device 7 is configured to be connected to the base-side connection part 52 provided on the feeder base 16 and to include a unit-side connection part 50 that transmits control signals and supplies power.

[0030] The electronic component mounter 1 of the present disclosure is configured as described above. Next, with reference to FIG. 5, the film formation operation and scraping operation performed by the paste transfer device 7 provided in the electronic component mounter 1 will be described. FIG. 5 is an explanatory diagram of the operation of the paste transfer device 7 provided in the electronic component mounter 1 according to an embodiment of the present disclosure. For convenience, FIG. 5 omits illustrations of components other than those necessary for explaining the film formation operation and scraping operation performed by the paste transfer device 7. FIG. 5(a) shows a state in which the transfer stage 24 is in the retracted position, the film formation squeegee 37 and the scraper 47 are positioned at the end (the right end in this example) of the transfer surface 30a on the film formation start side before the start of the film formation operation, and the paste P is supplied between the film formation squeegee 37 and the scraper 47 via the needle 35a. At the start of the film formation operation, the film formation gap g1 between the lower end of the film formation squeegee 37 and the transfer surface 30a is set to a film thickness t appropriate for transferring the paste P to the bumps 5a of the electronic component 5 (see FIG. 5(c)).

[0031] Next, the stage moving means is driven to move the transfer stage 24 forward (arrow b1), as shown in FIG. 5(b). As a result, the paste P is spread on the transfer surface 30a by the film-forming squeegee 37, and a paste coating film Pa with a thickness of t is formed on the transfer surface 30a. The film-forming direction of the paste P is the opposite direction (arrow b2) to the movement direction of the transfer stage 24 indicated by arrow b1. Then, as shown in FIG. 5(c), the mounting head 11A, which holds electronic components 5 on multiple nozzles 11a, is moved above the transfer stage 24, and the nozzles 11a are raised and lowered (arrow c) to perform a transfer operation, whereby the paste P is applied to the bumps 5a of the electronic components 5 by transfer.

[0032] Thereafter, a scraping operation of the paste P is performed. That is, as shown in FIG. 5(d), the film-forming squeegee 37 is raised (arrow d) and the transfer stage 24 is retracted (arrow e). As a result, the paste P present on the transfer surface 30a is scraped to one side by the scraper 47 and accumulated between the film-forming squeegee 37 and the scraper 47, returning to the state shown in FIG. 5(a). Thereafter, the film-forming operation and the scraping operation are repeated in the same manner.

[0033] Next, with reference to FIGS. 6 to 11 , the attachment of the film-forming squeegee 37 to the squeegee fixing member 100 will be described. FIG. 6 is a side view including a partial cross section for illustrating the film-forming squeegee 37 and the squeegee fixing member 100 provided in the electronic component mounter 1 according to an embodiment of the present disclosure. FIG. 6 illustrates a state in which the film-forming squeegee 37 shown in FIG. 10 is attached to the squeegee fixing member 100 shown in FIG. 11 . FIGS. 7 and 8 are perspective views of the film-forming squeegee 37 provided in the electronic component mounter 1 according to an embodiment of the present disclosure. FIG. 8 illustrates the opposite side in the Y direction of the film-forming squeegee 37 shown in FIG. 7 . FIG. 9 is a perspective view of the squeegee fixing member provided in the electronic component mounter 1 according to an embodiment of the present disclosure. FIG. 10 is a side view including a partial cross section of the film-forming squeegee 37 provided in the electronic component mounter 1 according to an embodiment of the present disclosure, and is a side view including the AA′ cross section (YZ plane) shown in FIG. Fig. 11 is a cross-sectional view of the squeegee fixing member 100 provided in the electronic component mounter 1 according to the embodiment of the present disclosure, and is a side view including the BB' cross section (YZ plane) shown in Fig. 9. Here, the AA' cross section (YZ plane) shown in Fig. 8 and the AA' cross section (YZ plane) shown in Fig. 9 have the same X-direction coordinate, and the hatched area shown in Fig. 6 indicates a cross section in a state where the film deposition squeegee 37 shown in Fig. 10 is attached to the squeegee fixing member 100 shown in Fig. 11.

[0034] The film-forming squeegee 37 has a recess 71 on a surface 70 that is parallel to the longitudinal direction of the sidewall 31A of the transfer stage 24, i.e., perpendicular to the film-forming direction of the paste P (see FIGS. 8 and 10). The recess 71 is composed of a recess 71A and a recess 71B. The recess 71A is a hole whose opening (XZ plane) and cross section (XZ plane) are round and extend in the Y direction. On the other hand, the recess 71B is a hole whose opening (XZ plane) and cross section (XZ plane) are oblong and extend in the Y direction.

[0035] The squeegee fixing member 100 has a recess 102 on a surface 101 that is parallel to the longitudinal direction of the side wall 31A of the transfer stage 24, i.e., perpendicular to the film-forming direction of the paste P (see FIGS. 9 and 11). The recess 102 is composed of a recess 102A and a recess 102B. Both the recess 102A and the recess 102B are holes that extend in the Y direction and have circular openings (in the XZ plane) and cross sections (in the XZ plane).

[0036] The position of the film deposition squeegee 37 relative to the squeegee fixing member 100 is regulated by a position regulating member 110 that engages with a recess 71 provided in the film deposition squeegee 37 and a recess 102 provided in the squeegee fixing member 100. The position regulating member 110 is preferably configured, for example, as a pin having a circular cross section (XZ plane). The position regulating member 110 is composed of a position regulating member 110A and a position regulating member 110B (see FIG. 9 ). The position regulating member 110A engages with a recess 102A provided in the squeegee fixing member 100, and then engages with a recess 71A provided in the film deposition squeegee 37. The position regulating member 110B engages with a recess 102B provided in the squeegee fixing member 100, and then engages with a recess 71B provided in the film deposition squeegee 37.

[0037] Here, the engagement of the position restricting member 110A with the recessed portion 71A and the recessed portion 102A determines the reference position for the X-direction contact between the film deposition squeegee 37 and the squeegee fixing member 100. To reliably determine this reference position, the opening and cross section of the recessed portion 71A are configured to be round hole-shaped, and the opening and cross section of the recessed portion 71B are configured to be elongated hole-shaped.

[0038] Furthermore, the amount by which the position restricting member 110A protrudes from the surface 101 when engaged with the recess 102A is set to be smaller than the amount by which the position restricting member 110B protrudes from the surface 101 when engaged with the recess 102B. The amount by which the position restricting member 110A protrudes from the surface 101 when engaged with the recess 102A and the amount by which the position restricting member 110B protrudes from the surface 101 when engaged with the recess 102B are adjusted by the jig that engages them. In this case, parts of the same length (the same part) can be selected for the position restricting member 110A and the position restricting member 110B, and further, the depths of the recesses 102A and 102B can be made the same. Furthermore, the protrusion amount can be adjusted by changing the lengths of the position restricting member 110A and the position restricting member 110B, or the depths of the recesses 102A and 102B can be set to different values.

[0039] The portion of the position restricting member 110A protruding from the surface 101 has a circular cross section (XZ plane) and engages with the recessed portion 71A, which has a circular cross section (XZ plane) and a round hole-like cross section (XZ plane). On the other hand, the portion of the position restricting member 110B protruding from the surface 101 has a circular cross section (XZ plane) and engages with the recessed portion 71B, which has an elongated hole-like cross section (XZ plane). Therefore, if the position restricting members 110A and 110B protrude from the surface 101 by the same amount, the force required to attach and detach the position restricting member 110A to and from the recessed portion 71A is greater than the force required to attach and detach the position restricting member 110B to and from the recessed portion 71B. This is because, when attaching the film deposition squeegee 37 to the squeegee fixing member 100 or removing the film deposition squeegee 37 from the squeegee fixing member 100, the contact resistance generated between the position restricting member 110A and the recessed portion 71A is greater than the contact resistance generated between the position restricting member 110B and the recessed portion 71B. Therefore, by adjusting the amount by which position restricting member 110A and position restricting member 110B protrude from surface 101, it is possible to equalize the force required to attach and detach position restricting member 110A to and from recess 71 and the force required to attach and detach position restricting member 110B to and from recess 71B. As a result, it is possible to improve the operability when attaching film deposition squeegee 37 to squeegee fixing member 100 or removing film deposition squeegee 37 from squeegee fixing member 100, and to enable easy attachment and removal of film deposition squeegee 37.

[0040] Hereinafter, the surface 70 of the film-forming squeegee 37 that is perpendicular to the film-forming direction of the paste P may be referred to as the first surface. Also, the recess 71 provided on the surface 70 of the film-forming squeegee 37 may be referred to as the first recess. Also, the surface 101 of the squeegee fixing member that is perpendicular to the film-forming direction of the paste P may be referred to as the second surface. Also, the recess 102 provided on the surface 101 of the squeegee fixing member 100 may be referred to as the second recess.

[0041] As shown in FIG. 6, when the film-forming squeegee 37 is attached to the squeegee fixing member 100, the surface 70 of the film-forming squeegee 37 and the surface 101 of the squeegee fixing member 100 come into contact in the Y direction (the direction of film formation of the paste P). At this time, the position restricting member 110 engages with both the film-forming squeegee 37 and the squeegee fixing member 100 in the Y direction. This improves the accuracy of control in adjusting the film thickness t compared to, for example, when the position restricting member 110 engages with both the film-forming squeegee 37 and the squeegee fixing member 100 in the vertical direction. This is because, when the position restricting member 110 engages with both the film-forming squeegee 37 and the squeegee fixing member 100 in the vertical direction, an error is more likely to occur in the vertical position of the film-forming squeegee 37 relative to the squeegee fixing member 100 compared to when the position restricting member 110 engages with both the film-forming squeegee 37 and the squeegee fixing member 100 in the Y direction as in this embodiment.

[0042] 8, recess 71B of the two recesses 71 provided in film deposition squeegee 37 is an elongated hole. As a result, position regulating member 110 can regulate the vertical position of film deposition squeegee 37 relative to squeegee fixing member 100 with recess 71B, and can regulate the vertical position and X-direction position of film deposition squeegee 37 relative to squeegee fixing member 100 with recess 71A.

[0043] The film-forming squeegee 37 has a hole 72 capable of accommodating a magnetic body. A magnet 73 is accommodated in the hole 72, and the position of the magnet 73 is fixed by a set screw 74.

[0044] The squeegee fixing member 100 has a hole 103 capable of accommodating a magnetic body. A magnet 104 is accommodated in the hole 103, and the position of the magnet 104 is fixed by a set screw 105.

[0045] The magnet 73 provided in the film-forming squeegee 37 and the magnet 104 provided in the squeegee fixing member 100 are disposed in positions facing each other. In other words, the hole 72 in the film-forming squeegee 37 and the hole 103 in the squeegee fixing member 100 are provided so that the housed magnet 73 and magnet 104 face each other.

[0046] The magnet 73 provided on the film deposition squeegee 37 and the magnet 104 provided on the squeegee fixing member 100 are arranged so that their opposite magnetic poles face each other. As a result, the film deposition squeegee 37 and the squeegee fixing member 100 are fixed by the magnetic bodies, that is, the magnetic force of the magnets 73 and 104. More specifically, the surface 70 of the film deposition squeegee 37 and the surface 101 of the squeegee fixing member 100 come into contact with each other due to the magnetic force, thereby fixing the film deposition squeegee 37 and the squeegee fixing member 100.

[0047] Although the example in which the film-forming squeegee 37 and the squeegee fixing member 100 each include a magnet has been described, the present invention is not limited thereto. For example, one of the film-forming squeegee 37 and the squeegee fixing member 100 may include a magnet, and the other of the film-forming squeegee 37 and the squeegee fixing member 100 may be made of a magnetic material that can be magnetized by the magnet. For example, if the film-forming squeegee 37 includes a magnet 73 and the squeegee fixing member 100 is made of a magnetic material that can be magnetized by the magnet 73, the film-forming squeegee 37 and the squeegee fixing member 100 are fixed by magnetic force. Alternatively, one of the film-forming squeegee 37 and the squeegee fixing member 100 may include a magnetic material, and the other of the film-forming squeegee 37 and the squeegee fixing member 100 may be made of a magnet that can magnetize the magnetic material. For example, the film-forming squeegee 37 may include a magnetic material, and the squeegee fixing member 100 may be made of a magnet that can magnetize the magnetic material. In this manner, at least one of the film-forming squeegee 37 and the squeegee fixing member 100 may include a magnetic material. In other words, it is sufficient that at least one of the film deposition squeegee 37 and the squeegee fixing member 100 has a hole capable of accommodating a magnetic body. Examples of magnetic bodies that can be magnetized by a magnet (for example, the magnet 73 or the magnet 104) include iron.

[0048] In this way, the film-forming squeegee 37 and the squeegee fixing member 100 are fixed by magnetic force, which makes it easier to attach and detach the film-forming squeegee 37 compared to, for example, when the film-forming squeegee 37 and the squeegee fixing member 100 are fixed by screws. This improves, for example, the maintainability of the film-forming squeegee 37.

[0049] The squeegee fixing member 100 is attached to the lifting member 43 by a nut 160. This allows the squeegee fixing member 100 to be movable in a direction perpendicular to the surface of the transfer stage 24 on which the paste coating film Pa is formed. This also allows the film-forming squeegee 37 to be raised and lowered relative to the transfer surface 30a, as described with reference to FIG.

[0050] The film-forming squeegee 37 and squeegee fixing member 100 are arranged in this order from upstream to downstream in the film-forming direction of the paste P (the direction of arrow b2 shown in FIG. 5(b)). When the paste coating film Pa is formed, a force is applied to the film-forming squeegee 37 in the movement direction of the transfer stage 24 (the direction of arrow b1 shown in FIG. 5(b)). At this time, since the film-forming squeegee 37 and squeegee fixing member 100 are arranged in the above order, the film-forming squeegee 37 is pressed against the squeegee fixing member 100.

[0051] Here, we will explain a case where the arrangement order of the film-forming squeegee 37 and the squeegee fixing member 100 is reversed, that is, where the squeegee fixing member 100 and the film-forming squeegee 37 are arranged in this order from upstream to downstream in the movement direction of the transfer stage 24 (the direction of arrow b1 shown in FIG. 5(b)) when the paste coating film Pa is formed. In this case, when the paste coating film Pa is formed, a force is applied to the film-forming squeegee 37 in the movement direction of the transfer stage 24 (the direction of arrow b1 shown in FIG. 5(b)), which may cause the film-forming squeegee 37 and the squeegee fixing member 100 to become unfixed. This is because the film-forming squeegee 37 and the squeegee fixing member 100 are fixed by magnetic force. If the force acting on the film-forming squeegee 37 in the movement direction of the transfer stage 24 (the direction of arrow b1 shown in FIG. 5(b)) during the formation of the paste coating film Pa is greater than the magnetic force fixing the film-forming squeegee 37 to the squeegee fixing member 100, the film-forming squeegee 37 may come off the squeegee fixing member 100. To prevent the film-forming squeegee 37 and the squeegee fixing member 100 from being released from fixation, the film-forming squeegee 37 and the squeegee fixing member 100 need to be fixed by a stronger magnetic force. Therefore, for example, the film-forming squeegee 37 and the squeegee fixing member 100 need to be equipped with magnets with strong magnetic force.

[0052] However, to facilitate the attachment and detachment of the film-forming squeegee 37 and the squeegee fixing member 100, it is preferable that the magnetic force of the magnet used to secure the film-forming squeegee 37 and the squeegee fixing member 100 is not excessively strong. When the squeegee fixing member 100 and the film-forming squeegee 37 are arranged in this order from upstream to downstream in the film-forming direction of the paste P (the direction of arrow b2 shown in FIG. 5(b)), as in this embodiment, the film-forming squeegee 37 and the squeegee fixing member 100 are unlikely to be released from their attachment when the paste coating film Pa is formed. Therefore, the magnetic force used to secure the film-forming squeegee 37 and the squeegee fixing member 100 only needs to be strong enough to secure the film-forming squeegee 37 and the squeegee fixing member 100 together and to facilitate the attachment and detachment of the film-forming squeegee 37 and the squeegee fixing member 100. For example, in this embodiment, the film deposition squeegee 37 and the squeegee fixing member 100 may be fixed by a magnet with a weak magnetic force that allows the film deposition squeegee 37 to be easily removed by hand by a person such as a user of the electronic component mounting machine 1.

[0053] (Summary of the embodiment) The above description of the embodiments discloses the following techniques.

[0054] (Technology 1) A paste transfer device (e.g., paste transfer device 7) includes a transfer stage (e.g., transfer stage 24) to which paste (e.g., paste P) to be transferred to an electronic component (e.g., electronic component 5) is supplied, a film-forming squeegee (e.g., film-forming squeegee 37) capable of forming a paste coating (e.g., paste coating Pa) on the transfer stage, and a squeegee fixing member (e.g., squeegee fixing member 100) to which the film-forming squeegee is attached, the position of the film-forming squeegee relative to the squeegee fixing member being regulated by a position regulating member (e.g., position regulating member 110), at least one of the film-forming squeegee and the squeegee fixing member being provided with a magnetic body (e.g., magnet 73), and the film-forming squeegee and the squeegee fixing member being fixed by the magnetic force of the magnetic body.

[0055] This allows the film-forming squeegee to be easily attached and detached, thereby improving the ease of maintenance of the film-forming squeegee by, for example, a user of the paste transfer device.

[0056] (Technology 2) In the paste transfer device described in Technology 1, the magnetic body is a magnet (e.g., magnet 73, magnet 104), and one of the film-forming squeegee and the squeegee fixing member is provided with a magnet, and the other of the film-forming squeegee and the squeegee fixing member is provided with a magnet at a position facing the magnet so that a magnetic pole different from that of the magnet faces.

[0057] As a result, the film deposition squeegee and the squeegee fixing member are fixed by the magnetic force of the magnet.

[0058] (Technology 3) In the paste transfer device described in Technique 1, the magnetic body is a magnet, one of the film-forming squeegee and the squeegee fixing member is provided with a magnet, and the other of the film-forming squeegee and the squeegee fixing member is made of a magnetic body that can be magnetized by the magnet.

[0059] As a result, one of the film-forming squeegee and the squeegee fixing member is equipped with a magnet, and the other of the film-forming squeegee and the squeegee fixing member is made of a magnetic material that can be magnetized by the magnet, and the film-forming squeegee and the squeegee fixing member are fixed in place by the magnetic force between the magnet and the magnetized magnetic material.

[0060] (Technology 4) In the paste transfer device described in any one of techniques 1 to 3, the position control member is composed of a pin, and regulates the position of the film deposition squeegee relative to the squeegee fixing member by engaging with a first recess (e.g., recess 71) provided in the film deposition squeegee and a second recess (e.g., recess 102) provided in the squeegee fixing member.

[0061] As a result, the position of the film deposition squeegee relative to the squeegee fixing member is regulated by the pin serving as the position regulating member.

[0062] (Technology 5) In the paste transfer device according to any one of the first to fourth techniques, at least one of the film-forming squeegee and the squeegee fixing member includes a hole (for example, hole 72, hole 103) capable of accommodating a magnetic body.

[0063] As a result, at least one of the film-forming squeegee and the squeegee fixing member has a hole capable of accommodating the magnetic material.

[0064] (Technology 6) In the paste transfer device described in Technology 4, the magnetic force of the magnetic body causes a first surface (e.g., surface 70) of the film-forming squeegee that is perpendicular to the film-forming direction of the paste (e.g., the direction indicated by arrow b2) to come into contact with a second surface (e.g., surface 101) of the squeegee fixing member that is perpendicular to the film-forming direction, thereby fixing the film-forming squeegee and the squeegee fixing member.

[0065] As a result, the surface of the film-forming squeegee perpendicular to the film-forming direction of the paste comes into contact with the surface of the squeegee fixing member perpendicular to the film-forming direction.

[0066] (Technology 7) In the paste transfer device according to Technique 6, the first recess is provided on the first surface, and the second recess is provided on the second surface.

[0067] As a result, the pin serving as the position restricting member engages with a recess provided on the surface of the film-forming squeegee that contacts the squeegee fixing member, and a recess provided on the surface of the squeegee fixing member that contacts the film-forming squeegee. The pin engages with both the film-forming squeegee and the squeegee fixing member in a direction perpendicular to the paste film-forming direction.

[0068] (Technology 8) In the paste transfer device according to any one of the first to seventh techniques, the film-forming squeegee and the squeegee fixing member are arranged in this order from upstream to downstream in the paste film-forming direction.

[0069] This allows the film deposition squeegee and the squeegee fixing member to be fixed together even with a weak magnetic force, for example.

[0070] (Technology 9) In the paste transfer device according to any one of Techniques 1 to 8, the squeegee fixing member is provided so as to be movable in a direction perpendicular to the surface of the transfer stage on which the paste coating film is formed.

[0071] This makes it possible to control the thickness of the paste coating.

[0072] (Technology 10) The electronic component mounting machine comprises an electronic component supply unit that supplies electronic components, a mounting head that removes electronic components from the electronic component supply unit and mounts them on a substrate, and a paste transfer device that transfers paste to the electronic components removed by the mounting head. The paste transfer device comprises a transfer stage to which paste is supplied, a film-forming squeegee that can form a paste coating on the transfer stage, and a squeegee fixing member to which the film-forming squeegee is attached. The position of the film-forming squeegee relative to the squeegee fixing member is regulated by a position regulating member, and at least one of the film-forming squeegee and the squeegee fixing member comprises a magnetic body, and the film-forming squeegee and the squeegee fixing member are fixed by the magnetic force of the magnetic body.

[0073] This allows the electronic component mounter to obtain the same effect as that of Technology 1.

[0074] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0075] The technology of the present disclosure is useful as a paste transfer device and an electronic component mounting machine. [Explanation of symbols]

[0076] 1. Electronic component mounting machine 3. Circuit Board 4A Electronic component supply section 5. Electronic Components 7 Paste transfer device 11A mounting head 24 Transcription Stage 30 Base 31A side wall 34 scraping unit 37 Coating squeegee 43 Lifting member 47 Scraper 70, 101 sides 71, 102 recesses Holes 72 and 103 73, 104 Magnets 74, 105 Set screws 100 Squeegee fixing member 110 Position control member P Paste Pa paste coating

Claims

1. a transfer stage to which paste for transfer to an electronic component is supplied; a film-forming squeegee capable of forming a paste coating film on the transfer stage; a squeegee fixing member to which the film-forming squeegee is attached, a position of the film deposition squeegee relative to the squeegee fixing member is regulated by a position regulating member; At least one of the film-forming squeegee and the squeegee fixing member includes a magnetic material, the film-forming squeegee and the squeegee fixing member are fixed by the magnetic force of the magnetic body; Paste transfer device.

2. the magnetic body is a magnet, one of the film-forming squeegee and the squeegee fixing member includes the magnet; the other of the film deposition squeegee and the squeegee fixing member is provided with a magnet at a position facing the magnet so that a magnetic pole different from that of the magnet faces the other. The paste transfer device according to claim 1 .

3. the magnetic body is a magnet, one of the film-forming squeegee and the squeegee fixing member includes the magnet; the other of the film-forming squeegee and the squeegee fixing member is made of a magnetic material that can be magnetized by the magnet; The paste transfer device according to claim 1 .

4. the position regulating member is constituted by a pin, and regulates the position of the film deposition squeegee relative to the squeegee fixing member by engaging with a first recess provided in the film deposition squeegee and a second recess provided in the squeegee fixing member, respectively; The paste transfer device according to claim 1 .

5. At least one of the film-forming squeegee and the squeegee fixing member has a hole capable of accommodating the magnetic body. The paste transfer device according to claim 1 .

6. a first surface of the film-forming squeegee, which is perpendicular to the film-forming direction of the paste, and a second surface of the squeegee fixing member, which is perpendicular to the film-forming direction, come into contact with each other by the magnetic force of the magnetic body, thereby fixing the film-forming squeegee and the squeegee fixing member together; The paste transfer device according to claim 4 .

7. the first recess is provided in the first surface, The second recess is provided on the second surface. The paste transfer device according to claim 6.

8. the film-forming squeegee and the squeegee fixing member are arranged in this order from upstream to downstream in a film-forming direction of the paste; The paste transfer device according to claim 1 .

9. the squeegee fixing member is provided to be movable in a direction perpendicular to a surface of the transfer stage on which the paste coating film is formed; The paste transfer device according to claim 1 .

10. an electronic component supply unit that supplies electronic components; a mounting head that picks up electronic components from the electronic component supply unit and mounts them on a substrate; a paste transfer device that transfers paste onto the electronic component picked up by the mounting head, The paste transfer device is a transfer stage to which the paste is supplied; a film-forming squeegee capable of forming a paste coating film on the transfer stage; a squeegee fixing member to which the film-forming squeegee is attached, a position of the film deposition squeegee relative to the squeegee fixing member is regulated by a position regulating member; At least one of the film-forming squeegee and the squeegee fixing member includes a magnetic material, the film-forming squeegee and the squeegee fixing member are fixed by the magnetic force of the magnetic body; Electronic component mounting machine.

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