Paste transfer apparatus, electronic component mounting apparatus, and detection method

Abstract

To provide a paste transfer device capable of accurately detecting a sign that paste overflows from the inside of a stage to the outside of the stage.SOLUTION: A paste transfer apparatus for transferring paste to an electronic component includes a transfer stage having a rectangular plate-shaped base portion to which the paste is supplied, a first side wall rising from each of both end sides of the base portion along a first direction that is a film formation direction in which the paste is formed into a film, and a second side wall rising from each of both end sides of the base portion along a second direction perpendicular to the first direction, and a sensor capable of detecting the paste on an upper surface of the first side wall.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a paste transfer device, an electronic component mounting machine, and a detection method. [Background technology]

[0002] A known paste transfer device for transferring paste to an electronic component includes, for example, a stage to which paste is supplied, a film-forming squeegee that moves horizontally in one direction on the stage to form a paste coating film, and a scraping squeegee that moves horizontally in one direction to scrape the paste on the stage (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-115477 Summary of the Invention [Problem to be solved by the invention]

[0004] In the paste transfer device of Patent Document 1, paste accumulates between the film-forming squeegee and the scraping squeegee, and can spill over the sidewall of the stage. This is due to the viscosity of the paste. In this case, the operation of the paste transfer device must be stopped, which can prolong the paste transfer process.

[0005] The present disclosure provides a paste transfer device, an electronic component mounter, and a detection method that can accurately detect signs of paste overflowing from inside the stage to outside the stage. [Means for solving the problem]

[0006] One aspect of the present disclosure is a paste transfer device that transfers paste to an electronic component, comprising: a rectangular plate-shaped base portion to which the paste is supplied; a transfer stage having first side walls rising from both end edges of the base portion along a first direction, which is a film-forming direction in which the paste is formed; and second side walls rising from both end edges of the base portion along a second direction perpendicular to the first direction; and a sensor capable of detecting the paste on the upper surface of the first side walls.

[0007] One aspect of the present disclosure is an electronic component mounting machine including the paste transfer device described above.

[0008] One aspect of the present disclosure is a detection method for determining the paste of a transfer stage having a rectangular plate-shaped base portion to which paste to be transferred to an electronic component is supplied, a first side wall rising from each of both end edges of the base portion along a first direction which is a film-forming direction in which the paste is formed, and a second side wall rising from each of both end edges of the base portion along a second direction perpendicular to the first direction, the detection method including detecting the presence or absence of the paste on the upper surface of the first side wall. [Effects of the Invention]

[0009] According to the present disclosure, signs of paste overflowing from inside the stage to outside the stage can be accurately detected. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram illustrating an example of the overall configuration of an electronic component mounter according to an embodiment of the present disclosure. [Figure 2A] FIG. 1 is a perspective view showing an example of a paste transfer device. [Figure 2B] FIG. 1 is a perspective view showing an example of a transfer stage. [Figure 3A] Structural diagram of paste transfer device [Figure 3B] Cross section A of Figure 3A [Figure 3C] Cross section B of Figure 3A [Figure 4]FIG. 1 is a top view showing at least a portion of the periphery of a deposition squeegee, a scraper, a transfer stage, and a sensor. [Figure 5] CC cross section of Figure 4 [Figure 6] FIG. 1 is a perspective view showing at least a portion of the periphery of a film-forming squeegee, a scraper, a transfer stage, and a sensor; [Figure 7] FIG. 1 is a diagram illustrating the operation of a paste transfer device. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with appropriate reference to the drawings. However, more detailed description than necessary may be omitted. For example, detailed descriptions of well-known matters and redundant descriptions of substantially identical configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Furthermore, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0013] (How the embodiment of the present disclosure was achieved) In the electronic component mounting field, electronic component mounting machines are used that have the function of soldering electronic components to a substrate via solder bumps formed on the underside of the electronic components. In soldering, a paste (soldering bonding aid) such as flux or solder paste is supplied to the solder bumps, and then the solder bumps are landed on the electrodes of the substrate. For this reason, electronic component mounting machines are equipped with a paste transfer device that transfers the paste to the bumps.

[0014] On the stage (also called the transfer stage) of the paste transfer device, paste is supplied via a needle between a film-forming squeegee and a scraping squeegee (also called a scraper). To prevent the supplied paste from overflowing from the transfer stage, a paste detection sensor that detects the amount of paste buildup is sometimes installed. Conventional paste detection sensors are fixedly positioned between the film-forming squeegee and the scraping squeegee with respect to the transfer stage, so there is a possibility that they may erroneously detect the buildup of paste when the paste is being formed into a film, rather than the buildup before the paste overflows from the transfer stage.

[0015] In the following embodiments, a paste transfer device and an electronic component mounter that can accurately detect signs of paste overflowing from inside the stage to outside the stage will be described.

[0016] (First embodiment) FIG. 1 is a diagram illustrating an example of the overall configuration of an electronic component mounter according to an embodiment of the present disclosure.

[0017] For ease of explanation, the axis extending in the height direction from the floor surface on which the electronic component mounter 1 is placed is referred to as the Z-axis. The axis perpendicular to the Z-axis (i.e., parallel to the floor surface) and extending from the front of the electronic component mounter 1 (the lower side of the paper in FIG. 1 ) to the rear of the electronic component mounter 1 (the upper side of the paper in FIG. 1 ) is referred to as the Y-axis. The axis perpendicular to the Y-axis and Z-axis is referred to as the X-axis. For ease of explanation, the positive direction of the Z-axis may be referred to as "up," the negative direction of the Z-axis as "down," the positive direction of the Y-axis as "front," the negative direction of the Y-axis as "rear," the positive direction of the X-axis as "right," and the negative direction of the Y-axis as "left." Furthermore, expressions such as "high" and "low" may be used to refer to the direction of the Z-axis. Furthermore, these directional expressions are used for ease of explanation and are not intended to limit the orientation of the structure during actual use.

[0018] The electronic component mounter 1 has a function of mounting electronic components on a board. A board transport mechanism 2 is arranged in the X direction, which is the board transport direction, on a base 1a of the electronic component mounter 1. The board transport mechanism 2 transports a board 3 that is the target of the component mounting operation.

[0019] Electronic component supply units that supply electronic components are arranged on both sides of the substrate transport mechanism 2. Multiple tape feeders 6 and paste transfer devices 7 are arranged in parallel in the electronic component supply unit 4A on one side. The tape feeders 6 supply electronic components 5 (FIG. 2A) held on tape. The paste transfer devices 7 transfer paste P, which is a viscous fluid such as flux, to the electronic components 5 picked up by the mounting head 11A. A tray feeder 8 is set in the electronic component supply unit 4B on the other side. The tray feeder 8 stores tray components (not shown), which are large electronic components.

[0020] A Y-axis table 9 is disposed at one end of the base 1a in the X direction (X-axis direction) along the Y direction (Y-axis direction) perpendicular to the substrate transport mechanism 2. Two X-axis tables 10A and 10B are coupled to the Y-axis table 9 so as to be freely movable along the Y direction. Mounting heads 11A and 11B are attached to the X-axis tables 10A and 10B, respectively.

[0021] The mounting head 11A drives the X-axis table 10A and the Y-axis table 9, thereby using a nozzle 11a (FIG. 2A) attached to the bottom to pick up electronic components 5 from the tape feeder 6 of the electronic component supply unit 4A. The mounting head 11A then accesses the paste transfer device 7 for paste transfer, and transports and mounts the electronic components 5 after paste transfer onto the substrate 3, which is positioned and held by the substrate transport mechanism 2. That is, the mounting head 11A picks up the electronic components 5 from the electronic component supply unit 4A and mounts them on the substrate 3. The X-axis table 10A and the Y-axis table 9 constitute a head moving means. The head moving means moves the mounting head 11A to access the substrate 3 and the paste transfer device 7.

[0022] In addition, by driving the X-axis table 10B and the Y-axis table 9, the mounting head 11B takes out tray components from the tray 8a held in the tray feeder 8 of the electronic component supply unit 4B, and transfers and mounts them onto the board 3 positioned and held by the board conveying mechanism 2.

[0023] The X-axis tables 10A, 10B are equipped with board recognition cameras 12 that move integrally with the mounting heads 11A, 11B. As the mounting heads 11A, 11B move above the board 3, the board recognition cameras 12 also move integrally to capture an image of the board 3. On the base 1a, between each of the electronic component supply units 4A, 4B and the board transport mechanism 2, a component recognition camera 13 and a nozzle stocker 14 are disposed.

[0024] The nozzle stocker 14 stores nozzles 11a to be attached to the mounting heads 11A and 11B for multiple component types. A control unit (not shown) included in the electronic component mounter 1 causes the mounting heads 11A and 11B to access the nozzle stocker 14 and execute a predetermined nozzle exchange operation, thereby exchanging the nozzles 11a of the mounting heads 11A and 11B according to the component type. The control unit moves the mounting head 11A holding the electronic component 5 relatively in the X direction above the component recognition camera 13. This causes the component recognition camera 13 to read an image of the electronic component 5 from below. This allows the type and shape of the electronic component 5 held by the mounting head 11A to be recognized. When the mounting head 11A mounts the electronic component 5, the mounting position on the board 3 is corrected based on the board recognition results from the board recognition camera 12 and the component recognition results from the component recognition camera 13. The same applies when the mounting head 11B mounts tray components.

[0025] Next, the structure of the paste transfer device 7 will be described.

[0026] FIG. 2A is a perspective view showing an example of a paste transfer device 7. FIG. 2B is a perspective view showing an example of a transfer stage 24. FIG. 3A is a structural explanatory diagram of a paste transfer device. FIG. 3B is a cross-sectional view taken along line A in FIG. 3A. FIG. 3C is a cross-sectional view taken along line B in FIG. 3A.

[0027] 2A, the paste transfer device 7 has a configuration in which the following components are provided on a long unit base 20. The unit base 20 is detachably attached to a feeder base 16 (FIG. 3A) provided in the electronic component supply unit 4A, with its longitudinal direction aligned with the Y direction, from the side opposite the access direction (direction of arrow a) of the mounting head 11A. In this embodiment, the access side of the mounting head 11A is defined as the front side, and the opposite side is defined as the rear side.

[0028] As shown in FIGS. 2A and 3A, the paste transfer device 7 has an engagement portion 20a. The engagement portion 20a engages with the feeder base 16 to secure the unit base portion 20 to the feeder base 16. A handle 21 is provided behind the engagement portion 20a and protrudes from the engagement portion 20a. When an operator attaches the paste transfer device 7 to the feeder base 16, the operator aligns the lower surface of the unit base portion 20 with the upper surface of the feeder base 16, grasps the handle 21, and pushes it forward. This causes the engagement portion 20a to engage with the rear end of the feeder base 16, and the unit base portion 20 is attached to a predetermined position. Note that the shape and arrangement of the handle 21 are not limited to this.

[0029] A guide rail 22 is disposed on the upper surface of the unit base portion 20 along the longitudinal direction (X direction). A slider 23 slidably fitted on the guide rail 22 is fixed to the underside of the transfer stage 24. As shown in FIGS. 3A to 3C, a feed screw 26 is threadedly engaged with a nut 25 coupled to the underside of the transfer stage 24. The feed screw 26 is driven to rotate by a motor 27 disposed on the rear end side of the unit base portion 20. Therefore, by driving the motor 27, the transfer stage 24 moves back and forth along the longitudinal direction (Y direction) on the upper surface of the unit base portion 20.

[0030] That is, the guide rail 22, slider 23, nut 25, feed screw 26, and motor 27 constitute a stage driving means that moves the transfer stage 24 back and forth in the longitudinal direction relative to the unit base portion 20. This stage driving means is covered with a safety cover 28 to ensure the safety of the operator. The safety cover 28 may also cover the film deposition squeegee 37, the scraper 47, and their peripheral components.

[0031] The configuration of the paste transfer device 7 may be different from that shown in FIG. 2A in the shape and arrangement of at least some of the members, or may be the same.

[0032] As shown in FIG. 2B, the transfer stage 24 has a concave structure mainly composed of a rectangular base portion 30 with a smooth top surface, and includes side walls 31A and 31B. The base portion 30 has two parallel, opposing end edges 30a1 and 30a2. The base portion 30 has two parallel, opposing end edges 30b1 and 30b2. The side wall 31A has two side walls 31A1 and 31A2. The side wall 31B has two side walls 31B1 and 31B2.

[0033] The side wall 31A1 rises (stands up) from the end edge 30a1 of the base portion 30 in the Z direction and extends along the longitudinal direction (Y direction) of the base portion 30. The side wall 31A2 rises from the end edge 30a2 of the base portion 30 in the Z direction and extends along the Y direction. The side wall 31B1 rises from the end edge 30b1 of the base portion 30 in the Z direction and extends along the short side direction (width direction, X direction) of the base portion 30. The side wall 31B2 rises from the end edge 30b2 of the base portion 30 in the Z direction and extends along the X direction.

[0034] Paste P to be transferred to electronic component 5 is supplied to base portion 30 of transfer stage 24. Base portion 30 has transfer surface 30a (FIGS. 3A to 3C) on its upper surface. Transfer surface 30a forms a coating of paste P and transfers paste P to electronic component 5.

[0035] 2A, a transfer area 32 is set at the front end of the transfer surface 30a. The transfer area 32 is an area where a coating of paste P is transferred onto the electronic components 5 held by the mounting head 11A. The size of the transfer area 32 is set so that the paste P can be transferred collectively onto multiple electronic components 5 held by multiple (e.g., eight) nozzles 11a of the mounting head 11A.

[0036] 3A, the film-forming unit 33 and the scraping unit 34 are disposed above the transfer stage 24 and behind the transfer area 32 at positions where they do not interfere with the mounting head 11A. The film-forming unit 33 has a film-forming squeegee 37 and its surrounding members (e.g., a squeegee fixing member 38). The film-forming squeegee 37 is fixed to the squeegee fixing member 38. The scraping unit 34 has a scraper 47 and its surrounding members (e.g., a scraper fixing member 48). The scraper 47 is fixed to the scraper fixing member 48.

[0037] 3A, the scraper 47 and the scraper fixing member 48 are arranged side by side in the Y direction, but this is not limiting. For example, the scraper 47 and the scraper fixing member 48 may be arranged side by side in the Z direction.

[0038] A needle 35a of a paste supply syringe 35 is inserted between the film forming unit 33 and the scraping unit 34. The paste supply syringe 35 and its needle 35a constitute a paste supply means that supplies paste P to the transfer stage 24. The film forming unit 33 is held by a bracket that is erected on the unit base 20, and thus its horizontal position relative to the unit base 20 is fixed.

[0039] 3A and 3B, the film-forming squeegee 37 extends downward, and is disposed so that its lower end maintains a film-forming gap g1 between itself and the transfer surface 30a. The film-forming squeegee 37 is an example of a squeegee member. The film-forming squeegee 37 is fixed to, for example, a block-shaped squeegee fixing member 38. The film-forming squeegee 37 is movable up and down relative to the bracket, i.e., can be raised and lowered.

[0040] An elevating member 43 disposed in the vertical direction (Z direction) is coupled to the squeegee fixing member 38. The elevating member 43 penetrates the interior of the unit base portion 20. A cam follower 44 is coupled to the lower end of the elevating member 43. A motor 45 is disposed in a horizontal position inside the unit base portion 20. A disc cam 46 is coupled to the rotation shaft of the motor 45. The disc cam 46 abuts against the cam follower 44. When the motor 45 is driven to rotate in this state, the elevating member 43 moves up and down in accordance with the cam characteristics of the disc cam 46. As a result, the film deposition squeegee 37 moves up and down relative to the transfer surface 30a.

[0041] That is, the lifting member 43, the cam follower 44, the motor 45, and the disk cam 46 constitute a squeegee position adjusting means for adjusting the vertical position of the film-forming squeegee 37. The squeegee position adjusting means may adjust the vertical position of the film-forming squeegee 37 during the film-forming operation of forming a film of the paste P, thereby changing the film-forming gap between the lower end of the film-forming squeegee 37 and the transfer surface 30a. This makes it possible to vary the thickness of the film of the paste P on the transfer surface 30a.

[0042] The transfer stage 24, with the paste P supplied to the transfer surface 30a, is moved horizontally in the Y direction by the stage driving means, whereby the film-forming squeegee 37 moves relative to the transfer stage 24 along the longitudinal direction of the sidewall 31A. As a result, the paste P is spread on the transfer surface 30a, forming a paste film having a thickness corresponding to the film-forming gap g1. Then, the control unit, for example, moves the transfer stage 24 after the paste film formation in the direction opposite to the access direction (the direction of arrow a in FIG. 2A ) of the mounting head 11A. As a result, as shown in FIG. 3A , the paste transfer device 7 can position the transfer area 32, on which the paste film has been formed, at a position where the mounting head 11A transfers the paste P. In this way, the film-forming unit 33 functions as a paste film forming unit that forms a paste film on the transfer stage 24 by moving horizontally in the Y direction relative to the transfer stage 24.

[0043] The scraping unit 34 is configured by attaching a scraper 47 to a block-shaped scraper fixing member 48. The scraper 47 is a scraping squeegee and is an example of a squeegee member. The scraper 47 is biased downward, and its lower end is in contact with the transfer surface 30a regardless of the height position of the transfer stage 24. As the transfer stage 24 is moved back and forth in the Y direction by the stage driving means, the scraper 47 scrapes the paste coating film (paste P) on the transfer stage 24. For example, the scraper 47 is made of a swelling material such as urethane rubber.

[0044] That is, the scraping unit 34 functions as a paste scraping section that scrapes the paste coating film formed on the transfer stage 24 by moving horizontally relative to the transfer stage 24 along the Y direction.

[0045] 3A and 3C, the paste transfer device 7 includes a sensor 100. The sensor 100 detects the presence or absence of the paste P on the upper surface of the side wall 31A in cooperation with, for example, the control and drive unit 51. The sensor 100 may be, for example, an optical sensor that detects using light, or a camera that captures an image.

[0046] 3A, a unit-side connection part 50 is provided on the engagement part 20a provided on the underside of the unit base part 20. The unit-side connection part 50 includes an air coupler 50a and an electric connector 50b. The air coupler 50a is connected to a control and drive unit 51 via an air pipe. The electric connector 50b is connected to the control and drive unit 51 via an electric wiring. The control and drive unit 51 is built in the paste transfer device 7.

[0047] The control and drive unit 51 controls and drives the motor 27 which is the drive source of the stage drive means and the motor 45 which is the drive source of the film forming unit 33. The control and drive unit 51 supplies and controls compressed air for discharging the paste P from the paste supply syringe 35. The control and drive unit 51 acquires detection information from the sensor 100 (for example, the light reception result by the light receiving sensor or the image captured by the camera), and detects the presence or absence of paste P on the upper surface of the side wall 31A based on the detection information.

[0048] A base-side connection section 52 is provided at the rear end of the feeder base 16. The base-side connection section 52 includes an air coupler 52a and an electric connector 52b. The air coupler 52a is connected to a control / power supply section 53 via an air pipe. The electric connector 52b is connected to a compressed air supply source 54 via an electric wiring. The control / power supply section 53 and the compressed air supply source 54 are built into the electronic component mounter 1 equipped with the paste transfer device 7.

[0049] When the paste transfer device 7 is slid forward along the feeder base 16 and attached, the unit-side connection part 50 fits into the base-side connection part 52. This electrically connects the control and power supply part 53 to the control and drive unit 51. Furthermore, compressed air can be supplied to the control and drive unit 51 from the compressed air supply source 54. Then, when the paste transfer device 7 is slid backward, these connections are interrupted. In this way, the paste transfer device 7 is configured to include the unit-side connection part 50 that is connected to the base-side connection part 52 provided on the feeder base 16 and that transmits control signals and supplies power.

[0050] Next, the sensor 100 will be described in detail.

[0051] When the sensor 100 is an optical sensor, the sensor 100 includes an emission sensor 100A as an emission unit and a light-receiving sensor 100B as a light-receiving unit, as shown in FIGS. 3A, 3B, 3C, and FIG. 4 (described later). The emission sensor 100A emits light L1. The emission sensor 100A emits light L1, for example, along the base 30 of the transfer stage 24, i.e., along a horizontal plane (XY plane). The light-receiving sensor 100B receives the light L1 emitted from the emission sensor 100A. The emission sensor 100A and the light-receiving sensor 100B are installed, for example, facing each other. For example, the emission sensor 100A is installed on one of the two side walls 31A, and the light-receiving sensor 100B is installed on the other of the two side walls 31A. The light-receiving sensor 100B sends the light-receiving result to the control and drive unit 51. The light emitting sensor 100A may emit light L1 in a direction not along the horizontal plane, and the light receiving sensor 100B may receive light L1 arriving from a direction not along the horizontal plane.

[0052] Therefore, the emission sensor 100A may emit light L1 from one side wall 31A (e.g., side wall 31A1) toward the other side wall 31A (e.g., side wall 31A2). The light receiving unit may receive the light on the other, first side wall side. The optical axis of light L1 traveling from the emission sensor 100A toward the light receiving sensor 100B may be along a direction perpendicular to the film formation direction in which the paste P is formed and parallel to the film formation surface of the paste P.

[0053] If the sensor 100 is a camera, it captures an image of an imaging range including the upper surface of the side wall 31A to obtain a captured image. The camera may be disposed in any position in the paste transfer device 7 where it can capture an image of the upper surface of the side wall 31A. For example, the camera may be disposed in the same position as the optical sensor, that is, the same position as the light emitting sensor 100A or the light receiving sensor 100B. The sensor 100 sends the captured image to the control and drive unit 51.

[0054] When the sensor 100 is a reflective optical sensor that combines an emission sensor 100A and a light receiving sensor 100B, the reflective optical sensor is disposed above the side wall 31A. The reflective optical sensor sends the light reception result to the control and drive unit 51.

[0055] The control and drive unit 51 may obtain a light reception result from the sensor 100 (light receiving sensor 100B) and detect the presence or absence of paste P on the upper surface of the side wall 31A based on the light reception result. For example, if the light reception result indicates that light L1 from the emission sensor 100A is blocked by some object, the control and drive unit 51 may determine that the object blocking the light is paste P on the upper surface of the side wall 31A and detect the presence of paste P. Furthermore, the control and drive unit 51 may obtain an image captured by a camera serving as the sensor 100 and perform image processing on the captured image to detect (recognize) the presence or absence of paste P on the upper surface of the side wall 31A.

[0056] Furthermore, when the control and drive unit 51 detects the presence of paste P on the upper surface of the sidewall 31A, it outputs the detection of paste P to the outside. The output destination here is the control and power supply unit 53 of the electronic component mounter 1, which is equipped with the paste transfer device 7 including the sensor 100 that detected the paste P. When the electronic component mounter 1 receives the detection of paste P, the control and power supply unit 53 outputs warning information that there is a possibility that the paste P will overflow from inside the transfer stage 24 to the outside of the transfer stage 24 to a display, speaker, or other display unit connected to the electronic component mounter 1, and causes this information to be displayed. Upon receiving this information, an operator operating the paste transfer device 7 or the electronic component mounter 1 can check the state of the paste P visually or by using an image captured by a camera, and then make a predetermined input to an input unit (e.g., an operation panel) of the electronic component mounter 1. The control and drive unit 51 receives input from the operator via the input section and stops the discharge (supply of paste P) from the paste supply syringe 35 or adjusts the amount of discharge so that the paste P does not overflow from inside the transfer stage 24 to outside the transfer stage 24.

[0057] Here, when the control and drive unit 51 detects the presence of paste P on the upper surface of the side wall 31A, it may perform a determination as to whether the paste P has overflowed from inside the transfer stage 24 to the outside of the transfer stage 24. When the control and drive unit 51 determines that the paste P will overflow from inside the transfer stage 24 to the outside of the transfer stage 24, it may issue a warning regarding the overflow of the paste P. The notification unit for this warning may be, for example, a display or a speaker. The notification by the notification unit may be, for example, a display or a sound output by a speaker, similar to when an operator operating the paste transfer device 7 or electronic component mounter 1 checks the state of the paste P visually or by an image captured by a camera. The warning information may be, for example, a warning message indicating that there is a sign of overflowing of the paste P, a warning sound output, or an LED display.

[0058] If there is a sign that the paste P is about to overflow from inside the transfer stage 24 to the outside of the transfer stage 24, the worker operating the paste transfer device 7 or the electronic component mounting machine 1 may make a predetermined input to an input unit (e.g., an operation panel) of the electronic component mounting machine 1. The control and drive unit 51 may receive the input from the worker via the input unit and stop the movement of the transfer stage 24 along the Y direction.

[0059] In addition, instead of input by the operator operating the paste transfer device 7 or electronic component mounting machine 1 based on visual inspection or confirmation of images captured by a camera, the ejection of paste P may be stopped or the movement of the transfer stage 24 may be stopped based on a command from the control and drive unit 51 or the control and power supply unit 53 (i.e., the control and drive unit 51).

[0060] As shown in FIG. 3C , the sensor 100 is fixed to a bracket 101. The bracket 101 is connected to a frame 20f of the unit base 20. The frame 20f is at least a part of the members constituting the outer frame of the unit base 20, or other members connected to the members constituting the outer frame. The bracket 101 is, for example, disposed perpendicular to the upper surface of the unit base 20, that is, disposed along the vertical direction, and fixes the position of the sensor 100. The back surface of the sensor 100 is attached along the installation surface of the bracket 101 on which the sensor 100 is installed.

[0061] In this way, the sensor 100 is fixed to the unit base part 20. On the other hand, the transfer stage 24 is movable in the Y direction. Therefore, the sensor 100 moves relative to the transfer stage 24 in the Y direction. Therefore, the sensor 100 can detect the presence or absence of paste P on the upper surface of the side wall 31A when the transfer stage 24 is at various different positions in the Y direction. Note that the sensor 100 may not be fixed to the unit base part 20, but may be movable relative to the unit base part 20 in the Y direction.

[0062] Next, the details of the configuration around the film-forming squeegee 37, the scraper 47, the transfer stage 24, and the sensor 100 will be described.

[0063] FIG. 4 is a top view showing at least a portion of the periphery of the film-forming squeegee 37, the scraper 47, the transfer stage 24, and the sensor 100. FIG. 5 is a cross-sectional view taken along the line CC of FIG. 4. In FIG. 5, not only the end faces on the line CC shown in FIG. 4 but also the tip side in the line of sight (the arrow shown relative to the line CC in FIG. 4) are visualized. FIG. 6 is a perspective view showing at least a portion of the periphery of the film-forming squeegee 37, the scraper 47, the transfer stage 24, and the sensor 100. Like FIG. 5, FIG. 6 visualizes the end faces on the line CC as well as the tip side in the line of sight (the arrow shown relative to the line CC in FIG. 4).

[0064] As shown in FIGS. 4 to 6, the paste transfer device 7 is provided with a film-forming squeegee 37 extending along the X direction above the transfer stage 24, and a scraper 47 extending along the X direction. The film-forming squeegee 37 is fixed to a squeegee fixing member 38. The squeegee fixing member 38 is connected to a bracket erected on the unit base portion 20 near the side wall 31A. The squeegee fixing member 38 is arranged so as to be able to move up and down relative to the base portion 30 of the transfer stage 24. Therefore, the film-forming squeegee 37 is arranged so as to be able to move relatively in the Y direction with respect to the transfer stage 24, and can move up and down along the Z direction.

[0065] The scraper 47 is formed of, for example, a thin plate-like member. The scraper 47 is supported by a scraper support member 47A. The scraper support member 47A, for example, clamps and holds the scraper 47. The scraper support member 47A is connected to a scraper fixing member 48 using, for example, fastening members 48A (e.g., screws or bolts), to fix the position of the scraper support member 47A, and therefore the position of the scraper 47. The scraper fixing member 48 has, for example, a shape symmetrical between the positive and negative sides in the X direction. The scraper fixing member 48 is connected to a bracket connected to the unit base portion 20 near the side wall 31A with respect to the transfer stage 24. The bracket may be the same as or different from the above-mentioned bracket (e.g., bracket 101). For example, the scraper fixing member 48 is fixed to the bracket using a plate-like member 49A arranged on the upper surface of the scraper fixing member 48 and fastening members (e.g., screws or bolts). Therefore, the scraper 47 is disposed so as to be movable in the Y direction relative to the transfer stage 24 while being in contact with the base portion 30.

[0066] In this way, the film-forming squeegee 37 and the scraper 47 do not move together with the transfer stage 24, but are fixed to the bracket or the unit base portion 20. As a result, when the transfer stage 24 moves relative to the unit base portion 20, the film-forming squeegee 37 and the scraper 47 move relative to the transfer stage 24 in the opposite direction to the movement direction of the transfer stage 24 relative to the unit base portion 20. Therefore, when the transfer stage 24 moves back and forth relative to the unit base portion 20, the film-forming squeegee 37 and the scraper 47 move back and forth relative to the transfer stage 24 in the opposite direction.

[0067] Furthermore, the length L of the side wall 31A along the X direction (also referred to as the thickness of the side wall 31A) should be at least as long as the paste P can remain on the upper surface of the side wall 31A. The length L is, for example, 30 mm. For example, if the length L is 10 mm, it takes a short time for the paste P to overflow from the upper surface of the side wall 31A. If the length L1 is 30 mm, the paste P can remain on the upper surface of the side wall 31A for a certain amount of time, ensuring sufficient time for the paste P to overflow.

[0068] The paste transfer device 7 also has a handle 102. The handle 102 is attached to the transfer stage 24. The transfer stage 24 is detachable from the unit base portion 20. The transfer stage 24 can be easily carried by an operator by gripping the handle 102.

[0069] Next, the film forming operation and scraping operation performed by the paste transfer device 7 will be described.

[0070] FIG. 7 is a diagram illustrating the operation of the paste transfer device 7. As shown in FIG.

[0071] First, the paste transfer device 7 performs a film formation operation of the paste P. In state A, the transfer stage 24 is in the retracted position. Furthermore, before the start of the film formation operation, the film formation squeegee 37 and the scraper 47 are positioned at the end of the transfer surface 30a on the film formation start side (the right end in this example). Furthermore, the paste P is supplied onto the base portion 30 between the film formation squeegee 37 and the scraper 47 via the needle 35a.

[0072] At the start of the film forming operation, the film forming gap g1 (see FIG. 3B) is set to an appropriate film thickness t for transferring the paste P to the bumps 5a of the electronic component 5 (see state C).

[0073] Next, as shown in state B, the control unit drives the stage moving means to move the transfer stage 24 forward (arrow b), causing the paste P to be spread on the transfer surface 30a by the film-forming squeegee 37, and a paste coating film Pa having a film thickness t is formed on the transfer surface 30a.

[0074] Next, as shown in state C, the control unit moves the mounting head 11A, which holds the electronic components 5 on the multiple nozzles 11a, onto the transfer stage 24. Here, the control unit raises and lowers the nozzles 11a (arrow c) to perform a transfer operation, thereby applying the paste P to the bumps 5a of the electronic components 5 by transfer.

[0075] Next, the paste transfer device 7 performs a scraping operation of the paste P. That is, as shown in state D, the control unit moves the transfer stage 24 backward (arrow e) while raising the film-forming squeegee 37 (arrow d). As a result, the paste P present on the transfer surface 30a is scraped to one side by the scraper 47 and accumulated between the film-forming squeegee 37 and the scraper 47. Then, the state returns to state A. Thereafter, the paste transfer device 7 repeatedly performs the film-forming operation and the scraping operation in the same manner.

[0076] The control section here may be the control and drive unit 51, the control and power supply section 53, or another control section or control device.

[0077] According to the paste transfer device 7 of this embodiment, even when the paste P supplied to the transfer stage 24 rises and attempts to climb over the side wall 31A, the sensor 100 can detect signs that the paste P is about to overflow from the transfer stage 24. For example, since the paste P is supplied between the film forming squeegee 37 and the scraper 47, the paste P is likely to accumulate in this area, and from this area the paste P is likely to overflow outside the transfer stage 24. Even in this case, the sensor 100 can detect signs that the paste P is about to overflow from the transfer stage 24.

[0078] It is possible that the paste P may try to overflow from other places on the transfer stage 24 than the upper surface of the side wall 31A between the film-forming squeegee 37 and the scraper 47, but the paste P is more likely to overflow first from between the film-forming squeegee 37 and the scraper 47. The sensor 100 can detect a state in which a certain amount of paste P has accumulated on the transfer stage 24, that is, a state in which the paste P is present on the upper surface of the side wall 31A.

[0079] It is also possible that paste P overflows from side wall 31A and then overflows from side wall 31B. Therefore, sensor 100 may detect paste P on the upper surface of side wall 31B as a sign that paste P will overflow from side wall 31B. Alternatively, multiple sensors 100 may be provided, with one sensor 100 detecting the presence or absence of paste P on the upper surface of side wall 31A and another sensor 100 detecting the presence or absence of paste P on the upper surface of side wall 31B.

[0080] Furthermore, in the paste transfer device 7, the position of the sensor 100 is variable along the Y direction relative to the transfer stage 24. Therefore, the paste transfer device 7 can detect the overflowing paste P no matter from which position along the Y direction of the side wall 31A the paste P is about to overflow.

[0081] Furthermore, since the paste transfer device 7 detects whether or not the paste P is present on the upper surface of the side wall 31A, even if the paste P has accumulated between the film-forming squeegee 37 and the scraper 47, it can determine that the paste P is not about to overflow if the paste P is not present on the upper surface of the side wall 31A. Therefore, the paste transfer device 7 can avoid detecting the accumulation of paste P as abnormal when, for example, the paste P is normally accumulated between the film-forming squeegee 37 and the scraper 47, and can accurately detect only the state in which the paste P is about to overflow from the transfer stage 24.

[0082] (Outline of the embodiment) As a result, the present disclosure describes at least the following: Note that, in parentheses, examples of components corresponding to the above-described embodiments are given, but the present disclosure is not limited to these.

[0083] [Item 1] A paste transfer device (paste transfer device 7) that transfers paste (paste P) to an electronic component (electronic component 5), a transfer stage (transfer stage 24) having a rectangular plate-shaped base portion (base portion 30) to which the paste is supplied, first side walls (side walls 31A, 31A1, 31A2) rising from both end sides (30a1, 30a2) of the base portion along a first direction (Y direction) that is a film formation direction in which the paste is formed into a film, and second side walls (side walls 31B, 31B1, 31B2) rising from both end sides (30b1, 30b2) of the base portion along a second direction (X direction) perpendicular to the first direction; a sensor (sensor 100) capable of detecting the paste on the top surface of the first sidewall; A paste transfer device comprising:

[0084] This allows the paste transfer device to recognize in advance whether there is a sign of paste overflowing from the transfer stage, based on the presence or absence of paste on the upper surface of the first side wall within the transfer stage that is close to the outside of the transfer stage, before the paste overflows. At this time, the paste transfer device can accurately detect the sign of paste overflowing from within the transfer stage to the outside of the transfer stage.

[0085] [Item 2] a control unit that issues a warning about overflow of the paste from the transfer stage when the paste is detected by the sensor, Item 1. The paste transfer device according to item 1.

[0086] This allows the paste transfer device to warn the operator that there is a possibility that the paste may overflow from the transfer stage.

[0087] [Item 3] and a control unit that outputs to an external device, when the paste is detected by the sensor, that the paste has been detected. Item 1. The paste transfer device according to item 1.

[0088] This allows the worker to take appropriate measures if there are signs that the paste is about to overflow.

[0089] [Item 4] the sensor includes an optical sensor; Item 1. The paste transfer device according to item 1.

[0090] This allows the paste transfer device to accurately detect signs of paste overflowing from the transfer stage optically with a simple configuration, allowing the operator to take the necessary measures.

[0091] [Item 5] The sensor includes an emission section (emission sensor 100A) that emits light (light L1) and a light receiving section (light receiving sensor 100B) that receives the light, the first side wall includes one first side wall (side wall 31A1) and another first side wall (side wall 31A2); the emission portion emits the light from the one first side wall side toward the other first side wall side, the light receiving unit receives the light on the other first side wall side; Item 5. The paste transfer device according to item 4.

[0092] This allows the paste transfer device to accurately detect signs of paste overflowing from the transfer stage optically, for example by arranging the light emitting unit and the light receiving unit in parallel opposite directions across the base, allowing the operator to take the necessary action.

[0093] [Item 6] an optical axis of the light traveling from the light emitting portion to the light receiving portion is aligned along a direction perpendicular to a film-forming direction in which the paste is formed into a film and is parallel to a film-forming surface of the paste; Item 6. The paste transfer device according to item 5.

[0094] This allows the paste transfer device to emit and receive light parallel to the base and horizontal plane, making it easier to detect only the paste near the top surface of the side wall. Therefore, the paste transfer device can accurately determine whether the paste will overflow from the transfer stage even when the paste is normally deposited in a specific location where it is likely to accumulate.

[0095] [Item 7] The first side wall has a predetermined thickness (length L) that allows the paste to remain on the upper surface. Item 1. The paste transfer device according to item 1.

[0096] This allows the paste transfer device to take time for the paste to remain on the upper surface of the side wall and move outside the transfer stage, allowing the operator to take any action they like with the paste on the transfer stage during this time.

[0097] [Item 8] a unit base portion (unit base portion 20) to which the transfer stage is attached, the sensor is installed at a fixed position relative to the unit base portion, the transfer stage is installed so as to be movable along the film formation direction relative to the unit base portion; Item 1. The paste transfer device according to item 1.

[0098] This allows the paste transfer device to move the transfer stage along the film-forming direction even when the sensor is fixed to the unit base, and therefore the paste transfer device can scan the upper surface of the side wall along the film-forming direction to determine whether there is a possibility that the paste will overflow outside the transfer stage.

[0099] [Item 9] Item 9. An electronic component mounter (electronic component mounter 1) equipped with the paste transfer device according to any one of items 1 to 8.

[0100] This allows the electronic component mounter to recognize in advance whether there is a sign of paste overflowing from the transfer stage, before the paste overflows, based on the presence or absence of paste on the upper surface of the first sidewall closest to the outside of the transfer stage. Therefore, the electronic component mounter can mount electronic components using a paste transfer device that accurately detects signs of paste overflowing from inside the transfer stage to outside the transfer stage.

[0101] [Item 10] A method for detecting paste on a transfer stage having a rectangular plate-shaped base portion to which paste to be transferred to an electronic component is supplied, first side walls rising from both end sides of the base portion along a first direction which is a film-forming direction in which the paste is deposited, and second side walls rising from both end sides of the base portion along a second direction perpendicular to the first direction, the method comprising: detecting the presence or absence of the paste on the top surface of the first sidewall; A detection method comprising:

[0102] This allows the detection method to achieve the same effect as item 1.

[0103] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0104] The present disclosure is useful as a paste transfer device, an electronic component mounter, a detection method, and the like that can accurately detect signs of paste overflowing from inside the stage to outside the stage. [Explanation of symbols]

[0105] 1. Electronic component mounting machine 3. Circuit Board 4A,4B Electronic component supply section 5. Electronic Components 7 Paste transfer device 11A, 11B mounting head 20 Unit base 24 Transcription Stage 30 Base 30a1,30a2,30b1,30b2 Edge 31A,31A1,31A2,31B,31B1,31B2 Side wall 33 Film forming unit 34 scraping unit 37 Coating squeegee 38 Squeegee fixing member 47 Scraper 48 Scraper fixing member 51 Control and drive unit 100 sensors 100A Emission Sensor 100B Light receiving sensor 101 Bracket L1 light P Paste Pa paste coating

Claims

1. A paste transfer device that transfers paste to an electronic component, a transfer stage including a rectangular plate-shaped base portion to which the paste is supplied, first side walls rising from both end sides of the base portion along a first direction which is a film-forming direction in which the paste is deposited, and second side walls rising from both end sides of the base portion along a second direction perpendicular to the first direction; a sensor capable of detecting the paste on the top surface of the first sidewall; A paste transfer device comprising:

2. a control unit that issues a warning about overflow of the paste from the transfer stage when the paste is detected by the sensor, The paste transfer device according to claim 1 .

3. and a control unit that outputs to an external device, when the paste is detected by the sensor, that the paste has been detected. The paste transfer device according to claim 1 .

4. the sensor includes an optical sensor; The paste transfer device according to claim 1 .

5. the sensor includes an emission unit that emits light and a light receiving unit that receives the light; the first sidewalls include one first sidewall and another first sidewall, the emission portion emits the light from the one first side wall side toward the other first side wall side, the light receiving unit receives the light on the other first side wall side; The paste transfer device according to claim 4 .

6. an optical axis of the light traveling from the light emitting portion to the light receiving portion is aligned along a direction perpendicular to a film-forming direction in which the paste is formed into a film and is parallel to a film-forming surface of the paste; The paste transfer device according to claim 5 .

7. The first side wall has a predetermined thickness that allows the paste to remain on the upper surface. The paste transfer device according to claim 1 .

8. a unit base portion to which the transfer stage is attached, the sensor is installed at a fixed position relative to the unit base portion, the transfer stage is disposed so as to be movable along the film formation direction relative to the unit base portion; The paste transfer device according to claim 1 .

9. An electronic component mounting machine comprising the paste transfer device according to claim 1.

10. A method for detecting paste on a transfer stage having a rectangular plate-shaped base portion to which paste to be transferred to an electronic component is supplied, first side walls rising from both end sides of the base portion along a first direction which is a film-forming direction in which the paste is deposited, and second side walls rising from both end sides of the base portion along a second direction perpendicular to the first direction, the method comprising: detecting the presence or absence of the paste on the top surface of the first sidewall; A detection method comprising:

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