Method for manufacturing a light-emitting device, method for manufacturing a light-emitting module, and light-emitting device

Abstract

To provide a method for manufacturing a light-emitting device that can reduce the warping of the light source, a method for manufacturing a light-emitting module, and a light-emitting device. [Solution] A method for manufacturing a light-emitting device comprises the steps of: preparing a collective light source unit; preparing a wiring board including a plurality of first substrates; a bonding step which includes placing a first bonding material between a pair of first wiring sections of the first substrate and a pair of electrode sections of the light-emitting section in the corresponding light source unit, with the first main surface of the collective light source unit and the first surface of the first substrate facing each other, and heating the first bonding material to form a first bonding member; and a step which separates the device into a plurality of light-emitting devices by cutting a resin member located between adjacent light source units.

Description

[Technical Field]

[0001] This disclosure relates to a method for manufacturing a light-emitting device, a method for manufacturing a light-emitting module, and a light-emitting device. [Background technology]

[0002] For example, Patent Document 1 discloses a method in which LED chips are placed on each of a plurality of support frames that are separated from each other, the plurality of support frames and the plurality of LED chips are covered with resin, and then the resin is cut between adjacent support frames and between adjacent LED chips. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Special Publication No. 2021-527941 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] The purpose of this disclosure is to provide a method for manufacturing a light-emitting device that can reduce the warping of the light source, a method for manufacturing a light-emitting module, and a light-emitting device. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, a method for manufacturing a light-emitting device is a step of preparing a collective light source unit, wherein the collective light source unit has a first main surface and a second main surface located opposite to the first main surface, the collective light source unit has a plurality of light sources and a resin member that holds the plurality of light sources together, the light sources have one or more light-emitting parts including a light-emitting element, the light-emitting parts have a light-emitting surface exposed from the resin member on the second main surface and a pair of electrode parts exposed from the resin member on the first main surface, and a step of preparing a wiring board including a plurality of first substrates. The invention comprises the steps of: preparing a wiring board, each of which corresponds to each of the light sources and has a first surface, with one or more pairs of first wiring sections located on the first surface side; a bonding step, which includes placing a first bonding material between the pair of first wiring sections of the first substrate and the pair of electrode sections of the light-emitting section in the corresponding light source, and heating the first bonding material to form a first bonding member; and separating the resin member located between adjacent light sources into a plurality of light-emitting devices by cutting it.

[0006] According to one aspect of the present disclosure, a method for manufacturing a light-emitting module comprises the steps of: preparing a light-emitting device obtained by the above method for manufacturing a light-emitting device; preparing a second substrate having an upper surface; and a bonding step of arranging the light-emitting device on the upper surface of the second substrate via a second bonding material, and heating the second bonding material to form a second bonding member, wherein the melting point of the first bonding material is higher than the melting point of the second bonding material.

[0007] According to one aspect of the present disclosure, the light-emitting device comprises a first substrate having a first surface and a base material, and one or more pairs of wiring portions disposed on the first surface side of the base material; one or more light-emitting units including a light-emitting element having a pair of electrode portions; and a resin member holding the one or more light-emitting units, wherein the pair of electrode portions of the light-emitting units are exposed from the resin member on the first main surface; and a first connecting member that electrically connects the pair of electrode portions of the light-emitting units and the pair of first wiring portions of the first substrate when the first surface of the first substrate and the first main surface of the light-emitting unit are facing each other, wherein in a plan view, the outer edge of the first substrate is located inside the outer edge of the light-emitting unit, and on the first surface side of the first substrate, the base material of the first substrate is separated from the resin member. [Effects of the Invention]

[0008] According to this disclosure, it is possible to provide a method for manufacturing a light-emitting device that can reduce the warping of the light source, a method for manufacturing a light-emitting module, and a light-emitting device. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic plan view of a light-emitting device according to an embodiment. [Figure 2] This is a schematic cross-sectional view along line II-II in Figure 1. [Figure 3] This is a schematic plan view showing the arrangement relationship between the first wiring section of the first substrate and the electrode sections of the multiple light-emitting units in a modified light-emitting device of the embodiment. [Figure 4] Figure 3 is a schematic plan view of the first side of the first substrate where the first wiring section is located. [Figure 5] This is a schematic plan view of the light-emitting module according to the embodiment. [Figure 6] Figure 5 is a schematic cross-sectional view along the line VI-VI. [Figure 7] This is a schematic cross-sectional view illustrating one step in the manufacturing method of a light-emitting device according to an embodiment. [Figure 8] This is a schematic cross-sectional view illustrating one step in the manufacturing method of a light-emitting device according to an embodiment. [Figure 9] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 10] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 11] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 12] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 13] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 14] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 15] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 16] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 17] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 18] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 19] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 20] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 21] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 22] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 23] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Figure 24] It is a schematic cross-sectional view for explaining one step of a method for manufacturing a light-emitting device according to an embodiment. [Modes for carrying out the invention]

[0010] Hereinafter, with reference to the drawings, a method for manufacturing a light-emitting device, a method for manufacturing a light-emitting module, a light-emitting device, and a light-emitting module according to the embodiments of this disclosure will be described. The embodiments shown below are illustrative examples of methods for manufacturing a light-emitting device, a method for manufacturing a light-emitting module, a light-emitting device, and a light-emitting module that embody the technical concept of this embodiment, and are not limited thereto. Furthermore, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are merely illustrative examples and are not intended to limit the scope of this disclosure unless specifically stated otherwise. Note that the size, positional relationships, etc. of the members shown in each drawing may be exaggerated to clarify the explanation. In addition, in the following description, the same name and reference numerals indicate the same or similar members, and detailed explanations will be omitted as appropriate. In addition, in some cases, end view diagrams showing only the cut surface will be shown as cross-sectional views.

[0011] In the following description, terms indicating specific directions or positions (e.g., "up," "down," and other terms including these) may be used. However, these terms are used merely for clarity to indicate the relative directions or positions in the referenced drawings. If the relative directional or positional relationships expressed by terms such as "up" and "down" in the referenced drawings are the same, the arrangement in drawings other than those disclosed, actual products, etc., does not have to be the same as in the referenced drawings. In this specification, the positional relationship expressed as "up (or down)" includes, for example, the case where two members are in contact with each other, and the case where the two members are not in contact but one member is located above (or below) the other member.

[0012] In the diagrams shown below, directions may be indicated by the X, Y, and Z axes. The X direction along the X axis indicates a predetermined direction within the light-emitting surface of the light-emitting device according to the embodiment. The Y direction along the Y axis indicates a direction perpendicular to the X direction within the light-emitting surface. The Z direction along the Z axis indicates a direction perpendicular to the light-emitting surface. That is, in the embodiment, the light-emitting surface of the light-emitting device is parallel to the XY plane, and the Z axis is perpendicular to the XY plane. Also, the direction in which the Z-axis arrow points is considered relatively upward or upward, and the opposite direction of the Z-axis arrow is considered relatively downward or downward. In the terminology of the embodiment, "planar view" means viewing the object from above. For example, in the terminology of the embodiment, "planar view" means viewing the object from the +Z direction to the -Z direction. In this specification, in addition to parts that can be directly seen from above, parts that cannot be directly seen from above may also be described as if they were transparent. Also, the same terminology may be used before and after processing including individual pieces, such as the translucent member 30 and the resin member 40.

[0013] [Light-emitting device] Figure 1 is a schematic plan view of the light-emitting device 1 according to an embodiment. Figure 2 is a schematic cross-sectional view taken along line II-II in Figure 1.

[0014] The first direction X is defined as a direction along the X-axis on the light-emitting surface of the light-emitting device 1. The second direction Y is defined as a direction intersecting the first direction X on the light-emitting surface of the light-emitting device 1, for example, a direction along the Y-axis. The third direction Z is defined as a direction perpendicular to the light-emitting surface of the light-emitting device 1, for example, a direction along the Z-axis. Note that the first, second, and third directions do not necessarily have to be along the X-axis, Y-axis, and Z-axis, respectively.

[0015] The light-emitting device 1 comprises a first substrate 201, a light source unit 110, and a first bonding member 301. Each component will be described in detail below.

[0016] <First substrate> The first substrate 201 is a support member that supports the light source unit 110. The first substrate 201 is also a heat dissipation member that releases heat generated by the light source unit 110. Furthermore, the first substrate 201 is a wiring member that electrically connects the light source unit 110 to an external power supply.

[0017] As shown in Figure 2, the first substrate 201 has a first surface 201A and a second surface 201B located on the opposite side of the first surface 201A in the third direction Z. The first substrate 201 has a first base material 203, one or more pairs of first wiring sections 211 arranged on the first surface 201A side, and one or more pairs of second wiring sections 212 arranged on the second surface 201B side.

[0018] The first base material 203 is an insulator. For example, aluminum nitride, aluminum oxide, silicon nitride, or resin can be used as the material for the first base material 203. When silicon nitride is used as the material for the first base material 203, the thickness of the first substrate 201 can be reduced while maintaining the mechanical strength of the first substrate 201. When aluminum nitride is used as the material for the first base material 203, the heat generated by the light source 110 can be efficiently dissipated.

[0019] A pair of first wiring sections 211 includes a positive wiring section and a negative wiring section. Multiple pairs of first wiring sections 211, each including a positive wiring section and a negative wiring section, are arranged on the first surface 201A side of the first substrate 201. The first surface 201A of the first substrate 201 includes the upper surface of the first base material 203 and the upper surface of the first wiring section 211. A pair of first wiring sections 211 only needs to include a positive wiring section and a negative wiring section, and may consist of two wiring sections or three or more wiring sections.

[0020] Each pair of second wiring sections 212 includes a positive wiring section and a negative wiring section. Multiple pairs of second wiring sections 212, each including a positive wiring section and a negative wiring section, are arranged on the second surface 201B side of the first substrate 201. The second surface 201B of the first substrate 201 includes the lower surface of the first base material 203 and the lower surface of the second wiring sections 212. Each pair of second wiring sections 212 only needs to include a positive wiring section and a negative wiring section, and may consist of two wiring sections or three or more wiring sections.

[0021] The first wiring section 211 and the second wiring section 212 are electrically connected, for example, via conductive vias that penetrate the first base material 203.

[0022] As the material for the first wiring section 211 and the second wiring section 212, at least one of the following can be used: copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or alloys thereof. In addition, the surface layers of the first wiring section 211 and the second wiring section 212 may be provided with layers of silver, platinum, aluminum, rhodium, gold, or alloys thereof, from the viewpoint of at least one of the wettability and light reflectivity of the joining members.

[0023] In Figure 1, the outer edge of the first substrate 201 in plan view is shown by a dashed line. The outer edge of the first substrate 201 in plan view is the outer edge of the first base material 203. The shape of the first surface 201A of the first substrate 201 in plan view is, for example, rectangular.

[0024] <Light source section> The light source unit 110 has a first main surface 110A facing the first substrate 201 in the third direction Z, and a second main surface 110B located on the opposite side of the first main surface 110A in the third direction Z. The second main surface 110B becomes the light-emitting surface of the light-emitting device 1.

[0025] The light source unit 110 includes one or more light-emitting units 10 and a resin member 40 that holds one or more light-emitting units 10. In this embodiment, the light source unit 110 has a plurality of light-emitting units 10, and the resin member 40 holds the plurality of light-emitting units 10 together.

[0026] As shown in Figure 1, the light-emitting device 1 has, for example, nine light-emitting units 10. For example, 3 x 3 light-emitting units 10 are arranged in the first direction X and the second direction Y. The number and arrangement of the light-emitting units 10 shown in Figure 1 are just examples and are not limited thereto.

[0027] The light-emitting device 1 can be used, for example, as a flash light source for an imaging device. The imaging device is, for example, mounted on a mobile communication terminal. When the light-emitting device 1 shown in Figure 1 is used as a flash light source for an imaging device, it is possible to switch between, for example, a first emission mode in which the light-emitting part 10 located in the center in a plan view emits light, and a second emission mode in which all light-emitting parts 10 emit light and emit light with a wider beam angle than the beam angle in the first emission mode. For example, when the imaging device is in telephoto shooting mode, the light-emitting device 1 is switched to the first emission mode, and when the imaging device is in wide-angle shooting mode, the light-emitting device 1 is switched to the second emission mode.

[0028] (Light-emitting part) The light-emitting unit 10 includes a light-emitting element 20. The light-emitting element 20 is, for example, an LED (Light Emitting Diode) or an LD (Laser Diode). The light-emitting element 20 has a semiconductor structure 21 and a pair of electrode parts 22.

[0029] The semiconductor structure 21 includes a nitride semiconductor. Nitride semiconductors include, for example, In x Al y Ga 1-x-yThe semiconductor structure 21 includes semiconductors of all compositions in which the composition ratios x and y are varied within their respective ranges in the chemical formula N(0≦x≦1,0≦y≦1,x+y≦1). Furthermore, nitride semiconductors also include those in the above chemical formula that further contain group V elements other than N (nitrogen), and those that further contain various elements added to control various physical properties such as the conductivity type of the semiconductor. The semiconductor structure 21 includes an emissive layer. The emissive layer may have an MQW (Multiple Quantum Well) structure, for example, that includes multiple barrier layers and multiple well layers. The light emitted by the emissive layer is, for example, ultraviolet light or visible light. The semiconductor structure 21 may include an element substrate, for example, a sapphire substrate.

[0030] Multiple semiconductor structures 21 may be separated from each other in the first direction X and the second direction Y, or parts of the semiconductor layers may be connected.

[0031] The light-emitting element 20 has an element light-emitting surface 20A and a pair of electrode portions 22 located on the opposite side of the element light-emitting surface 20A in a third direction Z. One light-emitting element 20 has a pair of electrode portions 22 as shown in Figure 1. One of the pair of electrode portions 22 is the positive electrode portion (anode), and the other is the negative electrode portion (cathode). The pair of electrode portions 22 may include a positive electrode portion and a negative electrode portion, and may consist of two electrode portions or three or more electrode portions. As the material of the electrode portions 22, for example, a metal such as gold or copper can be used.

[0032] The light-emitting section 10 may further include a translucent member 30 disposed on the element light-emitting surface 20A of the light-emitting element 20. The translucent member 30 disposed on the light-emitting element 20 will be referred to as the translucent member 30A to distinguish it from the outer translucent member described later. The translucent member 30A is bonded to the element light-emitting surface 20A via an adhesive layer. Alternatively, the translucent member 30A is directly bonded to the element light-emitting surface 20A without an adhesive layer or the like.

[0033] As shown in Figure 1, the shape of the light-emitting element 20 in a plan view and the shape of the light-transmitting member 30A in a plan view are, for example, rectangular. For example, in a plan view, the outer edge of the light-emitting element 20 (shown by a dashed line) is located inside the outer edge of the light-transmitting member 30A (shown by a solid line). In a plan view, because the outer edge of the light-transmitting member 30A is located outside the outer edge of the light-emitting element 20, the light emitted from the light-emitting element 20 is efficiently incident on the light-transmitting member 30A.

[0034] In a plan view, the outer edge of the translucent member 30A may coincide with the outer edge of the light-emitting element 20, or it may be located inside the outer edge of the light-emitting element 20. This allows the light-emitting part 10 to emit narrow-angle light with reduced light spread, compared to the case where the outer edge of the translucent member 30A is located outside the outer edge of the light-emitting element 20 in a plan view.

[0035] The light-transmitting member 30A is transparent to light emitted by the light-emitting element 20. For example, the transmittance of the light-transmitting member 30A to light with a wavelength of 450 nm emitted by the light-emitting element 20 is 70% or more, preferably 80% or more, and more preferably 90% or more.

[0036] The light-transmitting member 30A can convert the wavelength of the light emitted by the light-emitting element 20 and / or diffuse it. In the light-emitting device 1 shown in Figure 2, the light-transmitting member 30A includes a wavelength conversion layer 32 disposed on the element light-emitting surface 20A and a light diffusion layer 31 disposed on the wavelength conversion layer 32.

[0037] The wavelength conversion layer 32 contains a phosphor. As the wavelength conversion layer 32, a resin, ceramic, or glass containing a phosphor, or a sintered body of a phosphor can be used.

[0038] For example, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, epoxy-modified resin, or phenolic resin can be used as the resin for the wavelength conversion layer 32. Silicone resin or a modified silicone resin, which has excellent light resistance and heat resistance, is particularly preferred as the resin for the wavelength conversion layer 32.

[0039] As the phosphor, for example, yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphors (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphors (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphors (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphors (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphors (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphors (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu) and other nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x:Mn where x satisfies 0 < x < 1), or fluoride-based phosphors such as MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2) can be used.

[0040] The wavelength conversion layer 32 may contain one type of phosphor or a plurality of types of phosphors. The light emitting part 10 emits, for example, light in which the light emitted by the light emitting element 20 and the light emitted by the phosphor in the wavelength conversion layer 32 excited by the light emitted by the light emitting element 20 are mixed. The plurality of light emitting parts 10 may be composed of light emitting parts 10 having the same emission peak wavelength, or may include light emitting parts 10 having different emission peak wavelengths.

[0041] The upper surface of the light diffusion layer 31 constitutes the upper surface of the translucent member 30A. The light diffusion layer 31 contains a light diffusion substance that diffuses the light emitted by the light emitting element 20. As the light diffusion layer 31, for example, a resin, ceramic, or glass containing a light diffusion substance can be used. As the light diffusion substance of the light diffusion layer 31, for example, titanium oxide or silicon oxide can be used. As the resin of the light diffusion layer 31, the resins mentioned as the resin of the wavelength conversion layer 32 can be used.

[0042] As shown in Figure 1, the translucent member 30 in this embodiment includes a plurality of first outer translucent members 30B and a plurality of second outer translucent members 30C, which are arranged outside the plurality of light-emitting parts 10 so as to surround the plurality of light-emitting parts 10 in a plan view. Each of the first outer translucent member 30B and the second outer translucent member 30C includes a wavelength conversion layer 32 and a light diffusion layer 31 arranged on the wavelength conversion layer 32, similar to the translucent member 30A on the light-emitting part 20. The first outer translucent member 30B and the second outer translucent member 30C have the same translucency, wavelength conversion function, and light diffusion function as the translucent member 30A on the light-emitting part 20.

[0043] The shape of the light-emitting surface of the light-emitting device 1 is, for example, rectangular. The light-emitting surface of the light-emitting device 1 includes the upper surface of the translucent member 30A on the light-emitting element 20, the upper surface of the first outer translucent member 30B, and the upper surface of the second outer translucent member 30C. The area of ​​the upper surface of the first outer translucent member 30B is smaller than the area of ​​the upper surface of the translucent member 30A on the light-emitting element 20, and the area of ​​the upper surface of the second outer translucent member 30C is smaller than the area of ​​the upper surface of the first outer translucent member 30B.

[0044] The first outer translucent member 30B is located adjacent to the outermost translucent member 30A in the first direction X and the outermost translucent member 30A in the second direction Y among the plurality of translucent members 30A. The second outer translucent member 30C is located at the corner of the light-emitting surface of the light-emitting device 1.

[0045] Multiple translucent members 30A are spaced apart from each other in a first direction X and a second direction Y. For example, the first distance between adjacent translucent members 30A is smaller than the second distance between adjacent semiconductor structures 21. This makes it possible to narrow the dark area between the translucent members 30A on the light-emitting surface of the light-emitting device 1. The first distance is preferably, for example, 5 μm or more and 30 μm or less. By setting the first distance to 5 μm or more, it is possible to reduce the amount of light emitted from one light-emitting unit 10 that reaches the adjacent light-emitting unit 10 in the vicinity of the light-emitting surface of one light-emitting unit 10. This makes it possible to create a light-emitting device 1 with good contrast. Furthermore, by setting the first distance to 30 μm or less, when the body color of the translucent members 30A and the body color of the resin members 40 placed between adjacent translucent members 30A are different, the difference in body color of the resin members 40 relative to the translucent members 30A becomes less noticeable when the light is not being emitted. This makes it possible to create a light-emitting device 1 that has an excellent appearance when not emitting light. A light-emitting device 1 with an excellent appearance refers to, for example, a light-emitting device that has a simple appearance in which the differences in color of each part are not emphasized when not emitting light.

[0046] Multiple first outer translucent members 30B arranged in the first direction X are spaced apart from each other in the first direction X. Multiple first outer translucent members 30B arranged in the second direction Y are spaced apart from each other in the second direction Y. Translucent member 30A and first outer translucent member 30B are spaced apart from each other in the first direction X and the second direction Y. First outer translucent member 30B and second outer translucent member 30C are spaced apart from each other in the first direction X and the second direction Y.

[0047] By providing a first outer translucent member 30B and a second outer translucent member 30C in the region outside the multiple light-emitting parts 10, the variation in appearance between the inner region where the translucent member 30A on the light-emitting element 20 is located and the outer region where the first outer translucent member 30B and the second outer translucent member 30C are located is reduced compared to a light-emitting device in which only a resin member 40 is located in the outer region. As a result, the light-emitting device 1 can have an excellent appearance when not emitting light.

[0048] As shown in Figures 1 and 2, no light-emitting element 20 is positioned below the first outer translucent member 30B and below the second outer translucent member 30C. A resin member 40 is positioned in contact with the lower surface of the first outer translucent member 30B (the lower surface of the wavelength conversion layer 32) and the lower surface of the second outer translucent member 30C (the lower surface of the wavelength conversion layer 32). Since there is no light-emitting element 20 below the first outer translucent member 30B and the second outer translucent member 30C, and furthermore, the light emitted from the light-emitting part 10 located inside the first outer translucent member 30B and the second outer translucent member 30C in a plan view is shielded by the resin member 40, it is difficult for the light to enter the first outer translucent member 30B and the second outer translucent member 30C. This makes it possible to create a light-emitting device 1 with high contrast (luminance ratio between the light-emitting region and the non-light-emitting region).

[0049] (Resin component) In this embodiment, the resin member 40 holds together a plurality of light-emitting parts 10, a plurality of first outer light-transmitting members 30B, and a plurality of second outer light-transmitting members 30C.

[0050] The resin member 40 is positioned between adjacent light-emitting elements 20 and covers the sides of the light-emitting elements 20 (the sides of the semiconductor structure 21 and the sides of the pair of electrode portions 22). On the first main surface 110A of the light source unit 110, the lower surfaces of the pair of electrode portions 22 are exposed from the resin member 40. The first main surface 110A of the light source unit 110 includes the lower surface of the resin member 40 and the lower surfaces of the pair of electrode portions 22.

[0051] The resin member 40 is positioned between adjacent translucent members 30 and covers the sides of the translucent members 30. On the second main surface 110B of the light source unit 110, the upper surface of the translucent member 30 is exposed from the resin member 40. The second main surface 110B of the light source unit 110 includes the upper surface of the translucent member 30 and the upper surface of the resin member 40 positioned between adjacent translucent members 30.

[0052] The resin member 40 includes, for example, a resin and a light-reflecting substance contained in the resin, and is reflective to the light emitted by the light source unit 110. As the resin of the resin member 40, for example, a thermosetting resin such as silicone resin, silicone-modified resin, epoxy resin, epoxy-modified resin, or phenolic resin can be used. Among these, silicone resin or a modified resin thereof, which has excellent light resistance and heat resistance, is particularly preferred. As the light-reflecting substance of the resin member 40, for example, titanium dioxide, silicon dioxide, etc. can be used. The resin member 40 may also be composed of a material that is translucent or light-absorbing to visible light. A material that is light-absorbing includes, for example, carbon black.

[0053] By arranging a light-reflective or light-absorbing resin member 40 between adjacent light-emitting elements 20, when one light-emitting element 20 is emitting light and the adjacent light-emitting element 20 is not emitting light, the emission of light from one light-emitting element 20 towards the non-emitting element 20 can be reduced. This makes it possible to create a light-emitting device 1 with high contrast.

[0054] By arranging a light-reflective or light-absorbing resin member 40 between adjacent translucent members 30, when one light-emitting element 20 emits light and the adjacent light-emitting element 20 does not emit light, the emitted light from one light-emitting element 20 can be incident on the translucent member 30 on the non-emitting light-emitting element 20, reducing the emission of light from the phosphor contained in the translucent member 30 on the non-emitting light-emitting element 20. This makes it possible to create a light-emitting device 1 with high contrast.

[0055] The resin member 40 is located outside the multiple light-emitting elements 20 in a plan view. By arranging the light-reflective or light-absorbing resin member 40 outside the multiple light-emitting elements 20 in a plan view, light leakage to the area where the multiple light-emitting elements 20 are arranged can be reduced, and stray light emitted in unintended directions can be reduced.

[0056] <First Joining Member> The first bonding member 301 is positioned between the pair of electrode portions 22 of the light-emitting portion 10 and the pair of first wiring portions 211 of the first substrate 201, with the first surface 201A of the first substrate 201 and the first main surface 110A of the light-emitting portion 110 facing each other in the third direction Z. The first bonding member 301 fixes the light-emitting portion 110 to the first substrate 201 and electrically connects the pair of electrode portions 22 and the pair of first wiring portions 211. The first bonding member 301 is conductive, for example, solder.

[0057] On the first surface 201A side of the first substrate 201, the first base material 203 of the first substrate 201 is separated from the resin member 40 of the light source unit 110. There is a gap 500 between the upper surface of the first base material 203 of the first substrate 201 and the lower surface of the resin member 40 of the light source unit 110. The size of the gap 500 is, for example, 20 μm or more and 200 μm or less, and 50 μm or more and 100 μm or less. The side surface of the first bonding member 301 and the side surface of the first wiring portion 211 are exposed from the resin member 40 in the gap 500.

[0058] Because the first base material 203 of the first substrate 201 and the resin member 40 of the light source unit 110 are separated, thermal stress due to the difference in coefficients of linear expansion between the first base material 203 and the resin member 40 can be reduced. This reduces the likelihood of cracks occurring in the first joining member 301 and / or the resin member 40.

[0059] To miniaturize the light-emitting device 1, the thickness of the light source unit 110 in the third direction Z is preferably, for example, 300 μm or less. Furthermore, the hardness of the first base material 203 of the first substrate 201 is preferably higher than the hardness of the resin member 40. Even if the light source unit 110 is thinned to miniaturize the light-emitting device 1, the warping of the light source unit 110 can be reduced because the light source unit 110 is bonded to the first base material 203, which has a higher hardness than the resin member 40, via the first bonding member 301. The hardness of the first base material 203 of the first substrate 201 is, for example, 1000 HV or higher, 1200 HV or higher, and 1400 HV or higher on a Vickers hardness scale. Furthermore, the hardness of the resin member 40 is, for example, 75 or lower on a Shore D hardness scale and 70 or lower. Vickers hardness and Shore D hardness can be compared using a hardness conversion table such as SAE J417. Alternatively, as another measurement method, the Young's modulus of each component may be compared, and the result may be used as a comparison of hardness. In this case, for example, a component with a high Young's modulus may be substituted for a component with high hardness. The Young's modulus of the first base material 203 of the first substrate 201 is, for example, 100,000 MPa or more and 500,000 MPa or less. The Young's modulus of the resin component 40 is, for example, 20 MPa or more and 1,500 MPa or less.

[0060] As shown in Figure 1, in a plan view, the outer edge 201C of the first substrate 201 is located inside the outer edge 110C of the light source unit 110. As a result, even if the body color of the light-emitting surface of the light source unit 110 (for example, the body color of the translucent member 30) and the body color of the upper surface of the first substrate 201 are different, the first substrate 201 is not visible when the light-emitting device 1 is viewed from above, thus providing a light-emitting device 1 with an excellent appearance.

[0061] [Modified examples of light-emitting devices] A modified example of the light-emitting device according to the embodiment will be described with reference to Figures 3 and 4.

[0062] Figure 3 is a schematic plan view showing the arrangement relationship between the first wiring section of the first substrate 201 and the electrode sections of the plurality of light-emitting sections 10a to 10y in a modified light-emitting device. The modified light-emitting device has, for example, 25 light-emitting sections 10a to 10y. 5x5 light-emitting sections 10a to 10y are arranged in the first direction X and the second direction Y. Each of the plurality of light-emitting sections 10a to 10y has a positive electrode section 22A and a negative electrode section 22C.

[0063] The multiple light-emitting units include multiple inner light-emitting units 10a to 10i and multiple outer light-emitting units 10j to 10y arranged outside the multiple inner light-emitting units 10a to 10i so as to surround the multiple inner light-emitting units 10a to 10i in a plan view. The light-emitting device shown in Figure 3 includes nine inner light-emitting units and sixteen outer light-emitting units arranged to surround the nine inner light-emitting units.

[0064] Figure 4 is a schematic plan view of the first surface 201A side of the first substrate 201 where the first wiring section is arranged. The first wiring section has a plurality of positive wiring sections and a plurality of negative wiring sections. In Figure 4, the negative wiring sections are hatched. The plurality of positive wiring sections are joined to and electrically connected to the positive electrode section 22A via the first joining member 301 described above. The plurality of negative wiring sections are joined to and electrically connected to the negative electrode section 22C via the first joining member 301.

[0065] The multiple positive-side wiring sections include a first positive-side wiring section 211A1, a second positive-side wiring section 211A2, a third positive-side wiring section 211A3, a fourth positive-side wiring section 211A4, a fifth positive-side wiring section 211A5, a sixth positive-side wiring section 211A6, a seventh positive-side wiring section 211A7, an eighth positive-side wiring section 211A8, a ninth positive-side wiring section 211A9, a tenth positive-side wiring section 211A10, an eleventh positive-side wiring section 211A11, a twelfth positive-side wiring section 211A12, and a thirteenth positive-side wiring section 211A13.

[0066] The multiple negative wiring sections include a first negative wiring section 211C1, a second negative wiring section 211C2, a third negative wiring section 211C3, and a fourth negative wiring section 211C4.

[0067] Each of the multiple inner light-emitting sections is connected to a positive wiring section separate from the other inner light-emitting sections and is electrically connected to it. For example, the positive electrode section 22A of the inner light-emitting section 10a is connected to the second positive wiring section 211A2 and is electrically connected to it.

[0068] The negative electrode portion 22C of the inner light-emitting portion 10a, the negative electrode portion 22C of the inner light-emitting portion 10b, the negative electrode portion 22C of the inner light-emitting portion 10c, and the negative electrode portion 22C of the inner light-emitting portion 10e are commonly joined to and electrically connected to the second negative wiring portion 211C2. The negative electrode portions 22C of the inner light-emitting portion 10d, the inner light-emitting portion 10f, the inner light-emitting portion 10g, the inner light-emitting portion 10h, and the inner light-emitting portion 10i are all commonly joined to and electrically connected to the third negative wiring portion 211C3.

[0069] The modified light-emitting device can be switched between, for example, a first light-emitting mode in which only the inner light-emitting section 10e emits light, and a second light-emitting mode in which all light-emitting sections 10a to 10y emit light. In the first light-emitting mode, only the inner light-emitting section 10e must be used to irradiate light of a predetermined illuminance. For this reason, in the first light-emitting mode, the value of the current supplied to the inner light-emitting section 10e tends to be high, and the temperature of the inner light-emitting section 10e tends to be high.

[0070] The first wiring section is commonly joined to two or more inner light-emitting sections and has at least one negative wiring section (a second negative wiring section 211C2 in the example shown in Figures 3 and 4) that is electrically connected to it. Compared to a configuration in which the same number of negative wiring sections as the number of inner light-emitting sections are arranged separately from each other, the area of ​​the negative wiring section connected to the inner light-emitting section 10e can be increased. This improves the heat dissipation of the inner light-emitting section 10e, which tends to get hot in the first light-emitting mode.

[0071] In the first emission mode, all of the inner light-emitting parts 10a to 10i may be illuminated, or only some of the light-emitting parts of the inner light-emitting parts 10a to 10d and the inner light-emitting parts 10f to 10i, including the inner light-emitting part 10e, may be illuminated.

[0072] The positive electrode portion 22A of the outer light-emitting portion 10v, the positive electrode portion 22A of the outer light-emitting portion 10s, the positive electrode portion 22A of the outer light-emitting portion 10t, the positive electrode portion 22A of the outer light-emitting portion 10u, and the positive electrode portion 22A of the outer light-emitting portion 10y are commonly joined to and electrically connected to the first positive wiring portion 211A1.

[0073] The negative electrode portions 22C of the outer light-emitting section 10v, the outer light-emitting section 10s, the outer light-emitting section 10t, the outer light-emitting section 10u, the outer light-emitting section 10y, the outer light-emitting section 10j, and the outer light-emitting section 10r are all commonly connected to and electrically connected to the first negative wiring section 211C1.

[0074] The positive electrode portion 22A of the outer light-emitting portion 10j and the positive electrode portion 22A of the outer light-emitting portion 10k are commonly joined to and electrically connected to the fifth positive wiring portion 211A5.

[0075] The positive electrode portion 22A of the outer light-emitting portion 10r and the positive electrode portion 22A of the outer light-emitting portion 10q are commonly joined to and electrically connected to the sixth positive wiring portion 211A6.

[0076] The negative electrode portion 22C of the outer light-emitting portion 10k, the negative electrode portion 22C of the outer light-emitting portion 10l, the negative electrode portion 22C of the outer light-emitting portion 10q, and the negative electrode portion 22C of the outer light-emitting portion 10p are commonly joined to and electrically connected to the third negative wiring portion 211C3.

[0077] The positive electrode portion 22A of the outer light-emitting portion 10l, the positive electrode portion 22A of the outer light-emitting portion 10w, the positive electrode portion 22A of the outer light-emitting portion 10m, the positive electrode portion 22A of the outer light-emitting portion 10n, the positive electrode portion 22A of the outer light-emitting portion 10o, the positive electrode portion 22A of the outer light-emitting portion 10x, and the positive electrode portion 22A of the outer light-emitting portion 10p are commonly joined to and electrically connected to the 13th positive wiring portion 211A13.

[0078] The negative electrode portions 22C of the outer light-emitting section 10w, the outer light-emitting section 10m, the outer light-emitting section 10n, the outer light-emitting section 10o, and the outer light-emitting section 10x are all commonly joined to and electrically connected to the fourth negative wiring section 211C4.

[0079] As shown in Figure 3, the multiple outer light-emitting sections are arranged in the corners of the first surface 201A of the first substrate 201 in a plan view, and include first outer light-emitting sections 10v, 10w, 10x, and 10y, which have a smaller area in a plan view than the other outer light-emitting sections. The area of ​​the first outer light-emitting sections 10v, 10w, 10x, and 10y in a plan view is smaller than the area of ​​the inner light-emitting sections 10a to 10i in a plan view. The area of ​​the surface of the electrode portion of the first outer light-emitting sections 10v, 10w, 10x, and 10y that is joined to the first wiring portion is smaller than the area of ​​the surface of the electrode portion of the other light-emitting sections that is joined to the first wiring portion, which has a larger area than the first outer light-emitting sections 10v, 10w, 10x, and 10y.

[0080] It is preferable to have the same thickness in the third direction Z of the first bonding member 301 located between each of the multiple light-emitting parts 10a to 10y and the corresponding first wiring part. This reduces variations in the height of the light-emitting surfaces of the multiple light-emitting parts 10a to 10y in the third direction Z. If the thickness of the first bonding member 301 is made uniform, the amount of first bonding member 301 placed between the first outer light-emitting parts 10v, 10w, 10x, 10y, which have a small electrode area, and the first wiring part will decrease, and the amount of first bonding member 301 placed between other light-emitting parts and the first wiring part will decrease, which tends to reduce the bonding strength between the first outer light-emitting parts 10v, 10w, 10x, 10y and the first wiring part.

[0081] In the example shown in Figure 3, at least a portion of the outer edge of the first positive wiring portion 211A1, to which the first outer light-emitting portion 10v and the first outer light-emitting portion 10y are electrically connected, is located outward in the second direction Y than the outer edge of the first outer light-emitting portion 10v and the outer edge of the first outer light-emitting portion 10y in a plan view. This allows for an increase in the amount of the first joining member 301 connecting the positive electrode portion 22A of the first outer light-emitting portion 10v to the first positive wiring portion 211A1, and the amount of the first joining member 301 connecting the positive electrode portion 22A of the first outer light-emitting portion 10y to the first positive wiring portion 211A1, thereby increasing the bonding strength between the first outer light-emitting portion 10v and the first positive wiring portion 211A1, and between the first outer light-emitting portion 10y and the first positive wiring portion 211A1.

[0082] Furthermore, at least a portion of the outer edge of the fourth negative wiring section 211C4, to which the first outer light-emitting section 10w and the first outer light-emitting section 10x are electrically connected, is located outward in the second direction Y than the outer edge of the first outer light-emitting section 10w and the outer edge of the first outer light-emitting section 10x in a plan view. This allows for an increase in the amount of the first joining member 301 connecting the negative electrode section 22C of the first outer light-emitting section 10w and the fourth negative wiring section 211C4, and the amount of the first joining member 301 connecting the negative electrode section 22C of the first outer light-emitting section 10x and the fourth negative wiring section 211C4, thereby increasing the bonding strength between the first outer light-emitting section 10w and the fourth negative wiring section 211C4, and between the first outer light-emitting section 10x and the fourth negative wiring section 211C4.

[0083] [Light-emitting module] Figure 5 is a schematic plan view of the light-emitting module 700 according to the embodiment. Figure 6 is a schematic cross-sectional view taken along the line VI-VI in Figure 5.

[0084] The light-emitting module 700 comprises the light-emitting device 1, a second substrate 600, and a second bonding member 302.

[0085] As shown in Figure 5, the shape of the second substrate 600 in plan view is, for example, circular. The second substrate 600 has a second base material 610 and one or more pairs of third wiring sections 620 arranged on the upper surface of the second base material 610. The second base material 610 is an insulator. The materials of the second base material 610 and the third wiring sections 620 can be the same materials as those used for the first base material and first wiring sections as exemplified in the first substrate 201.

[0086] The light-emitting device 1 is positioned on the upper surface of the second substrate 600. The upper surface of the second substrate 600 includes the upper surface of the second base material 610 and the upper surface of the third wiring section 620.

[0087] The second bonding member 302 is positioned between the second wiring section 212 of the light-emitting device 1 and the third wiring section 620 of the second substrate 600, with the second surface 201B of the first substrate 201 and the upper surface of the second substrate 600 facing each other in the third direction Z. The second bonding member 302 fixes the light-emitting device 1 to the second substrate 600 and electrically connects the second wiring section 212 and the third wiring section 620. The second bonding member 302 is conductive, for example, solder.

[0088] The light-emitting module 700 may further include electronic components arranged on the upper surface of the second substrate 600. As mentioned above, in a plan view, the outer edge of the first substrate 201 is located inside the outer edge of the light source unit 110, making it easy to secure an area on the upper surface of the second substrate 600 for arranging electronic components. For example, electronic components can be arranged in an area below the light source unit 110 and to the side of the first substrate 201.

[0089] [Manufacturing method for light-emitting devices] A method for manufacturing a light-emitting device according to an embodiment will be described with reference to Figures 7 to 24. The method for manufacturing a light-emitting device according to an embodiment comprises the steps of preparing a collective light source unit, preparing a wiring board, a bonding step, and separating into a plurality of light-emitting devices.

[0090] <Process for preparing the collective light source> As shown in Figure 16, in the process of preparing the collective light source unit 100, the collective light source unit 100 has a first main surface 100A and a second main surface 100B located on the opposite side of the first main surface 100A in the third direction Z. The collective light source unit 100 has a plurality of light source units 110 and a resin member 40 that holds the plurality of light source units 110 together. The light source unit 110 has one or more light-emitting parts 10 including a light-emitting element 20. In this embodiment, the light source unit 110 has a plurality of light-emitting parts 10. The light-emitting part 10 has a light-emitting surface 10A and a pair of electrode parts 22 located on the opposite side of the light-emitting surface 10A in the third direction Z. The light-emitting surface 10A is exposed from the resin member 40 on the second main surface 100B of the collective light source unit 100. The bonding surface 22B of the electrode section 22, located on the first main surface 100A side of the collective light source section 100, is exposed from the resin member 40 on the first main surface 100A.

[0091] The process for preparing the collective light source unit 100 can be carried out by the steps described below with reference to Figures 7 to 16. The collective light source unit 100 prepared by the steps described below may further include a light-transmitting member 30.

[0092] The process of preparing the collective light source unit 100 includes, as shown in Figure 7, the step of arranging a translucent member 30 containing a light diffusion layer 31 and a wavelength conversion layer 32 in that order on a first holding member 401. For example, the pre-molded light diffusion layer 31 and wavelength conversion layer 32 are laminated and arranged on the first holding member 401. The first holding member 401 is, for example, a resin member containing fluororesin or polyimide resin.

[0093] The process of preparing the collective light source unit 100 includes, as shown in Figure 8, forming a plurality of grooves 30g from the upper surface of the wavelength conversion layer 32, extending beyond the interface between the wavelength conversion layer 32 and the light diffusion layer 31 to reach the light diffusion layer 31, thereby dividing the upper surface of the wavelength conversion layer 32 into a plurality of element placement regions 32A. The grooves 30g do not penetrate the light diffusion layer 31 and do not reach the first holding member 401. By forming the grooves 30g so as not to penetrate the light-transmitting member 30, handling in subsequent processes can be improved. For example, the grooves 30g can be formed by blade processing or laser processing.

[0094] The process of preparing the collective light source unit 100 includes the step of arranging each of the multiple light-emitting elements 20 in each of the multiple element placement regions 32A, with the element light-emitting surface 20A of the light-emitting elements 20 facing the upper surface of the wavelength conversion layer 32, as shown in Figure 9. For example, after supplying an uncured adhesive material to the element placement region 32A using a dispenser or the like, the light-emitting elements 20 are placed on the element placement region 32A via the adhesive material with the element light-emitting surface 20A of the light-emitting elements 20 facing downwards, and the adhesive material is cured by heating, thereby bonding the light-emitting elements 20 to the upper surface of the wavelength conversion layer 32. The temperature at which the adhesive material is heated and cured is, for example, about 150°C. Alternatively, the element light-emitting surface 20A of the light-emitting elements 20 may be directly bonded to the upper surface of the wavelength conversion layer 32 in a B-stage state, for example, without using an adhesive material, and then the wavelength conversion layer 32 may be cured. The B-stage state is a term that indicates the curing state of the resin as defined, for example, by the JIS K6800 standard.

[0095] The process of preparing the collective light source unit 100 includes the step of forming the first collective light source unit 101 by arranging resin members 40 between the multiple light-emitting elements 20 and in the grooves 30g, as shown in Figure 10. For example, after forming the resin members 40 so as to cover the bonding surface 22B of the electrode portion 22 by compression molding using a mold, the upper surface of the resin members 40 is ground down to expose the bonding surface 22B of the electrode portion 22 from the resin members 40, as shown in Figure 11.

[0096] The process of preparing the collective light source unit 100 includes, as shown in Figure 12, placing the second holding member 402 on the side of the first collective light source unit 101 where the electrode portion 22 of the light-emitting element 20 is located (the bonding surface 22B of the electrode portion 22 and the upper surface of the resin member 40), and as shown in Figure 13, removing the first holding member 401. For example, if the first holding member 401 and the second holding member 402 are photocurable sheets, first, UV light or the like is irradiated onto the first holding member 401 to reduce the adhesion between the first collective light source unit 101 and the first holding member 401. Then, the second holding member 402 is attached to the side of the first collective light source unit 101 where the electrode portion 22 of the light-emitting element 20 is located, and the first holding member 401 is removed from the first collective light source unit 101. By removing the first holding member 401, the upper surface 31A of the light diffusion layer 31 is exposed. For example, the material used for the first retaining member 401 can be used as the material for the second retaining member 402.

[0097] The process of preparing the collective light source unit 100 includes removing a portion of the light diffusion layer 31 from the upper surface 31A side of the light diffusion layer 31, exposing the resin member 40 arranged in the groove 30g as shown in Figure 14, and forming the second collective light source unit 102. For example, a portion of the light diffusion layer 31 can be removed from the upper surface 31A side of the light diffusion layer 31 by grinding.

[0098] The process of preparing the collective light source unit 100 includes, as shown in Figure 15, placing the third holding member 403 on the side where the element light-emitting surface 20A of the light-emitting element 20 of the second collective light source unit 102 is located (the upper surface 31A of the light diffusion layer 31 and the upper surface of the resin member 40 arranged in the groove 30g), and removing the second holding member 402 as shown in Figure 16. As the material for the third holding member 403, for example, the material exemplified as the material for the first holding member 401 can be used.

[0099] The light-transmitting members 30 are located between the element light-emitting surface 20A of the light-emitting element 20 and the third holding member 403, and between the resin member 40 and the third holding member 403, which are located between adjacent light-emitting elements 110. The light-emitting element 20 is not placed on the light-transmitting member 30 located between the resin member 40 and the third holding member 403 between adjacent light-emitting elements 110.

[0100] The collective light source unit 100 is prepared through the above process. The first main surface 100A of the collective light source unit 100 includes the bonding surface 22B of the electrode portion 22 and a surface of the resin member 40 that is continuous with the bonding surface 22B. The second main surface 100B of the collective light source unit 100 includes the light-emitting surface 10A of the light-emitting portion 10, a surface of the translucent member 30 between adjacent light source units 110 that is continuous with the light-emitting surface 10A of the resin member 40 arranged in the groove portion 30g. The collective light source unit 100 may also be prepared by acquisition, including purchase.

[0101] <Preparing the wiring board> As shown in Figure 17, the manufacturing method of the light-emitting device according to the embodiment includes a step of preparing a wiring board 200 including a plurality of first substrates 201. In this embodiment, in the step of preparing the wiring board 200, the wiring board 200 is a plurality of individualized first substrates 201. Each first substrate 201 in the wiring board 200 corresponds to a target for bonding with each light source unit 110 in the collective light source unit 100. As described above, each first substrate 201 has a first base material 203, a first wiring section 211, and a second wiring section 212.

[0102] <Joining process> Figure 18 shows a bonding step in a manufacturing method of a light-emitting device according to an embodiment. The bonding step involves placing the first main surface 100A of the collective light source unit 100 and the first surface 201A of the first substrate 201 opposite each other, placing a first bonding material between the first wiring portion 211 of the first substrate 201 and the electrode portion 22 of the light-emitting portion 10 of the light source unit 110 corresponding to the object to be bonded to the first substrate 201, and heating the first bonding material to form a first bonding member 301.

[0103] In the bonding process, for example, the first bonding material is placed on the electrode portion 22 using a dispenser or the like. The first bonding material is conductive and is, for example, solder. After placing the first bonding material on the electrode portion 22, the first substrate 201 is placed on the collective light source 100 such that the first wiring portion 211 is positioned on the first bonding material. In this state, for example, the first bonding material is heated and melted at a temperature of 250°C to 270°C. As the molten first bonding material hardens, it becomes a first bonding member 301 that bonds the electrode portion 22 and the first wiring portion 211 and electrically connects them.

[0104] As a comparative example, it is conceivable that the bonding process is performed with multiple light source units 110 separated from each other. In this case, the heat applied in the bonding process to melt the first bonding material may cause the resin member 40 of one light source unit 110 to expand toward the gap between adjacent light source units 110, and then contract, raising concerns that warping may occur in the light source unit 110. If warping occurs in the light source unit 110, the electrode portion 22 of the light-emitting portion 10 in the light source unit 110 and the corresponding first wiring portion 211 will be significantly separated in the third direction Z, which may cause poor bonding between the light source unit 110 and the first substrate 201.

[0105] According to this embodiment, the bonding process is performed in a state where multiple light source units 110 are not separated from each other, forming a combined light source unit 100. Therefore, there is no gap that causes the resin member 40 of one light source unit 110 to expand and contract toward the adjacent light source unit 110 due to the heat applied during the bonding process, thus reducing warping of the light source units 110. This enables good bonding between the light source units 110 and the first substrate 201.

[0106] Furthermore, since the individualized first substrates 201 are joined to the corresponding light source units 110, the alignment of the first substrates 201 with respect to the light source units 110 becomes easier compared to the case where a composite substrate, in which multiple first substrates 201 are connected to each other, is joined to the composite light source unit 100.

[0107] Furthermore, the first substrate 201 and the light source unit 110 are joined such that there is a gap 500 between the first base material 203 of the first substrate 201 and the resin member 40 of the light source unit 110 on the first surface 201A side of the first substrate 201. This reduces thermal stress due to the difference in coefficients of linear expansion between the first base material 203 and the resin member 40, thereby reducing the occurrence of cracks in the first joining member 301 and / or the resin member 40.

[0108] Furthermore, a translucent member 30 is positioned between the resin member 40 located between adjacent light source units 110 and the third holding member 403. A translucent member 30 (a translucent member 30 on which no light-emitting element 20 is located) is positioned between the translucent members 30 of adjacent light source units 110. This reduces the difference in the coefficient of linear expansion of the material between the light source unit 110 and the portion between adjacent light source units 110, compared to the case where only a resin member 40 is present between the translucent members 30 of adjacent light source units 110, thereby reducing the warping of the collective light source unit 100.

[0109] The thickness of the collective light source section 100 is, for example, 300 μm or less. Even with such a thin collective light source section 100, the manufacturing method of the light-emitting device according to this embodiment can reduce the warping of the collective light source section 100 during the bonding process.

[0110] <Process of separating into multiple light-emitting devices> After the bonding process, the resin member 40 located between adjacent light source units 110 is cut to separate it into multiple light-emitting devices 1. As shown in Figure 19, for example, a blade 800 is used to cut the resin member 40 and the translucent member 30 located between adjacent light source units 110 through the gap 220 between adjacent first substrates 201, thereby separating them into multiple light-emitting devices 1. Alternatively, the resin member 40 and the translucent member 30 may be cut by laser processing to separate them into multiple light-emitting devices 1.

[0111] On the first main surface 100A of the collective light source unit 100, individual first substrates 201 are arranged with gaps 220 between each light source unit 110. In other words, there are gaps 220 between adjacent first substrates 201. Therefore, the first substrates 201 are not cut during the process of separating into multiple light-emitting devices. Furthermore, the hardness of the resin member 40 and the light-transmitting member 30 are lower than the hardness of the first base material 203 of the first substrate 201. Therefore, when cutting the resin member 40 and the light-transmitting member 30, the stress on the joint between the light source unit 110 and the first substrate 201 can be reduced, and the reliability of the joint can be increased. In addition, the type of blade 800 does not need to be changed when cutting the first base material 203 of the first substrate 201 and when cutting the resin member 40 and the light-transmitting member 30.

[0112] In the process of preparing the collective light source unit 100, the third holding member 403 can be configured as shown in Figure 20, comprising a metal plate 410, a first adhesive layer 411 disposed on the metal plate 410, a base material 413 disposed on the metal plate 410 via the first adhesive layer 411, and a second adhesive layer 412 disposed on the base material 413. The collective light source unit 100 is disposed on the base material 413 via the second adhesive layer 412. The second main surface 100B of the collective light source unit 100 is adhered to the second adhesive layer 412.

[0113] The presence of a metal plate 410 in the third holding member 403 reduces thermal expansion and contraction of the third holding member 403, thereby reducing warping of the collective light source unit 100. Furthermore, the heat applied during the joining process to melt the first joining material can be efficiently dissipated through the metal plate 410, reducing thermal stress on the resin member 40 and thus reducing warping of the light source unit 110. For example, stainless steel can be used as the material for the metal plate 410.

[0114] For example, resin materials such as polyimide resin and fluororesin can be used as the material for the base material 413. Furthermore, the thermal shrinkage rate of the base material 413 is less than 0.1% at 200°C. This reduces the thermal expansion and contraction of the third holding member 403, and reduces the warping of the collective light source unit 100.

[0115] As the second adhesive layer 412, for example, a silicone resin, epoxy resin, or acrylate resin that hardens and loses its adhesiveness when exposed to ultraviolet light can be used. The collective light source unit 100 can be separated from the third holding member 403 by irradiation with ultraviolet light. As the first adhesive layer 411, for example, the resin exemplified as the resin for the second adhesive layer 412 can be used.

[0116] Furthermore, the first retaining member 401 and the second retaining member 402 mentioned above may also be made of materials with the same configuration as the third retaining member 403 shown in Figure 20, or they may be made of materials with the same configuration as the base material 413.

[0117] In the process of preparing the wiring board 200, as shown in Figure 21, the wiring board 200 may be a composite board in which a plurality of first boards 201 are connected via a connecting portion 203A. The connecting portion 203A is part of the first base material 203.

[0118] As shown in Figure 22, in the bonding process, the combined light source unit 100 is bonded to the wiring board 200, which is a combined substrate. In the bonding process, the first main surface 100A of the combined light source unit 100 and the first surface 201A of the first substrate 201 are placed opposite each other, and the first bonding material is placed between the first wiring portion 211 of the first substrate 201 and the electrode portion 22 of the light source unit 110. The first bonding material is heated to form the first bonded member 301. For example, the first bonding material is placed on the first wiring portion 211 using a dispenser. After placing the first bonding material on the first wiring portion 211, the combined light source unit 100 is placed on the wiring board 200, which is a combined substrate, so that the electrode portion 22 is positioned on the first bonding material. In this state, for example, the first bonding material is heated and melted at a temperature of 250°C to 270°C.

[0119] In the process of separating the light-emitting device into multiple light-emitting devices after the bonding process, as shown in Figure 23, the translucent member 30 located between adjacent light-emitting units 110, the resin member 40 located between adjacent light-emitting units 110, and the connection portion 203A of the wiring board 200 located between adjacent first substrates 201 are removed to separate the device into multiple light-emitting devices. For example, the translucent member 30, the resin member 40, and the connection portion 203A are cut using a blade 800 to separate the device into multiple light-emitting devices.

[0120] Figure 24 shows one light-emitting device 2 that has been separated into individual pieces by the process shown in Figure 23. In the light-emitting device 2, the side surface of the light source unit 110 and the side surface of the first substrate 201 are located on the same plane, separated by a gap 500. In a plan view, the outer edge of the first substrate 201 and the outer edge of the light source unit 110 coincide.

[0121] [Manufacturing method for light-emitting modules] The manufacturing method for the aforementioned light-emitting module 700, shown in Figures 5 and 6, will now be described.

[0122] A method for manufacturing the light-emitting module 700 includes, as an example, the steps of: preparing the light-emitting device 1 obtained by the method for manufacturing the light-emitting device described above, with reference to Figures 7 to 19; preparing a second substrate 600 having an upper surface 600A and a third wiring section 620 on the upper surface 600A; and a bonding step of placing the light-emitting device 1 on the upper surface 600A of the second substrate 600 via a second bonding material and heating the second bonding material to form a second bonding member 302.

[0123] For example, the second bonding material is placed on the third wiring portion 620 of the second substrate 600 using a printing method or a dispenser. The second bonding material is conductive, for example, solder. After placing the second bonding material on the third wiring portion 620, the light-emitting device 1 is placed on the second substrate 600 so that the second wiring portion 212 of the first substrate 201 is positioned on the second bonding material. In this state, the second bonding material is heated and melted. The melted second bonding material hardens and becomes a second bonding member 302 that bonds the second wiring portion 212 and the third wiring portion 620 and electrically connects them.

[0124] The melting point of the first bonding material is higher than that of the second bonding material. The first and second bonding materials may, for example, be materials containing different elements, or they may be materials containing the same elements but with different composition ratios. The melting point of the first bonding material is 250°C to 270°C, and the melting point of the second bonding material is approximately 240°C. This prevents the first bonding member 301 of the light-emitting device 1 from remelting when the second bonding material is melted, thus maintaining good bonding between the first substrate 201 and the light source unit 110 in the light-emitting device 1. Furthermore, by setting the temperature at which the second bonding material is melted lower than the temperature at which the first bonding material is melted, warping of the light source unit 110 can be reduced.

[0125] Embodiments of this disclosure may include the following methods for manufacturing a light-emitting device, a method for manufacturing a light-emitting module, and a light-emitting device.

[0126] [Section 1] A step in preparing a collective light source unit, The collective light source unit has a first main surface and a second main surface located on the opposite side of the first main surface, The collective light source unit comprises a plurality of light source units and a resin member that holds the plurality of light source units together. The light source unit has one or more light-emitting units, including a light-emitting element. The light-emitting portion comprises a light-emitting surface exposed from the resin member on the second main surface and a pair of electrode portions exposed from the resin member on the first main surface, and the steps of preparing the collective light source portion, A process for preparing a wiring board that includes multiple first substrates, Each of the first substrates corresponds to each of the light sources and has a first surface, with one or more pairs of first wiring sections located on the first surface side, a step of preparing the wiring substrate, A bonding process comprising: placing the first main surface of the collective light source and the first surface of the first substrate facing each other, arranging a first bonding material between the pair of first wiring portions of the first substrate and the pair of electrode portions of the light-emitting portion of the corresponding light source, and heating the first bonding material to form a first bonding member; A step of separating the resin member located between adjacent light source units into multiple light-emitting devices by cutting it, A method for manufacturing a light-emitting device equipped with the necessary components. [Section 2] In the process of preparing the wiring board, the wiring board is a plurality of individualized first substrates, In the bonding process, the first substrates, which have been separated into individual pieces for each light source, are arranged on the first main surface of the collective light source with gaps between them. The method for manufacturing a light-emitting device according to item 1, wherein, in the step of separating into a plurality of light-emitting devices, the resin member located between adjacent light-emitting parts is cut through the gap of adjacent first substrates to separate into a plurality of light-emitting devices. [Section 3] In the process of preparing the wiring board, the wiring board is a composite board in which the plurality of first boards are connected via connecting portions, The method for manufacturing a light-emitting device according to item 1, wherein in the step of separating the device into a plurality of light-emitting devices, the resin member located between adjacent light-emitting parts and the connection part of the wiring board located between adjacent first substrates are removed to separate the device into a plurality of light-emitting devices. [Section 4] The step of preparing the aforementioned collective light source unit is: The process involves arranging a light-diffusing layer and a wavelength-converting layer on a first holding member in this order, and arranging a light-transmitting member including the light-diffusing layer and the wavelength-converting layer on the first holding member, A step of forming a plurality of grooves from the upper surface of the wavelength conversion layer that extend beyond the interface between the wavelength conversion layer and the light diffusion layer to the light diffusion layer, thereby dividing the upper surface of the wavelength conversion layer into a plurality of element placement regions, A step of arranging each of the plurality of light-emitting elements in each of the plurality of element arrangement regions, wherein the element light-emitting surface of the light-emitting element, which has an element light-emitting surface and the pair of electrode portions on the opposite side of the element light-emitting surface, faces the upper surface of the wavelength conversion layer, A step of forming a first collective light source by arranging the resin member between the plurality of light-emitting elements and in the grooves, The steps include: placing a second holding member on the side of the first collective light source unit where the pair of electrode portions of the light-emitting element are located, and then removing the first holding member; A step of removing a portion of the light diffusion layer from the light diffusion layer side to expose the resin member arranged in the groove, thereby forming a second collective light source section. The process involves placing a third holding member on the side of the second collective light source unit where the element light-emitting surface of the light-emitting element is located, and then removing the second holding member. A method for manufacturing a light-emitting device according to any one of items 1 to 3, comprising: [Section 5] In the process of preparing the aforementioned collective light source unit, The method for manufacturing a light-emitting device according to claim 4, wherein the light-transmitting member is positioned between the element light-emitting surface of the light-emitting element and the third holding member, and between the resin member and the third holding member, which are positioned between adjacent light-emitting parts. [Section 6] In the process of preparing the aforementioned collective light source unit, The third retaining member comprises a metal plate, a first adhesive layer disposed on the metal plate, a substrate disposed on the metal plate via the first adhesive layer, and a second adhesive layer disposed on the substrate. The collective light source unit is disposed on the substrate via the second adhesive layer. A method for manufacturing a light-emitting device according to item 4 or 5, wherein the thermal shrinkage rate of the substrate is less than 0.1% at 200°C. [Section 7] The method for manufacturing a light-emitting device according to any one of items 1 to 6, wherein the thickness of the aggregate light source is 300 μm or less. [Section 8] In the process of preparing the wiring board, the first board comprises a base material and one or more pairs of wiring sections arranged on the first surface side of the base material, A method for manufacturing a light-emitting device according to any one of claims 1 to 7, wherein in the bonding step, the bonding is performed such that there is a gap between the base material of the first substrate and the resin member on the first surface side of the first substrate. [Section 9] The hardness of the resin member is lower than the hardness of the base material of the first substrate. A method for manufacturing a light-emitting device according to item 8, referencing item 2, wherein in the step of separating the resin member into a plurality of light-emitting devices, the resin member is cut using a blade. [Section 10] A step of preparing a light-emitting device obtained by the method for manufacturing a light-emitting device described in any one of items 1 to 9, A step of preparing a second substrate having an upper surface, A bonding step in which the light-emitting device is placed on the upper surface of the second substrate via a second bonding material, and the second bonding material is heated to form a second bonding member, Equipped with, A method for manufacturing a light-emitting module, wherein the melting point of the first bonding material is higher than the melting point of the second bonding material. [Section 11] A first substrate having a first surface, a base material, and one or more pairs of wiring portions arranged on the first surface side of the base material, A light source unit comprising one or more light-emitting units including a light-emitting element having a pair of electrode portions, and a resin member holding the one or more light-emitting units, wherein the pair of electrode portions of the light-emitting units are exposed from the resin member on the first main surface, With the first surface of the first substrate and the first main surface of the light source facing each other, a first connecting member electrically connects the pair of electrode portions of the light-emitting portion and the pair of first wiring portions of the first substrate, Equipped with, In a plan view, the outer edge of the first substrate is located inside the outer edge of the light source portion. A light-emitting device in which, on the first surface side of the first substrate, the base material of the first substrate is separated from the resin member. [Section 12] The light-emitting device according to item 11, wherein the thickness of the light source is 300 μm or less. [Section 13] The light-emitting device according to item 11 or 12, wherein the hardness of the base material of the first substrate is higher than the hardness of the resin member. [Section 14] The light source unit has a plurality of light-emitting units, The plurality of light-emitting units comprises a plurality of inner light-emitting units and a plurality of outer light-emitting units arranged outside the plurality of inner light-emitting units so as to surround the plurality of inner light-emitting units in a plan view. The light-emitting device according to any one of claims 11 to 13, wherein the one or more pairs of first wiring sections of the first substrate have a plurality of positive wiring sections electrically connected to each of the plurality of inner light-emitting sections, and a negative wiring section electrically connected in common to two or more of the inner light-emitting sections. [Section 15] The shape of the first surface of the first substrate in a plan view is rectangular. The plurality of outer light-emitting parts include a first outer light-emitting part which is located at the corner of the first surface in a plan view and has a smaller area in a plan view than the other outer light-emitting parts. The light-emitting device according to claim 14, wherein at least a portion of the outer edge of the first wiring portion to which the first outer light-emitting portion is electrically connected is located outside the outer edge of the first outer light-emitting portion in a plan view.

[0127] The embodiments of this disclosure have been described above with reference to specific examples. However, this disclosure is not limited to these specific examples. All forms that a person skilled in the art can implement by appropriately modifying the design based on the embodiments described above in this disclosure also fall within the scope of this disclosure, insofar as they encompass the gist of this disclosure. Furthermore, within the scope of the idea of ​​this disclosure, a person skilled in the art can conceive of various modifications and variations, and these modifications and variations also fall within the scope of this disclosure. [Explanation of Symbols]

[0128] 1,2...Light-emitting device, 10...Light-emitting part, 10a~10i...Inner light-emitting part, 10j~10y...Outer light-emitting part, 20...Light-emitting element, 20A...Element light-emitting surface, 21...Semiconductor structure, 22...Electrode part, 22A...Positive electrode part, 22C...Negative electrode part, 30...Translucent material, 30g...Groove part, 31...Light diffusion layer, 32...Wavelength conversion layer, 32A...Element arrangement area, 40...Resin material, 100...Collective light source part, 100A...First main surface, 100B...Second main surface, 101...First collective light source part, 102...Second collective light source part, 110...Light source part, 110A...First main surface, 110B...Second main surface, 200...Wiring board, 201...First Substrate, 201A...First side, 201B...Second side, 203...First base material, 203A...Connection part, 211...First wiring part, 211A1~211A13...Positive side wiring part, 211C1~211C4...Negative side wiring part, 212...Second wiring part, 220...Gap, 301...First joining member, 302...Second joining member, 401...First holding member, 402...Second holding member, 403...Third holding member, 410...Metal plate, 411...First adhesive layer, 412...Second adhesive layer, 413...Base material, 500...Gap, 600...Second substrate, 610...Second base material, 620...Third wiring part, 700...Light-emitting module, 800...Blade

Claims

1. A step in preparing a collective light source unit, The collective light source unit has a first main surface and a second main surface located on the opposite side of the first main surface. The collective light source unit comprises a plurality of light source units and a resin member that holds the plurality of light source units together. The light source unit has one or more light-emitting units, including a light-emitting element. The light-emitting portion comprises a light-emitting surface exposed from the resin member on the second main surface and a pair of electrode portions exposed from the resin member on the first main surface, and the steps of preparing the collective light source portion, A process for preparing a wiring board that includes multiple first substrates, The process involves preparing a wiring board, each of which corresponds to each of the light sources and has a first surface, with one or more pairs of first wiring sections located on the first surface side. A bonding process comprising: placing the first main surface of the collective light source and the first surface of the first substrate facing each other, arranging a first bonding material between the pair of first wiring portions of the first substrate and the pair of electrode portions of the light-emitting portion of the corresponding light source, and heating the first bonding material to form a first bonding member; A step of separating the resin member located between adjacent light source units into multiple light-emitting devices by cutting it, A method for manufacturing a light-emitting device equipped with the following features.

2. In the process of preparing the wiring board, the wiring board is a plurality of individualized first substrates, In the bonding process, the first substrates, which have been separated into individual pieces for each light source unit, are arranged on the first main surface of the collective light source unit with gaps between them. The method for manufacturing a light-emitting device according to claim 1, wherein in the step of separating the device into a plurality of light-emitting devices, the resin member located between adjacent light-emitting parts is cut through the gap between adjacent first substrates to separate the device into a plurality of light-emitting devices.

3. In the process of preparing the wiring board, the wiring board is a composite board in which the plurality of first boards are connected via a connecting portion. The method for manufacturing a light-emitting device according to claim 1, wherein in the step of separating the device into a plurality of light-emitting devices, the resin member located between adjacent light-emitting parts and the connection part of the wiring board located between adjacent first substrates are removed to separate the device into a plurality of light-emitting devices.

4. The step of preparing the aforementioned collective light source unit is: The process involves arranging a light-diffusing layer and a wavelength-converting layer in this order on a first holding member, and arranging a light-transmitting member including the light-diffusing layer and the wavelength-converting layer on the first holding member, A step of forming a plurality of grooves from the upper surface of the wavelength conversion layer that extend beyond the interface between the wavelength conversion layer and the light diffusion layer to the light diffusion layer, thereby dividing the upper surface of the wavelength conversion layer into a plurality of element placement regions, A step of arranging each of the plurality of light-emitting elements in each of the plurality of element arrangement regions, wherein the element light-emitting surface of the light-emitting element, which has an element light-emitting surface and the pair of electrode portions on the opposite side of the element light-emitting surface, faces the upper surface of the wavelength conversion layer, A step of forming a first collective light source by arranging the resin member between the plurality of light-emitting elements and in the grooves, The steps include: placing a second holding member on the side of the first collective light source unit where the pair of electrode portions of the light-emitting element are located, and then removing the first holding member; A step of removing a portion of the light diffusion layer from the light diffusion layer side to expose the resin member arranged in the groove, thereby forming a second collective light source section. The process involves placing a third holding member on the side of the second collective light source unit where the element light-emitting surface of the light-emitting element is located, and then removing the second holding member. A method for manufacturing a light-emitting device according to claim 1, comprising having the above characteristics.

5. In the process of preparing the aforementioned collective light source unit, The method for manufacturing a light-emitting device according to claim 4, wherein the light-transmitting member is positioned between the element light-emitting surface of the light-emitting element and the third holding member, and between the resin member and the third holding member, which are positioned between adjacent light-emitting parts.

6. In the process of preparing the aforementioned collective light source unit, The third holding member comprises a metal plate, a first adhesive layer disposed on the metal plate, a substrate disposed on the metal plate via the first adhesive layer, and a second adhesive layer disposed on the substrate. The collective light source unit is arranged on the substrate via the second adhesive layer. The method for manufacturing a light-emitting device according to claim 4, wherein the thermal shrinkage rate of the substrate is less than 0.1% at 200°C.

7. The method for manufacturing a light-emitting device according to any one of claims 1 to 6, wherein the thickness of the aggregate light source is 300 μm or less.

8. In the process of preparing the wiring board, the first board comprises a base material and one or more pairs of wiring portions arranged on the first surface side of the base material, A method for manufacturing a light-emitting device according to any one of claims 1 to 6, wherein in the bonding step, the bonding is performed such that there is a gap between the base material of the first substrate and the resin member on the first surface side of the first substrate.

9. The hardness of the resin member is lower than the hardness of the base material of the first substrate. A method for manufacturing a light-emitting device according to claim 8, referencing claim 2, wherein in the step of separating the resin member into a plurality of light-emitting devices, the resin member is cut using a blade.

10. A step of preparing a light-emitting device obtained by the method for manufacturing a light-emitting device described in claim 1, A step of preparing a second substrate having an upper surface, A bonding step is to place the light-emitting device on the upper surface of the second substrate via a second bonding material, and to heat the second bonding material to form a second bonding member, Equipped with, A method for manufacturing a light-emitting module, wherein the melting point of the first bonding material is higher than the melting point of the second bonding material.

11. A first substrate having a first surface, a base material, and one or more pairs of wiring portions arranged on the first surface side of the base material, A light source unit comprising one or more light-emitting units including a light-emitting element having a pair of electrode portions, and a resin member holding the one or more light-emitting units, wherein the pair of electrode portions of the light-emitting units are exposed from the resin member on the first main surface, With the first surface of the first substrate and the first main surface of the light source facing each other, a first connecting member electrically connects the pair of electrode portions of the light-emitting portion and the pair of first wiring portions of the first substrate, Equipped with, In a plan view, the outer edge of the first substrate is located inside the outer edge of the light source portion. A light-emitting device in which, on the first surface side of the first substrate, the base material of the first substrate is separated from the resin member.

12. The light-emitting device according to claim 11, wherein the thickness of the light source is 300 μm or less.

13. The light-emitting device according to claim 11, wherein the hardness of the base material of the first substrate is higher than the hardness of the resin member.

14. The light source unit has a plurality of light-emitting units, The plurality of light-emitting units comprises a plurality of inner light-emitting units and a plurality of outer light-emitting units arranged outside the plurality of inner light-emitting units so as to surround the plurality of inner light-emitting units in a plan view. The light-emitting device according to any one of claims 11 to 13, wherein the one or more pairs of first wiring sections of the first substrate have a plurality of positive wiring sections electrically connected to each of the plurality of inner light-emitting sections, and a negative wiring section electrically connected in common to two or more of the inner light-emitting sections.

15. The shape of the first surface of the first substrate in a plan view is rectangular. The plurality of external light-emitting parts include a first external light-emitting part which is located at the corner of the first surface in a plan view and has a smaller area in a plan view than the other external light-emitting parts. The light-emitting device according to claim 14, wherein at least a portion of the outer edge of the first wiring portion to which the first outer light-emitting portion is electrically connected is located outside the outer edge of the first outer light-emitting portion in a plan view.

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