Lens unit and camera module

Abstract

This prevents the position of the heater circuit pattern relative to the first lens from shifting compared to conventional technology. [Solution] The heater section provided on the image side of the first lens, which is closest to the object in the lens unit, comprises a metal circuit pattern and a resin layer that is integrally bonded to the first lens by two-color molding and covers the circuit pattern, and the first lens is made of synthetic resin. In this way, since the resin layer covers the circuit pattern, the circuit pattern is fixed to the resin layer, and since the resin layer and the first lens are two-color molded, the resin layer and the first lens are fixed together. Therefore, the displacement of the circuit pattern relative to the first lens can be suppressed more than in the conventional technology.

Description

Technical Field

[0001] The technology of the present disclosure relates to a lens unit and a camera module.

Background Art

[0002] Patent Document 1 discloses a lens unit including a plurality of lenses arranged along an optical axis, and a heater that is adhered to an image-side end face of a first lens located on the most object side by an adhesive and heats the first lens.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, since the heater is adhered to the first lens by an adhesive, over time, the adhesive may peel off, causing the heater to be misaligned with respect to the first lens, making it difficult to heat the first lens.

[0005] The technology of the present disclosure aims to provide a lens unit and a camera module that can prevent the position of the circuit pattern of the heater part from shifting with respect to the first lens more than in the prior art.

Means for Solving the Problems

[0006] To achieve the above objective, a lens unit according to a first aspect of the technology of this disclosure comprises a plurality of lenses arranged in line along the direction of the optical axis, and a heater portion provided on the image side of the first lens, which is positioned closest to the object among the plurality of lenses, wherein the first lens is made of synthetic resin, and the heater portion comprises a metal circuit pattern and a resin layer integrally bonded to the first lens by two-color molding and covering the circuit pattern.

[0007] A lens unit in a second embodiment comprises a plurality of lenses arranged in line along the direction of the optical axis, and a heater portion provided on the image side of the first lens, which is positioned closest to the object among the plurality of lenses, wherein the heater portion comprises a metal circuit pattern and a resin layer covering the circuit pattern.

[0008] The camera module of the third embodiment comprises a lens unit of the first or second embodiment. [Effects of the Invention]

[0009] In a first aspect of the technology of this disclosure, the heater portion provided on the image side of the first lens closest to the object comprises a metal circuit pattern and a resin layer that is integrally bonded to the first lens by two-color molding and covers the circuit pattern, and the first lens is made of synthetic resin. In this way, since the resin layer covers the circuit pattern, the circuit pattern is fixed to the resin layer, and since the resin layer and the first lens are two-color molded, the resin layer and the first lens are fixed together. Therefore, the first aspect can suppress the displacement of the circuit pattern relative to the first lens more than the prior art.

[0010] In the second embodiment, the heater portion provided on the image side of the first lens closest to the object comprises a metal circuit pattern and a resin layer covering the circuit pattern. Therefore, in the second embodiment, since the resin layer covers the circuit pattern, displacement of the heater portion from the first lens can be suppressed more effectively than in the prior art. [Brief explanation of the drawing]

[0011] [Figure 1A] Figure 1A is a cross-sectional view of an example of a camera module 350 equipped with a lens unit 1 according to the first embodiment. [Figure 1B] Figure 1B is a perspective view of an example of the heater unit 100. [Figure 1C] Figure 1C is a cross-sectional view (cross-sectional view AA in Figure 1B) of an example of the first lens L1 and an example of the heater section 100. [Figure 1D] Figure 1D shows an example of the heater unit 100 as viewed from the image side Lb. [Figure 2] Figure 2 shows an example of the circuit pattern 12 as viewed from the object side La. [Figure 3] Figure 3 is a cross-sectional view of an example of the circuit pattern 12. [Figure 4] Figure 4 shows a part of an example of a manufacturing method for the lens unit 1. [Figure 5] Figure 5 is another diagram showing a part of an example of how to manufacture the lens unit 1. [Figure 6] Figure 6 is yet another diagram showing a part of an example of how to manufacture the lens unit 1. [Figure 7] Figure 7 is yet another diagram showing a part of an example of how to manufacture the lens unit 1. [Figure 8] Figure 8 is yet another diagram showing a part of an example of how to manufacture the lens unit 1. [Figure 9] Figure 9 is yet another diagram showing a part of an example of how to manufacture the lens unit 1. [Figure 10] Figure 10 is yet another diagram showing part of an example of how to manufacture the lens unit 1. [Figure 11] Figure 11 is a perspective view showing an example of a circuit pattern 12 and an example of a film 102 bonded to the circuit pattern 12 in a first modified example of the first embodiment. [Figure 12] Figure 12 is a perspective view showing an example of a circuit pattern 12 of a second modified example of the first embodiment. [Figure 13A]FIG. 13A is a cross-sectional view of an example of the first lens L1 and an example of the heater unit 100 according to the second embodiment. [Figure 13B] FIG. 13B is a view of an example of the circuit pattern 12 as seen from the object side La. [Figure 14A] FIG. 14A is a view showing a part of an example of a method for manufacturing the lens unit 1 according to the second embodiment. [Figure 14B] FIG. 14B is another view showing a part of an example of a method for manufacturing the lens unit 1. [Figure 14C] FIG. 14C is yet another view showing a part of an example of a method for manufacturing the lens unit 1. [Figure 14D] FIG. 14D is a view of an example of the heater unit 100 as seen from the image side Lb. [Figure 15] FIG. 15 is a view of an example of the heater unit 100 of a modification of the second embodiment as seen from the object side La. [Figure 16] FIG. 16 is a cross-sectional view of an example of the first lens L1 and an example of the heater unit 100 according to the third embodiment. [Figure 17] FIG. 17 is a view of an example of the heater unit 100 as seen from the image side Lb. [Figure 18] FIG. 18 is a view showing a part of an example of a method for manufacturing the lens unit 1 according to the fourth embodiment. [Figure 19] FIG. 19 is a cross-sectional view of an example of the first lens L1 and an example of the heater unit 100 of the lens unit 1 according to the fourth embodiment. [Embodiments for Carrying Out the Invention]

[0012] [[ID=S37]] Hereinafter, embodiments of the technology of the present disclosure will be described with reference to the drawings.

[0013] [First Embodiment] [Overall Configuration] Figure 1 is a cross-sectional view of a camera module 350 equipped with a lens unit 1 according to this embodiment. As shown in Figure 1, the camera module 350 comprises a lens unit 1 equipped with an infrared cut filter 250 on the image side, an imaging unit 300, and a signal processing unit that performs calculation processing on the output signal from the imaging unit 300.

[0014] The imaging unit 300 includes an image sensor. The image sensor captures the image of the subject formed by the lens unit 1 and converts it into an electrical signal. For example, a CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) can be used. The image sensor is positioned so that its imaging surface coincides with the image plane of the lens unit 1.

[0015] The camera module 350 can be used, for example, in imaging devices mounted on automobiles or surveillance cameras.

[0016] A bandpass filter may be used instead of an infrared cut filter.

[0017] The lens unit 1 comprises a plurality of lenses arranged in a row along the optical axis L, a sealing member 5, and a lens holder 2 that holds the plurality of lenses. The plurality of lenses, from the object side La (subject side), consist of a first lens L1, a second lens L2, a third lens L3, a fourth lens L4, and a fifth lens L5.

[0018] The lens unit 1 includes a heater section 100 provided on the image side Lb of the first lens L1.

[0019] A light-shielding plate L7 is positioned between the second lens L2 and the third lens L3, and an aperture L8 is positioned between the third lens L3 and the fourth lens L4.

[0020] The first lens L1 is a plastic lens made of synthetic resin. The other lenses are either plastic lenses or glass lenses. The number and configuration of lenses held in the lens holder 2 are not limited to the above.

[0021] <Heater section 100> Figure 1B is a perspective view of an example of the heater section 100. Figure 1C is a cross-sectional view of an example of the first lens L1 and an example of the heater section 100. Figure 1D is a view of an example of the heater section 100 from the image side Lb. Figure 2 is a view of an example of the circuit pattern 12 from the object side La. Figure 3 is a cross-sectional view of an example of the circuit pattern 12.

[0022] As shown in Figure 1B, the heater section 100 comprises a metal circuit pattern 12 and a resin layer 24 that is integrally bonded to the first lens L1 by two-color molding and covers the circuit pattern 12. In Figure 1B, the resin layer 24 is shown by a dotted line.

[0023] The resin layer 24 is made of synthetic resin. The resin layer 24 is an opaque resin (for example, black). The melting point of the resin layer 24 is higher than the melting point of the first lens L1.

[0024] The circuit pattern 12 comprises one end 12A and the other end 12B. The shape of the circuit pattern 12 is such that it protrudes radially and has a plurality of protrusions 12t arranged at equal intervals along the circumferential direction. The number and shape of the protrusions 12t may be as shown in Figure 1B or Figure 2, and are not limited to these.

[0025] As shown in Figure 1C, the first lens L1 and the resin layer 24 of the heater section 100 are integrally molded by two-color molding. The resin layer 24 is interposed between the circuit pattern 12 and the first lens L1. The shape of the heater section 100 is cylindrical. The inner circumferential surface 12N of the circuit pattern 12 is covered with the resin layer 24.

[0026] As shown in Figures 1C and 1D, the image-side Lb of one end 12A and the other end 12B of the circuit pattern 12 each have a first exposed portion that is exposed from the resin layer 24.

[0027] The first exposed portion of the image side Lb at one end 12A and the other end 12B of the circuit pattern 12 is formed by direct contact with the first mold 14 for insert molding during the insert molding process described later.

[0028] At the first exposed portion of the image-side resin layer 24 at one end 12A and the other end 12B of the circuit pattern 12, a lead wire 80 made of an FPC (Flexible Printed Circuit Board) is connected, for example, as shown in Figures 1B and 1C. Note that the lead wire 80 may be replaced with a lead wire instead of an FPC.

[0029] Although not shown in the diagram, the image-side Lb of the circuit pattern 12 has a second exposed portion that is exposed from the resin layer 24 at positions other than each of the one end 12A and the other end 12B. This second exposed portion of the image-side Lb of the circuit pattern 12 is formed by direct contact with the first mold 14 for insert molding during insert molding.

[0030] The first exposed portion of the image-side Lb at one end 12A and the other end 12B of the circuit pattern 12, and the second exposed portion of the image-side Lb of the circuit pattern 12 other than each of the one end 12A and the other end 12B, serve as the positioning surface for the image-side Lb of the circuit pattern 12 in the optical axis direction when the circuit pattern 12 is placed in the first mold 14 (see also Figure 4).

[0031] (Manufacturing method for manufacturing the heater unit 100 and the first lens L1) Figures 4 to 11 show an example of a manufacturing method for the lens unit 1. The manufacturing method for producing the heater unit 100 and the first lens L1 will be explained with reference to Figures 4 to 11.

[0032] As shown in Figure 4, the circuit pattern 12 is placed in the first mold 14. As described above, the first mold 14 includes a contact portion 20 that directly contacts the first exposed portion of the image-side Lb at one end 12A and the other end 12B of the circuit pattern 12. The first mold 14 also includes at least one projection whose tip directly contacts the second exposed portion of the image-side Lb of the circuit pattern 12, other than each of the one end 12A and the other end 12B. When the circuit pattern 12 is placed in the first mold 14, the first exposed portions of the image-side Lb at one end 12A and the other end 12B of the circuit pattern 12 directly contact the contact portion 20, and the second exposed portions of the image-side Lb of the circuit pattern 12, other than each of the one end 12A and the other end 12B, directly contact the at least one projection. The first exposed portion of the image-side Lb at one end 12A and the other end 12B of the circuit pattern 12, and the second exposed portion of the image-side Lb of the circuit pattern 12 other than each of the one end 12A and the other end 12B, serve as the positioning surface for the image-side Lb of the circuit pattern 12 in the optical axis direction when the circuit pattern 12 is placed in the mold 14 (see also Figure 4).

[0033] As shown in Figure 5, the second mold 22 is placed on the first mold 14 so as to accommodate the circuit pattern 12 at a distance from it.

[0034] The first mold 14 and the second mold 22 have recesses 18 formed between them, which are spaced apart from the circuit pattern 12 to accommodate the circuit pattern 12.

[0035] As shown in Figure 6, the circuit pattern 12 is insert-molded into the resin layer 24 by filling the space (recess 18) between the first mold 14 and the second mold 22 with synthetic resin for the resin layer 24.

[0036] As shown in Figure 7, the second mold 22 is removed.

[0037] As shown in Figure 8, the third mold 30, which forms the space 32 for the first lens L1, is placed on top of the first mold 14 instead of the second mold 22.

[0038] As shown in Figure 9, the first lens L1 and the heater section 100 are molded in two colors by filling the space 32 of the third mold 30 with synthetic resin for the first lens L1 through the injection hole 34.

[0039] As shown in Figure 10, the first mold 14 and the third mold 30 are removed.

[0040] As described above, during insert molding, the first exposed portions of the image-side Lb at one end 12A and the other end 12B of the circuit pattern 12 come into direct contact with the contact portion 20 of the first mold 14. Therefore, the first exposed portions of the image-side Lb at each end 12A and the other end 12B of the circuit pattern 12 are exposed from the resin layer 24. In addition, during insert molding, the second exposed portions of the image-side Lb of the circuit pattern 12, other than each end 12A and the other end 12B, come into direct contact with the protrusions of the first mold 14. Therefore, the second exposed portions of the image-side Lb of the circuit pattern 12, other than each end 12A and the other end 12B, are exposed from the resin layer 24.

[0041] Subsequently, the lead wires 80 are connected to the portions of the image-side Lb of the circuit pattern 12 that are exposed from the resin layer 24 at one end 12A and the other end 12B.

[0042] The second lens L2 to the fifth lens L5, the light-shielding plate L7, and the aperture L8 are held in the lens holder 2, and the heater unit 100 and the first lens L1 manufactured by the above manufacturing method are attached to the lens holder 2.

[0043] The first mold 14 is fixed, while the second mold 22 and the third mold 30 are movable.

[0044] (effect) As described above, in this embodiment, the circuit pattern 12 is insert-molded into the resin layer 24, so the circuit pattern 12 is fixed to the resin layer 24, and since the resin layer 24 and the first lens L1 are two-color molded, the resin layer 24 and the first lens L1 are integrally molded. Therefore, in this embodiment, it is possible to prevent the circuit pattern 12 from shifting position relative to the first lens L1.

[0045] Since the resin layer 24 in this embodiment is opaque (for example, black), the generation of ghosting caused by the heater unit 100 can be suppressed. Furthermore, by making the resin layer 24 opaque (for example, black), the occurrence of ghosting caused by light reflected from the image side of the flange portion of the first lens L1 can be suppressed. Note that if the resin layer 24 is opaque, the occurrence of ghosting can be suppressed even without applying black ink.

[0046] Furthermore, in this embodiment, the inner circumferential surface 12N of the circuit pattern 12 is covered with a resin layer 24, which also helps to suppress the generation of ghosting caused by the heater unit 100.

[0047] Incidentally, the thickness of the resin layer 24 covering the inner surface of the circuit pattern 12, the shape of the circuit pattern 12 (especially the position of the inner surface 12N), and the shape of the first mold 14 (especially the position on the optical axis L side) are determined so that the position of the inner surface of the circuit pattern 12 is as close as possible to the position of the image side Lb of the first lens L1 and the generation of ghosting from the inner surface of the circuit pattern 12 is suppressed. Therefore, the width of the circuit pattern 12 is made closer to the width of the image side Lb of the first lens L1, and the area of ​​the first lens L1 heated by the circuit pattern 12 is increased. Thus, this embodiment can heat the first lens L1 more efficiently while suppressing the generation of ghosting.

[0048] (modified version) Figure 11 is a perspective view showing an example of a circuit pattern 12 and an example of a film 102 bonded to the circuit pattern 12 in a first modification of the first embodiment. As shown in Figure 11, in the first modification, the film 102 may be bonded to at least one side of the circuit pattern 12 (for example, the object-side La side) before insert molding the circuit pattern 12 into the resin layer 24. This fixes the multiple protrusions 12t to the film 102, making it easier to position the circuit pattern 12 in the first mold 14.

[0049] The film 102 melts during insert molding and becomes part of the resin layer 24.

[0050] Figure 12 shows an example of the circuit pattern 12 of the second modified example. As shown in Figure 12, the shape of the circuit pattern 12 of the second modified example is such that it protrudes in the circumferential direction and has a plurality of protrusions 12t arranged at equal intervals along the radial direction.

[0051] [Second Embodiment] Since the configuration of the second embodiment is substantially the same as that of the first embodiment, the same reference numerals are used for the same parts, and their descriptions are omitted, while the different parts are described.

[0052] (Configuration of heater unit 100 and first lens L1) Figure 13A is a cross-sectional view of an example of the first lens L1 and an example of the heater unit 100 in the second embodiment.

[0053] As shown in Figure 13A, the second exposed portion 12CP of the circuit pattern 12, other than one end 12A and the other end 12B of the image-side Lb, is exposed from the resin layer 24. The second exposed portion 12CP exposed from the resin layer 24 is covered by a covering portion 34C. The covering portion 34C is, for example, an adhesive.

[0054] At least one outer surface exposed portion 12G of the outer surface of the circuit pattern 12 is exposed from the resin layer 24. The outer surface exposed portion 12G is covered by the outer surface covering portion L1C of the first lens L1. The outer surface exposed portion 12G is located around the entire circumference or at multiple locations on the outer surface of the circuit pattern 12.

[0055] Figure 13B shows an example of a circuit pattern 12 as seen from the object side La. In Figure 13B, the shape of the portion 12C where the image side Lb of the circuit pattern 12 is exposed is rectangular.

[0056] (Manufacturing method for manufacturing the heater unit 100 and the first lens L1) The manufacturing method for producing the heater unit 100 and the first lens L1 of the second embodiment is substantially the same as the manufacturing method for producing the heater unit 100 and the first lens L1 of the first embodiment, so only the differences will be explained.

[0057] Figures 14A to 14C show a part of an example of a manufacturing method for the lens unit 1 according to the second embodiment.

[0058] As shown in Figure 14A, the circuit pattern 12 is placed in the first mold 14. The first mold 14 of the second embodiment includes the contact portion 20, a contact portion 14S that directly contacts the second exposed portion 12CP other than one end 12A and the other end 12B of the image side Lb of the circuit pattern 12, and a contact surface 14T that the outer peripheral surface of the circuit pattern 12 directly contacts.

[0059] The contact portion 20 and the contact portion 14S position the image-side Lb of the circuit pattern 12 in the direction of the optical axis L, and the contact surface 14T positions the circuit pattern 12 in a direction perpendicular to the optical axis L.

[0060] As shown in Figure 14B, the second mold 22 is placed on the first mold 14 so as to accommodate the circuit pattern 12 at a distance from it. The second mold 22 has a contact surface 22T that the exposed outer surface portion 12G of the circuit pattern 12 makes direct contact with. The contact surface 22T also positions the circuit pattern 12 perpendicular to the optical axis L.

[0061] As shown in Figure 14C, the third mold 30, which forms the space 32 for the first lens L1, is placed on top of the first mold 14 instead of the second mold 22.

[0062] The third mold 30 has a shape in which a covering portion L1C is formed on the outer circumference side of the first lens L1, covering at least one exposed outer surface portion 12G of the outer surface of the circuit pattern 12. Therefore, when synthetic resin for the first lens L1 is filled into the space 32, the covering portion L1C is formed on the outer circumference side of the first lens L1.

[0063] Figure 14D is a view of an example of the heater section 100 from the image side Lb. As shown in Figure 14D, the image side Lb of the heater section 100 is exposed from the resin layer 24, with the image side Lb of one end 12A and the other end 12B of the circuit pattern 12 exposed, and the second exposed portion 12CP other than each of the image side Lb of the circuit pattern 12, excluding the one end 12A and the other end 12B. As described above, the second exposed portion 12CP is covered with a cover portion 34C. The cover portion 34C is, for example, an adhesive.

[0064] (effect) This embodiment provides the same effects as the first embodiment.

[0065] Furthermore, in the second embodiment, the covering portion 34C (adhesive) is applied to the second exposed portion 12CP, but since there is only one second exposed portion 12CP, the effort required to apply the covering portion 34C (adhesive) is less than when there are multiple exposed portions.

[0066] (modified version) Figure 15 is a view of an example of a modified heater section 100 of the second embodiment, as seen from the image side Lb. As shown in Figure 15, three second exposed portions are formed in the circuit pattern 12 of the modified second embodiment, other than each of the one end 12A and the other end 12B on the image side Lb. Specifically, an exposed portion 12D is formed at a first position corresponding to the optical axis L, at the center of the one end 12A and the other end 12B. Exposed portions 12E and 12F are formed at a second and third position, opposite to each other, on a line that intersects with the line connecting the central position and the first position. The exposed portions 12D, 12E, and 12F are covered by the adhesive covering portion 34C. Alternatively, ejection pins may be placed at the positions of the first mold 14 corresponding to the exposed parts 12D, 12E, and 12F, so that after the first lens L1 and heater part 100 are molded in two colors in the mold, the first lens L1 and heater part 100 are ejected from the first mold 14 by the ejection pins.

[0067] The exposed portions 12D, 12E, and 12F serve as positioning surfaces for the image-side Lb of the circuit pattern 12 in the optical axis L direction. Since there are three exposed portions 12D, 12E, and 12F, the positioning accuracy of the image-side Lb of the circuit pattern 12 in the optical axis L direction in this modified example can be improved compared to the case of the second embodiment (one portion (see Figure 14D)).

[0068] [Third Embodiment] Since the configuration of the third embodiment is substantially the same as that of the second embodiment, the same reference numerals are used for the same parts, and their descriptions are omitted, while the different parts are described.

[0069] (Configuration of heater unit 100 and first lens L1) Figure 16 is a cross-sectional view of an example of the first lens L1 and an example of the heater unit 100 in the third embodiment. Figure 17 is a view of an example of the heater unit 100 from the image side Lb.

[0070] As shown in Figure 16, the circuit pattern 12 and the first lens L1 are in direct contact.

[0071] As shown in Figure 17, in the heater section 100 of the third embodiment, only the image-side Lb of one end 12A and the other end 12B is exposed from the resin layer 24.

[0072] (effect) This embodiment provides the same effects as the first embodiment.

[0073] In this embodiment, since the circuit pattern 12 and the first lens L1 are in direct contact, there are no members that obstruct temperature transfer between the circuit pattern 12 and the first lens L1, allowing the first lens to be heated more effectively. As a result, the lens surface of the first lens L1 heats up quickly, and any frost or other deposits can be removed more quickly.

[0074] In the third embodiment, the positioning surface when placing the circuit pattern 12 in the first mold 14 is the object-side La surface, so the image-side Lb positioning surface is unnecessary. [Fourth Embodiment] Since the configuration of the fourth embodiment is substantially the same as that of the first embodiment, the same reference numerals are used for the same parts, and their descriptions are omitted, while the different parts are described.

[0075] Figure 18 shows a part of an example of a manufacturing method for the lens unit 1 of the fourth embodiment. Figure 19 is a cross-sectional view of an example of the first lens L1 and an example of the heater section 100 of the lens unit 1 of the fourth embodiment.

[0076] The first lens L1 in the fourth embodiment is a glass lens.

[0077] In the first embodiment, as shown above (see Figure 6), the circuit pattern 12 is insert-molded into the resin layer 24 by filling the space between the first mold 14 and the second mold 22 (recess 18) with synthetic resin for the resin layer 24.

[0078] In contrast, in the fourth embodiment, as shown in Figure 18, the circuit pattern 12 is insert-molded into the resin layer 24 by filling the space between the first mold 14, the second mold 22, and the first lens L1 with synthetic resin for the resin layer 24. Specifically, after placing the circuit pattern 12 in the first mold 14 as described above, the first lens L1 and the second mold 22 are sequentially placed in the first mold 14 in which the circuit pattern 12 is placed. In the fourth embodiment, the following space is formed between the first mold 14, the second mold 22, and the first lens L1. In other words, in addition to the recess 18, a first vertical space 38D is formed that extends perpendicularly from the outer circumference of the recess 18 toward the object side La, a horizontal space 38C is connected to the end of the object side La of the first vertical space 38D and extends horizontally from that end toward the outer circumference, a second vertical space 38B extends perpendicularly from the outer circumference of the horizontal space 38C toward the object side La, and a protruding space 38 is formed that protrudes in the direction of the optical axis L from the end of the object side La of the second vertical space 38B.

[0079] The recess 18, the first vertical space 38D, the horizontal space 38C, the second vertical space 38B, and the protruding space 38A are filled with synthetic resin for the resin layer 24. As a result, as shown in Figure 19, the resin layer 24 is formed up to the outer circumference of the first lens L1 and a clamping portion 24ABC is formed that sandwiches the outer circumference of the first lens L1.

[0080] (effect) In the fourth embodiment, since the clamping portion 24ABC clamps the outer circumference of the first lens L1, even if the first lens L1 is a glass lens, the displacement of the heater portion 100 from the first lens L1 can be suppressed more effectively than in the prior art.

[0081] [Other variations] The image-side Lb of the resin layer 24 may have a shape that scatters light.

[0082] The circuit pattern 12 includes a portion that is exposed from the resin layer 24, and the exposed portion may be painted black.

[0083] In the configurations of the first embodiment (see Figure 1C), the second embodiment (see Figure 13A), and the third embodiment (see Figure 16), the first lens L1 may be a glass lens. In this case, similar to the fourth embodiment, the circuit pattern 12 and the first lens L1 are placed in the mold, and then the synthetic resin for the resin layer 24 is filled into the mold, thereby insert molding the circuit pattern 12 into the resin layer 24.

[0084] In the configuration of the fourth embodiment (see Figure 18), the first lens L1 may be a plastic lens made of synthetic resin.

[0085] Based on the above disclosures, the following addendum is proposed.

[0086] (Note 1) Multiple lenses arranged in line along the direction of the optical axis, A heater unit is provided on the image side of the first lens, which is positioned closest to the object among the plurality of lenses, Equipped with, The first lens is made of synthetic resin, The heater section comprises a metal circuit pattern and a resin layer that is integrally bonded to the first lens by two-color molding and covers the circuit pattern. Lens unit.

[0087] (Note 2) The resin layer is interposed between the circuit pattern and the first lens. The lens unit described in Appendix 1.

[0088] (Note 3) The circuit pattern and the first lens are in contact. The lens unit described in Appendix 1.

[0089] (Note 4) The circuit pattern comprises one end and the other end, The image side of each of the one end and the other end of the circuit pattern is provided with a first exposed portion that is exposed from the resin layer. The lens unit described in any one of the following appendices, 1 to 3.

[0090] (Note 5) The image side of the circuit pattern has a second exposed portion that is exposed from the resin layer at a position other than each of the one end and the other end. The lens unit described in Appendix 4.

[0091] (Note 6) The second exposed portion is located at a first position corresponding to the center of one end and the other end, straddling the optical axis, and at a second and third position opposite each other on a line intersecting the line connecting the center position and the first position. The lens unit described in Appendix 5.

[0092] (Note 7) The second exposed portion is covered by the covering portion. The lens unit described in Appendix 5 or Appendix 6. (Note 8) The covering part is an adhesive. The lens unit described in Appendix 7.

[0093] (Note 9) The shape of the heater section is cylindrical. The inner surface of the circuit pattern is covered with the resin layer. The lens unit described in any one of the appendices 1 through 8.

[0094] (Note 10) The outer circumferential surface of the circuit pattern includes at least one outer circumferential surface exposed portion that is exposed from the resin layer, The outer periphery of the first lens is provided with a covering portion that covers the exposed outer periphery of the outer periphery of the circuit pattern. The lens unit described in any one of the appendices 1 through 9.

[0095] (Note 11) The exposed portion of the outer periphery of the circuit pattern is located at the entire circumference or at multiple locations on the outer periphery of the circuit pattern. The lens unit described in Appendix 10.

[0096] (Note 12) The shape of the circuit pattern is such that it protrudes radially or circumferentially and has protrusions arranged at equal intervals along the circumferential or radial direction. The lens unit described in any one of the appendices 1 to 11.

[0097] (Note 13) Multiple lenses arranged in line along the direction of the optical axis, A heater unit is provided on the image side of the first lens, which is positioned closest to the object among the plurality of lenses, Equipped with, The heater section comprises a metal circuit pattern and a resin layer covering the circuit pattern. Lens unit.

[0098] (Note 14) The resin layer is formed up to the outer circumference of the first lens and includes a clamping portion that sandwiches the outer circumference of the first lens. The lens unit described in Appendix 13.

[0099] (Note 15) A camera module equipped with a lens unit as described in any one of the appendices 1 to 14. [Explanation of Symbols]

[0100] 1 Lens Unit 300 Imaging Unit L1 First Lens 24 resin layer 12 Circuit Patterns 14. First mold 22 Second mold 30 Third mold

Claims

1. Multiple lenses arranged in line along the direction of the optical axis, A heater unit is provided on the image side of the first lens, which is positioned closest to the object among the plurality of lenses, Equipped with, The first lens is made of synthetic resin, The heater section comprises a metal circuit pattern and a resin layer that is integrally bonded to the first lens by two-color molding and covers the circuit pattern. Lens unit.

2. The resin layer is interposed between the circuit pattern and the first lens. The lens unit according to claim 1.

3. The circuit pattern and the first lens are in contact. The lens unit according to claim 1.

4. The circuit pattern comprises one end and the other end, The image side of each of the one end and the other end of the circuit pattern is provided with a first exposed portion that is exposed from the resin layer. The lens unit according to claim 1.

5. The image side of the circuit pattern has a second exposed portion that is exposed from the resin layer at a position other than each of the one end and the other end. The lens unit according to claim 4.

6. The second exposed portion is located at a first position corresponding to the center of one end and the other end, straddling the optical axis, and at a second and third position opposite each other on a line intersecting the line connecting the center position and the first position. The lens unit according to claim 5.

7. The second exposed portion is covered by the covering portion. The lens unit according to claim 5.

8. The covering part is an adhesive. The lens unit according to claim 7.

9. The shape of the heater section is cylindrical. The inner surface of the circuit pattern is covered with the resin layer. The lens unit according to claim 1.

10. The outer circumferential surface of the circuit pattern includes at least one outer circumferential surface exposed portion that is exposed from the resin layer, The outer periphery of the first lens is provided with a covering portion that covers the exposed outer periphery of the outer periphery of the circuit pattern. The lens unit according to claim 1.

11. The exposed portion of the outer periphery of the circuit pattern is located at the entire circumference or at multiple locations on the outer periphery of the circuit pattern. The lens unit according to claim 10.

12. The shape of the circuit pattern is such that it protrudes radially or circumferentially and has protrusions arranged at equal intervals along the circumferential or radial direction. The lens unit according to claim 1.

13. Multiple lenses arranged in line along the direction of the optical axis, A heater unit is provided on the image side of the first lens, which is positioned closest to the object among the plurality of lenses, Equipped with, The heater section comprises a metal circuit pattern and a resin layer covering the circuit pattern. Lens unit.

14. The resin layer is formed up to the outer circumference of the first lens and includes a clamping portion that sandwiches the outer circumference of the first lens. The lens unit according to claim 13.

15. A camera module comprising the lens unit described in claim 1.

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