Indication device

Abstract

To provide highly convenient electronic devices. To make the information displayed easy for the user to read. To provide a sub-device. To reduce the actions required for the user to read information. [Solution] The housing of the electronic device has a first part located on the front of the housing and a side of the housing. It has a second part located therein, a first band attachment part, and a second band attachment part. The part has the function of displaying an image. The first band attachment part is visible from the front side of the housing. It is located on the upper side. The second part and the second band attachment part are on the front of the housing. It is located on the side that is on the lower side when viewed from the side. The first part has the function of displaying an image. or having at least one of the hour hand, minute hand, and second hand.

Description

Technical Field

[0001] One aspect of the present invention relates to an electronic device including a display device.

[0002] Note that one aspect of the present invention is not limited to the above technical field. As the technical field of one aspect of the present invention disclosed in this specification and the like, semiconductor devices, display devices, light-emitting devices, power storage devices, storage devices, electronic devices, lighting devices, input devices, input / output devices, their driving methods, or their manufacturing methods can be given as an example.

Background Art

[0003] Portable information terminals typified by smartphones and tablet terminals have been actively developed. In addition, such portable information terminals are required to be lightweight and small-sized.

[0004] In particular, in recent years, the development of wearable electronic devices (also referred to as wearable devices) has been actively carried out. Examples of wearable devices include a wristwatch-type device worn on the wrist, an eyeglass-type device worn on the head, a necklace-type device worn around the neck, and the like. For example, a wristwatch-type device includes a small display instead of a dial in a conventional watch and can provide various information other than time to a user. In addition, such wearable devices have also attracted attention for medical applications and self-management of health conditions, and their practical use is progressing.

[0005] Typical display devices include light-emitting devices including light-emitting elements such as organic EL (Electro Luminescence ) elements and light-emitting diodes (LEDs: Light Emitting Diodes), liquid crystal display devices, and electronic paper that performs display by an electrophoresis method or the like. ​ - and the like.

[0006] Patent Document 1 discloses a flexible light-emitting device to which an organic EL element is applied. .

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] One aspect of the present invention is to provide an electronic device with high convenience as one of the problems. Or, to provide an electronic device in which information displayed can be easily read by a user as one of the problems. Also, to reduce the operations for the user to read information as one of the problems.

[0009] Or, one aspect of the present invention is to provide an electronic device in which high visibility is achieved without being affected by external light. to provide an electronic device with reduced power consumption as one of the problems. Or, to provide an electronic device that can perform both smooth video display and gentle still image display. as one of the problems. Or, to provide a novel electronic device as one of the problems. as one of the problems. Or, to provide a novel electronic device as one of the problems. as one of the problems.

Means for Solving the Problems

[0010] One aspect of the present invention is an electronic device having a housing. The housing has a first part, a second part, a first band attachment part, and a second band attachment part. The first part is the front of the housing. It is located at the second part. The second part has the function of displaying an image. The second part, the first band The attachment part and the second band attachment part are located on the side of the housing, respectively. The attachment point is located on the upper side when viewed from the front of the housing. The second part and the second The band attachment point is located on the side of the housing, on the lower side when viewed from the front.

[0011] Another aspect of the present invention is an electronic device having a housing. The housing comprises a first part, a second part It has two parts, a first band attachment part, and a second band attachment part. The first part is It is located on the front of the enclosure. The second part has the function of displaying images. Second part, first The first band attachment section and the second band attachment section are located on the side of the housing. The first band attachment portion and the second band attachment portion are along the first straight line that penetrates the side of the housing. , are positioned opposite each other. The second part intersects the first straight line with the side of the housing. Of the intersection points, the first point on the side of the second band attachment point coincides with it.

[0012] Furthermore, in the above, the second part penetrates the side of the housing and, when viewed from the front, the first The second line intersects the first line and coincides with the second point, which is one of the two intersection points with the side. Preferably, the first point, the intersection of the first line and the second line, and the second point Preferably, the angle formed by the two is between 45 degrees and 270 degrees.

[0013] Furthermore, the first part described above has at least one of the hour hand, minute hand, and second hand. preferable.

[0014] Alternatively, the first part described above preferably has a function for displaying an image.

[0015] Furthermore, within the above-mentioned enclosure, there is a display panel that overlaps with the first part, and a display panel that overlaps with the second part. It is preferable that it has a nel.

[0016] The first part and the second part each have the function of displaying images, and are seamlessly continuous. It may also be configured as follows. In this case, the first part and the second part overlap, and a part of it is curved. It is preferable that it has a display panel.

[0017] Display panel provided across the first part, the second part, or the first and second parts The materials used include liquid crystal elements, organic EL elements, inorganic EL elements, LED elements, microcapsules, and electrophoretic elements. Dynamic element, electrowetting element, electrofluidic element, electro It is preferable that the element includes one or more selected from romic elements and MEMS elements.

[0018] Alternatively, it may be provided in the first part, the second part, or spanning the first and second parts. The display panel comprises a first substrate, a second substrate, a first liquid crystal element, a first light-emitting element, and It is preferable to have an insulating layer and a first liquid crystal element. Located between the insulating layers, the first light-emitting element is located between the first substrate and the first insulating layer, The liquid crystal element has the function of reflecting light to the second substrate side, and the first light-emitting element is on the second substrate It is preferable that it has the function of emitting light on the side. [Effects of the Invention]

[0019] According to one aspect of the present invention, a highly convenient electronic device can be provided. Or, the user can display It is possible to provide electronic devices that make it easy to read the information being presented. Or, the user can read the information. This can reduce the amount of eye movement required.

[0020] Alternatively, one aspect of the present invention provides an electronic device that achieves high visibility regardless of ambient light. Alternatively, it can provide electronic devices with reduced power consumption. Alternatively, it can display smooth video. This allows us to provide electronic devices that can both display still images that are easy on the eyes. Or, We can provide new electronic devices. [Brief explanation of the drawing]

[0021] [Figure 1] A diagram illustrating electronic devices. [Figure 2] A diagram illustrating electronic devices. [Figure 3] A diagram illustrating electronic devices. [Figure 4] A diagram illustrating electronic devices. [Figure 5] A diagram illustrating electronic devices. [Figure 6] A diagram illustrating electronic devices. [Figure 7] A diagram illustrating electronic devices. [Figure 8] A block diagram illustrating electronic devices. [Figure 9] A block diagram showing an example of a display device. [Figure 10] A diagram showing an example of a pixel unit. [Figure 11] A diagram showing an example of a pixel unit. [Figure 12] A diagram showing an example of a pixel unit. [Figure 13] A diagram showing an example of a display device and an example of a pixel. [Figure 14] A circuit diagram showing an example of a pixel circuit in a display device. [Figure 15] A circuit diagram showing an example of a pixel circuit in a display device, and a diagram showing an example of a pixel. [Figure 16] A perspective view showing an example of a display device. [Figure 17] A cross-sectional view showing an example of a display device. [Figure 18] A cross-sectional view showing an example of a display device. [Figure 19] A cross-sectional view showing an example of a display device. [Figure 20] A cross-sectional view showing an example of a transistor. [Figure 21] A cross-sectional view showing an example of a method for manufacturing a display device. [Figure 22] A cross-sectional view showing an example of a method for manufacturing a display device. [Figure 23] A cross-sectional view showing an example of a method for manufacturing a display device. [Figure 24] A cross-sectional view showing an example of a method for manufacturing a display device. [Modes for carrying out the invention]

[0022] Embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. Without departing from the spirit and scope of the present invention, its form and details may be modified in various ways. Those skilled in the art will readily understand what is possible. Therefore, the present invention is as shown in the following embodiments. It should not be interpreted as being limited to the contents described herein.

[0023] In the configuration of the invention described below, the same part or part having a similar function is The same reference numerals are used consistently across different drawings, and explanations of their repetition are omitted. When referring to the function of [this], the hatch pattern is the same, and sometimes no specific symbol is assigned.

[0024] In each figure described herein, the size, layer thickness, or area of ​​each component is as follows: It may be exaggerated for clarity. Therefore, it is not necessarily limited to that scale. stomach.

[0025] In this specification, ordinal numbers such as "the first," "the second," etc., are used to avoid confusion of constituent elements. This is added for the purpose of providing a numerical limit, and is not intended to limit the number of items.

[0026] (Embodiment 1) This embodiment describes an electronic device according to one aspect of the present invention.

[0027] One aspect of the present invention is an electronic device having a housing and a display unit located on the side of the housing. Furthermore, the casing is equipped with a band (belt or strap) for the user to wear. It has a pair of band attachment parts, which are the parts that are attached. One aspect of the present invention is a wearable It can be used as a device. Preferably, it can be attached to the user's arm. It can be used as a type of information terminal device.

[0028] The front of the casing has a display unit (first table) capable of displaying a clock face or an image. It is equipped with a display unit (also called a touch panel). If the display unit is located on the front of the housing, the display unit is a touch panel. It is preferable that it functions as such.

[0029] Furthermore, in one aspect of the present invention, a display unit (also a second display unit) that displays an image along the side of the housing is also a display unit that displays an image along the side of the housing. It has ( ). By providing a display unit on the side of the housing, various information can be displayed on the display unit. This makes it possible to do so, thereby improving user convenience.

[0030] Furthermore, it is more preferable that the second display unit functions as a touch panel. This allows, The side of the enclosure can be used as an input device. By touching the side of the enclosure, the user can... I can operate electronic devices.

[0031] For example, if it's a watch-type device intended to be worn on the wrist, there would be two band attachments. The protrusions are located on the top and bottom when viewed from the front. More specifically, they penetrate the side of the casing. Two band attachment points are positioned opposite each other on a straight line. The upper band attachment point The band (first band) attached to the attachment part (first band attachment part) is wrapped around the arm. When attached, it is located on the little finger side and attached to the band attachment part (second band attachment part) located on the lower side. The attached band (the second band) is positioned so that when worn on the wrist, the thumb side (the side facing the user) It is located on the side.

[0032] In particular, the second display unit is located on the side of the housing that is on the side of the second band attachment part. It is preferable to have this. This part of the housing does not perform any action that the user intends to see. It's a part that easily comes into view. For example, when you look at your arm while walking, it's a part that comes into view. It is a minute, and also when doing desk work (with arms resting on the desk), gaze This is the part that comes into view when you point it downwards. By positioning the second display unit in this area... When a user tries to obtain information from an electronic device, they turn their wrist to look at the front of the device. Without doing anything, simply by shifting your gaze, you can naturally obtain the information displayed on the second display unit. Cut.

[0033] Furthermore, the second display unit is provided extending from the lower side of the housing to either the left or right side. This is preferable. Also, the second display unit is located on the lower side of the housing, via the left side or the right side. It may also be provided across the upper side surface. This increases the display area of ​​the second display unit. This allows us to provide users with more information.

[0034] For example, if we consider the case where an electronic device is to be worn on the left arm (preferably the left wrist), then When viewed from the side, it is preferable that a second display unit is provided extending from the lower side to the left side of the casing. It seems that when an electronic device is worn on the left arm, a portion of the left side of the casing is also intended by the user. It is a part that easily comes into view without requiring any action to look at it.

[0035] On the other hand, if we consider the assumption that the electronic device will be worn on the right arm, when viewed from the front, the bottom of the casing... It is preferable that a second display section is provided extending from the side to the right side.

[0036] Furthermore, the second display unit is provided on the right side of the housing, extending from the lower side through to the left side. This may be acceptable. This allows for a universal design that can be worn on both the right and left arms. It can be achieved.

[0037] Furthermore, on the left or right side of the electronic device, in the area where the second display unit is not provided. It may be equipped with buttons, operating switches, a crown, etc. For example, when worn on the left arm If this were to be the case, these features would be placed on the right side of the casing, and it would be designed to be worn on the right arm. In such cases, these can be provided on the left side of the enclosure.

[0038] Furthermore, by providing buttons, operation switches, crowns, etc. on the upper side of the casing, This allows for a universal design that can be worn on both the upper and lower arms.

[0039] The first and second display units include liquid crystal elements, organic EL elements, LED elements, and microcavities. Capsules, electrophoretic elements, electrowetting elements, electrofluidic elements Preferably, it includes one or more selected from electrochromic elements and MEMS elements. Examples of liquid crystal elements include transmissive liquid crystal elements, reflective liquid crystal elements, and semi-transmissive liquid crystal elements. In particular, reflective liquid crystal elements do not require a light source, thus reducing power consumption. As crystal elements, there are nematic liquid crystal elements, cholesteric liquid crystal elements, ferroelectric liquid crystal elements, etc. When using a device with a liquid crystal material that has molybdenum properties, the rewriting of still images is Because the frequency can be reduced, power consumption can be reduced.

[0040] In particular, a display device in which a reflective element and a light-emitting element are mixed together is applied to the first display unit. This is preferable. As a result, when the ambient light is bright, the reflective element consumes energy. It can display low power, and when the ambient light is dim, the light-emitting element provides a vivid display. It can display kana characters. Furthermore, it can display them simultaneously using reflective elements and light-emitting elements. This reduces power consumption and allows for a vivid display.

[0041] Furthermore, the second display unit also incorporates a display device that combines the aforementioned reflective elements and light-emitting elements. It is preferable to use it.

[0042] At least one of the first display unit and the second display unit includes the above-mentioned reflective element and light-emitting element. By applying a display device that combines both, it becomes easier for the user to see regardless of the ambient light brightness. This makes it possible to create easy-to-use electronic devices.

[0043] Here, the first display unit and the second display unit are each fitted with display elements having the same configuration. You may apply a display device, or you may apply a display device having a different configuration. good.

[0044] For example, the first display unit located on the front of the enclosure, and the second display unit located on the side. By applying a display device that combines reflective elements and light-emitting elements to each, low power consumption is achieved. This makes it possible to create electronic devices that are both powerful and highly visible.

[0045] For example, the first display unit located on the front of the housing contains a mixture of reflective elements and light-emitting elements. By applying the aforementioned display device, low power consumption is achieved, and the second display unit is equipped with a light-emitting element. A display device may be applied to provide a clear display. In this case, the display device located on the side of the housing When the second display unit is used as a sub-display smaller than the first display unit, Because the area can be reduced, power consumption can be lowered.

[0046] Furthermore, the case may have a crystal, bezel, crown, push buttons, lugs, etc. stomach.

[0047] In the following, a more specific example of an electronic device according to one aspect of the present invention will be described with reference to the drawings. do.

[0048] [Configuration Example 1] Figures 1(A) and 1(B) show perspective views of the electronic device 10 exemplified below. Figure 1(A) is Figure 1(B) shows the front (main surface), right side, and bottom (lower side) of the electronic device 10. The front, left side, and bottom sides of device 10 are shown.

[0049] The electronic device 10 has a housing 11. The housing 11 has a display unit 21, a display unit 22, and a band holder. It has an attachment part 31, a band attachment part 32, a crown 25, and a button 26, etc. Examples 1(A) and (B) show that the electronic device 10 has bands 41 and 42 attached. This indicates that.

[0050] The display unit 21 is located on the front side of the housing 11 and has the function of clearly displaying information such as the time to the user. It has. For example, the display unit 21 may be a clock face, or it may display videos or still images. A display device capable of showing the information may be applied.

[0051] When a display device is applied to the display unit 21, even if a segment-type display device is applied Good. This allows it to function as a digital clock.

[0052] In particular, the display unit 21 is equipped with an active matrix or passive matrix display device. It is preferable to apply a touch. In particular, when applying a display device to the display unit 21, It is preferable to apply a display device that functions as a panel.

[0053] When an analog clock face is provided on the display unit 21 located on the front side of the housing 11, at least The clock shall have at least one hour hand, minute hand, or second hand. Furthermore, the clock's design shall be as follows: A quartz movement is preferred, but a mechanical movement is also acceptable. A quartz movement is adopted. So, the battery is shared between the display unit 21 and the electronic components inside the housing (for example, the display panel, etc.). It can. Also, by using a mechanical movement, the watch does not require electricity to operate, so it does not require a battery. It can still function as a clock even when the battery level is low. The watch mechanism can be powered by either a battery-powered quartz movement or a mainspring's restorative force. A hybrid system that combines mechanical elements and utilizes two power sources may also be used.

[0054] The display unit 22 is provided on a part of the side of the housing 11 and has the function of displaying images. Section 22 may be fitted with a segment-type display device, but an active-matrix type It is preferable to apply a display device using a formula or passive matrix method. In particular, display unit 2 It is preferable to apply a display device that functions as a touch panel to step 2.

[0055] The band attachment portion 31 is located on the upper side of the housing 11, and the band attachment portion 32 is located on the housing It is located on the lower side (bottom) of 11. The band attachment part 31 and the band attachment part 32 are, It is located opposite the display unit 21. Note that in Figures 1(A) and (B), The band attachment portion 31 and the band attachment portion 32 are shown as recesses provided in the housing 11. However, its form is not limited to this, and it has a mechanism that can fix band 41 or band 42. It is sufficient if they are connected. For example, bands 41 and 42 and housing 11 are connected via spring bars. In this configuration, the band attachment portion 31 and the band attachment portion 32 are at least the spring bar It can be configured to have a pair of bearing parts to which it is attached.

[0056] Furthermore, the housing 11 and the band 41, or the housing 11 and the band 42, are not detachable. It is also possible to do so. Furthermore, band 41, band 42, and housing 11 become one, and the boundary is unclear. It can also be a clear configuration. In that case, at least the parts that can be bent This will be band 41 or band 42.

[0057] Herein, in this specification, when the electronic device 10 is viewed from the front side (display unit 21 side), the band The orientation in which band 41 is provided is considered the upper side, and the orientation in which band 42 is provided is considered the lower side.

[0058] Note that the orientation of the image or dial shown in the display unit 21 is not limited to this, and it may also be tilted. This is also fine. For example, a display device may be applied to the display unit 21, and the electronic device 10 may be affected by the tilt of the housing 11. If the housing 11 has a function to detect its orientation, the orientation of the displayed image will be determined according to the orientation of the housing 11. You may change the character.

[0059] The crown 25 and button 26 function as part of the user interface. The user may, for example, push, pull, rotate, or move the crown 25 or button 26 up or down. Alternatively, operations such as sliding it in the forward and backward directions can be performed. Electronic device 10 In conjunction with such operations, the power turns on and off, applications are launched and switched, and Other operations can be performed. Note that here the casing 11 has one crown 25 and An example is shown in which two buttons 26 are provided, but other switches or the like may also be included.

[0060] Here, when bands 41 and 42 are wrapped around the user's arm, band 41 is on the little finger side. Band 42 is located on the thumb side (the side facing the user).

[0061] The display unit 22 is located on the side of the housing 11 that is on the band 42 side (i.e., the band mounting part 32 side). ) is located so that the user can look at the front of the electronic device 10 (for example, the display unit 21). Without having to make any movements such as turning your wrist, simply by directing your gaze towards the electronic device 10, the display unit 2 It is possible to view 2. Therefore, it is possible to create extremely convenient electronic devices.

[0062] Figure 2(A) is a schematic diagram of the electronic device 10 as seen from the front. This shows the case where an analog clock face is applied to the display unit 21.

[0063] The display unit 21 has an hour hand 51, a minute hand 52, a second hand 53, and an index 54. It is sufficient to have at least one of the hour hand 51, minute hand 52, and second hand 53. Dex 54 is not limited to the example shown in Figure 2(A), and various designs can be applied to it. The display unit 21 also includes a date display function (calendar) and a moon phase display function. It may also have a power reserve indicator function.

[0064] Figure 2(B) shows the images that can be displayed when a display device is applied to the display unit 21. This is an example.

[0065] In Figure 2(B), the display unit 21 shows date and time information 55, notification information 56, and multiple icons 57. This shows an example of what is displayed. Notification information 56 includes, for example, a message received from the left. Images notifying that the data communication signal has been received, images notifying the reception status of the data communication signal, and images notifying the reception status of the telephone communication signal. An image is shown to notify the communication status. Note that this is not the only example; various types of information can be displayed. It can be displayed on the display unit 21.

[0066] Figure 2(C) is a schematic diagram of the electronic device 10 as viewed from the display unit 22 side.

[0067] In Figure 2(C), the display unit 22 shows information indicating that a message has been received and the sender. This shows an example where information regarding the radio wave reception status is displayed. The display unit 22 can display a variety of information, not just the examples shown.

[0068] When displaying mainly still images as the images shown in display unit 21 and display unit 22 This applies to a display device having memory-enabled display elements in the display unit 21 and the display unit 22. This is preferable because it reduces power consumption.

[0069] Here, the display element with memory properties retains the display of a still image without rewriting it. This is a display element that has the function of [doing something]. A display element with memory functionality has the state when the power supply is stopped. The display element includes a display element that maintains the display of a still image, or a display element with memory capabilities. This includes a display element that maintains the display of a still image when a constant voltage is supplied. A display element with refresh properties maintains the display of a still image without performing a refresh operation. This also includes indicator elements.

[0070] A display element with memory capabilities can retain the display without refreshing or rewriting. The longer the period, the better. For example, 1 second or more, preferably 1 minute or more, more preferably It is preferable that it can be maintained for a period of one hour or more, more preferably one day or more, and not more than one year. Here, the state in which the display is maintained is, for example, the dynamic range of brightness. The change in brightness is 5% or less, preferably 3% or less, and more preferably 1% or less. This can be done. Note that in the case of a reflective display element, the above brightness is replaced with reflectance. That's all you need to do.

[0071] As a display element with memory properties, various bistable display technologies are applied to the display. Elements can be used. Typical examples of such display elements include electronic paper. Examples include the microcapsule method and electrophoresis (E PD: Electrophoretic Display) method, electronic powder fluid (registered trademark) Examples include particle-moving elements such as the ) method. Also, nematic liquid crystals and cholesteric Display elements using bistable liquid crystals, such as liquid crystals and ferroelectric liquid crystal elements, can also be used.

[0072] In addition, electrowetting (EW:El) is used as a display element with memory properties. ectrowetting) element, electrofluidic (EF: Electrof luidic element, electrochromic (EC) element child, MEMS (Micro Electro Mechanical Systems) Elements such as optical interference can be used. Examples of MEMS elements include optical interference-based MEMS elements and Examples include MEMS elements that use a shutter mechanism.

[0073] On the other hand, the display unit 21 and the display unit 22 use various types of display elements depending on the application of the electronic device 10. The child can be applied.

[0074] Furthermore, if smooth video display is required on display units 21 and 22, for example Organic Light Emitting Diode (OLED) (Also called) element, LED (Light Emitting Diode) element, QLED ( Spontaneous generation of elements such as Quantum-dot Light Emitting Diodes Light-emitting elements can be used as display elements. Alternatively, transmissive, reflective, or semi-transmissive elements can be used. A transmissive liquid crystal element may also be used.

[0075] In particular, the display unit 21 and the display unit 22 have a display element that utilizes reflected light and a light-emitting element. It is preferable to apply a display panel. A more specific example is between a pair of substrates, Reflective liquid crystal element and transistor that drives it, and organic EL element and transistor that drives it It is preferable to apply a display panel having moving transistors. By using this method, the display is made using a reflective liquid crystal element when the ambient light is bright, making it easier to see. It offers excellent performance and can be driven with low power consumption. Also, when the ambient light is dark, the OLED By using elements for display, vivid displays can be achieved. Furthermore, reflective liquid crystal elements By using both OLED and OLED elements for display, both low power consumption and display clarity can be achieved. The desired display can be achieved.

[0076] Furthermore, depending on the situation, it is possible to configure the display unit 21 or display unit 22 to not display anything. It is preferable to have this configuration. Specifically, the pixels of the display unit 21 or the display unit 22 are driven It is preferable that the display unit 21 and display unit 22 be transparent When using a display device that has a backlight, such as a liquid crystal display device, the backlight It is preferable to have a configuration that prevents the motor from being driven. Display unit 21 or display unit 22 By temporarily hiding (disabling) it, power consumption can be reduced to an extremely low level.

[0077] However, the above is not limited to the display units 21 and 22, and various displays can be shown on them. For example, incoming emails, phone calls, and social networking service (SNS) notifications. Notification, subject line of email or social media post, sender name of email or social media post, message Date and time, time of day, information about currently playing audio or music, volume, temperature, battery level, communication status, antenna It can display various information, such as signal strength and the download status of files. Furthermore, the display unit 21 and the display unit 22 are equipped with icons associated with various applications. This displays icons, control buttons, or sliders associated with various functions. It is permissible to do so. For example, a function to adjust the volume or fast forward when playing audio or music. There are icons associated with functions such as rewinding. Or, when a phone call comes in... Functions for responding or holding calls, and a state in which the operation of the electronic device 10 is disabled (also known as the locked state). You may also display an icon or other symbol associated with the function to disable (the function).

[0078] Furthermore, the pixels of the display unit 21 and the display unit 22, as well as the drive circuit, etc., have an oxidation in the channel formation region. It is preferable to use transistors that utilize solid semiconductors and achieve extremely low off-current. Transistors using oxide semiconductors with a larger band gap than silicon are... The low off-current allows the charge accumulated in the capacitive element connected in series with the transistor to be stored for a long period of time. It is possible to hold it over a period of time. For example, if such a transistor is applied to a pixel... Therefore, even when a display element with memory capabilities is not applied, the gradation of the displayed image is maintained. It is also possible to stop the drive circuit while maintaining power. As a result, power consumption is drastically reduced. This enables the creation of electronic devices.

[0079] [Configuration Example 2] Figures 3(A) and 3(B) show perspective views of the electronic device 10a exemplified below. Figure 3(A), The electronic device 10a shown in (B) differs from Figures 1(A), (B), etc., in that the shape of the display unit 22 is different. This differs from the configuration shown.

[0080] The display unit 22 is provided on the lower side of the housing 11 and extends to the left side. The display unit 22 is curved and provided along the corners of the side surface of the housing 11. The image can be displayed seamlessly from the bottom side to the left side.

[0081] For example, if we assume that the electronic device 10a is to be worn on the left arm, then on the lower side of the housing 11 In addition, the left side of the casing 11 also enters the user's field of vision without them intentionally looking at it. This is an easy part to access. This allows the user to access the front of the electronic device 10a (for example, the display unit 21). Without having to make any movements such as turning your wrist to look, simply by directing your gaze towards the electronic device 10a The display unit 22 can be viewed.

[0082] This configuration allows for a larger display area in the display unit 22, thus enabling a larger display area. It becomes possible to clearly display a lot of information to the user. Therefore, more convenient electronic devices can be developed. It can be achieved.

[0083] Furthermore, if the electronic device 10a is to be worn on the right arm, see Figures 3(A) and (B). The configuration shown can be reversed left to right. That is, when viewed from the front, the housing 1 A display unit 22 is provided extending from the lower side to the right side of 1, and a crown 25 is located on the left side of the housing 11. The configuration should include buttons 26 and the like.

[0084] [Configuration Example 3] Figures 4(A) and 4(B) show perspective views of the electronic device 10b exemplified below. Figure 4(A), The electronic device 10b shown in (B) differs from those in Figures 3(A), (B), etc., in that the shape of the housing 11 is different. The configuration shown is different.

[0085] The housing 11 has a circular shape when viewed from the front. Similarly, the display unit 21 is also circular. It has a specific shape.

[0086] The housing 11 has a cylindrical shape on its side. The display unit 22 is curved along its side. It has a curved shape. The display unit 22 is uniformly curved from the lower side to the left side of the housing 11. It is installed in this state. The display unit 22 extends from the lower side of the housing 11 to the left side, The image can be displayed without being cut off.

[0087] For example, if we assume that the electronic device 10b is to be worn on the left arm, then the lower side of the housing 11 or The area extending to the left side is a part that easily comes into the user's field of vision without them having to intentionally look at it. This allows the user to see the front of the electronic device 10b (for example, the display unit 21) Without making any movements such as turning your wrist, simply by directing your gaze towards the electronic device 10b, the display unit 22 You can see it.

[0088] This configuration allows for a larger display area in the display unit 22, thus enabling a larger display area. It becomes possible to clearly display a lot of information to the user. Therefore, more convenient electronic devices can be developed. It can be achieved.

[0089] Furthermore, if we assume that the electronic device 10b is to be worn on the right arm, see Figures 4(A) and (B). The configuration shown can be reversed left to right. That is, when viewed from the front, the housing 1 A display unit 22 is provided extending from the lower side to the right side of 1, and a crown 25 is located on the left side of the housing 11. The configuration should include buttons 26 and the like.

[0090] [Configuration Example 4] Figure 5(A) shows a perspective view of the electronic device 10c illustrated below. Device 10c has a seamless connection between the display unit 21 and the display unit 22, as shown in Figure 1(A). This configuration differs from that shown in (B), etc.

[0091] Display units 21 and 22 are provided on the front and lower sides of the housing 11. The display unit 21 and the display unit 22 are continuous and uninterrupted from the front to the lower side of the housing 11. It can display images.

[0092] It is preferable that the display unit 21 and the display unit 22 are implemented by a single display device. For example, a display device that is partially or entirely flexible can be applied.

[0093] For convenience, the boundary between display unit 21 and display unit 22 is shown with a dotted line in Figure 5(A). For example, If the front side of the housing is flat, then among the display units of the electronic device 10c, the one located on the front side The flat portion is defined as the display section 21, and the other portion, including the curved portion, is defined as the display section 22. It is possible to do so. Alternatively, the part visible from the front is the display unit 21, and the part not visible from the front is the display unit 21. This can also be defined as the display unit 22.

[0094] [Variation] Figure 5(B) shows the display unit 22a located on the lower side of the housing 11 and the left side of the housing 11. This shows an example having a display unit 22b, and a display unit 21, and a display unit 22a. Display unit 22b is seamlessly connected. Display unit 21, display unit 22a, and display unit 2 A continuous image can be displayed between 1 and the display unit 22b without interruption.

[0095] [Regarding the arrangement of the display unit 22] Next, we will explain how the display unit 22 is arranged.

[0096] Figure 6(A1) is a schematic diagram of the electronic device 10 shown in Figure 1(A), etc., as viewed from the front. This is shown. Also, Figure 6(A2) shows the oblique view of the electronic device 10 from the left side and the bottom side. A visual diagram is shown.

[0097] In Figure 6(A1), the area where the display unit 22 is provided is indicated by a dashed line. Part 22 is part of the side of the housing, but for clarity, the thickness is clearly indicated on the display part 22. Yes, they are.

[0098] Figures 6(A1) and (A2) show a hypothetical straight line 15 that penetrates the side of the housing 11. Furthermore, the straight line 15 is a straight line parallel to the surface of the display unit 21. If the surface is curved, the straight line 15 is a straight line perpendicular to the perpendicular line passing through the centroid of the display unit 21. .

[0099] Furthermore, the straight line 15 connects to a band attachment portion 31 located at a position symmetrical to a line or plane, and the band It is a straight line perpendicular to the line of symmetry or plane of symmetry of the mounting portion 32. That is, the band mounting portion 3 The parts 1 and the band attachment part 32 are provided along the straight line 15, respectively.

[0100] Furthermore, band 41, band 42, and housing 11 are integrally molded, resulting in clear band attachment. If part 31 and band attachment part 32 are not present, then the band attachment part 31 and band attachment part 32 are not present. The attachment portion 32 can be considered as being replaced by band 41 or band 42. The straight line 15 is the line of symmetry between bands 41 and 42, which are positioned in a line-symmetric or plane-symmetric position. Alternatively, it is a straight line perpendicular to the plane of symmetry, and bands 41 and 42 are along the straight line 15. Each will be provided.

[0101] Since the straight line 15 penetrates the side of the casing 11, there is a gap between the straight line 15 and the side of the casing 11. There are two intersection points. Of the two intersection points, the upper one (the side with the band attachment part 31) is designated as intersection 1. 5a. The intersection on the lower side (band attachment part 32 side) is defined as intersection 15b.

[0102] The display unit 22 is preferably positioned at least in a location that coincides with the intersection 15b. point b is a point that easily comes into the user's field of vision without the user intentionally looking at it, therefore here By providing the display unit 22, the user can look at the front of the electronic device 10 (for example, the display unit 21). Without having to make any movements such as turning your wrist, simply by directing your gaze towards the electronic device 10, the display unit 2 You can watch 2.

[0103] Figure 6(B) shows the electronic device 10a illustrated in Figures 3(A) and (B).

[0104] Figure 6(B) shows line 16 intersecting line 15. Line 16 intersects line 15 with line 15. Similarly, a straight line that penetrates the side of the housing 11, and the two intersection points of the straight line 16 and the housing 11 Let 16a be the intersection point and 16b be the intersection point. Here, line 16 is the midpoint of intersection points 15a and 15b, and This is a straight line that intersects with line 15.

[0105] Furthermore, of the two intersection points, the intersection point that coincides with the display unit 22 is designated as 16a. If both overlap with the display unit 22, the intersection that is further away than intersection 15b is considered intersection 16a. Let the closer intersection be intersection 16b.

[0106] In Figures 6(B) to (E), the display unit 22 overlaps with the intersection 16a, and the intersection 16a is displayed. This shows the case where it is located at the end of part 22.

[0107] Here, let θ be the angle between line 15 and line 16. The angle θ is the angle between line 15 and line 16 at intersection point 15b. This is the angle formed by the intersection of line 16 and intersection 16a.

[0108] The angle θ between line 15 and line 16 is, for example, 30 degrees or more and 300 degrees or less, preferably 45 degrees or less. The angle should be 270 degrees or less, more preferably 90 degrees or more and 270 degrees or less. The larger the angle θ, The display area of ​​the display unit 22 can be increased.

[0109] For example, Figure 6(C) shows the case where the angle θ exceeds 180 degrees. In this case, the display The section 22 is positioned from the lower side of the housing 11, through the left side, and extending to a portion of the upper side.

[0110] Figure 6(D) shows the electronic device 10b illustrated in Figures 4(A) and (B).

[0111] In Figure 6(D), the display unit 22 is curved and positioned along the cylindrical side surface of the housing 11. Figure 6(D) shows an example where θ is less than 180 degrees. In this case, the display unit 2 2 is positioned across the lower side and a portion of the left side of the casing 11.

[0112] Furthermore, Figure 6(E) shows an example where the angle θ exceeds 180 degrees. In this case, The display unit 22 is positioned on the lower side of the housing 11, extending through the left side and onto a portion of the upper side.

[0113] The above is an explanation of the arrangement method for the display unit 22.

[0114] [Example of internal configuration of electronic equipment] The following describes an example of the internal configuration of an electronic device according to one aspect of the present invention.

[0115] Figure 7(A) shows a schematic cross-sectional view of the electronic device 10. Figure 7(A) is shown in Figure 2(B). This corresponds to the cross-section when cut along the cutting line A1-A2.

[0116] The electronic device 10 includes a display device 61, a display device 62, a battery 71, and a pre-loaded battery inside the housing 11. It includes a circuit board 72, a vibration module 74, and an antenna 75, etc.

[0117] Multiple ICs 73 are mounted on the printed circuit board 72. Display device 61 and printed circuit board The board 72 is electrically connected by the FPC 63a. The display device 62 and the printed circuit board The board 72 is electrically connected by the FPC 63b.

[0118] The electronic device 10 has a translucent member 6 on the front side of the housing 11, in the area that overlaps with the display device 61. It has 4a. The user can see the image displayed in the display area of ​​the display device 61 through the light-transmitting member 64. It can be seen through a. The area of ​​the housing 11 where the light-transmitting member 64a is provided is displayed. This corresponds to section 21.

[0119] Furthermore, the electronic device 10 has a translucent material on the side of the housing 11 in the area that overlaps with the display device 62. It has 64b. The user can view the image displayed on the display device 62 through the light-transmitting member 64b. It can be seen. The area of ​​the housing 11 where the light-transmitting member 64b is provided is the display unit 22. It corresponds to.

[0120] The translucent members 64a and 64b can be, for example, glass, crystal glass, Plastics and the like can be used.

[0121] Figure 7(B) shows an example of the cross-sectional configuration of the electronic device 10c illustrated in Figure 5(A).

[0122] The electronic device 10c has a display device 61. The display device 61 is located on the front and side of the housing 11. A portion of it is curved over a certain distance. The display device 61 and the printed circuit board 72 are connected by an FPC. It is electrically connected via 63.

[0123] Furthermore, the housing 11 has a translucent member 64. The translucent member 64 is on the front of the housing 11. It is provided along the side and is partially curved.

[0124] The above is an explanation of an example of the internal configuration of an electronic device.

[0125] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0126] (Embodiment 2) [Examples of electronic device hardware configurations] The following describes an example of the hardware configuration of electronic device 10.

[0127] Figure 8 is a block diagram showing an example configuration of the electronic device 10.

[0128] In the drawings attached to this specification, the components are classified by function and shown as independent of each other. Although a block diagram is shown as a lock, the actual components are completely separated by function. This is difficult because one component may be involved in multiple functions, or one function may be involved in multiple components. It could also be related to the fundamentals.

[0129] Furthermore, the configuration of the electronic device 10 illustrated in Figure 8 is just one example, and it is not necessary to include all components. No. The electronic device 10 only needs to have the necessary components from among the components shown in Figure 8. Furthermore, it may have components other than those shown in Figure 8.

[0130] The electronic device 10 has a housing 11.

[0131] The enclosure 11 includes a processing unit (CPU) 661, a touch panel 651, a touch panel 652, and Memory device 664, display controller 671, touch sensor controller 672, Battery controller 673, power receiving unit 674, battery module 675, sound controller Controller 676, audio input unit 677, audio output unit 678, communication module 681, Tenor 682, attitude detection unit 683, external interface 685, camera module 686 It includes a vibration module 687, a sensor module 688, and the like.

[0132] Storage device 664, display controller 671, touch sensor controller 672 , battery controller 673, sound controller 676, communication module 681 , attitude detection unit 683, external interface 685, camera module 686, vibration module Route 687, sensor module 688, etc., are connected to the arithmetic unit via bus line 662. It is connected to 661.

[0133] The touch panel 651 corresponds to the display device that constitutes the display unit 21. 652 corresponds to the display device that constitutes the display unit 22.

[0134] The arithmetic unit 661 is, for example, a central processing unit (CPU). It can function as a g Unit. The arithmetic unit 661 can, for example, store memory 664 , display controller 671, touch sensor controller 672, battery controller Troller 673, sound controller 676, communication module 681, attitude detection unit 68 3. External interface 685, camera module 686, vibration module 687, It has the function of controlling each component, such as the sensor module 688.

[0135] Signals are transmitted between the arithmetic unit 661 and each component via the bus line 662. The arithmetic unit 661 receives input from each component connected via the bus line 662. It has functions for processing incoming signals and functions for generating signals to output to each component. It is possible to comprehensively control each component connected to the bus line 662.

[0136] In addition, a transistor using an oxide semiconductor in the channel formation region and realizing an extremely low off-current can also be used for the arithmetic unit 661 and ICs and the like of other components. Since the off-current of the transistor is extremely low, it can be used as a switch for holding the charge (data) flowing into the capacitive element that functions as a memory element, thereby ensuring a long data holding period. By using this characteristic for the registers and cache memories of the arithmetic unit 661, the arithmetic unit 661 is operated only when necessary, and in other cases, the information of the previous process is saved in the memory element, so that normal off computing becomes possible, and the power consumption of the electronic device 10 can be reduced.

[0137] The arithmetic unit 661 interprets and executes instructions from various programs by a processor, and performs various data processing and program controls. Programs that can be executed by the processor may be stored in the memory area of the processor or may be stored in the storage device 664.

[0138] As the arithmetic unit 661, in addition to the CPU, other microprocessors such as DSP (Digital Signal Processor) and GPU (Graphics Processing Unit) can be used alone or in combination. These microprocessors can also be used in FPGA (Field Programmable Gate Array) and FPAA (Field Programmable Analog Array). ​ PLDs (Programmable Logic Devices) such as ay This configuration can also be considered as the result of that process.

[0139] The arithmetic unit 661 may have main memory. The main memory is RAM (Randomized Memory). Volatile memory such as ROM (Read-On Memory) and ROM (Read-On Memory) It can be configured to include non-volatile memory such as (ly Memory).

[0140] Examples of RAM provided in main memory include DRAM (Dynamic Random-Accessed RAM). (DOM Access Memory) is used, and a virtual workspace is used for the arithmetic unit 661. Memory space is allocated and used accordingly. The operation stored in the memory device 664 Program systems, application programs, program modules, program data, etc. These are loaded into RAM for execution. The RAM, or program module, is directly accessed and manipulated by the arithmetic unit 661.

[0141] On the other hand, ROM does not require rewriting of the BIOS (Basic Input / Output). It can store the system (put System) and firmware, etc. As ROM, Mask ROM and OTPROM (One Time Programmable ROM) d Only Memory), EPROM (Erasable Programmable EPROM can be used (e.g., Read Only Memory). This is a UV-EPROM (Ultra-V) that allows for the erasure of stored data by ultraviolet irradiation. iolet Erasable Programmable Read Only Me mory), EEPROM (Electrically Erasable Program Examples include ammable read-only memory (AMMable Memory) and flash memory. It can be done.

[0142] Examples of storage devices 664 include flash memory and MRAM (Magnetore). sistive Random Access Memory), PRAM (Phase change RAM), ReRAM (Resistive RAM), FeRAM ( Memory devices using non-volatile memory elements such as Ferroelectric RAM. , or DRAM (Dynamic RAM) or SRAM (Static RAM), etc. A storage device or the like using a volatile memory element may also be used. For example, a hard disk Hard Disk Drive (HDD) and Solid State Drive (S You can also use a storage media drive such as an SSD. stomach.

[0143] Additionally, an HDD or S that can be attached and detached via a connector through the external interface 685. Storage devices such as SD cards, and recording media such as flash memory, Blu-ray discs, and DVDs. The media drive can also be used as storage device 664. The storage device is not built into the electronic device 10, but is located outside the electronic device 10, and the storage device is the storage device 664. It may also be used in this way. In that case, it is connected via the external interface 685, or The configuration may also involve exchanging data wirelessly using the communication module 681.

[0144] The touch panels 651 and 652 are each connected to a display controller 671 and a touch sensor controller 672. The display controller 671 and the touch sensor controller 672 are each connected to the arithmetic unit 661 via a bus line 662.

[0145] Based on the drawing instructions input from the arithmetic unit 661 via the bus line 662, the display controller 671 controls the touch panels 651 and 652 to display a predetermined image on their display surfaces.

[0146] The touch sensor controller 672 controls the touch sensors of the touch panels 651 and 652 according to the requests from the arithmetic unit 661 via the bus line 662. Also, the signal received by the touch sensor is output to the arithmetic unit 661 via the bus line 662. The touch sensor controller 672 may have a function of calculating the touch position information from the signal received by the touch sensor, or the arithmetic unit 661 may calculate it.

[0147] The touch panels 651 and 652 can display an image based on the signal supplied from the display controller 671. Also, the touch panels 651 and 652 can detect the approach or contact of a detection object such as a finger or a stylus based on the signal supplied from the touch sensor controller 672, and output the position information to the touch sensor controller 672.

[0148] Also, the touch panels 651 and 652, and the touch sensor controller ​​​​​​​​​​672 has the function of acquiring the height distance from its detection surface to the object being detected. This is preferable. It also has a function to acquire the magnitude of the pressure the detected object exerts on the detection surface. Preferably, it also has a function to acquire the size of the surface area in contact with the detection surface of the object to be detected. It is preferable that this is the case.

[0149] Touch panels 651 and 652 are modules equipped with touch sensors. The display panel can be configured to be mounted on top of the display surface. A module equipped with a sensor has at least a part of it that is flexible and conforms to the display panel. It is preferable that the module equipped with a touch sensor and the display panel are in contact. They can be bonded together with adhesives, etc. Furthermore, polarizing plates or cushioning materials (separators) can be placed between them. This is also acceptable. The thickness of the module equipped with the touch sensor should be less than or equal to the thickness of the display panel. It is preferable.

[0150] Touch panels 651 and 652 integrate a display panel and a touch sensor. It may also be an on-cell type touch panel, or an in-cell type touch panel. It is preferable to use a touch panel of a certain type. On-cell or in-cell type touch panels are Furthermore, it can be made thinner and lighter. Because the number of parts can be reduced, costs can be reduced.

[0151] The touch sensors in touch panel 651 and touch panel 652 are equipped with a finger or the like. Various sensors can be applied to detect when an intelligent entity approaches or makes contact. For example, Capacitive, resistive, surface acoustic wave, infrared, electromagnetic induction, optical, etc. A sensor to which this method is applied can be used. In addition, an optical system using a photoelectric conversion element can be used. You may also use a pressure sensor, a pressure-sensitive sensor using a pressure-sensitive element, etc. Alternatively, you may use a different type of sensor. You may have two or more types of sensors, or two or more sensors of the same type.

[0152] For example, a capacitive touch sensor has a pair of conductive layers. Capacitance is present between the pair of conductive layers. They are coupled. When the object to be detected touches, presses against, or approaches a pair of conductive layers, etc. Detection can be performed by utilizing the fact that the capacitance between a pair of conductive layers changes. .

[0153] Capacitive capacitance methods include surface capacitance and projected capacitance. In terms of capacitance systems, there are several types, mainly based on differences in the driving method, such as self-capacity systems and mutual-capacity systems. Using a mutual capacitance method is preferable because it facilitates simultaneous multi-point detection.

[0154] In addition, instead of touch panel 651 and touch panel 652, a touch sensor is used. A display panel without any functionality may be used.

[0155] Flexible touch panel 651 and touch panel 652, display panel, touch sensor Examples of sensors include display elements, the circuits that drive them, or components of touch sensors. This can be achieved by using a flexible substrate for supporting circuits and other components. (Touch panel) By applying a flexible substrate to 651 and the touch panel 652, the electronic device 10 This is preferable because it can reduce the weight.

[0156] As a material for a flexible substrate, organic resins can typically be used. In addition, glass, metals, alloys, semiconductors, etc., that are thin enough to be flexible can be used. Alternatively, a composite material containing two or more of the following: organic resin, glass, metal, alloy, semiconductor, etc. Laminated materials can be used.

[0157] The battery controller 673 manages the charge status of the battery module 675. It is possible. Also, the battery controller 673 receives from the battery module 675. The power is supplied to each component. The power receiving unit 674 receives power supplied from the outside. It has the function of charging the battery module 675. Battery controller 67 3 controls the operation of the power receiving unit 674 according to the charge state of the battery module 675. It is possible.

[0158] The battery module 675 has, for example, one or more primary and secondary batteries. For example, lithium-ion batteries can be used in the Terry Module 675. Examples include secondary batteries and lithium-ion polymer rechargeable batteries. Also, battery modules In addition to these batteries, the 675 also features a protection circuit to prevent overcharging and over-discharging of the battery. It may be provided.

[0159] When used indoors, an AC power source may be used as the external power source. When using the electronic device 10 disconnected from an external power source, the charge / discharge capacity is large and it can be used for a long time. A battery module 675 that enables the use of electronic devices 10 over time is desirable. When charging the Terry module 675, a charger capable of supplying power to the electronic device 10 is used. You may also use a USB (Universal Serial Bus) connector. Charging can be done via a wired method using a power strip or AC adapter, or via electric field coupling or electromagnetic induction. Even in configurations where charging is performed using wireless power transfer methods such as electromagnetic resonance (electromagnetic resonant coupling) methods, good.

[0160] The battery controller 673, for example, controls the battery management unit (BMU). It may have. The BMU collects cell voltage and cell temperature data, and detects overcharging and over-discharging. Monitoring, cell balancer control, battery degradation status management, battery level (State of Ch It performs calculations of arge (SOC), fault detection control, etc.

[0161] The battery controller 673 receives power from the battery module 675 via the power supply line. Control is performed to supply power to each component via (not shown). Battery The controller 673 includes, for example, a multi-channel power converter or inverter, protection circuits, etc. It can be configured to have the following features.

[0162] The battery module 675 is stacked with either the touch panel 651 or the touch panel 652. It is preferable to have a configuration in which the components are arranged in this way. In this case, the battery module 675 is incorporated. If the housing 11 is flexible and can be bent for use, Preferably, at least a portion of the battery module 675 is also flexible. Examples of secondary batteries applicable to the 675 battery module include lithium-ion secondary batteries. Examples include lithium-ion polymer secondary batteries. Furthermore, these batteries have flexibility. To prevent this, it is advisable to use a laminated bag for the battery's outer casing.

[0163] The film used for laminated bags is a metal film (aluminum, stainless steel, nickel). Plastic films made from organic materials (such as steel), organic materials (such as organic resins and fibers) Hybrid material films containing inorganic materials (such as ceramics), carbon-containing inorganic films A single-layer film selected from (carbon film, graphite film, etc.) or this A laminated film consisting of multiple layers is used. Metal films are easy to emboss, and When embossing is performed to create recesses or protrusions, the surface area of ​​the film exposed to the outside air increases. Therefore, it has excellent heat dissipation properties.

[0164] In particular, as a laminated bag, a metal film with recessed and raised areas formed by embossing. When using a laminate bag having the following properties, the stress applied to the laminate bag can cause problems. This can alleviate the problem. As a result, when the secondary battery is bent, the laminate bag will not tear. This is preferable because it effectively reduces problems such as storage issues.

[0165] Furthermore, it is preferable that the battery controller 673 has a low power consumption function. For example, as a low power consumption function, it detects when there is no input to the electronic device 10 for a certain period of time, The clock frequency of the arithmetic unit 661 is reduced or the clock input is stopped, arithmetic unit 6 To stop the operation of 61 itself, to stop the operation of the auxiliary memory, and each component Examples include reducing electricity consumption by decreasing the amount of electricity supplied to the power plant. The function is implemented either by the battery controller 673 alone, or in conjunction with the calculation unit 661. It can be done.

[0166] The audio input section 677 has, for example, a microphone or an audio input connector. The power unit 678 includes, for example, a speaker and an audio output connector. The audio input unit 677 and audio Each output unit 678 is connected to the sound controller 676 via the bus line 662. It is then connected to the arithmetic unit 661. Audio data input to the audio input unit 677 is processed by the sound code The signal is converted to a digital signal in the controller 676 and then processed by the sound controller 676 and the arithmetic processor. Processing is performed in unit 661. Meanwhile, the sound controller 676 receives from the calculation unit 661. In response to the command, the user generates an audible analog audio signal and outputs it to the audio output unit 678. The audio output connector of the audio output unit 678 has earphones, headphones, and headphones. Audio output devices such as Dorset can be connected, and the sound generated by the sound controller 676 is connected to these devices. The resulting audio is output.

[0167] The communication module 681 can communicate via the antenna 682. For example, In order to connect the electronic device 10 to the computer network in response to an instruction from the calculation unit 661 It controls the control signal and transmits the signal to the computer network. The Internet and intranet are the foundation of the World Wide Web (WWW). Extranet, PAN (Personal Area Network), LAN (Local Area Network), CAN (Campus Area Network) work), MAN (Metropolitan Area Network), WAN (Wide Area Network), GAN (Global Area Network) It is possible to connect electronic devices 10 to computer networks such as (org) and communicate with them. It can. Also, if multiple methods are used as the communication method, antenna 682 will communicate You may have multiple methods depending on the approach.

[0168] The communication module 681 is equipped with, for example, a high-frequency circuit (RF circuit) for transmitting and receiving RF signals. This is what you should do. High-frequency circuits use electromagnetic signals and electrical signals in the frequency band defined by the laws of each country. To convert between numbers and signals and use the electromagnetic signals to communicate wirelessly with other communication devices. This is the circuit. A practical frequency range of several tens of kHz to several tens of GHz is generally used. The high-frequency circuit connected to antenna 682 is equipped with a high-frequency circuit that supports multiple frequency bands. It has a wave circuit section, and the high-frequency circuit section includes an amplifier, mixer, filter, DSP, and RF It can be configured to include transceivers, etc. When performing wireless communication, the communication protocol Alternatively, communication technologies include LTE (Long Term Evolution) and GSM (G Local System for Mobile Communication: Registration (Trademark), EDGE (Enhanced Data Rates for GSM Evo) lution), CDMA2000 (Code Division Multiple Access 2000), W-CDMA (Wideband Code Divisi) Communication standards such as on Multiple Access (registered trademark), or Wi-Fi IEEE (Registered Trademark), Bluetooth (Registered Trademark), ZigBee (Registered Trademark), etc. The specifications standardized by E can be used for communication.

[0169] Furthermore, the communication module 681 has the function of connecting the electronic device 10 to a telephone line. This is also acceptable. When making a call via a telephone line, the communication module 681 is controlled by the arithmetic unit 661. In response to an instruction from, the system controls the connection signal for connecting the electronic device 10 to the telephone line, The signal is transmitted over the telephone line.

[0170] The communication module 681 receives broadcast radio waves from the antenna 682 and then transmits the touch panel It has a tuner that generates video signals to be output to 651 and the touch panel 652. That's also good. For example, a tuner has a demodulation circuit and an AD conversion circuit (analog-to-digital conversion circuit). The configuration can include a circuit and a decoder circuit, etc. The demodulation circuit is antenna 682 or It has the function of demodulating the input signal. The AD conversion circuit also has the function of demodulating the analog signal. It has the function of converting numbers into digital signals. The decoder circuit is also included in the digital signal It decodes the video data and generates a signal to send to the display controller 671. It has a function.

[0171] The decoder may also be configured to have a splitter circuit and multiple processors. It has the function of spatially and temporally dividing the input video data and outputting it to each processor. Multiple processors decode the input video data and control the display. Generates a signal to send to the 671. In this way, multiple processors act as decoders. By applying a configuration that processes data in parallel, extremely large amounts of video data can be processed in parallel. It can be coded, especially for displaying video with a resolution exceeding Full HD. In some cases, the decoder circuit that decodes the compressed data has extremely high processing power. It is preferable to have a processor. Also, for example, the decoder circuit preferably has 4 or more A configuration including multiple processors capable of parallel processing of 8 or more, more preferably 16 or more. It is preferable to do so. The decoder also includes the video signal in the input signal and It may also have a circuit to separate other signals (such as text information, program information, authentication information, etc.).

[0172] The broadcast signals that can be received by antenna 682 include those transmitted from terrestrial or satellite sources. Examples include radio waves. In addition, analog radio waves can be received by antenna 682. There are various types of broadcasting, including digital broadcasting and video and audio, or audio only. For example, the UHF band (approximately 300MHz to 3GHz) or the VHF band (30MHz to 300MHz) It is possible to receive broadcast radio waves transmitted in a specific frequency band within the Hz range. For example, by using multiple data received across multiple frequency bands, the transfer rate can be increased. This allows you to obtain more information than Full HD. The ability to display images with a certain resolution on touch panels 651 and 652 Yes, it is possible. For example, video with resolutions of 4K2K, 8K4K, 16K8K, or higher. It is possible to display an image.

[0173] Furthermore, the tuner transmits data via computer network data transmission technology. Using the broadcast data, a structure is created to generate a signal to be transmitted to the display controller 671. It may be considered complete. In this case, if the received signal is a digital signal, the tuner demodulates It does not need to have a circuit or an AD conversion circuit.

[0174] The attitude detection unit 683 has the function of detecting the tilt and attitude of the electronic device 10. For example, the attitude The momentum detection unit 683 includes an acceleration sensor, an angular velocity sensor, a vibration sensor, a pressure sensor, and a jack. Color sensors and the like can be used. Furthermore, multiple sensors can be used in combination. good.

[0175] The external interface 685 can be, for example, one or more buttons provided on the housing 11. External ports that can connect to switches (also called chassis switches) and other input components. Examples include the . The external interface 685 is connected via bus line 662 for calculations. It is connected to part 661. The housing switch is associated with the power on / off function. It has buttons for adjusting volume, taking photos, and more.

[0176] Furthermore, the external ports on the external interface 685 include, for example, a computer and It can be configured to connect to external devices such as printers via cables. It has USB ports, among others. It also has an external port, LAN (Local Area Network). Network connection terminal, digital broadcast reception terminal, AC adapter connection terminal They may have children. In addition, they may use not only wired but also infrared, visible light, ultraviolet light, etc. A configuration that includes a transceiver for optical communication may also be used.

[0177] The camera module 686 is connected to the arithmetic unit 661 via the bus line 662. For example, when a switch on the casing is pressed, or when the touch panel 651 and the touch panel In conjunction with touch operation on the 652, it is possible to take still images or videos. The Lamodule 686 may have a light source for photography, such as a xenon lamp. Lamps, light-emitting elements such as LEDs and organic ELs can be used. Alternatively, photographic light can be used. Touch panels 651 and 652 may be used as sources, in which case... In addition to white light, various other colors of light may be used for photography.

[0178] The vibration module 687 includes a vibration element that vibrates the electronic device 10 and a control for the vibration element. It has a vibration controller and a vibration element such as a vibration motor (eccentric motor) and a resonant element. Clutchers, magnetostrictive elements, piezoelectric elements, etc., can convert electrical signals or magnetic signals into vibrations. A scalable element can be used.

[0179] The vibration module 687, in response to instructions from the calculation unit 661, determines the vibration frequency of the vibration element. By controlling the amplitude, duration of vibration, etc., the electronic device 10 can be vibrated in various vibration patterns. It can be made to vibrate in conjunction with the operation of switches on the casing, etc., electronic devices. Vibration linked to the activation of device 10, and linked to the video and audio played by the video playback application. Movement vibration, vibration linked to incoming email, touch panel 651 and touch panel 6 Vibrations and other actions performed in various applications are linked to input operations to 52. The vibration module 687 can generate vibrations of various vibration patterns based on the above.

[0180] The sensor module 688 comprises a sensor unit and a sensor controller. The sensor controller supplies power to the sensor unit from the battery module 675, etc. The sensor controller also receives input from the sensor unit and converts it into a control signal. Output is sent to the calculation unit 661 via line 662. In the sensor controller, the sensor You may perform error management for the unit, or you may perform calibration processing for the sensor unit. Oh, the sensor controller has a configuration that includes multiple controllers that control the sensor unit. You may do so.

[0181] The sensor module 688 can measure, for example, force, displacement, position, velocity, acceleration, angular velocity, rotational speed, Distance, light, liquid, magnetism, temperature, chemicals, sound, time, hardness, electric field, electric current, voltage, power, radiation Various sensors capable of measuring radiation, flow rate, humidity, gradient, vibration, odor, or infrared radiation. A configuration including this feature may also be used.

[0182] The above is a description of an example of the hardware configuration of electronic device 10.

[0183] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0184] (Embodiment 3) The following are examples of display panels that can be used in the display section of an electronic device according to one embodiment of the present invention. This will be explained. The display panel shown as an example below uses both reflective liquid crystal elements and light-emitting elements. This is a display panel that has the ability to display in both transmissive and reflective modes.

[0185] Figure 9 shows a block diagram of the display device 500. The display device 500 has a display unit 501. ru.

[0186] The display unit 501 has a plurality of pixel units 530 arranged in a matrix. Unit 530 has a first pixel 531p and a second pixel 532p.

[0187] In Figure 9, the first pixel 531p and the second pixel 532p are red (R) and green, respectively. This shows an example of a display element that corresponds to three colors: (G), blue (B).

[0188] Each of the display elements in the first pixel 531p is a display element that utilizes the reflection of ambient light. Yes. The first pixel 531p corresponds to the first display element 531R, which is red (R), and the green (G A first display element 531G corresponding to ) and a first display element 531B corresponding to blue (B) To possess.

[0189] Each of the display elements in the second pixel 532p is a light-emitting element. 2p is the second display element 532R corresponding to red (R), and the second display element corresponding to green (G). It has a display element 532G and a second display element 532B corresponding to blue (B).

[0190] Figures 10(A) to (C) are schematic diagrams showing examples of the configuration of the pixel unit 530.

[0191] The first pixel 531p is the first display element 531R, the first display element 531G, and the first display It has a display element 531B. The first display element 531R reflects ambient light and displays red light Rr. It is ejected towards the display surface. The first display element 531G and the first display element 531B are similarly ejected. Green light Gr or blue light Br is emitted towards the display surface.

[0192] The second pixel 532p is the second display element 532R, the second display element 532G, and the second display It has a display element 532B. The second display element 532R emits red light Rt toward the display surface. Similarly, the second display element 532G and the second display element 532B each emit green light Gt Alternatively, blue light Bt is emitted towards the display surface.

[0193] Figure 10(A) shows the result of driving both the first pixel 531p and the second pixel 532p. It corresponds to the display mode (third mode). The pixel unit 530 is a reflected light (light Rr Using light (light Gr, light Br) and transmitted light (light Rt, light Gt, light Bt), light 53 of a predetermined color is produced. 5tr can be ejected towards the display surface.

[0194] Figure 10(B) shows how to use reflected light to display by driving only the first pixel 531p. This corresponds to the mode in which the display is performed (first mode). The pixel unit 530, for example, when there is sufficient ambient light In cases where the light is strong, the second pixel 532p is not driven, and the light from the first pixel 531p is used. Using only (light Rr, light Gr, and light Br), light 535r is emitted towards the display surface. Yes, it is possible. This allows for extremely low power consumption during operation.

[0195] Figure 10(C) shows how to drive only the second pixel 532p to produce light (transmitted light). It supports a mode (second mode) that uses to display. The pixel unit 530 is, for example, external In cases of extremely weak light, the first pixel 531p is not driven, and the second pixel 532p is driven instead. Using only the light from the source (light Rt, light Gt, and light Bt), light 535t is emitted towards the display surface. This allows for a vivid display. It also allows for brighter illumination in dark environments. By lowering the brightness, the glare perceived by the user can be reduced, and power consumption can also be decreased.

[0196] The color and number of display elements in the first pixel 531p and the second pixel 532p are limited. It is not determined.

[0197] Figures 11(A)-(C) and 12(A)-(C) show the configuration of the pixel unit 530, respectively. An example is shown. Note that in this example, both the first pixel 531p and the second pixel 532p are driven. The diagram shows a schematic representation of the display mode (third mode), but the same applies as above. In addition, there is a mode that drives only the first pixel 531p or the second pixel 532p (first mode Display can also be performed in the first and second modes.

[0198] The second pixel 532p shown in Figures 11(A), (C), and 12(B) is the second display element 5 In addition to 32R, the second display element 532G, and the second display element 532B, it exhibits white (W). It has a second display element 532W.

[0199] The second pixel 532p shown in Figures 11(B) and 12(C) is the second display element 532R. In addition to the second display element 532G and the second display element 532B, a second element exhibiting yellow (Y) It has a display element 532Y.

[0200] The configuration shown in Figures 11(A)-(C) and 12(B) and (C) is a second display element 532W And compared to a configuration without the second display element 532Y, the display using the second pixel 532p Power consumption in the modes (second mode and third mode) can be reduced.

[0201] The first pixel 531p shown in Figure 11(C) is the first display element 531R, the first display element 531G, in addition to the first display element 531B, the first display element 531 exhibits white (W) It has W.

[0202] The configuration shown in Figure 11(C) has a first pixel 531p that is different from the configuration shown in Figure 10(A). The power consumption in the display modes used (the first mode and the third mode) is reduced. can.

[0203] The first pixel 531p shown in Figures 12(A) to (C) is the first display element 53 which exhibits white light. It has only 1W. At this time, the display mode using only the first pixel 531p (first mode) In this case, it is possible to display in black and white or grayscale, and the second pixel 532 In the display modes using p (the second and third modes), color display is possible. can.

[0204] This configuration allows for an increase in the aperture ratio of the first pixel 531p. This improves the reflectivity of the first pixel, 531p, enabling a brighter display.

[0205] The first mode is for displaying information that does not require color display, such as document information. It is suitable for.

[0206] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0207] (Embodiment 4) In this embodiment, a more specific example of the display device illustrated in Embodiment 2 is shown in the drawings. See the explanation below.

[0208] Figure 13(A) is a block diagram of the display device 400. The display device 400 consists of a display unit 36 2. It has circuit GD and circuit SD. The display unit 362 has multiple circuits arranged in a matrix. It has 410 pixels.

[0209] The display device 400 has multiple wirings G1, multiple wirings G2, multiple wirings ANO, and multiple wirings CSCOM has multiple wirings S1 and multiple wirings S2. Multiple wirings G1, multiple wiring Line G2, multiple wirings ANO, and multiple wirings CSCOM are in the direction indicated by arrow R. Multiple pixels 410 and circuit GD arranged in a row are electrically connected. Multiple wiring S1 and multiple The wiring S2 is connected to a plurality of pixels 410 and circuit SD arranged in the direction indicated by arrow C. To connect electrically.

[0210] For simplicity, the configuration shown here has one circuit GD and one circuit SD, but the liquid Circuits GD and SD for driving the crystal element, and circuits GD and SD for driving the light-emitting element They may be provided separately.

[0211] Pixel 410 has a reflective liquid crystal element and a light-emitting element.

[0212] Figures 13(B1) to (B4) show examples of the configuration of the electrode 311 of the pixel 410. Electrode 3 11 functions as a reflective electrode of the liquid crystal element. Electrode 311 in Figures 13(B1) and (B2) An opening 451 is provided.

[0213] Figures 13(B1) and (B2) show the light-emitting element 360 located in the region overlapping with electrode 311. This is shown by the dashed line. The light-emitting element 360 is positioned in overlap with the aperture 451 of the electrode 311. As a result, the light emitted by the light-emitting element 360 is emitted towards the display surface side through the aperture 451. It will be done.

[0214] In Figure 13(B1), adjacent pixels 410 in the direction indicated by arrow R correspond to different colors. It is prime. At this time, as shown in Figure 13(B1), two adjacent elements in the direction indicated by arrow R In the pixels, the apertures 451 are not arranged in a single line, so they are provided at different positions on the electrodes 311. It is preferable that this is done. This makes it possible to separate the two light-emitting elements 360, The phenomenon in which light emitted by the optical element 360 is incident on the colored layer of the adjacent pixel 410 ( It can suppress loss talk (also known as throttling). Also, two adjacent light-emitting elements 360 Because they can be placed separately, the EL layer of the light-emitting element 360 can be made using a shadow mask or the like. Even when separating the displays, it is possible to achieve a display device with high resolution.

[0215] In Figure 13(B2), adjacent pixels 410 in the direction indicated by arrow C correspond to different colors. It is prime. Similarly in Figure 13(B2), two adjacent pixels in the direction indicated by arrow C In this configuration, the openings 451 are provided at different positions on the electrodes 311 so that they are not arranged in a single line. It is preferable that they be present.

[0216] The smaller the ratio of the total area of ​​the aperture 451 to the total area of ​​the non-apertures, the more liquid crystal elements are used. The display can be made brighter. Also, the total area of ​​the opening 451 relative to the total area of ​​the non-openings The larger the ratio, the brighter the display using the light-emitting element 360 can be.

[0217] The shape of the opening 451 may be, for example, a polygon, a square, an ellipse, a circle, or a cross. It is possible to have long, narrow stripes, slits, or checkerboard patterns. The aperture 451 may be positioned close to adjacent pixels. Preferably, the aperture 451 is the same color. Position the pixels close to the other pixels being displayed. This helps suppress crosstalk.

[0218] Furthermore, as shown in Figures 13(B3) and (B4), in the portion where the electrode 311 is not provided The light-emitting region of the light-emitting element 360 may be located there. This allows the light-emitting element 360 to emit The light is emitted towards the display surface.

[0219] In Figure 13(B3), two adjacent pixels 410 in the direction indicated by the arrow R show that the light-emitting element Child 360 is not arranged in a single line. In Figure 13(B4), adjacent in the direction indicated by arrow R. In the two pixels 410, the light-emitting elements 360 are arranged in a single line.

[0220] The configuration in Figure 13(B3) shows that the light-emitting elements 360 of two adjacent pixels 410 are connected to each other. Because they can be separated, as mentioned above, crosstalk can be suppressed and high resolution can be achieved. Furthermore, in the configuration shown in Figure 13(B4), the electrode 31 is located on the side of the light-emitting element 360 parallel to arrow C. Since 1 is not present, it is possible to suppress the light from the light-emitting element 360 from being blocked by the electrode 311, resulting in high It is possible to achieve the desired viewing angle characteristics.

[0221] Circuit GD can utilize various sequential circuits such as shift registers. Transistors and capacitive elements can be used in this. The transistors in circuit GD The transistor can be formed using the same process as the transistor included in pixel 410.

[0222] Circuit SD is electrically connected to wiring S1. Circuit SD uses, for example, an integrated circuit. This is possible. Specifically, the circuit SD uses an integrated circuit formed on a silicon substrate. It is possible to be there.

[0223] For example, using the COG (Chip on glass) method or the COF method, Circuit SD can be implemented on pads electrically connected to the 410. Specifically, An anisotropic conductive film can be used to mount integrated circuits onto pads.

[0224] Figure 14 is an example of a circuit diagram for pixel 410. In Figure 14, two adjacent pixels 410 This indicates that.

[0225] Pixel 410 consists of switch SW1, capacitive element C1, liquid crystal element 340, switch SW2, and It has a transistor M, a capacitive element C2, and a light-emitting element 360, etc. Furthermore, the pixel 410 has Wiring G1, G2, ANO, CSCOM, S1, and S2 are electrically connected. They are connected. Also, in Figure 14, the wiring VCOM1 is electrically connected to the liquid crystal element 340. The diagram also shows the wiring VCOM2 that electrically connects to the light-emitting element 360.

[0226] Figure 14 shows an example where transistors are used for switches SW1 and SW2. They are doing it.

[0227] The gate of switch SW1 is connected to wiring G1. The source of switch SW1 and One of the drains is connected to wiring S1, and the other is connected to one electrode of capacitive element C1, It is connected to one electrode of the liquid crystal element 340. The other electrode of the capacitive element C1 is connected to the wiring CS. It is connected to COM. The other electrode of the liquid crystal element 340 is connected to the wiring VCOM1. ru.

[0228] The gate of switch SW2 is connected to wiring G2. The source of switch SW2 and One of the drains is connected to wiring S2, and the other is connected to one electrode of capacitive element C2, It is connected to the gate of transistor M. The other electrode of the capacitive element C2 is connected to the transistor One of the sources or drains of transistor M is connected to wiring ANO. The other end of the source or drain is connected to one electrode of the light-emitting element 360. The other electrode of sub-electrode 360 ​​is connected to wiring VCOM2.

[0229] In Figure 14, transistor M has two gates sandwiching a semiconductor, and these are connected. This shows an example where the current that transistor M can supply is increased. It is possible.

[0230] Wiring G1 is used to provide a signal that controls switch SW1 to either a conductive or non-conductive state. This is possible. A predetermined potential can be applied to the wiring VCOM1. A liquid can be applied to the wiring S1. A signal can be provided to control the orientation state of the liquid crystal in the crystal element 340. (Wiring CSC) A predetermined potential can be applied to the OM.

[0231] Wiring G2 is used to provide a signal that controls switch SW2 to either a conductive or non-conductive state. This is possible. A potential difference is generated between wiring VCOM2 and wiring ANO, causing the light-emitting element 360 to emit light. The potentials can be applied to each. Wiring S2 controls the conduction state of transistor M. It can provide signals to control the situation.

[0232] Pixel 410 shown in Figure 14, for example, when displaying in reflection mode, wiring G1 and wiring It is driven by a signal applied to line S1 and displays using optical modulation by the liquid crystal element 340. This is possible. Also, when displaying in transparent mode, the signal to wiring G2 and wiring S2 It is driven by a motor, and the light-emitting element 360 can be illuminated to display information. Also, both modes When driven by this, the signals given to each of the wires G1, G2, S1 and S2 It can be driven by a number.

[0233] In Figure 14, one pixel 410 contains one liquid crystal element 340 and one light-emitting element 360. An example with such a feature has been shown, but it is not limited to this. Figure 15(A) shows one pixel 410. The liquid crystal element 340 and four light-emitting elements 360 (light-emitting elements 360r, 360g, 360b, 3 This shows an example with 60w). Pixel 410 shown in Figure 15(A) is different from Figure 14. It is possible to display full color using a light-emitting element with a single pixel.

[0234] In Figure 15(A), in addition to the example in Figure 14, wiring G3 and wiring S3 are connected to pixel 410. It is.

[0235] In the example shown in Figure 15(A), for example, four light-emitting elements 360 are each emitting red (R) and green light. Light-emitting elements exhibiting color (G), blue (B), and white (W) can be used. As the crystal element 340, a reflective liquid crystal element that exhibits white color can be used. Furthermore, when displaying in reflective mode, a highly reflective white display can be used. When displaying in transmissive mode, high color rendering can be achieved with low power consumption.

[0236] Figure 15(B) shows an example of the configuration of pixel 410 corresponding to Figure 15(A). Pixel 410 is, A light-emitting element 360w that overlaps with the opening of electrode 311, and arranged around electrode 311 It has light-emitting elements 360r, 360g, and 360b. It is preferable that 0r, light-emitting element 360g, and light-emitting element 360b have approximately the same light-emitting area. It seems so.

[0237] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0238] (Embodiment 5) In this embodiment, the display device exemplified in Embodiments 2 and 3 is more specific. A configuration example will be explained with reference to the drawings.

[0239] [Configuration Example 1] Figure 16 is a schematic perspective view of the display device 300. The display device 300 consists of a substrate 351 and a substrate It has a structure in which 361 is bonded together. In Figure 16, the substrate 361 is clearly indicated by a dashed line. .

[0240] The display device 300 includes a display unit 362, a circuit 364, wiring 365, etc. Figure 16 shows the table. This shows an example in which IC (integrated circuit) 373 and FPC 372 are mounted on the display device 300. Therefore, the configuration shown in Figure 16 is a display model having a display device 300, an IC, and an FPC. It can also be called a joule.

[0241] For example, a scan line drive circuit can be used as circuit 364.

[0242] The wiring 365 has the function of supplying signals and power to the display unit 362 and the circuit 364. The signal and power are supplied externally via FPC372 or from IC373 via wiring 365. It will be entered into.

[0243] Figure 16 shows the COG (Chip On Glass) method or COF (Chip o This shows an example where IC373 is provided on substrate 351 using a method such as n Film. 373 can be applied to ICs that have, for example, scan line driving circuits or signal line driving circuits. Furthermore, the display device 300 and the display module may be configured without an IC. The IC may be mounted on the FPC using a COF (Cross-of-Fiber) method or similar.

[0244] Figure 16 shows a magnified view of a part of the display unit 362. The display unit 362 has multiple tables The electrodes 311b of the display element are arranged in a matrix. The electrodes 311b are visible light It has the function of reflecting light and functions as a reflective electrode for the liquid crystal element 180.

[0245] Furthermore, as shown in Figure 16, the electrode 311b has an opening 451. In addition, the display unit 362 It has a light-emitting element 170 on the substrate 351 side of electrode 311b. The light is emitted towards the substrate 361 through the aperture 451 of electrode 311b. (Light-emitting element 170) The area of ​​the light-emitting region and the area of ​​the aperture 451 may be equal. If one of the area and the area of ​​the opening 451 is larger than the other, the margin for misalignment is This is preferable because it becomes larger. In particular, the area of ​​the aperture 451 is the area of ​​the light-emitting region of the light-emitting element 170. It is preferable that it be larger than [this value]. If the aperture 451 is small, a portion of the light from the light-emitting element 170 will be lost. The electrode 311b may block the contents, preventing them from being extracted to the outside. The opening 451 may be made sufficiently large. By doing so, it is possible to suppress the wasted light emission of the light-emitting element 170.

[0246] Figure 17 shows a portion of the area including the FPC 372 of the display device 300 shown in Figure 16, and circuit 3. When a portion of the area including 64 and a portion of the area including the display unit 362 are cut off, the cross-section An example of a surface is shown.

[0247] The display device 300 shown in Figure 17 has a transistor 201 between substrate 351 and substrate 361. , transistor 203, transistor 205, transistor 206, liquid crystal element 180, It has an optical element 170, an insulating layer 220, a colored layer 131, a colored layer 134, etc. The substrate 361 and the insulating layer The edge layer 220 is bonded via the adhesive layer 141. The substrate 351 and the insulating layer 220 are bonded via the adhesive layer It is bonded via 142.

[0248] The substrate 361 has a colored layer 131, a light-shielding layer 132, an insulating layer 121, and a liquid crystal element 180. An electrode 113 that functions as a common electrode, an alignment film 133b, an insulating layer 117, etc. are provided. The outer surface of the substrate 361 has a polarizing plate 135. The insulating layer 121 is a planarizing layer. It may have the following function: The insulating layer 121 can make the surface of the electrode 113 approximately flat. Therefore, the orientation state of the liquid crystal layer 112 can be made uniform. The insulating layer 117 is the cell of the liquid crystal element 180. It functions as a spacer to maintain the gap. The insulating layer 117 transmits visible light. Alternatively, the insulating layer 117 may be placed overlapping the display area of ​​the liquid crystal element 180.

[0249] The liquid crystal element 180 is a reflective liquid crystal element. The liquid crystal element 180 consists of an electrode 311a and a liquid crystal layer. It has a laminated structure in which electrodes 112 and 113 are stacked. The electrode 311a is in contact with the substrate 351 side. Furthermore, an electrode 311b that reflects visible light is provided. The electrode 311b has an aperture 451. Electrodes 311a and 113 transmit visible light. Between the liquid crystal layer 112 and electrode 311a An alignment film 133a is provided. An alignment film 133b is provided between the liquid crystal layer 112 and the electrode 113. It is provided.

[0250] In the liquid crystal element 180, electrode 311b has the function of reflecting visible light, and electrode 113 is It has the function of transmitting visible light. Light incident from the substrate 361 side is polarized by the polarizing plate 135. Light is emitted, passes through electrode 113 and liquid crystal layer 112, and is reflected by electrode 311b. Then liquid crystal layer 1 The light passes through electrode 12 and electrode 113 again and reaches polarizing plate 135. At this time, electrode 311b and The orientation of the liquid crystal is controlled by the voltage applied between electrodes 113, thereby controlling the optical modulation of light. This allows for the control of the intensity of light emitted through the polarizing plate 135. Furthermore, light is absorbed by the colored layer 131, which absorbs light outside of a specific wavelength range. The emitted light will, for example, be red in color.

[0251] As shown in Figure 17, the aperture 451 is provided with an electrode 311a that transmits visible light. This is preferable. This allows the region overlapping with the opening 451 to be treated the same as the other regions. Because the liquid crystal layer 112 is oriented in this way, liquid crystal alignment defects occur at the boundaries of these regions, which is unintended. This can suppress the leakage of light that is not present.

[0252] In the connection portion 207, the electrode 311b is connected to the transistor 20 via the conductive layer 221b. It is electrically connected to the conductive layer 222a of 6. Transistor 206 is a liquid crystal element It has the function of controlling the drive of 180.

[0253] A connecting portion 252 is provided in a part of the area where the adhesive layer 141 is provided. In 52, a conductive layer obtained by processing the same conductive film as electrode 311a and electrode 113 A portion is electrically connected by the connector 243. Therefore, it is formed on the substrate 361 side. The electrode 113 receives a signal from the FPC 372 connected to the substrate 351 side or The electric potential can be supplied via the connection part 252.

[0254] For example, conductive particles can be used as the connector 243. In this case, a material is used in which the surface of particles such as organic resin or silica is coated with a metal material. Yes, it is possible. Using nickel or gold as the metallic material is preferable because it reduces contact resistance. Particles coated in layers of two or more metal materials, such as nickel further coated with gold. It is preferable to use a material that is elastically deformable or plastically deformable as the connecting body 243. It is preferable to use it. In this case, the conductive particles, which are the connectors 243, are as shown in Figure 17. In some cases, it may take on a shape that is flattened in the vertical direction. This allows the connector 243 and the electrical The contact area with the conductive layer that is connected by gas is increased, which reduces contact resistance and also prevents connection failures. This can suppress the occurrence of malfunctions.

[0255] It is preferable that the connecting body 243 be positioned so as to be covered by the adhesive layer 141. For example, hard The connector 243 should be dispersed in the adhesive layer 141 before the transformation process.

[0256] The light-emitting element 170 is a bottom-emission type light-emitting element. The light-emitting element 170 is an insulating A laminated structure in which electrode 191, EL layer 192, and electrode 193 are stacked in that order from the layer 220 side. The electrode 191 is connected to the transistor 205 through an opening provided in the insulating layer 214. It is connected to the conductive layer 222b. Transistor 205 drives the light-emitting element 170. It has a function to control the electrode. The insulating layer 216 covers the end of the electrode 191. The electrode 193 is The electrode 193 contains a material that reflects visible light, and electrode 191 contains a material that transmits visible light. An insulating layer 194 is provided to cover it. The light emitted by the light-emitting element 170 is blocked by the colored layer 134 and the insulating layer. It is injected towards the substrate 361 via the edge layer 220, the opening 451, the electrode 311a, etc.

[0257] The liquid crystal element 180 and the light-emitting element 170 change the color of the colored layer depending on the pixel, thus enabling various It can display various colors. The display device 300 uses a liquid crystal element 180 to display colors. It is possible to perform color display using the light-emitting element 170. It is possible.

[0258] Transistor 201, transistor 203, transistor 205, and transistor 2 All of 06 are formed on the substrate 351 side surface of the insulating layer 220. Zista can be manufactured using the same process.

[0259] Transistor 203 is a transistor (switch) that controls the selected and deselected states of pixels. It is a transistor (also called a select transistor). Transistor 205 is an oscillator. This is a transistor (also called a driving transistor) that controls the current flowing through the optical element 170. .

[0260] On the substrate 351 side of the insulating layer 220, there are insulating layers 211, 212, 213, and insulating An insulating layer such as layer 214 is provided. A portion of the insulating layer 211 is located at the gate of each transistor. It functions as an insulating layer. The insulating layer 212 is provided covering the transistor 206, etc. The insulating layer 213 is provided covering the transistor 205, etc. The insulating layer 214 is flat It functions as a tanning layer. Furthermore, the number of insulating layers covering the transistor is not limited; it can be a single layer. Even if it is two or more layers, that is acceptable.

[0261] At least one layer of the insulating layer covering each transistor is designed to prevent the diffusion of impurities such as water and hydrogen. It is preferable to use a suitable material. This allows the insulating layer to function as a barrier film. Yes, it is possible. With this configuration, impurities from the outside diffuse into the transistor. This makes it possible to effectively suppress this issue and realize a highly reliable display device.

[0262] Transistor 201, transistor 203, transistor 205, and transistor 2 06 is a conductive layer 221a that functions as a gate, and an insulating layer 21 that functions as a gate insulating layer. 1. Conductive layers 222a and 222b that function as source and drain, and semi It has a conductive layer 231. Here, multiple layers obtained by processing the same conductive film have the same It has a stitching pattern.

[0263] Transistors 201 and 205 are transistors 203 and transistors In addition to the configuration of 206, it has a conductive layer 223 that functions as a gate.

[0264] Transistors 201 and 205 have two semiconductor layers in which the channel is formed. A configuration is applied in which the transistor is clamped by two gates. The threshold voltage of the gate can be controlled. Two gates are connected and the same signal is applied to them. The transistor may be driven by supplying power to it. Such a transistor may be driven by other transistors. Compared to a DISTRA, it is possible to increase the field-effect mobility and increase the on-current. This makes it possible. As a result, it is possible to create circuits that can be driven at high speed. Furthermore, the circuit section This makes it possible to reduce the occupied area by using transistors with high on-current. Therefore, even if the number of wires increases when the display device is made larger or higher resolution, each wire This makes it possible to reduce signal delay and suppress display inconsistencies.

[0265] Alternatively, one of the two gates can be given a potential to control the threshold voltage, and the other can be driven by By applying a potential for motion, the threshold voltage of a transistor can be controlled.

[0266] There are no limitations on the structure of the transistors in the display device. The transistors in circuit 364 The transistors in the display unit 362 may have the same structure or different structures. It is also possible that the multiple transistors in circuit 364 all have the same structure. Multiple types of structures may be used in combination. Similarly, the display unit 362 may have multiple types The transistors may all have the same structure, or two or more different structures may be used in combination. It's okay to stay there.

[0267] It is preferable to use a conductive material containing an oxide for the conductive layer 223. When forming the conductive film that constitutes the structure, the film is formed in an oxygen-containing atmosphere, which allows oxygen to enter the insulating layer 212. It can supply oxygen gas. The proportion of oxygen gas in the film-forming gas is in the range of 90% to 100%. It is preferable to do so. The oxygen supplied to the insulating layer 212 is absorbed by the subsequent heat treatment into the semiconductor layer 2 It is supplied to 31, which helps to reduce oxygen vacancies in the semiconductor layer 231.

[0268] In particular, it is preferable to use a low-resistance oxide semiconductor for the conductive layer 223. In such cases, it is preferable to use an insulating film that releases hydrogen, such as a silicon nitride film, for the insulating layer 213. It seems that hydrogen enters the conductive layer 223 during the deposition of the insulating layer 213 or during subsequent heat treatment. This can be supplied and effectively reduce the electrical resistance of the conductive layer 223.

[0269] A colored layer 134 is provided in contact with the insulating layer 213. It is covered.

[0270] A connection portion 204 is provided in the area where substrates 351 and 361 do not overlap. In section 204, the wiring 365 is electrically connected to the FPC 372 via the connecting layer 242. The connection part 204 has the same configuration as the connection part 207. The upper surface of the connection part 204 is electric The conductive layer obtained by processing the same conductive film as pole 311a is exposed. This allows for connection The part 204 and the FPC 372 can be electrically connected via the connecting layer 242.

[0271] A linear polarizing plate may be used as the polarizing plate 135 placed on the outer surface of the substrate 361, but a circular polarizing plate may be used. Polarizing plates can also be used. For example, circular polarizers can be used with a 1 / 4 wavelength phase difference from linear polarizers. A laminated board can be used. This allows for the suppression of external light reflection. Furthermore, depending on the type of polarizing plate, the cell gap and orientation of the liquid crystal elements used in the liquid crystal element 180 may vary. By adjusting the drive voltage and other parameters, the desired contrast can be achieved.

[0272] Various optical components can be placed on the outside of the substrate 361. , polarizing plates, phase difference plates, light diffusion layers (diffusion films, etc.), anti-reflective layers, and light-gathering films, etc. These include: Furthermore, the outside of the substrate 361 has an antistatic film to suppress the adhesion of dust, and dirt... It features a water-repellent film to prevent adhesion, a hard coat film to suppress the occurrence of scratches during use, and other similar elements. That's fine.

[0273] Substrates 351 and 361 are made of glass, quartz, ceramic, sapphire, respectively. Organic resins and the like can be used. Flexible material can be used for substrates 351 and 361. Using this method can increase the flexibility of the display device.

[0274] Examples of liquid crystal elements 180 include vertical alignment (VA: Vertical Alignment). A liquid crystal element to which the nt) mode is applied can be used. As for the vertical alignment mode, M VA (Multi-Domain Vertical Alignment) mode, P VA(Patterned Vertical Alignment) mode, ASV( Features such as Advanced Super View mode can be used.

[0275] Liquid crystal elements 180 can be liquid crystal elements to which various modes are applied. For example, In addition to VA mode, there are also TN (Twisted Nematic) mode and IPS (In-Plant Nematic) mode. -Plane-Switching) mode, FFS (Fringe Field Switch) itching) mode, ASM(Axially Symmetric aligne) d Micro-cell) mode, OCB (Optically Compensated) (ed Birefringence) mode, FLC (Ferroelectric L iquix Crystal mode, AFLC (AntiFerroelectric) Liquid crystal elements with modes such as Liquid Crystal applied can be used. .

[0276] Liquid crystal elements are elements that control the transmission or non-transmission of light through the optical modulation effect of liquid crystals. The optical modulation effect of liquid crystals is due to the electric field applied to the liquid crystal (horizontal electric field, vertical electric field or oblique electric field). It is controlled by an electric field (including the direction of rotation). As for the liquid crystal used in the liquid crystal element, thermotronic PIC liquid crystal, low molecular weight liquid crystal, polymer liquid crystal, polymer dispersed liquid crystal (PDLC) Dispersed Liquid Crystal, ferroelectric liquid crystal, antiferroelectric liquid crystal These can be used. Depending on the conditions, these liquid crystal materials can be cholesteric phase, smeck It exhibits phases such as the tic phase, cubic phase, chiral nematic phase, and isotropic phase.

[0277] As the liquid crystal material, either a positive-type liquid crystal or a negative-type liquid crystal may be used. The optimal liquid crystal material can be used depending on the mode and design.

[0278] An alignment layer can be provided to control the orientation of the liquid crystal. Furthermore, a transverse electric field method is employed. In this case, a liquid crystal exhibiting a blue phase without an alignment layer may be used. The blue phase is one of the liquid crystal phases. Therefore, as the temperature of a cholesteric liquid crystal is increased, it transitions from the cholesteric phase to the isotropic phase. This is the phase that appears immediately before. The blue phase only appears within a narrow temperature range, so the temperature range needs to be modified. To improve performance, a liquid crystal composition containing several weight percent or more of a chiral agent is used in the liquid crystal. A liquid crystal composition containing a liquid crystal exhibiting a phase and a chiral agent has a short response speed and is optically isotropic. Furthermore, a liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent does not require alignment treatment. Furthermore, it has low viewing angle dependence. Also, since an alignment layer is not required, rubbing treatment is unnecessary. Therefore, electrostatic discharge damage caused by the rubbing process can be prevented during the manufacturing process. This can reduce malfunctions and damage to liquid crystal displays.

[0279] When using a reflective liquid crystal element, a polarizing plate 135 is provided on the display surface side. Additionally, placing a light diffuser on the display side is preferable because it improves visibility.

[0280] A front light may be provided outside the polarizing plate 135. It is preferable to use edge-lit front lights. Using a front light equipped with an (itting diode) can reduce power consumption. Therefore, it is preferable.

[0281] The adhesive layer can be a photocuring adhesive such as an UV-curing type, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as anaerobic adhesives, can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imi Plastic resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, E Examples include VA (ethylene vinyl acetate) resin. In particular, the moisture permeability of epoxy resins, etc. Materials with low properties are preferred. A two-part resin mixture may also be used. Furthermore, adhesive sheets, etc. You may use it.

[0282] The connecting layer 242 is an anisotropic conductive film (ACF: Anisotropic Co Anisotropic conductive paste (ACP) You can use methods such as Conductive Paste.

[0283] The light-emitting element 170 is a top-emission type, bottom-emission type, dual-emission type There are various types, such as the yon type. The electrode that extracts light uses a conductive film that transmits visible light. It is preferable to use a conductive film that reflects visible light on the electrode that does not extract light.

[0284] The EL layer 192 has at least an emissive layer. The EL layer 192 has layers other than the emissive layer, Materials with high hole injection potential, materials with high hole transport potential, hole blocking materials, materials with high electron transport potential Substances with high electron injection properties, or bipolar substances (substances with high electron transport and hole transport properties) It may further have a layer containing substances such as [unclear].

[0285] The EL layer 192 can use either low-molecular-weight compounds or high-molecular-weight compounds. It may contain chemical compounds. The layers constituting the EL layer 192 are each deposited by a vapor deposition method (vacuum vapor deposition). It can be formed by methods such as (including adhesive application), transfer, printing, inkjet, and coating. Cut.

[0286] The EL layer 192 may contain inorganic compounds such as quantum dots. For example, quantum dots By using the material as a light-emitting layer, it can also function as a light-emitting material.

[0287] Furthermore, the combination of the color filter (coloring layer) and the microcavity structure (optical adjustment layer) By applying this technique, it is possible to extract light with high color purity from the display device. Optical adjustment The thickness of the layers is varied according to the color of each pixel.

[0288] In addition to the gate, source, and drain of a transistor, various wirings that constitute a display device and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, and chromium. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tung Examples include metals such as stainless steel, or alloys in which these are the main component. The film can be used as a single layer or as a laminated structure.

[0289] Furthermore, examples of conductive materials that are translucent include indium oxide, indium tin oxide, and Conductive oxides such as zinc oxide, zinc oxide, and zinc oxide with added gallium or Graphene can be used. Alternatively, gold, silver, platinum, magnesium, nickel, and t Examples include sten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium. Metal materials or alloy materials containing such metal materials can be used. Alternatively, the nitrogen of the metal material can be used. Metallic compounds (e.g., titanium nitride) may also be used. When using these nitrides, they should be thinned to a degree that allows light to pass through. A laminated film of materials can be used as a conductive layer. For example, an alloy of silver and magnesium and an ink Using a multilayer film of tungsten oxide is preferable because it can improve conductivity. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive elements of the display element. It can also be used for layers (conductive layers that function as pixel electrodes or common electrodes).

[0290] Examples of insulating materials that can be used for each insulating layer include acrylic, epoxy, etc. Resin, silicon oxide, silicon oxide nitride, silicon nitride, aluminum oxide Examples include inorganic insulating materials such as nium.

[0291] Materials that can be used for the colored layer include metal materials, resin materials, pigments, or dyes. Examples include resin materials.

[0292] [Configuration Example 2] The display device 300A shown in Figure 18 includes transistor 201, transistor 203, and transistor It does not have transistor 205 and transistor 206, but transistor 281 and transistor 2 In having transistors 84, 285, and 286, the display device 300 is mainly It is different.

[0293] Note that in Figure 18, the positions of the insulating layer 117 and the connection part 207, etc., are different from those in Figure 17. Figure 18 The edges of the pixels are shown in the diagram. The insulating layer 117 is placed on top of the edges of the colored layer 131. Furthermore, the insulating layer 117 is placed on top of the edge of the light-shielding layer 132. In addition, the insulating layer 117 is placed in a part that does not overlap with the display area (a part that overlaps with the light-shielding layer 132). It may also be used.

[0294] Two transistors in the display device, such as transistors 284 and 285 The zista may be partially stacked. This reduces the area occupied by the pixel circuit. Because it can be reduced in size, the resolution can be increased. Also, the light emission of the light-emitting element 170 The area can be increased, and the aperture ratio can be improved. The light-emitting element 170 has a high aperture ratio. This allows for a lower current density to achieve the required brightness, thus improving reliability.

[0295] Transistors 281, 284, and 286 are connected to the conductive layer 221 a, comprising an insulating layer 211, a semiconductor layer 231, a conductive layer 222a, and a conductive layer 222b. The conductive layer 221a overlaps with the semiconductor layer 231 via the insulating layer 211. The conductive layer 222a and the conductive layer The electrode layer 222b is electrically connected to the semiconductor layer 231. The transistor 281 is connected to the conductive layer It has 223.

[0296] Transistor 285 consists of a conductive layer 222b, an insulating layer 217, a semiconductor layer 261, and a conductive layer 22 3. It has an insulating layer 212, an insulating layer 213, a conductive layer 263a, and a conductive layer 263b. Layer 222b overlaps with semiconductor layer 261 via insulating layer 217. Conductive layer 223 is an insulating layer It overlaps with the semiconductor layer 261 via the insulating layer 213. Conductive layer 263a and conductive layer 2 63b is electrically connected to the semiconductor layer 261.

[0297] The conductive layer 221a functions as a gate. The insulating layer 211 functions as a gate insulating layer. The conductive layer 222a functions as either the source or the drain. Transistor 28 The conductive layer 222b of 6 functions as either a source or a drain.

[0298] The conductive layer 222b shared by transistors 284 and 285 is The part that functions as the source or drain of transistor 284, and the other part of transistor 285 It has a portion that functions as a gate. The insulating layer 217, insulating layer 212, and insulating layer 213 are , functions as a gate insulating layer. Of the conductive layer 263a and conductive layer 263b, one is a saw One side functions as a gate, and the other as a drain. The conductive layer 223 functions as a gate. ru.

[0299] [Configuration Example 3] Figure 19(A) shows a cross-sectional view of the display unit of the display device 300B.

[0300] Display device 300B differs from display device 300 in that it does not have a colored layer 131. The other components are the same as those of the display device 300, so a detailed explanation is omitted.

[0301] The liquid crystal element 180 exhibits white color. Since it does not have a colored layer 131, the display device 300 B can display in black and white or grayscale using the liquid crystal element 180. .

[0302] [Configuration Example 4] The display device 300C shown in Figure 19(B) has an EL layer 192 that is painted in a different color (light-emitting element 1 The EL layer 192 is divided and provided every 70 units, and it does not have a colored layer 134. It differs from the display device 300B. Other configurations are the same as the display device 300B. Detailed explanations will be omitted.

[0303] The light-emitting element 170 to which the color-shading method is applied has a minimum number of layers among the layers that make up the EL layer 192. All layers that make up the EL layer need to be painted separately (typically the light-emitting layer). It's okay if they're painted in different colors.

[0304] In one embodiment of the present invention, the structure of the transistors in the display device is not particularly limited. For example, it can be a planar transistor or a staggered transistor. Alternatively, it may be an inverse staggered transistor. Also, a top-gate or bottom-gate structure may be used. Any transistor structure of the te structure may be used. Alternatively, gate voltages may be placed above and below the channel. Poles may be established.

[0305] Figures 20(A) to (E) show examples of transistor configurations.

[0306] The transistor 110a shown in Figure 20(A) is a top-gate structure transistor. .

[0307] Transistor 110a consists of a conductive layer 221, an insulating layer 211, a semiconductor layer 231, and an insulating layer 21 2. It has a conductive layer 222a and a conductive layer 222b. The semiconductor layer 231 is on the insulating layer 151. It is provided there. The conductive layer 221 overlaps with the semiconductor layer 231 via the insulating layer 211. Layer 222a and conductive layer 222b are connected through openings provided in insulating layer 211 and insulating layer 212. Then, it is electrically connected to the semiconductor layer 231.

[0308] The conductive layer 221 functions as a gate. The insulating layer 211 functions as a gate insulating layer. Of the conductive layers 222a and 222b, one functions as a source and the other as a drain. It functions as an input.

[0309] Transistor 110a is a material between conductive layer 221 and conductive layer 222a or conductive layer 222b Because it is easy to create a rational distance between them, it is possible to reduce the parasitic capacity between them. .

[0310] The transistor 110b shown in Figure 20(B) has the same configuration as transistor 110a, It has a conductive layer 223 and an insulating layer 218. The conductive layer 223 is provided on the insulating layer 151 and semi It overlaps with the conductive layer 231. The insulating layer 218 is provided covering the conductive layer 223 and the insulating layer 151. It is being done.

[0311] The conductive layer 223 functions as one of a pair of gates. Therefore, the transistor turns on. It is possible to increase the current and control the threshold voltage, among other things.

[0312] Figures 20(C) to (E) show an example of a structure in which two transistors are stacked. The structures of the two transistors can be determined independently, as shown in Figure 20(C)~( It is not limited to combination E).

[0313] Figure 20(C) shows a configuration in which transistors 110c and 110d are stacked. Transistor 110c has two gates. Transistor 110d has a bottom gate. It has a gate structure. Note that transistor 110c may have one gate ( (Top gate structure). Also, transistor 110d may have two gates.

[0314] Transistor 110c consists of a conductive layer 223, an insulating layer 218, a semiconductor layer 231, and a conductive layer 22 1. It has an insulating layer 211, a conductive layer 222a, and a conductive layer 222b. The conductive layer 223 is an insulating layer. It is provided on layer 151. The conductive layer 223 is connected to the semiconductor layer 231 via the insulating layer 218. They overlap. The insulating layer 218 is provided covering the conductive layer 223 and the insulating layer 151. Layer 221 overlaps with semiconductor layer 231 via insulating layer 211. In Figure 20(C), insulating layer 21 An example is shown where 1 is provided only in the portion that overlaps with the conductive layer 221, as shown in Figure 20(B), etc. As such, the insulating layer 211 may be provided so as to cover the edge of the semiconductor layer 231. Layer 222a and conductive layer 222b are connected to semiconductor layer 2 through an opening provided in insulating layer 212. It is electrically connected to 31.

[0315] Transistor 110d consists of a conductive layer 222b, an insulating layer 213, a semiconductor layer 261, and a conductive layer 2 It has 63a and a conductive layer 263b. The conductive layer 222b is a semiconductor via the insulating layer 213. It has a region that overlaps with layer 261. The insulating layer 213 is provided covering the conductive layer 222b. The conductive layers 263a and 263b are electrically connected to the semiconductor layer 261.

[0316] The conductive layer 221 and the conductive layer 223 are used as gates for the transistor 110c, respectively. The insulating layer 218 and insulating layer 211 serve as gate insulating layers for transistor 110c. It works. The conductive layer 222a acts as either the source or drain of the transistor 110c. It works.

[0317] The conductive layer 222b functions as either the source or the drain of the transistor 110c. It has a portion that functions as the gate of transistor 110d and an insulating layer 21 3 functions as the gate insulating layer of transistor 110d. Conductive layer 263a and conductive layer Of the 263b, one functions as the source for transistor 110d, and the other is the transistor It functions as a drain for the Ta110d.

[0318] Transistors 110c and 110d are applied to the pixel circuit of the light-emitting element 170. It is preferable that this be done. For example, transistor 110c is used as a selection transistor, The 110d transistor can be used as the drive transistor.

[0319] The conductive layer 263b emits light through openings provided in the insulating layer 217 and the insulating layer 214. It is electrically connected to electrode 191, which functions as a child pixel electrode.

[0320] Figure 20(D) shows a configuration in which transistors 110e and 110f are stacked. Transistor 110e has a bottom gate structure. Transistor 110f has two It has a gate. Transistor 110e may have two gates.

[0321] The transistor 110e consists of a conductive layer 221, an insulating layer 211, a semiconductor layer 231, and a conductive layer 22 It has 2a and a conductive layer 222b. The conductive layer 221 is provided on the insulating layer 151. The conductive layer 221 overlaps with the semiconductor layer 231 via the insulating layer 211. The insulating layer 211 is conductive The conductive layer 222a and conductive layer 222b are provided covering layer 221 and the insulating layer 151. It is electrically connected to the semiconductor layer 231.

[0322] Transistor 110f consists of a conductive layer 222b, an insulating layer 212, a semiconductor layer 261, and a conductive layer 2 23, has an insulating layer 218, an insulating layer 213, a conductive layer 263a, and a conductive layer 263b. The electrode layer 222b has a region that overlaps with the semiconductor layer 261 via the insulating layer 212. 12 is provided covering the conductive layer 222b. The conductive layers 263a and 263b are The insulating layer 213 is electrically connected to the semiconductor layer 261 through an opening provided in the insulating layer 213. Layer 223 overlaps with semiconductor layer 261 via insulating layer 218. Insulating layer 218 is connected to conductive layer 2 It is located in the area that overlaps with 23.

[0323] The conductive layer 221 functions as the gate of the transistor 110e. The insulating layer 211 is It functions as the gate insulating layer of transistor 110e. The conductive layer 222a is transistor 11 It functions as either a source or a drain for 0e.

[0324] The conductive layer 222b functions as either the source or the drain of the transistor 110e. It has a portion that functions as the gate of transistor 110f and a portion that functions as the gate of transistor 110f. Conductive layer 22 3 functions as the gate of transistor 110f. Insulating layers 212 and 218 are These, respectively, function as gate insulating layers for transistor 110f. Conductive layer 263a and Of the conductive layers 263b, one functions as the source for transistor 110f, and the other functions as the source for transistor 110f. It functions as a drain for the 110f.

[0325] The conductive layer 263b is used as a pixel electrode of the light-emitting element through an opening provided in the insulating layer 214. It is electrically connected to the electrode 191, which functions as an electrode.

[0326] Figure 20(E) shows a configuration in which transistors 110g and 110h are stacked. Transistor 110g has a top gate structure. Transistor 110h has two It has a gate. Note that transistor 110g may have two gates.

[0327] The transistor 110g consists of a semiconductor layer 231, a conductive layer 221, an insulating layer 211, and a conductive layer 22 It has 2a and a conductive layer 222b. The semiconductor layer 231 is provided on the insulating layer 151. The conductive layer 221 overlaps with the semiconductor layer 231 via the insulating layer 211. The insulating layer 211 is conductive It is provided in superimposed on the electrical layer 221. The conductive layer 222a and conductive layer 222b are in the insulating layer 21 The semiconductor layer 231 is electrically connected to the opening provided in 2.

[0328] Transistor 110h consists of conductive layer 222b, insulating layer 213, semiconductor layer 261, and conductive layer 2 23, has an insulating layer 218, an insulating layer 217, a conductive layer 263a, and a conductive layer 263b. The electrode layer 222b has a region that overlaps with the semiconductor layer 261 via the insulating layer 213. 13 is provided covering the conductive layer 222b. The conductive layers 263a and 263b are The conductive layer is electrically connected to the semiconductor layer 261 through an opening provided in the insulating layer 217. 223 overlaps with the semiconductor layer 261 via the insulating layer 218. The insulating layer 218 is connected to the conductive layer 22 It is located in the area that overlaps with number 3.

[0329] The conductive layer 221 functions as the gate of transistor 110g. The insulating layer 211 is It functions as a gate insulating layer for transistor 110g. Conductive layer 222a is transistor 11 It functions as either a source or a drain for 0g.

[0330] The conductive layer 222b functions as either the source or the drain of transistor 110g. It has a portion that functions as the gate of transistor 110h and a portion that functions as the gate of transistor 110h. Conductive layer 22 3 functions as the gate of transistor 110h. Insulating layers 212 and 218 are These, respectively, function as gate insulating layers for transistor 110h. Conductive layer 263a and Of the conductive layers 263b, one functions as the source for transistor 110h, and the other functions as the source for transistor 110h. It functions as a drain for the 110h.

[0331] The conductive layer 263b is used as a pixel electrode of the light-emitting element through an opening provided in the insulating layer 214. It is electrically connected to the electrode 191, which functions as an electrode.

[0332] [Example of manufacturing method] The following describes the method for manufacturing the display device of this embodiment, using Figures 21 to 24. Explain it concretely.

[0333] Furthermore, thin films (insulating films, semiconductor films, conductive films, etc.) that make up the display device are produced by sputtering. Chemical vapor deposition (CVD) method, Vacuum deposition, pulsed laser deposition (PLD) ion) method, Atomic Layer Deposition (ALD) It can be formed using methods such as CVD. CVD methods include plasma chemical vapor deposition (PEC). VD:Plasma Enhanced Chemical Vapor Deposit The ion method or thermal CVD method may also be used. An example of the thermal CVD method is organometallic vapor deposition ( The MOCVD (Metal Organic CVD) method may also be used.

[0334] Thin films (insulating films, semiconductor films, conductive films, etc.) that make up display devices are made using spin coating, dip coating, etc. spray coating, inkjet, dispensing, screen printing, offset printing, Methods such as kurt knife coating, slit coating, roll coating, curtain coating, and knife coating. It can be formed by [this method].

[0335] When processing the thin films that make up the display device, processing can be done using methods such as lithography. Yes, it is possible. Alternatively, island-like thin films may be formed by a film deposition method using a shielding mask. Alternatively, thin films can be processed using methods such as nanoimprinting, sandblasting, and lift-off. This is also good. As a photolithography method, a resist mask is formed on the thin film to be processed. A method of processing the thin film by etching or the like to remove the resist mask, and a photosensitive A method of forming a thin film, then exposing and developing it to process the thin film into a desired shape. , there is.

[0336] When using light in lithography, the light used for exposure is, for example, the i-line (wavelength 365°C). (nm), g-line (wavelength 436nm), h-line (wavelength 405nm), or a mixture thereof. Light can be used. Other options include ultraviolet light, KrF laser light, or ArF laser light. It is also possible to use [this method]. Alternatively, exposure may be performed using immersion lithography. Examples of light that can be found include extreme ultraviolet (EUV) light and X-rays. A line can be used. Alternatively, an electron beam can be used instead of the light used for exposure. Extreme ultraviolet light, X-rays, or electron beams are preferred because they enable extremely fine processing. It is important to note that when exposure is performed by scanning a beam such as an electron beam, photo Masks are not necessary.

[0337] Thin film etching methods include dry etching, wet etching, and sandblasting. Laws and other regulations can be used.

[0338] The following describes an example of a method for manufacturing the display device 300 shown in Figure 17. Figures 21- Figure 24 will explain the manufacturing method, focusing particularly on the display unit 362 of the display device 300.

[0339] First, a colored layer 131 is formed on the substrate 361 (Figure 21(A)). The colored layer 131 is By forming them using photosensitive materials, they can be processed into island-like structures using photolithography or similar methods. This can be done. In addition, in the circuit 364 shown in Figure 17, a light-shielding layer 132 is provided on the substrate 361. ru.

[0340] Next, an insulating layer 121 is formed on the colored layer 131 and the light-shielding layer 132.

[0341] The insulating layer 121 preferably functions as a planarization layer. Resins such as epoxy can be suitably used.

[0342] An inorganic insulating film may be applied to the insulating layer 121. For example, nitrogen Silicon oxide film, silicon oxide nitride film, silicon oxide film, silicon oxide nitride film, aluminum oxide Inorganic insulating films such as aluminum oxide films and aluminum nitride films can be used. nium film, yttrium oxide film, zirconium oxide film, gallium oxide film, tantalum oxide film Using magnesium oxide film, lanthanum oxide film, cerium oxide film, neodymium oxide film, etc. Alternatively, two or more of the above-mentioned insulating films may be stacked and used.

[0343] Next, electrode 113 is formed. After forming a conductive film on electrode 113, a resist mask is used. It can be formed by removing the resist mask after etching the conductive film. The electrode 113 is formed using a conductive material that transmits visible light.

[0344] Next, an insulating layer 117 is formed on the electrode 113. An organic insulating film is used for the insulating layer 117. It is preferable that they be present.

[0345] Next, an alignment film 133b is formed on the electrode 113 and the insulating layer 117 (Figure 21(A)). The alignment film 133b can be formed by performing a rubbing treatment after forming a thin film of resin or the like. ru.

[0346] Furthermore, independently of the process explained using Figure 21(A), Figures 21(B) to 24(A) are also used. Perform the steps shown up to ).

[0347] First, a release layer 382 is formed on the fabricated substrate 381, and an insulating layer 383 is formed on the release layer 382. This is achieved (Figure 21(B)).

[0348] In this process, when peeling off the fabricated substrate 381, the interface between the fabricated substrate 381 and the peeling layer 382 Materials that separate at the interface between the release layer 382 and the insulating layer 383, or within the release layer 382. Select. In this embodiment, the case in which separation occurs at the interface between the insulating layer 383 and the release layer 382 is For example, this is not limited to combinations of materials used for the release layer 382 and the insulating layer 383. I can't.

[0349] The fabricated substrate 381 has sufficient rigidity to facilitate transport and is resistant to the temperatures involved in the fabrication process. In contrast, it has heat resistance. Examples of materials that can be used for the fabricated substrate 381 include, Examples include lath, quartz, ceramics, sapphire, resin, semiconductors, metals, or alloys. Examples of glass include alkali-free glass, barium borosilicate glass, and alumino. Examples include gynosilicate glass.

[0350] The release layer 382 can be formed using an organic or inorganic material.

[0351] Inorganic materials that can be used in the release layer 382 include tungsten, molybdenum, and thi. Tan, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium Metals containing elements selected from um, palladium, osmium, iridium, and silicon. Examples include alloys containing the element, or compounds containing the element. Crystals of silicon-containing layers. The structure can be amorphous, microcrystalline, or polycrystalline.

[0352] When using inorganic materials, the thickness of the release layer 382 is preferably between 1 nm and 1000 nm. The wavelength is 10 nm to 200 nm, more preferably 10 nm to 100 nm.

[0353] When using inorganic materials, the release layer 382 can be formed by, for example, sputtering, CVD, or ALD. It can be formed by methods such as vapor deposition.

[0354] Examples of organic materials that can be used in the release layer 382 include acrylic resin and epoxy resin. Polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene Examples include resins and phenolic resins.

[0355] When using organic materials, the thickness of the release layer 382 is 0.01 μm or more and less than 10 μm. It is preferable that the particle size be 0.1 μm or more and 3 μm or less, and more preferably 0.5 μm or more. It is even more preferable that the thickness be 1 μm or less. By setting the thickness of the release layer 382 to the above range, The manufacturing cost can be reduced. However, this is not limited to the thickness of the release layer 382. This may be 10 μm or larger, for example, 10 μm to 200 μm.

[0356] When using organic materials, the method for forming the release layer 382 is spin coating, dip, Spray coating, inkjet, dispensing, screen printing, offset printing, dock Examples include turn knife coats, slit coats, roll coats, curtain coats, and knife coats. It can be done.

[0357] It is preferable to use an inorganic insulating film as the insulating layer 383. For example, silicon nitride film, silicon oxide nitride film, silicon oxide film, silicon nitride oxide film, oxidation Inorganic insulating films such as aluminum films and aluminum nitride films can be used. Hafnium oxide film, yttrium oxide film, zirconium oxide film, gallium oxide film, tan oxide Tal film, magnesium oxide film, lanthanum oxide film, cerium oxide film, and neodymium oxide film, etc. Alternatively, you may use the above-mentioned insulating film stacked in two or more layers.

[0358] For example, the release layer 382 contains a layer containing a high-melting-point metal material such as tungsten and the metal material A laminated structure with an oxide-containing layer is applied, and silicon nitride, silicon oxide nitride, is used in the insulating layer 383. A laminated structure having multiple inorganic insulating films such as condensate or silicon nitride may also be applied. Using a high-melting-point metal material for the release layer 382 increases the formation temperature of subsequent layers. This makes it possible to reduce the concentration of impurities and realize a highly reliable display device. After peeling, the process involves removing layers that are unnecessary for the display device (such as the peeling layer 382 and the insulating layer 383). It may have a degree. Alternatively, without removing the release layer 382 or the insulating layer 383, the display device It may also be used as a component of [the system].

[0359] Next, an electrode 311a is formed on the insulating layer 383, and an electrode 311b is formed on the electrode 311a. (Figure 21(C)). Electrode 311b has an opening 451 on electrode 311a. Electrode 3 After forming a conductive film on 11a and electrode 311b, a resist mask is formed on each of them. The conductive film can be formed by etching it and then removing the resist mask. Electrode 311a is formed using a conductive material that transmits visible light. Electrode 311b reflects visible light. It is formed using a conductive material that is injected.

[0360] Next, an insulating layer 220 is formed (Figure 21(D)). Then, electrodes 311 are attached to the insulating layer 220. An opening is provided that reaches b.

[0361] The insulating layer 220 contains impurities in the peeling layer 382 that can later form transistors and displays. It can be used as a barrier layer to prevent diffusion into the element. When using this method, the insulating layer 220, when the release layer 382 is heated, contains in the release layer 382 It is preferable to prevent moisture and other substances from diffusing into transistors and display elements. Therefore, insulation is necessary. Layer 220 preferably has high barrier properties.

[0362] As the insulating layer 220, an inorganic insulating film and resin that can be used for the insulating layer 121 are used. It is possible to be there.

[0363] Next, transistors 205 and 206 are formed on the insulating layer 220.

[0364] The semiconductor materials used in transistors are not particularly limited; for example, elements and compounds of Group 14. Semiconductors or oxide semiconductors can be used in the semiconductor layer. Typically, silicon-containing semiconductors are used. This applies to semiconductors containing gallium arsenide, or oxide semiconductors containing indium, etc. Cut.

[0365] Here, transistor 206 has an oxide semiconductor layer as semiconductor layer 231. This shows how to fabricate a bottom-gate transistor. Transistor 205 is a transistor This configuration adds a conductive layer 223 and an insulating layer 212 to the configuration of ZISTA 206, and has two gates It has a to.

[0366] It is preferable to use an oxide semiconductor for the semiconductor layer of the transistor. When semiconductor materials with a wide band gap and low carrier density are used, transistors are formed. This reduces the current when the device is in the off state.

[0367] Specifically, first, conductive layers 221a and 221b are formed on the insulating layer 220. The conductive layers 221a and 221b form a resist mask after the conductive film has been deposited. This can be formed by etching the conductive film and then removing the resist mask. The conductive layer 221b and the electrode 311b are connected through an opening in the insulating layer 220.

[0368] Next, an insulating layer 211 is formed.

[0369] Examples of insulating layers 211 include silicon nitride film, silicon oxide nitride film, and silicon oxide. Inorganic insulating films such as films, silicon nitride film, aluminum oxide film, and aluminum nitride film It can also be used. Additionally, hafnium oxide film, yttrium oxide film, and zirconium oxide. Film, gallium oxide film, tantalum oxide film, magnesium oxide film, lanthanum oxide film, cerium oxide A luminum film and a neodymium oxide film may also be used. Furthermore, two or more of the above-mentioned insulating films may be stacked and used. It's okay to be there.

[0370] Inorganic insulating films become denser and have higher barrier properties the higher the deposition temperature, therefore they are formed at high temperatures. It is preferable that the substrate temperature during the deposition of the inorganic insulating film be between room temperature (25°C) and 350°C. A temperature of 100°C or higher and 300°C or lower is preferred.

[0371] Next, a semiconductor layer 231 is formed. In this embodiment, the semiconductor layer 231 is made of an oxide A material semiconductor layer is formed. After depositing the oxide semiconductor film, the resist mass is formed. By forming a groove and etching the oxide semiconductor film, then removing the resist mask, It can be formed.

[0372] The substrate temperature during the deposition of oxide semiconductor films is preferably 350°C or lower, and is between room temperature and 200°C. The lower temperature is more preferable, and a temperature between room temperature and 130°C is even more preferable.

[0373] Oxide semiconductor films are deposited using either an inert gas or oxygen gas, or both. This is possible. Furthermore, the oxygen flow rate ratio (oxygen partial pressure) during the deposition of oxide semiconductor films is important. There are no particular limitations. However, when obtaining a transistor with high field-effect mobility, acid The oxygen flow rate ratio (oxygen partial pressure) during the deposition of a semiconductor film is preferably between 0% and 30%. Furthermore, a concentration of 5% to 30% is more preferable, and 7% to 15% is even more preferable.

[0374] The oxide semiconductor film preferably contains at least indium or zinc. In particular, It is preferable that the material contains zinc and zinc.

[0375] The oxide semiconductor preferably has an energy gap of 2 eV or more, and 2.5 eV It is more preferable that it be above this level, and even more preferable that it be 3 eV or higher. By using oxide semiconductors with a wide energy gap, the off-current of the transistor can be reduced. It is possible.

[0376] Oxide semiconductor films can be formed by sputtering. In addition, for example... PLD method, PECVD method, thermal CVD method, ALD method, vacuum deposition method, etc. may be used.

[0377] An example of an oxide semiconductor will be described in Embodiment 4.

[0378] Next, conductive layers 222a and 222b are formed. 22b is obtained by forming a conductive film, then forming a resist mask, and etching the conductive film. The conductive layer 222a and conductive layer 222 can be formed by later removing the resist mask. b is connected to the semiconductor layer 231. Here, the conductive material of transistor 206 The electrolytic layer 222a is electrically connected to the conductive layer 221b. As a result, at the connection part 207 The electrode 311b and the conductive layer 222a can be electrically connected.

[0379] Furthermore, when processing conductive layers 222a and 222b, they are covered by a resist mask. In some cases, a portion of the semiconductor layer 231 may be thinned by etching.

[0380] As described above, transistor 206 can be fabricated (Figure 21(D)). Transistor In 206, a portion of the conductive layer 221a functions as a gate, and a portion of the insulating layer 211 functions as a gate. The conductive layer 222a and conductive layer 222b function as insulating layers, respectively, and the source or It functions as either a drain or a drain.

[0381] Next, an insulating layer 212 is formed to cover the transistor 206, and a conductive layer 22 is placed on top of the insulating layer 212. Form 3.

[0382] The insulating layer 212 can be formed by the same method as the insulating layer 211.

[0383] The conductive layer 223 of transistor 205 is formed by depositing a conductive film and then using a resist mask. It can be formed by removing the resist mask after etching the conductive film. ru.

[0384] As described above, transistor 205 can be fabricated (Figure 21(D)). Transistor In 205, a portion of the conductive layer 221a and a portion of the conductive layer 223 function as a gate. Part of the insulating layer 211 and part of the insulating layer 212 function as a gate insulating layer, and conductive layer 222 a and conductive layer 222b each function as either a source or a drain. .

[0385] Next, an insulating layer 213 is formed (Figure 21(D)). The insulating layer 213 is the same as the insulating layer 211. It can be formed by the following method.

[0386] Furthermore, the insulating layer 212 may be a silicon oxide film or oxidative nitride film formed in an oxygen-containing atmosphere. It is preferable to use an oxide insulating film such as a silicon film. Furthermore, the silicon oxide film and acid On the silicon nitride film, an insulating layer 213 is provided, which diffuses and permeates oxygen such as silicon nitride film. It is preferable to laminate an insulating film that is difficult to deposit. Oxide insulating films formed in an oxygen-containing atmosphere are This allows for the creation of an insulating film that readily releases a large amount of oxygen upon heating. Heat treatment is performed with an oxide insulating film that emits oxygen and an insulating film that is less permeable to oxygen stacked together. By doing so, oxygen can be supplied to the oxide semiconductor layer. As a result, the oxide semiconductor Oxygen vacancies in the body layer and defects at the interface between the oxide semiconductor layer and the insulating layer 212 are repaired, and defect levels This can reduce the noise, which in turn enables the creation of highly reliable display devices.

[0387] Next, a colored layer 134 is formed on the insulating layer 213 (Figure 21(D)), and then the insulating layer 2 Formation 14 is created (Figure 22(A)). The colored layer 134 overlaps with the opening 451 of electrode 311b. Arrange them accordingly.

[0388] The colored layer 134 can be formed by the same method as the colored layer 131. Insulating layer 21 Since 4 is a layer having the surface on which the display element will be formed later, it functions as a planarization layer. Preferably, the insulating layer 214 is made of a resin or inorganic insulating material that can be used in the insulating layer 121. The border membrane can be used as a reference.

[0389] Next, the insulating layer 212, insulating layer 213, and insulating layer 214 are provided with the transistor 205 An opening is formed that reaches the conductive layer 222b.

[0390] Next, electrode 191 is formed (Figure 22(A)). After the conductive film is deposited on electrode 191, A resist mask is formed, and after etching the conductive film, the resist mask is removed. This can be formed by the conductive layer 222b and electrode 191 of the transistor 205. The two are connected. Electrode 191 is formed using a conductive material that transmits visible light.

[0391] Next, an insulating layer 216 is formed to cover the end of the electrode 191 (Figure 22(B)). Insulating layer 21 6 can use a resin or inorganic insulating film that can be used for the insulating layer 121. Insulating layer 2 16 has an opening in the portion that overlaps with electrode 191.

[0392] Next, the EL layer 192 and the electrode 193 are formed (Figure 22(B)). The electrode 193 is A portion of it functions as a common electrode for the light-emitting element 170. Electrode 193 is a conductive material that reflects visible light. Formed using materials.

[0393] The EL layer 192 can be formed by methods such as vapor deposition, coating, printing, and extrusion. When creating the EL layer 192 separately for each pixel, a shadow mask such as a metal mask is used. It can be formed by vapor deposition or inkjet method, etc. EL layer 192 for each pixel If differentiation is not required, a vapor deposition method that does not use a metal mask can be used.

[0394] The EL layer 192 can use either low-molecular-weight compounds or high-molecular-weight compounds. It may contain inorganic compounds.

[0395] Each step performed after the formation of the EL layer 192 is performed such that the temperature applied to the EL layer 192 is The process is carried out so as to be below the heat resistance temperature. The electrode 193 is shaped using methods such as vapor deposition or sputtering. It is possible.

[0396] As described above, the light-emitting element 170 can be formed (Figure 22(B)). Child 170 consists of an electrode 191 that functions as a pixel electrode, an EL layer 192, and a common electrode. The light-emitting element 170 has a stacked configuration in which electrodes 193 that function as light-emitting elements are attached. The color layer 134 is fabricated so as to overlap with the aperture 451 of electrode 311b.

[0397] Here, we show an example of fabricating a bottom-emission type light-emitting element 170. However, the present invention is not limited to this aspect.

[0398] Light-emitting devices include top-emission type, bottom-emission type, and dual-emission type. Either of the above is acceptable. The electrode that extracts light uses a conductive film that transmits visible light. Furthermore, it is preferable to use a conductive film that reflects visible light on the electrode that does not extract light. stomach.

[0399] Next, an insulating layer 194 is formed to cover the electrode 193 (Figure 22(B)). The insulating layer 194 is It functions as a protective layer that suppresses the diffusion of impurities such as water into the light-emitting element 170. The optical element 170 is sealed by an insulating layer 194. After forming the electrodes 193, it is exposed to the atmosphere. It is preferable to form the insulating layer 194 without doing so.

[0400] The insulating layer 194 is, for example, an inorganic insulating film that can be used in the insulating layer 121 described above. It can be used. The insulating layer 194 preferably contains an inorganic insulating film with high barrier properties. It is also possible to use an inorganic insulating film and an organic insulating film stacked together.

[0401] The substrate temperature during the deposition of the insulating layer 194 must be below the heat resistance temperature of the EL layer 192. Preferred. The insulating layer 194 can be formed using methods such as ALD or sputtering. ALD method and sputtering method are preferred because they allow for low-temperature film deposition. Having it present results in good coverage of the insulating layer 194, which is desirable.

[0402] Next, the substrate 351 is bonded to the surface of the insulating layer 194 using the adhesive layer 142 (Figure 2). 2(C)).

[0403] The adhesive layer 142 can be a photocurable adhesive such as an ultraviolet-curable adhesive, a reaction-curing adhesive, or a thermosetting adhesive. Various types of curing adhesives, such as adhesives and anaerobic adhesives, can be used. Also, adhesive sheets, etc. You may use it.

[0404] The substrate 351 can be made of, for example, polyethylene terephthalate (PET), polyethylene naphth Polyester resins such as Talate (PEN), polyacrylonitrile resins, acrylic resins, Polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, poly Ethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysilicone Xane resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, poly Urethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, poly Tetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, etc. The substrate 351 can be made of various materials such as glass, quartz, resin, metal, alloy, and semiconductor. Seed materials may be used. The substrate 351 may be glass, quartz, or resin of a thickness sufficient to be flexible. Various materials such as fats, metals, alloys, and semiconductors may be used.

[0405] Next, the fabricated substrate 381 is peeled off (Figure 23(A)).

[0406] The separation surface includes materials and formation methods for the insulating layer 383, the release layer 382, ​​and the fabricated substrate 381, etc. Depending on the situation, it can take on various positions.

[0407] Figure 23(A) shows an example where separation occurs at the interface between the delamination layer 382 and the insulating layer 383. The separation exposes the insulating layer 383.

[0408] Before performing the separation, a separation starting point may be formed in the peeling layer 382. For example, peeling layer 382 Laser light may be irradiated onto part or the entire surface of the peeling layer 382. This weakens the peeling layer 382. This causes or reduces the adhesion between the release layer 382 and the insulating layer 383 (or fabricated substrate 381). It can be made to happen.

[0409] For example, by applying a tensile force perpendicular to the release layer 382, ​​the fabricated substrate 381 can be modified. It can be peeled off. Specifically, a portion of the upper surface of the substrate 351 is attracted and pulled upward. This allows the fabricated substrate 381 to be peeled off.

[0410] Between the release layer 382 and the insulating layer 383 (or fabricated substrate 381), a sharp object such as a blade is placed. A starting point for separation may be formed by inserting a sharp object from the substrate 351 side. The peeling layer 382 may be cut with an instrument of a certain shape to form a starting point for separation.

[0411] Next, the insulating layer 383 is removed. For example, the insulating layer 38 is removed using a dry etching method. 3 can be removed. This exposes electrode 311a (Figure 23(B)).

[0412] Next, an orientation film 133a is formed on the surface of the exposed electrode 311a (Figure 24(A)). The alignment film 133a is formed by performing a rubbing treatment after depositing a thin film of resin or the like. Cut.

[0413] Then, the substrate 361 after the process described using Figure 21(A) is completed, and Figure 24(A) The substrate 351, which has completed the process described above, is bonded to the liquid crystal layer 112 in between (Figure 24(B)). ). Although not shown in Figure 24(B), as shown in Figure 17 etc., substrate 351 and substrate 361 are The parts are bonded together with adhesive layer 141. Adhesive layer 141 is made of a material that can be used for adhesive layer 142. You can use the fee.

[0414] The liquid crystal element 180 shown in Figure 24(B) has an electrode 311a in which part functions as a pixel electrode. And electrode 311b), liquid crystal layer 112, and electrode 113 which partially functions as a common electrode are stacked. It has a structure. The liquid crystal element 180 is manufactured so as to overlap with the colored layer 131.

[0415] Based on the above, the display device 300 can be manufactured.

[0416] As described above, the display device of this embodiment has two types of display elements and multiple display modes Because it can be switched between modes, it offers high visibility and convenience regardless of ambient light. High.

[0417] In this specification, if multiple configuration examples are shown within a single embodiment, the configuration examples are... It is possible to combine them as appropriate.

[0418] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination.

[0419] (Embodiment 6) In this embodiment, C can be used in the transistor disclosed in one aspect of the present invention. This document explains the configuration of AC (Cloud-Aligned Composite)-OS. ru.

[0420] CAC-OS refers to, for example, an oxide semiconductor in which the elements constituting the semiconductor are between 0.5 nm and 10 nm. Preferably, the material is unevenly distributed with a size of 1 nm to 2 nm or near that size. This is the composition. In the following, in oxide semiconductors, one or more metal elements The elements are unevenly distributed, and the region containing the metal element is 0.5 nm to 10 nm, preferably 1 nm. A mixture of particles between 1 / 2nm and 2nm in size, or near that size, is described as a mosaic or patch. It is also called a form.

[0421] Furthermore, the oxide semiconductor preferably contains at least indium, particularly indium. It is preferable that it also contains aluminum, gallium, and zinc. Beryllium, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, Germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium , one or more types selected from tantalum, tungsten, or magnesium It may be included.

[0422] For example, CAC-OS in In-Ga-Zn oxide (In- Ga-Zn oxide may also be specifically referred to as CAC-IGZO. ) is indium oxide (hereinafter referred to as InO X1 (Let X1 be a real number greater than 0.) ) or indium zinc Oxides (hereinafter, In X2 Zn Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0) ) and gallium oxide (hereinafter referred to as GaOX3 (where X3 is a real number greater than 0) and set it.), or gallium zinc oxide (hereinafter, Ga X4 Zn Y4 O Z4 (where X4, Y4, and also Z4 are real numbers greater than 0).) and the like, the material separates into a mosaic shape and becomes a mosaic-like InO X1 , or In X2 Zn Y2 O Z2 is uniformly distributed in the film and has a structure (hereinafter, also referred to as a cloud-like structure).

[0423] That is, CAC-OS is a composite oxide semiconductor X3 having a structure in which a region mainly composed of GaO X2 Zn Y2 O Z2 , or InO X1 and a region mainly composed of In are mixed. In this specification, for example, the atomic number ratio of In to element M in the first region is greater than the atomic number ratio of In to element M in the second region, and the first region is assumed to have a higher In concentration compared to the second region.

[0424] Note that IGZO is a common name and may refer to one compound composed of In, Ga, Zn, and O in some cases. Representative examples include InGaO3(ZnO) m1 (where m1 is a natural number), or In (1+x0) Ga (1-x0) O3(ZnO) m0 (-1 ≤ x0 ≤ 1, where m0 is an arbitrary number) and crystalline compounds represented thereby.

[0425] The above crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. Note CAAC structure refers to a structure in which multiple IGZO nanocrystals have c-axis orientation and ab-plane orientation This is a crystal structure in which the elements are linked without orientation.

[0426] On the other hand, CAC-OS relates to the material composition of oxide semiconductors. CAC-OS is In, In a material composition containing Ga, Zn, and O, a portion of the material is in the form of nanoparticles with Ga as the main component. The observed region and the region observed as nanoparticles mainly composed of In are, This refers to a configuration that is randomly distributed in a mosaic-like manner. Therefore, in CAC-OS, Crystal structure is a secondary factor.

[0427] Furthermore, CAC-OS does not include a layered structure of two or more films with different compositions. For example, a structure consisting of two layers, one with In as the main component and the other with Ga as the main component, includes No.

[0428] Note that GaO X3 The region in which is the main component, and In X2 Zn Y2 O Z2 , or InO X1 In some cases, a clear boundary may not be observable in a region where [this component] is the main component.

[0429] Note that aluminum, yttrium, copper, vanadium, and beryllium can be used instead of gallium. Molybdenum, boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum N, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more species selected from Nesium etc. are included, CAC-OS will The region is observed to be in the form of nanoparticles mainly composed of the metal element, and the portion is mainly composed of In. The regions observed as nanoparticles are randomly dispersed in a mosaic-like manner. It refers to.

[0430] CAC-OS is a material that can be molded by sputtering, for example, under conditions where the substrate is not intentionally heated. This can be achieved. Also, when forming CAC-OS by sputtering, the deposition gas The gases selected were inert gases (typically argon), oxygen gas, and nitrogen gas. You may use one or more of them. Also, the oxygen in relation to the total flow rate of the deposition gas during film formation. A lower gas flow rate ratio is preferable; for example, a flow rate ratio of oxygen gas of 0% or more and less than 30% is preferable. Alternatively, it is preferable to have a value of 0% or more and 10% or less.

[0431] CAC-OS is an X-ray diffraction (XRD) measurement method When measured using one method, the Out-of-Plane method with a θ / 2θ scan: It is characterized by the absence of a clear peak. In other words, from X-ray diffraction, the measurement area It can be seen that there is no orientation in the ab-plane direction or the c-axis direction of the region.

[0432] Furthermore, CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam). In the electron diffraction pattern obtained by irradiation, there is a ring-shaped region of high brightness, and Multiple bright spots are observed in the ring region. Therefore, from the electron diffraction pattern, CAC-OS The crystal structure of is non-oriented in both the planar and cross-sectional directions, nc(nano- It can be seen that it has a crystal structure.

[0433] For example, in CAC-OS in In-Ga-Zn oxide, energy-dispersive X Linear spectroscopy (EDX: Energy Dispersive X-ray spectrometer) GaO X3 The region in which is the main component And, In X2 Zn Y2 O Z2 , or InO X1 Regions where it is the main component are unevenly distributed and mixed. It can be confirmed that it has the following structure.

[0434] CAC-OS has a different structure from IGZO compounds in which metal elements are uniformly distributed, It has different properties from GZO compounds. In other words, CAC-OS is GaO X3 These are the main components. The region and In X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component, and It exhibits phase separation and has a mosaic-like structure in which regions composed primarily of each element are arranged.

[0435] Here, In X2 Zn Y2 O Z2 , or InO X1 The region in which is the main component is GaO X This region has higher conductivity compared to regions where 3 is the main component. X2 Zn Y2 O Z2 , or InO X1 As the carrier flows through the region where acid is the main component, Conductivity as a semiconductor is exhibited. Therefore, In X2 Zn Y2 O Z2 , or InO X1 Regions where this is the main component are distributed in a cloud-like manner within the oxide semiconductor, resulting in a high field effect. Fruit mobility (μ) can be achieved.

[0436] On the other hand, GaO X3 Regions in which these are the main components are In X2 Zn Y2 O Z2 , or InO X1 This region has higher insulating properties compared to the region where GaO is the main component. X3 etc. The distribution of regions where this is the main component within the oxide semiconductor suppresses leakage current and improves performance. Switching operation can be achieved.

[0437] Therefore, when CAC-OS is used in semiconductor devices, GaO X3 Insulation caused by factors such as In X2 Zn Y2 O Z2 , or InO X1 The conductivity resulting from this works in a complementary manner. This results in a high on-current (I on ), and achieving high field effect mobility (μ) It is possible.

[0438] Furthermore, semiconductor devices using CAC-OS have high reliability. Therefore, CAC-OS is, It is ideal for various semiconductor devices, including displays.

[0439] This embodiment may be appropriately combined with other embodiments described herein, at least in part. They can be implemented in combination. [Explanation of symbols]

[0440] 10 Electronic equipment 10a electronic equipment 10b Electronic equipment 10c electronic equipment 11 cabinets 15 straight line 15a intersection 15b intersection 16 straight line 16a intersection 16b Intersection 21 Display section 22 Display section 22a Display section 22b Display section 25 Crown 26 buttons 31 Band attachment section 32 Band attachment section 41 bands 42 bands 51 hour hand 52 minute hand 53 second hand 54 Index 55 Date and Time Information 56 Notification Information 57 icons 61 Display device 62 Display device 63 FPC 63a FPC 63b FPC 64 components 64a Member 64b Member 71 batteries 72 Printed circuit boards 73 IC 74 Vibration Modules 75 Antenna 110a transistor 110b Transistor 110c transistor 110d transistor 110e Transistor 110f transistor 110g transistor 110h transistor 112 Liquid crystal layer 113 Electrode 117 Insulating layer 121 Insulating layer 131 Colored layer 132 Light blocking layer 133a Orientation film 133b Alignment film 134 Colored layer 135 Polarizing plate 141 Adhesive layer 142 Adhesive layer 151 Insulating layer 170 light-emitting elements 180 liquid crystal elements 191 Electrode 192 EL layer 193 Electrode 194 Insulating layer 201 Transistors 203 Transistors 204 Connection part 205 transistors 206 transistors 207 Connection part 211 Insulating layer 212 Insulating layer 213 Insulating layer 214 Insulating layer 216 Insulating layer 217 Insulating layer 218 Insulating layer 220 Insulating layer 221 Conductive layer 221a Conductive layer 221b Conductive layer 222a conductive layer 222b Conductive layer 223 Conductive layer 231 Semiconductor layer 242 Connecting Layers 243 Connectors 252 Connection part 261 Semiconductor layer 263a conductive layer 263b Conductive layer 281 transistors 284 transistors 285 transistors 286 transistors 300 display device 300A display device 300B display device 300C display unit 311 Electrode 311a electrode 311b electrode 340 LCD buttons 351 circuit board 360 light-emitting elements 360b light-emitting element 360g light-emitting element 360r light-emitting element 360W light-emitting element 361 circuit boards 362 Display section 364 circuits 365 Wiring 372 FPC 373 IC 381 Fabricated substrate 382 Delamination layer 383 Insulating layer 400 display device 410 pixels 451 Aperture 500 display device 501 Display section 530 pixel unit 531B Display element 531G Display Element 531p pixels 531R Display Element 531W display element 532B Display element 532G display element 532W display element 532p pixels 532R display element 532Y Display links 535r Light 535t light 535tr light 651 Touch Panel 652 Touch Panel 661 Arithmetic section 662 Bus Line 664 Storage device 671 Display Controller 672 Touch Sensor Controller 673 Battery Controller 674 Power receiving section 675 Battery Module 676 Sound Controller 677 Voice Input Section 678 Audio output section 681 Communication Module 682 Antenna 683 Posture detection unit 685 External Interface 686 Camera Module 687 Vibration Module 688 Sensor Module

Claims

1. The first semiconductor layer, A first conductive layer having a region located above the first semiconductor layer, A first insulating layer having a region located above the first conductive layer, A second semiconductor layer having a region located above the first insulating layer, A second insulating layer having a region located above the second semiconductor layer, A second conductive layer having a region located above the second insulating layer, A third insulating layer having a region located above the second conductive layer, A third conductive layer having a region located above the third insulating layer, A fourth insulating layer having a region located above the third conductive layer, A fourth conductive layer having a region located above the fourth insulating layer, The first semiconductor layer has a channel formation region for the first transistor, The first conductive layer is electrically connected to the source or drain of the first transistor and functions as the first gate electrode of the second transistor. The first insulating layer functions as the first gate insulating layer of the second transistor. The first insulating layer has silicon nitride, The second semiconductor layer has a channel formation region for the second transistor. The second semiconductor layer comprises an oxide semiconductor, The second insulating layer functions as the second gate insulating layer of the second transistor. The second conductive layer functions as the second gate electrode of the second transistor. The third conductive layer is electrically connected to the source or drain of the second transistor. The fourth conductive layer has the function of a pixel electrode, The fourth insulating layer has a resin, The fourth conductive layer is electrically connected to the third conductive layer, and the display device is provided.

2. The first semiconductor layer, A first conductive layer having a region located above the first semiconductor layer, A first insulating layer having a region located above the first conductive layer, A second semiconductor layer having a region located above the first insulating layer, A second insulating layer having a region located above the second semiconductor layer, A second conductive layer having a region located above the second insulating layer, A third insulating layer having a region located above the second conductive layer, A third conductive layer having a region located above the third insulating layer, A fourth insulating layer having a region located above the third conductive layer, A fourth conductive layer having a region located above the fourth insulating layer, The first semiconductor layer has a channel formation region for the first transistor, The first conductive layer is electrically connected to the source or drain of the first transistor and functions as the first gate electrode of the second transistor. The first insulating layer functions as the first gate insulating layer of the second transistor. The first insulating layer has silicon nitride, The second semiconductor layer has a channel formation region for the second transistor. The second semiconductor layer comprises an oxide semiconductor, The oxide semiconductor contains indium, The second insulating layer functions as the second gate insulating layer of the second transistor. The second conductive layer functions as the second gate electrode of the second transistor. The third conductive layer is electrically connected to the source or drain of the second transistor. The fourth conductive layer has the function of a pixel electrode, The fourth insulating layer has a resin, The fourth conductive layer is electrically connected to the third conductive layer, and the display device is provided.

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