Conveying device and conveying method

Abstract

Static discharge is performed according to the condition of the object being processed. [Solution] The disclosed transport device 10 comprises a storage unit 12 for storing objects to be processed, a transport unit for transporting objects to be processed along a predetermined transport path R between the storage unit 12 and a processing unit 20 for processing the objects, an ionizer 15 for blowing static-eliminating air toward the objects to be processed being transported by the transport unit, and a control unit for controlling the transport unit. The objects to be processed are held in a framed holding sheet. The control unit causes the transport unit to perform a first transport operation in which it takes out the objects to be processed from the storage unit 12 and hands them over to the processing unit 20, and a second transport operation in which it receives the objects to be processed from the processing unit 20 and hands them over to the storage unit 12. The static elimination conditions for the ionizer 15 in the first transport operation and the static elimination conditions for the ionizer 15 in the second transport operation are set individually.

Description

Technical Field

[0001] The present disclosure relates to a conveying device and a conveying method.

Background Art

[0002] Conventionally, a technique for discharging static electricity from a semiconductor substrate has been known (for example, Patent Document 1). Patent Document 1 discloses "a method for manufacturing a semiconductor integrated circuit device including the following steps: (a) a step of connecting an internal space of a first sealed semiconductor storage container in a sealed state in which a plurality of wafers are stored in a grounded state to a local clean room of a first wafer processing apparatus while maintaining cleanliness; (b) in the connected state, a step of accommodating all or part of the plurality of wafers stored in the first semiconductor storage container in a wafer processing unit of the first wafer processing apparatus by transferring them by a transfer mechanism provided in the local clean room; (c) a step of performing a first treatment on the wafers accommodated in the first wafer processing unit; (d) after the step (c), a step of accommodating the processed wafers in the first semiconductor storage container in a grounded state by transferring them by the transfer mechanism; (e) a step of discharging static electricity from the processed wafers after the step (c) and before or during the step (d); (f) after the step (d), a step of returning the first semiconductor storage container to a sealed state by releasing the connection between the first semiconductor storage container and the local clean room."

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, while Patent Document 1 discloses a technique for removing static electricity from a wafer (or object to be processed), it does not mention optimizing the static electricity removal conditions according to the state of the object to be processed (for example, the amount of charge on the object to be processed). In this situation, one of the objectives of this disclosure is to perform static electricity removal according to the state of the object to be processed. [Means for solving the problem]

[0005] One aspect of this disclosure relates to a transport device. The transport device comprises a storage unit for storing objects to be processed, a transport unit for transporting the objects to be processed along a predetermined transport path between the storage unit and a processing unit for processing the objects to be processed, an ionizer for blowing static-eliminating air toward the objects to be processed being transported by the transport unit, and a control unit for controlling the transport unit. The objects to be processed are held in a framed holding sheet, and the control unit causes the transport unit to perform a first transport operation in which it takes the objects to be processed out of the storage unit and delivers them to the processing unit, and a second transport operation in which it receives the objects to be processed from the processing unit and delivers them to the storage unit. The static elimination conditions for the ionizer in the first transport operation and the static elimination conditions for the ionizer in the second transport operation are set individually, respectively.

[0006] Another aspect of this disclosure relates to a transport method. The transport method is performed in a transport device comprising: a storage unit for storing objects to be processed; a transport unit for transporting objects to be processed along a predetermined transport path between the storage unit and a processing unit for processing the objects to be processed; and an ionizer for blowing static-eliminating air toward the objects to be processed being transported by the transport unit, wherein the objects to be processed are held in a framed holding sheet, and the transport method comprises: a first transport step in which the transport unit removes the objects to be processed from the storage unit and then delivers the removed objects to the processing unit; and a second transport step in which the transport unit receives the objects to be processed from the processing unit and then delivers the received objects to the storage unit, wherein the static elimination conditions for the ionizer in the first transport step and the static elimination conditions for the ionizer in the second transport step are set individually. [Effects of the Invention]

[0007] According to this disclosure, static electricity can be removed according to the state of the object being processed. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic front view showing the configuration of the conveying device of Embodiment 1. [Figure 2] This is a schematic plan view showing the configuration of the conveying device of Embodiment 1. [Figure 3] A plan view illustrating a predetermined transport route, where (a) shows an example of a transport route in a first transport operation, and (b) shows an example of a transport route in a second transport operation. [Figure 4] This is a cross-sectional view showing an example of a substrate, where (a) shows a wafer held in a framed retaining sheet, and (b) shows multiple element chips held in a framed retaining sheet. [Figure 5] This is a schematic front view showing the main parts of the transport device of Embodiment 2. [Figure 6] This is a schematic front view showing the main parts of the conveying device of Embodiment 3. [Modes for carrying out the invention]

[0009] Embodiments of the conveying device and conveying method relating to this disclosure will be described below with examples. However, this disclosure is not limited to the examples described below. In the following description, specific numerical values ​​and materials may be given as examples, but other numerical values ​​and materials may be applied as long as the effects of this disclosure are achieved.

[0010] (Conveyor device) The transport device according to this disclosure is a device that transports an object to be processed (for example, a substrate) between a storage unit and a processing unit. The processing unit may be a plasma processing unit that performs plasma processing on the object to be processed. Examples of plasma processing include plasma dicing, plasma cleaning, plasma etching, plasma ashing, or plasma CVD. The transport device according to this disclosure comprises a storage unit, a transport unit, an ionizer, and a control unit.

[0011] The containment unit contains the objects to be processed. The objects to be processed are held in a framed holding sheet. The containment unit may be, for example, a load port including a FOUP (Front Opening Unified Pod). The containment unit may contain multiple objects to be processed.

[0012] The transport unit transports the objects to be processed along a predetermined transport path between the storage unit and the processing unit that processes the objects. The transport unit may also transport the objects by holding them via a framed holding sheet. The transport unit may include a robotic arm that can move between the storage unit and the processing unit.

[0013] The ionizer sprays static-eliminating air toward the object being processed, which is being transported by the conveying unit. The ionizer is a device that generates positive and negative ions by ionizing the surrounding air through corona discharge. Static-eliminating air is air containing the ions thus generated, and by blowing static-eliminating air onto the object being processed, static electricity can be removed. The ionizer may be positioned above and below the conveying unit, or at least one of the two.

[0014] The control unit controls the transport unit. The control unit may have an arithmetic unit and a storage device that stores a program executable by the arithmetic unit (for example, a program to cause a computer to execute the transport method according to this disclosure). The control unit causes the transport unit to perform a first transport operation and a second transport operation. The first transport operation is the operation of transferring the object to be processed (i.e., the object to be processed before processing) taken out of the storage unit to the processing unit. The second transport operation is the operation of transferring the object to be processed (i.e., the object to be processed after processing) received from the processing unit to the storage unit.

[0015] In both the first and second transport operations, the objects being transported can be de-staticized by an ionizer. The de-static conditions for the ionizer in the first transport operation and the de-static conditions for the ionizer in the second transport operation are set individually. This makes it possible to de-staticize the objects with appropriate conditions even if the state of the objects being transported in the first transport operation (e.g., the amount of charge on the objects) and the state of the objects being transported in the second transport operation are different. The de-static conditions for the ionizer in the first transport operation and the de-static conditions for the ionizer in the second transport operation may be the same or different.

[0016] The transport device may further include a first measuring unit located on the storage side of the transport path and measuring the charge amount of the object to be processed that the transport unit takes out of the storage section, and a second measuring unit located on the processing side of the transport path and measuring the charge amount of the object to be processed that the transport unit receives from the processing unit. The control unit may determine the static discharge conditions for the first transport operation based on the charge amount measured by the first measuring unit when the transport unit performs the first transport operation, and determine the static discharge conditions for the second transport operation based on the charge amount measured by the second measuring unit when the transport unit performs the second transport operation. In this configuration, the charge amount of the object to be processed immediately after the start of the first transport operation is measured by the first measuring unit, while the charge amount of the object to be processed immediately after the start of the second transport operation is measured by the second measuring unit. Then, the static discharge conditions for the first transport operation are determined based on the measurement results of the first measuring unit, and the static discharge conditions for the second transport operation are determined based on the measurement results of the second measuring unit. Therefore, the static discharge conditions for each transport operation can be appropriately set according to the charge amount of the object to be processed. Each of the first and second measuring units may be, for example, an electrostatic potential sensor that detects the potential of static electricity charged on the object to be processed. The first measuring unit may be positioned upstream of the static elimination position, which is set to be in an area where the distance from the ionizer is 250 mm or less, in the transport path of the first transport operation. The second measuring unit may be positioned upstream of the static elimination position, which is set to be in an area where the distance from the ionizer is 250 mm or less, in the transport path of the second transport operation.

[0017] The static elimination conditions may include the airflow rate of the static elimination air discharged from the ionizer. The greater the airflow rate of the static elimination air, the more effectively the object being treated can be statically eliminated. Therefore, the airflow rate of the static elimination air may be set to increase as the charge level of the object being treated increases. This makes it possible to statically eliminate the object being treated under static elimination conditions that are more suitable for the state of the object being treated.

[0018] The static elimination condition may include the residence time at the static elimination position set in the region where the distance from the ionizer to the object to be processed conveyed by the conveyance unit is 250 mm or less. The static elimination position may be set on the leeward side of the ionizer, or particularly may be set below the ionizer. The static elimination position may be set in the region where the distance from the ionizer is 200 mm or less, 180 mm or less, 160 mm or less, 140 mm or less, or 120 mm or less. The longer the residence time of the object to be processed at such a static elimination position, the more powerfully the object to be processed can be statically eliminated. Therefore, the residence time may be set to be longer as the charge amount of the object to be processed is larger. Thereby, it becomes possible to statically eliminate the object to be processed under more suitable static elimination conditions according to the state of the object to be processed.

[0019] The control unit may adjust the residence time by adjusting the stop time of the object to be processed at the static elimination position. The longer the stop time of the object to be processed at the static elimination position, the longer the residence time and the more powerfully the object to be processed can be statically eliminated. Therefore, the stop time may be set to be longer as the charge amount of the object to be processed is larger. The stop time of the object to be processed at the static elimination position may be, for example, 0.5 seconds or more and 3 seconds or less, 0.5 seconds or more and 2 seconds or less, or 0.5 seconds or more and 1 second or less.

[0020] The control unit may adjust the residence time by adjusting the conveyance speed of the object to be processed at the static elimination position. The smaller the conveyance speed of the object to be processed at the static elimination position, the longer the residence time and the more powerfully the object to be processed can be statically eliminated. Therefore, the conveyance speed may be set to be smaller as the charge amount of the object to be processed is larger. The conveyance speed of the object to be processed at the static elimination position may be, for example, 40 mm / s or more and 500 mm / s or less.

[0021] The static discharge conditions may include the distance between the object to be treated and the ionizer at the static discharge position, which is set to a region where the distance from the ionizer is 250 mm or less. The smaller the distance between the object to be treated and the ionizer at the static discharge position, the more powerfully the object can be discharged. Therefore, this distance may be set to decrease as the amount of charge on the object to be treated increases. This makes it possible to discharge the object under static discharge conditions that are more suitable for the state of the object to be treated. The distance between the object to be treated and the ionizer at the static discharge position may be, for example, 50 mm or more and 250 mm or less.

[0022] The ionizer may include a first ionizer that sprays static-eliminating air from above onto the object to be processed during the first transport operation, and a second ionizer that sprays static-eliminating air from below onto the object to be processed during the second transport operation. The first ionizer may be positioned above the transport unit. The first ionizer may be a fixed ionizer. The second ionizer may be a movable ionizer provided on the transport unit, or a fixed ionizer positioned below the transport unit. This configuration is particularly suitable when the object to be processed (e.g., a substrate) is separated into individual pieces in the processing unit. That is, if static-eliminating air is sprayed from above onto the object after it has been separated into individual pieces, problems such as fine particles adhering to the object being blown into the air may occur. In contrast, in this configuration, static-eliminating air is blown from below by the second ionizer onto the individualized objects to be processed, that is, from the side of the holding sheet with the frame that holds the objects to be processed, so such problems are less likely to occur.

[0023] In the first transport operation, the object to be processed that the transport unit takes out of the storage unit and hands over to the processing unit may be a wafer before dicing, held in a framed holding sheet. The processing unit may be a plasma processing chamber that dices the wafer into multiple element chips. In the second transport operation, the object to be processed that the transport unit receives from the processing unit and hands over to the storage unit may be multiple element chips held in a framed holding sheet. In this configuration, the wafer that is handed over to the processing unit in the first transport operation is diced into multiple element chips by plasma dicing in the plasma processing chamber, and these multiple element chips are handed over to the storage unit in the second transport operation while still held in the framed holding sheet. In the transport apparatus according to this disclosure, the static elimination conditions for the wafer before dicing and the static elimination conditions for the multiple element chips can be appropriately set individually.

[0024] (Transportation method) The transport method according to this disclosure may be performed in a transport device according to this disclosure or in other transport devices. The transport method according to this disclosure is a transport method performed in a transport device comprising: a storage unit for storing objects to be processed held in a framed holding sheet; a transport unit for transporting objects to be processed along a predetermined transport path between the storage unit and a processing unit for processing the objects to be processed; and an ionizer for blowing static-eliminating air toward the objects to be processed being transported by the transport unit. The transport method according to this disclosure comprises a first transport step and a second transport step.

[0025] In the first transport process, the transport unit removes the object to be processed from the storage unit and then hands over the removed object to the processing unit. In other words, in the first transport process, the transport unit transports the object to be processed from the storage unit to the processing unit before processing.

[0026] In the second transport process, the transport unit receives the object to be processed from the processing unit and then transfers the received object to the storage unit. In other words, in the second transport process, the transport unit transports the processed object from the processing unit to the storage unit.

[0027] In both the first and second transport processes, the objects being transported can be electrostatically removed by an ionizer. However, the electrostatic removal conditions for the ionizer in the first transport process and the electrostatic removal conditions for the ionizer in the second transport process are set individually. This makes it possible to electrostatically remove the objects using appropriate conditions even when the state of the objects being transported in the first transport process (e.g., the amount of charge on the objects) and the state of the objects being transported in the second transport process are different.

[0028] The transport method may further include: a first measurement step of measuring the charge amount of the object to be processed that the transport unit takes out of the storage unit on the transport path; a second measurement step of measuring the charge amount of the object to be processed that the transport unit receives from the processing unit on the processing unit side of the transport path; a first determination step of determining the static discharge conditions in the first transport step based on the charge amount measured in the first measurement step; and a second determination step of determining the static discharge conditions in the second transport step based on the charge amount measured in the second measurement step. In this case, the static discharge conditions in each transport step can be appropriately set according to the charge amount of the object to be processed. Each of the first and second measurement steps may be performed, for example, using an electrostatic potential sensor that detects the potential of the static electricity charged on the object to be processed.

[0029] The static elimination conditions may include the airflow rate of the static elimination air ejected from the ionizer.

[0030] The static elimination conditions may include the time the object being processed, transported by the transport unit, stays in a static elimination position set to a region where the distance from the ionizer is 250 mm or less.

[0031] The transport method may further include a first adjustment step that adjusts the dwell time by adjusting the stopping time of the object to be processed at the static elimination position.

[0032] The transport method may further include a second adjustment step that adjusts the dwell time by adjusting the transport speed of the object to be processed at the static elimination position.

[0033] The static elimination conditions may include the distance between the object to be treated and the ionizer at the static elimination position, which is set to be within a region where the distance from the ionizer is 250 mm or less.

[0034] The ionizer may include a first ionizer that sprays static-eliminating air from above onto the object to be processed in the first conveying process, and a second ionizer that sprays static-eliminating air from below onto the object to be processed in the second conveying process.

[0035] In the first transport step, the object to be processed, which the transport unit removes from the storage unit and hands over to the processing unit, may be a wafer before individualization, held in a framed holding sheet. The processing unit may be a plasma processing chamber that individualizes the wafer into multiple element chips. In the second transport step, the object to be processed, which the transport unit receives from the processing unit and hands over to the storage unit, may be a plurality of element chips, held in a framed holding sheet.

[0036] As described above, according to this disclosure, by individually setting the static elimination conditions of the ionizer for each transport operation, static elimination can be performed according to the state of the object being processed.

[0037] Hereinafter, an example of a conveying device and conveying method relating to this disclosure will be specifically described with reference to the drawings. The components and processes of the example conveying device and conveying method described below can be applied to the components and processes described above. The components and processes of the example conveying device and conveying method described below can be modified based on the above description. Furthermore, the matters described below may be applied to the above embodiments. Among the components and processes of the example conveying device and conveying method described below, components and processes that are not essential to the conveying device and conveying method relating to this disclosure may be omitted. Note that the figures shown below are schematic and do not accurately reflect the actual shape and number of components.

[0038] Embodiment 1 Embodiment 1 of this disclosure will be described below. First, the conveying device 10 of this embodiment will be described, and then the conveying method of this embodiment will be described.

[0039] (Conveyor device) As shown in Figures 1 to 4, the transport device 10 of this embodiment comprises a housing 11, a storage section 12, a transport section 13, a fan filter unit 14, an ionizer 15, an aligner 16, a first measuring section 17, a second measuring section 18, and a control unit 19.

[0040] The housing 11 is a hollow box-shaped structure that is generally rectangular in shape. The housing 11 houses the transport unit 13, the fan filter unit 14, the ionizer 15, the aligner 16, the first measuring unit 17, and the second measuring unit 18. At least one (two in this example) processing unit 20 for processing the substrate 30 is connected to the housing 11 via an openable and closable opening (not shown). The processing unit 20 in this embodiment consists of a plasma processing chamber that separates a wafer held in a framed holding sheet into multiple element chips. The substrate 30 is an example of an object to be processed.

[0041] The housing section 12 houses the substrate 30 held in a framed retaining sheet. In this embodiment, the housing section 12 consists of a load port including a FOUP 12A that houses the substrate 30. The internal space of the FOUP 12A (i.e., the space in which the substrate 30 is housed) can communicate with the internal space of the housing 11 through an opening (not shown) formed in the housing 11, if necessary. The number of housing sections 12 is not particularly limited, and in this example, two housing sections 12 are provided.

[0042] The transport unit 13 is located in the lower part of the internal space of the housing 11. The transport unit 13 transports the substrate 30 between the storage unit 12 and the processing unit 20 along a predetermined transport path R (see Figure 3). In this embodiment, the transport unit 13 is composed of a transport robot having a transport arm 13a.

[0043] The fan filter unit 14 is located in the upper region of the internal space of the housing 11. The fan filter unit 14 has at least one (two in this example) fan (not shown) which generates a downward airflow. This airflow carries the static-de-static air (i.e., air containing ions) generated by the ionizer 15 to the substrate 30.

[0044] The ionizer 15 is located below the fan filter unit 14 in the internal space of the housing 11. The ionizer 15 blows static-dissipating air toward the substrate 30 being transported by the transport unit 13 (downward in this example). This static-dissipating air can dissipate static charge from the charged substrate 30.

[0045] The aligner 16 is positioned at the edge of the internal space of the housing 11 when viewed from above. The aligner 16 is configured to adjust the position of the substrate 30 as it is being transported from the housing 12 to the processing unit 20 by the transport unit 13 (i.e., in the first transport operation described later).

[0046] The first measuring unit 17 is located in the internal space of the housing 11, on the side of the storage unit 12 in the transport path R (the right side in Figures 1 and 2). The first measuring unit 17 measures the amount of charge on the substrate 30 that the transport unit 13 removes from the storage unit 12. Information regarding the measurement results from the first measuring unit 17 is sent to the control unit 19.

[0047] The second measuring unit 18 is located within the internal space of the housing 11, on the side of the processing unit 20 in the transport path R (the left side in Figures 1 and 2). The second measuring unit 18 measures the amount of charge on the substrate 30 received by the transport unit 13 from the processing unit 20. Information regarding the measurement results from the second measuring unit 18 is sent to the control unit 19.

[0048] The control unit 19 controls the transport unit 13. More specifically, the control unit 19 causes the transport unit 13 to perform a first transport operation (Figure 3(a)) in which it takes out the substrate 30 from the storage unit 12 and transfers it to the processing unit 20 via the aligner 16, and a second transport operation (Figure 3(b)) in which it receives the substrate 30 from the processing unit 20 and transfers it to the storage unit 12. The substrate 30 that the transport unit 13 takes out from the storage unit 12 and transfers to the processing unit 20 in the first transport operation is a wafer 31 before individualization, held in a framed holding sheet 33 (Figure 4(a)). This wafer 31 is individualized into a plurality of element chips 32 in the processing unit 20 (Figure 4(b)). The substrate 30 that the transport unit 13 receives from the processing unit 20 and transfers to the storage unit 12 in the second transport operation is the plurality of element chips 32 held in the framed holding sheet 33. The control unit 19 may also control the storage unit 12 and the transport unit 13.

[0049] Here, the static elimination conditions for the ionizer 15 in the first transport operation and the static elimination conditions for the ionizer 15 in the second transport operation are set individually. The static elimination conditions in the first transport operation are determined by the control unit 19 based on the amount of charge of the substrate 30 measured by the first measuring unit 17. The static elimination conditions in the second transport operation are determined by the control unit 19 based on the amount of charge of the substrate 30 measured by the second measuring unit 18.

[0050] Examples of static elimination conditions in each transport operation include the airflow rate of static elimination air ejected from the ionizer 15, the dwell time of the substrate 30 transported by the transport unit 13 at the static elimination position P (i.e., a predetermined position set in an area where the distance from the ionizer 15 is 250 mm or less, and shown as a black dot in Figure 3), and the distance between the substrate 30 and the ionizer 15 at the static elimination position P. The dwell time of the substrate 30 at the static elimination position P may be adjusted by the control unit 19 adjusting the stopping time of the substrate 30 at the static elimination position P, and / or by the control unit 19 adjusting the transport speed of the substrate 30 at the static elimination position P.

[0051] The static elimination position P in the first transport operation may be the position closest to the ionizer 15 in the transport path R in the first transport operation (in this example, the highest position). The static elimination position P in the second transport operation may be the position closest to the ionizer 15 in the transport path R in the second transport operation (in this example, the highest position).

[0052] (Transportation method) Next, the conveying method of this embodiment will be described. The conveying method of this embodiment may be performed in the conveying device 10 of this embodiment. The conveying method of this embodiment comprises a first conveying step, a second conveying step, a first measurement step, a second measurement step, a first determination step, and a second determination step.

[0053] In the first transport process, the transport unit 13 removes the substrate 30 (specifically, the wafer 31 before individualization, held in the framed holding sheet 33) from the storage unit 12, and then transfers the removed substrate 30 to the processing unit 20 via the aligner 16.

[0054] In the second transport process, the transport unit 13 receives the substrate 30 (specifically, multiple element chips 32 held on a framed holding sheet 33) from the processing unit 20, and then transfers the received substrate 30 to the storage unit 12.

[0055] Here, the static elimination conditions for the ionizer 15 in the first transport process and the static elimination conditions for the ionizer 15 in the second transport operation are set individually. Examples of static elimination conditions in each transport process include the same static elimination conditions as described above.

[0056] In the first measurement step, the amount of charge on the substrate 30 that the transport unit 13 removes from the transport unit 12 is measured on the side of the storage unit 12 in the transport path R of the first transport step.

[0057] In the second measurement step, the amount of charge on the substrate 30 received by the transport unit 13 from the processing unit 20 is measured on the processing unit 20 side of the transport path R in the second transport step.

[0058] In the first determination step, the static discharge conditions for the first transport step are determined based on the amount of charge of the substrate 30 measured in the first measurement step.

[0059] In the second determination step, the static discharge conditions for the second transport step are determined based on the amount of charge of the substrate 30 measured in the second measurement step.

[0060] Embodiment 2 Embodiment 2 of the present disclosure will now be described. The transport device 10 of this embodiment differs from Embodiment 1 in that the ionizer 15 includes a first ionizer 15A and a second ionizer 15B. Specifically, as shown in Figure 5, the transport device 10 of this embodiment includes a first ionizer 15A (or upper ionizer) corresponding to the ionizer 15 of Embodiment 1, and a second ionizer 15B (or lower ionizer) positioned below the first ionizer 15A. The first ionizer 15A blows static-eliminating air from above onto the substrate 30 during the first transport operation. On the other hand, the second ionizer 15B blows static-eliminating air from below onto the substrate 30 during the second transport operation. The second ionizer 15B of this embodiment is a fixed ionizer.

[0061] Modified form of Embodiment 2 A modified example of Embodiment 2 of the present disclosure will now be described. The transport device 10 of this modified example differs from Embodiment 2 in that the second ionizer 15B is a movable ionizer. Specifically, as shown in Figure 6, the second ionizer 15B of this modified example is attached to the lower surface of the transport arm 13a of the transport unit 13 and moves together with the transport unit 13 inside the housing 11. Since the transport arm 13a holds the substrate 30 on its upper surface, static-eliminating air is also blown from below onto the substrate 30 during the second transport operation by the second ionizer 15B of this modified example.

[0062] [Note] The above description of embodiments discloses the following technologies. (Technology 1) A storage section for containing the object to be processed, Between the storage unit and the processing unit that processes the object to be processed, there is a transport unit that transports the object to be processed along a predetermined transport path, An ionizer that sprays static-eliminating air toward the object to be processed being transported by the transport unit, A control unit that controls the transport unit, Equipped with, The object to be processed is held in a framed holding sheet. The control unit controls the transport unit. A first transport operation in which the object to be processed, removed from the storage unit, is transferred to the processing unit, A second transport operation, which involves transferring the object to be processed received from the processing unit to the storage unit, Have them do it, A transport device in which the static elimination conditions for the ionizer in the first transport operation and the static elimination conditions for the ionizer in the second transport operation are set individually. (Technology 2) A first measuring unit is positioned on the storage unit side of the transport path and measures the amount of charge on the object to be processed that the transport unit takes out of the storage unit. A second measuring unit is positioned on the processing unit side of the transport path and measures the amount of charge of the object to be processed that is received by the transport unit from the processing unit, Furthermore, The control unit, When the transport unit performs the first transport operation, the static discharge conditions in the first transport operation are determined based on the amount of charge measured by the first measuring unit, and, The transport device according to Technology 1, wherein the transport unit determines the static discharge conditions in the second transport operation based on the amount of charge measured by the second measuring unit when the transport unit performs the second transport operation. (Technology 3) The conveying apparatus according to Technology 1 or 2, wherein the static elimination conditions include the airflow rate of the static elimination air ejected from the ionizer. (Technology 4) The conveying device according to any one of the technologies 1 to 3, wherein the static elimination conditions include the time the object to be processed, conveyed by the conveying unit, stays at a static elimination position set to be in an area where the distance from the ionizer is 250 mm or less. (Technology 5) The conveying device according to Technology 4, wherein the control unit adjusts the dwell time by adjusting the stopping time of the object to be processed at the static elimination position. (Technology 6) The conveying device according to Technology 4, wherein the control unit adjusts the dwell time by adjusting the conveying speed of the object to be processed at the static elimination position. (Technology 7) The conveying device according to any one of the technologies 1 to 6, wherein the static elimination conditions include the distance between the object to be processed and the ionizer at a static elimination position set to a region where the distance from the ionizer is 250 mm or less. (Technology 8) The ionizer mentioned above is A first ionizer that ejects the static-eliminating air from above onto the object to be processed during the first transport operation, A second ionizer that ejects the static-eliminating air from below onto the object to be processed during the second transport operation, A conveying device as described in any one of the technologies 1 to 7, including the one described in Technology 1 to 7. (Technology 9) In the first transport operation, the object to be processed, which the transport unit removes from the storage unit and hands over to the processing unit, is a wafer before individualization, which is held in the framed holding sheet. The processing unit is a plasma processing chamber that separates the wafer into multiple element chips, The transport device according to any one of the technologies 1 to 8, wherein the object to be processed, in the second transport operation, is received by the transport unit from the processing unit and transferred to the storage unit, is the plurality of element chips held in the framed holding sheet. (Technology 10) A storage section for containing the object to be processed, Between the storage unit and the processing unit that processes the object to be processed, there is a transport unit that transports the object to be processed along a predetermined transport path, An ionizer that sprays static-eliminating air toward the object to be processed being transported by the transport unit, A conveying method performed in a conveying device comprising, The object to be processed is held in a framed holding sheet. The first transport step involves the transport unit removing the object to be processed from the storage unit and then transferring the removed object to the processing unit, The transport unit receives the object to be processed from the processing unit, and then the transport unit transfers the received object to the storage unit in a second transport step, Equipped with, A transport method in which the static elimination conditions for the ionizer in the first transport process and the static elimination conditions for the ionizer in the second transport process are set individually. (Technology 11) A first measurement step is performed on the storage unit side of the transport path to measure the amount of charge on the object to be processed that the transport unit takes out of the storage unit, In the transport path, on the processing unit side, a second measurement step is performed to measure the amount of charge of the object to be processed that is received by the transport unit from the processing unit, A first determination step in which the static discharge conditions in the first transport step are determined based on the amount of charge measured in the first measurement step, A second determination step in which the static discharge conditions in the second transport step are determined based on the amount of charge measured in the second measurement step, The transport method described in Technology 10 further includes the following: (Technology 12) The conveying method according to Technical 10 or 11, wherein the static elimination conditions include the airflow rate of the static elimination air ejected from the ionizer. (Technology 13) The conveying method according to any one of the technologies 10 to 12, wherein the static elimination conditions include the time the object to be processed, conveyed by the conveying unit, stays at a static elimination position set to be in an area where the distance from the ionizer is 250 mm or less. (Technology 14) The transport method according to Technical 13, further comprising a first adjustment step of adjusting the dwell time by adjusting the stopping time of the object to be processed at the static elimination position. (Technology 15) The conveying method according to Technical 13, further comprising a second adjustment step of adjusting the dwell time by adjusting the conveying speed of the object to be processed at the static discharge position. (Technology 16) The transport method according to any one of the technologies 10 to 15, wherein the static elimination conditions include the distance between the object to be processed and the ionizer at a static elimination position set to a region where the distance from the ionizer is 250 mm or less. (Technology 17) The ionizer mentioned above is A first ionizer that ejects the static-eliminating air from above onto the object to be processed in the first transport process, A second ionizer that ejects the static-eliminating air from below onto the object to be processed in the second transport process, A conveying method described in any one of the technologies 10 to 16, including the above. (Technology 18) In the first transport step, the object to be processed, which the transport unit removes from the storage unit and hands over to the processing unit, is a wafer before individualization, which is held in the framed holding sheet. The processing unit is a plasma processing chamber that separates the wafer into multiple element chips, The transport method according to any one of technologies 10 to 17, wherein the object to be processed in the second transport step is the plurality of element chips held in the framed holding sheet, which the transport unit receives from the processing unit and hands over to the housing unit. [Industrial applicability]

[0063] This disclosure can be used in conveying devices and conveying methods. [Explanation of symbols]

[0064] 10: Conveying device 11: Cabinet 12: Containment Unit 12a:FOUP 13: Conveying Section 13a: Conveyor arm 14: Fan filter unit 15: Ionizer 15A: First Ionizer 15B: Second Ionizer 16: Alaina 17: 1st measurement section 18:Second measurement part 19: Control Unit 20: Processing Unit 30: Substrate (object to be processed) 31: Wafer 32: Element Chip 33: Retaining sheet with frame P: Static neutralization position R: Conveyor path

Claims

1. A storage section for containing the object to be processed, Between the storage unit and the processing unit that processes the object to be processed, there is a transport unit that transports the object to be processed along a predetermined transport path, An ionizer that sprays static-eliminating air toward the object to be processed being transported by the transport unit, A control unit that controls the transport unit, Equipped with, The object to be processed is held in a framed holding sheet. The control unit controls the transport unit. A first transport operation in which the object to be processed, removed from the storage unit, is transferred to the processing unit, A second transport operation, which involves transferring the object to be processed received from the processing unit to the storage unit, Have them do it, A transport device in which the static elimination conditions for the ionizer in the first transport operation and the static elimination conditions for the ionizer in the second transport operation are set individually.

2. A first measuring unit is positioned on the storage unit side of the transport path and measures the amount of charge on the object to be processed that the transport unit takes out of the storage unit, A second measuring unit is positioned on the processing unit side of the transport path and measures the amount of charge of the object to be processed that is received by the transport unit from the processing unit, Furthermore, The control unit, When the transport unit performs the first transport operation, the static discharge conditions in the first transport operation are determined based on the amount of charge measured by the first measuring unit, and, The conveying device according to claim 1, wherein the discharge condition in the second conveying operation is determined based on the amount of charge measured by the second measuring unit when the conveying unit performs the second conveying operation.

3. The conveying apparatus according to claim 1, wherein the static elimination conditions include the airflow of the static elimination air ejected from the ionizer.

4. The conveying device according to claim 1, wherein the static elimination conditions include the time the object to be processed, conveyed by the conveying unit, stays at a static elimination position set to be in an area where the distance from the ionizer is 250 mm or less.

5. The conveying device according to claim 4, wherein the control unit adjusts the dwell time by adjusting the stopping time of the object to be processed at the static elimination position.

6. The conveying device according to claim 4, wherein the control unit adjusts the dwell time by adjusting the conveying speed of the object to be processed at the static elimination position.

7. The conveying device according to claim 1, wherein the static elimination conditions include the distance between the object to be processed and the ionizer at a static elimination position set to a region where the distance from the ionizer is 250 mm or less.

8. The ionizer mentioned above is A first ionizer that ejects the static-eliminating air from above onto the object to be processed during the first transport operation, A second ionizer that ejects the static-eliminating air from below onto the object to be processed during the second transport operation, The conveying device according to claim 1, including the following:

9. In the first transport operation, the object to be processed, which the transport unit removes from the storage unit and hands over to the processing unit, is a wafer before individualization, which is held in the framed holding sheet. The processing unit is a plasma processing chamber that separates the wafer into multiple element chips, The transport device according to any one of claims 1 to 8, wherein the object to be processed, in the second transport operation, is the plurality of element chips held in the framed holding sheet, which the transport unit receives from the processing unit and hands over to the storage unit.

10. A storage section for containing the object to be processed, Between the storage unit and the processing unit that processes the object to be processed, there is a transport unit that transports the object to be processed along a predetermined transport path, An ionizer that sprays static-eliminating air toward the object to be processed being transported by the transport unit, A conveying method performed in a conveying device comprising, The object to be processed is held in a framed holding sheet. The first transport step involves the transport unit removing the object to be processed from the storage unit and then transferring the removed object to the processing unit, The transport unit receives the object to be processed from the processing unit, and then the transport unit transfers the received object to the storage unit in a second transport step, Equipped with, A transport method in which the static elimination conditions for the ionizer in the first transport process and the static elimination conditions for the ionizer in the second transport process are set individually.

11. A first measurement step is performed on the storage unit side of the transport path to measure the amount of charge on the object to be processed that the transport unit takes out of the storage unit, In the transport path, on the processing unit side, a second measurement step is performed to measure the amount of charge of the object to be processed that is received by the transport unit from the processing unit, A first determination step in which the static discharge conditions in the first transport step are determined based on the amount of charge measured in the first measurement step, A second determination step in which the static discharge conditions in the second transport step are determined based on the amount of charge measured in the second measurement step, The transport method according to claim 10, further comprising:

12. The conveying method according to claim 10, wherein the static elimination conditions include the airflow of the static elimination air ejected from the ionizer.

13. The conveying method according to claim 10, wherein the static discharge conditions include the time the object to be processed, conveyed by the conveying unit, stays at a static discharge position set to be in an area where the distance from the ionizer is 250 mm or less.

14. The transport method according to claim 13, further comprising a first adjustment step of adjusting the dwell time by adjusting the stopping time of the object to be processed at the static elimination position.

15. The conveying method according to claim 13, further comprising a second adjustment step of adjusting the dwell time by adjusting the conveying speed of the object to be processed at the static elimination position.

16. The transport method according to claim 10, wherein the static elimination conditions include the distance between the object to be processed and the ionizer at a static elimination position set to a region where the distance from the ionizer is 250 mm or less.

17. The ionizer mentioned above is A first ionizer that sprays the static-eliminating air from above onto the object to be processed in the first transport process, A second ionizer that ejects the static-eliminating air from below onto the object to be processed in the second transport process, The conveying method according to claim 10, including the method described in claim 10.

18. In the first transport step, the object to be processed, which the transport unit removes from the storage unit and hands over to the processing unit, is a wafer before individualization, which is held in the framed holding sheet. The processing unit is a plasma processing chamber that separates the wafer into multiple element chips, The transport method according to any one of claims 10 to 17, wherein the object to be processed, in the second transport step, is the plurality of element chips held in the framed holding sheet, which the transport unit receives from the processing unit and hands over to the storage unit.

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